JP4763763B2 - Resist coating development system - Google Patents

Description

  The present invention relates to an in-line resist coating and developing processing system in which a large number of processing units are arranged in the order of a process flow.

  Conventionally, in a resist coating and developing processing system in FPD (flat panel display) manufacturing, in order to cope with an increase in the size of a substrate to be processed, a carrier such as a roller or a roller is laid in a horizontal flow path. Equipped with a flat-flow type processing unit that applies a predetermined liquid, gas, light, etc. to the processing surface of the substrate while horizontally transporting the substrate, and includes such a flat-flow type processing unit A system configuration or layout in which a large number of processing units are serially arranged in a process flow order along a substantially horizontal line has been standardized (for example, see Patent Document 1).

  As described in Patent Document 1, this type of layout has a horizontally long process station at the center of the system and a cassette station and an interface station at both ends in the longitudinal direction. In the cassette station, a cassette for storing a plurality of unprocessed or processed substrates is loaded between the stage in the station and the outside of the system, and the substrate is loaded between the cassette on the stage and the processing station. Out is done. In the interface station, the substrate is transferred between the adjacent exposure apparatus and the processing station.

The process station has two lines of process lines, a forward path and a return path, each having a cassette station as a start point and an end point, and an interface station as a turning point. Generally, in the forward process line, a cleaning processing system unit, a resist coating processing system unit, a drying / thermal processing system unit, etc. are arranged next to each other or in a row with a transport system unit in between. In the process line of the return path, a development processing unit, a drying / thermal processing system unit, an inspection system unit, and the like are arranged side by side or in a row with the transport system unit interposed therebetween.
JP 2007-200993 A

  As described above, an in-line resist coating and developing processing system in which a large number of processing units including a flat-flow processing unit are serially arranged in the order of process flow along a linear round-trip process line is provided on an FPD substrate. Along with the increase in size, the system longitudinal direction size (full length size) is steadily increasing, and this is becoming disadvantageous in terms of footprint in FPD manufacturing factories.

  Further, the processing speed of the exposure apparatus is increased, and each processing unit is required to shorten the tact time in the resist coating and developing processing system. Among them, when a vacuum drying process is sandwiched between the resist coating process and the pre-baking process, the vacuum drying process requires a relatively long time, so the tact time of the vacuum drying unit is most difficult to shorten. Has been.

  In particular, when a halftone exposure process is used for photolithography, the film thickness of the resist mask is about 1.5 to 2 times (about 2.0 to 3.0 μm) than usual (about 1.5 μm). In the resist coating process, the amount of solvent used per substrate increases, so that the time required for solvent evaporation is prolonged in the reduced-pressure drying unit, making it even more difficult to shorten the tact time.

  In addition, the number and density of processing units installed in the outbound process line is greater than that of the inbound process line, and the overall length of the outbound process line affects the longitudinal size of the system (full length size). The proportion of flat-flow prebaking units and cooling units arranged in series is large.

The present invention has been made in view of the above-described problems of the prior art, and is an in-line method in which a plurality of processing units are arranged in the order of process flow along a linearly extending round-trip process line. It is an object of the present invention to provide a resist coating / developing system that can efficiently shorten the cycle time of drying / thermal processing performed immediately after the resist coating processing, and can further reduce the overall size.

In order to achieve the above object, the resist coating and developing system of the present invention is an in-line type in which a plurality of processing units are connected in the order of the process flow to perform a series of processing including resist coating and developing on a substrate to be processed. An outward process line in which at least a cleaning processing unit, a resist coating processing unit, and a first drying / thermal processing unit are arranged in a first direction in the order of processes in the longitudinal direction of the system. A return process line in which at least the development processing unit and the second drying / thermal processing unit are arranged in a second direction opposite to the first direction in the process order in the longitudinal direction of the system, in forward process line, wherein the first drying / heat treatment unit includes a drying / thermal processor upstairs and Shitakai which a vertical stack of two stages, the Regis A substrate on which resist coating processing has been completed is received from the coating processing unit, and the received substrate is subjected to the same transport delay time to the upper floor drying / thermal processing unit and the lower floor drying / thermal processing unit. A sorting and loading unit that alternately sorts and loads the sheets one by one, and the upper and lower floor drying / thermal processing sections both reduce the resist coating film on the substrate to a certain level in a flat-flow manner. A vacuum drying unit for drying the substrate, a pre-baking unit for heating the resist coating film on the substrate to the first temperature by a flat-flow method, and a cooling unit for cooling the resist coating film on the substrate to the second temperature by a flat-flow method. Are arranged in a line in the first direction in this order, and the flat flow type vacuum drying unit, pre-bake unit and cooling unit are vertically cut to carry the flat flow of the substrate. And the sorting and loading unit includes a first height position for loading a substrate into the drying / thermal processing unit on the lower floor and the drying / thermal processing unit on the upper floor. A substrate transfer unit that can be moved up and down between the second height position for loading the substrate into the substrate, and a planar shape that supplies the drying gas controlled at a constant temperature and humidity into the room of the unit by downflow And a blower.

