JP2011104910A - Template processing method, program, computer storage medium, template processor, and imprinting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve throughput of template processing while forming a film of a mold release agent appropriately on the surface of a template. <P>SOLUTION: Template processing for forming the film of the mold release agent on the surface of the template includes cleaning the surface of the template (process A2), coating the surface of the template with the mold release agent by a coating unit (process A3), drying the mold release agent on the template (process A4), applying alcohol to the mold release agent on the template to stick the mold release agent closely to the surface of the template and eliminating the unreacted portion of the mold release agent (process A5), and drying to eliminate alcohol on the template (process A6), thus forming the film of the mold release agent with a predetermined film thickness on the surface of the template. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a template processing method, a program, a computer storage medium, a template processing apparatus, and an imprint system for forming a release agent on a template having a transfer pattern formed on the surface.

  For example, in a semiconductor device manufacturing process, for example, a photolithography process is performed on a semiconductor wafer (hereinafter referred to as “wafer”) to form a predetermined resist pattern on the wafer.

  When the resist pattern described above is formed, the resist pattern is required to be miniaturized in order to achieve higher integration of the semiconductor device. In general, the limit of miniaturization in the photolithography process is about the wavelength of light used for the exposure process. For this reason, it has been advancing to shorten the wavelength of exposure light. However, there are technical and cost limitations to shortening the wavelength of the exposure light source, and it is difficult to form a fine resist pattern on the order of several nanometers, for example, only by the method of advancing the wavelength of light. is there.

  Therefore, in recent years, it has been proposed to form a fine resist pattern on a wafer by using a so-called imprint method instead of performing a photolithography process on the wafer. In this method, a template (sometimes called a mold or a mold) having a fine pattern on the surface is pressure-bonded to the resist surface formed on the wafer, then peeled off, and the pattern is directly transferred to the resist surface. (Patent Document 1).

JP 2009-43998 A

  On the surface of the template used in the above-described imprinting method, a release agent having liquid repellency with respect to the resist is usually formed in order to make the template easy to peel from the resist.

  When forming a release agent on the surface of the template, first, after cleaning the surface of the template, the release agent is applied to the surface of the template. At this time, the contact angle of the release agent on the template is, for example, 77 degrees to 80 degrees. Next, the release agent is adhered to the surface of the template so that the release agent to be formed has a predetermined contact angle, for example, about 110 degrees and can exhibit a liquid repellent function with respect to the resist. Specifically, by chemically reacting the mold release agent and the template surface, among the components contained in the mold release agent, a component having liquid repellency to the resist, such as a fluoride component, is adsorbed on the template surface. Let Thereafter, the unreacted portion of the release agent is removed, and a release agent having a predetermined film thickness is formed on the surface of the template. The unreacted part of the release agent means a part other than the part where the release agent is chemically reacted with the surface of the template.

  However, when the release agent is formed as described above, it takes time to bring the release agent on the template into close contact with the surface of the template. For example, when the template is left in a room temperature atmosphere, it takes about 24 hours to bring the release agent into close contact with the template.

  Therefore, the inventors have attempted to heat and bake the release agent on the template in order to promote the chemical reaction between the release agent and the surface of the template. In this case, the time for bringing the release agent into close contact with the template could be shortened. For example, when the mold release agent is heated to 60 ° C., the time required to make the mold release agent adhere to the template is about 1 hour. When the mold release agent is heated to 200 ° C., the mold release agent is used as the template. The time required for adhesion was about 3 minutes.

  However, in this case, it takes time to cool the template once heated. Therefore, the throughput of template processing has not been improved. In addition, when the release agent is heated, the release agent expands thermally, so that the release agent cannot be formed on the surface of the template with a predetermined film thickness. When the imprint process is performed using the template on which the release agent is formed in this way, it is difficult to form a fine resist pattern on the order of several nanometers on the wafer.

  The present invention has been made in view of this point, and an object of the present invention is to improve the throughput of template processing while appropriately forming a release agent on the surface of the template.

  In order to achieve the above object, the present invention provides a template processing method for forming a release agent on a template having a transfer pattern formed on the surface, wherein the release agent is applied to the surface of the template. And an alcohol treatment step for improving the adhesion between the surface of the template and the release agent by applying an alcohol to the release agent on the template.

  As a result of investigations by the inventors, when alcohol is applied to the release agent on the template, the chemical reaction between the template surface and the release agent is promoted, and the adhesion between the template surface and the release agent is improved. I understood that. That is, when alcohol is applied to the release agent, the release agent can be brought into close contact with the surface of the template in a short time, and the contact angle of the release agent formed on the template is set to a predetermined angle. The mold release function of the mold can be exhibited. Thus, the release agent can be brought into close contact with the surface of the template in a short time, so that the throughput of the entire template processing can be improved. In addition, in this case, since it is not necessary to heat the release agent as in the prior art, the release agent does not thermally expand. Therefore, the release agent can be appropriately formed on the surface of the template with a predetermined film thickness.

  In the alcohol treatment step, after the adhesion between the surface of the template and the release agent is improved by the alcohol, an unreacted portion of the release agent on the template may be removed by the alcohol. The unreacted part of the release agent means a part other than the part where the release agent is chemically reacted with the surface of the template.

  At least during the alcohol treatment step or after the alcohol treatment step, the release agent on the template may be irradiated with light to further improve the adhesion between the surface of the template and the release agent. In such a case, the wavelength of the light is preferably 350 nm to 2500 nm.

  The template processing method may include a rinsing step of removing an unreacted portion of the release agent on the template with a rinsing liquid after the alcohol treatment step.

  The template processing method may include a cleaning step of cleaning the surface of the template before the releasing agent processing step.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to another aspect of the present invention, there is provided a template processing apparatus for forming a release agent on a template having a transfer pattern formed on a surface thereof, a rotation holding member for holding and rotating the template, It has an application unit provided with a release agent nozzle that supplies a release agent to the surface and an alcohol nozzle that supplies alcohol to the release agent on the template.

