WO2016199689A1

WO2016199689A1 - Substrate treatment apparatus

Info

Publication number: WO2016199689A1
Application number: PCT/JP2016/066558
Authority: WO
Inventors: 実戸島; 貴浩平子; 北斗稲
Original assignee: シャープ株式会社
Priority date: 2015-06-11
Filing date: 2016-06-03
Publication date: 2016-12-15

Abstract

A reduced-pressure drying apparatus (substrate treatment apparatus) (40) is provided with: a treatment chamber (41) for treating a mother glass substrate (substrate) (MG) by housing the mother glass substrate (MG); a supporting pin (45) for supporting the mother glass substrate (MG) in the treatment chamber (41), said supporting pin (45) having a rotatably supporting section (46) that rotatably supports the mother glass substrate (MG); and a swinging section (47) that swings the mother glass substrate (MG) along the substrate surface, said mother glass substrate being supported by the rotatably supporting section (46) in the treatment chamber (41).

Description

Substrate processing equipment

The present invention relates to a substrate processing apparatus.

Conventionally, when manufacturing a liquid crystal panel which is a main component of a liquid crystal display device, a conductive film or an insulating film is formed on the surface of a glass substrate by a photolithography method and patterned. In forming a conductive film or an insulating film on a substrate, a reduced pressure drying apparatus for performing a reduced pressure drying process for drying a photoresist applied to the surface of the substrate is used, and an example thereof is Patent Document 1 below. It is described in. A vacuum drying apparatus described in Patent Document 1 includes a chamber that accommodates a substrate to be processed, a decompression unit that decompresses the inside of the chamber, a plurality of lift pins that are arranged in the chamber and support the substrate to be processed from below, and lift pins Lift pin lifting means for lifting and lowering the lift pins in each group independently as a group unit, and substrate temperature range detection means for detecting the temperature of the substrate that changes with the decompression drying process by dividing it into a predetermined temperature range And, for each lift pin in the group, lift pin temperature adjusting means for setting a contact portion of the pin with the substrate to a predetermined temperature included in the temperature range detected by the substrate temperature range detecting means, and driving of the lift pin lifting means Control means for performing control.

JP 2009-295817 A

(Problems to be solved by the invention)
According to Patent Document 1 described above, switching control is performed so that the lift pin becomes a pin adjusted to a temperature approximate to the substrate temperature, and the contact location between the lift pin and the substrate is switched in accordance with the switching. . However, since the lift pins adjusted to a constant temperature are continuously supported for a certain time with respect to the same portion of the substrate to be processed until switching is performed, the atmospheric pressure and the substrate temperature in the chamber are not changed during that time. When the time changes, the pin mark may be transferred to the lift pin support position. That is, although the technique described in Patent Document 1 can suppress the transfer of pin marks to some extent, it is not always sufficient.

Further, in Patent Document 1, a lift pin temperature adjusting means for adjusting a plurality of lift pins to different temperatures is required, and a lift mechanism for controlling the lift pins to move up and down at a predetermined timing is required. However, it tends to be complicated and expensive.

The present invention has been completed based on the above circumstances, and an object thereof is to sufficiently suppress the occurrence of transfer unevenness.

(Means for solving the problem)
The substrate processing apparatus of the present invention includes a processing chamber for storing a substrate and processing the substrate, and a support pin for supporting the substrate in the processing chamber, and supports the substrate in a rotatable form. And a support pin having a rotation support portion for rotating, and a swinging portion for swinging the substrate supported by the rotation support portion along the plate surface in the processing chamber.

With this configuration, the substrate accommodated in the processing chamber is processed while being supported by the rotation support portion of the support pin. When this processing is performed, the substrate is swung along the plate surface by the swinging portion, and the rotation support portion is rotated in accordance with the swinging. At this time, since the support part with respect to the board | substrate by a rotation support part is displaced continuously, it can avoid fixing the support part like the past. This makes it difficult for the traces of the support pins to be transferred to the substrate, and thus the occurrence of uneven transfer of the support pins is sufficiently suppressed. Moreover, it requires a complicated structure such as a conventional support pin temperature adjusting means for adjusting a plurality of support pins to different temperatures and a lift mechanism for individually driving the support pins adjusted to different temperatures, and complicated control related thereto. Compared with a product, the structure is simplified and the cost is reduced.

The following configuration is preferable as an embodiment of the present invention.
(1) The swinging portion contacts the end surface of the substrate and swings the substrate. In this way, as compared with the case where the swinging portion is in contact with the plate surface of the substrate to swing the substrate, a mechanism for holding the substrate becomes unnecessary, and the structure is simplified and the cost is reduced. It becomes more suitable above. Further, the force for swinging the substrate along the plate surface from the swinging portion is efficiently transmitted to the substrate.

(2) A transport unit that linearly transports the substrate along the plate surface thereof in order to move the substrate into and out of the processing chamber, and the swing unit is configured to transfer the substrate by the transport unit. A plurality are arranged so as to be sandwiched from both sides with respect to the transport direction of the substrate. In this way, when the substrate is transported by the transport unit, it is possible to avoid the swinging unit from interfering with the transport. As a result, the substrate can be transported smoothly, which is suitable for shortening the tact time.

(3) Processing a display panel having a display area on which an image is displayed and a non-display area surrounding the display area as the substrate, and the swinging portion is a plate surface of the substrate The substrate is swung in contact with the non-display area. In this way, the end of the substrate is less likely to be damaged by the force acting on the substrate as it swings, compared to the case where the swinging portion abuts against the end surface of the substrate and swings the substrate. . Moreover, even if there is uneven transfer of the swinging part due to the contact at the place where the swinging part is in contact with the plate surface of the substrate, the display is made in the display area of the display panel constituted by the substrate. It is difficult for a situation that adversely affects the image to be generated.

(4) The rotation support unit includes a main rotating sphere in contact with the substrate, a plurality of sub rotating spheres arranged along a peripheral surface of the main rotating sphere and rotating in accordance with the rotation of the main rotating sphere, And a rotating sphere housing portion that houses the rotating sphere and the auxiliary rotating sphere. In this way, the main rotating sphere in contact with the substrate rotates smoothly as the plurality of sub-rotating spheres arranged along the peripheral surface rotate, and the support location for the substrate swung by the swinging portion is smooth. Is displaced. Compared to the case where the rotation support portion is configured by a roller having a rotation shaft, the degree of freedom related to the rotation direction of the main rotating sphere is high, so that the support location with respect to the substrate can be displaced more freely, thereby causing uneven transfer. It becomes harder to occur.

(5) A decompression unit for decompressing the processing chamber is provided. In this way, the substrate can be subjected to a reduced pressure drying process by reducing the pressure in the processing chamber by the pressure reducing unit. Here, when the substrate is fixedly supported by the support pins for a certain period of time as in the conventional case, a difference in drying speed occurs between the support portion by the support pin and the non-support portion in the substrate, and the trace of the support pin. There is a concern that transfer unevenness may occur. In that respect, as described above, the support portion on the substrate is avoided from being fixed by swinging the substrate along the plate surface by the swing portion and rotating the rotation support portion accordingly. The drying speed of the substrate is made uniform in the plate surface, and the occurrence of uneven transfer is sufficiently suppressed.

(The invention's effect)
According to the present invention, the occurrence of transfer unevenness can be sufficiently suppressed.

