JP5417186B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a technique for forming a plurality of thin film layers in a substrate processing apparatus having a slit nozzle.

  Conventionally, there has been proposed a substrate processing apparatus that discharges a processing liquid from a slit nozzle and forms a thin film on the surface of the substrate. For example, Patent Document 1 describes a substrate processing apparatus that discharges a processing liquid from a slit nozzle to a substrate.

JP 2007-287914 A

  In general, when a thin film is formed on a substrate using a slit nozzle, the thin film is formed by drying under reduced pressure and heat treatment (heating and cooling) on the substrate coated with the treatment liquid. Therefore, when forming a plurality of thin film layers, the cycle of coating → drying → heat treatment is repeated a predetermined number of times, and the length of the apparatus is inevitably long (see FIG. 11).

  Further, in the apparatus configuration as described above, even when only a predetermined process is selected from a plurality of processes arranged in order, it is not possible to reach a post-processing process without passing through an unnecessary processing process section. The problem occurs. As a result, the total number of processed substrates may be reduced.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to propose a substrate processing apparatus that shortens the overall length of the substrate processing apparatus that forms a plurality of thin film layers and suppresses a decrease in the number of processed sheets. And

In order to solve the above-mentioned problems, a first aspect of the present invention is a substrate processing apparatus for applying a predetermined processing liquid to a substrate to form a coating film, wherein the first and second slit nozzles and the substrate are horizontally disposed. An application mechanism for applying a processing liquid onto the upper surface of the substrate by scanning and moving the slit nozzle with respect to the substrate placed on the placement means, and the application A first drying mechanism that performs at least a first drying step among the steps of performing a drying process on the substrate coated by the mechanism, and the first drying of the substrate coated by the coating mechanism. A first transport mechanism that is carried into the mechanism and a substrate that has been transported to the first drying mechanism by the first transport mechanism are transported from a surface different from the surface of the first drying mechanism that faces the first transport mechanism. A second transport mechanism; Serial is stacked with the first drying mechanism, by the first conveying mechanism and the second conveying mechanism, a waiting mechanism in which the substrate is loaded or unloaded, the coating mechanism, the first drying device, pre-Symbol first conveyor A control mechanism for controlling the mechanism and the second transport mechanism , wherein the coating mechanism and the first drying mechanism are arranged on a concentric circle with the first transport mechanism as a center, and the control mechanism is configured by the coating mechanism. after the substrate on which treatment liquid has been applied by said first slit nozzle was performed first drying step was carried into the first drying mechanism by the first transport mechanism by the first by the second conveying mechanism carried from 1 drying mechanism to the standby mechanism, said unloaded from standby mechanism again placed on the mounting means of the coating mechanism, it is applied by the first slit nozzle of the substrate by the first conveying mechanism The top surface of the layer by physical solution, characterized by applying the processing liquid by the substantially same area as the layer a second slit nozzle.

Further, the invention according to claim 2 is the substrate processing apparatus according to claim 1 , wherein the second drying step is at least a part of the step of performing the drying process on the substrate coated by the coating mechanism. A second drying mechanism that performs the second drying mechanism, and the second drying mechanism and the first drying mechanism are arranged on a concentric circle with the second transport mechanism as a center, and the control mechanism performs a second drying step. Then, the substrate transported from the second drying mechanism to the standby mechanism stacked with the first drying mechanism is unloaded from the standby mechanism by the first transport mechanism, and the coating is performed. It mounts again on the mounting means of a mechanism, It is characterized by the above-mentioned.

Further, the invention of claim 3 is the substrate processing apparatus according to claim 2 , wherein the first drying step includes a reduced-pressure drying step of drying the coating solution coated on the substrate by the coating mechanism under reduced pressure. The second drying step includes a heating step of applying heat to the substrate.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the processing liquid applied by the first slit nozzle and the second slit nozzle are applied. The treatment liquid is a treatment liquid having a different composition.

  According to the present invention, the treatment liquid layer applied by the second slit nozzle is formed on the upper surface of the treatment liquid layer applied by the first slit nozzle on the substrate while preventing an increase in the size of the apparatus. It is possible to form with a simple configuration. In addition, even when the processing liquid is applied only by the first slit nozzle, the substrate can be transported to the next step without passing through the mechanism for applying the processing liquid by the second slit nozzle. The number of processed substrates is improved.

