TW201111061A - Coating device and coating method - Google Patents

Coating device and coating method Download PDF

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Publication number
TW201111061A
TW201111061A TW099118145A TW99118145A TW201111061A TW 201111061 A TW201111061 A TW 201111061A TW 099118145 A TW099118145 A TW 099118145A TW 99118145 A TW99118145 A TW 99118145A TW 201111061 A TW201111061 A TW 201111061A
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Taiwan
Prior art keywords
substrate
machine
substrate mounting
weight
smear
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TW099118145A
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Chinese (zh)
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TWI460020B (en
Inventor
Tadao Kosuge
Shinji Maehara
Yukihiro Kawasumi
Isamu Maruyama
Shigeru Ishida
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Hitachi Plant Technologies Ltd
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Publication of TWI460020B publication Critical patent/TWI460020B/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Coating Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The subject of this invention is to reduce whirled-up dust while shortening the production time. The solution of this invention is as follows. Gantries (2a-2c) respectively having different coating functions and a workpiece table (6) on which a glass substrate (17) is placed are provided on a base stand (1) movably in an X(T) axis direction. When the workpiece table (6) is located at A position, a first coating operation is performed on the glass substrate (17) by the coating head (8) of the gantry (2a); when the workpiece table (6) is located at B position, a second coating operation is performed on the glass substrate (17) by the coating head (8) of the gantry (2b); and when the workpiece table (6) is located at C position, a third coating operation is performed on the glass substrate (17) by the coating head (8) of the gantry (2c). At the substrate feed-in side (a), the glass substrate (17) subjected to coating treatment is transported from a feed-in side transport conveyor (18a) while keeping the height the same as that on the workpiece table (6); and at the substrate feed-out side (b), the treated glass substrate (17) is transported from the workpiece table (6) while keeping the height the same as that on a feed-out side transport conveyor (18b).

Description

201111061 六、發明說明： 【發明所屬之技術領域】 本發明係關於液晶面板等之平面顯示面板的製造，尤 其關於對基板上進行密封材等的塗抹或液晶的滴入塗抹之 ' 塗抹裝置及塗抹方法。 【先前技術】 製造出液晶面板等之以往技術，其一例有下列所提案 之裝置，亦即，具備有用以在真空狀態下進行處理之複數 個真空處理室與在大氣壓狀態下進行處理之複數個大氣壓 處理室，並於此等真空處理室間與大氣壓處理室間以及真 空處理室與大氣壓處理室之間，分別設置有用以搬運玻璃 基板之與外部阻隔之機器人室，當在該處理室間搬運玻璃 基板時，機器人室的機器人可將該玻璃基板從一方的處理 室自動地搬運至另一方的處理室，來製造出液晶面板之裝 置（例如參照專利文獻1 )。 根據該以往技術，從玻璃基板至成爲液晶面板爲止之 處理完全不經由人手而自動地處理，所以幾乎無粒子污染 或分子污染之疑慮" 此外，其他例亦有下列所提案之技術，亦即在依循將 基板設置在真空處理室內所設置之對位裝置，塗抹密封材 於基板上，然後將此般經塗抹密封材的基板與其他基板之 2片基板貼合並使密封材硬化，最後再注入液晶之步驟下 製造出面板時，係在較大氣壓更低之壓力下進行將密封材 -5- 201111061 形成於基板上之塗抹作業，並且在大氣壓以下之壓力下進 行將2片基板貼合之作業（例如參照專利文獻2 )。 根據該以往技術，由於在較大氣壓更低之壓力下進行 密封材的塗抹及2片基板的貼合，故可減少混入於密封材 內之氣泡，降低導因於該氣泡之斷裂不良或間隙不良，或 是液晶注入不良之缺失，亦可減少在基板周邊所被捲起之 塵埃等雜質，降低雜質所造成之面板不良。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開平6-324297號公報 [專利文獻2]日本特開平2001 - 1 3507號公報 【發明內容】 (發明所欲解決之問題） 在LCD (液晶面板）等之平面顯示面板的領域中，玻 璃基板的尺寸大型化乃逐年急遽地發展，伴隨於此，該製 造裝置亦朝向大型化發展。此外，爲了能夠在低成本下製 造，係強烈地要求可減少在製造裝置的內部或周邊所被捲 起之塵埃以提升良率，同時可抑制每1片面板的製造時間 〇 上述專利文獻1所記載之以往技術中，從玻璃基板來 製造液晶面板時，當將玻璃基板從大氣壓處理室搬運至真 空處理室時，從大氣壓狀態至真空狀態之真空啓動時間乃 -6 - 201111061 成爲耗損時間，而有總體製造時間增大之問題。 此外，上述專利文獻2所記載之以往技術中，當在真 空處理室內進行塗抹作業或基板的貼合作業時，朝向真空 處理室內之置入與取出是藉由人手或機器人等來進行，由 於保持在此等人手或機器人之基板的上下移動，使周圍的 ^ 空氣大幅流動，使塵埃伴隨於此空氣而被捲起。此外，即 使不使用相同的真空處理室，而是排列具有不同功能之複 數台裝置來製造面板時，當進行作爲對象工件之玻璃基板 的收授時，同樣在使用機器人等時，由於保持在此機器人 之基板的移動，使周圍的空氣大幅流動，該周圍空氣的流 動會使塵埃伴隨於此而被捲起。當具有此般塵埃的捲起時 ，塵埃附著於面板上成爲不良品之機率提高。 再者，上述專利文獻2所記載之以往技術中，作爲第1 例，當在真空環境內進行塗抹作業時，係在真空中塗抹密 封材後先進行大氣開放，散佈間隔材，並將紫外線照射在 經點焊的紫外線硬化樹脂而一邊暫時固定一邊貼合2片基 板。然後從定位裝置中取出被暫時固定的基板，裝入另外 準備的尼龍袋並將袋內予以減壓，亦即再次形成真空，藉 此加壓2片基板。接著進行加熱，使先前經塗抹的密封材 硬化而將2片基板黏著。最後從袋中取出，亦即再次開放 至大氣壓狀態，在大氣壓中封入液晶材料而製造出液晶面 板。因此’從密封材塗抹至完成液晶面板爲止前，係採用 2次形成真空狀態以及2次開放至大氣壓狀態之製造步驟。 此外，作爲第2例，當在真空環境內進行貼合作業時 201111061 ，係在大氣壓中塗抹密封材後散佈間隔材，將紫外線照射 在經點焊的紫外線硬化樹脂而暫時固定，並且在真空中貼 合2片基板。然後開放至大氣壓狀態，從定位裝置中取出 基板，藉由真空包裝法，亦即再次形成真空狀態而加壓2 片基板。接著在此真空包裝狀態下進行加熱，使先前經塗 抹的密封材硬化而將2片基板黏著。最後從袋中取出，亦 即再次開放至大氣壓狀態，在大氣壓中封入液晶材料而製 造出液晶面板。此例中，與上述相同，從密封材的塗抹至 完成液晶面板爲止前，係採用2次形成真空狀態以及2次開 放至大氣壓狀態之製造步驟。 其結果爲，不論於第1例或第2例，均在以抑制氣泡混 入於密封材中者爲目的下，在真空中進行從密封材的塗抹 至貼合工序爲止之塗抹作業、或是貼合作業的任一者，但 實際上在液晶注入前以熱硬化樹脂一邊加壓一邊壓著之時 點下，必需花費時間於再次形成真空狀態並製作真空環境 者。 在此，當使熱硬化樹脂的密封材硬化並將2片基板壓 著時，亦有不需形成真空狀態來進行加壓之製造方法。然 而，一般的液晶注入方式，較多係採用在下一階段的液晶 注入階段中，爲了使液晶面板內部成爲真空，在處理室內 使液晶面板先形成真空狀態，然後將液晶注入口浸入於液 晶後開放至大氣壓狀態，在大氣壓中將液晶擠壓至液晶面 板內部而塡入之製造方法。 本發明之目的在於提供一種可消除該問題，減少被捲 -8- 201111061 起的塵埃並同時縮短製造時間之塗抹裝置及塗抹方法。 (用以解決問題之技術手段） 爲了達成上述目的，本發明爲一種塗抹裝置，是在1 台或複數台的架台上設置有可使1個或複數個塗抹頭移動 地設置之移重機，塗抹頭係具備塡充有塗抹材之材料收納 筒與將來自塗抹材料收納筒的塗抹材料吐出之噴嘴吐出口 ’使移重機相對於裝載在架台上所設置之基板載置機台的 基板移動，並使塗抹頭相對於移重機移動，藉此使塗抹頭 相對於基板移動，而從噴嘴吐出口將塗抹材吐出於基板上 之塗抹裝置’從外部將基板朝向基板載置機台之送入，係 從送入側搬運輸送帶，以將送入高度維持在與基板載置機 台上的基板載置面爲相同高度之狀態來進行，並且從基板 載置機台將基板朝向外部之送出，係從基板載置機台至送 出側搬運輸送帶’以將送出高度維持在與基板載置機台上 的基板載置面爲相同高度之狀態來進行；並且具備：從載 置有由送入側搬運輸送帶所送入之該基板之位置開始，至 將該基板送出至送出側搬運輸送帶之位置爲止，以載置有 該基板之狀態使該基板載置機台移動之第〗移動機構，以 及使載置於該基板載置機台之該基板轉動之第2移動機構 〇 此外’本發明之塗抹裝置，係於架台上設置有複數台 的移重機’此等複數台的移重機中的任一台移重機上所設 置之塗抹頭’將與其他移重機上所設置之塗抹頭爲不同種 9 - 201111061 類的塗抹材吐出於基板上。 此外，本發明之塗抹裝置中，相同的移重機上所設置 之複數個塗抹頭中的任一個塗抹頭與其他塗抹頭，係將種 類不同的塗抹材吐出於基板上。 此外，本發明之塗抹裝置中，基板載置機台，具備有 :在基板載置機台上使基板在一方向上移動之依據滾子所 構成的基板移動手段；以及在基板載置機台上吸附基板， 而在基板載置機台上將基板的位置固定之基板位置固定手 段。 此外，本發明之塗抹裝置中，基板載置機台，具備有 :在基板載置機台上，藉由將空氣強吹於基板而使基板在 一方向上移動之基板移動手段；以及在基板載置機台上吸 附基板，而在基板載置機台上將基板的位置固定之基板位 置固定手段。 再者，本發明之塗抹裝置，係藉由耐壓蓋來覆蓋架台 上之基板載置機台的移動範圍，並藉由空氣吸引手段，將 以耐壓蓋所覆蓋之內部設定爲較大氣壓更低之氣壓，於低 氣壓的環境內，藉由移重機的塗抹頭對載置於基板載置機 台之基板進行塗抹動作。 爲了達成上述目的，本發明爲一種塗抹方法，是在1 台或複數台的架台上設置有可使1個或複數個塗抹頭移動 地設置之移重機’塗抹頭係具備塡充有塗抹材料之塗抹材 收納筒與將來自塗抹材收納筒的塗抹材料吐出之噴嘴吐出 口，使移重機相對於裝載在架台上所設置之基板載置機台 -10- 201111061 的基板移動，並使塗抹頭相對於移重機移動，藉此使塗抹 頭相對於基板移動，而從噴嘴吐出口將塗抹材吐出於基板 上之塗抹方法’從外部將基板朝向基板載置機台之送入， 係從送入側搬運輸送帶，以將送入高度維持在與基板載置 機台上的基板載置面爲相同高度之狀態來進行，並且從基 板載置機台將基板朝向外部之送出，係從基板載置機台至 送出側搬運輸送帶，以將送出高度維持在與基板載置機台 上的基板載置面爲相同高度之狀態來進行；基板載置機台 ，從載置有由送入側搬運輸送帶所送入之基板之位置開始 ，至將基板送出至送出側搬運輸送帶之位置爲止，係以載 置有基板之狀態移動；使載置於基板載置機台之基板轉動 ，來校正0軸偏移。 此外，本發明之塗抹方法，係於架台上設置有複數台 的移重機，複數台的移重機中的任一台移重機上所設置之 塗抹頭，係將與其他移重機上所設置之塗抹頭爲不同種類 的塗抹材吐出於基板上。 此外，本發明之塗抹方法中，相同的移重機上所設置 之複數個塗抹頭中的任一個塗抹頭與其他塗抹頭，係將種 類不同的塗抹材吐出於基板上。 此外，本發明之塗抹方法，係在基板載置機台上，藉 由依據滾子所構成的基板移動手段使基板在一方向上移動 ，來進行基板載置機台上之基板的定位，吸附被定位後的 基板，而在基板載置機台上將基板的位置固定。 此外，本發明之塗抹方法，係在基板載置機台上，藉 -11 - 201111061 由將空氣強吹於基板而使基板在一方向上移動，來進行基 板載置機台上之基板的定位，吸附被定位後的基板，而在 基板載置機台上將基板的位置固定。 再者，本發明之塗抹方法，係藉由耐壓蓋來覆蓋架台 上之基板載置機台的移動範圍，並將以耐壓蓋所覆蓋之內 部設定爲較大氣壓更低之氣壓，於低氣壓的環境內，藉由 移重機的塗抹頭對載置於基板載置機台之基板進行塗抹動 作。 發明之效果： 根據本發明，可在共通的工件機台（基板載置機台） 上進行3種材料的塗抹作業，例如密封材塗抹、導通用點 焊材塗抹及液晶滴入塗抹之塗抹作業，此外，該塗抹作業 前後的基板收授是由送入、送出輸送帶來進行，藉此可在 將塵埃的捲起抑制在最低之狀態下，如同將3種功能集中 在1個裝置內實現。 藉此，與以往排列具有複數種功能之複數台裝置，並 使用共通的1台機器人或設置在裝置間之複數台機器人來 進行基板的收授之機器人搬運方式相比，可縮短基板的動 線（移動線），而能夠達到：第一、減少基板搬運時的粒 子污染，提升液晶面板製造時的良率，第二、縮小設置面 積，有效活用無塵室者。 【實施方式】 -12- 201111061 玻璃基板係逐年往大型化發展，當審視至目前爲止對 應大型化之傾向時’可得知裝置內進行定位之手段亦逐漸 大型化，該重量亦只有增加之一途。伴隨於此，不僅是作 爲驅動源之馬達的大型化與滾珠螺桿、導向軸承等軸承或 動力傳遞機構的大型化’以及馬達驅動器的大容量化或配 線規模的增大之機械系列，亦更導致包含控制系列之基板 驅動部的大規模化之問題。 另一方面，第2個問題，在裝置內外之玻璃基板的進 出中，亦存在著將此玻璃基板送入.送出之手段有大型化 、重量化之傾向的其他問題。 當審視製造程序時，目前爲止的作法是將塗抹密封材 於玻璃基板之裝置、以點焊材來塗抹電極墊之裝置、及將 液晶予以滴入塗抹之裝置之3種功能的裝置排列設置，並 將此與玻璃基板的貼合裝置連結。在此等3種裝置間，使 搬運機器人來進行大型玻璃基板的送入·送出。該送入· 送出動作中，不僅在水平移動，並且在裝置間的移動中或 是將玻璃基板裝載於各裝置的機台時，亦有在保持玻璃基 板之狀態下重複進行上下移動之情況，藉此，使周圍的空 氣上下流動，並使塵埃伴隨於此而被捲起。 因此，本發明中，係改變以機器人進行收授之方式， 而構成一種具備1個或複數個移重機（門型框部）之1個塗 抹裝置或塗抹系統，該1個或複數個移重機係具有上述各 裝置的塗抹功能（以下在無特別言明下，亦含有液晶的滴 入塗抹功能），並將共通的工件機台設置在各個移重機， -13- 201111061 將玻璃基板裝載於此工件機台，然後將裝載有玻璃基板之 該工件機台設置在依據上述各功能所分配置位置上，藉此 使用該移重機來進行該塗抹動作，藉由使載置有該基板之 相同工件機台的移動，來進行不同功能之裝置間的基板的 移動，可排出基板之依據機器人之搬運或依據人手之搬運 〇 此外’本發明中，基板之朝向該工件機台的送入或基 板從該工件機台的送出，是藉由送入側搬運輸送帶或送出 側搬運輸送帶來進行，此等搬運輸送帶中，係維持在使裝 載於其上之玻璃基板的高度與載置於工件機台時之玻璃基 板的高度爲相等。 從上述中可得知，在各個移重機進行塗抹動作之間， 玻璃基板處於裝載在相同工件機台之狀態，相對於工件機 台並未移動，在對玻璃基板之塗抹動作中，塵埃不會被捲 起。此外，在玻璃基板朝向工件機台之送入與送出時，係 在不會改變高度下（亦即被舉起或降低），從搬運輸送帶 往工件機台以及從工件機台往搬運輸送帶被搬運，藉此， 塵埃不會被捲起。因此可提升所製造之面板的良率。 此外，係藉由蓋來覆蓋包含全部的移重機與工件機台 及此等的驅動機構等之空間全體，並將該空間內的壓力降 低爲較大氣壓更低，以減少該空間內的空氣量，藉此構成 爲更可降低塵埃的捲起力並降低被捲起的塵埃量之構造。 以下使用圖面來說明本發明之實施形態。 第1圖係顯示本發明之塗抹裝置及塗抹方法之第1實施 -14- 201111061 形態的要部之外觀立體圖，1爲架台，2a、2b、2c爲移重 機’ 3爲橫樑’ 4a、4b爲X軸方向移動機構，5a、5b爲線性 滑軌’ 6爲工件機台（基板載置機台），7爲線性滑軌，8 爲塗抹頭。 同圖中，以架台1的長度方向爲X軸方向，寬度方向爲 Y軸方向，於架台1上之與Y軸方向相對向的兩邊部，設置 有沿著X軸方向之線性滑軌5a、5b，此等線性滑軌5a、5b 間’係形成載置有玻璃基板（圖中未顯示）之工件機台6 的通路。於此通路上鋪設有在X軸方向上延伸設置之線性 滑軌7，此外，於工件機台6的內面側，設置有由線性馬達 所構成之工件機台移動機構（圖中未顯示），藉此，工件 機台6可沿著線性滑軌7，在從玻璃基板被送入之基板送入 側a至玻璃基板被送出之基板送出側b爲止之間，沿著架台 1的長度方向移動。 在此，工件機台6的移動方向爲X軸方向，但關於工件 機台6的移動方向，以下係設爲T軸方向。因此，工件機台 6所移動之線性滑軌7，亦設爲在T軸方向上延伸設置，用 以使工件機台6移動之上述工件機台移動機構，亦設爲T軸 方向移動機構。 此外，於架台1上，3台移重機2a〜2c係以橫跨工件機 台6的通路之方式所設置，於各個的兩端側，設置有由線 性馬達所構成之X軸方向移動機構（移重機移動機構）4a ' 4b。藉由該X軸方向移動機構4a、4b，可使此等移重機 2a〜2c分別獨立地沿著線性滑軌5a、5b在X軸方向上移動。 -15- 201111061 於各移重機2a〜2c的橫樑3之一方的側面’設置有複數 個塗抹頭8。此等塗抹頭8，可藉由移重機2 a〜2 c的橫樑3上 所設置之Y軸方向移動機構（圖中未顯示）’於該橫樑3的 側面上，在Y軸方向上移動。圖示的例子中’係顯不出在 移重機2 a~2c上，分別各設置有6個塗抹頭8，此等中的3個 塗抹頭8靠近橫樑3之一方的端側，剩餘的3個塗抹頭8靠近 橫樑3之另一方的端側之狀態。 在此，於移重機2 a〜2c中，分別負擔有各功能。配置 在最靠近基板送入側a之移重機2a，被分配到密封材朝向 玻璃基板之塗抹功能，設置在此之塗抹頭8，分別爲密封 材的塗抹頭。接著配置在基板送入側a之移重機2b，被分 配到成爲所製作之液晶面板的電極部之點焊材朝向玻璃基 板之塗抹功能，設置在此之塗抹頭8，分別爲點焊材的塗 抹頭。配置在最靠近基板送出側b之移重機2c，被分配到 液晶對玻璃基板之滴入塗抹功能，設置在此之塗抹頭8, 分別爲將液晶滴入塗抹於以玻璃基板上所塗抹之密封材所 包圍的區域內之塗抹頭。 經塗抹處理後的玻璃基板（圖中未顯示），藉由圖中 未顯示之送入側搬運輸送帶從基板送入側a所送入。此時 ，工件機台6位於送入側a，被送入之玻璃基板從送入側搬 運輸送帶被移至該工件機台6上。如此，載置有玻璃基板 之工件機台6，係藉由T軸方向移動機構依序被移動至預定 位置，並且當每次被設定在各預定位置時，藉由移重機2a 的各塗抹頭8將密封材塗抹於工件機台6上所載置之玻璃基 •16- 201111061 板’並藉由移重機2b的各塗抹頭8來塗抹點焊材，藉由移 重機2c的各塗抹頭8來滴入塗抹液晶。然後，工件機台6位 於基板送出側b，處理完畢的玻璃基板從該工件機台6被移 往圖中未顯示之送出側搬運輸送帶而進行送出搬運。 第2圖係槪略地顯示本發明之塗抹裝置及塗抹方法之 第1實施形態的全體構成之構成圖，9爲蓋，1〇爲基板送入 口，11爲基板送出口，12爲風扇過濾單元，13爲Z軸移動 機台’ Μ爲噴嘴，15爲基板吸附平板，16爲滾子，17爲玻 璃基板’ 18a爲送入側搬運輸送帶，18b爲送出側搬運輸送 帶’對應於第1圖之部分，係附加同一圖號並省略重複的 說明。 同圖中，架台1上的移重機2a〜2c與工件機台6所移動 之範圍，全體係以蓋9所覆蓋。於該蓋9的頂部，設置有複 數個風扇過濾單元1 2。於此蓋9的基板送入側a，設置有用 以將從送入側搬運輸送帶18a所搬運來之玻璃基板17送入 至蓋9內之較小開口（較玻璃基板17的寬度稍微大之寬度 ，且玻璃基板17的厚度稍微大之厚度的開口）的基板送入 口 10，從該基板送入口 10所送入之玻璃基板17，被載置於 工件機台6上。此外，於此蓋9的基板送出側b，設置有用 以從蓋9內將經塗抹處理後的（塗抹處理完畢的）玻璃基 板1 7排出至外部之具有與基板送入口 1 0同樣大小之較小開 口的基板送出口 11，從該基板送出口 11所送出之塗抹處理 完畢的玻璃基板17，被裝載於送出側搬運輸送帶18b。 在此，工件機台6上表面的基板載置面與搬運輸送帶 -17- 201111061 18a、18b的基板載置面，爲同樣高度面（同一平面的面） ，此外，工件機台6的基板載置面，如後述般，係由基板 吸附平板15及滾子16所構成者》該搬運輸送帶18a、18b， 除了具有導引滾子之滾子式搬運輸送帶之外，亦可使用球 狀的輸送帶，或是行走樑式者等。 藉由該構成，當藉由送入側搬運輸送帶18a所搬運之 玻璃基板17被送入於蓋9內時，係藉由送入側搬運輸送帶 18a，使玻璃基板17保持在此時的高度下從送入口 1〇壓入 於蓋9內，當此玻璃基板17到達工件機台6上時，藉由保持 在至目前爲止的高度之滾子16而在工件機台6上移動，並 在預定位置上被載置且吸附於基板吸附平板15而固定位置 〇 如此，裝載玻璃基板17之工件機台6係藉由T軸方向移 動機構在T軸方向上移動，並使該位置被設定在架台1上之 靠近基板送入側a的A位置，在此位置上，藉由移重機2a的 塗抹頭8來進行密封材的塗抹，而在玻璃基板17上描繪出 複數個（此時爲6個）被封閉之密封材的圖型。該密封材 的圖型，在移重機2a上，係一邊從裝載於塗抹頭8的Z軸移 動機台13之噴嘴14吐出密封材，一邊藉由Y軸方向移動機 構使塗抹頭8沿著移重機2a的橫樑3 (第1圖）在Y軸方向上 移動，並且藉由X軸方向移動機構4a、4b (第1圖），使移 重機2a在X軸方向上移動而藉此使塗抹頭8在X軸方向上移 動，使噴嘴14沿著矩形狀圖型的軌跡移動而進行描繪。此 時，藉由Z軸方向移動機構（圖中未顯示）來調整Z軸移動 -18 - 201111061 機台13之Z方向的高度，而將噴嘴14的密封材吐出口距離 玻璃基板17表面的高度經常保持在所規定的高度。 接著，工件機台6藉由T軸方向移動機構在T軸方向上 移動，並使該位置被設定在架台1上之中央部的B位置，在 此位置上，藉由移重機2b的塗抹頭8，對玻璃基板17上的 密封材之每個矩形狀的描繪圖型，在該描繪圖型外周的預 定位置（例如4個角落的位置）上進行電極劑之點焊材的 塗抹。此時，與上述相同，亦藉由移重機2b上所設置之塗 抹頭8之X、Y軸方向的移動，使該噴嘴14被設定在應予塗 抹各密封材的描繪圖型的點焊材之位置上，並在該位置上 ，從噴嘴14的吐出口吐出電極材。此時，與上述相同，將 噴嘴14的吐出口距離玻璃基板17表面的高度經常保持在所 規定的高度。 然後，工件機台6藉由T軸方向移動機構在T軸方向上 移動，並使該位置被設定在架台1上之靠近基板送出側b的 C位置，在此位置上，藉由移重機2 c的塗抹頭8，對玻璃基 板17上的密封材之每個描繪圖型，在藉由描繪圖型所包圍 之區域內進行液晶的滴入塗抹。此時，與上述相同，亦藉 由移重機2c上所設置之塗抹頭8之X、Y軸方向的移動，使 該噴嘴14被設定在應予將液晶滴入於以各密封材的描繪圖 型所包圍之區域內之位置上，並在該位置上，從噴嘴14的 吐出口滴入液晶。此時，與上述相同，亦將噴嘴1 4的吐出 口距離玻璃基板1 7表面的高度經常保持在所規定的高度。 藉由上述動作而結束朝向玻璃基板17之塗抹處理，並 *19- 201111061 從基板送出口 1〗將工件機台6上之該塗抹處理完畢的玻璃 基板17排出至蓋9外，此時，藉由工件機台6的滾子16從基 板送出口 Η被送出至蓋9外之玻璃基板17，係在維持此時 的高度下被壓出，當該玻璃基板1 7到達送出側搬運輸送帶 18b上時，在此時的高度下，在送出側搬運輸送帶18b上移 動，並將位置固定在預定位置上。 如此，玻璃基板1 7，不論是從送入側搬運輸送帶1 8a 移往蓋9內的工件機台6上時，或是從蓋9內的工件機台6上 移往送出側搬運輸送帶18b時，均不需使用機器人或人手 ，可僅藉由在將高度保持爲一定下之T軸方向上的移動來 進行，所以蓋9內的空氣不會上下流動，塵埃不會被捲起 。此外，同樣的，分配有不同功能之移重機2a、2b、2c間 之玻璃基板17的移動，亦可僅藉由在裝載於工件機台6下 之T軸方向上的移動來進行，所以蓋9內的空氣不會上下流 動，塵埃不會被捲起。因此，不會產生被捲起的塵埃附著 於玻璃基板17之密封材等的塗抹面之情形，而能夠避免因 塵埃的附著所造成之面板良率的降低。 此外，係將密封材的塗抹、電極材之點焊材的塗抹、 液晶的滴入塗抹之不同的塗抹處理功能之裝置（移重機 2 a〜2 c )設置在相同架台1上，並在裝載於工件機台6之狀 態下使玻璃基板1 7在此等裝置間移動’藉此在各裝置中進 行個別的塗抹處理’所以與使用機器人等之裝置間的玻璃 基板的搬運相比，可縮短從某一裝置移往下—裝置並開始 進行處理爲止之時間，而縮短製造所需時間’同時亦可縮 -20- 201111061 小此等裝置間的間隔，使進行該不同的功能處理之裝置全 體可達到小型化。 第3圖係顯示第1圖及第2圖之工件機台6的一具體例之 外觀立體圖，15a〜15e爲基板吸附平板，16a〜16d爲滾子， 19爲基板載置構件，20a〜20d爲連結構件，21爲空氣吸附 孔，22a、22b爲基板定位銷，23爲十字滾子軸承， 24 a〜2 4d爲ΧΥ0軸方向微動機構，25爲十字滾子軸承，26 爲正交軸承。 同圖中，工件機台6中，在X軸方向上互相平行且以等 間隔所配置之複數個（在此爲5個）以Y軸方向爲長度方向 之基板吸附平板15a〜15e，係分別具有以細長平板狀的連 結構件20a~20d所連結之構成的基板載置構件19。此等基 板吸附平板15a〜15e相當於第2圖中的基板吸附平板15，橫 向剖面形狀呈矩形狀或正方形狀，且連結構件20a〜20d較 基板吸附平板15a〜15e的高度更薄，藉此，連結構件20a〜 2〇d的部分係形成基板載置構件19的凹陷山谷部。於此等 山谷部（亦即連結構件20a〜2 0d的上表面側），分別配置 有涵蓋此山谷部的Y軸方向全長之滾子16 a〜16d。此等滾子 16 a〜16d相當於第2圖中的滾子16，係構成用以使載置於基 板載置構件19上之玻璃基板17(第2圖）在T(X)軸方向 上移動之基板移動機構，並藉由圖中未顯示之旋轉驅動機 構予以旋轉驅動。 於各個基板吸附平板15a〜15e的上表面，各自設置有 複數個（圖示中各自爲4個）用以吸附玻璃基板17(第2圖 -21 - 201111061 )來固定位置之空氣吸附孔21，並且在該基板載置構件19 之X軸方向的端側，亦即接近於位在與基板送入側a (第1 圖、第2圖）爲相反側的最前端之基板吸附平板1 5 e的外側 面，設置有複數個（在此爲2個）基板定位銷22a、22b。 此外，該基板載置構件1 9的中心部，係於該內面側上 藉由作爲旋轉構件的十字滾子軸承23所支撐，在基板載置 構件19的內面上之從十字滾子軸承23爲不同之方向上且互 爲相等距離之位置，係藉由ΧΥ0軸方向微動機構2 4a~2 4d 所支撐。十字滾子軸承23，係以該支撐位置爲中心使基板 載置構件19在0軸方向上轉動者，ΧΥ0軸方向微動機構 24a〜24d，係由十字滾子軸承25與正交軸承26所構成，並 藉由十字滾子軸承23以該中心部爲中心使基板載置構件19 在0軸方向上轉動，同時藉由ΧΥ0軸方向微動機構 2 4 a〜2 4d使該支撐位置在0軸方向上轉動，並在XY軸方向 上移動者。藉此，基板載置構件1 9能夠以該中心位置爲中 心轉動，並調整工件機台6上所裝載之玻璃基板17 (第1圖 )之0軸方向上的偏離。 該基板載置構件19係載置於圖中未顯示之基台上，於 該基台的內面側設置有第1圖中以說明之T軸方向移動機構 ，藉此，可使工件機台6在T軸方向上移動。 此外，滾子16a〜16d，其位置相對於基台被固定，但 由基板吸附平板15a~15e與連結構件20a〜20d所構成之基板 載置構件19、與基板定位銷22a、2 2b，係一同和十字滾子 軸承23與ΧΥ0軸方向微動機構24a~2 4d相對於基台可上下 -22- 201111061 移動。 因此，如第2圖中所說明般，當工件機台6位於蓋9的 基板送入口 1 0側並從送入側搬運輸送帶1 8 a導入玻璃基板 17時，基板載置構件19處於下降之狀態，基板定位銷22a 、22b處於上升之狀態，滾子16a〜16d與基板定位銷22a、 2 2b，該一部分處於較基板載置構件19之基板吸附平板 1 5 a〜15 e的上表面更往上方突出之狀態。 此時，滾子1 6 a〜1 6 d處於被旋轉驅動之狀態，如第2圖 中所說明般，玻璃基板1 7從送入側搬運輸送帶1 8a被壓入 於工件機台6上，當玻璃基板1 7被載入於旋轉的滾子 16a〜16d時，由於滾子16a〜16d的旋轉，使該玻璃基板17朝 向基板定位銷22a、22b的方向移動。當玻璃基板17抵接於 基板定位銷22a、22b時，滾子16a〜16d的旋轉停止，基板 載置構件19上升而成爲在該上表面載置有玻璃基板17之狀 態’接著，空氣吸附孔2 1係作爲基板位置固定機構來進行 吸附動作，藉此使玻璃基板17被吸附於基板載置構件19的 上表面，而成爲固定在工件機台6上之狀態。 