TWI388031B - Processing system - Google Patents

Processing system Download PDF

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TWI388031B
TWI388031B TW098127715A TW98127715A TWI388031B TW I388031 B TWI388031 B TW I388031B TW 098127715 A TW098127715 A TW 098127715A TW 98127715 A TW98127715 A TW 98127715A TW I388031 B TWI388031 B TW I388031B
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substrate
unit
atrium
processing
path
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TW098127715A
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Chinese (zh)
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TW201017804A (en
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Hironobu Kajiwara
Yoshiharu Ota
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means

Description

處理系統Processing system

本發明是有關在一連串的處理工程中具有依製程流程的順序來以大概水平的方向搬送被處理基板的搬送路線之處理系統。The present invention relates to a processing system for transporting a transport path of a substrate to be processed in a substantially horizontal direction in a series of processing processes in the order of process flow.

以往,在FPD(平板顯示器)製造的阻劑塗佈顯像處理系統,為了對應於被處理基板的大型化,而配備平移方式的處理單元,其係於水平方向鋪設滾筒或滾子等的搬送體而成平移搬送路上一邊水平搬送基板,一邊對基板的被處理面供給預定的液體、氣體、光等,而進行所要的處理,使依製程流程的順序沿著大概水平方向的路線來串聯排列包含如此的平移方式的處理單元的多數個處理單元之系統構成或佈局標準化(例如參照專利文獻1)。Conventionally, a resist coating development processing system manufactured by an FPD (flat panel display) is provided with a translation processing unit for transporting a roller or a roller in a horizontal direction in order to increase the size of the substrate to be processed. The substrate is transported horizontally on the translational transport path, and a predetermined liquid, gas, light, or the like is supplied to the processed surface of the substrate, and the desired processing is performed, and the processes in the order of the process flow are arranged in series along a route in the horizontal direction. The system configuration or layout standardization of a plurality of processing units of the processing unit including such a translation mode (see, for example, Patent Document 1).

如專利文獻1所記載,此種的佈局是在系統中心部配置橫長的製程站,在其長邊方向兩端部分別配置卡匣站及介面站。卡匣站是在站內的平台與系統外部之間進行收容複數片未處理或處理完成的基板之卡匣的搬出入,且在平台上的卡匣與處理站之間進行基板的搬出入。介面站是在鄰接的曝光裝置與處理站之間進行基板的交接。As described in Patent Document 1, such a layout is such that a horizontally long process station is disposed in the center of the system, and a cassette station and a mesa station are disposed at both ends in the longitudinal direction. The cassette station carries out the loading and unloading of the substrate of the unprocessed or processed substrate between the platform in the station and the outside of the system, and the substrate is carried in and out between the cassette on the platform and the processing station. The interface station performs the transfer of the substrate between the adjacent exposure device and the processing station.

製程站是具有以卡匣站作為始點‧終點,以介面站作為折返點的往路及復路的2列製程路線。一般,在往路的製程路線是洗淨處理系的單元、阻劑塗佈處理系的單元、熱的處理系的單元等或相鄰,或夾著搬送系的單元來配置成一列。在復路的製程路線是顯像處理系的單元、熱的處理系的單元、檢查系的單元等會相鄰,或夾著搬送系的單元來配置成一列。The process station is a two-row process route with a card-station station as the starting point, an end point, and a gateway station as a turning point. Generally, the process route in the forward path is a unit of the cleaning processing system, a unit of the resist coating processing system, a unit of the thermal processing system, or the like, or is arranged in a row in a unit sandwiching the transport system. The process route of the re-route is a unit of the development processing system, a unit of the thermal processing system, a unit of the inspection system, or the like, or is arranged in a row with the unit of the transport system interposed therebetween.

[專利文獻1]特開2007-200993號公報[Patent Document 1] JP-A-2007-200993

如上述般沿著直線性的往復路的製程路線來依製程流程的順序串聯排列配置含平移方式的處理單元的多數個處理單元之串聯型的處理系統是隨著FPD基板的大型化而系統長邊方向尺寸(全長尺寸)會不斷地變大,這對於FPD製造工廠而言在機體(footprint)的面是成為缺點。As described above, the tandem type processing system in which a plurality of processing units including the processing unit of the translation mode are arranged in series along the process route of the linear reciprocating path is in accordance with the enlargement of the FPD substrate. The side dimension (full length dimension) will continue to increase, which is a disadvantage in the face of the FPD manufacturing plant.

並且,曝光裝置的處理速度高速化,在阻劑塗佈顯像處理系統中各處理單元會被要求工站時間(Tact Time)的縮短化。其中,在阻劑塗佈工程與預烘烤工程之間夾著減壓乾燥的工程時,因為減壓乾燥處理需要比較長的時間,所以減壓乾燥單元的工站時間縮短化最困難。Further, the processing speed of the exposure apparatus is increased, and in each of the processing units for the resist coating and development processing, the processing time (Tact Time) is shortened. Among them, in the case where the vacuum drying process is interposed between the resist coating process and the prebaking process, since the vacuum drying process takes a relatively long time, it is most difficult to shorten the station time of the vacuum drying unit.

特別是在光蝕刻微影(Photolithography)使用半色調曝光製程時,阻劑光罩的膜厚為通常(約1.5μm)的約1.5~2倍(約2.0~3.oμm),該部分在阻劑塗佈處理中每一片基板的溶劑使用量會變多,因此在減壓乾燥單元中溶劑的蒸發所要的時間會拉長,工站時間縮短化更困難。In particular, when a halftone exposure process is used for photolithography, the film thickness of the resistive mask is about 1.5 to 2 times (about 2.0 to 3.Oμm) which is usually (about 1.5 μm), and the portion is resistive. Since the amount of solvent used per substrate in the coating treatment is increased, the time required for evaporation of the solvent in the vacuum drying unit is prolonged, and it is more difficult to shorten the station time.

本發明是有鑑於上述那樣以往技術的問題點而研發者,其目的是在於提供一種在沿著直線延伸的往復路的製程路線來依製程流程的順序排列配置複數的處理單元之串聯型系統中有效率地實現全長尺寸的縮短化及工站時間縮短化之處理系統。The present invention has been made in view of the problems of the prior art as described above, and an object of the present invention is to provide a tandem type system in which a plurality of processing units are arranged in the order of a process flow in a process route of a reciprocating path extending along a straight line. A processing system that efficiently shortens the overall length and shortens the station time.

為了達成上述目的,本發明的第1觀點之處理系統,係依製程流程的順序來連接複數的處理單元,而對被處理基板實施一連串的處理之串聯型的處理系統,其特徵係具有:第1製程路線,其係於系統長邊方向中在第1方向包含:使第1群的處理單元相鄰,或經由搬送系單元來配置成一列,平移搬送基板的第1往路平移搬送部、及在比該第1往路平移搬送部更製程流程的下游側平移搬送基板的第2往路平移搬送部;第2製程路線,其係於系統長邊方向中在與前述第1方向相反的第2方向,使位於比前述第1製程路線更製程流程的下游側之第2群的處理單元相鄰,或經由搬送系單元來配列成一列,在系統寬度方向與前述第1製程路線空出預定尺寸的中庭空間來平行延伸;第3群的處理單元,其係配置於前述中庭空間;及第1搬送裝置,其係配置於前述中庭空間,從前述第1往路平移搬送部的終端側的基板交接部搬出各基板,而搬送至前述第3群的處理單元之一,將在前述第3群的處理單元之一完成處理的各基板從該處理單元搬出,而搬入至前述第2往路平移搬送部的始端側的基板交接部。In order to achieve the above object, a processing system according to a first aspect of the present invention is a series processing system in which a plurality of processing units are connected in the order of a process flow, and a series of processing is performed on a substrate to be processed. a process route that includes, in a first direction in the longitudinal direction of the system, a processing unit that is adjacent to the first group, or a row that is arranged in a row via a transport unit, and a first forward translation transport unit that translates the substrate, and Translating the second forward translation transfer unit of the transport substrate to the downstream side of the process flow of the first forward translation transfer unit; the second process route is in a second direction opposite to the first direction in the longitudinal direction of the system a processing unit located in the second group on the downstream side of the process flow of the first process route, or arranged in a row via the transport system unit, and vacating a predetermined size in the system width direction and the first process route The atrium space extends in parallel; the processing unit of the third group is disposed in the atrium space; and the first conveying device is disposed in the atrium space, from the first to the first The substrate transfer unit on the terminal side of the road translation transport unit carries out the respective substrates, and transports them to one of the processing units of the third group, and the substrates that have been processed by one of the processing units of the third group are carried out from the processing unit. The substrate is transferred to the substrate delivery portion on the start side of the second forward translation transfer unit.

又,本發明的第2觀點之處理系統,係依製程流程的順序來連接複數的處理單元,而對被處理基板實施一連串的處理之串聯型的處理系統,其特徵係具有:第1製程路線,其係於系統長邊方向中在第1方向,使第1群的處理單元相鄰,或經由搬送系單元來配置成一列而成,第2製程路線,其係於系統長邊方向中與前述第1方向相反的第2方向包含:使位於比前述第1製程路線更製程流程的下游側之第2群的處理單元相鄰,或經由搬送系單元來配列成一列,平移搬送基板的第1復路平移搬送部、及在比該第1復路平移搬送部更製程流程的下游側平移搬送基板的第2復路平移搬送部,在系統寬度方向與前述第1製程路線空出預定尺寸的中庭空間來平行延伸;第3群的處理單元,其係配置於前述中庭空間;及第1搬送裝置,其係配置於前述中庭空間,從前述第1復路平移搬送部的終端側的基板交接部搬出各基板,而搬送至前述第3群的處理單元之一,將在前述第3群的處理單元之一完成處理的各基板從該處理單元搬出,而搬入至前述第2復路平移搬送部的始端側的基板交接部。Further, the processing system according to the second aspect of the present invention is a series processing system in which a plurality of processing units are connected in the order of a process flow, and a series of processing is performed on the substrate to be processed, and the first processing route is characterized in that: The first processing unit is adjacent to each other in the longitudinal direction of the system, or is arranged in a row via the transport unit, and the second process route is in the longitudinal direction of the system. The second direction opposite to the first direction includes: adjacent to the processing unit of the second group on the downstream side of the process flow of the first process route, or arranged in a row via the transport system unit, and translating the substrate a re-transporting and transporting unit and a second re-transporting and transporting unit that translates and transports the substrate on a downstream side of the process flow of the first re-transporting unit, and a predetermined size of the atrium space in the system width direction and the first process path Parallelly extending; the processing unit of the third group is disposed in the atrium space; and the first conveying device is disposed in the atrium space, and is translating and conveying the first complex road The substrate-side delivery unit on the terminal side carries out the respective substrates, and transports them to one of the processing units of the third group, and the substrates that have been processed in one of the processing units of the third group are carried out from the processing unit, and are carried in the aforementioned The substrate transfer portion on the start side of the second bypass translation transfer unit.

在本發明的處理系統中,第3群的處理單元及第1搬送裝置的佔有空間或運轉空間是全部被吸收於中庭空間之中,不被含在兩製程路線,因此不會增加系統寬度尺寸,可實現系統全長尺寸的大幅度縮短化。In the processing system of the present invention, the occupied space or the running space of the processing unit of the third group and the first conveying device are all absorbed in the atrium space, and are not included in the two process routes, so the system width size is not increased. It can greatly shorten the overall length of the system.

在本發明的較佳之一形態中,是在第3群的處理單元包含對基板之處理的內容及時間實質上相同的第1及第2處理單元。而且,經由第1往路平移搬送部來對連續不斷送來的基板交替重複安排第1及第2處理單元。藉由該構成,可錯開時間來使第1及第2處理單元並列運轉,實現工站時間的大幅度縮短化。In a preferred aspect of the present invention, the processing unit of the third group includes first and second processing units having substantially the same content and time of processing on the substrate. Further, the first and second processing units are alternately arranged on the continuously fed substrates via the first forward translation transfer unit. According to this configuration, the first and second processing units can be operated in parallel by shifting the time, and the station time can be greatly shortened.

此情況,第1搬送裝置具有可在設於中庭空間的搬送區域內移動的搬送機器人,第1及第2處理單元較理想是在系統長邊方向,之間夾著搬送區域來彼此相向配置於中庭空間。In this case, the first transport device has a transport robot that can be moved in the transport area provided in the atrium space, and the first and second processing units are preferably disposed in the longitudinal direction of the system with the transport region interposed therebetween. Atrium space.

在較佳之一形態中,第1及第2處理單元係與搬送區域鄰接配置。而且,搬送機器人係對第1及第2處理單元直接搬出入基板。In a preferred embodiment, the first and second processing units are disposed adjacent to the transport area. Further, the transport robot directly carries the first and second processing units into and out of the substrate.

在較佳之一形態中,在中庭空間,為了對第1處理單元搬出入基板,而設有在第1處理單元之外及中連續的第1中庭平移搬送部。而且,搬送機器人係對第1處理單元經由第1中庭平移搬送部來搬出入基板。In a preferred embodiment, in the atrium space, a first atrium translation transfer unit that is continuous outside the first processing unit and that is continuous in the middle of the first processing unit is provided. Further, the transport robot carries the first processing unit into and out of the substrate via the first atrium translation transport unit.

較佳之一形態,係第1中庭平移搬送部具有:第1中庭基板搬入路,其係與搬送區域鄰接設置;第1單元內搬送路,其係設於第1處理單元內,可與第1中庭基板搬入路連接;及第1中庭基板搬出路,其係由第1處理單元來看可在與第1中庭基板搬入路相反的側與第1單元內搬送路連接,通過第1處理單元之上或下延伸至與搬送區域鄰接的終端位置。In a preferred embodiment, the first atrium translation transport unit includes a first atrium substrate loading path that is disposed adjacent to the transport area, and a first intra-unit transport path that is coupled to the first processing unit and can be coupled to the first The first abutment substrate transport path is connected to the first abutment substrate transport path, and the first processing unit is connected to the first unit inner transport path on the side opposite to the first atrium substrate transport path, and is passed through the first processing unit. It extends up or down to the end position adjacent to the transport area.

而且,在對第1處理單元搬入基板時,係於第1中庭基板搬入路及第1單元內搬送路上搬送基板。When the substrate is loaded into the first processing unit, the substrate is transported on the first atrium substrate carrying path and the first unit inner conveying path.

並且,在從第1處理單元搬出基板時,係於第1單元內搬送路及第1中庭基板搬出路上搬送基板。When the substrate is carried out from the first processing unit, the substrate is transported on the first unit inner transfer path and the first atrium substrate carry-out path.

別的較佳之一形態,係第1中庭平移搬送部具有:與搬送區域鄰接而設成上下2段之可昇降的第1中庭基板搬入路及第1中庭基板搬出路、及設於第1處理單元內,可選擇性地連接至第1中庭基板搬入路及第1中庭基板搬出路的任一之第1單元內搬送路。In a preferred embodiment, the first atrium translation transport unit includes a first atrium substrate carrying path and a first atrium substrate carrying-out path that are vertically movable up and down in parallel with the transport area, and is provided in the first process. In the unit, the first intra-unit transfer path and the first intra-substrate transfer path of the first atrium substrate and the first abutment substrate transfer path are selectively connected.

而且,在對第1處理單元搬入基板時,係使第1中庭基板搬入路的高度位置對準第1單元內搬送路,在第1中庭基板搬入路及第1單元內搬送路上,將基板搬送於系統長邊方向的第1方向。When the first processing unit is loaded into the substrate, the height of the first atrium substrate carrying path is aligned with the first unit inner conveying path, and the substrate is transported on the first atrium substrate carrying path and the first unit inner conveying path. The first direction in the direction of the long side of the system.

並且,在從第1處理單元搬出基板時,係使第1中庭基板搬出路的高度位置對準第1單元內搬送路,在第1單元內搬送路及第1中庭基板搬出路上,將基板搬送於系統長邊方向的第2方向。When the substrate is carried out from the first processing unit, the height of the first atrium substrate transport path is aligned with the first intra-cell transport path, and the substrate transport is performed on the first intra-cell transport path and the first atrium substrate transport path. The second direction in the direction of the long side of the system.