According to the above configuration, in the outbound process line, the drying / thermal processing unit on the upper floor and the drying / thermal processing unit on the lower floor are operated simultaneously or in parallel at the subsequent stage (downstream side) of the resist coating processing unit. And drying immediately after resist coating processing, with a configuration in which a sheet blower for drying is provided in a sorting and loading unit that alternately distributes substrates one by one to the drying / thermal processing sections on the upper floor and the lower floor. In addition, the tact time of the thermal treatment can be greatly shortened. In addition, since the sorting and loading unit carries the substrates received from the resist coating processing unit to the drying / thermal processing units on the upper floor and the lower floor with the same transport delay time, all substrates are dried under reduced pressure. It is possible to uniformly perform the pre-drying process by the planar blower before. In addition, since the layout is such that two drying / thermal processing units are stacked on the upper and lower floors, there is no increase in the size in the system width direction. The total system size can be shortened.

As a preferred aspect of the present invention, a section of a flat flow path is formed after the drying / thermal processing units on the upper floor and the lower floor, and from the upstream side when an abnormal situation occurs on the downstream side of the system. A configuration is also possible in which an elevating type storage unit that receives the flowing substrate and stores it in multiple stages is provided.

According to the resist coating and developing processing system of the present invention, in the in-line layout in which a plurality of processing units are arranged in the order of the process flow along a linearly extending round-trip process line by the configuration and operation as described above. Shortening the tact time of the drying / thermal treatment performed immediately after the resist coating process and further shortening the overall length can be realized efficiently.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[First Embodiment]

  FIG. 1 is a plan view showing the overall configuration of a resist coating and developing treatment system according to an embodiment of the present invention. 2 and 3 are an external perspective view and a longitudinal sectional view showing a configuration of a main part (particularly, a drying / thermal processing part) of the resist coating and developing processing system.

  The resist coating and developing processing system 10 of this embodiment is installed in a clean room. For example, a glass substrate is used as a processing substrate G, and cleaning, resist coating, pre-baking, developing, post-baking, etc. in a photolithography process in an LCD manufacturing process. A series of processes are performed. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  As shown in FIG. 1, in this resist coating and developing processing system 10, a horizontally long process station (P / S) 16 is arranged at the center, and cassette stations (C / S) are arranged at both ends in the longitudinal direction (X direction). ) 14 and an interface station (I / F) 18 are arranged.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and a plurality of cassettes C that can accommodate a plurality of cassettes C by stacking substrates G in multiple stages, for example, 3 in a horizontal direction (Y direction). A cassette stage 20 that can be placed side by side and a transfer robot 22 that loads and removes the substrate G to and from the cassette C on the stage 20 are provided. The transfer robot 22 has a transfer arm 22a that can hold the substrate G in units of one unit, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate. G can be delivered.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or the process on a pair of parallel and opposite lines A and B extending in the horizontal system longitudinal direction (X direction).

  On the outward process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, the cleaning process unit 26, coating process unit 28, The thermal processing units 30 are arranged in a line in this order.

  More specifically, in the forward process line A, the cleaning process unit 26 and the coating process unit 28 are vertically cut from the carry-in unit (IN-PASS) 24 to distribute the carry-in unit (TW) 46 of the drying / thermal processing unit 30. A flat flow path 34 extending in the longitudinal direction of the system (X direction) is laid. The carry-in unit (IN-PASS) 24 is configured to receive an unprocessed substrate G from the transfer robot 22 of the cassette station (C / S) 14 and flow it into the transfer path 34 at a predetermined tact.

  The cleaning process unit 26 includes an excimer UV irradiation unit (E-UV) 36 and a scrubber cleaning unit (SCR) 38 in order from the upstream side along the flat flow path 34.

  In the coating process section 28, an adhesion unit (AD) 40, a cooling unit (COL) 42, and a resist coating unit (CT) 44 are arranged in this order from the upstream side along the flat flow path 34.

  The flat flow path 34 may be composed of, for example, a roller transport path in the cleaning process section 26, and may be composed of a floating transport path and a roller transport path in the coating process section 28.

  The drying / thermal processing unit 30 is composed of a drying / thermal processing unit 30 (1) on the first floor and a drying / thermal processing unit 30 (2) on the second floor, which are stacked in two stages. A sorting and loading unit (TW) 46 is provided. Next to the downstream side of the drying / thermal processing unit 30, the first and second floor unloading units (OUT−) connected to the drying / thermal processing units 30 (1) and 30 (2) on the first and second floors, respectively. PASS1) 32 (1) and (OUT-PASS2) 32 (2) are stacked in two stages.