1 is a schematic cross-sectional view showing a cross-sectional configuration of a liquid crystal panel according to Embodiment 1 of the present invention. The enlarged plan view which shows the plane structure in the display area of the array substrate which comprises a liquid crystal panel The enlarged plan view which shows the plane structure in the display area of CF substrate which comprises a liquid crystal panel Enlarged sectional view along line iv-iv in FIG. Side sectional view of the vacuum drying apparatus with the substrate placed outside the processing chamber Plan sectional view of the vacuum drying apparatus with the substrate placed outside the processing chamber Front sectional view of the vacuum drying apparatus with the substrate placed outside the processing chamber The perspective view which shows the rotation support part vicinity of a support pin Cross section of support pins and substrate Side sectional view of the vacuum drying apparatus with the substrate placed in the processing chamber Plan sectional view of the vacuum drying apparatus with the substrate placed in the processing chamber Front sectional view of the vacuum drying apparatus with the substrate placed in the processing chamber Side sectional view of the vacuum drying apparatus with the substrate lifted by the support pins Front sectional view of vacuum drying device with substrate lifted by support pins Side cross-sectional view of the vacuum drying apparatus with the transfer arm part out of the processing chamber and the gate part closed. Flat cross-sectional view of the vacuum drying apparatus with the transfer arm part out of the processing chamber and the gate part closed Front sectional view of the reduced pressure drying apparatus with the transfer arm part out of the processing chamber Plan sectional view showing the operation of swinging the substrate by the swing part Front sectional view showing operation of swinging substrate by swinging part Plan sectional drawing of the reduced pressure drying apparatus of the state which the board | substrate which concerns on Embodiment 2 of this invention has been arranged in the processing chamber Front sectional view showing operation of swinging substrate by swinging part Side sectional view of a reduced-pressure drying apparatus in a state where a substrate according to Embodiment 3 of the present invention is arranged outside the processing chamber Side sectional view of the vacuum drying apparatus with the substrate placed in the processing chamber Side sectional view of the vacuum drying device with the substrate lifted by the support pins and the gate portion closed. Side sectional view of the vacuum drying apparatus with the gate portion opened and the substrate disposed outside the processing chamber Sectional drawing which shows operation | movement by which a rotation support part is rotated in connection with rocking | fluctuating a board | substrate by the rocking | swiveling part which concerns on Embodiment 4 of this invention. Plan sectional drawing which shows the operation | movement which rock | fluctuates a board | substrate by the rocking | swiveling part which concerns on Embodiment 5 of this invention. Side sectional view of the vacuum drying apparatus in a state where the substrate is lifted by the support pins and the swinging portion is in contact with the substrate. Plan sectional drawing which shows the operation | movement which rock | fluctuates a board | substrate by the rocking | swiveling part which concerns on Embodiment 6 of this invention. Plan sectional drawing which shows the operation | movement which rock | fluctuates a board | substrate by the rocking | swiveling part which concerns on Embodiment 7 of this invention.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a vacuum drying apparatus (substrate processing apparatus) 40 used for manufacturing the

substrates

20 and 21 in the liquid crystal panel (display panel) 11 constituting the liquid crystal display apparatus will be exemplified. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing.

First, the configuration of the liquid crystal panel 11 will be described. As shown in FIG. 1, the liquid crystal panel 11 is formed by enclosing a liquid crystal layer 22 containing a liquid crystal material that is a substance whose optical characteristics change with application of an electric field between a pair of

substrates

20 and 21. Of the two

substrates

20 and 21 constituting the liquid crystal panel 11, the one disposed on the back side (backlight device side) is the array substrate (active matrix substrate, TFT substrate) 20, and is disposed on the front side (light emitting side). The substrate is a CF substrate (counter substrate) 21. Each of the array substrate 20 and the CF substrate 21 is formed by sequentially laminating a predetermined film (structure) on the inner surface side of a substantially transparent (translucent) glass substrate GS by a known photolithography method. It is said. The array substrate 20 and the CF substrate 21 are divided into a display area (active area) AA in which an image is displayed and a non-display area (non-active area) NAA that surrounds the display area AA and does not display an image ( (See FIG. 6). Note that a pair of front and back polarizing plates 23 are respectively attached to the outer surface sides of both the

substrates

20 and 21.

As shown in FIG. 2, on the inner surface side of the glass substrate GS constituting the array substrate 20 (the liquid crystal layer 22 side, the surface facing the CF substrate 21), a TFT which is a switching element having three electrodes 24a to 24c. (Thin Film Transistor) 24 and a large number of pixel electrodes 25 are provided side by side. Around these TFTs 24 and pixel electrodes 25, a gate wiring (metal film) 26 and a source wiring (metal film) 27 are formed in a lattice shape. It is arranged so as to surround it. The pixel electrode 25 is made of a transparent conductive film such as ITO (Indium Tin Oxide). Both the gate wiring 26 and the source wiring 27 are made of a metal film containing copper (Cu) or aluminum (Al) as a metal material, and are patterned on the glass substrate GS. The gate wiring 26 is disposed on the lower layer side (glass substrate GS side), while the source wiring 27 is disposed on the upper layer side. A gate insulating film 35, which will be described later, is interposed between both the

wirings

26 and 27, so that both the

wirings

26 and 27 are kept insulated from each other at the intersection to prevent leakage (short circuit, short circuit). Has been. The gate wiring 26 and the source wiring 27 are connected to the gate electrode 24a and the source electrode 24b of the TFT 24, respectively, and the pixel electrode 25 is connected to the drain electrode 24c of the TFT 24 via the drain wiring 34. The drain wiring 34 is made of a metal film containing copper or aluminum as a metal material, like the source wiring 27, and is patterned on the glass substrate GS in the same layer (layer) as the source wiring 27 in the same process.

On the array substrate 20, as shown in FIG. 2, capacity wiring (auxiliary capacity wiring, storage capacity wiring, Cs wiring, metal film) 33 that is parallel to the gate wiring 26 and overlaps the pixel electrode 25 in plan view. Is provided. The capacitor wiring 33 is arranged alternately with the gate wiring 26 in the Y-axis direction, and is made of a metal film containing copper or aluminum as a metal material in the same process as the gate wiring 26 in the same process. Patterned on the glass substrate GS. The gate wiring 26 is disposed between the pixel electrodes 25 adjacent to each other in the Y-axis direction, whereas the capacitor wiring 33 is disposed at a position that substantially crosses the central portion of each pixel electrode 25 in the Y-axis direction. The end portion of the array substrate 20 is provided with a terminal portion routed from the gate wiring 26 and the capacitor wiring 33 and a terminal portion routed from the source wiring 27. Each signal or reference potential is input from an external circuit that is not to be operated, and the drive of the TFT 24 is thereby controlled. An alignment film 28 for aligning liquid crystal molecules contained in the liquid crystal layer 22 is formed on the inner surface side of the array substrate 20 (FIG. 1).

On the other hand, on the inner surface side (the liquid crystal layer 22 side, the surface facing the array substrate 20) of the glass substrate GS constituting the CF substrate 21, as shown in FIGS. 1 and 3, each pixel electrode on the array substrate 20 side is provided. A large number of color filters are arranged side by side at a position overlapping 25 with a plan view. In the color filter, the colored portions 29 exhibiting R (red), G (green), and B (blue) are arranged alternately along the X-axis direction. In addition, the outer shape of each colored portion 29 has a vertically long rectangular shape in plan view following the outer shape of the pixel electrode 25. Between each coloring part 29 which comprises a color filter, the light-shielding part (black matrix) 30 which makes the grid | lattice shape for preventing color mixing is formed. The light shielding portion 30 is disposed so as to overlap with the gate wiring 26, the source wiring 27, and the capacitor wiring 33 on the array substrate 20 in plan view. A counter electrode 31 is provided on the surface of each colored portion 29 and the light shielding portion 30 so as to face the pixel electrode 25 on the array substrate 20 side. An alignment film 32 for aligning liquid crystal molecules contained in the liquid crystal layer 22 is formed on the inner surface side of the CF substrate 21.