在較佳之一形態中,係於中庭空間,為了對第2處理單元搬出入基板,而設有在第2處理單元之外及中連續的第2中庭平移搬送部,而且,搬送機器人係對第2處理單元經由第2中庭平移搬送部來搬出入基板。In a preferred embodiment, in the atrium space, a second atrium translation transfer unit that is continuous outside the second processing unit and in the middle of the second processing unit is provided in the atrium space, and the transfer robot is paired. 2 The processing unit carries in and out of the substrate via the second atrium translation transfer unit.

在較佳之一形態中,第2中庭平移搬送部具有第2中庭基板搬入路,其係與搬送區域鄰接設置;第2單元內搬送路,其係設於第2處理單元內,可與第2中庭基板搬入路連接;及第2中庭基板搬出路,其係由第2處理單元來看可在與第2中庭基板搬入路相反的側與第2單元內搬送路連接,通過第2處理單元之上或下延伸至與搬送區域鄰接的終端位置。In a preferred embodiment, the second atrium translation transport unit includes a second atrium substrate transport path that is disposed adjacent to the transport area, and the second unit inner transport path is provided in the second processing unit, and is second The second abutment substrate transport path is connected to the second abutment substrate transport path, and the second processing unit is connected to the second intra-cell transport path on the side opposite to the second atrium substrate transport path, and the second processing unit is connected to the second processing unit. It extends up or down to the end position adjacent to the transport area.

而且,在對第2處理單元搬入基板時,係於第2中庭基板搬入路及第2單元內搬送路上搬送基板。Further, when the second processing unit is loaded into the substrate, the substrate is transported on the second atrium substrate carrying path and the second unit inner conveying path.

並且,在從第2處理單元搬出基板時,係於第2單元內搬送路及第2中庭基板搬出路上搬送基板。In addition, when the substrate is carried out from the second processing unit, the substrate is transported on the second unit inner transfer path and the second atrium substrate carry-out path.

在別的較佳之一形態中,係第2中庭平移搬送部具有:與搬送區域鄰接而設成上下2段之可昇降的第2中庭基板搬入路及第2中庭基板搬出路、及設於第2處理單元內,可選擇性地連接至第2中庭基板搬入路及第2中庭基板搬出路的任一之第2單元內搬送路。In another preferred embodiment, the second atrium translation transport unit has a second atrium substrate carrying path and a second atrium substrate carrying-out path that are vertically movable up and down in two stages, and is provided in the second In the processing unit, the second intra-substrate substrate transport path and the second intra-substrate substrate transport path are selectively connected to any of the second intra-cell transport paths.

而且,在對第2處理單元搬入基板時,係使第2中庭基板搬入路的高度位置對準第2單元內搬送路,在第2中庭基板搬入路及第2單元內搬送路上,將基板搬送於系統長邊方向的第2方向。When the second processing unit is loaded into the substrate, the height of the second atrium substrate carrying path is aligned with the second intra-cell transfer path, and the substrate is transported on the second atrium substrate transfer path and the second intra-cell transfer path. The second direction in the direction of the long side of the system.

並且,在從第2處理單元搬出基板時,係使第2中庭基板搬出路的高度位置對準第2單元內搬送路,在第2單元內搬送路及第2中庭基板搬出路上,將基板搬送於系統長邊方向的第1方向。When the substrate is carried out from the second processing unit, the height of the second atrium substrate transport path is aligned with the second intra-cell transport path, and the substrate transport is performed on the second intra-cell transport path and the second atrium substrate transport path. The first direction in the direction of the long side of the system.

若根據較佳之一形態,則於第1製程路線中,在第1往路平移搬送部的終端側的基板交接部與第2往路平移搬送部的始端側的基板交接部之間配置有第3處理單元。而且,第1搬送裝置係對第3處理單元進行基板的搬出入。According to a preferred embodiment, the third process is disposed between the substrate delivery portion on the terminal side of the first forward translation transfer unit and the substrate delivery portion on the start side of the second forward translation transfer unit in the first process route. unit. Further, the first transport device carries out the substrate in and out of the third processing unit.

在較佳之一形態中,第3處理單元為在基板上塗佈阻劑液的阻劑塗佈單元,第1及第2處理單元為分別使基板上的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元,對阻劑塗佈單元的基板搬出口而言,第1及第2減壓乾燥單元的基板搬入口為大致等距離位置。In a preferred embodiment, the third processing unit is a resist coating unit that applies a resist liquid on the substrate, and the first and second processing units respectively dry the resist coating film on the substrate under reduced pressure. In the first and second reduced-pressure drying units, the substrate transfer ports of the first and second reduced-pressure drying units are substantially equidistant positions to the substrate transfer port of the resist application unit.

在此構成中,即使使第1及第2減壓乾燥單元並列運轉,全部的基板還是會同等隔一定的延遲時間在阻劑塗佈處理後接受減壓乾燥處理,因此可使阻劑塗佈膜的膜質(安定性‧再現性)提升。In this configuration, even if the first and second decompression drying units are operated in parallel, all of the substrates are subjected to a vacuum drying treatment after the resist coating treatment with a predetermined delay time, so that the resist can be coated. The film quality (stability and reproducibility) of the film is improved.

若根據別的較佳之一形態,則於第1製程路線中,在第1往路平移搬送部的搬送路上,設有在基板上塗佈阻劑液的阻劑塗佈單元,第1及第2處理單元為分別使基板上的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元,對第1往路平移搬送部的終端側的基板交接部而言,第1及第2減壓乾燥單元的基板搬入口為大致等距離位置。According to another preferred embodiment, in the first process route, a resist coating unit for applying a resist liquid on the substrate is provided on the transport path of the first forward transfer unit, first and second. The processing unit is a first and second decompression drying unit that respectively dries the resist coating film on the substrate under reduced pressure, and the first and the third substrate transfer unit on the terminal side of the first forward translation transfer unit 2 The substrate transfer inlet of the vacuum drying unit is at a substantially equidistant position.

在此構成中,也是即使使第1及第2減壓乾燥單元並列運轉,全部的基板還是會同等隔一定的延遲時間在阻劑塗佈處理後接受減壓乾燥處理,因此可使阻劑塗佈膜的膜質(安定性‧再現性)提升。In this configuration, even if the first and second decompression drying units are operated in parallel, all of the substrates are subjected to a reduced-pressure drying treatment after the resist coating treatment with a predetermined delay time, so that the resist can be coated. The film quality (stability and reproducibility) of the film is improved.

在較佳之一形態中,具有第2搬送裝置,其係於系統長邊方向的一端部,從被投入系統的任一卡匣取出未處理的基板來交給第1製程路線,從第2製程路線接收系統內的所要處理全部完成的基板,而收納於應從系統逐出的任一卡匣。In a preferred embodiment, the second conveying device is attached to the one end portion of the longitudinal direction of the system, and the unprocessed substrate is taken out from any of the cassettes of the system to be delivered to the first process route, and the second process is performed. All of the completed substrates in the route receiving system are processed and stored in any cassette that should be ejected from the system.

在別的較佳之一形態中,具有第3搬送裝置,其係於系統長邊方向的他端部,從第1製程路線搬出基板,而直接搬入第2製程路線,或使經由外部的處理裝置之後搬入第2製程路線。In another preferred embodiment, the third transport device is attached to the other end portion of the system in the longitudinal direction, and the substrate is carried out from the first process route, and the second process route is directly carried in, or the external processing device is passed. Then move into the second process route.

若根據本發明的處理系統,則藉由上述那樣的構成及作用,可在沿著直線延伸的往復路的製程路線來依製程流程的順序排列配置複數的處理單元之串聯型系統中有效率地實現全長尺寸的縮短化及工站時間縮短化。According to the processing system of the present invention, it is possible to efficiently arrange the tandem type system in which a plurality of processing units are arranged in the order of the process flow in the process route of the reciprocating path extending along a straight line by the above-described configuration and action. The shortening of the full-length size and the shortening of the station time are achieved.

以下,參照附圖來說明本發明的較佳實施形態。Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

(第1實施形態)(First embodiment)

圖1是表示本發明的第1實施形態之塗佈顯像處理系統10的佈局構成。此塗佈顯像處理系統10是設置於無塵室內,例如以玻璃基板作為被處理基板,在LCD製造製程中進行光蝕刻微影工程中的洗淨、阻劑塗佈、預烘烤、顯像及後烘烤等一連串的處理者。曝光處理是在與此系統鄰接設置的外部曝光裝置12進行。Fig. 1 is a view showing a layout configuration of a coating development processing system 10 according to a first embodiment of the present invention. The coating development processing system 10 is disposed in a clean room, for example, using a glass substrate as a substrate to be processed, and performing cleaning, resist coating, prebaking, and display in a photolithography lithography process in an LCD manufacturing process. A series of processors like and after baking. The exposure processing is performed by the external exposure device 12 disposed adjacent to the system.

此塗佈顯像處理系統10是在中心部配置橫長的製程站(P/S)16,其長邊方向(X方向)兩端部配置卡匣站(C/S)14與介面站(I/F)18。In the coating development processing system 10, a horizontally long process station (P/S) 16 is disposed at a central portion, and a card station (C/S) 14 and an interface station are disposed at both ends in the longitudinal direction (X direction). I/F) 18.

卡匣站(C/S)14是系統10的卡匣搬出入口,具備:卡匣平台20,其係可將能多段堆疊基板G而收容複數片的卡匣C於水平的一方向(Y方向)排列載置至4個;及搬送裝置22,其係對此平台20上的卡匣C進行基板G的出入。The cassette station (C/S) 14 is a cassette loading and unloading port of the system 10, and includes a cassette platform 20 which is capable of stacking a plurality of sheets of the substrate G and accommodating a plurality of cassettes C in a horizontal direction (Y direction). The arrangement is carried out to four; and the transfer device 22 performs the entry and exit of the substrate G on the cassette C on the stage 20.

搬送裝置22是由具有可以1片的單位來保持基板G的搬送臂22a之搬送機器人所構成,可用X,Y,Z,θ的4軸來動作,能夠進行鄰接的製程站(P/S)16側與基板G的交接。The transport device 22 is constituted by a transport robot having a transport arm 22a that can hold the substrate G in a single unit, and can be operated by four axes of X, Y, Z, and θ, and can be adjacent to a processing station (P/S). The intersection of the 16 side and the substrate G.

製程站(P/S)16是沿著延伸於水平的系統長邊方向(X方向)之互相平行且逆向的一對製程路線A,B來大致依製程流程或工程的順序配置複數的處理單元。The process station (P/S) 16 is a pair of process routes A and B which are parallel and reversed in the longitudinal direction (X direction) of the system extending horizontally, and the plurality of processing units are arranged substantially in the order of process flow or engineering. .

更詳細是在從卡匣站(C/S)14側往介面站(I/F)18側的往路之製程路線A中,依序一列配置搬入單元(IN-PASS)24、準分子UV照射單元(E-UV)26、刷子洗淨(Scrubber)單元(SCR)28、附著(adhesion)單元(AD)30、冷卻單元(COL)32、搬出單元(OUT-PASS)34、阻劑塗佈單元(CT)36、搬入單元(IN-PASS)38、預烘烤單元(PRE-BAKE)40、冷卻單元(COL)42及搬出單元(OUT-PASS)44等,作為第1群的單元。More specifically, in the process route A from the side of the card station (C/S) 14 to the interface station (I/F) 18 side, the loading unit (IN-PASS) 24 and the excimer UV irradiation are arranged in a row. Unit (E-UV) 26, Scrubber unit (SCR) 28, adhesion unit (AD) 30, cooling unit (COL) 32, carry-out unit (OUT-PASS) 34, resist coating The unit (CT) 36, the carry-in unit (IN-PASS) 38, the pre-baking unit (PRE-BAKE) 40, the cooling unit (COL) 42, the carry-out unit (OUT-PASS) 44, and the like are used as the units of the first group.

在此,準分子UV照射單元(E-UV)26、刷子洗淨單元(SCR)28、附著單元(AD)30及冷卻單元(COL)32皆是構成為平移方式的處理單元,從搬入單元(IN-PASS)24到搬出單元(OUT-PASS)34鋪設有縱貫上述處理單元26~32而延伸之例如滾子搬送路所構成的第1往路平移搬送部46。Here, the excimer UV irradiation unit (E-UV) 26, the brush cleaning unit (SCR) 28, the attachment unit (AD) 30, and the cooling unit (COL) 32 are all processing units configured in a translational manner, from the loading unit The (IN-PASS) 24 to the carry-out unit (OUT-PASS) 34 is provided with a first forward translation transport unit 46 including, for example, a roller transport path extending through the processing units 26 to 32.

又,預烘烤單元(PRE-BAKE)40及冷卻單元(COL)42皆是構成為平移方式的處理單元,從搬入單元(IN-PASS)38到搬出單元(OUT-PASS)44鋪設有縱貫上述處理單元40,42而延伸之例如滾子搬送路所構成的第2往路平移搬送部48。Further, both the pre-baking unit (PRE-BAKE) 40 and the cooling unit (COL) 42 are processing units configured to be in a translational manner, and are vertically disposed from the loading unit (IN-PASS) 38 to the unloading unit (OUT-PASS) 44. The second forward translation transport unit 48, which is formed by the roller transport path, extends through the processing units 40 and 42.

阻劑塗佈單元(CT)36並非是平移方式的處理單元,如後述圖2那樣,在平台76上載置固定基板G,在其上方使阻劑噴嘴78移動或掃描於水平方向,而在基板G上形成阻劑塗佈膜。The resist coating unit (CT) 36 is not a translating processing unit. As shown in FIG. 2 described later, the fixed substrate G is placed on the stage 76, and the resist nozzle 78 is moved or scanned in the horizontal direction above the substrate. A resist coating film is formed on G.

另一方面,在從介面站(I/F)18側往卡匣站(C/S)14側的復路之製程路線B中,依序一列配置搬入單元(未圖示)、顯像單元(DEV)52、後烘烤單元(POST-BAKE)54、冷卻單元(COL)56、檢查單元(AP)57及搬出單元(OUT-PASS)58等,作為第2群的單元。在此,上述搬入單元(未圖示)是設於周邊裝置(TITLER/EE)50之下,亦即與顯像單元(DEV)52同層。On the other hand, in the process route B of the re-route from the interface station (I/F) 18 side to the cassette station (C/S) 14 side, the carry-in unit (not shown) and the developing unit are arranged in a row ( DEV) 52, post-baking unit (POST-BAKE) 54, cooling unit (COL) 56, inspection unit (AP) 57, and carry-out unit (OUT-PASS) 58 are used as units of the second group. Here, the loading unit (not shown) is provided under the peripheral device (TITLER/EE) 50, that is, in the same layer as the developing unit (DEV) 52.

顯像單元(DEV)52、後烘烤單元(POST-BAKE)54、冷卻單元(COL)56及檢查單元(AP)57皆是構成為平移方式的處理單元。從上述搬入單元(未圖示)到搬出單元(OUT-PASS)58鋪設有縱貫上述處理單元52~58而延伸之例如滾子搬送路所構成的復路平移搬送部60。The developing unit (DEV) 52, the post-baking unit (POST-BAKE) 54, the cooling unit (COL) 56, and the inspection unit (AP) 57 are all processing units configured in a translational manner. A reversing translation transport unit 60 including, for example, a roller transport path extending through the processing units 52 to 58 is disposed from the loading unit (not shown) to the unloading unit (OUT-PASS) 58.

介面站(I/F)18是具有用以進行上述往路及復路的製程路線A,B或鄰接的曝光裝置12與基板G的交易之搬送裝置62,在此搬送裝置62的旁邊配置周邊裝置(TITLER/EE)50及旋轉平台(R/S)64。周邊裝置50是包含周邊曝光裝置(EE)及打碼機(TITLER)。旋轉平台(R/S)64是使基板G在水平面內旋轉的平台,用以在和曝光裝置12交接時變換長方形的基板G的方向。The interface station (I/F) 18 is a transfer device 62 having a process route A, B for performing the above-described forward and backward paths, or an adjacent exposure device 12 and a substrate G, and a peripheral device is disposed beside the transfer device 62 ( TITLER/EE) 50 and rotating platform (R/S) 64. The peripheral device 50 includes a peripheral exposure device (EE) and a coder (TITLER). The rotating platform (R/S) 64 is a platform for rotating the substrate G in a horizontal plane for converting the direction of the rectangular substrate G when it is transferred to the exposure device 12.

