JP4453849B2 - ACF pasting method - Google Patents

ACF pasting method Download PDF

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Publication number
JP4453849B2
JP4453849B2 JP2009171001A JP2009171001A JP4453849B2 JP 4453849 B2 JP4453849 B2 JP 4453849B2 JP 2009171001 A JP2009171001 A JP 2009171001A JP 2009171001 A JP2009171001 A JP 2009171001A JP 4453849 B2 JP4453849 B2 JP 4453849B2
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acf
pressure
substrate
blade
tape
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JP2010004051A (en
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淳 斧城
仁志 米沢
秀樹 野本
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株式会社日立ハイテクノロジーズ
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Description

The present invention provides an ACF (Anisotropic Conductive Film) on a substrate for mounting a semiconductor circuit device such as a driver circuit on a substrate composed of a display panel or the like constituting a flat display device such as a liquid crystal display, a plasma display, or an organic EL display. it relates to the ACF paste Tsukekata method pasted.

  For example, a liquid crystal display has a configuration in which a printed circuit board is connected via a semiconductor circuit device to a liquid crystal panel composed of two upper and lower transparent substrates forming a liquid crystal sealing space. Here, the semiconductor circuit device is a driver circuit, and this driver circuit includes inner and outer electrodes. The inner electrode is provided on one substrate constituting the liquid crystal panel, and the outer electrode is provided on the outer circuit. Each is electrically connected to the printed circuit board. Typical driver circuit mounting methods include the COG (Chip On Glass) method in which a chip-like IC package is directly connected to a liquid crystal panel and a printed circuit board, and TCP with a driver circuit mounted on a film-like substrate. There is a TAB (Tape Automated Bonding) method in which a (Tape Carrier Package) is connected to a liquid crystal panel and a printed circuit board.

  In any case, a wiring pattern is formed on at least two sides on the surface of one substrate constituting the liquid crystal panel, and the electrode in the wiring pattern and the inner electrode of the driver circuit are electrically connected. Accordingly, the liquid crystal panel is provided with a wiring pattern at a minute pitch interval, but a predetermined number of electrodes are formed as a group for each semiconductor circuit device to be mounted. In these plurality of electrode groups, a space is formed between adjacent electrode groups. The driver circuit is also connected to the printed circuit board. For this reason, a plurality of predetermined electrode groups are formed on the printed circuit board side as well as the liquid crystal panel side. Here, the number of wires constituting the electrode group on the printed circuit board side is usually smaller than the number of wires on the electrode group on the liquid crystal panel side.

  When connecting a driver circuit as a semiconductor circuit device to a liquid crystal panel or a printed circuit board, a large number of electrodes arranged at fine intervals are securely connected electrically and the driver circuit is fixed. Must. For this purpose, ACF is used. ACF is obtained by uniformly dispersing fine conductive particles in an adhesive binder resin. By thermocompression bonding the ACF, the electrodes are electrically connected through the conductive particles, and the binder resin is cured by heating, so that the driver circuit is fixed to the liquid crystal panel or the printed circuit board.

  For example, after affixing ACF to a portion where a wiring pattern is provided on one substrate of a liquid crystal panel, TCP as a driver circuit is mounted on this substrate as TAB. ACF, which is an adhesive substance, is laminated on the backing tape via a release layer, thereby constituting an ACF tape. The ACF tape is wound around a supply reel, sent out from the supply reel, and pasted on the substrate surface by a pasting unit. For this purpose, the affixing unit is provided with a member for mounting the supply reel, and includes a guide roller or the like at an appropriate location for drawing the ACF tape supplied from the supply reel along a predetermined path. A guide member is disposed.

  The ACF is attached to the substrate by batch attachment that is continuously attached over the entire length of one side of the substrate, divided attachment for each electrode group, and attachment so that the ACF is not attached to the blank area. There is. In the case of batch pasting, the ACF is also pasted to unnecessary blank areas, so that the material is wasted. In the blank area, the adhesive resin and the conductive particles constituting the ACF are left exposed. Therefore, inconvenience may occur in processing and processing after the driver circuit is mounted. Therefore, it is preferable to divide and paste.

