CN1828828A

CN1828828A - Substrate processing device, method and program

Info

Publication number: CN1828828A
Application number: CNA2006100580604A
Authority: CN
Inventors: 大塚庆崇; 中满孝志
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2005-02-28
Filing date: 2006-02-28
Publication date: 2006-09-06
Anticipated expiration: 2026-02-28
Also published as: TW200631074A; KR101061611B1; CN100407367C; TWI272662B; KR20060095504A; JP2006237482A; JP4378301B2

Abstract

This invention provides a base plate treating apparatus. The conveying parts (84A, 84B) of the first and the second base plate hold base plate (G) conveying interval, and the conveying interval refers to the interval from the coating starting position to the coating ending position instead of the total conveying interval from in-position to out-position. The first base plate conveying part (84A) conveys base plate (G [i]) to the coating ending position and returns to the in-position directly, then the base plate conveying part (84A) begins to convey the subsequent new base plate (G [i+1]). While the second base plate conveying parts (84B) conveys the base plate (G [i]) from the coating ending position to the out-position by itself, then the conveying parts (84B) returns to the coating starting position and waits for the arrival of next base plate (G [i+1]) conveyed by the first base plate conveying part (84A) itself. This invention can greatly shorten the intermittent time of supplying treatment fluid to the dealing base plate without rotation mode.

Description

Substrate board treatment, substrate processing method using same and substrate processing program

Technical field

The present invention relates to supply with on the processed substrate treatment fluid and the technology of handling, particularly treatment fluid is coated in processing substrate technology on the substrate in mode without spin.

Background technology

Present stage, in photoetching process (photolithograph) operation in flat-panel monitor (FPD) manufacture process, as helping the resist coating process that processed substrate (for example glass substrate) maximizes, what popularizing is that one side is ejected in resist liquid on the substrate with band shape by the resist nozzle of long type, one side promptly scans by the resist nozzle is relatively moved, and applies the without spin mode of resist liquid to the thickness of wanting on substrate with not needing to rotatablely move.

According to the resist applying device of the prior art of mode without spin, for example, as record in the patent documentation 1, flatly fixedly mounting in the substrate on the objective table be arranged at the minim gap of setting between the ejiction opening of the resist nozzle above the objective table below hundreds of μ m, one side make the resist nozzle along the scanning direction (generally being horizontal direction) with nozzle length direction quadrature move, one side is ejected into resist liquid on the substrate.This resist nozzle constitutes nozzle body formation and grows crosswise or long chi shape, with the ejiction opening ejection resist liquid of band shape from the very little diameter of bore fine (for example about 100 μ m).When the coating processing of being undertaken by the scanning of this long type resist nozzle finishes, take out this substrate by transfer robot or carrying arm from objective table, and take out of outside the auto levelizer.After this by transfer robot follow-up new substrate is moved in the auto levelizer immediately, and be positioned on the objective table.And the scanning by the resist nozzle repeats coating same as described above to this new substrate and handles.

Patent documentation 1: Japanese kokai publication hei 10-156255 patent gazette

In the resist liquid coating apparatus of mode without spin as described above, the short of substrate that will finish processing unloads or takes out of from objective table, make to be in dummy status above the objective table fully, just follow-up new substrate can not be moved into or mounting on objective table.Therefore, exist following problems, that is: carry out on institute (Tc) basis of wanting the time of scanning work at the resist nozzle, add the work untreatment base being moved into or be loaded on the objective table want the time (Tin) and the substrate that will finish processing from want the time (Tout) and the coating that obtains of the institute of the objective table unloading or the work of taking out of handle a circulation want the time (Tc+Tin+Tout) intactly become the intermittent time (tact time), thereby be difficult to shorten the intermittent time.

And, also exist following problems, that is: because the size and the weight of long type resist nozzle increases along with the maximization of substrate, thus be difficult to this heavy thick resist nozzle of growing up remain on consistently on the predetermined height and position in objective table top (close clearance) constant and it is stably moved horizontally with certain speed.

Summary of the invention

The present invention proposes in view of prior art problem as described above, and its purpose is to provide a kind of can shorten substrate board treatment, substrate processing method using same and the substrate processing program of in mode without spin treatment fluid being supplied with or is coated in the intermittent time of the work of treatment on the processed substrate significantly.

Other purpose of the present invention be to provide a kind of can be rationally expeditiously with substrate maximize corresponding substrate board treatment, substrate processing method using same and substrate processing program.

To achieve these goals, above being included in, substrate board treatment of the present invention has a plurality of ejiction openings, by the pressure of the gas by the ejection of above-mentioned ejiction opening processed substrate is suspended in objective table on the desired height, be used for aforesaid substrate is moved into the portion that moves into that moves into the position on the above-mentioned objective table, be used for aforesaid substrate is taken out of the portion that takes out of that take out of the position from the above-mentioned objective table, move on position and the above-mentioned coating position of taking out of between the position above above-mentioned objective table above-mentioned, treatment fluid is supplied with the top treatment fluid supply unit of aforesaid substrate, from above-mentioned move into the position by above-mentioned coating position to being set in above-mentioned coating position and above-mentioned primary importance of taking out of the position, maintenance and carrying are suspended in the first board carrying portion of the aforesaid substrate on the above-mentioned objective table, and from be set in above-mentioned move into the second place between position and the above-mentioned coating position by above-mentioned coating position to the above-mentioned position of taking out of, keep also carrying to be suspended in the second board carrying portion of the aforesaid substrate on the above-mentioned objective table.

In addition, substrate processing method using same of the present invention, move into the position in the one row ground setting of objective table upper edge board carrying direction, the coating starting position, apply end position and take out of the position, pressure by the gas of the ejection of the many ejiction openings above being arranged on above-mentioned objective table is suspended on the desired height processed substrate, on above-mentioned objective table, moving into first position that the position keeps aforesaid substrate to first interval of above-mentioned coating starting position from above-mentioned, first and second positions that second interval, keep aforesaid substrate from above-mentioned coating starting position to above-mentioned coating end position, second position that from above-mentioned coating end position to above-mentioned the 3rd interval of taking out of the position, keeps aforesaid substrate, in aforesaid substrate carrying direction, carry aforesaid substrate, aforesaid substrate by above-mentioned second interval move during in, coating treatment fluid on aforesaid substrate.

In addition, substrate processing program of the present invention implements processed substrate is moved into the operation in the position moved into of the objective table that has a plurality of ejiction openings in the above, on above-mentioned objective table, aforesaid substrate is suspended in the state on the desired height, move into the operation that the position keeps aforesaid substrate to the coating starting position ground, first position is carried from above-mentioned, on above-mentioned objective table, aforesaid substrate is suspended in the state on the desired height, the operation that keeps the ground, first and second positions of aforesaid substrate to carry to above-mentioned coating end position from above-mentioned coating starting position, on above-mentioned objective table, make aforesaid substrate move to from above-mentioned coating starting position the coating end position during on aforesaid substrate the operation of coating treatment fluid, on above-mentioned objective table, aforesaid substrate is suspended in the state on the desired height, from above-mentioned coating end position to taking out of the operation that the position keeps the ground, second position of aforesaid substrate to carry, with take out of the operation of taking out of locational aforesaid substrate that is placed in above-mentioned objective table.

