CN1755526A - Base plate processing system - Google Patents

Base plate processing system Download PDF

Info

Publication number
CN1755526A
CN1755526A CNA2005101079651A CN200510107965A CN1755526A CN 1755526 A CN1755526 A CN 1755526A CN A2005101079651 A CNA2005101079651 A CN A2005101079651A CN 200510107965 A CN200510107965 A CN 200510107965A CN 1755526 A CN1755526 A CN 1755526A
Authority
CN
China
Prior art keywords
substrate
table top
treating
resist
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101079651A
Other languages
Chinese (zh)
Inventor
归山武郎
坂井光广
梶原拓伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1755526A publication Critical patent/CN1755526A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

To provide a substrate processing system for coating surfaces of substrates to be processed with a film of a processing solution and forming a predetermined pattern on each substrate in cooperation of an exposure device, which system can coat the processing solution on each substrate uniformly and can increase a substrate processing throughput when cooperated with the exposure device. A substrate processing system 100 for coating surfaces of substrates to be processed a film of a processing solution comprises a coated-film forming means having first and second stages 50 and 59 for mounting each substrate thereon, and also having a processing solution coating means for coating the processing solution on the surfaces of the substrate mounted on the first and second stages 50 and 59 to form a film of the processing solution on each substrate; and substrate transporting means 42a and 42b for transporting the substrates having the films formed thereon by the coated-film forming means to a plurality of exposure devices 4a and 4b.

