TWI600973B - Object exchange method, object exchange system, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method - Google Patents

Description

Object exchange method, object exchange system, exposure apparatus, manufacturing method of flat panel display, and component manufacturing method

The present invention relates to an object exchange method, an object exchange system, an exposure apparatus, a method of manufacturing a flat panel display, and a component manufacturing method, and more particularly to an exchange method and system for an object held by an object holding device, and the foregoing object exchange An exposure apparatus of the system, a flat display using the above exposure apparatus, and a method of manufacturing an element.

Conventionally, in a lithography process for manufacturing electronic components such as liquid crystal display elements and semiconductor elements, an exposure apparatus is used which transfers an image formed on a photomask (or a reticle) to a glass substrate using an energy beam. (or wafer).

As such an exposure apparatus, there has been a case where a glass substrate which has been exposed on a substrate stage apparatus is carried out by using a predetermined substrate transfer apparatus, and then another glass substrate is carried into the substrate stage apparatus by using the substrate transfer apparatus, and sequentially exchanged. The glass substrate held by the substrate stage device is continuously exposed to a plurality of glass substrates (see, for example, Patent Document 1).

Here, when a plurality of glass substrates are continuously exposed, it is preferable to rapidly increase the glass substrate on the substrate stage device in order to improve the overall productivity.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] US Patent No. 6,559,928

The present invention has been made in view of the above circumstances, and is an object exchange method for exchanging objects arranged at a predetermined object exchange position into other objects, including: holding the first object An operation of the object holding device at the object exchange position; an operation of supporting the first object over the support device provided at the object exchange position; and moving the first object suspended from the support device away from the object holding device Acting; inserting a second object into an operation of transferring the second object between the first object and the object holding device suspended by the support device to the object holding device; and transferring the second object by After the object holding device is moved, the first object is moved relative to the supporting device to carry out the first object from the object exchange position.

Thereby, the second object is transferred to the object holding device in a state where the first object is suspended and supported by the supporting device, and thereafter the first object is carried out from the object exchange device. In other words, since the second object is preferentially carried forward to the object holding device and the end of the unloading operation of the first object held by the object holding device, the object exchange operation on the object holding device can be quickly performed.

The present invention is an object exchange system for exchanging objects arranged at a predetermined object exchange position into other objects, comprising: an object holding device capable of holding the object; and a supporting device disposed on the object Exchanging a position, capable of supporting the object; and driving the system to maintain the object holding device of the object in the object exchange position And the object is suspended from being supported by the support device to cause the object to be separated from the object holding device; and the object exchange device is inserted into the object while the object holding device is separated from the object. Handing the other object to the object holding device between the device and the object, and moving the object to the support device after transferring the aforementioned other object to the object holding device to exchange the object from the object exchange position Move out.

Thereby, the other object is transferred to the object holding device in a state where the object is suspended and supported by the supporting device, and thereafter the object is carried out from the object exchange device. In other words, since the loading of the object holding device by other objects is preferentially performed than the end of the moving operation of the object held by the object holding device, the exchange operation of the object on the object holding device can be quickly performed.

According to a third aspect of the invention, an exposure apparatus includes: an object exchange system according to a second aspect of the present invention; and a pattern forming apparatus that forms a predetermined pattern by using the energy beam on the object held by the object holding device.

According to a fourth aspect of the present invention, a method of manufacturing a flat panel display includes: an operation of exposing the object using an exposure apparatus according to a third aspect of the present invention; and an operation of developing the object after exposure.

According to a fifth aspect of the invention, there is provided a device manufacturing method comprising: an operation of exposing the object using an exposure apparatus according to a third aspect of the invention; and an operation of developing the object after exposure.

10‧‧‧Liquid exposure device

20‧‧‧Substrate stage device

26‧‧‧Substrate holder

30‧‧‧Substrate exchange device

36‧‧‧Substrate drive

38‧‧‧Air guiding device

44‧‧‧Adsorption pad

50‧‧‧Overhanging support device

52‧‧‧ Non-contact fixture device

P‧‧‧Substrate

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to a first embodiment.

Fig. 2 is a plan view showing a liquid crystal exposure apparatus (partially omitted) of Fig. 1.

Fig. 3(A) is a front view of the substrate exchange device of the liquid crystal exposure apparatus of Fig. 2, and Fig. 3(B) is a view showing a modification thereof.

4(A) to 4(C) are views (1 to 3) for explaining the operation of the substrate loading device included in the liquid crystal exposure apparatus of Fig. 1.

5(A) to 5(C) are views (1 to 3) for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment.

6(A) to 6(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (the fourth to sixth aspects thereof).

7(A) to 7(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (the seventh to the seventh).

8(A) and 8(B) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the first embodiment (10 and 11 thereof).

Fig. 9 is a plan view showing a substrate stage device and a substrate exchange device according to a second embodiment;

Fig. 10(A) is a side sectional view showing a substrate stage device according to a second embodiment, and Fig. 10(B) is a view showing a modification thereof.

11(A) to 11(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the second embodiment (the first to third aspects thereof).

12(A) to 12(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the second embodiment (the fourth to sixth aspects thereof).

13(A) to 13(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the third embodiment (the first to third aspects thereof).

Fig. 14(A) is a view for explaining a substrate exchange operation of the liquid crystal exposure apparatus of the third embodiment (4), and Fig. 14(B) is a view showing a modification thereof.

15(A) to 15(C) are views (1 to 3) for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment.

16(A) to 16(C) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment (the fourth to sixth aspects thereof).

17(A) and 17(B) are views for explaining the substrate exchange operation of the liquid crystal exposure apparatus of the fourth embodiment (the seventh and eighth embodiments thereof).

"First Embodiment"

Hereinafter, the first embodiment will be described with reference to Figs. 1 to 8(B).

In Fig. 1, the configuration of the liquid crystal exposure apparatus 10 of the first embodiment is schematically shown. The liquid crystal exposure apparatus 10 is a step-and-scan type projection exposure apparatus using a rectangular (angular) glass substrate P (hereinafter simply referred to as a substrate P) such as a liquid crystal display device (planar display), and so on. Device.

The liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage 14 that holds the mask M, a projection optical system 16, and a surface (the surface facing the +Z side in FIG. 1) is coated with a resist (sensing agent). The substrate stage device 20 of the substrate P, the substrate exchange device 30, the overhanging support device 50, and the like, etc. In the following description, when the exposure is performed, the direction in which the mask M and the substrate P are scanned with respect to the projection optical system 16 is the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the X-axis and Y. The direction in which the axial directions are orthogonal is the Z-axis direction. Further, the positions in the X-axis, the Y-axis, and the Z-axis direction are set to the X position, the Y position, and the Z position, respectively. Description.

The illumination system 12 has the same configuration as the illumination system disclosed in, for example, the specification of U.S. Patent No. 5,729,331. In other words, the illumination system 12 transmits light emitted from a light source (for example, a mercury lamp) (not shown) through a mirror, a dichroic mirror, a blind, a wavelength selective filter, various lenses, and the like, which are not shown. Illumination light (illumination light) IL is applied to the mask M as exposure light. For the illumination light IL, for example, an i-line (wavelength: 365 nm), a g-line (wavelength: 436 nm), an h-line (wavelength: 405 nm), or the like (or the above-described i-line, g-line, and h-line combined light) is used.

The mask stage 14 is adsorbed and held by the mask M, for example, by vacuum suction. The mask stage 14 is driven in the scanning direction (X-axis direction) by a predetermined long stroke by, for example, a mask stage driving system (not shown) including a linear motor. The position information of the mask stage 14 in the XY plane is obtained by a mask interferometer system including a laser interferometer (not shown).

The projection optical system 16 is disposed below the mask stage 14 . The projection optical system 16 has the same configuration as the projection optical system disclosed in the specification of the U.S. Patent No. 6,552,775, and a so-called multi-lens projection optical system, and has a plurality of projection opticals which form an erect positive image, for example, by a double-centered telecentric system. system.

The liquid crystal exposure device 10, when illuminating the illumination region on the reticle M with the illumination light IL from the illumination system 12, that is, through the illumination light IL passing through the reticle M, transmits the reticle in the illumination region through the projection optical system 16. The projection image (partial erect image) of the circuit pattern of M is formed in an irradiation region (exposure region) of the illumination light IL conjugate with the illumination region on the substrate P. And moving the mask M in the scanning direction by the relative illumination area (illumination light IL) and moving the substrate P in the scanning direction with respect to the exposure area (illumination light IL), thereby performing scanning exposure of an illumination area on the substrate P, The irradiation region is transferred to a pattern formed on the mask M.