  When the substrate G that has been subjected to the resist coating process in the coating process unit 28 is carried into the drying / thermal processing unit 30, the sorting / carrying-in unit (TW) 46 performs the drying / thermal processing unit 30 (1) on the first floor. Alternatively, it can be distributed to one of the drying / thermal processing units 30 (2) on the second floor. Usually, the substrates G are alternately distributed one by one to the drying / thermal processing unit 30 (1) on the first floor and the drying / thermal processing unit 30 (2) on the second floor.

  Here, the configuration of the drying / thermal processing unit 30 will be described in detail with reference to FIGS. 2 and 3.

  As shown in FIG. 2, the drying / thermal processing unit 30 (1) on the first floor includes a vacuum drying unit (VD1) 48 (1), which is configured as a flat-flow processing unit, and a pre-baking unit (PRE). -BAKE1) 50 (1) and cooling unit (COL1) 52 (1) are arranged in a line in this order in the system longitudinal direction (X direction).

  Similarly, the drying / thermal processing section 30 (2) on the second floor is also equipped with a vacuum drying unit (VD2) 48 (2) and a pre-bake unit (PRE-BAKE2) 50 that are all configured as a flat-flow processing unit. (2) and a cooling unit (COL2) 52 (2) are arranged in a line in this order in the longitudinal direction of the system (X direction).

  As shown in FIG. 3, the drying / thermal treatment unit 30 (1) on the first floor includes a vacuum drying unit (VD1) 48 (1), a pre-bake unit (PRE-BAKE1) 50 (1), and a cooling unit (COL1). ) A stationary flat flow path 54 (1) made up of, for example, a roller conveyance path extending through the 52 (1) to the carry-out unit (OUT-PASS1) 32 (1) on the first floor is laid.

  The reduced-pressure drying unit (VD1) 48 (1) has an integrated decompressable chamber 56 (1) having a flat rectangular parallelepiped shape. A pair of opposite side walls of the chamber 56 (1) in the substrate transport direction (X direction) are provided with a substrate carry-in port 58 (1) and a substrate carry-out port 60 (1) each having a shutter or a door valve. ing. In the chamber 56 (1), there is provided an internal roller conveyance path that constitutes a section of the flat flow conveyance path 54 (1).

  In this reduced pressure drying unit (VD1) 48 (1), a height position (position on the flat flow conveyance path 54 (1)) for loading or unloading the substrate G in the chamber 56 (1), and reduced pressure drying. A lift pin mechanism (not shown) is provided for raising and lowering the height position for processing (position floating upward from the flat flow conveyance path 54 (1)).

  One or more exhaust ports 62 (1) are provided in the bottom wall of the chamber 56 (1). These exhaust ports 62 (1) are connected to the inlet side of the vacuum pump 66 (1) through the exhaust pipe 64 (1). An on-off valve 68 (1) is provided in the middle of the exhaust pipe 64 (1). A purge gas supply unit (not shown) for supplying a purge gas such as air or nitrogen into the chamber when the chamber 56 (1) is returned from the reduced pressure state to the atmospheric pressure state is also connected to the chamber 56 (1) via the gas supply pipe. )It is connected to the.

  In the pre-baking unit (PRE-BAKE 1) 50 (1), a number of pre-baking heating elements, for example, sheathed heaters 70 (1), are arranged at regular intervals along the flat flow conveying path 54 (1). Yes. Each sheathed heater 70 (1) is connected to a heater power source 74 (1) via a cable 72 (1).

  In the cooling unit (COL1) 52 (1), a plurality of cold air nozzles 76 (1) are arranged at regular intervals along the flat flow conveying path 54 (1) for blowing out the cold air adjusted to a constant temperature. Has been. Each cold air nozzle 76 (1) is connected to the cold air supply unit 80 (1) via a pipe 78 (1).

  The drying / thermal processing unit 30 (2) on the second floor has the same or similar configuration as the drying / thermal processing unit 30 (1) on the first floor. That is, the drying / thermal treatment section 30 (2) on the second floor includes a vacuum drying unit (VD2) 48 (2), a pre-bake unit (PRE-BAKE2) 50 (2), and a cooling unit (COL2) 52 (2). Is installed, for example, a stationary flat flow path 54 (2) consisting of a roller conveyance path extending to the carry-out unit (OUT-PASS2) 32 (2) on the second floor.

  Here, the reduced pressure drying unit (VD2) 48 (2) is located directly above the first floor reduced pressure drying unit (VD1) 48 (1), and has the same or similar configuration (56 (2) to 68). (2)). The pre-bake unit (PRE-BAKE2) 50 (2) is located directly above the first-floor pre-bake unit (PRE-BAKE2) 50 (1), and has the same or similar configuration (70 (2) to 74 (74). 2)). The cooling unit (COL2) 52 (2) is located directly above the above-described first floor cooling unit (COL1) 52 (1) and has the same or similar configuration (76 (2) to 80 (2)). Have.

