TWI739894B - Object exchange system, exposure apparatus, flat-panel display manufacturing method, device manufacturing method, object moving method, and exposure method - Google Patents

Abstract

_{The substrate (P 1} ) placed on the substrate stage device (20) is exchanged for another substrate (P ₂ ), which includes: the substrate _{stage device (20) holding the substrate (P 1} ) is positioned on a predetermined object operation switching position; the substrate (P ₁₎ depending supported on provided depending support means (50) of the object exchange positions of operation; make overhang supported by the overhanging support means (50) of the substrate (P ₁₎ from the substrate stage device (20) The action of leaving; insert the substrate (P _{2 ) between the substrate (P 1} ) and the substrate stage device (20) which is suspended and supported by the suspension support device (50) _{and transfer the substrate (P 2} ) to the substrate The movement of the stage device (20); and the _{movement of the substrate (P 1} ) from the object exchange position by moving the _{substrate (P 1} ) relative to the suspension support device (50).

Description

Object exchange system, exposure device, flat panel display manufacturing method, device manufacturing method, object moving method, and exposure method

The present invention relates to an object exchange method, an object exchange system, an exposure device, a method for manufacturing a flat-panel display, and a component manufacturing method. More specifically, it relates to an object exchange method and system held in an object holding device, and the aforementioned object exchange The exposure device of the system, the flat panel display using the aforementioned exposure device, and the manufacturing method of the device.

In the past, an exposure device was used in the lithography process used to manufacture electronic components such as liquid crystal display elements and semiconductor elements. The exposure device used energy beams to transfer the pattern formed on the photomask (or reticle) to the glass substrate. (Or wafer) on.

As this type of exposure device, there is a conventional substrate transfer device to unload the exposed glass substrate on the substrate stage device, and then use the above-mentioned substrate transfer device to transfer other glass substrates onto the substrate stage device and exchange them in order. A glass substrate held by a substrate stage device to continuously perform exposure processing on a plurality of glass substrates (see, for example, Patent Document 1).

Here, when exposing a plurality of glass substrates continuously, in order to increase the overall productivity, it is best to quickly use the glass substrate on the substrate stage device.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Specification of U.S. Patent No. 6,559,928

The present invention was completed in view of the above-mentioned circumstances. From the first point of view, it is an object exchange method that exchanges an object arranged at a predetermined object exchange position for another object, which includes: holding the first object The operation of the object holding device at the object exchange position; the operation of suspending and supporting the first object on the supporting device provided at the object exchange position; the movement of causing the first object suspended and supported on the supporting device to move away from the object holding device Action; inserting a second object between the first object suspended and supported by the supporting device and the object holding device to transfer the second object to the object holding device; and by transferring the second object The operation of moving the first object relative to the supporting device after reaching the object holding device to carry the first object out of the object exchange position.

Thereby, the second object is transferred to the object holding device in a state where the first object is suspended and supported by the support device, and then the first object is carried out from the object exchange device. In other words, since the loading of the second object into the object holding device is performed prior to the completion of the unloading operation of the first object held by the object holding device, the object exchange operation on the object holding device can be performed quickly.

From the second point of view, the present invention is an object exchange system that exchanges objects arranged at a predetermined object exchange position into other objects, and includes: an object holding device capable of holding the aforementioned object; and a supporting device provided on the aforementioned object Exchange position, capable of suspending and supporting the aforementioned object; a drive system to allow the aforementioned object to be separated from the aforementioned object holding device in a state where the aforementioned object holding device holding the aforementioned object is located at the aforementioned object exchange position and the aforementioned object is suspended and supported by the aforementioned support device; and An object exchange device, by inserting other objects between the object holding device and the object while the object holding device is separated from the object, and the other object The object is transferred to the object holding device, and the object is moved out of the object exchange position by moving the object relative to the supporting device after the other object is transferred to the object holding device.

Thereby, the object is handed over to the object holding device in a state where the object is suspended and supported on the supporting device, and then the object is carried out from the object exchange device. That is, since the loading of other objects into the object holding device is performed prior to the completion of the removal of the object held by the object holding device, the object exchange operation on the object holding device can be performed quickly.

From a third viewpoint, the present invention is an exposure apparatus including: the object exchange system of the second viewpoint of the present invention; and a pattern forming device that uses energy beams to form a predetermined pattern on the object held by the object holding device.

From a fourth viewpoint, the present invention is a method for manufacturing a flat panel display, which includes: the operation of exposing the aforementioned object using the exposure device of the third viewpoint of the invention; and the operation of developing the aforementioned object after the exposure.

From the fifth viewpoint, the present invention is a device manufacturing method, which includes: the operation of exposing the aforementioned object using the exposure device of the third viewpoint of the present invention; and the operation of developing the aforementioned object after the exposure.

10: Liquid crystal exposure device

20: substrate stage device

26: substrate holder

30: Substrate exchange device

36: Substrate drive device

38: Air guiding device

40: X drive unit

44: Adsorption pad

50: Suspended support device

52: Non-contact fixture device

P: substrate

Fig. 1 is a diagram schematically showing the structure of the liquid crystal exposure apparatus of the first embodiment.

Fig. 2 is a plan view of the liquid crystal exposure device (part of which is omitted) of Fig. 1;

FIG. 3(A) is a front view of the substrate exchange device included in the liquid crystal exposure device of FIG. 2, and FIG. 3(B) is a diagram showing a modification example thereof.

4(A) to 4(C) are diagrams for explaining the operation of the substrate loading device included in the liquid crystal exposure device of FIG. 1 (part 1 to part 3).

5(A) to 5(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (Part 1 to Part 3).

6(A) to 6(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (part 4 to part 6).

7(A) to 7(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (Part 7 to Part 9).

8(A) and 8(B) are diagrams (10 and 11) for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment.

Fig. 9 is a plan view of a substrate stage device and a substrate exchange device of the second embodiment.

Fig. 10(A) is a side sectional view of the substrate stage device of the second embodiment, and Fig. 10(B) is a view showing a modification example thereof.

11(A) to 11(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the second embodiment (Part 1 to Part 3).

12(A) to 12(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the second embodiment (part 4 to part 6).

13(A) to 13(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the third embodiment (Part 1 to Part 3).

FIG. 14(A) is a diagram (No. 4) for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the third embodiment, and FIG. 14(B) is a diagram showing a modification example thereof.

15(A) to 15(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment (Part 1 to Part 3).

16(A) to 16(C) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment (part 4 to part 6).

17(A) and FIG. 17(B) are diagrams for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment (the 7 and 8).

"First Embodiment"

Hereinafter, the first embodiment will be described using FIGS. 1 to 8(B).

FIG. 1 schematically shows the structure of the liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure device 10 is a step-and-scan projection exposure device that uses a rectangular (angled) glass substrate P (hereinafter simply referred to as the substrate P) as an exposure object, for example, a liquid crystal display device (flat panel display), etc., so-called scanning Device.

The liquid crystal exposure device 10 has an illuminating system 12, a mask stage 14 holding a mask M, a projection optical system 16, and is held on the surface (the surface facing the +Z side in FIG. 1) coated with a resist (sensor) The substrate P of the substrate stage device 20, the substrate exchange device 30, the suspension support device 50, and these control systems and so on. In the following description, it is assumed that the direction in which the mask M and the substrate P are scanned relative to the projection optical system 16 during exposure is the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the X-axis and Y-axis The direction perpendicular to the axis direction is the Z axis direction. In addition, the positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The lighting system 12 has the same configuration as the lighting system disclosed in the specification of U.S. Patent No. 5,729,331, for example. That is, the illumination system 12 transmits light emitted from a light source (such as a mercury lamp) not shown in the figure through a reflector, a dichroic mirror, a blind, a wavelength selective filter, various lenses, etc., which are not shown in the figure. The mask M is irradiated with illumination light (illumination light) IL for exposure. The illumination light IL uses, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), etc. (or the aforementioned i-line, g-line, and h-line combined light).

The mask stage 14 sucks and holds its mask M by, for example, a vacuum suction method. The photomask stage 14 is driven in the scanning direction (X-axis direction) with a predetermined long stroke by, for example, a photomask stage drive system (not shown) including a linear motor. The position information of the mask stage 14 in the XY plane is obtained by a mask interferometer system including a laser interferometer not shown.

The projection optical system 16 is arranged below the mask stage 14. The projection optical system 16 has the same configuration as the projection optical system disclosed in the specification of US Patent No. 6,552,775, for example, a so-called multi-lens projection optical system, which is provided with a plurality of projection optics that form upright images with equal magnifications on both sides, for example. Tie.