The substrate stage device 20 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 26.

The XY coarse movement stage 22 is a device for driving the substrate holder 26 in the X-axis direction and the Y-axis direction with a predetermined long stroke. As the XY coarse motion stage 22, the X coarse motion stage capable of moving in the X-axis direction with a predetermined long stroke and capable of moving with a predetermined long stroke can be used, as disclosed in the specification of the U.S. Patent Application Publication No. 2010/0018950. A so-called gantry biaxial stage device in which the Y coarse movement stage is combined in the Y-axis direction (the illustration of the X and Y coarse movement stages is omitted). The fine movement stage 24 is disposed above the XY coarse movement stage 22, and is placed on the fixed base 18 by a weight eliminating device 28 disclosed in, for example, the specification of the US Patent Application Publication No. 2010/0018950. The fixing base 18 is formed of a rectangular plate-like member in plan view, and is provided on the ground 11 through the vibration isolating device 19.

The substrate holder 26 is formed of a rectangular plate-like member (or a rectangular parallelepiped shape) in plan view, and is integrally fixed to the upper surface of the fine movement stage 24. The substrate holder 26 is induced by the XY coarse movement stage 22 to move in the X-axis direction and/or the Y-axis direction with respect to the projection optical system 16 (illumination light IL) for a predetermined long stroke. The positional information in the XY plane of the substrate holder 26 (that is, the substrate P) is obtained by a substrate interferometer system including a laser interferometer (not shown). Further, the configuration of the XY coarse movement stage 22 is not particularly limited as long as at least the substrate P can be driven in the scanning direction with a predetermined long stroke.

A plurality of minute holes (not shown) are formed on the upper surface of the substrate holder 26 (the surface facing the +Z side). A vacuum suction device provided outside the substrate stage device 20 and a pressurized gas supply device (none of which are shown) are selectively connected to the substrate holder 26. The substrate holder 26 can be protected by the vacuum attraction supplied from the vacuum suction device through the plurality of holes. Holding the substrate P placed thereon and the pressurized gas suspension support (non-contact support) supplied through the plurality of holes (or other holes) from the pressurized gas supply device Substrate P.

As shown in FIG. 2, the size of each of the substrate holders 26 in the X-axis and Y-axis directions is set to be shorter than the respective dimensions of the substrate P in the X-axis and the Y-axis direction, and the substrate holder 26 is placed with the substrate P placed thereon. In the state, the end portion of the substrate P is slightly beyond the end portion of the substrate holder 26. This is because there is a possibility that the resist adheres to the back surface of the substrate P, and the resist is not attached to the substrate holder 26.

As shown in FIG. 2, on the -Y side of the substrate holder 26, a pair of Y press pin means 25y are arranged at predetermined intervals in the Y-axis direction. The Y push pin device 25y has a base 25a fixed to the substrate holder 26 (may also be a fine movement stage 24 or an XY coarse movement stage 22 (refer to FIG. 1)), and can be fixed relative to the base 25a (for example, 10 to 100 mm). The stroke of the stroke 25b in the Y-axis direction and the actuator (not shown) for driving the pin 25b. The front end portion (the end portion on the +Z side) of the pin 25b protrudes toward the +Z side from the upper surface of the substrate holder 26. Further, on the +Y side of the substrate holder 26, a pair of Y positioning pin devices 27y are disposed at a predetermined interval in the X-axis direction (the pair of Y pressing pin devices 25y are vertically symmetrical with respect to the paper surface of the substrate holder 26). The Y positioning pin device 27y has substantially the same configuration as the Y pressing pin device 25y except that the pin is fixed. Further, the pair of Y press pin devices 25y may be disposed on the +Y side of the substrate holder 26, and in this case, the pair of Y positioning pin devices 27y are disposed on the -Y side of the substrate holder 26. Further, the Y press pin device 25y may be disposed on the -Y side and the +Y side of the substrate holder 26, respectively.

Further, on the +X side of the substrate holder 26, a pair of X press pin devices 25x are disposed at predetermined intervals in the Y-axis direction. The X press pin device 25x has a fixing to the substrate holder 26 (also The base 25a of the micro-motion stage 24 or the XY coarse movement stage 22 (refer to FIG. 1) can be used, and the pin 25b can be moved in the Y-axis direction with a predetermined (for example, 1 to 100 mm) stroke with respect to the base 25a, and An actuator (not shown) that drives the pin 25b. Here, the pin 25b included in the X press pin device 25x can be lowered from the upper surface of the substrate holder 26 toward the +Z side at the front end portion and the front end portion is lowered toward the -Z side from the upper surface of the substrate holder 26. Drive in the up and down direction. Further, on the -X side of the substrate holder 26, a pair of X positioning pin devices 27x are disposed at a predetermined interval in the Y-axis direction (the pair of X pressing pin devices 25x are bilaterally symmetrical with respect to the paper surface via the substrate holder 26). The X positioning pin device 27x has substantially the same configuration as the X pressing pin device 25x except that the pin is fixed. The X press pin device 25x, the X positioning pin device 27x, the Y push pin device 25y, and the Y positioning pin device 27y are used when the substrate P is prealigned with the substrate holder 26.

The substrate exchange device 30 carries in the substrate holder 26 in which the substrate P held by the substrate holder 26 is carried out from the substrate holder 26 and the substrate P is empty (the substrate P is not held). As shown in FIG. 1, the substrate exchange device 30 is disposed on the +X side region of the substrate stage device 20, and is disposed on the ground 11. The substrate stage device 20 and the substrate exchange device 30 are housed in a processing chamber (not shown) of the liquid crystal exposure device 10.

The substrate exchange device 30 has a gantry 32, a bottom plate 34, a substrate driving device 36, and a plurality of air guiding devices 38. The gantry 32 is composed of a table-like member having a low height provided on the ground 11. The bottom plate 34 is formed of a plate-like member disposed in parallel with the XY plane, and as shown in FIG. 3(A), is formed by an X linear guide 33a fixed to the upper surface of the gantry 32 and a plurality of X sliders 33b fixed to the bottom of the bottom plate 34. A plurality of (for example, four) X linear guides 33 are mounted on the gantry 32. The bottom plate 34 is supported by a plurality of (for example, two) X linear motors 31 composed of an X stator 31a fixed to the upper surface of the gantry 32 and an X movable member 31b fixed to the lower surface of the bottom plate 34. The stage 32 is appropriately driven in the X-axis direction with a predetermined stroke.

Referring back to FIG. 1, the substrate driving device 36 drives the substrate to be loaded or the substrate P to be carried out when the substrate P on the substrate holder 26 is exchanged. The substrate driving device 36 includes an X driving unit 40, a support post 42, and an adsorption pad 44. The X drive unit 40 has an X fixed portion 40a and an X movable portion 40b. The X fixing portion 40a is formed of a member extending in the X-axis direction, and is fixed to the center portion of the upper surface of the bottom plate 34 in the Y-axis direction (see FIGS. 2 and 3(A)). The X movable portion 40b is mounted on the upper surface of the X fixing portion 40a, and includes a driving system of an X linear motor including a movable portion of the X fixing portion 40a and a movable portion of the X movable portion 40b, along the X fixing portion 40a. The X-axis direction is linearly driven by, for example, a stroke that is the same as the dimension of the substrate P in the X-axis direction. Further, the type of the actuator for driving the bottom plate 34 and the X movable portion 40b is not particularly limited, and may be, for example, a feed screw device, a belt drive device, or the like.

The pillar 42 is composed of a member extending in the X-axis direction, and the lower end portion is integrally fixed to the X movable portion 40b. The adsorption pad 44 is formed of a member having an X-shaped inverse L-shape, and a portion parallel to the XY plane is formed into a rectangular plate shape in plan view. The adsorption pad 44 is connected to a vacuum device (not shown), and the upper surface of the portion parallel to the XY plane functions as a substrate adsorption surface. One of the portions of the adsorption pad 44 that is parallel to the YZ plane faces one side of the upper end of the pillar 42 (the surface facing the -X side). The adsorption pad 44 is mounted to pass through the Z linear guide 46 (the Z linear guide 46a fixed to one side (-X side) of the post 42 and the portion parallel to the YZ plane fixed to the adsorption pad 44 (+ The plurality of Z sliding members 46b of the X side) are movable in the Z-axis direction with respect to the pillars 42. Further, the adsorption pad 44 is mounted on the Z actuator 48 (for example, a cylinder or the like) of the X movable portion 40b, and the upper surface (substrate adsorption surface) is higher than the substrate holder 26 and the plurality of air guiding devices 38. Position to the +Z side and the substrate holder 26 and a plurality of air guiding devices The position above the lower side of 38 is driven in the Z-axis direction.

