KR20100036974A - Resist coating and developing processing system - Google Patents

Abstract

PURPOSE: A resist coating and developing processing system is provided to efficiently realize the shortening of tact time or total length size by arranging a plurality of treatment units in an order of a process flow. CONSTITUTION: An inline type resist coating and developing processing system(10) for performing a series of processing including resist coating and developing processes on an untreated substrate by connecting a plurality of processing units as a process flow, comprises a proceeding process line and a returning process line. The proceeding process line arranges at least a cleaning part(26), a resist coating part(28), and a first drying/heat treatment part(30) in a longitudinal direction of a system in a process order. The returning process line arranges at least a developing part(92) and a second drying/heat treatment part in a second direction opposite to the first direction.

Description

Resist coating development processing system {RESIST COATING AND DEVELOPING PROCESSING SYSTEM}

The present invention relates to an in-line resist coating development processing system in which a plurality of processing units are arranged in an order of process flow.

Conventionally, in the resist coating and developing system in FPD (flat panel display) manufacturing, in order to cope with the enlargement of the substrate to be processed, the substrate is horizontally conveyed on a flat flow conveyance path formed by placing a carrier such as a roller in the horizontal direction. While the processing unit of the flow flow is provided with a predetermined liquid, gas, light, etc. to the processing target surface of the substrate to perform the required processing, a plurality of processing units including such a flow-flow processing unit are included in the process flow. The system configuration or layout which arranges serially along the line of substantially horizontal direction in order is standardized (for example, refer patent document 1).

As described in Patent Document 1, this kind of layout arranges a horizontally long process station in the center of the system, and arranges cassette stations and interface stations at both ends thereof in the longitudinal direction. In the cassette station, the cassettes for carrying out a plurality of unprocessed or processed substrates are carried out between the stage in the station and the outside of the system, and at the same time, the substrates are carried out between the cassette on the stage and the processing station. In the interface station, the substrate is transferred between the adjacent exposure apparatus and the processing station.

The process station has two rows of process lines, a return path and a return path, with the cassette station as the starting point and the end point, and the interface station as the return point. In general, a unit of a cleaning process system, a unit of a resist coating process system, a unit of a drying / thermal processing system, etc. are adjacent to the process line of a royal path, or are arrange | positioned in a line with the unit of a conveyance system between them. In the return process line, units of a developing system, units of a drying / thermal processing system, units of an inspection system, and the like are adjacent to each other or are arranged in a line with a unit of a conveying system interposed therebetween.

[Patent Document 1] Japanese Patent Application Publication No. 2007-200993

As described above, an inline resist coating and developing system for arranging and arranging a plurality of processing units including a flat flow type processing unit in a sequence of process flows along a linear reciprocating process line is used to increase the size of an FPD substrate. Accompanied by the increase in system longitudinal size (full length size), this is a disadvantage in terms of foot print in FPD manufacturing plants.

In addition, the processing speed of the exposure apparatus has been increased, and even in the resist coating and developing processing system, each processing unit demands a shortening of the tact time. Among them, when sandwiching the vacuum drying step between the resist coating step and the prebaking step, the reduced pressure drying process requires a relatively long time, which makes it difficult to shorten the tact time of the vacuum drying unit.

In particular, when a halftone exposure process is used for photolithography, the film thickness of the resist mask is about 1.5 to 2 times (about 2.0 to 3.0 μm) that of the usual (about 1.5 μm), so that the substrate 1 in the resist coating process is that much. Since the amount of solvent used per sheet increases, the time required for evaporation of the solvent in the vacuum drying unit becomes long, and shortening the tact time becomes more difficult.

In addition, the number of installations and the compactness of the processing unit in the route process line are larger than the route process line, and the total length of the route process line determines the system longitudinal direction size (full length size), and among them, the rear end of the pressure reduction drying unit. The proportion of the prebaking unit and the cooling unit in series flowing in series is large.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and in the inline method in which a plurality of processing units are arranged in a sequence of process flows along a process line of a linearly extending reciprocating path, shortening the tact time and An object of the present invention is to provide a resist coating and developing processing system which efficiently realizes a reduction in the overall length size.

In order to achieve the above object, the resist coating development processing system of the present invention connects a plurality of processing units in the order of process flow to perform a series of treatments including a resist coating process and a developing process on a substrate to be processed. A resist coating developing processing system, wherein in a system longitudinal direction, at least a cleaning processing unit, a resist coating processing unit, and a first drying / thermal processing unit are arranged in a first order in a process order, and in a system longitudinal direction, At least a developing process unit and a second drying / thermal processing unit arranged in a second order opposite to the first direction in the order of the process, and having a return process line, wherein the first drying / thermal treatment process The upper layer and the lower layer of the drying / thermal treatment unit is laminated in two stages of additional top and bottom, The drying and thermal treatment of the substrate is performed independently and in a flat flow manner by the drying / thermal treatment of the upper and lower layers.

According to the above-described configuration, in the route processing line, the drying / thermal treatment part of the upper layer and the drying / thermal treatment part of the lower layer and the lower layer drying / thermal treatment part are operated simultaneously or in parallel at the rear end (downstream side) of the resist coating treatment part. Tact time can be shortened significantly. In addition, since the layout of two drying / thermal processing units are arranged in an upper layer and a lower layer, there is no increase in the size of the system width direction, and shortening of the flat flow conveying distance, i.e., the total length of the system, due to the shortening of the flow time in the system length direction. Is also planned.

