TW201305724A - Film formation method, computer memory medium, and film formation device - Google Patents

Abstract

The present invention is a film formation method that forms a film of a silane coupling agent on a substrate, and wherein the method has: a supply step that supplies the silane coupling agent onto the substrate; and a film formation step that applies ultrasonic vibration to the silane coupling agent supplied onto the substrate, and forms a film of the silane coupling agent on the substrate. It is possible to appropriately forma a film of the silane coupling agent on the substrate, and it is possible to increase substrate processing throughput.

Description

Film forming method, program, computer memory medium and film forming device

The present invention relates to a film forming method, a program, a computer memory medium, and a film forming apparatus for forming a decane coupling agent on a substrate.

For example, in the manufacturing process of a semiconductor device, for example, a semiconductor wafer (hereinafter referred to as "wafer") is subjected to photolithography to form a predetermined resist pattern on the wafer.

When the above-described resist pattern is formed, in order to achieve higher integration of the semiconductor device, the resist pattern is required to be miniaturized. Generally, the limit of miniaturization of photolithography lithography is the wavelength of light used in exposure processing. Therefore, the short-wavelength of the light for the exposure process has progressed in the past. However, the short wavelength of the exposure light source is technically and cost-limited, and it is difficult to form a fine resist pattern of, for example, several nanometer units by the short wavelength of light.

Therefore, in recent years, instead of performing photolithography lithography on a wafer, it has been proposed to form a fine resist pattern on a wafer by a so-called imprint method. The method is a method in which a template having a fine pattern on a surface (also referred to as a mold or a mold) is pressed against a surface of a resist formed on a wafer, and then peeled off, and a pattern is directly transferred on the surface of the resist. (Patent Document 1).

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-43998

In the surface of the template used in the above-described imprint method, in order to easily peel the template from the resist, a release agent film having liquid repellency to the resist is usually formed.

When the release agent is formed on the surface of the template, first, after the surface of the template is washed, a release agent is applied to the surface of the template. Next, in order to allow the film-formed release agent to have a predetermined contact angle, the liquid repellency of the resist can be exhibited, and the release agent is adhered to the surface of the template. Specifically, the release agent is chemically reacted with the surface of the template, and among the components contained in the release agent, a component having a liquid repellency to the resist, for example, a fluoride component, is adsorbed on the surface of the template. Then, the unreacted portion of the release agent is removed, and a release film having a predetermined film thickness is formed on the surface of the template. Further, the unreacted portion of the release agent means a portion other than the portion where the release agent chemically reacts with the surface of the template.

However, if the above-described imprint method is repeated, that is, a plurality of resist patterns are formed on a plurality of wafers using a template, the release film on the template may be deteriorated. Therefore, the template needs to be replaced periodically. Therefore, in order to reduce the frequency of replacement of the template, it is tried to change the material of the release agent to improve the durability of the release agent.

However, it has been found by the inventors that when the material of the release agent is changed in order to improve the durability of the release agent, if the release agent is formed as described above, the release agent may be densely formed. The surface of the template is time consuming. therefore, There is room for improvement in the processing power of the template processing.

The present invention has been made in view of the above points, and an object thereof is to appropriately form a decane coupling agent on a substrate to improve the processing ability of the substrate processing.

In order to solve the above object, the present invention is a film forming method for forming a decane coupling agent on a substrate, which is characterized in that: a supply engineering is performed to supply a decane coupling agent to a substrate; and a film forming process is performed in a pair The supply process is such that the decane coupling agent supplied to the substrate imparts ultrasonic vibration, and a film of a decane coupling agent is formed on the substrate.

As a result of in-depth review by the inventors, it was found that if ultrasonic vibration is imparted to the decane coupling agent on the substrate, the chemical reaction between the surface of the substrate and the decane coupling agent is promoted, and the surface of the substrate is adhered to the silane coupling agent. Sex will improve. Specifically, when ultrasonic vibration is imparted to the decane coupling agent, the decane coupling agent vibrates, whereby water molecules enter between the decane coupling agent and the surface of the substrate. As a result, the hydrolysis of the decane couplant molecules by the water molecules is promoted, and the hydrolyzed decane couplant molecules and the hydroxyl groups on the surface of the substrate are bonded by dehydration condensation. As a result, the surface of the substrate and the decane coupling agent are firmly bonded, and the adhesion of the surface of the substrate to the decane coupling agent is enhanced. Therefore, when ultrasonic vibration is imparted to the decane coupling agent, the decane coupling agent can be adhered to the surface of the substrate for a short period of time, and the decane coupling agent can be appropriately formed on the substrate. So that it can be made in a short time Since the decane coupling agent is adhered to the surface of the substrate, the processing ability of the entire substrate processing can be improved.

In the film forming process, a reaction accelerator for promoting the reaction between the surface of the substrate and the decane coupling agent may be supplied to the decane coupling agent on the substrate, and the ultrasonic wave may be supplied to the decane coupling agent to which the reaction accelerator is supplied. vibration.

In the film forming process described above, the supply of the reaction accelerator may be performed before the decane coupling agent on the substrate is dried.

In the film forming process, a support plate may be disposed opposite to the decane coupling agent on the substrate, and the reaction accelerator may be diffused between the decane coupling agent and the support plate.

In the film forming process described above, the substrate may be moved to diffuse the reaction accelerator onto the decane coupling agent on the substrate.

In the film forming process described above, when the reaction accelerator is supplied to the decane coupling agent on the substrate, a mixed solution of the reaction accelerator and the solvent of the decane coupling agent may be supplied.

The above reaction accelerator may also be ethanol.

In the above film forming process, the ultrasonic vibration may be imparted in a direction perpendicular to the surface of the substrate.

In the film forming process described above, the ultrasonic vibrator or the substrate to which the ultrasonic vibration is applied may be relatively moved.

In the above supply process, a liquid or gaseous decane coupling agent may be supplied to the substrate.

The substrate is a template in which a predetermined pattern is formed on the surface, and the crucible is The alkane coupling agent can also be a release agent.

According to another aspect of the invention, it is possible to provide a program for operating on a computer that controls a control unit of the film forming apparatus in order to implement the film forming method by a film forming apparatus.

Further, according to the present invention, according to another aspect, a readable computer memory medium storing the above program can be provided.

Further, according to the present invention, according to another aspect of the invention, there is provided a film forming apparatus which forms a decane coupling agent on a substrate, and has the following features:

a decane coupling agent supply unit for supplying a decane coupling agent to the substrate; The ultrasonic vibrator imparts ultrasonic vibration to the decane coupling agent supplied from the decane coupling agent supply unit to the substrate.

The film forming apparatus may further include a reaction accelerator supply unit that supplies a reaction accelerator that promotes the reaction between the surface of the substrate and the decane coupling agent to the decane coupling agent supplied from the decane coupling agent supply unit to the substrate.

The film forming apparatus may further include a support plate disposed to face the decane coupling agent on the substrate, and diffusing the reaction accelerator between the decane coupling agent and the silane coupling agent.

The reaction accelerator supply unit may also supply a mixed solution of the reaction accelerator and the solvent of the decane coupling agent.

The above reaction accelerator may also be ethanol.

The ultrasonic vibrator may also impart the ultrasonic vibration in a direction perpendicular to the surface of the substrate.

The film forming apparatus may further have a substrate moving machine that moves the substrate Structure.

The film forming apparatus may have a vibrator moving mechanism that moves the ultrasonic vibrator.

The decane coupling agent supply unit can supply a liquid or gaseous decane coupling agent to the substrate.

The substrate is a template in which a predetermined pattern is formed on the surface, and the decane coupling agent may be a release agent.

According to the present invention, the decane coupling agent can be appropriately formed on the substrate to improve the processing ability of the substrate processing.

Hereinafter, embodiments of the present invention will be described. FIG. 1 is a plan view showing a schematic configuration of a template processing apparatus 1 including a coating unit as a film forming apparatus according to the embodiment. 2 and 3 are schematic side views showing the configuration of the template processing apparatus 1.

In the template processing apparatus 1 of the present embodiment, a template T having a rectangular parallelepiped shape as shown in FIG. 4 and having a predetermined transfer pattern C formed on the surface as a substrate is used. Hereinafter, the surface of the template T on which the transfer pattern C is formed is referred to as a surface T ₁ , and the surface on the opposite side to the surface T ₁ is referred to as a back surface T ₂ . Further, the template T is a transparent material that uses light that transmits visible light, near-ultraviolet light, ultraviolet light, or the like, such as quartz glass.

The template processing apparatus 1 has a configuration in which the template loading/unloading station 2 and the template processing station 3 are integrally connected as shown in FIG. 1, and the template loading/unloading station 2 carries out a plurality of sheets between the outside and the template processing apparatus 1 in a cassette unit. e.g. T. 5 sheet template, the template or unloading the cassette C _T T template, the template processing station 3 is provided with the template T of a predetermined plurality of processing unit.