Each of the plurality of air guiding devices 38 is formed of a rectangular parallelepiped member having a longitudinal direction in the X-axis direction, and is mounted on the intermediate bottom plate 37b via the support post 37a. As shown in FIG. 3(A), the intermediate bottom plate 37b is provided with, for example, two at a predetermined interval in the Y-axis direction so as not to hinder the movement of the pillars 42 of the substrate driving device 36. For example, the two intermediate bottom plates 37b are each connected to the bottom plate 34 via the stays 37c. Therefore, the plurality of air guiding devices 38 move integrally with the bottom plate 34 in the X-axis direction. As shown in FIG. 2, a plurality of air guiding devices 38 are disposed apart from each other at a predetermined interval in such a manner as to substantially support the underside of the substrate P. In the first embodiment, the air guiding device consisting of a plurality of (for example, three) air guiding devices 38 arranged at a predetermined interval in the X-axis direction is arranged in a plurality of columns at a predetermined interval in the Y-axis direction (for example, Six columns), and a total of, for example, eighteen air guiding devices 38 support the substrate P from below. Further, the number and arrangement of the air guiding devices 38, and the shape of the substrate guiding surface formed by the plurality of air guiding devices 38 can be appropriately changed depending on, for example, the size of the substrate P.

A plurality of minute holes (not shown) are formed on each of the plurality of air guiding devices 38. Further, a pressurized gas supply device and a vacuum suction device (none of which are shown) are selectively connected to each of the plurality of air guiding devices 38. Each of the plurality of air guiding devices 38 can support the substrate P (non-contact support) placed thereon by the pressurized gas supply supplied from the pressurized gas supply device through the plurality of holes, and can borrow The substrate P placed thereon is adsorbed by a vacuum suction force supplied from the vacuum suction device through the plurality of holes (or other holes).

Here, the loading operation of the substrate P by the substrate exchange device 30 will be described with reference to FIGS. 4(A) to 4(C). In the liquid crystal exposure apparatus 10, the substrate P is moved to the substrate holder 26. The loading operation and the unloading operation of the substrate holding device 26 to be described later (hereinafter collectively referred to as the substrate P exchange operation) are performed in a state where the substrate holder 26 is positioned at a predetermined substrate exchange position. The substrate exchange position is set near the +X side end of the mount 18. In a state where the substrate holder 26 is located at the substrate exchange position (the substrate holder 26 is disposed at a position shown by a broken line in FIG. 1), as shown in FIG. 4(A), the plurality of air guiding devices 38 are held by the substrate. The member 26 is adjacent in the X-axis direction, and the substrate guiding surface formed by the plurality of air guiding devices 38 forms a continuous guiding surface with the upper surface of the substrate holder 26.

When the substrate P is carried into the substrate stage device 20 by using the substrate exchange device 30, the Z position of the substrate holder 26 is positioned such that the Z position on the upper surface of the substrate holder 26 and the Z position on the upper surface of the plurality of air guiding devices 38 become It is roughly the same (or the substrate holder 26 side is slightly lower). Further, the position of the pin 25b of the X press pin device 25x is controlled so that the upper end portion is located on the -Z side (not protruding) from the upper surface of the substrate holder 26. As shown in FIG. 4(A), the substrate exchange device 30 is adsorbed and held by the substrate P of the adsorption pad 44 at the center portion in the Y-axis direction near the +X side end portion, and is moved toward the -X direction by the adsorption pad 44. The drive is moved along a guide surface formed by the upper surface of the plurality of air guiding devices 38 and the substrate holder 26.

Next, as shown in FIG. 4(B), after the +X side end portion of the substrate P is located closer to the -X side than the X press pin device 25x, as shown in FIG. 4(C), the adsorption pad 44 releases the substrate P. The adsorption is maintained and driven in the +X direction. Further, the pin 25b of the X press pin device 25x is driven in the +Z direction and the -X direction. Thereby, the +X side end portion of the substrate P is pressed by the pin 25b, and the -X side end portion of the substrate P abuts against the X positioning pin device 27x, and the substrate P is prealigned in the X-axis direction. Further, although not shown, in the same manner, the Y-press pin device 25y presses the Y-side end portion of the substrate P on the +Y side to perform pre-alignment of the substrate P in the Y-axis direction. In addition, it is also possible to move the substrate P as shown in FIG. 4(A). In this case, the adsorption pad 44 is released from the substrate P, and the adsorption pad 44 and the substrate P are separated, and the substrate P is moved by the inertial force. Further, a notch in which a part of the adsorption pad 44 can be inserted may be formed in the central portion of the +X side end portion of the substrate holder 26 in the Y-axis direction. In this case, since the X position of the substrate P on the substrate holder 26 can be adjusted by the substrate driving device 36, the X pressing pin device 25x and the X positioning pin device 27x are not required.

Referring back to FIG. 2, the suspension supporting device 50 is used together with the substrate exchange device 30 to carry out the unloading operation of the substrate P held by the substrate holder 26 from the substrate holder 26. The overhanging support device 50 is disposed above the substrate holder 26 in a state where the substrate stage device 20 is placed at the substrate exchange position.

The overhanging support device 50 has a plurality of non-contact clamp devices 52. The non-contact clamp device 52 is also referred to as a Benuri clamp, and its configuration is disclosed, for example, in the specification of U.S. Patent No. 5,067,762. That is, a gas supply device (not shown) is connected to each of the plurality of non-contact clamp devices 52, and a plurality of non-contacts are formed under the state in which the lower surface of the suspension support device 50 and the upper surface of the substrate P are opposed to each other with a predetermined gap therebetween. Pressurizing gas (for example, air) is ejected at a high speed on the upper surface of each of the pair of substrates P of the jig device 52. Then, by the action of the gas between the lower surface of each of the plurality of non-contact jig devices 52 and the upper surface of the substrate P (the so-called Bernoir effect and the ejector effect), the substrate P is forced upward in the weight direction ( The role of the attraction is that the substrate P is held in contact (sustraction holding) by the suspension supporting device 50.

In the first embodiment, for example, twenty-five non-contact jig devices 52 are arranged at predetermined intervals in the X-axis direction and the Y-axis direction so that the attraction force acts uniformly on the entire substrate P, but not The number and arrangement of the contact jig devices 52 are not limited thereto, and may be appropriately changed depending on, for example, the size of the substrate P.

The plurality of non-contact jig devices 52 are attached to a plurality of rod-shaped members parallel to the X-axis and arranged at predetermined intervals in the Y-axis direction at a predetermined interval in the X-axis direction in a state of being suspended and supported. The rod-shaped member parallel to the Y-axis is formed into a mesh-shaped support member 54 (refer to Fig. 1). The support member 54 is driven in the Z-axis direction (up-and-down direction) by a predetermined stroke by a plurality of (for example, four in the first embodiment) Z actuator 56. The Z actuator 56 is provided with a Z fixing portion 56a that is provided on the ground 11 (see FIG. 1) in a state of being physically separated from the substrate stage device 20 by a support member (not shown), and is driven to the Z fixing portion 56a. The Z movable portion 56b in the axial direction is connected to the support member 54 at the Z movable portion 56b.

Hereinafter, a surface formed by the lower surface of the plurality of non-contact jig devices 52 will be referred to as a substrate holding surface of the suspension supporting device 50. In the suspension supporting device 50, the supporting member 54 is driven in the Z-axis direction while the substrate P is held in non-contact, and the substrate P and the supporting member 54 are integrally moved in the Z-axis direction. Thereby, the suspension supporting device 50 can move the substrate P up and down above the substrate holder 26 located at the substrate exchange position. Further, the type of the actuator that moves the support member 54 up and down can be appropriately changed. For example, the support member 54 can be suspended by a rope or the like, and the support member 54 can be moved up and down by winding the rope.

Further, as shown in FIG. 1, the pin 58 (+Y side) protruding downward from the lower surface of the support member 54 is disposed on the +X side, the -X side, the +Y side, and the -Y side end portion of the support member 54, respectively. And the pin 58 on the -Y side is not shown). The plurality of pins 58 are arranged to surround the outer periphery of the substrate P in a state in which the plurality of non-contact jig devices 52 are suspended by the support substrate P to restrict the non-intentional direction of the substrate P with respect to the suspension support device 50 in a direction parallel to the XY plane. mobile. Further, the number of the pins 58 is not particularly limited as long as it can restrict the unintended movement of the substrate P. Further, the pin 58 disposed near the +X side end portion of the support member 54 can be lower than the substrate holding surface at the lower end portion. The protruding position is driven between a position where the lower end portion does not protrude downward from the substrate holding surface (a position where the substrate P is not hindered from moving in the +X direction with respect to the suspension supporting device 50). In addition, a plurality of pins 58 can be moved in the X-axis and/or the Y-axis direction, and the end portion of the substrate P supported by the plurality of non-contact jig devices 52 can be pressed by using the plurality of pins 58 to perform the substrate. P is aligned (pre-aligned) in the XY plane.

Further, as shown in FIG. 1, an external transfer robot 99 that carries the substrate P into the liquid crystal exposure device 10 from the outside of the liquid crystal exposure device 10 is disposed outside the liquid crystal exposure device 10 (only the external transfer mechanism is illustrated in FIGS. 1 and 2). The arm member 98 of the arm 99). As shown in FIG. 2, the arm member 98 has a plurality of support portions 98a formed of a plate-like member extending in parallel with the X-axis, and a connecting portion 98b connecting the ends of the plurality of support portions 98a to each other, also referred to as a fork arm ( Fork hand) and so on. The external transfer robot arm 99 has, for example, a drive device (for example, a robot arm) that can drive the arm member 98 at least in the X-axis direction and the Z-axis (up and down) direction with a predetermined stroke, although not shown.

Here, among the arm members 98 of the external transfer robot 99, the plurality of support portions 98a are arranged at substantially equal intervals in the Y-axis direction in order to suppress the bending of the substrate P. Further, the Y-axis direction interval of the plurality of air guiding devices 38 included in the substrate exchange device 30 described above is determined by considering the interval between the plurality of support portions 98a in the Y-axis direction. Specifically, the Y-axis direction of the plurality of air guiding devices 38 is set to be in the Y-axis with respect to the plurality of supporting portions 98a of the arm member 98 in a state where the arm member 98 is located on the plurality of air guiding devices 38. The directions do not overlap. Thereby, the air guiding device 38 can be inserted between the adjacent support portions 98a via a predetermined gap.

The liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above is subjected to the mask holder device 14 by a mask loader (not shown) under the management of a main control unit (not shown). The upper photomask M is loaded, and the substrate P on the substrate holder 26 is loaded by the substrate exchange device 30. Thereafter, the alignment control is performed by the main control device using an alignment detection system (not shown), and after the alignment measurement is completed, the plurality of illumination regions set on the substrate P are successively subjected to the step-scan mode exposure. action. In addition, since this exposure operation is the same as the exposure operation by the conventional step-and-scan method, detailed description thereof is omitted. Then, the substrate P that has been subjected to the exposure processing is carried out from the substrate holder 26 by the substrate exchange device 30, and the other substrate P that is next exposed is transferred to the substrate holder 26, whereby the substrate P on the substrate holder 26 is carried out. In the exchange, the plurality of substrates P are continuously subjected to an exposure operation or the like.

Hereinafter, using FIG. 5 (A) ~ FIG. 8 (B) described in the liquid crystal substrate exposure apparatus 10 of the substrate holder 26 is P (for convenience of description, referred to the substrate a plurality of substrates P P _1, P ₂ of the substrate, the substrate P ₃ ) exchange action. The following substrate exchange operation is performed under the management of a main control device (not shown). In addition, for simplification of illustration, each of the substrate stage device 20, the substrate exchange device 30, and the overhanging support device 50 is simplified (partial elements are not shown) in FIGS. 5(A) to 8(B). .

FIG 5 (A) based on the display substrate holder placed yl completion of exposure of the substrate P ₁ position of the substrate stage switching device state from the end of the exposure operation of the substrate position 20 to 26. A plurality of air guide means 30 of the exchange 38 to the substrate, the substrate P is placed after _a predetermined exposure process for the substrate P _2. Although the operation diagram is omitted in FIG. 5(A), in the substrate exchange device 30, the plurality of air guiding devices 38 are driven to the -X in accordance with the movement of the substrate stage device 20 to the substrate exchange position. Direction (close to the direction of the substrate stage device 20). Further, after the substrate stage device 20 is positioned at the substrate exchange position (or the substrate stage device 20 is moved toward the substrate exchange position), the overhanging support device 50 drives down the plurality of non-contact clamp devices 52.

Substrate stage device 20, in the state of the substrate exchange position, as shown in FIG. 5 (B), releasing the substrate holder 26 of _an adsorption substrate P held, and the holder 26 having the above substrate P from the substrate A pressurized gas is sprayed under the _1st . Further, depending support means 50, a plurality of lines from the non-contact fixture device 52 is ejected at a high speed gas, whereby the substrate P ₁ upward direction of gravity force action (levitation force) (FIG. 5 (B) in the non-display of the arrow gases The flow is in the direction in which the force is displayed.) The substrate P ₁ is adsorbed and held by the overhanging support device 50. Further, the substrate exchange device 30, a plurality of air from below the guide means 38 is ejected to the substrate P ₂ of the pressurized gas, the suspension on the substrate P ₂ a plurality of air guide 38. Further, the adsorption pad 44 is adsorbed and held under the substrate P ₂ . Next, FIG. 5 (C), the sucking and holding the substrate P ₁ depending support means 50 is raised driven, the substrate P is below the substrate holder ₁ 26 of the above separation.

Thereafter, as shown in FIG. 6(A), the adsorption pad 44 is driven to the -X direction. Thereby, the substrate P ₂ moves along the upper surface of the plurality of air guiding devices 38 and the guiding surface formed on the upper surface of the substrate holder 26. Hereinafter, as described above, the X press pin device 25x and the Y press pin device 25y are used on the substrate holder 26 (not shown in FIG. 6(A). Referring to FIG. 4(A) to FIG. 4(C)) After the pre-alignment, the substrate P ₂ is adsorbed and held by the substrate holder 26. At the time of the movement of the substrate P ₂ and the pre-alignment operation, the exposed substrate P ₁ stands by at the substrate exchange position while being held by the suspension supporting device 50. Hereinafter, the substrate stage device 20 in FIG. 6 (B), in order to be moved to a predetermined position of the start of the exposure operation on substrate P from the exposure operation of the substrate ₂ exchange position.

After the substrate stage device 20 is separated from the substrate exchange position, as shown in FIG. 6(C), the plurality of non-contact clamp devices 52 of the suspension support device 50 are driven to be driven downward. In this case, the substrate ₁ of P Z position, the suction pad 44 can be positioned below the suction holding position of the substrate P _2, i.e. with the loading of the substrate holder 26 (refer to FIG. 6 (A)) of the substrate ₁ of P The Z position is approximately the same.

Hereinafter, FIG. 7 (A), the sucking and holding of the substrate P below _a suction pad 44 is driven toward the + X direction, whereby the substrate P ₁ along a plurality of non-contact means below the clamp 52 and a plurality of air The guide surface formed on the upper surface of the guiding device 38 moves. In this case, the supporting means 50 overhanging the + side of the pin 58 X (in FIG. 7 (A), not shown. Referring to FIG. 1) is not in contact with a substrate ₁ of P retracted. Further, in FIGS. 7(A) to 8(B), the substrate stage device 20 holding the substrate P ₂ is illustrated for convenience of explanation, but the substrate P ₁ and the substrate P on the substrate exchange device 30 described below are illustrated. The switching operation of ₃ is performed in parallel with the exposure operation of the substrate P ₂ , and the actual position of the substrate stage device 20 is different.

Next, FIG. 7 (B), the substrate P after being conveyed to _a plurality of upper air guide means 38, i.e., desorbed suction pad 44 of the substrate P held _1, and the suction pad 44 is driven downward. Further, the air guide device 38 is stopped from P substrate below the discharge line of the pressurized gas _1. Further, although the operation diagram is omitted in FIG. 7(B), in the substrate exchange device 30, the plurality of air guiding devices 38 are driven in the +X direction (the direction away from the substrate stage device 20). In addition, the X position of the plurality of air guiding devices 38 may also be fixed.

