JP2012227317A - Deposition method, program, computer storage medium and deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance throughput of substrate processing by depositing a silane coupling agent appropriately on a substrate.SOLUTION: A surface of a template T is subjected to UV irradiation and cleaned (Fig. 11(a)). A mold release agent S is then applied onto the template T (Fig. 11(b)). Subsequently, alcohol A is applied onto the mold release agent S of the template T (Fig. 11(c)). Thereafter, supersonic vibration is imparted to the mold release agent S on the template T (Fig. 11(d)). Chemical reaction of the surface of the template T and the mold release agent S is accelerated by this supersonic vibration, and adhesion of the surface of the template T and the mold release agent S is enhanced. Finally, the mold release agent S on the template T is rinsed, and a mold release film Sis deposited on the template T along a transfer pattern (Fig. 11(e)).

Description

  The present invention relates to a film forming method, a program, a computer storage medium, and a film forming apparatus for forming a silane coupling agent on a substrate.

  For example, in a semiconductor device manufacturing process, for example, a photolithography process is performed on a semiconductor wafer (hereinafter referred to as “wafer”) to form a predetermined resist pattern on the wafer.

  When the resist pattern described above is formed, the resist pattern is required to be miniaturized in order to achieve higher integration of the semiconductor device. In general, the limit of miniaturization in the photolithography process is about the wavelength of light used for the exposure process. For this reason, it has been advancing to shorten the wavelength of exposure light. However, there are technical and cost limitations to shortening the wavelength of the exposure light source, and it is difficult to form a fine resist pattern on the order of several nanometers, for example, only by the method of advancing the wavelength of light. is there.

  Therefore, in recent years, it has been proposed to form a fine resist pattern on a wafer by using a so-called imprint method instead of performing a photolithography process on the wafer. In this method, a template (sometimes called a mold or a mold) having a fine pattern on the surface is pressure-bonded to the resist surface formed on the wafer, then peeled off, and the pattern is directly transferred to the resist surface. (Patent Document 1).

JP 2009-43998 A

  On the surface of the template used in the above-described imprinting method, a release agent having liquid repellency with respect to the resist is usually formed in order to make the template easy to peel from the resist.

  When forming a release agent on the surface of the template, first, after cleaning the surface of the template, the release agent is applied to the surface of the template. Next, the release agent is adhered to the surface of the template so that the release agent to be formed has a predetermined contact angle and can exhibit a liquid repellency function with respect to the resist. Specifically, by chemically reacting the mold release agent and the template surface, among the components contained in the mold release agent, a component having liquid repellency to the resist, such as a fluoride component, is adsorbed on the template surface. Let Thereafter, the unreacted portion of the release agent is removed, and a release agent having a predetermined film thickness is formed on the surface of the template. The unreacted part of the release agent means a part other than the part where the release agent is chemically reacted with the surface of the template.

  By the way, when the above-described imprint method is repeatedly performed, that is, when a plurality of resist patterns are formed on a plurality of wafers using one template, the release film on the template is deteriorated. For this reason, it is necessary to exchange a template regularly. Therefore, in order to reduce the replacement frequency of the template, an attempt has been made to improve the durability of the release agent by changing the material of the release agent.

  However, when the inventors investigated, in order to improve the durability of the mold release agent, when the material of the mold release agent was changed, the mold release agent was formed as described above, and the mold release agent was used as a template. It has been found that it may take time to adhere to the surface. For this reason, there is room for improvement in the throughput of the template processing.

  The present invention has been made in view of this point, and an object of the present invention is to appropriately form a silane coupling agent on a substrate to improve the throughput of substrate processing.

  In order to achieve the above object, the present invention provides a film forming method for forming a silane coupling agent on a substrate, the supply step of supplying the silane coupling agent on the substrate, And a film forming step of forming a film of the silane coupling agent on the substrate by applying ultrasonic vibration to the silane coupling agent supplied to the substrate.

  As a result of intensive studies by the inventors, when ultrasonic vibration is applied to the silane coupling agent on the substrate, the chemical reaction between the surface of the substrate and the silane coupling agent is promoted, and the surface of the substrate and the silane coupling agent are It has been found that the adhesion of the is improved. Specifically, when ultrasonic vibration is applied to the silane coupling agent, the silane coupling agent vibrates, so that water molecules enter between the silane coupling agent and the surface of the substrate. Then, hydrolysis of the silane coupling agent molecule is promoted by water molecules, and the hydrolyzed silane coupling agent molecule and the hydroxyl group on the surface of the substrate are bonded by dehydration condensation. Thus, the surface of the substrate and the silane coupling agent are firmly bonded, and the adhesion between the surface of the substrate and the silane coupling agent is improved. Therefore, when ultrasonic vibration is applied to the silane coupling agent, the silane coupling agent can be brought into close contact with the surface of the substrate in a short time, and the silane coupling agent can be appropriately formed on the substrate. Thus, since the silane coupling agent can be brought into close contact with the surface of the substrate in a short time, the throughput of the entire substrate processing can also be improved.

  In the film forming step, a reaction accelerator for promoting the reaction between the surface of the substrate and the silane coupling agent is supplied to the silane coupling agent on the substrate, and the silane coupling agent to which the reaction accelerator is supplied is supplied. The ultrasonic vibration may be applied.

  In the film forming step, the reaction accelerator may be supplied before the silane coupling agent on the substrate is dried.

  In the film forming step, a support plate may be disposed facing the silane coupling agent on the substrate, and the reaction accelerator may be diffused between the silane coupling agent and the support plate.

  In the film forming step, the reaction accelerator may be diffused on the silane coupling agent on the substrate by moving the substrate.

  In the film forming step, when the reaction accelerator is supplied to the silane coupling agent on the substrate, a mixed solution of the reaction accelerator and the solvent of the silane coupling agent may be supplied.

  The reaction accelerator may be an alcohol.

  In the film forming step, the ultrasonic vibration may be applied in a direction perpendicular to the substrate surface.

  In the film forming step, the ultrasonic vibrator for applying the ultrasonic vibration or the substrate may be relatively moved.

  In the supplying step, a liquid or gaseous silane coupling agent may be supplied onto the substrate.

  The substrate may be a template having a predetermined pattern formed on the surface, and the silane coupling agent may be a release agent.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control unit that controls the film forming apparatus in order to cause the film forming apparatus to execute the film forming method.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to still another aspect, the present invention provides a film forming apparatus for forming a silane coupling agent on a substrate, the silane coupling agent supplying unit supplying the silane coupling agent on the substrate, and the silane coupling agent And an ultrasonic vibrator for applying ultrasonic vibration to the silane coupling agent supplied onto the substrate from the supply unit.

  The film forming apparatus supplies a reaction accelerator for supplying a reaction accelerator for promoting the reaction between the surface of the substrate and the silane coupling agent to the silane coupling agent supplied onto the substrate from the silane coupling agent supply unit. May have a part.

  The film forming apparatus may include a support plate that is disposed to face the silane coupling agent on the substrate and diffuses the reaction accelerator between the film forming apparatus and the silane coupling agent.

  The reaction accelerator supply unit may supply a mixed solution of the reaction accelerator and the solvent of the silane coupling agent.

  The reaction accelerator may be an alcohol.

  The ultrasonic transducer may apply the ultrasonic vibration in a direction perpendicular to the substrate surface.

  The film forming apparatus may include a substrate moving mechanism that moves the substrate.

  The film forming apparatus may have a transducer moving mechanism that moves the ultrasonic transducer.

  The silane coupling agent supply unit may supply a liquid or gaseous silane coupling agent on the substrate.

  The substrate may be a template having a predetermined pattern formed on the surface, and the silane coupling agent may be a release agent.

  According to the present invention, it is possible to appropriately form a silane coupling agent on a substrate and improve the throughput of substrate processing.

