TWI272662B - Substrate treating apparatus and substrate treating method and substrate treating program - Google Patents

Abstract

The section where the 1st and 2nd substrate conveyance parts 84A, 84B hold and convey a substrate G together is not all the conveyance sections from a carrying-in position to a taking-out position but the middle section from an application start position to an application end position. If the substrate Gi is conveyed to an application end position, the 1st substrate conveyance part 84A will finish the duty of conveyance to the substrate Gi concerned there, will return to a carrying-in position immediately, and will start for conveyance of a following new substrate Gi+1. On the other hand, the 2nd substrate conveyance part 84B waits to convey a substrate Gi independently from an application end position to a taking-out position, and to return to a front application start position and for the 1st substrate conveyance part 84A to convey the following substrate Gi+1 from a carrying-in position, independently to the position subsequently.

Description

1272662 IX. Description of the invention: [Technical field to which the invention belongs] This side is supplied on the substrate of the cake. The female is technically: the other is about the material rotation method on the substrate. 2: [Prior Art] - Seed Surface Age 11 (FPD) manufacturing office _ light material, for A mesh ϊ ίί: processing substrate (such as glass substrate) < large-scale dt is 2 to make the photoresist liquid to the lion strip light resistance coating thick photoresist . The ordering party moves and moves on the substrate with the conventional film in a non-rotating manner using the desired film, and the horizontally fixed carrier, for example, the discharge port of the photoresist nozzle of Patent Document 1 The substrate of # and the resistance nozzle disposed above the stage are formed in the broom direction (the general direction is 'two long = 21, the interval is, the light is moved, and the horizontal direction of the photoresist is discharged on the substrate) In the case of a horizontally long or long strip, the nozzle is blocked from the γ = structure, and the broom of the nozzle is advanced. (4) The long strip-shaped optical arm is taken out from the carrier substrate, and the robot or the mover will follow. In the new substrate transfer device, the new substrate is placed on the stage by the photoresist by the photoresist. Next, it is treated by the Japanese Patent Publication No. 1]. SUMMARY OF THE INVENTION In the device that is unloaded and broadcasted from the stage, the 5 1272662 substrate cannot be moved and placed on the stage until the top surface of the processed substrate carrier is completely empty. Therefore, the time required to sweep the photoresist nozzle (Te), plus the time required to move the unprocessed substrate and load it to the carrier +=^ (τ(10)), that is, the coating process—彳The required day of the transfer is ", - one. (10)), this is the running time, it is difficult to shorten the running time of the flow. It is the increase of the amount of r, the size of the long-shaped resistive nozzle and the position of the heavy-duty nozzle (stenosis interval), and the speed of 4 It is also a problem that An (4) Water's movements and enthusiasm are more difficult. > The problem of the technique of the present invention is to provide a flow method in which the processing of the supply and application of the treatment liquid is greatly shortened In order to provide a substrate processing apparatus and a substrate processing method, the dog can efficiently increase the size of the substrate. The object of the substrate processing apparatus of the present invention has a carrier, which is placed on the substrate ί in the ~ = production loan: the pressure of the gas ejected 'cures 使 ϊ ; ^;; ί ^ 5 f Ξ;:,:Γί^ Today's board 1 ί - 支 Support it handles the 部 ί part that floats on the stage 'from the set position and the coating position and transports it on the table. Sc From the position of the cloth to the position of the exit, the support is set to the position of the substrate, the application end position, and the carry-out position 6 I272662 f along the substrate; The majority of the spray discharge force causes the broken substrate to float at the height f; on the stage, the first section from the ^^ to the coating start position supports the substrate:... The starting position is up to the coating end position, the cloth ending position is to the carry-out substrate, and the processing liquid is conveyed in the first two-: 基板 substrate transport direction. In the period of the singularity, the top surface of the substrate is coated with the 'original and substrate processing program, and the following is carried out on the top of each of the pedestals with the majority of the discharge ports, the current US plate, and the ☆ on the substrate. a step of arranging the first and second portions of the substrate on the stage at the position of the grading state τ from the coating side to the f: During the period in which the ΐ ϊ ϊ 开始 开始 位置 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 赖 赖 赖 赖 赖 赖 赖 赖 赖The substrate floats in the air, and is transported from the moving position to the stop === cloth position on the stage, and the processing liquid is supplied from the processing liquid supply unit to the portion of the coating liquid required for the processing. ^ ^ ^ ^ 罘 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板The part is supported by the second position between the moving position and the coating position, and the floating position is carried out. In the state of the substrate, the __ and the second substrate transporting unit simultaneously support and transport the substrate _, not all the transport _ from the 7 1272662 to the carry-out position, but the intermediate section from the second position to the set position. The first substrate transporting unit transports the substrate to the first position, and then transports the substrate, and immediately returns to the moving position and proceeds to carry out the subsequent transfer of the new substrate. In addition, the second substrate transporting portion is from the first position. Until the substrate is transported separately, and then returned to the second position, and wait for the first-lower substrate to be transported separately. Thereby, the first and second substrates are moved to the second substrate. In the vicinity of the application position, the transportation and the transportation in the area (the moving side section and the carrying-out section) are carried out on the early side, and the lining of the south and the running water _ is greatly improved. [(4) Shouting in the first place In a preferred embodiment, in accordance with a preferred embodiment, the substrate is coated with the processing liquid on the substrate from the =where = cloth and the substrate reaches the first position. State 様 'the first - and The substrate transporting portions respectively have: a first moving side: a side of the 375 carrying stage, and a parallel extending from the substrate, and a transporting body movable along the first guiding rail; In order to drive the first and second and second support portions, the first side edge portion of the substrate is supported by the first transporting device, and the first side edge portion of the substrate is arbitrarily sucked and lowered. The second substrate transporting portion ί 2 edge: ΐ" to make the second transporting her: ===. The younger brother and the first support portion preferably have the first and the first fine-adsorption adsorption a base portion of the substrate:: = a support portion, wherein a base end portion is fixed to the first transport body, coupled to the first-transmission; and a second and second spacer adsorption control portion 2 1 1272662 The first and second lining adsorption control supply is negative, so that the first and second brothers 7 and f are padded with the second positive pressure supply portion for the first and/or second and second lining of the substrate and the sub-layer The pads are separated from the substrate. And the pad-feeding positive pressure, so that, in accordance with a preferred state, the first and second branches, the first and second pad-receiving portions are: Cfi to the substrate ; ii to return the first and second pad support portions, the second base 2 and the second, the first and second support portions, the vertical sorrow and the squat - the pad is coupled to the base yang, the name钵笛一》铉一一一, 塾 is separated from the substrate. The first and second lining support portions are operative to change the height of the front end portion of the edge substrate. According to a preferred embodiment, the loading portion has a loading position on the loading table, and the front end of the pin is raised, and is used to lock the first top lifting lock in::: Bits are moving. Moreover, the unloading portion has a second position between the second plurality and the moving position above the stage, and the original position below the table is 'in accordance with the preferred state'. The processing liquid is supplied to the position, and the ridge passes under the nozzle. The substrate is a pair of left and right side edge portions viewed from the direction of the first and the first hybrid substrate 1 of the substrate from the row-method. Moreover, the conveying speed is set independently, and the substrate is stopped, and the support for the second portion of the county plate is started; or, when the movement is stopped, the support for the second portion of the plate is started. Further, at the end position of the coating 9 1272662, the substrate is temporarily stopped, and the support is terminated; or the movement of the substrate is not stopped, that is, the support of the portion ====. Further, the substrate is placed at a position on the substrate in the second section. In the case of the substrate of the present invention, the substrate processing apparatus and the substrate processing method according to the present invention can greatly shorten the processing operation for supplying and applying the processing liquid on the board. In the case of the flow-through type, it is possible to efficiently carry out the enlargement of the substrate in accordance with the lift and the fineness of the substrate. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. ^中' display-coating development processing system, 'in the system g, for example, using LCD substrate as the substrate to be processed, in the process of cleaning, photoresist coating, job baking, household 1 exposure treatment (4) Next, the exposure setting device (t®=) is configured to be roughly classified into a card station (P/S) 12 and an interface (I/F) 14. (./...〇, (4) General Department's card _(C/S)1() has: card table 16, minus C to a predetermined number, for example 4; handling 2 17 placed on card g stage 16 The upper side, parallel to the arrangement of the card c, the direction, and the transport mechanism 2G can be arbitrarily moved on the transport path 17, and the card of the carrier is transferred to the substrate G. 2〇The means with the supportable base=, for example, the transport arm' can be actuated on the Χ, γ, ζ, _4 axes, and can be processed by the handling station (] VS) on the 12th side of the JTF. The station (P/S) 12 passes through (interposes) the substrate interposer 23, the chemical supply sheet 10 1272662 i! 5, and the upper space 27, and is laterally arranged in order from the card (4) (c/s) 10 side. The processing unit η, the coating processing unit %, and the development processing unit %. The cleaning processing unit 22 includes: two scrubbing cleaning units (SCR),