In the present invention, by pressure substrate is suspended in the air by the gas (for example compressed air) of the ejiction opening above objective table ejection, substrate is transported to and takes out of the position from moving into the position on objective table, by the treatment fluid supply unit treatment fluid is supplied on the substrate on the coating position on the way, apply treatment fluid in the Zone Full on substrate or the desired a part of zone.For carrying substrate on objective table, the first and second board carrying portions simultaneously keep substrate, and one side moves along the board carrying direction.Here, the first board carrying portion, from move into the position by the coating position to the primary importance of taking out of before the position, keep the floating substrate of going up state of also carrying.On the other hand, the second board carrying portion, from move into the position and the second place of coating between the position by the coating position to taking out of the position, keep the floating substrate of going up state of also carrying.The first and second board carrying portions keep and the interval of carrying substrate together, are not from moving into the position to whole carryings interval of taking out of the position, but between the mesozone from the second place to the primary importance.When the first board carrying portion with board carrying when the primary importance, thereby stop carrying to this substrate, directly turn back to and move into the position, begin the carrying of follow-up new substrate.On the other hand, the second board carrying portion is transported to substrate individually and takes out of the position from primary importance, turn back to the second place therefrom, and the first board carrying portion that waits for is transported to the second place from moving into the position individually with next piece substrate.Like this, both collaborative works of the first and second board carrying portions, the limit of interval that will carry out board carrying fixes near the coating position, in addition, individually respectively hold carrying or mobile working in the interval (move between the lateral areas, take out of between the lateral areas) individually, improve the intermittent time significantly thereby can improve board carrying efficient greatly.

In substrate board treatment of the present invention, if according to a preferential sample attitude, then taking out of the roughly the same timing of position side and beginning the coating of treatment fluid on substrate with substrate is moved to from the second place, with substrate is placed in timing roughly the same on the primary importance and finishes the coating of treatment fluid on substrate.

If according to an optimal way, the then above-mentioned first and second board carrying portions comprise that respectively the mode of extending abreast with the moving direction with substrate is configured in first and second guide rails on one side of above-mentioned objective table, can along these first and second guide rails move first and second the carrying main bodys, to move the first and second carrying drive divisions that these first and second modes of carrying main bodys drive along first and second guide rails, with extend to the core of objective table from the first and second carrying main bodys, can keep first and second maintaining parts of first and second side edge parts of substrate with loading and unloading.

If according to an optimal way, the first board carrying portion then, remove on the primary importance in first maintaining part to the maintenance of first side edge part of substrate, the first carrying main body is turned back to from primary importance moves into the position.In addition, the second board carrying portion removes the maintenance of removing immediately after taking out of in the position in second maintaining part second side edge part of substrate in that substrate is placed in, and then makes the second carrying main body turn back to the second place from taking out of the position.Best, first and second maintaining parts have first and second pedestals that can be adsorbed on first and second side edge parts of substrate respectively with loading and unloading, base end part are fixed on the first and second carrying main bodys, and make the first and second base supports portions that leading section combines with first and second pedestals and control first and second pedestals first and second pedestals of the absorption of substrate are adsorbed control part.Here, best, first and second pedestals absorption control part has for first and second pedestals are combined with substrate, supply with the first and second negative pressure feeding portions of negative pressure to first and second pedestals, have for first and second pedestals are separated from substrate, supply with the first and second malleation feed units of malleation to first and second pedestals.

In addition, if according to an optimal way, then first and second maintaining parts have the first and second base supports portions are moved forward, separate and the first and second pedestal actuators that the first and second base supports portions are back moved from substrate in order to make first and second pedestals.Further, first and second maintaining parts make first and second pedestals combine with substrate moving on the position, first and second pedestals are separated from substrate.Best, the first and second base supports portions correspondingly make the height and position displacement of its leading section with the height and position of substrate.

In addition, if according to an optimal way, then the portion of moving into has and is used for moving on the position base plate supports many first lifting poles of pole front end with make the first lifting pole lifting unit that move forward position between lifting moving of the first lifting pole above original position below the objective table and objective table on the objective table.In addition, the portion of taking out of has and is used for taking out of on the position base plate supports many second lifting poles of pole front end with make the second lifting pole lifting unit that move forward position between lifting moving of the second lifting pole above original position below the objective table and objective table on the objective table.

In addition, if according to an optimal way, then the treatment fluid supply unit has the nozzle of the long type with the fine ejiction opening of the diameter that extends along the direction in the board carrying path on the cross-section objective table, on the coating position towards the substrate below nozzle, from ejiction opening ejection treatment fluid.

In substrate processing method using same of the present invention, first and second positions of preferable substrate are the side edge parts of the pair of right and left seen from the board carrying direction.In addition, can be in first, second and the 3rd interval, the transporting velocity of setting substrate, the floating height of going up of setting substrate independently independently.Again, also can on the coating starting position, substrate temporarily be stopped, beginning maintenance, perhaps also can on the coating starting position, the mobile of substrate be stopped, beginning maintenance second position of substrate to second position of substrate.In addition, also can on the coating end position, substrate temporarily be stopped, finishing maintenance, perhaps also can on the coating end position, the mobile of substrate be stopped, finishing maintenance first position of substrate to first position of substrate.Again, also can substrate by second interval move during in, follow-up new substrate is moved into the position.

If according to substrate board treatment of the present invention, substrate processing method using same and substrate processing program, then by formation as described above and effect, can shorten the intermittent time of with mode without spin treatment fluid being supplied with or is coated in the work of treatment on the processed substrate significantly, further, also can reasonably maximize corresponding with substrate expeditiously by floating upward carrying.

Description of drawings

Fig. 1 is the plane graph that expression can be used the formation of coating developing system of the present invention.

Fig. 2 is the flow chart that is illustrated in the processing sequence in the coating developing system of execution mode.

Fig. 3 is the simple plane graph that is illustrated in all formations of resist coating element in the coating developing system of execution mode and drying under reduced pressure unit.

Fig. 4 is the stereogram of all formations of the resist coating element in the expression execution mode.

Fig. 5 is the simple front elevation of all formations of the resist coating element in the expression execution mode.

Fig. 6 is the simple side view of a part of section of the formation of the board carrying portion in the resist coating element of expression execution mode.

Fig. 7 is the amplification profile of formation of the maintaining part of the board carrying portion in the resist coating element of expression execution mode.

Fig. 8 is the stereogram of formation of the base portion of the board carrying portion in the resist coating element of expression execution mode.

Fig. 9 is the stereogram of a variation of the maintaining part of the board carrying portion in the resist coating element of expression execution mode.

Figure 10 is the profile of formation of the ejection control part in the resist coating element of expression execution mode.

Figure 11 is the fragmentary cross-sectional view of formation of the stream of the objective table inside in the resist coating element of expression execution mode.

Figure 12 is the block diagram of formation of the control system in the resist coating element of expression execution mode.

Figure 13 is the sequential chart of coating work of treatment that is used for illustrating the resist coating element of execution mode.

Figure 14 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 15 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 16 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 17 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 18 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 19 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 20 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 21 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 22 is the general view in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Figure 23 is the stereogram in a stage of the coating work of treatment in the resist coating element of expression execution mode.

Label declaration

40 resist coating elements (CT)

54 Handling devices

74 carrying arms

76 objective tables

78 resist nozzles

84A, the 84B first and second board carrying portions

85 move into lifting pole lifting unit

86 move into and use lifting pole

87 aligned portions (alignment)

88 ejiction openings

90 attract mouth

91 take out of with lifting pole lifting unit

92 take out of and use lifting pole

96A, 96B first and second guide rails

98A, 98B first and second sliders

100A, the 100B first and second carrying drive divisions

102A, 102B first and second maintaining parts

104A, the 104B first and second absorption pedestals

106A, the 106B first and second base supports portions

108A, the 108B first and second pedestal Lift Parts

109A, the 109B first and second pedestal actuators

115A, 115B first and second pedestals absorption control part

134 objective table substrates float top

136 controllers

M1 moves into the zone

M3 the area of application

M5 takes out of the zone

Embodiment

Below, with reference to accompanying drawing preferential execution mode of the present invention is described.

Fig. 1 is that expression coating developing system is as the adaptable configuration example of substrate board treatment of the present invention.This coating developing system is set in the Clean room, for example with the LCD substrate as processed substrate, in the LCD manufacture process, each of carrying out cleaning in the photo-mask process, resist coating, preliminary drying, development and back baking handled.