  The coating unit may include a light irradiation unit that irradiates light to the release agent on the template. In such a case, the coating unit may further include an optical filter that transmits only the light having a wavelength of 350 nm to 2500 nm.

  The coating unit may include a rinse liquid nozzle that supplies a rinse liquid to the release agent on the template. Moreover, the said template processing apparatus may have a rinse unit which removes the unreacted part of the said mold release agent apply | coated to the surface of the said template with the said application | coating unit with a rinse liquid.

  The template processing apparatus may include a cleaning unit that cleans the surface of the template before the release agent is applied by the coating unit.

  According to another aspect of the present invention, there is provided an imprint system including the template processing apparatus, wherein the transfer pattern is placed on a substrate using the template having a release agent formed on the surface thereof by the template processing apparatus. And an imprint unit that transfers the coating film to the coating film and forms a predetermined pattern on the coating film.

  ADVANTAGE OF THE INVENTION According to this invention, the throughput of template processing can be improved, forming a mold release agent into the surface of a template appropriately.

It is a top view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a perspective view of a template. It is a longitudinal cross-sectional view which shows the outline of a structure of a coating unit. It is a top view which shows the outline of a structure of a holding member. It is a cross-sectional view which shows the outline of a structure of a coating unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is a cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is the flowchart which showed each process of the template process. It is explanatory drawing which showed typically the state of the template in each process of a template process, (a) shows a mode that the surface of the template was wash | cleaned, (b) has applied the mold release agent to the surface of the template (C) shows a state in which alcohol is applied to the mold release agent on the template, and (d) shows a state in which the mold release agent is formed on the template. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of a rinse unit. It is a top view which shows the outline of a structure of the imprint system concerning this Embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the imprint unit. It is a cross-sectional view which shows the outline of a structure of an imprint unit. It is the flowchart which showed each process of the imprint process. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) shows a mode that the resist liquid was apply | coated on the wafer, (b) shows the resist film on a wafer. FIG. 3C shows a state in which photopolymerization is performed, FIG. 3C shows a state in which a resist pattern is formed on the wafer, and FIG. 3D shows a state in which a remaining film on the wafer is removed.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view schematically showing the configuration of the template processing apparatus 1 according to the present embodiment. 2 and 3 are side views showing an outline of the configuration of the template processing apparatus 1.

In the template processing apparatus 1 of the present embodiment, a template T having a rectangular parallelepiped shape and having a predetermined transfer pattern C formed on the surface is processed as shown in FIG. Hereinafter, the transfer pattern C means the side of the template T which is formed with the surface T _1, the surface T ₁ opposite to the surface of the backside T _2. For the template T, a transparent material that can transmit visible light, near ultraviolet light, ultraviolet light, or the like, such as glass, is used.

Template processing unit 1 includes a plurality as shown in FIG. 1, for example, five of the template T or transferring, between the outside and the template processing apparatus 1 with the cassette unit, carrying out a template T the template cassette C _T The template loading / unloading station 2 and the processing station 3 including a plurality of processing units for performing predetermined processing on the template T are integrally connected.

The template loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 can mount a plurality of template cassettes _{CT in a line} in the X direction (vertical direction in FIG. 1). That is, the template carry-in / out station 2 is configured to be capable of holding a plurality of templates T.

The template carry-in / out station 2 is provided with a template carrier 12 that can move on a conveyance path 11 extending in the X direction. The template transport body 12 is also movable in the vertical direction and the vertical direction (θ direction), and can transport the template T between the template cassette _CT and the processing station 3.

  The processing station 3 is provided with a transport unit 20 at the center thereof. Around the transport unit 20, for example, four processing blocks G1 to G4 in which various processing units are arranged in multiple stages are arranged. A first processing block G1 and a second processing block G2 are arranged in this order from the template loading / unloading station 2 side on the front side of the processing station 3 (X direction negative direction side in FIG. 1). A third processing block G3 and a fourth processing block G4 are arranged in this order from the template loading / unloading station 2 side on the back side of the processing station 3 (X direction positive direction side in FIG. 1). A transition unit 21 for delivering the template T is disposed on the template loading / unloading station 2 side of the processing station 3.

  The transport unit 20 has a transport arm that holds and transports the template T and is movable in the horizontal direction, the vertical direction, and the vertical direction. And the conveyance unit 20 can convey the template T with respect to the various processing units mentioned later and the transition unit 21 which are arrange | positioned in the processing blocks G1-G4.

  In the first processing block G1, as shown in FIG. 2, a plurality of liquid processing units, for example, coating units 30 and 31 for applying a liquid release agent and alcohol to the template T are stacked in two stages in order from the bottom. ing. Similarly, in the second processing block G2, the coating units 32 and 33 are stacked in two stages in order from the bottom. In addition, chemical chambers 34 and 35 for supplying a release agent to the coating units 30 to 33 are provided at the lowermost stages of the first processing block G1 and the second processing block G2, respectively.

The third processing block G3, the cleaning unit 40, 41 which ultraviolet rays are irradiated to the template T as shown in FIG. 3, the release agent on the template T is to clean the surface T ₁ of the before the deposition Are stacked in two steps from the bottom.

  In the fourth processing block G4, as in the third processing block G3, the cleaning units 42 and 43 are stacked in two stages in order from the bottom.

  Next, the structure of the coating units 30 to 33 described above will be described. As shown in FIG. 5, the coating unit 30 has a processing container 110 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

  A rotation holding member 111 that holds and rotates the template T is provided at the center in the processing container 110. A central portion of the rotation holding member 111 is depressed downward, and an accommodating portion 112 for accommodating the template T is formed. A groove 112 a smaller than the outer shape of the template T is formed in the lower portion of the housing portion 112. Therefore, in the accommodating portion 112, the inner peripheral portion of the lower surface of the template T is not in contact with the rotation holding member 111 by the groove portion 112 a, and only the outer peripheral portion of the lower surface of the template T is supported by the rotation holding member 111. As shown in FIG. 6, the accommodating portion 112 has a substantially rectangular planar shape that conforms to the outer shape of the template T. A plurality of projecting portions 113 projecting inward from the side surfaces are formed in the housing portion 112, and the template T accommodated in the housing portion 112 is positioned by the projecting portions 113. In addition, when the template T is transferred from the transfer arm of the transfer unit 20 to the storage unit 112, the cutout portion 114 is provided on the outer periphery of the storage unit 112 in order to avoid the transfer arm from interfering with the storage unit 112. It is formed in the place.

