KR20130084742A - Substrate treating apparatus - Google Patents

Substrate treating apparatus Download PDF

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Publication number
KR20130084742A
KR20130084742A KR1020120005525A KR20120005525A KR20130084742A KR 20130084742 A KR20130084742 A KR 20130084742A KR 1020120005525 A KR1020120005525 A KR 1020120005525A KR 20120005525 A KR20120005525 A KR 20120005525A KR 20130084742 A KR20130084742 A KR 20130084742A
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KR
South Korea
Prior art keywords
substrate
processed
stage
floating
substrate stage
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Application number
KR1020120005525A
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Korean (ko)
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KR101818070B1 (en
Inventor
이경일
Original Assignee
주식회사 케이씨텍
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Priority to KR1020120005525A priority Critical patent/KR101818070B1/en
Publication of KR20130084742A publication Critical patent/KR20130084742A/en
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Publication of KR101818070B1 publication Critical patent/KR101818070B1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486Operating the coating or treatment in a controlled atmosphere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames

Abstract

The present invention relates to a substrate processing apparatus and a method thereof, comprising: a substrate stage on which a substrate to be processed is mounted; A slit nozzle for applying a chemical to a surface of the substrate to be processed mounted on the substrate stage; A floating unit which is installed in a conveying path for transferring the substrate to be processed to a second apparatus where the next process is performed after the chemical liquid applying process is performed to inject air upwards to float the substrate to be processed; A carriage for holding the target substrate from the substrate stage to the second device and moving the substrate to a floating state; It is configured to include, as the bottom surface of the substrate to be transported in a state of floating with the air is sprayed uniformly, to minimize the vibration generated during the transportation of the substrate or the start and stop of the substrate to be processed, Provided are a substrate processing apparatus and a method for suppressing a bending displacement caused by self-weight generated on a substrate to be processed and transferring the applied chemical liquid state to a second apparatus where the next step is performed even if the chemical liquid is thickly applied.

Description

Substrate Processing Unit {SUBSTRATE TREATING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, wherein in transferring a processed substrate to which a chemical liquid is applied in a chemical liquid applying apparatus to a second apparatus where a next process is performed, the vibration applied to the substrate to be processed is minimized, thereby applying the chemical liquid applying apparatus. The present invention relates to a substrate processing apparatus and a method for maintaining the original coating state without flowing down during the transport process even if the chemical liquid is thickly applied.

In the process of manufacturing flat panel displays, such as liquid crystal display devices, plasma display panels, field emission display devices, and light emitting display devices, glass is used. The coating process of apply | coating a chemical | medical solution, such as a resist liquid, to the surface of the to-be-processed board | substrate produced by this is accompanied, and the process of bonding the to-be-processed board | substrate with which the chemical | medical solution was apply | coated with a bonding substrate.

To this end, as shown in FIG. 1, after the chemical liquid 55 is applied to the surface of the substrate G by using the chemical liquid applying apparatus 20, the substrate 55 to which the chemical liquid 55 is applied is applied. Is conveyed to the substrate bonding apparatus 30 by the board | substrate conveying apparatus 10, the bonding board | substrate S is bonded to the to-be-processed substrate G to which the chemical | medical solution was apply | coated, and a panel is manufactured.

Here, the chemical liquid applying apparatus 20 may apply the chemical liquid to the surface of the substrate G to be processed by various methods such as a spin coating method. For example, as shown in FIG. 1, the substrate chuck 21 is mounted on the substrate chuck 21, and the slit nozzle 22 having the slit discharge port corresponding to the application width of the substrate G is disposed. While moving 22y to the nozzle transfer mechanism 24, the chemical liquid 55 may be supplied from the chemical liquid supply pump 23 and applied to the surface of the substrate G to be processed. Alternatively, the chemical liquid may be supplied to the center portion of the substrate G while the substrate G is rotated, so that the chemical liquid may be applied to the surface of the substrate G by rotation centrifugal force.

