CN104662478B - Object exchange method, object exchange system, exposure device, the manufacture method of flat-panel screens and assembly manufacture method - Google Patents

Object exchange method, object exchange system, exposure device, the manufacture method of flat-panel screens and assembly manufacture method Download PDF

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Publication number
CN104662478B
CN104662478B CN201380049087.5A CN201380049087A CN104662478B CN 104662478 B CN104662478 B CN 104662478B CN 201380049087 A CN201380049087 A CN 201380049087A CN 104662478 B CN104662478 B CN 104662478B
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China
Prior art keywords
substrate
action
holding apparatus
support
air guide
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CN201380049087.5A
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Chinese (zh)
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CN104662478A (en
Inventor
青木保夫
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Nikon Corp
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Nikon Corp
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Priority to CN201710587245.2A priority Critical patent/CN107436540B/en
Publication of CN104662478A publication Critical patent/CN104662478A/en
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Abstract

The substrate (P1) being placed on baseplate carrier device (20) is exchanged into other substrates (P2), it is included：The baseplate carrier device (20) for maintaining substrate (P1) is set to be located at the action that set object exchanges position；Make substrate (P1) pendulous support in the action for the pendulous support device (50) for being located at object exchange position；The action for making substrate (P1) of the pendulous support in pendulous support device (50) be left from baseplate carrier device (20)；Substrate (P2) is inserted into the action that the substrate (P2) is handed over to baseplate carrier device (20) by pendulous support between the substrate (P1) and baseplate carrier device (20) of pendulous support device (50)；And by making substrate (P1) relative to the mobile action so that substrate (P1) to be taken out of from object exchange position of pendulous support device (50).

Description

Object exchange method, object exchange system, exposure device, the manufacture of flat-panel screens Method and assembly manufacture method
Technical field
The present invention be on object exchange method, object exchange system, exposure device, the manufacture method of flat-panel screens, And assembly manufacture method, particular it relates to the exchange method and system of the object being held in object holding apparatus, possess The manufacture method of the exposure device of the object exchange system, the flat-panel screens using the exposure device and component.
Background technology
In the past, exposure is used in the photoetching process to manufacture the electronic building bricks such as LCD assembly, semiconductor subassembly Device, it is (or brilliant that the exposure device is that the pattern that be will be formed in using energy beam on mask (or graticule) is transferred to glass substrate Circle) on.
It is existing a kind of using set base board delivery device that the exposure on baseplate carrier device is complete as such a exposure device After complete glass substrate takes out of, other glass substrates are moved on baseplate carrier device by using aforesaid substrate carrying device, The glass substrate being held in baseplate carrier device is sequentially exchanged, so that multiple glass substrates are carried out continuously with exposure-processed person's (ginseng As usual such as patent document 1).
Herein, when being carried out continuously exposure to multiple glass substrates, for the lifting of overall throughput, preferably promptly hand over The glass substrate changed on baseplate carrier device.
Prior art document
Patent document
Patent document 1：No. 6,559,928 specifications of U.S. Patent No.
The content of the invention
To the means to solve the problem
The present invention is complete winner in view of the above-mentioned facts, is a kind of object exchange method from the point of view of the 1st viewpoint, be by The object for being configured at set object exchange position is exchanged into other objects, and it is included：Keep the object for maintaining the 1st object Device is located at the action that the object exchanges position；The 1st object pendulous support is set to exchange position in being located at the object The action of support meanss；Make what pendulous support was left in the 1st object of the support meanss from the object holding apparatus Action；2nd object is inserted into pendulous support between the 1st object of the support meanss and the object holding apparatus, And the 2nd object is handed over to the action of the object holding apparatus；And by the 2nd object is handed over to it is described After object holding apparatus, the 1st object is moved relative to the support meanss, the 1st object is handed over from the object The action that change place takes out of.
Thereby, the 2nd object is handed over to object holding apparatus by the state with the 1st object pendulous support in support meanss, its Afterwards, the 1st object is taken out of from object switch.That is, because the 2nd object is relatively held in thing to moving into for object holding apparatus The end for taking out of action of 1st object of body holding meanss is also preferentially carried out, accordingly, it is capable to promptly carry out on object holding apparatus Object switching motion.
The present invention is a kind of object exchange system from the point of view of the 2nd viewpoint, is that will be configured at set object to exchange at position Object be exchanged into other objects, it possesses：Object holding apparatus, can keep the object；Support meanss, located at the object Object described in exchange position, energy pendulous support；Drivetrain, to maintain the object holding apparatus of the object positioned at described Object is exchanged at position and state of the object by pendulous support in the support meanss, and makes the object from described Object holding apparatus leaves；And object switch, pass through the state left in the object holding apparatus and the object Under, other objects are inserted between the object holding apparatus and the object, and other objects are handed over to the object and kept Device, and by after other described objects are handed over into the object holding apparatus filling, the relatively described support of the object Movement is put, the object is exchanged into position from the object takes out of.
Thereby, other are handed over to object holding apparatus by the state with object pendulous support in support meanss, thereafter object Taken out of from object switch.That is, because other objects are relatively held in object holding dress to moving into for object holding apparatus The end for taking out of action for the object put also preferentially is carried out, therefore can promptly carry out the exchange of the object on object holding apparatus Action.
The present invention is a kind of exposure device, possessed from the point of view of the 3rd viewpoint：The object of the 2nd viewpoint of the present invention exchanges system System；And form the pattern formation dress of predetermined pattern in the object for being held in the object holding apparatus using energy beam Put.
The present invention is a kind of manufacture method of flat-panel screens, it is included from the point of view of the 4th viewpoint：Use the 3rd of the present invention the The exposure device of viewpoint makes the action of the object exposure；And the action for making the object after exposure develop.
The present invention is a kind of assembly manufacture method, it is included from the point of view of the 5th viewpoint：Use the exposure of the 3rd viewpoint of the present invention Electro-optical device makes the action of the object exposure；And the action for making the object after exposure develop.
Brief description of the drawings
Fig. 1 is the figure of the composition for the liquid crystal exposure apparatus that outline shows the 1st embodiment.
Fig. 2 is the top view of the liquid crystal exposure apparatus (part is omitted) shown in Fig. 1.
The front view for the substrate-replacing apparatus that Fig. 3 (A) is had by the liquid crystal exposure apparatus shown in Fig. 2, Fig. 3 (B) is it The schematic diagram of variation.
The substrate that Fig. 4 (A)~Fig. 4 (C) is had by the liquid crystal exposure apparatus shown in Fig. 1 moves into the action schematic diagram of device (its 1~its 3).
Fig. 5 (A)~Fig. 5 (C) for the 1st embodiment liquid crystal exposure apparatus substrate exchange action a schematic diagram (it 1 ~its 3).
Another schematic diagram that Fig. 6 (A)~Fig. 6 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 1st embodiment (its 4~its 6).
Another schematic diagram that Fig. 7 (A)~Fig. 7 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 1st embodiment (its 7~its 9).
The another schematic diagram that Fig. 8 (A) and Fig. 8 (B) acts for the substrate exchange of the liquid crystal exposure apparatus of the 1st embodiment (its 10 and its 11).
Fig. 9 is the top view of the substrate-replacing apparatus of the baseplate carrier device of the 2nd embodiment.
Figure 10 (A) is the sectional side view of the baseplate carrier device of the 2nd embodiment, and Figure 10 (B) is the signal of its variation Figure.
The schematic diagram that Figure 11 (A)~Figure 11 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 2nd embodiment (its 1~its 3).
Another schematic diagram that Figure 12 (A)~Figure 12 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 2nd embodiment (its 4~its 6).
Another schematic diagram that Figure 13 (A)~Figure 13 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 3rd embodiment (its 1~its 3).
Figure 14 (A) is a schematic diagram (its 4) for the substrate exchange action of the liquid crystal exposure apparatus of the 3rd embodiment, Figure 14 (B) it is the schematic diagram of its variation.
The schematic diagram that Figure 15 (A)~Figure 15 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 4th embodiment (its 1~its 3).
Another schematic diagram that Figure 16 (A)~Figure 16 (C) acts for the substrate exchange of the liquid crystal exposure apparatus of the 4th embodiment (its 4~its 6).
Another schematic diagram that Figure 17 (A) and Figure 17 (B) acts for the substrate exchange of the liquid crystal exposure apparatus of the 4th embodiment (its 7 and its 8).
Drawing reference numeral explanation
10 liquid crystal exposure apparatus
20 baseplate carrier devices
26 substrate holdings
30 substrate-replacing apparatus
36 substrate drive devices
38 air guide devices
44 absorption layers
50 pendulous support devices
52 noncontact grip devices
P substrates
Embodiment
《1st embodiment》
Hereinafter, the 1st embodiment is illustrated using Fig. 1~Fig. 8 (B).
In Fig. 1, the composition of the liquid crystal exposure apparatus 10 for showing the 1st embodiment of outline.Liquid crystal exposure apparatus 10 is Make for rectangle (angle-style) the glass substrate P (with the referred to as substrate P that places an order) such as liquid crystal display (flat-panel screens) For the projection aligner of the step-scan mode of exposure object thing, so-called scanner.