Divide substantially, this coating developing system is made of box platform (C/S) 10, treatment bench (P/S) 12 and interface portion (I/F) 14.

The box platform (C/S) 10 that is arranged on the end of system comprises: carry box platform 16, the box C that contains polylith substrate G that it can mounting predetermined number (for example 4); Carrying path 17, the side on this year box platform 16 and be arranged in parallel with the assortment direction of box C; With carrying mechanism 20, at the box C that makes to freedom of movement on this carrying path 17 on the substrate G discrepancy year box platform 16.This carrying mechanism 20 has the parts that can keep substrate G and for example carries arm, can work on X, Y, these four axles of Z, θ, and carry out acceptance and the payment of substrate G with the Handling device 38 of treatment bench described later (P/S) 12 sides.

By (clipping) substrate relay 23, soup feed unit 25 and space 27, and sequentially horizontal row are provided with handling part 22, coating handling part 24, the development treatment portion 26 of cleaning to treatment bench (P/S) 12 from above-mentioned box platform (C/S) 10 sides.

Clean handling part 22 and comprise that two dedustings (scrubber) clean ultraviolet irradiation/cooling unit (UV/COL) 30, heating unit (HP) 32 and the cooling unit (COL) 34 of unit (SCR) 28, two sections.

Coating handling part 24 comprises resist coating element (CT) 40, drying under reduced pressure unit (VD) 42, two sections type adhesion/cooling unit (AD/COL) 46, two sections type heating/cooling unit (HP/COL) 48 and the heating unit (HP) 50 of mode without spin.

Development treatment portion 26 comprises 52, two two sections types of three developing cells (DEV) heating/cooling unit (HP/COL) 53 and heating unit (HP) 55.

Carrying path 36,51,58 is arranged on along its length the middle body of each

processing unit

22,24,26, Handling device 38,54,60 moves along carrying path 36,51,58 respectively, be linked into each unit in the each processing unit, carry out moving into/take out of or carrying of substrate G.Wherein, in this system, manage throughout in the

unit

22,24,26, the side's side in carrying path 36,51,58 disposes the unit (SCR, CT, DEV etc.) of liquid treating system, disposes the unit (HP, COL etc.) of heat treatment system in the opposing party's side.

Be arranged on the interface portion (I/F) 14 of the other end of system,, be provided with carrying mechanism 59 with the exposure device adjacent sides being provided with extension (extention) (substrate is accepted payment portion) 56 and buffer table 57 with treatment bench 12 adjacent sides.This carrying mechanism 59 can move freely on the carrying path 19 of extending in the Y direction, except relative buffer table 57 carries out the discrepancy of substrate G, also carries out the acceptance payment of substrate G with extension (substrate is accepted payment portion) 56 and adjacent exposure device.

Fig. 2 is illustrated in the processing sequence in this coating developing system.At first, in box platform (C/S) 10, take out 1 substrate G the predetermined box C of carrying mechanism 20 from platform 12, give the Handling device 38 (operation S1) of the clean handling part 22 of treatment bench (P/S) 12.

In clean handling part 22, substrate G is moved in ultraviolet irradiation/cooling unit (UV/COL) 30 at first in turn, the thermal drying that enforcement is undertaken by ultraviolet irradiation in initial ultraviolet irradiation/cooling unit (UV) is cooled to predetermined temperature (operation S2) in the cooling unit (COL) of back.In cleaning, this ultraviolet ray mainly removes the organic substance of substrate surface.

Then, substrate G cleans a dedusting and accepts in the unit (SCR) 28 to clean to clean to handle, and removes emboliform dirt (operation S3) from substrate surface.After scouring (scrubbing) was cleaned, substrate G accepted the processed (operation S4) by the heating generation in heating unit (HP) 32, then be cooled to certain substrate temperature (operation S5) in cooling unit (COL) 34.Thereby finish the pre-treatment in cleaning handling part 22, accept payment portion 23 by Handling device 38 through substrate substrate G is transported in the coating handling part 24.

In coating handling part 24, at first, substrate G is moved in adhesion/cooling unit (AD/COL) 46 in turn, in initial coherent unit (AD), accept hydrophobization and handle (HMDS) (operation S6), in the cooling unit (COL) of back, be cooled to certain substrate temperature (operation S7).

After this, in resist coating element (CT) 40, resist is coated on the substrate G, then in drying under reduced pressure unit (VD) 42, accepts the dried (operation S8) that produces by decompression with method without spin.

Then, substrate G is moved in heating/cooling unit (HP/COL) 48 in turn, baking (bake) (preliminary drying) (operation S9) after applying in initial heating unit (HP) then, is cooled to certain substrate temperature (operation S10) in cooling unit (COL).In addition, also heating unit (HP) 50 can be used for baking after this coating.

After above-mentioned coating is handled, by the Handling device 54 of coating handling part 24 and the Handling device 60 of development treatment portion 26 substrate G is transported to interface portion (I/F) 14, therefrom substrate G is consigned to exposure device (operation S11).Resist exposure in exposure device on substrate G forms the circuit pattern of regulation.And, make the substrate G that finishes pattern exposure get back to interface portion (I/F) 14 from exposure device.The Handling device 59 of interface portion (I/F) 14 will consign to the development treatment portion 26 (operation S11) of treatment bench (P/S) 12 from the substrate G that exposure device is accepted through extension 56.

In development treatment portion 26, substrate G accepts development treatment (operation S12) in developing cell (DEV) 52 some.Then, substrate G is moved in heating/cooling unit (HP/COL) 53 one in turn, in initial heating unit (HP), carry out back baking (operation S13), then in cooling unit (COL), be cooled to certain substrate temperature (operation S14).Also heating unit (HP) 55 can be used for this back baking.

Make the substrate G that has finished a succession of processing in the development treatment portion 26 get back to box platform (C/S) 10 by the Handling device 60,54,38 in the treatment bench (P/S) 24, thereby substrate is housed among some box C (operation S1) by carrying mechanism 20.

In this coating developing system, for example can apply the present invention to apply in the resist coating element (CT) 40 of handling part 24.Below, an execution mode that applies the present invention to resist coating element (CT) 40 is described by Fig. 3～Figure 18.

Fig. 3 represents resist coating element (CT) 40 in the present embodiment and all formations of drying under reduced pressure unit (VD) 42.

As shown in Figure 3, on brace table or support frame 70, dispose resist coating element (CT) 40 and drying under reduced pressure unit (VD) 42 along directions X horizontal with being listed as.The new substrate G that will be accepted to apply processing by the Handling device 54 (Fig. 1) of carrying path 51 sides shown in arrow FA like that moves in the resist coating element (CT) 40.By the carrying arm 74 that can move along directions X, shown in arrow FB, will in resist coating element (CT) 40, finish the substrate G that coating handles like that and be sent in the drying under reduced pressure unit (VD) 42 by 72 guiding of the guide rail on supported 70.Handling device 54 (Fig. 1) by carrying path 51 sides takes out the substrate G of the dried that is through with like that in drying under reduced pressure unit (VD) 42 shown in arrow FC.

Resist coating element (CT) 40 has the platform 76 that extends along directions X length, constitute one side at this equidirectional advection ground, objective table 76 upper edges carrying substrate G, one side is gone up to substrate G by the resist nozzle 78 of the long type that is configured in objective table 76 tops and supplies with resist liquid, and goes up the resist coated film of the certain thickness of formation with method (processed face) on substrate without spin.State the formation and the effect of each unit in the resist coating element (CT) 40 in the back in detail.