When the liquid crystal exposure device 10 illuminates the illumination area on the mask M with the illumination light IL from the illumination system 12, that is, the illumination light IL passing through the mask M passes through the projection optical system 16. The projected image (partially erected image) of the circuit pattern of M is formed in the irradiation area (exposure area) of the illumination light IL conjugated with the illumination area on the substrate P. And by moving the mask M in the scanning direction relative to the illuminating area (illumination light IL) and moving the substrate P in the scanning direction relative to the exposure area (illumination light IL), the scanning exposure of an irradiated area on the substrate P is performed accordingly. The irradiated area transfers the pattern formed on the mask M.

The substrate stage device 20 includes an XY coarse motion stage 22, a fine motion stage 24, and a substrate holder 26.

The XY coarse motion stage 22 is a device for driving the substrate holder 26 in the X-axis direction and the Y-axis direction with a predetermined long stroke. As the XY coarse motion stage 22, for example, as disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950, an X coarse motion stage that can move in the X-axis direction with a predetermined long stroke and an X coarse motion stage that can move with a predetermined long stroke can be used. A so-called gantry dual-axis stage device (the X and Y coarse-motion stages are not shown in the figure) combined with the Y coarse-movement stage in the Y-axis direction. The micro-movement stage 24 is arranged above the XY coarse-movement stage 22, through, for example, a US patent application The weight elimination device 28 disclosed in the publication No. 2010/0018950 specification is placed on the fixing base 18. The fixing base 18 is composed of a rectangular plate-shaped member in a plan view, and is set on the ground 11 through a vibration isolator 19.

The substrate holder 26 is composed of a rectangular plate-shaped member (or a low-height rectangular parallelepiped) in a plan view, and is integrally fixed on the upper surface of the micro-movement stage 24. The substrate holder 26 is guided by the XY coarse motion stage 22 to move in the X-axis direction and/or the Y-axis direction with a predetermined long stroke relative to the projection optical system 16 (illumination light IL). The position information in the XY plane of the substrate holder 26 (ie, the substrate P) is obtained by a substrate interferometer system including a laser interferometer (not shown). In addition, the structure of the XY coarse motion stage 22 is not particularly limited as long as it can drive the substrate P in the scanning direction with a predetermined long stroke at least.

A plurality of micro holes (not shown) are formed on the upper surface of the substrate holder 26 (the surface facing the +Z side). The substrate holder 26 is optionally connected with a vacuum suction device and a pressurized gas supply device (both not shown) provided outside the substrate stage device 20. The substrate holder 26 can suck and hold the substrate P placed thereon by vacuum suction supplied from the vacuum suction device through the plurality of holes, and can pass through the plurality of holes from the pressurized gas supply device. The pressurized gas suspension support (non-contact support) supplied by the section (or other hole section) is placed on the substrate P on which it is placed.

As shown in FIG. 2, the dimensions of the substrate holder 26 in the X-axis and Y-axis directions are set to be slightly shorter than the dimensions of the substrate P in the X-axis and Y-axis directions. In the state, the end of the substrate P protrudes slightly from the end of the substrate holder 26. This is because there is a possibility that the resist may adhere to the back surface of the substrate P, and is to prevent the resist from attaching to the substrate holder 26.

As shown in FIG. 2, on the -Y side of the substrate holder 26, a pair of Y pressing pin devices 25y are arranged at predetermined intervals in the Y-axis direction. The Y pressing pin device 25y has a base 25a fixed to the substrate holder 26 (may also be a micro-movement stage 24 or an XY coarse-movement stage 22 (both refer to FIG. 1)), and can be set relative to the base 25a (for example, 10 to 100 mm). Degree) A pin 25b whose stroke moves in the Y-axis direction, and an unshown actuator for driving the pin 25b. The front end of the pin 25b (the end on the +Z side) protrudes from the upper surface of the substrate holder 26 to the +Z side. In addition, on the +Y side of the substrate holder 26, a pair of Y positioning pin devices 27y are arranged at a predetermined interval in the X-axis direction (with respect to the pair of Y pressing pin devices 25y and the substrate holder 26 is symmetrical on the surface of the paper). The Y positioning pin device 27y has substantially the same structure as the Y pressing pin device 25y except for the point that the pins are fixed. In addition, a pair of Y pressing pin devices 25y can also be arranged on the +Y side of the substrate holder 26. In this case, a pair of Y positioning pin devices 27y are arranged on the -Y side of the substrate holder 26. In addition, the Y pressing pin device 25y may be arranged on the -Y side and the +Y side of the substrate holder 26, respectively.

In addition, on the +X side of the substrate holder 26, a pair of X pressing pin devices 25x are arranged at predetermined intervals in the Y-axis direction. The X pressing pin device 25x has a base 25a fixed to the substrate holder 26 (may also be a micro-movement stage 24 or an XY coarse-movement stage 22 (both refer to Figure 1)), and can be set relative to the base 25a (for example, 1~100mm). Degree) A pin 25b whose stroke moves in the Y-axis direction, and an unshown actuator for driving the pin 25b. Here, the pin 25b of the X pressing pin device 25x can be at a position where the front end can protrude from the upper surface of the substrate holder 26 to the +Z side and a position where the front end is lowered from the upper surface of the substrate holder 26 to the -Z side Drive in the up and down direction. In addition, on the -X side of the substrate holder 26, a pair of X positioning pin devices 27x are arranged at a predetermined interval in the Y axis direction (with respect to the pair of X pressing pin devices 25x and the substrate holder 26 is symmetrical on the paper surface). The X positioning pin device 27x has substantially the same structure as the X pressing pin device 25x except for the point that the pin is fixed. The aforementioned X pressing pin device 25x, X positioning pin device 27x, Y pressing pin device 25y, and Y positioning pin device 27y are used in the pre-alignment operation of the substrate P with respect to the substrate holder 26.

The substrate exchange device 30 performs the unloading of the substrate P held by the substrate holder 26 from the substrate holder 26 and the carrying in of the substrate P to the substrate holder 26 that is empty (the substrate P is not held). As shown in FIG. 1, the substrate exchange device 30 is arranged in the +X side area of the substrate stage device 20 and is installed on the ground 11. The substrate stage device 20 and the substrate exchange device 30 are housed in a processing chamber (not shown) included in the liquid crystal exposure device 10.

The substrate exchange device 30 includes a stand 32, a bottom plate 34, a substrate driving device 36, and a plurality of air guide devices 38. The stand 32 is composed of a low-height table-like member installed on the ground 11. The bottom plate 34 is composed of a plate-shaped member arranged parallel to the XY plane. As shown in FIG. 3(A), it is composed of an X linear guide 33a fixed on the upper surface of the stand 32 and a plurality of X sliders 33b fixed below the bottom plate 34 A plurality of (for example, four) X linear guide devices 33 are mounted on the gantry 32. The bottom plate 34 is composed of a plurality of (for example, two) X linear motors 31 driven by the bottom plate drive system consisting of an X fixed member 31a fixed on the top of the stand 32 and an X movable member 31b fixed below the bottom plate 34. The predetermined stroke is properly driven in the X-axis direction.

Returning to FIG. 1, the substrate driving device 36 drives the substrate P to be carried in or out of the substrate P when the substrate P on the substrate holder 26 is exchanged. The substrate driving device 36 includes an X driving unit 40, a support 42, and a suction pad 44. The X drive part 40 has an X fixed part 40a and an X movable part 40b. The X fixing portion 40a is composed of a member extending in the X-axis direction, and is fixed to the center portion in the Y-axis direction on the upper surface of the bottom plate 34 (refer to FIGS. 2 and 3(A)). The X movable portion 40b is mounted on the upper surface of the X fixed portion 40a, and the drive system of the X linear motor composed of, for example, the fixed element of the X fixed portion 40a and the movable element of the X movable portion 40b follows the X fixed portion 40a. In the X-axis direction, for example, the stroke is the same as the size of the substrate P in the X-axis direction, and is driven linearly. In addition, the type of the actuator used to drive the bottom plate 34 and the X movable portion 40b is not particularly limited, and may be, for example, a feed screw device, a belt drive device, and the like.

