JPH11251399A - Device for processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for processing a substrata which enable reduction of an installation area as far as possible and a smooth carry of a substrate between processing units. SOLUTION: In a device for performing a series of processed for each substrate, a group of coating units SC1 to SC3 are arranged in a shape of hook and a group of developing treatment units SD1 to SD3 are arranged in a shape of hook, and one unit at one end of the hook of the one group is arranged in the pocket region of the hook of the other group. Thereby the installation area of the device can be reduced. Further, since a substrate is carried with a substrate-carrying robot TRA into or out of the coating units SC1 to SC3 and first heat treatment units which process the substrates simultaneously and a substrate is carried with a substrate-carrying robot TRB into or out of the development treatment units SD1 to SD3 and second heat treatment units which process the substrates simultaneously, the substrate can be carried smoothly between the processing units.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a series of processes such as a coating process, a developing process, and a heat treatment on a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a substrate for a photomask or an optical disk. The present invention relates to a substrate processing apparatus to be applied.

[0002]

2. Description of the Related Art Conventionally, in order to reduce the installation area of this type of substrate processing apparatus, there has been proposed an apparatus in which processing units are arranged in multiple stages around an elevating movement path of a substrate transport robot which moves up and down. Hereinafter, this substrate processing apparatus will be described with reference to FIG.

The substrate processing apparatus 10 includes a substrate transport robot TR that can move up and down to load and unload, for example, a semiconductor wafer (hereinafter, simply referred to as a “substrate”) with respect to each processing unit.
It has. As shown in FIG. 7A, two coating processing units SC1 and S2 that apply a photoresist or the like to the substrate around the vertical movement path of the substrate transport robot TR.
C2 and two development processing units SD1 and SD2 for developing a substrate on which a circuit pattern or the like is exposed are arranged. Further, as shown in FIG. 7B, the heat processing units HP1 to HP7, the cooling units, are located above the processing units SC1, SC2, SD1, and SD2 and around the elevating movement path of the substrate transport robot TR. Processing units CP1 to CP6, adhesion processing unit AH
L, an edge exposure unit EE is arranged. FIG.
In (b), for example, “CP4, H
“P4, HP5” indicates that the cooling processing unit CP4, the heating processing unit HP4, and the heating processing unit HP5 are arranged in multiple stages from the bottom in this order, and the display in other frames is also the same.

The substrate processing apparatus 10 configured as described above
An indexer device 20 provided with a robot 21 for taking out an unprocessed substrate W from the cassette C for storing the substrates W in multiple stages and for storing the processed substrate W in the cassette C is disposed at one end of the cassette C. . On the other end side of the substrate processing apparatus 10, an exposure apparatus 40 is disposed via an interface device 30 that intervenes the transfer of the substrate W.

Hereinafter, a flow of processing of a substrate W in the above-described conventional substrate processing apparatus will be briefly described with reference to FIG. FIG. 8 is a flowchart showing the flow of the substrate W to each processing unit and the like. Note that the steps described with reference numerals in FIG. 8, for example, “SC1, SC2” mean that the substrate is carried into the vacant coating processing unit to perform the parallel processing of the substrate.

The unprocessed substrate W taken out from the indexer device (IDA) 20 is transferred to the substrate transfer robot TR of the substrate processing device 10. The substrate W is transferred to the adhesion processing unit A by the substrate transport robot TR.
HL, heat treatment unit HP1 or HP2, cooling treatment unit CP1 or CP2, coating treatment unit SC1
Or SC2, heat treatment unit HP3 or HP4,
And it is sequentially conveyed to the cooling processing unit CP3. The substrate W that has been subjected to the above processing is supplied to the interface device (I
F), and is sent to the exposure apparatus (EXP) 40 via the F) 30.
The substrate W on which the circuit pattern or the like has been exposed is transferred again to the substrate transport robot TR via the interface device 30. The substrate W is transported by the substrate transport robot TR to the edge exposure unit EE, the heating unit HP5 or HP6, the cooling unit CP4 or CP5, the developing unit SD1 or SD2, and the heating unit HP.
7 or HP8, and the cooling processing unit CP6. The substrate W that has undergone the above processing is returned to the indexer device 20 and stored in the cassette C. Less than,
Similar processing is repeatedly performed for each substrate.

[0007]

By the way, compared with the processing capability of the substrate processing apparatus 10 as described above, the exposure apparatus 4
When the processing capacity of 0 is high, the operating rate of the exposure apparatus 40 decreases. Since the exposure apparatus 40 is very expensive, it is inconvenient that the operating rate of the exposure apparatus 40 decreases. Therefore, in such a case, it is desired to increase the number of processing units of the substrate processing apparatus 10 to increase the processing capability of the substrate processing apparatus 10. Specifically, there is a request to increase the number of coating processing units from two to three and the number of developing processing units from two to three.

In order to meet such a demand, the present inventors have studied the addition of a processing unit, and as a result, the following problems to be solved have been clarified.

