CN110520798B - Object exchanging apparatus, object processing apparatus, method for manufacturing flat panel display, method for manufacturing device, object exchanging method, and object processing method - Google Patents

Abstract

In order to shorten the time required for exchanging substrates, an object exchange device is provided with: a first support section (68) that supports a first surface of an object (P1); a second support (152) that receives the object from the first support and supports a second face of the object that is different from the first face; and a driving unit (43) that drives the first support unit (68) that has delivered the object to the second support unit, to an object exchange position where another object (P2) different from the object is carried into the first support unit.

Description

Object exchanging apparatus, object processing apparatus, method for manufacturing flat panel display, method for manufacturing device, object exchanging method, and object processing method

Technical Field

The invention relates to an object exchanging apparatus, an object processing apparatus, a method for manufacturing a flat panel display, a method for manufacturing a device, an object exchanging method, and an object processing method.

Background

In a photolithography process for manufacturing electronic devices such as liquid crystal display devices and semiconductor devices, an exposure apparatus is used in which a pattern formed on a mask (or a reticle) is transferred onto a glass substrate (or a wafer) by an energy beam.

As such an exposure apparatus, there are known the following exposure apparatuses: after the glass substrate on which exposure has been completed on the substrate stage device is carried out by a predetermined substrate carrying device, another glass substrate is carried onto the substrate stage device by the substrate carrying device, whereby the glass substrates held on the substrate stage device are sequentially exchanged and a plurality of glass substrates are continuously subjected to exposure processing (for example, see patent document 1). When a plurality of glass substrates are exposed continuously, it is preferable to exchange the glass substrates on the substrate stage device quickly in order to improve the overall throughput.

Patent document 1: U.S. patent application publication No. 2010/0266961.

Disclosure of Invention

According to a first aspect, there is provided an object exchange device including: a first support portion that supports a first surface of an object; a second support portion that receives the object from the first support portion and supports a second face of the object different from the first face; and a driving unit that drives the first support unit, which has delivered the object to the second support unit, to an object exchange position where another object different from the object is carried into the first support unit.

According to a second aspect, there is provided an object processing apparatus comprising: the above object exchanging apparatus; and a processing unit that performs a predetermined process on the second surface of the object or the other object on the first support unit at a processing position different from the object exchange position.

According to a third aspect, there is provided a method of manufacturing a flat panel display, comprising: exposing an object using the object processing apparatus; and a step of developing the exposed object.

According to a fourth aspect, there is provided a method of manufacturing an element, comprising: exposing an object using the object processing apparatus; and a step of developing the exposed object.

According to a fifth aspect, there is provided an object exchange method comprising: receiving an object having a first surface supported by a first support section, and supporting a second surface of the object, which is different from the first surface, by a second support section; and driving the first support section, which has delivered the object to the second support section, to an object exchange position where another object different from the object is carried into the first support section.

According to a sixth aspect, there is provided an object processing method comprising: the above object exchange method; and performing a predetermined process on the second surface of the object or the other object on the first support section at a process position different from the object exchange position.

Further, the structure of the embodiment described later may be appropriately modified, and at least a part of the structure may be replaced with another structure. Further, the components whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiment, and may be arranged at positions where the functions thereof can be realized.

Drawings

Fig. 1 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to a first embodiment.

Fig. 2 is a plan view of the liquid crystal exposure apparatus (partially omitted) of fig. 1.

Fig. 3 (a) to 3 (c) are views for explaining the operation of the substrate loading device included in the liquid crystal exposure apparatus of fig. 1.

Fig. 4 (a) to 4(c) are views (1) for explaining the substrate exchange operation in the first embodiment.

Fig. 5 (a) to 5 (c) are views (2) for explaining the substrate exchange operation in the first embodiment.

Fig. 6 (a) and 6 (b) are diagrams for explaining the substrate exchange operation in modification 1 of the first embodiment.

Fig. 7 (a) is a diagram schematically showing the configuration of the liquid crystal exposure apparatus according to modification 2 of the first embodiment, and fig. 7 (b) is a plan view of the liquid crystal exposure apparatus (partially omitted) of fig. 7 (a) as viewed from the-Z side.

Fig. 8 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to modification 3 of the first embodiment.

Fig. 9 (a) is a diagram schematically showing the configuration of the liquid crystal exposure apparatus according to the second embodiment, and fig. 9 (b) and 9 (c) are diagrams for explaining the substrate exchange operation in the second embodiment.

Fig. 10 (a) is a diagram schematically showing the configuration of the liquid crystal exposure apparatus according to the third embodiment, and fig. 10 (b) is a diagram (1) for explaining the substrate exchange operation in the third embodiment.

Fig. 11 (a) and 11 (b) are views (2) for explaining the substrate exchange operation in the third embodiment.

Fig. 12 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to a fourth embodiment.

Fig. 13 (a) and 13 (b) are diagrams for explaining the substrate exchange operation in modification 1 of the fourth embodiment.

Detailed Description

First embodiment

First, a first embodiment will be described with reference to fig. 1 to 5 (c).

Fig. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to a first embodiment. Fig. 2 is a plan view (partially omitted) of the liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 is, for example, a so-called scanner, which is a projection exposure apparatus of a step-and-scan method using a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a liquid crystal display device (flat panel display) or the like as an exposure object.

The liquid crystal exposure apparatus 10 includes: an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, a pair of stage bases 18, a substrate stage device 20 that holds a substrate P whose surface (surface facing the + Z side in fig. 1) is coated with a photoresist (a sensitive agent), an overhang supporting device 150, a substrate carry-in device 130, and control systems for these devices. Hereinafter, a direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 during exposure is referred to as an X-axis direction, a direction orthogonal to the X-axis in a horizontal plane is referred to as a Y-axis direction, a direction orthogonal to the X-axis and the Y-axis is referred to as a Z-axis direction, and directions of rotation (inclination) about the X-axis, the Y-axis, and the Z-axis are referred to as θ X, θ Y, and θ Z directions, respectively. The positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The lighting system 12 is configured in the same manner as the lighting system disclosed in, for example, U.S. patent No. 5,729,331. The illumination system 12 irradiates light emitted from a light source (for example, a mercury lamp), not shown, as exposure illumination light (illumination light) IL onto the mask M via a reflecting mirror, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, and the like, not shown, respectively. As the illumination light IL, for example, light such as i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm) or the like (or a composite light of the above-mentioned i-line, g-line, h-line) can be used.

The mask stage 14 holds a mask M of a light transmission type. The mask stage 14 drives the mask M in the X-axis direction (scanning direction) by a predetermined long stroke with respect to the illumination system 12 (illumination light IL) via a drive system (not shown) including, for example, a linear motor, and performs fine driving in the Y-axis direction and the θ z direction. The positional information on the horizontal plane of the mask M is obtained by a mask stage position measurement system (not shown) including, for example, a laser interferometer or an encoder.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having a configuration similar to that of the projection optical system disclosed in U.S. patent nos. 6, 552, 775 and the like, and includes, for example, a plurality of optical systems of double-sided telecentricity for forming an erected erect image.

In the liquid crystal exposure apparatus 10, when the mask M located in a predetermined illumination region is illuminated by the illumination light IL from the illumination system 12, a projection image (image of a partial pattern) of the pattern of the mask M in the illumination region is formed in an exposure region on the substrate P via the projection optical system 16 by the illumination light passing through the mask M. Then, the mask M is moved relatively in the scanning direction with respect to the illumination region (illumination light IL), and the substrate P is moved relatively in the scanning direction with respect to the exposure region (illumination light IL), whereby scanning exposure of one irradiation region on the substrate P is performed, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the irradiation region. Here, the illumination region on the mask M and the exposure region (illumination region of illumination light) on the substrate P are in an optically conjugate relationship with each other by the projection optical system 16.

The pair of stage bases 18 are each formed of a member extending in the Y-axis direction, and are arranged apart in the X-axis direction. The stage base 18 is provided on the floor 11 of the clean room via a plurality of vibration isolators 17.

(substrate table device 20)

Substrate stage device 20 is configured in the same manner as the substrate stage device disclosed in, for example, international publication No. 2016/169176. The substrate stage device 20 has an X coarse movement stage 40, a Y coarse movement stage 30, a weight canceling device 50, a substrate table 60, a substrate holder 68, and a substrate carrier 70.