Thereafter, in order to carry-out the substrate P ₁ to the liquid crystal exposure device 10 (see FIG. 1) outside, while FIG. 7 (C), the external transfer arm 99 of the robot arm member 98 is inserted in a space below the substrate P ₁ after being Ascending drive. At this time, as described above, the arm member 98 of the external transfer robot 99 does not come into contact with the plurality of air guiding devices 38. Accordingly, the substrate P ₁ of the arm member 98 is supported from below, in this state, the arm member 98 is driven toward the + X direction, whereby the substrate P is unloaded to _a liquid crystal exposure device 10 (see FIG. 1) outside. Further, in FIG. 7(B), the suction pad 44 is driven to be driven downward in order to prevent the suction pad 44 from coming into contact with the arm member 98, but the suction pad 44 may be moved in the -X direction to avoid contact with the arm member 98.

Hereinafter, FIG. 8 (A), the external transfer arm member 99 of the robot arm 98 (described above can also be moved out of the same system and the substrate P of the arm member _{98. 1,} may also be others), for the substrate P after the predetermined ₂ After the exposed substrate P _{3 is} transported over the plurality of air guiding devices 38, as shown in FIG. 8(B), the arm member 98 of the external transfer robot 99 is driven in the -Z direction and the -X direction, and the substrate P _{3 is} placed on a plurality of air guiding devices 38. Whereby, back to FIG. 5 (A) as shown in the state (however, the substrate P ₁ P ₂ is replaced with the substrate, the substrate is replaced with the substrate P ₂ P _3). Further, after the substrate P ₃ is transferred to the plurality of air guiding devices 38, the position alignment (alignment) of the substrate P _{3 may} be performed in a state of being suspended on the plurality of air guiding devices 38. The above alignment can be performed, for example, by detecting the position of the end (edge) of the substrate P ₃ by an edge sensor or a CCD (Charge Coupled Device) camera while pressing the plurality of end portions of the substrate P ₃ . Hereinafter, the operation of the plurality of substrates P is continuously performed by repeatedly performing the operations shown in FIGS. 5(A) to 8(B).

The above description of the present first embodiment, since the exposure is completed the substrate P ₁ in the state of the substrate exchange position standby (from next predetermined exposure of the substrate P loaded ₂ of path retracted) of, for the substrate P loaded ₂ of the operation, and After the substrate P ₂ is transferred to the substrate stage device 20, the substrate P _{1 is carried} out from the standby position. Therefore, after the substrate P ₁ is removed, for example, the substrate P _{2 is} started to the substrate stage device. Compared with the case of moving in 20, the cycle time of substrate exchange can be shortened.

And, generally, since the substrate P as compared to the time of exposure operation ₂ is required, the completion of the exposure of the substrate P _{unloaded. 1} to 10 outside the liquid crystal substrate exposure apparatus P operation and a plurality of air guide 38 on the apparatus ₃ The time required for the mounting operation is short (the substrate P ₃ can be prepared before the exposure operation of the substrate P ₂ is completed). Therefore, as shown in the present embodiment, even the exposed substrate P ₁ is removed. The substrate P _{2 is} preferentially carried in, and the overall productivity at the time of continuously performing exposure processing on a plurality of (for example, three or more) substrates P is not affected.

Further, in the suspension supporting device 50, since the plurality of non-contact jig devices 52 can be moved up and down, the loading path of the substrate P can be made the same as the carrying-out path, and the liquid crystal exposure device 10 can save space. And for driving the substrate P (substrate P ₁ ~ P ₃₎ of the drive train (in the present embodiment, drive means 36 to the substrate) of a can, no separate drive train is provided with the loading and unloading of a drive train. Therefore, the constitution of the liquid crystal exposure apparatus 10 is simple and the cost can be reduced.

Further, in the suspension supporting device 50, a plurality of non-contact jig devices 52 eject gas to the upper surface (exposure surface) of the substrate P. However, since the substrate P held by the suspension supporting device 50 is exposed, the pressurized gas is contained. There is no exposure to dust. Further, since the plurality of non-contact jig devices 52 are fixed in position in the XY plane, there is little possibility that the substrate P is dropped.

Further, the configuration of the liquid crystal exposure apparatus 10 of the first embodiment described above can be appropriately changed. For example, the substrate exchange device 30a shown in Fig. 3(B) may be configured such that a plurality of air guiding devices 38 can be moved up and down. Specifically, in the substrate exchange device 30a, a plurality of air guiding devices 38 are supported by the Z actuator 37d on the bottom plate 34a instead of the pillar 37c of the substrate exchange device 30 shown in Fig. 3(A). . When the exposed substrate P is carried out from the substrate stage device 20 (see FIG. 1 and the like), the suspension supporting device 50 (see FIG. 6(C)) is lowered as compared with the first embodiment, and the present modification is The substrate exchange device 30a only needs to drive a plurality of air guiding devices 38 up and down. Further, in this case, the movable stroke of the adsorption pad 44 in the Z-axis direction may be set to be longer than the first embodiment to adsorb and hold the lower surface of the substrate P.

Thereby, since the exposed substrate P can be carried out without changing the Z position of the suspension supporting device 50, the operation of the suspension supporting device 50 can be simplified. Moreover, since it is not necessary to lower the driving suspension supporting device 50, it is possible to wait without the substrate stage device 20 from the base. The board exchange position (below the suspension support device 50) is completely retracted, that is, the substrate unloading operation is started. Therefore, the time for the substrate exchange operation can be shortened. Further, the X fixing portion 40a for driving the suction pad 44 may be fixed to the gantry 32 as in the substrate exchange device 30a shown in Fig. 3(B) (the X fixing portion 40a itself may not move in the X-axis direction). In this case, the bottom plate 34a may be disposed on one side and the other side of the X fixing portion 40a, and the pair of bottom plates 34a may be synchronously driven.

"Second Embodiment"

Next, a second embodiment (and a modification thereof) will be described with reference to Figs. 9 to 12(C). In the second embodiment to the fourth embodiment, the same components as those in the above-described first embodiment are given the same reference numerals as in the first embodiment, and the description thereof will be omitted.

In the liquid crystal exposure apparatus of the second embodiment shown in FIG. 9, the substrate stage device 60, the suspension supporting device 50a (not shown in FIG. 9 (see FIG. 10(A)), and the substrate exchange device 70 are configured as described above. The first embodiment differs. As shown in FIG. 10(A), the substrate stage device 60 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 62. The configuration of the XY coarse movement stage 22 and the fine movement stage 24 (including the weight eliminating device 28) is the same as that of the above-described first embodiment. The substrate holder 62 is formed of a plate-like member having a rectangular shape in plan view, and is integrally fixed to the upper surface of the fine movement stage 24.

As shown in FIG. 9, on the upper surface of the substrate holder 62, a plurality of strips (for example, six in the second embodiment) extending in the X-axis direction are formed at predetermined intervals in the Y-axis direction. An air guiding device 64 is inserted into each of the plurality of X slots 62a. The air guiding device 64 is constituted by a member extending in the X-axis direction, and its dimension in the longitudinal direction is set to be approximately the same as the dimension of the substrate P in the X-axis direction (short in the second embodiment). A plurality of minute holes (not shown) are formed on the upper surface of the air guiding device 64. A pressurized gas supply device (not shown) provided outside the substrate stage device 60 is connected to the air guiding device 64, and can be used from the plurality of micro hole portions. The pressurized gas is ejected.

Further, as shown in FIG. 10(A), a leg portion 66 extending in the Z-axis direction is fixed to the lower side of the air guiding device 64 and in the longitudinal direction of the air guiding device 64. A pair of through holes 62b penetrating the substrate holder 62 in the vertical direction are formed on the bottom surface of the X groove 62a, and the leg portions 66 are inserted into the pair of through holes 62b. The XY coarse movement stage 22 has a pair of Z actuators 68 corresponding to the pair of leg portions 66 described above. The air guiding device 64, by the pair of Z actuators 68, protrudes upward from the upper surface of the substrate holder 26 and lowers above the upper surface of the substrate holder 26 (air guiding) The Z position is appropriately controlled between the position where the device 64 is housed in the X-groove 62a.

The suspension support device 50a shown in Fig. 10(A) is configured such that the Z position of the support member 54 supporting the plurality of non-contact clamp devices 52 is fixed (the Z actuator 56 is not provided (refer to Fig. 1)). Other than the point, the other is the same as the first embodiment described above.

The substrate exchange device 70 shown in Fig. 9 has a plurality of air guiding devices 74 (in the second embodiment, for example, six in the Y-axis direction are provided at predetermined intervals). The air guiding device 74 is constructed in the same manner as the air guiding device 64 of the substrate holder 62 (slightly wider). That is, the air guiding device 74 is constituted by a member extending in the X-axis direction, and as shown in Fig. 11(A), has a pair of leg portions 76 on the lower surface thereof. The air guiding device 74 is driven in the Z-axis direction by a predetermined stroke by a pair of Z actuators fixed to one of the bottom plates 34.