在此塗佈顯像處理系統10中,形成有被卡匣站(C/S)14及往路的製程路線A及介面站(I/F)18以及復路的製程路線B所包圍筆直延伸於X方向的中庭空間NS。在此中庭空間NS中,作為第3群的單元之2台的減壓乾燥單元66L,66R會彼此相向來分別配置於預定的位置,且在兩單元66L,66R之間設有1台的搬送裝置68。In the coating development processing system 10, the process route A and the interface station (I/F) 18 formed by the cassette station (C/S) 14 and the forward path, and the process route B of the re-route are formed to extend straightly to the X. Direction of the atrium space NS. In the atrium space NS, the two decompression drying units 66L and 66R, which are the units of the third group, are disposed at predetermined positions toward each other, and one of the two units 66L and 66R is disposed. Device 68.

圖2是表示減壓乾燥單元66L,66R及搬送裝置68以及其周圍的處理單元的詳細構成。Fig. 2 shows a detailed configuration of the decompression drying units 66L, 66R, the conveying device 68, and the processing unit therearound.

第1減壓乾燥單元66L是比第1往路平移搬送部46的搬出單元(OUT-PASS)34更靠製程路線A的上游側,配置於冷卻單元(COL)32的旁邊。第2減壓乾燥單元66R是比第2往路平移搬送部48的搬入單元(IN-PASS)38更靠製程路線A的下游側,配置於預烘烤單元(PRE-BAKE)40的旁邊。The first decompression drying unit 66L is disposed on the upstream side of the process route A than the unloading unit (OUT-PASS) 34 of the first forward translation conveying unit 46, and is disposed beside the cooling unit (COL) 32. The second decompression drying unit 66R is disposed on the downstream side of the process route A than the loading unit (IN-PASS) 38 of the second forward translation conveying unit 48, and is disposed beside the pre-baking unit (PRE-BAKE) 40.

在兩減壓乾燥單元66L,66R之間設有搬送區域TE。搬送裝置68是由具有可以1片的單位來保持基板G的搬送臂68a之搬送機器人所構成,可用X,Y,Z,θ的4軸來動作,移動於搬送區域TE內,可對基板搬入口或搬出口面臨搬送區域TE的全部單元、亦即兩減壓乾燥單元66L,66R、第1往路平移搬送部46的搬出單元(OUT-PASS)34、阻劑塗佈單元(CT)36及第2往路平移搬送部48的搬入單元(IN-PASS)38進出,而能夠進行該等的單元與基板G的交接。A transfer area TE is provided between the two decompression drying units 66L, 66R. The transport device 68 is constituted by a transport robot having a transport arm 68a that can hold the substrate G in a single unit, and can be operated by four axes of X, Y, Z, and θ, and moved in the transport area TE to carry in the substrate. The port or the outlet faces all the units of the transfer area TE, that is, the two decompression drying units 66L and 66R, the carry-out unit (OUT-PASS) 34 of the first forward transfer unit 46, and the resist coating unit (CT) 36 and The loading unit (IN-PASS) 38 of the second forward translation transport unit 48 enters and exits, and the units can be transferred to the substrate G.

各減壓乾燥單元66L,66R可將減壓可能的腔室予以二分割成上下,從上面開口的托盤或底淺容器型的下部腔室70(圖2)將可昇降移動的上部腔室(未圖示)舉起到上方,而使能夠進行基板G的搬出入。Each of the decompression drying units 66L, 66R can divide the chambers for decompression into two parts, and the upper chamber that can be moved up and down from the upper tray 70 or the bottom container type lower chamber 70 (Fig. 2) Not shown in the figure, the upper side is lifted, and the substrate G can be carried in and out.

如圖2所示,下部腔室70是大致四角形,在中心部配設有用以水平載置基板G而予以支撐的平台72,在底面的四個角落設有排氣口74。各排氣口74是經由排氣管(未圖示)來連通至真空泵(未圖示)。可在下部腔室70蓋上上部腔室的狀態下,藉由該真空泵來將兩腔室內被密閉的處理空間減壓至預定的真空壓力。並且,在各減壓乾燥單元66L,66R亦具備用以在平台72上進行搬送裝置68的搬送臂68a與基板G的交接之裝載/卸載機構(未圖示)。As shown in Fig. 2, the lower chamber 70 has a substantially square shape, and a platform 72 for supporting the substrate G to be horizontally placed is disposed at the center portion, and an exhaust port 74 is provided at four corners of the bottom surface. Each of the exhaust ports 74 is connected to a vacuum pump (not shown) via an exhaust pipe (not shown). The sealed processing space in the two chambers can be depressurized to a predetermined vacuum pressure by the vacuum pump in a state where the lower chamber 70 is covered with the upper chamber. Further, each of the decompression drying units 66L, 66R is also provided with a loading/unloading mechanism (not shown) for transferring the transfer arm 68a of the transport device 68 to the substrate G on the stage 72.

如圖2所示,阻劑塗佈單元(CT)36是具有:水平載置基板G而予以保持的平台76、及在被載置於該平台76上的基板G的上面(被處理面)利用長形的阻劑噴嘴78來以無旋轉法塗佈阻劑液之塗佈處理部80、及在未進行塗佈處理的期間為了下次準備而恢復阻劑噴嘴78的阻劑液吐出機能的噴嘴更新部82等。As shown in FIG. 2, the resist coating unit (CT) 36 is a stage 76 having a horizontally placed substrate G held thereon, and an upper surface (processed surface) of the substrate G placed on the stage 76. The coating treatment portion 80 that applies the resist liquid by the non-rotation method using the long resist nozzle 78 and the resist liquid discharge function that restores the resist nozzle 78 for the next preparation period without performing the coating process The nozzle update unit 82 and the like.

阻劑噴嘴78是具有可在X方向從一端到另一端覆蓋平台76上的基板G之細縫狀的噴嘴口的長形噴嘴,被連接至阻劑液供給源(未圖示)。塗佈處理部80是具有在塗佈處理時使阻劑噴嘴78在平台76的上水平移動於Y方向的噴嘴移動機構84。此噴嘴移動機構84是具有:水平支撐阻劑噴嘴78之倒字狀或門形的支撐體86、及使該支撐體86在Y方向直進移動於雙方向的直進驅動部88。阻劑噴嘴78會一邊將阻劑液帶狀地吐出,一邊在平台76上方從基板G的一端倒另一端水平移動(掃描)於Y方向,藉此在基板G的上面(被處理面)宛如鋪設地毯般以所望的膜厚來形成阻劑液的塗佈膜。另外,亦可將阻劑噴嘴78的長邊方向設為Y方向,將塗佈掃描方向設為X方向。The resist nozzle 78 is an elongated nozzle having a slit-like nozzle opening that covers the substrate G on the stage 76 from one end to the other in the X direction, and is connected to a resist liquid supply source (not shown). The coating processing unit 80 is a nozzle moving mechanism 84 that causes the resist nozzle 78 to horizontally move in the Y direction on the stage 76 during the coating process. The nozzle moving mechanism 84 has a horizontal support resist nozzle 78 A support body 86 having a shape or a gate shape, and a linear drive unit 88 that linearly moves the support body 86 in the Y direction in both directions. The resist nozzle 78 is horizontally moved (scanned) in the Y direction from the one end of the substrate G to the other end while the resist liquid is discharged in a strip shape, so that the upper surface (processed surface) of the substrate G is like A coating film of a resist liquid is formed in a film thickness as expected by laying a carpet. Further, the longitudinal direction of the resist nozzle 78 may be set to the Y direction, and the coating scanning direction may be set to the X direction.

在此阻劑塗佈單元(CT)36中,可從中庭空間NS的搬送區域TE側來進行基板G的搬出入。在平台76上亦具備用以進行基板G的裝載/卸載之可昇降移動的升降銷90等。In the resist coating unit (CT) 36, the substrate G can be carried in and out from the transfer region TE side of the atrium space NS. The platform 76 is also provided with a lift pin 90 for lifting and lowering loading/unloading of the substrate G, and the like.

兩減壓乾燥單元66L,66R是從阻劑塗佈單元(CT)36的基板搬出入口起左右對稱等距離位置。藉此,可使為了在阻劑塗佈單元(CT)36完成阻劑塗佈處理的基板G接受其次工程的減壓乾燥處理,而藉由搬送裝置68來移送至第1減壓乾燥單元66L時的搬送延遲時間與藉由搬送裝置68來移送至第2減壓乾燥單元66R時的搬送延遲時間能夠形成相等。The two decompression drying units 66L and 66R are symmetrical and equidistant positions from the substrate carrying-out port of the resist coating unit (CT) 36. Thereby, the substrate G for completing the resist coating treatment in the resist coating unit (CT) 36 can be subjected to the vacuum drying treatment of the second process, and transferred to the first decompression drying unit 66L by the transfer device 68. The transport delay time at the time can be made equal to the transport delay time when the transport device 68 transfers to the second decompression drying unit 66R.

在圖2中,第1往路平移搬送部46是在搬送方向(X方向)以一定間隔排列棒狀的滾子92來形成滾子搬送路,藉由馬達及傳動機構等所構成的滾子驅動部(未圖示)來旋轉驅動各滾子92,構成可在滾子搬送路上搬送基板G。在冷卻單元(COL)32內設有冷卻機構(未圖示),其係藉由熱交換在滾子搬送下通過的基板G,或吹冷風來冷卻至預定溫度。搬出單元(OUT-PASS)34是形成在第1往路平移搬送部46的滾子搬送路使平移搬送而來的基板G停止或静止的構成、及在搬送裝置68的搬送臂68a接收基板G的構成。另外,在第1往路平移搬送部46中,滾子搬送路可被分割成複數的區間,在各區間設有獨立的滾子驅動部。In FIG. 2, the first forward transfer conveyance unit 46 is formed by arranging rod-shaped rollers 92 at regular intervals in the conveyance direction (X direction) to form a roller conveyance path, and is driven by a roller constituted by a motor, a transmission mechanism, or the like. The unit (not shown) rotationally drives the rollers 92 to configure the substrate G to be transported on the roller transport path. A cooling mechanism (not shown) is provided in the cooling unit (COL) 32, which is cooled to a predetermined temperature by heat exchange of the substrate G that passes under the roller conveyance or by blowing cold air. The carry-out unit (OUT-PASS) 34 is a configuration in which the substrate G formed by the translational transport of the roller transport path of the first forward translation transport unit 46 is stopped or stopped, and the transport arm 68a of the transport device 68 receives the substrate G. Composition. Further, in the first forward translation and conveyance unit 46, the roller conveyance path can be divided into a plurality of sections, and an independent roller drive section is provided in each section.

同様,第2往路平移搬送部48也是在搬送方向(X方向)以一定間隔排列棒狀的滾子94來形成滾子搬送路,藉由具有馬達及傳動機構等的滾子驅動部(未圖示)來旋轉驅動各滾子94,構成可在滾子搬送路上搬送基板G。在預烘烤單元(PRE-BAKE)40內設有加熱器機構(未圖示),其係藉由熱交換在滾子搬送下通過的基板G,或吹熱風來加熱至預定溫度。搬入單元(IN-PASS)38是形成由搬送裝置68的搬送臂68a來接收基板G的構成、及可在剛接收基板G後開始平移搬送(滾子搬送)的構成。在第2往路平移搬送部48中,也是滾子搬送路可被分割成複數的區間,在各區間設有獨立的滾子驅動部。In the same manner, the second forward translation transport unit 48 also forms a roller-shaped roller 94 at a predetermined interval in the transport direction (X direction) to form a roller transport path, and has a roller drive unit including a motor and a transmission mechanism (not shown). Each of the rollers 94 is rotationally driven to form a substrate G that can be transported on the roller transport path. A heater mechanism (not shown) is provided in the pre-baking unit (PRE-BAKE) 40, which is heated to a predetermined temperature by heat exchange of the substrate G that passes under the roller conveyance or by blowing hot air. The carry-in unit (IN-PASS) 38 is configured to receive the substrate G by the transfer arm 68a of the transport device 68, and to start the translation transfer (roller transport) immediately after receiving the substrate G. In the second forward translation transport unit 48, the roller transport path can be divided into a plurality of sections, and an independent roller drive unit is provided in each section.

在此,說明此塗佈顯像處理系統對1片基板G的全工程的處理程序。Here, the processing procedure of the entire development of the one substrate G by the coating development processing system will be described.

首先,在卡匣站(C/S)14中,搬送裝置22會從平台20上的任一卡匣C取出一片基板G,且將該取出的基板G搬入至製程站(P/S)16的製程路線A側的搬入單元(IN-PASS)24。在搬入單元(IN-PASS)24中,基板G是被投入製程路線A的第1往路平移搬送部46。First, in the cassette station (C/S) 14, the transport device 22 takes out one of the substrates G from any of the cassettes C on the stage 20, and carries the taken-out substrate G into the process station (P/S) 16 The loading unit (IN-PASS) 24 on the side of the process route A. In the carry-in unit (IN-PASS) 24, the substrate G is the first forward translation transfer unit 46 that is put into the process route A.

被投入第1往路平移搬送部46的基板G是最初在洗淨製程部中藉由準分子UV照射單元(E-UV)26及刷子洗淨單元(SCR)28來依序實施紫外線洗淨處理及刷子洗淨處理。刷子洗淨單元(SCR)28是對水平移動於第1往路平移搬送部46的滾子搬送路上的基板G實施刷洗洗淨或吹氣洗淨,藉此來從基板表面除去粒子狀的污穢,然後實施洗滌處理,最後利用氣刀等來使基板G乾燥。一旦完成刷子洗淨單元(SCR)28之一連串的洗淨處理,則基板G會就那樣下降第1往路平移搬送部46的滾子搬送路而通過熱的處理部(30,32)。The substrate G to be loaded into the first forward transfer unit 46 is initially subjected to ultraviolet cleaning by the excimer UV irradiation unit (E-UV) 26 and the brush cleaning unit (SCR) 28 in the cleaning process unit. And brush cleaning treatment. The brush cleaning unit (SCR) 28 removes particulate contamination from the surface of the substrate by performing brush cleaning or air blowing on the substrate G that is horizontally moved on the roller transport path of the first forward translation transport unit 46. Then, the washing treatment is carried out, and finally the substrate G is dried by an air knife or the like. When the washing process of one of the brush cleaning units (SCR) 28 is completed, the substrate G is lowered by the roller transport path of the first forward translation transfer unit 46 and passes through the heat processing unit (30, 32).

在熱的處理部(30,32)中,基板G是最初在附著單元(AD)30實施利用蒸氣狀的HMDS之附著處理,使被處理面疏水化。在此附著處理終了後,基板G會在冷卻單元(COL)32被冷卻至預定的基板溫度。然後,基板G會進入搬出單元(OUT-PASS)34,停止於此。In the heat treatment unit (30, 32), the substrate G is first subjected to an adhesion treatment using a vaporous HMDS in the adhesion unit (AD) 30 to hydrophobize the surface to be treated. After the adhesion process is finished, the substrate G is cooled to a predetermined substrate temperature at the cooling unit (COL) 32. Then, the substrate G enters the carry-out unit (OUT-PASS) 34 and stops there.

之後不久,搬送裝置68會從中庭空間NS的搬送區域TE來進出於搬出單元(OUT-PASS)34,從第1往路平移搬送部46搬出基板G。其次,搬送裝置68會移動於搬送區域TE內,而將基板G搬入旁邊的阻劑塗佈單元(CT)36。After that, the transport device 68 enters the carry-out unit (OUT-PASS) 34 from the transport area TE of the atrium space NS, and carries out the substrate G from the first forward transfer unit 46. Next, the transfer device 68 moves into the transfer area TE, and the substrate G is carried into the resist coating unit (CT) 36 on the side.

在阻劑塗佈單元(CT)36中,基板G是被載置固定於平台76上,藉由使細縫噴嘴78水平移動(掃描)之無旋轉法來對基板G的上面(被處理面)塗佈阻劑液。In the resist coating unit (CT) 36, the substrate G is placed on the stage 76, and the upper surface of the substrate G is processed by a non-rotation method in which the slit nozzle 78 is horizontally moved (scanned). ) Apply a resist solution.