此外，如第2圖中所說明般，當工件機台6朝向架台1 的基板送出側b移動，並將塗抹處理完畢的玻璃基板1 7經 由基板送出口 11移往送出側搬運輸送帶18b時，係使基板 定位銷22a、22b與基板載置構件19下降，在玻璃基板17被 裝載於滾子1 6 a〜1 6 d之狀態下，使此等滾子1 6 a〜1 6 d旋轉。 藉此’玻璃基板1 7係從工件機台6上通過基板送出口 1 1朝 向送出側搬運輸送帶18b移動。 -23- 201111061 如此，不需使用機器人或人手而能夠將玻璃基板17從 送入側搬運輸送帶18a移送至工件機台6上，此外，亦不需 使用機器人或人手而能夠將塗抹處理完畢的玻璃基板17從 工件機台6移送至送出側搬運輸送帶18b上。 第4圖係顯示第1圖及第2圖之工件機台6的其他具體例 之外觀立體圖，27爲基板吸附平板，27a爲基板載置面， 27b爲前側面，28爲空氣噴出/吸附孔，對應於第3圖之部 分，係附加同一圖號並省略重複的說明。 同圖中，此具體例中，1個平板狀的基板吸附平板27 ，與第3圖所示之具體例相同，係形成爲藉由十字滾子軸 承23及ΧΥ0軸方向微動機構24 a〜24d支撐於圖中未顯示的 基台上之構成。惟該基板吸附平板27，其位置及高度相對 於該基台被固定。此基板吸附平板27的上表面呈平坦面， 並成爲圖中未顯示之玻璃基板的載置面2 7a，此基板載置 面27a係具有可將玻璃基板全體載置於此之面積。 此基板吸附平板27之接近於與基板送入側a (第2圖） 爲相反側的前側面27b側，與先前第3圖所示之具體例相同 ，設置有複數個（在此爲2個）基板定位銷22a、22b。此 等基板定位銷22a、22b，與先前第3圖所示之具體例相同 ，相對於基台可上下移動，且如第2圖中所說明般，當工 件機台6位於蓋9的基板送入口 1 0側並從送入側搬運輸送帶 18a導入玻璃基板17時，基板定位銷22a、22b處於上升之 狀態，並處於較基板吸附平板27的基板載置面27a更往上 方突出之狀態。藉此，從基板送入口 1 〇 (第2圖）所送入 -24- 201111061 之玻璃基板17，藉由抵接於基板定位銷22 a、22b ’可相對 於基板吸附平板27被定位。此外，如第2圖中所說明般， 當工件機台6位於蓋9的基板送出口 11側並從工件機台6將 玻璃基板17送出至送出側搬運輸送帶18b時’基板定位銷 22a、22b處於下降之狀態，並位於較基板吸附平板27的基 板載置面27a更下方。 於基板吸附平板27的基板載置面27a ’係沿著X ( T ) 軸方向與Y軸方向以預定間隔設置有空氣噴出/吸附孔2 8 ( 第4圖中，係顯示X軸方向上分別設置9個，Y軸方向上分 別設置7個之情況，但不限定於此）。此等空氣噴出/吸附 孔2 8，當在玻璃基板被定位之狀態下裝載於基板載置面 2 7 a時，係具有空氣吸附孔之功能，並將玻璃基板以空氣 吸附於基板載置面2 7a而固定。此外，從送入側搬運輸送 帶18a送入玻璃基板17時以及將玻璃基板17送出至送出側 搬運輸送帶18b時，爲了使該玻璃基板17於基板載置面27a 上在X軸（T軸）方向上移動，空氣噴出/吸附孔28係具有 空氣噴出孔之功能。 第5圖係顯示第4圖的空氣噴出/吸附孔28中之構成的 一具體例之圖，29爲空氣吸附孔，30爲空氣噴出孔，對應 於前述圖面之部分’係附加同一圖號並省略重複的說明。 第5圖（a )中’於空氣噴出/吸附孔28，係連通有空 氣吸附孔29及空氣噴出孔30。空氣吸附孔29中，係藉由真 空栗浦等之真空驅動源（圖中未顯不），如箭頭所示，來 吸引基板吸附平板27之基板載置面27a側的空氣，空氣噴 -25- 201111061 出孔30中，藉由空氣泵浦等之空氣驅動源（圖中未顯示） ，從基板吸附平板27的空氣噴出/吸附孔28將空氣往外部 噴出。在此，空氣吸附孔29係設置在垂直於基板載置面 2 7 a之方向，空氣噴出孔30係相對於基板載置面27a在T ( X )軸方向上傾斜地設置，藉此，從空氣噴出孔30所噴出之 空氣，係從空氣噴出/吸附孔28相對於基板載置面27a在T (X)軸方向上傾斜地噴出。 第5圖（b )係顯示出如第2圖中所說明般之從送入側 搬運輸送帶18a導入玻璃基板17移往工件機台6上時、以及 將塗抹處理完畢的玻璃基板1 7從工件機台6移往送出側搬 運輸送帶18b時之空氣噴出/吸附孔28之狀態。 此時，係從空氣噴出孔30中噴出塵埃量被降低之清靜 的空氣，如虛線箭頭所示，空氣從空氣噴出/吸附孔28相 對於基板載置面27a在T(X)軸方向上傾斜地噴出，並吹 抵玻璃基板17的內面。藉此，玻璃基板17從基板載置面 27a僅被舉起些許程度（例如約2μπι )，且被壓往Τ軸方向 。因此，玻璃基板17沿著基板載置面27a在Τ(Χ)軸方向 上被搬運。 第5圖（c )係顯示出如第2圖中所說明般之將在工件 機台6上被定位的玻璃基板17固定在該工件機台6的基板載 置面27a之狀態。 此時，係從空氣吸附孔29吸引空氣，如第5圖（b )中 所說明般，玻璃基板17在T(X)軸方向上被搬運，當藉由 基板定位銷22a、22b (第4圖）相對於基板載置面27a被定 -26- 201111061 位時，來自空氣噴出孔30之空氣的噴出停止，取而代之的 是從空氣吸附孔29進行空氣的吸引。藉此，玻璃基板17被 載置於基板載置面27a，並藉由更進一步的空氣吸引，使 玻璃基板17被固定在基板載置面27 a而固定位置。 如此，藉由空氣的作用，將玻璃基板17相對於基板載 置面27a在T(X)軸方向上，此外，並將玻璃基板17固定 在基板載置面27a，於基板吸附平板27上，係設置有依據 空氣噴出/吸附孔28所構成之基板移動機構及基板位置固 定機構。此外，當將處於第5圖（c )所示之狀態之塗抹處 理完畢的玻璃基板17搬運至送出側搬運輸送帶18b (第2圖 )時，只須從第5圖（c )所示之狀態切換爲第5圖（b )所 示之狀態即可。空氣吸附孔2 9中之空氣吸附/停止與空氣 噴出孔30中之空氣噴出/停止，可藉由依據電磁閥所進行 之切換動作來進行。 亦可將空氣吸附孔29及空氣噴出孔30分別設置在基板 載置面27a’此外，第5圖中，亦可將空氣噴出孔30般之傾 斜的空氣孔連通於空氣噴出/吸附孔28，並將該空氣孔兼 用於空氣吸附與空氣噴出。 此具體例中，不需具有第3圖所示之具體例般之滾子 16’亦不需具有使基板載置構件19上下移動之驅動手段， 可使構成更加簡化。 第6圖係擴大顯示第1圖之塗抹頭8的一具體例的要部 之立體圖’ 31爲塗抹材收納筒’ 32爲噴嘴支撐具，33爲距 離計，對應於前述圖面之部分，係附加同一圖號並省略重 -27- 201111061 複的說明。 同圖中，塗抹材收納筒31與設置有噴嘴14之噴嘴支撐 具32及距離計33，係設置在Z軸移動機台13 (第2圖）。 移重機2a的塗抹頭8中，係於塗抹材收納筒31收納有 密封材作爲塗抹材，移重機2b的塗抹頭8中，於塗抹材收 納筒31收納有導電性的液體作爲塗抹材，移重機2c的塗抹 頭8中，於塗抹材收納筒3 1收納有液晶作爲塗抹材。 距離計3 3，係藉由非接觸式的三角測距法，來測量從 噴嘴14的前端部至工件機台6(第1圖）上所裝載之玻璃基 板17的表面（上表面）爲止之距離。亦即，係在距離計33 的框體內設置發光元件，從該發光元件所射出之雷射光， 在玻璃基板17上的測量點S產生反射，並由同樣設置在框 體內之感光元件所感光，並因應該感光位置來進行測量。 此外，玻璃基板1 7上之雷射光的測量點S與噴嘴1 4的正下 方位置，雖然在玻璃基板1 7上偏離些許距離△ X及△ Y， 但該些許距離的偏離爲可忽視玻璃基板1 7表面上的凹.凸差 之範圍內，故距離計33的測量結果與從噴嘴14的前端部至 玻璃基板17的表面（上表面）爲止之距離之間幾乎不存在 差距。因此，藉由根據該距離計33的測量結果來控制Z軸 移動機台13 (第2圖），可配合玻璃基板17表面上的凹凸 (起伏），將從噴嘴Μ的前端部至玻璃基板17的表面（上 表面）爲止之距離（間隔）維持爲一定。 如此，藉由將從噴嘴14的前端部至玻璃基板17的表面 (上表面）爲止之距離（間隔）維持爲一定，並且將從噴 -28- 201111061 嘴1 4所吐出之每單位時間的塗抹材的量維持爲定量，可使 塗抹描繪在玻璃基板1 7上之圖型的寬度與厚度成爲一致。 此外，雖然圖中未顯示，但具備可進行照明的光源之 淨筒與圖像辨識攝像機，除了使用在各噴嘴14的平行調整 與間隔調整用之外，亦用在玻璃基板17的對位與塗抹材之 描繪圖型的形狀辨識等，故以與玻璃基板17相對向之方式 所設置。 返回第2圖，此實施形態中，係具備控制上述各部之 控制部。亦即，於架台1的內部，設置有用以控制進行各 機構的驅動之線性馬達以及使機台移動之馬達之主控制部 。於此主控制部，係中介纜線而連接有副控制部。副控制 部係控制用以驅動Z軸移動機台1 3 (第2圖）之Z軸伺服馬 達。 第7圖係顯示主控制部的構成與該控制的一具體例之 方塊圖，34a爲主控制部，34aa爲微電腦，34ab爲馬達控 制器’ 34ac爲圖像處理控制器，34ad爲外部介面，34ae爲 資料通訊匯流排’ 34af爲移重機移動用X軸線性馬達用驅 動器（以下略稱爲X軸驅動器），34ag爲塗抹頭部移動用γ 軸線性馬達用驅動器（以下略稱爲γ軸驅動器），34311爲 工件機台旋轉用0軸馬達用驅動器（以下略稱爲0軸驅動 器）’ 34ai爲工件機台移動用τ軸線性馬達用驅動器（以 下略稱爲T軸驅動器），34b爲副控制部，34c爲硬碟，34d 爲USB ( Universal Serial Bus :萬用序列匯流排）記憶體 ’ 34f爲顯示器’ 34g爲鍵盤，35爲調節器，36爲閥單元， -29- 201111061 37爲圖像辨識攝像機，38爲通訊纜線。 同圖中’主控制部34a係內藏有：微電腦34aa，與用 以控制驅動在移重機2a〜2c的橫樑3上之Y軸方向移動機構 之Y軸驅動器34ag與用以驅動移重機2a~2c的X軸方向移動 機構之X軸驅動器34 af、將裝載有玻璃基板17之工件機台6 (第1圖）在Θ軸方向上驅動之0軸驅動器34 ah、將工件 機台6在T軸方向上驅動之T軸驅動器34ai之馬達控制器 3 4ab，與對圖像辨識攝像機3*7中所得之圖像訊號進行處理 之圖像處理控制器3 4ac以及副控制部3 4b和控制塗抹頭8 ( 第1圖）的密封材等之塗抹材的塗抹動作之調節器35，與 用以和閥單元36進行通訊之外部介面34ad;此等微電腦 34aa與馬達控制器34ab與圖像處理控制器34ac與外部介面 34ad，係經由資料通訊匯流排34ae相互地連接。此外，副 控制部34b係經由通訊纜線38連接於該外部介面34ad。 此外，於主控制部34a，係連接有USB記憶體34d或作 爲外部記憶裝置之硬碟34c，顯示器34f與鍵盤34g等。從 鍵盤34g所輸入之資料等，係由顯示器34f表示，同時被記 億儲存於硬碟34c或USB記憶體34d等之記億媒體。 此外，雖然圖中未顯示，但於微電腦34aa中，係具備 有：主運算部與儲存有用以進行後述塗抹描繪之處理程式 之ROM，以及儲存有主運算部中的處理結果與來自外部介 面34ad、馬達控制器34ab的輸入資料之RAM，以及和外部 介面34ad與馬達控制器34ab進行資料往來之輸出入部等。 作爲以Y軸驅動器34ag所驅動之各塗抹頭8的Y軸方向 -30- 201111061 移動機構之線性馬達與作爲以X軸驅動器34af所驅動之移 重機2a〜2c (第1圖）的X軸方向移動機構4a、4b之線性馬 達，係設置有用以偵測出各塗抹頭8與移重機2a〜2c的位置 之線性尺規，並將該偵測結果分別供給至Y軸驅動器34ag 、X軸驅動器34af來進行塗抹頭8之Y軸方向、X軸方向上 的位置控制。此外，同樣的，以Θ軸驅動器34 ah所驅動之 工件機台6 (第1圖）的旋轉驅動馬達，係內藏有偵測出該 玻璃基扳1 7的旋轉量之編碼器，並將該偵測結果供給至0 軸驅動器34ah來進行玻璃基板17之方向的控制。再者，作 爲以T軸驅動器34ai所驅動之工件機台6的T軸方向移動機 構之線性馬達，係設置有用以偵測出工件機台6的位置之 線性尺規，並將該偵測結果供給至T軸驅動器3 4ai來進行 工件機台6的位置控制。藉由該位置控制，工件機台6係進 行第2圖所示之用以裝載被送入之玻璃基板17之基板送入 側a的位置、與用以裝載被送出之經塗抹處理的玻璃基板 17基板送出側b的位置上之A位置、B位置、C位置上的位 置設定。 此外，雖然第7圖中未顯示，但亦設置有第3圖所示的 構成之相對於工件機台6之滾子16 a〜16d的旋轉驅動機構， 與基板載置構件19或基板定位銷22a、22b的上下移動驅動 機構，此等機構亦藉由馬達控制器34ab所控制。 第8圖係顯示第7圖之副控制部3 4b的一具體例之方塊 圖，34ba爲微電腦，34bb爲馬達控制器，34bc爲外部介面 ，3 4 b d爲資料通訊匯流排，3 9爲Z軸馬達用驅動器（以下 -31 - 201111061 略稱爲Z軸驅動器），對應於前述圖面之部分，係附加同 一圖號並省略重複的說明。 同圖中，副控制部34b係內藏有：微電腦34ba與馬達 控制器34bb，與進行在距離計33 (第6圖）中所得之高度 資料的輸入或與主控制部34a之訊號傳送之外部介面34bc ，此等係經由資料通訊匯流排34be相互地連接。此外，雖 然圖中未顯示，但於微電腦34ba中，係具備有：主運算部 與儲存有用以在後述塗抹描繪時進行噴嘴14(第2圖、第6 圖）距離玻璃基板17表面的高度控制之處理程式之ROM， 以及儲存有主運算部中的處理結果與來自外部介面34bc及 馬達控制器34bb的輸入資料之RAM，以及和外部介面34bc 與馬達控制器34bb進行資料往來之輸出入部等。藉由馬達 控制器34bb所控制之Z軸馬達用驅動器39，係設置在每個 塗抹頭8(第1圖）並用以驅動該Z軸伺服馬達者，於此等Z 軸伺服馬達，係內藏有偵測出該旋轉量之編碼器，並將該 偵測結果送回Z軸驅動器39來進行噴嘴14的高度位置控制 〇 在主控制部34a與副控制部34b的協同控制下，各馬達 (線性馬達、Z軸伺服馬達、0軸伺服馬達等）根據從鍵 盤34g (第7圖）所輸入且儲存於微電腦3 4aa的RAM之資料 來移動·旋轉，藉此，X軸方向移動機構4a、4b使移重機 2 a〜2 c在X軸方向上僅移動任意距離，並且中介使噴嘴14 ( 第2圖）上下地移動之Z軸移動機台13 (第2圖），藉由移 重機2a~2c的橫樑3(第1圖）上所設置之塗抹頭8的Y軸方 -32- 201111061 向移動機構，在γ軸方向上僅移動任意距離，於該移動中 ，以設定於塗抹材收納筒3 1 (第6圖）之壓力持續地加壓 ，從噴嘴14前端部的吐出口中吐出密封材等之液狀的塗抹 材，而在玻璃基板17上依據該塗抹材描繪出期望的圖型。 在噴嘴1 4朝向Υ軸方向水平移動中，距離計3 3測量出 噴嘴1 4與玻璃基板1 7的表面之間的間隔，並以經常將此間 隔維持爲一定間隔之方式，藉由Ζ軸移動機台13的上下移 動來控制噴嘴14的高度。 依據副控制部3 4 b所進行之Ζ軸方向的控制，係因每個 移重機的功能而不同。安裝於移重機2 a之塗择頭8，係藉 由Z軸方向上的移動來上下地驅動密封材之塗抹頭8的噴嘴 14’移重機2b中，同樣是藉由Z軸方向上的移動來上下地 驅動成爲電極部之點焊材塗抹用之塗抹頭8的噴嘴14，移 重機2c中，同樣是藉由Z軸方向上的移動來上下地驅動液 晶滴入用之塗抹頭8的噴嘴14。 以移重機2a之密封材塗抹用的塗抹頭8爲例來說明， 在主控制部34a與副控制部34b的協同控制下，各馬達根據 從鍵盤34g所輸入且儲存於微電腦34aa的RAM之資料來移 動*旋轉，藉此使保持在工件機台6(第1圖）之玻璃基板 17在X軸方向上移動任意距離，並且以該X軸方向移動機 構4a、4b使移重機2a、2b在X軸方向上移動，藉此使中介 將噴嘴14上下地移動之Z軸移動機台13 (第2圖）所支撐之 噴嘴1 4 (第2圖），在X軸方向上僅移動任意距離，於該移 動中’以設定於塗抹材收納筒31 (第6圖）之壓力持續地 -33- 201111061 加壓’從噴嘴1 4前端部的吐出口中吐出塗抹材，亦即密封 材’而在玻璃基板17上塗抹有塗抹材之期望的描繪圖型。 在噴嘴14朝向X軸方向水平移動中，藉由距離計33 ( 第6圖）測量出噴嘴1 4與玻璃基板1 7之間隔，並以經常將 此間隔維持爲一定之方式，藉由Z軸移動機台13的上下移 動來控制噴嘴14之Z軸方向上的位置。 第9圖係顯示上述第1實施形態之全體動作的一具體例 之流程圖。以下係參照第2圖等，說明該動作。 同圖中，當開始動作時（步驟S100)，首先使T軸驅 動器34ai動作’將工件機台6移動至靠近架台1的基板送入 側a，亦即靠近第2圖的A位置，同時使移重機2a、2b退避 至靠近基板送出側b，亦即靠近第2圖的C位置（步驟S101 )。接著從送入側搬運輸送帶1 8 a將玻璃基板1 7朝向工件 機台6拉引，同時將移重機2a移動至玻璃基板17被定位之 位置’亦即靠近第2圖的A位置。在工件機台6之以基板定 位銷22a、22b (第3圖、第4圖）所決定之預定位置上，將 玻璃基板17予以暫定位，並藉由空氣吸附孔21 (第3圖） 、空氣噴出/吸附孔28 (第4圖）予以吸附固定（步驟S102 然後，藉由圖像辨識攝像機37(第7圖）辨識出玻璃 基板17上的標記後進行定位，並藉由0軸驅動器34ah (第 7圖），以設置在工件機台6的下表面之十字滾子軸承23與 ΧΥ0軸方向微動機構24 a〜24 d來校正0軸方向上的位置偏 離（步驟S 1 03 )。 -34- 201111061 當正確地校正位置偏離時，使Y軸驅動器34ag (第7圖 )與Z軸驅動器39(第8圖）動作，藉此使移重機2a上的Y 軸移動機構與Z軸移動機台13動作，將塗抹頭8之噴嘴14 ( 第6圖）的高度設定在圖型的描繪高度，並藉由塗抹頭8將 密封材塗抹於玻璃基板17上（步驟S104)。 在密封材塗抹處理後，使X軸驅動器34af而將工件機 台6移動至架台1的中間位置，亦即第2圖的B位置，同時使 先前結束密封材塗抹後之移重機2a退避至靠近架台1的送 入側a’亦即靠近第2圖的A位置（步驟S105)。 接著將移重機2b移動至架台1的中間位置，亦即靠近 第2圖的B位置，執行電極材的點焊材塗抹（步驟S106)。 點焊材的塗抹結束後，將工件機台6移動至靠近架台1的送 出側b ’亦即第2圖的C位置，同時使結束電極材的點焊材 塗抹處理後之移重機2b退避至靠近架台丨的送入側a，亦即 靠近第2圖的A位置（步驟si〇7)。 接著將移重機2c移動至靠近架台1的送出側b，亦即靠 近第2圖的C位置’將液晶滴入於由密封材所包圍之內部（ 步驟S 1 0 8 )。 在此結束一連串的塗抹動作，將玻璃基板i 7從工件機 台6移往送出側搬運輸送帶18b (步驟sl〇9)。 然後判定是否停止上述的全部工序（步驟S110)，當 對全部玻璃基板1 7結束該—連串的處理時，結束全部的作 業並停止動作（步驟S丨丨丨）。 上述第1實施形態中，係構成爲將6個塗抹頭8設置在！ -35- 201111061 個移重機，並藉由依據線性馬達所構成之塗抹頭8用的Y軸 移動機構，可使其在移重機的橫樑3上，在該長度方向（Υ 軸方向）上移動之構造。藉由該Υ軸移動機構來改變塗抹 頭8的停止位置，藉此可支援從外形2~3 ( m)見方大小之1 片的大型玻璃基板17來製作複數片面板時之塗抹。 此實施形態中，係在各移重機2a~2c中分別設置6個塗 抹頭8，並且將同一移重機，例如移重機2a的6個塗抹頭8 全部用作爲密封材塗抹用，但可因應使用狀況，選擇將移 重機2a的6個塗抹頭8與移重機2b的6個塗抹頭8全部用作爲 密封材塗抹用，或是點焊材塗抹用等。 此外，此實施形態中，設置在同一移重機之塗抹頭8 ，係全部構成爲將相同塗抹材塗抹於玻璃基板17上者，但 亦可在同一移重機中設置用以塗抹不同種類的塗抹材之塗 抹頭，使該移重機具有不同功能。例如，於移重機2a中， 亦可將6個塗抹頭8中的3個塗抹頭8設爲吐出密封材之塗抹 頭，將剩餘的3個塗抹頭8設爲吐出電極材之塗抹頭，使該 移重機2a具有密封材的塗抹功能與電極材的塗抹功能之2 種不同功能。此外，從該內容中，亦可構成爲在基台1上 僅設置1台移重機，於該移重機中’同樣地具有密封材的 塗抹功能、電極材的塗抹功能及液晶的滴入塗抹功能。 再者，亦可使設置在移重機2a之6個塗抹頭8停止，並 使移重機2 a退避至一方的行程終止側而活用2個移重機2 b 、2c的塗抹頭8，並設定爲教學資料而能夠隨機應變地活 用。 -36- 201111061 根據此第1實施形態，係在共通的工件機台6上進行複 數種材料的塗抹，例如密封材塗抹與導通用點焊材塗抹、 與液晶滴入塗抹，藉此，如同可將3種功能集中在1個裝置 內實現。 第10圖係槪略地顯示本發明之塗抹裝置及塗抹方法之 第2實施形態的全體構成之構成圖，40爲耐壓蓋，41 a爲基 板送入閘門，41b爲基板送出閘門，42爲吸引鼓風機，43 爲配管，對應於第2圖之部分，係附加同一圖號並省略重 複的說明。 同圖中，此第2實施形態係以具有剛性之耐壓蓋40來 覆蓋架台1上的工件機台6與移重機2a〜2c所移動之範圍， 並且在該耐壓蓋40的基板送入側a，設置有從送入側搬運 輸送帶18a將玻璃基板17送入至耐壓蓋40內並載置於工件 機台6上之基板送入閘門41a，在該耐壓蓋40的基板送出側 b，設置有從耐壓蓋40內的工件機台6將塗抹處理完畢的且 玻璃基板17送出至外部並載置於送出側搬運輸送帶18b之 基板送出閘門4 1 b，此等閘門4 1 a、4 1 b爲可開閉，並且僅 在玻璃基板1 7被送入或送出而通過時開放。 此外，耐壓蓋40的內部，係通過配管43而連接於作爲 空氣吸引手段的吸引鼓風機42，藉由該吸引鼓風機42，將 耐壓蓋40內部設定爲較大氣壓力更低之壓力的環境。如此 ，藉由將內部構成爲較大氣壓力更低之壓力的環境，可降 低空氣的密度’而降低因工件機台6與移重機2a〜2C之構造 物的移動所捲起之塵埃的共伴能力。此與在大氣壓環境下 -37- 201111061 相比，僅會捲起較小的塵埃，且更可降低捲起的塵埃量而 形成清潔的環境，藉此可更進一步地提高所製造之面板的 良率。 此外，雖因與塗抹處理時間的配合而有不同，但當更 進一步降低耐壓蓋40內部的壓力來構成高真空時，亦可使 用真空泵浦取代吸引鼓風機42來進行吸引。 關於上述構成以外之構成，係與先前的第1實施形態 相同，該動作亦由第9圖所表示。 如上述般，上述各實施形態中，係排列具有複數種功 能之複數台裝置（移重機），並將此等裝置構成爲可移動 ，同時將載置有玻璃基板之工件機台移動至藉由裝置來進 行塗抹處理之位置爲止，故不需進行下列依據機器人搬運 之基板的收授，亦即，使用共通的1台機器人或設置在裝 置間之複數台機器人，來進行成爲對象工件之玻璃基板的 收授，此外，藉由縮短基板的動線（移動線），而能夠達 到：第一、減少基板搬運時的粒子污染，提升液晶面板製 造時的良率，第二、縮小設置面積，有效活用無塵室者。 上述實施形態中，係以用於液晶面板的製作之塗抹處 理爲例來說明，但並不限定於此。因此，被進行塗抹處理 亦不限於玻璃基板。 【圖式簡單說明】 第1圖係顯示本發明之塗抹裝置及塗抹方法之第1實施 形態的要部之外觀立體圖。 -38- 201111061 第2圖係槪略地顯示本發明之塗抹裝置及塗抹方法之 第1實施形態的全體構成之構成圖。 第3圖係顯示第1圖及第2圖之工件機台6的一具體例之 外觀立體圖。 第4圖係顯示第1圖及第2圖之工件機台6的其他具體例 之外觀立體圖。 第5圖係顯示第4圖的空氣噴出/吸附孔28中之構成的 一具體例之圖。 第6圖係擴大顯示第1圖之塗抹頭8的一具體例的要部 之立體圖。 第7圖係顯示第1圖、第2圖所示之第1實施形態中之主 控制部的構成與該控制的一具體例之方塊圖。 第8圖係顯示第7圖之副控制部34b的一具體例之方塊 圖。 第9圖係顯示第1圖、第2圖所示之第1實施形態之全體 動作的一具體例之流程圖。 第10圖係槪略地顯示本發明之塗抹裝置及塗抹方法之 第2實施形態的全體構成之構成圖。 明 說 符 件 元 要 主 機 重 移 台：樑 架2C橫[Technical Field] The present invention relates to the manufacture of a flat display panel such as a liquid crystal panel, and more particularly to a coating device for applying a sealing material or the like on a substrate or a dripping of a liquid crystal. method. [Prior Art] A conventional technique for producing a liquid crystal panel or the like has an apparatus proposed as follows, that is, a plurality of vacuum processing chambers for performing processing in a vacuum state and a plurality of processing chambers under atmospheric pressure An atmospheric pressure processing chamber, and between the vacuum processing chamber and the atmospheric pressure processing chamber, and between the vacuum processing chamber and the atmospheric pressure processing chamber, respectively, a robot chamber for transporting the glass substrate and externally blocking is disposed, and is disposed between the processing chambers. In the case of a glass substrate, the robot in the robot room can automatically transport the glass substrate from one processing chamber to the other processing chamber to manufacture a liquid crystal panel (see, for example, Patent Document 1). According to the conventional technique, since the processing from the glass substrate to the liquid crystal panel is automatically processed without any human hand, there is almost no problem of particle contamination or molecular contamination. In addition, other examples have the following proposed techniques, that is, After the substrate is placed in the alignment device provided in the vacuum processing chamber, the sealing material is applied to the substrate, and then the substrate coated with the sealing material is pasted with the two substrates of the other substrate to cure the sealing material, and finally injected. When the panel is manufactured under the step of liquid crystal, the coating operation of forming the sealing material-5-201111061 on the substrate is performed under a pressure lower than the atmospheric pressure, and the bonding of the two substrates is performed under a pressure of atmospheric pressure or less. (For example, refer to Patent Document 2). According to the prior art, since the sealing material is applied and the two substrates are bonded under a relatively low pressure, the air bubbles mixed in the sealing material can be reduced, and the cracking failure or the gap failure due to the air bubbles can be reduced. Or the lack of liquid crystal injection defects can also reduce impurities such as dust that is rolled up around the substrate, and reduce panel defects caused by impurities. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. In the field of flat display panels such as (liquid crystal panel), the size of the glass substrate has been increasing rapidly year by year, and the manufacturing apparatus has also been expanding in size. Further, in order to be able to manufacture at a low cost, it is strongly required to reduce the dust which is rolled up inside or around the manufacturing apparatus to improve the yield, and at the same time, to suppress the manufacturing time per one panel. In the prior art described in the prior art, when the liquid crystal panel is manufactured from a glass substrate, when the glass substrate is transported from the atmospheric pressure processing chamber to the vacuum processing chamber, the vacuum activation time from the atmospheric pressure state to the vacuum state is -6 - 201111061, and the wear time is There is a problem with an increase in overall manufacturing time. Further, in the prior art described in the above Patent Document 2, when the application work or the bonding work of the substrate is performed in the vacuum processing chamber, the insertion and removal into the vacuum processing chamber are performed by a hand or a robot, and the like. The vertical movement of the substrate of the human hand or the robot causes the surrounding air to flow largely, and the dust is rolled up along with the air. Further, even when a panel is manufactured by arranging a plurality of devices having different functions without using the same vacuum processing chamber, when the glass substrate as the target workpiece is received, when the robot or the like is used, the robot is held by the robot. The movement of the substrate causes the surrounding air to flow largely, and the flow of the surrounding air causes the dust to be rolled up along with this. When such dust is rolled up, the probability of dust adhering to the panel becomes a defective product. In the prior art described in the above-mentioned Patent Document 2, as a first example, when a coating operation is performed in a vacuum environment, the sealing material is applied in a vacuum, and then the atmosphere is opened, the spacer is dispersed, and the ultraviolet rays are irradiated. Two sheets of the substrate were bonded while being temporarily fixed by spot welding of the ultraviolet curable resin. Then, the temporarily fixed substrate was taken out from the positioning device, and a separately prepared nylon bag was placed and the inside of the bag was depressurized, i.e., a vacuum was again formed, thereby pressing the two substrates. Heating is then carried out to harden the previously applied sealing material to adhere the two substrates. Finally, it is taken out from the bag, that is, it is again opened to the atmospheric pressure state, and the liquid crystal material is sealed at atmospheric pressure to produce a liquid crystal panel. Therefore, before the completion of the application of the sealing material to the completion of the liquid crystal panel, the manufacturing process of forming the vacuum state twice and opening to the atmospheric pressure twice is employed. In addition, as a second example, when the bonding work is performed in a vacuum environment, 201111061, the sealing material is applied after the atmospheric pressure is applied, and the spacer is dispersed, and the ultraviolet rays are irradiated to the spot-welded ultraviolet curing resin to be temporarily fixed, and in a vacuum. Two substrates are bonded together. Then, it was opened to the atmospheric pressure state, and the substrate was taken out from the positioning device, and the two substrates were pressed by vacuum packaging, that is, the vacuum state was again formed. Heating is then carried out in this vacuum packed state to harden the previously applied sealing material to adhere the two substrates. Finally, it is taken out from the bag, that is, it is again opened to the atmospheric pressure state, and the liquid crystal material is sealed at atmospheric pressure to produce a liquid crystal panel. In this example, as in the above, the manufacturing step of forming the vacuum state and the second opening to the atmospheric pressure state twice is used from the application of the sealing material to the completion of the liquid crystal panel. As a result, in the case of suppressing the incorporation of air bubbles into the sealing material, the coating operation from the application of the sealing material to the bonding step or the pasting is performed in a vacuum in the first or second example. In any case of the cooperation, in the case where the thermosetting resin is pressed while being pressed before the liquid crystal injection, it is necessary to take time to form a vacuum again and create a vacuum environment. Here, when the sealing material of the thermosetting resin is cured and the two substrates are pressed, there is a manufacturing method in which the vacuum state is not required to be pressurized. However, in general, the liquid crystal injection method is mainly used in the liquid crystal injection stage in the next stage. In order to make the inside of the liquid crystal panel vacuum, the liquid crystal panel is first formed into a vacuum state in the processing chamber, and then the liquid crystal injection port is immersed in the liquid crystal and then opened. A manufacturing method in which the liquid crystal is extruded into the inside of the liquid crystal panel at atmospheric pressure to break into the atmosphere. SUMMARY OF THE INVENTION An object of the present invention is to provide an application device and an application method which can eliminate the problem and reduce dust generated by the roll of -8-201111061 while shortening the manufacturing time. (Technical means for solving the problem) In order to achieve the above object, the present invention is an application device which is provided with a weighting machine which can be provided with one or a plurality of application heads on a stand of one or a plurality of stages, and is applied. The head system includes a material storage tube filled with a spread material and a nozzle discharge port for discharging the application material from the application material storage tube, and moves the weight machine to the substrate mounted on the substrate mounting machine provided on the mount, and The application head moves the applicator head relative to the weight moving machine to move the applicator head relative to the substrate, and the applicator device that ejects the applicator from the nozzle discharge port to the substrate from the outside is fed from the outside toward the substrate mounting machine. The conveyance belt is conveyed from the feeding side, and the feeding height is maintained at the same height as the substrate mounting surface on the substrate mounting machine, and the substrate is fed out from the substrate mounting machine. Carrying the conveyance belt from the substrate mounting machine to the delivery side to maintain the delivery height at the same height as the substrate placement surface on the substrate mounting machine; and The substrate is placed in a state where the substrate is fed by the feeding-side conveyance belt, and the substrate is conveyed to the delivery-side conveyance belt, and the substrate is placed on the substrate. a moving mechanism for moving the machine, and a second moving mechanism for rotating the substrate placed on the substrate mounting machine. In addition, the application device of the present invention is provided with a plurality of weight moving machines on the frame. 'The applicator heads set on any of the plurality of weight-lifting machines will be spit out of the substrate from the different types of applicator heads set on the other weight-lifting machines. Further, in the applicator of the present invention, any one of the plurality of applicators provided on the same weight-lifting machine and the other applicator heads discharge a different type of applicator from the substrate. Further, in the smear apparatus of the present invention, the substrate mounting machine includes: a substrate moving means for moving the substrate in one direction on the substrate mounting machine, and a substrate moving means; and the substrate mounting machine A substrate position fixing means for adsorbing the substrate and fixing the position of the substrate on the substrate mounting table. Further, in the smear apparatus of the present invention, the substrate mounting machine includes: a substrate moving means for moving the substrate in one direction by strongly blowing air on the substrate mounting table; and A substrate position fixing means for fixing the substrate on the mounting table and fixing the position of the substrate on the substrate mounting table. Furthermore, in the application device of the present invention, the range of movement of the substrate mounting machine on the gantry is covered by the pressure resistant cover, and the inside covered by the pressure resistant cover is set to a larger air pressure by air suction means. The air pressure is low, and in a low-pressure environment, the substrate placed on the substrate mounting machine is smeared by the application head of the weight lifting machine. In order to achieve the above object, the present invention is a smear method in which a weighting machine for squeezing one or a plurality of application heads is provided on one or a plurality of stages, and the smear head is provided with a smear material. The applicator storage tube and the nozzle discharge port for discharging the application material from the applicator storage tube move the substrate to the substrate mounted on the substrate mounting machine -10- 201111061 provided on the gantry, and the application head is opposed to The method of applying the weighting machine to move the applicator head relative to the substrate, and ejecting the applicator from the nozzle discharge port to the substrate, from the outside, the substrate is fed toward the substrate mounting machine, from the feeding side. The conveyance belt is conveyed so that the feed height is maintained at the same height as the substrate placement surface on the substrate mounting machine, and the substrate is fed out from the substrate mounting machine to the outside. The conveyance belt is transported from the machine to the delivery side to maintain the delivery height at the same level as the substrate placement surface on the substrate mounting machine; the substrate mounting machine The position of the substrate fed by the feeding-side conveyance belt is set to the position where the substrate is conveyed to the conveyance-side conveyance belt, and is moved in a state in which the substrate is placed; and the substrate is placed on the substrate-mounted machine. The substrate of the table is rotated to correct the 0-axis offset. In addition, the smear method of the present invention is characterized in that a plurality of weight-lifting machines are arranged on the gantry, and the smear heads provided on any of the plurality of weight-shifting machines are smeared with the other weight-lifting machines. The head is spit out of the substrate for different types of spreads. Further, in the application method of the present invention, any one of the plurality of application heads provided on the same weight-lifting machine and the other application heads discharge a different type of application material onto the substrate. Further, in the smear method of the present invention, the substrate is moved in one direction by the substrate moving means formed by the rollers on the substrate mounting machine, and the substrate on the substrate mounting machine is positioned and adsorbed. The positioned substrate is fixed on the substrate mounting machine. Further, the smear method of the present invention is carried out on a substrate mounting machine, by -11 - 201111061, by blowing air strongly onto the substrate to move the substrate in one direction, thereby positioning the substrate on the substrate mounting machine. The substrate after positioning is adsorbed, and the position of the substrate is fixed on the substrate mounting machine. Furthermore, in the smear method of the present invention, the range of movement of the substrate mounting machine on the gantry is covered by the pressure resistant cover, and the inside covered by the pressure resistant cover is set to a lower atmospheric pressure and lower. In the air pressure environment, the substrate placed on the substrate mounting machine is smeared by the applicator head of the weight lifting machine. Advantageous Effects of Invention According to the present invention, application of three kinds of materials can be performed on a common workpiece machine (substrate mounting machine), for example, sealing material application, general-purpose spot welding material application, and liquid crystal dropping application. In addition, the substrate conveyance before and after the application operation is performed by feeding and feeding, thereby suppressing the winding up of the dust to a minimum, as in the case of concentrating the three functions in one device. . In this way, it is possible to shorten the moving line of the substrate by arranging a plurality of devices having a plurality of functions in a conventional manner, and using a common robot or a plurality of robots provided between the devices to carry out substrate transportation. (moving the line), it is possible to achieve the first: to reduce particle contamination during substrate transportation, to improve the yield of the liquid crystal panel, and to reduce the installation area and to effectively use the clean room. [Embodiment] -12- 201111061 The glass substrate is being developed year by year. When examining the trend toward large-scale development so far, it is known that the means for positioning in the device is gradually increasing, and the weight is only increased. . Along with this, not only the increase in the size of the motor as the drive source, but also the increase in the size of the bearings or the power transmission mechanism such as the ball screw and the guide bearing, and the increase in the size of the motor drive or the increase in the wiring scale are also caused. The problem of large-scale development of the substrate drive unit of the control series is included. On the other hand, the second problem is that the glass substrate is fed into and out of the glass substrate inside and outside