Section UV irradiation/cooling unit (UV/a) L) 3G, I and cooling unit (COL) 34. The coating treatment unit 24 includes a non-rotating right Kawasaki surface drying unit (VD) 42 and upper and lower two stages _ holding/cooling unit (ad/) c =. Upper and lower two-stage heating/cooling unit (ffiVc〇L) 48, and heating unit (then development processing unit 26 includes: three developing units (D) segment type heating/cooling material (HP/TOL) 53, and fresh elements ^= The second towel center portion of each of the processing units 22, 24, and 26 is in the longitudinal direction, and the transport devices 38, 54 and 6G move along the transport path %, ί = and into and out of each processing unit. In each unit, the substrate G is moved, moved, or transported. In this system, the units of the liquid processing system are disposed on the side of the moving paths 36, 51, and 58 in each of the processing units 22, 24, and 26 (scr, ct, de (, on the other side, the unit of the heat treatment system (Hp, C〇l, etc.) is placed.; The other part of the system is placed at the other end of the face (I/F) 14 towel, one side f The extension portion (substrate delivery portion) 56 and the buffer station 57' are connected to the exposure f 2 - the financial institution 59. The transport mechanism 59 can be any crane on the route 19 of ^, =, except for the stinky coffee Figure 2 shows the processing sequence in the coating development processing system. (C/S) In 1G, the 'transport mechanism 2' is loaded from the stage 16 and is transferred to the substrate. Station (P/S) 12 = Out device 38 (Step S1). 丨a's version is only ΐ! ν at ΐΓί Γ 板 板 plate G first order is moved by the line / a π early 兀 (UV / In COL) 30, in the first ultraviolet irradiation unit (υν〇1272662, the teaching by ultraviolet irradiation is cooled to a predetermined temperature (the organic matter in the cooling unit (col) is removed.) This ultraviolet cleaning system is mainly intended to be The net surface of the substrate surface ==^ unit (SCR) 28 after receiving the scrubbing wash, the substrate G is heating a single dirt (steps). Scrubbing and washing step S4), then in the cooling unit (c〇) Dehydration treatment by heating (step S5). Up to this point, the cleaning processing unit = a constant substrate temperature (the step 38 is transported to the substrate G via the base "feeding unit 23" by the transporting device (G money scale collapses In the cooling unit, the 基板 'substrate G is sequentially carried into the heating/cooling unit (HP/COL) 48 "9, the two i hot and hot (HP) coated baking (lin) (step) =) 'The receiver is cooled to a certain substrate temperature in the unit (c〇L) (step). Moreover, the baking after the coating can also use the heating sheet. (Hp) 刈 After the coating process, the substrate (the transport device 54 of the coating processing unit 与 and the transport device 6 of the development processing unit 26 are transported to the face (i/f ^ is transported to the exposed wire) In the exposure apparatus, the predetermined substrate is exposed to the substrate, and then the substrate G whose image is completed is returned from the sV face to the face (I/F) 14. The transport mechanism w of the portion (I/1F) 14 transmits (10) the station (p/ > in the development processing unit 26, the substrate G is subjected to development processing in any of the developing units (DEV) 52 (step S12), and then sequentially It is carried into a heating/cooling unit (Hp 12 1272662 513), followed by post-baking in the μ unit (®) (step 514). = baking can also use the substrate temperature to be heated (steps