The X coarse movement stage 40 and the Y coarse movement stage 30 are devices for driving the substrate table 60 in the X axis direction and the Y axis direction by predetermined long strokes, respectively. The X coarse movement stage 40 is driven by an X drive mechanism 43 in the X axis direction by a predetermined stroke. Further, the Y coarse movement stage 30 is driven by a Y drive mechanism 33 in the Y axis direction by a predetermined stroke.

The weight cancellation device 50 generates a force in the upward direction of gravity to support the self weight of the system including the substrate table 60 and the substrate holder 68. As the structure of the weight cancellation device 50, for example, the same structure as that of the weight cancellation device disclosed in U.S. patent application publication No. 2010/0018950 can be used.

The substrate stage 60 is formed of a rectangular member in a plan view with the X-axis direction as the longitudinal direction. The center portion of the substrate table 60 is supported from below by the weight compensation device 50 via a spherical bearing device (not shown).

The substrate stage 60 is mechanically connected to the X coarse movement stage 40 via a plurality of flexure (flexure). The substrate table 60 is restricted in the directions parallel to the XY plane (X-axis, Y-axis, θ Z-direction) with respect to the X coarse movement stage 40 by the plurality of curved portions, and is in a state of being relatively movable in a minute range in the directions intersecting the XY plane (Z-axis, θ X, θ Y-direction) with respect to the X coarse movement stage 40. The substrate table 60 is pulled by the X coarse movement stage 40 via any one of the four curved portions, for example, and thereby moves in at least one of the X axis and the Y axis directions integrally with the X coarse movement stage 40.

The substrate stage 60 is driven slightly in the Z-axis direction, the θ X direction, and the θ y direction (hereinafter, referred to as Z tilt direction) with respect to the X coarse movement stage 40 via a plurality of Z voice coil motors (voice coil motors) 64. The Z voice coil motors 64 may be provided corresponding to the four corners of the substrate stage 60, for example, four, but are not limited thereto, as long as they are provided at least at three positions not on the same straight line. The positional information in the Z/tilt direction of the substrate stage 60 is obtained by a main control unit (not shown) using a plurality of Z sensors including a probe (probe) fixed to the lower surface of the substrate stage 60 and a target fixed to the weight compensation device 50. The Z sensors are arranged at, for example, four (at least three) at predetermined intervals around an axis parallel to the Z axis. A main control device (not shown) controls the Z tilt position of the substrate stage 60 (i.e., the substrate P) based on the outputs of the plurality of Z sensors.

A plurality of (e.g., four) guide plates 66 are fixed to the lower surface of the substrate table 60 in a cantilever-supported state. For example, four guide plates 66 are radially arranged to project (+ shape) outward of the substrate table 60 from respective ends of the substrate table 60 on the + X side, the-X side, the + Y side, and the-Y side. The flatness of the upper surface of the guide plate 66 is finished very high.

The substrate holder 68 for supporting the substrate P is formed of a plate-like member having a rectangular shape in a plan view with the X-axis direction as the longitudinal direction, and is fixed to the upper surface of the substrate table 60. The substrate holder 68 is longer in the longitudinal direction and the width direction than the substrate table 60, and is set to be substantially the same as (substantially slightly shorter than) the substrate P in the longitudinal direction and the width direction. The substrate P is placed on the upper surface of the substrate holder 68. A plurality of fine holes, not shown, are formed in the upper surface of the substrate holder 68.

A pressurized gas supply device for supplying a pressurized gas (for example, air) and a vacuum suction device (both not shown) are connected to the substrate holder 68. The substrate holder 68 ejects the pressurized gas (compressed air) supplied from the pressurized gas supply device to the lower surface of the substrate P through a part of the plurality of minute holes, thereby interposing the gas between the lower surface of the substrate P and the upper surface of the substrate holder 68 (i.e., forming a gas film). Further, the substrate holder 68 uses a vacuum suction device to suck the gas between the upper surface of the substrate holder 68 and the lower surface of the substrate P through the remaining minute holes, and applies a force (preload) in the direction of gravity downward to the substrate P, thereby imparting rigidity in the direction of gravity to the gas film.

The substrate holder 68 applies a force (for example, a force for correcting or correcting the flatness) for controlling the flatness to the substrate P while supporting the substrate P in a non-contact manner by floating the substrate P in the gravity direction (Z-axis direction) via a minute gap by balancing the pressure and flow rate of the pressurized gas and the vacuum suction force. Therefore, the substrate holder 68 restricts the substrate P in the Z-tilt direction, but does not restrict the substrate P in the three-degree-of-freedom direction in the horizontal plane. In addition, in the substrate holder 68, the distance between the substrate P and the substrate holder 68 can be controlled by balance adjustment (hereinafter, referred to as air adjustment) between ejection (air supply) of the pressurized gas and vacuum suction (air suction). The air adjustment can be controlled in accordance with the position of the upper surface of the substrate holder 68. The substrate holder 68 is disposed so as to be able to support at least a portion of the lower surface of the substrate P corresponding to an irradiation region on the substrate P (i.e., a region to which the pattern of the mask M is transferred). Therefore, the upper surface of the substrate holder 68 for supporting the substrate P is preferably set to a size capable of supporting at least one irradiation region formed on the substrate P. In the present embodiment, the substrate P is supported in a non-contact manner while a force for directing the gravity downward is applied to the substrate P by the ejection of the pressurized gas and the vacuum suction, but the present invention is not limited to this, and the substrate P may be supported in a non-contact manner while a force for directing the gravity downward is applied to the substrate P by the Bernoulli effect (Bernoulli effect) while the gas is passed between the substrate P and the substrate holder 68 at a high speed.

The substrate carrier 70 has a base 72 and a carrier body 74. As shown in fig. 2, the base 72 is a frame-shaped member having a rectangular shape in plan view (as viewed from the + Z side). The substrate stage 60 is disposed in an opening formed in the base 72 and having a rectangular shape in a plan view.

Four air bearings 78 are fixed to the lower surface of the base 72 so as to correspond to, for example, the four guide plates 66 fixed to the substrate table 60. For example, four air bearings 78 are disposed to face the upper surface of the guide plate 66 corresponding to the bearing surfaces (gas ejection surfaces), respectively, and eject pressurized gas (e.g., compressed air) from the bearing surfaces to the upper surface of the corresponding guide plate 66. The base 72 is suspended on, for example, the four guide plates 66 via a minute gap by the static pressure of the pressurized gas ejected from, for example, the four air bearings 78 to the corresponding guide plates 66.

A driving mechanism (e.g., a voice coil motor of an electromagnetic force driving system) for driving the substrate carrier 70 in the X-axis direction and the Y-axis direction is attached to a wall surface defining the opening of the base 72.

As shown in fig. 2, the carrier body 74 is formed of a U-shaped member in a plan view with the + X side open, for example. The carrier body 74 is placed on the upper surface of the base 72 and fixed to the base 72. The substrate holder 68 is disposed inside the carrier main body 74. Further, a gap is formed between the inner wall surface of the carrier body 74 and the side surface of the substrate holder 68 to such an extent that the substrate carriers 70 do not contact each other even when driven slightly in the three degrees of freedom directions (X-axis, Y-axis, θ z-direction) in the horizontal plane with respect to the substrate table 60.

As shown in fig. 1, a substrate P is placed on the carrier body 74. The vicinity of the end portions of the substrate P on the + X side, -X side, + Y side, and-Y side is a region where the mask pattern is not transferred (hereinafter referred to as a blank region), and the blank region is supported by the carrier main body 74 from below in a state where the substrate P is placed on the carrier main body 74. Further, a plurality of fine holes, not shown, are formed in the upper surface of the carrier main body 74. The carrier main body 74 is connected to a vacuum suction device, not shown, and can suction and hold a blank area of the substrate P through the plurality of holes.

As described above, the substrate holder 68 restricts the substrate P in the Z/tilt direction, but does not restrict the substrate P in the three degrees of freedom directions (X direction, Y direction, θ Z direction) in the horizontal plane. Thus, the substrate P is driven in three degrees of freedom using the substrate carrier 70. The main controller (not shown) drives the substrate carrier 70 in the X-axis direction and the Y-axis direction slightly with respect to the substrate table 60 by a driving mechanism (e.g., a voice coil motor of an electromagnetic force driving method) that drives the substrate carrier 70 in the X-axis direction and the Y-axis direction. The main controller (not shown) drives the substrate carrier 70 in the θ z direction with respect to the substrate table 60 by a driving mechanism (e.g., a voice coil motor of an electromagnetic force driving system) that drives the substrate carrier 70 in the X-axis direction or the Y-axis direction.