Here, the TFT 24 which is a switching element in the array substrate 20 will be described in detail. As shown in FIGS. 2 and 4, the TFT 24 is configured by laminating a plurality of films on the glass substrate GS constituting the array substrate 20, and specifically, in order from the lower layer side (glass substrate GS side). The gate electrode (metal film) 24a connected to the gate wiring 26, the gate insulating film (insulating film, gate insulator film) 35, the semiconductor film 36, the source electrode (metal film) 24b connected to the source wiring 27, and the pixel electrode 25, a drain electrode (metal film) 24c, an interlayer insulating film (insulating film, passivation film) 37, and a protective film (insulating film) 38 are stacked.

The gate electrode 24 a is made of a metal film containing copper or aluminum as a metal material, like the gate wiring 26, and is patterned on the glass substrate GS in the same process as the gate wiring 26. The gate insulating film 35 is made of, for example, a silicon nitride film (SiN _x ) or a silicon oxide layer (SiO _x ), and is stacked on the glass substrate GS, the gate electrode 24 a and the gate wiring 26. The gate insulating film 35 is a TFT 24. In FIG. 2, the gate electrode 24a and the semiconductor film 36 are kept in an insulating state. The semiconductor film 36 is made of, for example, amorphous silicon (a-Si), and has one end connected to the drain electrode 24c and the other end connected to the source electrode 24b. It is supposed to be possible.

The source electrode 24b and the drain electrode 24c are formed by laminating first conductive films 24b1 and 24c1 on the lower layer side (semiconductor film 36 side) and second conductive films 24b2 and 24c2 on the upper layer side (interlayer insulating film 37 side). Is done. The first conductive films 24b1 and 24c1 on the lower layer side are made of amorphous silicon (n ⁺ Si) doped with an n-type impurity such as phosphorus (P) at a high concentration, and function as an ohmic contact layer. The second conductive films 24b2 and 24c2 on the upper layer side are made of a metal film containing copper or aluminum as a metal material, like the source wiring 27 and the drain wiring 34, and the first conductive film is formed in the same process as the source wiring 27 and the drain wiring 34. Patterned on the films 24b1 and 24c1. A source line 27 and a drain line 34 are connected to ends of the source electrode 24b and the drain electrode 24c opposite to the channel region side, respectively.

The above-described source electrode 24b and drain electrode 24c are arranged opposite to each other with a predetermined interval (opening region) therebetween, and thus are not directly electrically connected to each other. However, the source electrode 24b and the drain electrode 24c are indirectly electrically connected via the semiconductor film 36 on the lower layer side, and the bridge portion between the

electrodes

24b and 24c in the semiconductor film 36 has a drain current. Functions as a flowing channel region.

The interlayer insulating film 37 is made of, for example, a silicon nitride film (SiN _x ) or a silicon oxide layer (SiO _x ), and is made of the same material as the gate insulating film 35 described above. The protective film 38 is made of an acrylic resin (for example, polymethyl methacrylate resin (PMMA)) or a polyimide resin, which is an organic material. Therefore, the protective film 38 is thicker than the gate insulating film 35 and the interlayer insulating film 37 made of other inorganic materials and functions as a planarizing film. Each insulating film (gate insulating film 35, interlayer insulating film 37, and protective film 38) related to the TFT 24 is formed with a uniform film thickness over almost the entire area including the area other than the area where the TFT 24 is formed on the array substrate 20. Has been.

The array substrate 20 having the TFT 24 having the above-described configuration is patterned by sequentially forming each conductive film and each insulating film constituting various wirings on the plate surface of the glass substrate GS using a known photolithography method. It is manufactured by. Similarly, the CF substrate 21 having the color filter is patterned by sequentially forming each film constituting the color filter, the light shielding portion 30 and the like on the plate surface of the glass substrate GS using a known photolithography method. It is manufactured by. Specifically, the glass substrate GS constituting each of the

substrates

20 and 21 is formed with a resist film by applying a photoresist, which is a processing liquid, after each film is formed. Each film is patterned by being subjected to development processing after exposure through a photomask corresponding to the pattern. Among these, a reduced pressure drying apparatus (substrate processing apparatus) 40 is used to form a resist film by drying the photoresist applied to the plate surface of the glass substrate GS constituting each of the

substrates

20 and 21 under reduced pressure. Next, the configuration of the reduced pressure drying apparatus 40 will be described in detail. In the present embodiment, the mother glass substrate MG in which a plurality of glass substrates GS are arranged side by side in the plate surface is processed by the reduced pressure drying apparatus 40, and FIG. 6, FIG. 11 and FIG. The outline of each display area AA in a plurality of glass substrates GS (array substrate 20 or CF substrate 21) is illustrated by a two-dot chain line. Therefore, in FIG. 6, FIG. 11 and FIG. 16, the lattice-shaped part outside each display area AA and the frame part on the outermost periphery side are set as non-display areas NAA. Further, the mother glass substrate MG is divided into individual glass substrates GS after completing various processes including a vacuum drying process.

As shown in FIG. 5, the vacuum drying apparatus 40 includes a processing chamber (chamber) 41 that accommodates a mother glass substrate MG (glass substrate GS) that is a substrate to be processed, a decompression unit 42 that decompresses the processing chamber 41, A pressure adjusting valve 43 that is connected to the decompression unit 42 and adjusts the pressure in the processing chamber 41, a transfer arm unit (transfer unit) 44 that transfers the mother glass substrate MG into and out of the processing chamber 41, and the inside of the processing chamber 41 And a support pin (lift pin) 45 for supporting the mother glass substrate MG. Note that the upper and lower descriptions in the vertical direction are based on FIGS. 5 and 7. Further, in FIGS. 5, 6 and 9 to 19, illustration of a resist film and the like on the mother glass substrate MG is omitted.

As shown in FIG. 5, the processing chamber 41 has a substantially box shape as a whole, and a loading / unloading port 41 a for loading / unloading the mother glass substrate MG is opened on the left side wall of the processing chamber 41. . Outside the side wall of the processing chamber 41 where the loading / unloading port 41a is provided, it is possible to slide (move) along the Z-axis direction between a position where the loading / unloading port 41a is opened and a position where the loading / unloading port 41a is closed. The gate part 41b is provided in a special form. The decompression unit 42 is connected to the processing chamber 41 via an exhaust pipe 42 a and has a vacuum pump that sucks air in the processing chamber 41. The pressure adjustment valve 43 is provided in the middle of the exhaust pipe 42a, and the pressure (depressurized state) in the processing chamber 41 can be finely adjusted by electrically controlling the opening degree.