/S into a series of processed substrates G by processing station (P

Invention temperature = Description This unit light-time cloth unit (CT) 4G and decompression drying as shown in Figure 3, on the support table or support frame 7〇, coated == line 5i side of the handling device 54 (Figure 1), such as The substrate Gf is shown in the arrow Fa to enter the resist coating unit (ct) 40. The transport arm 74, ir==, light, which can be moved in the X direction by being guided by m ¥ 72. 42 Φ-CVD of the coating treatment unit (ct) 4g completed in 4g) 42 ° (vd), the tunnel (4) The photoresist coating unit (CT) 40 has a stage 76 extending in the X direction. On the H stage 76, the substrate G is transported in the same direction as the water, and the photoresist is supplied onto the substrate from the elongated photoresist nozzle 78 disposed above the substrate 76, which is not the top surface of the substrate. (Processed surface) - a thick photoresist coating film. The structure and function of each part in the early (CT) 40 will be described in detail later. =J drying unit (VD) 42 has: a top-gate tray, a bottom-bottom container type, a valley to 80, and an upper portion that can be tightly sealed or embedded with the top surface of the lower chamber 8 Room (not shown). The lower chamber 8〇 has a quadrangular shape, and the center of the crucible is provided with a stage 82 on which the ribs are horizontally placed and supports the substrate G, and the four corners of the bottom surface are provided with an exhaust port 83 at 13 corners. Each of the exhaust gases π 83 is connected via a discharge f (not shown). In a state where the lower chamber 80 covers the upper chamber, the vacuum pump pumps the sealed processing space in the two chambers to a predetermined degree of vacuum. 4 and 5 show a more detailed overall structure in (CT) 40 according to an embodiment of the present invention. % + 1 milk, in the photoresist coating unit (CT) of the embodiment, the stage % is not used as the mounting surface of the euro-supporting plate G, and the chip is floated on the substrate floating on the crucible. Starting from the stage. Next, the straight plates arranged on the two sides of the stage 76 are respectively arbitrarily sucked and floated, and the substrates on the ports 6 are respectively. The _ edge portion, and the substrate G is transported on the side of the stage. The wire nozzle 78 is not a movable type or a miscellaneous type, but is fixedly disposed above the center of the stage 76 in the longitudinal direction or the conveying direction (χ direction). The area is divided into five ΐ:

In the La plate 1 'in order to be carried on the stage 76 from the transport arm of the transport device 54 (FIG. 1), a plurality of (for example, four) can be disposed at an interval between the original position below the stage and the upper side of the stage. Lifting and lowering as the source of the top lift pin lifting unit 85 (Fig.) US: The area where the floating substrate is transported is started, and in order to make the i 喷 喷 Ha Ha Ha Ha Ha , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Here, the loading position is not the height position of the substrate G calculated by the top surface or the floating position / /i precision, as long as it is maintained at, for example, 〜15G " m of the van K Hu direction (X direction) The size of the 'moving area A' is two 87 2 m 5 inches. Further, in the carry-in area M1, an alignment portion 87 (Fig. 12) is provided for placing the substrate G at the correct position on the stage %. 14 1272662 Area i 2 / = area of the M3 system photoresist supply area or coating resistance nozzle 78 for the 弁 ^ area 吣 ' at the predetermined position to accept light from above to make the substrate coating area Μ 台 top On the surface, there is no difference between the two positions: the sub-position Hb, and a plurality of sprays are arranged at a certain density. 90! ^ i The air outlet 88 for contracting the air and the suction port for sucking the air with a negative pressure ° 88 90 a ό , that is, the remaining S: the starting position Hb is maintained at the setting 値 (for example, 50//m). Also in the soil cloth, the floating position Hb in the M3 is specified at the lower end of the nozzle (spelling outlet): ,,: ΐίρ wei cloth uniformity or important parameters of the photoresist consumption, necessary ^ in this embodiment The substrate g is pulled from the coating area by 3 from J π Ί * 2 88 by applying a vertical upward force by the compressed air, and the fine balance is synthesized, and the floating position is held in the setting): The feedback control mechanism includes a strict detection sensor (not shown) for detecting f and the like. Further, in the case of transporting λ, the size of the application region is only required to be sufficiently narrow at the above-mentioned ruler of the photoresist nozzle g, and it is usually set in the middle between the carry-in region M1 and the application region M3 than the substrate f. The area M2 is a private area for changing or shifting the height position of the substrate G from the sub-location position Ha (100 to 150//mm) in the loading area to the floating of the coating area, and the position Hb (9) (four) ). In this transfer region m2, the discharge port 88 and the suction port 9G are also disposed in the top surface of the stage %. However, the density of the suction port 9 (four) is gradually increased along the conveyance direction. This causes the floating position of the substrate G to be linearly changed from 11 & The lower-adjacent area of the coating area M3 is a transfer area for changing the height position of the substrate G from the floating position for coating (Deng Yiguai) by 15 1272662 during transportation. Second, the temple ~ 15 〇 (four). In this transfer area 吣 decompression dry welding r 74 (Figure 3) ι out to the downstream side of the adjacent area it / Figure 3) ° This moving out of the area has the same as the above The value 2 is the construction of the makeup in the work room, in order to report the substrate G from the stage 76 to the transport arm 74 (Fig. 3), between the stage = the unloading position of the mouth == square_ position With the top lift locks above the stage, a plurality of lifts (for example, 4) can lift and lower the moving surface to set the surface of the lifting plate to the top of the floating position. The top lift pin 92 is a top lift lock 91 (Fig. 12) for carrying out the lift line 91 (Fig. 12), for example, with the gas line AS as the drive source. 12), and having a white strip-shaped nozzle body 79' of a length sufficient to cover the stage of the display), and the connection to the source of the liquid from the photoresist (not shown) ^ 94. The nozzle body 79 is a C-shaped nozzle support ^) (2 Γ) supported by the lower end of the nozzle extending in the nozzle length direction (γ M setting type, in order to adjust and descend the substrate G directly below it In the K^ surface, the height position can be arbitrarily changed in the up and down direction by, for example, a nozzle lifter (Fig. 12) composed of a ball screw mechanism, etc. Eighth, Ϊ 4, 6, and FIG. The first and second substrate carrying portions 84A and 84B are disposed in parallel with the left and right sides of the stage 76, and the first and second sliders (transporting bodies) are 98Α, 98Β, and may be in two The guides i〇fu and %B move in the axial direction (Χ direction); the first and second transport drive units 使 can hold the two sliders 98Α, 98Β or both on the two guides 96Α, 96Β Individually straight forward movement; first and second support sections 102Α, 102Β, from two slides 16 1272662