一旦在阻劑塗佈單元(CT)36完成阻劑塗佈處理,則搬送裝置68會從中庭空間NS的搬送區域TE來進出於阻劑塗佈單元(CT)36,從平台76搬出基板G。其次,搬送裝置68會移動於搬送區域TE內,將基板G搬入至兩減壓乾燥單元(VD)66L,66R的一方,例如第1減壓乾燥單元(VD)66L。Once the resist coating process is completed in the resist coating unit (CT) 36, the transfer device 68 advances from the transfer area TE of the atrium space NS into the resist coating unit (CT) 36, and the substrate G is carried out from the stage 76. . Next, the conveyance device 68 moves in the conveyance area TE, and carries the substrate G to one of the two decompression drying units (VD) 66L, 66R, for example, the first decompression drying unit (VD) 66L.

在第1減壓乾燥單元(VD)66L中,在平台72上水平載置基板G之後,關閉腔室(使上部腔室密合於下部腔室70),真空泵作動而開始真空排氣,將腔室內減壓而進行乾燥處理。此減壓乾燥處理是在減壓下的腔室內從基板G上的阻劑液膜蒸發有機溶劑(例如稀釋劑),有機溶劑蒸氣會與其他的氣體一起從腔室的排氣口74通過排氣管來送往真空泵側。一旦以一定時間完成減壓乾燥處理,則開啟腔室(使上部腔室往上方離開下部腔室70),卸載基板G。In the first decompression drying unit (VD) 66L, after the substrate G is placed horizontally on the stage 72, the chamber is closed (the upper chamber is brought into close contact with the lower chamber 70), and the vacuum pump is activated to start vacuum evacuation. The chamber is decompressed and dried. The vacuum drying treatment is to evaporate an organic solvent (for example, a diluent) from a resist liquid film on the substrate G in a chamber under reduced pressure, and the organic solvent vapor is discharged from the chamber exhaust port 74 together with other gases. The trachea is sent to the side of the vacuum pump. Once the vacuum drying treatment is completed for a certain period of time, the chamber is opened (the upper chamber is moved upward from the lower chamber 70), and the substrate G is unloaded.

搬送裝置62會進出於第1減壓乾燥單元(VD)66L,而搬出完成減壓乾燥處理的基板G。其次,移動於搬送區域TE內,將基板G搬入至搬入單元(IN-PASS)38。之後不久,在第2往路平移搬送部48開始滾子搬送,基板G平移搬送至製程路線A的下游側,通過熱的處理部(40,42)。The conveyance device 62 advances into the first decompression drying unit (VD) 66L, and carries out the substrate G that has completed the decompression drying process. Next, moving in the transfer area TE, the substrate G is carried into the carry-in unit (IN-PASS) 38. Shortly thereafter, the second forward translation transfer unit 48 starts the roller transport, and the substrate G is translated and transported to the downstream side of the process route A, and passes through the heat processing unit (40, 42).

在熱的處理部(40,42)中,基板G是最初在預烘烤單元(PRE-BAKE)40接受預烘烤,作為阻劑塗佈後的熱處理或曝光前的熱處理。藉由此預烘烤,殘留於基板G上的阻劑膜中之溶劑會蒸發而被除去,阻劑膜對基板的密合性會被強化。其次,基板G會在冷卻單元(COL)42被冷卻至預定的溫度。然後,基板G會從第2往路平移搬送部48的終點的搬出單元(OUT-PASS)44退出至介面站(I/F)18的搬送裝置62。In the hot processing section (40, 42), the substrate G is initially pre-baked in the pre-baking unit (PRE-BAKE) 40, as a heat treatment after the resist coating or a heat treatment before the exposure. By this prebaking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G is cooled to a predetermined temperature in the cooling unit (COL) 42. Then, the substrate G is ejected from the carry-out unit (OUT-PASS) 44 at the end of the second forward translation transport unit 48 to the transport device 62 of the interface station (I/F) 18.

在介面站(I/F)18中,基板G是在旋轉平台64例如接受90度的方向變換之後搬入至周邊裝置50的周邊曝光裝置(EE),在此接受用以在顯像時除去附著於基板G的周邊部的阻劑之曝光後,送往旁邊的曝光裝置12。In the interface station (I/F) 18, the substrate G is a peripheral exposure device (EE) that is carried into the peripheral device 50 after the rotary table 64 is subjected to, for example, a 90-degree direction change, and is received therein for removal of adhesion during development. After exposure of the resist on the peripheral portion of the substrate G, it is sent to the adjacent exposure device 12.

曝光裝置12是對基板G上的阻劑曝光預定的電路圖案。然後,完成圖案曝光的基板G是從曝光裝置12回到介面站(I/F)18,首先搬入至周邊裝置50的打碼機(TITLER),在基板G上的預定部位記上預定的資訊。然後,基板G會藉由搬送裝置62來搬入周邊裝置50之下的搬入單元(未圖示)。The exposure device 12 exposes a predetermined circuit pattern to the resist on the substrate G. Then, the substrate G on which the pattern exposure is completed is returned from the exposure device 12 to the interface station (I/F) 18, first loaded into the peripheral device 50 (TITLER), and predetermined information is recorded on a predetermined portion on the substrate G. . Then, the substrate G is carried into the carry-in unit (not shown) under the peripheral device 50 by the transport device 62.

如此,基板G將會搭乘於復路的製程路線B所鋪設的復路平移搬送部60的滾子搬送路來往卡匣站(C/S)14移動。In this manner, the substrate G is moved to the cassette station (C/S) 14 by the roller transport path of the return path translation transport unit 60 laid on the process route B of the return path.

在最初的顯像單元(DEV)52中,基板G是在平移搬送間實施顯像、洗滌、乾燥的一連串顯像處理。In the first developing unit (DEV) 52, the substrate G is a series of developing processes for performing development, washing, and drying between translational transports.

在顯像單元(DEV)52完成一連串的顯像處理的基板G是就那樣維持搭乘於復路平移搬送部60的滾子搬送路來依序通過熱的處理部(54,56)及檢查單元(AP)57。The substrate G that has completed a series of development processes in the developing unit (DEV) 52 maintains the roller processing path of the return path translation unit 60 to sequentially pass the heat processing unit (54, 56) and the inspection unit ( AP) 57.

在熱的處理部(54,56)中,基板G最初是在後烘烤單元(POST-BAKE)54接受後烘烤,作為顯像處理後的熱處理。藉由此後烘烤來蒸發除去在基板G上的阻劑膜所殘留的顯像液或洗淨液,強化阻劑圖案對基板G的密合性。其次,基板G是在冷卻單元(COL)56被冷卻成預定的溫度。在檢查單元(AP)57是針對基板G上的阻劑圖案進行非接觸的線寬檢查或膜質‧膜厚檢查等。In the hot processing section (54, 56), the substrate G is initially subjected to post-baking in a post-baking unit (POST-BAKE) 54 as a heat treatment after development processing. By this post-baking, the developer liquid or the cleaning liquid remaining on the resist film on the substrate G is evaporated to enhance the adhesion of the resist pattern to the substrate G. Next, the substrate G is cooled to a predetermined temperature at the cooling unit (COL) 56. The inspection unit (AP) 57 performs a non-contact line width inspection, a film quality, a film thickness inspection, and the like on the resist pattern on the substrate G.

搬出單元(OUT-PASS)58會從復路平移搬送部60接收完成全工程的處理之基板G,而交給卡匣站(C/S)14的搬送機構22。在卡匣站(C/S)14側,搬送機構22會將從搬出單元(OUT-PASS)58接收之完成處理的基板G收容於1個(通常是原來)的卡匣C。The carry-out unit (OUT-PASS) 58 receives the substrate G that has completed the processing of the entire project from the return path translation transport unit 60, and delivers it to the transport mechanism 22 of the cassette station (C/S) 14. On the side of the cassette station (C/S) 14, the transport mechanism 22 accommodates the completed substrate G received from the carry-out unit (OUT-PASS) 58 in one (usually the original) cassette C.

如上述般,此塗佈顯像處理系統10是在往路的製程路線A中鋪設:終端於阻劑塗佈單元(CT)36之前的第1往路平移搬送部46、及開始於預烘烤單元(PRE-BAKE)40之前的第2往路平移搬送部48,且在與阻劑塗佈單元(CT)36鄰接的中庭空間NS中使第1及第2減壓乾燥單元(VD)66L,66R互相對向分別設置於預定位置的同時,設置搬送裝置68。此搬送裝置68是在設於中庭空間NS的搬送區域TE內移動,可進出於兩減壓乾燥單元66L,66R、第1往路平移搬送部46的搬出單元(OUT-PASS)34、阻劑塗佈單元(CT)36及第2往路平移搬送部48的搬入單元(IN-PASS)38,可進行該等的單元與基板G的交接。As described above, the coating development processing system 10 is laid in the process route A of the forward path: the first forward translation transfer unit 46 before the resist coating unit (CT) 36, and the pre-baking unit (PRE-BAKE) 40 before the second forward translation transfer unit 48, and the first and second decompression drying units (VD) 66L, 66R in the atrium space NS adjacent to the resist application unit (CT) 36 The conveying device 68 is provided while being opposed to each other at a predetermined position. The conveying device 68 moves in the conveying area TE provided in the atrium space NS, and can enter the two decompression drying units 66L and 66R, the unloading unit (OUT-PASS) 34 of the first forward translating unit 46, and the resist coating. The transport unit (IN-PASS) 38 of the cloth unit (CT) 36 and the second forward translation transport unit 48 can perform the transfer of the units to the substrate G.

藉由該構成,在此塗佈顯像處理系統10中,第1及第2減壓乾燥單元(VD)68L,68R的佔有空間是被吸收於中庭空間NS之中,不含於兩製程路線A,B中,因此不會增加系統寬度尺寸(Y方向尺寸),可實現系統全長尺寸(X方向尺寸)的大幅度縮短化。According to this configuration, in the coating development processing system 10, the occupied spaces of the first and second decompression drying units (VD) 68L, 68R are absorbed in the atrium space NS, and are not included in the two process routes. In A and B, the system width dimension (Y-direction dimension) is not increased, and the total length of the system (X-direction dimension) can be greatly shortened.

而且,在此塗佈顯像處理系統10中,第1及第2減壓乾燥單元66L,66R是具有相同的構成‧機能,對基板G之減壓乾燥的處理內容及處理時間實質上是相同。然後,對於經由第1往路平移搬送部46依序傳送而來的基板G,在阻劑塗佈單元(CT)36剛接受阻劑塗佈處理之後,交替重複安排第1及第2減壓乾燥單元66L,66R。Further, in the coating development processing system 10, the first and second decompression drying units 66L, 66R have the same configuration and function, and the processing contents and processing time for decompressing and drying the substrate G are substantially the same. . Then, after the resist application coating unit (CT) 36 has just received the resist coating treatment on the substrate G sequentially transferred through the first forward transfer unit 46, the first and second decompression drying are alternately repeated. Units 66L, 66R.

例如,奇數個的各基板G是在阻劑塗佈單元(CT)36接受阻劑塗佈處理之後移送至第1減壓乾燥單元66L,在此接受減壓乾燥處理之後,送往第2往路平移搬送部48的搬入單元(IN-PASS)38。另一方面,偶數個的各基板G是在阻劑塗佈單元(CT)36接受阻劑塗佈處理之後移送至第2減壓乾燥單元66R,在此接受減壓乾燥處理之後,送往第2往路平移搬送部48的搬入單元(IN-PASS)38。For example, each of the odd-numbered substrates G is transferred to the first decompression drying unit 66L after the resist coating unit (CT) 36 receives the resist coating treatment, and is subjected to the vacuum drying treatment, and then sent to the second path. The carry-in unit (IN-PASS) 38 of the transport unit 48 is translated. On the other hand, an even number of the respective substrates G are transferred to the second decompression drying unit 66R after the resist coating unit (CT) 36 receives the resist coating treatment, and after receiving the vacuum drying treatment, they are sent to the first 2 The transfer unit (IN-PASS) 38 of the transfer unit 48 is moved.

因此,若第1及第2減壓乾燥單元66L,66R的1台分的工站時間設為t,則在間隔t/2的時間差來並列運轉2台之下,可將全體工站時間形成t/2。如此,1次的處理時間長的減壓乾燥單元會減半其工站時間,藉此使系統全體的工站時間律速的主要因素會消失。因此,即使曝光裝置12的處理速度高速化,或在光蝕刻微影使用半色調曝光製程,此塗佈顯像處理系統還是可充分從容地對應。Therefore, when the station time of one unit of the first and second decompression drying units 66L and 66R is t, the time difference between the first and second decompression drying units 66L and 66R is two in parallel, and the entire station time can be formed. t/2. In this way, the decompression drying unit having a long processing time of one time halved the station time, thereby causing the main factor of the station time rate of the entire system to disappear. Therefore, even if the processing speed of the exposure device 12 is speeded up, or the photo-etching lithography uses a halftone exposure process, the coating development processing system can sufficiently cope with it.

並且,在此塗佈顯像處理系統中,對於阻劑塗佈單元(CT)36的基板搬出口而言,第1及第2減壓乾燥單元66L,66R會被配置成等距離,因此從完成阻劑塗佈處理的時間點到開始減壓乾燥處理的延遲時間在奇數個的基板G與偶數個的基板G為一致也是件重要的事。亦即,來自阻劑塗佈膜之溶劑的蒸發是從剛塗佈之後就開始,一旦蒸發剛開始之後的乾燥情況有不均,則會有即使藉由其後的減壓乾燥處理或預烘烤也無法補償的情形。在此塗佈顯像處理系統,即使第1及第2減壓乾燥單元66L,66R並列運轉,全部的基板G還是會相等隔一定的延遲時間在阻劑塗佈處理後接受減壓乾燥處理,因此可使阻劑塗佈膜的膜質(安定性‧再現性)提升。Further, in the coating development processing system, the first and second decompression drying units 66L and 66R are disposed at equal distances with respect to the substrate transfer port of the resist coating unit (CT) 36. It is also important that the delay time from the completion of the resist coating treatment to the start of the vacuum drying treatment is coincident with an odd number of substrates G and an even number of substrates G. That is, the evaporation of the solvent from the resist coating film is started immediately after the coating, and once the drying is started immediately after the evaporation, there is unevenness, and there is even a drying treatment or prebaking by the subsequent vacuum drying. Bake can not compensate for the situation. When the development processing system is applied, even if the first and second decompression drying units 66L and 66R are operated in parallel, all of the substrates G are subjected to a vacuum drying treatment after the resist coating treatment with equal delay time. Therefore, the film quality (stability ‧ reproducibility) of the resist coating film can be improved.

(第2實施形態)(Second embodiment)

圖3是表示本發明的第2實施形態的塗佈顯像處理系統100的佈局構成。圖中,對於具有和上述第1實施形態的塗佈顯像處理系統10內的構成要素實質同一構成或機能的部分附上同一符號,且省略其說明。並且,在圖4~圖6中顯示此塗佈顯像處理系統100的要部的詳細佈局或構成。3 is a layout configuration of a coating development processing system 100 according to a second embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 10 of the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. Further, a detailed layout or configuration of the main part of the coating development processing system 100 is shown in FIGS. 4 to 6.

在此第2實施形態的系統100中,與上述第1實施形態的系統10相異的主要部分是被配置於中庭空間NS的第1及第2減壓乾燥單元102L,102R並非將基板固定於平台上的方式,而是構成為平移方式的減壓乾燥裝置。In the system 100 of the second embodiment, the main portion different from the system 10 of the first embodiment is the first and second decompression drying units 102L disposed in the atrium space NS, and the 102R is not fixed to the substrate. The way on the platform is a vacuum drying device that is constructed in a translational manner.