First, since there is a limit in the advance / retreat stroke of a substrate handling arm (not shown) provided in the substrate transport robot TR, three coating units and a development unit are provided around the substrate transport robot TR, respectively. It is difficult.

Therefore, in order to increase the number of processing units, it is appropriate to use two substrate transfer robots TR and arrange the processing units around each substrate transfer robot TR. As an example of a substrate processing apparatus using two substrate transport robots TR, an apparatus configuration as shown in FIG. 9 can be considered. The substrate processing apparatus 50 includes two substrate processing apparatuses 50.
A and 50B are connected in series, and one substrate processing apparatus 50A is provided with three coating processing units SC1, SC2 and SC3 around a substrate transfer robot TRA. Above these coating units SC1 to SC3, a group of heat treatment units (not shown) for loading and unloading substrates by the substrate transfer robot TRA is provided. Another substrate processing apparatus 50B includes three development processing units SD1 and S3 around a substrate transfer robot TRB.
D2 and SD3 are provided. A heat treatment unit group (not shown) for loading and unloading substrates by the substrate transfer robot TRB is also provided above the development processing units SD1 to SD3. Note that reference numeral 52 in FIG.
Is an interface mechanism for interposing the transfer of the substrate between the substrate transport robots TRA and TRB.

However, according to the substrate processing apparatus 50, the processing efficiency can be improved.
A and 50B have a drawback that the installation area of the substrate processing apparatus 50 becomes large because a vacant space is formed at the place indicated by the mark “x” in FIG.

As another example of a substrate processing apparatus using two substrate transport robots TR, an apparatus configuration as shown in FIG. 10 can be considered. This substrate processing apparatus 60 is configured by connecting two substrate processing apparatuses 60A and 60B. One substrate processing apparatus 60A includes three coating processing units SC1, SC2, and SC3 around a substrate transfer robot TRA. 1
Substrate processing robot SD of the other substrate processing apparatus 60B.
Around B, two development processing units SD2 and SD3 are arranged. Above the coating processing units SC1 to SC3 and the development processing unit SD1, a heat treatment unit group for loading and unloading substrates by the substrate transfer robot TRA is provided. Also, the development processing unit SD
Above SD1 and SD2, a heat treatment unit group and the like for loading and unloading substrates by the substrate transfer robot TRB are provided.

According to the substrate processing apparatus 60, the installation area of the apparatus can be made relatively small, but there are the following different problems. That is, the development processing unit S
Since D1 is disposed around the substrate transport robot TRA, the apparatus frame indicated by the reference symbol F in FIG.
1 cannot be loaded or unloaded from the substrate. Therefore, when the substrate transport robot TRB receives the exposed substrate from the exposure apparatus 40 via the interface device 30, the substrate transport robot TRB loads and transfers the substrate W to the development processing units SD2 and SD3 by itself. The unloading can be performed, but the developing unit S
For D1, the substrate W must be transferred to the substrate transfer robot TRA via the interface mechanism 52, and the substrate transfer robot TRA must load and unload the substrate to and from the development processing unit SD1. As a result, there is a difference in the timing of substrate transfer between the development processing units SD1 to SD3 that perform parallel processing and a processing unit group that performs another parallel processing (for example, coating processing, heating processing, cooling processing, and the like). This causes a problem that the substrate cannot be smoothly transported as a whole apparatus. Hereinafter, description will be made with reference to FIG.

FIG. 11A shows a substrate processing apparatus provided with development processing units SD1 to SD3 in which substrates are loaded and unloaded by one substrate transfer robot TR (for example, a substrate processing apparatus as shown in FIG. 9). 3) is a flow diagram showing the flow of the substrate before and after the development processing units SD1 to SD3 in FIG. In the figure, reference numerals A1 and A2 denote, for example, two cooling processing units for performing parallel processing, and reference numerals B1 and A2
B3 are, for example, three heat processing units that perform parallel processing. From the group of cooling processing units A1 and A2 that perform parallel processing, the development processing unit SD1 that performs parallel processing
~ The number of substrates transferred to SD3 per unit time,
The number of substrates transferred per unit time from the development processing units SD1 to SD3 to the heating processing units B1 to B3 that also perform parallel processing must be set to the same value. Otherwise, the substrate W stays in one of the processing units that perform the parallel processing, and the substrate cannot be transported smoothly. Therefore, when, for example, transfer of three substrates per 30 seconds is performed between groups of processing units that perform parallel processing, one development processing unit discharges one substrate per 10 seconds.

On the other hand, FIG. 11B shows a flow of the substrate in the substrate processing apparatus 60 shown in FIG. 10 in which the interface mechanism (IFB) 52 is interposed for carrying in / out the substrate to / from the developing unit SD1. FIG. In the substrate processing apparatus 60, the development processing unit S
Interface mechanism (I) for loading / unloading substrates to / from D1
Since the FB) 52 intervenes, it takes extra time to transfer the substrate, and as a result, the development processing unit SD1
It becomes impossible to discharge a substrate (for example, one substrate per 10 seconds) every set time. Therefore, as described above, the timing of the transfer of the substrate between the processing units performing the parallel processing is shifted, and a problem occurs that the substrate cannot be smoothly transported as a whole apparatus.