the device. There are other problems with the tendency to increase the size and weight. When the manufacturing process is examined, the conventional method is to arrange the device for applying the sealing material to the glass substrate, the device for applying the electrode pad with the spot welding material, and the device for dropping the liquid crystal into the device to be applied. This is connected to a bonding apparatus of a glass substrate. Between these three types of devices, the transfer robot is used to feed and send large glass substrates. In the feeding and feeding operation, not only when moving horizontally, but also when the glass substrate is mounted on the machine table of each device during the movement between the devices, the vertical movement is repeated while the glass substrate is held. Thereby, the surrounding air flows up and down, and the dust is rolled up along with this. Therefore, in the present invention, a smear device or a smear system including one or a plurality of weight-shifting machines (door-type frame portions), one or a plurality of weight-shifting machines, is configured to be changed by a robot. The smear function of each of the above devices (hereinafter, unless otherwise specified, also includes the drip application function of liquid crystal), and the common workpiece machine is set in each weight moving machine, -13- 201111061, the glass substrate is loaded on the workpiece a machine table, and then the workpiece machine mounted with the glass substrate is disposed at a position according to each of the functions described above, thereby using the weight machine to perform the painting operation, by using the same workpiece machine on which the substrate is placed The movement of the table, the movement of the substrate between the devices for different functions, the removal of the substrate by the robot or the handling by the human hand. In addition, in the present invention, the substrate is fed toward the workpiece or the substrate is from the substrate. The delivery of the workpiece table is performed by the feeding side conveyance belt or the delivery side conveyance belt, and the conveyance belt is maintained in the conveyance belt. The height of the glass substrate when the glass substrate carrying height of the workpiece placed on the machine to be equal. As can be seen from the above, the glass substrate is placed on the same workpiece table during the application operation of the weight machine, and the workpiece is not moved relative to the workpiece table, and the dust does not move during the application to the glass substrate. Was rolled up. In addition, when the glass substrate is fed and ejected toward the workpiece machine, the conveyor belt is transported to the workpiece machine table and the workpiece conveyor is transported to the conveyor belt without changing the height (ie, being lifted or lowered). It is carried, whereby the dust will not be rolled up. Therefore, the yield of the manufactured panel can be improved. In addition, the entire space including all the weights, the workpiece table, and the drive mechanism is covered by the cover, and the pressure in the space is reduced to a lower pressure to reduce the amount of air in the space. Thereby, it is configured to further reduce the winding force of the dust and reduce the amount of dust to be rolled up. The embodiments of the present invention will be described below using the drawings. Fig. 1 is an external perspective view showing the main part of the first embodiment of the present invention, the first embodiment of the present invention, the first embodiment of the present invention, the first embodiment of the present invention, the first embodiment of the present invention. In the X-axis direction moving mechanism, 5a, 5b are linear slides '6 is a workpiece machine (substrate mounting machine), 7 is a linear slide rail, and 8 is an applicator head. In the same figure, the longitudinal direction of the gantry 1 is the X-axis direction, and the width direction is the Y-axis direction. On both sides of the gantry 1 facing the Y-axis direction, linear slides 5a along the X-axis direction are provided. 5b, between these linear slides 5a, 5b' is a path for forming a workpiece table 6 on which a glass substrate (not shown) is placed. A linear slide rail 7 extending in the X-axis direction is disposed on the passage, and a workpiece machine moving mechanism composed of a linear motor is disposed on the inner surface side of the workpiece machine 6 (not shown) Thereby, the workpiece table 6 can be along the linear slide rail 7 between the substrate feeding side a fed from the glass substrate to the substrate feeding side b from which the glass substrate is fed, along the length direction of the gantry 1 mobile. Here, the moving direction of the workpiece table 6 is the X-axis direction, but the moving direction of the workpiece table 6 is set to the T-axis direction. Therefore, the linear slide rail 7 moved by the workpiece table 6 is also provided to extend in the T-axis direction, and the workpiece machine moving mechanism for moving the workpiece table 6 is also set as the T-axis direction moving mechanism. Further, on the gantry 1, three weight-shifting machines 2a to 2c are provided so as to straddle the path of the workpiece table 6, and an X-axis direction moving mechanism composed of a linear motor is provided on each of both end sides ( Weightlifting machine moving mechanism) 4a ' 4b. By the X-axis direction moving mechanisms 4a, 4b, the weight machines 2a to 2c can be independently moved in the X-axis direction along the linear slides 5a, 5b. -15- 201111061 A plurality of applicator heads 8 are provided on one side of the beam 3 of each of the weight machines 2a to 2c. These applicator heads 8 are movable in the Y-axis direction by the Y-axis direction moving mechanism (not shown) provided on the beam 3 of the weight-shifting machines 2a to 2c on the side surface of the beam 3. In the illustrated example, it is shown that on the weight-shifting machines 2a to 2c, six applicator heads 8 are respectively provided, and three of the applicator heads 8 are close to one end side of the beam 3, and the remaining 3 are The applicator head 8 is in a state close to the other end side of the beam 3. Here, each of the weight shifters 2a to 2c is responsible for each function. The weighting machine 2a disposed closest to the substrate feeding side a is assigned to the application function of the sealing material toward the glass substrate, and the applicator heads 8 disposed thereon are respectively the applicator heads of the sealing material. Then, the weighting machine 2b disposed on the substrate feeding side a is distributed to the coating function of the spot welding material which is the electrode portion of the liquid crystal panel to be formed, and is applied to the glass substrate, and the applicator head 8 is provided as a spot welding material. Smear the head. The weighting machine 2c disposed closest to the substrate sending side b is assigned to the drip application function of the liquid crystal to the glass substrate, and the applicator head 8 is disposed thereon, and the liquid crystal is dropped into the seal applied to the glass substrate. The applicator head in the area surrounded by the material. The glazed glass substrate (not shown) is fed from the substrate feed side a by a feed side conveyance belt (not shown). At this time, the workpiece stage 6 is placed on the feeding side a, and the fed glass substrate is transferred from the feeding side conveyance belt to the workpiece stage 6. In this manner, the workpiece table 6 on which the glass substrate is placed is sequentially moved to a predetermined position by the T-axis direction moving mechanism, and each of the applicator heads of the weight moving machine 2a is set each time at each predetermined position. 8 Applying the sealing material to the glass base 16-201111061 plate placed on the workpiece machine table 6 and applying the spot welding material by the respective applicator heads 8 of the weight lifting machine 2b, by the applicator heads 8 of the weight moving machine 2c To drip into the smear LCD. Then, the workpiece stage 6 is positioned on the substrate delivery side b, and the processed glass substrate is transferred from the workpiece stage 6 to the delivery side conveyance belt (not shown) to be conveyed and conveyed. Fig. 2 is a view schematically showing the configuration of the entire configuration of the first embodiment of the application device and the application method of the present invention, wherein 9 is a cover, 1 is a substrate feed port, 11 is a substrate delivery port, and 12 is a fan filter unit. 13 is a Z-axis moving machine' Μ is a nozzle, 15 is a substrate adsorption flat plate, 16 is a roller, 17 is a glass substrate '18a is a feeding-side conveying conveyor, and 18b is a feeding-side conveying conveyor' corresponding to the first In the drawings, the same drawing numbers are attached and overlapping descriptions are omitted. In the same figure, the range in which the weight machines 2a to 2c on the gantry 1 and the workpiece table 6 are moved is covered by the cover 9. At the top of the cover 9, a plurality of fan filter units 12 are provided. The substrate feed side a of the cover 9 is provided with a small opening for feeding the glass substrate 17 conveyed from the feed side conveyance belt 18a into the cover 9 (slightly larger than the width of the glass substrate 17) The substrate feed port 10 having the width and the thickness of the glass substrate 17 having a slightly larger thickness is placed on the workpiece table 6 from the glass substrate 17 fed from the substrate feed port 10. Further, the substrate supply side b of the cover 9 is provided to be used to discharge the smeared (smeared) glass substrate 17 from the inside of the cover 9 to the outside, and has the same size as the substrate feed port 10 The substrate opening/receiving port 11 having a small opening, and the glazed glass substrate 17 sent from the substrate feeding port 11 are mounted on the feeding-side conveying belt 18b. Here, the substrate mounting surface on the upper surface of the workpiece table 6 and the substrate mounting surface of the conveyance conveyor belts -17-201111061 18a and 18b are the same height surface (surface of the same plane), and the substrate of the workpiece machine table 6 The mounting surface is composed of the substrate adsorption flat plate 15 and the roller 16 as will be described later. The conveyance belts 18a and 18b may be used in addition to the roller type conveyance belt having the guide rollers. Conveyor belt, or walking beam type. According to this configuration, when the glass substrate 17 conveyed by the feeding-side conveyance belt 18a is fed into the lid 9, the conveyance belt 18a is conveyed by the feeding side, and the glass substrate 17 is held at this time. Pressed into the cover 9 from the feed port 1 at a height, and when the glass substrate 17 reaches the workpiece table 6, it moves on the workpiece table 6 by holding the roller 16 of the height up to the present, and The workpiece table 6 on which the glass substrate 17 is loaded is moved in the T-axis direction by the T-axis direction moving mechanism, and the position is set by being placed at a predetermined position and adsorbed on the substrate suction flat plate 15 at a fixed position. In the position A on the gantry 1 near the substrate feeding side a, at this position, the sealing material is applied by the applicator head 8 of the weight lifting machine 2a, and a plurality of pieces are drawn on the glass substrate 17 (this time 6) The pattern of the sealed seal material. In the pattern of the sealing material, the sealing material is discharged from the nozzle 14 of the Z-axis moving machine table 13 mounted on the applicator head 8 while the applicator head 8 is moved along the Y-axis direction moving mechanism. The beam 3 (Fig. 1) of the heavy machine 2a is moved in the Y-axis direction, and the weight moving machine 2a is moved in the X-axis direction by the X-axis direction moving mechanisms 4a, 4b (Fig. 1), thereby applying the applicator head 8 moves in the X-axis direction, and the nozzle 14 is moved along the trajectory of the rectangular pattern to draw. At this time, the height of the Z-axis movement -18 - 201111061 in the Z direction is adjusted by the Z-axis direction moving mechanism (not shown), and the sealing material discharge opening of the nozzle 14 is at a height from the surface of the glass substrate 17. Always kept at the required height. Next, the workpiece table 6 is moved in the T-axis direction by the T-axis direction moving mechanism, and the position is set at the B position of the center portion of the gantry 1, at which position the applicator head of the weight-removing machine 2b is used. 8. For each rectangular drawing pattern of the sealing material on the glass substrate 17, the spot welding material of the electrode agent is applied to a predetermined position (for example, a position of four corners) on the outer periphery of the drawing pattern. At this time, similarly to the above, the nozzle 14 is set to the spot welding material of the drawing pattern to which each sealing material should be applied by the movement of the applicator head 8 provided on the weight-shifting machine 2b in the X and Y-axis directions. At this position, the electrode material is discharged from the discharge port of the nozzle 14. At this time, the height of the discharge port of the nozzle 14 from the surface