JP7207096B2 - Substrate transport apparatus, exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method - Google Patents

Description

The present invention relates to a substrate transfer apparatus, an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an exposure method.

In the lithography process for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements, a pattern formed on a mask (or reticle) is transferred onto a substrate (substrate made of glass, plastic, etc., semiconductor wafer, etc.) using an energy beam. A transfer exposure device is used.

In this type of exposure apparatus, an exposed substrate is unloaded from the stage device holding the substrate transport device, and a new substrate is loaded onto the stage device. As a method for transporting a substrate, for example, the method described in Patent Document 1 is known.

WO2013/150787

According to the first aspect, the exposure apparatus is an exposure apparatus that uses a projection optical system to expose a substrate being scanned in a first direction on a predetermined plane, and has a first surface capable of supporting the substrate. a support portion that moves relative to the projection optical system ; a second surface capable of supporting the substrate; a projecting member that can project from the second surface; and a transfer portion for transferring the substrate on the first surface onto the second surface, wherein the port portion is adjusted to the second surface by the height adjustment portion. The surface is adjusted to the same height as the first surface and supports the substrate transferred from the first surface to the second surface by the transfer section, and the projecting member supports the substrate. By projecting from two surfaces, the substrate is held and the substrate is transported from the second surface to a position higher than the second surface .

It should be noted that the configurations of the embodiments described later may be modified as appropriate, and at least a part of them may be replaced with other components. Furthermore, constituent elements whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiments, and can be arranged at positions where their functions can be achieved.

1 is a diagram schematically showing the configuration of an exposure apparatus according to one embodiment; FIG. 2 is a plan view of a stage device and a substrate transfer device included in the exposure apparatus of FIG. 1; FIG. 3(a) and 3(b) are diagrams schematically showing the relationship between the beam unit and the air floating plate. It is a perspective view of a slide plate. FIGS. 5A and 5B are side views (1) of the exposure apparatus for explaining the substrate exchange operation in one embodiment. 6A and 6B are side views (part 2) of the exposure apparatus for explaining the substrate exchanging operation in one embodiment. 7A and 7B are side views (part 3) of the exposure apparatus for explaining the substrate exchanging operation in one embodiment. FIG. 8 is a side view (part 4) of the exposure apparatus for explaining the substrate exchange operation in one embodiment. FIG. 11 is a side view of a stage device and a substrate transfer device included in an exposure apparatus according to a first modified example of one embodiment; FIG. 10 is a plan view of a stage device and a substrate transfer device included in the exposure apparatus of FIG. 9; FIGS. 11A and 11B are side views (1) of the exposure apparatus for explaining the substrate exchanging operation in the first modified example of the embodiment. FIGS. 12(a) and 12(b) are side views (2) of the exposure apparatus for explaining the substrate exchanging operation in the first modified example of the embodiment. FIGS. 13A and 13B are side views (3) of the exposure apparatus for explaining the substrate exchange operation in the first modified example of the embodiment. 14A and 14B are side views (part 4) of the exposure apparatus for explaining the substrate exchanging operation in the first modified example of the embodiment. FIG. 11 is a perspective view showing a slide plate according to a second modified example of one embodiment; 16(a) and 16(b) are side views of an exposure apparatus for explaining a third modification of one embodiment. FIG. 17(a) is a plan view of a substrate transfer device according to a fourth modification of one embodiment, and FIG. 17(b) is a side view of the substrate transfer device. FIG. 11 is a plan view schematically showing a state in which a substrate feeder and a port portion according to a fourth modification approach each other; FIGS. 19(a) to 19(c) are diagrams (part 1) for explaining the board exchange operation in the fourth modification of the embodiment. FIGS. 20(a) to 20(c) are diagrams (part 2) for explaining the board exchange operation in the fourth modification of the embodiment. FIGS. 21A and 21B are diagrams (part 3) for explaining the board exchange operation in the fourth modification of the embodiment. 22(a) and 22(b) are side views of a stage device and a substrate transfer device included in an exposure apparatus according to a fifth modified example of one embodiment. It is a figure for demonstrating the 6th modification of one embodiment. FIGS. 24A and 24B are diagrams for explaining a seventh modification of one embodiment. 25(a) and 25(b) are a plan view and a side view showing another example (No. 1) of the stage device. FIG. 26(a) is a plan view showing another example (part 2) of the stage device, and FIGS. 26(b) and 26(c) are cross-sectional views taken along the line AA of FIG. 26(a). FIG. 27(a) is a plan view showing another example (No. 3) of the stage device, and FIG. 27(b) is a cross-sectional view taken along the line AA of FIG. 27(a). 28(a) to 28(c) are side views for explaining how the substrate is placed on the stage apparatus shown in FIGS. 27(a) and 27(b).

An embodiment according to the present invention will be described below with reference to FIGS. 1 to 8. FIG.

FIG. 1 schematically shows the configuration of an exposure apparatus 10P according to this embodiment. 2 is a plan view of a stage device 20P and a substrate transfer device 100P included in the exposure apparatus 10P of FIG. 1. FIG.

The exposure apparatus 10P performs step-and-scan projection using a rectangular (square) glass substrate P (hereinafter simply referred to as the substrate P) used in, for example, a liquid crystal display device (flat panel display). It is an exposure device, a so-called scanner.

The exposure apparatus 10P includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a resist (sensitizer) on the surface (the surface facing the +Z side in FIG. 1). , a stage device 20P for holding the substrate P (P1) coated with , a substrate transfer device 100P, a control system for these, and the like. Hereinafter, as shown in FIG. 1, X-, Y-, and Z-axes are set to be orthogonal to each other for the exposure apparatus 10P, and the mask M and the substrate P are aligned in the X-axis directions with respect to the projection optical system 16 during exposure. , and the Y-axis is set in the horizontal plane. Further, the rotation (tilt) directions about the X-axis, Y-axis, and Z-axis are described as θx, θy, and θz directions, respectively. Also, the positions in the X-axis, Y-axis, and Z-axis directions will be described as the X position, the Y position, and the Z position, respectively.

The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331, and irradiates the mask M with the illumination light IL. As illumination light IL, for example, light containing at least one wavelength of i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used. In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL emitted from the light source are not particularly limited. Light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm) may be used.

The mask stage 14 holds a light transmissive mask M. As shown in FIG. The mask stage 14 is driven by a predetermined stroke at least in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including, for example, a linear motor. In order to adjust the relative position of the mask stage 14 with at least one of the illumination system 12, the stage device 20P, and the projection optical system 16, the mask stage 14 is driven by a fine movement drive system that moves its X position and Y position by a stroke. The positional information of the mask stage 14 is obtained by, for example, a mask stage position measurement system (not shown) including a linear encoder system and an interferometer system.

The projection optical system 16 is arranged below the mask stage 14 (on the −Z side). The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms an erect image, for example. It is equipped with multiple telecentric optical systems on both sides. Note that the projection optical system 16 does not have to be of the multi-lens type. It may be composed of one projection optical system such as that used in a semiconductor exposure apparatus.

In the exposure apparatus 10P, when the mask M positioned within a predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, a projected image (partial pattern image) of the pattern of the mask M within the illumination area is produced. is formed in the exposure area by the projection optical system 16 . The mask M moves in the scanning direction relative to the illumination area (illumination light IL), and the substrate P moves relative to the exposure area in the scanning direction, whereby scanning exposure is performed on the substrate P. A pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

(Stage device 20P)
The stage device 20P includes a surface plate 22, a substrate table 24, a support device 26, and a substrate holder 28.

The surface plate 22 consists of a rectangular plate-like member in a plan view (viewed from the +Z side) arranged so that its upper surface (+Z surface) is parallel to the XY plane. Located on F. The support device 26 is placed on the surface plate 22 in a non-contact manner and supports the substrate table 24 from below in a non-contact manner. The substrate holder 28 is arranged on the substrate table 24, and the substrate table 24 and the substrate holder 28 are integrally driven by a stage drive system (not shown) provided in the stage device 20P. The stage drive system includes, for example, a linear motor, etc., and includes a coarse movement system capable of driving the substrate table 24 in the X-axis and Y-axis directions (along the upper surface of the platen 22) with a predetermined stroke, and a voice coil motor, for example. and a fine movement system for finely driving the substrate table 24 in directions of six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz). In addition, the stage device 20P includes, for example, an optical interferometer system, an encoder system, and the like, and is provided with a stage measurement system for obtaining positional information of the substrate table 24 in directions of the six degrees of freedom.

The substrate P is placed on the upper surface 28u (surface on the +Z side) of the substrate holder 28 which is rectangular in plan view. As shown in FIG. 2, the top surface 28u has substantially the same aspect ratio as the substrate P. As shown in FIG. As an example, the lengths of the long and short sides of the upper surface 28u are set slightly shorter than the lengths of the long and short sides of the substrate P, respectively.