A plurality of minute holes (not shown) are formed on the upper surface of the air guiding device 74. A pressurized gas supply device (not shown) is connected to the air guiding device 74, and the pressurized gas can be ejected from the plurality of minute holes. In the second embodiment, the substrate P has a plurality of air guiding devices 64 and/or substrate switching devices 70 included in the substrate stage device 60. A plurality of air guiding devices 74 are supported from below, and the air guiding devices 64, 74 suspend the supporting substrate P (non-contact support) by ejecting pressurized gas to the lower surface of the substrate P. The configuration of the substrate driving device 36 shown in FIG. 9 is the same as that of the above-described first embodiment, and thus the description thereof is omitted.

Hereinafter, the substrate exchange operation of the second embodiment will be described with reference to Figs. 11(A) to 12(C). FIG 11 (A) show the exposure of the substrate held completion of group P ₁ of the substrate stage device 60 exchange position (depending below the supporting means 50a) of the state. Further, the substrate P _{2 is} placed on the air guiding device 74 of the substrate exchange device 70. Arranged at positions of the substrate base exchange stage device 60, FIG. 11 (B), the depending support means 50a to increase the air guide 64 to drive suction holding can (depending support) position of the substrate P _1. Depending support means attracting and holding the substrate P ₁ 50a, in the first embodiment, in the same manner, the substrate ₁ P ₂ is retracted from the path of movement of the substrate P to the substrate board P ₂ until the end of the base station apparatus 60 of the loading operation. Further, in the substrate exchange device 70, the adsorption pad 44 adsorbs and holds the substrate P ₂ .

After the substrate P ₁ is transferred to the overhanging support means 50a, as shown in FIG. 11 (C), air guide means 64 is driven downward. At this time, the Z actuator 68 is controlled so that the Z position on the air guiding device 64 becomes substantially the same (or lower) than the Z position on the air guiding device 74 of the substrate exchange device 70. In this state, the Z position of the air guiding device 74 is set such that the upper surface of the air guiding device 64 is located on the +Z side above the substrate holder 62.

Next, as shown in Fig. 12(A), the adsorption pad 44 is driven in the -X direction. Thereby, the substrate P ₂ is moved along the guide surface formed by the upper surface of the air guiding device 74 and the air guiding device 64, and is transferred from the air guiding device 74 to the air guiding device 64. The following, although not shown, the suction pad 44 suction holding the substrate P after the lifting of _2, is driven by the -Z direction, and the + X direction from the substrate ₂ and the substrate P after being held between the removal tool 62 above As shown in FIG. 12 (B), air guide means 64 is driven downward, the substrate P ₂ placed on the substrate holder 62 above. Further, although not shown, the adsorption pad 44 to the drive train is the + Z direction and the -X direction, while the suction holding the substrate P ₁ below. Further, in the substrate exchange device 70, the air guiding device 74 is driven up. In this case, Z control system to cause the actuator 78 held at the Z position than the substrate below the overhang of the support means 50a of _a P slightly above the -Z side 74 of the air guide means.

Thereafter, as shown in Fig. 12(C), the pressurized gas is ejected from the upper surface of the air guiding device 74, and the adsorption pad 44 is driven to the +X direction. Accordingly, the substrate P ₁ along a plurality of non-contact clip device 52, and a plurality of predetermined air guide means 74 of the respective movement guide face, and placed on a plurality of air guide 74. Hereinafter, the above-described first embodiment in the same manner, on a plurality of air guide means 74, 99 used for an external transfer robot arm (not shown as in FIG. 12 (C)) after a predetermined substrate ₂ and the substrate P ₁ P The exchange operation of another substrate (not shown) for performing exposure processing (see FIGS. 7(B) to 8(B)).

According to the second embodiment described above, the since the system in the first embodiment similarly to the completion of the exposure of the substrate P ₁ is retracted from the substrate P _carry-2 of the path, preferentially for the substrate P ₂ than the substrate P unloaded ₁ of operation Since the loading operation is performed, the exchange time of the substrate P can be shortened.

Further, the second embodiment of the present aspect, since a plurality of air guide means 74 can move up and down, even if a plurality of non-contact without the clamp drive means 52 is lowered, the substrate P ₁ can also be directly unloaded from the retracted position. Thus, FIG. 12 (C), the substrate stage can be in the device 60 positioned at the substrate exchange position state, the unloading of _a substrate P (substrate P can also parallel with the pre-alignment operation of _2), can The time required for the exchange operation of the substrate P is shortened. Further, since the plurality of air guiding devices 64 included in the substrate stage device 60 can move up and down, the substrate P can be transferred from the substrate stage device 60 to the overhanging supporting device 50a. Therefore, the Z position of the plurality of non-contact jig devices 52 can be fixed, and the configuration of the suspension supporting device 50a can be simplified.

Further, the configuration of the liquid crystal exposure apparatus of the second embodiment described above can be appropriately changed. For example, as in the substrate stage device 60a shown in FIG. 10(B), the X-axis direction dimension may be shorter than the air guiding device 64 (see FIG. 10(A)) of the second embodiment (see FIG. 10(A)). In the present modification, for example, three air guiding devices 64a are housed in the X-groove 62a at predetermined intervals in the X-axis direction. The plurality of air guiding devices 64a are synchronously driven by a Z actuator 69 (for example, a cylinder device) housed in a recess 62c for defining a bottom surface of the X groove 62a. Further, although not shown, the air guiding device 74 (see FIG. 9) of the substrate exchange device 70 may be configured in the same manner.

"Third Embodiment"

Next, a third embodiment (and a modification thereof) will be described with reference to Figs. 13(A) to 14(B). In the third embodiment, the configuration of the substrate stage device 60 is the same as that of the second embodiment, and the configuration of the suspension supporting device 50 is the same as that of the first embodiment, but the operation during the substrate exchange operation (control of the main control device) ) The system is different. Further, the substrate exchange device 70a has a plurality of air guiding devices 74 (hidden in the paper surface depth direction in FIGS. 13(A) to 14(B)), similarly to the second embodiment shown in FIG. However, it does not have an element corresponding to the substrate driving device 36 (see FIG. 9).

In the third embodiment, the substrate P is transported by the own weight of the substrate P. FIG 13 (A) based displays of completion of exposure of the substrate P ₁ after the transfer to state 50 depending support means. The air guiding device 64 of the plurality of substrate stage devices 60 (hidden in the depth direction of the paper in FIGS. 13(A) to 14(B)) transfers the substrate P ₁ to the suspension supporting device 50 and is driven down. The point is the same as that of the second embodiment. However, in the third embodiment, the Z actuator 68 is controlled so that the Z position of the end portion of the air guiding device 64 on the +X side (the substrate exchange device 70a side) is higher. The Z-position at the X-side end portion is high, that is, the guide surface formed by the plurality of air guiding devices 64 becomes an inclined surface with respect to the XY plane.

Further, the air guiding device 74 of the plurality of substrate stage devices 70a (hidden in the depth direction of the paper in FIGS. 13(A) to 14(B)) similarly controls the Z actuator 78 so that + The Z position of the X-side end portion is higher than the Z position of the end portion of the -X side (the substrate stage device 60 side), that is, the guide surface formed by the plurality of air guiding devices 74 becomes an inclined surface with respect to the XY plane. Here, each of the Z actuators 68, 78 is controlled to form a single guide surface formed by each of the plurality of air guiding devices 64 and the air guiding device 74 (no step difference (or the step is small to not Influence on the movement of the substrate P ₂ )) Guide surface. Specifically, the angles of the guide faces (inclined faces) formed by the plurality of air guiding devices 64 and the air guiding devices 74 are set to be substantially the same as each other, and the guides formed by the plurality of air guiding devices 64 are formed. The Z position of the +X side end portion of the lead surface and the Z position of the X side end portion of the guide surface formed by the plurality of air guiding devices 74 are set to be substantially the same (actually, by a plurality of air guiding The guiding surface formed by the device 74 is a little higher).

Thereby, since the substrate P ₂ is supported by the plurality of air guiding devices 64, 74 in a non-contact manner (in a state in which the friction is substantially negligible), as shown in FIG. 13(B), the substrate P _{2 is} supported by the self-weight The guide faces formed by the plurality of air guiding devices 64, 74 are moved from the plurality of air guiding devices 74 to the plurality of air guiding devices 64. In the same manner as in the above-described first embodiment, after the pre-alignment operation is performed using the X-press pin device 25x (see FIG. 2) or the like, as shown in FIG. 13(C), the plurality of air guiding devices 74 are driven to descend, and This substrate P ₂ is adsorbed and held by the substrate holder 62.