In substrate stage device 20 described above, substrate holder 68 and substrate carrier 70 are arranged in non-contact with each other and have a physically (mechanically) separated structure, and substrate carrier 70 and substrate P can be driven very slightly without driving substrate holder 68. That is, the substrate carrier 70 can drive the substrate P relative to the substrate holder 68. This enables highly accurate positioning even when the substrate P is held in a non-contact manner.

(suspension support 150)

The suspension support device 150 is used together with the substrate carry-in device 130 for carrying out the substrate P held by the substrate holder 68 from the substrate holder 68. The suspension support device 150 is disposed so as to be positioned above the substrate holder 68 in a state where the substrate stage device 20 is positioned at the substrate exchange position.

The suspension support device 150 is provided with a non-contact support device 152. In the first embodiment, the noncontact support device 152 is attached to the reference plate 100 (not shown in fig. 1, see fig. 4 (a), etc.) to which the projection optical system 16 is attached.

A plurality of fine holes (not shown) are formed in the lower surface of the non-contact support device 152, and a pressurized gas supply device for supplying a pressurized gas (for example, air) and a vacuum suction device (both not shown) are connected to the non-contact support device 152. The non-contact support device 152 ejects the pressurized gas (compressed air) supplied from the pressurized gas supply device to the upper surface of the substrate P through a part of the plurality of minute holes, and sucks the gas between the lower surface of the non-contact support device 152 and the upper surface of the substrate P through the remaining minute holes by using the vacuum suction device. Further, the non-contact supporting device 152 supports the substrate P in a non-contact manner through a minute gap in the gravity direction (Z-axis direction) by the balance between the pressure and flow rate of the pressurized gas and the vacuum suction force. In the present embodiment, the substrate P is supported in a non-contact manner while a force for upward gravitational force is applied to the substrate P by both the ejection of the pressurized gas and the vacuum suction, but the present invention is not limited to this, and the substrate P may be supported in a non-contact manner while a force for upward gravitational force is applied to the substrate P by the bernoulli effect, for example, by passing the gas at a high speed between the substrate P and the non-contact support device 152. That is, the supporting method is not limited as long as the upper surface of the substrate P is supported without contacting the non-contact supporting device 152.

The suspension support device 150 includes a substrate stopper (not shown) for restricting an unintentional movement of the substrate P supported in a non-contact manner in a direction parallel to the XY plane, in the vicinity of the ends of the non-contact support device 152 on the + X side, -X side, + Y side, and-Y side. This is because the substrate P is restricted by the noncontact support device 152 in the Z/tilt direction, but the substrate P cannot be restricted in the three degrees of freedom directions (X direction, Y direction, θ Z direction) in the horizontal plane, and the substrate P supported in noncontact is moved. The substrate stopper is disposed so as to surround the outer periphery of the substrate P. The number of substrate stoppers is not particularly limited as long as the substrate P can be restricted from being inadvertently moved.

In the first embodiment, one non-contact support device 152 is arranged, but the size, number, and arrangement of the non-contact support devices 152 are not limited to this. The noncontact support device 152 may be changed as appropriate according to the size of the substrate P, for example, so long as a space is formed between the substrate subjected to exposure and the substrate holder 68 so that a new substrate P can be loaded onto the substrate holder.

(substrate carrying-in device 130)

The substrate loading device 130 carries in the substrate P with respect to the empty (not holding the substrate P) substrate holder 68. The substrate loading device 130 carries out the substrate P subjected to exposure supported by the above-described suspension support device 150. As shown in fig. 1, substrate carry-in device 130 is disposed in the + X side region of substrate stage device 20 and is provided on floor 11. Thus, the vibration generated by substrate loading device 130 is not transmitted to substrate stage device 20. Substrate stage device 20 and substrate loading device 130 are housed in a chamber, not shown, included in liquid crystal exposure apparatus 10.

The substrate loading device 130 includes a substrate moving device 136, an air guide 138, and an air guide driving mechanism 133.

The substrate moving device 136 moves the substrate P to be carried in or carried out during the exchange operation of the substrate P on the substrate holder 68. The substrate transfer device 136 is configured in the same manner as the substrate transfer device disclosed in, for example, international publication No. 2014/024483. The substrate moving device 136 includes an X drive mechanism 140, a support 142, and a suction pad 144. The X drive mechanism 140 linearly drives the adsorption pad 144 in the X axis direction, for example, with a stroke approximately equal to the dimension of the substrate P in the X axis direction. As the X drive mechanism 140, for example, a linear motor, a feed screw device, a belt drive device, or the like may be used.

The suction pad 144 is formed of a member having an inverted L-shaped XZ cross section, and a portion parallel to the XY plane is formed in a rectangular plate shape in a plan view. The suction pad 144 is connected to a vacuum apparatus, not shown, and the upper surface of the portion parallel to the XY plane functions as a substrate suction surface. One surface of the portion of the suction pad 144 parallel to the YZ plane faces one surface (surface facing the-X side) near the upper end of the pillar 142. The suction pad 144 is attached to be movable in the Z-axis direction with respect to the support 142 via a Z-axis drive mechanism 146 fixed to one surface (the "X-side surface") of the support 142. The suction pad 144 is driven in the Z-axis direction by a Z actuator 148 (e.g., an air cylinder) between a position where the upper surface (substrate suction surface) protrudes to the + Z side from the upper surfaces of the substrate holder 68 and the two air guides 138, and a position where the upper surface is lowered from the upper surfaces of the substrate holder 68 and the two air guides 138.

The air guide 138 in the present embodiment is formed of a rectangular parallelepiped member whose longitudinal direction is the X-axis direction. The air guide 138 is appropriately driven by a predetermined stroke in the X-axis direction by the air guide driving mechanism 133. The air guide 138 can be driven in the Z-axis direction by a Z actuator 137 (e.g., an air cylinder).

As shown in fig. 2, the gas guides 138 are disposed apart from each other at predetermined intervals so as to be capable of substantially uniformly supporting the lower surface of the substrate P. In the present first embodiment, the substrate P is supported from below by two gas guides 138. The size, number, and arrangement of the gas guides 138, the shape of the substrate guide surface formed by the gas guides 138, and the like can be changed as appropriate, for example, according to the size of the substrate P.

As shown in fig. 2, a plurality of minute holes are formed in the upper surface of the gas guide 138, and a pressurized gas supply device and a vacuum suction device (both not shown) may be selectively connected to the gas guide 138. The gas guide 138 can suspend and support (non-contact support) the substrate P placed on the upper surface thereof by the pressurized gas supplied from the pressurized gas supply device through the plurality of holes, and can suction and hold the substrate P placed on the upper surface thereof by the vacuum suction force supplied from the vacuum suction device through the plurality of holes (or other holes). The air guide 138 may be configured to have a dimension in the Y direction slightly shorter than the substrate P, and the substrate moving device 136 may be disposed on both sides of the air guide 138 in the Y direction. As a result, when the substrate moving device 136 is provided at the center of the gas guide 138, the substrate P can be prevented from being bent without being blown by the pressurized gas to the center of the substrate P by the X drive mechanism 140.

Here, the carrying-in operation of the substrate P using the substrate carrying-in device 130 will be described with reference to fig. 3 (a) to 3 (c). In the liquid crystal exposure apparatus 10 according to the first embodiment, the loading operation of the substrate P into the substrate holder 68 is performed in a state where the substrate holder 68 is located at the predetermined substrate exchange position. The substrate exchange position is set, for example, in the vicinity of the + X-side end of the movable region of the X coarse movement stage 40.

When the substrate P is carried into the substrate stage device 20 by using the substrate carry-in device 130, the Z position of the substrate holder 68 is positioned so that the Z position of the upper surface of the substrate holder 68 and the Z positions of the upper surfaces of the two air guides 138 become substantially the same (or so that the substrate holder 68 side becomes slightly lower). Thus, the substrate guide surface formed by the two gas guides 138 forms a continuous guide surface with the upper surface of the substrate holder 68.