Drying under reduced pressure unit (VD) 42 comprise the pallet of top opening or container type of the shallow end lower chamber 80 and can gas-tight seal above lower chamber 80 or the upper chamber (not drawing among the figure) of lid shape that can chimeric formation at this.Lower chamber 80 is roughly quadrangle, is equipped with the platform 82 that is used for horizontal mounting and supporting substrate G at core, and four angles of bottom surface are provided with exhaust outlet 83.Each exhaust outlet 83 communicates with vacuum pump (not drawing among the figure) via blast pipe (not drawing among the figure).Under the state that upper chamber is covered on the lower chamber 80, can enough this vacuum pumps the airtight processing space in two chambers be decompressed to predetermined vacuum degree.

Fig. 4 and Fig. 5 are resist coating element (CT) 40 interior all the constituting in more detail in expression an embodiment of the invention.

In the resist coating element (CT) 40 of this execution mode, objective table 76 does not keep the mounting table of substrate G and does not work as fixing as prior art, but skyborne substrate is floating appears on the stage and work as being used for by the power that air is pressed substrate G being suspended.And, be configured in first and second 84A of board carrying portion, the 84B of the translatory movement type on objective table 76 both sides, releasably keep being suspended in the both side edges portion of the substrate G on the objective table 76 respectively, along length direction (directions X) the carrying substrate G of platform.Resist nozzle 78 is not mobile model or sweep type but fixation type is arranged on the length direction of objective table 76 or the top of the center in the carrying direction (directions X).

In detail, objective table 76 is divided into five regional M at its length direction (directions X) ₁, M ₂, M ₃, M ₄, M ₅(Fig. 5).Left end zone M ₁Be to move into the zone, the new substrate G that will accept to apply processing moves into this zone M ₁Interior precalculated position.Move into regional M at this ₁In, for the carrying knee-joint from Handling device 54 (Fig. 1) is subjected to substrate G and is carried on the objective table 76, many (for example 4) lifting poles 86 that liftable moves between the preceding moving position above original position below the platform and the platform are set with predetermined interval.For example, by coming lifting to drive these lifting poles 86 as moving into of drive source air cylinder (not drawing among the figure) with lifting pole lifting unit 85 (Figure 12).

This moves into regional M ₁Also be the zone that begins the board carrying of floating following formula, be suspended in the top desired height and position H of the platform in this zone in order to make substrate G _aOn, the compressed-air actuated ejiction opening 88 of many ejection high pressure or malleation is set with certain density.Here, moving into regional M ₁In, the height and position of the substrate G that above objective table 76, sees or the floating position H that goes up _a, not needing extra high precision, for example can remain in the scope of 100～150 μ m.In addition, in carrying direction (directions X), preferably move into regional M ₁Size bigger than the size of substrate G.Further, moving into regional M ₁In, also can be provided for making the substrate G aligned portions 87 (Figure 12) that the position overlaps on objective table 76.

Be arranged on the regional M of the core of objective table 76 ₃Be resist liquid supply area or the area of application, when substrate G passes through this zone M ₃The time, in the precalculated position from above resist nozzle 78 accept the supply of resist liquid R.At this area of application M ₃Platform above, be suspended in the desired floating position H of going up in order to make substrate G _bOn, the compressed-air actuated ejiction opening 88 of many ejection high pressure or malleation is set with mixing and sucks the attraction mouth 90 of air with negative pressure with certain density.

Here, making the ejiction opening 88 of malleation and the attraction mouth 90 mixing existence of negative pressure is in order to float position H _bRemain on accurately on the set point (for example 50 μ m).That is the area of application M, ₃In the floating position H that goes up _bBe defined in nozzle lower end (ejiction opening) and the gap S between (processed face) (for example 100 μ m) above the substrate.This gap S is the uniformity of left and right sides resist coating thickness and the important parameter of resist consumption, need keep constant accurately.In the present embodiment, to the area of application M by substrate G ₃Part, when adding, add the power vertically downward that the negative pressure suction force of origin self-gravitation mouth 90 produces by vertically upward the power that produces from the compressed air of ejiction opening 88, the balance of the synthesis pressure by controlling this both direction will be floated position H _bMaintain on the set point (for example 50 μ m).In order to control this floating position of going up, can be provided with the feedback control strategies of the height detection sensor (not drawing among the figure) that comprises the height and position that detects substrate G etc.Wherein, the area of application M in the carrying direction (directions X) ₃Size can have the affluence that can under resist nozzle 78, stably form the sort of degree of close clearance S as described above, usually also can be littler than the size of substrate G.

Be set in and move into regional M ₁With the area of application M ₃Between zone line M ₂Be for the height and position that in carrying, makes substrate G from moving into regional M ₁In the floating position H that goes up _a(100～150 μ m) changes or moves to the area of application M ₃In the floating position H that goes up _bThe migration zone of (50 μ m).Move regional M at this ₂In also mixed configuration ejiction opening 88 and attract mouthfuls 90 on objective table 76.But, make to attract mouthfuls 90 density to increase gradually along the carrying direction, therefore in carrying, can make on substrate G floating the position little by little or linearly from H _aMove to H _b

The area of application M ₃Downstream adjacent areas M ₄Be to be used at height and position that carrying makes substrate G from being coated with position H on application floating _b(50 μ m) changes to the floating position H of going up that takes out of usefulness _cThe migration zone of (for example 100～150 μ m).Move regional M at this ₄Platform above, in the carrying direction with the migration of above-mentioned upstream side zone M ₂The configuration pattern mixed configuration ejiction opening 88 of symmetry and attraction mouth 90.

The regional M of the downstream of objective table 76 (right-hand member) ₅Be to take out of the zone.To in resist coating element (CT) 40, accept the substrate G that coating is handled by carrying arm 74 (Fig. 3), take out of regional M from this ₅In the precalculated position or take out of the position and take out of in the adjacent drying under reduced pressure unit (VD) 42 (Fig. 3), downstream.This takes out of regional M ₅Have spatially with above-mentioned and move into regional M ₁The formation of contrast, in order to unload carried base board G from objective table 76 and to accept payment work with carrying arm 74 (Fig. 3), with predetermined interval many (for example 4) lifting poles 92 that liftable moves between the preceding moving position above original position below the platform and the platform are set, and on platform with certain density be provided with many be used to make substrate G be suspended in above-mentioned floating on position H _cOn spout 88.For example, by coming lifting to drive lifting pole 92 as taking out of of drive source air cylinder (not drawing among the figure) with lifting pole lifting unit 91 (Figure 12).

Resist nozzle 78 is included in the resist feed unit 93 (Figure 12), the long chi shape nozzle body 79 that has the length that covers the substrate G on the objective table 76 passing through and extend along the Y direction is connected with resist supply pipe 94 from resist supply source (not drawing among the figure).Nozzle body 79 is formed with along the fine diameter ejiction opening (not drawing among the figure) of the slot-shaped or porous type of nozzle length direction (Y direction) extension in its lower end by door shape or nozzle support body (not drawing among the figure) support of " コ " word shape.This resist nozzle 78 is fixation types, still, for adjust with directly from its below by the gap S of substrate G, for example preferably can in above-below direction, change height and position arbitrarily by the nozzle lifting unit 95 (Figure 12) that constitutes by bolt-nut mechanism etc.

As Fig. 4, Fig. 6 and shown in Figure 7, first and second 84A of board carrying portion, 84B has the first and second guide rail 96As of configured in parallel at the right and left of objective table 76 respectively, 96B, can be at two guide rail 96A, last first and second sliders (carrying main body) 98A that accepts that moves along direction of principal axis (directions X) of 96B, 98B, can be at two

guide rail

96A, 96B is last simultaneously or individually make two

slider

98A, 98B directly advances the first and second mobile carrying drive division 100A, 100B, from two

slider

98A, 98B can load and unload the first and second maintaining part 102A of the left and right sides edge portion that keeps substrate G with extending towards the core of objective table 76,102B.