The left and right side edges of the support base plates G 98A and 98B extending toward the center of the stage 76 are arbitrarily sucked. (6) The drive unit 1GGA and the leg train are each constituted by a linear drive mechanism such as a spring motor. Further, the support portions 102A and 1B2B each have a suction 1G4B, and are coupled to the lower surface of the substrate G by vacuum suction force, and a plate spring type pad support portion 1〇6A capable of elastic deformation. 1〇6B, the suction pad 1〇4Α, 104B is supported by the front end portion, and the height position of the front end portion can be changed with the base end portion on the side of the sliders 98A and 98B as a fulcrum. The adsorption pads 104A, 104B are arranged in a row at a predetermined interval, and the pad support portion is 〇6Α, ι〇6β.

Don't stand alone _ pad 1Q4A, legs. Thereby, the side adsorption profile and the pad support 106 can securely support the base G at a separate height position (not - height position). As shown in Fig. 6 and Fig. 7, the pad supporting portions 〇6, 106B in this embodiment are attached to a pad-like lifting portion 108A which can be lifted and lowered on the inner side surfaces of the sliders 98A and 98B: 1 〇8Β. The first and second pad actuators 109A, 109B (Fig. 12), which are mounted on the slider 98, for example, by a cylinder (not shown), lift the ox portions 108A, 1〇8 The original position (retracted position) lower than the floating height position of the substrate G and the forward position (joining position) corresponding to the floating height position of the substrate G are moved up and down. As shown in Fig. 8, the respective suction pads 104A and 104B are provided with a plurality of suction ports 112A on the top surfaces of the pad bodies 11A, 11B of a rectangular shape made of synthetic rubber, for example. The suction ports 112A and n2B are slit-shaped long holes, but may be round or rectangular holes. The adsorption pads 1〇4Α and 〇4〇 are connected to, for example, strip-shaped vacuum tubes 114A and n4B made of synthetic rubber. The lines 116A, 116B of the vacuum tubes 114A, 114B are in communication with the vacuum sources of the first and second pad adsorption control units 1 =, 115B (Fig. 12), respectively. ^In the first and second pad adsorption control units 115A and 115B (Fig. 12), the lines 116A and 116B (Fig. 8) of the vacuum officials 114A and 114B are connected to the compression via a switching valve (not shown). The air source (not shown) switches the switching valve to the side of the compressed air source when the suction pads 1〇4A and 104B are separated from the side edge of the base 17 1272662 plate G, to supply positive Pressurize or pressurize the compressed air to the adsorption pad 1〇4A, 1〇4Β. In the support portions 102A, 102B, as shown in FIG. 4, each of the vacuum suction pads 104A, 104B and the pad support portions 106A, 106B, which are preferably arranged on one side, is separated or separated. Construction. However, it is also possible to have a one-piece structure in which the slabs of the slabs, the slabs of the slabs, and the slabs of the slabs of the slabs . As described above, a plurality of discharge ports (10) are provided on the top surface of the stage 76. In this