It is a top view which shows the outline of a structure of the template processing apparatus template processing apparatus provided with the coating unit concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a perspective view of a template. It is a longitudinal cross-sectional view which shows the outline of a structure of a coating unit. It is a cross-sectional view which shows the outline of a structure of a coating unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a rinse unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is a cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is the flowchart which showed each process of the template process. It is explanatory drawing which showed typically the state of the template in each process of template processing, (a) shows a mode that the surface of a template is wash | cleaned, (b) shows a mode that a mold release agent is apply | coated to the surface of a template (C) shows a state in which alcohol is applied onto a mold release film of the template, (d) shows a state in which ultrasonic vibration is applied to the template, and (e) shows a mold release film formed on the template. The state that was done is shown. It is explanatory drawing which showed typically the behavior of the mold release agent and alcohol on a template, (a) shows a mode that alcohol was supplied on the mold release agent, (b) shows the functional group of a mold release agent. (C) shows a state in which the functional group of the release agent extends, and (d) shows a state in which alcohol enters between the release agent and the surface of the template. It is explanatory drawing which shows a mode that the surface of a template and a releasing agent molecule | numerator carry out dehydration condensation. It is explanatory drawing which shows a mode that the surface of the template and the mold release agent molecule | numerator couple | bonded. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a top view showing the outline of the composition of a holding member. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is a top view which shows the outline of a structure of an imprint system. It is a side view which shows the outline of a structure of an imprint system. It is a side view which shows the outline of a structure of an imprint system. It is a longitudinal cross-sectional view which shows the outline of a structure of the imprint unit. It is a cross-sectional view which shows the outline of a structure of an imprint unit. It is the flowchart which showed each process of the imprint process. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) shows a mode that the adhesion film was formed on the wafer, (b) on the adhesion film of a wafer (C) shows a state in which a resist film is formed on the wafer, (d) shows a state in which the resist film on the wafer is photopolymerized, and (e) shows in the wafer. A state where the resist pattern is formed is shown, and (f) shows a state where the remaining film on the wafer is removed.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view showing an outline of a configuration of a template processing apparatus 1 including a coating unit as a film forming apparatus according to the present embodiment. 2 and 3 are side views showing an outline of the configuration of the template processing apparatus 1.

In the template processing apparatus 1 of the present embodiment, a template T as a substrate having a rectangular parallelepiped shape and having a predetermined transfer pattern C formed on the surface is used as shown in FIG. Hereinafter, the transfer pattern C means the side of the template T which is formed with the surface T _1, the surface T ₁ opposite to the surface of the backside T _2. For the template T, a transparent material capable of transmitting light such as visible light, near ultraviolet light, and ultraviolet light, such as quartz glass, is used.

Template processing unit 1 includes a plurality as shown in FIG. 1, for example, five of the template T or transferring, between the outside and the template processing apparatus 1 with the cassette unit, carrying out a template T the template cassette C _T The template loading / unloading station 2 and the template processing station 3 including a plurality of processing units for performing predetermined processing on the template T are integrally connected.

The template loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 can mount a plurality of template cassettes _{CT in a line} in the X direction (vertical direction in FIG. 1). That is, the template carry-in / out station 2 is configured to be capable of holding a plurality of templates T.

The template carry-in / out station 2 is provided with a template carrier 12 that can move on a conveyance path 11 extending in the X direction. The template transport body 12 can be expanded and contracted in the horizontal direction, and can also move in the vertical direction and the vertical direction (θ direction), and can transport the template T between the template cassette _CT and the template processing station 3.

  The template processing station 3 is provided with a transport unit 20 at the center thereof. Around the transport unit 20, for example, four processing blocks G1 to G4 in which various processing units are arranged in multiple stages are arranged. A first processing block G1 and a second processing block G2 are sequentially arranged from the template loading / unloading station 2 side on the front side of the template processing station 3 (X direction negative direction side in FIG. 1). A third processing block G3 and a fourth processing block G4 are arranged in this order from the template loading / unloading station 2 side on the back side of the template processing station 3 (X direction positive direction side in FIG. 1). On the template loading / unloading station 2 side of the template processing station 3, a transition unit 21 for transferring the template T is disposed.

  The transport unit 20 has a transport arm that holds and transports the template T and is movable in the horizontal direction, the vertical direction, and the vertical direction. And the conveyance unit 20 can convey the template T with respect to the various processing units mentioned later and the transition unit 21 which are arrange | positioned in the processing blocks G1-G4.

The first processing block G1, applying a plurality of liquid processing units, for example, a liquid release agent and reaction accelerator of the surface T ₁ of the template T as a silane coupling agent as shown in FIG. 2, formed A coating unit 30 as a film device and a rinsing unit 31 for rinsing the release agent on the template T are stacked in two stages in order from the bottom. Similarly, in the second processing block G2, the coating unit 32 and the rinsing unit 33 are stacked in two stages in order from the bottom. In addition, chemical chambers 34 and 35 for supplying various processing liquids to the liquid processing unit are provided at the lowermost stages of the first processing block G1 and the second processing block G2, respectively.

The third processing block G3, the cleaning unit 40, 41 which ultraviolet rays are irradiated to the template T as shown in FIG. 3, a release film on the template T is to clean the surface T ₁ of the before the deposition Are stacked in two steps from the bottom. Also, in the fourth processing block G4, similarly to the third processing block G3, the cleaning units 42 and 43 are stacked in two stages in order from the bottom.

  Next, the configuration of the coating units 30 and 32 described above will be described. As shown in FIG. 5, the coating unit 30 has a processing container 100 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

A mounting table 101 on which the template T is mounted is provided on the bottom surface in the processing container 100. Template T has a surface T ₁ is placed on the top surface of the mounting table 101 to face upward. Below the mounting table 101, a template moving mechanism 102 is provided as a substrate moving mechanism incorporating a drive unit. The template moving mechanism 102 allows the mounting table 101 and the template T mounted on the mounting table 101 to move in the horizontal direction.

A top surface of the mounting table 101, the below the template T is mounted on the mounting table 101, a direction perpendicular to the surface T ₁ of the template T, i.e. ultrasonic transducer for applying ultrasonic vibration in the vertical direction An ultrasonic transducer 110 is provided. The ultrasonic transducer 110 is provided with an ultrasonic oscillation device (not shown) for oscillating ultrasonic waves from the ultrasonic transducer 110. Below the ultrasonic transducer 110, a transducer moving mechanism 111 with a built-in driving unit is provided. By this transducer moving mechanism 111, the ultrasonic transducer 110 is movable in the horizontal direction. The ultrasonic transducer 110 is movable independently from the mounting table 101.

  Inside the mounting table 101, lifting pins 112 are provided for supporting the template T from below and lifting it. The elevating pin 112 can be moved up and down by the elevating drive unit 113. The ultrasonic vibrator 110 is formed with a through-hole 114 that penetrates the ultrasonic vibrator 110 in the thickness direction, and the elevating pin 112 is inserted through the through-hole 114.

  As shown in FIG. 6, a rail 120 extending along the Y direction (left-right direction in FIG. 6) is provided on the side of the mounting table 101 in the negative X direction (downward in FIG. 6). The rail 120 is formed, for example, from the outside of the mounting table 101 on the Y direction negative direction (left direction in FIG. 6) side to the Y direction positive direction (right direction in FIG. 6) side. Arms 121 and 122 are attached to the rail 120.

  The first arm 121 supports a release agent nozzle 123 as a silane coupling agent supply unit that supplies a release agent onto the template T. The release agent nozzle 123 has, for example, an elongated shape along the X direction that is the same as or longer than one side dimension of the template T. The discharge port of the release agent nozzle 123 is formed in a slit shape. The release agent nozzle 123 is connected to a supply pipe 125 communicating with a release agent supply source 124 as shown in FIG. Note that a material having a liquid repellency with respect to a resist film on the wafer, which will be described later, such as a fluorine-carbon compound, is used as the material of the release agent.

As shown in FIG. 6, the first arm 121 is movable on the rail 120 by the nozzle driving unit 126. As a result, the release agent nozzle 123 can move from the standby unit 127 installed on the outside in the Y direction positive direction side of the mounting table 101 to above the template T on the mounting table 101, and the surface T of the template T. ₁ can be moved in the side direction of the template T. Further, the first arm 121 can be moved up and down by a nozzle driving unit 126, and the height of the release agent nozzle 123 can be adjusted.

The second arm 122 is supported by an alcohol nozzle 130 as a reaction accelerator supply unit that supplies alcohol as a reaction accelerator, for example, t-pentyl alcohol, onto the template T (on the mold release agent on the template T). Has been. The alcohol nozzle 130 has, for example, an elongated shape along the X direction that is equal to or longer than one side dimension of the template T. The discharge port of the alcohol nozzle 130 is formed in a slit shape. The alcohol nozzle 130 is connected to a supply pipe 132 communicating with an alcohol supply source 131 as shown in FIG. The alcohol that is a reaction accelerator can promote the chemical reaction between the surface T _{1 of the} template T and the release agent S.