  In the sorting and loading unit (TW) 46, an elevating type substrate transport unit 84 including a conveyor 82 formed of, for example, a roller transport path is provided. A conveyor (roller transport path) 82 of the substrate transport section 84 is attached to a roller support section 86 that can be moved up and down. For example, the first floor flat flow transport path 54 is driven by a lift drive section 88 that is an air cylinder. It can be moved up and down between a first height position connectable to (1) and a second height position connectable to the flat flow conveying path 54 (2) on the second floor.

  The ceiling of the sorting and loading unit (TW) 46 has a planar shape such as a fan filter unit (FFU) that supplies a drying gas (air, nitrogen gas, etc.) controlled at a constant temperature and humidity into the room by downflow. A blower 90 can also be attached.

  The substrate G distributed from the sorting carry-in unit (TW) 46 to the drying / thermal processing section 30 (1) on the first floor moves on the flat flow transport path 54 (1) on the first floor, and the reduced-pressure drying unit. (VD1) 48 (1), pre-baking unit (PRE-BAKE1) 50 (1) and cooling unit (COL1) 52 (1) are sequentially subjected to a reduced pressure drying process, a pre-baking process and a cooling process, -PASS1) 32 (1) is passed to the interface station (I / F) 18.

  In addition, the substrate G distributed from the sorting and loading unit (TW) 46 to the drying / thermal processing unit 30 (1) on the second floor is reduced in pressure while moving on the flat flow conveyance path 54 (2) on the second floor. The drying unit (VD2) 48 (2), the pre-baking unit (PRE-BAKE2) 50 (2) and the cooling unit (COL2) 52 (2) are successively subjected to reduced-pressure drying processing, pre-baking processing and cooling processing, and the end point unloading unit (OUT-PASS2) 32 (2) is passed to the interface station (I / F) 18.

  Referring back to FIG. 1, the developing unit 92 configured as a flat-flow type processing unit is provided in the process line B on the return path from the interface station (I / F) 18 side to the cassette station (C / S) 14 side. , A post-bake unit (POST-BAKE) 94, a cooling unit (COL) 96, and an inspection unit (AP) 98 are arranged in a line along the flat flow path 100 in this order. Here, the post-bake unit (POST-BAKE) 94 and the cooling unit (COL) 96 constitute a drying / thermal processing section.

  The flat flow transport path 100 is composed of, for example, a roller transport path, and starts from a carry-in unit (not shown) provided below the peripheral device (TITLER / EE) 102 of the interface station (I / F) 18. It terminates at a carry-out unit (OUT-PASS) 104 provided at the rear stage of the unit (AP) 98.

  The interface station (I / F) 18 is a flat flow transfer path 54 (1), 54 (2) of the forward process line A, a flat flow transfer path 100 of the return process line B, and the adjacent exposure apparatus 12 and the substrate. A transfer robot 106 that can operate on three axes Y, Z, and θ for exchanging G is provided, and a peripheral device 102 is disposed around the transfer robot 106. The peripheral device 102 includes, for example, a titler (TITLER) and a peripheral exposure device (EE).

  Here, the processing procedure of all the processes for one substrate G in the resist coating and developing processing system will be described. First, in the cassette station (C / S) 14, the transfer robot 22 takes out one substrate G from any one of the cassettes C on the stage 20, and takes out the taken substrate G in the process station (P / S) 16. Carry in to the carry-in unit (IN-PASS) 24 on the process line A side. The substrate G is flown flat from the carry-in unit (IN-PASS) 24 and transferred or loaded onto the transfer path 34.

  The substrate G put into the flat flow path 34 is first subjected to an ultraviolet cleaning process and a scrubbing cleaning process in the cleaning process section 26 by an excimer UV irradiation unit (E-UV) 36 and a scrubber cleaning unit (SCR) 38 in sequence. The The scrubber cleaning unit (SCR) 38 removes particulate dirt from the substrate surface by performing brushing cleaning and blow cleaning on the substrate G that moves horizontally on the flat flow path 34, and then rinses. Finally, the substrate G is dried using an air knife or the like. When a series of cleaning processes in the scrubber cleaning unit (SCR) 38 is finished, the substrate G flows as it is, goes down the transport path 34 and enters the coating process section 28.

  In the coating process unit 28, the substrate G is first subjected to an adhesion process using vapor HMDS by an adhesion unit (AD) 40 as a pre-process for resist coating, and the surface to be processed is hydrophobized. After the completion of this adhesion process, the substrate G is cooled to a predetermined substrate temperature (for example, 23 ° C.) by a cooling unit (COL) 42. Thereafter, the substrate G flows flat and descends along the conveyance path 34 and is carried into a resist coating unit (CT) 44.

  The resist coating unit (CT) 44 uses a flat-flow spinless method in which a resist solution is supplied onto a substrate from a long slit nozzle (not shown) while the substrate G is floated and conveyed on a floating stage (not shown). A resist solution is applied to the substrate surface at a constant film pressure. Upon exiting the levitation stage, the substrate G enters the sorting and loading unit (TW) 46 of the drying / thermal processing unit 30 through the flat flow and the conveyance path 34.