As shown in FIG. 2, the substrate transport apparatus 10 is formed in a fork having three to four supports, in a state in which the bottom surface of the substrate G to be coated with the chemical solution is supported as a support. It moves from the chemical | medical agent coating apparatus 20 to the board | substrate bonding apparatus 30. FIG.

The substrate attaching device 30 is a moving body 32 reciprocating with reference numeral 32d in a state in which the conveyed substrate G is mounted on the surface 31s of the holder 31a of the fixed body 31. The bonded substrate S adsorbed and fixed by the suction pressure of the vacuum pump 33 to the fixed base 32a of the bonded substrate G to the to-be-processed substrate G, and a chemical liquid is interposed between the pair of substrates G and S. Manufacture the panel in the finished state.

However, the substrate conveyance apparatus 30 which moves the to-be-processed board | substrate G from the chemical | medical agent application apparatus 20 to the board | substrate bonding apparatus 30 as mentioned above has 3 to 4 support | bases in the bottom of the to-be-processed substrate G. As shown in Fig. 3, as shown in Fig. 3, in the region between the supports 11, the thin to-be-processed substrate is deflected downward (z), which causes the chemical liquid 55 to be referred to. Flowing in the direction indicated by 55x, even if the chemical liquid 55 is applied with a uniform thickness in the chemical liquid applying device 20, the problem that the bonding step of the substrate (G) to be bonded does not distribute to a certain thickness causes a problem do.

Above all, in moving from the chemical | medical agent application apparatus 20 to the board | substrate bonding apparatus 30 in which the next process is performed, the conventional board | substrate transportation apparatus 10 is a form which supports the to-be-processed substrate G from the bottom surface. Since the gripping is performed, the larger the size of the substrate G is, the more likely vibration is generated at the moment of gripping. This vibration energy causes the substrate G to be treated as a medium to remain on the substrate G for a predetermined time and causes the substrate G to vibrate repeatedly several times. It has deteriorated to nonuniform thickness, and it has become the cause which degrades the performance of the panel finally manufactured.

Therefore, in moving the processing target substrate G from the chemical applying apparatus 20 to the apparatus 30 in which the next process is performed, the vibration applied to the processing target substrate G is minimized to minimize the chemical liquid applying apparatus 20. There is an urgent need for a method that can maintain the state of the coating as it is.

In addition, as the size of the substrate G is recently increased, there are limitations in preventing local sagging of the substrate G in a manner supported by the three to four supports 11. Since the thickness of the chemical liquid applied to the surface of the processing substrate G may also be formed in several mm instead of the conventional several microns to several tens of microns, the chemical liquid applied by the chemical liquid applying apparatus 20 may be kept intact. The necessity of transporting the processing substrate G to the next process is greatly increased.

The present invention is to solve the above problems, the substrate processing apparatus capable of transporting the chemical liquid applied to the substrate to be processed in the chemical liquid applying apparatus to the second apparatus in which the next process is performed in the original state applied without flowing down. The purpose is to provide.

That is, an object of the present invention is to minimize the vibration applied to the processing target substrate to which the chemical liquid is applied in the chemical liquid applying apparatus, and to transport the applied chemical liquid to the apparatus where the next step is performed while maintaining the original state.

In other words, an object of the present invention is to prevent the chemical liquid from flowing down and contaminating the surroundings by vibration generated during transportation even when the chemical liquid is applied to the surface of the substrate to be processed in the chemical liquid applying apparatus with a thickness of 2 to 3 mm. .

On the other hand, an object of the present invention is to improve the efficiency of the process by enabling continuous transport in an in-line manner in transporting the substrate to be processed from the chemical liquid applying apparatus to the second apparatus where the next step is performed.

To this end, the present invention limits the vertical movement of the substrate to be processed in transporting the substrate to which the chemical liquid is applied and maintains the state supported by the uniform force on the entire bottom of the substrate. It aims at conveying to the 2nd apparatus performed.