As shown in FIG. 6, the second arm 122 is movable on the rail 120 by the nozzle driving unit 133. As a result, the alcohol nozzle 130 can move from the standby unit 134 installed on the outside in the Y direction positive direction side of the mounting table 101 to above the template T on the mounting table 101, and further on the surface T _{1 of the} template T. Can be moved in the side direction of the template T. The second arm 122 can be moved up and down by the nozzle driving unit 133 and the height of the alcohol nozzle 130 can be adjusted.

  The configuration of the coating unit 32 is the same as the configuration of the coating unit 30 described above, and a description thereof will be omitted.

  Next, the structure of the rinse units 31 and 33 described above will be described. The rinsing unit 31 has a processing container 140 in which a loading / unloading port (not shown) for the template T is formed on the side surface as shown in FIG.

  An immersion tank 141 in which the template T is immersed is provided on the bottom surface in the processing container 140. In the immersion tank 141, a rinse liquid for rinsing the release agent on the template T, for example, an organic solvent is stored.

A holding part 142 for holding the template T is provided on the ceiling surface in the processing container 140 and above the immersion tank 141. Holding portion 142, the outer peripheral portion of the rear surface _{T 2} of the template T has a chuck 143 for holding suction. Template T has a surface T ₁ is held on the chuck 143 to face upward. The chuck 143 can be moved up and down by a lifting mechanism 144. And the template T is immersed in the organic solvent stored in the immersion tank 141 in the state hold | maintained at the holding | maintenance part 142, and the mold release agent on the said template T is rinsed.

The holding unit 142 includes a gas supply unit 145 provided above the template T held by the chuck 143. The gas supply unit 145 can spray an inert gas such as nitrogen or a gas gas such as dry air downward, that is, on the surface T ₁ of the template T held by the chuck 143. Thus, it is possible to dry the surface T ₁ of the rinsing template T by dipping layer 141. The rinse unit 31 is connected to an exhaust pipe (not shown) for exhausting the internal atmosphere.

  The configuration of the rinsing unit 33 is the same as the configuration of the rinsing unit 31 described above, and a description thereof will be omitted.

  Next, the structure of the washing | cleaning units 40-43 mentioned above is demonstrated. As shown in FIG. 8, the cleaning unit 40 includes a processing container 150 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

A chuck 151 for attracting and holding the template T is provided in the processing container 150. Chuck 151, the surface _{T 1} of the template T to face upward, suction-holds the rear surface _{T 2.} A chuck drive unit 152 is provided below the chuck 151. The chuck driving unit 152 is provided on the bottom surface in the processing container 150 and is mounted on a rail 153 extending along the Y direction. The chuck 151 can be moved along the rail 153 by the chuck driving unit 152.

An ultraviolet irradiation unit 154 for irradiating the template T held by the chuck 151 with ultraviolet rays is provided on the ceiling surface in the processing container 150 and above the rail 153. The ultraviolet irradiation unit 154 extends in the X direction as shown in FIG. Then, while moving the template T along the rail 153, by irradiating ultraviolet from the ultraviolet irradiation unit 154 to the surface T ₁ of the said template T, ultraviolet rays are irradiated onto the surface T ₁ the entire surface of the template T.

  In addition, since the structure of the washing | cleaning units 41-43 is the same as that of the structure of the washing | cleaning unit 40 mentioned above, description is abbreviate | omitted.

  The template processing apparatus 1 is provided with a control unit 160 as shown in FIG. The control unit 160 is a computer, for example, and has a program storage unit (not shown). The program storage unit controls the transfer of the template T between the template loading / unloading station 2 and the template processing station 3, the operation of the drive system in the template processing station 3, and the like. The program that executes is stored. This program is recorded in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), memory card, or the like. Or installed in the control unit 160 from the storage medium.

  The template processing apparatus 1 according to the present embodiment is configured as described above. Next, template processing performed in the template processing apparatus 1 will be described. FIG. 10 shows the main processing flow of this template processing, and FIG. 11 shows the state of the template T in each step.

First, the template carrier 12, the template T is taken from the template cassette C _T on the cassette mounting table 10, (step A1 of FIG. 10) that is being conveyed to the transition unit 21 of the template processing station 3. At this time, in the template cassette C _T, the template T, the surface T ₁ of the transfer pattern C is formed is accommodated so as to face upward, the template T in this state is conveyed to the transition unit 21.

Thereafter, the transport unit 20 transports the template T to the cleaning unit 40 and sucks and holds it on the chuck 151. Subsequently, the template T is irradiated with ultraviolet rays from the ultraviolet irradiation unit 154 while moving the template T along the rails 153 by the chuck driving unit 152. In this way, as shown in FIG. 11A, the entire surface T _{1 of the} template T is irradiated with ultraviolet rays, organic contaminants, particles and other impurities on the surface T ₁ of the template T are removed, and the surface T ₁ is cleaned. (Step A2 in FIG. 10).

Thereafter, the template T is transported to the coating unit 30 by the transport unit 20. The template T conveyed to the coating unit 30 is transferred to the elevating pins 112 and placed on the placing table 101. Thereafter, the release agent S is supplied onto the template T from the release agent nozzle 123 while moving the release agent nozzle 123 in the side direction of the template T. Then, the release agent S is applied to the surface _{T 1} the entire surface of the template T as shown in FIG. 11 (b) (step A3 in FIG. 10).

  Thereafter, the supply of the release agent S from the release agent nozzle 123 is stopped, and the release agent nozzle 123 is moved to the standby unit 127. Subsequently, before the release agent S on the template T is dried, the alcohol nozzle 130 is moved in the side direction of the template T, and the t-pentyl alcohol A is transferred from the alcohol nozzle 130 onto the release agent S of the template T. (Hereinafter, simply referred to as “alcohol A”). And alcohol A is apply | coated to the whole surface on the mold release agent S of the template T, as shown in FIG.11 (c) (process A4 of FIG. 10).

Thereafter, as shown in FIG. 11D, ultrasonic vibration is applied from the ultrasonic vibrator 110 to the release agent S on the template T (step A5 in FIG. 10). Then, the chemical reaction between the surface T ₁ and the release agent S of the template T is accelerated, adhesion to the surface T ₁ and the release agent S of the template T is improved.

When the vibration intensity of the ultrasonic vibration applied from the ultrasonic vibrator 110 is not uniform in the template plane, the template T or the ultrasonic vibrator 110 is relatively moved by at least the template moving mechanism 102 or the vibrator moving mechanism 111. May be moved. In such a case, the vibration intensity of the ultrasonic vibration can be uniform within the template surface, the chemical reaction between the surface T ₁ and the release agent S of the template T can be uniformly accelerated.

Here, the action and effect when the ultrasonic vibration is applied to the release agent S on the template T described above will be described in detail with reference to FIG. 12 (a) is shown the state of the surface T ₁ of the previous template T for imparting ultrasonic vibrations, FIG. 12 (b) ~ (d) is a surface T ₁ of the template T in applying ultrasonic vibration state Is shown.

As shown in FIG. 12, a hydroxyl group (OH group) is formed on the surface T ₁ of the template T. Further, the release agent molecule of the release agent S that is a silane coupling agent has two functional groups. That is, the OR group that is one functional group is bonded to the surface T _{1 of the} template T. Further, OR groups of adjacent release agent molecules are also bonded to each other. R is an alkyl group, for example, CH ₃ . On the other hand, with other functional groups S _G (shaded portions in FIG. 12) is a functional group that exhibits the release function, a fluoride component.

As shown in FIG. 12A, even when the release agent S and the alcohol A are supplied onto the surface T _{1 of the} template T, atoms are densely arranged in the functional group S _G of the release agent S. Therefore, it takes time for the alcohol A to enter between the release agent S and the surface T _{1 of the} template T.

Therefore, ultrasonic vibration is applied from the ultrasonic vibrator 110 to the release agent S on the template T. The ultrasonic vibration is a compressional wave, the direction perpendicular to the surface T ₁ of the template T, i.e. traveling in the thickness direction of the release agent S. Then, the by ultrasonic vibration, the functional group S _G of release agent S as shown in FIG. 12 (b) ~ (d) vibrates in the vertical direction. Then, the functional group S _G as shown in FIG. 12 (b) when atrophy, alcohol A is moved downward. Next, as shown in FIG. 12C, when the functional group S _G is elongated, the atoms of the functional group S _G become sparse, and the alcohol A permeates the functional group S _G. When the functional group S _G as shown in FIG. 12 (d) to atrophy again to move further down the alcohol A, part of the alcohol A is the surface T ₁ of the release agent S and the template T Enter in between. When ultrasonic vibration is applied to the release agent S on the template T in this way, the alcohol A is easily moved.

