KR101052949B1 - Developing apparatus and developing method - Google Patents

Developing apparatus and developing method Download PDF

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Publication number
KR101052949B1
KR101052949B1 KR1020110003962A KR20110003962A KR101052949B1 KR 101052949 B1 KR101052949 B1 KR 101052949B1 KR 1020110003962 A KR1020110003962 A KR 1020110003962A KR 20110003962 A KR20110003962 A KR 20110003962A KR 101052949 B1 KR101052949 B1 KR 101052949B1
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South Korea
Prior art keywords
substrate
rinse
developer
mechanism
developing
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KR1020110003962A
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Korean (ko)
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KR20110013548A (en
Inventor
다쿠오 가와우치
히데아키 고토
데쓰야 사다
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도쿄엘렉트론가부시키가이샤
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Priority to JP2004121184A priority Critical patent/JP4537109B2/en
Priority to JPJP-P-2004-121184 priority
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110013548A publication Critical patent/KR20110013548A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/3042Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
    • G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Abstract

A development processing apparatus and a development processing method which suppress transfer generation on a substrate are provided.
The developing processing unit 24 includes a fourth substrate transport mechanism for supporting the substrate G on which the developer paddle is formed in a substantially horizontal posture and conveying it in a predetermined direction, and in a substrate transport direction of the substrate transported by the substrate transport mechanism. By supporting the rear side and lifting the front side, a rinse nozzle for supplying a rinse liquid to the substrate tilt mechanism 60 for holding the substrate in an oblique position and the surface of the substrate supported by the substrate tilt mechanism ( 52), a rinse liquid discharge control mechanism 46 for controlling the rinse liquid discharge from the rinse nozzle, a rinse nozzle moving mechanism 47 for moving the rinse nozzle according to the inclination of the substrate, and the substrate tilt mechanism. The surface of the substrate is rinsed by discharging the rinse liquid from the rinse nozzle while moving the rinse nozzle along the surface from the lower side of the substrate supported upward to the upper side thereof. To be provided with the rinse nozzle movement mechanism and the rinsing liquid discharge control mechanism rinsing process control unit 48 for controlling.

Description

Development Processing Apparatus and Developing Processing Method

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a developing apparatus used in a port lithography step of a substrate for an FPD (flat panel display) such as a liquid crystal display (LCD), and a developing processing method.

In the manufacture of LCDs, a resist film is formed on an LCD glass substrate (hereinafter referred to as an LCD substrate), and then the resist film is exposed to correspond to a circuit pattern, which is further developed using a so-called photolithography technique. A predetermined circuit pattern is formed on the LCD substrate. For example, the developing apparatus which pauses a board | substrate conveyed in a horizontal position at a predetermined position, applies a developing solution to the surface of a board | substrate, forms a paddle on a board | substrate, and advances a developing reaction by hold | maintaining for a predetermined time, and The developing method is known (for example, refer patent document 1).

A rinsing apparatus that collects the developer from the substrate and rinses the developer by flowing the developer on the substrate by tilting the substrate as an apparatus for rinsing to supply the rinse solution to the surface of the substrate held in the oblique position. And a rinse method are known (Patent Document 2).

However, in the developing apparatus and the developing method disclosed in Patent Document 1, while the developer is applied to the substrate, the substrate is always in contact with and supported at the same position as a roller for supporting the substrate, so that transfer occurs at that portion. There is a problem that it is easy and finally appears on the substrate.

In addition, in the rinse treatment and the rinse method disclosed in Patent Document 2, since the rinse liquid is scanned from the upper side to the lower side of the substrate held in an oblique position, the flow of the rinse liquid is accelerated at the lower portion of the substrate. There is a problem that traces of the flow of the rinse liquid appear on the substrate.

[Patent Document 1] Japanese Patent Publication No. 2003-100623 [Patent Document 2] Japanese Patent Publication No. 2003-086488

This invention is made | formed in view of such a situation, The developing processing apparatus which performs development processing and rinse processing continuously at a predetermined position, conveying a board | substrate to a horizontal direction, The developing process which suppressed transfer generation in a board | substrate. An object of the present invention is to provide an apparatus and a developing method. Moreover, an object of this invention is to provide the developing processing apparatus and developing processing method which suppress the trace generation of the flow of the rinse liquid by a rinsing process.

According to a first aspect of the present invention, there is provided a substrate transport mechanism for supporting a substrate in a substantially horizontal position and transporting the substrate in a predetermined direction;

A developing nozzle for supplying a developing solution to a surface of the substrate supported by the substrate carrying mechanism;

A developer discharge control mechanism for controlling the developer discharge from the developing nozzle;

A developing nozzle moving mechanism for moving the developing nozzle in a substrate transport direction and a vertical direction;

By moving the developer nozzle in a direction opposite to the substrate transport direction while discharging the developer solution from the developer nozzle while swinging the substrate supported by the substrate transport mechanism a predetermined distance before and after the substrate transport direction, And a paddle formation control device for controlling the substrate transfer mechanism, the developer solution discharge control mechanism, and the developer nozzle moving mechanism so that they are formed.

The present invention provides a developing method by the developing apparatus according to the first aspect. That is, according to the second aspect of the present invention, the developer nozzle is discharged from the developer nozzle for discharging the developer while the substrate held in the approximately horizontal posture is linearly shaken by a predetermined distance in the horizontal plane, and the developer nozzle is moved in the swinging direction of the substrate. There is provided a developing method characterized by forming a developer paddle on the substrate by scanning in parallel in one direction.

According to a third aspect of the present invention, there is provided a substrate transport mechanism for supporting a substrate on which a developer paddle is formed in a substantially horizontal position and transporting the substrate in a predetermined direction;

A substrate inclination mechanism for holding the substrate in an oblique posture by supporting the rear side of the substrate conveying direction and lifting the front side of the substrate conveyed by the substrate conveying mechanism;

A rinse nozzle for supplying a rinse liquid to a surface of the substrate supported by the substrate tilt mechanism;

A rinse liquid discharge control mechanism for controlling the rinse liquid discharge from the rinse nozzle;

A rinse nozzle moving mechanism for moving the rinse nozzle according to the inclination of the substrate;

The rinse nozzle moving mechanism such that the surface of the substrate is rinsed by discharging the rinse liquid from the rinse nozzle while moving the rinse nozzle along the surface from the lower side of the substrate supported by the substrate tilting mechanism upwards. And a rinse processing control device for controlling the rinse liquid discharge control mechanism.

