KR100821411B1 - Processing Apparatus - Google Patents

Abstract

The present invention provides a processing apparatus having a plurality of processing units that can combine a high productivity and a small footprint without causing a problem in the apparatus configuration, and can further shorten the length of the apparatus.

The processing apparatus 100 corresponds to each of the liquid processing units 21, 23, 24 and the liquid processing units 21, 23, 24, which perform predetermined liquid processing while the substrate G is conveyed substantially horizontally. A plurality of thermal processing units (26, 27, 28) provided and aggregated to perform predetermined thermal processing after each liquid treatment, and substrates carried out from the liquid treatment units (21, 23, 24); A plurality of conveying devices 33, 37, 40 for conveying G) to the respective thermal treatment unit sections, wherein the liquid treatment units 21, 23, 24 and the thermal treatment unit sections 26, 27, 28, Substantially arranged in two rows 2a, 2b in the order of treatment and at a predetermined interval, and at least a part of the thermal treatment units are disposed between these two rows.

Description

Processing Apparatus

1 is a plan view showing a resist coating and developing apparatus for an LCD glass substrate according to a first embodiment of the present invention.

Fig. 2 is a plan view showing the interior of a resist processing unit of the resist coating and developing apparatus for an LCD substrate according to the first embodiment of the present invention.

Fig. 3 is a schematic diagram for explaining the structure of each thermal processing unit block of the resist coating and developing apparatus for an LCD substrate according to the first embodiment of the present invention.

4 is a schematic view for explaining the structure of the first to third transfer apparatuses used in the resist coating and developing apparatus for an LCD substrate according to the first embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: cassette station 2: processing station

3: interface station 20: space

21: Scrub cleaning unit (liquid treatment unit)

23: resist processing unit (liquid processing unit)

24: Developing unit (liquid treating unit) 26: First thermal treating unit section

27: second thermal treatment unit section 28: third thermal treatment unit section

31,32,34,35,36,38,39: Thermal Treatment Unit Block                 

33: first conveying apparatus 37: second conveying apparatus

40: third conveying apparatus

100: resist coating and developing apparatus (processing apparatus)

G: LCD glass substrate

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a processing apparatus that performs a plurality of processes such as, for example, a resist coating and a post-exposure development process and a thermal process performed before and after the substrate to be processed, such as a liquid crystal display (LCD) glass substrate. will be.

In manufacturing LCDs, after forming a predetermined film on an LCD glass substrate, which is a substrate to be processed, a photoresist solution is applied to form a resist film, and a resist film is exposed to correspond to a circuit pattern, and a so-called photo is called a development process. Circuit patterns are formed by lithographic techniques.

In this photolithography technique, an LCD substrate, which is a substrate to be processed, is subjected to a series of processes such as cleaning treatment, dehydration baking, adhire (hydrophobization) treatment, resist coating, prebaking, exposure, development, and postbaking. A predetermined circuit pattern is formed in the resist layer.

Conventionally, such a process is to arrange processing units for each processing in a form conscious of the flow of processes on both sides of the conveying path, and to bring the substrate to be processed into each processing unit by a central conveying apparatus capable of traveling the conveying path. The processing system is formed by arranging one or more process blocks to be carried out. Since such a processing system is basically a random access, the processing freedom is very high.

However, in recent years, LCD substrates have been strongly demanded for large-scaled display, leading to the appearance of huge ones as long as 1m. In the processing system having the planar arrangement as described above, the footprint becomes very large, and the footprint of the substrate is reduced in terms of area saving. Reduction is strongly demanded.

In order to reduce the footprint, it is conceivable to stack the processing units in the vertical direction. However, in the current processing system, the conveying apparatus moves a large substrate in the horizontal direction at a high speed and with high precision in terms of productivity improvement. In addition, there is a natural limit to the high speed and high precision movement in the height direction. In addition, as the substrate is enlarged, the processing unit is also enlarged, and it is very difficult to install a spinner unit such as a resist coating process unit or a developing unit.

As another means of reducing the footprint, it is conceivable to arrange the processing units in the order of processing without using the central conveying apparatus. In this case, although the overall footprint is small, the units are arranged in the order of transport in succession. Therefore, there is a problem that the length of the device becomes long.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and a process having a plurality of processing units capable of combining a high productivity and a small footprint without causing any problems in the device configuration and having a relatively short length of the device can be performed. It is an object to provide a device.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, in the 1st viewpoint of this invention, it is a processing apparatus which performs a series of process containing a some liquid process with respect to a to-be-processed substrate, Comprising: A predetermined liquid process is performed, while a to-be-processed substrate is conveyed substantially horizontally. A plurality of thermal processing unit sections provided in correspondence with each of the plurality of liquid processing units and the plurality of thermal processing units and provided with a plurality of thermal processing units for predetermined thermal processing after the corresponding liquid processing; And a plurality of conveying apparatuses for conveying the substrate to be processed taken out from each liquid treatment unit to a corresponding thermal treatment unit section, wherein the plurality of liquid treatment units and the plurality of thermal treatment unit sections are substantially in the order of treatment. It is substantially arranged in two rows at predetermined intervals, and at least a part of said plurality of thermal processing units is between these two rows. It provides a process wherein in the device.