Description

Base plate processing system
Technical field
The present invention relates on the surface of processed substrate, form the film for the treatment of fluid,, on substrate, form the base plate processing system of predetermined pattern with the exposure device interlock.
Background technology
For example, in the manufacturing of LCD, form the film of regulation on as the LCD substrate of processed substrate after, painting photoresist liquid forms resist film, and is corresponding with circuit pattern, make the resist film exposure, utilize this film is carried out the so-called photoetching technique that developing is handled, form circuit pattern.In this photoetching technique, as master operation, the LCD substrate of processed substrate, through carrying out washing treatment → dehydration cure → adhere to (hydrophobization) processing → painting erosion resistant agent → prebake → exposure → developing → after a series of processing of curing, the circuit pattern that formation is stipulated on resist layer.
In addition, in this processing, in the past, carry out the exposure device and the resist-coating Videograph processing devices interlock that carries out handling beyond it of exposure-processed, carried out above-mentioned a series of processing.
In above-mentioned resist-coating Videograph processing devices, as painting erosion resistant agent liquid on the LCD substrate, form the method for resist film, existence with the resist supply nozzle of banded painting erosion resistant agent liquid and LCD substrate with the vertical direction of nozzle discharge opening length direction, the method that relatively moves and be coated with.In this case, the groove shape discharge opening with the minim gap that extends in the substrate width direction is set on the resist supply nozzle, by from this groove shape discharge opening, all surfaces with the resist liquid supplying substrate of band shape output forms resist film.
Adopt this method, owing to export (supply) resist liquid to the another side band shape on one side from substrate, resist liquid is waste not, can form resist film on tetragonal whole substrates.The coating membrane formation device that adopts this coated film formation method is disclosed in patent documentation 1 (spy opens flat 10-156255).
[Patent Document 1] spy opens flat 10-156255 communique (the 3rd page of right hurdle the 5th walks to the 4th page of left hurdle the 6th row, the 1st figure).
Summary of the invention
Yet, in utilizing the coating membrane formation device of above-mentioned coated film formation method, form the throughput rate of handling in order only to improve film, as shown in figure 14, two table tops 200 by mounting substrate G, resist supply nozzle 201 and adjust the device that the nozzle standby portion 202 attached to the state of the resist liquid of nozzle 201 front ends constitutes preferably are set.Like this, can respectively on table top 200, simultaneously substrate be carried out film and form processing.
But, in this case, have the floor area of coating membrane formation device and the cost technique for enhancing problem of device.
In addition, for addressing the above problem, even improve the throughput rate of coating membrane formation device, but because the processing speed of exposure device is slow, in the substrate delivery phase of carrying out to exposure device, handle and be detained greatly, the throughput rate all as resist-coating Videograph processing devices (base plate processing system) may not improve.
The invention relates to the problems referred to above face proposes, its objective is that coating forms the processing liquid film on the surface that will be provided at processed substrate, with the exposure device interlock, on substrate, form in the base plate processing system of predetermined pattern, treating fluid can be coated with equably, the base plate processing system of the processing substrate throughput rate in the time of can improving with the exposure device interlock on each substrate.
In order to address the above problem, base plate processing system of the present invention, it is characterized in that, coating forms the film for the treatment of fluid on the surface of processed substrate, with the exposure device interlock, on substrate, form in the base plate processing system of predetermined pattern, have: coated film forms the unit, it comprises first table top and second table top on the processed substrate of mounting respectively, is being positioned in the treating fluid coater unit that processed substrate surface on above-mentioned first table top and second table top is coated with treating fluid, forms film respectively; The substrate supply unit, a plurality of relatively exposure devices form the unit by above-mentioned coated film and carry out processed substrate after transport membrane forms.
Like this, by and two table tops of row arrangement, can be coated with processing to the processed substrate that is positioned in respectively on the table top expeditiously.That is, owing on a table top, be coated with in the processing, can on another table top, carry out Input-Output Operation, therefore, can save the needed time of substrate input and output, boost productivity than the situation of in the past single table top.
In addition, carry out substrate substrate conveying conveying device, can reduce the delay before base plate exposure is handled by having a plurality of relatively exposure devices.Therefore, all processing substrate throughput rate of base plate processing system in the time of can improving with the exposure device interlock especially.
In addition, preferably also have correspondingly, make one or more substrate rotating devices of processed substrate rotating in the horizontal direction with the processing substrate direction.
Adopt this structure, because all floor areas of base plate processing system dwindle, each processing element of being had of placement substrate disposal system freely.That is,, can make the direction of substrate consistent with subsequent processing even the processing substrate direction difference between the processing element is utilized the substrate rotating device.
In addition, above-mentioned treatment liquid coating device has: a treating fluid supply nozzle that contains the groove shape discharge opening that extends at the Width of processed substrate; Move the mobile device of above-mentioned treating fluid supply nozzle; Treating fluid is supplied with the treating fluid feedway of above-mentioned treating fluid supply nozzle, with being exported to from above-mentioned discharge opening, treating fluid freely rotates on the circumferential surface that forms roller, by above-mentioned roller is rotated, treating fluid attached to above-mentioned discharge opening is carried out fluid injection (priming) treating apparatus that homogenising is handled, preferably utilize above-mentioned treating fluid supply nozzle, on the processed substrate surface that is positioned on first table top and second table top, be coated with treating fluid.
In addition, above-mentioned fluid injection (priming) treating apparatus preferably is arranged between above-mentioned first table top and second table top.
In addition, before above-mentioned processed substrate was coated with processing, the said nozzle mobile device made the circumferential surface of the discharge opening of above-mentioned treating fluid supply nozzle near above-mentioned roller, handled carry out homogenising attached to the treating fluid on the above-mentioned discharge opening.
By this structure, the treating fluid attached to treating fluid supply nozzle discharge opening is carried out can being coated with processing to the substrate that is positioned on each table top immediately after homogenising handles.Therefore, can carry out the uniform film thickness coating to the substrate of on each table top, handling and handle, and can boost productivity.
In addition, preferred above-mentioned fluid injection (priming) treating apparatus has the roller control device for pivoting of the rotation of the above-mentioned roller of control, when to carrying out homogenising attached to the treating fluid on the above-mentioned discharge opening when handling, above-mentioned roller rotation control device, handle by the coating of on which of above-mentioned first table top or above-mentioned second table top, carrying out after this homogenising is handled, determine the sense of rotation of above-mentioned roller.
Adopting this structure, in spray nozzle front end portion, can discharge opening be that the border is controlled, and makes in an opposite side with the nozzle travel direction and adheres to more treating fluid.That is, in spray nozzle front end portion, with the discharge opening border, adhere under the state of more treating fluid in a side opposite with the nozzle travel direction, when the coating beginning, can suppress because the generation of the inhomogeneous broom bar that causes of coated film etc.
Also preferably in above-mentioned fluid injection treating apparatus, be provided with the moisturizing device that suppresses above-mentioned treating fluid supply nozzle front end drying.
Like this, by moisturizing device being set, the drying of nozzle tip in the time of can suppressing standby.
Also, have the first fluid injection treating apparatus and the second fluid injection treating apparatus preferably as above-mentioned priming device; The above-mentioned first fluid injection treating apparatus and the second fluid injection treating apparatus are configured in the right side or the left side of above-mentioned first table top and second table top respectively.
In addition, preferably to before being positioned in processed substrate on above-mentioned first table top and being coated with processing, the said nozzle mobile device makes the circumferential surface of the discharge opening of above-mentioned treating fluid supply nozzle near above-mentioned roller, the above-mentioned first fluid injection treating apparatus carries out homogenising to the treating fluid attached to above-mentioned discharge opening to be handled, and, to before being positioned in processed substrate on above-mentioned second table top and being coated with processing, the said nozzle mobile device makes the discharge opening of above-mentioned treating fluid supply nozzle near above-mentioned roller circumferential surface, and the above-mentioned second fluid injection treating apparatus carries out homogenising to the treating fluid attached to above-mentioned discharge opening to be handled.
Like this, by and two table tops of row arrangement, can be coated with processing expeditiously to the processed substrate that is positioned in respectively on the table top.That is,, can on another table top, carry out Input-Output Operation, therefore, can save the needed time of substrate input and output, boost productivity than the situation of previous single table top owing on a table top, be coated with in the processing.
In addition, owing to dispose the roller corresponding respectively, therefore, can after the treating fluid on the discharge opening that adheres to the treating fluid supply nozzle being carried out the homogenising processing, be coated with processing to mounting substrate on each table top immediately with each table top.Therefore, can carry out the coating of uniform film thickness to the substrate of on each table top, handling and handle, and can boost productivity.