According to one aspect of the invention, the first drying / thermal treatment unit receives the substrate from which the resist coating process is completed from the resist coating treatment unit, the received substrate to any one of the upper layer drying / thermal treatment unit or the lower layer drying / thermal treatment unit It is preferable to have a distribution carrying unit for dispensing and carrying in one. Typically, the distribution carry-in unit may carry in by distributing the board | substrate one by one with respect to the dry / thermal processing part of an upper layer, and the dry / thermal processing part of a lower layer.

According to another aspect, a substrate transfer capable of lifting and lowering in a distribution carrying unit between a first height position for carrying a substrate into a lower drying / thermal processing portion and a second height position for carrying a substrate into an upper drying / thermal processing portion The structure provided with a part is employ | adopted suitably. In this case, the board | substrate conveyance part may have the conveyor for carrying in a board | substrate to the stream by the drying / thermal processing part of an upper layer and a lower layer.

According to another aspect, both the upper layer and the lower layer drying / thermal treatment unit, a drying unit for drying the resist coating film on the substrate to a certain stage in a flat flow method, and a prebaking unit for heating the resist coating film on the substrate to a first temperature in a flat flow method; The arrangement which arrange | positions the cooling unit which cools the resist coating film on a board | substrate on a board | substrate to a 2nd temperature by the flow stream in this order in this order in an appropriate manner is employ | adopted suitably. In this case, in both the upper layer and the lower layer drying / thermal processing unit, a flat flow conveying path for terminating the flat flow drying unit, the prebaking unit, and the cooling unit to carry out the flat flow conveyance of the substrate is appropriately employed.

In the case where the drying unit of the flat flow system is a reduced pressure drying unit, since one tact time is relatively large, the effect of shortening the tact time and reducing the overall length size by the parallel operation of the present invention is large.

As one suitable form, a section of the flat flow conveyance path is formed at the rear end of the upper and lower layers of the drying / thermal treatment section, and when an abnormal situation occurs on the system downstream side, the substrate flowing from the upstream side is stored and stacked in multiple stages. It is also possible to install a lifting type storage unit for storing.

According to the resist coating and developing processing system of the present invention, in the inline layout in which a plurality of processing units are arranged in a sequence of process flows along a process line of a reciprocating line extending linearly by the above-described configuration and operation. Therefore, the tact time can be shortened or the overall length size shortened.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described with reference to an accompanying drawing.

[First Embodiment]

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the resist coating image development processing system in one Embodiment of this invention. FIG.2 and FIG.3 is an external perspective view and a longitudinal cross-sectional view which shows the structure of the principal part (especially drying / thermal processing part) of this resist coating developing process system.

The resist coating development processing system 10 of this embodiment is installed in a clean room, for example, using a glass substrate as a to-be-processed substrate G, and wash | cleaning in a photolithography process, resist coating, and prebaking in an LCD manufacturing process. , A series of processes such as development and post-baking are performed. An exposure process is performed in the external exposure apparatus 12 provided adjacent to this system.

As shown in Fig. 1, this resist coating and developing processing system 10 arranges a horizontally long process station (P / S) 16 at a central portion thereof, and the cassette station (at both ends thereof in the longitudinal direction (X direction)). C / S) 14 and interface station (I / F) 18 are arranged.

The cassette station (C / S) 14 is a cassette loading / exporting port of the system 10, and the substrate G is stacked in multiple stages so that a plurality of cassettes C which can be accommodated in plural sheets are arranged in one horizontal direction (Y direction). For example, the cassette stage 20 which can arrange and load up to three, and the transfer robot 22 which carries out the board | substrate G with respect to the cassette C on this stage 20 are provided. The transfer robot 22 has the transfer arm 22a which can hold the board | substrate G by one sheet | seat, can operate in four axes of X, Y, Z, and (theta), and is adjacent to the process station P / S It is possible to transfer the side (16) and the substrate (G).

The process station (P / S) 16 arranges each processing unit in the order of process flow or process in a pair of parallel and reverse lines A and B extending in the horizontal system longitudinal direction (X direction) and have.

The cleaning process part 26 and application | coating process which consist of a processing unit of a straight flow system to the process line A of the royal path from the cassette station (C / S) 14 side toward the interface station (I / F) 18 side. The part 28 and the drying / thermal processing part 30 are arrange | positioned in this order in a line.

More specifically, the distribution process unit of the drying / thermal processing unit 30 is terminated in the route process line A by terminating the cleaning process unit 26 and the application process unit 28 from the IN-PASS 24. The flat flow conveyance path 34 extended in the system longitudinal direction (X direction) is provided to (TW) 46. An import unit (IN-PASS) 24 receives the unprocessed substrate G from the transfer robot 22 of the cassette station (C / S) 14 and feeds it into the flat stream conveyance path 34 by a predetermined tact. It is configured to.

The cleaning process unit 26 arranges the excimer UV irradiation unit (E-UV) 36 and the scrubber cleaning unit (SCR) 38 in order from the upstream side along the flat stream conveyance path 34.

The application process unit 28 is an adhesion unit (AD) 40, a cooling unit (COL) 42, and a resist application unit (CT) 44 in order from the upstream side along the flat flow conveyance path 34. ) Is placed.

The flat flow conveyance path 34 may be comprised by the roller conveyance path in the washing | cleaning process part 26, for example, and may be comprised by the floating conveyance path, the roller conveyance path, etc. in the application | coating process part 28, for example.

