JP5373331B2 - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device smoothly conveying a substrate and positioning the substrate without making any alterations even when a size of the substrate as an object to be treated is remarkably changed, and either a length side or a width side is treated. <P>SOLUTION: A substrate conveying means 14 for conveying a panel substrate 1 between stages 10 to 13 of the substrate treatment device comprises a substrate pitch feed driving part 30, a substrate support part 31 and a substrate floating part 32. The substrate pitch feed driving part 30 comprises: a movable beam 40; and a driving member 41 which moves the movable beam 40 up and down, and back and forth. The substrate support part 31 is a stationary member disposed for all stages, the movable beam 40 and the substrate support part 31 suck the panel substrate 1 by vacuum. The substrate floating part 32 forms an air layer between the back surface of the panel substrate 1 and the substrate floating part to float the panel substrate 1 and, thereby, the panel substrate 1 is not allowed to slidingly contact with other members. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention, while transporting the substrate, those about the substrate processing equipment for performing a process on a predetermined position of the substrate.

  In a flat display device such as a liquid crystal display, a plasma display, or an organic EL display, an IC circuit element constituting a driver circuit is mounted on at least one edge region of a panel substrate made of a transparent substrate such as glass. For example, on a liquid crystal panel substrate, an IC circuit element is mounted on at least one side and a maximum of four sides to form a liquid crystal module.

  As a typical method for mounting an IC circuit element on a liquid crystal panel substrate, a driver IC constituting the IC circuit element is directly mounted on the panel substrate, and a large number of electrodes provided on the driver IC are wired on the panel substrate. There is a COG (Chip On Glass) system that is electrically connected to the circuit, and an IC circuit element is formed from a COF (Chip On Film) in which a driver IC is mounted on a flexible substrate, and the electrode provided on the flexible substrate of this IC circuit element There is also a TAB method in which TAB (Tape Automated Bonding) is mounted so as to be electrically connected to the wiring portion of the panel substrate.

  Regardless of the mounting method, a fine wiring pattern is formed on the panel substrate, and an anisotropic conductive sheet, that is, an ACF (Anisotropic Conductive Film) is attached to the portion where the wiring pattern is formed. None, IC circuit elements are mounted by COG or TAB via this ACF. The ACF has a function of fixing the IC circuit element to the panel substrate, and a function of electrically connecting a large number of electrodes formed on the IC circuit element and a wiring pattern provided on the panel substrate. Is composed of a binder resin made of a thermosetting resin in which fine conductive particles are dispersed.

  For example, when an IC circuit element composed of a flexible substrate on which a liquid crystal driver IC is mounted is mounted on a panel substrate of a liquid crystal panel by the TAB method, the IC circuit element is punched out from a TCP (Tape Carrier Package), and the IC circuit element is flexible. The electrodes formed on the substrate are aligned so as to match the wiring pattern of the panel substrate, and then temporarily crimped. The temporary press-bonding means has a suction means for vacuum-sucking the IC circuit element. At this stage, the IC circuit element is held by the adhesive force of the binder resin in the ACF. Therefore, the binder resin is in an uncured state, and the binder resin is cured by the main compression performed thereafter. The main pressure bonding is performed by placing the panel substrate on the receiving table and pressurizing the bonding portion of the COF to the liquid crystal panel with a pressure heating blade heated from above, and as a result, the IC circuit element via the conductive particles of the ACF. The electrode and the wiring of the panel substrate are electrically connected, and the binder resin is thermally cured.

  As described above, the mounting of the IC circuit element on the panel substrate is performed in three stages of the ACF pasting, the IC circuit element temporary pressure bonding, and the main pressure bonding. Such a liquid crystal module assembling apparatus having a three-stage configuration is conventionally known as disclosed in Patent Document 1, for example. In Patent Document 1, the main pressure bonding is performed in two stages. For this reason, the main pressure bonding stage has a two-stage structure, and the whole has a four-stage structure.