The pillar 42 is composed of a member extending in the X-axis direction, and its lower end is integrally fixed to the X movable portion 40b. The suction pad 44 is composed of an inverted L-shaped member with an XZ cross-section, and a portion parallel to the XY plane is formed in a rectangular plate shape in a plan view. The suction pad 44 is connected to a vacuum device not shown, and the upper surface of the part parallel to the XY plane functions as a substrate suction surface. One of the portions of the suction pad 44 parallel to the YZ plane faces a surface near the upper end of the pillar 42 (the surface facing the -X side). The suction pad 44 is installed to pass through the Z linear guide 46 (from the Z linear guide 46a fixed on one side of the pillar 42 (-X side) and the portion parallel to the YZ plane fixed to the suction pad 44 (+ The X side) is composed of a plurality of Z sliding members 46b) relative to the pillar 42 which is movable in the Z-axis direction. In addition, the suction pad 44 is mounted on the X movable portion 40b by the Z actuator 48 (for example, a cylinder, etc.) on its upper surface (substrate suction surface) compared to the respective upper surfaces of the substrate holder 26 and the plurality of air guide devices 38. The position protruding to the +Z side and the position lowered from the upper surface of the substrate holder 26 and the plurality of air guide devices 38 are driven in the Z-axis direction.

Each of the plurality of air guide devices 38 is composed of a rectangular parallelepiped member whose length is the X-axis direction, and is mounted on the middle bottom plate 37b through the support 37a. As shown in FIG. 3(A), the middle bottom plate 37b is provided, for example, two at a predetermined interval in the Y-axis direction so as not to hinder the movement of the support 42 of the substrate driving device 36. For example, the two middle bottom plates 37b are each connected to the bottom plate 34 through pillars 37c. Therefore, the plurality of air guide devices 38 and the bottom plate 34 move in the X-axis direction integrally. As shown in FIG. 2, a plurality of air guide devices 38 are arranged to be separated from each other at predetermined intervals so as to support the lower surface of the substrate P substantially evenly. In the first embodiment, the air guide device array composed of plural (e.g., three) air guide devices 38 arranged at predetermined intervals in the X-axis direction is arranged in the Y-axis direction at predetermined intervals (e.g., Six rows), and the substrate P is supported from below with a total of eighteen air guide devices 38, for example. In addition, the number and arrangement of the air guide devices 38, and the shape of the substrate guide surface formed by the plurality of air guide devices 38 can be appropriately changed depending on, for example, the size of the substrate P.

A plurality of micro holes (not shown) are formed on the upper surface of each of the plurality of air guide devices 38. In addition, a pressurized gas supply device and a vacuum suction device (neither shown) are optionally connected to each of the plurality of air guide devices 38. Each of the plurality of air guide devices 38 can support the substrate P (non-contact support) placed thereon by the pressurized gas supplied from the pressurized gas supply device through the plurality of holes, and can be supported by The substrate P placed thereon is sucked and held by vacuum suction supplied from the vacuum suction device through the plurality of holes (or other holes).

Here, the carrying-in operation of the board|substrate P using the board|substrate exchange apparatus 30 is demonstrated using FIG. 4(A)-FIG. 4(C). In the liquid crystal exposure apparatus 10, the loading operation of the substrate P to the substrate holder 26 and the removal operation of removing the substrate from the substrate holder 26 described later (hereinafter collectively referred to as the exchange operation of the substrate P) are based on the substrate holder 26 being positioned at a predetermined position. Carry out under the state of substrate exchange position. The substrate exchange position is set near the +X side end of the fixing base 18. In the state where the substrate holder 26 is located at the substrate exchange position (the state in which the substrate holder 26 is arranged in the position shown by the dotted line in FIG. 1), as shown in FIG. 4(A), a plurality of air guide devices 38 are held with the substrate The tool 26 is adjacent in the X-axis direction, and the substrate guide surface formed by a plurality of air guide devices 38 and the upper surface of the substrate holder 26 form a continuous guide surface.

When the substrate P is carried into the substrate stage device 20 using the substrate exchange device 30, the Z position of the substrate holder 26 is positioned so that the Z position on the substrate holder 26 and the Z position on the upper surface of the plurality of air guide devices 38 become They are almost the same (or a little lower on the side of the substrate holder 26). In addition, the position of the pin 25b of the X pressing pin device 25x is controlled so that the upper end is located on the -Z side (not protruding) from the upper surface of the substrate holder 26. In the substrate exchange device 30, as shown in FIG. 4(A), the substrate P, which is sucked and held by the suction pad 44 in the center of the Y-axis direction near the +X side end, is moved in the -X direction by the suction pad 44 It is driven to move along the guide surface formed by the upper surface of the plurality of air guide devices 38 and the upper surface of the substrate holder 26.

Next, as shown in FIG. 4(B), after the +X side end of the substrate P is located closer to the -X side than the X pressing pin device 25x, as shown in FIG. 4(C), the suction pad 44 releases the substrate P The suction is maintained and is driven in the +X direction. In addition, the pin 25b of the X pressing pin device 25x is driven in the +Z direction and the -X direction. Thereby, the +X-side end of the substrate P is pressed by the pin 25b, and the -X-side end of the substrate P abuts against the X positioning pin device 27x, and pre-alignment of the substrate P in the X-axis direction is performed. Also, although not shown, in the same way, the Y pressing pin device 25y presses the -Y side end of the substrate P on the +Y side to perform pre-alignment of the substrate P in the Y-axis direction. In addition, during the movement of the substrate P as shown in FIG. 4(A), the adsorption and holding of the substrate P by the adsorption pad 44 can be released, the adsorption pad 44 and the substrate P can be separated, and the substrate P can be moved by inertial force. In addition, a notch into which a part of the suction pad 44 can be inserted may be formed at the center of the +X side end of the substrate holder 26 in the Y axis direction. In this case, since the substrate driving device 36 can be used to adjust the X position of the substrate P on the substrate holder 26, the aforementioned X pressing pin device 25x and the X positioning pin device 27x are not required.

Returning to FIG. 2, the suspension support device 50 is used together with the above-mentioned substrate exchange device 30 to carry out the substrate P held by the substrate holder 26 from the substrate holder 26. The suspension support device 50 is arranged to be located above the substrate holder 26 in a state where the substrate stage device 20 is located at the substrate exchange position.

The suspension support device 50 has a plurality of non-contact clamp devices 52. The non-contact clamp device 52 is also called a Bernoulli clamp, and its structure is disclosed in, for example, the specification of US Patent No. 5,067,762. That is, a gas supply device (not shown) is connected to each of the plurality of non-contact jig devices 52, and the lower surface of the suspension support device 50 and the upper surface of the substrate P are opposed to each other with a predetermined gap. Each of the clamp devices 52 sprays pressurized gas (for example, air) at a high speed onto the upper surface of the substrate P. Then, by the action of the gas (the so-called Bernoulli effect and the ejector effect) between the lower surface of each of the plurality of non-contact jig devices 52 and the upper surface of the substrate P at high speed, the substrate The board P generates an upward force (attractive force) in the weight direction, and the board P is held by the suspension support device 50 in a non-contact manner (attractive holding).

In the first embodiment, for example, twenty-five non-contact jig devices 52 are arranged at predetermined intervals in the X-axis direction and the Y-axis direction in such a way that the attractive force can be applied to the entire substrate P evenly, but it is not The number and arrangement of the contact jig devices 52 are not limited to this, and can be appropriately changed depending on, for example, the size of the substrate P.

A plurality of non-contact clamp devices 52 are mounted in a suspended supported state by a plurality of rod-shaped members arranged at predetermined intervals in the Y-axis direction and parallel to the X-axis and a plurality of rod-shaped members arranged at predetermined intervals in the X-axis direction. The rod-shaped member parallel to the Y-axis is formed as a net-shaped support member 54 (refer to FIG. 1). The support member 54 is driven in the Z-axis direction (vertical direction) with a predetermined stroke by a plurality of (four in the first embodiment, for example) Z actuators 56. The Z actuator 56 is provided with a Z fixing portion 56a provided on the ground 11 (refer to FIG. 1) in a state of being physically separated from the substrate stage device 20 through a support member not shown, and a Z fixing portion 56a which is driven to Z with respect to the Z fixing portion 56a. The Z movable portion 56b in the axial direction is connected to the above-mentioned support member 54 to the Z movable portion 56b.

Hereinafter, the surface formed by the lower surface of the plurality of non-contact jig devices 52 will be referred to as the substrate holding surface of the suspension support device 50 for description. In the suspension support device 50, the support member 54 is driven in the Z-axis direction while the substrate P is held in a non-contact state, so that the substrate P and the support member 54 move in the Z-axis direction integrally. Thereby, the suspending support device 50 can move the substrate P up and down above the substrate holder 26 located at the substrate exchange position. In addition, the type of actuator that moves the support member 54 up and down can be changed as appropriate. For example, the support member 54 may be suspended by a rope or the like, and the support member 54 can be moved up and down by winding the rope.