The drying / thermal processing unit 30 is composed of one layer of drying / thermal processing unit [30 (1)] and two layers of drying / thermal processing unit [30 (2)], which are stacked and stacked in two stages up and down, and carry the distribution into the inlet. The unit (TW) 46 is provided. Next to the downstream side of the drying / thermal processing unit 30, the first- and second-layer carrying units OUT-PASS1 connected to the first- and second-layer drying / thermal processing units 30 (1) and 30 (2), respectively. ) [32 (1)] and (OUT-PASS2) [32 (2)] are stacked and arranged in two stages above and below.

When the substrate G on which the resist coating process is completed in the coating process unit 28 is carried into the drying / thermal processing unit 30, the drying / thermal processing unit 30 of one layer is carried out by the distribution loading unit (TW) 46. (1)] or two layers of drying / thermal processing sections 30 (2). Usually, the board | substrate G is divided so that it may be divided | segmented into one layer of drying / thermal processing part 30 (1) and two layers of drying / thermal processing part 30 (2) one by one.

2 and 3, the configuration of the drying / thermal processing unit 30 will be described in detail.

As shown in FIG. 2, the drying / thermal processing part 30 (1) of one layer is the pressure reduction drying unit VD1 [48 (1)] and prebaking unit PRE which are all comprised as a processing unit of a horizontal flow system. -BAKE1) [50 (1)] and cooling units COL1 [52 (1)] are arranged in a line in the system longitudinal direction (X direction) in this order.

Similarly, the vacuum drying unit VD2 [48 (2)] and the pre-baking unit PRE-BAKE2 [50 (2), both of which are constituted as processing units of the flow control method, are also constituted in the two-layer drying / thermal processing unit 30 (2). 2)] and cooling units (COL2) [52 (2)] are arranged in a line in the system longitudinal direction (X direction) in this order.

As shown in Fig. 3, the drying / thermal processing section 30 (1) of one layer includes a reduced pressure drying unit VD1 [48 (1)], a prebaking unit PRE-BAKE1 [50 (1)], and A fixed flat conveying path consisting of, for example, a roller conveying path extending from the cooling unit COL1 [52 (1)] to the first floor export unit OUT-PASS1 [32 (1)]. [54 (1)] is provided.

The reduced pressure drying unit VD1 48 (1) has an integral pressure sensitive chamber 56 (1) having a flat cuboid shape. A pair of sidewalls facing each other in the chamber 56 (1) in the substrate conveyance direction (X direction) is provided with an openable and closed substrate inlet 58 (1) provided with a shutter or a door valve and a substrate outlet 60 ( 1)] are formed respectively. In the chamber 56 (1), an internal roller conveying path constituting one section of the flat flow conveying path 54 (1) is provided.

The height position (position on the flat conveyance path 54 (1)) for carrying in or carrying out the board | substrate G in the chamber 56 (1) to this pressure reduction drying unit VD1 [48 (1)], A lift pin mechanism (not shown) is provided for moving up and down between height positions (positions floating upward from the flat flow path 54 (1)) for the vacuum drying treatment.

One or more exhaust ports 62 (1) are formed in the bottom wall of the chamber 56 (1). These exhaust ports 62 (1) are connected to the inlet side of the vacuum pump 66 (1) through the exhaust pipe 64 (1). An open / close valve 68 (1) is provided in the middle of the exhaust pipe 64 (1). In addition, a purge gas supply unit (not shown) for supplying a purge gas such as air or nitrogen to the room when the room of the chamber 56 (1) is returned from the reduced pressure state to the atmospheric pressure state is also provided through the gas supply pipe. 1)].

In the pre-baking unit PRE-BAKE1 [50 (1)], a heating element for prebaking, for example, a sheath heater 70 (1) along a flat flow conveyance path 54 (1), is fixed at regular intervals. There are a lot of places. Each sheath heater 70 (1) is connected to a heater power source 74 (1) via a cable 72 (1).

In the cooling unit COL1 52 (1), a plurality of cold wind nozzles 76 (1) for ejecting cold air regulated to a constant temperature are arranged along the flat flow conveyance path 54 (1) at regular intervals. It is. Each cold air nozzle 76 (1) is connected to the cold air supply part 80 (1) through a pipe 78 (1).

The two-layer drying / thermal treatment section 30 (2) also has the same or the same structure as the one-layer drying / thermal treatment section 30 (1) described above. That is, the two-layer drying / thermal processing section 30 (2) includes a vacuum drying unit VD2 48D, a prebaking unit PRE-BAKE2 502, and a cooling unit COL2 [2]. 52 (2)] and a flat plate conveying path 54 (2), for example, consisting of a roller conveying path, which extends to the second-stage transport unit OUT-PASS2 [32 (2)], is laid. have.