The present invention provides a developing method by the developing apparatus according to the third aspect. That is, according to the fourth aspect of the present invention, the substrate on which the paddle of the developer is formed is scanned in the opposite direction to the scanning direction of the developer nozzle by scanning in one direction the developer nozzle for discharging the developer to the substrate held in the approximately horizontal position. Conveying to and stopping at a predetermined position;

A step of flowing the developer on the substrate downward by supporting the rear side of the substrate in the substrate transport direction and lifting the front side;

Maintaining the substrate in an oblique position at a predetermined angle with respect to a horizontal plane;

A developing treatment method is provided which has a step of stopping a developing reaction and performing a rinse treatment by supplying a predetermined rinse liquid from the lower side to the upper surface of the substrate held in the oblique position. .

According to the developing apparatus and the developing treatment method according to the first and second aspects of the present invention, generation of transfer on the substrate can be suppressed. In addition, by shaking the substrate, in order to stir the developer, development accuracy such as line width uniformity can be increased. Furthermore, according to the developing apparatus and the developing treatment method according to the third and fourth aspects of the present invention, in the rinsing treatment for stopping the developing reaction, generation of traces of liquid flow can be suppressed. By these effects, a substrate having high product quality can be obtained.

The present invention is very suitable as a developing apparatus and developing method for a large substrate such as an LCD glass substrate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a resist coating and developing processing system provided with a resist coating apparatus which is an embodiment of a coating film forming apparatus of the present invention.
FIG. 2 is a side view showing a first thermal processing unit section of the resist coating and developing processing system shown in FIG.
Fig. 3 is a side view showing a second thermal processing unit section of the resist coating and developing processing system shown in Fig. 1;
Fig. 4 is a side view showing a third thermal processing unit section of the resist coating and developing processing system shown in Fig. 1.
5 is a side view showing a schematic structure of a developing unit (DEV).
6 is a plan view showing a schematic structure of a developing unit DEV.
7 is an explanatory diagram showing a schematic configuration of a control system for forming a developer paddle;
8 is an explanatory diagram schematically showing a process of forming a developer paddle;
9 is an explanatory diagram schematically showing another process of forming a developer paddle;
10 is an explanatory diagram schematically showing still another process of forming a developer paddle;
FIG. 11 is an explanatory diagram schematically showing a schematic structure of a substrate tilt mechanism and a developer removal process in a developer removal zone; FIG.
12 is an explanatory diagram showing a control system of a first rinse nozzle;

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to an accompanying drawing. In the present invention, a resist coating / development processing system including a development processing unit (DEV) for developing an LCD substrate subjected to exposure processing and continuously performing a process from formation of a resist film to development is given as an example. It shall be described in detail. 1 is a plan view showing a schematic configuration of this resist coating and developing processing system 100.

The resist coating and developing processing system 100 is adapted to apply a resist to a cassette station (import-export unit) 1 and an LCD substrate G on which a cassette C containing a plurality of LCD substrates G is placed. Interface station (interface section) for handing over the LCD substrate G between the processing station (processing section) 2 and the exposure apparatus 4 having a plurality of processing units for performing a series of processes including development (3), a cassette station 1 and an interface station 3 are disposed at both ends of the processing station 2, respectively. In addition, in FIG. 1, the longitudinal direction of the resist application and development processing system 100 is made into the X direction, and the direction orthogonal to the X direction with respect to a plane is made into the Y direction.

The cassette station 1 is a conveying apparatus for carrying in / out of the LCD substrate G between the mounting base 9 and the processing station 2 which can arrange the cassettes C in the Y direction. (11) is provided and the cassette (C) is conveyed between this mounting table 9 and the outside. Moreover, the conveying apparatus 11 has the conveying arm 11a, is movable on the conveyance path 10 provided along the Y direction which is the arrangement direction of the cassette C, and the cassette C is conveyed by the conveying arm 11a. ) And the carrying out of the LCD substrate G are performed between the processing station 2 and the processing station 2.

The processing station 2 basically has two rows of parallel conveying lines A and B for conveying the LCD substrate G, which extend in the X direction, from the cassette station 1 side along the conveying line A. The scrub cleaning processing unit (SCR) 21, the first thermal processing unit section 26, the resist processing unit 23 and the second thermal processing unit section 27 are arranged toward the interface station 3. Further, the second thermal processing unit section 27, the developing processing unit (DEV) 24, and the decolorization treatment of the development are performed from the interface station 3 side toward the cassette station 1 along the conveying line B. I-ray UV irradiation unit (i-UV) 25 and a third thermal processing unit section 28 are arranged. Part of the scrub cleaning processing unit (SCR) 21 is provided with an excimer UV irradiation unit (e-UV) 22 for removing organic matter from the LCD substrate G prior to scrubbing.

The scrub cleaning processing unit (SCR) 21 is subjected to a cleaning process and a drying process while the LCD substrate G is conveyed in a approximately horizontal position. As described in detail later, the developing unit (DEV) 24 is also subjected to the application of the developing solution, the cleaning of the developing solution after development, and the drying process while the LCD substrate G is conveyed about horizontally. In these scrub cleaning unit (SCR) 21 and developing unit (DEV) 24, the conveyance of the LCD substrate G is performed by roller conveyance or belt conveyance, for example, and the LCD substrate G The inlet and outlet of the is installed on the short sides facing each other. Also, the conveyance of the LCD substrate G to the i-ray UV irradiation unit (i-UV) 25 is continuously performed by the same mechanism as that of the developing processing unit (DEV) 24.