In particular, according to the first aspect of the present invention, the substrate that has been subjected to the drying process by the first drying mechanism is transported to the standby mechanism by the second transport mechanism, so that the coating mechanism performs the following process while the drying process is performed. The substrate can be applied, and the processing performance of the substrate processing apparatus is improved.

In particular, according to the second aspect of the present invention, it is possible to quickly carry the substrate that has been dried by the first drying mechanism into the second drying mechanism by the second transport mechanism, and the processing performance of the substrate processing apparatus is improved. improves.

In particular, according to the third aspect of the present invention, the processing liquid applied by the coating mechanism can be roughly dried by the first drying process, and then reliably dried by the second drying process. Processing performance is improved.

In particular, according to the invention of claim 4 , it is possible to form thin films having various effects by forming layers having different compositions on the upper surface of the layer formed by the treatment liquid applied by the first slit nozzle. It becomes.

It is a figure which shows the outline of a substrate processing system. 1 is a perspective view showing a coating apparatus 1. FIG. FIG. 4 is a side view showing a transport unit 2. FIG. 4 is a plan view showing a transport unit 2. It is a side view which shows the drying part. 3 is a side view showing a relationship among a drying unit 4, a transport unit 2, a transport unit 3, and a heat treatment unit 5. FIG. It is a figure which shows operation | movement of the substrate processing apparatus 100 and a substrate processing system. FIG. 6 is a view after the layer A and the layer B are formed on the upper surface of the substrate 90. It is a figure which shows operation | movement of the substrate processing apparatus 100 and substrate processing system concerning 2nd Embodiment. It is a figure which shows the outline of substrate processing apparatus 100 'concerning other embodiment. It is a figure which shows the outline of the conventional substrate processing system.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram showing a substrate processing system including a substrate processing apparatus 100 according to the present invention.

  In FIG. 1, for the sake of illustration and explanation, the Z-axis direction is defined as the vertical direction and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. The directions described below are not limited. The same applies to the following figures.

  In the substrate processing system, a square glass substrate for manufacturing a screen panel of a liquid crystal display device is used as a substrate 90 to be processed.

  The substrate processing system includes a loading unit 81 into which a substrate 90 to be processed is loaded, a cleaning unit 82 that cleans and cleans the substrate 90, and a temperature adjustment unit 83 that adjusts the substrate 90 to a predetermined temperature. The substrate 90 adjusted to a predetermined temperature by the temperature control unit 83 is carried into the substrate processing apparatus 100. A process until these are loaded into the substrate processing apparatus 100 is referred to as a pretreatment process.

  In addition, the substrate processing system temporarily stores the substrate 90 on which a thin film is formed by the substrate processing apparatus 100 and transfers it to the exposure unit 85, and an exposure unit that exposes a circuit pattern or the like on the surface of the substrate 90. 85, a developing unit 86 for developing the exposed substrate 90, an inspection unit 87 for inspecting the substrate 90, and a carry-out unit 88 for carrying out the substrate 90 that has been processed in the substrate processing system. A process after the substrate processing apparatus 100 is referred to as a post-processing process.

  Note that these pre-processing and post-processing steps can be appropriately selected depending on a circuit or the like formed on the substrate 90, and are not limited to the above embodiments.

  The substrate processing apparatus 100 heats and cools a coating unit 1 that applies a processing liquid to the surface of a substrate 90, a drying unit 4 that dries the processing liquid applied in the coating unit 1, and a substrate on which the processing liquid is applied. Heat treatment units 5 and 6 are provided. The substrate processing apparatus 100 includes a transport unit 2 that transports the substrate 90 between the coating unit 1 and the drying unit 4, and a transport unit that transports the substrate 90 between the drying unit 4 and the heat treatment units 5 and 6. 3 is provided. As described above, the substrate processing apparatus 100 is a coating unit that forms a thin film on the surface of the substrate 90 in the substrate processing system. The substrate 90 is taken out from the temperature control unit 83, which is a preprocessing step, by the transport unit 2, and each process is performed. It is an apparatus for carrying out the substrate to the transfer section 84 by the transport unit 3 after performing.