  The resist coating unit (CT) 44 includes sorter units (not shown) before and after the levitation stage, that is, on the carry-in side and the carry-out side. The sorter unit on the carry-in side includes a roller conveyance path that constitutes a section of the flat flow conveyance path 34, and a plurality of suction pads that can be vacuum-sucked / removed at the edge of the back surface of the substrate with respect to the substrate on the roller conveyance path. And a substrate feed mechanism for moving these suction pads in both directions parallel to the transport direction. When the substrate that has been cooled by the upstream cooling unit (COL) 42 is flattened and received on the roller conveyance path, the suction pad rises and is attracted to the rear edge of the substrate, and the substrate is sucked and held. A substrate feeding mechanism moves the substrate to the floating stage of the resist coating unit (CT) 44 through the pad. Then, after the substrate is carried into the levitation stage, the suction pad is separated from the substrate, and then the substrate feed mechanism and the suction pad are returned to the original positions. The sorter unit on the carry-out side has the same configuration as the sorter unit on the carry-in side, except that the order and direction of operation are reversed.

  In the drying / thermal processing section 30, as shown in FIG. 3, the substrate transport section 84 of the sorting and loading unit (TW) 46 performs the flat flow of the substrate G that has flown down the transport path 34 and conveys it as a conveyor ( (Rolling path) 82. And when the board | substrate G transfers to the conveyor (roller conveyance path) 82, the board | substrate G will once be stopped there.

  When the substrate G is distributed to the drying / thermal processing unit 30 (1) on the first floor, after a predetermined time T1, the conveyor (roller transport path) 82 of the substrate transport unit 84 and the vacuum drying unit 48 (1 ) Is simultaneously driven to carry the substrate G into the chamber 56 (1) of the vacuum drying unit 48 (1).

  When the substrate G is distributed to the drying / thermal processing unit 30 (2) on the second floor, the substrate transport unit 84 is moved up from the first floor to the second floor over a predetermined time T2, and then the substrate transport unit 84. The conveyor (roller transporting path) 82 and the inner roller transporting path of the vacuum drying unit 48 (2) are simultaneously driven to carry the substrate G into the chamber 56 (2) of the vacuum drying unit 48 (2).

  Here, it is desirable to make the waiting time T1 and the ascending movement time T2 equal. As a result, the substrate G that has been subjected to the resist coating process in the resist coating unit (CT) 44 is subjected to the decompression drying process in the next process, so that the first floor drying / thermal process is performed via the sorting and loading unit (TW) 46. The transport delay time when distributed to the section 30 (1) is equal to the transport delay time when allocated to the drying / thermal processing section 30 (2) on the second floor via the distribution carry-in unit (TW) 46. can do. In particular, when the planar blower 90 is operated to dry the resist coating film on the substrate G in the sorting / carrying-in unit (TW) 46 before drying under reduced pressure, this delay condition (T1 = T2) It is important to meet.

  When the sorting and loading unit TW46 distributes the substrate G to the drying / thermal processing unit 30 (1) on the first floor, immediately after the substrate G is loaded into the chamber 56 (1) of the vacuum drying unit 48 (1). In addition, the substrate carry-in port 58 (1) is closed and the chamber 56 (1) is hermetically sealed. Then, the vacuum pump 66 (1) is operated to start evacuation, and the inside of the chamber 56 (1) is decompressed to perform a drying process. In this vacuum drying process, an organic solvent (for example, thinner) evaporates from the resist liquid film on the substrate G in a chamber under reduced pressure, and the organic solvent vapor is exhausted from the exhaust port 62 (1) of the chamber together with other gases. It is sent to the vacuum pump 66 (1) side through the pipe 64 (1). When the decompression drying process is completed after a certain period of time, the substrate carry-out port 60 (1) is opened, the roller conveyance path 54 (1) is driven to carry the substrate G out of the chamber 56 (1), and at the same time downstream Carry into the adjacent pre-bake unit 50 (1).

  In the pre-baking unit 50 (1), the substrate G is heated to a certain temperature (for example, 160 ° C.) by the sheathed heater 122 while being moved on the flat flow transport path 54 (1) by roller transport, and is subjected to a pre-baking process. By this pre-baking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced.

  When the substrate G exits the pre-bake unit 50 (1), it enters the cooling unit 52 (1) in the adjacent chamber, where it flows flatly and moves on the conveyance path 54 (1) by roller conveyance while the cold air nozzle 76 (1). When the cooling unit 52 (1) exits the cooling unit 52 (1), it reaches a predetermined substrate temperature (for example, 23 ° C.).

  When the substrate G passes through the cooling unit 52 (1) and arrives at the carry-out unit (OUT-PASS) 32 (1), the roller conveyance on the flat flow path 54 (1) is stopped. Immediately after that, the transfer robot 106 on the interface station 18 side receives the substrate G and carries it out from the carry-out unit (OUT-PASS) 32 (1).