  As shown in FIG. 5, the rotation holding member 111 is attached to the cover body 115, and a rotation drive unit 117 is provided below the rotation holding member 111 via a shaft 116. By this rotation drive unit 117, the rotation holding member 111 can rotate around the vertical at a predetermined speed and can move up and down.

  Around the rotation holding member 111, there is provided a cup 120 for receiving and collecting the release agent scattered or dropped from the template T. A lower surface of the cup 120 is connected to a discharge pipe 121 that discharges the collected release agent and an exhaust pipe 122 that exhausts the atmosphere in the cup 120.

  As shown in FIG. 7, a rail 130 extending along the Y direction (left and right direction in FIG. 7) is formed on the X direction negative direction (downward direction in FIG. 7) side of the cup 120. For example, the rail 130 is formed from the outside of the cup 120 in the Y direction negative direction (left direction in FIG. 7) to the outside in the Y direction positive direction (right direction in FIG. 7). For example, two arms 131 and 132 are attached to the rail 130.

  A release agent nozzle 133 that supplies a release agent onto the template T is supported on the first arm 131. The first arm 131 is movable on the rail 130 by the nozzle driving unit 134. As a result, the release agent nozzle 133 can move from the standby portion 135 installed outside the cup 120 on the positive side in the Y direction to above the center portion of the template T in the cup 120. The first arm 131 can be moved up and down by a nozzle driving unit 134 and the height of the release agent nozzle 133 can be adjusted. Note that a material having a liquid repellency with respect to a resist film on the wafer, which will be described later, such as a fluorine-carbon compound, is used as the material of the release agent. In this embodiment, a liquid release agent is used, but a gaseous release agent may be used.

  The second arm 132 supports an alcohol nozzle 140 that supplies normal temperature alcohol, such as ethanol, to the mold release agent on the template T. The second arm 132 is movable on the rail 130 by the nozzle driving unit 141. As a result, the alcohol nozzle 140 can move from the standby portion 142 provided on the outer side of the cup 122 on the Y direction negative direction side to above the center portion of the template T in the cup 122. Further, the second arm 132 can be moved up and down by the nozzle driving unit 141, and the height of the alcohol nozzle 140 can be adjusted. In addition, alcohol should just be alcohols and you may use alcohol other than ethanol. For example, methanol, propanol, butanol, pentanol, hexanol, heptanol may be used, or a mixture of these alcohols may be used. The concentration of alcohol is not particularly limited, but is preferably 100%. Moreover, although normal temperature alcohol is used in this Embodiment, in order to suppress condensation of alcohol, you may use alcohol heated, for example to 70 degrees C or less. Furthermore, although liquid alcohol is used in the present embodiment, gaseous alcohol may be used.

In the above configuration, the release agent nozzle 133 and the alcohol nozzle 140 are supported by separate arms 131 and 132. However, the release agent nozzle 133 and the alcohol nozzle 140 are supported by the same arm. The movement and supply timing of the alcohol nozzle 140 may be controlled. Further, for example, a cleaning liquid nozzle for injecting a cleaning liquid, for example, an organic solvent, may be provided in the groove 112 a of the rotation holding member 111. By spraying the cleaning liquid onto the back surface T _{2 of the} template T from the cleaning liquid nozzle, the back surface T ₂ can be cleaned.

  In addition, since the structure of the coating units 31-33 is the same as that of the coating unit 30 mentioned above, description is abbreviate | omitted.

  Next, the structure of the washing | cleaning units 40-43 mentioned above is demonstrated. As shown in FIG. 8, the cleaning unit 40 includes a processing container 140 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

A chuck 141 for attracting and holding the template T is provided in the processing container 140. Chuck 141, the surface _{T 1} of the template T to face upward, suction-holds the rear surface _{T 2.} A chuck drive unit 142 is provided below the chuck 141. The chuck driving unit 142 is provided on the bottom surface in the processing container 150 and is mounted on a rail 143 extending along the Y direction. The chuck 141 can be moved along the rail 143 by the chuck driving unit 142.

An ultraviolet irradiation unit 144 that irradiates the template T held by the chuck 141 with ultraviolet rays is provided on the ceiling surface in the processing container 140 and above the rail 143. The ultraviolet irradiation unit 144 extends in the X direction as shown in FIG. Then, while moving the template T along the rail 143, by irradiating ultraviolet from the ultraviolet irradiation unit 144 to the surface T ₁ of the said template T, ultraviolet rays are irradiated onto the surface T ₁ the entire surface of the template T.

  In addition, since the structure of the washing | cleaning units 41-43 is the same as that of the structure of the washing | cleaning unit 40 mentioned above, description is abbreviate | omitted.

  The template processing apparatus 1 is provided with a control unit 200 as shown in FIG. The control unit 200 is a computer, for example, and has a program storage unit (not shown). The program storage unit controls the transfer of the template T between the template loading / unloading station 2 and the processing station 3, the operation of the drive system in the processing station 3, and the like, and executes template processing to be described later in the template processing apparatus 1. The program to be stored is stored. This program is recorded on a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), memory card, or the like. Or installed in the control unit 200 from the storage medium.

  The template processing apparatus 1 according to the present embodiment is configured as described above. Next, template processing performed in the template processing apparatus 1 will be described. FIG. 10 shows the main processing flow of this template processing, and FIG. 11 shows the state of the template T in each step.