  Next, each part of the substrate processing apparatus 1 will be described. FIG. 2 is a diagram illustrating the application unit 1.

  The application unit 1 includes a stage 15 that functions as a holding table for placing and holding the substrate to be processed 90 and also functions as a base for each attached mechanism. The stage 15 is made of a rectangular parallelepiped stone, and its upper surface and side surfaces are processed into flat surfaces.

  A holding surface 14 for the substrate 90 is provided on the upper surface of the stage 15. The holding surface 14 is formed horizontally, and a large number of vacuum suction ports (not shown) are distributed. The vacuum suction port holds the substrate 90 in a predetermined horizontal position by sucking the substrate 90 while processing the substrate 90 in the coating unit 1.

  The holding surface 14 of the stage 15 includes a plurality of lift pins LP, and the lift pins LP advance and retreat in the Z-axis direction to place the substrate 90 on the holding surface 14 or to a predetermined height position. It is possible to raise it.

  The traveling rail 13a is fixed on the (−Y) side of the upper surface of the stage 15, and the traveling rail 13b is fixed on the (+ Y) side. Both the traveling rails 13a and 13b are arranged so that the longitudinal direction thereof is along the X-axis direction, and have a function of guiding the movement of the bridge structures 11 and 12 described later.

  Above the stage 15, bridging structures 11 and 12 are provided that extend substantially horizontally from both sides of the stage 15.

  The bridging structure 11 is mainly composed of a nozzle support portion 110 using carbon fiber resin as an aggregate, and elevating mechanisms 112 and 113 that support both ends thereof. Similarly, the bridging structure 12 is mainly composed of a nozzle support portion 120 using carbon fiber resin as an aggregate, and lifting mechanisms 122 and 123 that support both ends thereof.

  Slit nozzles 111 and 121 are attached to the nozzle support portions 110 and 120, respectively. That is, the substrate processing apparatus 100 includes two slit nozzles 111 and 121 extending in the horizontal Y-axis direction.

  As schematically shown in FIG. 2, a discharge mechanism 16 including a storage mechanism 162, a pump 161, and a supply pipe 163 (shown by a broken line in FIG. 2) is connected to the slit nozzle 111. Similarly, a discharge mechanism 17 including a storage mechanism 172, a pump 171, and a supply pipe 173 (shown by a broken line in FIG. 2) is connected to the slit nozzle 121.

  The slit nozzles 111 and 121 are provided with slits (not shown) at the discharge tip portions, and when the coating liquid stored in the storage mechanisms 162 and 172 is supplied by the pumps 161 and 171, the slits are respectively provided. The coating liquid is discharged from the nozzle.

  In this embodiment, the storage mechanism 162 and the coating liquid stored in the storage mechanism 172 have different compositions, but they do not necessarily have different compositions, and may have the same composition.

  The elevating mechanisms 112 and 113 are arranged separately on both sides of the bridging structure 11 and are connected to the slit nozzle 111 by the nozzle support part 110. The elevating mechanisms 112 and 113 are used for moving the slit nozzle 111 up and down in translation and adjusting the posture of the slit nozzle 111 in the YZ plane. Similarly, the elevating mechanisms 122 and 123 of the bridging structure 12 are used for moving the slit nozzle 121 in a translational manner and adjusting the posture of the slit nozzle 121 in the YZ plane.

  Each lifting mechanism 112, 113, 122, 123 is connected to a linear motor (not shown). Therefore, the bridging structures 11 and 12 can be driven in the direction (X direction) defined by the traveling rails 13a and 13b. Therefore, a coating film of the coating liquid is formed on the main surface of the substrate 90 by being driven in the X direction on the stage 15 by the linear motor while discharging the coating liquid from each slit.