In the resist processing unit 23, the resist liquid is dropped onto the LCD substrate G held approximately horizontally, and the resist liquid is rotated at a predetermined rotational speed by rotating the LCD substrate G at a predetermined rotational speed. The resist coating apparatus (CT) 23a which enlarges to the whole and forms a resist film, the vacuum drying apparatus (VD) 23b which vacuum-drys the resist film formed on the LCD substrate G, and the LCD substrate G The peripheral edge resist removal apparatus (ER) 23c which removes the extra resist which adhered to the peripheral edge of LCD board | substrate G by the solvent ejection head which can scan four sides of is arrange | positioned in that order. In the resist processing unit 23, the LCD substrate G is placed between these resist coating processing apparatuses (CT) 23a, the reduced pressure drying apparatus (VD) 23b, and the peripheral edge resist removing apparatus (ER) 23c. A conveyance arm for conveying is provided.

The first thermal processing unit section 26 has two thermal processing unit blocks (TB) 31 · 32 formed by laminating thermal processing units for thermal processing on the LCD substrate G. The thermal processing unit Block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 21 side, and thermal processing unit block (TB) 32 is provided on the resist processing unit 23 side. The 1st conveyance apparatus 33 is provided between these two thermal processing unit blocks (TB) 31 * 32.

As shown in the side view of the first thermal processing unit section 26 in FIG. 2, the thermal processing unit block (TB) 31 passes through the LCD substrate G in order from below, and passes the pass unit PASS. (61), two dehydration bake units (DHP) 62 占 63 for dehydrating bake treatment for the LCD substrate G, and an adsorbing treatment unit AD for hydrophobization treatment for the LCD substrate G. 64 is stacked in four stages, and the thermal processing unit block (TB) 32 is a pass unit (PASS) (for carrying over the LCD substrate (G) in order from the bottom. 65), two cooling units (COL) 66 · 67 for cooling the LCD substrate G, and an AD 68 for performing hydrophobic treatment on the LCD substrate G in four stages. It has a stacked configuration.

The first conveying apparatus 33 receives the LCD substrate G from the scrub cleaning processing unit (SCR) 21 through the pass unit PASS 61, and the LCD substrate G between the thermal processing units. ) Is carried out, and the LCD substrate G is flipped over to the resist processing unit 23 through the pass unit PASS 65.

The 1st conveying apparatus 33 is the guide rail 91 which continues up and down, the elevating member 92 which elevates along the guide rail 91, and the base member 93 provided so that the elevating member 92 was rotatable. ) And a base holding arm 94 provided on the base member 93 so as to be able to retreat forward and holding the LCD substrate G. As shown in FIG. The lifting and lowering of the elevating member 92 is performed by the motor 95, the turning of the base member 93 is performed by the motor 96, and the forward and backward movement of the substrate holding arm 94 is performed by the motor 97. Is done by. Thus, the 1st conveyance apparatus 33 can move | move forward, backward and forward, and pivot, and can access any unit of the thermal processing unit block (TB) 31 * 32.

The second thermal processing unit section 27 has two thermal processing unit blocks (TBs) 34 占 35 formed by stacking thermal processing units for thermal processing on the LCD substrate G, and thermal processing units. Block (TB) 34 is provided on the resist processing unit 23 side, and thermal processing unit block (TB) 35 is provided on the developing processing unit (DEV) 24 side. And the 2nd conveyance apparatus 36 is provided between these two thermal processing unit blocks (TB) 34 * 35.

As shown in the side view of the second thermal processing unit section 27 in FIG. 3, the thermal processing unit block (TB) 34 passes through the LCD substrate G in order from below, and passes the pass unit PASS. ) And three pre-baking units (70, 71, 72) for pre-baking the LCD substrate (G) are stacked in four stages, and the thermal processing unit block (TB) 35 is a pass unit (PASS) 73 for flipping the LCD substrate (G) in order from the bottom, a cooling unit (COL) 74 for cooling the LCD substrate (G), and an LCD substrate ( Two pre-baking units (PREBAKE) 75 占 76 for prebaking with respect to G) are stacked in four stages.

The second conveying apparatus 36 receives the LCD substrate G from the resist processing unit 23 through the pass unit PASS 69, carries in and unloads the LCD substrate G between the thermal processing units, Extension and cooling stages (EXT and COL), which pass the LCD substrate G to the developing processing unit (DEV) 24 through a pass unit (PASS) 73, and the substrate take-up portion of the interface station 3 described later. Take over and receive the LCD substrate (G) relative to (44). Moreover, the 2nd conveyance apparatus 36 has the same structure as the 1st conveyance apparatus 33, and is accessible to any unit of the thermal processing unit block (TB) 34 * 35.

The third thermal processing unit section 28 has two thermal processing unit blocks (TB) 37 · 38 formed by stacking thermal processing units for thermal processing on the LCD substrate G, and thermal processing units. The block (TB) 37 is provided on the developing processing unit (DEV) 24 side, and the thermal processing unit block (TB) 38 is provided on the cassette station 1 side. A third transfer device 39 is provided between these two thermal processing unit blocks (TB) 37 · 38.

As shown in the side view of the third thermal processing unit section 28 of FIG. 4, the thermal processing unit block (TB) 37 is a pass unit for flipping the LCD substrate G in order from the bottom ( PASS (77) and three post-baking units (POBAKE) (78, 79, 80) for performing a post-baking process for the LCD substrate (G) has a configuration stacked in four stages. The thermal processing unit block (TB) 38 is a pass / cooling unit (PASS / COL) which delivers and cools the post-baking unit (POBAKE) 81 and the LCD substrate G in order from the bottom. (82) and two post-baking units (POBAKE) 83 · 84 for post-baking the LCD substrate G are stacked in four stages.

The third conveying apparatus 39 receives the LCD substrate G from the i-UV irradiation unit (i-UV) 25 through the pass unit PASS 77, and the LCD substrate between the thermal processing units. (G) carry-in / out and transfer of the LCD substrate G to the cassette station 1 through the pass cooling unit (PASS / COL) 82 is performed. Moreover, the 3rd conveying apparatus 39 also has the same structure as the 1st conveying apparatus 33, and can access any unit of the thermal processing unit block (TB) 37 * 38.