When the alcohol A enters between the surface T ₁ of the release agent S and the template T, releasing agent molecules of the release agent S is hydrolyzed. Then, the surface T ₁ and a release agent molecules of the template T is bonded by dehydration condensation as shown in FIG. 13. Adjacent release agent molecules are bonded by dehydration condensation. Thus, the accelerated chemical reaction between the surface T ₁ and the release agent S of the template T as shown in FIG. 14, the adhesion between the surface T ₁ and the release agent S of the template T is improved.

Incidentally, in the coating unit 30, thus after the close contact between the surface T ₁ and the release agent S of Plates T, inert gas or dry air such as nitrogen, for example with respect to the release agent S on the template T The release agent S may be dried by spraying a gas gas such as.

Thereafter, the template T is transported to the rinse unit 31 by the transport unit 20 and held by the holding unit 142. Subsequently, the holding unit 142 is lowered, and the template T is immersed in the organic solvent stored in the immersion tank 141. When a predetermined time elapses, only the unreacted part of the release agent S, that is, only the part other than the part where the release agent S chemically reacts with the surface T _{1 of the} template T and adheres to the surface T ₁ is peeled off. At this time, since the release agent S on the surface T ₁ of the template T in the above-described step A5 are in close contact, the release agent S distance from the surface T ₁ of the predetermined template T it will not be peeled off. Thus, release film S _F along the transfer pattern C on the template T is deposited in a predetermined thickness as shown in FIG. 11 (e) (step A6 in FIG. 10). Then, raise the holding portion 142 blows air gas to the template T from the gas supply unit 145, drying the surface T _1.

Thereafter, the transport unit 20, the template T is carried to the transition unit 21 and returned to the template cassette _{C T} by the template carrier 12 (step A7 in FIG. 10). Thus a series of template processing in template processing apparatus 1 is completed, the surface T ₁ of the template T, the release agent S along the shape of the transfer pattern C is formed in a predetermined thickness.

According to the above embodiment, in step A5, since the ultrasonic vibration to the release agent S on the template T from the ultrasonic transducer 110 is applied, the functional group S _G of the release agent S is vibrated, Alcohol A enters between the release agent S and the surface T _{1 of the} template T. Then, hydrolysis of the release agent molecules by an alcohol A is promoted, the hydroxyl group of the surface T ₁ of the hydrolyzed releasing agent molecule and the template T are coupled by dehydration condensation. Therefore, the chemical reaction between the surface T _{1 of the} template T and the release agent S is promoted, and the adhesion between the surface T _{1 of the} template T and the release agent S is improved. In other words, it can be brought into close contact with the surface T ₁ of the template T of the release agent S in a short time. Thereby, the throughput of the template process of process A1-process A7 can be improved.

The template T is made of quartz glass and is in an amorphous state. Therefore, the hydroxyl groups of the surface T ₁ of the template T is disposed in irregular positions, also are oriented random directions, it is difficult to react with the release agent S. According to the present embodiment, since the release agent S vibrates by applying ultrasonic vibration to the release agent S on the template T, the binding that has been difficult to combine conventionally is also promoted. Accordingly, with the surface T ₁ and the release agent S of the template T capable of binding in a shorter time, it can be further strengthened the bond.

Further, ultrasonic vibration from the ultrasonic transducer 110 to the template T Since the vibration in the thickness direction (vertical direction) of the release agent S, also vibrates in the thickness direction function S _G of the release agent S. That is, the moving direction of the vibration direction and alcohol A functional group S _G match. Therefore, the movement of the alcohol A can be performed efficiently. Even by applying ultrasonic vibration from a direction other than the thickness direction of the release agent S, it is possible to vibrate the mold release agent S, the chemical surface T ₁ and the release agent S of the template T than conventional The reaction can be promoted. Among these, this embodiment can promote the chemical reaction by moving the alcohol A most efficiently.

As a result of inventors studied intensively, the use of alcohol as a reaction accelerator, it has been found that can facilitate the chemical reaction between the surface T ₁ and the release agent S of the template T. That is, it was found that when alcohol A is supplied onto the release agent S as in the present embodiment, the release agent molecules are efficiently hydrolyzed. Therefore, it is possible to close contact with the surface T ₁ of the template T of the release agent S in a shorter time.

In the present embodiment, alcohol A is used for hydrolysis of the release agent molecules, but water molecules contained in the atmosphere in the coating unit 30 may be used. In such a case, the chemical reaction between the surface T _{1 of the} template T and the release agent S takes longer than using the alcohol A, but a mechanism for supplying the alcohol A (the alcohol nozzle 130 or the like) may be omitted. It is possible to simplify the apparatus configuration.

In the above embodiment, the ultrasonic vibration is applied from the lower side of the template T in the coating unit 30, but may be applied from the upper side of the template T. For example, as shown in FIG. 15, the ultrasonic transducer 110 is provided on the ceiling surface of the processing container 100 at a position facing the template T mounted on the mounting table 101. In addition, a transducer moving mechanism 111 that moves the ultrasonic transducer 110 in the horizontal direction is also provided on the ceiling surface of the processing container 100. In such a case, the direction perpendicular to the surface T ₁ of the ultrasonic vibration template T, that is, can be applied in the thickness direction of the release agent S, the release agent S is vibrated, the surface T ₁ and the release of the template T The chemical reaction of the mold S can be promoted.

  In the above embodiment, the alcohol A is supplied onto the mold release agent S of the template T in the coating unit 30, but a mixed liquid of, for example, an organic solvent is supplied as the solvent of the alcohol A and the mold release agent S. May be. For example, as shown in FIG. 16, a mixed solution nozzle 200 is supported on the second arm 122 instead of the alcohol nozzle 130. In addition to the supply pipe 132 communicating with the alcohol supply source 131, a supply pipe 202 communicating with the organic solvent supply source 201 is connected to the mixed solution nozzle 200.

In such a case, in step A <b> 4, the alcohol A supplied from the alcohol supply source 131 and the organic solvent supplied from the organic solvent supply source 201 are mixed in the mixed solution nozzle 200. Then, the liquid mixture is supplied onto the mold release agent S of the template T from the liquid mixture nozzle 200. Since the liquid mixture supplied onto the release agent S contains an organic solvent, the liquid mixture easily diffuses on the release agent S. If it does so, alcohol A can be more uniformly apply | coated on the mold release agent S, and a release agent molecule | numerator can be hydrolyzed appropriately. Therefore, the chemical reaction between the surface T _{1 of the} template T and the release agent S can be promoted.

  Here, in step A4 of the above embodiment, alcohol A was applied on mold release agent S before mold release agent S on template T was dried, but mold release was performed before alcohol A was applied. The agent S may be dried. In such a case, it becomes difficult for the alcohol A to diffuse on the release agent S. On the other hand, since the mixture of alcohol A and organic solvent easily diffuses on the release agent S, the present embodiment can be applied even if the release agent S is dry.

  In the present embodiment, the alcohol A and the organic solvent are mixed in the mixed solution nozzle 200, but the mixing method of the alcohol A and the organic solvent is not limited to this. For example, the mixed solution may be supplied to the mixed solution nozzle 200 from a mixed solution supply source (not shown) that mixes and stores the alcohol A and the organic solvent.

In the coating unit 30 of the above embodiment, a support plate 210 for diffusing the release agent S and alcohol A on the template T may be disposed above the mounting table 101 as shown in FIG. The support plate 210 has, for example, a flat plate shape. Support plate 210 is opposed to the template T on the table 101, the distance between the surface T ₁ of the said template T is located at a predetermined distance, for example within 1mm position. The support plate 210 is disposed so as to cover the surface T ₁ the entire surface of the template T. The support plate 210 can be moved in the processing container 100 by a moving mechanism (not shown).

  Instead of the release agent nozzle 123, the first arm 121 supports a release agent nozzle 211 that is arranged so that the supply port 211 a at the lower end portion faces obliquely downward. The supply port 211a of the release agent nozzle 211 may be, for example, a circular shape or a slit shape. Similarly, instead of the alcohol nozzle 130, the second arm 122 also supports an alcohol nozzle 212 arranged so that the supply port 212 a at the lower end portion faces obliquely downward. The supply port 212a of the alcohol nozzle 212 may have a circular shape or a slit shape, for example.

In such a case, in step A <b> 3, the release agent S is supplied from the release agent nozzle 211 between the end of the surface T <b> ₁ of the template T and the end of the support plate 210. Supplied release agent S is diffused between the surface T ₁ and the support plate 210 of the template T by capillarity (surface tension). Thereafter, in step A4, for supplying alcohol A between the end portion of the support plate 210 from the alcohol nozzle 212 and the end portion of the surface T ₁ of the template T. The supplied alcohol A diffuses between the release agent S of the template T and the support plate 210 by capillary action (surface tension).