Liquid crystal exposure apparatus 10 with illumination is 12, keep mask M mask microscope carrier 14, projection optics system 16, it is held in Surface (being the face towards+Z sides in Fig. 1) is coated with the baseplate carrier device 20 of the substrate P of resist (sensing agent), substrate exchange Device 30, pendulous support device 50 and these control system etc..It is to make mask M and substrate P when setting exposure in illustrating below The direction being scanned respectively with respect to projection optics system 16 be X-direction, in the horizontal plane direction orthogonal to X-axis be Y direction, The direction orthogonal with X-axis and Y direction is Z-direction.Also, X will be set in the position of X-axis, Y-axis and Z-direction Put, Y location and Z location are illustrated.
Illumination is 12, and it with the illumination disclosed in such as 5,729, No. 331 specifications of U.S. Patent No. etc. is same structure to be Into.That is, it 12 is the light that will be projected from light source (not shown) (such as mercury vapor lamp) that illumination, which is, respectively via reflection (not shown) Mirror, spectroscope (dichroic mirror), window shade, wavelength selective filters, various lens etc., (shine as exposure illumination light Mingguang City) IL is irradiated in mask M.Illumination light IL, is to use such as i lines (wavelength 365nm), g lines (wavelength 436nm), h line (wavelength Light (or synthesis light of above-mentioned i lines, g lines, h lines) 405nm) etc..
Mask microscope carrier 14, for example, adsorbed in vacuum suction mode and maintain its mask M.Mask microscope carrier 14 for example, by comprising The mask microscope carrier drivetrain (non-icon) of linear motor is driven in scanning direction (X-direction) with set long stroke.Mask microscope carrier 14 in the positional information in X/Y plane obtained by the mask interferometer system comprising not shown laser interferometer.
The configuration of projection optics system 16 is in the lower section of mask microscope carrier 14.Projection optics system 16 have with such as U.S. Patent No. 6, Projection optics system identical disclosed in 552, No. 775 specifications is constituted, the projection optics system of so-called poly-lens, possess for example with The equimultiple system of both sides telecentricity forms multiple projection optics systems of upright erect image.
Liquid crystal exposure apparatus 10, when to be that 12 illumination light IL illuminates the illumination region on mask M from illumination, that is, leads to Mask M illumination light IL is crossed, through projection optics system 16 by the (portion of projection image of the circuit pattern of the mask M in the illumination region Divide erect image), it is formed at the irradiation area (exposure area) with the illumination light IL of the illumination region conjugation in substrate P.And pass through Mask M is displaced into scanning direction and relative exposure region (illumination light IL) with respect to illumination region (illumination light IL) moves substrate P Move in scanning direction, the scan exposure of an irradiation area in substrate P is carried out according to this, mask is formed in irradiation area transfer M pattern.
Baseplate carrier device 20 possesses XY coarse motions microscope carrier 22, fine motion microscope carrier 24 and substrate holding 26.
XY coarse motions microscope carrier 22 is substrate holding 26 is driven in X-direction and Y direction with set long stroke Device.As XY coarse motions microscope carrier 22, it can be taken off using such as No. 2010/0018950 specification of U.S. Patent Application Publication No. Show, the X coarse motions microscope carrier of X-direction will can be displaced into set long stroke and Y direction can be displaced into set long stroke The so-called gate (gantry) that combines of Y coarse motion microscope carriers twin shaft bearing table device (diagram of X, Y coarse motion microscope carrier is omitted).It is micro- Dynamic load platform 24 is configured at the top of XY coarse motions microscope carrier 22, through such as No. 2010/0018950 explanation of U.S. Patent Application Publication No. Weight cancellation element 28 disclosed in book is placed in fixed seat 18.Fixed seat 18 is made up of the tabular component of vertical view rectangle, thoroughly Antihunting device 19 is crossed to be arranged on ground 11.
Substrate holding 26 is made up of the tabular component (or highly low rectangular-shape) of vertical view rectangle, is integrally attached to micro- Above dynamic load platform 24.Substrate holding 26 by above-mentioned XY coarse motions microscope carrier 22 by being induced and the relative (illumination of projection optics system 16 Light IL) X-direction and/or Y direction are displaced into set long stroke.The X/Y plane of substrate holding 26 (that is, substrate P) Interior positional information, is obtained by the substrate interferometer system comprising not shown laser interferometer.In addition, XY coarse motion microscope carriers As long as 22 composition at least can be driven substrate P in scanning direction with set long stroke, then it is not particularly limited.
Above substrate holding 26 multiple small hole portions (not shown) are formed with (towards the face of+Z sides).Protected in substrate Hold tool 26 and be selectively connected with the vacuum suction device being arranged on outside baseplate carrier device 20 and gas-pressurized supply dress Put (not shown).Substrate holding 26 can be inhaled by the vacuum supplied from above-mentioned vacuum suction device through above-mentioned multiple hole portions Gravitation absorption keeps loading the substrate P in face thereon, and can be above-mentioned multiple by being passed through from above-mentioned gas-pressurized feeding mechanism The gas-pressurized suspension support (non-contact support) of hole portion (or other hole portions) supply loads the substrate P in face thereon.
As shown in Fig. 2 substrate holding 26 is set as compared with substrate P in X-axis and Y in X-axis and the respective size of Y direction The respective size of direction of principal axis is short a little, is to be placed with the state of substrate P on substrate holding 26, and the end of substrate P is from base Plate keeps the end of tool 26 beyond a little.This be because have resist be attached to substrate P the back side possibility, and in order that this is anti- Erosion agent is not attached to the cause of substrate holding 26.
As shown in Fig. 2 in the-Y sides of substrate holding 26, a pair of Y pushpins dresses are configured with predetermined distance in Y direction Put 25y.Y pressings pin assembly 25y have be fixed on substrate holding 26 (but also fine motion microscope carrier 24 or XY coarse motions microscope carrier 22 be ( Reference picture 1)) base 25a, Y direction can be displaced into set (such as 10~100mm degree) stroke with respect to base 25a Pin 25b and actuator (not shown) to drive pin 25b.The leading section (end of+Z sides) for selling 25b is kept compared with substrate Past+Z sides are protruded above tool 26.Also, in the+Y sides of substrate holding 26, in X-direction, with predetermined distance, (opposed pair Y is pressed Pressure pin device 25y is symmetrical above and below in paper across substrate holding 26) it is configured with a pair of Y dowel devices 27y.Y alignment pins are filled 27y is put in addition to pin is to fix this point, it is roughly the same with Y pressing pin assemblies 25y to constitute.In addition, a pair of Y pressing pin assemblies 25y is also configured under+Y the sides of substrate holding 26, this situation, and a pair of Y dowel devices 27y are then configured at substrate holding 26-Y sides.Also, also can be respectively at-Y the sides of substrate holding 26 ,+Y sides configuration Y pressing pin assemblies 25y.
Also, in the+X sides of substrate holding 26, a pair of X pressing pin assemblies 25x are configured with predetermined distance in Y direction.X Pressing pin assembly 25x have be fixed on substrate holding 26 (but also fine motion microscope carrier 24 or (the equal reference picture of XY coarse motions microscope carrier 22 1) base 25a), can with respect to base 25a with set (such as 1~100mm degree) stroke be displaced into Y direction pin 25b, And the actuator (not shown) to drive pin 25b.Herein, X presses the pin 25b that pin assembly 25x has, can be in leading section Decline above substrate holding 26 toward the position that+Z sides are protruded with leading section compared with past-Z sides above substrate holding 26 Driven between position in above-below direction.Also, in the-X sides of substrate holding 26, in Y direction with predetermined distance (opposed pair X Pressing pin assembly 25x is symmetrical in paper across substrate holding 26) it is configured with a pair of X dowel devices 27x.X alignment pins Device 27x is roughly the same with X pressing pin assemblies 25x to constitute in addition to pin is to fix this point.Above-mentioned X pressing pin assemblies 25x, X Dowel device 27x, Y press pin assembly 25y and Y dowel device 27y, in prealignment of the substrate P to substrate holding 26 Used during action.
Substrate-replacing apparatus 30, for be held in the substrate P of substrate holding 26 from the taking out of of substrate holding 26, And substrate P moving into the substrate holding 26 of empty (not keeping substrate P).As shown in figure 1, substrate-replacing apparatus 30 is configured In+X the side regions of baseplate carrier device 20, it is arranged on ground 11.Baseplate carrier device 20 is contained in substrate-replacing apparatus 30 In the process chamber (not shown) that liquid crystal exposure apparatus 10 has.
Substrate-replacing apparatus 30 has pallet 32, bottom plate 34, substrate drive device 36 and multiple air guide devices 38.Pallet 32 is made up of the low tables' shape component of the height being arranged on ground 11.Bottom plate 34 is by the plate with X/Y plane configured in parallel Shape component is constituted, shown in such as Fig. 3 (A), through the x-ray guiding element 33a being fixed on above pallet 32 with being fixed on below bottom plate 34 Multiple X saddles 33b constitute multiple (such as four) x-ray guiding devices 33 be equipped on pallet 32.Bottom plate 34 passes through bag Containing the X stators 31a that is fixed on above the pallet 32 and X being fixed on below bottom plate 34 can mover 31b constituted it is multiple (for example Two) the backplane drive system of x-ray motor 31, suitably driven in X-direction with set stroke on pallet 32.