Here, the pressure reduction drying unit VD2 48 (2) is located directly above the pressure reduction drying unit VD1 48 (1) of the first layer described above, and has the same or the same configuration as that of 56 (2). ) To 68 (2)]. The pre-baking unit PRE-BAKE2 [50 (2)] is located directly above the pre-baking unit PRE-BAKE2 [50 (1)] on the first floor described above, and has the same or the same configuration as that of [70]. (2) to 74 (2)]. The cooling unit COL2 52 (2) is located directly above the cooling unit COL1 52 (1) on the first floor described above, and has the same or the same configuration as that of 76 (2) to 80 (2). )]

In the distribution carrying-in unit (TW) 46, the lifting-type board | substrate conveyance part 84 provided with the conveyor 82 which consists of roller conveyance paths, for example is provided. The conveyor (roller conveyance path) 82 of the board | substrate conveyance part 84 is provided in the roller support part 86 which can move up and down, for example, one floor by the elevating drive of the elevation drive part 88 which consists of an air cylinder. It can move up and down between the 1st height position which can be connected to the planar conveyance path 54 (1) of 2nd, and the 2nd height position which can be connected with the 2nd level flow path conveyance path 54 (2).

On the ceiling of the distribution loading unit (TW) 46, a planar blower (90) such as a fan filter unit (FFU) that supplies a drying gas (air, nitrogen gas, etc.) managed at a constant temperature and humidity to the room in a downflow. ) Can also be installed.

The substrate G distributed from the distribution carrying unit (TW) 46 to the first floor drying / thermal processing unit 30 (1) is dried under reduced pressure while moving on the first floor flat conveyance path 54 (1). Pressure reduction drying treatment, prebaking treatment, and cooling treatment are performed by the unit VD1 [48 (1)], the prebaking unit (PRE-BAKE1) [50 (1)], and the cooling unit (COL1) [52 (1)]. It receives in order, and is transmitted to the interface station (I / F) 18 from the export unit OUT-PASS1 32 (1) of an end point.

Further, the substrate G distributed from the distribution carrying unit (TW) 46 to the two-layer drying / thermal processing unit 30 (2) moves the two-layer flat flow conveyance path 54 (2), Decompression drying, prebaking and cooling by the vacuum drying unit (VD2) [48 (2)], prebaking unit (PRE-BAKE2) [50 (2)] and cooling unit (COL2) [52 (2)]. The processing is sequentially received, and is transmitted to the interface station (I / F) 18 from the export unit OUT-PASS2 32 (2) at the end point.

In Fig. 1, all of the process lines B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side are configured as a processing unit of the planar flow type. The unit 92, the post-baking unit (POST-BAKE) 94, the cooling unit (COL) 96 and the inspection unit (AP) 98 are arranged in a row in this order along the flat flow conveyance path 100. have. Here, the post-baking unit (POST-BAKE) 94 and the cooling unit (COL) 96 constitute a drying / thermal processing unit.

The flat flow conveyance path 100 consists of a roller conveyance path, for example, and is carried in the lower layer of the peripheral apparatus (TITLER / EE) 102 of the interface station (I / F) 18 (not shown). (Not shown), the terminal is terminated by an export unit (OUT-PASS) 103 provided at the rear end of the inspection unit (AP) 98.

The interface station (I / F) 18 is a flat flow conveyance path 54 (1), 54 (2) of the said return path process line A, the flat flow conveyance path 100 of the said return process line B, and the adjoining. It has a conveyance robot 106 which can operate in three axes of Y, Z, and (theta) for exchanging the exposure apparatus 12 and the board | substrate G to make, and the peripheral apparatus 102 around this conveyance robot 106. Is placed. The peripheral device 102 includes, for example, a titler TITLER and a peripheral exposure device EE.

Here, the processing procedure of the whole process with respect to one board | substrate G in this resist coating image development processing system is demonstrated. First, in the cassette station (C / S) 14, the transfer robot 22 takes out one board | substrate G from any cassette C on the stage 20, and removes the board | substrate ( G) is carried in to the loading unit (IN-PASS) 24 on the process line A side of the process station (P / S) 16. From the loading unit (IN-PASS) 24, the board | substrate G moves or loads on the planar conveyance path 34.

Substrate G injected into the flat stream conveyance path 34 is ultraviolet-cleaned by the excimer UV irradiation unit (E-UV) 36 and the scrubber cleaning unit (SCR) 38 in the washing | cleaning process part 26 initially. Treatment and scrubbing cleaning treatment are carried out sequentially. The scrubber cleaning unit (SCR) 38 removes particulate contamination from the surface of the substrate by performing brushing or blow cleaning on the substrate G that moves horizontally on the flat flow conveyance path 34. The rinse treatment is performed, and finally, the substrate G is dried using an air knife or the like. When a series of cleaning processes in the scrubber cleaning unit (SCR) 38 are complete | finished, the board | substrate G will descend | fall the flat stream conveyance path 34 as it is, and will enter into the application | coating process part 28. FIG.

In the application | coating process part 28, the board | substrate G is a pretreatment of resist application | coating, and the advised process which uses HMDS of a vapor state is first performed in the advice unit (AD) 40, and the to-be-processed surface becomes hydrophobic. do. After the completion of this advise processing, the substrate G is cooled to a predetermined substrate temperature (eg, 23 ° C.) in the cooling unit (COL) 42. Subsequently, the substrate G descends the flat flow conveyance path 34 and is carried into the resist coating unit (CT) 44.

The resist coating unit (CT) 44 is a spinless method of flat flow which supplies a resist liquid from a long slit nozzle (not shown) onto a substrate while conveying the substrate G onto a float stage (not shown). As a result, a resist liquid is applied to the surface of the substrate with a constant film thickness. Upon exiting the floating stage, the substrate G descends the flat stream conveyance path 34 and enters the distribution carrying-in unit (TW) 46 of the drying / thermal processing unit 30.