The present invention has been made in view of such circumstances, and a substrate processing apparatus capable of minimizing an installation area of a substrate processing apparatus and smoothly transporting a substrate between processing units. The main purpose is to provide

[0017]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a substrate processing apparatus that performs a series of processing on a substrate basis, and includes three coating processing units that perform coating processing on the substrate, and heat treatment on the substrate before and after the coating processing on the substrate. A first heat treatment unit group for applying heat treatment, three development treatment units for applying heat treatment to the substrate, a second heat treatment unit group for applying heat treatment to the substrate before and after the substrate heat treatment,
First substrate transport means commonly used for loading and unloading substrates to and from the three coating processing units and the first heat treatment unit group; and loading and unloading of substrates to and from the three development processing units and the second heat treatment unit group. A second substrate transfer means commonly used for unloading, wherein the three coating processing units and the three developing processing units are
Each of the processing units is arranged in a hook shape, and the processing units on one end side of the other hook-shaped arrangement are arranged so as to enter the hooked regions of each other, so that a total of six processing units are arranged in a rectangular shape. It is characterized by having been done.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the three coating processing units and the three developing processing units are horizontally arranged, and the three coating processing units are arranged horizontally. The processing units are arranged around an elevating movement path of a first substrate transfer means that can be moved up and down, and the three developing processing units are arranged around an elevating movement path of a second substrate transfer means that can be moved up and down, respectively. Further, the first heat treatment unit group is disposed above the three coating processing units and around the elevating movement path of the first substrate transfer means, and the second heat treatment unit group is It is located above the three developing units and around the elevating movement path of the second substrate transfer means.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect, the apparatus further includes a first substrate transfer apparatus arranged so as to be lined with the first heat treatment unit group or the second heat treatment unit group. Edge exposure means for exposing the periphery of the substrate, the edge exposure means being arranged around the elevating movement path of the means or the elevating movement path of the second substrate transport means.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the edge exposure means comprises:
Both of the substrate transfer means and the second substrate transfer means are arranged at positions where substrates can be loaded and unloaded.

According to a fifth aspect of the present invention, in the substrate processing apparatus of the first aspect, the three coating processing units and the three developing processing units are vertically arranged and the three coating processing units are arranged vertically. The processing units are arranged around an elevating movement path of a first substrate transfer means that can be moved up and down, and the three developing processing units are arranged around an elevating movement path of a second substrate transfer means that can be moved up and down, respectively. The first heat treatment unit group is arranged around a vertical movement path of the first substrate transfer means so as to face the three coating processing units, and the second heat treatment unit group is It is arranged around the vertical movement path of the second substrate transfer means so as to face the three development processing units.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to the first aspect, each of the three coating units is constituted by a photoresist coating unit.

According to a seventh aspect of the present invention, in the substrate processing apparatus of the first aspect, two of the three coating units are photoresist coating units, and the other is a photoresist coating unit. And a coating processing unit for forming an anti-reflection film on a substrate before coating.

According to an eighth aspect of the present invention, in the substrate processing apparatus according to the first aspect, two of the three coating units are photoresist coating units, and the other is a photoresist coating unit. And a coating processing unit for forming an anti-reflection film on the resist film after the application.

[0025]

The operation of the first aspect of the invention is as follows. When an indexer device is connected to one end of the substrate processing apparatus and an exposure device is connected to the other end, substrate processing proceeds as follows. An unprocessed substrate is taken out of the indexer device and transferred to the first substrate transfer means. First
The substrate transfer means carries the substrate into the first heat treatment unit group and performs heat treatment before the coating processing, and then the first substrate transfer means carries the substrate into the coating processing unit,
A coating process is performed on the substrate. While the previous substrate is undergoing the heat treatment or the coating treatment, the first substrate transfer means sequentially transfers the unprocessed substrates to be delivered to the vacant heat treatment unit or the coating treatment unit in the same order as described above. Carry in.
As a result, three substrates are processed in parallel in the three coating processing units. The first substrate transfer means loads the first heat treatment unit group in order from the substrate on which the coating process has been completed,
Heat treatment after the coating treatment is performed. The first substrate transfer means transfers the substrate after the heat treatment after the coating process to the second substrate transfer means, and the second substrate transfer means transfers the substrate to the exposure apparatus.

The exposed substrate is transferred again to the second substrate transport means. The second substrate transport means carries the substrate into the second heat treatment unit group and performs a heat treatment before the development processing, and then the second transport means carries the substrate into the development processing unit and Is subjected to a development process. While the previous substrate is undergoing the heat treatment and the development processing, the second substrate transfer means sequentially transfers the exposed substrates to be delivered to the vacant heat treatment units and the development processing units in the same order as described above. Carry in. As a result, three substrates are processed in parallel in the three developing units. The second substrate transporting means sequentially carries in the second heat treatment unit group from the substrate after the development processing, and performs the heat treatment after the development processing. Second
The substrate transfer means transfers the substrate after the heat treatment after the development processing to the first substrate transfer means, and the first substrate transfer means returns the substrate to the indexer device.