First, the template carrier 12, the template T is taken from the template cassette C _T on the cassette mounting table 10, it is transported to the transition unit 21 in the processing station 3 (in FIG. 10 step A1). At this time, in the template cassette C _T, the template T, the surface T ₁ of the transfer pattern C is formed is accommodated so as to face upward, the template T in this state is conveyed to the transition unit 21.

Thereafter, the transport unit 20 transports the template T to the cleaning unit 40 and sucks and holds it on the chuck 141. Subsequently, while the template T is moved along the rail 143 by the chuck driving unit 142, the template T is irradiated with ultraviolet rays from the ultraviolet irradiation unit 144. Thus, the irradiated ultraviolet rays to the surface T ₁ the entire surface of the template T, impurities in the organic contaminants and particles of the surface T ₁ of the template T is removed as shown in FIG. 11 (a), the surface T ₁ is cleaned (Step A2 in FIG. 10).

Thereafter, the template T is transported to the coating unit 30 by the transport unit 20 and transferred to the rotation holding member 111. Subsequently, the release agent nozzle 133 is moved to above the center of the template T by the first arm 131 and the template T is rotated. Then, the template T is rotated, for example, for 10 seconds, a release agent is supplied onto the rotating template T, and the release agent is diffused on the template T by centrifugal force. Thus, the release agent S on the surface _{T 1} the entire surface of the template T is applied as shown in FIG. 11 (b) (step A3 in FIG. 10).

  Thereafter, the supply of the release agent S from the release agent nozzle 133 is stopped, and the template T is further rotated, for example, for 20 seconds. The mold release agent S on the template T is dried by the rotation of the template T (step A4 in FIG. 10). While the release agent S is being dried in this manner, the release agent nozzle 133 moves from above the center of the template T, and the second arm 132 causes the alcohol nozzle 140 of the standby unit 142 to move to the center of the template T. Move to the top of the section.

When the release agent S on the template T is dried, the template T is continuously rotated, for example, for 10 seconds, and alcohol is supplied to the release agent S on the rotating template T. Supplied alcohol diffuses over the release agent S by centrifugal force, it is applied to the surface T ₁ the entire surface of the template T (step A5 in FIG. 10). The coated alcohols Thus, 11 release agent S is firmly and closely chemically react with the surface T ₁ of the template T (c), the release agent S is adhered to the surface T ₁ of the said template T To do. In addition, after the release agent S adheres to the surface T ₁ of the template T in this way, only the unreacted portion of the release agent S by the alcohol on the release agent S, that is, the release agent S becomes the surface of the template T. T ₁ and by chemical reaction only other than the portion in close contact with the surface T ₁ is removed. At this time, since the release agent S is in close contact with the surface T ₁ of the template T, the release agent S having a predetermined distance from the surface T _{1 of the} template T is not peeled off. Further, the contact angle of the mold release agent S on the template T is a predetermined angle, for example, 108 degrees, and the mold release agent S has sufficient liquid repellency with respect to a resist film to be described later. Function can be demonstrated. Thus, the release agent S along the transfer pattern C is formed on the template T with a predetermined film thickness as shown in FIG.

  Thereafter, the supply of alcohol from the alcohol nozzle 140 is stopped, and the template T is further rotated, for example, for 20 seconds. By the rotation of the template T, the alcohol on the template T is dried and removed (step A6 in FIG. 10).

Thereafter, the transport unit 20, the template T is carried to the transition unit 21 and returned to the template cassette _{C T} by the template carrier 12 (step A7 in FIG. 10). Thus a series of template processing in template processing apparatus 1 is completed, the surface T ₁ of the template T, the release agent S along the shape of the transfer pattern C is formed in a predetermined thickness.

According to the above embodiment, since the alcohol was applied to the release agent S on the template T at step A5, the chemical reaction between the surface T ₁ and the release agent S of the template T is promoted, the template The adhesion between the surface T ₁ of T and the release agent S is improved. In other words, it can be brought into close contact with the surface T ₁ of the template T of the release agent S in a short time. Thereby, the throughput of the template process of process A1-process A7 can be improved.

Moreover, after contact the release agent S on the surface T ₁ of the template T by the alcohol in step A5, only unreacted portion of the release agent S is removed further by alcohol on the release agent S. Such a close contact between the surface T ₁ and the release agent S of the template T, since doing removing the unreacted portion of the release agent S in the same process, it is possible to further improve the throughput of template processing.

Further, since the release agent S is brought into close contact with the surface T ₁ of the template T in the step A5, it is possible to the contact angle of the release agent S on the template T at a predetermined angle. Thereby, the release agent S has sufficient liquid repellency with respect to the resist film, and can exhibit its release function.

Moreover, when adhering the surface T ₁ and the release agent S of the template T at step A5, since no heating as in the conventional release agent, the release agent S is not able to thermal expansion. Therefore, it is possible to appropriately deposited release agent S in a predetermined thickness on the surface T ₁ of the template T.

The step A4~ step A6, i.e., is carried out coating and drying the coating and drying of the alcohol of the release agent S in one of the coating unit 30, brought into close contact with the surface T ₁ and the release agent S of the template T Therefore, it is not necessary to separately provide a processing unit for performing the processing for this. For this reason, the template processing apparatus 1 can be reduced in size.

Moreover, since cleaning the surface T ₁ of the template T in step A2, it can be applied to the surface T ₁ of the template T of the release agent S in a predetermined thickness in the subsequent step S3. Note that this step A2 may be omitted if the surface T ₁ of the template T is prewashed thoroughly.

In the above-described steps, the mold release agent S and the alcohol on the template T are dried by rotating the template T in the steps A4 and A6. However, for example, inert gas such as nitrogen or drying is performed. by blowing a gas such as air to the surface T ₁ of the template T, the release agent S and alcohol on the template T may be actively dried. In such a case, the coating unit 30, the gas nozzle to blow the gas to the surface T ₁ of the template T are separately provided.