In addition, the resist coating unit (CT) 44 includes a sorter unit (not shown) before and after the floating stage, that is, on the carry-in side and the carry-out side, respectively. The sorter unit on the carry-in side has a roller conveying path constituting one section of the flat flow conveying path 34, a plurality of adsorption pads capable of vacuum adsorption / detaching at the edge of the substrate back surface with respect to the substrate on the roller conveying path, and It has the board | substrate conveyance mechanism which moves a suction pad in both directions in parallel with a conveyance direction. When the substrate on which the cooling process is completed is received in the upstream cooling unit (COL) 42 on the roller conveying path in the upstream, the suction pad is raised to be adsorbed to the rear edge of the substrate, and the substrate is adsorbed and held. The substrate transfer mechanism is adapted to transfer the substrate to the floating stage of the resist coating unit (CT) 44 through the suction pad. After the substrate is loaded into the floating stage, the suction pad is separated from the substrate, and the substrate transfer mechanism and the suction pad are then returned to their original positions. The sorter unit on the carry-out side also has the same configuration as the sorter unit on the carry-in side, with the order and direction of operation reversed.

In the drying / thermal processing part 30, as shown in FIG. 3, the board | substrate conveyance part 84 of the distribution carrying-in unit (TW) 46 has flat-flowed the board | substrate G which descended the flat stream conveyance path 34 as it is. It introduces into the furnace conveyor (roller conveyance path) 82. And when the board | substrate G moves to the conveyor (roller conveyance path) 82, the board | substrate G is stopped there once.

When distributing the substrate G to one layer of drying / thermal processing section 30 (1), after a predetermined time T1 has elapsed, the conveyor (roller conveying path) 82 of the substrate conveying section 84 is passed. ) And the internal roller conveyance path of the reduced pressure drying unit 48 (1) are simultaneously driven to carry the substrate G into the chamber 56 (1) of the reduced pressure drying unit 48 (1).

In addition, when distributing the said board | substrate G to two layers of drying / thermal processing part 30 (2), the board | substrate conveyance part 84 is moved up from one layer to two layers over predetermined time T2. Then, the conveyor (roller conveyance path) 82 of the board | substrate conveyance part 84 and the internal roller conveyance path of the pressure reduction drying unit 48 (2) are simultaneously driven, and the said board | substrate G is driven by the pressure reduction drying unit [48]. (2)] into the chamber 56 (2).

Here, it is preferable to make the said predetermined time (waiting time) T1 and the said predetermined time (rising movement time) T2 into equal length. Thereby, in order to receive the pressure reduction drying process which is the next process, the board | substrate G by which the resist application | coating process was completed by the resist application unit (CT) 44, drying of one layer through the distribution loading unit (TW) 46 / Transfer delay time when distributed to the thermal processing unit 30 (1), and transfer delay time when distributed to the two-layer drying / thermal processing unit 30 (2) through the distribution loading unit (TW) 46 Can be equalized. In particular, when the surface blower 90 is operated to dry the resist coating film on the substrate G in the distribution loading unit (TW) 46 before drying under reduced pressure, this delay condition (T1 = T2) is reduced. It is important to satisfy.

When the distribution import unit (TW) 46 distributes the substrate G to one layer of drying / thermal processing unit 30 (1), the substrate G is formed of the reduced pressure drying unit 48 (1). Immediately after being brought into the chamber 56 (1), the substrate inlet 58 (1) is closed and the chamber 56 (1) is closed. Then, the vacuum pump 66 (1) is operated to start vacuum evacuation, and the drying process is performed by depressurizing the inside of the chamber 56 (1). In this vacuum drying process, the organic solvent (for example, thinner) evaporates from the resist liquid film on the substrate G in the chamber under reduced pressure, and the organic solvent vapor is discharged from the chamber together with other gases [62 (1)]. From the exhaust pipe 64 (1) to the vacuum pump 66 (1). When the pressure reduction drying process is completed over a predetermined time, the substrate discharging opening 60 (1) is opened, and the roller conveying path 54 (1) is driven to take out the substrate G from the chamber 56 (1). At the same time, it is carried in to the prebaking unit 50 (1) next to the downstream side.

The board | substrate G is fixed temperature (for example, with the sheath heater 70 (1), moving the flat stream conveyance path 54 (1) on roller conveyance in the prebaking unit 50 (1)). 160 degreeC), and it receives a prebaking process. By this prebaking, the solvent remaining in the resist film on the substrate G is removed by evaporation, thereby enhancing the adhesion of the resist film to the substrate.

When the board | substrate G exits from the prebaking unit 50 (1), it enters into the cooling unit 52 (1) of the neighboring chamber, and moves here the roller flow path 54 (1) on roller conveyance, Cold air is blown out from the cold wind nozzle 76 (1), and when it leaves the cooling unit 52 (1), it becomes a predetermined | prescribed substrate temperature (for example, 23 degreeC).

Then, when the substrate G exits the cooling unit 52 (1) and arrives at the carrying out unit OUT-PASS1 32 (1), the roller conveyance on the flat flow conveying path 54 (1) stops. . Immediately thereafter, the transfer robot 106 on the interface station 18 side receives the substrate G and takes it out of the carrying out unit OUT-PASS1 32 (1).