Although not all of the three coating processing units are always processed in parallel, in any case, these coating processing units load and unload substrates only by the first substrate transfer means. In addition, the three development processing units carry in and carry out the substrate only by the second substrate carrying means.
In other words, in the process of loading / unloading the substrate to / from a specific coating processing unit or developing processing unit, both the first substrate transport unit and the second substrate transport unit do not intervene.
The substrate can be smoothly transferred between the processing units performing the parallel processing.

Further, three coating processing units and 3
Each of the two processing units is arranged in a hook shape,
In addition, since the processing units on one end side of the other hook-shaped arrangement are arranged so as to enter the hooked areas of the other hook-shaped arrangement, the installation area of the substrate processing apparatus is also reduced.

According to the second aspect of the present invention, since the first heat treatment unit group is disposed above the three coating processing units, each of the coating processing units is moved up and down by the first substrate transfer means. And the first heat treatment unit group. Similarly, since the second heat treatment unit group is disposed above the three development processing units,
The substrate transfer means moves up and down, thereby transferring the substrate between each development processing unit and the second heat treatment unit group.

According to the third aspect of the present invention, when the edge exposure means is provided in parallel with the first heat treatment unit group, the coated substrate is subjected to heat treatment in the first heat treatment unit group. Later, the edge of the substrate is exposed by edge exposure means. The edge-exposed substrate is transferred from the first substrate transfer means to the second substrate transfer means and sent to the exposure apparatus. On the other hand, when the edge exposure means is arranged in parallel in the second substrate processing unit group, the second substrate transport means, which has received the substrate from the exposure apparatus, carries the substrate into the edge exposure means and causes Exposure is performed, and after that, after heat treatment in the second heat treatment unit group, the wafer is carried into the development processing unit and subjected to development processing.

According to the fourth aspect of the present invention, the edge exposure means can carry in and carry out the substrate from both the first substrate carrying means and the second substrate carrying means. Edge exposure can be arbitrarily performed before or after exposure of a circuit pattern or the like.

According to the fifth aspect of the present invention, the three coating processing units and the three developing processing units are respectively arranged in a hook shape, and the other hook-shaped arrangement is provided in a hooked area of each other. Is disposed so as to enter the processing unit at one end thereof, and is disposed in a rectangular shape as a whole in the vertical direction. Then, the first and second heat treatment unit groups are arranged to face these processing units. First
The substrate transfer means transfers the substrate between the coating processing unit group and the first heat treatment unit group by moving up and down, and the second substrate transfer means moves up and down to form the developing processing unit group. The substrate is transferred between the second heat treatment unit groups.

According to the sixth aspect of the present invention, since each of the three coating processing units is a photoresist coating processing unit, these three coating processing units are used for the parallel coating processing of the photoresist. .

According to the present invention, the antireflection film is applied to the substrate by using one coating processing unit before the photoresist is applied, and thereafter, by using two coating processing units. A parallel coating process of a photoresist is performed.

According to the eighth aspect of the present invention, after performing the parallel coating processing of the photoresist using the two coating processing units, the anti-reflection film is formed on the resist film using the one coating processing unit. Applied.

[0036]

Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a plan view showing a schematic configuration of a first embodiment of a substrate processing apparatus according to the present invention, FIG. 2 is a plan view around a substrate transfer robot, and FIG. FIG. As shown in FIG. 1A, the substrate processing apparatus 70 according to the present embodiment is configured by connecting two substrate processing apparatuses 70A and 70B. One substrate processing apparatus 70A includes a substrate transport robot TRA that can be moved up and down, and three coating processing units SC around the substrate transport robot TRA.
1, SC2 and SC3 are arranged in a hook shape (right angle).
The other substrate processing apparatus 70B includes a vertically movable substrate transport robot TRB, and three development processing units SD1, SD2, and SD3 are arranged in a hook shape (right angle) around the substrate transport robot TRA.

Three coating processing units S arranged in a hook shape
The coating processing units are arranged so as to enter the developing processing units SD3 into the pockets C1 to SC3 (inside empty spaces), and to the pockets of the three developing processing units SD1 to SD3 also arranged in a hook shape. SC1 is inserted so that six processing units SC1 to SC3 and SD1 to SD3 are arranged in a rectangular shape as a whole. With such an arrangement, there is no empty space in the substrate processing apparatus 70, and the installation area of the apparatus can be reduced.