In addition, in the second aspect of the present invention, there is provided a processing apparatus that performs a series of processes including a plurality of liquid processes on a substrate to be processed, a plurality of processes each of which performs predetermined processing on the substrate to be processed corresponding to the series of processes. A processing unit having a processing unit and a storage container in which a substrate to be processed before processing and / or a substrate to be processed are stored, and an import / export unit for carrying in / out of the substrate to be processed into the processing unit; A plurality of liquid processing units for which a predetermined liquid treatment is performed while the substrate to be processed is conveyed substantially horizontally and corresponding to each of the plurality of liquid processing units, and a plurality of thermal treatments for performing a predetermined thermal treatment after the corresponding liquid treatment The plurality of thermal processing unit sections provided with the processing units concentrated therein correspond to the substrates to be taken out from the liquid processing units. And a plurality of conveying apparatuses for conveying to the red process unit section, wherein the plurality of liquid process units and the plurality of thermal process unit sections are substantially arranged in two rows in the order of treatment and at predetermined intervals. At least a portion of the thermal treatment unit is disposed between these two rows, and the substrate to be processed is brought from the carrying-out unit into the processing unit and then conveyed along one side of the two rows, and after U turn, along the other side of the two rows. Provided is a processing apparatus which is conveyed and carried out to the carry-in / out unit.

In this case, it is preferable that the plurality of thermal processing unit sections have thermal processing unit blocks constituted by stacking a plurality of thermal processing units in a vertical direction adjacent to a corresponding conveying apparatus.

In a third aspect of the present invention, a processing apparatus which performs a series of processes including cleaning, resist coating, and post-exposure development on a substrate to be processed, wherein predetermined processing is performed on the substrates corresponding to the series of processing. A processing unit having a plurality of processing units, a storage container for storing the substrate to be processed before processing and / or the substrate to be processed, and an import / export unit for carrying in and out of the substrate to be processed; And an interface unit for exchanging a substrate to be processed between the exposure apparatus and the exposure apparatus, wherein the processing unit includes a cleaning processing unit in which cleaning processing and drying processing with a cleaning liquid are performed while the substrate to be processed is conveyed substantially horizontally; A resist processing unit which is subjected to a resist process including application of a resist liquid while being transported substantially horizontally; While the plate is transported substantially horizontally, a developing unit for developing the developer, removing the developing solution after drying, and drying the process, and a plurality of thermal processing units for predetermined thermal treatment of the substrate to be taken out from the cleaning process unit A second thermal processing unit section in which an integrated first thermal processing unit section, a plurality of thermal processing units which perform a predetermined thermal treatment on a substrate to be carried out from the resist processing unit, and the development processing unit A third thermal treatment unit section in which a plurality of thermal treatment units for predetermined thermal treatment are concentrated, and the substrate to be taken out from the cleaning treatment unit are conveyed to the first thermal treatment unit section. At the same time, the substrate to be processed from the first thermal processing unit section is returned to the resist processing unit. A second conveying substrate to be processed from the resist processing unit to the second thermal processing unit section and conveying the substrate to be processed from the second thermal processing unit section to the interface unit; A third conveyance apparatus for conveying the substrate to be processed and the substrate to be processed carried out from the developing unit to the third thermal processing unit section and conveying the substrate to be processed from the third thermal processing unit section to the carrying-in / out unit; And a cleaning processing unit, the resist processing unit, the developing processing unit, and the plurality of thermal processing unit sections in the processing section, arranged substantially in two rows in the order of processing and at predetermined intervals. At least a portion of the plurality of thermal processing units is disposed between these two rows, And, after being brought into the processing section from the carry-in and out section, reach the interface section along one of the rows, via the cleaning process unit and the resist processing unit, and after exposure by an exposure apparatus, According to the other side, it provides the processing apparatus characterized by reaching the said carrying-in / out part through the said developing process unit.

In this processing apparatus, the first second and third thermal processing unit sections comprise a thermal processing unit formed by stacking a plurality of thermal processing units in a vertical direction adjacent to the first, second and third conveying apparatus. It is desirable to have a block. In addition, the transfer of the carrying in and out of the processing unit can be performed by the third conveying apparatus.