  When the sorting and loading unit (TW) 46 distributes the substrate G to the drying / thermal processing unit 30 (2) on the second floor, the same drying and thermal processing as described above is performed by each processing unit on the second floor. That is, the vacuum drying unit 48 (2) on the second floor performs the same vacuum drying processing as the vacuum drying unit 48 (1) on the first floor on the substrate G carried from the sorting carry-in unit (TW) 46. Further, the pre-baking unit 50 (2) on the second floor performs the same pre-baking process as the pre-baking unit 50 (1) on the first floor with respect to the substrate G moving by roller transport on the flat flow transport path 54 (2) on the second floor. Apply. The cooling unit 52 (2) on the second floor performs the same cooling process as the cooling unit 52 (1) on the first floor on the substrate G passing by the roller transport on the flat flow path 54 (2). When the substrate G arrives at the carry-out unit (OUT-PASS) 32 (2), immediately after that, the transfer robot 106 on the interface station 18 side picks up the substrate G.

  In the interface station (I / F) 18, the substrate G is first carried into the peripheral exposure device (EE) of the peripheral device 102, where it receives exposure for removing the resist adhering to the peripheral portion of the substrate G during development. After that, it is sent to the adjacent exposure apparatus 12.

  In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18, it is first carried into a titler (TITLER) of the peripheral apparatus 102, where it is transferred to a predetermined portion on the substrate. Is recorded. Thereafter, the substrate G is carried into a carry-in unit (not shown) below the peripheral device 102 by the transfer robot 106.

  In this way, the substrate G is moved toward the cassette station (C / S) 14 by the flat flow transfer on the return flat flow transfer path 100 which is laid on the return process line B.

  In the first development unit (DEV) 92, the substrate G is subjected to a series of development processes of development, rinsing and drying while being transported in a flat flow.

  The substrate G that has undergone a series of development processes in the development unit (DEV) 92 passes through the drying / thermal processing units (94, 96) and the inspection unit (AP) 98 in sequence while descending the flat flow conveyance path 100 in the return path. To do.

  In the drying / thermal processing section (94, 96), the substrate G is first subjected to post-baking as a heat treatment after development processing in a post-bake unit (POST-BAKE) 94. By this post-baking, the developer and the cleaning solution remaining in the resist film on the substrate G are removed by evaporation, and the adhesion of the resist pattern to the substrate G is enhanced. Next, the substrate G is cooled to a predetermined temperature (for example, 23 ° C.) by a cooling unit (COL) 96. In the inspection unit (AP) 98, non-contact line width inspection, film quality / film thickness inspection, and the like are performed on the resist pattern on the substrate G.

  The carry-out unit (OUT-PASS) 104 finishes the processing of all the steps, passes the return path and flows the substrate G arrived at the end of the transfer path 100 to the transfer robot 22 of the cassette station (C / S) 14. On the cassette station (C / S) 14 side, the transfer robot 22 stores the processed substrate G received from the carry-out unit (OUT-PASS) 104 in any one (usually the original) cassette C.

  As described above, in the resist coating and developing processing system 10, the drying / thermal processing unit 30 provided in the subsequent stage of the coating process unit 28 in the outward process line A has a two-story laminated structure, and the resist coating process has been completed. The substrate G is distributed to the drying / thermal processing units 30 (1), 30 (2) on the first and second floors, and the drying / thermal processing units 30 (1), 30 (2) on the first and second floors are A series of processes of drying under reduced pressure, pre-baking and cooling are performed independently by a flat flow method.

  Thus, typically, the substrate G that has been subjected to the resist coating process is alternately distributed one by one to the drying / thermal processing units 30 (1) and 30 (2) on the first and second floors. It is also possible to reduce the tact time of the entire thermal processing unit 30 by half.

  In particular, in this embodiment, the vacuum drying units 48 (1) and 48 (2) on the first floor and the second floor can be operated in parallel, so that the rate-determining factor of the tact time is remarkably reduced or eliminated. Thus, since there is a margin in the transport time on the flat flow transport paths 54 (1) and 54 (2), the flat flow speed is reduced and the flat flow transport paths 54 (1) and 54 (2) are shortened. In other words, the pre-baking units 50 (1) and 50 (2) and the cooling units 52 (2) and 50 (2) can be shortened. As a result, it is possible to reduce the overall system size (X-direction size). Of course, there is no increase in the system width size (Y direction size).

  In an ordinary FPD panel manufacturing factory, the area of the photolithography department where the resist coating and developing processing system is installed is sufficiently high for the ceiling height because the exposure apparatus connected in-line next to it is tall. There is room, and the degree of freedom of the device size in the height direction is large.

  As another application, either one of the drying / thermal processing unit 30 (1) on the first floor or the drying / thermal processing unit 30 (2) on the second floor is stopped, and only one of them is temporarily or continuously operated. (Single lung driving) is also possible.

  As another application, it is possible to set different recipes for drying and thermal processing in the drying / thermal processing units 30 (1) and 30 (2) on the first floor and the second floor. For products that require different treatments, continuous feed and continuous flat flow treatment are possible without setup change time.