Even in the case where the distribution carrying-in unit (TW) 46 distributes the substrate G to the two-layer drying / thermal processing unit 30 (2), the drying and thermal processing as described above by each of the two-layer processing units. Is performed. That is, the two-layer pressure reduction drying unit 48 (2) is the same vacuum drying as the one-layer pressure reduction drying unit 48 (1) with respect to the substrate G carried in from the distribution carrying-in unit (TW) 46. Perform the process. In addition, the two-layer prebaking unit 50 (2) has a one-layer prebaking unit 50 (1) with respect to the substrate G that moves the two-layer flat flow conveying path 54 (2) on roller conveyance. The same prebaking process is performed as in []]. In addition, the cooling unit 52 (2) of the 2nd floor is the same cooling as the cooling unit 52 (1) of the 1st layer with respect to the board | substrate G which passes through the plain flow conveyance path 54 (2) by roller conveyance. Perform the process. And when the board | substrate G arrives at carrying-out unit OUT-PASS2 32 (2), the conveyance robot 106 of the interface station 18 side will take over board | substrate G immediately after that.

In the interface station (I / F) 18, the substrate G is first brought into the peripheral exposure apparatus EE of the peripheral apparatus 102, where the resist developed on the peripheral portion of the substrate G is developed. After receiving exposure for removal at the city, it is sent to the neighboring exposure apparatus 12.

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, when the substrate G, which has completed the pattern exposure, is returned to the interface station (I / F) 18 from the exposure apparatus 12, first, the substrate G is brought into the titler TITLER of the peripheral apparatus 102, and Predetermined information is recorded at predetermined sites on the substrate. Then, the board | substrate G is carried in to the loading unit (not shown) of the lower layer of the peripheral apparatus 102 by the carrier robot 106. As shown in FIG.

Thus, the board | substrate G moves to the cassette station (C / S) 14 by the flat flow conveyance on the flat flow conveyance path 100 of the return route attached to the process line B of the return path this time.

In the first developing unit (DEV) 92, a series of developing processes of developing, rinsing, and drying are performed while the substrate G is conveyed in the flat stream.

The substrate G, which has completed a series of development processes in the developing unit DEV 92, is dried and thermally treated units 94 and 96 and an inspection unit AP 98 while descending the flat flow conveying path 100 back home. Pass sequentially).

In the drying / thermal processing units 94 and 96, the substrate G is first subjected to post-baking as heat treatment after development treatment in a post-baking unit (POST-BAKE) 94. By this post-baking, the developer or cleaning solution remaining in the resist film on the substrate G is evaporated and removed to enhance the adhesion of the resist pattern to the substrate G. Next, the substrate G is cooled to a predetermined temperature (for example, 23 ° C.) in the cooling unit (COL) 96. In the inspection unit (AP) 98, non-contact line width inspection, film quality, film thickness inspection, etc. are performed with respect to the resist pattern on the board | substrate G.

The carrying-out unit (OUT-PASS) 103 transfers the board | substrate G which reached | attained the terminal part of the flat-flow conveying path 100 to the return after finishing the process of the whole process, and the transfer robot 22 of the cassette station (C / S) 14. ). On the cassette station (C / S) 14 side, the cassette C of any one (usually original) of the processed substrate G received by the transfer robot 22 from the export unit (OUT-PASS) 103. To accommodate.

As described above, the resist coating and developing processing system 10 uses a drying / thermal processing unit 30 provided at the rear end of the coating process unit 28 in the process line A of the royal road as a laminated structure having a two-layer structure. The substrate G, which has been subjected to the resist coating treatment, is distributed to the first and second layers of drying / thermal processing units 30 (1) and 30 (2), and the first and second layers of drying / thermal processing units [30 ( 1) and 30 (2)] are each subjected to a series of treatments of reduced pressure drying, prebaking and cooling independently in a straight flow method.

Thereby, typically, drying / thermal is achieved by alternately distributing the substrate G on which the resist coating process is completed, one by one to two layers of drying / thermal processing units 30 (1) and 30 (2). It is also possible to shorten the tact time of the whole processing part 30 by half.

In particular, in this embodiment, since the pressure reduction drying units 48 (1) and 48 (2) of the first and second layers are operated in parallel, the rate factor of the tact time is remarkably alleviated or eliminated. In this way, a margin arises in the conveyance time on the flat stream conveyance paths 54 (1) and 54 (2), so that the conveyance speed of the flat stream is slowed, and the flat stream conveyance paths 54 (1) and 54 (2) are shortened. In other words, the prebaking units 50 (1) and 50 (2) and the cooling units 52 (2) and 52 (2) may be shortened. As a result, the shortening of the system full length size (X direction size) can be realized. Of course, there is no increase in system width size (Y direction size).

Moreover, in the normal FPD panel manufacturing plant, since the height of the exposure apparatus connected inline next to the area of the photolithography area where the resist coating and developing processing system is installed is high, there is sufficient margin in the ceiling height, The degree of freedom of the device size is large.

As another application, an operation of stopping one of the first floor drying / thermal processing unit 30 (1) or the second floor drying / thermal processing unit 30 (2) and temporarily or continuously operating one side (one-way operation) It is also possible.

As another application, it is also possible to set different recipes for drying and thermal treatment in the one- and two-layer drying / thermal treatment sections 30 (1), 30 (2). For products that require different treatments, continuous dosing and continuous flat flow treatment are also possible without changing the order.

In addition, in the drying / thermal processing part 30 in this embodiment, before carrying in into a pressure reduction drying unit 48 (1), 48 (2), it carries out pre-drying process in the distribution carry-in unit (TW) 46. FIG. It is also possible to implement | achieve, and it can also shorten the whole drying time after a resist coating process by this.