The present invention is a substrate stage on which the substrate to be processed is mounted in order to achieve the object as described above; A slit nozzle for applying a chemical to a surface of the substrate to be processed mounted on the substrate stage; A floating unit which is installed in a conveying path for transferring the substrate to be processed to a second apparatus where the next process is performed after the chemical liquid applying process is performed to inject air upwards to float the substrate to be processed; A carriage for holding the target substrate from the substrate stage to the second device and moving the substrate to a floating state; It provides a substrate processing apparatus comprising a.

This transfers the substrate to be processed by applying the chemical liquid on the substrate stage to the second apparatus where the next step is performed, thereby transporting the bottom surface of the substrate to be floated with uniformly injected air. The vibration generated during the start and stop of conveying the substrate to be processed or the processing target can be minimized.

At this time, according to an embodiment of the present invention, the substrate stage may be formed with a suction hole for fixing the substrate to be processed and an exhaust hole for floating the substrate. Through this, the carriage can hold the substrate to be processed while slightly lifting the substrate to which the chemical liquid is applied on the substrate stage.

On the other hand, according to another embodiment of the present invention, the substrate to be processed may be mounted on a support plate on the substrate stage, and the support plate may be transferred to the second device while being held by the carriage. Even in this case, a uniform floating force is applied to the bottom surface of the supporting plate by the floating unit, so that the vibration applied to the substrate to be processed can be minimized and transferred to the second device where the next step is performed.

On the other hand, according to another field of the invention, the present invention comprises the steps of placing the substrate to be processed on the substrate stage; Applying a chemical to the substrate to be processed mounted on the substrate stage; Floating the to-be-processed substrate with air ejected from the substrate stage, and holding the injured to-be-processed substrate with a carriage; The carriage is moved to the second device to be subjected to the next process with respect to the substrate to be processed, wherein air is sprayed upward on a bottom surface of the substrate to be transferred to the second apparatus while the substrate is floating. It provides a substrate processing method comprising the step.

In addition, the present invention, after mounting the substrate to be processed on the support plate on which the grip portion is formed, the step of mounting the support plate and the substrate to a substrate stage; Applying a chemical to the substrate; Gripping the grip of the support plate with a carrier; The carriage is moved to the second device to be subjected to the next process with respect to the substrate to be processed, and upwardly air is injected from the floating unit provided in the area connecting the substrate stage and the second device, so that the substrate is processed. Transferring to the second device in an injured state; It provides a substrate processing method comprising.

By carrying the substrate to be processed to the second device as described above, even when the chemical liquid is applied to the surface of the substrate to be processed to a thickness of 2 mm or more, the flow of the chemical liquid applied by the small vibration can be caused. It was confirmed that it can apply | coat, maintaining the application state as it is from a chemical | medical agent application apparatus to a 2nd apparatus, maintaining it as it is.

As described above, in the present invention, in transporting the processing target substrate coated with the chemical liquid in the substrate stage to the second apparatus where the next step is performed, the bottom surface of the processing substrate is uniformly applied by the floating force caused by air uniformly injected. By carrying it in such a supported state, it is possible to obtain an advantageous effect of minimizing vibrations generated during the transportation of the substrate to be processed or when starting and stopping the substrate to be processed.

In addition, the present invention by supporting the substrate to be treated with the chemical liquid with a uniform flotation force, to minimize the bending displacement of the substrate to be treated to obtain an advantageous effect that can be transported to the second device while maintaining the application state of the chemical liquid as it is Can be.

Thus, carrying the to-be-processed board | substrate to a 2nd apparatus, maintaining the application | coating state of the chemical | medical agent apply | coated to the to-be-processed board | substrate was confirmed experimentally even when a chemical liquid was apply | coated to the surface of a to-be-processed substrate with a thickness of 3 mm.

In addition, the present invention provides a process for applying a chemical liquid to the surface of the substrate to be processed and a vacuum drying process performed in the second apparatus, as it is transferred in-line from the chemical liquid applying apparatus to the second apparatus where the next process is performed. The substrate bonding process can be performed in a series of continuous processes, thereby obtaining an advantageous effect of improving the process efficiency.