In the processing station 2, each processing unit and the conveying apparatus are arrange | positioned so that 2 rows of conveying lines A and B may be comprised as mentioned above, and in order to process basically, and these conveying lines A and B The space 40 is provided in between. And a shuttle (substrate mounting member) 41 is provided so that this space 40 can be reciprocated. The shuttle 41 is configured to hold the LCD substrate G. The shuttle 41 receives the LCD substrate G between the transfer lines A and B via the shuttle 41. The flipping of the LCD substrate G to the shuttle 41 is performed by the first to third transfer devices 33, 36 and 39.

The interface station 3 includes a transfer device 42 for carrying in and carrying out the LCD substrate G between the processing station 2 and the exposure apparatus 4, and a buffer stage BUF for arranging a buffer cassette ( 43) and an external device block 45 having an extension / cooling stage (EXT / COL) 44, which is a substrate repelling part having a cooling function, and a titler and a peripheral exposure device EE stacked up and down. ) Is provided adjacent to the conveying apparatus 42. The conveying apparatus 42 is provided with the conveying arm 42a, and carrying-in / out of the LCD board G is performed by the conveying arm 42a with the exposure apparatus 4 to the processing station 2.

Regarding the resist coating and developing processing system 100 configured in this manner, first, the LCD substrate G in the cassette C disposed on the mounting base 9 of the cassette station 1 is transferred to the conveying apparatus 11. This is carried in directly to the excimer UV irradiation unit (e-UV) 22 of the processing station 2 to perform scrub pretreatment. Subsequently, the conveying apparatus 11 carries in the LCD substrate G to the scrub cleaning processing unit (SCR) 21 and scrubs it. After the scrub cleaning process, the LCD substrate G is transferred to the pass unit PASS 61 of the thermal processing unit block (TB) 31 belonging to the first thermal processing unit section 26, for example, by roller conveyance. It is taken out.

The LCD substrate G disposed on the pass unit PASS 61 is first conveyed to one of the dehydration bake unit (DHP) 62 · 63 of the thermal processing unit block (TB) 31 and heated. Treated, and then transferred to one of the cooling units (COL) 66 · 67 of the thermal processing unit block (TB) 32 and cooled, and then the thermal processing unit block TB ( 31 is conveyed to either the AD treatment unit (AD) 64 of the thermal treatment unit block (TB) 32 or the advanced treatment unit (AD) 68 of the thermal processing unit block (TB) 32, and is processed there by the HMDS. (Hydrophobization treatment). Thereafter, the LCD substrate G is conveyed to one of the cooling units (COLs) 66 and 67 and cooled to further pass to the pass unit (PASS) 65 of the thermal processing unit block (TB) 32. Is returned. The conveyance processing of the LCD substrate G at the time of performing such a series of processes is performed by the 1st conveying apparatus 33 all.

The LCD substrate G disposed on the pass unit PASS 65 is carried into the resist processing unit 23 by the transfer arm of the resist processing unit 23. After the resist liquid is spin-coated with respect to the resist coating processing apparatus (CT) 23a, the LCD substrate G is conveyed to the reduced-pressure drying apparatus (VD) 23b and dried under reduced pressure, whereby the peripheral edge resist removing apparatus (ER) And the excess resist around the edge of the LCD substrate G is removed. After completion of the removal of the peripheral edge resist, the LCD substrate G passes from the resist processing unit 23 by the transfer arm to the thermal processing unit block (TB) 34 belonging to the second thermal processing unit section 27. It is sent to and received from the unit (PASS) 69.

The LCD substrate G disposed in the pass unit PASS 69 is prebaked (PREBAKE) 70 · 71 · of the thermal processing unit block (TB) 34 by the second transfer device 36. 72) and the prebaking process of the prebaking unit (PREBAKE) 75 · 76 of the thermal processing unit block (TB) 35, followed by prebaking, and then cooling of the thermal processing unit block (TB) 35. It is conveyed to the unit (COL) 74 and cooled to predetermined temperature. And the 2nd conveyance apparatus 36 is conveyed to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35 further.

Thereafter, the LCD substrate G is conveyed to the extension cooling stage (EXT / COL) 44 of the interface station 3 by the second conveying apparatus 36, and the conveying apparatus 42 of the interface station 3 is carried out. ) Is conveyed to the peripheral exposure apparatus EE of the external device block 45 to perform exposure for removing the peripheral resist, and is then conveyed to the exposure apparatus 4 by the conveying apparatus 42, whereby the LCD substrate G The resist film on) is exposed and a predetermined pattern is formed. In some cases, the LCD substrate G is accommodated in the buffer cassette on the buffer stage BUF 43 and then conveyed to the exposure apparatus 4.

After the exposure is finished, the LCD substrate G is carried to the titler TITLER of the upper end of the external device block 45 by the conveying device 42 of the interface station 3 so that predetermined information is transferred to the LCD substrate G. After being recorded, it is placed on an extension cooling stage (EXT-COL) 44. The LCD substrate G is subjected to the thermal processing unit block (TB) 35 belonging to the second thermal processing unit section 27 from the extension cooling stage (EXT / COL) 44 by the second conveying device 36. Is passed to the pass unit (PASS) 73.

The LCD substrate G is developed from the pass unit PASS 73 by, for example, actuating a substrate transfer mechanism that extends from the pass unit PASS 73 to the development processing unit DEV 24. It is carried in the processing unit (DEV) 24, and a developing process is performed there. This developing treatment step will be described later in detail.

After the completion of the development process, the LCD substrate G is conveyed from the development processing unit (DEV) 24 to the i-ray UV irradiation unit (i-UV) 25 by a continuous conveying mechanism, for example, roller conveyance, and then the LCD. The decolorization process is performed with respect to the board | substrate G. Thereafter, the LCD substrate G is connected to the thermal processing unit block (TB) 37 belonging to the third thermal processing unit section 28 by the substrate transport mechanism in the i-ray UV irradiation unit (i-UV) 25. It is carried out to the pass unit (PASS) 77.

The LCD substrate G disposed on the pass unit PASS 77 is a post-bake unit POBAKE (78, 79, 80) of the thermal processing unit block (TB) 37 by the third transfer device 39. ) And one of the post-baking units (POBAKE) 81, 83, 84 of the thermal processing unit block (TB) 38 and post-baked, and then the thermal processing unit block (TB) 38 After being conveyed to the pass / cooling unit (PASS / COL) 82 and cooled to a predetermined temperature, the predetermined cassette C arranged in the cassette station 1 by the conveying apparatus 11 of the cassette station 1 Is accommodated).