An upper surface 28u of the substrate holder 28 is finished extremely flat over the entire surface. The upper surface 28u of the substrate holder 28 is formed with a plurality of minute holes (not shown) for blowing air and minute holes (not shown) for vacuum suction. It should be noted that a common hole may be used as both the minute hole for blowing air and the minute hole for vacuum suction. The substrate holder 28 sucks the air between the upper surface 28u and the substrate P through the plurality of holes using a vacuum suction force supplied from a vacuum device (not shown), thereby holding the substrate P on the upper surface 28u. It can be sucked (flatness correction). The substrate holder 28 is a so-called pin chuck type holder, and has a plurality of pins (pins with a very small diameter of, for example, about 1 mm) arranged at substantially equal intervals. By having the plurality of pins, the substrate holder 28 can reduce the possibility of supporting the substrate P with dust or foreign matter caught in the rear surface thereof, and can reduce the possibility of deformation of the substrate P due to the foreign matter being caught. The substrate P is held (supported) on the upper surfaces of the pins. An XY plane formed by the upper surfaces of the plurality of pins is defined as an upper surface 28 u of the substrate holder 28 . In addition, the substrate holder 28 supplies (supplies) pressurized gas (for example, air) from a pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the hole. , the rear surface of the substrate P attracted to the substrate holder 28 can be separated from the upper surface 28u (float the substrate P). In addition, in each of the plurality of holes formed in the substrate holder 28, the timing of supplying the pressurized gas may be different, or the positions of the holes for vacuum suction and the holes for supplying the pressurized gas may be changed. or appropriately change the air pressure between suction and air supply to control the grounding state of the substrate P (for example, an air pool between the rear surface of the substrate P and the upper surface 28u of the substrate holder 28). so that it does not occur).

It should be noted that the substrate holder 28 may correct the flatness of the substrate in a state in which the substrate P is not adsorbed to the upper surface 28u but is floated and supported. In this case, the substrate holder 28 supplies (supplies) a pressurized gas (for example, air) from a pressurized gas supply device (not shown) to the back surface of the substrate P through the hole. A gas is interposed between the lower surface of P and the upper surface 28u of the substrate holder 28 (that is, a gas film is formed). In addition, the substrate holder 28 uses a vacuum suction device to suck the gas between the substrate holder 28 and the substrate P through the holes for vacuum suction, so that the substrate P is subjected to a downward force (preload) in the direction of gravity. ) imparts rigidity in the direction of gravity to the gas film. The substrate holder 28 holds (supports) the substrate P in a non-contact manner by floating the substrate P in the Z-axis direction via a small clearance by the balance between the pressure and flow rate of the pressurized gas and the vacuum suction force. A force for controlling the flatness (for example, a force for correcting or correcting the flatness) may be applied to P. Each hole may be formed by processing the substrate holder 28, or the substrate holder 28 may be made of a porous material to supply or suck air. The upper surface 28u of the substrate holder 28 that floats and supports the substrate P is not the surface where the hole is formed, but a virtual surface located above the surface by the above-mentioned clearance, that is, the surface of the substrate whose plane has been corrected. The upper surface is referred to as an upper surface 28u.

As shown in FIG. 2, for example, two cutouts 28a are formed apart in the Y-axis direction at the −X side end of the upper surface 28u of the substrate holder 28 . In addition, as shown in FIG. 2, two cutouts 28b, for example, are formed apart from each other in the Y-axis direction at the +X side end of the upper surface of the substrate holder 28. As shown in FIG.

(Substrate transfer device 100P)
As shown in FIG. 1, the substrate transfer device 100P has a port section 150P, a substrate slide hand 140P, a substrate feeder 160P, and a transfer device 180P. The port section 150P, the substrate slide hand 140P, and the substrate feeder 160P are installed on the +X side with respect to the stage device 20P. For example, the transfer of the substrate P between an external device (not shown) such as a coater/developer and the substrate holder 28 is performed by the substrate transfer device 100P.

Also, the transfer of the substrate P between the external device and the exposure apparatus 10P is performed by an external transfer apparatus 300 arranged outside the chamber (not shown) accommodating the exposure apparatus 10P. The external transport device 300 has a fork-shaped robot hand, and the substrate P before exposure is placed on the robot hand, and the substrate P is transported from the external device to the port section 150P in the exposure apparatus 10P. The exposed substrate P is transported from the port section 150P to an external device.

As shown in FIG. 2, the port section 150P has a beam unit 152 including a plurality of (five in this embodiment) beams arranged at predetermined intervals in the Y-axis direction. A plurality of minute holes (not shown) for blowing out air are formed in the upper surface of each beam of the beam unit 152 . The beam unit 152 supplies pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the back surface of the substrate P and the top surface of each beam through the holes. By doing so, it is possible to separate the back surface of the substrate P from the top surface of the beam unit 152 (float the substrate P). The distance between the beams in the Y-axis direction is such that the beam unit 152 can support the substrate P from below with good balance, and when the fork hand of the external transfer device 300 is arranged at the same height as the beam unit 152, the fork hand A plurality of fingers 300F possessed by the hand are set so as to be arranged (insertable and removable) between the plurality of beams.

The length in the longitudinal direction (X-axis direction) of each beam is slightly longer than the length in the longitudinal direction of the substrate P, and the length in the width direction (Y-axis direction) is slightly longer than the length in the width direction of the substrate P, for example It is set to about 1/50, or about 10 to 50 times the thickness of the substrate P, for example.

As shown in FIG. 1, each of a plurality of beams (in FIG. 1, they overlap in the depth direction of the page) is positioned inside both ends in the X-axis direction by a plurality of (for example, two) rod-shaped legs 254. supported from below. The lower ends of the legs 254 supporting the beam unit 152 are connected to a plate-shaped base portion 253 . The base portion 253 is vertically moved by a vertical movement mechanism 255 . In addition, the vertical movement mechanism 255 is movable in the X-axis direction along a rail 257 laid on the floor F along the X-axis direction. That is, the plurality of beam units 152 and the substrate P supported by the plurality of beam units 152 are movable in the X-axis direction and the Z-axis direction.

An air floating plate 251 is fixed to the vertical movement mechanism 255 via a mounting member 252 . That is, the height position of the air floating plate 251 is fixed. As shown in FIG. 2, the air floating plate 251 is formed with grooves 251a capable of accommodating three of the five beams of the beam unit 152, excluding the two beams located at the ends in the Y-axis direction. there is FIG. 3(a) schematically shows a state in which the beam unit 152 is driven upward by the vertical movement mechanism 255 and positioned above the air floating plate 251, and FIG. ), the state in which the beam unit 152 is driven downward by the vertical movement mechanism 255 is schematically shown. In the state shown in FIG. 3A, a predetermined space is formed between the beam unit 152 and the air floating plate 251 in the vertical direction (Z direction). On the other hand, in the state shown in FIG. 3B, the beam unit 152 is accommodated in the groove 251a of the air floating plate 251, and the upper surface of the beam unit 152 and the upper surface of the air floating plate 251 are included in substantially the same plane. is configured as With such a configuration, there is almost no gap between the upper surface of the beam unit 152 and the upper surface of the air floating plate 251 in the Y direction, and the upper surface of the beam unit 152 and the upper surface of the air floating plate 251 allow the substrate P to move. Almost the entire surface can be supported. Since the air floating plate 251 is fixed to the vertical motion mechanism 255, the air floating plate 251 also moves in the X-axis direction as the vertical motion mechanism 255 moves in the X-axis direction.

Although not shown, the upper surface of the air floating plate 251 is formed with a plurality of minute holes (not shown) for blowing out air. In the air floating plate 251, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) to the rear surface of the substrate P placed on the air floating plate 251 through the holes. By doing so, it is possible to separate the back surface of the substrate P from the upper surface of the air floating plate 251 (float the substrate P).

Returning to FIG. 2, a pair of substrate slide hands 140P are provided on the +Y side and -Y side of the port section 150P. The substrate slide hand 140P has, as shown in FIGS. 2 and 1, a suction pad 142 and a vertical movement mechanism 144 for moving the suction pad 142 up and down. The vertical movement mechanism 144 is movable in the X-axis direction along a rail 146 laid along the X-axis direction. That is, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown). Note that the suction pad 142 of the substrate slide hand 140P is in a state of projecting closer to the beam unit 152 than the rail 146, as shown in FIG. The reason for this is that when the substrate slide hand 140P conveys the substrate P (P2) to the substrate feeder 160P (in the state of FIG. 6B), the substrate P placed on the substrate holder 28 This is to avoid contact between (P1) and the vertical movement mechanism 144 .

As shown in FIGS. 1 and 2, the substrate feeder 160P is provided between the stage device 20P and the port section 150P in the X-axis direction. and a slide plate 264 supported at a predetermined height from F. As will be described later, the height of the support column 262 is defined so that the upper surface of the substrate holder 28 and the lower surface of the slide plate 264 do not contact each other when the stage device 20P moves to the substrate exchange position. A perspective view of the slide plate 264 is shown in FIG. As can be seen from FIGS. 4 and 2, the slide plate 264 has a plate portion 263 having a triangular XZ cross section and a support portion 265 to which the upper ends of the support columns 262 are connected. The size of the upper surface of the plate portion 263 is set to a size capable of supporting substantially the entire surface of the substrate P. As shown in FIG. Most of the upper surface of the plate portion 263 is inclined with respect to the XY plane. Although not shown, the upper surface of the plate portion 263 is formed with a plurality of minute holes (not shown) for blowing out air. In the plate portion 263, pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (air supply) to the back surface of the substrate P placed on the plate portion 263 through the hole. By doing so, it is possible to separate the rear surface of the substrate P from the upper surface of the plate portion 263 (float the substrate P). Notches 263a are formed at the ends of the plate portion 263 on the +X side, the +Y side, and the -Y side. This notch 263a is formed to avoid mechanical interference with the suction pad 142 of the substrate slide hand 140P.