In addition, preferred above-mentioned first and second priming devices have the roller control device for pivoting that the above-mentioned roller of control rotates, and the roller rotation direction of the above-mentioned first fluid injection treating apparatus is identical with the roller direction of the above-mentioned second fluid injection treating apparatus.
Adopting this structure, can be that the border is controlled with the discharge opening at spray nozzle front end, makes on the opposite side with the nozzle travel direction and adheres to more treating fluid.That is, at spray nozzle front end, be the border with the discharge opening, on a side opposite, adhere under the state of more treating fluid, in the time of can being suppressed at the coating beginning, because the generation of the inhomogeneous broom bar that causes of coated film etc. with the nozzle travel direction.
Also preferably in above-mentioned first fluid injection treating apparatus or the above-mentioned second fluid injection treating apparatus, the moisturizing device that suppresses above-mentioned treating fluid supply nozzle front end drying is set.
By moisturizing device being set like this, the drying of spray nozzle front end in the time of can being suppressed at standby.
Adopt the present invention can obtain the film of coating formation treating fluid on the surface of processed substrate, with the exposure device interlock, on substrate, form in the base plate processing system of predetermined pattern, can on each substrate, be coated with treating fluid equably, can improve the base plate processing system of the throughput rate of the processing substrate of advancing with the exposure device interlock.
Description of drawings
Fig. 1 is the planimetric map of expression as the entire infrastructure of first embodiment of the resist-coating Videograph processing devices of base plate processing system of the present invention.
Fig. 2 is the stereographic map with resist-coating device of resist-coating Videograph processing devices shown in Figure 1.
Fig. 3 is the side view of the resist-coating device of Fig. 2.
The front end amplification sectional view of the resist supply nozzle that Fig. 4 has for the resist-coating device of Fig. 2.
The figure that near the discharge opening of the resist supply nozzle that Fig. 5 has for the resist-coating device of key diagram 2 resist liquid homogenising is handled.
The synoptic diagram of the moving direction of the resist supply nozzle that Fig. 6 has for the resist-coating device of presentation graphs 2.
The process flow diagram of the action control operation of the resist supply nozzle that Fig. 7 has for the resist-coating device of presentation graphs 2.
Fig. 8 is the side view that schematically shows first variation of the resist-coating device that the resist-coating Videograph processing devices of Fig. 1 has.
The figure that the coating of the resist supply nozzle that Fig. 9 is had for the resist-coating device of key diagram 8 is handled.
The figure that Figure 10 handles for the fluid injection of the resist supply nozzle that is had of the resist-coating device of key diagram 8.
Figure 11 is the side view that schematically shows second variation of the resist-coating device that the resist-coating developing device of Fig. 1 has.
Figure 12 is the side view that schematically shows the 3rd variation of the resist-coating device that the resist-coating developing device of Fig. 1 has.
Figure 13 is the planimetric map of expression as the entire infrastructure of second embodiment of the resist-coating Videograph processing devices of base plate processing system of the present invention.
Figure 14 has the figure of the action of two resist supply nozzles under the existing coating membrane formation device situation for expression.
Symbol description:
23-resist-coating processing element 23a-resist-coating device (coating membrane formation device)
50-table top (first table top) 51-resist supply nozzle (treating fluid supply nozzle)
51a-discharge opening 51b-lower surface
51c-dip plane 52-fluid injection roller (first priming device)
55-nozzle standby portion (fluid injection treating apparatus) 59-table top (second table top)
86-nozzle mobile device 63-fluid injection roller (second priming device)
65-roller control device for pivoting 95-resist liquid supply source (treating fluid feedway)
100-resist-coating Videograph processing devices 101-resist-coating Videograph processing devices
G-LCD substrate (processed substrate) G1-LCD substrate (processed substrate)
G2-LCD substrate (processed substrate) R-resist liquid (treating fluid)
Embodiment
Below, first embodiment of the present invention mode is described with reference to the accompanying drawings.Fig. 1 is the planimetric map of expression as all structures of the resist-coating Videograph processing devices of base plate processing system of the present invention.This resist-coating Videograph processing devices 100 has: mounting is accommodated the box station 1 of a plurality of box C of the polylith LCD substrate G (hereinafter referred to as substrate G) of processed substrate; Have and be included in substrate G and go up the treating stations 2 of coating as a plurality of processing element of a series of processing of the resist liquid for the treatment of fluid and developing; With at a plurality of (2) exposure devices (EXP) 4a, carry out the station, interface 3 of the replacing usefulness of substrate G between the 4b.In addition, dispose above-mentioned box station 1 and station, interface 3 respectively at the two ends of above-mentioned treating stations 2.
Box station 1 has the conveying mechanism 10 that carries out the input and output of substrate G between box C and treating stations 2.In addition, this conveying mechanism 10 has the conveying arm 11 that moves on the conveying road that can be provided with in the orientation along box C.Utilize this conveying arm 11 can between box C and treating stations 2, carry out the conveying of substrate G.
Treating stations 2 has the substrate G that extends at directions X and carries the two parallel row pipeline A of usefulness, B, 3 configurations of station, interface along pipeline A from box station 1 side direction and clean clean processing element (SCR) 21, the first heat processing unit zone 26, resist-coating processing element 23 and the second heat processing unit zone 27.In addition, on a part of cleaning on the clean processing element (SCR) 21, excimer UV irradiation part (e-UV) 22 is set.
In addition, along pipeline B, from station, interface 3 towards the box station 1 configuration developing processing element (DEV) 24, i line UV irradiation part (i-UV) 25 and the 3rd heat processing unit 28.
The first heat processing unit zone 26 is made of the stacked a plurality of thermal treatment sections of the heat processing unit multistage that substrate G is carried out heat treated or cooling processing.That is, by substrate G is carried out before the resist-coating heat treated cure parts, utilize HMDS gas to carry out the stacked thermal treatment section 26a such as adhesive attachment means that hydrophobization is handled, 26b constitutes the cooling-part 26c that is cooled to set point of temperature of substrate G.
In addition, the center configuration in the first heat processing unit zone 26 has the vertical transport parts (S/A) 5 of the conveying arm (omitting among the figure) of conveying substrate G.The conveying arm of vertical transport parts (S/A) 5 can be at X, Y, and Z-direction moves, and can rotate in the horizontal direction.That is, the conveying arm of vertical transport parts (S/A) 5 can be near each thermal treatment section 26a in the first heat processing unit zone 26,26b, and 26c carries out the conveying of substrate G.
In addition, resist-coating processing element 23 is by constituting as coating resist-coating device (CT) 23a of membrane formation device and drying under reduced pressure parts (VD) 23b, as shown in the figure, they respectively with vertical transport parts (S/A) 6 disposed adjacent.
In addition, vertical transport parts (S/A) 6 are the structure that all parts identical with vertical transport parts (S/A) 5 structures can move more greatly in X-direction.That is, in resist-coating device (CT) 23a, a transfer unit is corresponding to two table top correspondences in X-direction and row arrangement.In addition, utilize vertical transport parts 6 (S/A) to carry out the conveying of substrate G on drying under reduced pressure parts (VD) 23b.
About resist-coating device (CT) 23a, describe in detail afterwards.
The second heat processing unit zone 27 is by three the thermal treatment section 27a of configuration on every side that surround vertical transport parts (S/A) 7,27b, 27c formation.
Vertical transport parts (S/A) 7 have the structure identical with vertical transport parts (S/A) 5, carry out substrate in three thermal treatment section 27a, 27b, the conveying on the 27c
The 3rd heat processing unit 28 is by two the thermal treatment section 28as adjacent with vertical transport parts (S/A) 8, and 28b constitutes.
Vertical transport parts (S/A) 8 have the structure identical with vertical transport parts (S/A) 5, carry out substrate in two thermal treatment section 28a, the conveying on the 28b.
In addition, station, interface 3 has as respectively at exposure device (EXP) 4a, carries out vertical transport parts (S/A) 42a of base board delivery device of the input and output of substrate G between the 4b, buffering table top (BUF) 43a of 42b and configuration buffer pocket, 43b.
Vertical transport parts (S/A) 42a, 42b have respectively the structure identical with above-mentioned vertical transport parts (S/A) 5.
In addition, station, interface 3 has the vertical transport parts (S/A) 44 as the substrate acceptance division after treating stations 2.These vertical transport parts (S/A) 44 make the parts identical with above-mentioned vertical transport parts (S/A) 5 structures all Y direction can be bigger move, utilize vertical transport parts (S/A) 44, can be transported to two buffering table top (BUF) 43a from the substrate G that treating stations 2 is sent, on the 43b.
Buffering table top (BUF) 43a, 43b is transported to exposure device (EXP) 4a for temporarily accommodating, and the block of the substrate G among the 4b is provided with the substrate rotating parts (ROT) 46 as the substrate rotating device in its hypomere portion.That is,, on the 43b, can temporarily accommodate substrate G, make it can be by aforesaid substrate rotatable parts (ROT) 46 at buffering table top (BUF) 43a, with exposure device (EXP) 4a, the processing substrate direction correspondence among the 4b is rotated.
Station, interface 3 has the external device (ED) section 45 of captions recording device (TITLER) and peripheral exposure device (EE) stacked on top of one another.Between this external device (ED) section 45 and vertical transport parts (S/A) 42a, be provided as the substrate rotating parts (ROT) 46 of substrate rotating device.That is, substrate G after the 4b exposure-processed, utilizes vertical transport parts (S/A) 42a or vertical transport parts (S/A) 44 to be transported on the substrate rotating parts (ROT) 46 by exposure device (EXP) 4a, again with the corresponding rotation of the processing substrate direction of subsequent processing.