In the drying / thermal processing section 30 in this embodiment, the pre-drying process is also performed in the sorting and loading unit (TW) 46 before being loaded into the reduced-pressure drying units 48 (1) and 48 (2). It is possible to shorten the total drying time after the resist coating process.
[Second Embodiment]

  FIG. 4 shows a layout configuration of the coating and developing treatment system 100 according to the second embodiment. In the drawing, parts having substantially the same configuration or function as those in the coating and developing treatment system 10 in the first embodiment described above are denoted by the same reference numerals, and description thereof is omitted. FIG. 5 shows a detailed layout or configuration of the main part in the coating and developing treatment system 100.

  In the system 100 of the second embodiment, the main part different from the system 10 of the first embodiment is that the drying / thermal processing unit 30 ( 1), 30 (2) and unloading units (OUT-PASS1) 32 (1), (OUT-PASS2) 32 (2) on each floor This is the point that an elevating type storage unit (ST1) 104 (1), (ST2) 104 (2) constituting one section is provided.

  In this embodiment, between the cooling units (COL1) 52 (1) and (COL2) 52 (2) on each floor and the storage units (ST1) 104 (1) and (BF2) 104 (2) on each floor. Further, buffer units (BF1) 102 (1) and (BF2) 102 (1) are provided for temporarily stopping the substrate or adjusting the speed on the flat flow transport paths 52 (1) and 54 (2). The flat flow transport paths 52 (1) and 54 (2) may be configured such that, for example, each unit is defined as one section and an independent roller transport operation is performed by an individual roller driving unit for each section.

  As shown in FIG. 5, the storage unit (ST1) 104 (1) on each floor, for example, the storage unit (ST1) 104 (1) on the first floor is a conveyor ( A roller conveyance path) 106 is attached to a frame 108 (1) capable of moving up and down in a plurality of stages. The elevating frame 108 (1) is coupled to an elevating drive unit (not shown) having, for example, an air cylinder or a motor as a drive source, and selects one of the plurality of stages of conveyors 106 to flow through it. 52 (1) can be arranged.

  The storage unit (ST2) 104 (2) on the second floor also has the same or similar configuration / function as the storage unit (ST1) 104 (1) on the first floor.

  Normally, that is, in the normal state, the substrate G that has exited the cooling units (COL1) 52 (1) and (COL2) 52 (2) on each floor is flushed and flushed on the transport paths 52 (1) and 52 (2). By carrying the buffer unit (BF1) 102 (1), (BF2) 102 (2) and the storage unit (ST1) 104 (1), (ST2) 104 (2) by conveyance, the unloading unit (OUT-PASS1) 32 ( 1) and (OUT-PASS2) 32 (2). In the carry-out units (OUT-PASS1) 32 (1) and (OUT-PASS2) 32 (2) on each floor, lift pins 110 (1 ), 110 (2). When the substrate G arrives, a lift pin lifting / lowering drive unit (not shown) is operated to lift the lift pins 110 (1) and 110 (2), and the substrate G is flown and transported 52 (1) and 52 (2). It is lifted horizontally and transferred to the transfer robot 106 (FIG. 1) on the interface station (IF) 18 side.

  However, on the downstream side of the process flow with respect to the drying / thermal processing unit 30, for example, any abnormality occurs in any one of the processing units on the exposure apparatus 12 or the return path process line B, and the interface station (IF) 18 side When the board G cannot be sent to the buffer unit, the buffer unit (BF1) 102 (1), (BF2) 102 (2) and the storage unit (ST1) 104 (1), (ST2) 104 (2) Demonstrate. That is, the substrate G coming out of the cooling units (COL1) 52 (1) and (COL2) 52 (2) on each floor is held on the conveyor 106 of the storage units (ST1) 104 (1) and (ST2) 104 (2). . The lift frame 108 (1) can be moved stepwise in the vertical direction to place the substrates G on the plurality of stages of conveyors 106, and the plurality of substrates G can be stacked and stored.

In the second embodiment, a buffer unit (BF 1) 102 (1), (BF 2) 102 (2) and a storage unit (ST 1) 104 (1), (ST 2) 104 are placed after the drying / thermal processing unit 30. The total length of the system is longer than that of the first embodiment by the addition of (2). However, the tact time can be made much shorter than that of the conventional system because the first and second floor decompression drying units 48 (1) and 48 (2) have sufficient margins as described above.
[Other Embodiments]

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and other embodiments or various modifications can be made within the scope of the technical idea.

  For example, although the substrate transport unit 84 provided in the sorting and loading unit (TW) 46 of the drying / thermal processing unit 30 is configured by the elevating type conveyor 86 in the above-described embodiment, three of the Z axis, the θ axis, and the X axis are used. It is also possible to substitute a transfer robot that can operate on an axis.