(Conveyor 180P)
Returning to FIG. 1, the transfer device 180P is a device that cooperates with the substrate slide hand 140P during substrate replacement. In other words, in the exposure apparatus 10P, the substrate P is carried into and out of the substrate holder 28 using the substrate slide hand 140P and the transfer device 180P. The transport device 180P is also used for positioning the substrate P when the substrate P is placed on the substrate holder 28. As shown in FIG.

The transport device 180P is provided in the stage device 20P and, as shown in FIGS. 1 and 2, includes a pair of substrate loading bearer devices 182P, a pair of substrate unloading bearer devices 183P, and an offset beam section 185P.

The substrate carry-in bearer device 182P includes a suction pad 284 that sucks and holds the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown), and a drive mechanism 286 that drives the suction pad 284 along the Z-axis direction. , provided. The suction pad 284 is positioned in the most −Z side and is in the notch 28a formed in the substrate holder 28. As shown in FIG.

The substrate unloading bearer device 183P has a suction pad that suctions and holds the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown), and can be driven along the X-axis direction. The substrate unloading bearer device 183P is located in the most −X side, and enters the notch 28b formed in the substrate holder 28. As shown in FIG.

The offset beam section 185P has a plurality of (for example, eight in this embodiment) beam sections arranged at predetermined intervals in the Y-axis direction. The beam portion is arranged so that its upper surface is included in substantially the same plane as the upper surface 28 u of the substrate holder 28 . A plurality of fine holes (not shown) for blowing out air are formed on the upper surface of the beam portion. A pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) between the beam portion and the back surface of the substrate P through the plurality of holes. Thereby, the rear surface of the substrate P can be separated from the upper surface of the beam section (the substrate P can be floated).

The configurations of the board loading bearer device 182P and the board unloading bearer device 183P can be changed as appropriate. For example, each bearer device 182P, 183P is attached to the substrate table 24 in this embodiment, but is not limited to this. (not shown). Also, the positions and numbers of the bearer devices 182P and 183P are not limited to this. For example, it may be attached to the +Y side and -Y side of the substrate table 24 .

In the exposure apparatus 10P configured as described above, the mask loader (not shown) loads the mask M onto the mask stage 14 under the control of the main controller (not shown), and the substrate transfer apparatus 100P. , the substrate P is loaded onto the substrate holder 28 . After that, the main controller performs alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, a plurality of shot areas set on the substrate P are sequentially exposed by the step-and-scan method. Action is performed. Since this exposure operation is similar to the conventional step-and-scan exposure operation, the X direction is set as the scanning direction. A detailed description of the step-and-scan exposure operation will be omitted. Then, the substrate P that has undergone the exposure process is unloaded from the substrate holder 28 by the substrate transport device 100P, and another substrate P to be exposed next is loaded into the substrate holder 28. Substrates P are exchanged, and a series of exposure operations for a plurality of substrates P is performed.

(Substrate replacement operation)
The exchange operation of the substrate P on the substrate holder 28 in the exposure apparatus 10P will be described in detail below with reference to FIGS. 5(a) to 8. FIG. The board replacement operation described below is performed under the control of a main controller (not shown). In the side views of FIGS. 5A to 8 for explaining the substrate exchanging operation, illustrations and symbols of portions not necessary for explanation are appropriately omitted in order to facilitate understanding of the operation of the substrate transfer apparatus 100P. shall be omitted.

Further, as a premise of the explanation of the operation, it is assumed that the substrate P1 is placed in advance on the substrate holder 28 of the stage device 20P. In the substrate exchange operation, an operation of unloading the exposed substrate P1 and an operation of loading (placing) a new substrate P2 (different from the substrate P1) into the substrate holder 28 are executed. . In FIGS. 5A to 8, the operating directions of the constituent elements are schematically indicated by white arrows for easy understanding. In addition, the state of sucking or supplying (supplying) gas is schematically indicated by black arrows.

As shown in FIG. 1, while the substrate P1 is being exposed in the stage device 20P, the main controller moves the external transport device 300 holding the substrate P2 before exposure to the port section 150P (FIG. 3A). (where the beam unit 152 is positioned at the high position shown). Then, the main controller transfers the substrate P2 to the beam unit 152 by driving the external transfer device 300 downward (see FIG. 5A). It is assumed that the external transport device 300 is positioned in the Y-axis direction so that the fingers 300F of the fork-shaped robot hand of the external transport device 300 do not come into contact with the beam unit 152 .

After the board P2 is delivered to the port section 150P, the main controller drives the external transport device 300 in the +X direction (arrow A direction) as shown in FIG. The portion 150P is retracted from the lower side of the beam unit 152 .

Next, the main controller controls the vertical movement mechanism 255 of the port section 150P to drive the beam unit 152 downward (see arrow B1), as shown in FIG. 5(b). As a result, the height positions of the upper surface (+Z surface) of the beam unit 152 and the upper end of the slide plate 264 of the substrate feeder 160P substantially match. Further, the main controller controls the up-and-down movement mechanism 144 of the substrate slide hand 140P to drive the suction pad 142 upward (see arrow B2). Start sucking and holding near both ends of the side. At this stage, since the exposure of the substrate P1 has been completed, the main controller starts driving the stage device 20P in the +X direction (see arrow B3).

Next, as shown in FIG. 6A, the main controller causes the substrate unloading bearer device 183P to adsorb and hold the substrate P1, and drives the substrate unloading bearer device 183P in the +X direction to move the substrate P1 to the substrate holder 28. Offset in the +X direction above (see arrow C1). The offset amount varies depending on the size of the substrate P1, but is, for example, about 50 mm to 100 mm, and is the distance up to the position where the −X side end of the substrate P1 does not overlap the substrate carry-in bearer device 182P. The substrate unloading bearer device 183P moves the +X side of the substrate P1 onto the offset beam portion 185P while sucking and holding the substrate P1. During offsetting, pressurized gas is supplied (supplied) from the upper surface 28u of the substrate holder 28 to the lower surface of the substrate P1. As a result, the substrate P1 floats from the upper surface 28u of the substrate holder 28, and the friction between the lower surface of the substrate P1 and the upper surface 28u of the substrate holder 28 is negligible (low friction state). The main controller also supplies (supplies) the pressurized gas from the upper surface of the beam portion of the offset beam portion 185P. As a result, the movement of the substrate P1 from the upper surface of the substrate holder 28 to the offset beam portion 185P is performed in a low-friction state.

The main controller also drives the substrate slide hand 140P (suction pad 142 and vertical movement mechanism 144) in the -X direction along the rail 146 in FIG. 6(a) (see arrow C2). During this drive, the main controller supplies pressurized gas from the upper surface of the beam unit 152 of the port portion 150P and the upper surface of the slide plate 264 (plate portion 263) of the substrate feeder 160P. As a result, the substrate P2 is lifted and transported on the beam unit 152 and the slide plate 264 in a non-contact state. At this time, the substrate P2 bends slightly along the upper surfaces of the beam unit 152 and the slide plate 264 due to its own weight.

As a result of the movement of the substrate slide hand 140P (suction pad 142 and vertical movement mechanism 144), the suction pad 142 is positioned at the notch 263a of the plate portion 263 of the slide plate 264 as shown in FIG. It has become. On the other hand, the stage device 20P reaches the substrate exchange position at this stage as shown in FIG. 6(b). In the state shown in FIG. 6B, the −X side end of the substrate P2 is located above the suction pad 284 of the substrate carry-in bearer device 182P. At this stage, the main controller may adjust (align) the position of the substrate P2 with respect to the substrate holder 28 by adjusting the position of the suction pad 142 of the substrate slide hand 140P.

Next, the main controller, as shown in FIG. 6B, drives the suction pad 284 of the substrate carry-in bearer device 182P upward (see arrow D1). Further, the main controller starts sucking and holding the substrate P2 by the suction pad 284 . Furthermore, the main controller cancels the adsorption and holding of the substrate P2 by the adsorption pads 142 of the substrate slide hand 140P, and drives the adsorption pads 142 in the -Z direction, +X direction, -Z direction, and -X direction in order ( (see arrow D2), the suction pad 142 is positioned on the lower surface side of the +X side end of the substrate P1. The reason why the suction pad 142 is driven as indicated by the arrow D2 is to avoid contact between the suction pad 142 and the substrate P1. At the stage where the suction pad 142 is positioned at the position shown in FIG. Further, the main controller controls the vertical movement mechanism 255 to move the beam unit 152 so that the upper surface of the beam unit 152 substantially coincides with the upper surface of the offset beam portion 185P (as shown in FIG. 3(b)). It is driven downward (see arrow D3). At this time, the top surface of the beam unit 152 substantially coincides with the top surface of the air floating plate 251 .