In the resist-coating Videograph processing devices 100 that constitutes like this, at first, be configured in substrate G in the box C in the box station 1 by after in the conveying device 10 input treating stations 2, utilize excimer UV irradiation part (e-UV) 22 to clean pre-treatment earlier, utilize scouring to clean processing element (SCR) 21 and clean clean the processing.
Secondly, (26b among the 26c, carries out a series of thermal treatment (processing is cured in dehydration, hydrophobization processing etc.) for HP, COL) 26a substrate G to be imported the heat processing unit section that belongs to the first heat processing unit zone 26.
Then, in substrate G input resist-coating processing element 23, the film that carries out resist liquid forms to be handled.In this resist-coating processing element 23, at first in resist-coating device (CT) 23a, secondly painting erosion resistant agent liquid on substrate G, carry out drying under reduced pressure and handle in drying under reduced pressure parts (VD) 23b.
Carry out the processing of resist film forming in resist-coating processing element 23 after, substrate G is imported the heat processing unit section that belongs to the second heat processing unit zone 27, and (27b among the 27c, carries out a series of thermal treatment (pre-bake treatment etc.) for HP, COL) 27a.
Secondly, utilize vertical transport parts (S/A) 44, substrate G is transported in the peripheral exposure device (EE) of external device (ED) section 45.Therein, substrate G is removed the exposure of peripheral resist.Then, utilize vertical transport parts (S/A) 44, substrate G alternatively temporarily is housed in buffering table top (BUF) 43a, among the 43b, utilize vertical transport parts (S/A) 42a, 42b, the substrate G that accommodates is transported to 2 exposure devices (EXP) 4a, on any platform among the 4b.
Promptly, utilize vertical transport parts (S/A) 42a, the substrate G that will be housed on buffering table top (BUF) 43a is transported among exposure device (EXP) 4a, utilizes vertical transport parts (S/A) 42b, and the substrate G that will be housed on buffering table top (BUF) 43b is transported among exposure device (EXP) 4b.
At exposure device (EXP) 4a, among the 4b, the resist film on the substrate G is exposed, and forms predetermined pattern.
Behind the end exposure, utilize vertical transport parts (S/A) 42a, 42b, 44 grades once are transported to substrate G on the substrate rotating parts (ROT) 46.In subsequent processing, corresponding again with the processing substrate direction, make substrate rotating in the horizontal direction.
Secondly, substrate G is transported in the captions recording device of epimere of external device (ED) section 45 information of recording prescribed.Yet utilize the roller conveyer structure again substrate G to be transported to treating stations 2, at first, substrate G is transported in the developing processing element (DEV) 24, carry out developing and handle.
After the developing processing finishes, with substrate G from developing processing element (DEV) 24 input i line UV irradiation parts (i-UV) 25, to the substrate G processing of decolouring.Then, substrate G is imported the 3rd heat processing unit zone 28,, carry out a series of thermal treatment (afterwards curing processing etc.) on the 28b at heat processing unit section (HP) 28a.
In addition, after being cooled to set point of temperature, utilize travelling belt to carry, substrate G is transported to box station 1, utilize conveying device 11 to be housed among the box C of regulation.
Then, according to Fig. 2 and Fig. 3, resist-coating device (CT) 23a that resist-coating processing element 23 is had is described in detail.Fig. 2 is the stereographic map of the outward appearance of expression resist-coating device (CT) 23a, and Fig. 3 is the side view of resist-coating device (CT) 23a.
This resist-coating device (CT) 23a is by table top 50 that flatly keeps substrate G (first table top) and table top 59 (second table top), and constitutes being positioned in the treatment liquid coating device that substrate G on these table tops carries out painting erosion resistant agent liquid.
Treatment liquid coating device has the table top of being configured in 50, the resist supply nozzle of 59 top (treating fluid supply nozzle) 51, move the nozzle mobile device 86 of this resist supply nozzle 51 (hereinafter referred to as nozzle 51) and with the resist liquid supply source 95 (treating fluid feedway) of resist liquid supply nozzle 51.
In this structure, move horizontally nozzle 51 by utilizing nozzle mobile device 86, the substrate G (G1, G2) on the table top 50,59 is relatively moved horizontally with nozzle 51.
And for example shown in Figure 3, above-mentioned table top 50 and table top 59 have the substrate maintaining part 50a that has liftable sorption mechanism respectively, and 59a utilizes aforesaid substrate maintaining part 50a, and 59a receives and keep the substrate G of input.
In addition, as shown in Figure 2, said nozzle 51 has at substrate G1, the discharge opening 51a of the groove shape that the Width of G2 extends and the resist liquid reception room (not illustrating among the figure) that is communicated with this discharge opening 51a.The resist liquid supply pipe 57 of resist liquid supply source 95 by connecting is connected with this resist liquid reception room.
Shown in the amplification sectional view of Fig. 4, the leading section of nozzle 51 from its minor face, is taper, and along the nozzle short side direction, the front and back of discharge opening 51a form lower surface 51b and dip plane 51c respectively.In addition, on the travel direction of this nozzle 51 when coating is handled directivity is arranged.That is, as shown in Figure 4, the bottom 51b of an opposite side with the nozzle travel direction is bigger at the width that nozzle short side direction length forms.Like this, utilize the surface of bottom 51b, with the resist liquid R pressed towards substrate surface of output, therefore coating is handled stable.
Again as shown in Figures 2 and 3, between table top 50 and table top 59, above-mentioned treatment liquid coating device has nozzle standby portion 55 (fluid injection treating apparatus).This nozzle standby portion 55 has when standby, make the fluid injection roller 52 (roller) free to rotate that becomes evenly (being called fluid injection handles) usefulness attached to the resist liquid of the front end of nozzle 51, with in order to wash being immersed in the container 53 in the thinning agent and suppressing the portion that preserves moisture (moisturizing device) 54 of nozzle 51 front end dryings of this fluid injection roller 52.
As shown in Figure 5, the fluid injection before substrate is coated with processing makes the circumferential surface of the front end of nozzle 51 near fluid injection roller 52 in handling.From discharge opening 51a output resist liquid R, on the other hand, utilize roller control device for pivoting 65 that rotary roller 52 is rotated, make attached to the resist liquid R homogenising of nozzle 51 front ends and handle.
And for example shown in Figure 5, mobile from the resist liquid R of discharge opening 51a output in the rotation direction of roller 52.Therefore, after fluid injection is handled,,, become the state that has the resist liquid of Duoing to adhere to than opposite side along the rotation direction of roller 52 in a side of nozzle 51 front ends.When coating was handled, the moving direction of may command nozzle 51 made with discharge opening 51a to be the border, and resist liquid R adheres to a few side becomes travel direction.Like this, generations such as broom bar are arranged when suppressing the coating beginning, coated film is more even.
In addition, as shown in Figure 5, be provided with slide 91 in the centre of fluid injection roller 52.This slide 91 is made by the drug resistance resin, and the circumferential surface sliding contact of front end and fluid injection roller 52 can be removed the resist liquid or the thinning agent 89 of unwanted coating last time on the circumferential surface.
The front end shape of slide 91 is just passable as long as can bring into play the function of removing resist liquid, except the wedge shape section that uses in this example, also may adopt the arbitrary shape of the cross sectional shape of square-section or fork-shaped.
In addition, constituting of this slide 91 utilizes cylinder 90, can the upper/lower positions of the circumferential surface of contact fluid injection roller 52 and leave fluid injection roller 52 circumferential surfaces on lifting between the position, as required, its position may change.
And for example shown in Figure 2, in the both sides of the length direction of discharge opening 51a, be provided with the film thickness monitoring device 80 that reduction is pressed from the output of the resist liquid R of discharge opening 51a output.This film thickness monitoring device 80 is by the suction tube 82 that is connected with access 81 that the both sides of the length direction of discharge opening 51a are communicated with respectively, with be located at for example constituting of suction tube 82 as the suction pump 83 of diaphragm pump, by driving suction pump 83, can reduce the output pressure of discharge opening 51a both sides.On the attraction side (being nozzle 51 sides) of the suction pump 83 of suction tube 82, be provided with open and close valve 84.
The manner of execution of resist-coating device (CT) 23a of said structure then, is described.At first, as shown in Figure 2, the action during painting erosion resistant agent liquid R is described with respect to the substrate G1 that is positioned on the table top 50.
At first, nozzle 51 is configured in the nozzle standby portion 55, on the other hand, the sorption on table top 50 keeps by conveying arm 64 substrate conveying G1.At this moment, utilize the substrate maintaining part 50a sorption substrate G1 that is installed on the table top 50.In again resist liquid R being supplied to resist liquid reception room in the nozzle 51 from resist liquid supply source 95, utilize nozzle mobile device 86 simultaneously, nozzle 51 is moved to the left end top of table top 50 from nozzle standby portion 55.
Secondly, nozzle 51 is exported resist liquid R from discharge opening 51a, and moves to right at substrate G1.The distance of discharge opening 51a and substrate G is set to be preferably set to 60 μ m about 40～150 μ m.
In addition, at this moment by driving suction pump 83, attract the both sides of the length direction of discharge opening 51a, the output of the resist liquid R of the both sides of minimizing discharge opening 51a is pressed, at the output pressure of discharge opening 51a central part side and the output pressure state about equally of both sides, that is, under the thick equal state of the liquid of resist liquid R, be banded output (supply) to substrate G.Therefore, by substrate G and nozzle 51 relative moving horizontally, resist liquid R is the surface of banded supplying substrate G, forms the resist film of homogeneous film thickness on the surface of whole base plate G.
Like this, after forming resist film on the substrate G surface, stop the supply of resist liquid R, simultaneously, nozzle 51 is moved to position of readiness, the discharge opening 51a that makes nozzle 51 is near the fluid injection roller 52 in the nozzle standby portion 55, for coating processing is next time prepared.In addition, form the substrate G of resist film, utilize vertical transport parts 6, be transported on drying under reduced pressure parts (VD) 23b from mounting table 50.