  Japanese Patent Application Laid-Open No. H10-228561 discloses a method of performing ACF divisional pasting for each electrode group of a substrate. In this Patent Document 1, a plurality of holding parts holding ACF for one pasting length are arranged in the rotation direction of the rotating body, and the length of pasting the ACF tape with the mount tape being bonded is attached. It cut | disconnects for every and is set as the structure which adsorb | sucks a mount tape to a holding | maintenance part. And this holding | maintenance part is made to contact / separate to a liquid crystal panel with the shaft provided in the rotary body so that it could protrude and retract.

  By moving the substrate that makes up the liquid crystal panel, each electrode group is positioned at a predetermined pitch interval so as to face the rotating body in sequence, and the shaft connected to the holding unit is extended to attract the holding unit. The laminated tape of the ACF and the mount tape being pressed is pressed against the substrate. Then, the holding tape is held in an adsorbed state by the holding portion, and the shaft is pulled toward the rotating body, whereby the ACF is peeled off from the mounting tape and attached to the substrate.

JP-A-9-83114

  In Patent Document 1 described above, the substrate is supported by the table portion so as to be movable in the X, Y, and θ directions, and the table portion is provided with a substrate support. On the ACF attachment side, a rotating body is attached to the frame, and a plurality of holding portions for holding the divided ACF are provided on the outer peripheral surface of the rotating body. The rotating body can be moved up and down and indexed. Accordingly, by rotating and lowering the rotating body while moving the table portion and applying a pressure force to the substrate support, the ACF held by the holding portion is provided for each part where the electrode group of the substrate is provided. Is pasted. Thus, since the substrate support is provided on the table portion side and the substrate support is pitch-fed together with the substrate every time the ACF is attached by the rotating body, the substrate support is at least the ACF attachment portion of the substrate. Must have a length that spans the entire length of

  If the substrate is small, the dimensions of the substrate support will be short, so even if there are some dimensional errors or assembly errors between the rotating body on the pressing side and the substrate support, the ACF attachment accuracy However, if the substrate is large, an error may be accumulated from one end of the substrate support to the other end. In this case, the pressure applied by the rotating body is not uniform over the entire ACF, and pressure unevenness may occur, resulting in poor adhesion.

  The present invention has been made in view of the above points, and an object of the present invention is to apply an even pressure to the ACF so as to perform a smooth bonding operation. It is in.

  In order to achieve the above-described object, the present invention is an ACF tape in which an ACF is laminated on a mount tape by using a pressure-bonding head composed of a pressure blade and a receiving blade and moving the pressure blade and the receiving blade up and down. Is pressed onto a substrate on which a plurality of electrodes are formed, and the ACF is attached to the substrate, wherein the pressure blade and the receiving blade are respectively driven up and down by a lifting drive means. Is brought into contact with the back side of the substrate, and an ACF tape is pressure-bonded to the substrate by applying pressure to the substrate with a pressure blade, and after the ACF is pressure-bonded to the substrate, The feature is that the pressure applied to the ACF tape is released, and then the receiving blade is displaced to the lowered position.

  To attach the ACF to the substrate, it is also possible to perform batch attachment in which the ACF is continuously attached so as to cover the entire length of one side. However, a plurality of ACF attachment regions are set on the substrate, and each ACF is attached. It is desirable to perform the division pasting for each attachment area. In this case, it is assumed that the pressure blade and the receiving blade constituting the pressure bonding head have a length that extends over the entire length of the ACF attachment region. Then, after the ACF is attached to one ACF attachment region, the pressure bonding head is transported in the direction in which the electrodes provided on the substrate are arranged in order to move the pressure bonding head to another ACF attachment region. become. In addition, the pressure blade and the receiving blade are lifted and lowered independently, but as the guide means during lifting, the pressure blade and the receiving blade can be separate, but common It is desirable to guide by the guide means in view of the accuracy of ACF attachment.

  In the case of dividing and pasting, the ACF tape is half-cut. Since the ACF sites before and after being cut by the half cut are to be attached, the length dimensions of the pressure blade and the receiving blade are at least as much as the ACF attachment dimensions. However, the length dimension of the pressure blade and the receiving blade is not limited to the length of the ACF to be attached, and the pressure blade can be longer than the length of the cut ACF tape. In this case, when the ACF is pasted, the excess length of the pressure blade and the receiving blade is arranged on the part of the mount tape that has been pasted. If the pressure blade is made longer than the ACF attachment length, the electrode group is formed on the short side and the long side, even for a plurality of types of substrates having different lengths of the electrode group and the same substrate. It is possible to deal with cases where the lengths are different.