The substrate loading device 130 drives the suction pad 144, which sucks and holds the central portion in the Y axis direction in the vicinity of the + X side end portion of the substrate P, in the-X direction. Thereby, the substrate P moves along the guide surface.

When the + X-side end of the substrate P reaches a predetermined position as shown in fig. 3 (b), the suction pad 144 releases the suction holding of the substrate P and is driven in the + X direction as shown in fig. 3 (c). In addition, in the moving process of the substrate P shown in fig. 3 (a), the suction holding of the substrate P by the suction pad 144 may be released, the suction pad 144 may be separated from the substrate P, and the substrate P may be moved by the inertial force.

In the liquid crystal exposure apparatus 10 (see fig. 1) configured as described above, under the management of a main control device (not shown), the mask M is loaded onto the mask stage 14 by a mask loader (not shown), and the substrate P is loaded onto the substrate holder 68 by the substrate loading device 130. Thereafter, alignment measurement is performed by the main controller using an alignment detection system, not shown, and after the alignment measurement is completed, the step-and-scan exposure operation is sequentially performed on a plurality of irradiation regions set on the substrate P. Note that this exposure operation is the same as the exposure operation of the step-and-scan method that has been performed conventionally, and therefore, a detailed description thereof is omitted. Then, the substrate P on which the exposure process has been completed is retracted from the substrate holder 68 by the suspension support device 150, and another substrate P to be exposed next is carried to the substrate holder 68 by the substrate carrying-in device 130. This allows the exchange of the substrates P on the substrate holder 68, and the exposure operation and the like are continuously performed on the plurality of substrates P.

Next, the exchange operation of the substrate P on the substrate holder 68 in the liquid crystal exposure apparatus 10 according to the first embodiment will be described with reference to fig. 4 (a) to 5 (c). The substrate on the substrate holder 68 after exposure is referred to as a substrate P1, and a new substrate transferred onto the substrate holder 68 is referred to as a substrate P2. The following substrate exchange operation is performed under the management of a main control device, not shown. For simplicity of illustration, substrate stage device 20, substrate loading device 130, and suspension support device 150 are simplified in fig. 4 a to 5 c (some elements are not shown).

As shown in fig. 4 (a), when substrate stage device 20 having finished the exposure processing reaches the substrate exchange position, vacuum suction force is weakened by substrate holder 68, and substrate carrier 70 releases suction holding of substrate P1 by carrier main body 74.

Next, as shown in fig. 4 (b), the substrate holder 68 increases the pressure and/or flow rate of the pressurized gas supplied from the pressurized gas supply device, and applies levitation force (levitation force) to the lower surface of the substrate P1 so that the distance between the lower surface of the substrate P1 and the substrate holder 68 is increased. Thereby, the substrate P1 floats on the substrate holder 68. The suspended substrate P1 is received by the suspended support 150 by vacuum suction of the non-contact support 152 of the suspended support 150. Thereby, the lower surface of the substrate P1 is separated from the upper surface of the substrate holder 68.

On the other hand, in the substrate loading device 130, pressurized gas is ejected from the two gas guides 138 to the lower surface of the substrate P2, and the substrate P2 is levitated above the two gas guides 138. Further, the suction pad 144 sucks and holds the lower surface of the substrate P2.

Thereafter, as shown in fig. 4(c), the suction pad 144 is driven in the-X direction. Thereby, the substrate P2 moves along the guide surface formed by the upper surfaces of the two gas guides 138 and the upper surface of the substrate holder 68.

As shown in fig. 5 (a), when carrier body 74 suction-holds substrate P2 after substrate P2 is carried onto substrate holder 68, substrate stage device 20 moves from the substrate exchange position to a predetermined exposure operation start position for the exposure operation of substrate P2, as shown in fig. 5 (b).

When substrate stage device 20 is moved away from the substrate exchange position, as shown in fig. 5 (b), air guide 138 and suction pad 144 of substrate loading device 130 are driven to be raised. At this time, the suction pad 144 is positioned at a height (Z position) at which the upper surface of the suction pad 144 can suck and hold the lower surface of the substrate P1.

Thereafter, as shown in fig. 5 (c), the suction pad 144 suction-holding the lower surface of the substrate P1 is driven in the + X direction, whereby the substrate P1 moves along the guide surface formed by the lower surface of the non-contact supporting device 152 and the upper surfaces of the two air guides 138. That is, the substrate loading device 130 can load the substrate P1. Thus, the substrate loading device 130 functions as a substrate unloading device, and can perform loading and unloading operations of a substrate, and therefore, may be collectively referred to as a substrate conveying device.

Thereafter, the substrate P1 is carried out to the outside of the liquid crystal exposure apparatus 10 (see fig. 1) by a hand of an external transfer robot (not shown).

As described above in detail, according to the first embodiment, the liquid crystal exposure apparatus 10 includes: a substrate holder 68 that supports the lower surface of the substrate P1; a suspended support device 150 (non-contact support device 152) that receives the substrate P1 from the substrate holder 68 and supports the upper surface of the substrate P1; and an X drive mechanism 43 that drives the substrate holder 68 to be carried into the substrate exchange position of the substrate holder 68 toward the substrate P2. Accordingly, since the substrate P2 is carried in while the exposed substrate P1 is kept waiting at the substrate exchange position (subsequently retreated from the carry-in path of the substrate P2 to be exposed), and the substrate P1 is carried out from the waiting position after the transfer of the substrate P2 to the substrate stage device 20, the time required for substrate exchange can be shortened, for example, compared to a case where the carry-in operation of the substrate P2 to the substrate stage device 20 is started after the carry-out operation of the exposed substrate P1 is completed.

In the above description, after substrate stage device 20 reaches the substrate exchange position, substrate holder 68 attenuates the vacuum suction force and applies the levitation force to the lower surface of substrate P1, but the present invention is not limited to this. The substrate holder 68 may apply a levitation force to the lower surface of the substrate P1 while reducing the vacuum suction force before the substrate stage device 20 reaches the substrate exchange position (for example, when the + X-side end of the substrate holder 68 reaches the vicinity of the center of the non-contact support device 152 in the X-axis direction). Accordingly, the transfer of substrate P1 to noncontact support device 152 can be started before substrate stage device 20 reaches the substrate exchange position, and the time taken for substrate exchange can be further shortened. Further, the timing at which the substrate holder 68 attenuates the vacuum suction force and imparts the levitation force to the lower surface of the substrate P1 can be appropriately determined within a range in which the substrate P1 can be appropriately received by the noncontact support device 152 without coming into contact with other components such as the reference plate 100.

In addition, according to the first embodiment, the substrate holder 68 applies the levitation force to the substrate P1 so that the substrate P1 is supported by the non-contact support device 152. Accordingly, the substrate holder 68 can move the substrate P1 to a position where the noncontact support device 152 can support the substrate P1 using an already-provided device (pressurized gas supply device), and thus the structure of the substrate stage device 20 can be simplified.

In the first embodiment, the substrate holder 68 applies a levitation force to the substrate P1 so that the distance between the lower surface of the substrate P1 and the substrate holder 68 is increased. When the lower surface of the substrate P1 is separated from the substrate holder 68, a new substrate P2 can be loaded, and therefore, the time required for substrate exchange can be further shortened.

In the first embodiment, the substrate loading device 130 loads the substrate P2 between the substrate holder 68 and the substrate P1 so that the substrate P2 is supported by the substrate holder 68. Thus, the substrate P2 can be carried into the substrate holder 68 without carrying out the substrate P1, and therefore, the time required for substrate exchange can be shortened.

In the first embodiment, the substrate holder 68 applies a force capable of levitating and supporting the substrate P1 or the substrate P2 to the substrate P1 or the substrate P2, and the substrate loading device 130 loads the levitating and supported substrate P2 into the substrate holder 68. This allows the substrates P1 and P2 to be exchanged without damaging them.

In the first embodiment, the substrate loading device 130 loads the substrate P1 out of the noncontact support device 152. This eliminates the need for a separate substrate unloading device, and simplifies the structure of the liquid crystal exposure apparatus 10.

In the first embodiment, the liquid crystal exposure apparatus 10 includes the substrate carrier 70, and the substrate carrier 70 holds the substrate P2 that is carried into the substrate holder 68 by the substrate carrying-in device 130 and is suspended and supported by the substrate holder 68, and drives the substrate P2 relative to the substrate holder 68. This enables to position suspended and supported substrate P2 with high accuracy.

In the first embodiment, the noncontact support device 152 supports the substrate P1 whose holding by the substrate carrier 70 is released. Thereby, the substrate P1 can be delivered from the substrate holder 68 to the noncontact supporting device 152.

In the first embodiment, the non-contact supporting device 152 controls the gas between the upper surface of the substrate P1 and the non-contact supporting device 152, and supports the upper surface of the substrate P1 in a non-contact manner. This allows supporting the substrate P1 without damaging the exposed surface of the exposed substrate P1.

(modification 1)

In the liquid crystal exposure apparatus 10a according to modification 1 of the first embodiment, the substrate loading device 130a further includes a pressurized gas supply device (not shown) that supplies a pressurized gas (for example, air). The other configurations are the same as those of the liquid crystal exposure apparatus 10 according to the first embodiment, and therefore, detailed description thereof is omitted.

The substrate exchange operation in modification 1 will be described with reference to fig. 6 (a) and 6 (b).

In the liquid crystal exposure apparatus 10a, when the substrate stage device 20 reaches the substrate exchange position, as shown in fig. 6 (a), the substrate carry-in device 130a blows the pressurized gas AIR1 to the lower surface of the + X-side end portion of the substrate P1 on the substrate holder 68, thereby applying an upward force to the lower surface of the substrate P1. That is, the substrate carry-in device 130a assists the operation of delivering the + X-side end of the substrate P1 to the noncontact support device 152. Thereby, the substrate P1 is supported by the non-contact support device 152 in order from the + X-side end to the-X-side end.

When the lower surface of the + X-side end of the substrate P1 is separated from the upper surface of the substrate holder 68, the substrate loading device 130 loads the substrate P2 into the substrate holder 68 from the + X side toward the-X side, as shown in fig. 6 (b). The substrate holder 68 reduces the pressure and/or flow rate of the pressurized gas from the point where the substrate P1 is handed over to the non-contact support device 152, and starts the suction of the gas without contact supporting the substrate P2. Thus, the board P2 can be gradually carried into the substrate holder 68 from the position where the board P1 is delivered to the noncontact support device 152 (the position where the board P1 is separated from the substrate holder 68). The substrate holder 68 may reduce the pressure and/or flow rate of the pressurized gas from the position where the substrate P1 is transferred to the noncontact support device 152, and after the entire substrate P2 is transferred onto the substrate holder 68, the suction of the gas may be started to support the substrate P2 in noncontact.

As described above in detail, according to modification 1 of the first embodiment, the substrate carry-in device 130a carries in the substrate P2 to the substrate holder 68 supporting a part of the substrate P1 (the side end portion at the-X side in modification 1). Accordingly, even in a state where a part of the substrate P1 is supported by the substrate holder 68, the carrying-in of the substrate P2 into the substrate holder 68 can be started, and therefore, the time taken for substrate exchange can be further shortened.

In modification 1, the substrate loading device 130a loads the substrate P2 from the side of the substrate holder 68 that supports one end (+ X-side end) of the substrate P1 to the side that supports the other end (-X-side end). Accordingly, even in a state where the other end portion of the substrate P1 is supported, the carrying-in of the substrate P2 can be started, and thus the time taken for substrate exchange can be further shortened.

In modification 1, the substrate loading device 130a applies a force to the lower surface (first surface) of the substrate P1 so that the substrate P1 is delivered to the noncontact support device 152 while the substrate P2 is loaded into the substrate holder 68. Accordingly, the substrate P2 can be carried into the substrate holder 68 while the substrate P1 is transferred to the noncontact support device 152, and therefore the time required for substrate exchange can be further reduced.

In the substrate loading device 130a according to modification 1 described above, the gas guide 138 may be provided with a pressurized gas supply device (not shown) for blowing out pressurized gas that applies force to the lower surface of the substrate P1.

In modification 1, the substrate loading device 130a may blow the pressurized gas AIR1 to the lower surface of the substrate P1 before the substrate stage device 20 reaches the substrate exchange position.

(modification 2)

Fig. 7 (a) and 7 (b) show the configuration of a liquid crystal exposure apparatus 10b according to modification 2 of the first embodiment. The suspension support device 150a included in the liquid crystal exposure apparatus 10b of modification 2 includes a plurality of (e.g., four) substrate conveyance devices 158. The other configurations are the same as those of the liquid crystal exposure apparatus 10 according to the first embodiment, and therefore, detailed description thereof is omitted.

The substrate conveyance device 158 includes a holding portion 158a that holds a part of the lower surface of the substrate P1, and a driving member 158b that drives the holding portion 158a in the Y-axis direction and the Z-axis direction. The driving member 158b is attached to the reference plate 100. The holding portion 158a is, for example, a suction pad connected to a vacuum device not shown.

In liquid crystal exposure apparatus 10b of modification 2, when substrate stage device 20 reaches the substrate exchange position, drive member 158b drives holding portion 158a in the-Z direction, and performs alignment so that the Z position of the upper surface of holding portion 158a is slightly lower than the Z position of the lower surface of substrate P1. At this time, the Y position of the end portion of the holding portion 158a on the side of the board P1 is adjusted to a position not touching the board P1.

Thereafter, the holding portion 158a is driven in the Y-axis direction by the driving member 158b so that the holding portion 158a can hold the lower surface of the substrate P1, and thereafter, the holding portion 158a is driven in the + Z direction, whereby a part of the substrate P1 is held by the holding portion 158 a. Thereby, a part of the substrate P1 is held by the suspension support device 150 a. Thereafter, the driving member 158b further drives the holding portion 158a in the + Z direction (toward the substrate exchange position side) so that the other portion of the substrate P1 is contactlessly supported by the noncontact support device 152. Thus, the substrate P1 is separated from the substrate holder 68, and the substrate loading device 130 can load the substrate P2 onto the substrate holder 68.

Thereafter, the upper surface of the substrate P1 is held in a noncontact manner by the noncontact supporting device 152. At this time, the holding portion 158a functions as a drop preventing portion that holds the lower surface of the substrate P1 so that the substrate P1 that is contactlessly supported by the noncontact support device 152 does not drop.

The driving member 158b may drive the holding portion 158a not only in the Y-axis direction and the Z-axis direction but also in the X-axis direction. Before substrate stage device 20 reaches the substrate exchange position, driving member 158b drives holding unit 158a in the-Z direction, positions holding unit 158a so that the Z position of the upper surface of holding unit 158a is slightly lower than the Z position of the lower surface of substrate P1, and drives holding unit 158a in the Y-axis direction to hold a part of substrate P1. Thereafter, the holding portion 158a holding part of the substrate P1 may be driven in the + Z direction and the + X direction while driving the substrate holder 68 in the X axis direction so as to face the substrate exchange position. The holding portion 158a may have a length similar to that of the board P1, and the board P1 may be driven to slide on the holding portion 158a without being driven in the + X direction. Thus, when the substrate holder 68 reaches the substrate exchange position, the substrate P2 can be carried in because the substrate is not present on the substrate holder 68. This can reduce the time required for substrate exchange.

As described above in detail, according to modification 2 of the first embodiment, the suspension support device 150a includes the holding portion 158a that holds a part of the board P1, and the driving member 158b that drives the holding portion 158a so that a part of the board P1 is held by the suspension support device 150 a. Further, the driving member 158b drives the holding portion 158a holding a part of the substrate P1 toward the substrate exchange position side so that the other part of the substrate P1 is supported by the suspension support device 150a (the non-contact support device 152). Thus, even if the pressure and flow rate of the pressurized gas supplied from the pressurized gas supply device are not increased in the substrate holder 68 to make the substrate P1 float high, the substrate P1 can be separated from the substrate holder 68 and the substrate P1 can be supported by the non-contact supporting device 152.

The suspension support device 150a includes a holding portion 158a that holds the lower surface side of the substrate P1 so that the substrate P1 supported in a non-contact manner does not fall. This prevents the substrate P1 contactlessly supported by the noncontact support device 152 from dropping and damaging the new substrate P2 or the like.