A cassette mounting table 10 is provided in the template loading/unloading station 2. The cassette mounting table 10 is such that a plurality of template cassettes C _T are placed in a row in the X direction (vertical direction in FIG. 1). That is, the template carry-in/out station 2 constitutes a template T that can hold a complex number.

The template loading/unloading station 2 is provided with a template conveying body 12 that can move on the conveying path 11 extending in the X direction. The template transport body 12 is expandable and contractible in the horizontal direction, and can be moved in the vertical direction and around the vertical axis (θ direction), and the template _T can be transported between the template cassette C _T and the template processing station 3.

A transport unit 20 is provided at a central portion of the template processing station 3. Around the transport unit 20, various processing units are arranged in a plurality of stages, for example, four processing blocks G1 to G4 are arranged. On the front side of the template processing station 3 (on the negative side in the X direction of FIG. 1), the first processing block G1 and the second processing block G2 are sequentially arranged from the template loading/unloading station 2 side. On the back side of the template processing station 3 (the positive side in the X direction of FIG. 1), the third processing block G3 and the fourth processing block G4 are sequentially arranged from the template loading/unloading station 2 side. A transfer unit 21 for transferring the template T is disposed on the template carry-in/out station 2 side of the template processing station 3.

The transport unit 20 is a transport arm that is transported while holding the template T and is movable in the horizontal direction, the vertical direction, and the vertical axis. And, transport The unit 20 can transport the template T to the various processing units and the transfer unit 21 which will be described later in the processing blocks G1 to G4.

As shown, in the first processing block G1 are sequentially superimposed by the plurality of liquid processing units, for example a surface coated template T ₁ T as liquid Silane coupling agent and reaction accelerator releasing agent 2 The coating unit 30 of the film forming apparatus and the cleaning unit 31 of the release agent for cleaning the template T are in two stages. Similarly to the second processing block G2, the coating unit 32 and the cleaning unit 33 are sequentially stacked in the next step. Further, in the lowermost stages of the first processing block G1 and the second processing block G2, chemical chambers 34 and 35 for supplying various processing liquids to the liquid processing unit are provided.

3, in the third processing block G3 are sequentially superimposed by the template T 2 period irradiated with ultraviolet light, _a mold release film before washing the surface of T cleaning units 40, 41 formed on the template T . Further, in the fourth processing block G4, similarly to the third processing block G3, the two cleaning units 42 and 43 are superimposed in this order.

Next, the configuration of the above coating units 30 and 32 will be described. The coating unit 30 is a processing container 100 having a carry-out port (not shown) in which a template T is formed on the side surface as shown in FIG. 5 .

A mounting table 101 on which the template T is placed is provided on the bottom surface of the processing container 100. The template T is placed on the upper surface of the mounting table 101 such that its surface T ₁ faces upward. A template moving mechanism 102 as a substrate moving mechanism of the built-in driving unit is provided below the mounting table 101. The mounting table 101 and the template T placed on the mounting table 101 are movable in the horizontal direction by the template moving mechanism 102.

In the above stage 101, below the mounting table 101 contained in the template counter T is provided in the ultrasonic transducer 110 and the surface of the template T is T ₁ i.e. the direction perpendicular to the vertical direction to impart ultrasonic vibration. The ultrasonic vibrator 110 is provided with an ultrasonic oscillating device (not shown) for oscillating the ultrasonic waves from the ultrasonic vibrator 110. Below the ultrasonic vibrator 110, a vibrator moving mechanism 111 having a built-in driving unit is provided. The ultrasonic vibrator 110 is movable in the horizontal direction by the vibrator moving mechanism 111. Further, the ultrasonic vibrator 110 is independently movable from the mounting table 101.

A lift pin 112 for lifting and lowering the template T from below is provided inside the mounting table 101. The lift pin 112 can be moved up and down by the lift drive unit 113. The ultrasonic vibrator 110 is formed with a through hole 114 that penetrates the ultrasonic vibrator 110 in the thickness direction, and the lift pin 112 forms the insertion through hole 114.

As shown in FIG. 6, a rail 120 extending in the Y direction (the horizontal direction of FIG. 6) is provided on the side of the mounting table 101 in the negative X direction (the downward direction in FIG. 6). The rail 120 is formed, for example, from the outside in the negative direction of the Y direction of the mounting table 101 (the left direction in FIG. 6) to the outside in the positive direction of the Y direction (the right direction in FIG. 6). Arms 121, 122 are mounted on the track 120.

The first arm 121 is provided with a release agent nozzle 123 as a decane coupling agent supply unit that supplies a release agent to the template T. The release agent nozzle 123 is, for example, the same or longer than the one side of the template T, and has an elongated shape along the X direction. Further, the discharge port of the release agent nozzle 123 is formed in a slit shape. Further, as shown in FIG. 5, a supply pipe 125 that communicates with the release agent supply source 124 is connected to the release agent nozzle 123. In addition, the material of the release agent is used The resist film on the wafer to be described later has a liquid repellency material such as a fluorocarbon compound.

As shown in FIG. 6, the first arm 121 is movable on the rail 120 by the nozzle driving unit 126. Thereby, the release agent nozzle 123 can be moved from the standby unit 127 provided on the outer side in the positive direction of the Y direction of the mounting table 101 to the upper side of the template T on the mounting table 101, and can be on the surface T1 of the template T. Moves in the side direction of the template T. Further, the first arm 121 is lifted and lowered by the nozzle driving unit 126, and the height of the release agent nozzle 123 can be adjusted.

In the second arm 122, an ethanol nozzle 130 as a reaction accelerator supply unit that supplies ethanol (for example, t-pentyl alcohol) as a reaction accelerator to the template T (on the release agent on the template T) is provided. The ethanol nozzle 130 is, for example, the same size as or longer than the one side of the template T, and has an elongated shape along the X direction. Further, the discharge port of the ethanol nozzle 130 is formed in a slit shape. Further, as shown in FIG. 5, a supply pipe 132 that is connected to the ethanol supply source 131 is connected to the ethanol nozzle 130. Further, the ethanol of the reaction accelerator is a chemical reaction which promotes the surface T ₁ of the template T and the releasing agent S.

As shown in FIG. 6, the second arm 122 is movable on the rail 120 by the nozzle driving unit 133. Accordingly, the standby section 134 moves outward 130 may be the positive direction of the Y-direction stage 101 side ethanol nozzle provided to the carrier above the template T on the mounting table 101, and may be T at the surface of the template T on the _mobile In the side direction of the template T. Further, the second arm 122 is lifted and lowered by the nozzle driving unit 133, and the height of the ethanol nozzle 130 can be adjusted.

In addition, the configuration of the coating unit 32 is the same as that of the coating unit 30 described above. The same is true, so the description is omitted.

Next, the configuration of the above-described cleaning units 31 and 33 will be described. The cleaning unit 31 is a processing container 140 having a carry-out port (not shown) in which a template T is formed on the side surface as shown in Fig. 7 .

A dipping groove 141 for immersing the template T is provided on the bottom surface of the processing container 140. A cleaning liquid for cleaning the release agent on the template T, for example, an organic solvent, is stored in the dipping tank 141.

On the top surface of the processing container 140, above the immersion tank 141 is a holding portion 142 provided with a holding template T. The holding portion 142 is a suction cup 143 having an outer peripheral portion that adsorbs and holds the back surface T ₂ of the template T. The template T is held by the suction cup 143 with its surface T ₁ facing upward. The suction cup 143 can be raised and lowered by the lifting mechanism 144. Further, the template T is an organic solvent that is immersed in the immersion tank 141 while being held by the holding portion 142, and the release agent on the template T is cleaned.

The holding portion 142 is a gas supply portion 145 having a plate T provided above the suction cup 143. For example, the gas supply unit 145 can blow an inert gas such as nitrogen or a gas such as dry air to the lower surface, that is, the surface T ₁ of the template T held by the suction cup 143. Thereby, the surface T ₁ of the template T which can be washed in the dipping tank 141 can be dried. Further, an exhaust pipe (not shown) that exhausts the internal environment is connected to the cleaning unit 31.

The configuration of the cleaning unit 33 is the same as the configuration of the cleaning unit 31 described above, and thus the description thereof will be omitted.

Next, the configuration of the above-described cleaning units 40 to 43 will be described. The cleaning unit 40 has a loading and unloading form in which a template T is formed on the side as shown in FIG. A processing container 150 (not shown).

A suction cup 151 that adsorbs and holds the template T is provided in the processing container 150. The chuck 151 adsorbs and holds the back surface T _{2 such} that the surface T _{1 of} the template T faces upward. A suction cup driving portion 152 is provided below the suction cup 151. This chuck drive unit 152 is attached to a rail 153 that extends in the Y direction on the bottom surface provided in the processing container 150. The suction cup 151 can be moved along the rail 153 by the suction cup driving portion 152.