As shown in FIGS. 5 and 6, the transfer arm portion 44 includes a main portion 44 a, and a plurality (four in this embodiment) of substrate support arms 44 b that branch from the main portion 44 a and support the mother glass substrate MG. ,have. The main portion 44a is connected to a drive mechanism (not shown), and can move freely in at least the vertical direction (Z-axis direction) and the horizontal direction (X-axis direction and Y-axis direction) by the drive mechanism. The substrate support arms 44b extend along the long side direction (X-axis direction) of the mother glass substrate MG, and a plurality of the substrate support arms 44b are spaced along the short side direction (Y-axis direction) of the mother glass substrate MG. They are arranged side by side. The transfer arm unit 44 can carry the mother glass substrate MG supported by the substrate support arm 44b from the outside of the processing chamber 41 into the processing chamber 41 through the loading / unloading port 41a, and conversely, the mother glass substrate MG. The inside can be carried out of the processing chamber 41 through the loading / unloading port 41a. The transfer direction of the mother glass substrate MG with respect to the processing chamber 41 by the transfer arm unit 44 coincides with the X-axis direction (the long side direction of the mother glass substrate MG) and is linear. The height position of the mother glass substrate MG transferred into the processing chamber 41 by the transfer arm unit 44, in other words, the position in the Z-axis direction is the transfer position (FIGS. 10 to 12).

As shown in FIGS. 5 and 7, the support pin 45 is disposed in the processing chamber 41 so as to rise from the bottom wall side to the ceiling wall side of the processing chamber 41, and is mechanical to a motor (not shown). By being connected to, it is possible to move up and down along the vertical direction (Z-axis direction, normal direction of the plate surface of the mother glass substrate MG). The support pin 45 has a tip portion (rotation support portion 46 described later) in contact with the mother glass substrate MG at a height position lower than the transfer position of the mother glass substrate MG transferred into the processing chamber 41 by the transfer arm unit 44. And a lift position (FIGS. 13 to 15, 17, and 19) that are higher than the transfer position of the mother glass substrate MG. It has come to be. The mother glass substrate MG is lifted while being supported by the support pins 45 that are lifted from the transfer position transferred into the processing chamber 41 by the transfer arm unit 44 to the lift position, and is supported by the support pins 45 that have reached the lift position. The vacuum drying process is performed in the state. The height position of the mother glass substrate MG lifted by the support pins 45 in the lift position is the processing position (FIGS. 13 to 15, 17, and 19).

As shown in FIG. 6, the support pins 45 overlap with the mother glass substrate MG transferred into the processing chamber 41 by the transfer arm unit 44 in a plan view, and a plurality of support pins 45 are flat on the plate surface of the mother glass substrate MG. They are arranged side by side in a matrix. Specifically, the support pins 45 are arranged side by side at predetermined intervals along the long side direction (X-axis direction) and the short side direction (Y-axis direction) of the mother glass substrate MG. The Y-axis direction is adjacent to each substrate support arm 44b of the transfer arm unit 44 without overlapping. That is, the support pins 45 are arranged so that the arrangement interval in the Y-axis direction is wider than the width dimension of each substrate support arm 44b, and the support pins 45 are arranged alternately with the substrate support arms 44b in the Y-axis direction. Yes.

Further, as shown in FIGS. 8 and 9, the support pin 45 according to the present embodiment is provided with a rotation support portion 46 that supports the mother glass substrate MG in a rotatable form. In addition, as shown in FIGS. 6 and 7, the reduced-pressure drying apparatus 40 according to the present embodiment moves the mother glass substrate MG supported by the rotation support unit 46 in the processing chamber 41 along the plate surface. It has a swinging part 47 that swings. According to such a configuration, if the mother glass substrate MG is swung along the plate surface by the swinging portion 47 when the mother glass substrate MG is subjected to the decompression drying process in the processing chamber 41, the rocking is prevented. The rotation support part 46 is rotated with the movement. At this time, since the support location for the mother glass substrate MG by the rotation support portion 46 is continuously displaced, it is possible to avoid fixing the support location as in the prior art. As a result, the drying rate of the mother glass substrate MG when the reduced-pressure drying process proceeds is made uniform in the plate surface, and the traces of the support pins 45 are hardly transferred to the mother glass substrate MG. Accordingly, the occurrence of transfer unevenness of the support pin 45 is sufficiently suppressed. Moreover, it requires a complicated structure such as a conventional support pin temperature adjusting means for adjusting a plurality of support pins to different temperatures and a lift mechanism for individually driving the support pins adjusted to different temperatures, and complicated control related thereto. Compared with a product, the structure is simplified and the cost is reduced.

As shown in FIGS. 8 and 9, the rotation support portion 46 is provided at the upper end portion in the vertical direction of the support pin 45 (the end portion on the mother glass substrate MG side). The rotation support part 46 is accommodated in a ball holder (rotary sphere accommodating part) 46a, a main ball (main rotating sphere) 46b accommodated in the ball holder 46a and in direct contact with the mother glass substrate MG, and accommodated in the ball holder 46a. And a plurality of sub-balls (sub-rotating spheres) 46c that are arranged along the peripheral surface of the main ball 46b and that rotate along with the rotation of the main ball 46b. The ball holder 46a has a columnar shape that is thicker than the base end side portion (portion other than the rotation support portion 46) of the support pin 45, and a ball storage chamber that stores the

balls

46b and 46c on the upper end surface in the vertical direction. 46a1 is formed open. The ball housing chamber 46a1 is configured such that the opening opening is narrower than the internal space, and the main ball 46b is held in a state of being prevented from coming off by the opening end. The ball holder 46a has a spherical surface in which the peripheral surface of the ball housing chamber 46a1 is slightly larger than the peripheral surface of the main ball 46b. The main ball 46b is a sphere whose diameter is larger than the diameter of the sub-ball 46c and the opening opening of the ball housing chamber 46a1, and is held by the opening end of the ball housing chamber 46a1 in the ball holder 46a. It can be rotated. The sub ball 46c is a sphere whose diameter is smaller than that of the main ball 46b, and is disposed between the peripheral surface of the ball housing chamber 46a1 and the peripheral surface of the main ball 46b. Are arranged side by side while being adjacent to each other in the circumferential surface (both spherical surfaces). These sub-balls 46c are rotated so as to follow the rotation of the main ball 46b, so that the main ball 46b is smoothly rotated with low loss. The sub-ball 46c is held in a retaining state by the open end of the ball housing chamber 46a1 in the ball holder 46a.

As shown in FIGS. 6 and 7, the swinging portion 47 is disposed at a height position overlapping with the mother glass substrate MG in the processing chamber 41 as a processing position in the Z-axis direction, and in the mother glass substrate MG. They are arranged so as to face the end surface on the long side along the X-axis direction (conveying direction). In this case, a mechanism for holding the mother glass substrate MG becomes unnecessary as compared with a case where the rocking portion is in contact with the plate surface of the mother glass substrate MG and the mother glass substrate MG is swung. Further, the force for swinging the mother glass substrate MG along the plate surface from the swinging portion 47 is efficiently transmitted to the mother glass substrate MG. The swinging part 47 is arranged in a pair so as to sandwich the mother glass substrate MG from both sides in the short side direction (Y-axis direction). That is, the plurality of swinging portions 47 are arranged so as to be sandwiched from both sides in the transport direction of the mother glass substrate MG by the transport arm portion 44. In this way, when the mother glass substrate MG is transported by the transport arm portion 44, the swinging portion 47 can be prevented from hindering transport. As a result, the mother glass substrate MG can be transported smoothly, which is suitable for shortening the tact time. Three sets of swinging portions 47 that are paired in the Y-axis direction are arranged at positions spaced apart in the X-axis direction. That is, the oscillating portion 47 is arranged so that the mother glass substrate MG is associated with both end portions and the central portion in the long side direction.