According to the present invention, a plurality of liquid treatment units for liquid treatment such as cleaning treatment, resist treatment, and developing treatment are configured such that a predetermined liquid treatment is performed while the substrate to be processed is substantially horizontally conveyed therein. For each unit, a plurality of thermal treatment units for subsequent thermal treatment are collected and installed, and a plurality of liquid treatment units and a plurality of thermal treatment unit sections are substantially arranged in two rows in the order of treatment and at predetermined intervals. Therefore, since a series of processing is performed by sending the substrate to be processed according to these rows, a large-scale central transfer apparatus and a central transfer route that travels between a plurality of processing units as in the past can be maintained while maintaining high productivity. Is basically unnecessary, and thus the area can be saved and the footprint can be reduced. In addition, since at least a part of the plurality of thermal processing units is arranged between the two rows, the length of the processing apparatus can be shortened by that amount. In addition, since the processing units are arranged in substantially two rows with a predetermined interval as described above, the space between these rows can be used as the maintenance space.

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to an accompanying drawing.

1 is a plan view showing a resist coating and developing apparatus for an LCD glass substrate according to a first embodiment of the present invention.

The resist coating and developing apparatus 100 includes a cassette station (load-in / out unit) 1 on which a cassette C containing a plurality of LCD glass substrates G is placed, and a resist coating and developing on a substrate G. Interface station (interface part) 3 for exchanging substrate G between a processing station (processing part) 2 having a plurality of processing units for carrying out a series of processes including an exposure apparatus 4 and an exposure apparatus 4 The cassette station 1 and the interface station 3 are disposed at both ends of the processing station 2, respectively. 1, the longitudinal direction of the resist coating and developing apparatus 100 is the X direction, and the direction orthogonal to the X direction on the plane is the Y direction.

The cassette station 1 is provided with the conveying apparatus 11 for carrying in / out of an LCD board | substrate G between the cassette C and the processing station 2, and is external to this cassette station 1 Import and export of the cassette (C) is made. Moreover, the conveying apparatus 11 has the conveying arm 11a, and carrying-in / out of the board | substrate G is performed between the cassette C and the processing station 2 by the conveying arm 11a.                     

The processing station 2 basically has parallel two rows of lines 2a and 2b extending along the X direction, and the scrub cleaning process from the cassette station 1 side toward the interface station 3 on one side 2a side. The unit (SCR) 21 and the resist processing unit 23 are arranged, and a developing processing unit (DEV) 24 is provided on the interface station 3 side of the other line 2b. In addition, a first thermal processing unit section 26 is provided in the portion between the scrub cleaning unit (SCR) 21 and the resist processing unit 23 in the line 2a, and the lines 2a and 2b. The second thermal treatment unit section 27 is installed in the portion adjacent to the interface station 3 of the (), and the third thermal treatment unit section 28 is provided in the cassette station 1 side of the line 2b. have. In addition, an excimer UV irradiation unit (e-UV) 22 is provided on a part of the scrub cleaning processing unit (SCR) 21, and is located adjacent to the downstream side of the developing processing unit (DEV) 24. A UV irradiation unit (i-UV) 25 is provided. The lines 2a and 2b are provided at predetermined intervals, and a space 20 is formed therebetween. On the other hand, the excimer UV irradiation unit (e-UV) 22 is for removing organic matter from the substrate G prior to scrub cleaning, and the i-ray UV irradiation unit (i-UV) 25 is decolorized. To do that.

In the scrub cleaning processing unit (SCR) 21, the substrate G is not rotated as in the prior art but is cleaned and dried while being conveyed substantially horizontally. In this scrub cleaning processing unit (SCR) 21, the conveyance of the board | substrate G is performed by roller conveyance or belt conveyance, for example.

The development processing unit (DEV) 24 is also configured to apply the developer, to wash the developer after development, and to dry the substrate G while the substrate G is rotated substantially horizontally without being rotated therein. Also in this development processing unit (DEV) 24, conveyance of the board | substrate G is performed by roller conveyance or belt conveyance, for example. In addition, the conveyance of the board | substrate G to the i-ray UV irradiation unit (i-UV) 25 is performed continuously by the same mechanism as the conveyance mechanism of the developing process unit (DEV) 24. As shown in FIG.

The resist processing unit 23 drops the resist liquid from a nozzle (not shown) while rotating the substrate G by the spin chuck 51 in the cup 50 as shown in the plan view of the inside thereof in FIG. The resist coating apparatus (CT) 23a to be applied, the pressure reducing drying apparatus (VD) 23b for drying the resist film formed on the substrate G under reduced pressure in the reduced pressure vessel 52, and the stage 54 are placed. Peripheral edge resist removal apparatus (ER) 23c for removing the excess resist attached to the periphery of the substrate G by means of the solvent ejection head 53 which can scan the four sides of the substrate G is arranged in that order. The board | substrate G is conveyed substantially horizontally between them by the pair of sub-arms 56 guided by the guide rail 55 and moving. The resist processing unit 23 is provided with an inlet 57 and an outlet 58 of the substrate G on the short side facing each other. The guide rail 55 extends outward from the discharge port 58, and the sub arm 56 allows the substrate G to be carried out. On the other hand, the carrying in of the board | substrate G to the resist process unit 23 is performed by the 1st conveyance apparatus 33 mentioned later.