On the top surface of the processing container 150, above the rail 153, an ultraviolet ray irradiation portion 154 that irradiates the template T held by the suction cup 151 with ultraviolet rays is provided. The ultraviolet ray irradiation unit 154 extends in the X direction as shown in Fig. 9 . Further, the template T to move along the rail 153, 154 from the UV irradiation portion irradiating ultraviolet rays to the surface of the template T is T _1, whereby the ultraviolet rays are irradiated to the surface of the template T _{T. 1} overall.

The configuration of the cleaning units 41 to 43 is the same as the configuration of the cleaning unit 40, and thus the description thereof is omitted.

In the above-described template processing apparatus 1, as shown in FIG. 1, a control unit 160 is provided. The control unit 160 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a template processing device 1 for controlling the transfer of the template T between the inbound/incoming station 2 and the template processing station 3, or the operation of the drive system of the template processing station 3, and the like. Template processing described later. In addition, the program can also be recorded on a computer-readable hard disk (HD), floppy disk (FD), compact disc (CD), optical disk (MO), memory card and other computer readable memory media. It is attached to the control unit 160 by the memory medium.

The template processing apparatus 1 of the present embodiment is configured as described above. Next, the template processing performed in the template processing apparatus 1 will be described. FIG. 10 is a main processing flow showing the template processing, and FIG. 11 is a diagram showing the state of the template T of each project.

First, the template _{T is} taken from the template cassette C _T on the cassette mounting table 10 by the template transport body 12, and transported to the transfer unit 21 of the template processing station 3 (the project A1 of FIG. 10). At this time, in the template cassette C _T , the template T is placed so that the surface T _{1 on} which the transfer pattern C is formed is directed upward, and in this state, the template T is transported to the transfer unit 21 .

Then, the template T is transported to the cleaning unit 40 by the transport unit 20, and is sucked and held by the suction cup 151. Then, while the template T is moved along the rail 153 by the suction cup driving unit 152, ultraviolet rays are irradiated from the ultraviolet irradiation unit 154 to the template T. Thus, like in FIG. 11 (a) as shown in ultraviolet rays is irradiated to the surface of the template T is T ₁ round, surface impurities and the like template T T ₁ organic pollutants or particles will be removed, the surface of the T ₁ Will be washed (Project A2 of Figure 10).

Then, the template T is transferred to the coating unit 30 by the transport unit 20. The template T conveyed to the coating unit 30 is transferred to the lift pins 112 and placed on the mounting table 101. Then, while releasing the release agent nozzle 123 in the side direction of the template T, the release agent S is supplied from the release agent nozzle 123 to the template T. Then, as shown in Fig. 11 (b), the release agent S is entirely applied to the surface T _{1 of the} template T (work A3 of Fig. 10).

Then, the supply of the release agent S from the release agent nozzle 123 is stopped, and the release agent nozzle 123 is moved to the standby unit 127. Next, in the template T Before the release agent S is dried, the ethanol nozzle 130 is moved to the side direction of the template T, and t-pentyl alcohol A (hereinafter sometimes referred to as "ethanol A") is supplied from the ethanol nozzle 130 to the release of the template T. Agent S. Then, as shown in FIG. 11(c), ethanol A is entirely applied to the release agent S of the template T (work A4 of FIG. 10).

Then, as shown in FIG. 11(d), ultrasonic vibration is applied from the ultrasonic vibrator 110 to the release agent S on the template T (work A5 of FIG. 10). Thus, the surface of the template T is T ₁ and the chemical reaction will be to promote the release agent S, the template T T adhesion surface ₁ S of the release agent will increase.

Further, when the vibration intensity imparted to the ultrasonic vibration from the ultrasonic vibrator 110 is not uniform in the template plane, the template T or the ultrasonic vibrator may be caused by at least the template moving mechanism 102 or the vibrator moving mechanism 111. 110 moves relatively. In this case, ultrasonic vibration can form a uniform intensity of vibration in the mold surface, the surface can template T T S chemical reaction of _a release agent without promoting unevenly.

Here, the action and effect when ultrasonic vibration is applied to the release agent S on the template T will be described in detail with reference to FIG. Fig. 12 (a) shows a state of the surface T ₁ of the template T before the ultrasonic vibration is applied, and Figs. 12 (b) to (d) show a state of the surface T ₁ of the template T in the ultrasonic vibration.

As shown in FIG. 12, a hydroxyl group (OH group) is formed on the surface T _{1 of the} template T. Further, the release agent molecule of the release agent S of the decane coupling agent has two functional groups. That is, the monofunctional OR group is bonded to the surface T _{1 of the} template T. Further, the OR groups of adjacent release agent molecules are also bonded to each other. Further, R is an alkyl group such as CH ₃ . On the other hand, the other functional group S _G (hatched portion in Fig. 12) is a functional group which exhibits a mold release function and has a fluoride component.

Further, as shown in Fig. 12 (a), even if the releasing agent S and the ethanol A are supplied on the surface T ₁ of the template T, the atoms are closely arranged in the functional group S _G of the releasing agent S, so that the atoms are closely arranged in the functional group S _G of the releasing agent S. It takes time for the ethanol A to enter the release agent S and the surface T _{1 of the} template T.

Then, the ultrasonic vibration is applied to the release agent S on the template T by the ultrasonic vibrator 110. This ultrasonic vibration-dense wave travels in a direction perpendicular to the surface T _{1 of the} template T, that is, in the thickness direction of the releasing agent S. As a result, as a result of the ultrasonic vibration, as shown in FIGS. 12(b) to (d), the functional group S _{G of the} releasing agent S vibrates in the vertical direction. Then, as shown in FIG. 12(b), once the functional group S _{G is} atrophied, the ethanol A moves to the lower side. Next, as shown in Fig. 12(c), once the functional group S _{G is} elongated, the atom of the functional group S _G is deteriorated, so that ethanol A is impregnated into the functional group S _G . Then, as shown in FIG. 12(d), once the functional group S _{G is} further atrophied, the ethanol A moves to the lower side, and a part of the ethanol A enters between the release agent S and the surface T _{1 of the} template T. When the ultrasonic vibration is applied to the release agent S on the template T as described above, the ethanol A is easily moved.

Once the ethanol A enters between the release agent S and the surface T _{1 of the} template T, the release agent molecules of the release agent S are hydrolyzed. Then, as shown in _{FIG. 1} template T T surface release agent molecules are bound by dehydrating condensation of 13. Further, adjacent mold release molecules are bonded to each other by dehydration condensation. Thus, as shown, the surface of the template T ₁ T chemistry S release agent 14 will be promoted, the surface of the template T is T ₁ and the adhesion of the release agent S will increase.

Further, in the coating unit 30, after the surface T ₁ of the template T and the release agent S are adhered to each other, the release agent S on the template T may be, for example, blown with an inert gas such as nitrogen or dry air. The gas is used to dry the release agent S.

Then, the template T is transported to the cleaning unit 31 by the transport unit 20 and held by the holding unit 142. Next, the holding portion 142 is lowered, and the template T is immersed in the organic solvent accumulated in the dipping tank 141. Once the predetermined time has elapsed, only the S portion of the unreacted release agent, i.e. a release agent S on the surface of the template T T _{chemistry. 1,} only the peel adhesion than the portion of the surface T _1. At this time, in the above-described work A5, since the release agent S adheres to the surface T _{1 of the} template T, the release agent S having a predetermined distance does not peel off from the surface T _{1 of the} template T. Thus, like in FIG. 11 (e) as shown, along the transfer pattern on the template T C S _F will release film with a predetermined thickness forming (drawing 10 A6). Then, the holding portion 142 rises, the gas blown from the gas supply portion 145 to the template T, T ₁ so that the surface was dried.

Then, the template T is transferred to the transfer unit 21 by the transport unit 20, and the template transport body 12 is returned to the template cassette C _T (item A7 of FIG. 10). In this way, a series of template processes of the template processing apparatus 1 are completed, and the release agent S along the shape of the transfer pattern C on the surface T _{1 of the} template T is formed into a film with a predetermined film thickness.

According to the above embodiment, in the operation A5, the ultrasonic vibration is applied to the release agent S on the template T by the ultrasonic vibrator 110. Therefore, the functional group S _{G of the} release agent S vibrates, and the ethanol A will It enters between the release agent S and the surface T _{1 of the} template T. As a result, the hydrolysis of the release agent molecules is promoted by the ethanol A, and the hydrolyzed release agent molecules and the hydroxyl groups on the surface T ₁ of the template T are combined by dehydration condensation. Therefore, the chemical reaction of the surface T _{1 of the} template T with the releasing agent S is promoted, and the adhesion of the surface T _{1 of} the template T to the releasing agent S is enhanced. That is, the release agent S can be adhered to the surface T _{1 of the} template T for a short time. Thereby, the processing capability of the template processing of the engineering A1 to the engineering A7 can be improved.