Fig. 1 is returned to, object is moved into driving during the switching motion of substrate P of the substrate drive device 36 on substrate holding 26 Or take out of the substrate P of object.Substrate drive device 36 possesses X drive divisions 40, pillar 42 and absorption layer 44.X drive divisions 40 have There is X fixed part 40a and X movable parts 40b.X fixed parts 40a is made up of the component for extending X-direction, is fixed on above bottom plate 34 The central portion (reference picture 2 and Fig. 3 (A)) in Y direction.X movable parts 40b passes through on being equipped on above X fixed parts 40a Comprising stator that for example X fixed parts 40a has and X movable parts 40b have can the driving of x-ray motor that is constituted of mover System, along X fixed parts 40a in X-direction with the stroke for example with the X-direction size same degree of substrate P by straight driving.This Outside, the species of the actuator to drive above-mentioned bottom plate 34 and X movable parts 40b is not particularly limited, and also be can be and is for example fed spiral shell Lever apparatus, belt drive etc..
Pillar 42 is made up of the component for extending X-direction, and bottom is integrally attached to X movable parts 40b.Absorption layer 44 by XZ sections are constituted against the component of L-shaped, and the part parallel with X/Y plane is formed as overlooking the tabular of rectangle.Absorption layer 44 is connected to The function of substrate adsorption face is played above not shown vacuum plant, the above-mentioned part parallel with X/Y plane.Absorption layer 44 The part parallel with YZ planes one face to the one side near the upper end of pillar 42 (towards the face of-X sides).Absorption layer 44 It is to be installed into through Z linear guides 46 (by the Z linear guides 46a for the one side (- X sides) for being fixed on above-mentioned pillar 42 Multiple Z sliding components 46b of the part (+X side) parallel with YZ planes with being fixed on above-mentioned absorption layer 44 are constituted) relative branch Post 42 may move in Z-direction.Also, absorption layer 44 is the Z actuators 48 (such as cylinder) by being installed on X movable parts 40b, (substrate adsorption face) past+Z sides above respective compared with substrate holding 26 and multiple air guide devices 38 are protruded in the above Position and it is driven in Z-direction compared between the position declined above substrate holding 26 and multiple air guide devices 38.
Each of multiple air guide devices 38 is made up of the cuboid component using X-direction as length direction, through branch Post 37a is equipped on central floor panel 37b.Shown in central floor panel 37b such as Fig. 3 (A), not hinder aforesaid substrate drive device 36 The mode that pillar 42 is moved is provided with such as two in Y direction with predetermined distance.The central floor panel 37b of such as two, each Bottom plate 34 is connected to through pillar 37c.Therefore, multiple air guide devices 38 are integratedly displaced into X-direction with bottom plate 34.Such as Shown in Fig. 2, multiple air guide devices 38 are separated each other in the way of below substantially uniformly supporting substrate P with predetermined distance matches somebody with somebody Put.In this 1st embodiment, the institute of air guide device 38 of multiple (such as three) that are arranged in X-direction with predetermined distance The air guide device row of composition are with predetermined distance to be arranged with multiple row (such as six row) in Y direction, and to add up to such as ten The supporting substrate P from below of the air guide device 38 of eight.In addition, the number of air guide device 38 and configuration and passing through Shape in substrate guided face of multiple formation of air guide device 38 etc. can be depending on suitably changing such as the size of substrate P.
Multiple air guide devices 38 are respective to be formed with multiple small hole portions (not shown) above.Also, multiple air are led Each of leading-in device 38 is selectively connected with not shown gas-pressurized feeding mechanism and vacuum suction device (not shown). Multiple air guide devices 38 each, can pass through it is being supplied from above-mentioned gas-pressurized feeding mechanism through above-mentioned multiple hole portions plus Body suspension support of calming the anger loads the substrate P (non-contact support) in face thereon, and can be by saturating from above-mentioned vacuum suction device The pull of vacuum absorption for crossing above-mentioned multiple hole portions (or other hole portions) supply keeps loading the substrate P in face thereon.
Herein, action is moved into using what Fig. 4 (A)~Fig. 4 (C) illustrated the substrate P carried out using substrate-replacing apparatus 30.Liquid In brilliant exposure device 10, substrate P moves into action and from substrate holding 26 described later takes out of substrate to substrate holding 26 Take out of the action switching motion of substrate P (hereinafter collectively referred to as), be that set substrate exchange position is located at substrate holding 26 In the state of carry out.Substrate exchange position is set near+X the side ends of fixed seat 18.It is located at substrate in substrate holding 26 Exchange in the state of position (substrate holding 26 is configured at the state of the position being shown in phantom in Fig. 1), as shown in Fig. 4 (A), Multiple air guide devices 38 are abutted with substrate holding 26 in X-direction, pass through the base of multiple air guide devices 38 formation Plate guiding face above substrate holding 26 with forming continuous guiding face.
It is by the Z of substrate holding 26 when being moved into substrate P toward baseplate carrier device 20 using substrate-replacing apparatus 30 Position is positioned to the Z location above substrate holding 26 turns into roughly the same with the Z location above multiple air guide devices 38 (or the side of substrate holding 26 is relatively low a little).Also, X pressing pin assemblies 25x pin 25b position is controlled so as to upper end compared with substrate Tool 26 is kept to be located at-Z sides (not protruding) above.In substrate-replacing apparatus 30, such as shown in Fig. 4 (A), the Y near+X side ends The adsorbed substrate P for being held in absorption layer 44 of the central portion of direction of principal axis, by absorption layer 44 by toward -X direction driving along by many The guiding face movement that individual air guide device 38 is formed with substrate holding 26 above above.
Then, as shown in Fig. 4 (B), after+X the side ends of substrate P are located at and more lean on-X sides compared with X pressing pin assemblies 25x, such as Shown in Fig. 4 (C), absorption layer 44 is that the absorption for releasing substrate P is kept, and is driven toward +X direction.Also, X pressing pin assemblies 25x pin 25b is driven toward +Z direction and -X direction.Thereby ,+X the side ends of substrate P are pressed by pin 25b, and-X the side ends of substrate P are abutted In X dowel device 27x, prealignment of the substrate P in X-direction is carried out.Also, although not shown, but similarly, pass through Y pushpins Device 25y presses the-Y side ends of substrate P in+Y sides, to carry out prealignment of the substrate P in Y direction.In addition, also can such as scheme In the movement of substrate P shown in 4 (A), desorb absorption of the pad 44 to substrate P and keep, separate the absorption layer 44 and substrate P, Substrate P is moved by inertia force.Also, also can be in the Y direction central portion formation absorption of+X side ends of substrate holding 26 The pluggable breach of the part of pad 44.Under this situation, due to that can use on the adjustment substrate holding 26 of substrate drive device 36 The X position of substrate P, therefore do not need above-mentioned X pressing pin assembly 25x and X dowel devices 27x.
Fig. 2 is returned to, pendulous support device 50 is to be used to that substrate holding will be held in together with aforesaid substrate switch 30 The substrate P of tool 26 takes out of action from what substrate holding 26 took out of.Pendulous support device 50 is arranged to fill baseplate carrier Put 20 to be located in the state of substrate exchange position, positioned at the top of substrate holding 26.
Pendulous support device 50 has multiple noncontact grip devices 52.Noncontact grip device 52 is also known as bernoulli folder Tool, its composition is disclosed in such as 5,067, No. 762 specification of U.S. Patent No. etc..That is, in multiple noncontact grip devices 52 Each be connected with not shown gas supply device, below the pendulous support device 50 with above substrate P across set Space in the state of, each of multiple noncontact grip devices 52 above substrate P to spraying at a high speed gas-pressurized (such as air).Then, by high speed by multiple noncontact grip devices 52 it is respective below and substrate P above between gas The effect (so-called bernoulli effect and jet effect) of body, the power (attraction) along weight direction up is produced to substrate P Effect, substrate P keeps (attracting holding) by the noncontact of pendulous support device 50.
In this 1st embodiment, though will such as two can equably make attraction act on the overall mode of substrate P 15 noncontact grip devices 52 are configured in X-direction and Y direction with predetermined distance, but the number of noncontact grip device 52 Mesh and configuration are not limited to this, also visual suitably to be changed such as the size of substrate P.
Multiple noncontact grip devices 52, be with suspend in midair the state of support be installed on by Y direction with predetermined distance Multiple rod members parallel with X-axis of configuration and the multiple bar-shaped structures parallel with Y-axis configured in X-direction with predetermined distance Part is formed as netted supporting member 54 (reference picture 1).Supporting member 54 is by multiple (for example, four in this 1st embodiment Platform) Z actuators 56 are driven in Z-direction (above-below direction) with predetermined stroke.Z actuators 56 possess to pass through branch (not shown) Z fixed parts 56a and relatively should that the state of support component and the physical separation of baseplate carrier device 20 is arranged in 11 (reference pictures 1) of ground Z fixed parts 56a is driven in the Z movable part 56b of Z-direction, and above-mentioned supporting member 54 is connected with Z movable parts 56b.
Hereinafter, the base in the face, referred to as pendulous support device 50 that are formed below multiple noncontact grip devices 52 will be passed through Plate holder surface illustrates.Pendulous support device 50, by by substrate P noncontact keep in the state of supporting member 54 driven In Z-direction, substrate P is integratedly displaced into Z-direction with supporting member 54.Thereby, pendulous support device 50 can be positioned at base The top that plate exchanges the substrate holding 26 of position makes to move above and below substrate P.In addition, making supporting member actuator dynamic about 54 Species can be changed suitably, suspended supporting member 54 in midair such as can also restrict, made supporting member about 54 by the way that the rope is rolled It is dynamic.