The first thermal processing unit section 26 has two thermal processing unit blocks (TB) 31, 32 formed by laminating thermal processing units for thermal processing on the substrate G. As shown in FIG. The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 21 side, and the thermal processing unit block (TB) 32 is provided in the space 20. The first transfer device 33 is provided between the thermal processing unit block (TB) 31 and the resist processing unit 23.

The second thermal processing unit section 27 has three thermal processing unit blocks (TB) 34, 35, 36 formed by stacking thermal processing units for thermal processing on the substrate G, and thermal processing. The unit block (TB) 34 is installed on the resist processing unit 23 side, and the thermal processing unit block (TB) 35 is installed on the developing processing unit (DEV) 24 side, and the thermal processing unit block ( TB) 36 is provided in the space 20 adjacent to the interface station 3. Then, the second transfer device 37 is provided between the thermal processing unit blocks (TB) 34 and 35.

The third thermal processing unit section 28 has two thermal processing unit blocks (TB) 38, 39 formed by stacking thermal processing units for thermal processing on the substrate G, and thermal processing unit blocks. The TB 38 is provided on the developing unit (DEV) 24 side, and the thermal processing unit block (TB) 39 is provided on the cassette station 1 side end portion of the space 20. And the 3rd conveying apparatus 40 is provided between these two thermal processing unit blocks (TB) 38,39.

Each thermal treatment unit block TB in these first to third thermal treatment unit sections 26 to 28 is configured as shown in FIG. That is, the thermal treatment unit block (TB) 31 of the first thermal treatment unit section 26, as shown in Fig. 3 (a), is a dehydration bake that performs dehydration bake treatment on the substrate G in order from the bottom. A hydrophobization treatment (advance treatment) is performed on the unit (DHP) 61, the extension unit (EXT) 62 which exchanges the substrate G, the dehydration bake unit (DHP) 63, and the substrate G. The AD treatment unit (AD) 64 is laminated in four stages, and the thermal treatment unit block (TB) 32 is configured to sequentially rotate the substrate G from the bottom, as shown in FIG. Two cooling units (COL) 65 and 66 to cool and an adjunct processing unit (AD) 67 are laminated | stacked in three steps. In addition, the thermal processing unit block (TB) 34 of the second thermal processing unit section 27 is pre-baked to the substrate G in order from the bottom, as shown in Fig. 3 (c). PREBAKE (68), extension unit (EXT) 69, and two pre-baking units (70, 71) are stacked in four stages, and thermal processing unit block (TB) (35) As shown in Fig. 3 (d), the cooling unit (COL) 72, the extension unit (EXT) 73, and the two pre-baking units (PREBAKE) 74 and 75 are stacked in four stages. The thermal processing unit block (TB) 36 is composed of two extension cooling units (EXT COL) 76, 77 for exchanging and cooling the substrate G, as shown in Fig. 3 (e). ) Is laminated in two stages. The thermal processing unit block (TB) 38 of the third thermal processing unit section 28 is a cooling unit (COL) 78 and an extension unit (EXT) 79 in order from the bottom as shown in Fig. 3 (f). ) And two post-baking units (POBAKEs) 80 and 81 for post-baking the substrate are stacked in four stages, and the thermal processing unit block (TB) 39 is illustrated in FIG. As shown in Fig. 6, four post-baking processing units (POBAKEs) 82, 83, 84, and 85 are stacked in four stages.                     

The first conveying apparatus 33 is configured to access each unit of the thermal processing unit blocks (TB) 31 and 32 and the resist processing unit 23, and the scrub cleaning process unit (SCR) ( 21. Receipt of the board | substrate G carried out from the extension unit (EXT) 62, carried in from 21), and carrying in / out of the board | substrate G between the thermal process units which belong to the said thermal process unit blocks TB (31,32). And the substrate G are sent to and received from the resist processing unit 23.

The second conveying apparatus 37 is configured to be accessible to each unit of the thermal processing unit blocks (TB) 34, 35, and 36, and is carried out from the resist processing unit 23 to extend the extension unit EXT ( 73. Receipt of the board | substrate G handed over to 73, carrying in / out of the board | substrate G between the units which belong to thermal processing unit blocks TB (34, 35, 36), and extension cooling unit (EXTCOL) ( The substrate G is sent to and received from 76 or 77.