The rocking portion 47 is mechanically connected to a motor (not shown), and is displaced along the plate surface of the mother glass substrate MG by being driven by the motor. Specifically, first, the swinging portion 47 is moved to a standby position (FIG. 14) that is separated from the end surface of the mother glass substrate MG by the motor to the outside in the Y-axis direction, and a contact position that contacts the end surface of the mother glass substrate MG ( 17) and can be moved. The distance between the swinging portions 47 paired in the Y-axis direction is larger than the short side dimension of the mother glass substrate MG at the standby position, but is substantially the same as the short side dimension of the mother glass substrate MG at the contact position. . In addition, although the rocking | swiveling part 47 is the arrangement | positioning which overlaps about the mother glass substrate MG in which the one part was made into the conveyance position about a Z-axis direction, it is arrange | positioned apart in the Y-axis direction, so This is suitable for shortening the tact time by avoiding interference with the mother glass substrate MG and reducing the displacement of the mother glass substrate MG from the transfer position to the processing position. Then, as shown in FIG. 18, the swinging portion 47 brought into the contact position can be eccentrically moved so as to draw an elliptical orbit when viewed in plan by a motor, and accordingly, the mother glass substrate MG. Can be swung along the plate surface. When the mother glass substrate MG is swung in this manner, the main ball 46b and the sub ball 46c provided in the rotation support portion 46 of each support pin 45 rotate, whereby each support pin 45 in the mother glass substrate MG is rotated. The support location is continuously displaced, and the trajectory has an elliptical shape similar to the trajectory of the swinging portion 47 that is eccentrically moved. That is, each support location on the mother glass substrate MG by each support pin 45 is continuously displaced within the range of the elliptical orbit. In FIG. 18, the trajectory in which each support location on the mother glass substrate MG by each support pin 45 is displaced in accordance with the eccentric motion of the swinging portion 47 is shown in a shaded shape. In this elliptical orbit, the major axis direction coincides with the X-axis direction and the minor axis direction coincides with the Y-axis direction, and the same orbit adjacent in the X-axis direction and the same orbit adjacent in the Y-axis direction overlap. There is nothing (non-overlapping). That is, the mother glass substrate MG does not have a portion that contacts the plurality of support pins 45 when swinging.

This embodiment has the structure as described above, and its operation will be described next. As shown in FIGS. 5 to 7, the mother glass substrate MG coated with a photoresist is placed on the substrate support arm 44 b of the transfer arm unit 44 arranged outside the processing chamber 41. The transfer arm 44 is driven while the gate 41b of the processing chamber 41 is opened and the loading / unloading port 41a is opened, and the mother glass substrate MG is accommodated in the processing chamber 41 as shown in FIGS. Place it at the transfer position. At this time, since the support pin 45 is in the standby position, it is not in contact with the mother glass substrate MG in the transport position. Further, since the support pins 45 are arranged so as not to overlap the substrate support arm 44b in the Y-axis direction, interference with the substrate support arm 44b of the transfer arm unit 44 that has entered the processing chamber 41 is avoided. (FIG. 11). Further, since the swinging portion 47 is disposed at the standby position retracted on both sides with respect to the mother glass substrate MG in the Y-axis direction, interference with the mother glass substrate MG carried in is avoided (FIG. 11). When the support pin 45 in the standby position is driven so as to rise, the main ball 46b of the rotation support portion 46 is moved to a predetermined height, and the plate surface on the back side of the mother glass substrate MG (photoresist non-coated surface). Touched. When the support pin 45 is further raised from this state, the mother glass substrate MG supported by the rotation support portion 46 is also raised accordingly.

As shown in FIGS. 13 and 14, when the support pin 45 reaches the lift position, the mother glass substrate MG reaches the processing position. Then, when the transfer arm unit 44 leaves the processing chamber 41 through the loading / unloading port 41a with the mother glass substrate MG not mounted, as shown in FIGS. 15 to 17, the gate unit 41b is slid to load / unloading port 41a. Occlude. Thus, if the inside of the process chamber 41 is made into the sealed space, a reduced-pressure drying process is performed. When performing the reduced-pressure drying process, the pressure adjusting valve 43 is opened and the pressure-reducing part 42 is driven, so that the air in the process chamber 41 is sucked and depressurized so as to maintain the target vacuum degree. Thereby, the photoresist applied to the mother glass substrate MG is dried under reduced pressure, and a resist film is formed eventually.

Prior to the vacuum drying process, the swinging portion 47 is displaced from the standby position so as to approach the mother glass substrate MG in the Y-axis direction as shown in FIGS. . At this time, the mother glass substrate MG is held in a state of being sandwiched by the swinging portions 47 that make a pair from both sides in the Y-axis direction. When each oscillating portion 47 is driven in synchronism with the vacuum drying process, each oscillating portion 47 moves eccentrically so as to draw an elliptical orbit as viewed in a plane, and accordingly, the mother glass The substrate MG is swung while drawing a similar trajectory along the plate surface. When the mother glass substrate MG is swung, the main ball 46b and the sub ball 46c provided in the rotation support portion 46 of each support pin 45 rotate, so that each support location on the mother glass substrate MG by each support pin 45 is changed. Displaces continuously. At this time, the main ball 46b rotates smoothly by the rotation of the sub ball 46c, whereby the support location for the mother glass substrate MG swung by the swinging portion 47 is smoothly displaced. (See FIG. 9). Here, if the mother glass substrate MG is fixedly supported by the support pins for a certain period of time as in the conventional case, the drying speed is different between the support location by the support pins and the non-support location in the mother glass substrate MG. This may cause transfer unevenness in which the trace of the support pin is transferred. In that respect, as described above, the mother glass substrate MG is swung along the plate surface by the swinging portion 47, and the main ball 46b and the subball 46c of the rotation support portion 46 are rotated accordingly. It is possible to avoid fixing the support portion on the substrate MG. As a result, the drying speed of the mother glass substrate MG is made uniform within the plate surface, and the occurrence of uneven transfer is sufficiently suppressed.

At the time of the swing, the main ball 46b of the rotation support portion 46 in contact with the mother glass substrate MG is rotatable with a high degree of freedom, so each support location on the mother glass substrate MG by each support pin 45 is shown in FIG. As shown in the plane shown by the shaded area in FIG. 3, the range of the elliptical trajectory is continuously displaced. Since the ranges in which the support portions are displaced do not overlap each other in a plan view, the mother glass substrate MG does not have a portion that contacts the plurality of support pins 45 when swinging. Thereby, generation | occurrence | production of a transfer nonuniformity is suppressed more suitably. It should be noted that the driving of each swinging portion 47 may be started prior to the start of the reduced pressure drying process, or conversely, may be started after a certain period of time has elapsed since the start of the reduced pressure drying process. Absent.

When the reduced pressure drying process is completed as described above, the reduced pressure state in the processing chamber 41 is released, and the pressure in the processing chamber 41 is returned to atmospheric pressure. Then, as shown in FIG. 13 and FIG. 14, when the transfer arm portion 44 enters the processing chamber 41 through the loading / unloading port 41a with the gate portion 41b open, each support is shown in FIGS. The pin 45 is lowered from the lift position to the standby position. Before each support pin 45 reaches the standby position, the mother glass substrate MG is received by the transfer arm unit 44 at the transfer position. By moving the transfer arm unit 44 that has received the mother glass substrate MG to the outside of the processing chamber 41, as shown in FIGS. 5 to 7, the mother glass substrate MG that has been subjected to the drying under reduced pressure is taken out.