of the glass substrate 17 is constantly maintained at a predetermined height as described above. Then, the workpiece table 6 is moved in the T-axis direction by the T-axis direction moving mechanism, and the position is set to the C position on the gantry 1 near the substrate feeding side b, at this position, by the weight moving machine 2 The applicator head 8 of c draws a pattern on each of the seal members on the glass substrate 17, and performs drip application of the liquid crystal in a region surrounded by the drawing pattern. At this time, similarly to the above, the nozzle 14 is set in the X and Y-axis directions of the applicator head 8 provided on the weight-shifting machine 2c, and the liquid crystal is dropped into the drawing of each sealing material. At a position in the region surrounded by the pattern, liquid crystal is dropped from the discharge port of the nozzle 14 at this position. At this time, as in the above, the discharge port of the nozzle 14 is always kept at a predetermined height from the surface of the glass substrate 17. By the above operation, the smear processing to the glass substrate 17 is completed, and *19-201111061, the glazed glass substrate 17 on the workpiece table 6 is discharged from the substrate delivery port 1 to the outside of the lid 9. The glass substrate 17 which is sent out from the substrate delivery port 6 to the outside of the cover 9 by the roller 16 of the workpiece stage 6 is pushed out at a height maintained at this time, and when the glass substrate 17 reaches the delivery side conveyance belt 18b At the time of this, at the height at this time, it moves on the delivery side conveyance belt 18b, and fixes a position in predetermined position. In this manner, the glass substrate 17 is moved from the feeding side conveyance belt 18a to the workpiece table 6 in the cover 9, or from the workpiece table 6 in the cover 9 to the delivery side conveyance belt. In the case of 18b, it is not necessary to use a robot or a human hand, and it can be performed only by moving in the T-axis direction in which the height is kept constant, so that the air in the cover 9 does not flow up and down, and the dust is not rolled up. Further, similarly, the movement of the glass substrate 17 between the transfer machines 2a, 2b, and 2c to which the different functions are assigned may be performed only by the movement in the T-axis direction mounted on the workpiece table 6, so that the cover The air inside 9 does not flow up and down, and the dust will not be rolled up. Therefore, it is possible to prevent the dust which is rolled up from adhering to the application surface of the sealing material or the like of the glass substrate 17, and it is possible to avoid a decrease in panel yield due to adhesion of dust. In addition, the devices (the weight shifters 2 a to 2 c ) which apply the different application processes of the application of the sealing material, the application of the spot material of the electrode material, and the dripping of the liquid crystal are placed on the same stand 1 and are loaded. When the glass substrate 17 is moved between the devices in the state of the workpiece stage 6, the individual smearing process is performed in each device, so that it can be shortened compared with the transportation of the glass substrate between devices using a robot or the like. From the time when a device moves to the next device and starts processing, the time required for manufacturing is shortened, and the interval between the devices can be reduced by -20-201111061, so that the devices performing the different functional processing are all Can be miniaturized. 3 is an external perspective view showing a specific example of the workpiece machine table 6 of FIGS. 1 and 2, 15a to 15e are substrate adsorption plates, 16a to 16d are rollers, and 19 are substrate mounting members, 20a to 20d. For the connecting member, 21 is an air absorbing hole, 22a, 22b are substrate positioning pins, 23 is a cross roller bearing, 24 a to 2 4d are ΧΥ0 axis direction micro-motion mechanism, 25 is a cross roller bearing, and 26 is an orthogonal bearing. In the same figure, in the workpiece machine table 6, a plurality of (here, five) substrate adsorption plates 15a to 15e which are arranged in parallel in the X-axis direction and are arranged at equal intervals in the Y-axis direction are respectively The substrate mounting member 19 has a structure in which the connecting members 20a to 20d are connected in an elongated flat shape. The substrate adsorption flat plates 15a to 15e correspond to the substrate adsorption flat plate 15 in Fig. 2, and have a rectangular cross-sectional shape in a rectangular or square shape, and the connection members 20a to 20d are thinner than the substrate adsorption flat plates 15a to 15e. The portions of the connecting members 20a to 2〇d form the valley portion of the substrate mounting member 19. The valley portions (i.e., the upper surface sides of the connecting members 20a to 20d) are respectively disposed with rollers 16a to 16d covering the entire length of the valley portion in the Y-axis direction. These rollers 16a to 16d correspond to the rollers 16 in Fig. 2, and constitute a glass substrate 17 (Fig. 2) placed on the substrate mounting member 19 in the T (X) axis direction. The moving substrate moving mechanism is rotationally driven by a rotary drive mechanism not shown. Each of the upper surfaces of the substrate adsorption plates 15a to 15e is provided with a plurality of (four in the drawings) for adsorbing the glass substrate 17 (Fig. 2-21 - 201111061) to fix the position of the air adsorption hole 21, Further, on the end side in the X-axis direction of the substrate mounting member 19, that is, the substrate adsorption plate 1 5 e which is located at the foremost end opposite to the substrate feeding side a (Fig. 1 and Fig. 2). The outer side surface is provided with a plurality of (here, two) substrate positioning pins 22a, 22b. Further, the center portion of the substrate mounting member 19 is supported by the cross roller bearing 23 as a rotating member on the inner surface side, and the cross roller bearing on the inner surface of the substrate mounting member 19 23 is a position in the different directions and equidistant from each other, and is supported by the micro-motion mechanism 2 4a~2 4d in the 0-axis direction. The cross roller bearing 23 is configured such that the substrate mounting member 19 is rotated in the 0-axis direction around the support position, and the ΧΥ-axis direction micro-motion mechanisms 24a to 24d are constituted by the cross roller bearing 25 and the orthogonal bearing 26. And the substrate mounting member 19 is rotated in the 0-axis direction around the center portion by the cross roller bearing 23, and the support position is in the 0-axis direction by the ΧΥ0-axis direction micro-motion mechanism 2 4 a to 2 4d. Rotate up and move in the direction of the XY axis. Thereby, the substrate mounting member 19 can be rotated centering on the center position, and the deviation in the 0-axis direction of the glass substrate 17 (Fig. 1) mounted on the workpiece stage 6 can be adjusted. The substrate mounting member 19 is placed on a base (not shown), and a T-axis direction moving mechanism to be described in FIG. 1 is provided on the inner surface side of the base, whereby the workpiece machine can be placed. 6 moves in the T-axis direction. Further, the rollers 16a to 16d are fixed to the base, but the substrate mounting members 19 and the substrate positioning pins 22a and 22b composed of the substrate suction flat plates 15a to 15e and the connecting members 20a to 20d are Together with the cross roller bearing 23 and the ΧΥ0 axis direction micro-motion mechanism 24a~2 4d, it can move up and down -22-201111061 with respect to the base. Therefore, as described in FIG. 2, when the workpiece machine table 6 is positioned on the substrate feed port 10 side of the cover 9 and the glass substrate 17 is introduced from the feed side conveyance belt 18 8 a, the substrate mounting member 19 is lowered. In a state where the substrate positioning pins 22a and 22b are in an ascending state, the rollers 16a to 16d and the substrate positioning pins 22a and 22b are located on the upper surface of the substrate adsorption flat plates 15a to 15e of the substrate mounting member 19. The state that protrudes further upwards. At this time, the rollers 1 6 a to 16 d are in a state of being rotationally driven, and as described in Fig. 2, the glass substrate 17 is pressed into the workpiece table 6 from the feeding side conveyance belt 18a. When the glass substrate 17 is loaded on the rotating rollers 16a to 16d, the glass substrate 17 is moved in the direction of the substrate positioning pins 22a and 22b by the rotation of the rollers 16a to 16d. When the glass substrate 17 is in contact with the substrate positioning pins 22a and 22b, the rotation of the rollers 16a to 16d is stopped, and the substrate mounting member 19 is raised to be in a state in which the glass substrate 17 is placed on the upper surface. In the case where the adsorption operation is performed as the substrate position fixing mechanism, the glass substrate 17 is adsorbed on the upper surface of the substrate mounting member 19, and is fixed to the workpiece stage 6. Further, as described in FIG. 2, when the workpiece stage 6 moves toward the substrate delivery side b of the gantry 1, and the glazed glass substrate 17 is moved to the delivery side conveyance belt 18b via the substrate delivery port 11 The substrate positioning pins 22a and 22b and the substrate mounting member 19 are lowered, and the rollers are rotated by 1 6 a to 16 d while the glass substrate 17 is mounted on the rollers 16 6 to 16 d. . Thereby, the glass substrate 17 is moved from the workpiece stage 6 to the delivery side conveyance belt 18b through the substrate discharge port 1 1 . -23- 201111061 In this way, the glass substrate 17 can be transferred from the feeding-side conveyance belt 18a to the workpiece machine table 6 without using a robot or a human hand, and the smear can be processed without using a robot or a human hand. The glass substrate 17 is transferred from the workpiece stage 6 to the delivery-side conveyance belt 18b. Fig. 4 is an external perspective view showing another specific example of the workpiece machine table 6 of Figs. 1 and 2, 27 is a substrate adsorption plate, 27a is a substrate mounting surface, 27b is a front side surface, and 28 is an air ejection/adsorption hole. The parts corresponding to those in FIG. 3 are attached with the same drawing numbers and overlapping descriptions are omitted. In the specific example, in the specific example, one flat substrate adsorption flat plate 27 is formed by the cross roller bearing 23 and the ΧΥ0 axis direction micromotion mechanism 24 a to 24d as in the specific example shown in Fig. 3 . Supported on a base that is not shown in the figure. However, the substrate is attracted to the flat plate 27, and its position and height are fixed with respect to the base. The upper surface of the substrate adsorption flat plate 27 has a flat surface and is a mounting surface 27a of a glass substrate (not shown). The substrate mounting surface 27a has an area in which the entire glass substrate can be placed. The substrate suction plate 27 is closer to the front side surface 27b side opposite to the substrate feeding side a (Fig. 2), and is provided in plural as in the specific example shown in Fig. 3 (here, two) Substrate positioning pins 22a, 22b. The substrate positioning pins 22a, 22b are the same as the specific example shown in the previous FIG. 3, and are movable up and down with respect to the base, and as illustrated in FIG. 2, when the workpiece machine table 6 is placed on the substrate of the cover 9 When the glass substrate 17 is introduced from the feeding side conveyance belt 18a on the inlet 10 side, the substrate positioning pins 22a and 22b are in a state of being raised, and are protruded upward from the substrate mounting surface 27a of the substrate suction flat plate 27. Thereby, the glass substrate 17 fed from -24 to 201111061 from the substrate feed port 1 (Fig. 2) can be positioned with respect to the substrate suction flat plate 27 by abutting on the substrate positioning pins 22a, 22b'. Further, as described in FIG. 2, when the workpiece stage 6 is located on the substrate feed opening 11 side of the cover 9 and the glass substrate 17 is fed from the workpiece stage 6 to the delivery side conveyance belt 18b, the substrate positioning pin 22a, 22b is in a lowered state and is located below the substrate mounting surface 27a of the substrate adsorption flat plate 27. The substrate mounting surface 27a' of the substrate adsorption flat plate 27 is provided with air ejection/adsorption holes 2 8 at predetermined intervals along the X (T) axis direction and the Y-axis direction (in FIG. 4, the X-axis directions are respectively displayed). There are nine, and seven in the Y-axis direction, but it is not limited to this. When the glass substrate is placed on the substrate mounting surface 27a in a state in which the glass substrate is positioned, the air ejection/adsorption hole 28 has a function of an air suction hole, and the glass substrate is adsorbed to the substrate mounting surface by air. 2 7a and fixed. Further, when the feeding side conveyance belt 18a is fed into the glass substrate 17, and when the glass substrate 17 is sent to the delivery side conveyance belt 18b, the glass substrate 17 is placed on the substrate mounting surface 