Further, the template T is made of quartz glass and is in an amorphous state. Therefore, the hydroxyl group on the surface T ₁ of the template T is disposed at an irregular position, and it is difficult to react with the releasing agent S in an irregular direction. According to the present embodiment, the ultrasonic wave is applied to the release agent S on the template T, and the release agent S vibrates. Therefore, the bonding which is difficult to bond in the past is also promoted. Therefore, the surface T _{1 of the} template T and the release agent S can be combined in a shorter time, and the bonding can be made stronger.

Further, since the ultrasonic vibration from the ultrasonic vibrator 110 to the template T vibrates in the thickness direction (vertical direction) of the release agent S, the functional group S _{G of the} release agent S also vibrates in the thickness direction. That is, the vibration direction of the functional group S _G coincides with the moving direction of the ethanol A. Therefore, the movement of the ethanol A can be performed efficiently. Further, even if the ultrasonic vibration is imparted in the direction other than the thickness direction of the release agent S, the release agent S can be vibrated, so that the chemical reaction between the surface T ₁ of the template T and the release agent S can be promoted more than ever. In this embodiment, ethanol A is most efficiently moved to promote a chemical reaction.

Further, as a result of intensive review by the inventors, it was found that when ethanol is used as the reaction accelerator, the chemical reaction between the surface T ₁ of the template T and the releasing agent S can be promoted. In other words, when ethanol A is supplied to the release agent S as in the present embodiment, the hydrolysis of the release agent molecules is efficiently performed. Therefore, the release agent S can be adhered to the surface T _{1 of the} template T in a shorter time.

Further, in the present embodiment, ethanol A is used for the hydrolysis of the release agent molecules, but water molecules contained in the environment in the coating unit 30 may be used. In this case, although the chemical reaction between the surface T _{1 of the} template T and the release agent S takes longer than the use of the ethanol A, the mechanism for supplying the ethanol A (the ethanol nozzle 130 or the like) can be omitted, and the device configuration can be simplified. .

In the above embodiment, the ultrasonic vibration is applied from the lower side of the template T in the coating unit 30, but may be given from above the template T. For example, as shown in FIG. 15, the ultrasonic vibrator 110 is disposed on the top surface of the processing container 100 at a position facing the template T placed on the mounting table 101. Further, a vibrator moving mechanism 111 for moving the ultrasonic vibrator 110 in the horizontal direction is also provided on the top surface of the processing container 100. In this case, ultrasonic vibration can also be imparted in a direction perpendicular to the surface T _{1 of the} template T, that is, in the thickness direction of the release agent S, so that the release agent S can be vibrated to promote the surface T ₁ and the release of the template T. The chemical reaction of the agent S.

In the above embodiment, the coating unit 30 supplies ethanol A to the release agent S of the template T, but may also supply a mixed solution of ethanol A and a solvent such as an organic solvent as the release agent S. For example, as shown in FIG. 16, the second arm 122 is provided with a mixed liquid nozzle 200 instead of the ethanol nozzle 130. The mixed liquid nozzle 200 is connected to the supply pipe 132 of the ethanol supply source 131. In addition to the supply pipe 202 connected to the organic solvent supply source 201, a supply pipe 202 is connected.

In this case, in the project A4, the ethanol A supplied from the ethanol supply source 131 and the organic solvent supplied from the organic solvent supply source 201 are mixed in the mixed solution nozzle 200. Further, the mixed liquid is supplied from the mixed liquid nozzle 200 to the release agent S of the template T. Since the organic solvent is contained in the mixed liquid supplied to the release agent S, the mixed liquid is easily diffused on the release agent S. In this way, ethanol A can be more uniformly applied to the release agent S, and hydrolysis of the release agent molecules can be appropriately performed. Therefore, the chemical reaction of the surface T ₁ of the template T with the releasing agent S can be promoted.

Here, the work A4 of the above embodiment is to apply the ethanol A to the release agent S before the release agent S on the template T is dried. However, the release agent S may be dried before the application of the ethanol A. In this case, it is difficult for ethanol A to diffuse on the release agent S. On the other hand, since the mixed liquid of the ethanol A and the organic solvent easily spreads on the release agent S, the present embodiment can be applied even if the release agent S is dried.

Further, in the present embodiment, ethanol A and an organic solvent are mixed in the mixed liquid nozzle 200, but the method of mixing the ethanol A and the organic solvent is not limited thereto. For example, a mixed liquid supply source (not shown) in which ethanol A and an organic solvent are mixed may be supplied to the mixed liquid nozzle 200.

In the coating unit 30 of the above embodiment, as shown in FIG. 17, a support plate 210 for diffusing the release agent S and the ethanol A on the template T may be disposed above the mounting table 101. The support plate 210 is, for example, having a flat plate shape. Support plate 210 is a template T on the mounting table 101 pairs, arranged at a distance to the surface of the template T is T ₁ becomes a predetermined distance, for example, a position within 1mm. Further, the support plate 210 is disposed in such a manner as to cover the surface T _{1 of the} template T. In addition, the support plate 210 can be moved into the processing container 100 by a moving mechanism (not shown).

In place of the release agent nozzle 123, the first arm 121 is disposed, and the supply port 211a provided at the lower end portion is disposed to be obliquely downward toward the release agent nozzle 211. The supply port 211a of the release agent nozzle 211 may have a circular shape or a slit shape, for example. Similarly, in the second arm 122, the ethanol nozzle 130 is replaced, and the supply port 212a provided at the lower end portion is disposed so as to be obliquely downward toward the ethanol nozzle 212. The supply port 212a of the ethanol nozzle 212 may have a circular shape or a slit shape, for example.

In this case, the project A3, the nozzle 211 is supplied from the releasing agent to the template T between the surface S T of the end portions 210 of the support plate ₁ of a release agent. The supplied release agent S is diffused between the surface T _{1 of the} template T and the support plate 210 by capillary action (surface tension). Then, in the engineering and A4, ethanol is supplied between the template T A to T end surface of the support plate ₁ and the end portion 210 of the nozzle 212 from ethanol. The supplied ethanol A is diffused between the release agent S of the template T and the support plate 210 by capillary action (surface tension).

According to the present embodiment, since the release agent S and the ethanol A are easily diffused on the template T, the release agent S and the ethanol A can be more uniformly applied to the template T, and the surface T _{1 of the} template T can be promoted. The chemical reaction of the release agent S. Further, since ethanol A easily diffuses on the release agent S, the present embodiment can be applied even if the release agent S is dried.

Further, in the above embodiment, the support plate 210 has a flat plate shape, but may have a mesh shape. In this case, the release agent S and the ethanol A may be diffused on the surface T _{1 of the} template T by surface tension. Further, in this case, the release agent S and the ethanol A may be supplied from above the support plate 210.

In the work A3 and the work A4 of the above embodiment, the template T can be moved in order to diffuse the release agent S and the ethanol A on the surface T ₁ of the template T. For example, in engineering A3, after the supply of the release agent on the template T S, S when the releasing agent is not diffused in a surface of the template T T _{round. 1} and the like, may be moved by a template mechanism 120 causes the movement of the template T The release agent S is allowed to diffuse. Also in the work A4, the template T can be moved by the template moving mechanism 120 to diffuse the ethanol A onto the release agent S of the template T.

Further, in the works A3 and A4, the template T can be rotated in order to diffuse the release agent S and the ethanol A on the surface T ₁ of the template T. In this case, for example, as shown in FIG. 18, in the processing container 100 of the coating unit 30, instead of the mounting table 101 of the above-described embodiment, the holding member 220 that holds the template T and rotates is provided. The central portion of the holding member 220 is formed with a receiving portion 221 that houses the template T downwardly. In the lower portion of the accommodating portion 221, a groove portion 221a having a smaller outer shape than the template T is formed. Therefore, in the accommodating portion 221, the inner peripheral portion of the lower surface of the template T does not come into contact with the holding member 220 by the groove portion 221a, and only the outer peripheral portion of the lower surface of the template T is supported by the holding member 220. The accommodating portion 221 has a substantially quadrangular planar shape suitable for the outer shape of the template T as shown in FIG. In the accommodating portion 221, a plurality of protruding portions 222 projecting from the side surface to the inner side are formed, and the protruding portion 222 is used to position the template T accommodated in the accommodating portion 221. Further, when the template T is transferred from the transfer arm of the transport unit 20 to the accommodating portion 221, in order to prevent the transfer arm from interfering with the accommodating portion 221, four notch portions 223 are formed on the outer circumference of the accommodating portion 221.

As shown in FIG. 18, the holding member 220 is attached to the lid body 224, and a rotation driving portion 226 is provided below the holding member 220 via a shaft 225. By thus rotating the driving portion 226, the holding member 220 can be rotated at a predetermined speed about the vertical axis and can be raised and lowered.

A cup 230 that receives the release agent that is scattered or dropped from the template T is provided around the holding member 220. A discharge pipe 231 through which the recovered release agent is discharged and an exhaust pipe 232 that exhausts the environment in the cup 230 are connected to the lower surface of the cup 230.