Moreover, as shown in FIG. 1, in the vicinity of the ends of the support member 54 on the +X side, -X side, +Y side, and -Y side, pins 58 (+Y side And the pin 58 on the -Y side is not shown). The plurality of pins 58 are arranged to surround the outer periphery of the substrate P in a state where a plurality of non-contact clamp devices 52 are used to suspend and support the substrate P, so as to limit the unintentional direction of the substrate P relative to the suspending support device 50 in a direction parallel to the XY plane move. In addition, the number of pins 58 is not particularly limited as long as it can restrict the unintentional movement of the above-mentioned substrate P. In addition, the pin 58 arranged near the +X side end of the support member 54 can protrude below the substrate holding surface at the lower end and the position where the lower end does not protrude downward from the substrate holding surface (without hindering the substrate P from being opposed) The suspension support device 50 is driven between the moving position in the +X direction). In addition, a plurality of pins 58 can be moved in the X-axis and/or Y-axis directions, and by using the plurality of pins 58 to press the end of the substrate P suspended and supported by the plurality of non-contact clamp devices 52, the substrate The position of P in the XY plane is aligned (pre-aligned).

Moreover, as shown in FIG. 1, outside the liquid crystal exposure apparatus 10 is arranged an external transport robot 99 for transporting the substrate P from the outside of the liquid crystal exposure apparatus 10 into the liquid crystal exposure apparatus 10 (in FIGS. 1 and 2 only the external transport machine is shown) The arm member 98 of the arm 99). As shown in FIG. 2, the arm member 98 has a plurality of support portions 98a composed of a plate-shaped member extending parallel to the X axis and a connecting portion 98b that connects one end of the plurality of support portions 98a to each other, also called a fork arm ( fork hand) and so on. Although not shown in the figure, the external transport robot arm 99 has, for example, a driving device (for example, a robot arm) capable of driving the arm member 98 at least in the X-axis direction and the Z-axis (up and down) direction with a predetermined stroke.

Here, in the arm member 98 of the external transport robot 99, a plurality of support portions 98a are arranged at substantially equal intervals in the Y-axis direction in order to suppress the bending of the substrate P. In addition, the Y-axis direction interval of the plurality of air guide devices 38 included in the substrate exchange device 30 is determined by considering the Y-axis direction interval of the plurality of support portions 98a. Specifically, the spacing in the Y-axis direction of the plurality of air guide devices 38 is set to be opposite to the plurality of support portions 98a of the arm member 98 in the Y-axis direction when the arm member 98 is located on the plurality of air guide devices 38. Direction not overlapping. Thereby, the air guide device 38 can be inserted between the adjacent support portions 98a via a predetermined gap.

The liquid crystal exposure apparatus 10 (refer to FIG. 1) constructed in the above manner is managed by a not-shown main control device, and the photomask on the photomask stage device 14 is performed by a not-shown photomask loader. M is loaded, and the substrate P on the substrate holder 26 is loaded by the substrate exchange device 30. After that, the main control device uses an alignment detection system not shown to perform alignment measurement. After the alignment measurement is completed, a step-and-scan exposure is successively performed on a plurality of shot areas set on the substrate P action. In addition, since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, the detailed description is omitted. Then, the substrate P on which the exposure process has been completed is carried out from the substrate holder 26 by the substrate exchange device 30, and the other substrates P of the next exposure are transported to the substrate holder 26, thereby performing the substrate P on the substrate holder 26 In exchange, exposure operations and the like are continuously performed on a plurality of substrates P.

Hereinafter, the substrate P on the substrate holder 26 in the liquid crystal exposure apparatus 10 will be described using FIGS. 5(A) to 8(B) (for the convenience of description, the plurality of substrates P are referred to as substrate P ₁ , substrate P ₂ , substrate P ₃ ) The exchange action. The following substrate exchange operations are performed under the management of the main control device not shown. In addition, in order to simplify the illustration, in FIGS. 5(A) to 8(B), each of the substrate stage device 20, the substrate exchange device 30, and the suspension support device 50 is simplified (some elements are not shown). .

FIG. 5(A) shows a state in which the substrate stage device 20 on which the exposed substrate P1 is placed on the substrate holder 26 (the state of the second supporting device) moves from the exposure end position to the substrate exchange position. A plurality of air guide means 30 of the exchange 38 to the substrate, the substrate P is placed after _a predetermined exposure process for the substrate P _2. In addition, although the illustration of the operation is omitted in FIG. 5(A), in the substrate exchange device 30, corresponding to the movement of the substrate stage device 20 to the substrate exchange position, a plurality of air guide devices 38 are driven to -X Direction (the direction approaching the substrate stage device 20). In addition, after the substrate stage device 20 is located at the substrate exchange position (or the substrate stage device 20 is moving to the substrate exchange position), the suspension support device 50 lowers and drives the plurality of non-contact clamp devices 52 (the aspect of the first support device) ).

Substrate stage device 20, in the state of the substrate exchange position, as shown in FIG. 5 (B), releasing the substrate holder 26 of _an adsorption substrate P held, and the holder 26 having the above substrate P from the substrate Pressurized gas is sprayed from below _1. In addition, the suspending support device 50 ejects gas from a plurality of non-contact fixture devices 52 at a high speed, thereby _{exerting an upward force (levitation force) in the direction of gravity on the substrate P 1} (the arrow in FIG. 5(B) does not show the gas The flow indicates the direction of the force), and the substrate P ₁ is adsorbed and held by the suspension support device 50. In addition, the substrate exchange device 30 sprays pressurized gas from the plurality of air guide devices 38 to the lower surface of the substrate P ₂ , and the substrate P ₂ is suspended on the plurality of air guide devices 38. In addition, the suction pad 44 sucks and holds the lower surface of the substrate P ₂ . Next, FIG. 5 (C), the sucking and holding the substrate P ₁ depending support means 50 is raised driven, the substrate P is below the substrate holder ₁ 26 of the above separation.

Thereafter, as shown in FIG. 6(A), the suction pad 44 is driven in the -X direction. Thereby, the substrate P ₂ moves along the guide surface formed by the upper surface of the plurality of air guide devices 38 and the upper surface of the substrate holder 26. Hereinafter, as described above, the X pressing pin device 25x and the Y pressing pin device 25y are used on the substrate holder 26 (not shown in FIG. 6(A). Refer to FIGS. 4(A) to 4(C)). After the pre-alignment, the substrate P ₂ is sucked and held by the substrate holder 26. During the movement of the substrate P ₂ and the pre-alignment operation, the exposed substrate P ₁ is held in the substrate exchange position while being sucked and held by the suspension support device 50. The following, Figure 20 device substrate stage 6 (B), in order to move toward a predetermined Zhi proceeds exposure operation starting position for exposing the substrate P Operation ₂ Zhi exchange location from the substrate.

After the substrate stage device 20 is separated from the substrate exchange position, as shown in FIG. 6(C), the plurality of non-contact jig devices 52 included in the suspension support device 50 are lowered and driven. In this case, the substrate ₁ of P Z position, the suction pad 44 can be positioned below the suction holding position of the substrate P _2, i.e. with the loading of the substrate holder 26 (refer to FIG. 6 (A)) of the substrate ₁ of P The Z position is roughly the same.

Next, as shown in FIG. 7(A), _{the suction pad 44 sucking and holding the underside of the substrate P 1} is driven to the +X direction, whereby the substrate P ₁ is moved along the underside of the plurality of non-contact clamp devices 52 and the plurality of air The guide surface formed on the upper surface of the guide device 38 moves. In this case, the supporting means 50 overhanging the + side of the pin 58 X (in FIG. 7 (A), not shown. Referring to FIG. 1) is not in contact with a substrate ₁ of P retracted. _{In addition, although the substrate stage device 20 holding the substrate P 2} is shown in FIGS. 7(A) to 8(B) for the convenience of _{description, the substrate P 1} and the substrate P on the substrate exchange device 30 described below The exchange action of _{3 and the exposure action of the substrate P 2 are} performed in parallel, and the actual position of the substrate stage device 20 is different.

Next, FIG. 7 (B), the substrate P after being conveyed to _a plurality of upper air guide means 38, i.e., desorbed suction pad 44 of the substrate P held _1, and the suction pad 44 is driven downward. Further, the air guide device 38 is stopped from P substrate below the discharge line of the pressurized gas _1. In addition, although illustration of the operation is omitted in FIG. 7(B), in the substrate exchange device 30, a plurality of air guide devices 38 are driven in the +X direction (the direction away from the substrate stage device 20). In addition, the X positions of a plurality of air guiding devices 38 can also be fixed.