Further, in modification 2 of the first embodiment described above, the holding portion 158a also serves as a drop prevention portion, but the suspension support device 150a may also be provided with a drop prevention device that is different from the holding portion 158a and holds the lower surface side of the substrate P1 so that the substrate P1 supported without contact does not drop.

(modification 3)

In the first embodiment and the modifications 1 and 2 thereof, the suspension support device is attached to the reference plate 100 to which the projection optical system 16 is attached, but the suspension support device may be disposed separately from the reference plate 100.

Fig. 8 schematically shows the configuration of a liquid crystal exposure apparatus 10c according to modification 3 of the first embodiment. In the liquid crystal exposure apparatus 10c according to modification 3, as shown in fig. 8, the suspension support device 150b includes a suspension support device mounting frame 151 and is disposed apart from the reference plate 100 on which the projection optical system 16 is mounted. This can prevent vibrations from the suspension support device 150b from being transmitted to the projection optical system 16. The other configurations are the same as those of the liquid crystal exposure apparatus 10 according to the first embodiment, and therefore, detailed description thereof is omitted.

Second embodiment

Next, the second embodiment will be described with reference to fig. 9 (a) to 9 (c). In the second embodiment to be described below, the same reference numerals as those in the first embodiment are given to the same components as those in the first embodiment and the modifications thereof, and the description thereof is omitted. In the second embodiment, substrate stage device 20 (substrate holder 68) is driven to the substrate exchange position by X drive mechanism 43.

Fig. 9 (a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10d according to the second embodiment. As shown in fig. 9 (a), in the second embodiment, the suspension support device 150c is disposed separately from the reference plate 100 to which the projection optical system 16 is attached. The suspension support device 150c includes a drive device 153 for moving the non-contact support device 152 up and down. The driving device 153 is mounted to the suspension support device mounting frame 151.

Next, the substrate exchange operation in the second embodiment will be described with reference to fig. 9 (b) and 9 (c).

In the liquid crystal exposure apparatus 10d according to the second embodiment, when the substrate stage device 20 holding the substrate P1 whose exposure is completed is driven to the substrate exchange position, the lowering of the noncontact support device 152 by the drive device 153 is started. The timing at which substrate stage device 20 is driven to the substrate exchange position and the timing at which the lowering of non-contact support device 152 is started may be the same or different. The noncontact support device 152 may be lowered to a position to receive the substrate P1 from the substrate holder 68 until the + X-side end of the substrate stage device 20 reaches the-X-side end of the substrate exchange position.

Further, for example, if the + X-side end of the substrate P1 overlaps the-X-side end of the substrate exchange position or the-X-side end of the non-contact supporting device 152, the substrate holder 68 weakens the vacuum suction force. As a result, as shown in fig. 9 (b), the + X-side end of the substrate P1 is transferred to and supported by the lowered noncontact support device 152. That is, the noncontact support device 152 receives the substrate P1 from the substrate holder 68 in the process in which the substrate holder 68 is moving toward the substrate exchange position. When the + X-side end of the substrate P1 is supported by the noncontact support device 152, the drive device 153 starts to raise the noncontact support device 152, while the substrate holder 68 continues to move to the substrate exchange position. Therefore, the distance between the substrate holder 68 and the non-contact supporting device 152 is continuously changed in the direction in which the substrate holder 68 is driven to the substrate exchange position. As substrate stage device 20 moves to the substrate exchange position, substrate P1 is transferred to and supported by noncontact support device 152 in order from the + X-side end to the-X-side end.

By the above control, when substrate stage device 20 reaches the substrate exchange position (below suspension support device 150 c), substrate P1 is already retracted from substrate stage device 20 as shown in fig. 9 (c). This allows a new substrate P2 to be immediately carried into the substrate holder 68, and the time required for substrate exchange can be further reduced.

As described above in detail, according to the second embodiment, the liquid crystal exposure apparatus 10d includes: a substrate holder 68 that supports the lower surface of the substrate P1; a suspension support device 150c (non-contact support device 152) that receives the substrate P1 from the substrate holder 68 and supports the upper surface of the substrate P1; and an X drive mechanism 43 that drives the substrate holder 68, which has delivered the substrate P1 to the noncontact support device 152, to a substrate exchange position where the substrate P2 is carried into the substrate holder 68. Accordingly, since the substrate P1 on the substrate holder 68 can be retracted to the noncontact support device 152 and a new substrate P2 can be carried into the substrate holder 68 at the substrate exchange position, the cycle time for substrate exchange can be shortened as compared with the case where a new substrate P2 is carried in after the substrate P1 is discharged.

In addition, in the present second embodiment, the non-contact supporting device 152 receives the substrate P1 from the substrate holder 68 in the process of driving the substrate holder 68 to the substrate exchange position by the X driving mechanism 43. Thus, the substrate P1 can be retracted toward the noncontact support device 152 until the substrate holder 68 reaches the substrate exchange position (below the overhang support device 150 c), and a new substrate P2 can be carried into the substrate holder 68 immediately after the substrate holder 68 reaches the substrate exchange position. Therefore, the time required for substrate exchange can be further reduced.

In the second embodiment, the noncontact support device 152 supports the substrate P1 in order from one end (in the second embodiment, the + X-side end) of the substrate P1 located on the substrate exchange position side to the other end (the-X-side end). Thus, the noncontact support device 152 can smoothly receive the substrate P1 in conjunction with the movement of the substrate holder 68 to the substrate exchange position.

In the second embodiment, the suspending support device 150c includes the driving device 153, and the driving device 153 drives the non-contact support device 152 so that the relative distance between the substrate holder 68 and the non-contact support device 152 is shortened in the direction (Z-axis direction) in which the substrate P1 is transferred from the plate holder 68 to the non-contact support device 152. Thereby, the substrate P1 can be stably delivered from the substrate holder 68 to the noncontact supporting device 152.

Further, in the present second embodiment, the distance between the substrate holder 68 and the non-contact supporting device 152 is continuously changed in the direction in which the substrate holder 68 is driven to the substrate exchange position. Thus, until the substrate holder 68 reaches the substrate exchange position (below the suspension support device 150 c), the substrate P1 can be retracted from the substrate holder 68 as shown in fig. 9 (c). This allows a new substrate P2 to be immediately carried into the substrate holder 68, and the time required for substrate exchange can be further reduced.

In the second embodiment, the drive device 153 lowers the noncontact support device 152 so that the relative distance between the substrate holder 68 and the noncontact support device 152 is shortened, but the present invention is not limited thereto. For example, the substrate holder 68 may be raised by the driving device so that the relative distance between the substrate holder 68 and the non-contact supporting device 152 is shortened. Further, the non-contact supporting device 152 may be lowered by the driving device 153, and the substrate holder 68 may be raised by the driving device.

In the second embodiment, after substrate stage device 20 reaches the substrate exchange position, noncontact support device 152 may be lowered to transfer substrate P1 from substrate holder 68 to noncontact support device 152.

In the second embodiment, the driving device 153 may be attached to the reference plate 100.

Further, after substrate P2 is carried onto substrate holder 68, substrate P1 supported by noncontact support device 152 may be driven in the-Z direction by drive device 153 so that substrate stage device 20 is driven in the-X direction toward the exposure start position and then becomes substantially the same height as that of air guide 138. As a result, the substrate P1 supported by the noncontact support device 152 can be carried out without driving the substrate moving device 136 and the air guide 138 in the + Z direction.

Third embodiment

Fig. 10 (a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10e according to the third embodiment. As shown in fig. 10 (a), in the suspension support device 150d according to the third embodiment, the Z position of the lower surface of the X-side end of the non-contact support device 152a is lower than the Z position of the lower surface of the X-side end. Further, a substrate stopper 154 is attached to the + X-side end of the noncontact support device 152 a. Further, in the third embodiment, the substrate loading device 130b includes a driving device 145 for moving the end portion of the air guide 138 on the-X side up and down. The driving device 145 is, for example, an air cylinder.

A substrate exchange operation in the liquid crystal exposure apparatus 10e according to the third embodiment will be described with reference to fig. 10 (b) to 11 (b).