  Further, on the (+ X) side and the (−X) side of the stage 15, a cleaning mechanism for cleaning slit nozzles 111 and 121, which will be described later, a standby pod, and the like are provided (not shown). Therefore, when the slit nozzle 111 does not apply the resist solution, the bridging structure 11 moves to the (−X) side shown in FIG. 2 and stands by. Similarly, when the slit nozzle 121 does not apply the coating solution, the bridging structure 12 moves to the (+ X) side shown in FIG. 2 and stands by.

  Returning to FIG. 1, the transport unit 2 is a unit that transports the substrate 90 in the substrate processing apparatus 100. Similarly, the transport unit 3 is a unit for transporting the substrate 90.

FIG. 3 is a side view showing the transport unit 2. FIG. 4 is a plan view showing the transport unit 2. Since the transport unit 2 and the transport unit 3 are the same multi-indirect robot, each unit will be described using the transport unit 2 as a representative.

The transport unit 2 includes a base 21 for fixing each component of the transport unit 2, an arm unit 22, an elevating mechanism 23, and a rotating mechanism 29.

  The arm unit 22 includes a robot hand 221, a first arm 223, and a second arm 224. Further, the robot hand 221 includes four chucks 222.

  A plurality of support pins (not shown) are erected on the chuck 222. The robot hand 221 supports the substrate 90 from below by the tips of a plurality of support pins provided on the chuck 222 coming into contact with the back surface of the substrate 90.

  The first arm 223 and the second arm 224 are connected to the robot hand 221. With such a structure, the arm portion 22 can be expanded and contracted, and the robot hand 221 can advance and retreat in a horizontal plane. Note that although the transport unit 2 in the present embodiment has been described as moving forward and backward in the direction along the X-axis direction in the drawing, the forward and backward direction of the robot hand 221 can be changed by the rotation mechanism 29 described later. Is possible. In the state shown in FIG. 3 and FIG. 4, the state of advance in the (+ X) direction is indicated by a solid line, and the state of exit in the (−X) direction is indicated by a virtual line.

  The elevating mechanism 23 includes a support member 231 and a support member 232. The support member 231 to which the arm portion 22 is attached is configured to be movable up and down in the Z-axis direction along the column member 232 by a linear motion mechanism (not shown). That is, the elevating mechanism 23 has a function of elevating and lowering the arm portion 22 in the Z axis direction within a predetermined range.

  By providing the lifting mechanism 23 in this way, the transport unit 2 can move the substrate 90 supported by the robot hand 221 in the Z-axis direction.

The rotation mechanism 29 includes a rotation motor (not shown), and is a mechanism that integrally rotates the arm unit 22 and the lifting mechanism 23 around the axis O. In other words, the rotation mechanism 29 has a function of adjusting the advancing / retreating direction of the arm portion 22. For example, when the rotation mechanism 29 rotates 180 ° from the state shown in FIG. 3, the arm portion 23 turns around. That is, the vehicle enters the (−X) direction and exits in the (+ X) direction.
Further, when the rotation mechanism 29 rotates in the 90 ° direction, the advancing / retreating direction of the arm portion 22 becomes a direction perpendicular to the paper surface.

  FIG. 5 is a diagram showing the drying unit 4. The drying unit 4 is configured by stacking drying units 41 and 42 and a standby unit 43.

  The drying unit 41 includes a lid 411, a chamber 412, and a suction mechanism 413. The drying unit 41 is configured as a unit that performs a drying process on the substrate 90 that has been processed in the coating unit 1.

  The lid portion 411 is a plate-like member disposed so as to be parallel to the XY plane, and is supported by a frame (not shown). Moreover, the cover part 411 can be moved up and down in the Z-axis direction as shown by an arrow in FIG. 5, and is moved up and down between an upper position (position shown in FIG. 5) and a lower position. In addition, the cover part 411 receives the chamber 412 in the lower position.

  The chamber 412 is a member that mainly forms a processing chamber in the drying unit 41.

A recess is formed in the lower surface of the lid portion 411 and the upper surface of the chamber 412, and a sealed processing space 414 is formed by the lid portion 411 and the chamber 412 coming into contact with each other. Note that the processing space 414 is formed as a space that can sufficiently accommodate the substrate 90 in a horizontal posture.