Also, as shown in figure 1, being each configured near+X the sides of supporting member 54 ,-X sides ,+Y sides and-Y side ends The pin 58 protruded below supporting member 54 toward lower section (pin 58 of+Y sides and-Y sides is not shown).Multiple pins 58 are configured to make It is relative with restricting substrate P with the periphery that the substrate P is surrounded in the state of multiple pendulous support substrate Ps of noncontact grip device 52 The movement that is not intended to of the pendulous support device 50 toward the direction parallel with X/Y plane.As long as in addition, the number of pin 58 can be limited The movement being not intended to of substrate P is stated, is not particularly limited.Also, being configured at the pin near the+X side ends of supporting member 54 58, can be in bottom compared with the position that substrate retaining surface is not protruded with bottom toward the position that lower section is protruded compared with substrate retaining surface toward lower section Driven between putting and (not hindering substrate P relative to the position of the movement toward +X direction of pendulous support device 50).In addition, can also make many Individual pin 58 may move in X-axis and/or Y direction, and be pressed by using the plurality of pin 58 by multiple noncontact grip devices 52 The end of the substrate P of pendulous support, carries out aligned in position (prealignment) of the substrate P in X/Y plane.
Also, substrate P is removed outside liquid crystal exposure apparatus 10 as shown in figure 1, having in the exterior arrangement of liquid crystal exposure apparatus 10 The outside conveyance mechanical arm 99 entered in liquid crystal exposure apparatus 10 (only illustrates what outside conveyance mechanical arm 99 had in Fig. 1 and Fig. 2 Arm member 98).As shown in Fig. 2 arm member 98 has multiple supporting part 98a by being constituted with the tabular component that X-axis is extended in parallel With the connecting portion 98b for being interconnected with one another multiple supporting part 98a one end, also known as forks arm (fork hand) etc..Remove outside Send mechanical arm 99, although not shown but with for example arm member 98 can at least be driven with predetermined stroke in X-direction and Z axis (on Under) drive device (such as mechanical arm) in direction.
Herein, in the arm member 98 of outside conveyance mechanical arm 99, multiple supporting part 98a are in order to suppress the bending of substrate P Configured in Y direction with the interval of approximate equality.Also, multiple air guide devices that above-mentioned substrate-replacing apparatus 30 has 38 Y direction interval, is to consider above-mentioned multiple supporting part 98a Y direction interval to determine.It is described as follows, it is multiple The Y direction interval of air guide device 38, is set as being located at the state on the plurality of air guide device 38 in arm member 98 Multiple supporting part 98a of the lower relative arm member 98 do not overlap in Y direction.Whereby, can be by air guide device 38 across both Fixed space is inserted between adjacent supporting part 98a.
The liquid crystal exposure apparatus 10 (reference picture 1) constituted in the above described manner, is the management in not shown main control unit Under, the loading to the mask M on mask bearing table device 14 is carried out by mask loader (not shown), and fill by substrate exchange Put loading of 30 progress to the substrate P on substrate holding 26.Thereafter, by main control unit, examined using not shown alignment Survey is performed to locating tab assembly, and after this pair of locating tab assembly terminates, stepping is gradually carried out to the multiple irradiation areas being set in substrate P The exposure actions of scan mode.Further, since this exposure actions is identical with the exposure actions of the step-scan mode of existing progress, Therefore it describes what is omitted in detail.Then, the substrate P of exposure-processed has been terminated by substrate-replacing apparatus 30 from substrate holding 26 On take out of, and it is secondary one exposure other substrate Ps be transported to substrate holding 26, thereby carry out substrate holding 26 on substrate Multiple substrate Ps are carried out continuously exposure actions etc. by P exchange.
Hereinafter, illustrate that the substrate P on the substrate holding 26 in liquid crystal exposure apparatus 10 (is using Fig. 5 (A)~Fig. 8 (B) Explanation is convenient, and multiple substrate Ps are referred to as into substrate P 1, substrate P 2, substrate P 3) switching motion.Following substrate exchange action, It is to be carried out under the management of not shown main control unit.In addition, for the simplification of diagram, in Fig. 5 (A)~Fig. 8 (B), by base Onboard table apparatus 20, substrate-replacing apparatus 30 and pendulous support device 50 each respectively simplify (a part of key element is not expected Show) display.
Fig. 5 (A) be displayed at being placed with substrate holding 26 the baseplate carrier device 20 of the substrate P 1 that exposure is finished from Exposure actions end position is moved to the state of substrate exchange position.In multiple air guide devices 38 of substrate-replacing apparatus 30 On, it is placed with the substrate P 2 that exposure-processed is scheduled for after substrate P 1.In addition, Fig. 5 (A) though in eliminate the diagram of action, But in substrate-replacing apparatus 30, moved accordingly toward substrate exchange position with baseplate carrier device 20, multiple air guiding dresses 38 are put by the past -X direction of driving (close to the direction of baseplate carrier device 20).Also, being located at substrate exchange in baseplate carrier device 20 Behind position (or during baseplate carrier device 20 is moved toward substrate exchange position), pendulous support device 50 is to decline that driving is multiple non-to be connect Touch grip device 52.
Baseplate carrier device 20, in the state of substrate exchange position, such as shown in Fig. 5 (B), releases substrate holding The absorption of 26 pairs of substrate Ps 1 is kept, and to spraying gas-pressurized below the substrate P 1 above substrate holding 26.Also, outstanding Vertical support meanss 50, are to spray gas at a high speed, thereby to the acting gravity force direction of substrate P 1 from multiple noncontact grip devices 52 Power (suspending power) (direction flowed but show power of the non-display gas of arrow in Fig. 5 (B)) up, the substrate P 1 is inhaled It is attached to be held in pendulous support device 50.Also, substrate-replacing apparatus 30, from multiple air guide devices 38 to being sprayed below substrate P 2 Go out gas-pressurized, the substrate P 2 suspends on multiple air guide devices 38.Also, the absorption of absorption layer 44 is kept under substrate P 2 Face.Secondly, such as shown in Fig. 5 (C), the pendulous support device 50 that absorption maintains substrate P 1 is raised below driving, substrate P 1 Separated with above substrate holding 26.
Hereafter, as shown in Fig. 6 (A), absorption layer 44 is by the past -X direction of driving.Whereby, substrate P 2 is guided along multiple air and filled The guiding face movement put above 38 and formed above substrate holding 26.Hereinafter, as described above, being in substrate holding It is (not shown in Fig. 6 (A) using X pressing pin assembly 25x and Y pressing pin assemblies 25y on 26.Reference picture 4 (A)~Fig. 4 (C)) carry out After prealignment, substrate P 2 is adsorbed to be held in substrate holding 26.Aforesaid substrate P2 it is mobile when, and prealignment action When, it is standby in substrate exchange position in the state of holding is adsorbed by pendulous support device 50 to expose the substrate P 1 finished.With Under, baseplate carrier device 20 is past both from substrate exchange position to the exposure actions of substrate P 2 in order to carry out such as shown in Fig. 6 (B) Fixed exposure actions starting position movement.
After baseplate carrier device 20 leaves from substrate exchange position, such as shown in Fig. 6 (C), pendulous support device 50 is had The multiple noncontact grip devices 52 having are lowered by driving.Now, the Z location of substrate P 1, being oriented to absorption layer 44 can adsorb Keep the position below substrate P 2 that is, the Z location with being moved to the substrate P 1 of (reference picture 6 (A)) during substrate holding 26 It is roughly the same.
Hereinafter, as shown in Fig. 7 (A), the absorption layer 44 that absorption maintains below substrate P 1 is driven toward +X direction, by This, substrate P 1 is along the guiding face formed below multiple noncontact grip devices 52 and above multiple air guide devices 38 It is mobile.Now, the pin 58 (not shown, reference picture 1 in Fig. 7 (A)) of+X sides of pendulous support device 50 is not to be contacted with substrate P 1 Mode keep out of the way.In addition, Fig. 7 (A)~Fig. 8 (B) though in for convenience of description and illustrating has the baseplate carrier that maintains substrate P 2 Substrate P 1 on device 20, but the substrate-replacing apparatus 30 illustrated below is moved with the switching motion of substrate P 3 with the exposure of substrate P 2 Work is parallel progress, and the physical location of baseplate carrier device 20 is different.
Then, as shown in Fig. 7 (B), after substrate P 1 is transported to multiple tops of air guide device 38, that is, desorb Absorption of the pad 44 to substrate P 1 is kept, and the absorption layer 44 is lowered by driving.Also, from air guide device 38 under substrate P 1 The ejection of the gas-pressurized in face stops.Also, in Fig. 7 (B) though in the diagram that acts of omission, it is multiple in substrate-replacing apparatus 30 Air guide device 38 is driven toward +X direction (direction left from baseplate carrier device 20).In addition, multiple air guidings The X position of device 38 can also be fixed.