In the liquid crystal exposure apparatus 10e according to the third embodiment, as shown in fig. 10 (b), when the non-contact support device 152a supports the substrate P1 whose exposure has been completed, a new substrate P2 is carried into the substrate holder 68 by the substrate carrying-in device 130 b. At this time, the substrate P1 having completed the exposure supported by the non-contact support device 152a is always moved toward the + X side by the action of gravity and is brought into contact with the substrate stopper 154. Therefore, the substrate stopper on the-X side can be omitted.

When a new substrate P2 is loaded onto the substrate holder 68, the suction pad 144 moves in the + X direction as shown in fig. 11 (a). Then, the substrate loading device 130b raises the-X-side end of the air guide 138 by the driving device 145.

Thereafter, as shown in fig. 11 (b), when the substrate stopper 154 is opened, the substrate P1 is carried out in the + X direction by the self-weight of the substrate P1 and the gravity. At this time, the substrate P1 may be moved while the substrate P1 is held by the suction pad 144, or the suction pad 144 may not be used.

As described above in detail, according to the third embodiment, the substrate P1 supported by the noncontact support device 152a is carried out from the noncontact support device 152a by the self weight and gravity of the substrate P1. This can simplify the mechanism for carrying out the substrate P1 from the noncontact support device 152 a.

In the third embodiment, the non-contact supporting device 152a may be attached to the reference plate 100.

When a new substrate P2 is carried onto the substrate holder 68, the air guide 138 may be tilted by driving the driving device 145 in the-Z direction. As a result, the substrate P2 can be easily carried into the substrate holder 68 by gravity.

Fourth embodiment

Fig. 12 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10f according to the fourth embodiment. The fourth embodiment changes the shape of the non-contact supporting device. In the overhung supporting device 150e according to the fourth embodiment, as shown in fig. 12, the non-contact supporting device 152b has a semi-cylindrical shape curved in the Y-axis direction, and the Y-axis direction center portion becomes the lowest (the most protruded in the-Z-axis direction). Therefore, the substrate P1 supported by the noncontact support device 152b is always intended to be closer to the center in the Y-axis direction as indicated by the arrow, and thus the substrate stopper device in the Y-axis direction can be omitted. In this case, a substrate stopper in the X-axis direction is required.

(modification 1)

Fig. 13 (a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10g according to modification 1 of the fourth embodiment. In the liquid crystal exposure apparatus 10g according to modification 1, the suspension support device 150f includes a guide mechanism 159 that guides the noncontact support device 152c in the X-axis direction. Further, the shape of the noncontact support device 152c becomes a part of a sphere having a large curvature which is curved not only in the Y-axis direction but also in the X-axis direction.

The substrate exchange operation in the liquid crystal exposure apparatus 10g according to modification 1 will be described with reference to fig. 13 (a) and 13 (b).

When the non-contact support device 152c supports the substrate P1 on which exposure has been completed, a new substrate P2 is loaded onto the substrate holder 68 by the substrate loading device 130. At this time, as shown by arrows in fig. 13 (a) and 13 (b), the substrate P1 supported by the noncontact support device 152c is always intended to be close to the central portion, and thus the substrate stopper device in the X-axis direction and the Y-axis direction can be omitted.

When the non-contact support device 152c supports the substrate P1 after completion of exposure, the substrate loading device 130 carries the substrate P2 into the substrate holder 68 as shown in fig. 13 (b). At this time, the noncontact support device 152c moves upward of the substrate loading device 130 by the guide mechanism 159.

As described above in detail, according to modification 1 of the fourth embodiment, non-contact supporting apparatus 152c carries out substrate P1 while supporting the upper surface of substrate P1. This makes it possible to omit a mechanism for unloading the substrate P1 from the noncontact support device 152c in the substrate loading device 130.

In modification 1 of the fourth embodiment, the non-contact support device 152 according to the first and second embodiments may be used instead of the non-contact support device 152 c. That is, the lower surface of the non-contact supporting device may be a flat surface.

In the first to fourth embodiments and the modifications thereof, the effect of shortening the time taken for substrate exchange becomes more remarkable as the sizes of the substrate P1 and the substrate P2 are larger (for example, 500mm or more).

The first to fourth embodiments and their modifications may be combined as appropriate. For example, the second embodiment may be combined with modification 2 of the first embodiment, and the suspension support device 150b according to the second embodiment may be configured to include the substrate transport device 158. In this case, the driving member 158b of the substrate transport apparatus 158 may be mounted on the suspension support apparatus mounting frame 151.

For example, the non-contact support device 152 of the first embodiment may be inclined such that the Z position of the + X-side end is lower than the Z position of the-Z-side end in combination with the first embodiment and the third embodiment. In addition, the first embodiment may be combined with the fourth embodiment or the modification 1 of the fourth embodiment, and the shape of the non-contact supporting device 152 of the first embodiment may be a semi-cylindrical shape curved in the Y-axis direction, or may be a part of a sphere having a large curvature that is curved not only in the Y-axis direction but also in the X-axis direction. Further, the guide mechanism 159 may be attached to the reference plate 100, and the substrate P2 may be carried out in a state where the substrate P2 is supported by the noncontact support device 152 according to the first embodiment.

In the first to fourth embodiments and the modifications thereof, the liquid crystal exposure apparatus is used as an example, but the present invention is not limited thereto. The first to fourth embodiments and the modifications thereof may be applied to an inspection apparatus that detects the surface of the substrate P.

The liquid crystal exposure apparatus according to the first to fourth embodiments and the modifications thereof described above uses a glass substrate used for a liquid crystal display device as an object to be exposed, but the present invention is not limited thereto. The liquid crystal exposure apparatus 10 can also use a wafer or the like used for a semiconductor device or the like as an exposure object.

Further, the liquid crystal exposure apparatus according to the first to fourth embodiments and the modifications thereof described above includes one substrate stage device, but the configurations of the first to fourth embodiments and the modifications thereof can be applied to an exposure apparatus including a plurality of substrate stage devices.

In the first to fourth embodiments and the modifications thereof, the carrier main body 74 provided in the substrate carrier 70 is formed in a U-shape in plan view (see fig. 2), but the invention is not limited thereto. The carrier main body 74 may be formed into a rectangular frame shape in plan view or a triangular frame shape in plan view as long as it can hold the substrate by suction on the upper surface thereof. The carrier main body 74 may include a pair of members having a rectangular cross section, for example, which are provided so as to sandwich the substrate holder 68 in the X-axis direction or the Y-axis direction, or may be configured by a single rod-shaped member, and may hold only the vicinity of one end portion of the substrate P by suction in the X-axis direction or the Y-axis direction. The substrate carrier 70 may have a configuration similar to that of the substrate carrier disclosed in, for example, U.S. patent No. 8,699,001, or may have a configuration having an adsorption portion for adsorbing an end portion of a substrate and a main body portion to which the adsorption portion is attached. The number of the adsorption parts is not limited. The suction unit may be provided so as to be capable of being driven in the X direction, the Y direction, and the Z direction relative to the main body.

Method for manufacturing device

Next, a method for manufacturing a microdevice using the liquid crystal exposure apparatus 10, 10a to 10g according to each of the above embodiments in a photolithography step will be described. In the liquid crystal exposure apparatuses 10 and 10a to 10g of the above embodiments, a liquid crystal display element as a micro-device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, or the like) on a plate (glass substrate).

Pattern formation Process

First, a so-called photolithography step of forming a pattern image on a photosensitive substrate (e.g., a glass substrate coated with a photoresist) is performed using the exposure apparatus according to each of the above embodiments. Through this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various steps such as a developing step, an etching step, and a photoresist stripping step, thereby forming a predetermined pattern on the substrate.

Color filter forming process

Next, a color filter in which a plurality of combinations of three dots corresponding to r (red), g (green), and b (blue) are arranged in a matrix, or a color filter in which a plurality of combinations of filters of R, G, B in three stripes are arranged in the horizontal scanning line direction is formed.

Cell assembling process

Next, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained in a pattern forming step and a color filter obtained in a color filter forming step.

Module assembling process

Then, each component such as a circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) is mounted to complete the liquid crystal display element.

In this case, in the pattern forming step, the plate is exposed with high throughput and high accuracy using the liquid crystal exposure apparatus according to each of the above embodiments, and as a result, the productivity of the liquid crystal display element can be improved.

The disclosures of all the publications, international publications, U.S. patent application publications, and U.S. patent specifications cited in the above description are incorporated herein by reference as part of the present description.