In the apparatus of Patent Document 1, an ACF adhering stage, a temporary press-bonding stage, and a main press-bonding stage are arranged in a straight line. It is configured. The conveyor is composed of a pair of belts, and the positioning table is arranged at an intermediate position between the two belts constituting the conveyor and can be moved up and down. That is, the panel substrate is transported by moving the belt with the positioning table positioned below the transport surface of the transport conveyor. When the panel substrate is transported to a predetermined position in each stage, the panel substrate is separated from the belt by raising the positioning table, and the position is adjusted with respect to the processing means in each stage. Each processing stage is provided with a substrate support, and the processing mechanism provided on each stage is operated in a state where the lower surface of the area where the IC circuit element is mounted on the panel substrate is supported by the substrate support. , ACF is affixed, the IC circuit element is mounted, and then the IC circuit element is thermocompression bonded.
JP 2003-76290 A

  In Patent Document 1 described above, since the panel substrate is placed on a pair of belts constituting a conveyor, the width of the belt and the distance between the belts depend on the size of the panel substrate. In addition, the positioning table is arranged at an intermediate position between both belts. For this reason, the panel substrate to be processed has a constant size and can process only one of the long side and the short side.

  Here, the positional relationship with the processing mechanism is fixed in each stage in the mounting area of the IC circuit elements on the panel substrate conveyed by the conveyor. Therefore, the end of the panel substrate on the conveyor is at a fixed position on one of the pair of belts. When the size of the panel substrate changes, the position on the other belt changes, and the contact position with the positioning table also changes. For this reason, when processing panel substrates of different sizes, or when processing the same side of the same panel, the same transfer conveyor must be used unless the positions of the transfer conveyor and positioning table are adjusted. Will not be able to use.

  The present invention has been made in view of the above points. The object of the present invention is to reduce the short side even when the size of the substrate to be processed changes greatly or when the long side is processed. In processing the side, the substrate can be smoothly transported and positioned without any change.

In order to achieve the above-described object, the present invention provides an edge portion of at least one side of a substrate while intermittently transporting the substrate constituting the display panel to a processing portion in which a plurality of processing mechanisms are linearly arranged. In a substrate processing apparatus that performs processing in each region by each processing mechanism, a substrate transport unit that transports the substrate is provided along the arrangement direction of the processing mechanisms and performs processing on the substrate by the processing mechanism. Sometimes, a substrate supporting member that fixes the substrate by applying a negative pressure to the back surface of the substrate opposite to the surface to be processed, and a portion of the substrate that is close to the edge region to be processed are held. , floating the the substrate pitch feed driving means for feeding pitch of the substrate toward the arrangement direction of the processing mechanism, the substrate wherein a portion of the opposite side of the substrate pitch feed drive means to the respective processing mechanisms A substrate float means for, and is characterized in that it comprises a.

  The substrate transport means pitches the substrate. The pitch feeding interval may be one pitch of the processing mechanism, or may be an interval smaller than that. However, when the interval is short, it is set to 1 / integer of the arrangement interval of the processing mechanism. The substrate is separated from the substrate support member during transport and is supported by the substrate support member during processing. Then, the substrate is supported by the substrate support member or fixed to the substrate pitch feed driving means. This part is an edge region of the side where processing is performed, and the floating region other than this region is floating. In order to achieve this, a substrate float means is provided. Therefore, at the position facing the substrate float means on the substrate, it does not come into contact with any member and, of course, is conveyed without sliding.

  Here, the substrate pitch feed driving means intermittently feeds the substrate at regular pitch intervals, and a cylinder or a cam mechanism can be used, but a movable beam that operates in the order of ascending, advancing, descending, and retreating. It is desirable to be of the walking beam type with And the adsorption | suction part which makes a negative pressure act on the back surface of a board | substrate is set as the structure provided on the surface of this movable beam and a board | substrate support member. When the movable beam is lowered and the substrate is attracted and supported by the substrate support member, the substrate is peeled from the substrate support member and held by the movable beam by raising the movable beam straight. At this time, the substrate is not displaced in the transport direction or in the opposite direction, nor is it displaced in the rotation direction, and the substrate is not displaced. Further, by lowering the movable beam adsorbing the substrate straight downward, the substrate is adsorbed and supported by the substrate support member without being displaced and separated from the movable beam. As a result, the substrate moves to a predetermined position almost accurately during pitch feeding, and is not displaced. At the time of substrate transfer, a slight misalignment may occur, but this misalignment amount is suppressed to tens of μm or less, and if this amount of misalignment is reached, the substrate processing mechanism side can easily adjust the position. Is not a special problem.

  Regardless of the size of the substrate or the processing of any side, the edge region of the side to be processed must be arranged and transported at a constant position in the substrate transporting means. Can do. The intermediate part of the side to be processed of the substrate with respect to the substrate pitch feed driving means when processing the long side of the substrate, when processing the short side, and when processing substrates of different sizes Or the rear end of the transport direction can be a fixed position in each processing stage, that is, the reference position, but the side to be processed and the front corner in the transport direction is the reference position. When set to be arranged, the positional relationship between the corners of the substrate and the processing mechanism at the start of processing can be controlled.

  The position where the substrate pitch feed driving means and the substrate support member are in contact with each other is the same position, but the position of the opposite edge differs depending on the side of the substrate to be processed and the size of the substrate. By making the substrate float means the most part excluding the contact position to the substrate pitch feed driving means and the substrate support member, a large-sized substrate having a size several to ten times larger than a predetermined size substrate is obtained. By floating the substrate up to the substrate, the substrate can be transported without contacting other members. In addition, when the processing is performed, the movable beam in the substrate pitch feed driving means is arranged at a predetermined position with the front position in the transport direction of the edge region where processing is performed on the substrate as a reference position. This is advantageous in terms of arrangement and operation control.

  The substrate float means acts on the substrate with pressurized air, and for this purpose, an air ejection portion is provided on the upper surface of the pressurized air chamber. This air ejection portion can be formed of, for example, a porous ceramic plate. When air is ejected from the surface of the porous ceramic plate, an air layer is formed between the back surface of the substrate and the plate, and the porous portion faces in an arbitrary direction. An air layer having a thickness of 1 mm is formed. As a result, the substrate floats in a non-contact state with respect to the plate. However, since the porous ceramic plate is expensive, a similar effect can be obtained by mounting a punching board on the upper part of the pressurized air chamber so that low-pressure air is ejected from the pores. It is done.

  Here, the plurality of processing mechanisms are not particularly limited. For example, the substrate may be a liquid crystal panel substrate and an IC circuit element may be mounted on the panel substrate. In this case, the processing mechanism includes an ACF attaching means for attaching the ACF to the panel substrate, and an IC circuit element supply / temporary pressure bonding means for placing the IC circuit element on the portion where the ACF is attached. The IC circuit element can be composed of a crimping means for thermocompression bonding to the panel substrate. In this case, these mechanisms are arranged in a straight line, and the substrate transfer means is arranged at a position close to these processing mechanisms. When processing the panel substrate, a cradle that supports the back side is provided, but the substrate support member can function as a cradle that supports the load acting on the panel substrate during processing. It is good also as a structure which provides a receiving stand in each process mechanism side.

  Even if the size of the substrate to be processed changes greatly, and when the long side is processed or the short side is processed, any changes are made to the configuration of the substrate transfer means in the substrate processing apparatus. Therefore, the substrate can be smoothly transported and positioned in a stable state.

    Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 shows a configuration of a panel substrate 1 of a liquid crystal panel in which two glass substrates are bonded as a panel substrate and liquid crystal is sealed between them. Here, the panel substrate 1 includes a lower substrate 2 and an upper substrate 3, and the lower substrate 2 has at least one side protruding from the upper substrate 3. Wirings are formed on the overhanging portion with fine intervals, and a predetermined number of IC circuit elements 4 are mounted on the overhanging portion using the ACF 5. For this purpose, a predetermined number of wiring groups are formed in the area where the IC circuit elements 4 are mounted, and the IC circuit elements 4 are mounted for each wiring group. Therefore, the projecting portion of the lower substrate 2 is a portion where the IC circuit element 4 is mounted, and a predetermined region including the projecting portion is an edge region E to be processed.

  The ACF 5 is formed by uniformly dispersing conductive particles in a binder resin made of a thermosetting resin. In order to mount the IC circuit element 4 on the panel substrate 1, first, in the edge region E of the lower substrate 2 in the panel substrate 1. ACF5 is pasted. Thereafter, the IC circuit element 4 is temporarily pressure-bonded on the ACF 5 while being relatively positioned. Thereafter, the predetermined number of electrodes provided on the IC circuit element 4 and the wiring formed on the panel substrate 1 are electrically connected to each other by the conductive particles contained in the temporarily bonded ACF 5, and the IC circuit element 4 is bonded with a binder resin. Is fixed to the panel substrate 1.