As described above, the reduced-pressure drying apparatus (substrate processing apparatus) 40 according to the present embodiment accommodates the mother glass substrate (substrate) MG and processes the mother glass substrate MG, and the processing chamber 41. A support pin 45 for supporting the mother glass substrate MG in the inside, and a support pin 45 having a rotation support portion 46 for supporting the mother glass substrate MG in a rotatable manner, and a rotation support portion 46 in the processing chamber 41. And a rocking portion 47 that rocks the mother glass substrate MG supported by the plate along the plate surface.

With such a configuration, the mother glass substrate MG accommodated in the processing chamber 41 is processed while being supported by the rotation support portion 46 of the support pin 45. When this processing is performed, the mother glass substrate MG is swung along the plate surface by the swinging portion 47, and the rotation support portion 46 is rotated along with the swinging. . At this time, since the support part with respect to the mother glass substrate MG by the rotation support part 46 is displaced continuously, it is avoided that the support part is fixed as in the prior art. As a result, the traces of the support pins 45 are difficult to be transferred to the mother glass substrate MG, and the occurrence of uneven transfer of the support pins 45 is sufficiently suppressed. Moreover, it requires a complicated structure such as a conventional support pin temperature adjusting means for adjusting a plurality of support pins to different temperatures and a lift mechanism for individually driving the support pins adjusted to different temperatures, and complicated control related thereto. Compared with a product, the structure is simplified and the cost is reduced.

Further, the swinging part 47 contacts the end surface of the mother glass substrate MG and swings the mother glass substrate MG. In this case, a mechanism for holding the mother glass substrate MG becomes unnecessary as compared with a case where the rocking portion is in contact with the plate surface of the mother glass substrate MG and the mother glass substrate MG is swung. This is more suitable for simplification and cost reduction. Further, the force for swinging the mother glass substrate MG along the plate surface from the swinging portion 47 is efficiently transmitted to the mother glass substrate MG.

Further, in order to move the mother glass substrate MG in and out of the processing chamber 41, a transfer arm unit (transfer unit) 44 that linearly transfers the mother glass substrate MG along its plate surface is provided. Are arranged in such a manner that the mother glass substrate MG is sandwiched from both sides in the conveyance direction of the mother glass substrate MG by the conveyance arm unit 44. In this way, when the mother glass substrate MG is transported by the transport arm portion 44, the swinging portion 47 can be prevented from hindering transport. As a result, the mother glass substrate MG can be transported smoothly, which is suitable for shortening the tact time.

The rotation support unit 46 includes a main ball (main rotating sphere) 46b in contact with the mother glass substrate MG and a plurality of sub-balls (lined along the peripheral surface of the main ball 46b and rotated with the rotation of the main ball 46b). A sub-rotating sphere) 46c, and a ball holder (rotating sphere accommodating portion) 46a for accommodating the main ball 46b and the sub-ball 46c. In this way, the main ball 46b in contact with the mother glass substrate MG rotates smoothly by rotating the plurality of sub-balls 46c arranged along the peripheral surface thereof, and the mother glass that is rocked by the rocking portion 47. The support location for the substrate MG is smoothly displaced. Compared to the case where the rotation support portion 46 is configured by a roller having a rotation shaft, since the degree of freedom in the rotation direction of the main ball 46b is high, the support location for the mother glass substrate MG can be displaced more freely. Therefore, uneven transfer is less likely to occur.

Further, a decompression unit 42 for decompressing the inside of the processing chamber 41 is provided. By doing so, the mother glass substrate MG can be subjected to a reduced pressure drying process by reducing the pressure in the processing chamber 41 by the pressure reducing unit 42. Here, when the mother glass substrate MG is fixedly supported by the support pins for a certain period of time as in the prior art, there is a difference in the drying speed between the support portions by the support pins and the non-support portions in the mother glass substrate MG. There is a concern that unevenness of transfer, in which the trace of the support pin is transferred, occurs. In that respect, as described above, the mother glass substrate MG is swung along the plate surface by the swinging portion 47 and the rotation support portion 46 is rotated accordingly, whereby the support location on the mother glass substrate MG is fixed. Therefore, the drying rate of the mother glass substrate MG is made uniform in the plate surface, and the occurrence of transfer unevenness is sufficiently suppressed.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. 20 or FIG. In this Embodiment 2, what changed the rocking | swiveling part 147 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIGS. 20 and 21, the swinging portion 147 according to the present embodiment is in contact with the plate surface of the mother glass substrate MG. Specifically, the swinging portion 147 is arranged so as to overlap with the mother glass substrate MG accommodated in the processing chamber 141 in a plan view, and is vacuum-sucked to the back plate surface of the mother glass substrate MG. Thus, it is possible to hold the mother glass substrate MG and thereby swing the mother glass substrate MG. Thereby, compared with the above-described first embodiment, the end portion of the mother glass substrate MG is less likely to be damaged along with the swing. Note that a vacuum suction means (not shown) including a vacuum pump for vacuum suction of the mother glass substrate MG is connected to the swing portion 147. And the rocking | swiveling part 147 is contact | abutted to the outer peripheral side part which makes frame shape among the plate surfaces of the mother glass substrate MG, and the outer peripheral side portion of the plate surfaces of this mother glass substrate MG is made of each glass. The area outside the display area AA of the substrate GS, that is, the non-display area NAA. Here, when the swinging portion 147 is brought into contact with the plate surface of the mother glass substrate MG as in the present embodiment, there is a possibility that uneven transfer of the swinging portion 147 due to the reduced pressure drying process occurs at the contact portion. is there. Even if such transfer unevenness occurs, the contact portion of the rocking portion 147 in the mother glass substrate MG is set as the non-display area NAA of each glass substrate GS as described above. It is possible to avoid transfer unevenness in the display area AA. Therefore, when a liquid crystal panel is manufactured using the glass substrate GS obtained by dividing the mother glass substrate MG that has been subjected to such a reduced-pressure drying process, the image displayed in the display area AA of the liquid crystal panel is changed. It is possible to avoid adverse effects caused by uneven transfer of the moving part 147. In addition, the rocking | swiveling part 147 which concerns on this embodiment shall be eccentrically moved so that an elliptical locus may be drawn on a plane similarly to the rocking | swiveling part 47 described in Embodiment 1 mentioned above.

As described above, according to the present embodiment, the mother glass substrate MG constitutes a liquid crystal panel (display panel) having a display area AA on which an image is displayed and a non-display area NAA surrounding the display area AA. The swinging unit 147 contacts the non-display area NAA on the plate surface of the mother glass substrate MG and swings the mother glass substrate MG. In this way, the mother glass is caused by the force acting on the mother glass substrate MG as it swings, as compared with the case where the swinging portion abuts on the end surface of the mother glass substrate MG to swing the mother glass substrate MG. The end of the substrate MG is difficult to be damaged. Moreover, even if there is a transfer unevenness of the swinging part 147 due to the contact at the place where the swinging part 147 is in contact with the plate surface of the mother glass substrate MG, it is constituted by the mother glass substrate MG. It is difficult for a situation in which an image displayed on the display area AA of the liquid crystal panel is adversely affected.