  In the ACF tape, when the ACF constituting the adhesive layer is attached to the substrate, it is necessary to align the substrate and the attachment unit. This alignment is performed by holding the substrate in a fixed manner. The position adjustment of the attachment unit can be performed, and a position adjustment mechanism may be provided on the substrate support base side that supports the substrate.

  The pressure blade and the receiving blade constituting the pressure bonding head are moved up and down while being guided by the guide means. Separate guide means may be provided for the pressure blade and the receiving blade, but it is desirable to guide by the common guide means from the viewpoint of the accuracy of ACF attachment. The pressure blade and the receiving blade are configured so as to move up and down independently, the pressure blade is in contact with the upper surface of the ACF tape, and the receiving blade is in contact with the lower surface of the substrate. The pressure blade can be driven up and down by a ball screw, and the receiving blade can be driven up and down by a cylinder so that the pressure blade can apply pressure to the ACF tape during pressure bonding. Each of these pressure blades and receiving blades can be attached to a lifting block that is driven to move up and down.

A CF is for mounting the semiconductor circuit element on a substrate, a substrate which the semiconductor circuit element is mounted, may be a printed circuit board or the like, a panel of a flat display including a liquid crystal display or the like, especially The present invention is more suitably applied to a device for mounting a predetermined number of driver circuits on a large panel.

  The ACF can be applied smoothly to the substrate by applying a uniform pressure to the substrate.

It is a principal part top view which shows the liquid crystal cell as a board | substrate with which ACF is affixed, and the driver circuit mounted in this board | substrate. It is a front view which shows schematic structure of an ACF sticking machine. FIG. 3 is a left side view of FIG. 2. FIG. 3 is a plan view of FIG. 2. It is a structure explanatory drawing of a horizontal feed roller. It is a side view which shows the structure of a horizontal feed roller. It is a structure explanatory view of a cutter unit. It is a principal part enlarged front view of the ACF sticking machine which shows the half cut state of an ACF tape. FIG. 9 is a left side view of FIG. 8. It is a principal part enlarged front view of the ACF sticking machine which shows the descent state of a sticking unit. It is a left view of FIG. It is a principal part enlarged front view of the ACF sticking machine which shows the raising state of a receiving blade. FIG. 13 is a left side view of FIG. 12. It is a principal part enlarged front view of the ACF sticking machine which shows the crimping | compression-bonding state of an ACF tape. It is a left view of FIG. It is explanatory drawing which shows the state which has peeled the mount tape of an ACF tape. It is a principal part enlarged front view of the ACF sticking machine which shows the dimensional relationship with a pressure blade and ACF affixed with this pressure blade.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 shows a liquid crystal panel as an example of a substrate to which an ACF is attached, and a driver circuit made of TCP mounted on a substrate as a TAB as an example of a semiconductor circuit device mounted via the ACF. The substrate is not limited to a liquid crystal panel, but can be a substrate for other displays or other various printed circuit boards. The board is not limited to the driver circuit, and the ACF Various semiconductor circuit devices that are electrically connected to each other can be applied.

  In FIG. 1, reference numeral 1 denotes a liquid crystal panel. The liquid crystal panel 1 is composed of a lower substrate 2 and an upper substrate 3 each made of a glass thin plate, and liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 protrudes from the upper substrate 3 by a predetermined width on at least two sides (one side or three sides or more), and is integrated on the film substrate 4a on the projecting portion 2a. A plurality of driver circuits 4 on which circuit elements 4b are mounted are mounted.

  The projecting portion 2a of the lower substrate 2 is provided with a predetermined number of electrodes connected to wirings respectively connected to TFTs (Thin Film Transistors) formed on the portion where the substrates 2 and 3 are overlapped. These electrodes have a predetermined number of electrodes formed as a group for each mounting portion of the driver circuit 4 as indicated by reference numeral 5 in the drawing. Alignment marks 6a and 6a are formed on the left and right sides of each electrode group 5. Therefore, a blank region having a predetermined width, that is, a portion where no electrode is provided is formed between adjacent electrode groups 5 and 5. On the other hand, the driver circuit 4 is provided with a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5, and the electrode group connected to the electrode group 5 is denoted by reference numeral 7. . The driver circuit 4 is also formed with alignment marks 6b and 6b on both the left and right sides of the electrode group 7. When the driver circuit 4 is mounted on the liquid crystal panel 1, the electrode group 7 is defined with reference to these alignment marks. Position adjustment is performed so that each electrode constituting and each electrode constituting the electrode group 5 coincide.