In the coating unit 30 of the above embodiment, the release agent S on the template T may be irradiated with light. In this case, as shown in FIG. 12, a light irradiation unit 210 for irradiating the template T with light is provided on the ceiling surface in the processing container 110 of the coating unit 30 and above the rotation holding member 111. Light irradiating part 210 is opposed to the surface T ₁ of the template T held by the rotary holding member 111 is disposed so as to cover the surface T ₁ the entire surface. For the light irradiation unit 210, for example, a metal hydride lamp is used.

An optical filter 211 that transmits only light of a predetermined wavelength is disposed between the rotation holding member 111 and the light irradiation unit 210. The optical filter 211 is opposed to the surface T ₁ of the template T held by the rotary holding member 111 is disposed so as to cover the surface T ₁ the entire surface. The optical filter 211 may be disposed on the light irradiation surface of the light irradiation unit 210. Further, the light irradiation unit 210 and the optical filter 211 may be disposed obliquely above the rotation holding member 111.

The predetermined wavelength of the light transmitted by the optical filter 211 described above is, for example, 350 nm to 2500 nm. As a result of examination by the inventors, when the release agent S on the template T is irradiated with light having such a wavelength, the chemical bonding between the surface T _{1 of the} template T and the release agent S can be promoted, and the surface of the template T It was found that the adhesion between T ₁ and the release agent S is improved. That is, it is possible to further promote the chemical bonding between the surface T ₁ of the template T and the release agent S with the alcohol described above, and to make the release agent S adhere to the surface T ₁ of the template T in a shorter time. I understood. Further, it was found that when the release agent S is irradiated with light having a wavelength shorter than 350 nm, the release agent S may be destroyed and its release function may be impaired. Further, it was found that when the release agent S is irradiated with light having a wavelength longer than 2500 nm, the release agent S may be heated and thermally expanded. In order to properly deposited release agent S in a predetermined thickness on the surface _{T 1} of the template T, and the 350nm~2500nm a predetermined wavelength of light as described above. The optical filter 211 may be formed by overlapping a filter that blocks light having a wavelength shorter than 350 nm and a filter that blocks light having a wavelength longer than 2500 nm.

  In addition, since the other structure of the coating unit 30 is the same as that of the coating unit 30 of the said embodiment, description is abbreviate | omitted.

In such a case, in step A5, alcohol is applied to the release agent S on the template T, and light is irradiated downward from the light irradiation unit 210. Of the irradiated light, light having a wavelength shorter than 350 nm and light having a wavelength longer than 2500 nm are blocked by the optical filter 211. Then, only light having a wavelength of 350 nm to 2500 nm passes through the optical filter 211 and is irradiated to the release agent S on the template T. And these alcohols with light, chemical bonds of the surface T ₁ and the release agent S of the template T is promoted, the release agent S on the surface T ₁ of the template T short, closely example 5 seconds. Since it is possible to adhere the surface T ₁ and the release agent S of the template T in a shorter time, it is possible to further improve the throughput of template processing. Since steps A1 to A4 and steps A6 and A7 are the same as those in the above embodiment, the description thereof is omitted.

In the above embodiment, alcohol is applied to the release agent S on the template T in Step A5 and light is applied to the release agent S. However, the alcohol on the template T is removed by drying in Step A6. After that, the release agent S may be irradiated with light. Moreover, you may irradiate light to the mold release agent S continuously after process A5 to process A6. In any case, it can be brought into close contact with the surface T ₁ of the template T of the release agent S in a short time.

  The application unit 30 of the above embodiment may further include a rinsing liquid nozzle 220 for supplying a rinsing liquid, for example, a solvent for the releasing agent S, to the releasing agent S on the template T as shown in FIG. Good. The rinse liquid nozzle 220 is supported by the third arm 221. The third arm 221 is movable on the rail 130 by the nozzle driving unit 222. Thus, the rinsing liquid nozzle 220 passes from the standby unit 223 installed between the standby unit 142 and the cup 120 to the upper part of the center of the template T in the cup 120 and between the standby unit 135 and the cup 120. It can move to the standby unit 224 installed. The third arm 221 can be moved up and down by the nozzle driving unit 222, and the height of the rinsing liquid nozzle 220 can be adjusted. Since the other configuration of the coating unit 30 is the same as that of the above embodiment, the description thereof is omitted. In the above configuration, the rinsing liquid nozzle 220 is supported by the third arm 221, but may be supported by the same arm together with the release agent nozzle 133 and the alcohol nozzle 140.

In such a case, while the alcohol on the template T is dried in step A6, the alcohol nozzle 140 moves from above the center of the template T, and the third arm 221 causes the rinse liquid nozzle 220 of the standby unit 224 to move to the template. Move to above the center of T. Then, supplying a rinsing liquid onto the template T during rotation, to rinse the surface T ₁ the entire surface of the template T. When a predetermined time elapses, only the unreacted portion of the release agent S is peeled off, and the release agent S along the transfer pattern C is formed on the template T. Then, after stopping the supply of the rinsing liquid, it continues to further rotate the template T, drying finishing off the surface T _1. In this way, the release agent S on the template T is rinsed. When the rinsing process of the release agent S is completed, the template T in step A7 is returned to the template cassette C _T. Since steps A1 to A7 are the same as those in the above embodiment, the description thereof is omitted. In the above configuration, the rinsing liquid is dried by rotating the template T. For example, an inert gas such as nitrogen or a gas such as dry air is sprayed on the surface T ₁ of the template T to The rinse solution may be actively dried.

  According to the above embodiment, even when the unreacted portion of the release agent S cannot be completely removed by alcohol in step A5, the unreacted portion of the release agent S can be reliably removed by the rinse liquid. . Therefore, the release agent S on the template T can be more reliably deposited with a predetermined film thickness.