According to the present embodiment, the release agent S and the alcohol A can easily diffuse on the template T, so that the release agent S and the alcohol A can be more uniformly applied on the template T. The chemical reaction between the surface T ₁ and the release agent S can be promoted. In addition, since the alcohol A easily diffuses on the release agent S, the present embodiment can be applied even if the release agent S is dry.

In the above embodiment, the support plate 210 has a flat plate shape, but may have a mesh shape. Even in such a case, the surface T _{1 of the} template T can be diffused by the surface tension of the release agent S and the alcohol A. In such a case, the release agent S and the alcohol A can also be supplied from above the support plate 210.

In Step A3 and Step A4 of the above embodiment, for diffusing the release agent S and alcohols A in the surface T ₁ of the template T, it may be moved template T. In example step A3 movement, after supplying the release agent S on the template T, if the surface T ₁ the entire surface release agent S of the template T is such not diffused by the template moving mechanism 120 templates T Thus, the release agent S can be diffused. Similarly, also in step A4, the template T is moved by the template moving mechanism 120, and the alcohol A can be diffused on the release agent S of the template T.

In the step A3 and Step A4, for diffusing the release agent S and alcohols A in the surface T ₁ of the template T, it may be the template T is rotated. In this case, for example, as shown in FIG. 18, a holding member 220 that holds and rotates the template T is provided in the processing container 100 of the coating unit 30 instead of the mounting table 101 of the above embodiment. A central portion of the holding member 220 is depressed downward, and an accommodating portion 221 for accommodating the template T is formed. A groove portion 221 a smaller than the outer shape of the template T is formed in the lower portion of the housing portion 221. Therefore, in the accommodating part 221, the inner peripheral part of the lower surface of the template T is not in contact with the holding member 220 by the groove part 221a, and only the outer peripheral part of the lower surface of the template T is supported by the holding member 220. As shown in FIG. 19, the accommodating portion 221 has a substantially rectangular planar shape that conforms to the outer shape of the template T. A plurality of projecting portions 222 projecting inward from the side surface are formed in the housing portion 221, and the template T housed in the housing portion 221 is positioned by the projecting portion 222. Further, when the template T is transferred from the transport arm of the transport unit 20 to the storage unit 221, there are four notches 223 on the outer periphery of the storage unit 221 in order to prevent the transport arm from interfering with the storage unit 221. It is formed in the place.

  As shown in FIG. 18, the holding member 220 is attached to the cover body 224, and a rotation driving unit 226 is provided below the holding member 220 via a shaft 225. By this rotation drive unit 226, the holding member 220 can rotate at a predetermined speed around the vertical and can move up and down.

  Around the holding member 220, there is provided a cup 230 that receives and collects the release agent scattered or dropped from the template T. A discharge pipe 231 for discharging the collected release agent and an exhaust pipe 232 for exhausting the atmosphere in the cup 230 are connected to the lower surface of the cup 230.

  Instead of the release agent nozzle 123, a release agent nozzle 240 having a circular discharge port shape is supported on the first arm 121. Similarly, the second arm 121 has an alcohol nozzle 241 having a circular discharge port instead of the alcohol nozzle 130.

  An ultrasonic transducer 110 is provided on the ceiling surface of the processing container 100 at a position facing the template T held by the holding member 220. Further, a transducer moving mechanism 111 that horizontally moves the ultrasonic transducer 110 is also provided on the ceiling surface of the processing container 100. In the present embodiment, the ultrasonic transducer 110 and the transducer moving mechanism 111 are provided above the template T, but may be provided below the template T. For example, the ultrasonic transducer 110 and the transducer moving mechanism 111 may be arranged in the groove 221a.

  In such a case, the template T conveyed to the coating unit 30 is transferred to the holding member 220 in step A3. Subsequently, the release agent nozzle 240 is moved to above the center of the template T and the template T is rotated. Then, the release agent S is supplied from the release agent nozzle 240 onto the rotating template T, and the release agent S is diffused on the template T by centrifugal force.

  Thereafter, in step A4, the alcohol nozzle 241 is moved to above the center of the template T, and the template T is continuously rotated. Then, the alcohol A is supplied from the alcohol nozzle 241 onto the rotating template T, and the alcohol A is diffused on the template T by centrifugal force.

Also in the present embodiment, the release agent S and the alcohol A can be more uniformly applied on the template T, and the chemical reaction between the surface T _{1 of the} template T and the release agent S can be promoted.

  In the coating unit 30 of the above embodiment, the release agent S is supplied from the release agent nozzles 123, 211, and 240 onto the template T. For example, the template T is placed in the immersion tank in which the release agent S is stored. The mold release agent S may be applied on the template T.

  In the above embodiment, the liquid alcohol A is supplied onto the release agent S of the template T in the coating unit 30, but the vaporized alcohol A may be supplied onto the release agent S. . In such a case, in step A4, the vaporized alcohol A is supplied into the processing container 100, and the atmosphere in the processing container 100 is changed to an alcohol atmosphere. Further, in step A4, the liquid alcohol A may be supplied from the alcohol nozzle 130 onto the release agent S while the inside of the processing container 100 is in an alcohol atmosphere.

In the above embodiment, the coating unit 30, but the surface T ₁ of the template T has been supplied a liquid release agent S, the vaporized release agent gas to the surface T ₁ of the template T by depositing Also good. In such a case, in the first processing block G1 of the template processing apparatus 1, a coating unit 250, which will be described later, is arranged instead of the coating unit 30 and the rinsing unit 31 shown in FIG. Similarly, in the second processing block G2, a coating unit 250 is disposed instead of the coating unit 32 and the rinse unit 33.

  As shown in FIG. 20, the application unit 250 includes a mounting table 260 on which the template T is mounted, and a lid 261 provided above the mounting table 260. The lid 261 is configured to be movable in the vertical direction by, for example, an elevating mechanism (not shown). Further, the lower surface of the lid 261 is open. The lid 261 and the mounting table 260 are integrated to form a sealed processing space K.

The mounting table 260, the surface T ₁ of the template T the template T is placed to face upward. A temperature control plate 270 that controls the temperature of the template T is provided on the upper surface of the mounting table 260. The temperature control plate 270 includes a Peltier element, for example, and can adjust the template T to a predetermined temperature. In the mounting table 260, lifting pins 271 for supporting the template T from below and lifting it are provided. The elevating pin 271 can be moved up and down by an elevating drive unit 272. A through hole 273 that penetrates the upper surface in the thickness direction is formed on the upper surface of the mounting table 260, and the elevating pin 271 is inserted through the through hole 273.

  An ultrasonic vibrator 280 for applying ultrasonic vibrations to the release agent S on the template T at a position on the ceiling surface of the lid 261 facing the template T placed on the placing table 260; A transducer moving mechanism 281 that moves the ultrasonic transducer 280 in the horizontal direction is provided. Since the ultrasonic transducer 280 and the transducer moving mechanism 281 are the same as the ultrasonic transducer 110 and the transducer moving mechanism 111 in the above embodiment, the description thereof is omitted. In the present embodiment, the ultrasonic transducer 280 and the transducer moving mechanism 281 are provided above the template T, but may be provided below the template T. For example, the ultrasonic transducer 280 and the transducer moving mechanism 281 may be disposed on the upper surface of the mounting table 260.

  Further, a gas supply pipe 290 for supplying a release agent gas and water vapor on the template T is provided on the ceiling surface of the lid 261. The gas supply pipe 290 is connected to a release agent supply source 291 that supplies a release agent gas and a water vapor supply source 292 that supplies water vapor. Further, the gas supply pipe 290 includes a supply device group including a release agent gas supplied from the release agent supply source 291, a valve for controlling the flow of water vapor supplied from the water vapor supply source 292, a flow rate adjusting unit, and the like. 293 is provided. In the present embodiment, the gas supply pipe 290 functions as a silane coupling agent supply unit.

  The release agent supply source 291 stores a liquid release agent S therein. The release agent supply source 291 is connected to a gas supply pipe (not shown) that supplies nitrogen gas into the release agent supply source 291. In the release agent supply source 291, the liquid release agent S is vaporized by supplying nitrogen gas therein, and the release agent gas is generated. The release agent gas is supplied to the gas supply pipe 290 using the nitrogen gas as a carrier gas.