  The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 8. As is well known, the ACF 8 is obtained by dispersing a large number of fine conductive particles in a binder resin having an adhesion function. By heating and pressing the ACF 8 between the driver circuit 4 and the liquid crystal panel 1, the ACF 8 is electrically conductive particles. The electrodes constituting the electrode group 5 and the electrodes constituting the electrode group 7 are electrically connected to each other through the adhesive, and the binder resin is thermally cured to fix the driver circuit 4 to the liquid crystal panel 1. It will be. Here, the ACF 8 is divided for each position of the electrode group 5 provided on the projecting portion 2a of the lower substrate 2, and is pasted every length L. As a result, the ACF 8 can be used without waste, and the attached ACF 8 is almost completely covered by the driver circuit 4.

  2 to 4 show a schematic configuration of an attaching mechanism for attaching the ACF 8 to the overhanging portion 2a of the lower substrate 2. FIG. In these drawings, 9 is a support base for holding the liquid crystal panel 1 in a horizontal state. The liquid crystal panel 1 is stably held on the support base 9 by, for example, vacuum suction means. Here, the liquid crystal panel 1 is in contact with the support base 9 over a wide area, but the lower position of the projecting portion 2a of the lower substrate 2 to which the ACF 8 is attached is open. The support base 9 can be provided with position adjusting means in the X, Y, and θ directions for alignment of the liquid crystal panel 1 and the driver circuit 4 and the like.

  Reference numeral 10 denotes a unit for attaching the ACF 8 to the liquid crystal panel 1, and this attachment unit 10 has a mounting plate provided in the vertical direction, and a supply reel 11 is detachably attached thereto. The ACF 8 is laminated on the release layer of the mount tape 12 to form an ACF tape 13, and the ACF tape 13 is wound around the supply reel 11. The ACF tape 13 is travel-guided along a travel path composed of rollers 14 to 17 attached to the attaching unit 10. Further, reference numeral 18 denotes a driving roller which is driven so as to sandwich the mount tape 12 after the ACF 8 is attached to the liquid crystal panel 1 and send it to the discharge unit 19.

  The rollers 14 and 15 are guide rollers for the feeder of the ACF tape 13, and the guide roller 15 is attached to the swing arm 20, and the swing arm 20 swings around the rotation shaft 21. Driving means (not shown) such as a motor is connected to the rotating shaft 21. When the swing arm 20 is swung in the direction of arrow F, at least one pasting from the supply reel 11, that is, FIG. The ACF tape 13 of the length L shown in FIG. 6 is sent out and stays between the rollers 14 and 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not fluctuate due to the difference in the amount of winding of the supply reel 11.

  As shown in FIGS. 5 and 6, the rollers 16 and 17 guide the ACF tape 13 in the horizontal direction in the travel route, and define the length of the ACF 8 to be attached to the liquid crystal panel 1 once. It is a horizontal guide roller. The horizontal guide roller 17 defines the ACF 8 attachment start end position, and the horizontal guide roller 16 defines the ACF 8 attachment end position, and the attachment area of the ACF 8 is set by these. As is apparent from FIG. 6, the horizontal guide rollers 16 and 17 are formed with flange portions 16b and 17b on both sides of the cylindrical portions 16a and 17a, and from the cylindrical portions 16a and 17a of the flange portions 16b and 17b. The height of the protruding portion is approximately the same as or slightly larger than the thickness of the mount tape 12 in the ACF tape 13.

  Accordingly, the ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16 and 17 and then separated from the mount tape 12. Then, the mount tape 12 from which the ACF 8 has been peeled is collected at a position downstream of the horizontal guide roller 17. A driving roller 18 is provided at a position downstream of the ACF 8 attachment region defined by the horizontal guide rollers 16 and 17. The driving roller 18 includes a driving roller 18a and a pinch roller 18b, and the mount tape 12 is sandwiched between the driving roller 18a and the pinch roller 18b. By rotating the drive roller 18a, the ACF tape 12 is pitch-fed every length L.