Secondly the action of the nozzle 51 when continuously a plurality of substrates being coated with processing, according to Fig. 6 and Fig. 7, is described on resist-coating device (CT) 23a.Fig. 6 is the synoptic diagram of the moving direction of expression nozzle 51.Fig. 7 is the process flow diagram of the action control operation of expression nozzle 51.
At first, make the fluid injection roller 52 of nozzle 51, carry out the fluid injection of nozzle 51 front ends and handle (the step S1 of Fig. 7) near nozzle standby portion 55.At substrate G1 with uncoated treatment state, be transported to (the step S2 of Fig. 7) under the situation on the table top 50, nozzle 51 moves on the left end of table top 50.Carry out coating processing (the step S3 of Fig. 7) to the resist liquid R of substrate G1.At this moment, nozzle 51 moves on direction shown in the arrow of Fig. 6, is coated with processing.
Secondly, nozzle 51 moves to nozzle standby portion 55, carries out the fluid injection of nozzle 51 front ends and handles (the step S4 of Fig. 7).Be transported under the situation on the table top 59 (the step S5 of Fig. 7) at the substrate G2 with uncoated treatment state, nozzle 51 moves on the right-hand end of table top 59, carries out handling (the step S6 of Fig. 7) to the coating of the resist liquid R of substrate G2.At this moment, nozzle 51 moves on direction shown in the arrow of Fig. 6, is coated with processing.
Secondly, turn back to the processing of the step S1 of Fig. 7, then, under situation the about continuously substrate of uncoated state being transported on each table top,, carry out the coating of substrate is handled according to above-mentioned flow process.
In addition, in above-mentioned steps S2 or step S5, under situation about substrate not being transported on the table top, nozzle 51 moves to the portion of preserving moisture 54, nozzle 51 front ends standby under moist state (the step S7 of Fig. 7) after fluid injection is handled.
In addition, as mentioned above, on the travel direction of nozzle 51 when coating is handled directivity is arranged, because like this, when coating was handled, to substrate G1, G2 controlled mobile action by the device 86 that nozzle moves, make that shown in the arrow of Fig. 6 nozzle 51 moves on substrate on same direction.
Adopt above-described first embodiment, by and two table tops 50,59 of row arrangement, can be coated with processing to the substrate G that is positioned in respectively on the table top expeditiously.That is, be coated with in the processing on a table top, can carry out Input-Output Operation on another table top, therefore the situation with existing single table top compares, and can save the time that the substrate input and output need, and can boost productivity.
In addition, owing between two table tops 50,59, dispose nozzle standby portion 55, therefore after nozzle 51 being carried out the fluid injection processing, can be coated with processing to being positioned in arbitrary table top upper substrate G immediately.Owing to like this, can carry out the coating processing of uniform film thickness to the substrate G that is positioned on arbitrary table top.
In addition, with situation with two devices that constitute by table top, nozzle and nozzle standby portion shown in Figure 14 relatively, can reduce floor area, also can reduce installation cost.
Adopt the structure shown in the foregoing description, even because substrate maintaining part 50a, the fault of 59a etc. can not be in table top 50 or table top 59 any one on be coated with under the state of processing, by moving, can on another table top, be coated with processing according to the flow process different with flow process shown in Figure 7.That is, producing under the situation of fault on table top 50 sides, can carry out the fluid injection of nozzle 51 front ends successively repeatedly and handle and the coating of the untreated substrate G2 on the table top 59 is handled.On the other hand, producing under the situation of fault on table top 59 sides, can carry out the fluid injection of nozzle 51 front ends successively repeatedly and handle and the coating of the untreated substrate G1 on the table top 50 is handled.Therefore, can avoid the operation interrupted of the resist-coating Videograph processing devices 100 that causes by above-mentioned fault.
As mentioned above, adopt the structure (configuration) of resist-coating Videograph processing devices 100, have with respect to many (2) exposure device 4a, the vertical transport parts 42a that 4b, conveying substrate use, 42b.Owing to like this, can reduce and utilize the preceding delay of exposure-processed of the substrate G of coated film formation processing expeditiously of two table tops.The throughput rate of the processing substrate that the resist-coating Videograph processing devices (base plate processing system) in the time of therefore, can improving with the exposure device interlock especially is all.
Adopt this configuration, each heat processing unit and resist-coating processing element 23 be configured in carry out vertical transport parts (S/A) that substrate carries around, in addition, corresponding with the processing substrate direction in the subsequent processing, the substrate rotating parts of rotational substrate G are arranged on important place in the horizontal direction.Like this, can avoid each processing element to be arranged side by side, can reduce the size of resist-coating Videograph processing devices in a direction.
The structure of the resist-coating device 23a that illustrates in the foregoing description and action control thereof are examples, are not limited only to this.Then, according to Fig. 8～Figure 10, first variation of the resist-coating device that comprises in the base plate processing system of the present invention is described.
Fig. 8 is the side view that schematically shows first variation of resist-coating device.Fig. 9 is used for the figure that coating that resist supply nozzle that the resist-coating device of key diagram 8 had carries out is handled.The figure that the fluid injection of the resist supply nozzle that Figure 10 is had for the resist-coating device of key diagram 8 is handled.
In this first variation, the action that utilizes nozzle mobile device 86 to carry out is controlled as shown in Figure 8, the moving direction when nozzle 51 can change the coating processing on table top 50 sides or table top 59 sides.
And for example shown in Figure 9, the leading section of nozzle 51 is clamped discharge opening 51a, and relative bottom 51b forms big width together.Like this, the travel direction of nozzle 51 direction as shown by arrows, no matter be which direction, the resist liquid R of output to substrate surface, can be carried out stable coating by the surface pressure of bottom 51b.
In addition, in fluid injection shown in Figure 10 was handled, which carried out the coatings processing next time of roller control device for pivoting 65 bases in table top 50 or table top 59, the rotation direction of decision roller 52.That is, at nozzle 51 front ends, be the border with discharge opening 51a, the rotation direction of decision roller 52 makes on the opposite side of nozzle travel direction that coating is handled next time and adheres to more resist liquid R.
And for example shown in the figure, clamp nozzle 51, slide 91 is set respectively about roller 52, control, make the circumferential surface sliding contact of any slide 91 and roller 52 according to the rotation direction of roller 52.That is, according to the rotation direction of roller 52, any cylinder 90 is driven, the lifting action of control slide 91.
Like this, adopt first variation of resist-coating device 23a, after any that is positioned in the substrate G1 on the table top 50 or is positioned in substrate G2 on the table top 59 carried out fluid injection handling, moving nozzle 51 on the orientation substrate of handling so is coated with processing immediately.
That is, because than directive structure on the travel direction of nozzle 51, therefore not waste, can not increase floor area in the shift action of nozzle 51, more can boost productivity, and can also suppress the drying of nozzle 51 front ends.
Second variation of resist-coating device 23a then, is described according to Figure 11.
Figure 11 is the side view that schematically shows second variation of resist-coating device 23a.As shown in figure 11, mounting substrate G1 respectively, the table top 50 of G2 and table top 59 laterally and row arrangement are provided with nozzle standby portion 55 (fluid injection treating apparatus) in the place adjacent with the table top 50 of table top 59 opposite sides.
In this resist-coating device 23a, the nozzle 51 that moves from nozzle standby portion 55 at first is coated with the substrate G1 that handles on the table top 50, and secondly the substrate G2 on the table top 59 is handled in coating, returns nozzle standby portion 55.
Like this, adopt the second distortion example of resist-coating device 23a,, the processing block number of time per unit is increased because serially to being positioned in the substrate G1 on table top 50 and the table top 59 respectively, G2 is coated with processing.
Yet, in second variation of this resist-coating device 23a, after coating is handled to substrate G1, be coated with on the discharge opening periphery of resist liquid attached to the groove shape of dry solidification in handling.Because like this, when under this state next substrate G2 being coated with when handling, from the resist liquid disorder of discharge opening output, generation can not be coated with the technical matters of processing equably to real estate.
Therefore, as the example that solves the problems of the technologies described above,, the 3rd distortion example of resist-coating device 23a is described according to Figure 12.Figure 12 is the side view that schematically shows the 3rd variation of resist-coating device.As shown in figure 12, constitute the left side that roller 52 (the first fluid injection treating apparatus) and the portion 54 that preserves moisture is configured in table top 50, roller 63 (the second fluid injection treating apparatus) is configured in the left side of table top 59.
That is, roller 63 is configured between table top 50 and the table top 59.In addition, preserve moisture that to be configured in roller 63 contiguous also passable in portion 54.Do not illustrate among the figure, roller 52 and the part 54 of preserving moisture are configured in the right side of table top 50, the right side that roller 63 is configured in table top 59 is also passable.In this case, will preserve moisture that to be configured in roller 59 contiguous also passable in portion 54.In addition, above-mentioned roller 52 and roller 63 rotate in the same direction.
Adopt this structure, at first, carry out the fluid injection processing with roller 52 after, on table top 50, carry out the coating of substrate G1 is handled, secondly, after utilizing roller 63 to carry out the fluid injection processing, on table top 59, carry out the coating of substrate G2 and handle.
Like this, adopt the 3rd variation of resist-coating device 23a,, therefore can solve the technical matters of second variation owing to, carry out fluid injection and handle to before being positioned in substrate G1 on table top 50 and the table top 59 and substrate G2 respectively any being coated with processing.