  Further, in the above-described embodiment, all the processing units arranged on the forward process line A and the return process line B are unified in a flat flow system, so that there is an advantage that the processing efficiency and the conveyance efficiency can be improved. However, a configuration including a non-flat flow processing unit is also possible. For example, as a resist coating unit (CT) 44 disposed on the outward process line A, instead of a floating type in which a resist nozzle is fixed and the substrate is floated and conveyed to perform resist coating processing, the substrate is fixed on a stage. It is also possible to use a method (stage fixed type) in which the resist nozzle is moved by scanning.

  Further, in the drying / thermal processing section 30, instead of the vacuum drying units 48 (1) and 48 (2), the resist coating film on the substrate is vacuum-dried under normal pressure while the substrate is flown flat and moved on the transport path. It is also possible to incorporate an atmospheric drying unit for drying (surface modification) equivalent to

  The substrate to be processed in the present invention is not limited to a glass substrate for LCD, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates and the like are also possible.

It is a top view which shows the layout structure of the resist application | coating development system in one Embodiment of this invention. It is a perspective view which shows the general | schematic structure of the principal part of the resist application | coating development processing system of FIG. 1, especially the drying / thermal processing part integrated in the outward process line. FIG. 2 is a longitudinal sectional view schematically showing a configuration of a main part of the resist coating and developing treatment system of FIG. 1, particularly a drying / thermal treatment part incorporated in an outward process line. It is a top view which shows the layout structure of the resist application | coating development system in 2nd Embodiment. It is a longitudinal cross-sectional view which shows typically the structure of the principal part of the resist application | coating development processing system of FIG.

Explanation of symbols

10 resist coating and developing system 14 cassette station (C / S)
16 Process station (P / S)
18 Interface station (I / F)
26 Cleaning Process Unit 28 Coating Process Unit 30 Drying / Thermal Processing Unit 30 (1) First Floor Drying / Thermal Processing Unit 30 (2) Second Floor Drying / Thermal Processing Unit 32 (1) First Floor Unloading Unit (OUT-PASS1)
32 (2) Unloading unit on the second floor (OUT-PASS2)
46 Sorting unit 48 (1) First floor vacuum drying unit 48 (2) Second floor vacuum drying unit
50 (1) 1st floor pre-bake unit (PRE-BAKE1)
50 (2) 2nd floor pre-bake unit (PRE-BAKE2)
52 (1) 1st floor cooling unit (COL1)
52 (2) Second floor cooling unit (COL2)
54 (1) 1st floor flat flow path 54 (2) 2nd floor flat flow path 92 Development unit (DEV)
94 Post-bake unit (POST-BAKE)
96 Cooling unit (COL)
104 (1) First floor storage unit (ST1)
104 (2) Second floor storage unit (ST2)

Claims (3)

An inline type resist coating and developing system for connecting a plurality of processing units in the order of the process flow and performing a series of processes including a resist coating process and a development process on a substrate to be processed.
An outward process line in which at least the cleaning processing unit, the resist coating processing unit, and the first drying / thermal processing unit are arranged in the first direction in the process order in the longitudinal direction of the system;
A return process line in which at least the development processing section and the second drying / thermal processing section are arranged in a second direction opposite to the first direction in the process order in the system longitudinal direction,
In the outbound process line, the first drying / thermal processing unit is configured to perform resist coating processing from the upper / lower floor drying / thermal processing units arranged in two layers, and the resist coating processing unit. The finished substrate is received, and the received substrates are alternately distributed to the upper floor drying / thermal processing unit and the lower floor drying / thermal processing unit one by one with the same transport delay time. A sorting and loading unit,
Each of the drying / thermal processing units on the upper floor and the lower floor has a vacuum drying unit for drying the resist coating film on the substrate to a certain level under a flat flow method, and a resist on the substrate by a flat flow method. A pre-bake unit that heats the coating film to the first temperature and a cooling unit that cools the resist coating film on the substrate to the second temperature in a flat-flow manner are arranged in a line in the first direction in this order. A flat flow conveyance path for carrying out a flat flow conveyance of the substrate by longitudinally cutting the flat flow vacuum drying unit, the pre-bake unit and the cooling unit,
The sorting and loading unit includes a first height position for loading a substrate into the drying / thermal processing unit on the lower floor and a second height for loading the substrate into the drying / thermal processing unit on the upper floor. A substrate transfer unit that can be moved up and down between the height position of and a planar blower that supplies a drying gas controlled at a constant temperature and humidity into the room of the unit by downflow,
Resist coating development system. The resist coating and developing processing system according to claim 1 , wherein the substrate transport unit includes a conveyor for carrying the substrate in a flat flow into the drying / thermal processing units on the upper floor and the lower floor. After the upper floor and lower floor drying / thermal processing sections, a section of the flat flow transport path is configured, and the substrate that has flowed from the upstream side when an abnormal situation occurs on the downstream side of the system is received. The resist coating / developing system according to claim 1 or 2 , further comprising an elevating type storage unit for storing in multiple stages.

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