Thereafter, in order to carry-out the substrate P ₁ to the liquid crystal exposure device 10 (see FIG. 1) outside, while FIG. 7 (C), the external transfer arm 99 of the robot arm member 98 is inserted in a space below the substrate P ₁ after being Drive up. At this time, as described above, the arm member 98 of the external transport robot arm 99 and the plurality of air guide devices 38 are not in contact with each other. Accordingly, the substrate P ₁ of the arm member 98 is supported from below, in this state, the arm member 98 is driven toward the + X direction, whereby the substrate P is unloaded to _a liquid crystal exposure device 10 (see FIG. 1) outside. In addition, in FIG. 7(B), although the suction pad 44 is lowered and driven to avoid contact between the suction pad 44 and the arm member 98, the suction pad 44 can also be moved in the -X direction to avoid contact with the arm member 98.

Hereinafter, as shown in FIG. 8(A), the arm member 98 of the external transport robot arm 99 (it may be the same as the arm member 98 of the _{substrate P 1 that has been carried out, or other), the substrate P 2 is} scheduled to be carried out afterwards. After the exposed substrate P _{3 is} transported to the top of the plurality of air guides 38, as shown in FIG. 8(B), the arm member 98 of the external transport robot 99 is driven in the -Z direction and the -X direction, and the substrate P _{3 is} placed on a plurality of air guiding devices 38. Thereby, it returns to the state shown in FIG. 5(A) (however, the substrate P _{1 is} replaced with the substrate P ₂ , and the substrate P _{2 is} replaced with the substrate P ₃ ). In addition, after the substrate P ₃ is transferred to the plurality of air guide devices 38, the position alignment (alignment) of _{the substrate P 3 may} be performed in a state of floating on the plurality of air guide devices 38. The alignment, for example, while the edge sensor or CCD (Charge Coupled Device) camera or the like detects the end portion ₃ of the substrate P (the edge) position, while pressing the substrate P at the ends of a plurality of _3, thereby to achieve. Hereinafter, by repeatedly performing the operations shown in FIG. 5(A) to FIG. 8(B), the exposure operation for the plurality of substrates P is continuously performed.

According to the first embodiment described above, _{the substrate P 2} is carried in the substrate P _{2 in a state where the exposed substrate P 1 is} at the substrate exchange position standby (retrieved from the carry-in path of the substrate P 2 following the scheduled exposure), and After the substrate P ₂ is transferred to the substrate stage device 20, the substrate P ₁ is unloaded from the above-mentioned standby position. For example, after _{the unloading operation of the substrate P 1} after the exposure is completed, the substrate P ₂ to the substrate stage device is started. Compared with the loading action of 20, the cycle time of substrate exchange can be shortened.

Also, generally speaking, since _{the time required for the exposure operation of the substrate P 2 is} compared with the time required for the exposure of the substrate P ₁ to the liquid crystal exposure device 10 and the substrate P ₃ to a plurality of air guide devices 38 the time required for the mounting operation be short (up to the substrate P before the exposure operation ₂ can prepare the end of the substrate _{P. 3),} so as in this embodiment, even when compared with the completion of exposure of the substrate P unloaded operation ₁ Carrying in the substrate P ₂ preferentially has no effect on the overall productivity when exposure processing is performed on a plurality of (for example, three or more) substrates P in succession.

In addition, in the suspending support device 50, since the plurality of non-contact jig devices 52 can move up and down, the carrying-in path and the carrying-out path of the substrate P can be made the same, and the liquid crystal exposure device 10 can be space-saving. In addition, only one drive system (substrate drive device 36 in this embodiment) for driving the substrate P (substrate P ₁ to P ₃ ) is sufficient, and it is not necessary to separately provide a drive system for carrying in and a driving system for carrying out. Therefore, the structure of the liquid crystal exposure device 10 is simple, and the cost can be reduced.

In addition, although the suspending support device 50 is a plurality of non-contact jig devices 52 spraying gas on the upper surface (exposure surface) of the substrate P, the exposure of the substrate P held by the suspending support device 50 is completed, so if the pressurized gas contains There is no risk of poor exposure to dust. In addition, since the positions of the plurality of non-contact jig devices 52 in the XY plane are fixed, there is little possibility of dropping the substrate P.

In addition, the structure of the liquid crystal exposure apparatus 10 of the said 1st Embodiment can be changed suitably. For example, the substrate exchange device 30a shown in FIG. 3(B) may be configured such that a plurality of air guide devices 38 can move up and down. Specifically, in the substrate exchange device 30a, a plurality of air guide devices 38 are replaced by the support 37c of the substrate exchange device 30 shown in FIG. 3(A) and are supported by a Z actuator 37d on the bottom plate 34a. . When the exposed substrate P is carried out from the substrate stage device 20 (refer to FIG. 1 etc.), compared to the above-mentioned first embodiment, it is the descending drive suspension support device 50 (refer to FIG. 6(C)). This modification is The substrate exchange device 30a only needs to lift and drive the plurality of air guide devices 38. In addition, at this time, the movable stroke in the Z-axis direction of the suction pad 44 may be set to be longer than that of the first embodiment described above to suction and hold the bottom surface of the substrate P.

Thereby, since the exposed substrate P can be carried out without changing the Z position of the suspension support device 50, the operation of the suspension support device 50 can be simplified. In addition, since it is not necessary to drive the suspension support device 50 down, it is not necessary to wait for the substrate stage device 20 to completely retract from the substrate exchange position (below the suspension support device 50) and start the substrate unloading operation. therefore, Can shorten the time of substrate exchange action. In addition, the X fixing portion 40a for driving the suction pad 44 may be fixed to the gantry 32 like the substrate exchange device 30a shown in FIG. 3(B) (the X fixing portion 40a itself may not move in the X-axis direction). In this case, it is only necessary to arrange the bottom plates 34a on one side and the other side of the X fixing portion 40a, and to drive the pair of bottom plates 34a synchronously.

"Second Embodiment"

Next, the second embodiment (and its modification examples) will be described using FIGS. 9 to 12(C). In addition, in the second to fourth embodiments described below, and these modifications, the same constituent elements as those of the first embodiment described above are given the same reference numerals as those of the first embodiment described above, and their description is omitted.

In the liquid crystal exposure apparatus of the second embodiment shown in FIG. 9, the structure of the substrate stage device 60, the suspension support device 50a (not shown in FIG. 9. Refer to FIG. 10(A)), and the substrate exchange device 70 are the same as those described above The first embodiment is different. As shown in FIG. 10(A), the substrate stage device 60 includes an XY coarse motion stage 22, a fine motion stage 24, and a substrate holder 62. The structure of the XY coarse motion stage 22 and the fine motion stage 24 (including the weight elimination device 28) is the same as that of the above-mentioned first embodiment. The substrate holder 62 is composed of a rectangular plate-shaped member in a plan view, and is integrally fixed to the upper surface of the micro-movement stage 24.

As shown in FIG. 9, on the upper surface of the substrate holder 62, a plurality of X grooves 62a extending in the X axis direction are formed at predetermined intervals in the Y axis direction (for example, six in this second embodiment). An air guiding device 64 is inserted into each of the plurality of X slots 62a. The air guide device 64 is composed of a member extending in the X-axis direction, and the dimension in the longitudinal direction is set to be the same as the size of the substrate P in the X-axis direction (slightly shorter in the second embodiment). A plurality of micro holes (not shown) are formed on the upper surface of the air guiding device 64. A pressurized gas supply device (not shown) provided outside the substrate stage device 60 is connected to the air guide device 64, and the pressurized gas can be ejected from the plurality of minute holes.

Also, as shown in FIG. 10(A), below the air guide device 64 and near the longitudinal ends of the air guide device 64, feet 66 extending in the Z-axis direction are fixed. A pair of through holes 62b penetrating the substrate holder 62 in the vertical direction is formed on the bottom surface for defining the X groove 62a, and a leg 66 is inserted into each of the pair of through holes 62b. The XY coarse motion stage 22 has a pair of Z actuators 68 corresponding to the pair of legs 66 described above. The air guide device 64, by the pair of Z actuators 68, protrudes upward from the upper surface of the substrate holder 26 and the upper surface is lower than the upper surface of the substrate holder 26 (air guide The Z position of the device 64 is appropriately controlled between the positions of the X slot 62a).