In the embodiment, the respective injection ports 88 belonging to the loading area M1 and the carrying-out area m5 of the stage 76 are provided with a squeezing (2) inside the stage 76 in the form of a flow rate switching valve, wherein the air discharge flow rate is in accordance with the substrate The relative positions of G are switched individually and automatically. In the figure, the configuration of the discharge control portion 122 according to an embodiment is shown. The control unit 122 has a valve chamber 124 formed inside the stage 76 and having a spherical body shape, and a spherical valve body 126 movable in the valve chamber 124. At the top and bottom of the valve chamber 124, opposite outlets (10) ^ inlets 124b are formed in the wrong direction. The outlet 124a is connected to =88 corresponding to the nozzle control unit 122. The person π(10) is connected to the compressed air supply path at the lower portion of the stage 76. Fig. 11 shows an example of the arrangement of the compressed air supply path 128 in the stage 76. Compressed air source such as a compressor (not inside the external piping 13〇, and introduced into the stage 76 π 132. The compressed air is introduced into the Qiu J inlet b _ shrink air, from which it is distributed to the load. Most of the compressed air supply in the stage 76 is in the supply line 128. The outlet 12 of the valve chamber i24 is formed as a valve seat, and the groove portion of the valve seat is in the circumferential direction to pre-tighten the valve seat. When the base outlet 124a is blocked, the compressed air may pass through the valve chamber i24 through 18 1272662 and exit to the nozzle outlet 88. The valve body 126 has a smaller diameter than the valve chamber 124, and a resin ball. The vertical upward force pu of the air pressure on the side of the upper Fengqiu port 124b below the spherical surface, and the ball acts as a corresponding downward force of the air pressure on the side of the outlet 124a (the reaction force 阀 valve body 126 is forever Vertically downward corresponds to the weight of the mass and the vertical (direction: the position of the body difference (height illusion. It is beneficial in the direction of (4) yiwei, as shown in Fig. 10, corresponding to the presence above each of the ejector outlets 88 In the discharge control unit 122 directly below the discharge σ 88 , 126 ^ - As described above, a plurality of the ejection ports 88 formed on the top surface of the stage 76 are supplied to the forest-like force _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The ground floating in the required height diagram 12 shows that the photoresist coating unit of this embodiment (the control 19 1272662 ΐΐ t iff 36 in (7) (10) is composed of a microcomputer, and the two i-stage substrate in the control unit floats. Portion 134, photoresist liquid supply unit 93, spray arm lift lift lift unit 85, (4) top lift lift unit 9 first and 115B J 3 -〇A, 1〇〇B, first and second liner adsorption Control unit 115A,

1〇9A '109B (CTt!〇' 中中中图图1二~图23' illustrates the unit rdrTl in the photoresist coating unit ring of this embodiment. Fig. 13 shows one of the coating processing operations. A timing diagram of the position or state of each part within the I). Fig. 14 is a perspective view showing the position or state of the main movable portion in the plan view. Fig. 14 is a perspective view showing the state of Fig. 22. In the photo-resistance media, for example, the photo-resisting coating process is carried out in (4) stylized - (4) coating process. Figure 14 shows the time point t〇 corresponding to Figure 13, unprocessed : Set 54 (The picture is moved into the stage 76 and moved into the "M: after the ίί 詈 入 ^ ^ or ί the top lift pin % will just accept the substrate Gi level support two = = make _ fold back to the corresponding adsorption The pad is inspected _ position (the rear woman is actuated. The eleventh plate transporting portion 84B will just occupy/seat at the station 76, and the force will be sent back to the carry-out area M5. The slider 98B to the top of the substrate The Gi-1 unit U f corresponds to the removal of the vacuum suction force in the carry-out area M5. Take the second: the suction position Ϊ = the top lift pin % drops, and the substrate (10) to the transport as indicated by the arrow J is floated. The base correction presses the pressure from the four directions by $20 χ 272662 ^ '_ to align the substrate Gi to the position on the stage 76 (Fig. 15, Fig. 13; ^. The second substrate carrying portion 84B makes the slider 98B returns from the conveyance end position I, i kg to the conveyance stop position Pc corresponding to the application start position at a high speed %. The carry-out machine, that is, the a-arm 74 entrance/exit area My from the top lift pin % accepting base The board is moved out of the load (the time point of FIG. 15 and FIG. 13), and the application start position is set in the loading position in the area M1 and the position directly below the photoresist nozzle 78, that is, the photoresist liquid supply. Position ?5. Μα Ϊ Carrying area _ After the alignment of the substrate G1 is completed, in the first substrate carrying portion, the pad actuator 109A is immediately actuated to make the adsorption pad 1〇4A from the home position position) UP (up) to the forward position (combined position). Suction_pad 104A 22 2 is opened (〇N) vacuum, vacuum-adsorbing force contact non-contact bonding = the other side (left side) side of the substrate Gi The edge portion (Fig. 16, Fig. 13. After the adsorption pad 1〇4A is bonded to the left side edge portion of the substrate Gi, the pressing portion is retracted to a predetermined position. On the other hand, the second substrate carrying the padded two cows Stop position Ρ. Standby 'and start to supply vacuum to the suction below (® 16 / ® U 'moving _ top lift 92 back to the side edge of the stage ί so that the support part 1〇2A support the left side of the substrate 6起点 The starting position Pa is straightened in a relatively high speed-fixed speed (X direction), and is moved to the sergeant side of the stage 76. After the stop position & is temporarily stopped (the upper side of the flow-side conveyance stop position is stopped), in the middle of the operation, the extension is made: 3 is the free end, but the floating position of the stage substrate floating portion 134 is limited. 'The left side edge portion coupled to the first substrate conveying portion m is moved at almost the same height. 邛 As described above, the first substrate conveying portion 84 is slid by a stop position of 4, at the end of Namur (four)卩 _ 塾 21 1272662 Actuator 1G9B is actuated to make the absorbing pad interesting from the original position (retracted position to the forward position (combined position). The suction pad 1〇4B is bonded to the side edge portion of the other side C side of the substrate Gi without contact by vacuum suction force due to vacuum. The coating start end side (Hb) on the stage 76 is located at a different height position f C a Hb) taken as l〇〇//m, and the rising distance from the adsorption pad 1〇狃 (for example) The number-comparison can be (4), slightly to the extent of = coating on the loading platform 76

TiJf ^ 84A ' 84B Q = is the phase _ 々 位置 上 上 从 从 从 从 从 = = = = = = = = = = = = = = 另 另 另 另 另 另 另 另 另 另 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴The transporting sections 84A and 84B make the ^^ ϊ== transporting direction (χ direction) straight into the phase::] 3 (the time t5 in Fig. 13). On the other hand, the photoresist R is discharged from the photoresist nozzle 78 in the photoresist supply " Thereby, the photoresist liquid supply position Ps directly under the photoresist nozzle W is discharged toward the crucible direction in the χ direction of the substrate Gi _ face 勤 γ γ ray 3 in a certain flow rate (4) osaki r, from the substrate (10) The coating film RM of the tip end to the i-terminal g photoresist (time point t6 in Figs. 19 and 13). (5) Silly _ first in the end of the substrate Q (coating end line) directly below the photoresist nozzle, the liquid-repellent supply position Ps ^ 'on the scale processing portion 93 stops the photoresist nozzle 78 from discharging the photoresist R At the same time, the first part =, 84B causes the individual sliders 98a to pass at the conveyance end position = set (downstream side transport stop position) Pd simultaneously. On the other hand, in the coating operation, a new substrate which is carried by the conveying device 54 is delivered to the jacking pin 86 (at time t7 in Figs. 20 and 13). In the first substrate conveying portion 84A, the slider 98A - reaches the conveyance stop position 22 1272662