In addition, with the texture ratio of resist-coating device 23a shown in Figure 4, floor area and installation cost increase, but in above-mentioned first variation, can obtain the throughput rate that equates with resist-coating device shown in Figure 8.
Then, according to second embodiment of Figure 13 explanation as the resist-coating Videograph processing devices of base plate processing system of the present invention.Figure 13 is the planimetric map of all structures (configuration) of the resist-coating Videograph processing devices of expression second embodiment.Identical with structure shown in Figure 1, with identical symbolic representation, omit its detailed description.
This resist-coating Videograph processing devices 101 is same with the resist-coating Videograph processing devices 100 of Fig. 1, has box station 1, treating stations 2 and station, interface 3 along the figure X-direction.
In resist-coating Videograph processing devices 101, treating stations 2 is same with resist-coating Videograph processing devices 100 shown in Figure 1, has the pipeline A that the substrate G that extends in X-direction carries parallel two row of usefulness, B.
Yet,, clean clean processing element (SCR) 21, the first heat processing unit zones 26, resist processing element 23 and the second heat processing unit zone 27 from box station side 1 towards 3 assortments of station, interface along pipeline A.In addition, clean a part of cleaning on the processing element (SCR) 21 and be provided with excimer UV irradiation part (e-UV) 22.
In addition, along pipeline B, box station 1 configuration developing processing element (DEV) 24, i line UV irradiation part (i-UV) 25 and the 3rd heat processing unit 28 from station, interface 3 side direction.
First heat processing unit zone, 26 and first embodiment is same, is made of a plurality of thermal treatment sections, except thermal treatment section 26a, beyond the 26b, also has the roller of utilization conveying etc. and carry the tunnel sections 26d of natural cooling in tunnel path.Also has the cooling-part 26e that substrate G is cooled to set point of temperature, 26f.
In addition, clean to clean between the processing element (SCR) 21 and first heat processing unit 26, dispose corresponding with the processing substrate direction in the subsequent processing, as the substrate rotating parts (ROT) 12 of the substrate rotating device that makes substrate G rotation in the horizontal direction.
In addition, between thermal treatment section 26a and thermal treatment section 26b, vertical transport parts (S/A) 13 are set,, are transported to the device on first heat processing unit 26 as utilizing substrate rotating parts (ROT) 12 with the substrate G that rotates.Vertical transport parts (S/A) 5 of the vertical transport parts (S/A) 13 and first embodiment is same, has the conveying arm (omitting among the figure) of conveying substrate G, and this conveying arm can be at X, and Y and Z-direction move, and can rotate.Utilize these vertical transport parts (S/A) 13 that substrate G relatively hot is handled section 26a, 26b carries.
In addition, vertical transport parts (S/A) 14 are configured in the cooling-part 26e of Y direction and row arrangement, the vicinity of 26f.These vertical transport parts (S/A) 14 make the parts identical with vertical transport parts (S/A) 13 structures all, do big moving along Y direction, can utilize a transfer unit to carry out relative two cooling-part 26e with substrate G, and 26f carries.
As shown in the figure, resist-coating processing element 23 is round vertical transport parts (S/A) 15 configurations.That is, resist-coating device (CT) 23a (coating membrane formation device) that resist-coating processing element 23 has and drying under reduced pressure parts (VD) 23C, 23d are respectively adjacent to vertical transport parts (S/A) 15 configurations.
Vertical transport parts (S/A) 15 make the parts identical with vertical transport parts (S/A) 13 structures all, do big moving along Y direction.Therefore, utilize vertical transport parts 15 (S/A) each device of the relative resist-coating processing element 23 of substrate G can be carried.
In addition, in resist-coating device (CT) 23a, also can use the structure identical (comprising the 1st～the 3rd variation), omit its detailed description with first embodiment.
In addition, the second heat processing unit zone 27 is by 4 thermal treatment section 27a of the four direction configuration of surrounding vertical transport parts (S/A) 16,27b, 27c, 27d formation.The structure of vertical transport parts (S/A) 16 is identical with above-mentioned vertical transport parts (S/A) 13, can be with relative 4 the thermal treatment section 27a of substrate, and 27b, 27c, 27d carries.
In treating stations 2,, vertical transport parts (S/A) 17,18 are set in the front and back of the 3rd heat processing unit 28 along X-direction.Vertical transport parts (S/A) 17,18 structure with vertical transport parts (S/A) 13 respectively are identical, substrate G relatively hot can be handled section 28a, and 28b carries.
In resist-coating Videograph processing devices 101, station, interface 3 is corresponding with the processing substrate direction in the subsequent processing by conduct, substrate rotating parts (ROT) 19a of the substrate rotating device of rotational substrate G in the horizontal direction, 19b, as with capable relative 2 the exposure device 4a of substrate G, interface element 20 and external device (ED) section 45 that 4b carries out the substrate conveying conveying device constitute.
Also have, interface element 20 constitutes the parts identical with the structure of above-mentioned vertical transport parts (S/A) 13 can be moved freely in Y direction, at two exposure device 4a, comes and goes between the 4b.
The treatment process of the resist-coating Videograph processing devices 101 of above structure (configuration) is described.
At first, the substrate G in the box C in will being configured in box station 1, utilize conveying device 11 input treating stations 2 after, clean pre-treatment by excimer UV irradiation part (e-UV) 22 earlier, clean processing element (SCR) 21 and clean to clean and handle by cleaning.
Secondly, substrate G is transported on the substrate rotating parts 12, makes it and the corresponding rotation of the processing substrate direction of subsequent processing.Then, substrate G is imported the thermal treatment section 26a that belongs to the first heat processing unit zone 26, among the 26b, carry out a series of heat treatment process (processing is cured in dehydration, hydrophobization processing etc.).And by substrate G is carried in tunnel sections 26d, natural cooling at cooling-part 26e, is cooled to set point of temperature among the 26f.
Then, utilize vertical transport parts (S/A) 14, in substrate G input resist-coating processing element 23, carry out the formation of resist liquid film and handle.In this resist-coating processing element 23, described in above-mentioned first embodiment, in resist-coating device (CT) 23a, resist liquid is coated on the substrate G, then, at drying under reduced pressure parts (VD) 23c, carry out drying under reduced pressure among the 23d (any) and handle.
In addition, (23c, 23d) drying under reduced pressure parts (VD) in resist-coating device (CT) 23a, expeditiously to a plurality of substrate G of painting erosion resistant agent, carry out drying under reduced pressure side by side and handle, and can boost productivity by being provided with 2.
After the resist film forming is handled in above-mentioned resist-coating processing element 23, substrate G is imported the heat processing unit section 27a that belongs to the second heat processing unit zone 27,27b, 27c among the 27d, carries out a series of thermal treatment (the molten processing of preliminary drying etc.).
Secondly, utilizing substrate rotating parts (ROT) 19a that substrate G is consistent with subsequent processing, after rotating in the horizontal direction, utilize interface element (I/F) 20, be transported to exposure device 4a, in any of 4b.Interface element (I/F) 20 constitutes to make with the parts of vertical transport parts (S/A) 13 same structures all can do big moving on Y direction.
At exposure device 4a, among the 4b, behind resist film exposure formation predetermined pattern, utilize interface element (I/F) 20 to take out substrate G, utilize substrate rotating parts (ROT) 19b, consistent with subsequent processing, rotate in the horizontal direction.
Secondly, substrate G is transported in the peripheral exposure device (EE) of external device (ED) section 45 at station, interface 3 exposure of removing peripheral resist.Then, be transported in the captions recording device (TITLER) of epimere of external device (ED) section 45 information of recording prescribed on substrate G.
Then, utilize the roller conveyer structure, substrate G is transported to treating stations 2 again.At first substrate G is transported in the developing processing element (DEV) 24, carries out developing and handle.
After the developing processing finishes, substrate G is input to the i line UV irradiation part (i-UV) 25 from developing processing element (DEV) 24, the substrate G processing of decolouring.Again substrate G is input in the 3rd heat processing unit zone 28,, carries out a series of thermal treatment (afterwards curing processing etc.) on the 28b at heat processing unit section 28a.
After again substrate G being cooled to set point of temperature, utilize travelling belt to carry, be transported to box station 1, be housed in by conveying device 11 among the box C of regulation.
Like this, adopt second embodiment, as shown in figure 13, have substrate a plurality of relatively (two) exposure device 4a, 4b carries out the interface element 20 of usefulness.Like this, can reduce and carry out coated film expeditiously by two table tops and form the delay of substrate G before exposure-processed of handling.Therefore, all processing substrate throughput rate of resist-coating Videograph processing devices (base plate processing system) in the time of can improving with the exposure device interlock especially.
Also have, adopt this configuration, around the vertical transport parts (S/A) that carry out the substrate conveying, dispose each heat processing unit and resist-coating processing element 23, corresponding in important local setting with the processing substrate direction in subsequent processing, the substrate rotating parts that substrate G is rotated in the horizontal direction.Like this, each processing element can be avoided being arranged side by side in one direction, the size of resist-coating Videograph processing devices can be reduced.
In addition, in above-mentioned first and second embodiment, forming resist film with coating on the LCD substrate is example, but is not to only limit to this, can use in the base plate processing system for the treatment of fluid being supplied with on the processed substrate arbitrarily.As treating fluid of the present invention, except resist liquid, interlayer dielectic for example, the dielectric material, the liquid of wiring material etc. also can.In addition, processed substrate of the present invention be not authority in the LCD substrate, semiconductor wafer, the CD substrate, glass substrate, photomask, printed base plates etc. also can.
Utilizability on the industry
The present invention is in the processing substrate with treatment fluid film forming on LCD substrate or semiconductor wafer etc. Be suitable in the system, can in semiconductor manufacturing industry, electronic device manufacturing industry etc., use well.