The first arm 121 is a mold release agent nozzle 240 having a circular shape in place of the release agent nozzle 123. Similarly, the second arm 121 is an ethanol nozzle 241 having a circular shape in place of the ethanol nozzle 130 and having a discharge port.

On the top surface of the processing container 100, an ultrasonic vibrator 110 is provided at a position opposed to the template T held by the holding member 220. Further, a vibrator moving mechanism 111 for moving the ultrasonic vibrator 110 in the horizontal direction is also provided on the top surface of the processing container 100. Further, in the present embodiment, the ultrasonic vibrator 110 and the vibrator moving mechanism 111 are provided above the template T, but may be provided below the template T. For example, the ultrasonic vibrator 110 and the vibrator moving mechanism 111 may be disposed in the groove portion 221a.

In this case, in the project A3, the template T conveyed to the coating unit 30 is delivered to the holding member 220. Next, the release agent nozzle 240 is moved above the center portion of the template T, and the template T is rotated. Then, from demolding The agent nozzle 240 supplies the release agent S to the rotating template T, and the release agent S is diffused onto the template T by the telecentric force.

Then, in the work A4, the ethanol nozzle 241 is moved over the center portion of the template T, and the template T is continuously rotated. Further, ethanol A is supplied from the ethanol nozzle 241 to the rotating template T, and the ethanol A is diffused onto the template T by the telecentric force.

In the present embodiment, the release agent S and the ethanol A can be more uniformly applied to the template T, and the chemical reaction between the surface T ₁ of the template T and the release agent S can be promoted.

In the coating unit 30 of the above embodiment, the release agent S is supplied from the release agent nozzles 123, 211, and 240 to the template T. For example, the template T may be immersed in the immersion tank in which the release agent S is stored. The release agent S is applied to the template T.

In the above embodiment, the liquid A-form ethanol A is supplied to the release agent S of the template T in the coating unit 30, but the vaporized ethanol A may be supplied to the release agent S. In this case, in the project A4, the vaporized ethanol A is supplied into the processing container 100, and the environment in the processing container 100 forms an ethanol environment. Further, in the work A4, the liquid ethanol A can be supplied from the ethanol nozzle 130 to the release agent S while the ethanol environment is formed in the processing container 100.

In the above embodiment, the liquid release agent S is supplied to the surface T _{1 of the} template T in the coating unit 30, but the vaporized release agent gas may be adhered to the surface T _{1 of the} template T. In this case, in the first processing block G1 of the template processing apparatus 1, in place of the coating unit 30 and the cleaning unit 31 shown in FIG. 2, a coating unit 250 to be described later is disposed. Similarly, the coating unit 250 is disposed in place of the coating unit 32 and the cleaning unit 33 in the second processing block G2.

As shown in FIG. 20, the coating unit 250 has a mounting table 260 on which the template T is placed, and a lid 261 provided above the mounting table 260. The lid body 261 is configured to be movable in the vertical direction by, for example, a lifting mechanism (not shown). Further, the lower surface of the lid body 261 is an opening. Then, the lid body 261 and the mounting table 260 are integrated to form a sealed processing space K.

The template T is placed on the mounting table 260 such that the surface T _{1 of} the template T faces upward. A temperature control plate 270 that controls the temperature of the template T is provided on the upper surface of the mounting table 260. The temperature control panel 270 is, for example, a built-in cooling element (Peltier device) or the like, and can adjust the template T to a predetermined temperature. A lift pin 271 for lifting and lowering the template T from below is provided in the mounting table 260. The lift pin 271 can be moved up and down by the lift drive unit 272. A through hole 273 that penetrates the upper surface in the thickness direction is formed on the upper surface of the mounting table 260, and the lift pin 271 forms the insertion through hole 273.

On the top surface of the lid body 261, at a position facing the template T placed on the mounting table 260, an ultrasonic vibrator 280 that imparts ultrasonic vibration to the release agent S on the template T is provided, and The ultrasonic vibrator 280 moves to the vibrator moving mechanism 281 in the horizontal direction. Since the ultrasonic vibrator 280 and the vibrator moving mechanism 281 are the same as those of the ultrasonic vibrator 110 and the vibrator moving mechanism 111 of the above-described embodiment, description thereof will be omitted. Further, in the present embodiment, the ultrasonic vibrator 280 and the vibrator moving mechanism 281 is disposed above the template T, but may be disposed below the template T. For example, the ultrasonic vibrator 280 and the vibrator moving mechanism 281 may be disposed on the upper surface of the mounting table 260.

Further, a gas supply pipe 290 for supplying a release agent gas and water vapor to the die plate T is provided on the top surface of the lid body 261. The gas supply pipe 290 is connected to a release agent supply source 291 that supplies the release agent gas, and a water vapor supply source 292 that supplies the steam. Further, the gas supply pipe 290 is provided with a supply device group 293 including a valve or a flow rate adjusting unit that controls the flow of the release agent gas supplied from the release agent supply source 291 and the water vapor supplied from the steam supply source 292. . Further, in the present embodiment, the gas supply pipe 290 has a function as a decane coupling agent supply unit.

The release agent supply source 291 is a mold release agent S which is stored in a liquid state. Further, a gas supply pipe (not shown) that supplies nitrogen gas to the release agent supply source 291 is connected to the release agent supply source 291. In the release agent supply source 291, a liquid release agent S is vaporized by supplying nitrogen gas to the inside to generate a release agent gas. This release agent gas is supplied to the gas supply pipe 290 using the above nitrogen gas as a carrier gas.

The steam supply source 292 is, for example, a liquid water stored therein. Then, for example, the liquid water is heated to vaporize, and water vapor is generated.

An exhaust pipe 294 that exhausts the environment of the processing space K is connected to the side surface of the lid body 261. An exhaust pump 295 for evacuating the environment of the processing space K is connected to the exhaust pipe 294.

In this case, in the item A3, the template T conveyed to the coating unit 250 is transferred to the lift pins 271 and placed on the mounting table 260. At this time, the template T on the mounting table 260 is temperature-tuned to a predetermined temperature by the temperature control panel 270, for example, 50 °C. Then, the lid body 261 is lowered, and the lid body 261 and the mounting table 260 form a sealed processing space K. Then, a gaseous release agent gas is supplied from the gas supply pipe 290 to the processing space K. The supplied release agent gas is deposited along the transfer pattern C on the surface T ₁ of the template T. Then, in the work A4, water vapor is supplied from the gas supply pipe 290 to the processing space K, and this water vapor is supplied to the releasing agent S deposited on the template T.

Further, in the above-described work A4, water vapor is supplied to the release agent S on the template T, but ethanol, for example, t-pentyl alcohol, may be supplied in the same manner as in the above embodiment. In this case, it is preferable that the t-pentyl alcohol is vaporized and supplied from the gas supply pipe 290 to the processing space K. Further, in the projects A3 and A4, the supply of the release agent gas and the t-pentyl alcohol from the gas supply pipe 290 can be simultaneously performed.

Then, in the project A5, ultrasonic vibration is applied from the ultrasonic vibrator 280 to the release agent S on the template T. Thus, the surface of the template T is T ₁ and the chemical reaction will be to promote the release agent S, the template T T adhesion surface ₁ S of the release agent will increase. Specifically, the release agent molecules of the release agent S deposited on the template T by water vapor are hydrolyzed, and the surface T _{1 of the} template T and the release agent molecules are combined by dehydration condensation. In addition, since the function of the ultrasonic vibration combined here is the same as that of the above embodiment, the description thereof is omitted. As a result, the release film S _F along the transfer pattern C on the template T is formed into a film at a predetermined film thickness. Further, after the release film S _F is formed on the template T, the environment of the treatment space K may be replaced with an inert gas such as nitrogen.

In the work A3 of the present embodiment, since the gas-like release agent gas is deposited along the transfer pattern C on the template T, it is not necessary to clean the release agent S. Therefore, the work A6 of the above embodiment can be omitted.

In the coating unit 30 of the above embodiment, when the release agent S is applied onto the template T, the release agent S may be applied while irradiating the surface T ₁ of the template T with ultraviolet rays. Further, after the release agent S is applied onto the template T, the release agent S on the template T may be heated to a predetermined temperature while imparting ultrasonic vibration to the release agent S on the template T. For example 200 ° C. By irradiating the surface T ₁ of the template T with ultraviolet rays or heating the release agent S on the template T in this manner, the adhesion of the surface T _{1 of the} template T to the release agent S can be improved.

In the cleaning unit 31 of the above embodiment, the release agent S is washed by immersing the template T in the organic solvent accumulated in the immersion tank 141, but a cleaning unit having the same configuration as that of the coating unit 30 may be used. In this case, instead of the release agent nozzles 123, 211, and 240 of the coating unit 30, a cleaning liquid nozzle that supplies an organic solvent as a cleaning liquid for the release agent S to the template T is used.