Next, the main controller moves the stage device 20P in the -X direction (see arrow E1), as shown in FIG. 7(a). In addition, the main controller moves the port section 150P in the -X direction (see arrow E2) in synchronization with the movement of the stage device 20P. Thereby, the positional relationship between the stage device 20P and the port section 150P is maintained. Furthermore, the main controller moves the substrate slide hand 140P in the +X direction while the stage device 20P and the port section 150P are driven in the -X direction (see arrow E3).

As a result, the substrate holder 28 relatively moves away from the substrate feeder 160P. In this case, as the substrate holder 28 moves away from the slide plate 264, the area of the substrate P2 held by the slide plate 264 decreases and the area of the substrate P2 supported by the substrate holder 28 increases. . The substrate holder 28 can hold the substrates P2 in order from the −X side end of the substrate P2 toward the +X side end. As a result, the air between the substrate holder 28 and the substrate P2 can be discharged from the -X side toward the +X side. It is possible to solve problems caused by air pockets such as failure to correct the flatness of the substrate P on the holder 28 .

Further, as the stage device 20P, the port section 150P, and the substrate slide hand 140P move, the substrate P1 slides on the substrate holder 28 and the offset beam section 185P, and the substrate P1 moves from the substrate holder 28 to the beam unit 152 and the air levitation. It is designed to be transferred onto the plate 251 . During this transfer, the substrate P1 is slid from a plane (upper surface of the substrate holder 28) to a plane (a plane formed by the beam unit 152 and the air floating plate 251). As a result, the substrate P1 can be moved onto the beam unit 152 and the air floating plate 251 in the same state as when it was supported on the upper surface of the substrate holder 28 . Therefore, deformation of the substrate P1 during transportation is suppressed compared to the case where the destination of the substrate P1 is not the beam unit 152 and the air floating plate 251 but only the beam unit 152 (i.e., discrete support in the Y direction). can do. Furthermore, since the substrate P1 is less likely to be deformed during transportation, the substrate slide hand 140P can be moved at high speed, and the substrate exchanging operation can be speeded up. When the substrate P1 is transferred onto the beam unit 152 and the air floating plate 251, the pressurized gas is supplied (supplied) from the upper surface of the beam unit 152 and the air floating plate 251 to the lower surface of the substrate P1. there is

Next, as shown in FIG. 7B, the main controller moves the port section 150P and the substrate slide hand 140P at the same speed in the +X direction (see arrows F1 and F2). Then, the main controller releases the suction and holding of the substrate P1 by the suction pads 142 when the substrate slide hand 140P reaches the position (substrate transfer position) shown in FIG. Note that the main controller may perform alignment (position adjustment) of the substrate P1 by finely driving the suction pad 142 before releasing the suction holding of the suction pad 142 . Further, the main controller may slightly lower the suction pad 142 after releasing the suction holding of the suction pad 142 .

Next, the main controller lowers the suction pad 284 of the substrate carry-in bearer device 182P (see arrow F3). Further, the main controller starts holding the substrate P<b>2 by suction with the substrate holder 28 . When the substrate carry-in bearer device 182P can be finely driven in the X-axis direction, the substrate carry-in bearer device 182P is driven before the substrate holder 28 sucks and holds the substrate P2 to perform alignment (substrate holder of the substrate P2). 28) may be performed.

Further, the main controller moves the stage device 20P holding the substrate P2 by suction to a predetermined exposure start position, and starts exposure of the substrate P2. A description of the exposure operation for the substrate P2 is omitted.

Next, as shown in FIG. 8, the main controller controls the vertical movement mechanism 255 of the port section 150P to drive the beam unit 152 upward, and moves the substrate P1, which is released from suction and holding by the suction pads 142, to the port section. 150P (see arrow G1). Then, the main controller drives the external transport device 300 (see arrow G2) to pick up the substrate P1 from the port portion 150P, and drives the external transport device 300 holding the substrate P1 in the +X direction. , the substrate P1 is unloaded to an external device such as a coater/developer. After the exposed substrate P1 is delivered to the external device, the main controller uses the external transfer device 300 to load the substrate P3 to be exposed next to the substrate P2 into the port section 150P (FIG. 5). (a)).

By the operation described above, the substrate on the substrate holder 28 is exchanged.

As described above in detail, according to this embodiment, the substrate feeder 160P for loading the substrate P2 from above the upper surface 28u of the substrate holder 28 and the port having the upper surface flush with the upper surface 28u of the substrate holder 28 are provided. The substrate slide hand 140P air-floats the substrate P1 on the upper surface of the substrate holder 28 with the port portion 150P and the substrate holder 28 in close proximity to each other. The board 251 and the beam unit 152 are moved in a direction parallel to the upper surfaces to transfer the substrate P1 to the port section 150P. Thus, in the present embodiment, when the exposed substrate P1 is unloaded from the substrate holder 28, it can be slid from surface to surface, so that the substrate can be reliably and quickly unloaded. By doing so, it is possible to quickly replace the substrate in the substrate holder 28 .

Further, in the present embodiment, the beam unit 152 is lifted from a state in which the substrate P1 is supported on the air floating plate 251 and the beam unit 152 of the port portion 150P, thereby moving the substrate P2 above the upper surface of the air floating plate 251. can be positioned at This makes it possible to easily carry out the substrate P1 out of the exposure apparatus 10P by the external transport device 300. FIG.

Further, in this embodiment, the port portion 150P has a rod-shaped beam unit 152 extending in the X-axis direction. As a result, the substrate P2 can be slid onto the substrate feeder 160P from the state in which the substrate P2 is floated on the beam unit 152. FIG. Therefore, since the air floating plate 251 does not need to be raised to the same height as the beam unit 152 in order to transport the substrate P2, the drive mechanism for the air floating plate 251 can be omitted.

Further, in this embodiment, a groove 251a for accommodating the beam unit 152 is formed in the air floating plate 251 at the port portion 150P. As a result, when the beam unit 152 is accommodated in the air floating plate 251, the upper surface of the air floating plate 251 and the upper surface of the beam unit 152 can be combined to form a wide surface. 28 to the port part 150P, since the entire surface of the substrate P1 is supported by a wide surface including the upper surface of the air floating plate 251 and the upper surface of the beam unit 152, deformation of the substrate P1 is suppressed as much as possible. can do.

Further, in this embodiment, the main controller drives the stage device 20P so that the substrate feeder 160P (slide plate 264) is retracted along the X-axis direction from between the substrate P2 and the substrate holder 28, By moving the substrate slide hand 140P in the X-axis direction with respect to the substrate holder 28 while holding the substrate P1, the substrate P2 is loaded onto the substrate holder 28 and the substrate P1 is unloaded from the substrate holder 28. Accordingly, in the present embodiment, the substrate P2 is slidably transported with respect to the substrate holder 28, thereby suppressing the occurrence of impact during transportation. Further, in the present embodiment, since the substrate feeder 160P is fixed to the floor F, a movable portion for driving the substrate feeder 160P is not required, which simplifies the structure and reduces dust generation. can do. Further, in this embodiment, the structure of the entire substrate transfer apparatus 100P is simple, so the cost can be reduced.

Further, in the present embodiment, the main controller drives the substrate holder 28 in a direction away from the substrate feeder 160P while part of the substrate P2 is held by the substrate carry-in bearer device 182P, thereby causing the substrate P2 to become a substrate. Transfer onto holder 28 . As a result, in the present embodiment, the substrate feeder 160P can be fixed to the floor F, which eliminates the need for a movable portion for driving the substrate feeder 160P. can be reduced. Further, in this embodiment, the structure of the entire substrate transfer apparatus 100P is simple, so the cost can be reduced. Further, in this embodiment, since the upper surface of the substrate feeder 160P (slide plate 264) is inclined with respect to the upper surface of the substrate holder 28, the substrate P2 is slid and conveyed onto the substrate holder 28 by performing the above-described operation. can do. As a result, it is possible to suppress the impact during substrate transfer and reduce the generation of dust.

Further, in this embodiment, it is also possible to transfer the substrate carried out from the substrate holder 28 to the port portion 150P to the substrate feeder 160P without using the external transfer device 300. FIG. As a result, the operation of the substrate transfer device 100P can be checked without using the external transfer device 300 during device testing, maintenance, or when trouble occurs.

In this embodiment, when the substrate P2 is transported from the beam unit 152 to the substrate feeder 160P, the transport speed may be lower than when the substrate is unloaded from the substrate holder . By doing so, even if the substrate P2 is supported and transported only by the beam unit 152, contact between the substrate P2 and the beam unit 152 can be suppressed. Since the timing of transporting the substrate from the beam unit 152 to the substrate feeder 160P can be set while the substrate on the substrate holder 28 is being exposed, the transport speed of the substrate can be reduced as described above. there is no impact on throughput.