Claims (11)

1. base plate processing system, it is coated with the film that forms treating fluid on the surface of processed substrate, with the exposure device interlock, form predetermined pattern on substrate, has:
The coating membrane formation device, it has: first table top and second table top of the processed substrate of difference mounting; With on the surface that is positioned in the processed substrate on described first table top and second table top respectively, be coated with treating fluid, form the treatment liquid coating device of film;
Base board delivery device with respect to a plurality of exposure devices, and is carried the processed substrate that is formed with film by described coating membrane formation device.
2. base plate processing system as claimed in claim 1 is characterized in that:
Also have correspondingly, make one or more substrate rotating devices of processed substrate rotating in the horizontal direction with the processing substrate direction.
3. base plate processing system as claimed in claim 1 or 2 is characterized in that:
Described treatment liquid coating device has: a treating fluid supply nozzle that contains the groove shape discharge opening that extends on the Width of processed substrate; Move the nozzle mobile device of described treating fluid supply nozzle; Treating fluid is supplied with the treating fluid feedway of described treating fluid supply nozzle; Treating fluid is outputed to from described discharge opening on the roller circumferential surface that freely rotates formation, rotates, the treating fluid attached to described discharge opening is carried out the fluid injection treating apparatus that homogenising is handled by making described roller,
Utilize described treating fluid supply nozzle, on the surface that is positioned in the processed substrate on first table top and second table top, be coated with treating fluid.
4. base plate processing system as claimed in claim 3 is characterized in that:
Described first table top and second table top and row arrangement,
Described fluid injection treating apparatus is arranged between described first table top and second table top.
5. base plate processing system as claimed in claim 3 is characterized in that:
Before described processed substrate was coated with processing, described nozzle mobile device made the circumferential surface of the discharge opening of described treating fluid supply nozzle near described roller, handled carry out homogenising attached to the treating fluid on the described discharge opening.
6. base plate processing system as claimed in claim 3 is characterized in that:
Described fluid injection treating apparatus has the roller control device for pivoting that the described roller of control rotates,
When to carrying out homogenising attached to the treating fluid on the described discharge opening when handling, described roller control device for pivoting, handle by the coating of on any of described first table top or described second table top, carrying out after this homogenising is handled, determine the rotation direction of described roller.
7. base plate processing system as claimed in claim 3 is characterized in that:
In described fluid injection treating apparatus, be provided with the moisturizing device of the front end drying that suppresses described treating fluid supply nozzle.
8. base plate processing system as claimed in claim 3 is characterized in that:
As described priming device, have the first fluid injection treating apparatus and the second fluid injection treating apparatus,
The described first fluid injection treating apparatus and the second fluid injection treating apparatus are configured in the right side or the left side of described first table top and second table top respectively.
9. base plate processing system as claimed in claim 8 is characterized in that:
To before being positioned in processed substrate on described first table top and being coated with processing, described nozzle mobile device makes the circumferential surface of the discharge opening of described treating fluid supply nozzle near described roller, the described first fluid injection treating apparatus carries out homogenising to the treating fluid attached to described discharge opening to be handled
And, to before being positioned in processed substrate on described second table top and being coated with processing, described nozzle mobile device makes the discharge opening of described treating fluid supply nozzle near described roller circumferential surface, and the described second fluid injection treating apparatus carries out homogenising to the treating fluid attached to described discharge opening to be handled.
10. base plate processing system as claimed in claim 8 or 9 is characterized in that:
Described first and second priming devices have the roller control device for pivoting that the described roller of control rotates, and the roller of the described first fluid injection treating apparatus is identical with the rotation direction of the roller of the described second fluid injection treating apparatus.
11. base plate processing system as claimed in claim 8 or 9 is characterized in that:
In described first fluid injection treating apparatus or the described second fluid injection treating apparatus, the moisturizing device of the front end drying that suppresses described treating fluid supply nozzle is set.
CNA2005101079651A 2004-09-30 2005-09-30 Base plate processing system Pending CN1755526A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004287596 2004-09-30
JP2004287596A JP2006100722A (en) 2004-09-30 2004-09-30 Substrate processing system therefor