Next, the structure of the developing processing unit (DEV) 24 will be described in detail. 5 is a side view showing a schematic structure of a developing unit (DEV) 24, and FIG. 6 is a plan view thereof. The development processing unit (DEV) 24 includes a substrate loading zone 24a, a first developer supply zone 24b, a second developer supply zone 24c, a developer removal zone 24d, a rinse zone 24e, and drying. It consists of the zone 24f. Further, the substrate loading zone 24a is adjacent to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35, and the drying zone 24f is an i-ray UV irradiation unit (j-UV) 25 ) (See FIG. 1).

The LCD substrate G is conveyed in a substantially horizontal posture from the pass unit PASS 73 to the substrate loading zone 24a by the first substrate transfer mechanism 14a provided therebetween. The substrate loading zone 24a is provided as a buffer region between the pass unit (PASS) 73 and the first developer supply zone 24b. The substrate loading zone 24a prevents the developer from scattering from the first developer supply zone 24b to the pass unit PASS 73 and contaminating the pass unit PASS 73.

The 1st board | substrate carrying mechanism 14a makes the longitudinal direction the Y direction, and arrange | positions the some pivot axis member 16 and the pivot shaft member 16 which were arranged in parallel with each other at predetermined intervals in the X direction which is a board | substrate conveyance direction. It is installed at a predetermined position of the first motor 15a and the pivot shaft member 16 to rotate and supports the LCD substrate G, and the pivot shaft member 16 is rotated by the first motor 15a. It is equipped with the some roller (plate member) 17 which rotates.

In the first substrate transfer mechanism 14a, the plurality of pivot shaft members 16 are synchronously driven by a belt or the like, and the roller 17 rotates by rotating the pivot shaft member 16 and the LCD substrate G. The LCD substrate G is conveyed by the frictional force between and. As it is difficult to bend or the like on the LCD substrate G, the pivot shaft members 16 are arranged in the X direction at predetermined intervals, and a predetermined number of rollers 17 are provided in the Y direction. In addition, in FIG. 6, the 1st board | substrate carrying mechanism 14a is not shown, The figure in FIG. 6 is abbreviate | omitted also about the 2nd board | substrate carrying mechanism 14b-the 5th board | substrate carrying mechanism 14e demonstrated below. Doing.

The first developer supply zone 24b is a zone for supplying the first developer to the LCD substrate G conveyed from the substrate carrying zone 24a to form a developer paddle. And a second substrate transport mechanism 14b for transporting the LCD substrate G, and developing nozzles 51a and 51b for applying a developer to the LCD substrate G.

The second substrate transport mechanism 14b is driven by the second motor 15b. Therefore, the second substrate transfer mechanism 14b can be driven independently of the first substrate transfer mechanism 14a. However, when conveying LCD substrate G from the board | substrate carrying zone 24a to the 1st developing solution supply zone 24b, the 1st board | substrate carrying mechanism 14a and the 2nd board | substrate carrying mechanism 14b are a board | substrate conveyance speed. Is driven to be equal.

The developing nozzles 51a and 51b are long in the direction orthogonal to the substrate conveyance direction (Y direction), and have elongate nozzles or slit-shaped ejection openings that can discharge the developer in a band shape, or a plurality of holes provided at predetermined intervals. It is possible to have a discharge port in the shape, and the developing nozzle moving mechanism 55 is free to scan in the X direction and free to move up and down in the Z direction.

FIG. 7 is an explanatory diagram showing a schematic configuration of a control system of an operation of supplying a developer to the LCD substrate G to form a developer paddle. The start and stop of the discharge of the developer from the developing nozzles 51a and 51b are controlled by the developer discharge control mechanism 56. For example, the developer discharge control mechanism 56 includes a tank for storing the developer, a pump for feeding the developer at a predetermined flow rate, and a valve for opening and closing the liquid supply line to the developing nozzles 51a and 51b. have. The second substrate transfer mechanism 14b, the developing nozzle moving mechanism 55, and the developer discharge control mechanism 56 are controlled by the paddle formation control device 57, and the paddle formation control device 57 is inputted. Or the developer paddles are formed on the LCD substrate G by controlling them according to the recipe stored in the predetermined storage means.

FIG. 8 is an explanatory diagram schematically showing a process of forming a developer paddle on the LCD substrate G. FIG. As shown in Fig. 8A, the developing nozzles 51a and 51b are initially positioned on the front side in the substrate conveyance direction with respect to the LCD substrate G carried in and stopped in the first developer supply zone 24b. 2nd developer supply zone 24c side}. The paddle formation control device 57 drives the developing nozzle moving mechanism 55, arranges the developing nozzles 51a and 51b at a predetermined height, and at a predetermined speed toward the LCD substrate G (for example, 100). Scan starts at ~ 300 mm / sec).

Next, as shown in Fig. 8 (b), when the developing nozzle 51a reaches the vicinity of the right end (front side of the substrate conveying direction) of the LCD substrate G, the paddle forming control device 57 develops the developing nozzle. The developer discharge control mechanism 56 is controlled so that the developer discharge from the 51a and 51b is started. In addition, the developing nozzle 51a and the developing nozzle 51b may delay the timing of the developer discharge.

Then, after the start of discharging the developing solution from the developing nozzles 51a and 51b, the paddle formation control device 57 drives the second substrate transfer mechanism 14b, and the LCD substrate G in the direction indicated by the arrow + B. In the direction opposite to the direction in which the developing nozzles 51a and 51b are scanned, they are horizontally moved at a predetermined speed (for example, 5 to 20 mm / sec).

Subsequently, as shown in Fig. 8C, the LCD substrate G is stopped when the predetermined time (for example, 2 to 6 seconds) has elapsed while the developing nozzles 51a and 51b are continuously scanned. Subsequently, as shown in Fig. 8 (d), while the developing nozzles 51a and 51b are scanned, the LCD substrate G is shown in the direction indicated by the arrow -B, that is, the direction in which the developing nozzles 51a and 51b are scanned. In the same direction as in the above, horizontal movement is performed at a predetermined speed (for example, 5 to 20 mm / sec).