The above-described embodiments are suitable examples of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the scope of the present invention.

Description of the reference numerals

10. 10a to 10g … liquid crystal exposure device; a 43 … X drive mechanism; 68 … a substrate holder; 70 … a substrate carrier; 130. 130a, 130b … substrate loading device; 150. 150 a-150 f …; 152. 152a to 152c … non-contact support means; 153 … driving means; 158a … holding portion; 158b … drive component; p, P1, and P2 ….

Claims (46)

1. An object exchange device, comprising:

a first support portion that supports a first surface of an object;

a second support portion that receives the object from the first support portion and supports a second face of the object different from the first face;

a driving unit that drives the first support unit, which has delivered the object to the second support unit, to an object exchange position at which another object different from the object is carried into the first support unit; and

a carrying-in device that carries the other object into the first support section along a placement surface on the first support section facing the first surface,

the second support portion supports another portion of the object,

the carrying-in device carries the other object into the first support section that supports a part of the object whose other part is supported by the second support section.

2. The object exchange device of claim 1,

the second support receives the object from the first support during driving of the first support to the object exchange position by the driving portion.

3. The object exchange device of claim 1 or 2,

the second support portion supports the object in order from one end side of the object located on the object exchange position side to the other end side.

4. The object exchange device of claim 1 or 2,

the second support portion has: a holding portion that holds a part of the object; and a driving member that drives the holding portion so that a part of the object is supported by the second support portion.

5. The object exchange device of claim 4,

the driving member drives the holding portion holding a part of the object toward the object exchange position side so that another part of the object is supported by the second supporting portion.

6. The object exchange device of claim 1 or 2,

the first support section applies a levitation force to the first surface so that the object is supported by the second support section.

7. The object exchange device of claim 6,

the first support section applies the levitation force to the object so that a distance between the first surface and the first support section is increased.

8. The object exchange device of claim 1,

the carrying-in device carries the other object into a space between the first support section and the object so as to be supported by the first support section.

9. The object exchange device of claim 1 or 2,

the carrying-in device applies a force to the first surface so that the other object is transferred to the second support portion while being carried into the first support portion.

10. The object exchange device of claim 1 or 2,

the carrying-in device carries in the other object from a side supporting one end portion of the object in the first supporting portion to a side supporting the other end portion.

11. The object exchange device of claim 1 or 2,

the first support section imparts a force capable of levitating and supporting the object or the other object,

the carrying-in device carries the other object supported in a floating manner into the first support section.

12. The object exchange device of claim 1 or 2,

the carrying-in device that carries in the other object to the first support section carries out the object from the second support section.

13. The object exchange device of claim 1 or 2,

the object carrying device further includes a holding device that holds the other object that is carried into the first support section by the carrying-in device and is supported by the first support section in a floating manner, and that drives the other object relative to the first support section.

14. The object exchange device of claim 13,

the second support portion supports the object whose holding by the holding device is released.

15. The object exchange device of claim 1 or 2,

the object supported by the second support portion is carried out from the second support portion by the self weight and gravity of the object.

16. The object exchange device of claim 1 or 2,

the second support section carries out the object while supporting the second surface.

17. The object exchange device of claim 1 or 2,

the second support controls gas between the second face and the second support, non-contact supporting the second face of the object.

18. The object exchange device of claim 1 or 2,

the distance between the first support portion and the second support portion continuously changes in a direction in which the first support portion is driven toward the object exchange position.

19. The object exchange device of claim 17,

the second support portion has a fall prevention portion that holds the first surface side so that the object supported in the non-contact manner does not fall.

20. The object exchange device of claim 1 or 2,

the object transfer device further includes a driving device that drives one of the first support section and the second support section so that a relative distance between the first support section and the second support section becomes shorter in a direction of transferring the object from the first support section to the second support section.

21. An object processing apparatus, comprising:

the object exchange device of any one of claims 1 to 20; and

and a processing unit that performs a predetermined process on the second surface of the object or the other object on the first support unit at a processing position different from the object exchange position.

22. The object processing apparatus according to claim 21,

the drive unit drives the first support unit, which supports the object subjected to the predetermined process, from the processing position to the object exchange position.

23. The object processing apparatus according to claim 21,

the processing unit is a patterning device that scans and exposes the second surface of the object with an energy beam and forms a predetermined pattern on the second surface.

24. The object processing apparatus according to claim 23,

the driving section drives the object on the first supporting section in the scanning exposure.

25. The object processing apparatus according to claim 23,

the driving unit drives the other object carried in on the first support unit in the scanning exposure.

26. An object processing apparatus, comprising:

the object exchange device of claim 13; and

a processing unit that scans and exposes the second surface of the object or the other object held by the holding device with an energy beam at a processing position different from the object exchange position, and forms a predetermined pattern on the second surface,

the holding device is relatively driven with respect to the first support portion in the scanning exposure.

27. The object processing apparatus according to claim 21,

the processing unit is an inspection device that inspects the second surface of the object.

28. The object processing apparatus according to claim 21,

the object and the other object are substrates used for a display panel of a display device.

29. The object processing apparatus according to claim 28,

the object and the other objects are substrates having a size of 500mm or more.

30. A method of manufacturing a flat panel display, comprising:

a step of exposing the object using the object processing apparatus according to claim 28; and

a step of developing the exposed object.

31. A component manufacturing method, comprising:

a step of exposing the object using the object processing apparatus according to claim 28; and

a step of developing the exposed object.

32. An object exchange method, comprising:

receiving an object having a first surface supported by a first support section, and supporting a second surface of the object, which is different from the first surface, by a second support section;

driving the first support section, which has delivered the object to the second support section, to an object exchange position at which another object different from the object is carried into the first support section; and

a step of carrying the other object into the first supporting section along a placement surface on the first supporting section facing the first surface by a carrying-in device,

the second support portion supports another portion of the object when the supporting is performed,

when the object is carried in, the other object is carried in to the first support section that supports a part of the object whose other part is supported by the second support section.

33. The object exchange method according to claim 32,

receiving the object from the first supporting part during driving of the first supporting part to the object exchange position at the time of the supporting.

34. The object exchange method according to claim 32 or 33,

in the supporting, the object is supported in order from one end side to the other end side of the object located on the object exchange position side.

35. The object exchange method according to claim 32 or 33,

further comprising driving the holding portion so that a part of the object held by the holding portion is supported by the second support portion.

36. The object exchange method according to claim 35,

in the driving, the holding portion is driven toward the object exchange position side so that another part of the object is supported by the second support portion.

37. The object exchange method according to claim 32 or 33,

the method further includes the step of applying a levitation force to the first surface so that the object on the first support portion is supported by the second support portion.

38. The object exchange method according to claim 37,

in the applying, the levitation force is applied to the object so that a distance between the first surface and the first support portion is increased.

39. The object exchange method according to claim 34,

and carrying the other object into a space between the first support part and the object so as to be supported by the first support part at the time of carrying.

40. The object exchange method according to claim 32 or 33,

in the carrying-in, a force is applied to the first surface so that the other object is transferred to the second support portion while the other object is carried into the first support portion.

41. The object exchange method according to claim 32 or 33,

the method further includes a step of holding the other object that is carried into the first support section by the carrying-in device and is supported by the first support section in a floating manner by a holding device, and driving the other object relative to the first support section.

42. The object exchange method according to claim 32 or 33,

controlling the gas between the second surface and the second support portion to support the second surface of the object in a non-contact manner when the supporting is performed.

43. An object processing method, comprising:

an object exchange method according to any one of claims 32 to 42; and

and performing a predetermined process on the second surface of the object or the other object on the first support section at a process position different from the object exchange position.

44. The object processing method according to claim 43,

in the driving, the first support unit that supports the object subjected to the predetermined process is driven from the processing position to the object exchange position.

45. The object processing method according to claim 43,

in the predetermined processing, the second surface of the object is scan-exposed by an energy beam, and a predetermined pattern is formed on the second surface.

46. An object processing method, comprising:

the object exchange method of claim 41; and

scanning and exposing the second surface of the object or the other object held by the holding device with an energy beam at a processing position different from the object exchange position to form a predetermined pattern on the second surface,

in the relative driving, the other object is relatively driven with respect to the first supporting section in the scanning exposure.

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