Further, as shown in FIG. 1B, the heating processing units HP1 to HP3 and the cooling processing units are located above the coating processing units SC1 to SC3 of the substrate processing apparatus 70A and around the substrate transfer robot TRA. Unit CP1
To CP4 and the adhesion processing unit AHL
1. A first heat treatment unit group including AHL2 is arranged, and two edge exposure units EE1 and EE2 are provided side by side with the first heat treatment unit group. Similarly, the development processing unit S of the substrate processing apparatus 70B
D1 to SC3, the substrate transfer robot T
Around the RB, a second heat treatment unit group including heat processing units HP4 to HP9 and cooling processing units CP5 to CP8 is arranged. In addition, in FIG. 1B, for example, “CP3, HP2, H
P3 ”, as shown in FIG.
3, the heat processing units HP2 and HP3 are arranged in multiple stages from the bottom in that order, and the display in other frames is the same.

The configuration of each processing unit and the substrate transfer robots TRA and TRB will be briefly described below with reference to FIGS. Since the substrate transfer robots TRA and TRB have the same configuration, the substrate transfer robot TRA will be described as an example. The substrate transfer robot TRA includes two substrate handling arms 71. Each substrate handling arm 71 is composed of an articulated arm that moves forward and backward with the rotation of the motor 72 at the base end thereof, and has a substantially U-shaped shape for mounting and holding the substrate W at the distal end thereof. A substrate holding section 73 is provided. Substrate transfer robot T
The RA is configured to be rotatable around the axis P1 and to be able to move up and down. The lifting / lowering drive mechanism of the substrate transport robot TRA is not particularly limited.
A screw feed mechanism or a rodless cylinder, or a substrate transfer robot TRA, which is disposed along the RA moving path
Can be constituted by a pantograph-type elevating mechanism or the like which is connected and arranged below the.

The coating units SC1 to SC3 include a substrate rotation holding mechanism 83 for holding the substrate W on the spin chuck 81 and rotating the same by a motor 82, a nozzle 84 for discharging the coating liquid onto the substrate W, It is provided with a cup 85 for preventing scattering. Development processing unit S
Each of D1 to SD3 includes a substrate rotation holding mechanism similar to the coating processing units SC1 to SC3, a nozzle for discharging a developing solution onto the substrate W, a scattering prevention cup, and the like. The coating units SC <b> 1 to SC <b> 3 are selectively used as follows, for example, according to the type of the coating liquid applied to the substrate W.

In the first example, the coating units SC1 to SC
This is a case where all of C3 is configured by a photoresist coating unit. In this case, the coating processing unit SC
1 to SC3 are subjected to parallel processing of photoresist application.

In the second example, the coating units SC1 to SC
Among C3, the coating units SC1 and SC2 are photoresist coating units, and the other coating unit SC3 is a coating unit for forming an antireflection film on the substrate W before the photoresist is coated. This is the case. In this case, the coating processing unit SC1,
SC2 is subjected to parallel processing of photoresist coating.

In a third example, the coating units SC1 to SC
Among C3, the coating units SC1 and SC2 are photoresist coating units, and the other coating unit SC3 is a coating unit for forming an anti-reflection film on the resist film after coating the photoresist. Is the case. Also in this case, the coating processing unit SC
1. SC2 is subjected to parallel processing of photoresist coating.

The anti-reflection film described in the second and third examples has a feature of absorbing or attenuating the UV light irradiated by the exposure device 40, and is used to reduce standing waves and halation generated during exposure. , Formed on the upper or lower part of the resist film. The antireflection film formed on the resist film also has a function of preventing the deterioration of the resist film due to an external atmosphere.

Each of the heat processing units HP1 to HP9 and the cooling processing units CP1 to CP8 includes a heating plate or a cooling plate in each housing. The adhesion processing units AHL1 and AHL2 include a heating plate in the housing, an HMD
The apparatus is provided with a mechanism for supplying a vapor of an adhesion enhancer such as S (hexamethyldisilazane). As shown in FIG. 3, the edge exposure units EE1 and EE2 include a substrate rotation holding mechanism 86 for holding the substrate W and rotating at low speed, and a substrate W
And a light irradiating section 87 for irradiating light to the periphery of the light emitting device. In the edge-exposed substrate W, the photoresist film on the peripheral edge of the substrate W is removed by a subsequent development process, so that there is no adverse effect that the photoresist film on the peripheral edge of the substrate W is peeled off and becomes particles.

Reference numeral 75 in FIG. 1 denotes an interface mechanism that intervenes between the transfer of substrates between the substrate transfer robots TRA and TRB. Interface mechanism 75
Are composed of support pins for supporting the substrate W, a mechanism for positioning the substrate, and the like.

The substrate W in the apparatus of the embodiment described above will be described below.
Will be described with reference to FIG. FIG. 4 is a flowchart showing the flow of the substrate W when the coating units SC1 to SC3 are photoresist coating units. Steps in which reference numerals are arranged in FIG. 4, for example, “SC1, SC2, SC3” are performed by loading a substrate into an empty coating processing unit and performing parallel processing of the substrate (in this case, parallel processing of photoresist coating). Means to do.