在中庭空間NS,為了在第1及第2減壓乾燥單元102L,102R以平移搬出入基板G,而設有在該等的單元102L,102R之外及中連續的第1及第2中庭平移搬送部104L,104R。然後,搬送裝置68可對第1及第2減壓乾燥單元102L,102R分別經由第1及第2中庭平移搬送部104L,104R來搬送基板G。In the atrium space NS, in order to move the first and second decompression drying units 102L and 102R into and out of the substrate G, the first and second atriums are displayed in addition to and in the units 102L and 102R. Transport units 104L, 104R. Then, the conveyance device 68 can convey the substrate G to the first and second decompression drying units 102L and 102R via the first and second atrium translation transfer units 104L and 104R, respectively.

如圖4所示,第1中庭平移搬送部104L是具有:中庭基板搬入路106,其係設於與搬送區域TE鄰接的搬入單元(IN-PASS)105內;單元內搬送路108,其係設於第1減壓乾燥單元102L內,與中庭基板搬入路106連接;中庭基板搬出路114,其係由第1減壓乾燥單元102L來看可在位於和搬入單元(IN-PASS)105相反側的升降機室(EV)110與單元內搬送路108連接,通過第1減壓乾燥單元102L的上面延伸至與搬送區域TE鄰接的搬出單元(OUT-PASS)112。As shown in FIG. 4, the first atrium translation transport unit 104L includes an atrium substrate transport path 106 that is provided in a carry-in unit (IN-PASS) 105 adjacent to the transport area TE, and an intra-unit transport path 108. The first decompression drying unit 102L is provided in the first decompression drying unit 102L, and is connected to the atrium substrate carrying path 106. The atrium substrate carrying-out path 114 is opposite to the in-loading unit (IN-PASS) 105 as viewed by the first decompression drying unit 102L. The elevator room (EV) 110 on the side is connected to the in-unit conveyance path 108, and extends through the upper surface of the first decompression drying unit 102L to a carry-out unit (OUT-PASS) 112 adjacent to the conveyance area TE.

中庭基板搬入路106、單元內搬送路108及中庭基板搬出路114是在搬送方向(X方向)以一定間隔排列棒狀或陀螺狀的滾子116而形成滾子搬送路,藉由具有馬達及傳動機構等的滾子驅動部(未圖示)來旋轉驅動各滾子116,構成可在滾子搬送路上搬送基板G。在此,可在各區間(106,108,114)具備獨立的滾子驅動部(未圖示)。The atrium substrate carrying path 106, the in-unit transfer path 108, and the atrium substrate carrying-out path 114 are rod-shaped or gyro-shaped rollers 116 arranged at regular intervals in the transport direction (X direction) to form a roller transport path, and have a motor and A roller drive unit (not shown) such as a transmission mechanism rotationally drives the rollers 116 to configure the substrate G to be transported on the roller transport path. Here, an independent roller drive unit (not shown) may be provided in each section (106, 108, 114).

並且,中庭基板搬出路114的滾子搬送路是被分割成升降機室(EV)110內的滾子搬送路114a、及第1減壓乾燥單元102L的上層的中間搬送室118內的滾子搬送路114b、及搬出單元(OUT-PASS)112內的滾子搬送路114c的3區間,可在各區間具備獨立的滾子驅動部(未圖示)。Further, the roller transport path of the atrium substrate carrying-out path 114 is divided into a roller transport path 114a in the elevator room (EV) 110 and a roller transport in the intermediate transfer chamber 118 of the upper layer of the first decompression drying unit 102L. In the three sections of the path 114b and the roller transport path 114c in the carry-out unit (OUT-PASS) 112, an independent roller drive unit (not shown) may be provided in each section.

升降機室(EV)110內的滾子搬送路114a是被安裝於可昇降移動的滾子支撐部120,可藉由例如汽缸所構成的昇降驅動部122的昇降驅動來移動於可與第1層的單元內搬送路(滾子搬送路)108連接的第1高度位置H1 、及可與第2層的中間搬送室118內的滾子搬送路114b連接的第2高度位置H2 之間。The roller transport path 114a in the elevator room (EV) 110 is attached to the roller support portion 120 that can be moved up and down, and can be moved to the first floor by the lifting drive of the elevation drive unit 122 constituted by, for example, a cylinder. The first height position H 1 connected to the in-unit conveyance path (roller conveyance path) 108 and the second height position H 2 connectable to the roller conveyance path 114b in the intermediate transfer chamber 118 of the second layer.

在將基板G搬入第1減壓乾燥單元102L時,首先,搬送裝置68會從中庭空間NS的搬送區域TE來對搬入單元(IN-PASS)105內搬入基板G。緊接著,在中庭基板搬入路106及單元內搬送路108上開始滾子搬送動作,基板G會從搬入單元(IN-PASS)105搬入至第1減壓乾燥單元102L。When the substrate G is carried into the first decompression drying unit 102L, first, the conveying device 68 carries the substrate G into the loading unit (IN-PASS) 105 from the conveying area TE of the atrium space NS. Then, the roller transport operation is started in the atrium substrate transport path 106 and the intra-cell transport path 108, and the substrate G is carried into the first decompression drying unit 102L from the carry-in unit (IN-PASS) 105.

並且,在從第1減壓乾燥單元102L搬出基板G時,首先,在滾子搬送路108,114a上進行滾子搬送動作,基板G會從第1減壓乾燥單元102L搬出至升降機室(EV)110的第1層。其次,在升降機室(EV)110內,滾子搬送路114a上昇,基板G會被移至第2層。其次,在滾子搬送路114a,114b,114c上進行滾子搬送動作,基板G會從升降機室(EV)110通過中間搬送室118來移至搬出單元(OUT-PASS)112。然後,搬送裝置68會從中庭空間NS的搬送區域TE來接受基板G,從搬出單元(OUT-PASS)112搬出。When the substrate G is carried out from the first decompression drying unit 102L, first, the roller transport operation is performed on the roller transport paths 108 and 114a, and the substrate G is carried out from the first decompression drying unit 102L to the elevator room (EV). ) The first layer of 110. Next, in the elevator room (EV) 110, the roller transport path 114a rises, and the substrate G is moved to the second layer. Next, the roller transport operation is performed on the roller transport paths 114a, 114b, and 114c, and the substrate G is moved from the elevator chamber (EV) 110 through the intermediate transfer chamber 118 to the carry-out unit (OUT-PASS) 112. Then, the transport device 68 receives the substrate G from the transport area TE of the atrium space NS, and carries it out from the carry-out unit (OUT-PASS) 112.

在圖4中,減壓乾燥單元(VD)102L是具有一體形式之減壓可能的腔室124,其係具有扁平的長方體形狀。在基板搬送方向(X方向)在腔室124的相對向的一對側壁分別設有附遮板或閘閥之可開閉的基板搬入口126及基板搬出口128。在腔室124內設有上述單元內搬送路(滾子搬送路)108。In Fig. 4, the reduced-pressure drying unit (VD) 102L is a chamber 124 having an integrated form of reduced pressure, which has a flat rectangular parallelepiped shape. In the substrate transfer direction (X direction), a pair of opposite side walls of the chamber 124 are provided with an openable and closable substrate transfer inlet 126 and a substrate transfer opening 128. The intra-unit conveyance path (roller conveyance path) 108 is provided in the chamber 124.

在此減壓乾燥單元(VD)102L具有用以上升下降的升降銷機構(未圖示),其係於腔室124內在用以搬入或搬出基板G的高度位置(滾子116上的位置)與為了減壓乾燥處理的高度位置(從滾子116浮至上方的位置)之間上升下降。The decompression drying unit (VD) 102L has a lift pin mechanism (not shown) for raising and lowering, which is at a height position (position on the roller 116) for loading or unloading the substrate G in the chamber 124. It rises and falls between the height position (the position where the roller 116 floats upward) for the vacuum drying process.

在腔室124的底壁設有1個或複數的排氣口130。該等的排氣口130是經由排氣管132來連接至真空泵134的入側。在排氣管132的途中設有開閉閥136。One or a plurality of exhaust ports 130 are provided in the bottom wall of the chamber 124. These exhaust ports 130 are connected to the inlet side of the vacuum pump 134 via the exhaust pipe 132. An opening and closing valve 136 is provided in the middle of the exhaust pipe 132.

圖5及圖6是表示搬入單元(IN-PASS)105的內部之一構成例。FIG. 5 and FIG. 6 show an example of the configuration of the inside of the loading unit (IN-PASS) 105.

在搬入單元(IN-PASS)105內,如圖5所示,空出比基板G更大的間隔來設有在搬送方向(X方向)平行延伸的一對水平框架140A,140B。在該等的水平框架140A,140B之間,空出適當的間隔來平行排列配置有複數根(圖示的例子是4根)的棒狀支撐構件142。各棒狀支撐構件142是被延伸於與搬送方向(X方向)正交的方向(Y方向)的複數根(圖示的例子是3根)的樑144所支撐。如圖6所示,樑144的兩端部是分別被固定於水平框架140A,140B的下面。In the loading unit (IN-PASS) 105, as shown in FIG. 5, a pair of horizontal frames 140A, 140B extending in parallel in the conveying direction (X direction) are provided at intervals larger than the substrate G. Between the horizontal frames 140A and 140B, a plurality of rod-shaped supporting members 142 (four in the illustrated example) are arranged in parallel at an appropriate interval. Each of the rod-shaped support members 142 is supported by a plurality of beams 144 extending in a direction (Y direction) orthogonal to the conveyance direction (X direction) (three in the illustrated example). As shown in Fig. 6, both ends of the beam 144 are fixed to the lower surfaces of the horizontal frames 140A, 140B, respectively.

在棒狀支撐構件142的上面,用以搭載支撐基板G的球狀的自由滾子146會以一定的間距來安裝多數個。On the upper surface of the rod-shaped support member 142, a plurality of spherical free rollers 146 for mounting the support substrate G are mounted at a constant pitch.

從搬入單元(IN-PASS)105的入口側來看,在水平框架140A,140B的後端部(最後部)安裝有架橋型的驅動滾子148。此驅動滾子148是在架設於水平框架140A,140B之間的旋轉軸148a隔著一定的間隔來一體固定多數的陀螺狀滾子或滾筒148b,可經由滑輪150利用旋轉驅動部152來旋轉驅動。As seen from the entrance side of the loading unit (IN-PASS) 105, a bridge type driving roller 148 is attached to the rear end portion (last portion) of the horizontal frames 140A, 140B. The drive roller 148 integrally fixes a plurality of gyro-shaped rollers or rollers 148b at a constant interval between the rotation shafts 148a spanned between the horizontal frames 140A and 140B, and can be rotationally driven by the rotation driving unit 152 via the pulleys 150. .

在水平框架140A,140B,在其長度方向隔著一定的間隔來安裝有多數的單邊支持型的驅動滾子154。該等的驅動滾子154可在水平框架140A,140B的外側經由驅動皮帶156來旋轉驅動。在此,驅動皮帶156是經由滑輪150來連接至旋轉驅動部152。In the horizontal frames 140A and 140B, a plurality of single-sided support type drive rollers 154 are attached at regular intervals in the longitudinal direction. The drive rollers 154 can be rotationally driven via the drive belt 156 on the outside of the horizontal frames 140A, 140B. Here, the drive belt 156 is connected to the rotation driving portion 152 via the pulley 150.

驅動滾子148,154及自由滾子146是構成上述中庭基板搬入路106。The driving rollers 148, 154 and the free roller 146 constitute the atrium substrate carrying path 106.

搬出單元(OUT-PASS)112內的構成亦除了搬送方向或搬送動作成相反的點以外,其餘與上述搬入單元(IN-PASS)105內的構成相同。The configuration in the carry-out unit (OUT-PASS) 112 is the same as the configuration in the carry-in unit (IN-PASS) 105 except that the transport direction or the transport operation is reversed.

又,第2減壓乾燥單元102R及第2中庭平移搬送部104R亦由阻劑塗佈單元(CT)36來看僅左右對稱配置位置相異,其餘則具有分別與上述第1減壓乾燥單元102L及第1中庭平移搬送部104L同様的構成,發揮同様的作用。Further, the second decompression drying unit 102R and the second atrium translation conveying unit 104R are also different in the left-right symmetric arrangement position by the resist coating unit (CT) 36, and the others have the first decompression drying unit separately. The configuration of the 102L and the first atrium translation transport unit 104L is the same as that of the first embodiment.

在此第2實施形態的塗佈顯像處理系統100中也是與上述第1實施形態的塗佈顯像處理系統10同様,可實現系統全長尺寸及工站時間之大幅度的縮短化。In the coating development processing system 100 of the second embodiment, as well as the coating development processing system 10 of the first embodiment, the overall length of the system and the station time can be greatly shortened.

(比較例)(Comparative example)

另外,就參考例(比較例)而言,可想像如圖7所示,在製程路線A中,於第2往路平移搬送部48的途中,亦即搬入單元(IN-PASS)38與預烘烤單元(PRE-BAKE)40之間配置第1平移式減壓乾燥單元102L,在中庭空間NS配置第2平移式減壓乾燥單元102R的佈局。Further, in the reference example (comparative example), it is conceivable that, as shown in FIG. 7, in the process route A, in the middle of the second forward translation transfer unit 48, that is, the loading unit (IN-PASS) 38 and the pre-bake The first translation type decompression drying unit 102L is disposed between the baking units (PRE-BAKE) 40, and the layout of the second translating type decompression drying unit 102R is disposed in the atrium space NS.

此情況,在製程路線A上,在第2往路平移搬送部48的搬入單元(IN-PASS)38與第1平移式減壓乾燥單元102L之間、及第1平移式減壓乾燥單元102L與預烘烤單元(PRE-BAKE)40之間分別配置有第1及第2橫向輸送機(CR-PASS)160,162。而且,夾著第2平移式減壓乾燥單元102R,且鄰接於第1及第2橫向輸送機(CR-PASS)160,162鄰接,在中庭空間NS分別配置有第3及第4橫向輸送機(CR-PASS)164,166。In this case, in the process route A, between the loading unit (IN-PASS) 38 of the second forward translation conveying unit 48 and the first translation type decompression drying unit 102L, and the first translation type decompression drying unit 102L and First and second lateral conveyors (CR-PASS) 160, 162 are disposed between the pre-baking units (PRE-BAKE) 40, respectively. Further, the second translating and drying unit 102R is interposed, and adjacent to the first and second lateral conveyors (CR-PASS) 160 and 162 are adjacent to each other, and the third and fourth lateral conveyors are disposed in the atrium space NS. (CR-PASS) 164,166.

在此,各個的橫向輸送機(CR-PASS)160~166是具有相正交的平移搬送路及搬送驅動部,可選擇性地切換平移的X方向輸送機動作與平移的Y方向輸送機動作。Here, each of the lateral conveyors (CR-PASS) 160 to 166 is a Y-direction conveyor that selectively switches between the X-direction conveyor movement and the translational movement, and has a translational transport path and a transport drive unit that are orthogonal to each other. .

例如,第1橫向輸送機(CR-PASS)160是從搬入單元(IN-PASS)38平移接收的基板G中,奇數個的基板G是就那樣直接搬入第1平移式減壓乾燥單元102L,偶數個的基板G是轉送至第3橫向輸送機(CR-PASS)164。For example, the first horizontal conveyor (CR-PASS) 160 is the substrate G that is translated and received from the loading unit (IN-PASS) 38, and the odd number of substrates G are directly carried into the first translational pressure reducing drying unit 102L. The even number of substrates G are transferred to the third lateral conveyor (CR-PASS) 164.

第3橫向輸送機(CR-PASS)164是將從第1橫向輸送機(CR-PASS)160接收的偶數個的基板G搬入至第2平移式減壓乾燥單元102R。The third lateral conveyor (CR-PASS) 164 carries an even number of substrates G received from the first lateral conveyor (CR-PASS) 160 to the second translation type vacuum drying unit 102R.

第4橫向輸送機(CR-PASS)166是搬出在第2平移式減壓乾燥單元102R完成減壓乾燥處理的偶數個的基板G,轉送至第2橫向輸送機(CR-PASS)162。The fourth lateral conveyor (CR-PASS) 166 is an even-numbered substrate G that has been subjected to the vacuum drying treatment performed by the second translational-type vacuum drying unit 102R, and is transferred to the second lateral conveyor (CR-PASS) 162.