1 illustrates a general substrate processing process
FIG. 2 is a plan view showing a structure in which a substrate to be processed is gripped by a supporting part of the conventional substrate transport apparatus of FIG.
FIG. 3 is a side view showing the deflection of the substrate to be held held by the supporting portion of FIG.
4A is a plan view schematically illustrating a configuration of a substrate processing apparatus according to an embodiment of the present invention.
4B is a front view of FIG. 4A
5 is a cross-sectional view along the cutting line AA of FIG. 4B
6A to 6C sequentially illustrate configurations according to a process of processing a substrate to be processed using the substrate processing apparatus of FIG. 4A.
7A is a plan view schematically illustrating the configuration of a substrate processing apparatus according to another embodiment of the present invention.
FIG. 7B is a front view of FIG. 7A
Fig. 8 is a cross sectional view along the cutting line BB of Fig. 7b.
9A to 9C are diagrams sequentially illustrating a configuration in accordance with a process of processing a substrate to be processed using the substrate processing apparatus of FIG. 7A.

Hereinafter, a substrate processing apparatus 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention.

4A is a plan view schematically illustrating the configuration of a substrate processing apparatus according to an embodiment of the present invention, FIG. 4B is a front view of FIG. 4A, FIG. 5 is a cross-sectional view along the cutting line AA of FIG. 4B, and FIGS. 6A to 6C. 4 is a diagram sequentially illustrating a configuration in accordance with a process of processing a substrate to be processed using the substrate processing apparatus of FIG. 4.

As shown in the figure, the substrate processing apparatus 100 according to an embodiment of the present invention is a substrate stage 110 to mount the substrate (G) to be processed, and the substrate to be mounted on the substrate stage 110 ( A process in which the nozzle unit 120 for applying the chemical liquid 55 to the surface of G) and the substrate G to which the chemical liquid 55 is applied are held, and the next step is performed on the substrate G. Air is sprayed onto the carriages 130 and 130 'to be transferred to the apparatus 30, and the bottom surface of the substrate G to be transported in the space between the substrate stage 110 and the second apparatus 30 to be treated. It is composed of a floating unit 140 for floating the substrate (G) with a uniform floating force.

Although not shown in the drawing, the substrate stage 110 is provided with a plurality of suction holes and exhaust holes, and the suction pressure 111p is applied to the vacuum pump 111 in a state where the substrate G is mounted. When the position of G) is fixed and the application of the chemical liquid 55 to the processing target substrate G is completed, the positive pressure 112p is applied to the first pressure pump 112 to process the processing target substrate G by the substrate stage 110. Slightly lift from).

The nozzle unit 120 discharges the chemical liquid 55 from the slit nozzle (reference numeral 22 in FIG. 1) while moving in the longitudinal direction 120d with respect to the substrate stage 110 to the surface of the substrate G to be processed. The chemical liquid 55 of a predetermined thickness is applied. Although the detailed configuration of the nozzle unit 120 is not shown in Figs. 4 to 6C, the same or similar configuration as the chemical liquid applying unit of the known slit coater apparatus may be employed.

The carriages 130 and 130 'are provided with a gripping portion 130a for gripping an edge of the substrate G to hold the substrate G. The gripper 130a may be formed in a form of a tong, and a suction port through which the suction pressure 131p is applied is communicated with the suction pump 131 on the upper surface thereof, so that the bottom surface of the edge of the substrate G to be processed is controlled. May be fixed by adsorption at several locations. To this end, as shown in FIG. 5, each of the carriages 130 and 130 ′ is in communication with a suction pump 131 to which suction pressure is applied.

Guide rails on both sides of the second device 30 from the substrate stage 110 so that the carriages 130, 130 ′ can move from the substrate stage 110 to the fixed body 31 of the second device 30. 70 is provided to guide the movement of the carriages 130, 130 'in the longitudinal direction 130d. In the figure, the configuration of the carriage 130, 130 'is composed of two pairs, but may be composed of three to four pairs. In addition, although the configuration in which the nozzle unit 120 also moves along the guide rail 70 is illustrated as an example, the nozzle unit 120 may be moved by a separate guide means.

The carriages 130, 130 ′ and the nozzle unit 120 can be moved along the guide rail 70 on the principle of a linear motor. That is, the N pole and the S pole are alternately arranged on the guide rail 70, and coils are installed on the carriages 130 and 130 ′ and the nozzle unit 120 engaged with the guide rail 70 to control the coil. By applying a current, the carriages 130 and 130 'and the nozzle unit 120 can be precisely moved along the guide rail 70.

The floating unit 140 is formed from the substrate stage 110 to the fixed body 31 in the second device 30, and applies a uniform floating force 140v to the bottom surface of the substrate G to be processed. To this end, the exhaust holes 140a are formed at regular intervals over the upper surface. The exhaust hole 140a communicates with the second pressurizing pump 141 so that air is injected at a controlled pressure when the substrate G is transported, so that the bottom surface of the substrate G is uniformly supported. It is possible to suppress the bending displacement of the substrate G to be processed and to keep the substrate G flat.

Hereinafter, a substrate processing method using the substrate processing apparatus 100 according to the embodiment of the present invention configured as described above will be described in detail with reference to FIGS. 6A to 6C.

Step 1 : First, as shown in FIG. 6A, the carriages 130 and 130 'are guided in the direction indicated by reference numeral 130x so that the plurality of carriages 130 and 130' are located outside one side of the substrate stage 110. It moves along the rail 70.

Subsequently, the substrate stage 110 is mounted on the substrate G and the vacuum pump 111 is operated to apply the suction pressure 111p to the suction hole of the substrate stage 110. Fix the position of (G).

And while the nozzle unit 120 moves to 120x, the chemical liquid 55 is apply | coated to the surface of the to-be-processed substrate G with a uniform thickness from a slit nozzle.

Step 2 : Then, as shown in Fig. 6B, the nozzle unit 120 is moved in the direction indicated by reference numeral 120x 'and moved outward of the other side of the substrate stage 110. At the same time, the substrate stage 110 applies the floating force 110v to the substrate G by spraying air into the exhaust hole with the first pressure pump 112 to apply the substrate G to the substrate stage 110. ).

Then, the plurality of carriages 130 and 130 'are moved in the direction indicated by reference numeral 130x' and positioned at both sides of the substrate stage 110 at intervals from each other, and then the suction pump 131 as shown in FIG. The suction pressure 131p is applied to the suction ports of the carriages 130 and 130 'to grip the substrate G at the holding portion 130a of the carriages 130 and 130'.

Step 3 : Then, in a state in which air is injected to the plurality of exhaust holes of the floating unit 140 by the second pressure pump 141 so that the floating force 140v is applied, the carriages 130 and 130 ' The substrate G to be processed is transferred along the guide rail 70 to the second device 30 where the next step is performed. Since the to-be-processed substrate G is supported by the uniform floating force 140v by the air discharged from the floating unit 140, the to-be-processed substrate G maintains a flat state without local bending deformation, and thus, the substrate stage ( Conveyed from 110 to the second device 30.

At this time, the floating force 110v acting on the substrate stage 110 is continuously applied until the substrate G is released from the substrate stage 110. More preferably, an exhaust hole through which air is blown is formed in the upper surface of the fixed body 31 of the second device 20 where the next process is performed, so that the substrate stage 110 is located above the fixed body 31. Even in the state, the substrate stage can be supported with uniform floating force.

Then, when the substrate G to be processed is positioned above the fixed body 31, the suction pressure 131p applied to the carriages 130 and 130 'is removed, and the carriages 130 and 130' are lifted unit. It is moved to both sides of 140. The substrate G is slowly mounted on the mounting surface of the fixed body 31 while the floating force of the air injected from the exhaust hole (not shown) of the mounting surface 31s of the fixed body 31 is lowered.

Substrate processing method according to an embodiment of the present invention configured as described above is the bottom surface of the substrate to be processed (G) due to the floating force by the air after the substrate (G) is applied to the chemical liquid in the substrate stage 110 Since it is conveyed to the second device 30 while being uniformly supported in its entirety, it is possible to eliminate vibrations generated when the substrate G is held by the robot arm and when the substrate G is placed. Since it is supported by a constant air flotation force and maintained in a flat state throughout the transfer from the substrate stage 110 to the second device 30, the chemical liquid applied in the substrate stage 110 is uniformly distributed. The beneficial effect can be obtained.

Hereinafter, the substrate processing apparatus 200 according to another embodiment of the present invention will be described in detail. However, in describing another embodiment of the present invention, a detailed description of functions or configurations common to the substrate processing apparatus 100 of the above-described embodiment will be omitted for clarity.

Fig. 7A is a plan view schematically showing the configuration of a substrate processing apparatus according to another embodiment of the present invention, Fig. 7B is a front view of Fig. 7A, Fig. 8 is a cross sectional view along the cutting line BB of Fig. 7B, and Figs. 9A to 9C. FIG. 7A is a diagram sequentially illustrating a configuration according to a process of processing a substrate to be processed using the substrate processing apparatus of FIG. 7A.

The substrate processing apparatus 200 according to another exemplary embodiment of the present invention does not float the target substrate G on the substrate stage 110, and air floats only between the substrate stage 110 and the second apparatus 30. It is different from the above-described embodiment in that it is transported in a state. That is, as illustrated in FIGS. 7A and 7B, the substrate processing apparatus 200 according to another exemplary embodiment of the present invention may include a substrate stage 110 for mounting a substrate G and a substrate stage 110. The nozzle unit 120 for applying the chemical liquid 55 to the surface of the substrate to be processed G, and the substrate G to which the chemical liquid 55 has been applied, are gripped with respect to the substrate G. The carriages 230 and 230 'to be transferred to the second device 30 where the next step is performed, and the bottom surface of the substrate G to be transported in the space between the substrate stage 110 and the second device 30. A floating unit 140 for injecting air to float the substrate G with a uniform flotation force, and a support plate 250 positioned at the bottom of the substrate G to be transported together with the substrate G. It consists of.

Although the substrate stage 110 is not shown in the drawing, a plurality of suction holes are formed, and the suction pressure 111p is applied to the vacuum pump 111 in a state where the substrate G is mounted. Fix the position of. The suction hole of the substrate stage 110 is aligned with the hole (not shown) of the support plate 250, so that the suction pressure 111p by the vacuum pump 111 is applied to the substrate G to be processed.

The carriages 230 and 230 ′ are provided with a gripping portion 130a for gripping an edge of the substrate G to hold both sides of the support plate 250 for mounting the substrate G. More specifically, as shown in Figure 8, the holding portion 230a may be formed in the form of picking in the form of tongs, as in the above-described embodiment, both sides of the support plate 250 is sucked by suction pressure to grip You may. As shown in FIG. 8, in the case of picking up in the form of tongs, the moving tongs 235 are moved by rotating the screw shaft 234 which is engaged with the moving tongs 235 in the forward and reverse directions indicated by 234d. Both sides 255 of the support plate 250 may be gripped by moving in the up and down direction 235v above the 230.

Guide rails on both sides of the second device 30 from the substrate stage 110 so that the carriages 230, 230 ′ can move from the substrate stage 110 to the fixed body 31 of the second device 30. 70 is provided to guide the movement of the carriages 230, 230 'in the longitudinal direction 230d. In the figure, the configuration of the carriage 230, 230 'is composed of two pairs, but may be composed of three to four pairs.

The floating unit 140 is formed from the substrate stage 110 to the fixed body 31 in the second device 30, and applies a uniform floating force 140v to the bottom surface of the substrate G to be processed. To this end, the exhaust holes 140a are formed at regular intervals over the upper surface. As shown in the figure, the upper surface of the floating unit 140 is positioned lower than the upper surface of the substrate stage 110, so that the upper side of the floating unit 140 may be moved even if the supporting plate 250 and the substrate G are horizontally moved. The air flotation force 140v allows uniform support over the entire area of the substrate. That is, the exhaust hole 140a communicates with the second pressure pump 141, and when the substrate G is transported, air is injected at a controlled pressure, so that the bottom surface of the substrate G is uniformly supported. This suppresses the occurrence of the bending displacement of the substrate G and maintains the flat state of the substrate G.

The support plate 250 moves together in a state where the substrate G is mounted on the upper surface, and a hole is formed to align with a suction hole formed in the substrate stage 110, and acts from the substrate stage 110 through the hole. The suction force is transmitted to the substrate G to be processed. As shown in FIG. 8, the supporting plate 250 is formed to be easily gripped by the holding portions 230a of the carriages 230 and 230 ', with both sides bent upward. Since the support plate 250 is used for horizontal transfer of the substrate G to be processed,

Although not shown in the drawings, a marker is formed to assist the alignment of the holes of the support plate 250 and the suction holes of the substrate stage 110. As a result, the support plate 250 may be mounted on the substrate stage 110 at a predetermined position.

Hereinafter, a substrate processing method using the substrate processing apparatus 200 according to the exemplary embodiment of the present invention configured as described above will be described in detail with reference to FIGS. 9A to 9C.

Step 1 : First, as shown in Fig. 9A, the carriages 230, 230 'are guided in the direction indicated by 230x so that the plurality of carriages 230, 230' are located outside one side of the substrate stage 110. It moves along the rail 70.

Next, the support plate 250 is mounted on the substrate stage 110, and the substrate G is mounted on the support plate 250. Alternatively, the support plate 250 may be mounted on the substrate stage 110 in a state where the substrate G is mounted on the support plate 250 in advance. Positioning markers are formed in the support plate 250 and the substrate stage 110, and the support plate 250 is placed on the substrate stage 110 with the holes of the support plate 250 and the suction holes of the substrate stage 110 aligned. Is mounted.

Then, the vacuum pump 111 is operated to apply the suction pressure 111p to the suction hole of the substrate stage 110 so that the supporting plate 250 and the processing target substrate G thereon are fixed in position. And while the nozzle unit 120 moves to 120x, the chemical liquid 55 is apply | coated to the surface of the to-be-processed substrate G with a uniform thickness from a slit nozzle.

Step 2 : Then, as shown in Fig. 9B, the nozzle unit 120 is moved in the direction indicated by reference numeral 120x 'and moved outward of the other side of the substrate stage 110. At the same time, the plurality of carriages 230, 230 ′ move in the direction indicated by reference numeral 230x ′ and are spaced apart from each other on both sides of the substrate stage 110, and then the screw shaft 234 as shown in FIG. 8. The moving forceps 234 are moved downward by rotating 234d to grip both side portions 255 of the support plate 250. Although not shown in the drawing, as shown in FIG. 5, both side portions 255 of the support plate 250 may be gripped by suction pressure.

Step 3 : Then, in a state in which air is injected to the plurality of exhaust holes of the floating unit 140 by the second pressure pump 141 so that the floating force 140v is applied, the carriages 230 and 230 ' The substrate G to be processed is transferred along the guide rail 70 to the second device 30 where the next step is performed.

On the upper side of the substrate stage 110, the support plate 250 slides with respect to the substrate stage 110, but when a part of the support plate 250 is positioned above the floating unit 140, it is discharged from the floating unit 140. The supporting plate 250 and the substrate G are supported by the uniform floating force 140v by the air. When the substrate G reaches the upper surface of the fixed body 31 of the second device 30, the support plate 250 is supported and seated by the mounting surface 31s of the fixed body 31. To this end, the height of the mounting surface 31s of the fixed body 31 is approximately the same height to have a fine height deviation to allow the height of the upper surface of the substrate stage 110 and the bending displacement of the substrate G to be processed. It is preferable to install.

Therefore, the substrate G to be processed is horizontally transported from the substrate stage 110 to the second device 30 while maintaining a flat state without local bending deformation.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

DESCRIPTION OF REFERENCE NUMERALS
100: substrate processing apparatus 110: substrate stage
120: nozzle unit 130, 130 ', 230: carriage
140: floating unit 250: support plate

Claims (9)

  1. A substrate stage on which a substrate to be processed is mounted;
    A slit nozzle for applying a chemical to a surface of the substrate to be processed mounted on the substrate stage;
    A floating unit which is installed in a conveying path for transferring the substrate to be processed to a second apparatus where the next process is performed after the chemical liquid applying process is performed to inject air upwards to float the substrate to be processed;
    A carriage for holding the target substrate from the substrate stage to the second device and moving the substrate to a floating state;
    Substrate processing apparatus comprising a.
  2. The method of claim 1,
    And the substrate stage includes a suction hole for fixing the substrate to be processed and an exhaust hole for floating the substrate.
  3. The method of claim 2,
    And a vent hole for injecting air is formed on a mounting surface of the second device on which the substrate is to be processed.
  4. The method of claim 1,
    The substrate to be processed is mounted on a support plate on the substrate stage, and the support plate is transferred to the second device with both sides of the support plate held by the carriage.
  5. 5. The method of claim 4,
    The upper surface of the floating unit is disposed at a height lower than the upper surface of the substrate stage.
  6. 5. The method of claim 4,
    The mounting surface on which the substrate to be processed is mounted in the second device is installed at the same height as the substrate stage.
  7. 7. The method according to any one of claims 1 to 6,
    The floating unit is a substrate processing apparatus, characterized in that the exhaust holes are arranged at uniform intervals so as to support the bottom surface of the substrate to be processed with a uniform floating force.
  8. Mounting the substrate to be processed on the substrate stage;
    Applying a chemical to the substrate to be processed mounted on the substrate stage;
    Floating the to-be-processed substrate with air ejected from the substrate stage, and holding the injured to-be-processed substrate with a carriage;
    The carriage is moved to a second device to be subjected to the next process with respect to the substrate, wherein air is sprayed upward on the bottom surface of the substrate to transfer the substrate to the second apparatus while the substrate is floating. Steps;
    ≪ / RTI >
  9. Mounting the substrate on the support plate on which the grip part is formed, and then mounting the support plate and the substrate on a substrate stage;
    Applying a chemical to the substrate;
    Gripping the grip of the support plate with a carrier;
    The carriage is moved to the second device to be subjected to the next process with respect to the substrate to be processed, and upwardly air is injected from the floating unit provided in the area connecting the substrate stage and the second device, so that the substrate is processed. Transferring to the second device in an injured state;
    ≪ / RTI >
KR1020120005525A 2012-01-18 2012-01-18 Substrate treating apparatus KR101818070B1 (en)

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JP2002181714A (en) 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2005032626A (en) 2003-07-08 2005-02-03 Calsonic Kansei Corp Pure water tank for fuel cell power generation system
JP4305918B2 (en) 2004-01-30 2009-07-29 東京エレクトロン株式会社 Floating substrate transfer processing equipment
JP4049751B2 (en) 2004-02-05 2008-02-20 東京エレクトロン株式会社 Coating film forming device
JP4033841B2 (en) 2004-02-12 2008-01-16 東京エレクトロン株式会社 Floating substrate transfer processing method and apparatus
JP4378301B2 (en) 2005-02-28 2009-12-02 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and substrate processing program
JP2006332378A (en) 2005-05-26 2006-12-07 Sharp Corp Method and apparatus for positioning article, and for manufacturing semiconductor device

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