The 3rd conveying apparatus 40 is comprised so that each unit of the thermal processing unit blocks (TB) 38 and 39 can be accessed, and the receipt of the board | substrate G handed over to the extension unit (EXT) 79 is carried out. , Carrying in and out of the substrate G between the units belonging to the thermal processing unit blocks (TB) 38, 39, transferring the substrate G to the conveying apparatus 11 of the cassette station 1, and the cassette station 1. The board | substrate G is received from the conveying apparatus 11 of (), and the board | substrate G is carried in to the scrub cleaning process unit (SCR) 21 and the excimer UV irradiation unit (e-UV) 22. .

The said 1st-3rd conveying apparatuses 33,37,40 all have the structure shown in FIG. That is, these conveying apparatuses are the guide rail 91 which extends up and down, the elevating member 92 which elevates along the guide rail 91, and the base member 93 provided so that the elevating member 92 was rotatable. And a substrate holding arm 94 which is provided so as to be able to move forward and backward on the base member 93 and holds the substrate G. As shown in FIG. The lifting and lowering of the elevating member 92 is performed by the motor 95, the turning of the base member 93 is performed by the motor 96, and the forward and backward operation of the substrate holding arm 94 is performed by the motor 97. It is done by. Since these conveying apparatuses are provided in such a manner as to be capable of vertical motion, forward and backward motion, and swing motion, they are accessible to each unit.

As described above, the substrate G in the scrub cleaning processing unit (SCR) 21 is, for example, an extension unit (EXT) 62 of the thermal processing unit block (TB) 31 by roller conveyance. The board | substrate G carried out by carrying out to the pin and which is not shown in figure out is projected by the 1st conveying apparatus 33 here. In addition, although the carrying in of the board | substrate G to the resist processing unit 23 is performed directly by the 1st conveying apparatus 33 as mentioned above, when carrying out the board | substrate G from the resist processing unit 23, The sub arm 56 transports the substrate G through the outlet 58 to the extension unit EXT 69 of the thermal processing unit block TB 34, where the pins (not shown) protrude. The substrate G is carried out on the board. Loading of the substrate G into the development processing unit (DEV) 24 causes the substrate (not shown) to protrude in the extension unit (EXT) 73 of the thermal processing unit block (TB) 35 to raise the substrate. It lowers from a state and is performed by acting, for example, the roller conveyance mechanism extended to the extension unit (EXT) 73. As shown in FIG. The substrate G of the i-ray UV irradiation unit (i-UV) 25 is carried out to the extension unit (EXT) 79 of the thermal processing unit block (TB) 38 by roller transport, for example. The board | substrate G raised by the pin not shown protrudes is conveyed by the 3rd conveying apparatus 40. As shown in FIG.

The interface station 3 includes a transfer device 42 for carrying in and out of the substrate G between the processing station 2 and the exposure apparatus 4, and a buffer stage (BUF) 43 for arranging a buffer cassette. An external device block 45 having a title TITLER and a peripheral exposure device EE stacked up and down is provided adjacent to the conveying device 42. The conveying apparatus 42 is provided with the conveying arm 42a, and the conveyance arm 42a carries in and unloads the board | substrate G between the processing station 2 and the exposure apparatus 4. As shown in FIG.

In the resist coating and developing apparatus 100 configured as described above, first, the substrate G in the cassette C disposed in the cassette station 1 is transferred by the conveying apparatus 11 to the third conveying apparatus of the processing station 2. It is handed over to 40, it is carried in to the excimer UV irradiation unit (e-UV) 22 by this 3rd conveying apparatus 40, and scrub preprocess is performed. Subsequently, the substrate G is loaded into the scrub cleaning processing unit (SCR) 21 disposed under the excimer UV irradiation unit (e-UV) 22 by the third conveying device 40, and the scrub It is cleaned. In this scrub cleaning, the substrate G is conveyed substantially horizontally without being rotated as in the prior art, so that the cleaning treatment and the drying treatment are performed. Accordingly, two rotary cleaning scrubber cleaning units are conventionally used. It is possible to realize the same processing capacity as in the case of less area. After the scrub cleaning process, the substrate G is carried out to the extension unit (EXT) 62 of the thermal processing unit block (TB) 31 belonging to the first thermal processing unit section 26 by, for example, roller conveyance. do.