  The suction mechanism 413 is mainly configured by a pipe that communicates an air conditioner outside the apparatus with the processing space 414. With such a structure, the drying unit 41 can perform a reduced-pressure drying process.

  Although not shown in detail, the drying unit 41 includes a plurality of lift pins (not shown) that penetrate the chamber 412 from below. Then, when the tips of the plurality of lift pins abut against the back surface of the substrate 90, the drying unit 41 supports the substrate 90 carried in from below. Further, since the plurality of lift pins can be moved up and down while supporting the substrate 90, the drying unit 41 can adjust the height position of the loaded substrate 90 in the Z-axis direction.

  The drying unit 42 has the same configuration as the above-described drying unit 41 and is a unit that similarly performs a reduced-pressure drying process, and thus detailed description thereof is omitted. In the embodiment, the drying unit 41 and the drying unit 42 are different in parameters such as pressure and time for performing the reduced-pressure drying process.

  The standby unit 43 includes a lower frame 431 and a pin 432, and the lower frame 431 is configured to be parallel to the XY plane. The pins 432 are members for placing the substrate 90 at a predetermined distance from the lower frame 431. The pins 432 are disposed on the lower frame 431 so as to support the end and center of the substrate 90. With this configuration, it is possible to support the loaded substrate 90 from the lower surface.

  In this embodiment, the standby unit 43 is stacked below the drying unit 41 and the drying unit 42. However, the present invention is not limited to this. Specifically, the standby unit 43 includes the drying unit 41 and the drying unit 41. It may be laminated on the upper part of the drying unit 42.

  FIG. 6 is a side view showing the relationship between the drying unit 4, the transport unit 2, the transport unit 3, and the heat treatment unit 5.

  The frame (indicated by phantom lines in FIGS. 5 and 6) of the drying unit 4 includes an opening wider than the width of the substrate 90 on the (−X) side and the (+ X) side. Therefore, the transport unit 2 and the transport unit 3 can carry the substrate 90 into any of the drying unit 41, the drying unit 42, and the standby unit 43. Similarly, the substrate 90 supported by any of the drying unit 41, the drying unit 42, and the standby unit 43 can be carried out by either the transport unit 2 or the transport unit 3.

  Note that the pins 432 arranged in the standby unit 43 are arranged at positions that do not interfere with the chuck 222 of the robot hand 221 in plan view. With this configuration, the substrate 90 can be transferred between the standby unit 43 and the transport unit 2 or the transport unit 3.

  The heat treatment units 5 and 6 are processing units that perform heat treatment and cooling treatment on the substrate 90 that has been dried under reduced pressure by the drying unit 4. Specifically, the substrate 90 is placed, a heating unit 51 (hereinafter referred to as HP) that applies heat to the substrate 90, and the substrate 90 is placed and cooled by the aforementioned HP. A cooling unit 52 (hereinafter referred to as CP) and a buffer 53 (hereinafter referred to as BF) are configured.

  In FIG. 6, only the heat treatment unit 5 is shown, but the heat treatment unit 6 has the same configuration, and thus the description thereof is omitted.

  The heat treatment units 5 and 6 are appropriately laminated so that the above-described HP, CP, and BF correspond to each treatment, and the transport unit 3 is arranged to be laminated on the heat treatment units 5 and 6. The substrate 90 is carried into and out of the HP, CP, and BF.

  Note that the coating unit 1, the transport unit 2, the transport unit 3, the drying unit 4, the heat treatment unit 5, and the heat treatment unit 6 are controlled in conjunction with a control unit (not shown). The control unit may be included in the substrate processing apparatus 100 alone, or may be a part of the control unit of the substrate processing system. The control unit may be a general computer, or may be controlled by a base combined with an electronic circuit.

  Next, operations of the substrate processing apparatus 100 and the substrate processing system will be described with reference to FIG.

  In the substrate processing system, the substrate 90 carried in from the carry-in unit 81 is subjected to a cleaning process by the cleaning unit 82, dried by the temperature adjustment unit 83, and adjusted to a predetermined temperature (step S11: pre-processing completed). .