At the time of Pd, the pad adsorption control unit 115A stops supplying vacuum to the adsorption pad 1〇4A, and the pad actuator 1G9A causes the adsorption pad to just read the moving position (the binding end t (retracted position)' to make the adsorption observation. 104A is from the left side t of the substrate Gi, Γ, . , and the time point ts) of FIG. At this time, the pad adsorption control portion 115A supplies positive pressure (Wei air)' to accelerate separation from the substrate q. π 98 移 moves at a high speed 乂 5 in a direction opposite to the substrate conveyance direction, and the sub-f returns to the conveyance starting position Pa (at time t9 in Fig. 2 to Fig. 13). On the other hand, in the second substrate conveying portion 84B, the support portion 1〇2β is supported by the base portion, and the slider _ is moved from the downstream side substrate stop position to the conveyance terminal at a relatively high speed. The constant speed V4 is in the substrate transport direction (X square i from Ershan: 21, time point t9 in Fig. 13). At this time, the left edge portion of the substrate Gi is at the height of the side edge portion of the crane. Then, when the slider 9δΒ pad 104b1TH is set up & 槪塾 槪塾 槪塾 控制 控制 控制 槪塾 槪塾 停止 停止 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附;fe r dip position) retracted to the original position (retracted position), so that the end of the adsorption pad 104 Β iiLnii is separated. At this time, the pad adsorption control unit (10) replaces the adsorption to accelerate the separation from the substrate Gi. The original position below the top lift pin 92彳_ is raised to the W position (Fig. 22, Fig. 23, Fig. 13). %, iiH In this embodiment, the loading table 76 is separately disposed. The human area is moved out of the area M5, and the substrate is sequentially transferred to the areas, and the substrate loading operation, the photoresist liquid supply to the substrate G, and the iS secret are performed in the second or the second column. , the time required for the action (TlN), the time (Tg) required to move from the loading area (10) on the stage, and the coating process after the addition of the moving area 1 (/(10)). It is used as needed to greatly test the flow time of the flow. Moreover, the pressure of the gas ejected from the discharge port 88 placed on the top surface of the carrier 76 causes the 23 1272662 plate G to float in the air and be carried on the stage 76. At the same time as the floating substrate G, the photoresist is supplied and coated on the substrate G from the fixed long photoresist nozzle 78. Therefore, it is possible to efficiently increase the size of the substrate. The substrate 7 is transported on the stage 76, and the first and second substrate carrying portions 84A and 84B are disposed on both sides of the stage 76. The same side of the both sides of the support substrate Gi moves in the substrate conveyance direction. Here, the first substrate conveyance portion 84A is moved from the carry-in area to the position directly under the long photoresist nozzle. The position is up to -5 and the substrate is floated on the stage 76 until the application end position between the application position and the carry-out position in the carry-out area is supported. On the other hand, the second base plate The conveyance unit 84B supports and conveys the substrate floating on the stage from the application start position set between the loading position and the application position, the application position, and the removal position. The first and second substrate conveyance units 84A and 84B simultaneously support and transport the substrate (the section of the ^ is not the entire conveyance section from the loading position to the carry-out position, but the intermediate section from the application start position to the application end position. First substrate conveyance unit 84A When the substrate Gi is transported to the application end position, the transfer operation of the substrate & the assembly is completed, and immediately returned to the loading position and the subsequent transfer of the new substrate 〇丨 +1 is started. Transport unit 84B The substrate Gi is separately transported from the application end position to the carry-out position, and then the application start position before the transfer position is folded back. At this position, the first substrate transport unit 84A is separately transported to transport the next substrate '. Between the first and second substrate transporting portions 84A and 84B, the substrate nano-operations performed by the two are limited to the minimum necessary (the coating interval where the substrate is required to be high), and the sections other than the interval are included. The transportation and movement operations in the (porting side section and the carrying-out section) are performed separately and individually, and the board transportation efficiency is greatly improved and the running time is greatly improved. Further, the laying & The guide rails 96A and 96B on the both sides need not be laid from one end of the stage 76 to the other end, and the first board conveyance unit 84A can only apply the guide rail 96A from the loading position to the J application end position, and the second substrate conveyance The part b can be laid only from the position of 24 1272662 to the carry-out position, and the cost of the conveyance system such as the guide rails 96A, 96B or the drive unit 黯, 丨 _ can be reduced. The substrate substrate of the second substrate transport unit 84B #j can be transported by the substrate transfer unit, and the substrate can be transported from the substrate transfer unit. The above is a description of the preferred embodiment of the present invention. The present invention is not limited to the above-described embodiments, and various changes can be made within the scope of the technical idea. For example, 102A and 102B of the substrate transporting portions 84A and 84B in the above-described embodiment have vacuum suction type #见垫1〇4A, 1〇4B, and iron may be used.