Further, the present third embodiment, the carry-out completion of the exposure of the substrate P by using the substrate P is also _a weight of _1. That is, in parallel with the pre-alignment operation of the substrate P ₂ , the suspension supporting device 50 is configured such that the substrate holding surface formed by the plurality of non-contact clamp devices 52 is inclined with respect to the XY plane, specifically The Z position of the end portion of the +X side (substrate exchange device 70a side) of the substrate holding surface is controlled to be lower than the Z position of the end portion of the -X side, and a plurality of Z actuators 56 are controlled (not shown in FIG. 13(C). Show, refer to Figure 1, etc.).

Further, in the substrate exchange device 70a, each of the plurality of air guiding devices 74 is driven such that the inclination angle of the guide surface formed by the plurality of air guiding devices 74 and the inclination of the substrate holding surface of the suspension supporting device 50 The angles are roughly the same. Thereby, the substrate P ₁ is moved along the guiding surface formed by the substrate holding surface of the suspension supporting device 50 and/or the plurality of air guiding devices 74, and is placed on the plurality of air guiding devices 74. Further, a brake device for stopping the substrate P ₂ carried out from the suspension supporting device 50 at a desired position on the plurality of air guiding devices 74 may be disposed in the substrate exchange device 70.

According to the third embodiment described above, since the substrate exchange device 70a does not have an element for driving the substrate P, the configuration is simple.

Further, the configuration of the liquid crystal exposure apparatus of the third embodiment described above can be appropriately changed. For example, as shown in FIG. 14(B), the support member 54b is configured to be long so that the +X side end portion of the substrate holding surface formed by the plurality of non-contact clamp devices 52 is larger than the substrate. The +X side end portion of the holder 62 protrudes toward the X side, and the protruding portion overlaps the -X side end portion of the air guiding device 74 of the substrate exchange device 70a in the up and down direction. Thereby, the substrate P ₁ can be more smoothly transferred from the suspension supporting device 50b to the plurality of air guiding devices 74.

"Fourth Embodiment"

Next, a fourth embodiment will be described with reference to Figs. 15(A) to 17(B). In the liquid crystal exposure apparatus of the fourth embodiment, the exchange operation of the substrate P on the substrate stage device 60 is performed by the external transfer robot 99 disposed outside the liquid crystal exposure device. In addition, the structure of the substrate stage device 60 is The second embodiment is the same (however, the control is different), and the suspension support device 50b has the suspension support device 50 of the first embodiment except for the fact that the movable stroke in the Z-axis direction is long (see FIG. 1). Etc.) The same composition (however, the control is different). Further, elements corresponding to the substrate exchange device 30 of the first embodiment or the substrate exchange device 70 of the second embodiment are not provided.

FIG 15 (A) show the exposure of the substrate held completion of group P ₁ of the substrate stage device 60 exchange position (depending below the support means 50b) of the state. Further, in the +X side region of the substrate exchange position, the arm member 98 having the external transfer robot 99 supporting the substrate P ₂ is in standby. Further, the standby position of the arm member 98 supporting the substrate P ₂ may be the inside of the processing chamber (not shown) in which the substrate stage device 60 and the suspension supporting device 50b are housed, or may be outside the processing chamber. When the standby position of the arm member 98 supporting the substrate P ₂ is the outside of the processing chamber, the substrate exchange operation on the substrate stage device 60 described below is performed through the opening formed in the processing chamber.

In the fourth embodiment, the arm member 98 of the external transfer robot 99 has a plurality of support portions 98a arranged at predetermined intervals in the Y-axis direction (overlap in FIGS. 15(A) to 17(B)). The substrate stage device 60 has a plurality of air guiding devices 64 (overlapped on the deep side of the paper in FIGS. 15(A) to 17(B)) at a predetermined interval in the Y-axis direction. Further, the plurality of support portions 98a and the plurality of air guiding devices 64 are arranged at intervals in the Y-axis direction so that the positions of the Y-axis directions do not overlap each other in a state where the arm members 98 are positioned above the substrate holder 62 (air guide) The guiding device 64 can pass between the adjacent supporting portions 98a). Therefore, the configuration of the arm member 98 and/or the plurality of air guiding devices 64 of the external transfer robot 99 of the fourth embodiment is substantially different from that of FIG. 2 or FIG. 9, but is used for convenience of explanation. The same symbol is used to illustrate.

As shown in Fig. 15(B), in the fourth embodiment, the exposed substrate P _{1 is} transferred to the overhang support by a plurality of air guiding devices 64 that drive the substrate stage device 60 at the substrate exchange position. Device 50b. Next, FIG. 15 (C), the increase of driving a plurality of the substrate P held _a non-contact clamp means 52, depending on the substrate by means of a support holding surface 50b and a plurality of air guide means 64 formed in the guide A wide space is formed between the faces. Thereafter, as shown in Fig. 16(A), the arm member 98 of the external transfer robot 99 supporting the substrate P ₂ is inserted into the space.

Or less, by 16 (B) As indicated by the arm member 98 is driven downward (also an increase in driving a plurality of air guide 64), the substrate P ₂ are a plurality of air guide means 64 is supported from below, and further by The arm member 98 is driven in the +X direction, and the arm member 98 is retracted from below the suspension support device 50b. Next, as shown in FIG. 16(C), a plurality of air guiding devices 64 are driven down, and the substrate P ₂ is placed on the substrate holder 62. Further, the arm members 98 of the external transfer robot 99 are driven in the +Z direction in parallel. In the transfer operation from the arm member 98 of the external transfer robot 99 to the substrate P ₂ of the substrate holder 62, the substrate P ₁ stands by at the substrate exchange position as in the first to third embodiments.

Hereinafter, FIG. 17 (A), the holding substrate ₂ of the P base substrate stage apparatus 20 away from the substrate exchange position, parallel to the external transfer arm member 99 of the robot arm 98 is driven in the -X direction, whereby arranged in the the lower support means 50b depending, in this state, a plurality of non-contact clip device 52 is driven downward, whereby P ₁ is placed on the substrate 99 of the arm member 98 on the outer transporting robot arm. Hereinafter, the support means is released depending on the substrate P depending 50b of the support ₁ and the support substrate P of the arm member ₁₉₈ in the external device after attracting and holding the substrate P to the _driving direction of + X, the substrate ₁ is conveyed to P (e.g. Coating the developing device). Further, a plurality of non-contact jig devices 52 are driven in parallel in parallel.

According to the fourth embodiment described above, the substrate stage device 60 is Since the transfer operation of the substrate P is performed directly between the external transfer robot arm 99, it is not necessary to provide a device for transporting the substrate P into the liquid crystal exposure device (for example, corresponding to the first embodiment described above (see FIGS. 7(C) to 8). The apparatus of the substrate exchange device 30 of (B)) can simplify the constitution of the liquid crystal exposure apparatus. Further, in the fourth embodiment, the substrate stage device 60 has the same air guiding device 64 as that of the second embodiment. However, since the substrate P does not move along the air guiding device 64, it is also possible to use, for example, lift. A device that does not have a guiding function for the pin device.

In addition, the configurations of the first to fourth embodiments (including the modifications thereof, the same applies hereinafter) described above can be appropriately changed. In the first to fourth embodiments, for example, the non-contact jig device 52 is configured to move the gas at a high speed between the substrate P and the upper surface of the substrate P to apply a force to the substrate P in the direction of gravity (+Z direction). However, the present invention is not limited thereto, and a so-called vacuum that attracts a gas on the upper surface side of the substrate P to cause a force in the +Z direction to act on the substrate P and eject a gas to the substrate P to maintain a gap with the substrate P may be used. Preload air bearing (vacuum preload air bearing).

In the above-described first to fourth embodiments, the substrate P to be carried out is held by the non-contact jig device 52 from above, but the substrate P can be driven from the substrate holders 26 and 62. When leaving, the configuration of the suspension supporting device can be appropriately changed. For example, a plurality of supporting members (for example, an adsorption pad) which are in contact with the end portion of the supporting substrate P from the lower surface side (the region protruding outward from the end portion of the substrate holder 26) are used. 44 (refer to FIG. 1) an L-shaped member that is vertically opposite (and may be used in combination with the non-contact jig device 52) to support the substrate P from above.