  Therefore, in the following description, the substrate processing apparatus of the present invention is described as being applied to an apparatus for mounting the IC circuit element 4 on the panel substrate 1. However, the substrate processing apparatus of the present invention is not limited to this application. FIG. 2 shows an example of the stage configuration of the substrate processing apparatus. The substrate processing apparatus includes a carry-in unit 10, an ACF attachment stage 11, an IC circuit element supply / temporary pressure bonding stage 12, and a main pressure bonding stage 13. These stages 10 to 13 are arranged in a straight line, and the panel substrate 1 is conveyed by the substrate conveying means 14. Here, the conveyance of the panel substrate 1 is by intermittent conveyance in the direction indicated by the arrow in FIG. 2, and the conveyance pitch interval is the interval between the stages 10 to 13, that is, the inter-stage interval P.

  In the carry-in part 10, the panel board | substrate 1 is carried in from the front process, and is positioned in a predetermined position. In the ACF attaching stage 11, as shown in FIG. 3, the ACF 5 is attached to the surface of the lower substrate 2 in the panel substrate 1. For this purpose, the ACF attaching stage 11 is provided with an ACF attaching unit 20 for attaching the ACF 5 at a predetermined position on the surface of the panel substrate 1. The ACF adhering unit 20 is provided with an adhering head 20a and a receiving portion 20b that supports the load of the adhering head 20a when the ACF 5 is adhered to the panel substrate 1 by the adhering head 20a. Here, the ACF 5 may be attached so as to cover the entire length of one side of the panel substrate 1, but it is preferable that the ACF 5 is attached individually for each region where each IC circuit element 4 is mounted.

  The panel substrate 1 to which the ACF 5 is attached is conveyed by one pitch by the substrate conveying means 14 and moves to the IC circuit element supply / temporary pressure bonding stage 12. In the IC circuit element supply / temporary pressure bonding stage 12, as shown in FIG. 4, the IC circuit element 4 is connected to a predetermined position of the panel substrate 1, and the IC circuit element 4 is attached to the panel substrate 1 by the adhesive force of the ACF 5. Keep the connected state. For this purpose, the IC circuit element supply / temporary crimping stage 12 is provided with a temporary crimping unit 21. The temporary crimping unit 21 includes an adsorption head 21 a that holds the IC circuit element 4 by suction and presses it against the panel substrate 1, and a receiving portion 21 b that supports the load when the suction head 21 a presses the panel substrate 1. Composed. The IC circuit element 4 is held by the temporary pressure bonding unit 21 so as not to fall off the panel substrate 1 due to the adhesive force of the binder resin of the ACF 5. Here, the plurality of IC circuit elements 4 are mounted on the panel substrate 1, but the temporary crimping unit 21 moves in parallel with the panel substrate 1, and the IC circuit elements 4 are sequentially formed in the formation portions of the plurality of electrode groups. It is pasted.

  The stage 13 is a final crimping stage. The panel substrate 1 to which the IC circuit element 4 is temporarily crimped is pressed against the panel substrate 1 from above and heated by the ACF 5 in the final crimping stage 13. The binder resin is melted or softened and compressed so that the electrodes of the IC circuit element 4 and the wiring of the panel substrate 1 are electrically connected through the conductive particles, and the binder resin is heated. Harden. For this purpose, the main crimping stage 13 is provided with a crimping unit 22.

  The provisional pressure bonding unit 21 described above is configured to connect the IC circuit elements 5 to the panel substrate 1 one by one in order, but the final pressure bonding stage 13 needs to be pressure-bonded for a long time for thermosetting. In order to shorten the time, thermocompression bonding is performed simultaneously on all the IC circuit elements 4. For this purpose, one long crimping means can be used, but in order to crimp with high accuracy, the crimping unit 22 is connected to the panel substrate 1 as shown in FIG. The same number as 5 is provided. As shown in FIG. 5, each crimping unit 22 includes a crimping blade 22 a provided with a heater and a receiving portion 22 b that supports the back surface of the panel substrate 1, and the crimping blade 22 a is connected to a pressurizing means 22 c. Yes.

  The substrate transfer means 14 pitch-feeds the panel substrate 1 every stage interval P, and an example of a specific configuration thereof is shown in FIGS. As shown in FIG. 6, the substrate transport unit 14 includes a substrate pitch feed driving unit 30, a substrate support unit 31, and a substrate floating unit 32.