  Then, the substrate processing apparatus 100 drives the transport unit 2 to take out the substrate 90 from the temperature control unit 83 and carry it into the coating unit 1. And the coating liquid A is apply | coated to the board | substrate 90 by the application part 1 (step S12: application | coating process A). Specifically, the control unit drives the bridging structure 11 of the coating unit 1 to scan and move above the substrate 90, and drives the pump 161 to drive the coating liquid A stored in the storage mechanism 162 to the substrate 90. Apply.

  When the coating process A is completed, the transport unit 2 transports the coated substrate 90 to the drying unit 4 (step S13: reduced pressure drying A). Here, a predetermined reduced-pressure drying process is performed using the drying unit 41 of the drying unit 4. By the reduced-pressure drying process A, the coating liquid A applied on the substrate 90 is dried to such an extent that most of the solvent evaporates, so that the fluidity is lost.

  When the vacuum drying A is completed, the transport unit 3 transports the substrate 90 to the heat treatment unit 5 (step S14: heat treatment A). Specifically, the substrate 90 is transported to the HP stacked in the heat treatment unit 5 and subjected to heat treatment at a predetermined temperature and time, whereby the coating liquid A on the substrate 90 is further dried. The substrate 90 after the heat treatment is transported to the CP by the transport unit 3. In CP, the heat accumulated on the substrate 90 by the heat treatment is released, and the temperature is returned to room temperature so that the subsequent processing can be performed. The substrate returned to the normal temperature is carried to the buffer 53 and waits. The heat treatment here is appropriately combined depending on the composition of the coating liquid A and the desired film thickness.

  Next, the control unit determines whether continuous processing is performed on the substrate 90 (step S15). Here, the continuous treatment is a treatment for forming a new layer B on the upper surface of the layer (herein referred to as layer A) formed by the heat treatment A from the coating treatment A described above.

  FIG. 8 is a diagram in which layers A and B are formed on the upper surface of the substrate 90 by continuous processing. By laminating layers having a plurality of compositions in this way, it is possible to form layers having various characteristics. Further, by using the same material (coating liquid) for forming the layer A and the layer B, it is possible to form a film that is thicker than the film thickness that can be formed by a single coating process. Further, in this description, a process for forming two layers will be described, but it is possible to form more layers than two layers.

  In step S15 in FIG. 7, the presence or absence of continuous processing is determined, and the substrate 90 determined to be present (Yes in step S15) is taken out of the buffer 53 by the transport unit 3 and stored in the standby unit 43 of the drying unit 4. Carry in (Step S21: Transport to standby unit). Then, the substrate 90 carried into the standby unit 43 is carried out by the carrying unit 2 and carried into the coating unit 1 again. By providing the standby unit 43 in this way, the substrate 90 can be transferred from the transport unit 3 to the transport unit 2 without using the drying units 41 and 42 of the drying unit 4.

  The coating unit 1 applies the coating liquid B to the substrate 90 with the layer A formed on the upper surface (step S22: coating process B). Specifically, the control unit bridges the coating unit 1. The coating liquid B stored in the storage mechanism 172 is applied to the substrate 90 by driving the pump 171 while driving the structure 12 to scan and move above the substrate 90.

  When the coating process B is completed, the transport unit 2 transports the coated substrate 90 to the drying unit 4 (step S23: reduced pressure drying B). Here, using the drying unit 42 of the drying unit 4, the reduced pressure drying process B is performed with parameters different from the reduced pressure drying A. By the reduced-pressure drying process B, the coating liquid B applied onto the substrate 90 is dried to such an extent that most of the solvent evaporates and the fluidity is lost.

  When the decompression drying B is completed, the transport unit 3 transports the substrate 90 to the heat treatment unit 6 (step S24: heat treatment B). Specifically, the substrate 90 is transferred to the HP of the heat treatment unit 6 and subjected to heat treatment at a predetermined temperature and time, whereby the coating liquid B on the substrate 90 is further dried. The substrate 90 after the heat treatment is transported to the CP of the heat treatment unit 6 by the transport unit 3 in the same manner. In CP, the heat accumulated on the substrate 90 by the heat treatment is released, and the temperature is returned to room temperature so that the subsequent processing can be performed. The substrate returned to the normal temperature is carried to the BF of the heat treatment unit 6 and stands by.