The structure of the suspension support device 50a shown in FIG. 10(A), except that the Z position of the support member 54 that suspends and supports a plurality of non-contact clamp devices 52 is fixed (the Z actuator 56 (refer to FIG. 1) is not provided). Except for the points, the others are the same as the above-mentioned first embodiment.

The substrate exchange device 70 shown in FIG. 9 has a plurality of air guide devices 74 (for example, six units are provided at predetermined intervals in the Y-axis direction in the second embodiment). The air guiding device 74 is constructed in the same manner (slightly wider) as the air guiding device 64 of the substrate holder 62. That is, the air guiding device 74 is composed of a member extending in the X-axis direction, and as shown in FIG. 11(A), a pair of legs 76 are provided on the lower surface thereof. The air guiding device 74 is driven in the Z-axis direction with a predetermined stroke by a pair of Z actuators 78 fixed to the bottom plate 34.

A plurality of micro holes (not shown) are formed on the upper surface of the air guide device 74. A pressurized gas supply device (not shown) is connected to the air guide device 74, and the pressurized gas can be ejected from the plurality of minute holes. In the second embodiment, the substrate P is supported from below from the plurality of air guide devices 64 of the substrate stage device 60 and/or the plurality of air guide devices 74 of the substrate exchange device 70, and the air The guiding devices 64 and 74 are aligned with the substrate P A pressurized gas is sprayed from the bottom to suspend and support the substrate P (non-contact support). In addition, since the structure of the substrate driving device 36 shown in FIG. 9 is the same as that of the above-mentioned first embodiment, the description thereof is omitted.

Hereinafter, the substrate exchange operation of the second embodiment will be described using FIGS. 11(A) to 12(C). FIG 11 (A) show the exposure of the substrate held completion of group P ₁ of the substrate stage device 60 exchange position (depending below the supporting means 50a) of the state. _{In addition, the substrate P 2 is} placed on the air guide device 74 of the substrate exchange device 70. Arranged at positions of the substrate base exchange stage device 60, FIG. 11 (B), the depending support means 50a to increase the air guide 64 to drive suction holding can (depending support) position of the substrate P _1. Depending support means attracting and holding the substrate P ₁ 50a, in the first embodiment, in the same manner, the substrate ₁ P ₂ is retracted from the path of movement of the substrate P to the substrate board P ₂ until the end of the base station apparatus 60 of the loading operation. In addition, in the substrate exchange device 70, the suction pad 44 sucks and holds the substrate P ₂ .

After the substrate P ₁ is transferred to the overhanging support means 50a, as shown in FIG. 11 (C), air guide means 64 is driven downward. At this time, the Z actuator 68 is controlled so that the Z position on the upper surface of the air guiding device 64 is substantially the same as the Z position on the upper surface of the air guiding device 74 of the substrate exchange device 70 (or slightly lower). In this state, the Z position of the air guiding device 74 is set so that the upper surface of the air guiding device 64 is located closer to the +Z side than the upper surface of the substrate holder 62.

Next, as shown in FIG. 12(A), the suction pad 44 is driven in the -X direction. Thereby, the substrate P ₂ moves along the guide surface formed by the upper surface of the air guide device 74 and the upper surface of the air guide device 64, and is transferred from the air guide device 74 to the air guide device 64. The following, although not shown, the suction pad 44 suction holding the substrate P after the lifting of _2, is driven by the -Z direction, and the + X direction from the substrate ₂ and the substrate P after being held between the removal tool 62 above As shown in FIG. 12(B), the air guide device 64 is driven downward, and the substrate P _{2 is} placed on the upper surface of the substrate holder 62. Further, although not shown, the adsorption pad 44 to the drive train is the + Z direction and the -X direction, while the suction holding the substrate P ₁ below. In addition, in the substrate exchange device 70, the air guide device 74 is driven upward. In this case, Z control system to cause the actuator 78 held at the Z position than the substrate below the overhang of the support means 50a of _a P slightly above the -Z side 74 of the air guide means.

After that, as shown in FIG. 12(C), pressurized gas is sprayed from the upper surface of the air guide 74, and the adsorption pad 44 is driven in the +X direction. Accordingly, the substrate P ₁ along a plurality of non-contact clip device 52, and a plurality of predetermined air guide means 74 of the respective movement guide face, and placed on a plurality of air guide 74. Hereinafter, the above-described first embodiment in the same manner, on a plurality of air guide means 74, 99 used for an external transfer robot arm (not shown as in FIG. 12 (C)) after a predetermined substrate ₂ and the substrate P ₁ P Perform the exchange operation of other substrates (not shown) for exposure processing (refer to Fig. 7(B) ~ Fig. 8(B)).

According to the second embodiment described above, the since the system in the first embodiment similarly to the completion of the exposure of the substrate P ₁ is retracted from the substrate P _carry-2 of the path, preferentially for the substrate P ₂ than the substrate P unloaded ₁ of operation The loading operation can shorten the exchange time of the substrate P.

Further, the second embodiment of the present aspect, since a plurality of air guide means 74 can move up and down, even if a plurality of non-contact without the clamp drive means 52 is lowered, the substrate P ₁ can also be directly unloaded from the retracted position. Therefore, as shown in FIG. 12(C), it is possible to carry _{out the unloading of the substrate P 1} (which can also be performed in parallel with the pre-alignment operation _{for the substrate P 2) with the substrate stage device 60 in the substrate exchange position.} Shorten the time required for the exchange action of the substrate P. In addition, since the plurality of air guide devices 64 included in the substrate stage device 60 can move up and down, the substrate P can be transferred from the substrate stage device 60 to the suspension support device 50a. Therefore, the Z position of a plurality of non-contact clamp devices 52 can be fixed, and the structure of the suspension support device 50a can be simplified.

In addition, the structure of the liquid crystal exposure apparatus of the said 2nd Embodiment can be changed suitably. For example, like the substrate stage device 60a shown in FIG. 10(B), the X-axis direction size may be shorter than the air guide device 64 of the second embodiment (see FIG. 10(A)). In this modification (For example, three) The air guide device 64a is accommodated in the X groove 62a at a predetermined interval in the X-axis direction. The plurality of air guide devices 64a are synchronously driven by Z actuators 69 (for example, cylinder devices) accommodated in the recess 62c formed on the bottom surface of the X groove 62a. In addition, although not shown, the air guide device 74 (refer to FIG. 9) of the substrate exchange device 70 may be configured in the same manner.

"The third embodiment"

Next, the third embodiment (and its modification examples) will be described using FIGS. 13(A) to 14(B). In the third embodiment, although the structure of the substrate stage device 60 is the same as that of the above-mentioned second embodiment, and the structure of the suspension support device 50 is the same as that of the above-mentioned first embodiment, the operation during the substrate exchange operation (control of the main control device) ) Are different. In addition, the substrate exchange device 70a has a plurality of air guide devices 74 (hidden in the depth direction of the paper in FIGS. 13(A) to 14(B)), similarly to the above-mentioned second embodiment shown in FIG. 9, However, it does not have an element equivalent to the substrate driving device 36 (refer to FIG. 9).

In the third embodiment, the substrate P is transported by its own weight. FIG. 13(A) shows _{the state after the exposed substrate P 1 is} transferred to the suspension support device 50. In the substrate stage device 60, a plurality of (in FIG. 13 (A) ~ FIG. 14 (B) are hidden in the depth direction of the drawing) of the air guiding device 64 transferred to the substrate P ₁ depending support means 50 is driven downward after this Although the points are the same as in the second embodiment described above, in this third embodiment, the Z actuator 68 is controlled so that the Z position of the end of the air guide device 64 on the +X side (the substrate exchange device 70a side) -The Z position of the X-side end is high, that is, the guide surface formed by a plurality of air guide devices 64 becomes an inclined surface with respect to the XY plane.

In addition, the air guiding devices 74 of the plurality of substrate stage devices 70a (hidden in the depth direction of the paper in FIGS. 13(A) to 14(B)) are similarly controlled to control the Z actuator 78 so that + The Z position of the end on the X side is higher than the Z position of the end on the -X side (the substrate stage device 60 side), that is, the guiding surface formed by the plurality of air guiding devices 74 becomes an inclined surface with respect to the XY plane. Here, each of the Z actuators 68 and 78 is controlled so that the guide surface formed by each of the plural air guide devices 64 and the air guide device 74 forms a single (no level difference (or the level difference is so small) Affect the movement of the substrate P ₂ )) Guide surface. Specifically, the angle of the guide surface (inclined surface) formed by each of the plurality of air guide devices 64 and the air guide device 74 is set to be substantially the same as each other, and the guide formed by the plurality of air guide devices 64 The Z position of the +X side end of the guide surface and the Z position of the -X side end of the guide surface formed by a plurality of air guide devices 74 are set to be approximately the same (in fact, by a plurality of air guides The guiding surface formed by the device 74 is slightly higher).