  In the above embodiment, the rinsing liquid nozzle 220 is provided in the coating unit 30. Instead of this, the rinsing unit that removes the unreacted portion of the release agent S on the template T by the rinsing liquid is used as the template processing apparatus 1. It may be further provided inside. In this case, as shown in FIG. 14, a rinse unit 230 is arranged in the first processing block G1 instead of the coating unit 31 shown in FIG. Similarly, in the second processing block G2, a rinsing unit 231 is arranged instead of the coating unit 33. Moreover, the rinse liquid is supplied to the rinse units 230 and 231 from the chemical chambers 34 and 35, respectively.

  The rinsing unit 230 has a processing container 240 in which a loading / unloading port (not shown) for the template T is formed on the side surface as shown in FIG.

  An immersion tank 241 in which the template T is immersed is provided on the bottom surface in the processing container 240. A rinse liquid for rinsing the release agent S on the template T is stored in the immersion tank 241.

A holding part 242 for holding the template T is provided on the ceiling surface in the processing container 240 and above the immersion tank 241. Holding portion 242, the outer peripheral portion of the rear surface _{T 2} of the template T has a chuck 243 for holding suction. Template T has a surface T ₁ is held on the chuck 243 to face upward. The chuck 243 can be moved up and down by a lifting mechanism 244. And the template T is immersed in the rinse liquid stored in the immersion tank 241 in the state hold | maintained at the holding | maintenance part 242, and the mold release agent S on the said template T is rinsed.

The holding unit 242 includes a gas supply unit 245 provided above the template T held by the chuck 243. The gas supply unit 245 can spray an inert gas such as nitrogen or a gas such as dry air downward, that is, the surface T ₁ of the template T held by the chuck 243. Thus, it is possible to dry the surface T ₁ of the rinsing template T in the immersion bath 241. The rinse unit 230 is connected to an exhaust pipe (not shown) that exhausts the internal atmosphere.

  The configuration of the rinsing unit 231 is the same as the configuration of the rinsing unit 230 described above, and a description thereof will be omitted.

In such a case, after the alcohol on the template T is dried and removed in step A6, the template T is transported to the rinse unit 230 and held by the holding unit 242. Subsequently, the holding unit 242 is lowered and the template T is immersed in the rinse liquid stored in the immersion tank 241. When a predetermined time elapses, only the unreacted part of the release agent S is peeled off. Then, raise the holder 242, blowing gas to the template T from the gas supply unit 245, drying the surface T _1. Thus the process in the rinsing unit 230 is completed, the template T in step A7 is returned to the template cassette C _T. Since steps A1 to A7 are the same as those in the above embodiment, the description thereof is omitted.

  Also in the above embodiment, when the unreacted portion of the release agent S cannot be completely removed by alcohol in step A5, the unreacted portion of the release agent S can be surely removed by the rinse liquid. Therefore, the release agent S on the template T can be more reliably deposited with a predetermined film thickness.

In the above embodiment, while the template T is moved in the cleaning unit 40, the moving template T is irradiated with ultraviolet rays. For example, as in the coating unit 30 shown in FIG. using an ultraviolet irradiation portion covering the surface T ₁ the entire surface may be irradiated with ultraviolet rays to the template T. In this case, it is possible to irradiate ultraviolet rays to the surface T ₁ the entire surface of the template T by one irradiation, it is possible to clean the surface T ₁ of the template T quickly. In this case, the template T is rotated, may be irradiated with ultraviolet rays to the surface T ₁ entire template T in the rotation.

The template processing apparatus 1 of the above embodiment may be arranged in the imprint system 300 as shown in FIG. The imprint system 300 uses a template T to form a resist pattern on a wafer W as a substrate, and a plurality of, for example, 25 wafers W between the outside and the imprint system 300 in cassette units. It has a wafer carry-in / out station 311 for carrying in / out and carrying in / out the wafer W with respect to the wafer cassette _CW . An interface station 312 for transferring the template T is arranged between the template processing apparatus 1 and the imprint unit 310. The imprint system 300 has a configuration in which the template processing apparatus 1, the interface station 312, the imprint unit 310, and the wafer carry-in / out station 311 are integrally connected.

The wafer loading / unloading station 311 is provided with a cassette mounting table 320. The cassette mounting table 320 can mount a plurality of wafer cassettes _CW in a row in the X direction (vertical direction in FIG. 16). That is, the wafer carry-in / out station 311 is configured to be capable of holding a plurality of wafers W.

The wafer carry-in / out station 311 is provided with a wafer carrier 322 that can move on a conveyance path 321 extending in the X direction. The wafer carrier 322 is also movable in the vertical direction and around the vertical direction (θ direction), and can carry the wafer W between the wafer cassette _CW and the imprint unit 310.

  The wafer carry-in / out station 311 is further provided with an alignment unit 323 for adjusting the orientation of the wafer W. The alignment unit 323 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W, for example.

  The interface station 312 is provided with a template transport body 331 that moves on a transport path 330 extending in the X direction. A reversing unit 332 for inverting the front and back surfaces of the template T is disposed on the positive direction side of the transport path 330 in the X direction, and a plurality of templates T are temporarily stored on the negative direction side of the transport path 330 in the X direction. A buffer cassette 333 is disposed. The template transport body 331 is also movable in the vertical direction and around the vertical direction (θ direction), and can transport the template T between the processing station 3, the reversing unit 332, the buffer cassette 333, and the imprint unit 310.

  In the processing station 3 of the template processing apparatus 1, a transition unit 334 for delivering the template T is disposed on the interface station 312 side of the transport unit 20.

  Next, the configuration of the above-described imprint unit 310 will be described. As shown in FIG. 17, the imprint unit 310 has a processing container 340 in which a loading / unloading port (not shown) for the template T and a loading / unloading port (not shown) for the wafer W are formed on the side surfaces.

  A wafer holder 341 on which the wafer W is placed and held is provided on the bottom surface in the processing container 340. The wafer W is placed on the upper surface of the wafer holder 341 so that the surface to be processed faces upward. In the wafer holding part 341, elevating pins 342 for supporting the wafer W from below and elevating it are provided. The elevating pin 342 can be moved up and down by the elevating drive unit 343. A through hole 344 that penetrates the upper surface in the thickness direction is formed on the upper surface of the wafer holding portion 341, and the elevating pins 342 are inserted through the through holes 344. The wafer holding unit 341 can be moved in the horizontal direction and can be rotated around the vertical by a moving mechanism 345 provided below the wafer holding unit 341.