第2橫向輸送機(CR-PASS)162是從第1平移式減壓乾燥單元102L搬出完成減壓乾燥處理的奇數個的基板G,予以送往後段的預烘烤單元(PRE-BAKE)40。並且,從第4橫向輸送機(CR-PASS)166接收減壓乾燥處理完成的偶數個的基板G,予以送往後段的預烘烤單元(PRE-BAKE)40。The second lateral conveyor (CR-PASS) 162 is an odd-numbered substrate G that has been discharged from the first translational-type decompression drying unit 102L to complete the reduced-pressure drying process, and is sent to the subsequent pre-baking unit (PRE-BAKE) 40. . Then, an even number of substrates G which have been subjected to the reduced-pressure drying process are received from the fourth lateral conveyor (CR-PASS) 166, and are sent to the pre-baking unit (PRE-BAKE) 40 of the subsequent stage.

圖7的佈局是使第1及第2平移式減壓乾燥單元102L,102R並列運轉,藉此雖可實現工站時間的縮短化,但因為在製程路線A會被插入一列2台的橫向輸送機(CR-PASS)160,162及1台的減壓乾燥單元102L,所以合倂該等3台的單元(160,102L,162)之X方向尺寸L會就那樣使製程路線A的全長增大,進而使系統的全長增大,無法實現系統全長尺寸的縮短化。並且,將在阻劑塗佈單元(CT)36完成阻劑塗佈處理的基板G送至第1平移式減壓乾燥單元102L時與送至第2平移式減壓乾燥單元102R時亦有搬送延遲時間相異的缺點。The layout of Fig. 7 is such that the first and second translating decompression drying units 102L, 102R are operated in parallel, whereby the station time can be shortened, but since the process route A is inserted into a row and two sets of lateral conveyance Since the machine (CR-PASS) 160, 162 and one unit of the reduced-pressure drying unit 102L, the X-direction dimension L of the three units (160, 102L, 162) is combined to increase the total length of the process route A. Larger, and thus the total length of the system is increased, and the overall length of the system cannot be shortened. Further, when the substrate G that has been subjected to the resist coating treatment by the resist coating unit (CT) 36 is sent to the first translation type decompression drying unit 102L, and when it is sent to the second translation type decompression drying unit 102R, it is also transported. The disadvantage of different delay times.

(第3實施形態)(Third embodiment)

圖8是表示本發明的第3實施形態的塗佈顯像處理系統170的佈局構成。圖中,對於具有和上述第1實施形態的塗佈顯像處理系統10內的構成要素實質同一構成或機能的部分附上同一符號,且省略其說明。並且,在圖9中顯示此塗佈顯像處理系統170的阻劑塗佈單元(CT)172的構成。Fig. 8 is a view showing a layout configuration of a coating development processing system 170 according to a third embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 10 of the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the configuration of the resist coating unit (CT) 172 of the coating development processing system 170 is shown in FIG.

在此第3實施形態的系統170中,與上述第1實施形態的系統10相異的主要部分是阻劑塗佈單元(CT)172並非將基板固定於平台上的方式,而是構成為平移方式的阻劑塗佈裝置,在往路的製程路線A中此阻劑塗佈單元(CT)172是沿著第1往路平移搬送部46來配置於比搬出單元(OUT-PASS)34更上游的位置。In the system 170 of the third embodiment, the main difference from the system 10 of the first embodiment is that the resist coating unit (CT) 172 is not a method of fixing the substrate to the stage, but is configured to translate. In the resist application device of the aspect, the resist application unit (CT) 172 is disposed upstream of the carry-out unit (OUT-PASS) 34 along the first forward translation transfer unit 46 in the process route A of the forward path. position.

如圖9所示,阻劑塗佈單元(CT)172是具有:塗佈用的浮上平台174,其係構成第1往路平移搬送部46的一部分或一區間;基板搬送機構176,其係將在該塗佈用浮上平台174上浮在空中的基板G搬送於浮上平台長邊方向(X方向);阻劑噴嘴178,其係對被搬送於浮上平台174上的基板G上面供給阻劑液;及噴嘴更新部180,其係於塗佈處理的空閒時間更新阻劑噴嘴178。As shown in FIG. 9, the resist coating unit (CT) 172 has a floating upper platform 174 for coating a part or a section of the first forward translation conveying unit 46, and a substrate conveying mechanism 176. The substrate G floating in the air on the coating floating platform 174 is transported in the longitudinal direction of the floating platform (X direction), and the resist nozzle 178 is supplied with a resist liquid on the substrate G conveyed on the floating platform 174; And the nozzle update unit 180 updates the resist nozzle 178 at the idle time of the coating process.

在浮上平台174的上面設有將預定的氣體(例如空氣)噴射至上方的多數個氣體噴射孔182,可藉由從該等的氣體噴射孔182所噴射的氣體壓力來使基板G從平台上面浮上於一定的高度。A plurality of gas injection holes 182 for spraying a predetermined gas (for example, air) to the upper side of the floating upper stage 174 are provided, and the substrate G can be lifted from the stage by the gas pressure ejected from the gas injection holes 182. Float to a certain height.

基板搬送機構176是具備:隔著浮上平台174來延伸為X方向的一對導軌184A,184B、及可沿著該等的導軌184A,184B來往復移動的滑塊186、及以能夠在浮上平台174上可裝卸地保持基板G的兩側端部之方式設於滑塊186的吸附墊等的基板保持構件(未圖示),藉由直進移動機構(未圖示)來使滑塊186移動於搬送方向(X方向),藉此構成可在浮上平台174上進行基板G的浮上搬送。The substrate transfer mechanism 176 includes a pair of guide rails 184A and 184B extending in the X direction via the floating platform 174, and a slider 186 that can reciprocate along the guide rails 184A and 184B, and can be placed on the floating platform. The substrate holding member (not shown) such as a suction pad of the slider 186 is detachably held at both ends of the substrate 174, and the slider 186 is moved by a linear motion mechanism (not shown). In the transport direction (X direction), the floating transport of the substrate G can be performed on the floating upper platform 174.

阻劑噴嘴178是在與搬送方向(X方向)正交的水平方向(Y方向)穿越浮上平台174的上方延伸的長形噴嘴,可在預定的塗佈位置由細縫狀的吐出口來對通過其正下方的基板G的上面帶狀地吐出阻劑液。並且,阻劑噴嘴178是可與支撐此噴嘴的噴嘴支撐構件188一體移動於X方向,且構成可升降於Z方向,可在上述塗佈位置與噴嘴更新部180之間移動。The resist nozzle 178 is an elongated nozzle that extends above the floating platform 174 in the horizontal direction (Y direction) orthogonal to the transport direction (X direction), and can be formed by a slit-shaped discharge port at a predetermined coating position. The resist liquid is discharged in a strip shape by the upper surface of the substrate G directly below. Further, the resist nozzle 178 is movable in the X direction integrally with the nozzle supporting member 188 that supports the nozzle, and is configured to be movable up and down in the Z direction, and is movable between the coating position and the nozzle updating portion 180.

噴嘴更新部180是在浮上平台174的上方的預定位置被支柱構件190所保持,具備:供以作為塗佈處理的預備,使阻劑液吐出至阻劑噴嘴178之填裝處理部192、及基於防止阻劑噴嘴178的阻劑吐出口乾燥的目的,供以保持於溶劑蒸氣的環境中之噴嘴浴室194、及供以除去附著於阻劑噴嘴178的阻劑吐出口附近的阻劑之噴嘴洗淨機構196。The nozzle updating unit 180 is held by the pillar member 190 at a predetermined position above the floating platform 174, and includes a filling processing unit 192 that supplies a resist liquid to the resist nozzle 178, and a preparation process for discharging the resist liquid. For the purpose of preventing the resist discharge port of the resist nozzle 178 from drying, the nozzle bathroom 194 held in the environment of the solvent vapor and the nozzle for removing the resist near the discharge port of the resist nozzle 178 are provided. Washing mechanism 196.

在此,說明阻劑塗佈單元(CT)172的主要作用。首先,從前段的冷卻單元(COL)32經由分類機構(未圖示)來搬入基板G至設定於浮上平台174的前端側之搬入區域,在此待機的滑塊186會保持基板G而接收。在浮上平台174上,基板G是接受由氣體噴射孔182所噴射的氣體(空氣)壓力來以大致水平的姿勢保持浮上狀態。Here, the main function of the resist coating unit (CT) 172 will be described. First, the cooling unit (COL) 32 of the preceding stage is loaded into the loading area of the front end side of the floating platform 174 via a sorting mechanism (not shown), and the standby slider 186 holds the substrate G and receives it. On the floating upper platform 174, the substrate G receives the gas (air) pressure injected from the gas injection hole 182 to maintain the floating state in a substantially horizontal posture.

而且,滑塊186會一邊保持基板G一邊移動於搬送方向(X方向),在基板G通過阻劑噴嘴178的下面時,阻劑噴嘴178會朝基板G的上面帶狀地吐出液狀的阻劑液,藉此在基板G上從基板前端往後端鋪地毯那樣在一面形成阻劑液的塗佈膜。如此被塗佈阻劑的基板G之後也藉由滑塊186在浮上平台174上被浮上搬送,從設定於浮上平台174的後端之搬出區域經由分類機構(未圖示)來送往搬出單元(OUT-PASS)34。Further, the slider 186 moves in the transport direction (X direction) while holding the substrate G, and when the substrate G passes under the resist nozzle 178, the resist nozzle 178 discharges a liquid resistance in a strip shape toward the upper surface of the substrate G. The coating liquid forms a coating film of the resist liquid on one side of the substrate G from the front end of the substrate to the rear end. The substrate G to which the resist is applied is also transported by the slider 186 on the floating platform 174, and is transported from the carry-out area set at the rear end of the floating platform 174 to the carry-out unit via a sorting mechanism (not shown). (OUT-PASS) 34.

另外,搬入側的分類機構(未圖示)是具有:被鋪設於第1往路平移搬送部46的搬送方向(X方向)之滾子搬送路、及對於此滾子搬送路上的基板可真空吸附/離脫於基板背面的緣部之複數的吸附墊、及可使該等的吸附墊與搬送方向平行移動於雙方向的基板傳送機構。一旦在平移下於該滾子搬送路上接收在上游側的冷卻單元(COL)32被冷卻成一定溫度的基板,則吸附墊會上昇而吸附於該基板的背面緣部,經由吸附保持基板的吸附墊,基板傳送機構可將基板移送至平台178的搬入區域。而且,在搬入區域搬入基板後,吸附墊會從基板分離,其次基板傳送機構及吸附墊會回到原位置。Further, the sorting mechanism (not shown) on the carry-in side has a roller transport path that is laid in the transport direction (X direction) of the first forward translation transport unit 46, and vacuum-adsorbs the substrate on the transport path of the roller. / A plurality of adsorption pads that are separated from the edge of the back surface of the substrate, and a substrate transfer mechanism that can move the adsorption pads in parallel with the transport direction in both directions. When the substrate on the upstream side of the cooling unit (COL) 32 is cooled to a constant temperature on the roller transport path, the adsorption pad rises and is adsorbed on the back edge of the substrate, and the substrate is adsorbed via the adsorption. The pad, substrate transfer mechanism can transfer the substrate to the loading area of the platform 178. Further, after the substrate is carried in the loading area, the adsorption pad is separated from the substrate, and the substrate transfer mechanism and the adsorption pad are returned to the original position.

搬出側的分類機構(未圖示)亦除了動作相反(對稱)的點以外,具有和搬入側的分類機構同様的構成‧機能。In addition to the point of the opposite (symmetric) operation, the sorting mechanism (not shown) on the carry-out side has the same function as the sorting mechanism on the carry-in side.

在此第3實施形態的塗佈顯像處理系統170中也是將第1及第2減壓乾燥單元(VD)66L,66R配置於中庭空間NS,因此不會增加系統寬度尺寸(Y方向尺寸),可實現系統全長尺寸(X方向尺寸)及工站時間的大幅度的縮短化。不過,在製程路線A上平移方式的阻劑塗佈單元(CT)172比平台方式的阻劑塗佈單元(CT)36更單元尺寸(X方向尺寸)長,該部分多少系統全長尺寸(X方向尺寸)會變長。但,另一方面,中庭空間NS的搬送裝置68是只要進出於兩減壓乾燥單元66L,66R、第1往路平移搬送部46的搬出單元(OUT-PASS)34及第2往路平移搬送部48的搬入單元(IN-PASS)38即可,不必進出於阻劑塗佈單元(CT)172。亦即,具有搬送裝置68的搬送行程上的負擔變輕的優點。In the coating development processing system 170 of the third embodiment, since the first and second decompression drying units (VD) 66L and 66R are disposed in the atrium space NS, the system width dimension (Y-direction dimension) is not increased. It can achieve a large reduction in the overall length of the system (X-direction dimension) and station time. However, the resist coating unit (CT) 172 in the translational mode on the process route A is longer than the plate-type resist coating unit (CT) 36 in unit size (X-direction dimension), and the system has a full-length system size (X). Direction size) will become longer. On the other hand, the transport device 68 of the atrium space NS is a transport unit (OUT-PASS) 34 and a second forward shift transport unit 48 that are driven by the two decompression drying units 66L, 66R, the first forward translating unit 46, and the like. The carry-in unit (IN-PASS) 38 is sufficient, and it is not necessary to enter the resist coating unit (CT) 172. That is, there is an advantage that the burden on the conveyance path of the conveyance device 68 becomes light.

另外,圖8的佈局是在製程路線A上將第1往路平移搬送部46的搬出單元(OUT-PASS)34及第2往路平移搬送部48的搬入單元(IN-PASS)38排列配置於橫方向(X方向)。In addition, the layout of FIG. 8 is arranged such that the carry-out unit (OUT-PASS) 34 of the first forward translation transfer unit 46 and the carry-in unit (IN-PASS) 38 of the second forward translation transfer unit 48 are arranged in the horizontal direction on the process route A. Direction (X direction).

但,亦可為一變形例,如圖10所示,將該搬出單元(OUT-PASS)34及該搬入單元(IN-PASS)38以兩層方式上下重疊配置之構成。此情況,第1往路平移搬送部46的搬出單元(OUT-PASS)34是與阻劑塗佈單元(CT)172同層例如排列於第1層,第2往路平移搬送部48的搬入單元(IN-PASS)38是與預烘烤單元(PRE-BAKE)40同層例如排列於第2層。However, as a modification, as shown in FIG. 10, the carry-out unit (OUT-PASS) 34 and the carry-in unit (IN-PASS) 38 may be vertically stacked in two layers. In this case, the carry-out unit (OUT-PASS) 34 of the first forward transfer conveyance unit 46 is arranged in the same layer as the resist application unit (CT) 172, for example, in the first layer, and the carry-in unit of the second forward translation transfer unit 48 ( The IN-PASS 38 is arranged in the same layer as the pre-baking unit (PRE-BAKE) 40, for example, in the second layer.

在圖10的佈局中,由於第1往路平移搬送部46的搬出單元(OUT-PASS)34與第2往路平移搬送部48的該搬入單元(IN-PASS)38是二維地集中配置於一處,因此中庭空間NS內的搬送裝置68及第1及第2減壓乾燥單元(VD)66L,66R亦可集中乃至近接配置,可使搬送裝置68的移動範圍縮小化,使移動方向(運動軸)簡素化。In the layout of FIG. 10, the carry-in unit (OUT-PASS) 34 of the first forward translation transport unit 46 and the carry-in unit (IN-PASS) 38 of the second forward translation transport unit 48 are two-dimensionally arranged in one place. Therefore, the conveying device 68 and the first and second decompression drying units (VD) 66L, 66R in the atrium space NS can be concentrated or even arranged, and the moving range of the conveying device 68 can be reduced to make the moving direction (moving). Axis) is simplified.

(第4實施形態)(Fourth embodiment)

圖11是表示本發明的第4實施形態的塗佈顯像處理系統200的佈局構成的要部。圖中,對於具有和上述第2實施形態的塗佈顯像處理系統100內的構成要素實質同一構成或機能的部分附上同一符號,且省略其說明。FIG. 11 is a main part showing a layout configuration of the coating development processing system 200 according to the fourth embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 100 of the second embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.