In the above embodiment, when the release agent S as a decane coupling agent is formed on the template T as a substrate, the type of combination of the substrate and the decane coupling agent is not limited thereto. The present invention is also applicable to, for example, when a binder as a decane coupling agent is formed on a wafer as a substrate.

The film formation of the adhesion film on the wafer is performed by a wafer processing apparatus having the same configuration as that of the template processing apparatus 1. And, as shown in Figure 21, the mode The plate processing apparatus 1 and the wafer processing apparatus 310 may be provided in the imprint system 300. Further, the wafer processing apparatus 310 may be provided separately from the template processing apparatus 1 of the above-described embodiment. However, in the present embodiment, the case where it is provided in the imprint system 300 will be described.

The imprint system 300 has a template T processed by the template processing apparatus 1 in addition to the template processing apparatus 1 and the wafer processing apparatus 310, and forms a resistance on the wafer W to be processed by the wafer processing apparatus 310. Imprinting unit 320 of the agent pattern. An interface station 321 that performs the transfer of the template T is disposed between the imprint unit 320 and the template processing apparatus 1. Further, an interface station 322 that performs the transfer of the template T is disposed between the imprint unit 320 and the wafer processing apparatus 2. That is, the template processing apparatus 1, the interface station 321, the imprinting unit 320, the interface station 322, and the wafer processing apparatus 310 are arranged in the Y direction (the horizontal direction in FIG. 21) in this order, and are integrally connected.

The wafer processing apparatus 310 has a configuration in which the wafer loading/unloading station 330 and the wafer processing station 331 are integrally connected, and the wafer loading/unloading station 330 carries out a plurality of sheets between the outside and the imprinting system 300 in a cassette unit, for example. The wafer W of 25 sheets or the wafer _{W is carried} into and out of the wafer W. The wafer processing station 331 is provided with a plurality of processing units for performing predetermined processing on the wafer W.

A cassette mounting table 340 is provided at the wafer carry-in/out station 330. The cassette mounting table 340 has a plurality of wafer cassettes C _W placed in a row in the X direction (vertical direction in FIG. 21). That is, the wafer carry-in/out station 330 constitutes a wafer W that can hold a plurality of numbers.

A wafer conveyance body 342 that can move on the conveyance path 341 extending in the X direction is provided in the wafer carry-in/out station 330. The wafer transfer body 342 is expandable and contractible in the horizontal direction, and can be moved in the vertical direction and around the vertical axis (θ direction), and the wafer _W can be transferred between the wafer cassette C _W and the imprint unit 310.

A transport unit 350 is provided at a central portion of the wafer processing station 331. Around the transport unit 350, various processing units are arranged in a plurality of stages, for example, four processing blocks F1 to F4 are arranged. On the front side of the wafer processing station 331 (on the negative side in the X direction of FIG. 21), the first processing block F1 and the second processing block F2 are sequentially arranged from the wafer loading/unloading station 330 side. On the back side of the wafer processing station 331 (the positive side in the X direction of FIG. 21), the third processing block F3 and the fourth processing block F4 are sequentially disposed from the wafer loading/unloading station 330 side. A transfer unit 351 for transferring the wafer W is disposed on the wafer carry-in/outlet 330 side of the wafer processing station 331. Further, a transfer unit 352 for transferring the wafer W is also disposed on the interface station 322 side of the wafer processing station 331.

The transport unit 350 is a transport arm that holds the wafer W and transports it in the horizontal direction, the vertical direction, and the vertical axis. Further, the transport unit 350 can transport the wafer W to various processing units and transfer units 351 and 352 which will be described later in the processing blocks F1 to F4.

As shown in FIG. 22, in the first processing block F1, a plurality of liquid processing units are sequentially stacked, and for example, an adhesive agent as a decane coupling agent is applied to the surface (processed surface) of the wafer W. The coating unit 360 of the membrane device and the cleaning unit 361 for cleaning the adhesive on the wafer W are in two stages. Similarly to the second processing block F2, the coating unit 362 and the cleaning unit 363 are sequentially stacked in two stages. Further, in the lowermost stages of the first processing block F1 and the second processing block F2, chemical chambers 364 and 365 for supplying various processing liquids to the liquid processing unit are provided.

In addition, the configuration of the coating units 360 and 362 is the same as the configuration of the coating unit 30 that applies the release agent S to the template T, and thus the description thereof is omitted. However, instead of the release agent nozzle 123, a sealant nozzle on which the adhesive agent is applied to the wafer W is provided. The adhesive agent is used to improve the adhesion between the wafer W and the resist film, and is similar to the release agent S as a decane coupling agent. Therefore, the adhesive molecule in the adhesive has two functional groups. That is, the monofunctional group is an OR group (R For example, alkyl). Further, the other functional group SG is a functional group which easily reacts with the resist film, and has an organic component.

Further, the configuration of the cleaning units 361 and 363 is the same as the configuration of the cleaning unit 31 for cleaning the release agent S on the template T, and thus the description thereof will be omitted. That is, for example, an organic solvent is used as the cleaning liquid in the cleaning units 361 and 363.

As shown in FIG. 23, in the third processing block F3, the wafer W is irradiated with ultraviolet rays in two stages, and the surface (processed surface) before the adhesion film is formed on the wafer W is washed. Net unit 370, 371. Further, in the fourth processing block F4, similarly to the third processing block F3, two cleaning units 372 and 373 are superposed in this order.

The configuration of the cleaning units 370 to 373 is also the same as the configuration of the cleaning unit 40 for cleaning the surface T1 of the template T, and thus the description thereof will be omitted.

The interface station 321 is provided with a movement extending in the X direction as shown in FIG. The template transport body 381 that moves on the transport path 380. In the forward direction of the X direction of the conveyance path 380, the inversion unit 382 which reverses the front and back sides of the template T is disposed, and the buffer of the plurality of templates T is temporarily stored in the negative direction of the X direction of the conveyance path 380. Card 383. The template transport body 381 is expandable and contractible in the horizontal direction, and is movable in the vertical direction and around the vertical axis (θ direction), and can be used in the template processing station 3, the inversion unit 382, the buffer cassette 383, and the imprint unit 320. Transfer template T between. Further, in the template processing station 3 of the template processing apparatus 1, a transfer unit 384 for performing the transfer of the template T is disposed on the interface station 321 side of the transport unit 20.

The interface station 322 is provided with a wafer transfer body 391 that moves on a transfer path 390 that extends in the X direction. Further, a buffer cassette 392 that temporarily stores a plurality of wafers W is disposed on the negative side in the X direction of the transport path 390. The wafer transfer body 391 is expandable and contractible in the horizontal direction, and can be moved in the vertical direction and around the vertical axis (θ direction), and can be transferred between the wafer processing station 331, the buffer cassette 392, and the imprint unit 320. Round W.

Next, the configuration of the above-described imprint unit 320 will be described. The imprint unit 320 is a processing container 400 having a carry-out port (not shown) in which a template T is formed on the side surface and a carry-out port (not shown) of the wafer W as shown in FIG.

A wafer holding portion 401 on which a wafer W is placed and held is provided on the bottom surface of the processing container 400. The wafer W is placed on the upper surface of the wafer holding portion 401 so that the surface to be processed faces upward. A lift pin 402 for supporting and lowering the wafer W from below is provided in the wafer holding portion 401. The lift pin 402 can be moved up and down by the lift drive unit 403. On the wafer holding portion 401 The surface is formed with a through hole 404 that penetrates the upper surface in the thickness direction, and the lift pin 402 is formed with the through hole 404. Further, the wafer holding portion 401 is movable in the horizontal direction by the moving mechanism 405 provided below the wafer holding portion 401, and is rotatable about the vertical axis.

As shown in FIG. 25, a track 410 extending in the Y direction (the horizontal direction in FIG. 25) is provided on the side of the wafer holding portion 401 in the negative X direction (the downward direction in FIG. 25). The rail 410 is formed, for example, from the outside in the negative direction of the Y direction of the wafer holding portion 401 (the left direction in FIG. 25) to the outside in the positive direction of the Y direction (the right direction in FIG. 25). An arm 411 is mounted on the track 410.

The arm 411 is provided with a resist liquid nozzle 412 that supplies a resist liquid to the wafer W. The resist liquid nozzle 412 is, for example, the same or longer than the diameter of the wafer W, and has an elongated shape along the X direction. The resist liquid nozzle 412 is, for example, a nozzle using an ink jet method, and a plurality of supply ports (not shown) that are formed in a row along the longitudinal direction are formed in the lower portion of the resist liquid nozzle 412. Further, the resist liquid nozzle 412 can strictly control the supply timing of the resist liquid, the supply amount of the resist liquid, and the like.

The arm 411 is freely movable on the rail 410 by the nozzle driving portion 413. Thereby, the resist liquid nozzle 412 can be moved from the standby portion 414 provided on the outer side in the positive direction of the Y direction of the wafer holding portion 401 to the wafer W above the wafer holding portion 401, and can be in the crystal The surface of the circle W moves in the radial direction of the wafer W. Further, the arm 411 is lifted and lowered by the nozzle driving unit 413, and the height of the resist liquid nozzle 412 can be adjusted.