Hereafter, it is outside to liquid crystal exposure apparatus 10 (reference picture 1) in order to which substrate P 1 is taken out of, and as shown in Fig. 7 (C), outside The arm member 98 of portion's conveyance mechanical arm 99 is raised driving after the underlying space of insertion substrate P 1.Now, as described above, outside The arm member 98 of portion's conveyance mechanical arm 99 is not contacted with multiple air guide devices 38.Whereby, substrate P 1 by the arm member 98 from Supported underneath, the arm member 98 is by driving toward +X direction in this case, and substrate P 1 is taken out of to liquid crystal exposure apparatus 10 whereby (reference picture 1) outside.In addition, in Fig. 7 (B), though absorption layer 44 is declined in order to avoid the contact with arm member 98 of absorption layer 44 Driving, but can also make absorption layer 44 toward -X direction movement to avoid the contact with arm member 98.
Hereinafter, as shown in Fig. 8 (A), the arm member 98 of outside conveyance mechanical arm 99 (but also take out of substrate P 1 with above-mentioned Arm member 98 it is identical, also can be other), the substrate P 3 that exposure-processed is scheduled for after substrate P 2 is transported to multiple air Behind the top of guiding device 38, as shown in Fig. 8 (B), the arm member 98 of said external conveyance mechanical arm 99 by driving toward -Z direction and- X-direction, substrate P 3 is placed on multiple air guide devices 38.Whereby, state (but, substrate P 1 shown in Fig. 5 (A) is returned to Substrate P 2 is replaced with, substrate P 2 replaces with substrate P 3).In addition, can also be handed over to multiple air guide devices 38 in substrate P 3 After upper, the aligned in position (alignment) of the substrate P 3 is carried out with the state being suspended on multiple air guide devices 38.Above-mentioned alignment, Such as can while with edge sensor or CCD (Charge Coupled Device) video camera detect substrate P 3 end (side Edge) position, while many places of the end of pressing substrate P 3, are thus carried out.Hereinafter, by the way that Fig. 5 (A)~Fig. 8 (B) is repeated Shown action, to be carried out continuously exposure actions to multiple substrate Ps.
The embodiment of sheet the 1st from the description above, due to make exposure finish substrate P 1 standby in substrate exchange position In the state of (keeping out of the way from the moving-in path of the substrate P 2 of then predetermined exposure), carry out substrate P 2 moves into action, and is somebody's turn to do After substrate P 2 is to the transfer of baseplate carrier device 20, substrate P 1 is taken out of from above-mentioned position of readiness, therefore with for example exposing Taking out of after release for complete substrate P 1, starts substrate P 2 and the situation for moving into action of baseplate carrier device 20 is compared, energy Shorten the circulation time of substrate exchange.
Also, typically, due to compared to the time required for the exposure actions to substrate P 2, exposing the substrate P 1 finished Taking out of required for action and substrate P 3 are acted to the mounting on multiple air guide devices 38 outside toward liquid crystal exposure apparatus 10 Time it is shorter can (untill terminating to the exposure actions of substrate P 2 before can prepared substrate P3), therefore such as this embodiment institute Show, even if the action that takes out of of the substrate P 1 finished compared with exposure preferentially carries out substrate P 2 and moves into action, for it is multiple (for example More than three) overall throughput of substrate P when being carried out continuously exposure-processed have no influence.
Also, in pendulous support device 50, because multiple noncontact grip devices 52 can be dynamic up and down, therefore substrate P can be made Moving-in path is identical with taking out of path, and can make the save space of liquid crystal exposure apparatus 10.Also, to drive substrate P (substrate P 1~ P3 drivetrain (being substrate drive device 36 in this embodiment)) is one, it is not necessary to be independently arranged the drive moved into Dynamic system and the drivetrain taken out of.Therefore, the composition of liquid crystal exposure apparatus 10 is simple, and cost can also decline.
Also, though pendulous support device 50 is multiple noncontact grip devices 52 sprays gas to (plane of exposure) above substrate P Body, but because the substrate P for being held in pendulous support device 50 is that exposure is finished, if therefore include dust in above-mentioned gas-pressurized Also without ill-exposed phenomenon.Also, multiple noncontact grip devices 52 are because the position in X/Y plane is fixes, therefore make substrate The possibility that P is fallen is also few.
In addition, the composition of the liquid crystal exposure apparatus 10 of above-mentioned 1st embodiment can be changed suitably.For example, also can be such as Fig. 3 (B) the substrate-replacing apparatus 30a shown in, being configured to multiple air guide devices 38 can be dynamic up and down.Illustrate, handed in substrate In changing device 30a, multiple air guide devices 38 are to replace the pillar 37c of the substrate-replacing apparatus 30 shown in Fig. 3 (A) and change It is supported on Z actuators 37d on bottom plate 34a.The substrate that exposure is finished is being taken out of from baseplate carrier device 20 (reference picture 1 etc.) During P, compared in above-mentioned 1st embodiment for decline driving pendulous support device 50 (reference picture 6 (C)), the base of this variation As long as multiple air guide devices 38 are then risen driving by plate switch 30a.As long as in addition, now by absorption layer 44 The movable travel settings of Z-direction are that more above-mentioned 1st embodiment length is kept below substrate P with adsorbing.
Thereby, due to the substrate P finished can be exposed in the case of the Z location of pendulous support device 50 is not changed Take out of, therefore the action of pendulous support device 50 can be simplified.Also, due to driving pendulous support device 50, therefore energy need not be declined Without waiting for baseplate carrier device 20 since substrate exchange position (lower section of pendulous support device 50) keeps out of the way i.e. completely substrate Take out of action.Accordingly, it is capable to shorten the time of substrate exchange action.Also, the X fixed part 40a to drive absorption layer 44, also can be such as It is fixed on pallet 32 that (X fixed parts 40a can not also be displaced into X-axis side in itself as substrate-replacing apparatus 30a shown in Fig. 3 (B) To).Under this situation, as long as bottom plate 34a is respectively arranged at into X fixed parts 40a side and opposite side and synchronously driven this pair Bottom plate 34a.
《2nd embodiment》
Secondly the 2nd embodiment (and its variation) is illustrated using Fig. 9~Figure 12 (C).In addition, to the 2nd of following explanation the ~the 4 embodiment and this etc. variation in above-mentioned 1st embodiment identical inscape, assign with the above-mentioned 1st Embodiment identical symbol, the description thereof will be omitted.
In the liquid crystal exposure apparatus of the 2nd embodiment shown in Fig. 9, baseplate carrier device 60, pendulous support device 50a It is (not shown in Fig. 9.Reference picture 10 (A)) and the composition and above-mentioned 1st embodiment of substrate-replacing apparatus 70 it is different.Substrate Bearing table device 60 such as shown in Figure 10 (A), includes XY coarse motions microscope carrier 22, fine motion microscope carrier 24 and substrate holding 62.XY coarse motions are carried The composition of platform 22 and fine motion microscope carrier 24 (including weight cancellation element 28) is identical with above-mentioned 1st embodiment.Substrate holding 62 It is made up of, is integrally attached to above fine motion microscope carrier 24 tabular component of vertical view rectangle.
As shown in figure 9, above substrate holding 62, a plurality of (reality of sheet the 2nd is formed with predetermined distance in Y direction Apply in form is, for example, six) extend the X grooves 62a of X-direction.Guide and fill inserted with air in each of multiple X grooves 62a Put 64.Air guide device 64 is made up of the component for extending X-direction, the X being dimensioned so as to substrate P of its length direction Direction of principal axis size same degree (being short a little in this 2nd embodiment).It is formed with above air guide device 64 multiple Small hole portion (not shown).The gas-pressurized supply being arranged at outside baseplate carrier device 60 is connected with air guide device 64 Device (not shown), can spray gas-pressurized from above-mentioned multiple small hole portions.
Also, as shown in Figure 10 (A), in air guide device 64 below and be air guide device 64 length direction two ends Near portion, the foot 66 for extending Z-direction is fixed with.In to provide that above-mentioned X grooves 62a bottom surface is formed with a pair above and below Direction through substrate keeps the through hole 62b of tool 62, has foot 66 in each insert of a pair of through hole 62b.XY coarse motions are carried Platform 22 accordingly has a pair of Z actuators 68 with above-mentioned a pair of foots 66.Air guide device 64, passes through a pair of Z actuators 68, and above above substrate holding 26 toward top protrude position with above compared with above substrate holding 26 down Its Z location is appropriately controlled between the position (air guide device 64 is contained in X grooves 62a position) that side declines.
The composition of pendulous support device 50a shown in Figure 10 (A), except the multiple noncontact grip devices 52 of suspention support Beyond the Z location of supporting member 54 is fixed (not having Z actuators 56 (reference picture 1)) this point, other are then implemented with the above-mentioned 1st Homomorphosis.
It (is with predetermined distance in Y direction in this 2nd embodiment that substrate-replacing apparatus 70 shown in Fig. 9, which has many, Provided with such as six) air guide device 74.Air guide device 74 is the air guide device 64 with substrate holding 62 It is similarly (a little compared with its width) to constitute.That is, air guide device 74 is made up of the component for extending X-direction, such as Figure 11 (A) It is shown, in below with a pair of foots 76.Air guide device 74 by be fixed on a pair of Z actuators 78 of bottom plate 34 by with Predetermined stroke is driven in Z-direction.