此實施形態也是與上述第2實施形態同様,在中庭空間NS中,搬送裝置68是可對第1及第2減壓乾燥單元102L,102R分別經由第1及第2中庭平移搬送部202L,202R來搬出入基板G。In the same manner as the above-described second embodiment, in the atrium space NS, the transport device 68 can move the first and second decompression drying units 102L and 102R via the first and second atrium translation transport units 202L and 202R, respectively. To move out of the substrate G.

在此,在搬送區域TE與第1及第2減壓乾燥單元102L,102R之間分別設有可昇降之一體形式的第1及第2搬入/搬出單元(IN/OUT-PASS)204L,204R。Here, the first and second loading/unloading units (IN/OUT-PASS) 204L, 204R are provided between the transfer area TE and the first and second decompression drying units 102L and 102R, respectively. .

如圖12~圖14所示,第1中庭平移搬送部202L是具有:分別設置於第1搬入/搬出單元(IN/OUT-PASS)204L內的下段及上段之中庭基板搬入路206及中庭基板搬出路208、及設於第1減壓乾燥單元102L內,可選擇性地連接至中庭基板搬入路206及中庭基板搬出路208的任一之單元內搬送路108。中庭基板搬入路206、中庭基板搬出路208及單元內搬送路108是例如由滾子搬送路所構成,可藉由分別獨立的滾子驅動部來驅動。As shown in FIG. 12 to FIG. 14 , the first atrium translation transport unit 202L includes lower and upper atrium substrate loading paths 206 and atrium substrates respectively provided in the first loading/unloading unit (IN/OUT-PASS) 204L. The carry-out path 208 and the first decompression drying unit 102L are selectively connected to any of the in-unit transfer path 108 of the atrium substrate carrying path 206 and the atrium substrate carrying-out path 208. The atrium substrate loading path 206, the atrium substrate carrying-out path 208, and the intra-unit conveying path 108 are constituted by, for example, a roller conveying path, and can be driven by independent roller driving units.

中庭基板搬入路206及中庭基板搬出路208是在被收容於第1搬入/搬出單元(IN/OUT-PASS)204內的狀態下,可藉由例如汽缸等所構成的昇降驅動部210的昇降驅動來昇降移動。The atrium substrate loading path 206 and the atrium substrate carrying-out path 208 are lifted and lowered by the elevating drive unit 210 including a cylinder or the like while being housed in the first loading/unloading unit (IN/OUT-PASS) 204. Drive to move up and down.

在第1減壓乾燥單元102L搬入基板G時,如圖14所示,將中庭基板搬入路206的高度位置對準單元內搬送路108,在中庭基板搬入路206及單元內搬送路108上將基板G搬送於系統長邊方向(X方向)的第1方向(從圖的右邊至左邊)。When the first decompression drying unit 102L is loaded into the substrate G, as shown in FIG. 14, the height position of the atrium substrate carrying path 206 is aligned with the intra-unit transfer path 108, and the abutment substrate carrying path 206 and the intra-unit transfer path 108 are placed. The substrate G is conveyed in the first direction (from the right side to the left side in the drawing) in the longitudinal direction (X direction) of the system.

從第1減壓乾燥單元102L搬出基板G時,如圖13所示,將中庭基板搬出路208的高度位置對準單元內搬送路108,在單元內搬送路108及中庭基板搬出路208上將基板G搬送於系統長邊方向(X方向)的第2方向(從圖的左邊到右邊)。When the substrate G is carried out from the first decompression drying unit 102L, as shown in FIG. 13, the height position of the atrium substrate carrying-out path 208 is aligned with the intra-unit transfer path 108, and the intra-unit transfer path 108 and the atrium substrate carry-out path 208 are placed. The substrate G is transported in the second direction (from the left to the right of the drawing) in the longitudinal direction (X direction) of the system.

在此塗佈顯像處理系統200中,如圖12所示,在第1減壓乾燥單元102L內基板Gi 正接受減壓乾燥處理的期間,搬送裝置68可進出於第1搬入/搬出單元(IN/OUT-PASS)204L來以搬送臂68a搬入其次的基板Gi+1 至中庭基板搬入路206。In the coating development processing system 200, as shown in FIG. 12, while the substrate G i is receiving the vacuum drying process in the first decompression drying unit 102L, the conveying device 68 can enter the first loading/unloading unit. (IN/OUT-PASS) 204L carries the next substrate G i+1 to the atrium substrate carrying path 206 by the transfer arm 68a.

然後,如圖13所示,可在中庭基板搬入路206使其次的基板Gi+1 保持待機下,將在第1減壓乾燥單元102L內完成減壓乾燥處理的基板Gi 以滾子搬送來搬出至中庭基板搬出路208。Then, 13 may be moved in a path so that the substrate 206 followed atrium G i + 1 substrates held standby, dried under reduced pressure to complete the process in the first vacuum drying unit 102L substrate G i to the transport roller Move out to the atrium substrate removal path 208.

或,亦可為別的順序,亦即將減壓乾燥處理完成的基板Gi 從第1減壓乾燥單元102L搬出至中庭基板搬出路208,同時將其次應在第1減壓乾燥單元102L接受減壓乾燥處理的基板Gi+1 搬入至中庭基板搬入路206。Alternatively, in another order, the substrate G i which has been subjected to the reduced-pressure drying treatment may be carried out from the first decompression drying unit 102L to the atrium substrate carrying-out path 208, and secondarily received by the first decompression drying unit 102L. The substrate G i+1 subjected to the pressure drying process is carried into the atrium substrate carrying path 206.

又,如圖14所示,將基板Gi+1 從中庭基板搬入路206以滾子搬送來搬入至第1減壓乾燥單元102L,同時搬送裝置68可將處理完成的基板Gi利用搬送臂68a來從中庭基板搬出路208搬出。In addition, as shown in FIG. 14, the substrate G i+1 is carried by the roller from the atrium substrate carrying path 206 to the first decompression drying unit 102L, and the transfer device 68 can use the transfer arm 68a by the processed substrate Gi. It is carried out from the atrium substrate removal path 208.

搬入/搬出單元(IN/OUT-PASS)204L的中庭基板搬入路206及中庭基板搬出路208的構成可與圖5及圖6所示者相同。The configuration of the atrium substrate loading path 206 and the atrium substrate carrying-out path 208 of the loading/unloading unit (IN/OUT-PASS) 204L can be the same as those shown in FIGS. 5 and 6 .

第2搬入/搬出單元(IN/OUT-PASS)204R及第2中庭平移搬送部202R亦具有與上述第1搬入/搬出單元(IN/OUT-PASS)204L及第1中庭平移搬送部202L同様的構成‧機能。The second loading/unloading unit (IN/OUT-PASS) 204R and the second atrium shifting and conveying unit 202R are also provided in the same manner as the first loading/unloading unit (IN/OUT-PASS) 204L and the first atrium shifting and conveying unit 202L. Composition ‧ function

在此第4實施形態中,因為在第1及第2減壓乾燥單元102L,102R中可使基板搬出口128兼用於基板搬入口126來從搬送區域TE側進行基板G的出入,所以可使中庭平移搬送部202L,202R小型化。In the fourth embodiment, the substrate transfer port 128 can be used as the substrate transfer port 126 in the first and second decompression drying units 102L and 102R, and the substrate G can be taken in and out from the transfer region TE side. The atrium translation transfer units 202L and 202R are miniaturized.

以上說明有關本發明的較佳實施形態,但本發明並非限於上述實施形態,亦可在其技術思想的範圍內實施各種的變形。The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit and scope of the invention.

例如,上述實施形態是在往路的製程路線A包含第1及第2往路平移搬送部46,48的系統中,在中庭空間NS配置以製程流程來連接該等的平移搬送部46,48之第3群的處理單元。然而,在復路的製程路線B包含第1及第2復路平移搬送部時,可在中庭空間NS配置以製程流程來連接該等2個的復路平移搬送部之第3群(或第4群)的處理單元。For example, in the above-described embodiment, in the system in which the process route A of the forward route includes the first and second forward translation transfer units 46 and 48, the translational transport unit 46, 48 is connected to the atrium space NS by a process flow. 3 groups of processing units. However, when the process route B for the re-route includes the first and second reversing translation transport units, the third group (or the fourth group) of the two reversing translation transmission units can be connected in the atrium space NS by the process flow. Processing unit.

在上述實施形態,被配置於中庭空間NS的處理單元為減壓乾燥單元,但亦可按照製程路線的配置構成來配置其他的處理單元。In the above embodiment, the processing unit disposed in the atrium space NS is a reduced-pressure drying unit, but other processing units may be disposed in accordance with the arrangement of the processing routes.

本發明的被處理基板並非限於LCD用的玻璃基板,亦可為其他的平板顯示器用基板、或半導體晶圓、CD基板、光罩、印刷基板等。The substrate to be processed of the present invention is not limited to a glass substrate for LCD, and may be another substrate for a flat panel display, a semiconductor wafer, a CD substrate, a photomask, a printed substrate, or the like.

10...塗佈顯像處理系統10. . . Coating imaging system

14...卡匣站(C/S)14. . . Card Station (C/S)

16...製程站(P/S)16. . . Process station (P/S)

18...介面站(I/F)18. . . Interface station (I/F)

22...搬送裝置twenty two. . . Transport device

34...搬出單元(OUT-PASS)34. . . Move out unit (OUT-PASS)

36...阻劑塗佈單元(CT)36. . . Resistor coating unit (CT)

38...搬入單元(IN-PASS)38. . . Move in unit (IN-PASS)

46...第1往路平移搬送部46. . . The first way to the translation transmission department

48...第2往路平移搬送部48. . . The second way translation transmission department

60...復路平移搬送部60. . . Compound path translation

62...搬送裝置62. . . Transport device

66L...第1減壓乾燥單元(VD)66L. . . First decompression drying unit (VD)

66R...第1減壓乾燥單元(VD)66R. . . First decompression drying unit (VD)

68...搬送裝置68. . . Transport device

102L...第1減壓乾燥單元(VD)102L. . . First decompression drying unit (VD)

102R...第1減壓乾燥單元(VD)102R. . . First decompression drying unit (VD)

104L...第1中庭平移搬送部104L. . . 1st atrium translation transfer section

104R...第2中庭平移搬送部104R. . . The second atrium translation transport section

105...搬入單元(IN-PASS)105. . . Move in unit (IN-PASS)

112...搬出單元(OUT-PASS)112. . . Move out unit (OUT-PASS)

172...阻劑塗佈單元(CT)172. . . Resistor coating unit (CT)

A...往路製程路線A. . . Route to the road

B...復路製程路線B. . . Reroute route

圖1是表示本發明的第1實施形態的塗佈顯像處理系統的佈局構成的平面圖。1 is a plan view showing a layout configuration of a coating development processing system according to a first embodiment of the present invention.

圖2是表示在圖1的塗佈顯像處理系統中被配置於中庭空間的減壓乾燥單元及搬送裝置以及其周圍的處理單元的詳細構成的平面圖。2 is a plan view showing a detailed configuration of a decompression drying unit and a conveying device disposed in an atrium space in the coating development processing system of FIG. 1 and a processing unit therearound.

圖3是表示第2實施形態的塗佈顯像處理系統的佈局構成的平面圖。3 is a plan view showing a layout configuration of a coating development processing system according to a second embodiment.

圖4是表示圖2的塗佈顯像處理系統的要部構成的大略側面圖。Fig. 4 is a schematic side view showing a configuration of a main part of the coating development processing system of Fig. 2;

圖5是表示圖4的搬入單元內部的構成平面圖。Fig. 5 is a plan view showing the inside of the loading unit of Fig. 4;

圖6是表示圖4的搬入單元內部的構成正面圖。Fig. 6 is a front elevational view showing the inside of the loading unit of Fig. 4;

圖7是表示比較例的系統的佈局構成平面圖。Fig. 7 is a plan view showing a layout of a system of a comparative example.

圖8是表示第3實施形態的塗佈顯像處理系統的佈局構成的平面圖。8 is a plan view showing a layout configuration of a coating development processing system according to a third embodiment.

圖9是表示圖9的塗佈顯像處理系統的阻劑塗佈單元的構成平面圖。Fig. 9 is a plan view showing the configuration of a resist coating unit of the coating development processing system of Fig. 9;

圖10是表示第3實施形態之一變形例的塗佈顯像處理系統的佈局構成的要部平面圖。FIG. 10 is a plan view of a main part showing a layout configuration of a coating development processing system according to a modification of the third embodiment.

圖11是表示第4實施形態的塗佈顯像處理系統的要部的佈局構成的平面圖。FIG. 11 is a plan view showing a layout configuration of a main part of a coating development processing system according to a fourth embodiment.

圖12是表示圖11的塗佈顯像處理系統的搬入/搬出單元及中庭平移搬送部的構成及動作的一階段的一部分剖面側面圖。FIG. 12 is a partial cross-sectional side view showing a configuration and an operation of the loading/unloading unit and the atrium shifting conveying unit of the coating development processing system of FIG. 11 .

圖13是表示圖11的塗佈顯像處理系統的搬入/搬出單元及中庭平移搬送部的構成及動作的一階段的一部分剖面側面圖。FIG. 13 is a partial cross-sectional side view showing a first stage of the configuration and operation of the loading/unloading unit and the atrium shifting conveying unit of the coating development processing system of FIG. 11 .

圖14是表示圖11的塗佈顯像處理系統的搬入/搬出單元及中庭平移搬送部的構成及動作的一階段的一部分剖面側面圖。FIG. 14 is a partial cross-sectional side view showing a configuration and an operation of the loading/unloading unit and the atrium shifting conveying unit of the coating development processing system of FIG. 11 .

10...塗佈顯像處理系統10. . . Coating imaging system

12...外部曝光裝置12. . . External exposure device

14...卡匣站(C/S)14. . . Card Station (C/S)

16...製程站(P/S)16. . . Process station (P/S)

18...介面站(I/F)18. . . Interface station (I/F)

20...卡匣平台20. . . Card platform

22...搬送裝置twenty two. . . Transport device

22a...搬送臂22a. . . Transport arm

24...搬入單元(IN-PASS)twenty four. . . Move in unit (IN-PASS)

26...準分子UV照射單元(E-UV)26. . . Excimer UV irradiation unit (E-UV)

28...刷子洗淨(Scrubber)單元(SCR)28. . . Brush Scrubber Unit (SCR)

30...附著(adhesion)單元(AD)30. . . Adhesion unit (AD)

32...冷卻單元(COL)32. . . Cooling unit (COL)

34...搬出單元(OUT-PASS)34. . . Move out unit (OUT-PASS)

36...阻劑塗佈單元(CT)36. . . Resistor coating unit (CT)

38...搬入單元(IN-PASS)38. . . Move in unit (IN-PASS)

40...預烘烤單元(PRE-BAKE)40. . . Pre-baking unit (PRE-BAKE)

42...冷卻單元(COL)42. . . Cooling unit (COL)

44...搬出單元(OUT-PASS)44. . . Move out unit (OUT-PASS)

46...第1往路平移搬送部46. . . The first way to the translation transmission department

48...第2往路平移搬送部48. . . The second way translation transmission department

50...周邊裝置(TITLER/EE)50. . . Peripheral device (TITLER/EE)

52...顯像單元(DEV)52. . . Imaging unit (DEV)

54...後烘烤單元(POST-BAKE)54. . . Post-baking unit (POST-BAKE)

56...冷卻單元(COL)56. . . Cooling unit (COL)

57...檢查單元(AP)57. . . Inspection unit (AP)

58...搬出單元(OUT-PASS)58. . . Move out unit (OUT-PASS)

60...復路平移搬送部60. . . Compound path translation

62...搬送裝置62. . . Transport device

64...旋轉平台(R/S)64. . . Rotating platform (R/S)

66L...第1減壓乾燥單元(VD)66L. . . First decompression drying unit (VD)

66R...第1減壓乾燥單元(VD)66R. . . First decompression drying unit (VD)

68...搬送裝置68. . . Transport device

110...升降機室(EV)110. . . Lift room (EV)

A...往路製程路線A. . . Route to the road

B...復路製程路線B. . . Reroute route

C...卡匣C. . . Card

G...基板G. . . Substrate

Claims (16)