On the top surface of the processing container 400, above the wafer holding portion 401 is a template holding portion 420 provided with a holding template T as shown in Fig. 24 . In other words, the wafer holding portion 401 and the template holding portion 420 are disposed such that the wafer W placed on the wafer holding portion 401 and the template T held by the template holding portion 420 face each other. Further, the template holding portion 420 is a suction cup 421 having an outer peripheral portion that adsorbs and holds the back surface T ₂ of the template T. The suction cup 421 is movably movable in the vertical direction by a moving mechanism 422 provided above the suction cup 421, and is rotatable about a vertical axis. Thereby, the template T can be rotated up and down in the predetermined direction on the wafer W on the wafer holding portion 401.

The template holding portion 420 is a light source 423 having a template T provided above the chuck 421. The light source 423 is, for example, light that emits visible light, near-ultraviolet light, ultraviolet light, or the like, and light from the light source 423 is irradiated to the lower side through the template T.

The imprint system 300 of this embodiment is configured as described above. Next, the imprint process performed on the imprint system 300 will be described. Fig. 26 is a view showing the main processing flow of the imprint process, and Fig. 27 is a view showing the state of the template T and the wafer W for each process of the imprint process.

First, the template transporting body 12 transports the template T from the template to the inbound station 2 to the template processing station 3 (item B1 of Fig. 26). 3 is performed sequentially washed template T T ₁ as a surface (26 of the drawing B2) in the template processing stations, the coated surface of the release agent ₁ S is T (FIG. 26 project B3), of the release agent The application of the ethanol A of S (the engineering B4 of FIG. 26), the ultrasonic vibration of the release agent S on the template T (the engineering B5 of FIG. 26), and the cleaning of the release agent S (the engineering of FIG. 26) B6), a release film S _{F is} formed on the surface T _{1 of the} template T. Further, the above-described items B2 to B6 are the same as the items A2 to A6 of the above-described embodiment, and thus detailed description thereof will be omitted.

The template T forming the release film S _F is transferred to the transfer unit 384. Next, the template T is transported to the inversion unit 382 by the template transport body 381 of the interface station 321, and the front and back surfaces of the template T are reversed. That is, the back surface T _{2 of the} template T faces upward. Then, the template T is transported to the imprint unit 320 by the template transport body 381, and is sucked and held by the chuck 421 of the template holding unit 420 (item B7 of FIG. 26). In this case, the template T prior to the transfer nip unit 320, the template can temporarily keep the release film S _F is formed in the buffer cassette 383 T.

In the template processing station 3, the template T is subjected to predetermined processing, and in the template T being transported to the imprint unit 320, the wafer loading/unloading station 330 is transferred from the cassette mounting table 340 by the wafer transfer unit 342. The wafer cassette C _W takes out the wafer W and transports it to the transfer unit 351 of the wafer processing station 331 (item B8 of Fig. 26). Further, the wafer _W in the wafer cassette C _W is housed so that the surface to be processed faces upward.

Then, the wafer W is transported to the cleaning unit 370 by the transport unit 350, and the surface (processed surface) of the wafer W is washed (item B9 of FIG. 26). Then, the wafer W is transferred to the coating unit 360, the adhesive is applied onto the wafer W (the engineering B10 of FIG. 26), and the ethanol A is applied to the adhesive of the wafer W (FIG. 26). In the same manner as in the coating unit 360, the ultrasonic wave is applied to the adhesive on the wafer W (the engineering B12 of Fig. 26). As a result, the chemical reaction between the surface of the wafer W and the adhesive is promoted, and the adhesion between the surface of the wafer W and the adhesive is increased. Then, the wafer W is transported to the cleaning unit 361, and the adhesive on the wafer W is cleaned (item B13 of Fig. 26). As a result, as shown in FIG. 27(a), a film B _F of a predetermined film thickness is formed on the wafer W. Further, in the above-described processes B9 to B13, the same processing as the processes A2 to A6 performed on the template T in the above-described embodiment is performed on the wafer W, and thus detailed description thereof will be omitted.

The wafer W on which the adhesion film B _F is formed is transferred to the transfer unit 352. Next, the wafer W is transferred to the imprint unit 320 by the wafer transfer body 391 (item B14 of FIG. 26). At this time, before the wafer W is transported to the imprint unit 320, the wafer W on which the adhesion film B _F is formed may be temporarily stored in the buffer cassette 392.

The wafer W carried into the imprint unit 320 is transferred to the lift pins 402 and placed on the wafer holding portion 401 for holding. Then, after the wafer W held by the wafer holding unit 401 is moved to a predetermined position in the horizontal direction and aligned, the resist liquid nozzle 412 is moved in the radial direction of the wafer W, as shown in FIG. 27(b). The resist liquid R is applied to the adhesion film B _F of the wafer W (item B15 of Fig. 26). At this time, the control unit 160 controls the supply timing, the supply amount, and the like of the resist liquid R supplied from the resist liquid nozzle 412. That is, in the resist pattern formed on the wafer W, the amount of the resist liquid R coated with the portion corresponding to the convex portion (the portion corresponding to the concave portion of the transfer pattern C of the template T) is applied. In many cases, the portion corresponding to the concave portion (the portion corresponding to the convex portion of the transfer pattern C) is applied in such a manner that the amount of the resist liquid R to be applied is small. Thus, the resist liquid R is applied onto the wafer W in accordance with the aperture ratio of the transfer pattern C. Then, the surface of the wafer W and the resist liquid R are adhered by the adhesion film B _F on the wafer W, and the resist film R _{F is} formed as shown in Fig. 27 (c).

When the resist film R _F is formed on the wafer W, the wafer W held by the wafer holding portion 401 is moved to a predetermined position in the horizontal direction to be aligned, and is held by the template holding portion 420. The template T is rotated into a predetermined direction. Then, as shown by the arrow of Fig. 27(c), the template T is lowered to the wafer W side. The template T is lowered to a predetermined position, and the surface T _{1 of the} template T is pushed onto the resist film R _F on the wafer W. In addition, the predetermined position is set according to the height of the resist pattern formed on the wafer W. Next, light is irradiated from the light source 423. The light from the light source 423 is irradiated to the resist film R _F on the wafer W through the template T as shown in Fig. 27 (d), whereby the resist film R _F is photopolymerized. As a result, the transfer pattern C of the template T is transferred to the resist film R _F on the wafer W to form a resist pattern P (item B16 of FIG. 26).

Then, as shown in FIG. 27(e), the template T is raised to form a resist pattern P on the wafer W. At this time, since the release film S _{F is} formed on the surface T _{1 of the} template T, there is no possibility that the resist on the wafer W adheres to the surface T ₁ of the template T. Then, the wafer W is transferred to the wafer transfer body 342 by the lift pins 402, transported from the imprint unit 320 to the wafer carry-in/out station 330, and returned to the wafer cassette C _W (item B17 of FIG. 26). Further, although a thin resist residual film L may remain in the concave portion of the resist pattern P formed on the wafer W, it may be, for example, outside the imprint system 300 as shown in Fig. 27(f). The residual film L is removed as usual.

The above-described processes B8 to B17 are repeated, and a resist pattern P is formed on each of the plurality of wafers W by using a template T. During the period, the above-described processes B1 to B6 are repeated, and a release film S _F is formed on the surface T ₁ of the plurality of templates T. The template T forming the release film S _F is a buffer cassette 383 stored in the interface station 321 .

Then, when the predetermined number of wafers W are subjected to the works B8 to B17, the used template T is carried out from the imprinting unit 320 by the template transporting body 381, and is transported to the reversing unit 382 (engineering B18 of Fig. 26). ). Next, the template T in the buffer cassette 383 is transported to the imprint unit 320 by the template transport body 381. As a result, the template T in the imprint unit 320 is replaced. Further, the timing of replacing the template T is set in consideration of deterioration of the template T or the like. Also, when the wafer W forms a different resist pattern P, the template T is also replaced. Moreover, the template T can also be replaced, for example, every time the template T is used. Also, for example, the template T may be replaced at each wafer W, or for example, each batch may be replaced.

The used template T conveyed to the inverting unit 382 is inverted on the front and back sides. Then, the template T is returned to the template cassette C _T by the template transport body 381, the transport unit 20, and the template transport body 12. As described above, in the imprint system 300, the predetermined resist pattern P is continuously formed on the plurality of wafers W while continuously replacing the template T.

According to the above embodiment, in the wafer processing apparatus 310, since the ultrasonic wave is applied to the adhesive on the wafer W to which the adhesive is applied, the surface of the wafer W and the adhesive can be promoted. In the chemical reaction, the adhesion of the surface of the wafer W to the adhesive is increased. That is, the adhesive can be adhered to the surface of the wafer W for a short time. Thereby, the processing capability of the wafer processing can be improved.