  The substrate pitch feed drive unit 30 includes a movable beam 40 and a drive member 41 that moves the movable beam 40 up and down and back and forth. As shown in FIG. 7, the movable beam 40 is composed of a square beam having a large number of suction holes 42 formed on the surface thereof, and a negative pressure pipe 43 is connected to the inside thereof. Therefore, the movable beam 40 can hold the panel substrate 1 by suction. Here, even if the size of the substrate to be transported is the same or different, if the difference is slight, the suction hole 42 provided on the surface of the movable beam 40 may be provided at a certain location. . However, the arrangement of the suction holes must be set differently depending on whether the substrates to be processed have different sizes or the sides to be processed have short sides or long sides. For this purpose, as shown in FIG. 8, a plurality of negative pressure chambers 44 are provided in the movable beam 40, and a plurality of suction holes 42 formed on the surface of the movable beam 40 are provided in each of the negative pressure chambers 44. Configure to connect. The negative pressure pipes 43 are connected to the negative pressure chambers 44. These negative pressure pipes 43 are connected to the electromagnetically operated distribution valves 45, and the distribution valves 45 at necessary places are opened. Thus, a negative pressure suction force is applied to the suction hole 42 where the panel substrate 1 is placed. A similar configuration can be adopted for the substrate support member 31 that adsorbs the panel substrate 1.

  The drive member 41 is provided with a slider 47 on a linear motor stage 46, and the slider 47 is driven by the linear motor to reciprocate at a pitch interval P. Accordingly, as many substrate pitch feed driving units 30 as the number of stages constituting the processing apparatus are provided. The drive member 41 can be configured to reciprocate by a feed screw, a cylinder or the like instead of the linear motor system. An elevating member 48 is provided on the slider 47, and this elevating member 48 can also be driven by a linear motor. The movable portion 48a of the elevating member 48 reciprocates in the vertical direction of a predetermined stroke. The elevating member 48 can be driven not by a linear motor but by a cylinder or a cam mechanism. The movable beam 40 is connected to the movable portion 48 a of the elevating member 48.

  Here, the length of the movable beam 40 is shorter than the pitch interval P described above, and is the same as or longer than the length of the longest side of the panel substrate 1 conveyed by the substrate conveying means 14. Further, the lifting stroke of the movable portion 48 a of the lifting member 48 is lower than the surface of the substrate support portion 31 and the position of the surface of the movable beam 40 connected to the movable portion 48 a slightly higher than the surface of the substrate support portion 31. Between the positions. Further, the substrate support portion 31 is a beam-like member that extends over almost the entire length of the transport path, and is composed of a rectangular beam having a large number of suction holes formed on the surface thereof, like the movable beam 40 constituting the substrate pitch feed driving portion 30. Is done.

  The substrate support portion 31 is disposed in parallel with the respective stages 10 to 13, and the panel substrate 1 is located at the edge region E to be processed or at a position close to the edge region E with respect to the panel substrate 1. It is provided for adsorbing and fixing the back surface of the lens at a predetermined position. Here, since the ACF adhering unit 20, the provisional pressure bonding unit 21 and the pressure bonding unit 22 provided in each stage 11 to 13 are provided with receiving portions 20b, 21b and 22b for supporting the panel substrate 1, the substrate support The part 31 is provided at a position as close as possible to the receiving part as long as it does not interfere with the receiving part. The substrate support part 31 can also function as a receiving part. In this case, the substrate support portion 31 is disposed at a position including the edge region E of the panel substrate 1. The movable beam 40 constituting the substrate pitch feed driving unit 30 is disposed on the opposite side of the substrate supporting unit 31 from the above-described processing unit mounting unit and is close to the substrate supporting unit 31. Provide in position.

  The panel substrate 1 is always sucked and held by either the substrate support unit 31 or the movable beam 40 of the substrate pitch feed driving unit 30. And parts other than these adsorption parts are made to float. For this purpose, a substrate floating portion 32 is provided. As shown in FIG. 9, the substrate floating portion 32 is configured by a punching board 51 provided on the upper surface of the pressurized air chamber 50, and an air pipe 52 for supplying pressurized air is provided in the pressurized air chamber 50. It is connected. The punching board 51 has a large number of pores 51 a, and pressurized air is ejected from the pressurized air chamber 50 through the pores 51 a of the punching board 51. Here, the pressurized air ejected from the punching board 51 is for conveying the panel substrate 1 in a non-contact state with the punching board 51 or the like. Accordingly, an air layer is formed between the back surface of the panel substrate 1 and the panel substrate 1 is held in a floating or floating state, and is not for pushing up the panel substrate 1. Therefore, if air is pressurized using a fan and a pressure of about several kPa is applied to the back surface of the panel substrate 1, an air layer is formed between the punching board 51 and the back surface of the panel substrate 1. Can be brought into a non-contact state. The substrate floating unit 32 covers the entire moving range up to the edge opposite to the edge region to be processed on the long side when the short side of the largest panel substrate is processed. It is configured.