As a result, since the substrate P ₂ is supported by the plurality of air guides 64 and 74 in a non-contact manner (in a state where friction is substantially negligible), as shown in FIG. 13(B), the substrate P _{2 is} edged by its own weight The guide surface formed by the plurality of air guide devices 64 and 74 moves from the plurality of air guide devices 74 to and from the plurality of air guide devices 64. Hereinafter, as in the above-mentioned first embodiment, after the pre-alignment operation is performed using the X pressing pin device 25x (refer to FIG. 2), etc., as shown in FIG. 13(C), a plurality of air guide devices 74 are lowered and driven by This substrate P ₂ is sucked and held by the substrate holder 62.

Further, the present third embodiment, the carry-out completion of the exposure of the substrate P by using the substrate P is also _a weight of _1. That is, the pre-alignment of the substrate P ₂ parallel operation, depending on the supporting means 50, to the substrate by a plurality of lines of non-contact clamping means 52 is formed opposite the holding surface is inclined to the XY plane of the embodiment, specifically system The Z position of the end of the +X side (substrate exchange device 70a side) of the above-mentioned substrate holding surface is lower than the Z position of the end of the -X side to control a plurality of Z actuators 56 (not shown in Fig. 13(C)) Show. Refer to Figure 1, etc.).

In addition, in the substrate exchange device 70a, each of the plurality of air guide devices 74 is driven so that the inclination angle of the guide surface formed by the plurality of air guide devices 74 and the inclination of the substrate holding surface of the above-mentioned suspension support device 50 The angle becomes approximately the same. Thereby, the substrate P ₁ moves along the substrate holding surface of the suspension support device 50 and/or the guiding surface formed by the plurality of air guiding devices 74 and is placed on the plurality of air guiding devices 74. _{In addition, a stopper device for stopping the substrate P 2} carried out from the suspension support device 50 at a desired position on the plurality of air guide devices 74 may also be arranged in the substrate exchange device 70.

According to the third embodiment described above, since the substrate exchange device 70a does not have an element for driving the substrate P, the structure is simple.

In addition, the structure of the liquid crystal exposure apparatus of the said 3rd Embodiment can be changed suitably. For example, in the suspension support device 50b shown in FIG. 14(B), the support member 54b is configured to be longer so that the +X side end of the substrate holding surface formed by a plurality of non-contact jig devices 52 is larger than the substrate The +X side end of the holder 62 protrudes toward the X side, and the protruding part overlaps the -X side end of the air guide 74 of the substrate exchange device 70a in the vertical direction. Accordingly, the substrate P ₁ can be more smoothly transfer from the depending support means 50b to the plurality of air guide 74.

"Fourth Embodiment"

Next, the fourth embodiment will be described using FIGS. 15(A) to 17(B). In the liquid crystal exposure apparatus of the fourth embodiment, the exchange operation of the substrate P on the substrate stage device 60 is performed by an external transport robot 99 arranged outside the liquid crystal exposure apparatus. In addition, the structure of the substrate stage device 60 is the same as that of the above-mentioned second embodiment (however, the control is different), and the suspension support device 50b is the same as the above-mentioned first except that the movable stroke in the Z-axis direction is longer. The suspension support device 50 (refer to FIG. 1 etc.) of the embodiment has the same configuration (however, the control is different). In addition, no element corresponding to the substrate exchange device 30 of the above-mentioned first embodiment or the substrate exchange device 70 of the above-mentioned second embodiment is provided.

FIG 15 (A) show the exposure of the substrate held completion of group P ₁ of the substrate stage device 60 exchange position (depending below the support means 50b) of the state. In addition, in the +X side area of the substrate exchange position, the arm member 98 of the external transport robot 99 _{supporting the substrate P 2 is on standby.} Further, the support has a standby position P ₂ the arm of the substrate member 98, the Xi Yi Ke substrate stage apparatus accommodated inside processing chamber (not shown) within 60 and device 50b hung down support Xi Yi Ke outside the processing chamber. When the standby position of the arm member 98 supporting the substrate P ₂ is outside the processing chamber, the substrate exchange operation on the substrate stage device 60 described below is performed through the opening formed in the processing chamber.

Here, in the fourth embodiment, the arm member 98 of the external transport robot arm 99 has a plurality of support portions 98a arranged at predetermined intervals in the Y-axis direction (overlapped in FIGS. 15(A) to 17(B)) The deep side of the paper surface), the substrate stage device 60 has a plurality of air guide devices 64 (overlaid on the deep side of the paper surface in FIGS. 15(A) to 17(B)) arranged at predetermined intervals in the Y-axis direction. In addition, the intervals in the Y-axis direction of the plurality of support portions 98a and the plurality of air guide devices 64 are set so that the positions in the Y-axis direction do not overlap each other when the arm member 98 is positioned above the substrate holder 62 (air guide The guiding device 64 can pass between adjacent supporting portions 98a). Therefore, although the structure of the arm member 98 of the external transport robot 99 and/or the plurality of air guides 64 of the fourth embodiment is actually different from that of FIG. 2 or FIG. 9, it is used here for the convenience of explanation. The same symbols are used for description.

_{As shown in FIG. 15(B), in the fourth embodiment, the exposed substrate P 1 is} transferred to the suspension support by ascending and driving a plurality of air guide devices 64 of the substrate stage device 60 at the substrate exchange position装置50b. Next, as shown in FIG. 15(C), a _{plurality of non-contact jig devices 52 holding a substrate P 1} are lifted and driven, in the guide formed by the substrate holding surface of the suspension support device 50b and the plurality of air guide devices 64 A wide space is formed between the lead surfaces. Thereafter, as shown in FIG. 16(A), the arm member 98 of the external transport robot 99 _{supporting the substrate P 2 is inserted into the above-mentioned space.}

Hereinafter, by lowering the driving arm member 98 as shown by the arrow in FIG. 16(B) (and driving a plurality of air guide devices 64 ascending), the substrate P ₂ is supported from below by a plurality of air guide devices 64, and then by The arm member 98 is driven in the +X direction, and the arm member 98 retreats from below the suspension support device 50b. Next, as shown in FIG. 16(C), a plurality of air guides 64 are driven downward, and the substrate P ₂ is placed on the substrate holder 62. In addition, the arm member 98 of the external transport robot 99 is driven in the +Z direction in parallel. And, during the transfer from the robot arm 99 of the outer arm member 98 to the substrate holding device 62 P ₂ of the handover operation in the same manner as the substrate P ₁ standby and the first to third embodiment, the substrate exchange position.

Next, as shown in FIG. 17(A), the substrate _{stage device 20 holding the substrate P 2} is separated from the substrate exchange position, and the arm member 98 of the external transport robot 99 is driven in the -X direction in parallel, thereby being arranged in the lower support means 50b depending, in this state, a plurality of non-contact clip device 52 is driven downward, whereby P ₁ is placed on the substrate 99 of the arm member 98 on the outer transporting robot arm. Hereinafter, the support means is released depending on the substrate P depending 50b of the support ₁ and the support substrate P of the arm member ₁₉₈ in the external device after attracting and holding the substrate P to the _driving direction of + X, the substrate ₁ is conveyed to P (e.g. Coating and developing device). In addition, a plurality of non-contact jig devices 52 are driven up and down in parallel.

According to the fourth embodiment described above, since the substrate P is directly transferred between the substrate stage device 60 and the external transport robot 99, there is no need to provide a device for transporting the substrate P into the liquid crystal exposure device (for example, It is equivalent to the above-mentioned first embodiment (refer to the device of the substrate exchange device 30 in FIGS. 7(C) to 8(B)), and the structure of the liquid crystal exposure device can be simplified. In addition, in the fourth embodiment, the substrate stage device 60 has the same air guide device 64 as the above-mentioned second embodiment, but since the substrate P does not move along the air guide device 64, it can also be used such as lifting Pin device is a device that does not have a guiding function.