  For example, the water vapor supply source 292 stores liquid water therein. Then, for example, the liquid water is heated and vaporized to generate water vapor.

  An exhaust pipe 294 that exhausts the atmosphere of the processing space K is connected to the side surface of the lid 261. An exhaust pump 295 that evacuates the atmosphere of the processing space K is connected to the exhaust pipe 294.

In such a case, in step A <b> 3, the template T transported to the coating unit 250 is transferred to the lifting pins 271 and placed on the placing table 260. At this time, the temperature of the template T on the mounting table 260 is adjusted to a predetermined temperature, for example, 50 ° C. by the temperature control plate 270. Subsequently, the lid body 261 is lowered, and a processing space K sealed by the lid body 261 and the mounting table 260 is formed. Thereafter, gaseous release agent gas is supplied from the gas supply pipe 290 to the processing space K. The supplied release agent gas is deposited along the transfer pattern C on the surface T _{1 of the} template T. Thereafter, in step A4, water vapor is supplied from the gas supply pipe 290 to the processing space K, and the water vapor is supplied to the release agent S deposited on the template T.

  In addition, although water vapor | steam was supplied with respect to the mold release agent S on the template T in above-mentioned process A4, you may supply alcohol, for example, t-pentyl alcohol similarly to the said embodiment. In such a case, it is preferable to vaporize t-pentyl alcohol and supply it to the processing space K from the gas supply pipe 290. In steps A3 and A4, the release agent gas and water vapor (t-pentyl alcohol) may be simultaneously supplied from the gas supply pipe 290.

Thereafter, in step A5, ultrasonic vibration is applied from the ultrasonic vibrator 280 to the release agent S on the template T. Then, the chemical reaction promoted with the surface T ₁ and the release agent S of the template T, to improve adhesion to the surface T ₁ and the release agent S of this template T. Specifically, the releasing agent molecules of the release agent S deposited on the template T by steam is hydrolyzed, further surface T ₁ and a release agent molecules of the template T is bonded by dehydration condensation. Note that the action of ultrasonic vibration in this coupling is the same as that in the above embodiment, so that the description thereof is omitted. Thus, release film S _F along the transfer pattern C on the template T is deposited in a predetermined thickness. Incidentally, after forming a release film S _F on the template T, the atmosphere in the processing space K inert gas may be replaced, for example, nitrogen gas.

  In step A3 of the present embodiment, since the gaseous release agent gas is deposited along the transfer pattern C on the template T, it is not necessary to rinse the release agent S. Therefore, step A6 in the above embodiment can be omitted.

In the coating unit 30 in the above embodiment, when applying the release agent S on the template T, while irradiating ultraviolet rays to the surface T ₁ of the template T, it may be applied to the release agent S. Further, after applying the release agent S on the template T, while applying ultrasonic vibration to the release agent S on the template T, the release agent S on the template T is further moved to a predetermined temperature, for example, 200 ° C. You may heat to. In this way, the adhesion between the surface T _{1 of the} template T and the release agent S is improved by irradiating the surface T ₁ of the template T with ultraviolet rays or heating the release agent S on the template T. Can do.

  In the rinsing unit 31 of the above embodiment, the release agent S is rinsed by immersing the template T in the organic solvent stored in the dip layer 141, but the rinsing unit having the same configuration as the coating unit 30. May be used. In such a case, instead of the release agent nozzles 123, 211, and 240 of the coating unit 30, a rinse liquid nozzle that supplies an organic solvent as a rinse liquid of the release agent S onto the template T is used.

  In the above embodiment, the case where the release agent S as the silane coupling agent is formed on the template T as the substrate has been described, but the type of combination of the substrate and the silane coupling agent is not limited thereto. For example, the present invention can also be applied when an adhesion agent as a silane coupling agent is formed on a wafer as a substrate.

  The adhesion film is formed on the wafer by a wafer processing apparatus having the same configuration as the template processing apparatus 1. Further, as illustrated in FIG. 21, the template processing apparatus 1 and the wafer processing apparatus 310 may be provided in the imprint system 300. The wafer processing apparatus 310 may be provided independently as in the template processing apparatus 1 of the above embodiment, but in this embodiment, the case where it is provided in the imprint system 300 will be described. .

  The imprint system 300 forms a resist pattern on the wafer W processed by the wafer processing apparatus 310 using the template T processed by the template processing apparatus 1 in addition to the template processing apparatus 1 and the wafer processing apparatus 310. An imprint unit 320 is provided. Between the imprint unit 320 and the template processing apparatus 1, an interface station 321 for transferring the template T is disposed. An interface station 322 for transferring the template T is disposed between the imprint unit 320 and the wafer processing apparatus 2. That is, the template processing apparatus 1, the interface station 321, the imprint unit 320, the interface station 322, and the wafer processing apparatus 310 are arranged in this order in the Y direction (left and right direction in FIG. 21), and are connected integrally.

The wafer processing apparatus 310 is a wafer loading / unloading station for loading / unloading a plurality of, for example, 25 wafers W in the cassette unit between the outside and the imprint system 300 and loading / unloading the wafers W into / from the wafer cassette _CW . 330 and a wafer processing station 331 including a plurality of processing units for performing predetermined processing on the wafer W are integrally connected.

The wafer loading / unloading station 330 is provided with a cassette mounting table 340. The cassette mounting table 340 can mount a plurality of wafer cassettes _CW in a row in the X direction (vertical direction in FIG. 21). That is, the wafer carry-in / out station 330 is configured to be capable of holding a plurality of wafers W.

The wafer carry-in / out station 330 is provided with a wafer carrier 342 that can move on a conveyance path 341 extending in the X direction. The wafer transfer body 342 can be expanded and contracted in the horizontal direction and can also move in the vertical direction and the vertical direction (θ direction), and can transfer the wafer W between the wafer cassette _CW and the imprint unit 310.

  The wafer processing station 331 is provided with a transfer unit 350 at the center thereof. Around the transport unit 350, for example, four processing blocks F1 to F4 in which various processing units are arranged in multiple stages are arranged. On the front side of the wafer processing station 331 (X direction negative direction side in FIG. 21), the first processing block F1 and the second processing block F2 are sequentially arranged from the wafer carry-in / out station 330 side. On the back side of the wafer processing station 331 (the positive side in the X direction in FIG. 21), the third processing block F3 and the fourth processing block F4 are sequentially arranged from the wafer carry-in / out station 330 side. On the wafer loading / unloading station 330 side of the wafer processing station 331, a transition unit 351 for transferring the wafer W is disposed. A transition unit 352 for transferring the wafer W is also arranged on the interface station 322 side of the wafer processing station 331.

  The transfer unit 350 has a transfer arm that holds and transfers the wafer W and is movable in the horizontal direction, the vertical direction, and the vertical direction. The transfer unit 350 can transfer the wafer W to various processing units (to be described later) arranged in the processing blocks F1 to F4 and the transition units 351 and 352.

  As shown in FIG. 22, the first processing block F1 is applied as a film forming apparatus in which an adhesive as a silane coupling agent is applied to the surface (surface to be processed) of a plurality of liquid processing units, for example, a wafer W. A unit 360 and a rinse unit 361 for rinsing the adhesive on the wafer W are stacked in two stages in order from the bottom. Similarly, in the second processing block F2, a coating unit 362 and a rinsing unit 363 are stacked in two stages from the bottom. In addition, chemical chambers 364 and 365 for supplying various processing liquids to the liquid processing unit are provided at the lowermost stages of the first processing block F1 and the second processing block F2, respectively.

The configuration of the coating units 360 and 362 is the same as the configuration of the coating unit 30 that coats the mold release agent S on the template T, and thus the description thereof is omitted. However, instead of the release agent nozzle 123, an adhesive agent nozzle for applying an adhesive agent on the wafer W is provided. The adhesive agent improves the adhesion between the wafer W and the resist film, and is a silane coupling agent like the mold release agent S. Therefore, the adhesive agent molecule in the adhesive agent has two functional groups. That is, one functional group is an OR group (R is an alkyl group, for example). The other functional group _SG is a functional group that easily reacts with the resist film, and has an organic component.

  Moreover, since the structure of the rinse units 361 and 363 is the same as that of the rinse unit 31 which rinses the mold release agent S on the template T, description is abbreviate | omitted. That is, in these rinse units 361 and 363, for example, an organic solvent is used as the rinse liquid.

  In the third processing block F3, as shown in FIG. 23, a cleaning unit 370 that irradiates the wafer W with ultraviolet rays and cleans the surface (surface to be processed) before the adhesion film is formed on the wafer W. , 371 are stacked in two steps from the bottom. Also, in the fourth processing block F4, similarly to the third processing block F3, cleaning units 372 and 373 are stacked in two stages in order from the bottom.