It is a gasket or the like that mechanically (for example, sandwiches) the side edge portion of the support substrate G. Further, the spacers 104A and 1G4B are bonded to the side edges of the substrate 自由 by suction and suction. The intestines, the linings, the linings of the linings, the linings, the linings, and the linings are also available in various ways and configurations. In the above-mentioned implementation, the photoresist nozzle is of the type, but the horizontal J movement can be performed as needed. In the above-described embodiment, the substrate by the first substrate conveyance unit 84A is conveyed at a position exactly corresponding to the application start position (PJ is temporarily stopped, and the substrates by the first and second substrate conveyance portions 84A and 84B are caused. The conveyance is temporarily stopped in response to the application end position (Pd). As a modification, the position (PJ and the second substrate conveyance unit 84B) may be coupled to the position corresponding to the application start position without performing the temporary stop. The substrate g that is moving is separated from the substrate g that is moving at the position (Pd) corresponding to the coating end position, and the substrate-transporting portion 84A is separated from the substrate g that is moving. As another modification, it is also possible to correspond to the coating start position. The position where the position (pc) is shifted, the temporary stop of the substrate transport by the first substrate transport unit 84A, or the transport of the substrate by the second substrate transport unit 84B, or the position (Pd) corresponding to the coating end position The position of the first and second substrate transporting portions 84a and 8 is temporarily stopped by the substrate transport or the first substrate transporting portion 84a is terminated. The photoresist coating device in the coating and developing treatment system is manufactured. However, the present invention can be applied to the processing liquid to supply the processing liquid to the substrate to be processed. Therefore, 'as the treatment liquid in the present invention' Other than the thick ^, it may be, for example, an interlayer insulating material, a dielectric material, or other base material for a flat panel display, a CD substrate, a substrate, a photomask, a printed substrate, or the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a configuration of a coating and developing treatment system to which the present invention can be applied, showing a flow of processing in a coating and developing treatment system of an embodiment, and subtraction ==== in the system The photoresist coating unit is shown in an oblique view of the entire structure of the photoresist coating unit of t. Fig. 5 is a schematic view of the overall structure of the photoresist coating unit in the non-continuous (four) In the photoresist coating unit of the state in which the structure of the board|substrate conveyance part of the board|substrate conveyance part of the pattern of the board|substrate conveyance unit is a board|substrate conveyance part of the board|substrate conveyance part of The support of the ministry In the light-resistance (4) unit of the configuration, the structure of the control unit is as shown in Fig. π of the flow path of the object portion in the optical fiber unit of the solid fiber. The structure of the control system in the photoresist coating unit of the embodiment is shown. The time of the block diagram is used to explain the implementation of the coating process in the light-time cloth unit in the embodiment of the coating process operation step in the photoresist coating sheet s of the embodiment. In the step of the coating process in the photoresist finishing unit of the embodiment of the coating process, the photoresist coating of the embodiment of the coating process of the filament coating unit of the step 11 of the step of the coating process is performed. At the stage of the coating treatment operation in the photoresist coating unit of the embodiment of the embodiment, the stage of the coating processing operation in the photoresist coating unit of the shape of '%' is performed. In the stage of the coating process operation of the photoresist coating material of the embodiment in the step of the coating process in the form of the photoresist coating unit, the coating process in the photoresist coating unit of the embodiment is shown. Main component No. Description 10 Card station (C/S) 12 Processing station (P/S) 14 Interface (I/F) 16 Stage 27 1272662 17, 19 Transport route 100A, WOB First and second transport drive unit 102A 102B first and second support portions 104A, 104B first and second suction pads 106A, 106B first and second pad support portions 108A, 108B first and second pad lifting portions 109A, 109B first And second pad actuators 110A, 110B pad body 112A, 112B suction port

114A, 114B vacuum tubes 115A, 115B first and second pad adsorption control units 116A, 116B lines 118A, 118B notch portions 120A, 120B pad support portion 122 ejection control portion 124 valve chamber 124a outlet 124b inlet 124c groove portion 126 valve Body 128 compressed air supply route 130 external piping 132 compressed air introduction unit 134 stage substrate floating unit 136 controller 20 transport mechanism 22 cleaning processing unit 23 substrate interposer 24 coating processing unit 28 1272662 25 chemical supply unit 26 development Processing unit 27 Space 28 Scrubbing and cleaning unit (SCR) 30 Ultraviolet irradiation/cooling unit (UV/COL) 32, 50, 55 Heating unit (HP) 34 Cooling unit (COL) 36, 51, 58 Transportation route 38, 54, 60 Handling unit 40 Photoresist coating unit (CT) 42 Decompression drying unit (VD) 46 Attachment/cooling unit (AD/COL) 48, 53 Heating/cooling unit (HP/COL) 52 Developing unit (DEV) 56 Extension Portion (or substrate delivery unit) 57 Buffer stage 59 Transport mechanism 70 Support table or support frame 72 Guide rail 74 Transfer arm 76 Stage 78 Photoresist nozzle 79 Nozzle body 80 Lower chamber 82 Stage 83 Exhaust ports 84A, 8 4B First and second substrate conveying portions 85 Loading and unloading lifting and lowering portions 86 Loading and unloading lifting pins 29 1272662 87 Aligning portions 88 Injection ports 90 Suction ports 91 Loading and unloading lifting pins lifting portion 92 Carrying out lifting pins 93 photoresist liquid supply unit 94 photoresist liquid supply pipe 95 nozzle lifting portion 96A, 96B first and second guides 98A, 98B first and second slider C cassette

Fa, FB, Fc arrow G, Gi, Gi+1, Gh substrate

Ha, Hb, Hc floating position ]\4| Loading area M2, M4 transfer area M3 Coating area M5 Carry-out area R Photoresist liquid RM Photoresist coating film S1 to S14 Step 30

Claims (1)