27a on the X axis (T axis). In the direction of movement, the air ejection/adsorption hole 28 has a function of an air ejection hole. Fig. 5 is a view showing a specific example of the configuration of the air ejection/adsorption hole 28 of Fig. 4, 29 is an air suction hole, and 30 is an air ejection hole, and the portion corresponding to the aforementioned figure is attached with the same figure number. Duplicate descriptions are omitted. In Fig. 5(a), the air ejection/adsorption holes 28 are connected to the air adsorption holes 29 and the air ejection holes 30. The air suction hole 29 is sucked by a vacuum driving source such as a vacuum pump or the like (not shown), and attracts the air on the substrate mounting surface 27a side of the substrate adsorption flat plate 27 as indicated by an arrow. - 201111061 In the outlet hole 30, air is blown out from the air ejection/adsorption hole 28 of the substrate adsorption plate 27 by an air driving source (not shown) such as air pumping. Here, the air suction hole 29 is provided in a direction perpendicular to the substrate mounting surface 27a, and the air ejection hole 30 is provided obliquely with respect to the substrate mounting surface 27a in the T (X) axis direction, whereby the air is supplied from the air. The air ejected from the ejection holes 30 is ejected obliquely from the air ejection/adsorption hole 28 in the T (X) axis direction with respect to the substrate mounting surface 27a. Fig. 5(b) shows the glass substrate 17 when the glass substrate 17 is introduced from the feeding side conveyance belt 18a to the workpiece machine table 6, as shown in Fig. 2, and the glazed glass substrate 17 is removed. The state of the air ejection/adsorption hole 28 when the workpiece table 6 is moved to the delivery side conveyance belt 18b. At this time, the clean air in which the amount of dust is reduced is ejected from the air ejection hole 30, and the air is ejected from the air ejection/adsorption hole 28 in the T (X) axis direction with respect to the substrate mounting surface 27a as indicated by a broken line arrow. It is ejected and blown against the inner surface of the glass substrate 17. Thereby, the glass substrate 17 is lifted only a little (for example, about 2 μm) from the substrate mounting surface 27a, and is pressed in the z-axis direction. Therefore, the glass substrate 17 is conveyed in the 轴 (axis) axis direction along the substrate mounting surface 27a. Fig. 5(c) shows a state in which the glass substrate 17 positioned on the workpiece stage 6 is fixed to the substrate mounting surface 27a of the workpiece stage 6 as described in Fig. 2 . At this time, air is sucked from the air suction hole 29, and as described in FIG. 5(b), the glass substrate 17 is conveyed in the T (X) axis direction by the substrate positioning pins 22a, 22b (fourth In the case where the substrate mounting surface 27a is positioned at -26-201111061, the ejection of air from the air ejection hole 30 is stopped, and instead, air is sucked from the air suction hole 29. Thereby, the glass substrate 17 is placed on the substrate mounting surface 27a, and the glass substrate 17 is fixed to the substrate mounting surface 27a by a further air suction. In this way, the glass substrate 17 is placed in the T (X) axis direction with respect to the substrate mounting surface 27a by the action of air, and the glass substrate 17 is fixed to the substrate mounting surface 27a on the substrate adsorption flat plate 27, A substrate moving mechanism and a substrate position fixing mechanism formed by the air ejection/adsorption holes 28 are provided. Further, when the glazed glass substrate 17 in the state shown in Fig. 5(c) is transported to the delivery-side conveyance belt 18b (Fig. 2), it is only necessary to show it as shown in Fig. 5(c). The state is switched to the state shown in Fig. 5(b). The air suction/stop in the air suction hole 209 and the air discharge/stop in the air ejection hole 30 can be performed by the switching operation according to the solenoid valve. The air suction hole 29 and the air ejection hole 30 may be respectively provided on the substrate mounting surface 27a'. Further, in FIG. 5, the air hole which is inclined like the air ejection hole 30 may be communicated with the air ejection/adsorption hole 28, The air hole is used for both air adsorption and air ejection. In this specific example, it is not necessary to have the roller 16' as in the specific example shown in Fig. 3, and it is not necessary to have a driving means for moving the substrate mounting member 19 up and down, and the configuration can be further simplified. Fig. 6 is a perspective view showing an enlarged view of a main part of a specific example of the applicator head 8 of Fig. 1 '31 is a applicator storage tube' 32 is a nozzle holder, and 33 is a distance meter corresponding to the part of the aforementioned figure. Attach the same figure number and omit the description of the weight -27- 201111061. In the same figure, the applicator storage tube 31 and the nozzle holder 32 and the distance meter 33 provided with the nozzles 14 are provided on the Z-axis moving table 13 (Fig. 2). In the applicator head 8 of the weight-lifting machine 2a, a sealing material is stored in the applicator storage container 31 as a coating material, and in the applicator head 8 of the weight-shifting machine 2b, a conductive liquid is stored in the applicator storage container 31 as a coating material, and is moved. In the applicator head 8 of the heavy machine 2c, liquid crystal is accommodated in the applicator storage tube 3 1 as a coating material. The distance meter 3 measures the surface (upper surface) of the glass substrate 17 mounted on the workpiece machine table 6 (Fig. 1) from the front end portion of the nozzle 14 by a non-contact triangulation method. distance. That is, a light-emitting element is provided in the frame of the distance meter 33, and the laser light emitted from the light-emitting element is reflected by the measuring point S on the glass substrate 17, and is sensed by the photosensitive element also disposed in the frame. And the measurement should be made due to the position of the light. Further, the measurement point S of the laser light on the glass substrate 17 and the position directly below the nozzle 14 are offset by a slight distance Δ X and Δ Y on the glass substrate 17, but the deviation of the distance is a negligible glass substrate. 1 7 concave on the surface. In the range of the convexity difference, there is almost no difference between the measurement result of the distance meter 33 and the distance from the tip end portion of the nozzle 14 to the surface (upper surface) of the glass substrate 17. Therefore, by controlling the Z-axis moving machine table 13 (Fig. 2) based on the measurement result of the distance meter 33, the unevenness (undulation) on the surface of the glass substrate 17 can be matched, from the front end portion of the nozzle 至 to the glass substrate 17 The distance (interval) from the surface (upper surface) is kept constant. In this manner, the distance (interval) from the front end portion of the nozzle 14 to the surface (upper surface) of the glass substrate 17 is maintained constant, and the application per unit time ejected from the nozzle -28-201111061 nozzle 14 is maintained. The amount of the material is maintained constant, and the width and thickness of the pattern drawn on the glass substrate 17 can be made uniform. Further, although not shown in the drawing, a clean cylinder and an image recognition camera having a light source capable of illumination are used for alignment of the glass substrate 17 in addition to the parallel adjustment and interval adjustment of each nozzle 14. Since the shape of the drawing pattern of the spreader is recognized or the like, it is provided so as to face the glass substrate 17. Returning to Fig. 2, in this embodiment, a control unit for controlling each of the above units is provided. That is, a main control unit for controlling the linear motor for driving the respective mechanisms and the motor for moving the table is provided inside the gantry 1. In the main control unit, a sub-control unit is connected to the intermediate cable. The sub-control unit controls the Z-axis servo motor for driving the Z-axis moving machine 13 (Fig. 2). Fig. 7 is a block diagram showing a configuration of a main control unit and a specific example of the control, 34a is a main control unit, 34aa is a microcomputer, 34ab is a motor controller' 34ac is an image processing controller, and 34ad is an external interface. 34ae is a data communication busbar '34af is a X-axis motor driver for moving weights (hereinafter referred to as an X-axis driver), and 34ag is a γ-axis motor driver for smear head movement (hereinafter abbreviated as γ-axis driver) 34411 is a 0-axis motor driver for workpiece machine rotation (hereinafter abbreviated as 0-axis driver)' 34ai is a τ-axis linear motor driver for workpiece machine movement (hereinafter abbreviated as T-axis driver), 34b is a vice Control unit, 34c is a hard disk, 34d is a USB (Universal Serial Bus) memory 34f is a display '34g is a keyboard, 35 is a regulator, 36 is a valve unit, -29- 201111061 37 Like the identification camera, 38 is the communication cable. In the same figure, the main control unit 34a includes a microcomputer 34aa, and a Y-axis driver 34ag for controlling the Y-axis direction moving mechanism on the beam 3 of the weight-shifting machines 2a to 2c, and for driving the weight-shifting machine 2a. The X-axis driver 34 af of the X-axis direction moving mechanism of 2c, the 0-axis driver 34 ah that drives the workpiece machine table 6 (FIG. 1) on which the glass substrate 17 is mounted in the z-axis direction, and the workpiece machine table 6 at T The motor controller 34ab of the T-axis driver 34ai driven in the axial direction, and the image processing controller 34ac and the sub-controller 34b and the control smear for processing the image signals obtained in the image recognition camera 3*7 The regulator 35 of the application operation of the coating material such as the sealing material of the head 8 (Fig. 1) and the external interface 34ad for communicating with the valve unit 36; the microcomputer 34aa and the motor controller 34ab and the image processing control The device 34ac and the external interface 34ad are connected to each other via a data communication bus 34ae. Further, the sub-control unit 34b is connected to the external interface 34ad via a communication cable 38. Further, the main control unit 34a is connected to a USB memory 34d or a hard disk 34c as an external memory device, a display 34f, a keyboard 34g, and the like. The data input from the keyboard 34g is indicated by the display 34f, and is stored in the hard disk 34c or the USB memory 34d. Further, although not shown in the drawing, the microcomputer 34aa includes a main calculation unit and a ROM for storing a processing program for performing smear drawing described later, and a processing result stored in the main calculation unit and an external interface 34ad. The RAM of the input data of the motor controller 34ab, and the input/output section for performing data exchange with the external interface 34ad and the motor controller 34ab. As the Y-axis direction of each of the applicator heads 8 driven by the Y-axis driver 34ag, the linear motor of the moving mechanism and the X-axis direction of the weight-shifting machines 2a to 2c (Fig. 1) driven by the X-axis driver 34af The linear motor of the moving mechanism 4a, 4b is provided with a linear ruler for detecting the position of each of the applicator head 8 and the weight moving machines 2a to 2c, and supplies the detection result to the Y-axis driver 34ag and the X-axis driver, respectively. The 34af is used to control the position of the applicator head 8 in the Y-axis direction and the X-axis direction. In addition, similarly, the rotary drive motor of the workpiece table 6 (Fig. 1) driven by the x-axis drive 34 ah has an encoder for detecting the amount of rotation of the glass base plate 17 and This detection result is supplied to the zero-axis driver 34ah to control the direction of the glass substrate 17. Further, as a linear motor that moves the T-axis direction of the workpiece table 6 driven by the T-axis driver 34ai, a linear ruler for detecting the position of the workpiece table 6 is provided, and the detection result is obtained. The position control of the workpiece table 6 is performed by supplying it to the T-axis driver 3 4ai. By the position control, the workpiece table 6 performs the position for loading the substrate feeding side a of the glass substrate 17 to be fed as shown in FIG. 2, and the glass substrate for loading the applied smear. 