Here, carrying drive division 100A, 100B respectively by the driving mechanism of straight moving type for example linear motor constitute.In addition, maintaining

part

102A, 102B have following absorption pedestal 104A, the 104B that is combined in the left and right sides edge portion of substrate G by vacuum adsorption force respectively; With supporting

absorption pedestal

104A, 104B at leading section, the base end part of

slider

98A, 98B side as fulcrum, is changed the mode of height and position of leading section and the 106A of base supports portion, the 106B of flat spring type that can strain.With a determining deviation one row ground

configuration absorption pedestal

104A, 104B, the 106A of base supports portion, 106B support each

absorption pedestal

104A, 104B independently.Therefore, substrate G stably can be remained on and respectively adsorb pedestal 104 and base supports portion 106 independently on the height and position (even if different height and positions).

As shown in Figure 6 and Figure 7, the 106A of base supports portion, 106B in the present embodiment are installed on tabular pedestal Lift Part 108A, the 108B on the medial surface that liftably is installed on slider 98A, 98B.By the first and second pedestal actuator 109A, the 109B (Figure 12) that for example air cylinder (not drawing among the figure) that carries on

slider

98A, 98B constitutes, make

pedestal Lift Part

108A, 108B floating the low original position (retreating position) of height and position and going up lifting moving between the corresponding preceding moving position (binding site) of height and position than substrate G with floating of substrate G.

As shown in Figure 8, each

absorption pedestal

104A, 104B, with a plurality of attract Base body 110A, 110B that mouthful 112A, 112B for example are arranged on the Nogata shape of being made by synthetic rubber above.These attract mouthful 112A, a 112B is slot-shaped slotted hole, but also can be the aperture of circle and rectangle.The banded vacuum tube 114A, the 114B that are made of synthetic rubber are connected with absorption pedestal 104A, 104B.Pipeline 116A, the 116B of these

vacuum tubes

114A, 114B is communicated with the vacuum source of first and second pedestals absorption control part 115A, 115B (Figure 12) respectively.

First and second pedestals absorption control part 115A, 115B (Figure 12), the transfer valve (not drawing among the figure) that process is switched pipeline 116A, the 116B (Fig. 8) of

vacuum tube

114A, 114B also is connected with compressed air source (not drawing among the figure), when make

absorption pedestal

104A, 104B from the side edge part of substrate G from the time, this transfer valve is switched to this compressed air source, supply with the compressed air of malleation or high pressure to

absorption pedestal

104A, 104B.

In maintaining

part

102A, 102B, as shown in Figure 4, preferably with vacuum suction pedestal 104A, the 104B of one-sided row and the 106A of base supports portion, the 106B divergence type that is separated into every group or the formation of self fully.But, as shown in Figure 9, also can be with being provided with the 120A of base supports portion, the 120B that a flat spring that cuts

part

118A, 118B forms an one-sided row umber, disposing the absorption pedestal 104A of one-sided row, the one-piece type formation of 104B thereon.

As mentioned above, on objective table 76, be provided with many ejiction openings 88.In the present embodiment, about belonging to the regional M of moving into of objective table 76 ₁With take out of regional M ₅Each ejiction opening 88, be provided with in the inside of objective table 76 in the mode of flow transfer valve and use the ejection control part 122 that switches the ejection flow of air with the relative position relation of substrate G individually and automatically.

Figure 10 represents the formation according to the ejection control part 122 of an execution mode.The inside that this ejection control part 122 is included in objective table 76 forms the ball valve 126 that has the valve chamber 124 of spherical surface body shape wall and be provided with movably in this valve chamber 124.In the top and the bottom of valve chamber 124, be respectively formed at mutual opposed outlet 124a of vertical direction and inlet 124b.Outlet 124a and the ejiction opening 88 corresponding with this ejection control part 122 are communicated with.Inlet 124b is communicated with compressed air feed path 128 in the bottom of objective table 76 process.

Figure 11 represents an example of the pipe arrangement pattern of the compressed air feed path 128 in the objective table 76.For example the compressed air from compressed air sources such as compressor (not drawing among the figure) externally flows through in the pipe arrangement 130, and the compressed air that imports in the objective table 76 imports unit 132.To import the compressed air that unit 132 imports by compressed air therefrom and distribute to many compressed air feed paths 128 that spread in the objective table 76.

In Figure 10, the periphery of the outlet 124a of valve chamber 124 constitutes valve seat.In this valve seat, by with predetermined space (for example 90 ° of intervals) along the peripheral direction setting and form a plurality of (4) from the 124c of ditch portion that extends radially of outlet 124a.Therefore, be close to or be located on the valve seat by making valve body 126, even if clog outlet 124a, compressed air also can escape to ejiction opening 88 sides by the 124c of ditch portion from valve chamber 124.Valve body 126 is to have a for example resinous spheroid that internal diameter little than valve chamber 124 encloses the diameters of two circles, and the Lower Half of sphere is subjected to and the corresponding power P vertically upward of air pressure of the 124b side that enters the mouth _U, and the first half of sphere is subjected to and corresponding power (reaction) P vertically downward of the air pressure of the 124a side that enters the mouth _DIn addition, always on valve body 126, acting on vertically downward and the corresponding gravity P of its quality _G(steady state value).Valve body 126 is with power P vertically upward as described above _UPower (P vertically downward _D+ P _G) difference correspondingly in valve chamber 124, change the position (height and position) of vertical direction.

In the present embodiment, as shown in figure 10, whether corresponding above each ejiction opening 88 with substrate G, in the ejection control part 122 of this ejiction opening 88 below just, the height and position of the valve body 126 in the valve chamber 124 is switched to and export the primary importance that the valve seat of 124a side is close to, perhaps leave some the second place that in valve chamber 124, becomes suspended state from this valve seat.

That is, be in top (the position H on tight setting is floating of each ejiction opening 88 as substrate G _aFollowing is last near distance) time because from the reaction force of substrate G, near this ejiction opening 88 and near the air pressure the outlet 124a of its valve chamber 124 below just increase, act on power vertically downward on the valve body 126 (P particularly _D) and power P vertically upward _UEqually matched or be increased to than its big slightly degree, valve body 126 leaves from the valve seat of outlet 124a side.Therefore, outlet 124a becomes open state, and the compressed air that imports to valve chamber 124 from inlet 124b sprays from ejiction opening 88 by outlet 124a with big flow.

As mentioned above, by many ejiction openings of on objective table 76, forming 88 and be used for to they supply with produce floating on the compressed-air actuated compression supply source used of power, outside pipe arrangement 130, compressed air feed path 128, ejection control part 122, further at the regional M of objective table 76 ₂, M ₃, M ₄In mixes with ejiction opening 88 and to have attraction mouth 90 that ground forms and the vacuum mechanism etc. that is used for negative pressure suction force given them, the stylobate plate on the height of wanting that is configured for substrate G is suspended on the objective table 76 expeditiously floats top 134 (Figure 12).

Figure 12 represents the formation of the control system in the resist coating element (CT) 40 of this execution mode.Controller 136 is made of microcomputer, interior each one, particularly control desk substrate of control coating element floats top 134, resist feed unit 93, nozzle lifting unit 95, moves into lifting pole lifting unit 85, takes out of with lifting pole lifting unit 91, first and second and carry each action of drive division 100A, 100B, first and second pedestals absorption control part 115A, 115B, the first and second pedestal actuator 109A, 109B etc. and all move (in proper order).

Then, use Figure 13～Figure 23, the coating work of treatment in the resist coating element (CT) 40 of this execution mode is described.Figure 13 shows the position or the state of each one in the unit (CT) 40 that applies in 1 circulation of dealing with the work with slip chart.The position or the state of each main movable part in constantly that Figure 14～Figure 22 is illustrated in 1 circulation with general plane figure.Figure 23 represents the state of Figure 22 with stereogram.