  As shown in FIG. 18, a rail 350 extending along the Y direction (left and right direction in FIG. 18) is provided on the negative side in the X direction (downward direction in FIG. 18) of the wafer holder 341. The rail 350 is formed, for example, from the outer side of the wafer holding portion 341 on the Y direction negative direction (left direction in FIG. 18) to the outer side on the Y direction positive direction (right direction in FIG. 18). An arm 351 is attached to the rail 350.

  The arm 351 supports a resist solution nozzle 352 that supplies a resist solution onto the wafer W. The resist solution nozzle 352 has, for example, an elongated shape along the X direction that is the same as or longer than the diameter dimension of the wafer W. For example, an ink jet type nozzle is used as the resist solution nozzle 352, and a plurality of supply ports (not shown) formed in a line along the longitudinal direction are formed below the resist solution nozzle 352. The resist solution nozzle 352 can strictly control the resist solution supply timing, the resist solution supply amount, and the like.

  The arm 351 is movable on the rail 350 by the nozzle driving unit 353. As a result, the resist solution nozzle 352 can move from the standby unit 354 installed on the outer side of the wafer holding unit 341 on the positive side in the Y direction to above the wafer W on the wafer holding unit 341, and further the surface of the wafer W The top can be moved in the radial direction of the wafer W. The arm 351 can be moved up and down by a nozzle driving unit 353, and the height of the resist solution nozzle 352 can be adjusted.

A template holder 360 that holds the template T as shown in FIG. 17 is provided on the ceiling surface in the processing container 340 and above the wafer holder 341. That is, the wafer holding unit 341 and the template holding unit 360 are arranged so that the wafer W placed on the wafer holding unit 341 and the template T held on the template holding unit 360 face each other. Furthermore, the template holding portion 360 has a chuck 361 for holding adsorb outer peripheral portion of the rear surface T ₂ of the template T. The chuck 361 is movable in the vertical direction and rotatable about the vertical by a moving mechanism 362 provided above the chuck 361. As a result, the template T can rotate up and down in a predetermined direction with respect to the wafer W on the wafer holder 341.

  The template holding unit 360 includes a light source 363 provided above the template T held by the chuck 361. The light source 363 emits light such as visible light, near ultraviolet light, and ultraviolet light, and the light from the light source 363 passes through the template T and is irradiated downward.

  The imprint system 300 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 300 will be described. FIG. 19 shows the main processing flow of this imprint process, and FIG. 20 shows the state of the template T and wafer W in each step of this imprint process.

First, the template T is transported from the template carry-in / out station 2 to the processing station 3 by the template carrier 12 (step B1 in FIG. 19). In the processing station 3, the cleaning of the surface _{T 1} of the template T (step B2 in FIG. 19), the application of the release agent S on the surface _{T 1} (step B3 in FIG. 19), the release agent S drying (in Figure 19 step B4), the step B5 alcohol coating (FIG. 19 to the release agent S on the template T), drying and removal of the alcohol (step B6 in FIG. 19) are performed sequentially release the surface _{T 1} of the template T The agent S is formed into a film. In addition, since these processes B2 to B6 are the same as the processes A2 to A6 in the above-described embodiment, detailed description thereof is omitted.

The template T on which the release agent S is formed is transported to the transition unit 334. Subsequently, the template T is transported to the reversing unit 332 by the template transport body 331 of the interface station 312 and the front and back surfaces of the template T are reversed. That is, the rear surface T ₂ of the template T is directed upwards. Thereafter, the template T is transported to the imprint unit 310 by the template transport body 331 and is sucked and held by the chuck 361 of the template holding unit 360.

Performs predetermined processing on the template T in the processing station 3 Thus, during transport of the template T to the imprint unit 310, the wafer loading and unloading stations 311, the wafer carrier 322, the wafer cassette C _W on the cassette mounting table 320 The wafer W is taken out from the wafer and transferred to the alignment unit 323. Then, the alignment unit 323 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W. Thereafter, the wafer W is transferred to the imprint unit 310 by the wafer transfer body 322 (step B7 in FIG. 19). In the wafer carry-in / out station 311, the wafers _W in the wafer cassette _CW are accommodated so that the surface to be processed faces upward. In this state, the wafers W are carried to the imprint unit 310.

  The wafer W carried into the imprint unit 310 is transferred to the lift pins 342 and is placed and held on the wafer holding unit 341. Subsequently, after aligning the wafer W held by the wafer holding unit 341 by moving it to a predetermined position in the horizontal direction, the resist solution nozzle 352 is moved in the radial direction of the wafer W, as shown in FIG. As shown, a resist solution is applied onto the wafer W to form a resist film R as a coating film (step B8 in FIG. 19). At this time, the control unit 200 controls the supply timing and supply amount of the resist solution supplied from the resist solution nozzle 352. That is, in the resist pattern formed on the wafer W, the amount of the resist solution applied to the portion corresponding to the convex portion (the portion corresponding to the concave portion in the transfer pattern C of the template T) is large, and the portion corresponding to the concave portion ( The resist solution is applied so that the amount of the resist solution applied to a portion corresponding to the convex portion in the transfer pattern C is small. Thus, the resist solution is applied on the wafer W in accordance with the aperture ratio of the transfer pattern C.

When the resist film R is formed on the wafer W, the wafer W held by the wafer holder 341 is moved to a predetermined position in the horizontal direction for alignment, and the template T held by the template holder 360 is used. Is rotated in a predetermined direction. Then, the template T is lowered to the wafer W side as shown by the arrow in FIG. Template T is lowered to a predetermined position, the surface T ₁ of the template T is pressed against the resist film R on the wafer W. The predetermined position is set based on the height of the resist pattern formed on the wafer W. Subsequently, light is emitted from the light source 363. The light from the light source 363 passes through the template T and is irradiated onto the resist film R on the wafer W, as shown in FIG. 20B, whereby the resist film R is photopolymerized. In this way, the transfer pattern C of the template T is transferred to the resist film R on the wafer W, and a resist pattern P is formed (step B9 in FIG. 19).