The substrate G disposed on the extension unit EXT 62 is lifted by the pins (not shown) protruding, and the following series of processings are performed by the first thermal processing unit section 26. That is, first of all, the heat treatment unit block (TB) 31 is conveyed to one of the dehydration bake units (DHP) 61 and 63 and heat-treated, and then the heat treatment unit block (TB) 32 is cooled. After being conveyed to one of the units (COL) 65 and 66 and cooled, the Advance Treatment Unit (AD) 64 of the Thermal Treatment Unit Block (TB) 31 and the Thermal Treatment in order to increase the fixability of the resist. It is conveyed to any one of the Advance Processing Units (AD) 67 of the unit block (TB) 32, where it is Advance processed (hydrophobized) by HMDS, and thereafter, the cooling unit (COL) 65, It is conveyed to any one of 66) and is cooled. The conveyance process at this time is all performed by the 1st conveyance apparatus 33. As shown in FIG. On the other hand, in some cases, the treatment is not performed.

Subsequently, the substrate G is carried into the resist processing unit 23 by the first transfer device 33. Subsequently, the substrate G is first spin-coated with the resist liquid with respect to the substrate G in the resist coating apparatus CT 23a therein, and then the pressure reducing drying apparatus VD is applied by the sub-arm 56. It is conveyed to 23b, and it is dried under reduced pressure, and it is conveyed to the peripheral edge resist removal apparatus 23c by the subarm 56, and the extra resist of the peripheral edge of the board | substrate G is removed. After the peripheral edge resist removal is completed, the substrate G is carried out from the resist processing unit 23 by the subarm 56. Thus, the installation of the pressure reduction drying apparatus (VD) 23b behind the resist coating processing apparatus (CT) 23a is performed after prebaking the substrate G to which the resist is applied, if it is not provided. After the post-baking treatment, the shapes of the lift pins and the fixing pins may be transferred to the substrate G. However, the solvent in the resist may be dried under reduced pressure without heating by the vacuum drying apparatus VD. Is gradually released, and rapid drying as in the case of heating and drying does not occur, and drying of the resist can be promoted without adversely affecting the resist, and transfer can be efficiently prevented on the substrate.

In this way, the application | coating process is complete | finished and the board | substrate G carried out from the resist process unit 23 by the sub arm 56 is a thermal process unit block (TB) 34 which belongs to the 2nd thermal process unit section 27. ) Is passed to the extension unit (EXT) 69. The substrate G disposed on the extension unit EXT 69 is prebaked (PREBAKE) 68, 70, 71 of the thermal processing unit block (TB) 34 by the second transfer device 37. ) And the pre-baking process of any one of the prebaking units (PREBAKE) 74,75 of the thermal processing unit block (TB) 35, and then the cooling unit (TB) of the thermal processing unit block (TB) 35. COL) 72 or extension cooling units (EXT COL) 76, 77, and cooled to a predetermined temperature.

Subsequently, when the substrate G is cooled by the cooling unit (COL) 72, the substrate G is conveyed to the extension cooling units (EXT COL) 76 and 77 by the second transfer device 37, and then extension cooling. In the case where the unit (EXT / COL) 76, 77 is cooled, it is conveyed to the exposure apparatus 4 by the transfer device 42 of the interface station 3 as it is, and the resist film on the substrate G is exposed therefor to be prescribed. Pattern is formed. In some cases, the substrate G is accommodated in the buffer cassette on the buffer stage BUF 43 and then conveyed to the exposure apparatus 4.

After the end of the exposure, the substrate G is conveyed to the peripheral exposure apparatus EE at the lower end of the external device block 45 by the transfer device 42 of the interface station 3 to perform exposure for removing the peripheral resist. The conveying apparatus 42 is carried in to the titler TITLER of the upper end of the external device block 45, and predetermined information is written on the board | substrate G, and then it is carried in to the processing station 2 again. That is, the board | substrate G is conveyed by the conveying apparatus 42 in the extension cooling unit (EXT * COL) 76,77 of the thermal processing unit block (TB) 36 which belongs to the 2nd thermal processing unit section 27. As shown in FIG. After being conveyed to either one, it is conveyed by the 2nd conveyance apparatus 37 to the extension unit EXT 73 of the thermal processing unit block TB (35). Then, the extension unit (EXT) 73 extends from the developing unit (DEV) 24 to the extension unit (EXT) 73 by lowering in the state where the substrate G is raised by protruding the pins. For example, the board | substrate G is carried in to the developing process unit (DEV) 24, and a developing process is performed by acting a roller conveyance mechanism. In this development process, the substrate G is not rotated as in the prior art, but is conveyed substantially horizontally, for example, by roller conveyance, to apply the developer, to remove the developer after development, and to dry. The same processing capacity as using three developing processing units of a type can be realized in a smaller area.