Controller 136 for example will be stored in resist coating handling procedure in the storage medium such as CD and be taken in the main storage and implement, and control a succession of coating work of treatment of sequencing.

Figure 14 represents the moment t with Figure 13 ₀Correspondence is being that Handling device 54 (Fig. 1) is with untreated new substrate G by the machine of moving into immediately _iMove into the regional M of moving into of objective table 76 ₁After state.At this moment, move into regional M ₁Lifting pole 86 G that will just accept _iMove on the position before flatly being supported on.First 84A of board carrying portion just turns back to slider 98A and moves into regional M ₁The interior carrying original position P that moves into the position correspondence _aAt this constantly, pedestal absorption control part 115A begins to supply with vacuum to absorption pedestal 104A.Finally, pedestal actuator 109A makes absorption pedestal 104A drop to original position (retreating position).On the other hand, second 84B of board carrying portion just will finish preceding 1 substrate G that coating is handled on objective table 76 _I-1Give and take out of regional M ₅Slider 98B arrives and takes out of regional M ₅The interior carrying final position P that takes out of the position correspondence _b, pedestal absorption control part 115B removes the vacuum adsorption force from absorption pedestal 104B.Replace, in order to unload carried base board G _I-1, lifting pole 92 rises to the preceding moving position (substrate is paid and accepted the position) of platform top from the original position of platform below.

After this, moving into regional M ₁ Middle lifting pole 86 descends, and makes substrate G _iDrop to carrying and promptly float upward position H with height and position _a(Fig. 5).Then, aligned portions 87 work to push the mode of pressing component (not drawing the figure) as shown by arrow J like that from the four directions, are pushed the floating substrate G that goes up state _i, make substrate G _iLocation (the moment t of Figure 15, Figure 13 on objective table 76 ₁).Second 84B of board carrying portion is V at full speed ₁Make slider 98B from carrying final position P _bTurn back to the carrying stop position P corresponding with applying the starting position _cThe machine of taking out of is promptly carried arm 74 and is linked into and takes out of regional M ₅, accept substrate G from lifting pole 92 _I-1, take out of the outside (moment t of Figure 15, Figure 13 of platform 76 ₁).In addition, will apply the starting position is set in and moves into regional M ₁In move into position and resist nozzle 78 positive lower positions be resist liquid supply position P _sBetween.

When moving into regional M ₁In finish substrate G _iTo on time, pedestal actuator 109A work in first 84A of board carrying portion immediately after this makes absorption pedestal 104A rise (UP) to preceding moving position (binding site) from original position (retreating position).Absorption pedestal 104A connects vacuum from its front, with the floating substrate G that goes up state _iA side's (left side) side edge part contact, combine (the moment t of Figure 16, Figure 13 by vacuum adsorption force immediately afterwards ₂).At absorption pedestal 104A and substrate G _iLeft border portion combine after soon, aligned portions 87 is kept out of the way to the precalculated position pressing component.On the other hand, second 84B of board carrying portion, one side makes slider 98B at carrying stop position P _cStandby, one side begins vacuum feed to adsorbing pedestal 104B.In addition, taking out of the M of portion ₅In, take out of the below (moment t of Figure 16, Figure 13 that keeps out of the way platform with lifting pole 92 ₂).

Then, first 84A of board carrying portion is when keeping substrate G with maintaining part 102A _iThe constant platform 98A that makes of left border portion with constant speed V than higher speed ₂, from carrying original position P _aDirectly advance mobilely along substrate moving direction (directions X), arrive the carrying stop position P of the upstream side corresponding with the coating starting position on the objective table 76 _cThe time, make platform 98A temporarily stop at the there (moment t of Figure 17, Figure 13 ₃).On the coating starting position, substrate G _iOn the front end (coating initial) of resist the area of application be positioned at resist nozzle 78 just below.In addition, from carrying original position P _aTo upstream side carrying stop position P _cBoard carrying in, substrate G _iMargo dexter portion become free end, still, the floating power constraint height and position of going up by being produced by the floating top 134 of stylobate plate moves on the roughly the same height of the margo dexter portion that the maintaining part 102A with first 84A of board carrying portion combines.

As mentioned above, when arriving upstream side, the slider 98A of first 84A of board carrying portion carries stop position P _cThe time, pedestal actuator 109B work among second 84B of board carrying portion of standby herein makes absorption pedestal 104B rise (UP) to preceding moving position (binding site) from original position (retreating position).Absorption pedestal 104B is because connect vacuum, thus with substrate G _iThe opposing party's (right side) side edge part contact after combine by vacuum adsorption force immediately.On the coating starting position on the objective table 76, substrate G _iHeight and position at substrate rearward end side (H _a) and substrate leading section side (H _b) difference, but their poor (H _a-H _b) peak is 100 μ m, compare and can ignore to the climb (for example counting mm) of preceding moving position with original position from absorption pedestal 104B.Like this, at the carrying stop position P corresponding with the coating starting position on the objective table 76 _cOn, first and second 84A of board carrying portion, 84B clamp the floating substrate G that goes up state _iAnd opposed mutually, form substrate G _iBoth side edges portion do not remain on the locational state of the equal height (moment t of Figure 18, Figure 13 ₄).On the other hand, in diagram, omit, but 95 work of nozzle lifting unit descend resist nozzle 78, make the ejiction opening and the substrate G of resist nozzle 78 _iBetween gap S consistent with set point (for example 50 μ m).

Then, first and second 84A of board carrying portion, 84B are to compare the constant speed V of low speed ₃Make slider 98A, 98B from carrying stop position P _cDirectly advance the mobile (moment t of Figure 13 along board carrying direction (directions X) ₅).On the other hand, in resist liquid feed unit 93, begin to spray resist liquid R by resist nozzle 78.Like this, by towards along directions X with constant speed V ₃Supply with position P by the resist liquid that resist nozzle 78 is just following _sSubstrate G _iAbove, by the long type resist nozzle 78 that extends along the Y direction with the constant banded resist liquid R of flow ejection, from substrate G _iFront end form the coated film RM (moment t of Figure 19, Figure 13 of resist liquid towards the rear end ₆).

As substrate G _iRearward end (coating end lines) reach resist nozzle 78 just below resist liquid supply with position P _sThe time, finish coating in this etching and handle, the ejection that resist liquid feed unit 93 finishes from the resist liquid R of resist nozzle 78, and first and second 84A of board carrying portion, 84B make separately

platform

98A, 98B stop at carrying final position P simultaneously _bIn face of position (downstream carrying stop position) P _dOn.On the other hand, moving into regional M ₁In, in application job, move into follow-up new substrate G by Handling device 54 _i, and consign to the lifting pole 86 (moment t of Figure 20, Figure 13 ₇).

In first 84A of board carrying portion, slider 98A has just arrived carrying stop position P _d, pedestal absorption control part 115A just stops to supply with vacuum to absorption pedestal 104A, and meanwhile, pedestal actuator 109A makes the moving in the past position (binding site) of absorption pedestal 104A drop to original position (retreating position), makes absorption pedestal 104A from substrate G _iLeft end separate the (moment t of Figure 20, Figure 13 ₈).At this moment, pedestal absorption control part 115A supplies with malleation (compressed air) to absorption pedestal 104A, quickens from substrate G _iSeparation.Then, V at full speed ₅Make slider 98A along mobile in the opposite direction, and turn back to carrying original position P with board carrying side _a(the moment t of Figure 21, Figure 13 ₉).