  As is apparent from FIG. 3, the affixing unit 10 is mounted on a lift drive unit 22, which is mounted on a longitudinal drive unit 23, and the longitudinal drive unit 23 is a parallel motion that constitutes a conveying means. The drive unit 24 is mounted. By these mechanisms, the ACF 8 attachment region defined by the horizontal guide rollers 16-17 (see FIG. 2) in the route of the ACF tape 13 is moved in the vertical direction, that is, the Z-axis direction, and the horizontal plane in the X-axis direction (electrode It is possible to move and adjust the position in the direction orthogonal to the arrangement of the group 5 and the Y-axis direction (the arrangement direction of the electrode group 5). On the other hand, the liquid crystal panel 1 is fixedly held on the support base 9 by vacuum suction.

  Here, it is necessary to adjust the relative position of the ACF tape 13 between the horizontal guide rollers 16-17 and the electrode group 5 on the lower substrate 2. The parallel movement drive unit 24 moves the pasting region in a direction parallel to the arrangement direction of the electrode groups 5 in the liquid crystal panel 1, that is, in the Y-axis direction. Although the position can be adjusted on the affixing unit 10 side, as described above, when the support base 9 is provided with position adjusting means in the X, Y, and θ directions, the ACF tape 13 is provided on the support base 9 side. Can also be aligned.

  The raising / lowering drive part 22 has the inclination block 30, and the cylinder 31 (or motor) in order to move this inclination block 30 to the front-back direction. Further, a slide member 32 that engages with the inclined surface of the inclined block 30 is connected to the pasting unit 10, and this slide member 32 has an inclined surface that coincides with the inclined block 30, The structure is such that it cannot be displaced except in the vertical direction. Thereby, when the cylinder 31 is driven, the affixing unit 10 is displaced in the vertical direction.

  Next, the back-and-forth movement drive unit 23 is for moving back and forth the pedestal 34 on which the inclined block 30 is mounted, and the reciprocation of the pedestal 34 is performed by a driving means 35 including a cylinder, a motor and the like. The parallel drive unit 24 has a carriage 34 on which a pedestal 34 and its driving means 35 are mounted. The carriage 36 rotates and drives a ball screw 37 constituting a ball screw feeding means by a motor 38. Thus, the affixing unit 10 can be moved in parallel with the arrangement direction of the electrode group 5 in the liquid crystal panel 1.

  In the travel path of the ACF tape 12 attached to the affixing unit 10, as shown in FIG. 8, half-cut means 40 is provided at a position slightly downstream from the position of the horizontal guide roller 16. The means 40 is attached to the surface of the affixing unit 10 so as to be reciprocally movable in the front-rear direction. As shown in FIG. 7, the half-cut means 40 includes a cutter 41 and a cutter receiver 42, and the cutter 41 approaches and separates from the cutter receiver 42 about the shaft 43 as indicated by an arrow in the figure. It is possible to turn in the direction to do. The cutter 44 is normally held away from the cutter receiver 42 by the urging force of the spring 44 acting on the cutter 41, and the cutter 41 is pushed in a direction against the spring 44 by the pushing roller 46 provided in the cylinder 45. Thus, the rocker is oscillated and displaced in a direction close to the cutter receiver 42. Then, at the position where the cutter 41 is closest to the cutter receiver 42, an interval that is the same as or slightly shorter than the thickness of the mount tape 12 of the ACF tape 13 is formed therebetween. Thereby, only the ACF 8 is half-cut.

  Further, in order to attach the ACF 8 to the protruding portion 2 a of the lower substrate 2, the ACF tape 13 is pressure-bonded to the surface of the lower substrate 2 with a predetermined pressure at a position between the horizontal guide rollers 16 and 17. For this purpose, the affixing unit 10 is provided with a crimping head 50 as shown in FIGS. Here, the liquid crystal panel 1 is placed on the support base 9, but the overhanging portion 2 a of the lower substrate 2 protrudes from the support base 9, and the pressure-bonding head 50 detects the protruding portion from above and below. It is the structure which clamps.

  The pressure-bonding head 50 includes a pressure blade 51 and a receiving blade 52. The pressure blade 51 and the receiving blade 52 are attached to elevating blocks 53 and 54, respectively. These elevating blocks 53 and 54 are mounted so as to be displaceable in the vertical direction along a pair of guide rails 55 provided in the attaching unit 10. The pressure blade 51 and the receiving blade 52 are arranged above and below the liquid crystal panel 1 and have the same length. The pressure blade 51 is disposed above the ACF tape 13 that is guided between the horizontal guide rollers 16 and 17 and travels in the horizontal direction.