<Embodiment 3>
A third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the transfer means for the mother glass substrate MG is changed from the first embodiment. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 22, the vacuum drying apparatus 240 according to the present embodiment is a transfer conveyor for transferring the mother glass substrate MG into and out of the processing chamber 241 instead of the transfer arm unit described in the first embodiment. (Conveying section) 48 is provided. The transport conveyor 48 is formed by arranging a number of transport rollers 48a that extend along the Y-axis direction and that are rotatable at predetermined intervals along the X-axis direction. Thereby, the conveyance conveyor 48 can convey the mother glass substrate MG linearly along the X-axis direction. Of the processing chamber 241, a pair of front and rear side walls in the transport direction of the mother glass substrate MG is provided with a carry-in port 49 for carrying the mother glass substrate MG, a carry-out port 50 for carrying the mother glass substrate MG, Are provided. The transport conveyor 48 is connected to the plurality of transport rollers 48 a disposed in the processing chamber 241, the plurality of transport rollers 48 a disposed outside the carry-in port 49 with respect to the processing chamber 241, and the processing chamber 241. And a plurality of transport rollers 48a disposed outside the carry-out port 50. The mother glass substrate MG is linearly conveyed by such a conveyance conveyor 48 so as to penetrate the processing chamber 241 before and after in the conveyance direction. Further, the processing chamber 241 is provided with a pair of gate portions 241b that can close the carry-in port 49 and the carry-out port 50, respectively.

When performing the reduced-pressure drying process, as shown in FIG. 22, the mother glass substrate MG is placed on the transport conveyor 48 outside the carry-in port 49 with respect to the process chamber 241. The mother glass substrate MG is conveyed forward in the conveyance direction (right side shown in FIG. 22) by rotating each conveyance roller 48a. As shown in FIG. 23, the mother glass substrate MG is transferred into the processing chamber 241 through the conveyance inlet 49. To house. When the mother glass substrate MG is accommodated in the processing chamber 241, each support pin 245 is raised from the standby position to lift the mother glass substrate MG. When each support pin 245 reaches the lift position, as shown in FIG. 24, each gate portion 241b is slid to close the carry-in port 49 and the carry-out port 50, and a reduced-pressure drying process is performed. During the drying under reduced pressure, the mother glass substrate MG is swung by a swinging portion (not shown) as in the first embodiment, so that uneven transfer of each support pin 245 is suppressed. When the decompression drying process is completed, as shown in FIG. 23, each support pin 245 is lowered from the lift position to the standby position, and the mother glass substrate MG is placed on the transport conveyor 48. Then, each gate portion 241b is slid to open the carry-in port 49 and the carry-out port 50, and the mother glass substrate MG is carried forward in the carrying direction by the carrying conveyor 48. As shown in FIG. Take it out. Note that the specific timing for opening and closing each gate portion 241b can be changed as appropriate. For example, each gate portion 241b is closed at the same time as or prior to raising each support pin 245 from the standby position. Alternatively, the gate portions 241b may be opened at the same time as or before the support pins 245 are lowered from the lift position.

<Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIG. In this Embodiment 4, what changed the structure of the rotation support part 346 from above-mentioned Embodiment 1 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 26, the rotation support portion 346 according to the present embodiment includes a rotation roller 51 that is pivotally supported so as to be rotatable about a rotation shaft 51a. The rotation roller 51 is configured such that the axis direction of the rotation shaft 51a coincides with the X-axis direction and is rotatable around the axis line of the rotation shaft 51a. On the other hand, the swinging portion 347 is driven to repeatedly swing back and forth the mother glass substrate MG along the Y-axis direction. When the mother glass substrate MG is oscillated by the oscillating portion 347, each of the rotating rollers 51 constituting each of the rotation supporting portions 346 is rotated around the axis in the X-axis direction around each rotating shaft 51a, Thereby, each support location by each rotation roller 51 in the mother glass substrate MG is continuously displaced so as to repeatedly reciprocate along the Y-axis direction. As a result, it is possible to avoid fixing each supporting portion on the mother glass substrate MG, so that the drying speed of the mother glass substrate MG is made uniform within the plate surface, thereby sufficiently suppressing the occurrence of transfer unevenness. .

<Embodiment 5>
A fifth embodiment of the present invention will be described with reference to FIG. 27 or FIG. In the fifth embodiment, the swinging portion 447 is changed from the first embodiment. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 27, the swinging portion 447 according to the present embodiment is in contact with a pair of end surfaces on the long side and a pair of end surfaces on the short side of the mother glass substrate MG. It is composed of things. That is, the mother glass substrate MG is configured such that all of the outer peripheral end surfaces of the four sides are in contact with the swinging portion 447. Specifically, the mother glass substrate MG is sandwiched from both sides in the short side direction (Y-axis direction) by the swinging portions 447 that are in contact with the pair of end surfaces on the long side, and the pair of end surfaces on the short side. Are held so as to be swingable in a form of being sandwiched from both sides in the long side direction (X-axis direction) by each swinging part 447. Thereby, the mother glass substrate MG can be rocked more stably. In addition, each rocking | swiveling part 447 which pinches | interposes the mother glass substrate MG from the both sides about the long side direction is shown with respect to the mother glass substrate MG made into a conveyance position (refer the two-dot chain line of the same figure) as shown in FIG. The vertical direction (Z-axis direction) is arranged so as not to overlap with the upper side, thereby avoiding interference with the mother glass substrate MG conveyed by the conveyance arm unit 444.

<Embodiment 6>
Embodiment 6 of the present invention will be described with reference to FIG. In the sixth embodiment, a swing portion 547 is changed from the fifth embodiment. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 5 is abbreviate | omitted.

29. As shown in FIG. 29, the swinging portion 547 according to the present embodiment is composed of four members that are in contact with the four corners of the outer peripheral end surface of the mother glass substrate MG. The oscillating portion 547 has an L shape as viewed in a plane following the corner portion of the mother glass substrate MG. In this way, it is possible to stably rock the mother glass substrate MG while reducing the number of installed rocking portions 547.

<Embodiment 7>
Embodiment 7 of the present invention will be described with reference to FIG. In the seventh embodiment, the arrangement of the swinging portion 647 is changed from the above-described second embodiment. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 2 is abbreviate | omitted.

As shown in FIG. 30, the swinging portion 647 according to this embodiment includes a frame-like outer peripheral side portion and a central side portion surrounded by the outer peripheral side portion of the plate surface of the mother glass substrate MG. They are arranged in a plane so as to contact each other. Four oscillating portions 647 that are in contact with the outer peripheral portion of the plate surface of the mother glass substrate MG are arranged so as to be in contact with the four corners of the outer peripheral portion. The swinging portion 647 that abuts on the center side portion of the plate surface of the mother glass substrate MG 4 abuts on a lattice-like portion that partitions the display areas AA of the glass substrates GS out of the center side portion. One is arranged. As described above, each of the swinging portions 647 is in contact with an area outside the display area AA of each glass substrate GS, that is, the non-display area NAA. Since each oscillating portion 647 according to the present embodiment is distributed and arranged in the outer peripheral side portion and the central side portion of the plate surface of the mother glass substrate MG, the mother glass substrate MG is more stably shaken. It is possible to move.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In each of the above-described embodiments (except for the fourth embodiment), the mother glass substrate is moved by performing an eccentric motion so that the swinging portion draws an elliptical locus whose major axis direction coincides with the X-axis direction when viewed in a plane. In this case, the mother glass substrate is swung by performing an eccentric motion so that the swinging portion draws an elliptical locus whose major axis direction coincides with the Y-axis direction when seen in a plane. It doesn't matter. Further, the swinging portion may be driven so as to draw a perfect circular locus along the plate surface of the mother glass substrate. Further, the swinging unit may be driven so as to draw a linear locus along the plate surface of the mother glass substrate.