On the other hand, in second 84B of board carrying portion, keep substrate G with maintaining part 102B _iThe constant platform 98B that makes of right-hand end with higher constant speed V ₄Along board carrying direction (directions X) from downstream substrate stop position P _dMove to carrying final position P _b(the moment t of Figure 21, Figure 13 ₉).At this moment, substrate G _iLeft border portion become free end, but still the floating power constraint height and position of going up by producing by the floating top 134 of stylobate plate, with margo dexter portion roughly the same height on move.And slider 98B has just arrived carrying final position P _b, pedestal absorption control part 115B just stops to supply with vacuum to absorption pedestal 104B, and meanwhile, pedestal actuator 109B makes the moving in the past position (binding site) of absorption pedestal 104B drop to original position (retreating position), makes absorption pedestal 104B from substrate G _iRight-hand end separate.At this moment, pedestal absorption control part 115B supplies with malleation (compressed air) to absorption pedestal 104B, quickens from substrate G _iSeparation.Replace, in order to unload carried base board G _i, lifting pole 92 rises to the preceding moving position (moment t of Figure 22, Figure 23, Figure 13 of platform top from the original position of platform below ₁₀).

As mentioned above, in this embodiment, on objective table 76, be provided with respectively and move into regional M ₁, the area of application M ₃, take out of regional M ₅, by in these each zones, transmitting substrate in turn, independent or carry out substrate side by side and move into work, resist liquid supply work, substrate and take out of work in each zone.By this pipeline system, make the intermittent time, and will move into the required time (T of work on the objective table 76 about 1 substrate G _IN), on objective table 76 from moving into regional M ₁Be transported to and take out of regional M ₅Required time (T _C), from taking out of regional M ₅Take out of required time (T _OUT) coating that obtains of adding up handles the required time (T of 1 circulation _C+ T _IN+ T _OUT) compare, shorten significantly.And, because by utilize from be arranged on objective table 76 above the gas pressure of ejiction opening 88 ejections, substrate G is suspended in the air, one side is supplied with resist liquid and be coated on the substrate G by the long type nozzle 78 of fixation in the substrate G one side that carrying on the objective table 76 is suspending, so can be reasonably corresponding with the maximization of substrate expeditiously.

And, for carrying substrate G on objective table 76 _i, first and second 84A of board carrying portion, the 84B that are configured in objective table 76 both sides simultaneously keep substrate G _iBoth side edges portion, the one side move along the board carrying direction.Here, first 84A of board carrying portion is from moving into regional M ₁Interior moves into the position by the just following coating position of long type resist nozzle, up to being set in the coating position and taking out of regional M ₅Interior takes out of the coating end position maintenance between the position and carries the substrate G that is suspended on the objective table 76 _iOn the other hand, second 84B of board carrying portion, from be set in move into position and the coating starting position of coating between the position by the coating position to taking out of that the position keeps and carrying is suspended in substrate on the platform.

First and second 84A of board carrying portion, 84B keep and carrying substrate G together _iThe zone, be not from move into the zone to take out of the zone whole carryings interval, but from the coating starting position to the coating end position the mesozone.First 84A of board carrying portion is when with substrate G _iBe transported to coating during end position, finish there this substrate G _iTransportation, turn back to immediately and move into the position and carry out follow-up new substrate G _I+1Carrying.On the other hand, second 84B of board carrying portion is individually with substrate G _iBe transported to and take out of the position from the coating end position,, wait for that first 84A of board carrying portion is individually with next piece substrate G then from moving into the coating starting position that the position turns back to the front _I+1Be transported to this position.

Like this, between first and second 84A of board carrying portion, 84B, the board carrying work that both are carried out simultaneously is limited to necessary Min. (requiring the interval in the coating of tight substrate height), in addition carrying or mobile working in the interval of individually respectively holding individually (move between the lateral areas, take out of between the lateral areas) can be realized increasing substantially thereby the improvement significantly of intermittent time of board carrying efficient.In addition, guide rail 96A, the 96B on the both sides on the objective table 76 are laid in, do not need to be applied to the other end from an end of objective table 76, first 84A of board carrying portion can only be applied to the coating end position with guide rail 96A from moving into the position, second 84B of board carrying portion can only be applied to guide rail 96B and take out of the position from the coating starting position, also can reach the purpose of the cost of the handling system of cutting down

guide rail

96A, 96B and carrying drive division 100A, 100B etc., also the guide rail 96B of second 84B of the board carrying portion side can be extended to and move into the position, about the substrate that load the front, two

substrates trucking department

84A, 84B also can begin board carrying together from moving into the position.

More than, preferential execution mode of the present invention has been described, but the present invention is not limited to above-mentioned execution mode, in its technological thought scope, can carry out all distortion.

For example, the maintaining part 102A of the 84A of board carrying portion, 84B in the above-mentioned execution mode, pedestal 104A, the 104B that 102B has vacuum adsorption type, but also can be the pedestal etc. of the side edge part of the maintenance substrate G that mechanically (for example clips ground).In addition, also can adopt various ways and formation in the mechanism (106A of base supports portion, 106B,

pedestal lifting unit

106A, 106B, pedestal regulon 109A, 109B etc.) that is used for

pedestal

104A, 104B are combined with the side edge part of substrate G with freely loading and unloading.In the above-described embodiment with resist nozzle 78 as fixation type, but resist nozzle 78 is moved horizontally when needing.

In the above-described embodiment, make the board carrying that is undertaken by first 84A of board carrying portion just in time temporarily stop at the position (P corresponding with applying the starting position _c) on, make the board carrying that is undertaken by first and second 84A of board carrying portion, 84B just in time temporarily stop at the position (P corresponding with applying end position _d) on.As a variation, also can not carry out so temporarily stopping, forming make second 84B of board carrying portion with the coating corresponding position (P in starting position _c) go up with move in substrate G combine, make first 84A of board carrying portion with apply the corresponding position (P of end position _d) go up the formation that the substrate G from move separates.As other variation, also can be formed on from the coating the corresponding position (P in starting position _c) on the position of departing from, make first 84A of board carrying portion temporarily stop board carrying and second 84B of board carrying portion joined in the board carrying, from the corresponding position (P of coating end position _d) on the position of departing from, make first and second 84A of board carrying portion, 84B temporarily stop board carrying and make first 84A of board carrying portion carry out descending from the substrate of board carrying.

Resist applying device in the coating developing system that above-mentioned execution mode and LCD make is relevant, but the present invention can be applied to treatment fluid is supplied with any processing unit and application on the processed substrate.So, as the treatment fluid among the present invention, except resist liquid, for example also can be the coating liquid of interlayer dielectic, dielectric substance, wiring material etc., also can be developer solution and flushing liquor etc.Processed substrate among the present invention is not limited to the LCD substrate, and the flat-panel monitor that also can be other is with substrate, semiconductor wafer, CD substrate, glass substrate, photomask, tellite etc.

Claims

1. a substrate board treatment is characterized in that, comprising:

Objective table has many ejiction openings in the above, by the pressure of the gas by the ejection of described ejiction opening processed substrate is suspended on the desired height;

Be used for described substrate is moved into the portion that moves into that moves into the position on the described objective table;

Be used for described substrate is taken out of the portion that takes out of that take out of the position from the described objective table;

The treatment fluid supply unit, described move into the position and describedly take out of coating position between the position, above described objective table, with treatment fluid supply with described substrate above;

The first board carrying portion, from described move into the position by described coating position to being set in described coating position and described primary importance of taking out of the position, keep also carrying to be suspended in described substrate on the described objective table; With

The second board carrying portion, from be set in described move into the second place between position and the described coating position by described coating position to the described position of taking out of, keep also carrying to be suspended in described substrate on the described objective table.

2. substrate board treatment according to claim 1 is characterized in that:

With described substrate is placed in the moment roughly the same on the described primary importance, finish the coating of treatment fluid on described substrate.

3. substrate board treatment according to claim 1 is characterized in that:

The described first board carrying portion comprises

The mode that extends in parallel with the moving direction with described substrate is configured in first guide rail on one side of described objective table;

Can along described first guide rail move first the carrying main body;

To move the first carrying drive division that described first mode of carrying main body drives along described first guide rail; With

Extend to the core of described objective table from the described first carrying main body, releasably keep first maintaining part of first side edge part of described substrate.