Incidentally, the description thereof is omitted configuration of a cleaning unit 370-373 also are the same as that of the cleaning unit 40 for cleaning the surface _{T 1} of the template T.

  The interface station 321 is provided with a template transport body 381 that moves on a transport path 380 extending in the X direction as shown in FIG. A reversing unit 382 for inverting the front and back surfaces of the template T is disposed on the positive direction side in the X direction of the transport path 380, and a plurality of templates T are temporarily stored on the negative direction side of the transport path 380 in the X direction. A buffer cassette 383 is disposed. The template conveyance body 381 can be expanded and contracted in the horizontal direction, and can also move in the vertical direction and the vertical direction (θ direction), and between the template processing station 3, the reversing unit 382, the buffer cassette 383, and the imprint unit 320. The template T can be conveyed. In the template processing station 3 of the template processing apparatus 1, a transition unit 384 for delivering the template T is disposed on the interface station 321 side of the transport unit 20.

  The interface station 322 is provided with a wafer transfer body 391 that moves on a transfer path 390 extending in the X direction. A buffer cassette 392 that temporarily stores a plurality of wafers W is disposed on the negative side of the transfer path 390 in the X direction. The wafer transfer body 391 can be expanded and contracted in the horizontal direction, and can also move in the vertical direction and the vertical direction (θ direction), and transfers the wafer W between the wafer processing station 331, the buffer cassette 392, and the imprint unit 320. it can.

  Next, the configuration of the above-described imprint unit 320 will be described. As shown in FIG. 24, the imprint unit 320 has a processing container 400 in which a loading / unloading port (not shown) for the template T and a loading / unloading port (not shown) for the wafer W are formed on the side surfaces.

  A wafer holding unit 401 on which the wafer W is placed and held is provided on the bottom surface in the processing container 400. The wafer W is placed on the upper surface of the wafer holding unit 401 so that the surface to be processed faces upward. In the wafer holding unit 401, elevating pins 402 are provided for supporting the wafer W from below and elevating it. The elevating pin 402 can be moved up and down by the elevating drive unit 403. A through hole 404 that penetrates the upper surface in the thickness direction is formed on the upper surface of the wafer holding unit 401, and the elevating pins 402 are inserted through the through hole 404. The wafer holding unit 401 can be moved in the horizontal direction and can be rotated around the vertical by a moving mechanism 405 provided below the wafer holding unit 401.

  As shown in FIG. 25, a rail 410 extending along the Y direction (left and right direction in FIG. 25) is provided on the negative side in the X direction (downward direction in FIG. 25) of the wafer holding unit 401. The rail 410 is formed, for example, from the outer side of the wafer holding unit 401 on the Y direction negative direction (left direction in FIG. 25) to the outer side on the Y direction positive direction (right direction in FIG. 25). An arm 411 is attached to the rail 410.

  A resist solution nozzle 412 for supplying a resist solution onto the wafer W is supported on the arm 411. The resist solution nozzle 412 has, for example, an elongated shape along the X direction that is the same as or longer than the diameter dimension of the wafer W. For example, an inkjet type nozzle is used as the resist solution nozzle 412, and a plurality of supply ports (not shown) formed in a line along the longitudinal direction are formed below the resist solution nozzle 412. The resist solution nozzle 412 can strictly control the resist solution supply timing, the resist solution supply amount, and the like.

  The arm 411 is movable on the rail 410 by a nozzle driving unit 413. As a result, the resist solution nozzle 412 can move from the standby unit 414 installed outside the wafer holding unit 401 on the positive side in the Y direction to above the wafer W on the wafer holding unit 401, and further the surface of the wafer W The top can be moved in the radial direction of the wafer W. The arm 411 can be moved up and down by a nozzle driving unit 413 and the height of the resist solution nozzle 412 can be adjusted.

A template holding unit 420 that holds the template T as shown in FIG. 24 is provided on the ceiling surface in the processing container 400 and above the wafer holding unit 401. That is, the wafer holding unit 401 and the template holding unit 420 are arranged such that the wafer W placed on the wafer holding unit 401 and the template T held on the template holding unit 420 face each other. Furthermore, the template holding portion 420, the outer peripheral portion of the rear surface T ₂ of the template T has a chuck 421 for holding suction. The chuck 421 is movable in the vertical direction and rotatable about the vertical by a moving mechanism 422 provided above the chuck 421. Accordingly, the template T can be rotated up and down in a predetermined direction with respect to the wafer W on the wafer holding unit 401.

  The template holding unit 420 includes a light source 423 provided above the template T held by the chuck 421. The light source 423 emits light such as visible light, near ultraviolet light, and ultraviolet light, and the light from the light source 423 is transmitted through the template T and irradiated downward.

  The imprint system 300 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 300 will be described. FIG. 26 shows the main processing flow of this imprint processing, and FIG. 27 shows the state of the template T and the wafer W in each step of this imprint processing.

First, the template T is transported from the template carry-in / out station 2 to the template processing station 3 by the template carrier 12 (step B1 in FIG. 26). The template processing station 3, the cleaning of the surface _{T 1} of the template T (step B2 in FIG. 26), (step B3 in FIG. 26) the application of the release agent S on the surface _{T 1,} the alcohol A to the release agent S Application (step B4 in FIG. 26), application of ultrasonic vibration to the release agent S on the template T (step B5 in FIG. 26), rinsing of the release agent S (step B6 in FIG. 26) are sequentially performed. release film _{S F} on the surface _{T 1} of the template T is deposited. In addition, since these processes B2 to B6 are the same as the processes A2 to A6 in the above embodiment, detailed description thereof is omitted.

Template T release film S _F is deposited is transported to the transition unit 384. Subsequently, the template T is transported to the reversing unit 382 by the template transport body 381 of the interface station 321 and the front and back surfaces of the template T are reversed. That is, the rear surface T ₂ of the template T is directed upwards. Thereafter, the template T is transported to the imprint unit 320 by the template transport body 381 and sucked and held on the chuck 421 of the template holding unit 420 (step B7 in FIG. 26). At this time, prior to conveying the template T in the imprint unit 320, the buffer cassette 383, the template T release agent S _F is deposited may be temporarily stored.

In this way, the template processing station 3 performs predetermined processing on the template T, and the template T is being transferred to the imprint unit 320. At the wafer carry-in / out station 330, the wafer cassette C on the cassette mounting table 340 is moved by the wafer transfer body 342. _The wafer W is taken out from W and transferred to the transition unit 351 of the wafer processing station 331 (step B8 in FIG. 26). The wafer _W in the wafer cassette CW is accommodated so that the surface to be processed faces upward.

Thereafter, the wafer W is transferred to the cleaning unit 370 by the transfer unit 350, and the surface (surface to be processed) of the wafer W is cleaned (step B9 in FIG. 26). Thereafter, the wafer W is transferred to the coating unit 360, and an adhesive is applied on the wafer W (step B10 in FIG. 26), and alcohol A is further applied on the adhesive on the wafer W (step B11 in FIG. 26). Thereafter, in the coating unit 360, ultrasonic vibration is applied to the adhesive on the wafer W (step B12 in FIG. 26). Then, the chemical reaction between the surface of the wafer W and the adhesive agent is promoted, and the adhesion between the surface of the wafer W and the adhesive agent is improved. Thereafter, the wafer W is transferred to the rinse unit 361, and the adhesive on the wafer W is rinsed (step B13 in FIG. 26). In this way, an adhesion film _BF having a predetermined thickness is formed on the wafer W as shown in FIG. In these steps B9 to B13, the same processing as the steps A2 to A6 performed on the template T in the above embodiment is performed on the wafer W, and thus detailed description thereof is omitted.

The wafer W on which the adhesion film _BF is formed is transferred to the transition unit 352. Subsequently, the wafer W is transferred into the imprint unit 320 by the wafer transfer body 391 (step B14 in FIG. 26). At this time, the wafer W on which the adhesion film _BF is formed may be temporarily stored in the buffer cassette 392 before the wafer W is transferred to the imprint unit 320.