In the first and second embodiments, the substrate driving device 36 that moves the substrate P during the loading and unloading of the substrate P is provided in the substrate exchange device 30. However, the substrate driving device 36 is not limited thereto, and may be used in the substrate carrier device 20. The side (or each of the substrate exchange device 30 and the substrate stage device 20) is provided with a device for driving the substrate P.

Further, the above-described first to fourth embodiments (and the modifications), although based on making of completion of exposure of the substrate P ₁ depending supported by the overhanging support means 50 (50a, 50b) for I. substrate P ₂ substrate under the state the holder 26 carrying action, but the action of the step of exchanging the substrate is not limited thereto, for example, can also be used in the substrate ₁ of the substrate P is exposed in the switching operation of the secondary device 30 a pre-transfer substrate P ₂ from the plurality of air guide 38 to overhang the supporting means 50 (in advance I. substrate P ₂ stand to the substrate exchange position), after the substrate P is exposed of _an operation end, from moving to the substrate exchange position of the (50a, 50b) beneath the overhanging support means 50 the substrate holder 26 of _an unloading operation of unloading the substrate P, and thereafter, by the non-contact driving the clamp apparatus 52 is lowered to the substrate P ₂ is placed on the substrate holder 26 with.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Further, as the illumination light, for example, a single-wavelength laser light of an infrared band or a visible light band emitted from a DFB semiconductor laser or a fiber laser may be used, for example, an optical fiber amplifier doped with germanium (or both germanium and germanium). Amplification, using nonlinear optical crystallization to convert wavelengths into harmonics of ultraviolet light. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like can also be used.

In addition, the case where the projection optical system 16 is a multi-lens projection optical system including a plurality of projection optical systems has been described. However, the number of projection optical systems is not limited thereto, and may be one or more. Further, it is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using an OFNER type large-sized mirror. Further, the projection optical system 16 may be an enlarged or reduced system.

Further, the use of the exposure apparatus is not limited to the exposure apparatus for transferring the liquid crystal display element pattern to the liquid crystal panel of the angle type, and may be widely applied to, for example, An exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA wafer are manufactured. Further, in addition to manufacturing a micro component such as a semiconductor element, it is also suitable for use in manufacturing a photomask or a reticle for use in a photo-exposure device, an EUV exposure device, an X-ray exposure device, an electron beam exposure device, or the like. The circuit pattern is transferred to an exposure device such as a glass substrate or a germanium wafer.

Further, the object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask substrate. Further, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film shape (a sheet member having flexibility) is also included. Further, the exposure apparatus of the present embodiment is particularly effective in the case where a substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed.

An electronic component such as a liquid crystal display element (or a semiconductor element) is manufactured by the following steps, that is, a step of performing a function of a device, a performance design, a step of fabricating a photomask (or a reticle) according to the design procedure, and manufacturing. a step of transferring a pattern of a photomask (reticle) to a lithography step of a glass substrate according to the exposure apparatus and the exposure method of the above embodiments, and developing the exposed glass substrate The developing step, an etching step of removing the exposed portion of the portion other than the portion where the resist remains by etching, a resist removing step for removing the resist which is not required for the etching end, a component assembling step, an inspection step, and the like. In this case, in the lithography step, since the exposure method is performed by using the exposure apparatus of each of the above embodiments, the element pattern is formed on the glass substrate, so that a high-complexity element can be manufactured with good productivity.

In addition, the disclosures of all publications, the International Publications, the U.S. Patent, and the U.S. Patent Application Publications, which are incorporated herein by reference, are incorporated by reference.

As explained above, the object exchange method of the present invention is adapted to exchange objects on the object holding device. Further, the method of manufacturing a flat panel display of the present invention is suitable for producing a flat panel display. Further, the component manufacturing method of the present invention is suitable for the production of micro components.

20‧‧‧Substrate stage device

26‧‧‧Substrate holder

30‧‧‧Substrate exchange device

38‧‧‧Air guiding device

40‧‧‧X drive department

44‧‧‧Adsorption pad

50‧‧‧Overhanging support device

52‧‧‧ Non-contact fixture device

P ₁ , P ₂ ‧‧‧ substrates

Claims (26)

An object exchange method comprising: supporting an operation of a support device such that a first object held by a first holding surface of the first object holding device is separated from the first holding surface; and supporting the support device Between the first object and the first holding surface, the second object held by the second holding surface of the second holding device is carried into the first holding surface along the first and second holding surfaces. And an operation of moving the first object out of the support device with respect to the support device after the second object is carried into the first holding surface. The object exchange method according to the first aspect of the invention, wherein the moving the first object is moved along the second holding surface to carry the first object out of the support device. In the object exchange method according to the first aspect of the invention, the second object suspended in the first and second holding faces is carried into the first holding surface. The object exchange method according to claim 1, wherein the first object faces the first object holding device while being held by the first object holding device; and the support operation is performed by the The other surface of the first object is suspended and supported by the support device in a non-contact state. The object exchange method of claim 4, wherein the supporting action is performed by causing a gas to pass through the support device and the first object at a high speed to apply a force upward in a gravity direction to the first object. . For example, the object exchange method of claim 3, wherein the moving operation is The second object is moved along the loading guide surface formed by the first and second holding faces. The object exchange method according to claim 6, wherein the moving out operation moves the first object along a carry-out guide surface formed by the support device and the second holding surface. The object exchange method according to any one of claims 1 to 7, wherein the moving operation and the moving operation are performed by moving the first and second objects using a common driving device. The object exchange method according to claim 8, wherein the moving path of the first object in the moving operation is the same as the moving path of the second object in the moving operation. The object exchange method according to the seventh aspect of the invention, wherein the loading operation includes an operation of moving the second object by the self-weight of the second object, wherein the loading guide surface is inclined with respect to a horizontal plane; The operation includes an operation of moving the first object by the self-weight of the first object by tilting the carry-out guiding surface with respect to a horizontal plane. An object exchange system including: a first object holding device having a first holding surface capable of holding an object; and a second object holding device provided at a position different from the first object holding device in a predetermined direction a second holding surface of the object; the supporting device supports the object above the first holding surface such that the object is separated from the first holding surface; and the object exchange device is supported by the first holding surface and the support The aforementioned object of the device The other object held on the second holding surface moves in the predetermined direction along the first and second holding faces, and is carried into the first holding surface, and the object supported by the supporting device is supported from the support. The device is moved out. The object exchange system of claim 11, wherein the object exchange device moves the object from the support device by moving the object along the second holding surface. The object exchange system of claim 12, wherein the first and second holding surfaces hold the object or the other object in a suspended state; and the object exchange device suspends the object Or the other objects mentioned above move. The object exchange system of claim 11, wherein the object is facing the first object holding device while being held by the first object holding device; the supporting device is another object One side is suspended in a non-contact state. The object exchange system of claim 12, wherein the supporting means acts on the object by passing a gas at a high speed between the object and the object so as to force upward in the direction of gravity. The object exchange system according to claim 13, wherein the object exchange device moves the other object to the first holding surface along a loading guide surface formed by the first and second holding faces. mobile. The object exchange system according to claim 16, wherein the object exchange device moves the object along the carry-out guide surface formed by the support device and the second holding surface to carry the object out. An object exchange system according to any one of claims 11 to 17, wherein The object exchange device moves the other object and the object using a common drive device when the other object is carried in and when the object is carried out. The object exchange system according to claim 18, wherein the object exchange device moves the other object and the object along the same movement path when the other object is carried in and when the object is carried out. The object exchange system of claim 17, wherein the first object holding device and the object exchange device tilt the guiding guide surface relative to a horizontal plane when the other object is carried in, and the weight of the other object is The support device and the object exchange device tilt the guide surface for the carry-out relative to the horizontal plane when the object is carried out, and move the object by the weight of the object. The object exchange system according to claim 20, wherein the face of the support device that faces the object and the second holding surface face at least a part of the face of the object overlaps in the vertical direction. An exposure apparatus comprising: the object exchange system according to any one of claims 11 to 21; and a pattern forming device that forms a predetermined pattern by using the energy beam on the object held by the first object holding device. The exposure apparatus of claim 22, wherein the foregoing system is used for a substrate of a flat panel display device. The exposure apparatus of claim 23, wherein the length of the at least one side of the substrate or the diagonal length is 500 mm or more. A method of manufacturing a flat panel display, comprising: An action of exposing the object by using an exposure apparatus according to any one of claims 22 to 24; and an action of developing the object after exposure. A method of manufacturing a component, comprising: an action of exposing the object by using an exposure device of claim 22; and an action of developing the object after exposure.