  The lifting block 54 to which the receiving blade 52 is attached is moved up and down by a predetermined stroke by a cylinder 56 as a lifting drive means. That is, when the cylinder 56 is in the contracted state, the receiving blade 52 descends and is disposed at a lower position away from the liquid crystal panel 1. When the cylinder 56 is extended, the receiving blade 52 is moved to the liquid crystal panel 1. Contact the lower surface. On the other hand, a pressurizing means 57 is connected to the elevating block 53 to which the pressurizing blade 51 is attached. The illustrated pressurizing means 57 has a feed screw 57a driven by a motor, and constitutes a so-called jack. The pressurizing means 57 moves the elevating block 53 connected to the pressurizing blade 51 up and down along the guide rail 55 so that the liquid crystal panel 1 received on the receiving blade 52 is predetermined from above. The pressure is applied. And the pressurization blade 51 and the receiving blade 52 are comprised so that a parallelism may be maintained correctly. In addition, the cylinder 56 that supports the receiving blade 52 is introduced with a pressure that can be held in an extended state without moving excessively by the pressure applied by the pressurizing means 57 at least at the lift stroke end position.

  A heater (not shown) is incorporated in the pressure blade 51 constituting the pressure head 50 or in both the pressure blade 51 and the receiving blade 52, so that the pressure head 50 thermally bonds the ACF tape 13 to the liquid crystal panel 1. It will be. The degree of heating is relatively low so that the binder resin of ACF8 is somewhat softened so that the adhesive strength is not lost. The pressure blade 51 and the receiving blade 52 constituting the pressure-bonding head 50 have a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has at least the attachment length L of the ACF 8. Shall.

  As described above, the affixing unit 10 is equipped with the supply reel 11, the travel path of the ACF tape 13 supplied from the supply reel 11, the half-cut means 40, and the crimping head 50. With this ACF attaching device, the ACF 8 necessary for mounting the driver circuit 4 on the TAB is attached to the electrode group 5 formed in a predetermined number on the projecting portion 2 a of the lower substrate 2 of the liquid crystal panel 1.

  On the support base 9, the liquid crystal panel 1 to which the ACF 8 is attached is arranged in a horizontal state at a predetermined position and held by suction. In this state, on the lower substrate 2 of the liquid crystal panel 1, the projecting portion 2a shown in FIG. 4 protrudes from the support base 9, and a predetermined number of driver circuits 4 are mounted on the projecting portion 2a. For this reason, the affixing unit 10 to which the affixing mechanism is mounted by the ball screw 37 is pitch-fed in the direction of the arrow at every pitch interval P shown in FIG.

  The ACFs 8 corresponding to the length L are sequentially attached to the liquid crystal panel 1. For this purpose, the transport table 36 constituting the parallel motion drive unit 24 is driven to displace the attaching unit 10 to a predetermined attaching region. At this time, as shown by the arrows in FIG. 8 and FIG. 9, the sticking unit 10 is held at the raised position by the lift drive unit 22. The pressure blade 51 constituting the pressure-bonding head 50 is held in the raised position, and the receiving blade 52 is held in the lowered position. As a result, the pressure blade 51 and the receiving blade 52 are kept in a non-contact state with the liquid crystal panel 1, and the sticking unit 10 is smoothly moved, and the liquid crystal panel 1 is damaged. There is no. Further, the ACF tape 13 is separated from the liquid crystal panel 1, and even if the half-cut means 40 protrudes forward from the surface of the attaching unit 10, it does not interfere with the liquid crystal panel 1. Accordingly, the ACF tape 13 is half-cut. By performing this half-cutting, the half-cut position of the ACF tape 13 becomes the pasting end position, and the end where the previous ACF 8 was pasted is the pasting start end position. That is, the horizontal guide roller 17 is disposed at a front position from the application start end position, and the horizontal guide roller 16 is disposed at a rear position from the application end position.