The unprocessed substrate W taken out from the indexer device (IDA) 20 is transferred to the substrate transfer robot TRA of the substrate processing device 70. The substrate W is transferred to the adhesion processing unit AHL1 or AHL2, the cooling processing unit CP1 or CP2, the coating processing unit SC1 or SC2 or SC3, the heating processing unit HP1 or HP2 or HP3, the cooling processing unit CP3 or CP4, The sheet is sequentially conveyed to the edge exposure unit EE1 or EE2. The substrate W that has been subjected to the above processing is transferred to the interface mechanism (IF
B) The substrate transfer robot TRB is transferred from the substrate transfer robot TRA via 75, and further sent to the exposure apparatus (EXP) 40 via the interface device (IF) 30.

The substrate W on which the circuit pattern and the like have been exposed by the exposure device 40 is transferred again to the substrate transport robot TRB via the interface device 30. This substrate W
Are processed by the substrate transport robot TRB by the heating processing unit HP4 or HP5 or HP6, the cooling processing unit CP5 or CP6, the developing processing unit SD1 or S
D2 or SD3, heat treatment unit HP7 or HP
8 or HP9 and the cooling processing unit CP7 or CP8. Substrate W that has undergone the above processing
Is transferred from the substrate transport robot TRB via the interface mechanism 75 to the substrate transport robot TRA, is returned from the indexer device 20, and is stored in the cassette C. Hereinafter, the same processing is repeatedly performed for each substrate.

As described above, according to the apparatus of the present embodiment, a single substrate transfer robot performs loading and unloading of substrates to and from a plurality of processing units that perform a certain kind of parallel processing. The time required for loading and unloading the substrate by the above is the same for each processing unit. That is,
In a group of processing units performing parallel processing, parallel processing is performed because the time required for loading / unloading a substrate to / from a specific processing unit is not longer than other processing units in the group. The substrate can be smoothly transferred from one processing unit group to another processing unit group.

<Second Embodiment> FIG. 5 is a plan view showing a schematic configuration of a second embodiment of the substrate processing apparatus according to the present invention. In FIG. 5, the components indicated by the same reference numerals as those in FIG. 1 have the same configurations as those of the first embodiment, and thus the description thereof will be omitted. Hereinafter, the characteristic portions of this embodiment will be described.

The substrate processing apparatus 90 according to this embodiment is different from the substrate processing apparatus 90 shown in FIG.
In the rectangular device frame indicated by the symbol F in FIG.
This is an integrated apparatus in which three coating processing units SC1 to SC3 and three developing processing units SD1 to SD3 are arranged, and the installation area is smaller than that of the apparatus of the first embodiment. The coating processing units SC1 to SC3 and the developing processing units SD1 to SD3 are arranged in a hook shape around the substrate transfer robots TRA and TRB, respectively.
Further, the development processing unit SD3 is located in the hook area of the coating processing units SC1 to SC3, and the coating processing unit S is located in the hook area of the development processing units SD1 to SD3.
It is the same as the device of the first embodiment in that C1 is arranged so as to enter each.

A first heat treatment unit group similar to that of the first embodiment is arranged at a position above the coating processing units SC1 to SC3 and around the elevating movement path of the substrate transfer robot TRA. Units SD1 to SD3
And a second heat treatment unit group similar to that of the first embodiment is disposed around the vertical movement path of the substrate transport robot TRB. Coating units SC1 to SC
3 and the first heat treatment unit group are the substrate transfer robot T
The substrate W is loaded and unloaded by RA, and the development processing units SD1 to SD3 and the second heat treatment unit group are loaded and unloaded by the substrate transfer robot TRB in the same manner as in the first embodiment. .

Further, as a feature of the present embodiment, the first and second heat treatment units are arranged so that the two edge exposure units EE1 and EE2 can carry in / out the substrate by both the substrate transfer robots TRA and TRB. It is located between them. As a result, the edge exposure can be performed in parallel on the substrate W before or after exposure by the exposure device 40. That is, when edge exposure is performed before exposure by the exposure apparatus 40, the substrate W is loaded and unloaded to and from the edge exposure units EE1 and EE2 by using the substrate transfer robot TRA. When edge exposure is performed after the exposure, the substrate W is loaded / unloaded to / from the edge exposure units EE1 and EE2 using the substrate transport robot TRB. The processing flow of the substrate W by the apparatus of the present embodiment is as follows.
Since the processing flow is the same as that of the apparatus of the first embodiment shown in FIG. 4, the description is omitted here.

<Third Embodiment> FIG. 6 is a view showing the schematic arrangement of a third embodiment of the substrate processing apparatus according to the present invention. FIG. FIG. 2B is a layout view of each processing unit when the embodiment apparatus is viewed from above. In FIG. 6, the components indicated by the same reference numerals as those in FIG.
Since the configuration is the same as that of the first embodiment, the description is omitted here. Hereinafter, the characteristic portions of this embodiment will be described.

