TW200627519A - Substrate processing system - Google Patents

Substrate processing system

Info

Publication number
TW200627519A
TW200627519A TW094131361A TW94131361A TW200627519A TW 200627519 A TW200627519 A TW 200627519A TW 094131361 A TW094131361 A TW 094131361A TW 94131361 A TW94131361 A TW 94131361A TW 200627519 A TW200627519 A TW 200627519A
Authority
TW
Taiwan
Prior art keywords
stage
substrate
processing system
film formation
application
Prior art date
Application number
TW094131361A
Other languages
Chinese (zh)
Other versions
TWI281704B (en
Inventor
Takeo Kaeriyama
Mitsuhiro Sakai
Hironobu Kajiwara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200627519A publication Critical patent/TW200627519A/en
Application granted granted Critical
Publication of TWI281704B publication Critical patent/TWI281704B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Abstract

In the substrate processing system 100 which carries out application formation of the film of processing liquid, is interlocked with exposure equipment, and forms a predetermined pattern in the surface of a processed substrate. The substrate processing system 100 has the first stage 50 and the second stage 59 in which the processed substrate is laid, respectively, an application film formation means to have the processing liquid application means which applies processing liquid to the surface of the processed substrate laid in the first stage 50 and the second stage 59, respectively, and carries out film formation, and a substrate conveyance means 42a and 42b to convey the processed substrate in which film formation was carried out by the application film formation means, to two or more exposure equipments 4a and 4b.
TW094131361A 2004-09-30 2005-09-12 Substrate processing system TWI281704B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004287596A JP2006100722A (en) 2004-09-30 2004-09-30 Substrate processing system therefor

Publications (2)

Publication Number Publication Date
TW200627519A true TW200627519A (en) 2006-08-01
TWI281704B TWI281704B (en) 2007-05-21

Family

ID=36240209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131361A TWI281704B (en) 2004-09-30 2005-09-12 Substrate processing system

Country Status (4)

Country Link
JP (1) JP2006100722A (en)
KR (1) KR20060051463A (en)
CN (1) CN1755526A (en)
TW (1) TWI281704B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100803147B1 (en) * 2007-04-04 2008-02-14 세메스 주식회사 Slit coater and method of coating a process solution on a substrate using the same
JP2009065000A (en) * 2007-09-07 2009-03-26 Tokyo Electron Ltd Treating method for substrate, program, computer storage medium, and substrate treating system
CN102046840B (en) * 2008-03-25 2012-08-01 奥宝科技Lt太阳能有限公司 Processing apparatus and processing method
JP4900397B2 (en) * 2009-01-29 2012-03-21 東京エレクトロン株式会社 Liquid processing equipment
WO2011080933A1 (en) * 2009-12-28 2011-07-07 タツモ株式会社 Coating device for substrate and substrate-coating method
JP5417186B2 (en) * 2010-01-08 2014-02-12 大日本スクリーン製造株式会社 Substrate processing equipment
JP2011156482A (en) * 2010-02-01 2011-08-18 Sharp Corp Liquid coating device
CN103199031B (en) * 2012-01-04 2015-10-14 沈阳芯源微电子设备有限公司 Full-automatic glue film coating, developing apparatus
CN104597716A (en) * 2013-10-31 2015-05-06 上海和辉光电有限公司 Exposure and development apparatus, and exposure and development method
CN117184835A (en) * 2022-05-31 2023-12-08 上海德沪涂膜设备有限公司 Coating apparatus

Also Published As

Publication number Publication date
TWI281704B (en) 2007-05-21
KR20060051463A (en) 2006-05-19
JP2006100722A (en) 2006-04-13
CN1755526A (en) 2006-04-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees