KR101818070B1 - Substrate treating apparatus - Google Patents

Substrate treating apparatus Download PDF

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Publication number
KR101818070B1
KR101818070B1 KR1020120005525A KR20120005525A KR101818070B1 KR 101818070 B1 KR101818070 B1 KR 101818070B1 KR 1020120005525 A KR1020120005525 A KR 1020120005525A KR 20120005525 A KR20120005525 A KR 20120005525A KR 101818070 B1 KR101818070 B1 KR 101818070B1
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KR
South Korea
Prior art keywords
substrate
processed
support plate
chemical liquid
substrate stage
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KR1020120005525A
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Korean (ko)
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KR20130084742A (en
Inventor
이경일
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주식회사 케이씨텍
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Priority to KR1020120005525A priority Critical patent/KR101818070B1/en
Publication of KR20130084742A publication Critical patent/KR20130084742A/en
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Publication of KR101818070B1 publication Critical patent/KR101818070B1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486Operating the coating or treatment in a controlled atmosphere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames

Abstract

The present invention relates to a substrate processing apparatus and method, and more particularly, to a substrate processing apparatus and a substrate processing method. A slit nozzle for applying a chemical liquid to a surface of the substrate to be processed which is placed on the substrate stage; A floating unit installed on a transfer path for transferring the substrate to be processed next to a second apparatus after the chemical liquid applying process is performed, and for blowing air upward to float the substrate to be processed; A carriage holding the target substrate from the substrate stage to the second apparatus and moving the target substrate in a floating state; And the bottom surface of the target substrate is uniformly transported in a state of being floated with air to be sprayed so as to minimize the vibrations generated during transportation of the target substrate or at the start and stop of transporting the target substrate, The present invention provides a substrate processing apparatus capable of transferring a state of a coated chemical liquid to a second apparatus in which a subsequent process is performed as it is, even if the chemical liquid is thickly coated, by suppressing deflection displacement caused by its own weight generated on the substrate to be processed.

Description

[0001] SUBSTRATE TREATING APPARATUS [0002]

The present invention relates to a substrate processing apparatus, in which, in transferring a substrate to be processed to which a chemical liquid is applied to a second apparatus to be subjected to a next process in the chemical liquid applying apparatus, vibration applied to the substrate to be processed is minimized, The present invention relates to a substrate processing apparatus and method which can maintain the original applied state without flowing down during transportation even if the chemical liquid is applied thickly.

BACKGROUND ART In a process for manufacturing a flat panel display such as a liquid crystal display device, a plasma display panel, a field emission display device, and a light emitting display device, A coating process of applying a chemical liquid such as a resist solution onto the surface of the substrate to be processed, and a process of attaching the substrate to which the chemical liquid is applied to the adhesion substrate.

1, the chemical liquid 55 is applied to the surface of the target substrate G by using the chemical liquid application device 20, and then the target substrate G coated with the chemical liquid 55 is coated on the surface of the target substrate G, Is transferred to the substrate adhesion apparatus 30 by the substrate transport apparatus 10 and the adhesion substrate S is adhered to the substrate G on which the chemical liquid is applied to manufacture the panel.

Here, the chemical solution applying device 20 may apply a chemical solution to the surface of the substrate G by various methods such as a spin coating method. For example, as shown in Fig. 1, a substrate to be processed G is mounted on a substrate chuck 21, and a slit nozzle 22 having a slit discharge port corresponding to a coating width of the substrate G The chemical liquid 55 may be supplied from the chemical liquid supply pump 23 while being moved to the nozzle feed mechanism 24 so as to be applied to the surface of the substrate G to be processed. Or may be applied in such a form that the chemical liquid is supplied to the central portion of the target substrate G while rotating the target substrate G so that the chemical liquid spreads on the surface of the target substrate G by the centrifugal force.

The substrate transport apparatus 10 is formed in a fork shape having three to four supports as shown in FIG. 2, and supports the bottom surface of the substrate G coated with the chemical solution by a support And moves from the chemical liquid application device 20 to the substrate laminating device 30. [

The substrate cementing apparatus 30 includes a moving body 32 reciprocating at 32d in a state where the transported substrate G is mounted on the surface 31s of the stationary body 31a of the stationary body 31, The adhesion substrate S adhered and fixed by the suction pressure of the vacuum pump 33 to the fixed base 32a of the substrate W is adhered to the substrate G so that a chemical solution is interposed between the pair of substrates G, Thereby producing a panel in a state of being formed.

However, the substrate conveying device 30 for moving the substrate G from the chemical liquid applying device 20 to the substrate laminating device 30 as described above has three to four supports The thin substrate to be processed in the region between the supports 11 as shown in Fig. 3 is deflected downward (z), and by this sagging, 55x and the chemical liquid 55 is applied with a uniform thickness in the chemical liquid application device 20, there is a problem that the chemical liquid 55 is adhered in a state where it is not distributed in a uniform thickness in the laminating step of the substrate G to be processed do.

Above all, the conventional substrate transport apparatus 10 has a structure in which the substrate to be processed G is supported on the bottom surface in moving from the chemical liquid application apparatus 20 to the substrate laminating apparatus 30 where the next process is performed Therefore, as the size of the substrate G to be processed becomes larger, vibration is inevitably generated at the moment of grasping. This vibration energy causes the target substrate G to remain on the target substrate G for a certain period of time using the target substrate G as a medium and causes the target substrate G to vibrate repeatedly several times, It has become uneven in thickness to deteriorate the performance of the finally produced panel.

Therefore, in moving the substrate G from the chemical liquid application device 20 to the next device 30, the vibration applied to the substrate G is minimized, and the chemical liquid application device 20 It is necessary to provide a method of maintaining the applied state as it is.

Further, as the size of the substrate G to be processed recently becomes larger, there is a limitation in preventing the local sagging phenomenon of the substrate G in the method in which the substrate G is supported by three to four supports 11, The thickness of the chemical solution applied to the surface of the substrate G may be several millimeters rather than a few microns to several tens of microns, The necessity of carrying the processed substrate G to the next process is greatly increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a substrate processing apparatus capable of transferring a chemical solution applied to a substrate to be processed from a chemical liquid application apparatus to a second apparatus, And to provide the above-mentioned objects.

That is, an object of the present invention is to minimize vibration applied to a substrate to which a chemical solution is applied in a chemical solution applying device, and to convey the applied chemical solution to an apparatus in which the next process is performed while maintaining the original state.

In other words, the object of the present invention is to prevent the chemical solution from flowing down due to the vibration generated during transportation even when the chemical solution is applied to the surface of the substrate to be treated in the chemical solution applying device with a thickness of 2 to 3 mm .

On the other hand, the object of the present invention is to improve the efficiency of the process by making it possible to carry the substrate to be processed successively in an inline manner in the second apparatus in which the subsequent process is carried out in the chemical liquid application apparatus.

In order to achieve the above object, the present invention relates to a method of manufacturing a semiconductor device, which is capable of minimizing up-and-down movement of a substrate to be processed in transporting a substrate to which a chemical liquid is applied, To the second device to be performed.

In order to achieve the above object, the present invention provides a substrate processing apparatus comprising: a substrate stage on which a substrate to be processed is mounted; A slit nozzle for applying a chemical liquid to a surface of the substrate to be processed which is placed on the substrate stage; A floating unit installed on a transfer path for transferring the substrate to be processed next to a second apparatus after the chemical liquid applying process is performed, and for blowing air upward to float the substrate to be processed; A carriage holding the target substrate from the substrate stage to the second apparatus and moving the target substrate in a floating state; And a substrate processing apparatus.

This is because, in transporting the substrate to which the chemical liquid has been applied on the substrate stage to the second apparatus for subsequent processing, the bottom surface of the substrate to be processed is transported uniformly in the state of being floated with the sprayed air, The vibration generated at the time of starting and stopping the transportation of the substrate to be processed and the transportation of the substrate to be processed can be minimized.

At this time, according to one embodiment of the present invention, the substrate stage may be formed with a suction hole for fixing the position of the substrate to be processed and an exhaust hole for floating the substrate to be processed. This allows the carriage to grasp the substrate to be processed while the substrate to be treated with the chemical liquid is slightly lifted from the substrate stage.

On the other hand, according to another embodiment of the present invention, the substrate to be processed is mounted on the support plate on the substrate stage, and may be transferred to the second device while the support plate is held by the carriage. Even in this case, it is possible to carry a uniform lifting force to the bottom surface of the support plate by the lifting unit, thereby minimizing the vibration applied to the substrate to be transferred to the second apparatus where subsequent processing is performed.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: mounting a substrate to be processed on a substrate stage; Applying a chemical liquid to the substrate to be processed which is placed on the substrate stage; A step of floating the substrate to be processed by the air ejected from the substrate stage and holding the floating target substrate by a carriage; The carriage is moved to the second apparatus in which the next process is to be performed on the substrate to be processed, the air is blown upward on the bottom surface of the substrate to be processed, and the substrate is transferred to the second apparatus in a floating state The substrate processing method comprising the steps of:

The present invention also provides a method of manufacturing a semiconductor device, comprising: mounting a substrate to be processed on a support plate on which a grip portion is formed; Applying a chemical liquid to the substrate to be processed; Gripping the grip portion of the support plate with a carriage; The air is directed upward from a floating unit provided in an area connecting the substrate stage and the second device to the second device in which the next process is to be performed on the substrate to be processed, Transporting the second device in a floating state to the second device; And a substrate processing method.

Even when the chemical liquid is applied to the surface of the substrate to be processed to a thickness of 2 mm or more so that the chemical liquid applied by the small vibration can be caused by carrying the substrate to be processed to the second apparatus as described above, It is confirmed that the coating liquid can be applied from the chemical liquid application device to the second device while maintaining the application state.

As described above, according to the present invention, in transferring a substrate to be processed to which a chemical liquid is applied on a substrate stage to a second apparatus for subsequent processing, the bottom surface of the substrate is uniformly sprayed It is possible to obtain an advantageous effect of minimizing the vibration generated during transportation of the substrate to be processed or at the start and stop of transporting the substrate to be processed.

The present invention also provides an advantageous effect that the deflection displacement of the substrate to be processed can be minimized by supporting the substrate to which the chemical liquid has been applied by a uniform floating force so that the substrate can be transported to the second device while maintaining the coating state of the chemical liquid .

The transfer of the target substrate to the second apparatus while maintaining the applied state of the chemical liquid applied to the target substrate was experimentally confirmed even when the chemical liquid was applied to the surface of the target substrate with a thickness of 3 mm.

In addition, the present invention can be applied to a process for applying a chemical liquid on the surface of a substrate to be processed and a vacuum drying process performed in the second device, The substrate laminating process can be performed in a series of continuous processes, and an advantageous effect of improving the process efficiency can be obtained.

1 is a view showing a general substrate processing process
FIG. 2 is a plan view showing a configuration in which a substrate to be processed is held by a support portion of the conventional substrate transport apparatus of FIG.
Fig. 3 is a side view showing deflection of the target substrate held by the support portion of Fig. 2
4A is a plan view schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.
4B is a front view of Fig.
FIG. 5 is a cross-sectional view along the cutting line AA in FIG.
6A to 6C are views sequentially showing the configuration according to the process of processing the substrate to be processed using the substrate processing apparatus of FIG. 4A
7A is a plan view schematically showing a configuration of a substrate processing apparatus according to another embodiment of the present invention.
7B is a front view of Fig.
8 is a cross-sectional view along the cutting line BB in Fig.
Figs. 9A to 9C are views sequentially showing the configuration of a process for processing a substrate using the substrate processing apparatus of Fig. 7A. Fig.

Hereinafter, a substrate processing apparatus 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

Fig. 4A is a plan view schematically showing the configuration of a substrate processing apparatus according to an embodiment of the present invention, Fig. 4B is a front view of Fig. 4A, Fig. 5 is a transverse sectional view along a cutting line AA in Fig. 4 is a view sequentially showing a configuration according to a process of processing a substrate to be processed by using the substrate processing apparatus of FIG.

A substrate processing apparatus 100 according to an embodiment of the present invention includes a substrate stage 110 for mounting a substrate G to be processed and a substrate stage 110 A nozzle unit 120 for applying a chemical liquid 55 to the surface of the substrate G and a nozzle unit 120 for gripping the substrate G on which the chemical liquid 55 is applied, The carriage 130 and 130 'for transferring the processed substrate G to the first apparatus 30 and the second substrate 30 for transferring the air to the bottom surface of the substrate G to be transported in the space between the substrate stage 110 and the second apparatus 30, And a floating unit 140 for floating the substrate G with a uniform floating force.

Although not shown in the drawing, the substrate stage 110 has a plurality of suction holes and an exhaust hole. In the state where the substrate G is mounted, a suction pressure 111p is applied to the vacuum pump 111, And the static pressure 112p is applied by the first pressurizing pump 112 to the substrate stage 110 to be processed after the application of the chemical solution 55 to the substrate G is completed, ).

The nozzle unit 120 moves in the longitudinal direction 120d with respect to the substrate stage 110 and discharges the chemical liquid 55 from the slit nozzle 22 A chemical liquid 55 having a predetermined thickness is applied. Although the detailed configuration of the nozzle unit 120 is not shown in Figs. 4 to 6C, the same or similar configuration as the chemical liquid application unit of the known slit coater apparatus can be employed.

The carriage 130 or 130 'is provided with a gripper 130a for holding the edge of the substrate G to grip the substrate G to be processed. The suction port 131p is connected to the suction pump 131 to communicate with the suction pump 131. The suction port 131p is provided on the bottom surface of the substrate G May be adsorbed and fixed at various positions. As shown in FIG. 5, each of the carriages 130 and 130 'is connected to a suction pump 131 to which a suction pressure is applied.

On both sides of the second device 30 from the substrate stage 110 are provided guide rails 130 and 130 'so that the carriage 130 and 130' can move from the substrate stage 110 to the fixed body 31 of the second device 30. [ (70) is provided to guide the movement of the carriage (130, 130 ') in the longitudinal direction (130d). Although the figure shows a configuration in which two pairs of carriages 130 and 130 'are provided, it may be composed of three to four pairs. Although the drawing shows the structure in which the nozzle unit 120 moves along the guide rail 70 as an example, the nozzle unit 120 may be moved by a separate guide means.

The carriage 130, 130 'and the nozzle unit 120 can be moved along the guide rail 70 to the principle of a linear motor. That is, the N-poles and the S-poles are alternately arranged in the guide rail 70, and the coils are installed in the carriage 130, 130 'and the nozzle unit 120 which are engaged with the guide rail 70, The carriage 130, 130 'and the nozzle unit 120 can be precisely moved along the guide rail 70 by applying a current.

The floating unit 140 is formed from the substrate stage 110 to the fixed body 31 in the second device 30 and applies a uniform floating force 140v to the bottom surface of the target substrate G An exhaust hole 140a is formed at regular intervals over the upper surface. The exhaust hole 140a communicates with the second pressurizing pump 141 so that air is injected at a controlled pressure when the substrate to be processed G is transported and the bottom surface of the substrate G is uniformly supported, The occurrence of flexural displacement of the target substrate G is suppressed and the target substrate G is maintained in a flat state.

Hereinafter, a substrate processing method using the substrate processing apparatus 100 according to an embodiment of the present invention will be described in detail with reference to FIGS. 6A to 6C.

Step 1: First, as shown in FIG. 6A, the carriage 130, 130 'is guided in the direction indicated by reference numeral 130x so that a plurality of carriages 130, 130' are positioned outside one side of the substrate stage 110 And moves along the rail 70.

Subsequently, the target substrate G is placed on the substrate stage 110, the vacuum pump 111 is operated, and the suction pressure 111p is applied to the suction holes of the substrate stage 110, (G) is fixed.

Then, while the nozzle unit 120 moves to 120 x, the chemical liquid 55 is applied to the surface of the target substrate G from the slit nozzle with a uniform thickness.

Step 2: Then, as shown in FIG. 6B, the nozzle unit 120 is moved in the direction indicated by 120x 'and moved to the outside of the other side of the substrate stage 110. At the same time, the substrate stage 110 injects air into the exhaust hole with the first pressurizing pump 112 to apply a levitation force 110v to the target substrate G, thereby moving the target substrate G to the substrate stage 110 .

Next, a plurality of carriages 130, 130 'move in the direction indicated by reference numeral 130x' and are spaced apart from each other on both sides of the substrate stage 110, and then the suction pump 131, as shown in FIG. 5, The suction pressure 131p is applied to the suction port of the carriage 130 or 130 'to grip the substrate G from the grip 130a of the carriage 130 or 130'.

Step 3: The carriage 130, 130 'is then moved in the state that the air is sprayed by the second pressurizing pump 141 to act on the flotation force 140v on the plurality of exhaust holes of the floating unit 140 And transfers the substrate G along the guide rail 70 to the second apparatus 30 where the next process is performed. The target substrate G is supported by the uniform lifting force 140v by the air discharged from the floating unit 140 so that the target substrate G is held on the substrate stage 110) to the second device (30).

At this time, the lifting force 110v acting on the substrate stage 110 is continuously applied until the substrate G is released from the substrate stage 110. More preferably, an exhaust hole through which air is injected is formed on the upper surface of the fixed body 31 of the second device 20 in which the next process is performed, so that the substrate stage 110 is positioned on the upper side of the fixed body 31 The substrate stage can be supported with a uniform lifting force.

Subsequently, when the target substrate G is positioned on the fixed body 31, the suction pressure 131p applied to the carriages 130 and 130 'is removed, and the carriages 130 and 130' (140). The to-be-processed substrate G is seated on the stationary surface of the stationary body 31 gradually while the floating force of the air injected from the exhaust hole (not shown) of the stationary body 31 is lowered.

The substrate processing method according to an embodiment of the present invention configured as described above is such that after the substrate G is coated with the chemical liquid on the substrate stage 110, The vibration generated when the substrate W is held by the robot arm and when the target substrate G is placed can be removed by the conventional robot arm And is maintained in a flat state while being supported by a constant air lifting force throughout the time from the substrate stage 110 to the second device 30, so that the chemical solution applied on the substrate stage 110 is maintained in a uniformly distributed state It is possible to obtain an advantageous effect.

Hereinafter, a substrate processing apparatus 200 according to another embodiment of the present invention will be described in detail. However, in explaining another embodiment of the present invention, a detailed description of functions or configurations common to the substrate processing apparatus 100 of the above-described embodiment will be omitted for the sake of clarity of the present embodiment.

Fig. 7A is a plan view schematically showing the configuration of a substrate processing apparatus according to another embodiment of the present invention, Fig. 7B is a front view of Fig. 7A, Fig. 8 is a transverse sectional view along a cutting line BB in Fig. Is a diagram sequentially showing a configuration according to a process of processing a substrate to be processed by using the substrate processing apparatus of Fig. 7A.

The substrate processing apparatus 200 according to another embodiment of the present invention does not float the target substrate G on the substrate stage 110 but does not float the target substrate G between the substrate stage 110 and the second device 30 The present invention is different from the above-described embodiment in that it is transported in a state of being transported. 7A and 7B, the substrate processing apparatus 200 according to another embodiment of the present invention includes a substrate stage 110 for mounting a substrate G to be processed, A nozzle unit 120 for applying the chemical liquid 55 to the surface of the substrate G to be processed and a target substrate G to which the chemical liquid 55 is applied are gripped and the target substrate G A carriage 230 and 230 'for transferring the wafer W to a second apparatus 30 where the next process is performed and a carriage 230 and 230' for transferring the processed substrates G and B to the lower surface of the substrate G to be transferred to the space between the substrate stage 110 and the second apparatus 30 A float unit 140 for spraying air to float the target substrate G with a uniform levitation force and a support plate 250 which is disposed on the bottom surface of the target substrate G and is transported together with the target substrate G, .

A plurality of suction holes are formed in the substrate stage 110 although not shown in the figure so that the suction pressure 111p is applied to the substrate G by the vacuum pump 111 in a state in which the substrate G is stationary, . The suction holes of the substrate stage 110 are aligned with the communication holes of the support plate 250 so that the suction pressure 111p by the vacuum pump 111 is applied to the substrate G to be processed.

The carriage 230 and 230 'is provided with a gripping portion 130a for gripping the edge of the substrate G to grip both sides of the support plate 250 for holding the substrate G to be processed. More specifically, as shown in FIG. 8, the grip portion 230a may be formed in the form of a gripping pin. Alternatively, as in the above-described embodiment, both sides of the support plate 250 may be suction- You may. 8, by rotating the screw shaft 234 engaged with the movable gripper 235 in the forward and reverse directions indicated by 234d, the movable gripper 235 is moved to the carriage (not shown) 230 in the vertical direction 235v to grip both side portions 255 of the support plate 250. [

On both sides of the second device 30 from the substrate stage 110, guide rails (not shown) are provided on the opposite sides of the second device 30 so that the carriages 230 and 230 'can move from the substrate stage 110 to the fixed body 31 of the second device 30. [ (70) is provided to guide the movement of the carriage (230, 230 ') in the longitudinal direction (230d). Although two carriage units 230 and 230 'are shown in the figure, the carriage units 230 and 230' may be composed of three or four pairs.

The floating unit 140 is formed from the substrate stage 110 to the fixed body 31 in the second device 30 and applies a uniform floating force 140v to the bottom surface of the target substrate G An exhaust hole 140a is formed at regular intervals over the upper surface. The upper surface of the floating unit 140 is positioned lower than the upper surface of the substrate stage 110 so that even though the supporting plate 250 and the substrate to be processed G are moved horizontally, The air lifting force (140v) enables uniform support over the entire area of the substrate. That is, the exhaust hole 140a is communicated with the second pressurizing pump 141 so that the air is injected at a controlled pressure when the target substrate G is carried, and the bottom surface of the target substrate G is uniformly supported Thereby suppressing the flexural displacement of the target substrate G and maintaining the target substrate G in a flat state.

The supporting plate 250 moves together with the substrate G mounted thereon on the upper surface thereof and has communication holes aligned with the suction holes formed in the substrate stage 110. The supporting plate 250 supports the substrate stage 110 through the communication holes, To the substrate G to be processed. As shown in FIG. 8, the support plate 250 is formed such that both sides of the support plate 250 are bent upward and are easily gripped by the grips 230a of the carriages 230 and 230 '. Since the support plate 250 is used for horizontal transfer of the substrate G,

Although not shown in the drawing, a marker is formed to assist in aligning the suction holes of the substrate stage 110 with the communication holes of the support plate 250. Thereby, the support plate 250 can be accurately mounted on the substrate stage 110 at a predetermined position.

Hereinafter, a substrate processing method using the substrate processing apparatus 200 according to an embodiment of the present invention will be described in detail with reference to FIGS. 9A to 9C.

Step 1: First, as shown in FIG. 9A, the carriage 230, 230 'is guided in the direction indicated by reference numeral 230x so that a plurality of carriages 230, 230' are located outside one side of the substrate stage 110 And moves along the rail 70.

Then, the support plate 250 is mounted on the substrate stage 110, and the substrate G is mounted on the support plate 250. Alternatively, the support plate 250 may be mounted on the substrate stage 110 in a state where the target substrate G is previously mounted on the support plate 250. A positioning marker is formed on the support plate 250 and the substrate stage 110 so that the support plate 250 is positioned on the substrate stage 110 in a state where the communication holes of the support plate 250 and the suction holes of the substrate stage 110 are aligned, .

Then the vacuum pump 111 is operated to apply the suction pressure 111p to the suction hole of the substrate stage 110 so that the support plate 250 and the substrate G on the substrate are fixed in position. Then, while the nozzle unit 120 moves to 120 x, the chemical liquid 55 is applied to the surface of the target substrate G from the slit nozzle with a uniform thickness.

Step 2: Then, as shown in FIG. 9B, the nozzle unit 120 moves in the direction indicated by 120x 'and moves to the outside of the other side of the substrate stage 110. At the same time, the plurality of carriages 230 and 230 'move in the direction indicated by reference numeral 230x' and are spaced apart from each other on both sides of the substrate stage 110, and then, the screw shaft 234, The movable clamping unit 234 is moved downward to grip both sides 255 of the support plate 250. [ Although not shown in the drawings, the side portions 255 of the support plate 250 may be gripped by the suction pressure as shown in FIG.

Step 3: Then, the carriages 230 and 230 ', in a state in which air is sprayed by the second pressurizing pump 141 and the floating force 140v is applied to the plurality of exhaust holes of the floating unit 140, And transfers the substrate G along the guide rail 70 to the second apparatus 30 where the next process is performed.

When the support plate 250 slides relative to the substrate stage 110 at the upper side of the substrate stage 110 but a part of the support plate 250 is positioned above the floating unit 140, The support plate 250 and the target substrate G are supported by a uniform lifting force 140v. When the substrate G reaches the upper surface of the fixed body 31 of the second device 30, the supporting plate 250 is supported by the stationary surface 31s of the fixed body 31 and is seated. The height of the mounting surface 31s of the fixed body 31 is set to be substantially the same height so as to have a small height deviation enough to allow the height of the upper surface of the substrate stage 110 and the deflection displacement of the substrate G to be processed .

Therefore, the substrate G to be processed is conveyed horizontally from the substrate stage 110 to the second device 30 while maintaining a flat state without local warping.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

DESCRIPTION OF REFERENCE NUMERALS
100: substrate processing apparatus 110: substrate stage
120: nozzle unit 130, 130 ', 230: carriage
140: floating unit 250: supporting plate

Claims (9)

  1. A substrate stage on which a substrate to be processed is mounted and on which a suction hole for applying suction pressure is formed on a bottom surface of the substrate to be processed;
    A support plate formed in the substrate stage with a communication hole communicating with the suction hole and being transported together with the substrate to be processed while supporting a bottom surface of the substrate to be processed;
    A slit nozzle for applying a chemical liquid to a surface of the substrate to be processed which is placed on the substrate stage;
    A floating unit installed in a transfer path for transferring the substrate to be processed to a second apparatus for performing a next process after the chemical liquid application process is performed, and for spraying air upward to float the support plate;
    A carriage holding the support plate from the substrate stage to the second device and moving the support plate in a floating state;
    Wherein the substrate processing apparatus comprises:
  2. The method according to claim 1,
    Wherein the substrate stage is provided with an exhaust hole for floating the support plate after the chemical liquid applying process is performed.
  3. 3. The method of claim 2,
    Wherein an exhaust hole for ejecting air is formed on a mounting surface of the second apparatus on which the substrate to be processed is mounted.
  4. The method according to claim 1,
    Wherein the support plate is conveyed to the second apparatus while both sides of the support plate are held by the carriage.
  5. 5. The method of claim 4,
    Wherein the upper surface of the floating unit is disposed at a lower height than the upper surface of the substrate stage.
  6. 5. The method of claim 4,
    Wherein the mounting surface on which the substrate to be processed is mounted in the second apparatus is provided at the same height as the substrate stage.
  7. 7. The method according to any one of claims 1 to 6,
    Wherein the floating units are arranged at uniform intervals so as to support the bottom surface of the target substrate with a uniform floating force.
  8. Placing a substrate on a bottom surface of the support plate in a state in which a substrate to be processed is mounted on an upper surface of a support plate on which a grip portion is formed;
    Applying a chemical solution to the substrate to be processed in a state where a suction pressure is applied to a bottom surface of the substrate to be processed through a communication hole formed in the support plate so as to communicate with a suction hole formed in the substrate stage in the substrate stage;
    Gripping the grip portion of the support plate with a carriage;
    An air directed upward is blown from a floating unit provided in an area connecting the substrate stage and the second device to move the carriage to the second device where the next process is to be performed on the substrate to be processed, And conveying the immobilized support plate to the second device in a floating state;
    ≪ / RTI >
  9. delete
KR1020120005525A 2012-01-18 2012-01-18 Substrate treating apparatus KR101818070B1 (en)

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KR101818070B1 true KR101818070B1 (en) 2018-01-12

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002181714A (en) 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2005032626A (en) 2003-07-08 2005-02-03 Calsonic Kansei Corp Pure water tank for fuel cell power generation system
JP2005223119A (en) 2004-02-05 2005-08-18 Tokyo Electron Ltd Apparatus and method for forming coating film
JP2005228881A (en) 2004-02-12 2005-08-25 Tokyo Electron Ltd Levitation substrate transfer processing method and its apparatus
JP2005244155A (en) 2004-01-30 2005-09-08 Tokyo Electron Ltd Uplift substrate conveyance processor
JP2006237482A (en) 2005-02-28 2006-09-07 Tokyo Electron Ltd Substrate processing device, substrate processing method, and substrate processing program
JP2006332378A (en) 2005-05-26 2006-12-07 Sharp Corp Method and apparatus for positioning article, and for manufacturing semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002181714A (en) 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2005032626A (en) 2003-07-08 2005-02-03 Calsonic Kansei Corp Pure water tank for fuel cell power generation system
JP2005244155A (en) 2004-01-30 2005-09-08 Tokyo Electron Ltd Uplift substrate conveyance processor
JP2005223119A (en) 2004-02-05 2005-08-18 Tokyo Electron Ltd Apparatus and method for forming coating film
JP2005228881A (en) 2004-02-12 2005-08-25 Tokyo Electron Ltd Levitation substrate transfer processing method and its apparatus
JP2006237482A (en) 2005-02-28 2006-09-07 Tokyo Electron Ltd Substrate processing device, substrate processing method, and substrate processing program
JP2006332378A (en) 2005-05-26 2006-12-07 Sharp Corp Method and apparatus for positioning article, and for manufacturing semiconductor device

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