Although the position of the substrate feeder 160P is fixed in this embodiment, the present invention is not limited to this. That is, substrate feeder 160P may be movable in the X-axis direction. As a result, the substrate feeder 160P can be moved in accordance with the movement of the stage device 20P and the like, so that the throughput of substrate exchange can be improved.

Note that the notch 28b may not be formed in the substrate holder 28. FIG. As described above, when the lengths of the long and short sides of the upper surface 28u of the substrate holder 28 are set slightly shorter than the lengths of the long and short sides of the substrate P, the If the protruding substrate P can be moved in the +X-axis direction while being held by the substrate unloading bearer device 183P, and the substrate P can be offset from the upper surface 28u of the substrate holder 28 toward the +X side, the notch 28b can be moved to the substrate holder. It does not have to be formed on 28. In this case, even the edge of the substrate P can be flattened.

(First modification)
The first modified example will be described below with reference to FIGS. 9 to 14(b).

FIG. 9 schematically shows a side view of a stage device 20Q and a substrate transfer device 100Q included in an exposure apparatus 10Q according to a first modified example. 10 is a plan view of a stage device 20Q and a substrate transfer device 100Q included in the exposure apparatus 10Q of FIG. 9. FIG.

As shown in FIGS. 9 and 10, in Modification 1, a stage device 20Q is employed instead of the stage device 20P of the first embodiment. Further, in the substrate transfer apparatus 100Q of the first modified example, the port section 150Q is used instead of the port section 150P of the substrate transfer apparatus 100P of the first embodiment, and the substrate feeder 160Q is used instead of the substrate feeder 160P. is employed.

The stage device 20Q has a substrate holder 28Q, as shown in FIG. Unlike the substrate holder 28, the notch 28a on the -X side is not formed in the substrate holder 28Q. Further, the pair of substrate carrying-in bearer devices 182P are movable in the X-axis direction as a whole (see arrow V in FIG. 9), but the suction pad 284 is assumed not to move in the Z-axis direction. do.

The port portion 150Q has a plurality of pins 354, a plate-shaped base portion 353 that holds the lower ends of the pins 354 at the same height, and a vertical movement mechanism 355 that drives the base portion 353 in the Z-axis direction. Further, the port portion 150Q has a plate-like air floating plate 351 supported at a predetermined height position by a support 352 provided on the floor F. As shown in FIG. The height position of the upper surface of the air floating plate 351 substantially matches the height position of the upper surface of the substrate holder 28 . As shown in FIGS. 9 and 10, the air floating plate 351 is formed with a plurality of circular openings 351a. The position of the circular opening 351a in the XY plane corresponds to the position of the pin 354 in the XY plane, and the pin 354 is inserted through the corresponding circular opening 351a.

When the vertical movement mechanism 355 raises the base portion 353, the pin 354 projects from the air floating plate 351, and when the base portion 353 is lowered, the pin 354 does not project from the air floating plate 351 as shown in FIG.

As shown in FIG. 10, the substrate feeder 160Q includes a slide plate 364, a pair of support arms 365 that support the slide plate 364, a pair of movable bodies 366 to which the pair of support arms 365 are respectively connected, and an X-axis direction. and a pair of rails 367 extending to the .

The slide plate 364 is a plate member having a right triangle shape when viewed from the Y-axis direction and a rectangular shape when viewed from the Z-axis direction. The size of the upper surface of the slide plate 364 is set so that substantially the entire surface of the substrate P can be supported. When the vertical movement mechanism 355 raises the base portion 353 and the pins 354 while the slide plate 364 is positioned as shown in FIGS. 9 and 10, the pins 354 are inserted into the through holes 364a.

A substrate transfer hand 370 is provided for each of the pair of support arms 365 . The substrate transfer hand 370 is an articulated robot or parallel link robot having a suction pad at its tip.

The slide plate 364 is driven in the X-axis direction by moving the movable body 366 along the rails 367 . The movable body 366 can also drive the support arm 365 in the Z-axis direction. Therefore, the height position of the slide plate 364 is adjusted by the movable body 366 . Since the board transfer hand 370 is also provided on the support arm 365 that supports the slide plate 364, it is driven along with the slide plate 364 in the X-axis direction and the Z-axis direction.

(Substrate replacement operation)
Hereinafter, the operation of exchanging the substrate on the substrate holder 28Q in the first modified example will be described in detail with reference to FIGS. 11(a) to 14(b) and other drawings.

FIG. 11(a) shows a state in which the substrate P1 on the substrate holder 28Q has been exposed, and the port section 150Q and the substrate feeder 160Q are ready to receive the substrate before exposure. In this state, the main controller drives the movable body 366 of the substrate feeder 160Q to position the slide plate 364 above the port portion 150Q, and drives the vertical movement mechanism 355 of the port portion 150Q to move the base portion. It is realized by raising 353 and pin 354 . In this state, the pin 354 passes through the circular opening 351 a of the air floating plate 351 and passes through the through hole 364 a of the slide plate 364 .

Next, the main controller drives the external transport device 300 holding the substrate P2 before exposure in the -X direction (see arrow H1) to position the substrate P2 above the slide plate 364. FIG. Then, the main controller lowers the external transport device 300 to transfer the substrate P2 to the pins 354, and thereafter drives the external transport device 300 in the +X direction as shown in FIG. It is withdrawn from the device 10Q (see arrow H2).

Next, the main controller drives the movable body 366 of the substrate feeder 160Q to raise the slide plate 364 (see arrow J1) as shown in FIG. 12(a). In addition, the main controller starts lowering the pin 354 by driving the vertical movement mechanism 355 in accordance with the upward movement of the slide plate 364 (see arrow J2). As a result, the substrate P2 is gradually transferred onto the upper surface of the slide plate 364. As shown in FIG. Further, the main controller drives the substrate transport hand 370 (see arrow J3) to hold the vicinity of the +X side end of the back surface of the substrate P2 by suction, thereby preventing the substrate P2 from falling from the upper surface of the slide plate 364. .

As shown in FIG. 12(b), when the substrate P2 is transferred onto the slide plate 364, the upper end of the pin 354 does not protrude from the upper surface of the air floating plate 351 and enters the circular opening 351a. Become. On the other hand, in the stage device 20Q, since the exposure of the substrate P1 is completed, the main controller moves the stage device 20Q in the +X direction and positions it at the substrate exchange position (see arrow J4).

Next, the main controller drives the movable body 366 to move the slide plate 364 holding the substrate P2 before exposure in the -X direction as shown in FIG. (see arrow K1). When the slide plate 364 is moved, the main controller drives the substrate unloading bearer device 183P to offset the substrate P1 on the substrate holder 28Q in the +X direction (see arrow K2). Further, the main controller moves the substrate carry-in bearer device 182P in the +X direction and positions the suction pad 284 above the substrate holder 28Q (see arrow K3).

Next, as shown in FIG. 13B, the main controller drives the movable body 366 to lower the slide plate 364 and bring the −X side end of the substrate P2 into contact with the suction pad 284 (arrow See L1). At this timing, the main controller starts sucking and holding substrate P2 with suction pad 284 . Further, the main controller drives the substrate transfer hand 370 to start sucking and holding the back surface of the substrate P1 with the suction pad at the tip.

Next, the main controller drives the movable body 366 to move the slide plate 364 in the +X direction (see arrow L2), as shown in FIG. 14(a). As a result, the slide plate 364 is retracted from between the substrate P2 and the substrate holder 28Q, and along with this retraction, the area of the substrate P2 held by the slide plate 364 is reduced and the area of the substrate P2 supported by the substrate holder 28Q is increased. It is designed to Also, as the slide plate 364 moves, the substrate P1 held by the substrate transfer hand 370 slides on the substrate holder 28Q and the offset beam portion 185P and is transferred onto the air floating plate 351 . During this transfer, the substrate P1 slides from one surface (upper surface of the substrate holder 28Q) to another surface (upper surface of the air floating plate 351). When the substrate P1 is transferred onto the air floating plate 351, pressurized gas is supplied (air supply) from the upper surface of the air floating plate 351 to the lower surface of the substrate P1. As a result, the substrate P1 is transferred onto the air floating plate 351 in a non-contact manner.

In this way, it is possible to replace the substrate on the substrate holder 28Q also in the first modified example. After that, when the substrate P1 is entirely positioned on the air levitation plate 351, the main controller releases the substrate P1 from suction and holding by the substrate transport hand 370 and raises the slide plate 364, as shown in FIG. 14(b). (see arrow M1). Further, the main controller drives the vertical movement mechanism 355 to raise the pins 354, thereby raising the substrate P1 (see arrow M2). Further, the main controller moves the external transport device 300 in the -X direction (see arrow M3) to get under the substrate P1 and raise the external transport device 300 to pick up the substrate P1. After that, the substrate P1 is carried out of the exposure apparatus 10Q by driving the external transport device 300 in the +X direction. On the other hand, on the stage device 20Q side, the main controller drives the substrate carry-in bearer device 182P in the -X direction to withdraw the suction pad 284 from between the substrate P2 and the substrate holder 28Q (see arrow M4). After that, returning to FIG. 11A, the same processing as above is repeatedly executed.