17 Position setting at the A position, the B position, and the C position at the position of the substrate feeding side b. Further, although not shown in Fig. 7, the rotary drive mechanism of the rollers 16a to 16d with respect to the workpiece table 6 shown in Fig. 3 is provided, and the substrate mounting member 19 or the substrate positioning pin. The up and down movement drive mechanisms 22a, 22b are also controlled by the motor controller 34ab. Figure 8 is a block diagram showing a specific example of the sub-control unit 34b of Figure 7, 34ba is a microcomputer, 34bb is a motor controller, 34bc is an external interface, 34 4bd is a data communication bus, and 3 9 is Z The driver for the shaft motor (hereinafter, abbreviated as a Z-axis drive) is attached to the same drawing, and the overlapping description will be omitted. In the same figure, the sub-controller 34b includes a microcomputer 34ba and a motor controller 34bb, and an external input of the distance data obtained by the distance meter 33 (Fig. 6) or an external signal transmission with the main control unit 34a. The interfaces 34bc are interconnected via a data communication bus 34be. Further, although not shown in the drawing, the microcomputer 34ba includes a main calculation unit and a height control for storing the nozzles 14 (second and sixth figures) from the surface of the glass substrate 17 when the painting is described later. The ROM of the processing program, and a RAM storing the processing results in the main computing unit and the input data from the external interface 34bc and the motor controller 34bb, and an input/output portion for performing data exchange with the external interface 34bc and the motor controller 34bb. The Z-axis motor driver 39 controlled by the motor controller 34bb is provided in each of the applicator heads 8 (Fig. 1) and is used to drive the Z-axis servo motor, and the Z-axis servo motor is incorporated therein. An encoder that detects the amount of rotation and sends the detection result back to the Z-axis driver 39 to perform height position control of the nozzle 14. Under the cooperative control of the main control unit 34a and the sub-control unit 34b, each motor ( The linear motor, the Z-axis servo motor, the zero-axis servo motor, and the like are moved and rotated based on the data input from the keyboard 34g (Fig. 7) and stored in the RAM of the microcomputer 34a, whereby the X-axis direction moving mechanism 4a, 4b moves the weight-shifting machines 2a to 2c only by an arbitrary distance in the X-axis direction, and moves the nozzles 14 (Fig. 2) up and down to move the Z-axis moving machine table 13 (Fig. 2) by the weight-shifting machine 2a. Y-axis of the applicator head 8 provided on the beam 3 (Fig. 1) of ~2c - 32-201111061 The moving mechanism moves only a certain distance in the γ-axis direction, and is set to the coating material during the movement. The pressure of the cylinder 3 1 (Fig. 6) is continuously pressurized, from the discharge port at the front end of the nozzle 14 A liquid coating material such as a sealing material is discharged, and a desired pattern is drawn on the glass substrate 17 in accordance with the coating material. In the horizontal movement of the nozzle 14 toward the x-axis direction, the distance meter 3 3 measures the interval between the nozzle 14 and the surface of the glass substrate 17, and maintains the interval at a constant interval by the Ζ axis. The up and down movement of the moving machine table 13 controls the height of the nozzle 14. The control of the x-axis direction by the sub-control unit 3 4 b differs depending on the function of each weight machine. The coating head 8 attached to the weight moving machine 2a drives the nozzle 14' of the applicator head 8 of the sealing material up and down by the movement in the Z-axis direction, and also moves in the Z-axis direction. The nozzle 14 of the applicator head 8 for spot welding of the electrode portion is driven up and down, and the weight of the applicator head 8 for liquid crystal dropping is driven up and down by the movement in the Z-axis direction. 14. The applicator head 8 for applying the sealing material of the weight lifting machine 2a will be described as an example. Under the cooperative control of the main control unit 34a and the sub-control unit 34b, the motors are based on the data input from the keyboard 34g and stored in the RAM of the microcomputer 34aa. To move *rotate, thereby moving the glass substrate 17 held on the workpiece stage 6 (Fig. 1) by an arbitrary distance in the X-axis direction, and moving the weighting machines 2a, 2b in the X-axis direction moving mechanisms 4a, 4b Moving in the X-axis direction, the nozzle 1 4 (Fig. 2) supported by the Z-axis moving machine table 13 (Fig. 2), which moves the nozzle 14 up and down, moves only an arbitrary distance in the X-axis direction. During this movement, the pressure applied to the applicator storage container 31 (Fig. 6) is continuously -33-201111061. Pressing 'spraying the applicator from the discharge port of the tip end of the nozzle 1 4, that is, the sealing material' is in the glass. A desired pattern of the spreader is applied to the substrate 17. In the horizontal movement of the nozzle 14 in the X-axis direction, the distance between the nozzle 14 and the glass substrate 17 is measured by the distance meter 33 (Fig. 6), and the interval is often maintained constant by the Z-axis. The vertical movement of the moving machine table 13 controls the position of the nozzle 14 in the Z-axis direction. Fig. 9 is a flow chart showing a specific example of the overall operation of the first embodiment. Hereinafter, this operation will be described with reference to Fig. 2 and the like. In the same figure, when the operation is started (step S100), the T-axis driver 34ai is first operated to move the workpiece table 6 closer to the substrate feeding side a of the gantry 1, that is, to the A position of the second drawing, and at the same time The weight machines 2a and 2b are evacuated to the substrate delivery side b, that is, to the C position of FIG. 2 (step S101). Next, the glass substrate 17 is pulled toward the workpiece table 6 from the feeding side conveyance belt 18 a, and the weight machine 2a is moved to a position where the glass substrate 17 is positioned, i.e., near the A position of Fig. 2 . The glass substrate 17 is temporarily positioned at a predetermined position determined by the substrate positioning pins 22a and 22b (Fig. 3, Fig. 4) of the workpiece table 6, and is provided by the air suction hole 21 (Fig. 3). The air ejection/adsorption hole 28 (Fig. 4) is adsorbed and fixed (step S102, and then the mark on the glass substrate 17 is recognized by the image recognition camera 37 (Fig. 7), and positioned by the 0-axis driver 34ah. (Fig. 7), the positional deviation in the 0-axis direction is corrected by the cross roller bearing 23 provided on the lower surface of the workpiece stage 6 and the 微0-axis direction micro-motion mechanisms 24a to 24d (step S1 03). 34- 201111061 When the positional deviation is correctly corrected, the Y-axis drive 34ag (Fig. 7) and the Z-axis drive 39 (Fig. 8) are actuated, whereby the Y-axis moving mechanism and the Z-axis moving machine on the weight-shifting machine 2a are caused. The table 13 operates to set the height of the nozzle 14 (Fig. 6) of the applicator head 8 to the drawing height of the pattern, and applies the sealing material to the glass substrate 17 by the applicator head 8 (step S104). After the processing, the X-axis driver 34af is caused to move the workpiece table 6 to the middle position of the gantry 1. In other words, the position B of Fig. 2 is simultaneously retracted to the feeding side a' of the gantry 1 near the feeding side a' of the gantry 1 (step S105). 2b is moved to the intermediate position of the gantry 1, that is, near the B position of Fig. 2, and the spot welding material application of the electrode material is performed (step S106). After the application of the spot welding material is finished, the workpiece machine table 6 is moved to the gantry 1 The delivery side b', that is, the C position in FIG. 2, and the weighting machine 2b after the spot welding material application process of the end electrode material is retracted to the feeding side a near the gantry, that is, near the A position of FIG. (Step si〇7) Next, the weight moving machine 2c is moved to the delivery side b close to the gantry 1, that is, near the C position of the second figure, the liquid crystal is dropped into the interior surrounded by the sealing material (step S1 0 8). Here, the series of application operations are completed, and the glass substrate i 7 is moved from the workpiece stage 6 to the delivery side conveyance belt 18b (step sl9). Then, it is determined whether or not to stop all the above steps (step S110), when When all the glass substrates 1 7 end the series of processes, all of them are finished. In the first embodiment, the six applicator heads 8 are provided in the -35-201111061 weight-lifting machine, and the applicator head is constructed by a linear motor. The Y-axis moving mechanism for 8 can be configured to move in the longitudinal direction (the y-axis direction) on the beam 3 of the weight moving machine. The stop position of the applicator head 8 is changed by the cymbal moving mechanism. This supports the application of a large number of glass substrates 17 having a size of 2 to 3 (m) square to produce a plurality of panels. In this embodiment, six applicator heads 8 are provided in each of the weight-lifting machines 2a to 2c, and the same weight-lifting machine, for example, six applicator heads 8 of the weight-shifting machine 2a are used as the sealing material, but it can be used as needed. In the case, all of the six applicator heads 8 of the weight-shifting machine 2a and the six applicator heads 8 of the weight-shifting machine 2b are selected for use as a sealing material or for spot welding. Further, in this embodiment, the applicator heads 8 provided in the same weight-lifting machine are all configured to apply the same applicator to the glass substrate 17, but may be provided in the same weight-weighting machine to apply different types of applicators. The smear head makes the weight machine have different functions. For example, in the weight-shifting machine 2a, three of the six applicator heads 8 may be used as an applicator head for discharging the sealing material, and the remaining three applicator heads 8 may be used as an applicator head for discharging the electrode material. The weight-shifting machine 2a has two different functions of the application function of the sealing material and the application function of the electrode material. Further, in this case, it is also possible to provide only one weight moving machine on the base 1, and in the weight moving machine, the same applies to the application function of the sealing material, the application function of the electrode material, and the dripping application function of the liquid crystal. . Further, the six applicator heads 8 provided in the weight-shifting machine 2a can be stopped, and the weight-removing machine 2a can be retracted to one of the stroke end sides, and the applicator heads 8 of the two weight-shifting machines 2b and 2c can be utilized and set to Teaching materials can be used in a random manner. -36- 201111061 According to the first embodiment, the application of a plurality of materials is performed on the common workpiece table 6, for example, the sealing material is applied and the conductive spot material is applied, and the liquid crystal is dripped and applied. The three functions are concentrated in one device. Fig. 10 is a structural view showing the entire configuration of a second embodiment of the application device and the application method of the present invention, 40 is a pressure resistant cover, 41 a is a substrate delivery gate, 41 b is a substrate delivery gate, and 42 is a The suction blower is used, and 43 is a piping. The same reference numerals are attached to the parts corresponding to the second drawing, and overlapping descriptions are omitted. In the same figure, the second embodiment covers the range in which the workpiece table 6 and the weight machines 2a to 2c on the gantry 1 are moved by the rigid pressure-resistant cover 40, and the substrate of the pressure-resistant cover 40 is fed. The side a is provided with a substrate feeding gate 41a that feeds the glass substrate 17 into the pressure-resistant cover 40 from the feeding-side conveyance belt 18a and is placed on the workpiece table 6, and feeds the substrate of the pressure-resistant cover 40. The side b is provided with a substrate delivery gate 4 1 b that has been smeared from the workpiece table 6 in the pressure-resistant cover 40 and that has been sent out to the outside and placed on the delivery-side conveyance belt 18b. These gates 4 are provided. 