In addition, the configuration of the first to fourth embodiments (including their modifications. The same applies hereinafter) described above can be changed as appropriate. For example, in the first to fourth embodiments described above, although the non-contact jig device 52 passes gas at a high speed between it and the upper surface of the substrate P to act on the substrate P in the upward direction of gravity (+Z direction). , But not limited to this, it is also possible to use a so-called vacuum that sucks the gas on the upper side of the substrate P to make the +Z-direction force act on the substrate P and ejects the gas to the substrate P to maintain the gap with the substrate P Vacuum preload airbearing.

In addition, in the first to fourth embodiments described above, the substrate P to be carried out is held on the pattern surface (upper surface) by the non-contact jig device 52 from above, but as long as the substrate P can be removed from the substrate holders 26, 62 The structure of the suspending support device can be changed as appropriate. For example, a plurality of supporting members (for example, a suction pad) that touches the vicinity of the end of the support substrate P from the bottom side (the area protruding outward from the end of the substrate holder 26) is used. 44 (refer to FIG. 1) an L-shaped member with the upper and lower sides) (may be used in combination with the non-contact jig device 52) to support the substrate P from above.

In addition, in the first and second embodiments described above, the substrate driving device 36 that moves the substrate P during the loading and unloading of the substrate P is provided in the substrate exchange device 30, but it is not limited to this, and may be provided in the substrate stage device 20. A device for driving the substrate P is provided on the side (or each of the substrate exchange device 30 and the substrate stage device 20).

In addition, in the above-mentioned first to fourth embodiments (and modifications), although the exposure of the substrate P _{1 is} suspended and supported by the suspension support device 50 (50a, 50b), the next substrate P _{2 is performed} against the substrate. The loading operation of the holder 26, but the steps of the substrate exchange operation are not limited to this. For example, the substrate exchange device 30 may be used in the exposure operation of the _{substrate P 1 to transfer the next substrate P 2} from the plurality of air guide devices 38 in advance. To the suspension support device 50 (previously set the next substrate P ₂ to the substrate exchange position), after _{the exposure of the substrate P 1} is completed, move from the suspension support device 50 (50a, 50b) to the substrate exchange position After the substrate holder 26 _{carries out the unloading operation of the substrate P 1 , the substrate P 2 is} placed on the substrate holder 26 by driving down the non-contact jig device 52.

Illumination light may be ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength of 248 nm) of ultraviolet light and the like, or F ₂ laser beam (wavelength 157 nm) of the vacuum ultraviolet light and the like. In addition, as the illuminating light, for example, single-wavelength laser light in the infrared band or visible light band emitted from a DFB semiconductor laser or fiber laser can be used, for example, a fiber amplifier doped with erbium (or both erbium and mirror). Amplification, the use of nonlinear optical crystals to convert the wavelength into harmonics of ultraviolet light. In addition, a solid laser (wavelength: 355nm, 266nm) or the like can also be used.

In addition, although the description has been given for the case where the projection optical system 16 is a multi-lens projection optical system with a plurality of projection optical systems, the number of projection optical systems is not limited to this, as long as there is more than one projection optical system. In addition, it is not limited to the projection optical system of the multi-lens method, and may be, for example, a projection optical system using an Ofner type large mirror. In addition, the projection optical system 16 may be a magnification system or a reduction system.

In addition, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the corner glass plate. It can also be widely applied to, for example, the production of organic EL (Electro-Luminescence) Exposure equipment for panel manufacturing, exposure equipment for semiconductor manufacturing, thin film magnetic heads, micro machines, and exposure equipment for DNA wafers. Moreover, in addition to manufacturing micro-elements such as semiconductor elements, for manufacturing photomasks or reticles used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, and electron beam exposure equipment, it can also be applied to The circuit pattern is transferred to the exposure device such as glass substrate or silicon wafer.

In addition, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a photomask substrate. In addition, when the exposure target is a substrate for a flat-panel display, the thickness of the substrate is not particularly limited. For example, a film-like (a flexible sheet-like member) is also included. In addition, the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target.

Electronic components such as liquid crystal display components (or semiconductor components) are manufactured through the following steps, namely: the steps of designing the function and performance of the components, the steps of making a mask (or reticle) according to this design step, and manufacturing Steps of the glass substrate (or wafer), transfer the pattern of the photomask (reticle) to the microstructure of the glass substrate according to the exposure device and the exposure method of the above-mentioned embodiments Shadow step, development step to develop the exposed glass substrate, etching step to remove parts of exposed members other than the remaining part of the resist by etching, resist removal to remove the resist that is not needed due to the end of the etching Steps, component assembly steps, inspection steps, etc. In this case, in the lithography step, since the aforementioned exposure method is performed using the exposure device of each of the above embodiments, and the device pattern is formed on the glass substrate, a high-integrity device can be manufactured with good productivity.

In addition, the disclosures of all publications, international publications, U.S. patents, and U.S. patent application publications on exposure devices cited in the above description are cited as part of the description of this specification.

As explained above, the object exchange method of the present invention is suitable for exchanging objects on an object holding device. In addition, the manufacturing method of the flat panel display of the present invention is suitable for the production of flat panel displays. In addition, the device manufacturing method of the present invention is suitable for the production of micro devices.

20: substrate stage device

26: substrate holder

30: Substrate exchange device

38: Air guiding device

40: X drive unit

44: Adsorption pad

50: Suspended support device

52: Non-contact fixture device

P ₁ , P ₂ : substrate

Claims (12)

An object exchange system, comprising: a first supporting device arranged to face the first surface of the object and supporting the first surface in a non-contact manner; and a second supporting device arranged to face the second surface of the object Surface, and support the second surface in a non-contact manner; and a driving part, in a state where the object is supported in a non-contact manner by the first support device and the second support device, relative to the first support device and the first support device 2 The supporting device makes the aforementioned object move relatively; wherein, the aforementioned first supporting device is opposed to the aforementioned second supporting device in such a way that the aforementioned object is supported by the aforementioned first supporting device and the aforementioned second supporting device in a non-contact manner. The object exchange system is equipped with a holding device for holding the object, the first supporting device supports the object on the holding device in a non-contact manner; the first supporting device is the first supporting device that supports the object in a non-contact manner In the state of the surface, the aforementioned object is separated from the aforementioned holding device; the aforementioned second supporting device supports another object different from the aforementioned object, and the aforementioned driving part is used to separate the aforementioned object from the aforementioned holding device by the aforementioned first supporting device Afterwards, the holding device moves the other object on the second supporting device to the holding device; the driving portion inserts the other object at a position between the object and the holding device. For example, the object exchange system of the first item of the scope of patent application, wherein the holding device moves in a manner close to the second supporting device; the driving part is along the surface of the holding device and the surface of the second supporting device Move the aforementioned other object. For example, the object exchange system of the second item of the scope of patent application, wherein the holding device is moved to a position overlapping with the first supporting device in the up and down direction. For example, the object exchange system of the first item in the scope of the patent application, wherein the holding device moves in a direction separated from the second supporting device while holding the other object. An exposure apparatus is provided with: an object exchange system as in any one of items 1 to 4 in the scope of patent application; and a pattern forming device that uses energy beams to form a predetermined pattern on the other object held by the holding device. For example, in the exposure device of item 5 of the scope of patent application, the object supported by the first supporting device and the second supporting device in a non-contact manner is an object with the predetermined pattern formed by the pattern forming device. Such as the exposure device of the 5th or 6th patent application, wherein the aforementioned object and the aforementioned another object system are used for the substrate of a flat-panel display device. Such as the exposure device of the 7th patent application, wherein the length of at least one side of the aforementioned substrate or the length of the diagonal line is more than 500mm. A method for manufacturing a flat-panel display includes: using the exposure device of any one of the 5th to 8th patent applications to expose the aforementioned object; and the operation of developing the aforementioned object after exposure. A method of manufacturing an element, which includes: the operation of exposing the aforementioned object using the exposure device of the 5th or 6th patent application; and the operation of developing the aforementioned object after the exposure. An object moving method comprising: respectively supporting the first surface and the second surface of the object in a non-contact manner; and moving the aforementioned object in a state where the aforementioned object is supported in a non-contact manner; Among them, in the aforementioned non-contact supporting action, the aforementioned object on the holding device is supported in a non-contact manner; in the aforementioned moving action, the aforementioned holding device after separating the aforementioned object from the aforementioned holding device is brought into contact with the aforementioned Another object with a different object is moved to the aforementioned holding device; in the aforementioned moving action, the aforementioned other object is inserted at a position between the aforementioned object and the aforementioned holding device. An exposure method comprising: the movement of the aforementioned object by the object movement method of the eleventh scope of the patent application; and the movement of using an energy beam to form a predetermined pattern on the aforementioned other object held by the aforementioned holding device.

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