The substrate processing apparatus 100 according to the present embodiment
One coating processing unit SC1 to SC3 and three developing processing units SD1 to SD3 are vertically arranged, and heat treatment unit groups 102 to 1 are opposed to these processing units.
05 are arranged in multiple stages. Specifically, the coating processing units SC1 to SC3 include two coating processing units SC1 and SC2, and a coating processing unit S
C3 is arranged in the upper row, respectively, and has a hook-like arrangement as a whole. The development processing units SD1 to SD3 are arranged in a hook shape as a whole, with the development processing unit SD1 arranged at the lower level and the two development processing units SD2 and SD3 arranged at the upper level. Then, the development processing unit SD3 is located in the hook area of the coating processing units SC1 to SC3, and the coating processing unit SC1 is located in the hook area of the development processing units SD1 to SD3.
The six coating processing units SC1 to SC3 and SD1 to SD3 are arranged so as to enter respectively.
Are arranged in a rectangular shape. As a result, in the apparatus of this embodiment, the installation area of the apparatus in the vertical plane can be reduced.

The processing units SC1 to SC3, SD
The arrangement of 1 to SD3 is not limited to the above example, and the arrangement may be reversed from the arrangement of FIG.

An elevating path LA of the substrate transfer robot TRA is provided so as to pass substantially between the coating units SC1 and SC2.
A vertical moving path LB of the substrate transport robot TRB is provided so as to pass through substantially the middle of D3. A first group of heat treatment units 102 and 103 each including a plurality of heating processing units (HP) and cooling processing units (CP) arranged in multiple stages along the vertical movement path LA of the substrate transfer robot TRA. Are disposed facing the coating processing units SC1 to SC3. Thus, the coating processing units SC1 to SC arranged around the vertical movement path LA of the substrate transfer robot TRA.
The substrate transfer robot TRA carries in and out the substrates 3 and the heat treatment unit groups 102 and 103.
Similarly, a second heat treatment unit group 104, 105 is formed around the vertical movement path LB of the substrate transfer robot TRB.
Heat treatment unit groups are development processing units SD1 to SD
3 and are arranged. Substrate transfer robot TRB
Processing units SD1 to SD3 and heat treatment unit groups 104, 10 arranged around the vertical movement path LB of
In 5, the substrate is transferred in and out by the substrate transfer robot TRB.

The substrate transfer robots TRA and TR of this embodiment
B has a retractable substrate handling arm 101 for loading and unloading substrates to and from each processing unit, and is configured to be able to turn and move up and down as in the first embodiment. In this embodiment, each substrate transport robot TR
A and TRB have a single substrate handling arm 101, but may be configured to have two substrate handling arms, respectively, as in the first embodiment.

Also in the present embodiment, for example, the coating units SC1 to SC3 capable of performing parallel processing carry in / out the substrate only by the substrate transfer robot TRA. Similarly, the developing units SD1 to SD3 are the substrate transfer robots. Since the loading / unloading of the substrate is performed only by the TRB, the substrate can be smoothly transported between the processing units that perform the parallel processing.

[0061]

As apparent from the above description, the present invention has the following effects. According to the first aspect of the present invention, the three coating processing units and the first heat treatment unit group are controlled by the first substrate transfer means, and the three development processing units and the second heat treatment unit group are controlled by the second heat treatment unit group. Since the substrates are loaded and unloaded by the substrate transport means, the substrates can be transported smoothly between the processing units that perform the parallel processing. Further, since the coating processing unit and the developing processing unit are arranged in a rectangular shape so that no empty area is formed, the installation area of the substrate processing apparatus can be reduced.

According to the second aspect of the present invention, the first heat treatment unit group is disposed above the three coating processing units, and the second heat treatment unit group is disposed above the three development processing units. In the substrate processing apparatus described above, the substrate can be smoothly transported between the processing units performing the parallel processing, and the installation area of the apparatus can be reduced.

According to the third aspect of the present invention, in the substrate processing apparatus provided with the edge exposure means, the substrate can be smoothly transferred between the processing units performing the parallel processing, and the installation area of the apparatus can be reduced. Can be smaller.

According to the fourth aspect of the present invention, the edge exposure can be arbitrarily performed before or after the circuit pattern is exposed on the substrate.

According to the fifth aspect of the present invention, the substrate can be smoothly transferred between the processing units performing the parallel processing, and the installation area of the apparatus in the vertical plane can be reduced.

According to the sixth aspect of the present invention, when the three coating processing units perform the parallel processing of the photoresist coating, the substrate can be smoothly transported.

According to the seventh aspect of the present invention, the two coating processing units perform the photoresist coating in parallel, and the other coating processing unit forms an anti-reflection film on the substrate before the photoresist is coated. When forming, the substrate can be transported smoothly.

According to the eighth aspect of the invention, the two coating processing units perform the parallel processing of the photoresist coating, and the other coating processing unit applies an anti-reflection film on the resist film after applying the photoresist. When forming, the substrate can be transported smoothly.