  By configuring as described above, a predetermined number of IC circuit elements 4 can be mounted on each side of the panel substrate 1. Here, there are various sizes of flat display panels. As shown in FIG. 10, when a small-sized panel substrate is 1S, a medium-sized panel substrate is 1M, and a large-sized panel substrate is 1L, a solid line As shown, even if the long side is set as the processing target, as shown by the phantom line, the short side is set as the processing target. The parts can be arranged at the same position. The position of this corner is the reference position C. That is, the ACF adhering unit 20 in the ACF adhering stage 11 and the temporary pressure bonding unit 21 in the IC circuit element supply / temporary pressure bonding stage 12 are controlled to start operation from the reference position C.

  Since the driving at the time of transporting the panel substrate 1 is the movable beam 40 constituting the substrate pitch feed driving unit 30, all the sizes from the panel substrate 1S to the panel substrate 1L described above, and in which direction are directed. Sometimes, it comes into contact with the movable beam 40. Accordingly, the transport driving force can be applied to the panel substrate 1 without fail. The driving force does not act on most portions of the panel substrate 1, but the back side of the panel substrate 1 faces the substrate floating portion 32 except for the portion that contacts the movable beam 40. Pressurized air is ejected and the panel substrate 1 is floated by this air pressure. Therefore, when the panel substrate 1 is transported by the movable beam 40 of the substrate pitch feed driving unit 30, the panel substrate 1 does not slide into contact with other members. For this reason, the panel substrate 1 can be transported with a light load by the movable beam 40, and the panel substrate 1 is not damaged.

  The panel substrate 1 is adsorbed by the above-mentioned movable beam 40 at the time of conveyance, but is supported by the substrate support portion 31 while processing is performed at each stage. That is, the panel substrate 1 is switched between a state where it is attracted to the movable beam 40 and a state where it is attracted to the substrate support part 31. Therefore, when the panel substrate 1 moves between the stages, the movable beam 40 is lifted straight by the operation of the elevating member 48 in the panel substrate 1 adsorbed to the substrate support portion 31. When the movable beam 40 comes into contact with the panel substrate 1 and further rises, the panel substrate 1 is peeled off from the substrate support portion 31 and is held by suction on the movable beam 40. At this time, an upward displacement force is applied to the panel substrate 1, but it does not shift laterally or in the rotational direction. Here, the position of the panel substrate 1 due to the rising of the movable beam 40 is slightly higher than the substrate support portion 31. Accordingly, there is no possibility that the panel substrate 1 on which weak pressurized air is acting from below is deformed.

  When the panel substrate 1 is attracted to the movable beam 40, the movable beam 40 moves forward and moves from the previous stage toward the next stage. At this time, only the portion of the panel substrate 1 close to the edge region to be processed is held by the movable beam 40, but the other portions are in a floating state by the substrate floating portion 32. As a result, the entire stage smoothly moves to the next stage, and there is no fear that a lateral displacement direction or a moment in the rotational direction acts.

  When the panel substrate 1 moves to the next stage, the movable beam 40 descends, but descends straight downward. For this reason, the back surface of the panel substrate 1 comes into contact with the substrate support portion 31 during the operation, and is sucked and held by the substrate support portion 31. As a result, the panel substrate 1 is peeled off by the lowering of the movable beam 40, but at this time, the panel substrate 1 is not displaced in the lateral direction or the rotating direction.