As shown in Fig. 8, the developing nozzle 51a is inclined so as to discharge the developing solution at an oblique rear. As a result, the expansion of the developing solution in front of the developing nozzle 51a is suppressed, and the weakening at the time of supplying the developing solution to the LCD substrate G is suppressed. Further, the developing nozzle 51b is also inclined at a predetermined angle so that the developing solution first applied to the LCD substrate G is not greatly stirred by the developing solution discharged from the developing nozzle 51b. In addition, the developing nozzle 51b is held at a position farther from the LCD substrate G than the developing nozzle 51a. As a result, the developer discharged from the developing nozzle 51a is suppressed from being pushed out in the scanning direction by the developing nozzle 51b.

Then, at the timing when the developing nozzle 51b reaches the vicinity of the left end of the LCD substrate G, the discharge of the developing solution from the developing nozzles 51a and 51b is stopped and the LCD substrate G is stopped. The developing nozzle 51b is lowered to approach the left end of the LCD substrate G and held for a predetermined time (for example, 1 to 2 seconds). As a result, the developer supplied to the LCD substrate G can be prevented from overflowing from the left end of the LCD substrate G. FIG.

Thereafter, the developing nozzles 51a and 51b are raised to a predetermined height and returned to their original positions. On the other hand, the LCD substrate G in which the developer paddle was formed is conveyed to the 2nd developer supply zone 24c by driving the 2nd board | substrate carrying mechanism 14b. Further, the series of operations shown in Figs. 8B to 8D for forming the developer paddle described above may be further repeated once or several times.

In the method for forming the developer paddle described above, the development is performed such that the horizontal movement of the LCD substrate G is stopped and the timing of scanning stop by the developing nozzle 51b reaching the left side of the LCD substrate G matches. It is preferable to match the scanning speed of the nozzles 51a and 51b with the swing period of the LCD substrate G. For example, during the time when the developing nozzles 51a and 51b move from the right end to the left end of the LCD substrate G, the LCD substrate G can reciprocate horizontal movement once or multiple times. It is preferable to adjust the scanning speed of the developing nozzles 51a and 51b, the horizontal moving speed and the moving time of the LCD substrate G.

According to this method of forming the developer paddle, while the developer is being applied to the LCD substrate G, the LCD substrate G is not always supported at the same point by the roller 17, so that the roller 17 The contacts are not stained. That is, generation of transfer can be prevented. Further, by first moving the LCD substrate G in the direction opposite to the scanning direction of the developing nozzles 51a and 51b, the development uniformity can be improved and the liquid overflow from the LCD substrate G can be suppressed. have.

In the method of forming the developer paddle shown in Fig. 8, the moving direction at the start of horizontal movement of the LCD substrate G is reversed from the scanning direction of the developing nozzles 51a and 51b. However, as shown in Fig. 9, the LCD substrate G May be adapted to the scanning direction of the developing nozzles 51a and 51b. That is, as shown in Fig. 9A (showing the same state as in Fig. 8A), scanning of the developing nozzles 51a and 51b is first started toward the stopped LCD substrate G. .

Next, as shown in Fig. 9B, when the developing nozzle 51a reaches the vicinity of the right end (front side of the substrate conveying direction) of the LCD substrate G, the developer is discharged from the developing nozzles 51a and 51b. Then, the LCD substrate G is then horizontally moved at a predetermined speed in the direction of arrow-B, such as the direction in which the developing nozzles 51a and 51b are scanned. Subsequently, as shown in Fig. 9 (c), the LCD substrate G is stopped at a time point when a predetermined time has elapsed while the developing nozzles 51a and 51b are continuously scanned.

Subsequently, as shown in Fig. 9 (d), the LCD substrate G is horizontally moved at a predetermined speed in the direction of the arrow + B while continuously scanning the developing nozzles 51a and 51b. Then, as shown in Fig. 9E, the discharge of the developing solution from the developing nozzles 51a and 51b is stopped in accordance with the timing at which the developing nozzle 51b reaches the vicinity of the left end of the LCD substrate G. Then, as shown in FIG. At the same time, the LCD substrate G is stopped, the developing nozzle 51b is lowered to approach the left end of the LCD substrate G, and the predetermined time is maintained.

By the method of forming the developer paddle, the LCD substrate G is not always supported by the roller 17 at the same point while the developer is being applied to the LCD substrate G. The contacts are not stained. Moreover, compared with the method shown in FIG. 8, although it is disadvantageous in terms of developing uniformity, it does not lead to poor quality, and in terms of device configuration (hard configuration), it is easy to control and the device cost can be reduced. desirable.

In addition, you may form a developer paddle by the method shown in FIG. That is, scanning of the developing nozzles 51a and 51b is started toward the stopped LCD substrate G (Fig. 10 (a)), and the developing nozzle 51a is the right end of the LCD substrate G (substrate broadcasting). In the front direction, the developer is discharged from the developing nozzles 51a and 51b (Fig. 10 (b)), and the developing nozzles 51a and 51b are not moved horizontally. 10 (c), when the developing nozzle 51b reaches near the left end of the LCD substrate G, the discharge of the developing solution from the developing nozzles 51a and 51b is stopped and the developing nozzle ( 51b) is dropped to approach the left end of the LCD substrate G (Fig. 10 (d)). Thereafter, the developing nozzles 51a and 51b are separated from the LCD substrate G, and the LCD substrate G is first moved in the direction of the arrow + B, for example, and then returned to the direction of the arrow -B. .

Also by this method, since the LCD substrate G can shorten the time supported by the roller 17 at the same point, generation | occurrence | production of the transfer in the contact part of the roller 17 can be suppressed. In addition, as shown in Figs. 8 and 9, the LCD substrate G is shaken while the developer paddle is discharged from the developing nozzles 51a and 51b to form the developer paddle. It may be oscillated further and conveyed to the second developer supply zone 24c after a predetermined time has elapsed.

In this way, the developer may overflow from the LCD substrate G while the LCD substrate G filled with the liquid in the first developer supply zone 24b is transferred to the developer removal zone 24d. In this way, the second developer supply zone 24c newly applies the developer to the LCD substrate G in order to prevent the developing reaction from progressing by overflowing the developer from the LCD substrate G during the conveyance of the LCD substrate. It is a zone to supplement.