  Thereafter, after the half-cut means 40 is retracted, as shown by the arrows in FIGS. 10 and 11, the attaching unit 10 is lowered by the elevating drive unit 22, and the horizontal guide rollers 16 of the ACF tape 13, The part between 17 is arranged at a position close to the surface of the lower substrate 2 of the liquid crystal panel 1. Thereafter, the cylinder 56 is operated to raise the elevating block 54 so that the receiving blade 52 comes into contact with the back surface of the liquid crystal panel 1 as shown in FIGS. Here, the receiving blade 52 does not extend over the entire length of the liquid crystal panel 1 but is limited to a position corresponding to a region where the ACF 8 is attached by one operation. Next, as shown by the arrows in FIGS. 14 and 15, by operating the pressurizing means 57, the pressurizing blade 51 is lowered, and the backing tape 12 of the ACF tape 13 is pushed, whereby the ACF 8 is Crimp to the lower substrate 2. At the time of this pressure bonding, the pressure blade 51 is arranged so that the corner portion on the base end side coincides with the ACF attachment end position half-cut by the half-cut means 40.

  Then, a feed screw 57 a constituting the pressurizing means 57 is driven to apply a predetermined pressure to the liquid crystal panel 1. Here, the lower substrate 2 of the liquid crystal panel 1 is made of a thin glass plate, is allowed to be deformed to some extent, and has the same length and the pressure blade 51 and the receiving blade that are accurately maintained in parallelism. 52. Therefore, at the time of clamping, the portion of the liquid crystal panel 1 to be clamped follows the pressure-bonding head 50 composed of the pressure blade 51 and the receiving blade 52. The pressure blade 51 and the receiving blade 52 also include from the start position to the end position where the ACF tape 13 is applied, and the ACF tape 13 has a uniform pressure applied to the entire contact portion of the pressure blade 51. Works. Further, since the position of the end portion of the pressure blade 51 coincides with the half-cut pasting end position, the pressing force acts on the base end side from the half-cut pasting end position where the ACF 8 exists. Never do. Even if the pasting of the ACF 8 is completed last time, the pressure blade 51 and the receiving blade 52 protrude forward from the pasting start position where the ACF 8 does not exist and is only the mount tape 12, but there is a special problem. It will not be.

  When the ACF 8 is pressure bonded to the lower substrate 2, the pressure applied to the ACF tape 13 by the pressure bonding head 50 is released. Next, the cylinder 56 is driven to displace the receiving blade 52 to the lowered position. Thereafter, the elevation drive unit 22 is raised. At this time, as shown by the arrows in FIG. 16, the longitudinal drive unit 23 is driven together with the elevation drive unit 22, and is inclined with respect to the width direction of the ACF tape 12. When operated so as to be pulled upward, the mount tape 12 is peeled off from the ACF 8.

  As described above, the attachment of the ACF 8 to the one electrode group 5 in the projecting portion 2a of the lower substrate 2 is completed. The affixing unit 10 is held in the raised position, the driving roller 18 is operated, and the ACF tape 13 is pulled out from the supply reel 11 and fed by one pitch. Then, the translation drive unit 24 is operated to move the pasting unit 10 by one pitch, that is, by the amount indicated by the interval P in FIG. And the board | substrate support stand 9 holding the liquid crystal panel 1 does not move. In this state, the ACF 8 is sequentially attached to the electrode group 5 by repeating the same operation as described above. That is, for each arrangement of the electrode groups 5 in the liquid crystal panel 1, the ACF 8 is pressure-bonded almost limited to the length L, and this is sequentially repeated.

  Here, the pressure-bonding head 50 includes a pressure blade 51 and a receiving blade 52, and the pressure blade 51 and the receiving blade 52 are driven up and down by elevating blocks 53 and 54, respectively. , 54 move up and down along the guide rail 55 provided in the affixing unit 10 to hold the lower substrate 2 from above and below in a state where the pressure blade 51 and the receiving blade 52 always maintain parallelism accurately. When n electrode groups 5 are formed on the liquid crystal panel 1, the distance (n · P) is separated from the first ACF 8 attachment position to the final ACF 8 attachment position, but all have substantially the same conditions. ACF8 is pressure-bonded. Therefore, ACF 8 can be attached to all electrode groups 5 with an equal pressure even in a large liquid crystal panel 1 as well as a small size, and no crimping failure occurs. In addition, although both the raising / lowering blocks 53 and 54 are made to guide the same guide rail 55, it is not necessary to share the guide rail 55 necessarily.