  From the above, even if the panel substrate 1 moves between the stages, the position is not substantially displaced, and is always held at a constant position. Here, since the board | substrate conveyance means 14 does not have a means to position the panel board | substrate 1 exactly | strictly, in each stage, position adjustment is carried out by the ACF sticking unit 20, the temporary crimping | compression-bonding unit 21, and the crimping | compression-bonding unit 22 side. . At this time, the panel substrate 1 is disposed at a substantially constant position, and the corner portion in the front direction of conveyance of the edge region E to be processed by the panel substrate 1 is surely positioned at the reference position C on each stage. Therefore, these position adjustments can be performed easily, smoothly and quickly. This is the same whether the size of the panel substrate 1 is different or the edge region E to be processed for the panel substrate 1 is on the long side or the short side.

It is explanatory drawing which shows a part of liquid crystal cell as an example of a panel board | substrate, and the IC circuit element mounted in this liquid crystal cell. It is a schematic block diagram of the substrate processing apparatus which shows one Embodiment of this invention. FIG. 3 is a configuration explanatory diagram of an ACF attaching stage in FIG. 2. FIG. 3 is a configuration explanatory diagram of the provisional pressure bonding stage of FIG. 2. FIG. 3 is an explanatory diagram of a configuration of the main crimping stage in FIG. 2. It is an external appearance perspective view of a board | substrate conveyance means. It is sectional drawing of the movable beam which comprises a board | substrate pitch feed drive part. It is a block diagram explaining the movable beam suction means. It is sectional drawing of a pressurization chamber. It is explanatory drawing which shows the size of the panel substrate handled by the substrate processing apparatus of this invention, and the edge | side used as a process target.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel substrate 2 Lower substrate 3 Upper substrate 4 IC circuit element 5 ACF 10 Carry-in part 11 ACF sticking stage 12 IC circuit element supply and provisional pressure bonding stage 13 Final pressure bonding stage 20 ACF bonding unit 21 Temporary pressure bonding unit 22 Pressure bonding unit 30 Board Pitch feed drive unit 31 Substrate support unit 32 Substrate floating unit 40 Movable beam 41 Drive member 42 Suction hole 43 Negative pressure pipe 46 Linear motor stage 47 Slider 48 Lifting member 50 Pressurized air chamber 51 Punching board

Claims (6)

A substrate processing apparatus for performing processing by each processing mechanism on an edge region of at least one side of the substrate while intermittently transporting the substrate constituting the display panel to a processing unit in which a plurality of processing mechanisms are arranged in a straight line In
Substrate transport means for transporting the substrate provided along the array direction of the processing mechanisms,
A substrate support member for fixing the substrate by applying a negative pressure to the back surface of the substrate opposite to the processing surface when processing the substrate by the processing mechanism;
A substrate pitch feed driving means for holding only the portion near the edge region to be processed among the substrates and pitch-feeding the substrates toward the arrangement direction of the processing mechanisms;
Substrate float means for levitating the substrate on the opposite side of the substrate pitch feed driving means with respect to each processing mechanism;
A substrate processing apparatus comprising: The substrate pitch feed driving means is of a walking beam type having a movable beam that operates in the order of ascending, advancing, descending, and retreating,
When transporting the substrate, negative pressure is applied to the back surface of the substrate by a plurality of suction portions provided on the surface of the movable beam, and when processing the substrate, the substrate support member is attached to the substrate. The substrate processing apparatus according to claim 1, wherein switching is performed so that a negative pressure is applied to the back surface. The movable beam has a length equal to or greater than the length of the longest side of the substrate to be transported;
A plurality of negative pressure chambers connected to the suction portion;
A distribution valve connected to each negative pressure chamber for a negative pressure pipe for applying a negative pressure to the negative pressure chamber, and controlling whether to apply a negative pressure to the negative pressure chamber;
The substrate processing apparatus according to claim 2, further comprising:   The substrate transport means can transport a plurality of types of substrates, and each size substrate is an edge region on the side to be processed, and is movable with the front corner in the transport direction as a reference position. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus is arranged on a beam.   2. The substrate processing apparatus according to claim 1, wherein said substrate float means is configured to mount a punching board having a large number of pores on an upper surface of a pressurized air chamber. The substrate is a liquid crystal panel substrate, and the plurality of processing mechanisms are for mounting an IC circuit element on the liquid crystal panel substrate,
ACF adhering means for adhering ACF to the liquid crystal panel substrate, IC circuit element supply / temporary pressure bonding means for placing an IC circuit element on the ACF adhering portion, and the IC circuit element as the liquid crystal The substrate processing apparatus according to claim 1, further comprising a pressure-bonding unit that thermocompression-bonds to the panel substrate.

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