  Through the above-described steps, the layer A and the layer B are formed on the substrate 90 and are in a standby state in the buffer 53. Thereafter, in response to an instruction from the exposure unit 85, the transport unit 3 carries the substrate 90 into the transfer unit 84 (step S16: to the exposure process).

  Further, in step S15 of FIG. 7, the presence or absence of continuous processing is determined, and the substrate 90 determined to be absent (No in step S15) waits in the buffer 53 as it is. Then, in response to an instruction from the exposure unit 85, the transfer unit 3 loads the transfer unit 84 into the transfer unit 84 (step S16: to the exposure process).

  As described above, in the substrate processing apparatus 100 of the present embodiment, by providing the standby unit 43, the substrate once transported to the downstream heat treatment process can be returned to the coating process. Therefore, it is easy to perform film formation with the coating solution a plurality of times. By continuously forming the layer B after forming the layer A in this manner, it is possible to reduce the possibility that impurities or the like are mixed between the layer A and the layer B. In addition, by appropriately selecting the type of coating liquid and the number of coatings, various types of coating films can be formed without changing the layout of the entire apparatus.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  For example, FIG. 9 is a diagram for explaining the operation of the substrate processing system according to the second embodiment of the present invention. In the second embodiment, a case where a highly dry coating liquid is used as the coating liquid is shown.

  The substrate processing system according to the second embodiment performs a pre-processing operation on the substrate 90 carried in from the carry-in unit 81, similarly to the substrate processing system according to the above-described embodiment (step S111: before Processing complete).

  Thereafter, the coating unit 1 applies the coating liquid A ′ to the substrate 90 (step S112: coating process A ′). In this case, the coating liquid A ′ uses a solvent having a higher drying property (= lower boiling point) than the coating liquid A described above.

  When the coating process A ′ is completed, a reduced pressure drying process is performed (step S113: reduced pressure drying A ′). Since the coating liquid A ′ has high drying properties, the coating liquid A ′ is almost dried only by performing the reduced pressure drying A ′. Here, a predetermined reduced-pressure drying process is performed using the drying unit 41 of the drying unit 4. By the reduced-pressure drying process A ′, the coating liquid A ′ applied on the substrate 90 is substantially dried as the solvent evaporates.

  When continuous processing is selected for the substrate 90 on which the layer of the coating liquid A ′ is formed (Yes in step S115), the transport unit 2 unloads the substrate 90 from the drying unit 41, and again enters the coating unit 1. Carry in (step S121).

  Thereafter, the coating liquid B ′ is applied to the substrate 90 that has been carried into the coating unit 1 and in which the layer of the coating liquid A ′ is formed on the upper surface (step S122: coating process B ′).

  When the coating process B ′ is completed, the transport unit 2 transports the coated substrate 90 to the drying unit 4 (step S123: reduced pressure drying B ′).

When the vacuum drying B ′ is completed, the transport unit 3 transports the substrate 90 to the heat treatment unit 5 (step S114: heat treatment). Here, it is possible to avoid a subsequent heat treatment step by using a coating solution having a high drying property similar to the coating solution A ′ as the coating solution B ′. In such a case, the heat treatment (step S114) is not performed, and the transport unit 3 delivers the substrate 90 to the downstream exposure process.
As described above, the heat treatment step may be appropriately omitted depending on the drying property of the coating solution.

  In the second embodiment, the substrate is transported to the coating unit 1 by the transport unit 2 in step S <b> 121, but the substrate 90 may be unloaded by the transport unit 3 and loaded into the standby unit 43. By using the transport unit 3, the transport unit 2 can perform transport operations of other substrates.

  Specifically, while the substrate 90 is being dried under reduced pressure by the drying unit 41, the coating unit 1 performs the coating operation of another substrate. The transport unit 3 transports the substrate 90 from the drying unit 41 to the standby unit 43, and the transport unit 2 transports another substrate to the drying unit 41, thereby improving the processing number of the coating apparatus 100. Can do.