As described above, according to the first modified example, it is possible to obtain the same effects as those of the above-described embodiment. Further, according to the first modified example, the substrates carried in from the external transport device 300 are received (the substrates are transported from the external transport device 300 to the slide plate 364) and the substrates carried out by the external transport device 300 are delivered (air By using a plurality of common pins 354 for transporting the substrate from the floating plate 351 to the external transport device 300, there is no need to prepare individual pins for each operation, and the number of parts can be reduced. Further, since the area of the through holes 364a is smaller than that of the grooves 251a provided in the air floating plate 251 shown in the first embodiment, the air floating plate 351 can support the substrate P with a larger area. By using the air floating plate 251 when carrying out the exposed substrate from the substrate holder 28Q, it is possible to suppress the substrate from being damaged or generating dust. Further, when the exposed substrate is unloaded from the substrate holder 28Q, it is easy to transport the substrate while floating in the air, so the substrate can be transported at high speed. In addition, since the substrate is transferred on the air floating plate 351 in a non-contact manner, an expensive porous air bearing member (for example, a carbon member or a ceramic member) can be used as the air floating plate 351, or a high-grade material can be used for the air floating plate 351. Costs can also be reduced because there is no need to apply special surface lapping or the like.

In addition, in the first modified example, the case where the stage device 20Q is used as the stage device has been described, but the present invention is not limited to this, and a stage device 20P similar to that of the above embodiment may be used. Conversely, in the above embodiment, it is also possible to use the stage device 20Q of the first modified example.

Also in the first modification, the port portion 150Q may be movable in the X-axis direction as in the above-described embodiment. Accordingly, by moving the port part 150Q together with the stage device 20Q and the substrate feeder 160Q when exchanging the substrate, it is possible to perform the substrate exchanging operation in a shorter time.

(Second modification)
A second modification will be described below with reference to FIG. 15 .

In the second modified example, a slide plate 364' shown in FIG. 15 is used instead of the slide plate 364 of the first modified example. A slide plate 364' in FIG. 15 has a substantially right triangular plate portion 3641A and a plate-like arm portion 3641B when viewed from the Y-axis direction. A groove portion 3642 is formed along the Y-axis direction in the vicinity of the +X side end portion of the upper surface of the plate portion 3641A, and the arm portion 3641B is fitted in the groove portion 3642 . A through-hole 364a' is formed through the slide plate 364' along the Y-axis direction in the same manner as the slide plate 364 of the first modification. A through hole 364a' is also formed at a location where the arm portion 3641B exists.

A substrate transfer hand 370 is provided on the lower surface (-Z surface) of the arm portion 3641B, as in the first modification.

According to the second modification, the slide plate 364' is easy to manufacture and has increased rigidity, so that it is possible to suppress the bending of the substrate to be held. In addition, since the position of the arm portion 3641B in the Y-axis direction overlaps the position of the plate portion 3641A in the Y-axis direction, the size of the slide plate 364' in the Y-axis direction can be reduced.

(Third modification)
The third modification will be described below with reference to FIGS. 16(a) and 16(b). 16(a) and 16(b) schematically show side views of part of an exposure apparatus 10R according to the third modification.

In the third modification, as shown in FIG. 16A, a port portion 150Q' is used as the port portion that moves along the rail 257 in the X-axis direction. This port portion 150Q' is characterized in that it has the pin 354 described in the first modified example. In addition, the air floating plate 351 can move up and down independently of the pin 354 in the port portion 150Q'.

In the third modification, as shown in FIG. 16(a), with the air floating plate 351 positioned at the bottom end of the movement range and the pin 354 positioned at the top end of the movement range, the main controller: By driving the external transport device 300 , the substrate P 2 before exposure is loaded onto the upper end of the pins 354 . Then, the main controller moves the external transport device 300, which has finished carrying in the substrate P2, in the +X direction and retracts it outside the exposure device 10R (arrow N1).

Next, as shown in FIG. 16(b), the main controller drives the vertical movement mechanism 355 to raise the air floating plate 351 (see arrow N2). At this time, the height of the upper surface of the air floating plate 351 substantially matches the height of the upper end of the slide plate 264 of the substrate feeder 160P. Further, the main controller transfers the substrate P2 to the upper surface of the air floating plate 351 by driving the pin 354 slightly downward (see arrow N3). Further, the main controller drives the vertical movement mechanism 144 of the substrate slide hand 140P to raise the suction pad 142 and cause the suction pad 142 to suck and hold the lower surface of the substrate P2. Since this state is almost the same as that of the above embodiment shown in FIG. The substrate P1 on the substrate holder 28 is slid onto the upper surface of the air floating plate 351 using the substrate slide hand 140P, and the substrate P2 is received by the substrate holder 28 from the slide plate 264. By handing over, the substrate exchange on the substrate holder 28 is executed.

As described above, according to the third modified example, it is possible to obtain the same effects as those of the above embodiment.

(Fourth modification)
The fourth modified example will be described below with reference to FIGS. 17(a) to 21(b).

FIG. 17A schematically shows a plan view of a substrate transfer device 100S included in an exposure device 10S according to the fourth modification. Also, FIG. 17B schematically shows a side view of the substrate transfer device 100S.

The substrate transfer apparatus 100S of the fourth modification is characterized in that it employs a substrate feeder 160S instead of the substrate feeder 160P of the above embodiment. Further, the present invention is characterized in that there is only one substrate slide hand 140P, and that the substrate slide hand 140P is provided in the port portion 150P and moves integrally with the port portion 150P in the X-axis direction.

17(a) and 17(b), the substrate feeder 160S has a slide plate 464 and is supported at a predetermined height above the floor F by two support columns 262. there is The +X side of the slide plate 464 is a comb tooth portion 464a. The upper surface of the comb tooth portion 464a is parallel to the XY plane, and the upper surface other than the comb tooth portion 464a is inclined with respect to the XY plane. The comb tooth portion 464a located on the most -Y side is set shorter in the X-axis direction than the other comb tooth portions. This is to avoid mechanical interference with the suction pads 142 of the substrate slide hand 140P.

The port section 150P has a configuration similar to that of the above embodiment. A substrate slide hand 140P also has the same configuration as that of the above embodiment. However, the rail 146 of the substrate slide hand 140P is fixed to the vertical movement mechanism 255 of the port section 150P via the mounting member 147. As shown in FIG. As a result, when the port portion 150P moves along the rail 257 in the X-axis direction, the substrate slide hand 140P also moves in the X-axis direction.

In FIG. 18, the upper surface of each beam of the beam unit 152 of the port section 150P and the upper end of the slide plate 464 of the substrate feeder 160S are almost at the same height, and each beam and the slide plate 464 are closest to each other. state is shown. In the state of FIG. 18, the −X side end of each beam of the beam unit 152 enters the gap between the comb tooth portions 464a of the slide plate 464. In the state shown in FIG.

Next, based on FIGS. 19(a) to 21(b), the substrate exchanging operation in the fourth modified example will be described.

FIG. 19A shows a state in which the beam unit 152 of the port section 150P has received the substrate P2 before exposure from the external transport device 300. FIG. The main controller moves the port portion 150P along the rail 257 in the -X direction from the state of FIG. 19(a) (see arrow Q1). Then, as shown in FIG. 19B, the main controller drives the vertical movement mechanism 255 to lower the beam unit 152 supporting the substrate P2 (see arrow Q2). Further, as shown in FIG. 19(c), the main controller drives the vertical movement mechanism 144 to raise the suction pad 142 (see arrow Q3), and the +X side and -Y side of the lower surface of the substrate P2. The vicinity of the end (corner) is held by suction. In the state shown in FIG. 19(c), the upper surface of the comb tooth portion 464a of the slide plate 464 and the upper surface of each beam of the beam unit 152 are substantially at the same height. FIG. 18 shows a state in which the slide plate 464 and the beam unit 152 in FIG. 19(c) are viewed from the +Z side. In the state shown in FIG. 18, it is possible to prevent the gap extending in the X-axis direction from being generated between the beam unit 152 and the slide plate 464 .

Next, the main controller drives the vertical movement mechanism 144 of the board slide hand 140P along the rail 146 in the -X direction (see arrow R1), as shown in FIG. 20(a). As a result, the substrate P2 is slid and transported from the beam unit 152 onto the slide plate 464 . During this slide transfer, pressurized gas is supplied (supplied) from the upper surface of the slide plate 464 and the upper surfaces of the beams of the beam unit 152, so that the substrate P2 is transported between the slide plate 464 and the beams. It is levitated and conveyed in a non-contact state with respect to the upper surface. Further, as described above, since there is no gap extending in the X-axis direction between each beam and the slide plate 464, even if the substrate is slid and conveyed from the beam unit 152 onto the slide plate 464, the -X side of the substrate The edge does not fall into the gap, and damage to the substrate due to contact between the substrate and the slide plate 464 can be prevented.

At this stage, when the exposure of the substrate P1 in the stage device 20P is completed, the main controller drives the stage device 20P to the substrate exchange position below the slide plate 464 as shown in FIG. 20(b). Move 20P (see arrow R2). Further, the main controller offsets the substrate P1 on the substrate holder 28 in the +X direction, and raises the suction pad 284 of the substrate carry-in bearer device 182P (see arrow R3). As a result, when the substrate P2 and the suction pad 284 come into contact with each other, the main controller starts holding the substrate P2 with the suction pad 284 by suction.

Further, the main controller drives the substrate slide hand 140P to suck and hold the vicinity of the +X side and -Y side end (corner) of the lower surface of the substrate P1.

Note that the main controller moves the port portion 150P in the +X direction along the rail 257 so as not to interfere with the movement of the stage device 20P (see arrow R4). Further, the main controller drives the vertical movement mechanism 255 to lower the beam unit 152 (see arrow R5) so that the top surface of the beam unit 152 and the top surface of the air floating plate 251 are substantially aligned.

Next, the main controller moves the stage device 20P in the -X direction (see arrow R6), as shown in FIG. 20(c). In addition, the main controller moves the port section 150P in the -X direction (see arrow R7) in synchronization with the movement of the stage device 20P. Thereby, the positional relationship between the stage device 20P and the port section 150P is maintained. Furthermore, the main controller moves the substrate slide hand 140P (vertical movement mechanism 144) in the +X direction while the stage device 20P and the port section 150P are driven in the -X direction (see arrow R8).

As a result, the slide plate 464 of the substrate feeder 160S is retracted from between the substrate P2 and the substrate holder . In this case, as the slide plate 464 retreats, the area of the substrate P2 held by the slide plate 464 decreases and the area of the substrate P2 supported by the substrate holder 28 increases. The main controller lowers the suction pad 284 of the substrate carry-in bearer device 182P in accordance with the operation of FIG. 20(c).

Further, the substrate P1 is slid and transported from the substrate holder 28 onto the beam unit 152 and the air floating plate 251 as the stage device 20P, the port section 150P, and the substrate slide hand 140P move. When the substrate P1 is transferred onto the beam unit 152 and the air floating plate 251, the pressurized gas is supplied (supplied) from the upper surface of the beam unit 152 and the air floating plate 251 to the lower surface of the substrate P1. there is

Next, the main controller moves the port section 150P in the +X direction (see arrow S1), as shown in FIG. 21(a). Then, when the state of FIG. 21( a ) is reached, the main controller releases the suction holding of the substrate P<b>1 by the suction pads 142 .

Next, as shown in FIG. 21(b), the main controller controls the vertical movement mechanism 255 of the port section 150P to drive the beam unit 152 upward (see arrow S2). Then, the main controller drives the external transport device 300 (see arrow S3) to pick up the substrate P1 from the beam unit 152, and drives the external transport device 300 holding the substrate P1 in the +X direction. , the substrate P1 is unloaded to an external device such as a coater/developer.

By the operation described above, the substrate on the substrate holder 28 is exchanged.

As described above, according to the fourth modified example, it is possible to obtain the same effects as those of the above-described embodiment. Further, according to the fourth modification, the +X side of the slide plate 464 is the comb tooth portion 464a so that each beam of the beam unit 152 can enter the gap between the comb tooth portions 464a. A gap extending in the X-axis direction can be prevented from being generated between the slide plate 464 and the slide plate 464 . As a result, even if the substrate is slid and transported from the beam unit 152 onto the slide plate 464, the -X side edge of the substrate does not fall into the gap, so that the substrate and the slide plate 464 do not fall. Damage to the substrate due to contact can be prevented.

In addition, in the fourth modification, only one substrate slide hand 140P is provided, so the number of parts is reduced and the cost can be reduced. However, without being limited to this, in the fourth modified example, a pair of substrate slide hands 140P may be provided as in the above-described embodiment. Further, in the above-described embodiment and other modified examples, only one substrate slide hand may be provided as in the fourth modified example.

Further, in the fourth modified example, since the rails 146 of the substrate slide hand 140P are provided in the port portion 150P, the stroke of the rails 146 in the X-axis direction can be shortened.

In addition, in the fourth modified example, the case where the position of the slide plate 464 of the substrate feeder 160S is fixed has been described.

(Fifth modification)
The fifth modification will be described below with reference to FIGS. 22(a) and 22(b). As shown in FIG. 22(a), the fifth modification is characterized in that it includes a rotation mechanism 266 that rotates the slide plate 264 of the substrate feeder 160P of the above embodiment around the Y axis. . It should be noted that the slide plate 264 of the fifth modification is assumed to be a plate-like member having a right-angled triangular shape when viewed from the Y-axis direction.

In the fifth modification, when the substrate P2 is slidably transported from the beam unit 152 to the slide plate 264, the main controller rotates the rotation mechanism 266 so that the upper surface of the slide plate 264 is parallel to the XY plane. do. Then, from this state, as shown in FIG. 22B, the main controller moves the substrate slide hand 140P holding the lower surface of the substrate P2 in the +X direction, thereby moving the substrate P2 from the beam unit 152 to the slide plate. 264 to slide the substrate P2. By doing so, it is possible to transfer the substrate P2 onto the slide plate 264 without deforming the substrate P2. After the slide plate 264 receives the substrate P2, the main controller rotates the rotating mechanism 266 to return to the state shown in FIG. 22(a). Thereafter, operations similar to those of the above embodiment (FIGS. 6B to 8) are executed.

As described above, according to the fifth modified example, it is possible to suppress deformation of the substrate P2 when the substrate P2 is slidably transported from the beam unit 152 to the slide plate 264 .

It should be noted that the rotating mechanism 266 according to the fifth modified example can be applied not only to the above embodiment, but also to the third and fourth modified examples.

(Sixth modification)
Next, a sixth modified example will be described with reference to FIG. The sixth modification is characterized in that a cover 199 is provided on the slide plate 264 of the substrate feeder 160P of the above embodiment.

The cover 199 has an inverted U-shaped YZ cross section, and a substrate can be slid in between the cover 199 and the slide plate 264 from the +X side, and can be slid out from the -X side. It is possible. Although FIG. 23 illustrates the case where the cover 199 is transparent, the cover 199 may not be transparent.

In the sixth modification, by providing the cover 199, it is possible to prevent dust from adhering to the substrate P and to keep the temperature of the substrate P constant.

Note that the cover 199 can be appropriately provided on a slide plate other than the above embodiment. In particular, in the case of a substrate feeder fixed on the floor F, since the substrate feeder does not move, even if the cover 199 increases the weight, no particular problem occurs.

(Seventh modification)
Next, a seventh modification will be described with reference to FIGS. 24(a) and 24(b). As shown in FIG. 24(a), the seventh modification is characterized in that the upper surface of the slide plate 264 of the substrate feeder 160P of the above embodiment is curved. By curving the upper surface (substrate supporting surface) of the slide plate 264 in this manner, the section modulus of the substrate can be increased. That is, it is possible to obtain the same effect as when the thickness of the substrate is several to several hundred times greater than the actual thickness with respect to the deflection of the substrate.

By doing so, even if the substrate P is placed on the substrate feeder 160P with the edge on the -X side sticking out as shown in FIG. It is possible to suppress the occurrence of bending (sagging). Further, since the occurrence of bending (sagging) of the substrate P is suppressed, when the substrate P is brought into contact with the substrate holder 28, the substrate P can be brought into contact with the center portion of the side on the -X side in the Y-axis direction. Therefore, wrinkles are less likely to occur at the edge of the substrate P on the -X side.

(Other modifications)
In the above embodiment and its modification, the stage device 20P includes CCD cameras 31x and 31y (image processing edge detector) for detecting the edge of the substrate P, as shown in FIGS. 25(a) and 25(b). detection). The CCD camera 31x is arranged so as to observe two sides on the -X side of the substrate P before it is placed on the substrate holder . The CCD camera 31y is arranged so that one point on the −Y side (or +Y side) of the substrate P can be observed from below. Thereby, the X position, Y position, and θz position of the substrate P with respect to the stage device 20P can be known. These pieces of information are used for stage control as correction of the position of the substrate P before mounting and positional information of the substrate P after mounting.

Further, in the first and second embodiments and modifications thereof, the stage device 20M shown in FIGS. 26(a) to 26(c) may be used.

In the stage device 20M, as shown in FIG. 26A, two substrate carry-in bearer devices 182M are provided at the -X side end of the substrate holder 28M. As shown in FIG. 26(b), the substrate carry-in bearer device 182M is in a state where it is partly accommodated in the notch 28a formed at the end of the substrate holder 28M on the -X side. is set to be substantially the same height as the upper surface of the substrate holder 28M. Therefore, even after the substrate P is placed, the suction pad 284 does not need to be retracted from the substrate holder 28M.

Further, as shown in FIG. 26(c), the substrate carry-in bearer device 182M can be tilted so that the rear surface of the substrate P which is carried in obliquely can be reliably sucked and fixed. In addition, the substrate carry-in bearer device 182M can move in the horizontal direction (X-axis direction or X-axis and Y-axis direction) so that relative position adjustment (alignment) of the substrate P can be performed.