1272662 X. Patent application scope: 1. A substrate processing apparatus having: - a loading table having a plurality of ejection ports on its top surface, and the substrate to be processed is floated at a desired height by the pressure of the ejection body from the ejection opening; a loading portion for loading the substrate into the loading position; a loading portion for carrying the substrate out from the loading position on the stage; and the supply unit 'in the moving position The processing position of the loading position is such that the processing liquid is supplied to the top surface of the substrate above the stage; and the first substrate conveying unit is dirty from the loading position and the first position between the positions In the second embodiment, the substrate transporting portion is placed between the moving position and the coating position, and is placed on the loading table at the position of the (4) picking position, and is supported and transported. The substrate processing apparatus of the present invention, wherein: the application of the processing liquid on the armored red is performed at almost the same timing as the position of the substrate at the time of reaching the position of the 5th floor. a substrate processing apparatus of item 1, wherein - the substrate is disposed on the side of the stage, and extends in parallel to the wire board, the transport body, which is movable along the first track; the track shift i is the transport drive unit' for driving the first transport The main body is along the first guiding portion, and the 搬运ί-supporting portion is connected from the first conveying body toward the central portion of the loading table to support the first side edge portion of the substrate. 4. The substrate processing apparatus of the third item, wherein: the board: iif:, in the first position, the support portion of the base member is released from the first support portion, and the first one is immediately made The substrate is retracted from the first position 31 1272662 to the loading position. The substrate processing device of claim 3, wherein the first support and the portion thereof are coupled to the first Carrying on the body, adsorbing. Dimensions - recording part _, (4) _ _ pad for the adsorption side of the substrate, the fifth field, wherein the first pad adsorption base device, its _ a pad - In her part, to supply a positive pressure to the first pad, so that the middle of the 8th item 5 to 7 In any one of the substrate processing apparatuses, the compensating means 'moving the first pad support portion to move the first plate; and returning the first viewing device to the first portion to enable the first The substrate processing apparatus according to any one of claims 5 to 7, wherein the first support portion is coupled to the substrate at the first position of the substrate at the first position The substrate processing apparatus according to any one of claims 4 to 7, wherein: the first pad support portion scale is changed at a height position of the substrate In the case of the substrate processing according to any one of claims 1 to 7, the substrate is moved from the second position to the carry-out position side. At the time of the application, the application of the treatment liquid on the substrate is started. The substrate handling device of any one of claims 1 to 7 wherein the second substrate carrying portion has: a second guide rail disposed on the other side of the stage, Parallelly extending in the direction of movement of the slab-plate; ϋκ soil-a second transport body movable along the second rail; • a second transport drive portion for driving the second transport body along The second tomb is moved; and the second bracket is connected to the center portion of the stage from the second transport body, and the second side edge portion of the substrate is arbitrarily sucked. The substrate processing apparatus of claim 12, wherein the support ΐ ί ί ί ί ΐ ΐ ί ί ί ί ί ί ί ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ The position is folded back to the second position. Λ —, 托 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板Departments are fixed at 誃, ,,,. And the front end portion is audibly coupled to the mth and ... - the transport body, and the second: pad adsorption control portion is configured to control the second substrate to handle the substrate treatment of the wire The device, wherein the second liner-negative pressure supply portion is configured to couple the second liner to the substrate. The second lining 1272266 pad adsorption control unit has: a second positive pressure supply unit for the substrate processing device of the 14th member of the patent application scope A positive pressure is applied to the second liner to separate the first substrate. The substrate processing apparatus of claim 13, wherein the second pad adsorption control unit has: a second general actuator that moves the second pad support portion to enable the first Two junctions to the substrate; and the second pad support portion _ to separate the second liner from the substrate. The substrate processing apparatus of claim 13, wherein: the pad adsorption control unit bonds the second spacer to the substrate in the second position, and the substrate is lining the substrate Separation. [19] The substrate processing apparatus of claim 13, wherein: the 支撑 ΐΐ 支撑 support portion of the portion corresponds to the height position of the substrate, and the paste first to seventh processing-axis plate processing device is changed at the front end thereof, the end thereof a pin for lifting the pin lifting portion on the loading position on the stage, so that the first top lifting pin is between the moving position above the original position of the carrier below the stage Move up and down. The substrate processing apparatus of any one of the items 1 to 7 of the patent scope, wherein the end support lock is used for "positioning on the stage, and a second rise in front of the pin" a pin lifting portion for performing a scale shifting between the second top lift and the forward position above the stage: and the substrate processing according to any one of claims 7 to 7 The processing liquid supply unit has a long-shaped nozzle having a small-diameter discharge port 23 extending in a transverse direction of the substrate conveyance path on the stage 34 1272662. ·· setting, ϊί $ bit, direction 'set moving position' coating start position main cloth, ', mouth bundle position, and carry-out position in a row, by spraying from a plurality of spray outlets provided on the top surface of the stage The height of the floating surface of the substrate to be processed is required; in the if table, the first portion of the plate from the moving position to the coating start position: the first portion of the plate; The cloth start position to the end of the coating, and the third interval up to the carry-out position is set to The substrate is transported in the substrate transport direction; and vice versa. The substrate is coated on the top surface of the substrate during the movement of the second section. The substrate processing method according to claim 23, wherein the first and second portions of the substrate are transported from the substrate. Look at the left and right-right side-by-side applications for the substrate processing method of the 23rd item of the special-profit range, in which: the silk plate inspection speed of the Haidi, the first, and the second section is independently set to 26i t application / The substrate processing method of item 23, wherein: the floating height of the substrate set in the "Hai, first, and second intervals is independently set. 27. The substrate processing method according to claim 23 of the patent application scope苴28. The substrate processing method according to claim 23, the substrate is smashed; the substrate processing method is not started, and the substrate processing method is as described in claim 23, wherein The coating end field is such that the substrate (4) is stopped, and the support for the portion of the substrate is terminated. 30. The substrate processing method according to claim 23, wherein at the coating end position, the support for the first portion of the substrate is terminated without stopping the movement of the substrate. The substrate processing method of claim 23, wherein the substrate moves the subsequent new substrate into the loading position while the second section is moving. 36