Second Embodiment

4 shows a layout configuration of the coating and developing processing system 200 according to the second embodiment. In the figure, the same code | symbol is attached | subjected to the part which has the structure or function substantially the same as the component in the coating-developing processing system 10 in 1st Embodiment mentioned above, and the description is abbreviate | omitted. 5 shows the detailed layout or configuration of the main part in this coating and developing processing system 200. As shown in FIG.

In the system 200 of this 2nd embodiment, the main part different from the system 10 of the said 1st embodiment is the drying / thermal treatment of each layer in the drying / thermal processing part 30 of the channel process line A. Between the thermal processing unit 30 (1), 30 (2) and the carrying out unit (OUT-PASS1) [32 (1)], (OUT-PASS2) [32 (2)] of each layer, (1) and 54 (2)] are provided with lifting type storage units ST1 [104 (1)] and (ST2) [104 (2)].

In the present embodiment, the cooling units COL1 [52 (1)], (COL2) [52 (2)] of each layer, and the storage units ST1 [104 (1)], (ST2) of each layer. Buffer unit (BF1) [102 (1)], (BF2) for temporarily stopping or adjusting the speed of the substrate on the flat stream conveyance paths 54 (1) and 54 (2) between [104 (2)]. 102 (1) is provided. The flat stream conveying paths 54 (1) and 54 (2) may be configured to perform independent roller conveying operations by individual roller drive units for each section, for example, with each unit as one section.

As shown in FIG. 5, the storage unit of each layer, for example, the storage unit ST1 [104 (1) of one layer, is one piece of the flat stream conveyance path 54 (1) by the length of one board | substrate. The conveyor (roller conveyance path) 106 which comprises a section is provided in multiple steps in the lifting frame 108 (1) which can move up and down. The elevating frame 108 (1) is coupled to an elevating drive unit (not shown) which uses, for example, an air cylinder or a motor as a drive source, and selects any one of the conveyor 106 of the plurality of stages to form a flat flow conveying path [ 54 (1)].

The storage unit ST2 (104 (2)) on the second floor also has the same structure or function as that of the storage unit ST1 (104 (1)) on the first floor described above.

Normally, at the time of normality, the board | substrate G which exited the cooling unit COL1 [52 (1)], (COL2) [52 (2)] of each layer is a flat stream conveyance path 54 (1), 54 (2). )] Buffer units BF1 [102 (1)], (BF2) [102 (2)] and storage units ST1 [104 (1)], (ST2) [104 (2)]. It is excessively sent to the export unit OUT-PASS1 [32 (1)], (OUT-PASS2) [32 (2)]. Lifts that can be lowered and lowered in the flat flow conveyance paths 54 (1) and 54 (2) in the export units OUT-PASS1 [32 (1)] and (OUT-PASS2) [32 (2)] of each floor. Pins 110 (1) and 110 (2) are provided. When the board | substrate G arrives, a lift pin lifting drive part (not shown) act | operates, the lift pins 110 (1) and 110 (2) are raised, and the board | substrate G is moved to the flat stream conveyance path 54 (1). , 54 (2)] and lifts it horizontally and transfers it to the transfer robot 106 (FIG. 4) on the interface station (IF) 18 side.

However, at the downstream side of the process flow than the drying / thermal processing unit 30, for example, an abnormality occurs in any one of the processing units on the exposure apparatus 12 or the return process line B, so that the interface station IF In the case where the substrate G cannot be sent to the 18 side, the buffer units BF1 [102 (1)], (BF2) [102 (2)] and the storage unit ST1 [104 (1)]. , (ST2) 104 (2) performs its original function. That is, the substrate G from the cooling units COL1 [52 (1)] and (COL2) [52 (2)] of each layer is stored in the storage units ST1 [104 (1)] and (ST2) [104. (2)] is stopped. By moving the lifting frame 108 stepwise in the vertical direction, the substrates G are stacked on the conveyor 106 of the plurality of stages, and the plurality of substrates G can be stacked and stored.

In the second embodiment, the buffer units BF1 [102 (1)], (BF2) [102 (2)] and the storage unit ST1 [104 (1)] at the rear end of the drying / thermal processing unit 30. , (ST2) 104 (2) is added, the system total length is longer than in the first embodiment. However, the tact time can be made much shorter than the conventional system because the tact time can be sufficiently afforded by the parallel operation of the first and second pressure reducing drying units 48 (1) and 48 (2) as described above.

[Other Embodiments]

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to the above-mentioned embodiment, A different embodiment or various deformation | transformation are possible within the scope of the technical idea.

For example, although the board | substrate conveyance part 84 installed in the distribution carrying-in unit (TW) 46 of the drying / thermal processing part 30 was comprised by the lifting-type conveyor 86 in the above-mentioned embodiment, Z-axis, It is also possible to substitute the carrier robot which can operate in three axes of a (theta) axis and an X axis.

Moreover, in the above-mentioned embodiment, since the processing unit arrange | positioned on the path | route process line A and the path | route process line B is unified in a flat flow system, there exists an advantage that the processing efficiency and conveyance efficiency can be improved. However, a configuration including a non-parallel processing unit is also possible. For example, as a resist coating unit (CT) 44 arranged on a path process line A, a substrate is placed on a stage instead of a floating type in which a resist nozzle is fixed and the substrate is floated and conveyed to perform a resist coating process. It is also possible to use a method (stage fixed type) in which the resist nozzle is scanned and moved in the scanning direction.