According to the stage device 20M, the suction pad 284 can be tilted, so that the back surface of the substrate P can be reliably fixed by suction.

Further, in the above embodiment and its modification, a stage device 20N shown in FIGS. 27(a) and 27(b) may be used.

The stage device 20N does not have the independently driven substrate loading bearer device described in the above embodiment. In the stage device 20N, the loaded substrate is placed at one or a plurality of locations near the -X side end surface of the substrate holder so that a part of the upper surface of the substrate holder 28N also functions as a suction pad 284 that suction-holds the leading end of the loaded substrate. A suction area (bearer area) 187 is provided for suction-holding the tip of the carrier.

Since the stage device 20N does not have an independently driven substrate loading bearer device, the relative position of the loaded substrate cannot be adjusted by the substrate loading bearer device. A pair of substrate carry-out hands may be used to perform relative position adjustment with respect to the substrate on the substrate carry-in hand. Further, when it is desired to adjust the relative position of the substrate after placing the substrate on the substrate holder 28N, the relative position of the substrate may be adjusted using the substrate unloading bearer device 183P.

If the stage device does not have an independently driven substrate loading bearer device, for example, the substrate feeder 160P (slide plate 264) is connected to the substrate P and the substrate holder 28N as shown in FIGS. The substrate P is placed on the substrate holder 28N while being retracted from the space between the substrate holders 28N. P can be imported.

In addition, in the above-described embodiment and modified example, the projection optical system 16 is a unity magnification system, but the present invention is not limited to this, and a reduction system or an enlargement system may be used.

The application of the exposure apparatus is not limited to the exposure apparatus for liquid crystals that transfers the liquid crystal display element pattern to a rectangular glass plate. exposure equipment, thin-film magnetic heads, micromachines, and exposure equipment for manufacturing DNA chips. In addition to microdevices such as semiconductor elements, glass substrates, silicon wafers, etc. are also used for manufacturing masks or reticles used in optical exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, and the like. It can also be applied to an exposure apparatus that transfers a circuit pattern to a substrate.

Also, the substrate to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). Note that the exposure apparatus of the present embodiment is particularly effective when the exposure target is a substrate having a side length or a diagonal length of 500 mm or more. Moreover, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll form.

《Device manufacturing method》
Next, a method of manufacturing a microdevice using the exposure apparatus according to each of the above embodiments in the lithography process will be described. In the exposure apparatus of the above embodiment, a liquid crystal display element as a microdevice can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
<Pattern formation process>
First, a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus according to each of the embodiments described above. Through this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. After that, the exposed substrate undergoes each process such as a development process, an etching process, a resist stripping process, etc., thereby forming a predetermined pattern on the substrate.
<Color filter forming process>
Next, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or a filter set of three stripes of R, G, and B is A plurality of color filters arranged in the horizontal scanning line direction are formed.
<Cell assembly process>
Next, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming process and the color filters obtained in the color filter forming process. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained in the pattern forming process and the color filter obtained in the color filter forming process.
<Module assembly process>
After that, each component such as an electric circuit for performing display operation of the assembled liquid crystal panel (liquid crystal cell) and a backlight is attached to complete a liquid crystal display element.

In this case, in the pattern forming process, the substrate is exposed with high throughput and high accuracy using the exposure apparatus according to the above-described embodiment and modifications, and as a result, the productivity of the liquid crystal display element can be improved. can.

The embodiments described above are examples of preferred implementations of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention.

10P Exposure device 20P Stage device 28 Substrate holder 100P Substrate transfer device 140P Substrate slide hand 150P Port section 152 Beam unit 160P Substrate feeder 182P Substrate carry-in bearer device 251 Air floating plate 264 Slide plate P, P1, P2 Substrate

Claims (21)

An exposure apparatus that exposes a substrate being scanned in a first direction on a predetermined plane using a projection optical system,
a support having a first surface capable of supporting the substrate and moving relative to the projection optical system ;
a port portion having a second surface capable of supporting the substrate, a projecting member capable of projecting from the second surface, and a height adjusting portion capable of adjusting the height of the second surface ;
a transfer unit that transfers the substrate on the first surface to the second surface;
The port section adjusts the second surface to the same height as the first surface by the height adjusting section, and supports the substrate transferred from the first surface to the second surface by the transfer section. death,
The projection member protrudes from the second surface that supports the substrate, thereby holding the substrate and conveying the substrate from the second surface to a position higher than the second surface. A loading unit that performs a loading operation for loading the substrate from above with respect to the first surface,
The support section has a substrate holding section capable of holding a portion of the substrate carried in by the loading section, holds the substrate by the substrate holding section, and faces the loading section within the predetermined plane. 2. The exposure apparatus according to claim 1, wherein said substrate is supported by said first surface by moving. The loading unit performs the loading operation of loading the first substrate onto the first surface,
The support part supports a second substrate different from the first substrate on the first surface,
3. The exposure apparatus according to claim 2, wherein said transfer section transfers said second substrate from said first surface to said second surface in parallel with said loading operation. The projecting member holds the substrate at a position higher than the second surface,
4. The exposure apparatus according to claim 2, wherein said loading section receives and holds said substrate held at a position higher than said second surface by said projecting member. 5. The exposure apparatus according to claim 4, wherein said projecting member is a plurality of pin-shaped members. The height adjustment unit drives the second surface above the plurality of pin-shaped members holding the substrate,
6. The exposure apparatus according to claim 5, wherein said port receives and supports said substrate on said second surface from said plurality of pin-shaped members. The loading section has a third surface capable of supporting the substrate,
the height adjustment unit is driven upwardly of the plurality of pin-shaped members that hold the substrate on the second surface;
the second surface receives the substrate from the plurality of pin-shaped members and supports the substrate at a position equal to or higher than the highest position of the third surface;
7. The exposure apparatus according to claim 6, wherein said loading section supports said substrate transferred from said second surface by said transfer section on said third surface. An exposure apparatus that exposes a substrate being scanned in a first direction on a predetermined plane using a projection optical system,
a support having a first surface capable of supporting the substrate and moving relative to the projection optical system;
a port portion having a second surface fixed at the same height as the first surface and capable of supporting the substrate; and a protruding member protruding from the second surface;
a transfer unit that transfers the substrate on the first surface to the second surface;
the port section supports the substrate transferred from the first surface to the second surface by the transfer section;
The projection member protrudes from the second surface that supports the substrate, thereby holding the substrate and conveying the substrate from the second surface to a position higher than the second surface. A loading unit that performs a loading operation for loading the substrate from above with respect to the first surface,
The support section has a substrate holding section capable of holding a part of the substrate carried in by the carrying-in section, holds the part of the substrate by the substrate holding section, and maintains the carrying-in section within the predetermined plane. 9. The exposure apparatus according to claim 8, wherein said substrate is supported by said first surface by moving relative to said substrate. The loading unit performs the loading operation of loading the first substrate onto the first surface,
The support part supports a second substrate different from the first substrate on the first surface,
10. The exposure apparatus according to claim 9, wherein said transfer section transfers said second substrate from said first surface to said second surface in parallel with said loading operation. the protruding member receives and holds the substrate at a position higher than the second surface;
11. The exposure apparatus according to claim 9, wherein said loading section receives and holds said substrate held at a position higher than said second surface by said protruding member. 12. The exposure apparatus according to claim 11, wherein said projecting member is a plurality of pin-shaped members. The carrying-in part has a third surface capable of holding the substrate and an opening through which the plurality of pin-shaped members can protrude,
the port portion holds the substrate above the third surface by causing the pin-shaped member to protrude from the opening portion when the loading portion exists above the port portion;
13. The carrying-in part according to claim 12, wherein the carrying-in part receives the substrate from the plurality of pin-shaped members and holds the substrate by the third surface by relatively moving the third surface with respect to the plurality of pin-shaped members. Exposure equipment. 12. The exposure apparatus according to claim 11, wherein said projecting member is a plurality of prismatic members extending in said first direction. 3. The port section adjusts the upper surface of the prismatic member to the same height as the second surface, and supports the substrate transferred from the first surface to the second surface by the transfer section. 15. The exposure apparatus according to 14. The loading section has a third surface capable of holding the substrate,
the plurality of prismatic members hold the substrate at the same position as or higher than the highest position of the third surface;
16. The exposure apparatus according to claim 14, wherein said loading section holds said substrate transferred from said plurality of prismatic members by said transfer section on said third surface. 17. The exposure apparatus according to any one of claims 1 to 16 , wherein said port section and said delivery section move integrally. The exposure apparatus according to any one of claims 1 to 17, wherein the substrate has at least one side length or diagonal length of 500 mm or more, and is for a flat panel display. exposing a substrate using the exposure apparatus according to any one of claims 1 to 18 ;
and developing the exposed substrate. A device manufacturing method comprising:
exposing a substrate using the exposure apparatus according to any one of claims 1 to 18 ;
and developing the exposed substrate. An exposure method , comprising exposing the substrate with the exposure apparatus according to any one of claims 1 to 18 .

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