Publications (1)

Publication Number Publication Date
CN1755526A true CN1755526A (en) 2006-04-05

Family

ID=36240209

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101079651A Pending CN1755526A (en) 2004-09-30 2005-09-30 Base plate processing system

Country Status (4)

Country Link
JP (1) JP2006100722A (en)
KR (1) KR20060051463A (en)
CN (1) CN1755526A (en)
TW (1) TWI281704B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102166559A (en) * 2010-01-08 2011-08-31 大日本网屏制造株式会社 Substrate processing device
CN102046840B (en) * 2008-03-25 2012-08-01 奥宝科技Lt太阳能有限公司 Processing apparatus and processing method
CN102687240A (en) * 2009-12-28 2012-09-19 龙云株式会社 Coating device for substrate and substrate-coating method
CN101281372B (en) * 2007-04-04 2012-11-28 细美事有限公司 Coater and method of coating a process solution on a substrate using the same
CN103199031A (en) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 Full-automatic glue film coating and developing device
CN104597716A (en) * 2013-10-31 2015-05-06 上海和辉光电有限公司 Exposure and development apparatus, and exposure and development method
CN117184835A (en) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 Coating apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065000A (en) * 2007-09-07 2009-03-26 Tokyo Electron Ltd Treating method for substrate, program, computer storage medium, and substrate treating system
JP4900397B2 (en) * 2009-01-29 2012-03-21 東京エレクトロン株式会社 Liquid processing equipment
JP2011156482A (en) * 2010-02-01 2011-08-18 Sharp Corp Liquid coating device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101281372B (en) * 2007-04-04 2012-11-28 细美事有限公司 Coater and method of coating a process solution on a substrate using the same
CN102046840B (en) * 2008-03-25 2012-08-01 奥宝科技Lt太阳能有限公司 Processing apparatus and processing method
CN102687240A (en) * 2009-12-28 2012-09-19 龙云株式会社 Coating device for substrate and substrate-coating method
CN102166559A (en) * 2010-01-08 2011-08-31 大日本网屏制造株式会社 Substrate processing device
CN102166559B (en) * 2010-01-08 2013-08-21 大日本网屏制造株式会社 Substrate processing device
CN103199031A (en) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 Full-automatic glue film coating and developing device
CN103199031B (en) * 2012-01-04 2015-10-14 沈阳芯源微电子设备有限公司 Full-automatic glue film coating, developing apparatus
CN104597716A (en) * 2013-10-31 2015-05-06 上海和辉光电有限公司 Exposure and development apparatus, and exposure and development method
CN117184835A (en) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 Coating apparatus

Also Published As

Publication number Publication date
JP2006100722A (en) 2006-04-13
TWI281704B (en) 2007-05-21
KR20060051463A (en) 2006-05-19
TW200627519A (en) 2006-08-01

Similar Documents

Publication Publication Date Title
CN1755526A (en) Base plate processing system
CN1746776A (en) Substrate processing apparatus and substrate positioning device
CN100341113C (en) Coating method and coating device
CN1828828A (en) Substrate processing device, method and program
CN1286152C (en) Liquid processing apparatus and method thereof
KR101052949B1 (en) Developing Processing Apparatus and Developing Processing Method
CN1437044A (en) LCD adhesion machine and method for producing LCD with the same adhering machine
CN1831649A (en) Coating and developing apparatus and coating and developing method
CN1685471A (en) Methods and systems for processing a substrate using a dynamic liquid meniscus
CN101060093A (en) Substrate transportation and processing apparatus
CN101034666A (en) Substrate treating apparatus
CN1808275A (en) Coating and developing apparatus and coating and developing method
CN1900358A (en) Apparatus for electroless deposition of metals onto semiconductor substrates
CN1501439A (en) Substrate processing method, substrate processing apparatus and substrate processing system
CN1892423A (en) Substrate processing apparatus
CN1933100A (en) Apparatus for and method of processing substrate subjected to exposure process
CN101079388A (en) Substrate transfer apparatus, substrate process system, and substrate transfer method
CN1681965A (en) Electroless plating apparatus and electroless plating method
CN101060066A (en) Substrate processing apparatus
CN1913101A (en) Decompression drying device
CN1674225A (en) Dummy substrate and substrate processing method using the same
CN1858648A (en) Coating method and coating apparatus
CN1276469C (en) Method and apparatus for coating anti-corrosion liquid
CN1441301A (en) Method for producing liquid crystal display
CN101042988A (en) Substrate processing method and storage medium

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20060405