The 3rd board | substrate carrying mechanism 14c which drives from the 3rd motor 15c is provided in the 2nd developing solution supply zone 24c, The 3rd board | substrate carrying mechanism 14c is the 2nd board | substrate carrying mechanism 14b. It can be driven independently. When conveying LCD substrate G from the 1st developer supply zone 24b to the 2nd developer supply zone 24c, the 2nd board | substrate carrying mechanism 14b and the 3rd board | substrate carrying mechanism 14c are a board | substrate conveyance speed. Is driven to be equal.

In the second developer supply zone 24c, a developer replenishment nozzle 51c having the same structure as the developing nozzle 51a is fixedly arranged with its longitudinal direction as the Y direction. In the developer replenishment nozzle 51c, a predetermined amount of developer is supplied onto the LCD substrate G carried by the third substrate transfer mechanism 14c, thereby replenishing the developer overflowing from the LCD substrate G.

The developer removal zone 24d includes a substrate tilt mechanism 60 (not shown in FIG. 5) for converting the LCD substrate G into an oblique posture, and a developer solution on the surface of the LCD substrate G. The first rinse nozzle 52 for discharging the rinse liquid (for example, pure water) for flushing in a band shape in the Y direction and the fourth substrate transport mechanism 14d driven by the fourth motor 15d. Is being installed. The first rinse nozzle may have a structure in which a plurality of rinse liquid discharge ports for discharging the rinse liquid in a conical shape are provided in a direction orthogonal to the substrate conveying direction by the substrate conveying mechanism. The developing reaction of the LCD substrate G is performed while being conveyed from the first developer supply zone 24b to the developer removal zone 24d.

11 is an explanatory diagram schematically showing the schematic structure of the substrate tilt mechanism 60 and the developer removal process in the developer removal zone 24d. In addition, illustration of the developer paddle is abbreviate | omitted in FIG. The substrate tilt mechanism 60 includes a frame 58c, a plurality of support pins 58b provided on the frame 58c, and a substrate support member that supports the lower end when the LCD substrate G is converted into an inclined posture. 58a and the 1st lifting mechanism 59a and the 2nd lifting mechanism 59b which raise and lower the frame 58c are provided. The frame 58c is free to rotate in the attachment portion of the first lift mechanism 59a.

12 is an explanatory diagram showing a control system of the first rinse nozzle 52. The rinse liquid discharge control mechanism 46 controls the start / stop of the rinse liquid discharge from the first rinse nozzle 52. The rinse nozzle moving mechanism 47 moves the first rinse nozzle 52 in accordance with the inclination of the LCD substrate G. As shown in FIG. The rinse processing control apparatus 48 controls these rinse liquid discharge control mechanisms 46, the rinse nozzle moving mechanism 47, the 1st lifting mechanism 59a, and the 2nd lifting mechanism 59b according to a recipe.

As shown in Fig. 11A, the substrate inclination mechanism 60 is formed by the roller 17 of the fourth substrate conveyance mechanism 14d while the LCD substrate G is conveyed to the developer removal zone 24d. It is placed at the bottom. When the driving of the fourth substrate carrying mechanism 14d is stopped and the LCD substrate G is stopped, as shown in Fig. 11B, the first lifting mechanism 59a and the second lifting mechanism 59b are simultaneously held. By driving, the frame 58c is lifted by the same height. At this time, the plurality of support pins 58b can be in constant contact with the rear surface of the LCD substrate G.

Next, as shown in Fig. 11 (c), by driving only the second lifting mechanism 59b, the frame 58c is rotated by a predetermined angle, for example, 15 degrees around the substrate supporting member 58a. In this way, the LCD substrate G is inclined by 15 degrees so that the developer on the LCD substrate G flows downward. In addition, since the lower end of the LCD substrate G is supported by the substrate supporting member 58a, the LCD substrate G does not slip off. In addition, the shape of the frame 58c and the arrangement of the support pins 58b are considered so that the warpage of the LCD substrate G in the inclined posture is reduced.

After most of the developer on the LCD substrate G flows downward, as shown in Fig. 11D, the second lifting mechanism 59b is set such that the inclination angle of the LCD substrate G is, for example, 5 degrees. While driving, while keeping the LCD substrate G at an inclined position of 5 degrees, the first rinse nozzle 52 is scanned along the surface of the LCD substrate G from the lower end to the upper end of the LCD substrate G. Pure water is discharged to the surface of the LCD substrate (G). As a result, the developer on the LCD substrate G is washed away, whereby the development reaction can be completely stopped.

For example, the first rinse nozzle 52 is capable of scanning at a speed of, for example, 500 mm / second so that the developer can be washed away in a short time. In practice, the line width uniformity of the developing pattern can be improved by setting the scan speed of the first rinse nozzle 52 to be between 100 mm / sec and 300 mm / sec, more preferably between 200 mm / sec and 300 mm / sec. .

In addition, when the direction in which the first rinse nozzle 52 is to be scanned is set from the upper end to the lower end of the LCD substrate G, the flow of the rinse liquid containing the developer is urgently lowered from the LCD substrate G. This causes liquid flow traces on the LCD substrate (G). However, as described above, the direction in which the first rinse nozzle 52 is to be scanned is set from the lower end to the upper end of the LCD substrate G, so that the rinse liquid containing the developer solution at the lower end side of the LCD substrate G is removed. Rapid flow is prevented, whereby the generation of liquid flow traces is suppressed.

In the rinse zone 24e, a second rinse nozzle 53 for discharging rinse liquid such as pure water toward the LCD substrate G and a fifth substrate transfer mechanism 14e for conveying the LCD substrate G are provided. It is installed. The fifth substrate transfer mechanism 14e is driven by the fifth motor 15e to enable substrate transfer in the drying zone 24f.

The second rinse nozzle 53 has a shape longer than the width of the LCD substrate G, and is capable of discharging the rinse liquid over the entire width direction of the LCD substrate G. In the rinse zone 24e, while rinsing the LCD substrate G at a predetermined speed, the rinse liquid is discharged to the front and rear surfaces of the LCD substrate G to remove the developer residue attached to the LCD substrate G and the substrate. Clean.