4. substrate board treatment according to claim 3 is characterized in that:

The described first board carrying portion, remove on the described primary importance in described first maintaining part to the maintenance of first side edge part of described substrate, after this make the described first carrying main body turn back to the described position of moving into immediately from described primary importance.

5. substrate board treatment according to claim 3 is characterized in that:

Described first maintaining part comprises

Releasably be adsorbed on first pedestal of first side edge part of described substrate;

Base end part is fixed on the described first carrying main body, and the first base supports portion that leading section is combined with described first pedestal; With

Control the first pedestal absorption control part of described first pedestal to the absorption of described substrate.

6. substrate board treatment according to claim 5 is characterized in that:

Described first pedestal absorption control part has for described first pedestal is combined with described substrate, and to the first negative pressure feeding portion of described first pedestal supply negative pressure.

7. substrate board treatment according to claim 6 is characterized in that:

Described first pedestal absorption control part has for described first pedestal is separated from described substrate, and to the first malleation feed unit of described first pedestal supply malleation.

8. according to each described substrate board treatment in the claim 5,6,7, it is characterized in that:

Described first maintaining part have for make described first pedestal and described substrate in conjunction with and make the described first base supports portion move, separate and the first pedestal actuator that the described first base supports portion is back moved from described substrate forward in order to make described first pedestal.

9. according to each described substrate board treatment in the claim 5～7, it is characterized in that:

Described first maintaining part makes described first pedestal combine with described substrate described moving on the position, described first pedestal is separated from described substrate.

10. according to each described substrate board treatment in the claim 4～7, it is characterized in that:

The described first base supports portion correspondingly makes the height and position displacement of its leading section with the height and position of described substrate.

11., it is characterized in that according to each described substrate board treatment in the claim 1～7:

Moving to described taking out of the roughly the same moment of position side with making described substrate from the described second place, the coating of beginning treatment fluid on described substrate.

12., it is characterized in that according to each described substrate board treatment in the claim 1～7:

The described second board carrying portion comprises

The mode that extends in parallel with the moving direction with described substrate is configured in second guide rail on the another side of described objective table;

Can along described second guide rail move second the carrying main body;

To move the second carrying drive division that described second mode of carrying main body drives along described second guide rail; With

Extend to the core of described objective table from the described second carrying main body, releasably keep second maintaining part of second side edge part of described substrate.

13. substrate board treatment according to claim 12 is characterized in that:

The described second board carrying portion, described substrate being placed in the described maintenance of removing immediately after taking out of in the position in described second maintaining part second side edge part of described substrate, then make the described second carrying main body turn back to the described second place from the described position of taking out of.

14. substrate board treatment according to claim 12 is characterized in that:

Described second maintaining part comprises

Second pedestal that combines with second side edge part of described substrate releasably;

Base end part is fixed on the described second carrying main body, and the second base supports portion that leading section is combined with described second pedestal; With

Control the second pedestal absorption control part of described second pedestal to the absorption of described substrate.

15. substrate board treatment according to claim 13 is characterized in that:

Described second pedestal absorption control part has for described second pedestal is combined with described substrate, and to the second negative pressure feeding portion of described second pedestal supply negative pressure.

16. substrate board treatment according to claim 14 is characterized in that:

Described second pedestal absorption control part has for described second pedestal is separated from described substrate, and to the second malleation feed unit of described second pedestal supply malleation.

17. substrate board treatment according to claim 13 is characterized in that:

Described second pedestal absorption control part have for make described second pedestal and described substrate in conjunction with and make the described second base supports portion move, separate and the second pedestal actuator that the described second base supports portion is back moved from described substrate forward in order to make described second pedestal.

18. substrate board treatment according to claim 13 is characterized in that:

Described second pedestal absorption control part makes described second pedestal combine with described substrate on the described second place, described taking out of described second pedestal is separated from described substrate.

19. substrate board treatment according to claim 13 is characterized in that:

The described second base supports portion correspondingly makes the height and position displacement of its leading section with the height of described substrate.

20., it is characterized in that according to each described substrate board treatment in the claim 1～7:

The described portion of moving into comprises

Be used for moving on the position on described objective table with the many first lifting poles of described base plate supports at the pole front end; With

Make the first lifting pole lifting unit that move forward position between lifting moving of the described first lifting pole above original position below the described objective table and described objective table.

21., it is characterized in that according to each described substrate board treatment in the claim 1～7:

The described portion of taking out of comprises

Be used for taking out of on the position on described objective table with the many second lifting poles of described base plate supports at the pole front end; With

Make the second lifting pole lifting unit that move forward position between lifting moving of the described second lifting pole above original position below the described objective table and described objective table.

22., it is characterized in that according to each described substrate board treatment in the claim 1～7:

Described treatment fluid supply unit comprises the nozzle of the long type with the fine ejiction opening of the diameter that extends along the direction in the board carrying path on the cross-section described objective table, on described coating position,, spray described treatment fluid from described ejiction opening towards the described substrate below described nozzle.

23. a substrate processing method using same is characterized in that:

Move into position, coating starting position, apply end position and take out of the position in the one row ground setting of objective table upper edge board carrying direction;

Pressure by the gas of the ejection of a plurality of ejiction openings above being arranged on described objective table is suspended on the desired height processed substrate;

On described objective table, moving into first position that the position keeps described substrate to first interval of described coating starting position from described, first and second positions that second interval, keep described substrate from described coating starting position to described coating end position, second position that from described coating end position to described the 3rd interval of taking out of the position, keeps described substrate, the described substrate of carrying in described board carrying direction;

Described substrate by described second interval move during in, coating treatment fluid on described substrate.

24. substrate processing method using same according to claim 23 is characterized in that:

First and second positions of described substrate are the side edge parts of the pair of right and left seen from the board carrying direction.

25. substrate processing method using same according to claim 23 is characterized in that:

Set the transporting velocity of the described substrate in described first, second and the 3rd interval independently.

26. substrate processing method using same according to claim 23 is characterized in that:

Set described first, second independently and go up height with the floating of described substrate in the 3rd interval.

27. substrate processing method using same according to claim 23 is characterized in that:

On described coating starting position, described substrate is temporarily stopped, beginning maintenance to second position of described substrate.

28. substrate processing method using same according to claim 23 is characterized in that:

On described coating starting position, the mobile of described substrate stopped, beginning maintenance to second position of described substrate.

29. substrate processing method using same according to claim 23 is characterized in that:

On described coating end position, described substrate is temporarily stopped, finishing maintenance to first position of described substrate.

30. substrate processing method using same according to claim 23 is characterized in that:

On described coating end position, the mobile of described substrate stopped, finishing maintenance to first position of described substrate.

31. substrate processing method using same according to claim 23 is characterized in that:

Described substrate by described second interval move during in, follow-up new substrate is moved into the described position of moving into.

32. a substrate processing program is characterized in that, it is implemented:

Processed substrate moved into the operation in the position moved into of the objective table that has a plurality of ejiction openings in the above;

On described objective table, described substrate is suspended in the state on the desired height, move into the operation that the position keeps described substrate to the coating starting position ground, first position is carried from described;

On described objective table, described substrate is suspended in the state on the desired height, the operation that keeps the ground, first and second positions of described substrate to carry to described coating end position from described coating starting position;

On described objective table, make described substrate move to from described coating starting position the coating end position during, on described substrate the operation of coating treatment fluid;

On described objective table, described substrate is suspended in the state on the desired height, from described coating end position to taking out of the operation that the position keeps the ground, second position of described substrate to carry; With

Take out of the operation of taking out of locational described substrate that is placed in described objective table.