The wafer W carried into the imprint unit 320 is transferred to the lift pins 402 and is placed and held on the wafer holding unit 401. Subsequently, after aligning the wafer W held by the wafer holding unit 401 by moving it to a predetermined position in the horizontal direction, the resist solution nozzle 412 is moved in the radial direction of the wafer W, as shown in FIG. As shown, a resist solution R is applied on the adhesion film _BF of the wafer W (step B15 in FIG. 26). At this time, the control unit 160 controls the supply timing and supply amount of the resist solution R supplied from the resist solution nozzle 412. That is, in the resist pattern formed on the wafer W, the amount of the resist solution R applied to the portion corresponding to the convex portion (the portion corresponding to the concave portion in the transfer pattern C of the template T) is large, and the portion corresponding to the concave portion. The resist solution R is applied so that the amount of the resist solution R applied to the portion corresponding to the convex portion in the transfer pattern C is small. Thus, the resist solution R is applied on the wafer W in accordance with the aperture ratio of the transfer pattern C. Then, the adhesive film _BF on the wafer W causes the surface of the wafer W and the resist solution R to be in close contact, and a resist film _RF is formed as shown in FIG.

When the resist film _RF is formed on the wafer W, the wafer W held on the wafer holder 401 is moved to a predetermined position in the horizontal direction for alignment, and the template held on the template holder 420 is used. T is rotated in a predetermined direction. Then, the template T is lowered to the wafer W side as shown by the arrow in FIG. Template T is lowered to a predetermined position, the surface T ₁ of the template T is pressed against the resist film R _F on the wafer W. The predetermined position is set based on the height of the resist pattern formed on the wafer W. Subsequently, light is emitted from the light source 423. Light from the light source 423 is irradiated to the resist film R _F on the wafer W passes through the template T as shown in FIG. 27 (d), thereby the resist film R _F is photopolymerized. Thus, the transfer pattern C of the template T on the resist film R _F on the wafer W is transferred, the resist pattern P is formed (step B16 in FIG. 26).

Thereafter, as shown in FIG. 27E, the template T is raised to form a resist pattern P on the wafer W. At this time, the surface T ₁ of the template T since Hanaregatamaku S _F is deposited, does not resist on the wafer W adheres to the surface T ₁ of the template T. Thereafter, the wafer W is transferred to the wafer transfer body 342 by the lift pins 402, transferred from the imprint unit 320 to the wafer carry-in / out station 330, and returned to the wafer cassette _CW (step B17 in FIG. 26). Note that a thin resist residual film L may remain in the recesses of the resist pattern P formed on the wafer W. For example, as shown in FIG. The film L may be removed.

The above steps B8 to B17 are repeated to form resist patterns P on the plurality of wafers W using one template T, respectively. During this period, it repeats the step B1~B6 described above, forming a release film _{S F} on the surface _{T 1} of the plurality of templates T. Template T release film S _F is deposited are stored in the buffer cassette 383 in the interface station 321.

  Then, when Steps B8 to B17 are performed on the predetermined number of wafers W, the used template T is unloaded from the imprint unit 320 and transferred to the reversing unit 382 by the template transfer body 381 (Step of FIG. 26). B18). Subsequently, the template T in the buffer cassette 383 is transported to the imprint unit 320 by the template transport body 381. Thus, the template T in the imprint unit 320 is exchanged. Note that the timing for exchanging the template T is set in consideration of deterioration of the template T and the like. The template T is also replaced when a different resist pattern P is formed on the wafer W. For example, the template T may be exchanged each time the template T is used once. Further, for example, the template T may be exchanged for each wafer W, or the template T may be exchanged for each lot, for example.

The used template T conveyed to the reversing unit 382 has its front and back surfaces reversed. Thereafter, the template carrier 381, the transport unit 20, the template carrier 12, the template T is returned to the template cassette _{C T.} Thus, in the imprint system 300, the predetermined resist pattern P is continuously formed on the plurality of wafers W while the template T is continuously replaced.

  According to the above embodiment, since the ultrasonic vibration is applied to the adhesive on the wafer W coated with the adhesive in the wafer processing apparatus 310, the chemical reaction between the surface of the wafer W and the adhesive is promoted. This improves the adhesion between the surface of the wafer W and the adhesive. That is, the adhesive can be brought into close contact with the surface of the wafer W in a short time. Thereby, the throughput of wafer processing can be improved.

Further, since the imprint system 300 and a template processing apparatus 1 and the wafer processing apparatus 310, the imprinting system 300, together forming a release film S _F on the template T, the adhesion on the wafer W A film _BF can be formed. As described above, since the template processing and the wafer processing are performed by the one implement system 300, the throughput of the imprint processing can be improved. This also enables mass production of semiconductor devices.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

DESCRIPTION OF SYMBOLS 1 Template processing apparatus 30, 32 Application | coating unit 102 Template moving mechanism 110 Ultrasonic vibrator 111 Oscillator moving mechanism 123 Release agent nozzle 130 Alcohol nozzle 160 Control part 200 Liquid mixture nozzle 210 Support plate 250 Coating unit 300 Imprint system 310 Wafer Processing device 360, 362 Application unit A Alcohol B _F Adhesive film C Transfer pattern S Release agent S _F Release film T Template W Wafer

Claims (23)

A film forming method for forming a silane coupling agent on a substrate,
A supplying step of supplying a silane coupling agent onto the substrate;
Forming a film of the silane coupling agent on the substrate by applying ultrasonic vibration to the silane coupling agent supplied on the substrate in the supplying step. Membrane method. In the film forming step, a reaction accelerator for promoting the reaction between the surface of the substrate and the silane coupling agent is supplied to the silane coupling agent on the substrate, and the silane coupling agent to which the reaction accelerator is supplied is supplied. The film forming method according to claim 1, wherein the ultrasonic vibration is applied. The film formation method according to claim 2, wherein in the film formation step, the reaction accelerator is supplied before the silane coupling agent on the substrate is dried. In the film forming step, a support plate is disposed opposite to the silane coupling agent on the substrate, and the reaction accelerator is diffused between the silane coupling agent and the support plate. The film forming method according to claim 2. The film forming method according to claim 2, wherein in the film forming step, the substrate is moved to diffuse the reaction accelerator on the silane coupling agent on the substrate. In the film formation step, when the reaction accelerator is supplied to the silane coupling agent on the substrate, a mixed solution of the reaction accelerator and the solvent of the silane coupling agent is supplied. Item 6. The film forming method according to any one of Items 2 to 5. The film forming method according to claim 2, wherein the reaction accelerator is alcohol. The film forming method according to claim 1, wherein in the film forming step, the ultrasonic vibration is applied in a direction perpendicular to a substrate surface. The film forming method according to claim 1, wherein in the film forming step, the ultrasonic vibrator for applying the ultrasonic vibration or the substrate is relatively moved. The film forming method according to claim 1, wherein in the supplying step, a liquid or gaseous silane coupling agent is supplied onto the substrate. The substrate is a template having a predetermined pattern formed on the surface,
The film forming method according to claim 1, wherein the silane coupling agent is a mold release agent. A program that operates on a computer of a control unit that controls the film forming apparatus in order to cause the film forming apparatus to execute the film forming method according to claim 1. A readable computer storage medium storing the program according to claim 12. A film forming apparatus for forming a silane coupling agent on a substrate,
A silane coupling agent supply unit for supplying a silane coupling agent on the substrate;
A film forming apparatus comprising: an ultrasonic vibrator that applies ultrasonic vibration to the silane coupling agent supplied onto the substrate from the silane coupling agent supply unit. It has a reaction accelerator supply part for supplying a reaction accelerator for promoting the reaction between the surface of the substrate and the silane coupling agent to the silane coupling agent supplied onto the substrate from the silane coupling agent supply part. The film forming apparatus according to claim 14. The film forming apparatus according to claim 15, further comprising a support plate that is disposed to face the silane coupling agent on the substrate and diffuses the reaction accelerator between the silane coupling agent and the silane coupling agent. . The film formation apparatus according to claim 15 or 16, wherein the reaction accelerator supply unit supplies a mixed liquid of the reaction accelerator and a solvent of the silane coupling agent. The film forming apparatus according to claim 15, wherein the reaction accelerator is alcohol. The film forming apparatus according to claim 14, wherein the ultrasonic vibrator applies the ultrasonic vibration in a direction perpendicular to a substrate surface. The film forming apparatus according to claim 14, further comprising a substrate moving mechanism that moves the substrate. The film forming apparatus according to claim 14, further comprising a vibrator moving mechanism that moves the ultrasonic vibrator. The film forming apparatus according to claim 14, wherein the silane coupling agent supply unit supplies a liquid or gaseous silane coupling agent onto the substrate. The substrate is a template having a predetermined pattern formed on the surface,
23. The film forming apparatus according to claim 14, wherein the silane coupling agent is a mold release agent.

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