Multiple small hole portions (not shown) are formed with above air guide device 74.Connected in air guide device 74 There is gas-pressurized feeding mechanism (not shown), gas-pressurized can be sprayed from above-mentioned multiple small hole portions.In this 2nd embodiment, The multiple air guide devices 64 and/or substrate-replacing apparatus 70 that substrate P has from aforesaid substrate bearing table device 60 are had Multiple air guide devices 74 supported from below, air guide device 64,74 pass through to below substrate P spray pressurization gas Body, carrys out suspension support substrate P (non-contact support).In addition, the composition of the substrate drive device 36 shown in Fig. 9 is due to above-mentioned 1 embodiment is identical, therefore omits the description.
Hereinafter, the substrate exchange for illustrating the 2nd embodiment using Figure 11 (A)~Figure 12 (C) is acted.Figure 11 (A) displays are protected The baseplate carrier device 60 for holding the substrate P 1 that exposure is finished is located at substrate exchange position (pendulous support device 50a lower section) State.Also, in being placed with substrate P 2 on the air guide device 74 of substrate-replacing apparatus 70.It is configured at the base of substrate exchange position Onboard table apparatus 60, such as shown in Figure 11 (B), air guide device 64 is risen driving by pendulous support device 50a extremely can adsorb guarantor Hold the position of (pendulous support) substrate P 1.Pendulous support device 50a absorption keeps substrate P 1, same with above-mentioned 1st embodiment Ground, make substrate P 1 from substrate P 2 path of motion retreat to substrate P 2 to baseplate carrier device 60 move into release untill. Also, in substrate-replacing apparatus 70, the absorption of absorption layer 44 keeps substrate P 2.
After substrate P 1 is handed over to pendulous support device 50a, such as shown in Figure 11 (C), decline driving air guide device 64.Now, it is to control Z actuators 68 Z location above air guide device 64 is turned into the air with substrate-replacing apparatus 70 Z location above guiding device 74 is roughly the same (or low a little).In this case, it is by the Z location of air guide device 74 Be set to above air guide device 64 be located at compared with above substrate holding 62 more lean on+Z sides.
Secondly, such as shown in Figure 12 (A), absorption layer 44 is by the past -X direction of driving.Thereby, substrate P 2 guides dress along by air Put the guiding face above 74 with being formed above air guide device 64 to move, air is transferred load to from air guide device 74 On guiding device 64.Hereinafter, although not shown, but absorption layer 44 is after the absorption for releasing substrate P 2 is kept, by being driven past-Z Direction and +X direction and above substrate P 2 and substrate holding 62 between pulled out after, such as shown in Figure 12 (B), decline and drive Dynamic air guide device 64, substrate P 2 is placed in above substrate holding 62.And then, although not shown, but absorption layer 44 be by Drive toward +Z direction and -X direction, and adsorb and keep below substrate P 1.Also, in substrate-replacing apparatus 70, rising driving empty Conductance leading-in device 74.Now, it is to control Z actuators 78 so as to relatively be held in pendulous support device above air guide device 74 Z location below 50a substrate P 1 slightly leans on-Z sides.
Hereafter, as shown in Figure 12 (C), sprayed gas-pressurized from air guide device 74 above, absorption layer 44 by driving it is past+ X-direction.Thereby, each defined of the substrate P 1 along multiple noncontact grip devices 52 and multiple air guide devices 74 is led Draw face movement, and be placed on multiple air guide devices 74.Hereinafter, in the same manner as above-mentioned 1st embodiment, in multiple air On guiding device 74, carried out using outside conveyance mechanical arm 99 (being not shown in Figure 12 (C)) after substrate P 1 and substrate P 2 It is scheduled for the switching motion (reference picture 7 (B)~Fig. 8 (B)) of other substrates (not shown) of exposure-processed.
The 2nd embodiment from the description above, due to being in the same manner as above-mentioned 1st embodiment, to make what exposure was finished The moving-in path of substrate P 1 from substrate P 2 is kept out of the way, and the action that takes out of compared with the substrate P 1 preferentially carries out substrate P 2 and moves into action, Therefore the swap time of substrate P can be shortened.
Also, in this 2nd embodiment, because multiple air guide devices 74 can be dynamic up and down, even if therefore not making multiple non- Contact grip device 52 and decline driving, also substrate P 1 can directly be taken out of from retreating position.Therefore, can be as shown in Figure 12 (C) Baseplate carrier device 60 is located in the state of substrate exchange position, carry out the taking out of of substrate P 1 (also can with to the pre- of substrate P 2 Alignment actions are parallel), the time needed for the switching motion of substrate P can be shortened.Also, by baseplate carrier device 60 have it is many Individual air guide device 64 can be dynamic up and down, therefore from baseplate carrier device 60 substrate P can be handed over into pendulous support device 50a. Accordingly, it is capable to which the Z location of fixed multiple noncontact grip devices 52, can make pendulous support device 50a composition simple.
In addition, the composition of the liquid crystal exposure apparatus of above-mentioned 2nd embodiment can be changed suitably.For example, also can be such as Figure 10 (B) As shown baseplate carrier device 60a, by (the reference picture of air guide device 64 of more above-mentioned 2nd embodiment of X-direction size 10 (A)) short multiple (being such as three in this variation) air guide device 64a are contained in X in X-direction with predetermined distance In groove 62a.Multiple air guide device 64a, by being formed at what is housed in the recess 62c to regulation X grooves 62a bottom surface Z actuators 69 (such as cylinder unit) are synchronously driven.Though also, non-icon, the air guide device of substrate-replacing apparatus 70 74 (reference pictures 9) also can be constituted similarly.
《3rd embodiment》
Secondly, the 3rd embodiment (and its variation) is illustrated using Figure 13 (A)~Figure 14 (B).In this 3rd embodiment, Though the composition of baseplate carrier device 60 is identical with above-mentioned 2nd embodiment, the composition of pendulous support device 50 is implemented with the above-mentioned 1st Homomorphosis, but the action (control of main control unit) during substrate exchange action is different.Also, substrate-replacing apparatus 70a, though with Above-mentioned 2nd embodiment shown in Fig. 9 similarly there are multiple air guide devices 74 (to be hidden in Figure 13 (A)~Figure 14 (B) In paper depth direction), but the key element without equivalent to substrate drive device 36 (reference picture 9).
It is the conveyance that substrate P is carried out using the deadweight of substrate P in 3rd embodiment.Figure 13 (A) is that display will expose Complete substrate P 1 is handed over to the state after pendulous support device 50.In the multiple (in Figure 13 (A)~Figure 14 of baseplate carrier device 60 (B) paper depth direction is hidden in) air guide device 64 substrate P 1 is handed over to pendulous support device 50 after be lowered by It is control Z actuators 68 so that air is led though it is identical with above-mentioned 2nd embodiment to drive this to put, in this 3rd embodiment The Z location of+X sides (substrate-replacing apparatus 70a sides) end of leading-in device 64 is compared with the Z location height of-X side ends, i.e. by multiple The guiding face of the formation of air guide device 64 turns into the inclined plane of relative X/Y plane.
Also, the sky of baseplate carrier device 70a multiple (being hidden in paper depth direction in Figure 13 (A)~Figure 14 (B)) Conductance leading-in device 74 is also control Z actuators 78 so that the Z location of+X side ends is compared with-X sides (baseplate carrier device 60 similarly Side) end Z location it is high, turn into the inclination of relative X/Y plane i.e. by the guiding face of multiple air guide devices 74 formation Face.Herein, Z actuators 68,78 each, be controlled so as to multiple air guide devices 64 and air guide device 74 each The guiding face formed forms single (no segment difference (or segment difference will not as low as be impacted to the movement of substrate P 2)) guiding face. Specifically, the angle of each guiding face formed (inclined plane) of multiple air guide devices 64 and air guide device 74 Degree be set as it is substantially identical to each other, and the Z location of+X side ends of guiding face that is formed of multiple air guide devices 64 with it is many The Z location of-X the side ends for the guiding face that individual air guide device 74 is formed is set as roughly the same (in fact, by multiple The guiding face that air guide device 74 is formed is higher a little).
Thereby, due to substrate P 2 by multiple air guide devices 64,74 in a non contact fashion (with substantially can neglecting frictional State) support, therefore as shown in Figure 13 (B), substrate P 2 is by conducting oneself with dignity along by multiple air guide devices 64,74 shapes Into guiding face from multiple air guide devices 74 toward moving on multiple air guide devices 64.Hereinafter, implement with the above-mentioned 1st Form similarly, using X presses pin assembly 25x (reference picture 2) etc. and carried out after prealignment action, such as shown in Figure 13 (C), declines and drives Multiple air guide devices 74 are moved, thereby substrate P 2 adsorbs holding by substrate holding 62.
Also, in this 3rd embodiment, exposing the taking out of for substrate P 1 finished and also being carried out using the deadweight of the substrate P 1.Also That is, the prealignment with aforesaid substrate P2 is acted concurrently, and pendulous support device 50 is with by multiple noncontact grip devices 52 The substrate retaining surface formed with respect to the inclined mode of X/Y plane, specifically aforesaid substrate retaining surface+X sides (substrate hand over Changing device 70a sides) end the Z location mode low compared with the Z location of-X side ends, control multiple Z actuators 56 (in Figure 13 (C) It is not shown, reference picture 1 etc.).