[Brief description of the drawings]

FIG. 1 is a diagram showing an arrangement of each processing unit in a first embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a plan view showing the periphery of a substrate transfer robot of the first embodiment.

FIG. 3 is a view as viewed in the direction of arrows AA in FIG. 2;

FIG. 4 is a flowchart showing a flow of processing a substrate in the apparatus of the first embodiment.

FIG. 5 is a diagram showing an arrangement of each processing unit in a second embodiment.

FIG. 6 is a diagram showing an arrangement of each processing unit in a third embodiment.

FIG. 7 is a diagram showing an arrangement of each processing unit in a conventional substrate processing apparatus.

FIG. 8 is a flowchart showing a flow of processing a substrate in a conventional apparatus.

FIG. 9 is a diagram illustrating an example of a substrate processing apparatus provided for describing the problem of the present invention.

FIG. 10 is a diagram showing another example of the substrate processing apparatus for explaining the problem of the present invention.

FIG. 11 is a flowchart showing a flow of processing of a substrate for explaining the problem of the present invention.

[Explanation of symbols]

 70, 90, 100: substrate processing apparatus TRA, TRB: substrate transfer robot SC1 to SC3: coating processing unit SD1 to SD3: developing processing unit HP1 to HP9: heating processing unit CP1 to CP8: cooling processing unit AHL1 to AHL2: adhesion processing Unit EE1 to EE2: Edge exposure unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ryuichi Chikamori 322 Hahazushi Furukawa-cho, Fushimi-ku, Kyoto Dinichi Screen Manufacturing Co., Ltd. Dainichi Screen Manufacturing Co., Ltd.Rakusai Office (72) Inventor Masami Otani 322 Hazukashi Furukawa-cho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Corporation Rakusai Office

Claims (8)

[Claims] 1. A substrate processing apparatus for performing a series of processing for each substrate, comprising: three coating processing units for performing a coating process on a substrate; and a first heat processing unit for performing a heat treatment on the substrate before and after the coating process on the substrate. A group, three development processing units for performing a development process on the substrate, a second heat treatment unit group for performing a heat treatment on the substrate before and after the development process on the substrate, and a group of the three application processing units and the first heat treatment unit group. A first substrate transfer unit commonly used for loading and unloading substrates, and a second substrate transfer unit commonly used for loading and unloading substrates to and from the three development processing units and the second heat treatment unit group. The three coating processing units and the three developing processing units are respectively arranged in a hook shape, and one end of the other hook shape arrangement is provided in a hooked area of each other. Substrate processing apparatus is arranged so that the processing unit enters in, six processing units as a whole, characterized in that it is arranged in a rectangular shape. 2. The substrate processing apparatus according to claim 1, wherein the three coating processing units and the three developing processing units are horizontally arranged, and the three coating processing units are vertically movable. The three development processing units are arranged around a vertical movement path of a second substrate transportation means capable of moving up and down, respectively, around the vertical movement path of the first substrate transportation means; and The unit group is located above the three coating processing units and is arranged around the elevating movement path of the first substrate transporting means. The second heat treatment unit group is provided for the three developing processing units. A substrate processing apparatus disposed at an upper position and around a vertical movement path of the second substrate transfer means. 3. The substrate processing apparatus according to claim 2, wherein said apparatus further comprises a first heat treatment unit group or a second heat treatment unit group.
A substrate having edge exposing means for exposing the periphery of the substrate, arranged around the elevating movement path of the first substrate transfer means or the elevating movement path of the second substrate transfer means so as to line up with the heat treatment unit group Processing equipment. 4. The substrate processing apparatus according to claim 3, wherein said edge exposure unit includes a first substrate transfer unit and a second substrate exposure unit.
A substrate processing apparatus in which both of the substrate transfer means are disposed at positions where substrates can be loaded and unloaded. 5. The substrate processing apparatus according to claim 1, wherein the three coating processing units and the three developing processing units are vertically arranged, and the three coating processing units are vertically movable. The three development processing units are arranged around a vertical movement path of a second substrate transportation means capable of moving up and down, respectively, around the vertical movement path of the first substrate transportation means; and A unit group is arranged around the elevating movement path of the first substrate transfer means so as to face the three coating processing units, and the second heat treatment unit group faces the three developing processing units. A substrate processing apparatus disposed around a vertical movement path of the second substrate transport means. 6. The substrate processing apparatus according to claim 1, wherein each of the three coating units is a photoresist coating unit. 7. The substrate processing apparatus according to claim 1, wherein two of the three coating processing units are photoresist coating processing units, and another one of the three coating processing units is on a substrate before the photoresist is coated. A substrate processing apparatus which is a coating processing unit for forming an anti-reflection film. 8. The substrate processing apparatus according to claim 1, wherein two of the three coating processing units are photoresist coating processing units, and another one of the three coating processing units is on a resist film after the photoresist is coated. A substrate processing apparatus which is a coating processing unit for forming an anti-reflection film.