1 a and 4 1 b are openable and closable, and are opened only when the glass substrate 17 is fed or sent out. Further, the inside of the pressure-resistant cover 40 is connected to the suction blower 42 as an air suction means by the pipe 43, and the inside of the pressure-resistant cover 40 is set to an environment having a relatively high pressure of a lower air pressure. In this way, by setting the internal environment to a pressure with a lower pressure of the lower air pressure, the density of the air can be reduced, and the dust accompanying the movement of the structure of the workpiece machine 6 and the weight moving machines 2a to 2C can be reduced. ability. Compared with the atmospheric pressure environment -37-201111061, only a small amount of dust is rolled up, and the amount of dust that is rolled up is reduced to form a clean environment, thereby further improving the quality of the manufactured panel. rate. Further, although it differs from the smear processing time, when the pressure inside the pressure-resistant cover 40 is further lowered to constitute a high vacuum, vacuum suction may be used instead of the suction blower 42 to perform suction. The configuration other than the above configuration is the same as that of the first embodiment, and the operation is also shown in Fig. 9. As described above, in each of the above embodiments, a plurality of devices (weight shifters) having a plurality of functions are arranged, and the devices are configured to be movable while moving the workpiece table on which the glass substrate is placed to Since the device is placed at the position where the smear process is performed, it is not necessary to perform the following transfer of the substrate to be transported by the robot, that is, the glass substrate to be the target workpiece is used by using one common robot or a plurality of robots provided between the devices. In addition, by shortening the moving line (moving line) of the substrate, it is possible to achieve: first, reduce particle contamination during substrate transportation, improve yield during liquid crystal panel manufacturing, and second, reduce installation area, and effectively Use the clean room. In the above embodiment, the smear process for producing a liquid crystal panel is described as an example, but the invention is not limited thereto. Therefore, the smear treatment is not limited to the glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of a main part of a first embodiment of the application device and the application method of the present invention. -38-201111061 Fig. 2 is a structural view showing the overall configuration of the first embodiment of the application device and the application method of the present invention. Fig. 3 is an external perspective view showing a specific example of the workpiece machine table 6 of Figs. 1 and 2; Fig. 4 is an external perspective view showing another specific example of the workpiece table 6 of Figs. 1 and 2; Fig. 5 is a view showing a specific example of the configuration of the air ejection/adsorption hole 28 of Fig. 4. Fig. 6 is a perspective view showing an enlarged main portion of a specific example of the applicator head 8 of Fig. 1. Fig. 7 is a block diagram showing a configuration of a main control unit and a specific example of the control in the first embodiment shown in Figs. 1 and 2; Fig. 8 is a block diagram showing a specific example of the sub-control unit 34b of Fig. 7. Fig. 9 is a flow chart showing a specific example of the overall operation of the first embodiment shown in Figs. 1 and 2 . Fig. 10 is a view showing the configuration of the entire configuration of the second embodiment of the application device and the application method of the present invention. Ming said that the symbol is to be transferred to the main machine: the beam 2C horizontal

構 機 33 移 向 方 軸 X -39- 201111061 5 a、5 b :線性滑軌 6 :工件機台 7 :線性滑軌 8 :塗抹頭 9 :蓋 1 〇 :基板送入口 1 1 :基板送出口 13 : Z軸移動機台 1 4 :噴嘴 15、 15a~15e:基板吸附平板 16、 16a〜1 6d :滾子 1 7 :玻璃基板 1 8 a :送入側搬運輸送帶 18b :送出側搬運輸送帶 1 9 :基板載置構件 20a~20d :連結構件 2 1 :空氣吸附孔 22a、22b :基板定位銷 2 3 :十字滾子軸承 24a〜24d: ΧΥ0軸方向微動機構 25 :十字滾子軸承 2 6 :正交軸承 27 :基板吸附平板 27a :基板載置面 -40- 201111061 2 7 b :前側面 28 :空氣噴出/吸附孔 29 :空氣吸附孔 3 0 :空氣噴出孔 34af:移重機移動用X軸線性馬達用驅動器 3 4ag :塗抹頭部移動用Y軸線性馬達用驅動器 3 4 ah :工件機台旋轉用0軸馬達用驅動器 3 4 ai :工件機台移動用T軸線性馬達用驅動器 3 4b :副控制部 39 : Z軸馬達用驅動器 40 :耐壓蓋 4 1 a :基板送入閘門 4 1 b :基板送出閘門 42 :吸引鼓風機 43 :配管 -41 -Machine 33 Moving to square axis X -39- 201111061 5 a, 5 b : Linear slide 6 : Work machine table 7 : Linear slide 8 : Applicator head 9 : Cover 1 〇 : Substrate feed port 1 1 : Substrate feed port 13 : Z-axis moving machine 1 4 : Nozzles 15 , 15 a to 15 e : Substrate adsorption flat plates 16 , 16 a to 1 6 d : Roller 1 7 : Glass substrate 1 8 a : Feeding side conveyance conveyor belt 18b : Delivery side conveyance conveyance Belt 19: substrate mounting members 20a to 20d: coupling member 2 1 : air suction holes 22a, 22b: substrate positioning pins 2 3 : cross roller bearings 24a to 24d: ΧΥ0-axis direction micro-motion mechanism 25: cross roller bearing 2 6 : Orthogonal bearing 27 : Substrate adsorption flat plate 27a : Substrate mounting surface - 40 - 201111061 2 7 b : Front side 28 : Air ejection/adsorption hole 29 : Air suction hole 3 0 : Air ejection hole 34af: For moving weight machine X-axis motor driver 3 4ag: Y-axis motor driver for smear head movement 3 4 ah : 0-axis motor driver for workpiece machine rotation 3 4 ai : T-axis motor driver 3 for workpiece machine movement 4b: sub-control unit 39: Z-axis motor driver 40: pressure-resistant cover 4 1 a : substrate feeding gate 4 1 b : substrate feeding Gate 42: suction blower 43: pipe -41--

Claims (1)

201111061 七、申請專利範圍： 1. 一種塗抹裝置，是在1台或複數台的架台上設置有 可使1個或複數個塗抹頭移動地設置之移重機，該塗抹頭 係具備塡充有塗抹材之材料收納筒與將來自該塗抹材料收 納筒的塗抹材料吐出之噴嘴吐出口，使該移重機相對於裝 載在該架台上所設置之基板載置機台的基板移動，並使該 塗抹頭相對於該移重機移動，藉此使該塗抹頭相對於該基 板移動，而從該噴嘴吐出口將該塗抹材吐出於該基板上之 塗抹裝置，其特徵爲： 從外部將該基板朝向該基板載置機台之送入，係從送 入側搬運輸送帶，以將送入高度維持在與該基板載置機台 上的基板載置面爲相同高度之狀態來進行，並且從該基板 載置機台將該基板朝向外部之送出，係從該基板載置機台 至送出側搬運輸送帶，以將送出高度維持在與該基板載置 機台上的基板載置面爲相同高度之狀態來進行； 並且具備：從載置有由送入側搬運輸送帶所送入之該 基板之位置開始，至將該基板送出至送出側搬運輸送帶之 位置爲止，以載置有該基板之狀態使該基板載置機台移動 之第1移動機構，以及 使載置於該基板載置機台之該基板轉動之第2移動機 構。 2 -如申請專利範圍第1項所述之塗抹裝置，其中，於 前述架台上設置有複數台的前述移重機， 複數台的前述移重機中的任一台前述移重機上所設置 -42- 201111061 之前述塗抹頭，係將與其他前述移重機上所設置之前述塗 抹頭爲不同種類的前述塗抹材吐出於前述基板上。 3 ·如申請專利範圍第1或2項所述之塗抹裝置，其中， 相同的前述移重機上所設置之前述複數個塗抹頭中的任一 個前述塗抹頭與其他前述塗抹頭，係將種類不同的前述塗 抹材吐出於前述基板上。 4·如申請專利範圍第1、2或3項所述之塗抹裝置，其 中，前述基板載置機台，具備有： 在前述基板載置機台上使前述基板在一方向上移動之 由滾子所構成的基板移動手段；以及 在前述基板載置機台上吸附前述基板，而在前述基板 載置機台上將前述基板的位置固定之基板位置固定手段。 5 .如申請專利範圍第1、2或3項所述之塗抹裝置，其 中，前述基板載置機台，具備有： 在前述基板載置機台上，藉由將空氣強吹於前述基板 而使前述基板在一方向移動之基板移動手段；以及 在前述基板載置機台上吸附前述基板，而在前述基板 載置機台上將前述基板的位置固定之基板位置固定手段。 6.如申請專利範圍第1至5項中任一項所述之塗抹裝置 ，其中，藉由耐壓蓋來覆蓋前述架台上之前述基板載置機 台的移動範圍，並藉由空氣吸引手段，將以該耐壓蓋所覆 蓋之內部設定爲較大氣壓更低之氣壓，於該低氣壓的環境 內，藉由前述移重機的前述塗抹頭對載置於前述基板載置 機台之前述基板進行塗抹動作。 -43- 201111061 7. —種塗抹方法，是在1台或複數台的架台上設置有 可使1個或複數個塗抹頭移動地設置之移重機，該塗抹頭 係具備塡充有塗抹材料之塗抹材收納筒與將來自該塗抹材 收納筒的塗抹材料吐出之噴嘴吐出口，使該移重機相對於 裝載在該架台上所設置之基板載置機台的基板移動，並使 該塗抹頭相對於該移重機移動，藉此使該塗抹頭相對於該 基板移動，而從該噴嘴吐出口將該塗抹材吐出於該基板上 之塗抹方法，其特徵爲： 從外部將該基板朝向該基板載置機台之送入，係從送 入側搬運輸送帶’以將送入高度維持在與該基板載置機台 上的基板載置面爲相同高度之狀態來進行，並且從該基板 載置機台將該基板朝向外部之送出，係從該基板載置機台 至送出側搬運輸送帶，以將送出高度維持在與該基板載置 機台上的基板載置面爲相同高度之狀態來進行； 該基板載置機台，從載置有由送入側搬運輸送帶所送 入之該基板之位置開始，至將該基板送出至送出側搬運輸 送帶之位置爲止，係以載置有該基板之狀態移動； 使載置於該基板載置機台之該基板轉動，來校正0軸 偏移。 8. 如申請專利範圍第7項所述之塗抹方法，其中，於 前述架台上設置有複數台的前述移重機， 複數台的前述移重機中的任一台前述移重機上所設置 之前述塗抹頭’係將與其他前述移重機上所設置之前述塗 抹頭爲不同種類的前述塗抹材吐出於前述基板上。 -44 - 201111061 9. 如申請專利範圍第7或8項所述之塗抹方法’其中’ 相同的前述移重機上所設置之前述複數個塗抹頭中的任一 個前述塗抹頭與其他前述塗抹頭，係將種類不同的前述塗 抹材吐出於前述基板上。 10. 如申請專利範圍第7、8或9項所述之塗抹方法，其 中’在前述基板載置機台上，藉由由滾子所構成的基板移 動手段使前述基板在一方向移動，來進行前述基板載置機 台上之前述基板的定位， 吸附被定位後的前述基板，而在前述基板載置機台上 將前述基板的位置固定。 1 1 _如申請專利範圍第7、8或9項所述之塗抹方法，其 中’在前述基板載置機台上，藉由將空氣強吹於前述基板 而使前述基板在一方向移動，來進行前述基板載置機台上 之前述基板的定位， 吸附被定位後的前述基板，而在前述基板載置機台上 將前述基板的位置固定。 1 2 _如申請專利範圍第7至1 1項中任一項所述之塗抹方 法’其中’藉由耐壓蓋來覆蓋前述架台上之前述基板載置 機台的移動範圍’並將以該耐壓蓋所覆蓋之內部設定爲較 大氣壓更低之氣壓’於該低氣壓的環境內，藉由前述移重 機的前述塗抹頭對載置於前述基板載置機台之前述基板進 行塗抹動作。 -45-201111061 VII. Patent application scope: 1. A smear device is provided with a weighting machine which can be arranged on one or more gantry platforms to move one or a plurality of smear heads, and the smear head is provided with smear and smear. a material storage tube and a nozzle discharge port for discharging the application material from the application material storage tube, and moving the weight machine to the substrate mounted on the substrate mounting machine provided on the frame An application device for moving the applicator head relative to the substrate by moving the applicator head relative to the substrate, and ejecting the applicator from the nozzle discharge port to the substrate, wherein the substrate is oriented from the outside toward the substrate The feeding of the mounting table is performed by conveying the conveying belt from the feeding side to maintain the feeding height at the same height as the substrate mounting surface on the substrate mounting table, and from the substrate. The machine table sends the substrate to the outside, and conveys the conveyor belt from the substrate mounting machine to the delivery side to maintain the delivery height on the substrate mounting surface on the substrate mounting machine. In the same state as the height, the position is set from the position where the substrate fed by the feeding side conveyance belt is placed, and the position of the substrate is sent to the delivery side conveyance belt. The state of the substrate causes the first moving mechanism to move the substrate mounting table, and the second moving mechanism that rotates the substrate placed on the substrate mounting table. [2] The application device of claim 1, wherein the plurality of the weight-shifting machines are provided on the gantry, and any one of the plurality of weight-lifting machines is disposed on the weight-lifting machine. The above-mentioned applicator head of 201111061 is formed on the substrate by using a different type of the above-mentioned applicator from the above-mentioned applicator head provided on the other weight-shifting machine. The application device according to claim 1 or 2, wherein any one of the plurality of application heads disposed on the same weight-lifting machine and the other application heads are different in type The aforementioned spreader is spit out of the aforementioned substrate. The smear apparatus according to the first aspect of the invention, wherein the substrate mounting machine includes: a roller that moves the substrate in one direction on the substrate mounting machine The substrate moving means configured to fix the substrate, and the substrate position fixing means for fixing the position of the substrate on the substrate mounting table on the substrate mounting table. The smear apparatus according to the first aspect of the invention, wherein the substrate mounting machine includes: the substrate mounting machine is configured to strongly blow air onto the substrate a substrate moving means for moving the substrate in one direction; and a substrate position fixing means for fixing the position of the substrate on the substrate mounting table by adsorbing the substrate on the substrate mounting table. 6. The application device according to any one of claims 1 to 5, wherein the moving range of the substrate mounting machine on the gantry is covered by a pressure resistant cover, and by means of air suction The inside covered by the pressure-resistant cover is set to a lower air pressure, and in the low-pressure environment, the aforementioned application head of the weight lifting machine is placed on the substrate placed on the substrate mounting machine. Apply the smear. -43- 201111061 7. A method of applying a weighting machine in which one or a plurality of applicators are movably disposed on one or a plurality of stages, the applicator head is provided with a smear material The applicator storage tube and the nozzle discharge port for discharging the application material from the applicator storage tube, and moving the weight machine to the substrate mounted on the substrate mounting machine provided on the stand, and the applicator head is opposed to a method of applying the weighting machine to the substrate, wherein the applicator head is moved relative to the substrate, and the applicator is discharged from the nozzle to the substrate, wherein the substrate is externally directed toward the substrate. The feeding of the setting machine is performed by conveying the conveying belt from the feeding side to maintain the feeding height at the same level as the substrate mounting surface on the substrate mounting table, and is placed from the substrate. The machine feeds the substrate toward the outside, and conveys the conveyor from the substrate mounting machine to the delivery side to maintain the delivery height at the same height as the substrate mounting surface on the substrate mounting machine. The substrate mounting machine is placed from a position where the substrate fed by the feeding side conveyance belt is placed, and when the substrate is fed to the delivery side conveyance belt. The state of the substrate is moved; the substrate placed on the substrate mounting table is rotated to correct the 0-axis offset. 8. The smear method according to claim 7, wherein the plurality of the weight-shifting machines are provided on the gantry, and the smear set on the weight-lifting machine of any one of the plurality of weight-lifting machines The head's will be spit out of the aforementioned substrate from the above-mentioned applicator head provided on the other aforementioned weight-lifting machine. -44 - 201111061 9. The smear method according to claim 7 or 8, wherein any one of the plurality of application heads disposed on the same weight-lifting machine is the same as the other application heads, The above-mentioned spread materials of different types are discharged from the aforementioned substrate. 10. The smear method according to claim 7, wherein the substrate is moved in one direction by a substrate moving means formed by a roller on the substrate mounting machine. Positioning the substrate on the substrate mounting table is performed, and the positioned substrate is adsorbed, and the position of the substrate is fixed on the substrate mounting table. The smear method of claim 7, wherein the substrate is moved in a direction by strongly blowing air on the substrate on the substrate mounting machine. Positioning the substrate on the substrate mounting table is performed, and the positioned substrate is adsorbed, and the position of the substrate is fixed on the substrate mounting table. The smear method of any one of claims 7 to 11 wherein the 'movement range of the substrate mounting machine on the gantry is covered by a pressure resistant cover' The inside of the pressure-resistant cover is set to a lower air pressure. In the low-pressure environment, the substrate placed on the substrate mounting machine is smeared by the application head of the weight lifting machine. -45-
TW099118145A 2009-06-10 2010-06-04 Smearing and smearing method TWI460020B (en)

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