An air nozzle (air knife) 54 for injecting dry gas such as nitrogen gas at a predetermined wind pressure is provided in the drying zone 24f through which the LCD substrate G passed through the rinse zone 24e is conveyed. In the drying zone 24f, dry gas is sprayed on the front and rear surfaces of the LCD substrate G while the LCD substrate G is conveyed at a predetermined speed, and the rinse liquid attached to the LCD substrate G is blown to blow the LCD substrate. (G) is dried. In addition, the air nozzle 54 has a shape longer than the width of the LCD substrate G, and the dry gas can be discharged to the entire width direction of the LCD substrate G. As shown in FIG. The LCD substrate G whose drying process is complete | finished is conveyed to i line | wire UV irradiation unit (i-UV) 25 by the 5th board | substrate carrying mechanism 14e.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, one developing nozzle may be arranged in the first developing solution supply zone 24b or may be three or more. When one developer nozzle is used, the flow rate of the developer to be discharged from the developer nozzle must be increased, so that the ejection force of the developer is increased so that the developer to be discharged onto the LCD substrate G overflows from the LCD substrate G. It is necessary to control the discharge state of the developing solution from the developing nozzle, for example, the discharge direction and the ejection force of the developing solution.

1: cassette station 2: processing station
3: interface station 14a: first substrate transport mechanism
14b: second substrate transfer mechanism 14c: third substrate transfer mechanism
14d: fourth substrate transport mechanism 14e: fifth substrate transport mechanism
24: developing unit 24a: substrate loading zone
24b: First developer supply zone 24c: Second developer supply zone
24d: developer removal zone 24e: rinse zone
24f: drying zone 46: rinse liquid discharge control mechanism
47: rinse nozzle moving mechanism 48: rinse processing control device
51a to 51b: developing nozzle 52: first rinse nozzle
55: developing nozzle moving mechanism 56: developing solution discharge control mechanism
57 paddle formation control device 60 substrate inclination mechanism
100: resist coating / development processing system G: LCD substrate

Claims (4)

  1. A substrate transport mechanism for supporting a substrate on which a developer paddle is formed in a horizontal position and transporting the substrate in a predetermined direction;
    A substrate inclination mechanism for holding the substrate in an oblique posture by supporting the rear side of the substrate conveying direction and lifting the front side of the substrate conveyed by the substrate conveying mechanism;
    A rinse nozzle for supplying a rinse liquid to a surface of the substrate supported by the substrate tilt mechanism;
    A rinse liquid discharge control mechanism for controlling the rinse liquid discharge from the rinse nozzle;
    A rinse nozzle moving mechanism for moving the rinse nozzle according to the inclination of the substrate;
    Rinse liquid from the rinse nozzle to the surface of the substrate while moving the rinse nozzle along the surface of the substrate from the lower end to the upper end of the substrate while the substrate is held in an oblique position by the substrate tilt mechanism. And a rinse processing control device for controlling the rinse nozzle moving mechanism and the rinse liquid discharge control mechanism so that the surface of the substrate is rinsed by discharging the light.
  2. The developing apparatus according to claim 1, wherein the rinse nozzle has a structure in which a plurality of rinse liquid discharge ports for discharging the rinse liquid in a conical shape are provided in a direction orthogonal to the substrate conveying direction by the substrate conveying mechanism. .
  3. A step of conveying the substrate on which the paddle of the developer is formed in a direction opposite to the scanning direction of the developer nozzle and stopping at a predetermined position by scanning the developer nozzle for discharging the developer to one side in a horizontal position;
    A step of flowing the developer on the substrate downward by supporting the rear side of the substrate in the substrate transport direction and lifting the front side;
    Maintaining the substrate in an oblique position at a predetermined angle with respect to a horizontal plane;
    The development reaction is stopped and rinsed by supplying a rinse liquid to the surface of the substrate along the surface of the substrate from the lower end to the upper end of the substrate while the substrate is held in an oblique position. Development process characterized by having a process.
  4. The rinse solution of claim 3, wherein the substrate on which the developer paddle is formed is inclined 15 degrees with respect to a horizontal plane so that the developer on the substrate flows downward, and then the inclination angle of the substrate is maintained at 5 degrees. Developing method characterized in that for supplying.
KR1020110003962A 2004-04-16 2011-01-14 Developing apparatus and developing method KR101052949B1 (en)

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JP4924187B2 (en) * 2007-04-27 2012-04-25 東京エレクトロン株式会社 Developing device, developing method and coating, developing device, and storage medium
JP5006122B2 (en) 2007-06-29 2012-08-22 株式会社Sokudo Substrate processing equipment
JP5449662B2 (en) 2007-10-18 2014-03-19 株式会社Sokudo Development device
JP5128918B2 (en) 2007-11-30 2013-01-23 株式会社Sokudo Substrate processing equipment
KR100935474B1 (en) * 2008-02-27 2010-01-06 주식회사 케이씨텍 Processing apparatus for substrate
KR100935473B1 (en) * 2008-02-27 2010-01-06 주식회사 케이씨텍 Processing apparatus for substrate
JP5188926B2 (en) * 2008-10-16 2013-04-24 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN102969259B (en) * 2011-08-31 2016-05-18 细美事有限公司 The device for the treatment of substrate
KR101308136B1 (en) * 2011-08-31 2013-09-12 세메스 주식회사 Apparatus for treating substrate
CN104347352B (en) * 2013-07-31 2018-05-29 细美事有限公司 A kind of substrate board treatment and substrate processing method using same
JP6390732B2 (en) * 2013-08-05 2018-09-19 東京エレクトロン株式会社 Treatment liquid supply device
JP6221954B2 (en) 2013-08-05 2017-11-01 東京エレクトロン株式会社 Development method, development device, and storage medium
JP5668120B2 (en) * 2013-10-01 2015-02-12 株式会社Screenセミコンダクターソリューションズ Development device
JP6475487B2 (en) * 2014-12-15 2019-02-27 株式会社Screenセミコンダクターソリューションズ Development method

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