  In the above-described embodiment, the drying unit 4 includes the drying unit 41 and the drying unit 42, but either one may be used. In addition, when a reduced-pressure drying process is not necessary depending on the composition of the coating solution, the drying process is performed by a unit that simply mounts a substrate, such as a standby unit, instead of the drying unit 41 and the drying unit 42. May be.

  The heat treatment unit 5 and the heat treatment unit 6 include a plurality of heating units 51, cooling units 52, and buffers 53. The arrangement and number of these units are appropriately determined as design matters. Moreover, although the substrate processing apparatus 100 was demonstrated using the structure provided with the heat processing part 5 and the heat processing part 6, any one may be sufficient as a heat processing part, and these are also matters suitably selected as a design matter. Further, when the heat treatment and the cooling treatment are not necessary depending on the composition of the coating liquid, the heating unit 51, the cooling unit 52, and the buffer 53 may be omitted.

Moreover, although the conveyance unit 2 and the conveyance unit 3 were arrange | positioned with respect to the drying part 4 in the direction (180 degree direction) which opposes, it is not limited to this. For example, as with a coating apparatus 100 ′ illustrated in FIG.

DESCRIPTION OF SYMBOLS 1 ... Coating device 2, 3 ... Conveyance unit 4 ... Drying part 5, 6 ... Heat processing part 14 ... Holding surface 41, 42 ... Drying unit 43 ... Standby unit 51- ... Heating unit 52 ... Cooling unit 53 ... Buffer 90 ... Substrate 111, 121 ... Slit nozzle

Claims (4)

In a substrate processing apparatus for applying a predetermined processing liquid to a substrate and forming a coating film,
The first and second slit nozzles, and a placing unit for placing the substrate horizontally, and scanning the substrate with respect to the substrate placed on the placing unit, thereby moving the substrate. An application mechanism for applying the treatment liquid to the upper surface of
A first drying mechanism that performs a first drying step that is at least a part of the step of performing a drying process on the substrate coated by the coating mechanism;
A first transport mechanism for transporting the substrate coated by the coating mechanism to the first drying mechanism;
A second transport mechanism for unloading the substrate transported to the first drying mechanism by the first transport mechanism from a surface different from the surface of the first drying mechanism facing the first transport mechanism;
A standby mechanism that is stacked with the first drying mechanism, and the substrate is carried in or out by the first transport mechanism and the second transport mechanism;
The application mechanism, and a control mechanism for controlling the first drying device, pre-Symbol first conveying mechanism and the second transport mechanism,
The coating mechanism and the first drying mechanism are arranged on a concentric circle with the first transport mechanism as a center,
The control mechanism, after the substrate which the treatment liquid has been applied by the first slit nozzle was performed first drying step was carried into the first drying mechanism by the first transport mechanism by the coating mechanism, The second transport mechanism carries in the standby mechanism from the first drying mechanism, the first transport mechanism unloads from the standby mechanism, and is placed again on the placing means of the coating mechanism, and the substrate A substrate processing apparatus, wherein a processing liquid is applied to an upper surface of a layer made of a processing liquid applied by one slit nozzle by the second slit nozzle in substantially the same area as the layer. The substrate processing apparatus according to claim 1 ,
A second drying mechanism for performing a second drying step that is at least a part of the step of performing a drying process on the substrate coated by the coating mechanism;
The second drying mechanism and the first drying mechanism are arranged on a concentric circle centering on the second transport mechanism ,
The control mechanism performs a second drying process, and then transfers the first transported substrate from the second drying mechanism to the standby mechanism stacked with the first drying mechanism by the second transport mechanism. A substrate processing apparatus , wherein the substrate is unloaded from the standby mechanism by the mechanism and placed again on the placing means of the coating mechanism . The substrate processing apparatus according to claim 2 ,
The first drying step includes a reduced-pressure drying step of drying the coating solution coated on the substrate by the coating mechanism under reduced pressure,
The substrate processing apparatus, wherein the second drying step includes a heating step of applying heat to the substrate. In the substrate processing apparatus in any one of Claims 1-3 ,
The substrate processing apparatus, wherein the processing liquid applied by the first slit nozzle and the processing liquid applied by the second slit nozzle are processing liquids having different compositions.

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