Also, substrate-replacing apparatus 70a, each of multiple air guide devices 74 is driven into by multiple air guiding dress Putting the angle of inclination at the angle of inclination of 74 guiding faces formed and the substrate retaining surface of above-mentioned pendulous support device 50 turns into big Cause identical.Therefore, substrate P 1 is 74 shapes of substrate retaining surface and/or multiple air guide devices along pendulous support device 50 Into guiding face movement, and be placed on multiple air guide devices 74.In addition, also can be by make from pendulous support device The brake gear that is intended to position stopping of 50 substrate Ps 2 taken out of on multiple air guide devices 74 is configured at substrate exchange Device 70.
The 3rd embodiment from the description above, because substrate-replacing apparatus 70a does not have to drive wanting for substrate P Element, therefore constitute simple.
In addition, the composition of the liquid crystal exposure apparatus of above-mentioned 3rd embodiment can be changed suitably.For example, as shown in Figure 14 (B) Pendulous support device 50b, supporting member 54b be configured so that it is longer, so as to be formed by multiple noncontact grip devices 52 Substrate retaining surface+X side ends compared with substrate holding 62+X side ends toward X sides protrude, the part of the protrusion is in upper and lower To with being overlapped near-X the side ends of substrate-replacing apparatus 70a air guide device 74.Thereby, can be by substrate P 1 more swimmingly It is handed over to from pendulous support device 50b on multiple air guide devices 74.
《4th embodiment》
Secondly the 4th embodiment is illustrated using Figure 15 (A)~Figure 17 (B).The liquid crystal exposure apparatus of 4th embodiment, base The switching motion of substrate P on onboard table apparatus 60 is the outside conveyance mechanical arm 99 by being configured at outside liquid crystal exposure apparatus Carry out.In addition, the composition of baseplate carrier device 60 is (but, control different) identical with above-mentioned 2nd embodiment, pendulous support Device 50b is in addition in this longer point of the removable stroke of Z-direction, and other are the pendency branch with above-mentioned 1st embodiment Support arrangement 50 (reference picture 1 etc.) identical is constituted and (but, controlled different).In addition, being not provided with equivalent to above-mentioned 1st embodiment Substrate-replacing apparatus 30 or above-mentioned 2nd embodiment substrate-replacing apparatus 70 key element.
The baseplate carrier device 60 that Figure 15 (A) displays maintain the substrate P 1 that exposure is finished is (outstanding positioned at substrate exchange position Hang down support meanss 50b lower section) state.Also,+X the side regions in substrate exchange position, have the outside for being supported by substrate P 2 to remove In sending the arm member 98 of mechanical arm 99 standby.In addition, being supported by the position of readiness of the arm member 98 of substrate P 2, it also can be and contain The inner side of baseplate carrier device 60 and pendulous support device 50b process chamber (not shown), also can be the outside of the process chamber.When When the position of readiness for being supported by the arm member 98 of substrate P 2 is the outside of process chamber, on the baseplate carrier device 60 illustrated below Substrate exchange action is carried out through the opening portion for being formed at process chamber.
Herein, in this 4th embodiment, the arm member 98 of outside conveyance mechanical arm 99 has in Y direction with set Every multiple supporting part 98a (the deep side of paper is overlapped in Figure 15 (A)~Figure 17 (B)) of configuration, baseplate carrier device 60 has (paper is overlapped in Figure 15 (A)~Figure 17 (B) deep in multiple air guide devices 64 that Y direction is configured with predetermined distance Side).Also, multiple supporting part 98a and multiple air guide devices 64, the interval of its Y direction are set to make arm member 98 The position of Y direction does not overlap mutually in the state of the top of substrate holding 62, and (air guide device 64 can be by adjacent Between the supporting part 98a connect).Therefore, the arm member 98 and/or multiple air of the outside conveyance mechanical arm 99 of this 4th embodiment It is conveniently using for same-sign here for explanation though the composition of guiding device 64 is actually different with Fig. 2 or Fig. 9 It is bright.
As shown in Figure 15 (B), in this 4th embodiment, by rising baseplate carrier of the driving positioned at substrate exchange position Multiple air guide devices 64 of device 60, the substrate P 1 that exposure is finished is handed over to pendulous support device 50b.Secondly, such as scheme Shown in 15 (C), rise multiple noncontact grip devices 52 that driving maintains substrate P 1, passing through pendulous support device 50b's Broad spatial is formed between the guiding face that substrate retaining surface and multiple air guide devices 64 are formed.Hereafter, such as Figure 16 (A) institute Show, the arm member 98 for being supported by the outside conveyance mechanical arm 99 of substrate P 2 inserts above-mentioned space.
Hereinafter, (it can also rise the multiple air guidings of driving to fill by declining driving arm member 98 such as Figure 16 (B) arrow Suo Shi Put 64), substrate P 2 is supported from below by multiple air guide devices 64, and then by arm member 98 by the past +X direction of driving, should Arm member 98 is kept out of the way below pendulous support device 50b.Secondly, such as shown in Figure 16 (C), the multiple air guide devices of driving are declined 64, substrate P 2 is placed on substrate holding 62.Also, the outside arm member 98 for transporting mechanical arm 99 concurrently is driven into past+Z Direction.Also, the transfer in the arm member 98 toward the substrate P 2 of substrate holding 62 that carry out transporting mechanical arm 99 from said external is moved In work, substrate P 1 is standby in substrate exchange position in the same manner as above-mentioned 1st~the 3rd embodiment.
Hereinafter, as shown in Figure 17 (A), the baseplate carrier device 20 for maintaining substrate P 2 leaves from substrate exchange position, and The arm member 98 of conveyance mechanical arm 99 is thereby configured at below pendulous support device 50b by driving toward -X direction outside row ground, Multiple noncontact grip devices 52 are lowered by driving under the state, and thereby substrate P 1 is placed in the arm of outside conveyance mechanical arm 99 On component 98.Hereinafter, pendulous supports of the pendulous support device 50b to substrate P 1 is released, and is supported by the arm member 98 of substrate P 1 By driving toward +X direction after absorption keeps substrate P 1, the substrate P 1 is transported to external device (ED) (being for example coated with developing apparatus). Also, concurrently multiple noncontact grip devices 52 are raised driving.
The embodiment of sheet the 4th from the description above, due to baseplate carrier device 60 and outside conveyance mechanical arm 99 it Between directly carry out the transfer action of substrate P, therefore need not set substrate P is transported to the device (example to liquid crystal exposure apparatus Such as equivalent to above-mentioned 1st embodiment (reference picture 7 (C)~Fig. 8 (B)) substrate-replacing apparatus 30 device), liquid crystal can be exposed The composition of electro-optical device is simple.In addition, in this 4th embodiment, though baseplate carrier device 60 has and above-mentioned 2nd embodiment phase Same air guide device 64, but because substrate P is not moved along the air guide device 64, therefore also can be used such as lifter pin dress The device without guidance function put.
In addition, the composition of the 1st~the 4th embodiment (including its variation, as follows) described above can be changed suitably. In for example above-mentioned 1st~the 4th embodiment, though noncontact grip device 52 is by pass the gas through at a high speed and substrate P Above between with the power to the substrate P acting gravity force direction up (+Z direction), but not limited to this also can be used and attract substrate The gas of side is so that the power of +Z direction acts on the substrate P and the substrate P is sprayed gas to keep and the substrate P above P Between space so-called vacuum preloaded air bearing (vacuum preload airbearing).
Also, in above-mentioned 1st~the 4th embodiment, take out of the substrate P of object, though by noncontact grip device 52 from Top is kept pattern plane (above), but as long as substrate P can be made to be left from substrate holding 26,62, then pendulous support device Composition can suitably change, for example using it is multiple near following side contacts supporting substrate P end (from the end of substrate holding 26 Portion is toward region protruding outside) supporting member (for example making absorption layer 44 (reference picture 1) opposite L-shaped component up and down) (also Can with noncontact grip device 52 simultaneously with) come substrate P supported from above.
Also, in above-mentioned 1st and the 2nd embodiment, making the substrate driving that substrate P is moved when moving into and taking out of in substrate P Though device 36 is located at substrate-replacing apparatus 30, not limited to this also can be in the side of baseplate carrier device 20 (or substrate-replacing apparatus 30 and baseplate carrier device 20 each) provided with driving substrate P device.
Also, in above-mentioned 1st~the 4th embodiment (and variation), though in the pendulous support of substrate P 1 for finishing exposure Enter move into action of the substrate P 2 of places one to substrate holding 26, but base in the state of pendulous support device 50 (50a, 50b) The step not limited to this of plate switching motion, for example, can also use substrate-replacing apparatus 30 by secondary one in the exposure actions of substrate P 1 Substrate P 2 is handed over to pendulous support device 50 from multiple air guide devices 38 in advance (makes a time substrate P 2 standby in base in advance Plate exchanges position), after terminating to the exposure actions of substrate P 1, carried out below pendulous support device 50 (50a, 50b) from shifting What the substrate holding 26 moved to substrate exchange position took out of substrate P 1 takes out of action, thereafter, by by noncontact grip device 52 decline driving, and substrate P 2 is placed on substrate holding 26.