In addition, in the drying / thermal processing unit 30, instead of the vacuum drying units 48 (1) and 48 (2), the resist coating film on the substrate is subjected to the same pressure reduction drying process under normal pressure while the substrate is moved on the flat stream conveying path. It is also possible to put in an atmospheric pressure drying unit for drying (surface modification).

The substrate to be processed in the present invention is not limited to the glass substrate for LCD, but other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates, and the like can also be used.

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows the layout structure of the resist coating image development processing system in one Embodiment of this invention.

FIG. 2 is a perspective view illustrating an overview configuration of main parts of the resist coating and developing processing system of FIG. 1, in particular of the drying / thermal processing part that enters a route process line; FIG.

3 is a longitudinal sectional view schematically showing the configuration of a main part of the resist coating and developing treatment system of FIG.

4 is a plan view showing a layout configuration of a resist coating and developing processing system according to a second embodiment.

FIG. 5 is a vertical cross-sectional view schematically illustrating the configuration of main parts of the resist coating and developing processing system of FIG. 1. FIG.

<Explanation of symbols for the main parts of the drawings>

10: resist coating developing processing system

14: cassette station (C / S)

16: process station (P / S)

18: interface station (I / F)

26: cleaning process unit

28: coating process unit

30: drying / thermal treatment unit

30 (1): 1-layer drying / thermal treatment section

30 (2): 2 layers drying / thermal treatment section

32 (1): 1st floor export unit (OUT-PASS1)

32 (2): 2nd floor export unit (OUT-PASS2)

46: distribution import unit

48 (1): 1-layer reduced pressure drying unit

48 (2): 2-layer vacuum drying unit

50 (1): 1st floor prebaking unit (PRE-BAKE1)

50 (2): Prebaking Unit (PRE-BAKE2) on 2nd Floor

52 (1): 1st floor cooling unit (COL1)

52 (2): 2nd Floor Cooling Unit (COL2)

54 (1): Plain Flow Carrier on 1F

54 (2): Flat Flow Carrier on the 2nd Floor

92 development unit (DEV)

94: Post-Bake Unit (POST-BAKE)

96: cooling unit (COL)

104 (1): Storage unit (ST1) on the first floor

104 (2): Storage unit (ST2) on the second floor

Claims (9)

An inline type resist coating development processing system which connects a plurality of processing units in order of a process flow and performs a series of processes including a resist coating process and a developing process on a substrate to be processed, In the longitudinal direction of the system, at least the cleaning process unit, the resist coating process unit and the first process line for arranging the first drying / thermal processing unit arranged in the first direction in the order of the process, In the longitudinal direction of the system, at least the developing processing unit and the second drying / thermal processing unit are arranged in a second direction opposite to the first direction and arranged in the order of the process, and has a return process line, In the path process line, the first drying / thermal treatment unit is composed of an upper layer and a lower layer drying / thermal treatment unit stacked in two stages of upper and lower, drying and thermal treatment to the substrate by the upper and lower drying / thermal treatment unit A resist coating developing treatment system wherein the thermal treatment is performed independently in a horizontal flow manner. The method according to claim 1, wherein the first drying / thermal processing unit receives a substrate on which the resist coating process is completed from the resist coating processing unit, and receives the received substrate from the drying / thermal processing unit of the upper layer or the drying / thermal processing unit of the lower layer. A resist coating developing processing system, comprising: a dispensing import unit for distributing and carrying in one of the following. The resist coating and developing processing system according to claim 2, wherein the distribution loading unit distributes and imports the substrates one by one to the drying / thermal processing unit of the upper layer and the drying / thermal processing unit of the lower layer. 4. A second height position according to claim 2 or 3, wherein a first height position for carrying the substrate into the lower drying / thermal processing portion and the second height for bringing the substrate into the upper drying / thermal processing portion in the distribution carrying unit. A resist coating and developing processing system comprising a substrate transfer section capable of moving up and down between positions. The resist coating and developing processing system according to claim 4, wherein the substrate conveying unit has a conveyor for carrying the substrate into the dry stream in the upper layer and the lower layer in a flat stream. The drying / thermal treatment portion of the upper layer and the lower layer is both a drying unit for drying the resist coating film on the substrate to a certain stage in a flat flow method, and a resist coating on the substrate in a flat flow method. And a pre-baking unit for heating the film to the first temperature and a cooling unit for cooling the resist coating film on the substrate to the second temperature in a counterflow manner in a row in the first direction in this order. The resist according to claim 6, wherein in both the upper layer and the lower layer drying / thermal processing section, a resist flowing path for terminating the dry flow, the prebake unit, and the cooling unit of the flat flow type and carrying out the flow of the substrate is provided. Coating development treatment system. 8. A substrate according to claim 7, comprising a section of the flat stream conveying path at a rear end of the upper and lower layers of the drying / thermal processing section, and storing a substrate flowing from an upstream side when an abnormal situation occurs on the system downstream side. The resist coating developing system which installs the storage type of the lifting type which keeps | stacking in multiple stages. 7. The resist coating developing processing system according to claim 6, wherein the flat flow type drying unit is a reduced pressure drying unit for drying a resist coated film on a substrate in a reduced pressure chamber.

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