After the development process is completed, the substrate G is conveyed from the development process unit (DEV) 24 to the i-ray UV irradiation unit (i-UV) 25 by a continuous transport mechanism, for example, roller transport. The decoloring treatment is performed on the substrate G. Subsequently, the substrate G is conveyed in the i-ray UV irradiation unit (i-UV) 25 and further extended to the outside thereof by a third thermal treatment unit section 28 by a conveying mechanism, for example, roller conveyance. Is transferred to the extension unit (EXT) 79 of the thermal processing unit block (TB) 38 belonging to the &quot;                     

The substrate G disposed on the extension unit EXT 79 is formed by the third conveying device 40 by the post-baking units POBAKE 80 and 81 of the thermal processing unit block TB 38. It is conveyed to any one of the post-baking units (POBAKEs) 82, 83, 84, and 85 of the processing unit block (TB) 39, and post-baked, and then the cooling unit of the thermal processing unit block (TB) 38 is (COL) 78 is conveyed to the conveying apparatus 11 of the cassette station 1 by the 3rd conveying apparatus 40, after being cooled to predetermined temperature, and is conveyed by the conveying apparatus 11 to the cassette station. It is accommodated in the predetermined cassette C arrange | positioned at (1).

As described above, the scrub cleaning processing unit (SCR) 21, the resist processing unit 23, and the developing processing unit (DEV) 24 are transported with a predetermined liquid treatment while the substrate G is substantially horizontal. And a plurality of thermal processing units for subsequent thermal treatment for each of the scrub cleaning processing unit (SCR) 21, the resist processing unit 23, and the developing processing unit (DEV) 24. To install the first to third thermal processing unit sections 26, 27, and 28, and further, these scrub cleaning unit (SCR) 21, resist processing unit 23, and developing unit (DEV). ) 24 and thermal treatment unit sections 26, 27, 28 are arranged in substantially two rows of lines 2a, 2b in substantially the order of treatment and at a predetermined interval, such lines 2a, 2b. Since a series of treatments were performed while sending the substrate G along, the high productivity can be maintained. Haejyeoseo a plurality of conveying to a central large central conveying device and running it to the running through the treatment unit, such as below basically unnecessary, so it is possible to reduce the saving of the area, it is possible to reduce the footprint. In addition, since the thermal treatment unit blocks 32, 36 and 39 are arranged in the space 20 between the lines 2a and 2b, a part of the thermal treatment unit is not in the lines 2a and 2b but in the space 20. It becomes arrange | positioned, and the length of the whole apparatus can be shortened by that much. In addition, this space 20 can be used as a maintenance space. In addition, in the scrub cleaning processing unit (SCR) 21 and the developing processing unit (DEV) 24, since it is a so-called horizontal flow system which processes while conveying in a horizontal direction without rotating the board | substrate G, it is a conventional board | substrate. It becomes possible to reduce the mist which generate | occur | produces a lot when rotating (G).

In addition, since the first to third thermal processing unit sections 26, 27, and 28 are constituted by thermal processing unit blocks (TB) in which a plurality of thermal processing units are stacked, the footprint can be made smaller. The thermal treatment can be performed in accordance with the flow of the processing of the substrate G by minimizing the conveyance of the substrate G, thereby increasing the productivity. Moreover, since the 1st-3rd conveying apparatuses 33, 37, and 40 dedicated to each thermal processing unit section were provided corresponding to each thermal processing unit section, productivity can be made high also by this.

In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible within the scope of the idea of this invention. For example, the device layout is illustrative only and is not limited thereto. In addition, the processing is not limited to the processing by the resist coating and developing apparatus as described above, but can be applied to other apparatuses for liquid processing and thermal processing. In addition, although the case where an LCD substrate is used as the substrate to be processed is shown, the present invention is not limited thereto, and it is of course applicable to the processing of other substrates such as color filters.

As described above, according to the present invention, a plurality of liquid processing units that perform a predetermined liquid treatment are configured such that a predetermined liquid treatment is performed while the substrate to be processed is substantially horizontally conveyed therein, and for each liquid treatment unit, A plurality of thermal treatment units for subsequent thermal treatment are collected and installed, and a plurality of liquid treatment units and a plurality of thermal treatment unit sections are arranged substantially in two rows in the order of treatment and at predetermined intervals. Since a series of processing is performed by sending a substrate to be processed according to heat, high productivity can be maintained, and a large-scale central conveying apparatus traveling between a plurality of processing units as in the prior art and a central conveying path on which it runs are basically used. In this case, the area can be reduced, and the footprint can be reduced. In addition, since at least part of the plurality of thermal processing units is disposed between the two rows, the length of the processing apparatus can be shortened by that amount. In addition, since the processing units are arranged in substantially two rows with a predetermined interval as described above, the space between these rows can be used as the maintenance space.