Illumination light can be the ultraviolet of ArF PRKs (wavelength 193nm), KrF PRKs (wavelength 248nm) etc. The vacuum-ultraviolet light such as light or F2 laser (wavelength 157nm).In addition, as illumination light, also can be used for example will be from dfb semiconductor The infrared bands or the single wavelength laser of visible band that laser or optical-fiber laser are sent are with for example doped with erbium (or erbium and ytterbium two Person) fiber amplifier be subject to amplification, using nonlinear optical crystal be subject to wavelength convert be ultraviolet light harmonic wave.Furthermore, also Solid State Laser (wavelength can be used：355nm, 266nm) etc..
Though also, it is to be directed to the projection optics system that projection optics system 16 is the poly-lens mode for possessing branched projection optics system Situation is described, but the number not limited to this of projection optics system, as long as more than one.In addition, being not limited to poly-lens The projection optics system of mode, can also be such as using the projection optics system of the large-scale speculum of Ou Funa (Ofner) type.Also, As projection optics system 16, it also can be amplification system or reduce system.
Also, the purposes on exposure device, is not limited to LCD assembly pattern being transferred to the glass plate of angle-style Liquid crystal exposure device, be also widely portable to for example for manufacturing organic EL (Electro-Luminescence) panel The exposure dress of the exposure device of manufacture, the exposure device of semiconductor manufacturing, film magnetic head, micromachine and DNA chip etc. Put.Also, in addition to the micromodules such as manufacture semiconductor subassembly, being penetrated to manufacture for light exposure device, EUV exposure devices, X Mask or graticule used in line exposing device and electron ray exposure device etc., also can be suitably used for circuit pattern to be turned Print to the exposure device of glass substrate or Silicon Wafer etc..
Also, the object of exposure object does not limit glass plate, such as wafer, ceramic substrate, film structural component or mask also can be Other objects such as substrate.Also, when exposure object thing is the substrate of flat-panel screens, the thickness of its substrate is not particularly limited, For example also comprising membranaceous (flat member with pliability) person.In addition, the exposure device of this embodiment is particularly to one side Length or diagonal a length of more than 500mm substrate are particularly effective for the situation of exposure object thing.
Via manufactured by following step etc., i.e., the electronic building bricks such as LCD assembly (or semiconductor subassembly), be：Carry out group The step of function of part, performance design, the step of make mask (or graticule) according to this design procedure, manufacture glass substrate The step of (or wafer), exposure device and its exposure method according to above-mentioned each embodiment turn the pattern of mask (graticule) Print to the lithography step of glass substrate, make development step that the glass substrate after exposure develop, it is residual by etching removing resist The etching step for exposing component of part beyond the part deposited, remove because etching terminate without resist resist Removing step, cell assembling step, checking step etc..Under this situation, in lithography step, due to using above-mentioned each embodiment Exposure device perform the exposure method, in forming component pattern on glass substrate, therefore can manufacture high with good productivity The component of integrated level.
In addition, quoting all publications, International Publication publication, United States Patent (USP) on exposure device cited in described above And the part that the announcement of U.S. Patent Application Publication specification is recorded as this specification.
Industrial applicability
As mentioned above, object exchange method of the invention is suitable to exchange the object on object holding apparatus.Also, this hair The manufacture method of bright flat-panel screens is suitable to production flat-panel screens.Also, the assembly manufacture method of the present invention is suitable to miniature group The production of part.

Claims (22)

1. a kind of object exchange method, is that the 1st object being configured at set object exchange position is exchanged into the 2nd object, Characterized in that, it is included：
The object holding apparatus for maintaining the 1st object is set to be located at the action that the object exchanges position；
Make the 1st object pendulous support in the action for the support meanss for being located at the object exchange position；
The action for making pendulous support be left in the 1st object of the support meanss from the object holding apparatus；
Formed by the external guidance component by the object holding apparatus and located at the outside of the object holding apparatus Move into and keep filling with the object in the 1st object of the support meanss by the 2nd object insertion pendulous support with guiding face Between putting, and the 2nd object movement is set to move into the action of the object holding apparatus；And
By after the 2nd object is handed over into the object holding apparatus, making the 1st object relative to the support dress Movement is put, the 1st object is exchanged into the action that position takes out of from the object.
2. object exchange method as claimed in claim 1, it is characterised in that the 1st object is being held in the object guarantor One is faced in the object holding apparatus in the state of holding device；
The action of the support, is to make the another side of the 1st object with contactless state pendulous support in the support meanss.
3. object exchange method as claimed in claim 2, it is characterised in that the action of the support, is by making gas high Speed is by between the support meanss and the 1st object, so that the power of gravity direction up acts on the 1st object.
4. object exchange method as claimed in claim 3, it is characterised in that the action moved into, is to make the 2nd object It is suspended in described move into on guiding face.
5. object exchange method as claimed in claim 1, it is characterised in that the action taken out of, is along by the branch Support arrangement uses guiding face with being taken out of formed by the external guidance component, moves the 1st object.
6. the object exchange method as described in any one of claim 1 to 5, it is characterised in that the action moved into and described The action taken out of, is to move the 1st and the 2nd object using common drive device.
7. object exchange method as claimed in claim 6, it is characterised in that in the action taken out of, the 1st object Path of motion it is identical with the path of motion of the 2nd object in the action moved into.
8. object exchange method as claimed in claim 5, it is characterised in that the action moved into is comprising making described to move into use Guiding face relative level is tilted, and makes the action that the 2nd object is moved by the deadweight of the 2nd object；
The action taken out of passes through the deadweight of the 1st object comprising making described take out of be tilted with guiding face relative level The action for moving the 1st object.
9. a kind of object exchange system, is that the 1st object for being configured at set object exchange position is exchanged into the 2nd object, its It is characterised by, it possesses：
Object holding apparatus, can keep the 1st object；
Support meanss, located at the 1st object described in object exchange position, energy pendulous support；
Drivetrain, is located at the object in the object holding apparatus for maintaining the 1st object and exchanges position and the described 1st Object in the state of the support meanss, makes the 1st object be left from the object holding apparatus by pendulous support；And
Object switch, with located at the outside of the object holding apparatus, formed and removed together with the object holding apparatus Enter the external guidance component with guiding face, in the state of being left in the object holding apparatus and the 1st object, along institute State to move into makes the 2nd object insertion be moved between the object holding apparatus and the 1st object with guiding face, and by the 2nd Object is moved into the object holding apparatus, and by after the 2nd object is handed over into the object holding apparatus, making institute State the 1st object to move relative to the support meanss, the 1st object is exchanged into position from the object takes out of.
10. object exchange system as claimed in claim 9, it is characterised in that the 1st object is being held in the object guarantor One is faced in the object holding apparatus in the state of holding device；
The support meanss are the another sides by the 1st object with contactless state pendulous support.
11. object exchange system as claimed in claim 10, it is characterised in that the support meanss, is by making gas high Speed by it between the 1st object, so as to act on the 1st object along the power of gravity direction up.
12. object exchange system as claimed in claim 9, it is characterised in that the object holding apparatus and the outside are led Primer component is the 2nd object is suspended in described move into on guiding face.
13. object exchange system as claimed in claim 9, it is characterised in that the object switch, is along by described Taken out of formed by support meanss and the external guidance component and use guiding face, make the 1st object movement with by the 1st object Take out of.
14. the object exchange system as described in any one of claim 9 to 13, it is characterised in that the object switch It is to make the 2nd object using common drive device in the 2nd object when moving into and when taking out of of the 1st object And the 1st object movement.
15. object exchange system as claimed in claim 14, it is characterised in that the object switch is in the 2nd thing Body when moving into and when taking out of of the 1st object, be to move the 2nd object and the 1st object along identical mobile route It is dynamic.
16. object exchange system as claimed in claim 13, it is characterised in that the object holding apparatus and the object are handed over Changing device when moving into, makes described move into be tilted with guiding face relative level, passes through the 2nd object in the 2nd object Deadweight make the 2nd object move；
The support meanss and the object switch the 1st object make when taking out of it is described take out of it is relative with guiding face Horizontal plane, the 1st object is moved by the deadweight of the 1st object.
17. object exchange system as claimed in claim 16, it is characterised in that the support meanss to in the described 1st The facial and external guidance component of object to in the 1st object face at least a portion in above-below direction weight It is folded.
18. a kind of exposure device, it is characterised in that possess：
Object exchange system described in any one of claim 9 to 17；And
Using energy beam in the 1st object or the 2nd object that are held in the object holding apparatus, the figure of predetermined pattern is formed Case forming apparatus.
19. exposure device as claimed in claim 18, it is characterised in that the 1st object or the 2nd object are aobvious for flat board Show the substrate of device device.
20. exposure device as claimed in claim 19, it is characterised in that the length on the substrate at least one side is diagonal a length of More than 500mm.
21. a kind of manufacture method of flat-panel screens, it is characterised in that it is included：
Usage right requires the action that the exposure device described in 18 to 20 any one exposes the 1st object or the 2nd object；With And
The action for making the 1st object after exposure or the 2nd object develop.
22. a kind of assembly manufacture method, it is characterised in that it is included：
Exposure device described in usage right requirement 18 makes the action that the 1st object or the 2nd object expose；And
The action for making the 1st object after exposure or the 2nd object develop.
CN201380049087.5A 2012-08-08 2013-08-07 Object exchange method, object exchange system, exposure device, the manufacture method of flat-panel screens and assembly manufacture method Active CN104662478B (en)

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