Thereafter, the template T is raised as shown in FIG. 20C to form a resist pattern P on the wafer W. At this time, since the surface T ₁ of the template T release agent S is coated, never resist on the wafer W adheres to the surface T ₁ of the template T. Thereafter, the wafer W is transferred to the wafer carrier 322 by the lift pins 342, transferred from the imprint unit 310 to the wafer carry-in / out station 311 and returned to the wafer cassette _CW (step B10 in FIG. 19). Note that a thin resist residual film L may remain in the recesses of the resist pattern P formed on the wafer W. For example, the residual film L outside the imprint system 300 as shown in FIG. The film L may be removed.

The above steps B7 to B10 (portions surrounded by a dotted line in FIG. 19) are repeatedly performed, and a resist pattern P is formed on each of the plurality of wafers W using one template T. During this period, it repeats the step B1~B6 described above, forming the release agent S on the surface T ₁ of the plurality of templates T. The template T on which the release agent S is formed is stored in the buffer cassette 333 of the interface station 312.

  When Steps B7 to B10 are performed on a predetermined number of wafers W, the used template T is unloaded from the imprint unit 310 by the wafer transfer body 331 and transferred to the reversing unit 332 (Step of FIG. 19). B11). Subsequently, the template T in the buffer cassette 333 is transported to the imprint unit 310 by the wafer transport body 331. Thus, the template T in the imprint unit 310 is exchanged. Note that the timing for exchanging the template T is set in consideration of deterioration of the template T and the like. The template T is also replaced when a different pattern P is formed on the wafer W. For example, the template T may be exchanged every time the template T is used once. Further, for example, the template T may be exchanged for each wafer W, or the template T may be exchanged for each lot, for example.

The used template T conveyed to the reversing unit 332 has its front and back surfaces reversed. Thereafter, the wafer transfer body 331, the transport unit 20, by the wafer transfer body 12, the template T is returned to the template cassette _{C T.} Thus, in the imprint system 300, the predetermined resist pattern P is continuously formed on the plurality of wafers W while the template T is continuously replaced.

  Since the imprint system 300 of the above embodiment includes the template processing apparatus 1, the template T is deposited on the imprint unit 310 while the release agent S is formed on the template T in the imprint system 300. Can be supplied continuously. Accordingly, for example, even when the resist pattern P is formed on the plurality of wafers W before the template T deteriorates, the template T in the imprint unit 310 can be exchanged continuously and efficiently. Therefore, the predetermined resist pattern P can be continuously formed on the plurality of wafers W. This also enables mass production of semiconductor devices.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The present invention is useful when a release agent is formed on a template having a transfer pattern formed on the surface, and a predetermined pattern is formed on a substrate using the template on which the release agent is formed. Useful when doing.

DESCRIPTION OF SYMBOLS 1 Template processing apparatus 30-33 Application | coating unit 40-43 Cleaning unit 111 Rotation holding member 133 Release agent nozzle 140 Alcohol nozzle 200 Control part 210 Light irradiation part 211 Optical filter 220 Rinse liquid nozzle 230, 231 Rinse unit 300 Imprint system 310 Imprint unit C Transfer pattern P Resist pattern R Resist film S Release agent T Template W Wafer

Claims (15)

A template processing method for forming a release agent on a template having a transfer pattern formed on a surface thereof,
A release agent treatment step of applying a release agent to the surface of the template;
Thereafter, an alcohol treatment step is applied to apply an alcohol to the mold release agent on the template to improve the adhesion between the surface of the template and the mold release agent. In the alcohol treatment step, after the adhesion between the surface of the template and the release agent is improved by the alcohol, an unreacted portion of the release agent on the template is removed by the alcohol. The template processing method according to claim 1. At least during the alcohol treatment step or after the alcohol treatment step, the release agent on the template is irradiated with light to further improve the adhesion between the surface of the template and the release agent. The template processing method according to claim 1 or 2. The template processing method according to claim 3, wherein the wavelength of the light is 350 nm to 2500 nm. The template processing method according to claim 1, further comprising a rinsing step of removing an unreacted portion of the release agent on the template with a rinsing liquid after the alcohol treatment step. The template processing method according to claim 1, further comprising a cleaning step of cleaning the surface of the template before the release agent processing step. A program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method according to claim 1. A readable computer storage medium storing the program according to claim 7. A template processing apparatus for forming a release agent on a template having a transfer pattern formed on a surface thereof,
A rotation holding member for holding and rotating the template;
A release agent nozzle for supplying a release agent to the surface of the template;
A template processing apparatus comprising: a coating unit including an alcohol nozzle that supplies alcohol to a release agent on the template. The template processing apparatus according to claim 9, wherein the coating unit includes a light irradiation unit that irradiates light to the release agent on the template. The template processing apparatus according to claim 10, wherein the coating unit includes an optical filter that transmits only the light having a wavelength of 350 nm to 2500 nm. The template processing apparatus according to claim 9, wherein the coating unit includes a rinse liquid nozzle that supplies a rinse liquid to a release agent on the template. The template processing apparatus according to claim 9, further comprising a rinsing unit that removes an unreacted portion of the release agent applied to the surface of the template by the rinsing liquid. . The template processing apparatus according to claim 9, further comprising a cleaning unit that cleans a surface of the template before the release agent is applied by the application unit. An imprint system comprising the template processing apparatus according to any one of claims 9 to 14,
An imprint unit that transfers the transfer pattern to a coating film formed on a substrate using the template having a release agent formed on the surface thereof by the template processing apparatus, and forms a predetermined pattern on the coating film. An imprint system comprising:

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