Claims (6)

A processing apparatus for performing a series of processing including a plurality of liquid processing on a substrate to be processed, A plurality of liquid treatment units for which a predetermined liquid treatment is performed while the substrate to be processed is conveyed substantially horizontally; A plurality of thermal treatment unit sections provided corresponding to each of the plurality of liquid treatment units and provided with a plurality of thermal treatment units arranged to perform predetermined thermal treatment after the corresponding liquid treatment; And a plurality of conveying apparatuses for conveying the substrate to be processed taken out from each liquid treatment unit to a corresponding thermal treatment unit section, The plurality of liquid treatment units and the plurality of thermal treatment unit sections are substantially arranged in two rows in the order of treatment and at predetermined intervals, At least a portion of the plurality of thermal processing units is disposed between these two rows. A processing apparatus for performing a series of processing including a plurality of liquid processing on a substrate to be processed, A processing unit having a plurality of processing units each performing a predetermined process on a substrate to be processed in response to the series of processes; A storage container for storing the substrate to be processed before processing and / or the substrate to be processed after being processed, and carrying in / out of the substrate to be processed with the processing section; The processing unit, A plurality of liquid treatment units for which a predetermined liquid treatment is performed while the substrate to be processed is conveyed substantially horizontally; A plurality of thermal treatment unit sections provided corresponding to each of the plurality of liquid treatment units and provided with a plurality of thermal treatment units arranged to perform predetermined thermal treatment after the corresponding liquid treatment; It has a plurality of conveying devices for conveying the substrate to be processed from each liquid treatment unit to the corresponding thermal treatment unit section, The plurality of liquid treatment units and the plurality of thermal treatment unit sections are substantially arranged in two rows at predetermined intervals in the order of treatment, Disposed between these two rows in at least a portion of the plurality of thermal processing units, The substrate to be processed is conveyed along one side of the second row after being carried from the carry-in / out section to the processing section, and after U turn, is carried along the other side of the second row and carried out to the carry-in / out section. The thermal processing unit section according to claim 1 or 2, wherein the plurality of thermal processing unit sections have thermal processing unit blocks formed by stacking a plurality of thermal processing units in a vertical direction adjacent to a corresponding conveying apparatus. Processing apparatus. A processing apparatus which performs a series of processing including cleaning, resist coating, and post-exposure phenomenon on a substrate to be processed, A processing unit having a plurality of processing units each performing a predetermined process on a substrate to be processed in response to the series of processes; An import / export unit for placing a storage container for storing the substrate to be processed before processing and / or the substrate to be processed after processing, and carrying in and out of the substrate to be processed; An interface unit for exchanging a substrate to be processed between the processing unit and the exposure apparatus; The processing unit, A cleaning treatment unit in which the substrate to be processed is conveyed about horizontally, and the cleaning treatment unit and the drying treatment are performed by the cleaning liquid; A resist processing unit for carrying out a resist process including application of a resist liquid while the substrate to be processed is conveyed substantially horizontally; A developing unit for carrying out the developer solution, removing the developer after development, and drying the substrate to be processed, substantially horizontally; A first thermal processing unit section in which a plurality of thermal processing units which perform predetermined thermal processing are processed on the substrate to be carried out from the cleaning processing unit; A second thermal processing unit section in which a plurality of thermal processing units that perform predetermined thermal processing are collected on the substrate to be taken out from the resist processing unit; A third thermal processing unit section in which a plurality of thermal processing units which perform predetermined thermal processing are processed on the substrate to be carried out from the developing unit, A first conveying apparatus for conveying the substrate to be processed carried out from the cleaning processing unit to the first thermal processing unit section and conveying the substrate to be processed from the first thermal processing unit section to the resist processing unit; A second conveying apparatus which conveys the substrate to be processed taken out of the resist processing unit to the second thermal processing unit section and conveys the substrate to be processed from the second thermal processing unit section to the interface unit; And a third conveying device for conveying the substrate to be processed taken out of the developing unit into the third thermal processing unit section and conveying the substrate to be processed from the third thermal processing unit section to the carrying-in / out section. The cleaning processing unit, the resist processing unit, the developing processing unit, and the plurality of thermal processing unit sections in the processing unit are substantially arranged in two rows at predetermined intervals in the order of processing. At least a portion of the plurality of thermal processing units is disposed between these two rows, The substrate to be processed is brought into the processing section from the carry-in / out section, and then reaches the interface section along one of the rows via the cleaning processing unit and the resist processing unit, and after exposure by the exposure apparatus, the interface. And a portion reaching the carry-in / out portion along the other side of the column via the developing unit. The thermal processing unit according to claim 4, wherein the first, second and third thermal processing unit sections are each formed by stacking a plurality of thermal processing units in a vertical direction adjacent to the first second and third conveying apparatus. And a processing unit block. The processing apparatus according to claim 4 or 5, wherein the transfer between the carry-in and carry-out portion and the processing portion is performed by the third conveying apparatus.

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