一種處理系統,係依製程流程的順序來連接複數的處理單元,而對被處理基板實施一連串的處理之串聯型的處理系統,其特徵係具有:第1製程路線,其係於系統長邊方向中在第1方向包含:使第1群的處理單元相鄰,或經由搬送系單元來配置成一列,平移搬送基板的第1往路平移搬送部、及在比該第1往路平移搬送部更製程流程的下游側平移搬送基板的第2往路平移搬送部;第2製程路線,其係於系統長邊方向中在與前述第1方向相反的第2方向,使位於比前述第1製程路線更製程流程的下游側之第2群的處理單元相鄰,或經由搬送系單元來配列成一列,在系統寬度方向與前述第1製程路線空出預定尺寸的中庭空間來平行延伸;第3群的處理單元,其係配置於前述中庭空間;及第1搬送裝置,其係配置於前述中庭空間,從前述第1往路平移搬送部的終端側的基板交接部搬出各基板,而搬送至前述第3群的處理單元之一,將在前述第3群的處理單元之一完成處理的各基板從該處理單元搬出,而搬入至前述第2往路平移搬送部的始端側的基板交接部。A processing system is a series processing system that performs a series of processing on a substrate to be processed according to a sequence of process flows, and has a feature of the first process route, which is in the longitudinal direction of the system. The first direction includes: arranging the processing units of the first group adjacent to each other, or arranging them in a row via the transport unit, translating the first forward translation transport unit of the substrate, and processing more than the first forward transfer unit The downstream side of the flow translates the second forward translation transfer unit of the transport substrate; the second process route is in a second direction opposite to the first direction in the longitudinal direction of the system, and is located in a process longer than the first process route. The processing units of the second group on the downstream side of the flow are adjacent to each other or arranged in a row via the transport system unit, and extend in parallel with the atrium space of a predetermined size in the system width direction and the first process route; the processing of the third group a unit disposed in the atrium space; and a first conveying device disposed in the atrium space, and a substrate transfer from a terminal side of the first forward translation transfer unit One of the processing units of the third group is transported out of the respective substrates, and each of the substrates that have been processed in one of the processing units of the third group is carried out from the processing unit, and is carried into the second forward translation and transport unit. The substrate transfer portion on the start side. 如申請專利範圍第1項之處理系統,其中,前述第3群的處理單元係包含對基板之處理的內容及時間實質上相同的第1及第2處理單元,經由前述第1往路平移搬送部來對連續不斷送來的基板交替重複安排前述第1及第2處理單元。The processing system of the third aspect of the invention, wherein the processing unit of the third group includes first and second processing units having substantially the same content and time of processing of the substrate, and the first forward translation transmission unit The first and second processing units are alternately arranged alternately for the continuously fed substrates. 如申請專利範圍第2項之處理系統,其中,前述第1搬送裝置具有可在設於前述中庭空間的搬送區域內移動的搬送機器人,前述第1及第2處理單元係於系統長邊方向,之間夾著前述搬送區域來彼此相向配置於前述中庭空間。The processing system of the second aspect of the invention, wherein the first conveying device has a transport robot movable in a transport area provided in the atrium space, wherein the first and second processing units are in a longitudinal direction of the system. The transport area is interposed therebetween so as to face each other in the atrium space. 如申請專利範圍第3項之處理系統,其中,前述第1及第2處理單元係與前述搬送區域鄰接配置,前述搬送機器人係對前述第1及第2處理單元直接搬出入基板。The processing system of claim 3, wherein the first and second processing units are disposed adjacent to the transporting region, and the transport robot directly carries the first and second processing units into and out of the substrate. 如申請專利範圍第3項之處理系統,其中,在前述中庭空間,為了對前述第1處理單元搬出入基板,而設有在前述第1處理單元之外及中連續的第1中庭平移搬送部,前述搬送機器人係對前述第1處理單元經由前述第1中庭平移搬送部來搬出入基板。The processing system of the third aspect of the invention, wherein the first atrium translation transfer unit is provided in addition to the first processing unit and in the middle of the first processing unit in the atrium space. The transport robot carries the first processing unit into and out of the substrate via the first atrium translation transport unit. 如申請專利範圍第5項之處理系統,其中,前述第1中庭平移搬送部係具有:第1中庭基板搬入路,其係與前述搬送區域鄰接設置;第1單元內搬送路,其係設於前述第1處理單元內,可與前述第1中庭基板搬入路連接;及第1中庭基板搬出路,其係由前述第1處理單元來看可在與前述第1中庭基板搬入路相反的側與前述第1單元內搬送路連接,通過前述第1處理單元之上或下延伸至與前述搬送區域鄰接的終端位置,在對前述第1處理單元搬入基板時,係於前述第1中庭基板搬入路及前述第1單元內搬送路上搬送基板,在從前述第1處理單元搬出基板時,係於前述第1單元內搬送路及前述第1中庭基板搬出路上搬送基板。The processing system of the fifth aspect of the invention, wherein the first atrium translation transfer unit has a first atrium substrate carrying path provided adjacent to the transfer area, and a first unit inner transfer path is provided in the first unit transfer path. The first processing unit may be connected to the first atrium substrate carrying path; and the first atrium substrate carrying out path may be viewed from the first processing unit on a side opposite to the first atrium substrate carrying path. The first unit inner transfer path is connected to the first processing unit, and the first processing unit is extended to the end position adjacent to the transfer area, and the first apron substrate is moved in when the substrate is loaded into the first processing unit. The substrate is transported on the transport path in the first unit, and when the substrate is carried out from the first processing unit, the substrate is transported on the first intra-cell transfer path and the first atrium substrate carry-out path. 如申請專利範圍第5項之處理系統,其中,前述第1中庭平移搬送部係具有:與前述搬送區域鄰接而設成上下2段之可昇降的第1中庭基板搬入路及第1中庭基板搬出路、及設於前述第1處理單元內,可選擇性地連接至前述第1中庭基板搬入路及前述第1中庭基板搬出路的任一之第1單元內搬送路,在對前述第1處理單元搬入基板時,係使前述第1中庭基板搬入路的高度位置對準前述第1單元內搬送路,在前述第1中庭基板搬入路及前述第1單元內搬送路上,將基板搬送於系統長邊方向的第1方向,在從前述第1處理單元搬出基板時,係使前述第1中庭基板搬出路的高度位置對準前述第1單元內搬送路,在前述第1單元內搬送路及前述第1中庭基板搬出路上,將基板搬送於系統長邊方向的第2方向。The processing system of the fifth aspect of the present invention, wherein the first atrium translation transfer unit has a first atrium substrate carrying path and a first atrium substrate carrying out that are vertically movable up and down in parallel with the transfer area. The first unit processing unit is selectively connected to the first intra-substrate substrate carrying path and the first intra-substrate substrate carrying-out path in the first processing unit, and the first processing is performed on the first processing unit. When the unit is carried into the substrate, the height of the first atrium substrate is in alignment with the first intra-unit transfer path, and the substrate is transported to the system in the first abutment substrate transfer path and the first intra-cell transfer path. In the first direction in the lateral direction, when the substrate is carried out from the first processing unit, the height position of the first atrium substrate carrying-out path is aligned with the first unit inner conveying path, and the first unit inner conveying path and the aforementioned The first atrium substrate is carried out on the road, and the substrate is transported in the second direction in the longitudinal direction of the system. 如申請專利範圍第3、5~7項中任一項所記載之處理系統,其中,在前述中庭空間,為了對前述第2處理單元搬出入基板,而設有在前述第2處理單元之外及中連續的第2中庭平移搬送部,前述搬送機器人係對前述第2處理單元經由前述第2中庭平移搬送部來搬出入基板。The processing system according to any one of the third to fifth aspect, wherein the atrium space is provided outside the second processing unit in order to carry in and out the substrate to the second processing unit. In the second intermediate atrium translation transport unit, the transport robot carries the second processing unit into and out of the substrate via the second atrium translation transport unit. 如申請專利範圍第8項之處理系統,其中,前述第2中庭平移搬送部係具有:第2中庭基板搬入路,其係與前述搬送區域鄰接設置;第2單元内搬送路,其係設於前述第2處理單元内,可與前述第2中庭基板搬入路連接;及第2中庭基板搬出路,其係由前述第2處理單元來看可在與前述第2中庭基板搬入路相反的側與前述第2單元内搬送路連接,通過前述第2處理單元之上或下延伸至與前述搬送區域鄰接的終端位置,在對前述第2處理單元搬入基板時,係於前述第2中庭基板搬入路及前述第2單元内搬送路上搬送基板,在從前述第2處理單元搬出基板時,係於前述第2單元内搬送路及前述第2中庭基板搬出路上搬送基板。The processing system of the eighth aspect of the invention, wherein the second atrium translation transfer unit has a second atrium substrate loading path provided adjacent to the transfer area, and a second unit inner transfer path provided in the second unit transfer path The second processing unit may be connected to the second atrium substrate carrying path; and the second atrium substrate carrying out path may be viewed from the second processing unit on a side opposite to the second atrium substrate carrying path. The second unit inner transfer path is connected to the second processing unit, and the second processing unit is extended to the end position adjacent to the transfer area, and is moved to the second processing unit to move the substrate into the second atrium substrate. The substrate is transported on the transport path in the second unit, and when the substrate is carried out from the second processing unit, the substrate is transported on the second unit inner transport path and the second atrium substrate transport path. 如申請專利範圍第8項之處理系統,其中,前述第2中庭平移搬送部係具有:與前述搬送區域鄰接而設成上下2段之可昇降的第2中庭基板搬入路及第2中庭基板搬出路、及設於前述第2處理單元内,可選擇性地連接至前述第2中庭基板搬入路及前述第2中庭基板搬出路的任一之第2單元内搬送路,在對前述第2處理單元搬入基板時,係使前述第2中庭基板搬入路的高度位置對準前述第2單元内搬送路,在前述第2中庭基板搬入路及前述第2單元內搬送路上,將基板搬送於系統長邊方向的第2方向,在從前述第2處理單元搬出基板時,係使前述第2中庭基板搬出路的高度位置對準前述第2單元內搬送路,在前述第2單元內搬送路及前述第2中庭基板搬出路上,將基板搬送於系統長邊方向的第1方向。The processing system of the eighth aspect of the present invention, wherein the second atrium translation transport unit has a second atrium substrate carrying path and a second atrium substrate carrying out that are movable up and down in parallel with the transfer area. The second unit processing unit is selectively connected to the second intra-substrate substrate carrying path and the second intra-substrate substrate carrying-out path in the second processing unit, and the second processing is performed on the second processing When the unit is loaded into the substrate, the height of the second atrium substrate carrying path is aligned with the second intra-cell transfer path, and the substrate is transported to the system length on the second atrium substrate transfer path and the second intra-cell transfer path. In the second direction in the lateral direction, when the substrate is carried out from the second processing unit, the height position of the second atrium substrate carrying-out path is aligned with the second intra-cell transfer path, and the second unit inner transfer path and the aforementioned The second atrium substrate is carried out on the road, and the substrate is transported in the first direction in the longitudinal direction of the system. 如申請專利範圍第1~7項中任一項所記載之處理系統,其中,在前述第1製程路線中,在前述第1往路平移搬送部的終端側的基板交接部與前述第2往路平移搬送部的始端側的基板交接部之間配置有第3處理單元,前述第1搬送裝置係對前述第3處理單元進行基板的搬出入。The processing system according to any one of the first to seventh aspect, wherein the substrate transfer portion on the terminal side of the first forward translation transfer unit and the second forward path are shifted in the first process route A third processing unit is disposed between the substrate delivery portions on the start side of the transport unit, and the first transport device carries in and out the substrate to the third processing unit. 如申請專利範圍第11項之處理系統,其中,前述第3處理單元為在前述基板上塗佈阻劑液的阻劑塗佈單元,前述第1及第2處理單元為分別使基板上的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元,對前述阻劑塗佈單元的基板搬出口而言,前述第1及第2減壓乾燥單元的基板搬入口為大致等距離位置。The processing system of claim 11, wherein the third processing unit is a resist coating unit that applies a resist liquid on the substrate, and the first and second processing units respectively block the substrate The first and second decompression drying units which are dried under reduced pressure, and the substrate transfer ports of the first and second decompression drying units are substantially the substrate transfer ports of the resist application unit. Isometric location. 如申請專利範圍第11項之處理系統,其中,在前述第1製程路線中,在前述第1往路平移搬送部的搬送路上,設有在前述基板上塗佈阻劑液的阻劑塗佈單元,前述第1及第2處理單元為分別使基板上的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元,對前述第1往路平移搬送部的終端側的基板交接部而言,前述第1及第2減壓乾燥單元的基板搬入口為大致等距離位置。The processing system of claim 11, wherein in the first process route, a resist coating unit that applies a resist liquid on the substrate is provided on a transfer path of the first forward transfer transfer unit The first and second processing units are first and second decompression drying units that dry the resist coating film on the substrate under reduced pressure, and transfer the substrate to the terminal side of the first forward translation transfer unit. In the first embodiment, the substrate loading ports of the first and second decompression drying units are substantially equidistant positions. 一種處理系統,係依製程流程的順序來連接複數的處理單元,而對被處理基板實施一連串的處理之串聯型的處理系統,其特徵係具有:第1製程路線,其係於系統長邊方向中在第1方向,使第1群的處理單元相鄰,或經由搬送系單元來配置成一列而成,第2製程路線,其係於系統長邊方向中與前述第1方向相反的第2方向包含:使位於比前述第1製程路線更製程流程的下游側之第2群的處理單元相鄰,或經由搬送系單元來配列成一列,平移搬送基板的第1復路平移搬送部、及在比該第1復路平移搬送部更製程流程的下游側平移搬送基板的第2復路平移搬送部,在系統寬度方向與前述第1製程路線空出預定尺寸的中庭空間來平行延伸;第3群的處理單元,其係配置於前述中庭空間;及第1搬送裝置,其係配置於前述中庭空間,從前述第1復路平移搬送部的終端側的基板交接部搬出各基板,而搬送至前述第3群的處理單元之一,將在前述第3群的處理單元之一完成處理的各基板從該處理單元搬出,而搬入至前述第2復路平移搬送部的始端側的基板交接部。A processing system is a series processing system that performs a series of processing on a substrate to be processed according to a sequence of process flows, and has a feature of the first process route, which is in the longitudinal direction of the system. In the first direction, the processing units of the first group are adjacent to each other or arranged in a row via the transport unit, and the second process route is the second opposite to the first direction in the longitudinal direction of the system. The direction includes: positioning the processing unit located in the second group on the downstream side of the process flow of the first process route, or arranging them in a row via the transport system unit, and translating the first complex translation transfer unit of the substrate, and The second return-transfer transporting portion of the downstream transfer-transporting substrate is further parallel to the first process route in the system width direction in the system width direction, and the third group of the third-group translational transport unit a processing unit disposed in the atrium space; and a first conveying device disposed in the atrium space, and a substrate from a terminal side of the first reversing translation transfer unit The unit transports each of the substrates and transports them to one of the processing units of the third group, and the substrates that have been processed in one of the processing units of the third group are carried out from the processing unit, and are carried into the second reversing translation unit. The substrate transfer portion on the start side. 如申請專利範圍第1~7、14項中任一項所記載之處理系統,其中,具有第2搬送裝置,其係於系統長邊方向的一端部,從被投入系統的任一卡匣取出未處理的基板來交給前述第1製程路線,從前述第2製程路線接收系統內的所要處理全部完成的基板,而收納於應從系統逐出的任一卡匣。The processing system according to any one of the first to seventh aspects of the present invention, wherein the second conveying device is attached to one end of the system in the longitudinal direction and is taken out from any of the cassettes of the system. The unprocessed substrate is delivered to the first process route, and the completed substrate in the system is received from the second process route and stored in any cassette that should be ejected from the system. 如申請專利範圍第1~7、14項中任一項所記載之處理系統,其中,具有第3搬送裝置,其係於系統長邊方向的他端部,從前述第1製程路線搬出基板,而直接搬入前述第2製程路線,或使經由外部的處理裝置之後搬入前述第2製程路線。The processing system according to any one of the first to seventh aspect, wherein the third transfer device is attached to the substrate at the end portion in the longitudinal direction of the system, and the substrate is carried out from the first process route. On the other hand, the second process route is directly carried in, or the second process route is carried in via the external processing device.
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