  Here, in attaching the ACF 8 to the projecting portion 2 a of the lower substrate 2 in the liquid crystal panel 1, the position of the end portion on the base end side of the pressure blade in the travel path of the ACF tape 13 is a half-cut attachment. Although it is necessary to make it coincide with the attachment end position, it is not essential to position the pressure blade at the attachment start end position. That is, the pressure blade 151 and the receiving blade 152 shown in FIG. 17 can extend further forward by the length α beyond the position where the ACF 8 is attached. Here, on the front side from the pasting start end position, the pasting of the ACF 8 was completed last time, the ACF 8 does not exist, and only the mount tape 12 is present. Therefore, even if this part is sandwiched between the pressure blade 151 and the receiving blade 152, there is no problem, and since there is no ACF 8 at this part, the pressure applied to the ACF 8 at the part to be attached is equal. Sex is not impaired.

  The liquid crystal panel 1 has driver circuits 4 mounted on the short side and the long side, and the overall length may be different between the short side electrode group and the long side electrode group. Therefore, by making the entire length of the pressure blade 151 and the receiving blade 152 longer than the longer one of the short side electrode group and the long side electrode group, the ACF 8 is attached to these short side portions. Even when the ACF 8 is attached to the long side portion, the same attaching mechanism can be used. Further, the present invention can also be applied when attaching ACF to liquid crystal panels having different screen sizes.

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Lower board | substrate 2a Overhang | projection part 3 Upper board | substrate 4 Driver circuit 5 Electrode group 8 ACF 9 Support base 11 Supply reel 12 Mount tape 13 ACF tape 16, 17 Horizontal guide roller 22 Lifting drive part 23 Back and forth movement drive part 24 Flat Action drive unit 36 Carriage 40 Half-cut means 41 Cutter 50 Crimp head 51, 151 Pressure blade 52, 152 Receiving blade 53, 54 Lift block 55 Guide rail 56 Cylinder 57 Pressure means

Claims (3)

  1. Using a pressure-bonding head composed of a pressure blade and a receiving blade, the pressure blade and the receiving blade are moved up and down to press the ACF tape in which the ACF is laminated on the mount tape against the substrate on which a plurality of electrodes are formed. A method of attaching the ACF to the substrate,
    The pressure blade and the receiving blade are each driven up and down by the up and down drive means,
    After the receiving blade is brought into contact with the back side of the substrate, the ACF tape is pressure-bonded to the substrate by applying pressure to the substrate with a pressure blade,
    After the ACF is pressure-bonded to the substrate, the pressure applied to the ACF tape by the pressure-bonding head is released, and then the receiving blade is displaced to the lowered position.
  2. A plurality of ACF attachment areas are set on the substrate, and the pressure blades and the receiving blades constituting the pressure bonding head have a length extending over the entire length of the ACF attachment area. The ACF adhering method according to claim 1, wherein after the attachment is performed, the pressure-bonding head is conveyed in an arrangement direction of electrodes provided on the substrate.
  3. The ACF adhering method according to claim 1 or 2, wherein the pressure blade and the receiving blade are guided in a vertical direction by a common guide means and are driven up and down independently.
JP2009171001A 2007-08-21 2009-07-22 ACF pasting method Expired - Fee Related JP4453849B2 (en)

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CN101714500B (en) * 2009-09-30 2012-02-01 日东电子科技(深圳)有限公司 COG chip inversion bonding device
KR101220316B1 (en) * 2010-07-28 2013-01-09 현정 주식회사 film's binding device
WO2013183507A1 (en) * 2012-06-06 2013-12-12 シャープ株式会社 Component press-bonding device
KR102138746B1 (en) * 2013-05-15 2020-07-29 삼성디스플레이 주식회사 Film treating apparatus and method for film treating using the same
CN104914595B (en) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 Substrate briquetting machine
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JP5096835B2 (en) * 2007-08-21 2012-12-12 株式会社日立ハイテクノロジーズ ACF pasting device and flat panel display manufacturing device

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CN101916001B (en) 2012-10-10
JP2009071282A (en) 2009-04-02
TWI373813B (en) 2012-10-01
CN101393332A (en) 2009-03-25
JP2009276775A (en) 2009-11-26
KR101011178B1 (en) 2011-01-26
JP4501036B2 (en) 2010-07-14
JP2010004051A (en) 2010-01-07
TW200926324A (en) 2009-06-16
KR20090019738A (en) 2009-02-25
CN101916001A (en) 2010-12-15
JP4392766B2 (en) 2010-01-06
CN101393332B (en) 2010-09-15

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