(2) In each of the above-described embodiments (excluding Embodiment 4), a case where the trajectories in which each support portion by each rotation support portion in the mother glass substrate is displaced along with the swing by the swing portion does not overlap each other is shown. However, it is also possible to take a setting in which the trajectories overlap each other.

(3) In each of the above-described embodiments (excluding Embodiments 2 and 7), the case where the oscillating portions are arranged to face each other with the mother glass substrate interposed therebetween is shown. For example, the arrangement may be a non-opposing arrangement with the mother glass substrate interposed therebetween, such as a staggered arrangement. In that case, for example, the number of swinging portions disposed on one side across the mother glass substrate may not match the number of swinging portions disposed on the other side.

(4) In Embodiments 2 and 7 described above, the case where the oscillating portion is symmetrically arranged in the plate surface of the mother glass substrate is shown. However, the oscillating portion is asymmetric in the plate surface of the mother glass substrate. It may be arranged as follows. In that case, for example, the oscillating portion may be selectively disposed so as to contact only one long side portion (one short side portion) of the outer peripheral side portion of the mother glass substrate.

(5) In Embodiments 2 and 7 described above, the swinging part is in contact with the non-display area on the mother glass substrate. However, the swinging part is located between the non-display area and the display area on the mother glass substrate. You may make it contact | abut to the range which straddles, or may contact | abut only to a display area.

(6) In each of the above-described embodiments (excluding Embodiment 3), a case where the mother glass substrate is carried in and out by one transfer arm unit, and one loading / unloading port and one gate unit are provided in the processing chamber is shown. However, the mother glass substrate is carried in by the carrying arm portion for carrying in, and the mother glass substrate is carried out by the carrying arm portion for carrying out, respectively. Two gate portions for opening and closing may be provided.

(7) In each of the above-described embodiments (excluding Embodiments 2 and 7), the configuration in which the mother glass substrate is transferred to and from the transfer arm portion by moving the support pins up and down is shown. However, the support pins are fixed. It is also possible to adopt a configuration in which the mother glass substrate is transferred to and from the support pins by raising and lowering the transfer arm unit.

(8) In the above-described Embodiments 2 and 7, the configuration in which the mother glass substrate is transferred to and from the conveyor by moving the support pins up and down has been shown. However, the support pins are fixed and part of the conveyor It is also possible to adopt a configuration in which the mother glass substrate is transferred to and from the support pins by raising and lowering the (part disposed in the processing chamber).

(9) The configuration described in the second embodiment can be combined with the configuration described in the third and fourth embodiments.

(10) The configuration described in the third embodiment can be combined with the configurations described in the fourth to seventh embodiments.

(11) The configuration described in the fourth embodiment can be combined with the configurations described in the fifth to seventh embodiments.

(12) In each of the above-described embodiments, the case where the mother glass substrate in which a plurality of glass substrates are arranged in the plane is subjected to the vacuum drying process, but the glass substrate may be individually subjected to the vacuum drying process.

(13) In each of the above-described embodiments, the case where the glass mother glass substrate is subjected to the drying under reduced pressure has been described, but the case where the synthetic resin mother substrate is subjected to the drying under reduced pressure may be used.

(14) In each of the above-described embodiments, the reduced-pressure drying apparatus used for manufacturing a substrate constituting a TN type or VA type liquid crystal panel has been shown. However, for manufacturing a substrate constituting an IPS type or FFS type liquid crystal panel. The present invention is also applicable to the vacuum drying apparatus used.

(15) In each of the above-described embodiments, a vacuum drying apparatus used for manufacturing a substrate that constitutes a liquid crystal panel whose semiconductor film is made of amorphous silicon is shown. However, a liquid crystal panel whose semiconductor film is made of an oxide semiconductor or low-temperature polysilicon. The present invention can also be applied to a vacuum drying apparatus used for manufacturing a substrate that constitutes the substrate.

(16) In each of the above-described embodiments, a vacuum drying apparatus used for manufacturing a substrate constituting a liquid crystal panel in which a TFT is used as a switching element has been described. However, a switching element other than a TFT (for example, a thin film diode (TFD)) The present invention is also applicable to a vacuum drying apparatus used for manufacturing a substrate constituting the liquid crystal panel used.

(17) In each of the above-described embodiments, the reduced-pressure drying apparatus used for manufacturing the substrate constituting the liquid crystal panel is shown. However, the present invention is also applied to the reduced-pressure drying apparatus used for manufacturing the substrate constituting the display panel other than the liquid crystal panel. The invention is applicable. Examples of the display panel other than the liquid crystal panel include an organic EL panel, PDP, EPD (electrophoretic display panel, MEMS (Micro Electro Mechanical Systems) display panel, and the like.

(18) In each of the embodiments described above, the reduced pressure drying apparatus is shown as an example of the substrate processing apparatus, but the present invention is applicable to other types of substrate processing apparatuses than the reduced pressure drying apparatus.

11 ... Liquid crystal panel (display panel), 20 ... Array substrate (substrate), 21 ... CF substrate (substrate), 40, 240 ... Vacuum drying apparatus (substrate processing apparatus), 41, 241. .. Processing chamber, 42 ... Decompression unit, 44 ... Transfer arm unit (transfer unit), 45 ... Support pin, 46, 346 ... Rotation support unit, 46a ... Ball holder (Rotating sphere) Accommodating portion), 46b ... main ball (main rotating sphere), 46c ... sub ball (sub rotating sphere), 47, 147, 347, 447, 547, 647 ... swinging portion, 48 ... Transport conveyor section (transport section) AA ... display area, GS ... glass substrate (substrate), MG ... mother glass substrate (substrate), NAA ... non-display area

Claims

A processing chamber for containing the substrate and processing the substrate;
A support pin for supporting the substrate in the processing chamber, the support pin having a rotation support portion for supporting the substrate in a rotatable manner;
A substrate processing apparatus comprising: an oscillating unit configured to oscillate the substrate supported by the rotation support unit in the processing chamber along a plate surface thereof.
The substrate processing apparatus according to claim 1, wherein the swinging unit is in contact with an end surface of the substrate to swing the substrate.
In order to move the substrate into and out of the processing chamber, the substrate includes a transport unit that transports the substrate linearly along its plate surface,
The substrate processing apparatus according to claim 2, wherein a plurality of the swinging units are arranged so as to sandwich the substrate from both sides with respect to the transporting direction of the substrate by the transporting unit.
Processing a display panel having a display area for displaying an image and a non-display area surrounding the display area as the substrate;
The substrate processing apparatus according to claim 1, wherein the swinging unit contacts the non-display area on the plate surface of the substrate to swing the substrate.
The rotation support unit includes a main rotating sphere in contact with the substrate, a plurality of sub rotating spheres arranged along a circumferential surface of the main rotating sphere and rotating in accordance with the rotation of the main rotating sphere, the main rotating sphere, and The substrate processing apparatus according to claim 1, further comprising: a rotating sphere housing portion that houses the auxiliary rotating sphere.
The substrate processing apparatus according to claim 1, further comprising a decompression unit that decompresses the processing chamber.