Moreover, since the imprint system 300 has the template processing apparatus 1 and the wafer processing apparatus 310, in the imprint system 300, the release film S _F can be formed on the template T, and the adhesion film B can be formed on the wafer W. _F. Since the stencil processing and the wafer processing are performed in one imprint system 300 as described above, the processing capability of the imprint processing can be improved. Further, mass production of the semiconductor device can be achieved by this.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the invention is not limited thereto. As long as the person skilled in the art can think of various modifications and modifications within the scope of the technical idea described in the patent application, these are of course within the technical scope of the present invention. The present invention is not limited to this example, and various types can also be employed. The present invention is also applicable to a case where the substrate is an FPD (flat panel display) other than the wafer, or another substrate such as a photomask for a photomask.

1‧‧‧Template processing device

30, 32‧‧‧ Coating unit

102‧‧‧Template moving mechanism

110‧‧‧Supersonic vibrator

111‧‧‧ vibrator moving mechanism

123‧‧‧Release nozzle

130‧‧‧Ethanol nozzle

160‧‧‧Control Department

200‧‧‧ mixed liquid nozzle

210‧‧‧Support board

250‧‧‧ Coating unit

300‧‧‧ Imprinting system

310‧‧‧ Wafer Processing Unit

360, 362‧‧‧ coating unit

A‧‧‧Ethanol

B _F ‧‧‧ Cover film

C‧‧·Transfer pattern

S‧‧‧Release

S _F ‧‧‧ release film

T‧‧‧ template

W‧‧‧ wafer

FIG. 1 is a plan view showing a schematic configuration of a template processing apparatus including a coating unit according to the embodiment.

Fig. 2 is a side view showing the outline of a configuration of a template processing apparatus according to the embodiment.

Fig. 3 is a side view showing the outline of a configuration of a template processing apparatus according to the embodiment.

Figure 4 is a perspective view of the template.

Fig. 5 is a schematic longitudinal cross-sectional view showing a configuration of a coating unit.

Fig. 6 is a schematic cross-sectional view showing a configuration of a coating unit.

Fig. 7 is a schematic longitudinal cross-sectional view showing a configuration of a washing unit.

8 is a schematic longitudinal cross-sectional view showing a configuration of a cleaning unit.

Fig. 9 is a schematic cross-sectional view showing the configuration of a cleaning unit.

Fig. 10 is a flow chart showing each project of the template processing.

FIG. 11 is an explanatory view schematically showing a state of a template of each process of the template processing, wherein (a) shows a case where the surface of the template is washed, and (b) shows a case where a release agent is applied to the surface of the template. (c) is a case where ethanol is applied to the release film of the template, (d) is a case where ultrasonic vibration is applied to the template, and (e) is a case where a release film is formed on the template.

FIG. 12 is an explanatory view schematically showing the behavior of the release agent and the ethanol on the template, wherein (a) shows the case where ethanol is supplied to the release agent, and (b) shows the case where the functional group of the release agent shrinks. (c) is a case where the functional group of the release agent is elongated, and (d) is a case where ethanol enters between the release agent and the surface of the template.

Fig. 13 is an explanatory view showing a state in which the surface of the template is dehydrated and condensed with a releasing agent molecule.

Fig. 14 is an explanatory view showing a state in which the surface of the template is bonded to a release agent molecule.

Fig. 15 is a longitudinal cross-sectional view showing the outline of a configuration of a coating unit according to another embodiment.

Fig. 16 is a longitudinal cross-sectional view showing the outline of a configuration of a coating unit according to another embodiment.

Fig. 17 is a view showing the configuration of a coating unit according to another embodiment; A slightly longitudinal section.

Fig. 18 is a longitudinal cross-sectional view showing the outline of a configuration of a coating unit according to another embodiment.

19 is a plan view showing the outline of a configuration of a holding member.

Fig. 20 is a longitudinal cross-sectional view showing the outline of a configuration of a coating unit according to another embodiment.

21 is a plan view showing the outline of a configuration of an imprint system.

Fig. 22 is a side view showing the outline of the configuration of the imprint system.

Fig. 23 is a side view showing the outline of the configuration of the imprint system.

Fig. 24 is a longitudinal cross-sectional view showing the outline of a configuration of an imprint unit.

Fig. 25 is a schematic cross-sectional view showing the configuration of an imprint unit.

Fig. 26 is a flow chart showing each item of the imprint process.

Fig. 27 is an explanatory view schematically showing a state of a template and a wafer in each process of the imprint process, wherein (a) shows a case where an adhesive film is formed on a wafer, and (b) shows a state in which a wafer is dense. When the resist liquid is applied to the film, (c) is a case where a resist film is formed on the wafer, (d) is a photopolymerization of the resist film on the wafer, and (e) is The case where the resist pattern is formed on the wafer is shown, and (f) shows the case where the residual film on the wafer is removed.

A‧‧‧Ethanol

C‧‧·Transfer pattern

S‧‧‧Release

S _F ‧‧‧ release film

T‧‧‧ template

Claims (23)

A film forming method is a film forming method for forming a decane coupling agent on a substrate, characterized in that: a supply engineering, which supplies a decane coupling agent to a substrate; and a film forming process, which is in the above supply engineering The decane coupling agent supplied to the substrate imparts ultrasonic vibration, and a film of a decane coupling agent is formed on the substrate. The film forming method according to the first aspect of the invention, wherein in the film forming process, a reaction accelerator for promoting a reaction between a surface of the substrate and a decane coupling agent is supplied to the decane coupling agent on the substrate, and is supplied The decane coupling agent of the reaction accelerator imparts the above-described ultrasonic vibration. The film forming method of claim 2, wherein in the film forming process, the supply of the reaction accelerator is performed before drying the decane coupling agent on the substrate. The film forming method of claim 2, wherein in the film forming process, a support plate is disposed opposite to the decane coupling agent on the substrate, and the reaction accelerator is diffused to the decane coupling agent and Support between boards. The film forming method according to claim 2, wherein in the film forming process, the substrate is moved to spread the reaction accelerator on the silane coupling agent on the substrate. The film forming method according to any one of the above-mentioned invention, wherein the reaction accelerator is supplied to the decane coupling agent on the substrate when the reaction accelerator is supplied to the substrate. With the above A mixture of solvents for decane coupling agents. The film forming method according to any one of claims 2 to 6, wherein the reaction accelerator is ethanol. The film forming method according to any one of claims 1 to 7, wherein in the film forming process, the ultrasonic vibration is applied in a direction perpendicular to a surface of the substrate. The film forming method according to any one of the first to eighth aspects of the present invention, wherein in the film forming process, the ultrasonic vibrator or the substrate to which the ultrasonic vibration is applied is relatively moved. The film forming method according to any one of claims 1 to 9, wherein in the supply process, a liquid or gaseous decane coupling agent is supplied to the substrate. The film forming method according to any one of claims 1 to 10, wherein the substrate is a template in which a predetermined pattern is formed on the surface, and the decane coupling agent is a release agent. A program for operating a computer controlled by a control unit of the film forming apparatus by performing a film forming method according to any one of claims 1 to 11 by a film forming apparatus. . A readable computer memory medium storing the program as described in item 12 of the patent application. A film forming apparatus is a film forming apparatus for forming a decane coupling agent on a substrate, characterized by: a decane coupling agent supply unit that supplies a decane coupling agent to the substrate; The ultrasonic vibrator imparts ultrasonic vibration to the decane coupling agent supplied from the decane coupling agent supply unit to the substrate. The film forming apparatus of claim 14, comprising a reaction accelerator supply unit that supplies a surface of the substrate to the decane coupling agent by supplying a decane coupling agent supplied from the decane coupling agent supply unit to the substrate. Promoted reaction promoter. The film forming apparatus of claim 15, comprising a support plate disposed opposite to the decane coupling agent on the substrate, and diffusing the reaction accelerator between the decane coupling agent and the silane coupling agent. The film forming apparatus according to claim 15 or 16, wherein the reaction accelerator supply unit supplies a mixed liquid of the reaction accelerator and the solvent of the decane coupling agent. The film forming apparatus according to any one of claims 15 to 17, wherein the reaction accelerator is ethanol. The film forming apparatus according to any one of claims 14 to 18, wherein the ultrasonic vibrator is provided with the ultrasonic vibration in a direction perpendicular to a surface of the substrate. The film forming apparatus according to any one of claims 14 to 19, further comprising a substrate moving mechanism that moves the substrate. The film forming apparatus according to any one of claims 14 to 20, further comprising a vibrator moving mechanism that moves the ultrasonic vibrator. The film forming apparatus according to any one of claims 14 to 21, wherein the decane coupling agent supply unit supplies the substrate A liquid or gaseous decane coupling agent. The film forming apparatus according to any one of claims 14 to 22, wherein the substrate is a template in which a predetermined pattern is formed on the surface, and the decane coupling agent is a release agent.