TW201017804A - Processing system - Google Patents

Processing system Download PDF

Info

Publication number
TW201017804A
TW201017804A TW098127715A TW98127715A TW201017804A TW 201017804 A TW201017804 A TW 201017804A TW 098127715 A TW098127715 A TW 098127715A TW 98127715 A TW98127715 A TW 98127715A TW 201017804 A TW201017804 A TW 201017804A
Authority
TW
Taiwan
Prior art keywords
substrate
unit
atrium
path
processing
Prior art date
Application number
TW098127715A
Other languages
Chinese (zh)
Other versions
TWI388031B (en
Inventor
Hironobu Kajiwara
Yoshiharu Ota
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201017804A publication Critical patent/TW201017804A/en
Application granted granted Critical
Publication of TWI388031B publication Critical patent/TWI388031B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The subject matter of the present invention is to efficiently realize shortening of the whole size and shortening of the tact time in an in-line system wherein a plurality of processing units are arranged along a process line of a linearly extended reciprocating path according to a sequence of a process flow. The coating and developing processing system 10 has a cassette station (C/S) 14, an outward process line A, an interface station (I/F) 18, a homeward process line B, and a space NS. The space NS is enclosed by the cassette station (C/S) 14, the process line A, the interface station (I/F) 18 and the process lines B. It is formed straight in the direction of X in the enclosed area. Two reduced-pressure drying units 66L, 66R as the third groups unit are set up mutually face to face respectively at the predetermined position in the space NS. One transfer device 68 is set up between both units 66L, 66R.

Description

201017804 六、發明說明: 【發明所屬之技術領域】 本發明是有關在一連串的處理工程中具有依製程流程 的順序來以大槪水平的方向搬送被處理基板的搬送路線之 處理系統。 【先前技術】 〇 以往,在FPD (平板顯示器)製造的阻劑塗佈顯像處 理系統,爲了對應於被處理基板的大型化,而配備平移方 式的處理單元,其係於水平方向鋪設滾筒或滾子等的搬送 體而成平移搬送路上一邊水平搬送基板,一邊對基板的被 處理面供給預定的液體、氣體、光等,而進行所要的處理 ,使依製程流程的順序沿著大槪水平方向的路線來串聯排 列包含如此的平移方式的處理單元的多數個處理單元之系 統構成或佈局標準化(例如參照專利文獻1 )。 9 如專利文獻1所記載,此種的佈局是在系統中心部配 置橫長的製程站,在其長邊方向兩端部分別配置卡匣站及 介面站。卡匣站是在站內的平台與系統外部之間進行收容 複數片未處理或處理完成的基板之卡匣的搬出入,且在平 台上的卡匣與處理站之間進行基板的搬出入。介面站是在 鄰接的曝光裝置與處理站之間進行基板的交接。 製程站是具有以卡匣站作爲始點•終點,以介面站作 爲折返點的往路及復路的2列製程路線。一般,在往路的 製程路線是洗淨處理系的單元、阻劑塗佈處理系的單元、 -5- 201017804 熱的處理系的單元等或相鄰,或夾著搬送系的單元來配置 成一列。在復路的製程路線是顯像處理系的單元、熱的處 理系的單元、檢査系的單元等會相鄰,或夾著搬送系的單 元來配置成一列。 [專利文獻1]特開2007-200993號公報 【發明內容】 (發明所欲解決的課題) _ 如上述般沿著直線性的往復路的製程路線來依製程流 程的順序串聯排列配置含平移方式的處理單元的多數個處 理單元之串聯型的處理系統是隨著FPD基板的大型化而系 統長邊方向尺寸(全長尺寸)會不斷地變大,這對於FPD 製造工廠而言在機體(footprint)的面是成爲缺點。 並且,曝光裝置的處理速度高速化,在阻劑塗佈顯像 處理系統中各處理單元會被要求工站時間(TactTime)的 縮短化。其中,在阻劑塗佈工程與預烘烤工程之間夾著減 © 壓乾燥的工程時,因爲減壓乾燥處理需要比較長的時間, 所以減壓乾燥單元的工站時間縮短化最困難。 特別是在光蝕刻微影(Photolithography)使用半色調 曝光製程時,阻劑光罩的膜厚爲通常(約1.5μηι)的約 1.5〜2倍(約2.0〜3.0 μιη ),該部分在阻劑塗佈處理中每 一片基板的溶劑使用量會變多,因此在減壓乾燥單元中溶 劑的蒸發所要的時間會拉長,工站時間縮短化更困難。 本發明是有鑑於上述那樣以往技術的問題點而硏發者 -6 - 201017804 ’其目的是在於提供一種在沿著直線延伸的往復路的製程 路線來依製程流程的順序排列配置複數的處理單元之串聯 型系統中有效率地實現全長尺寸的縮短化及工站時間縮短 化之處理系統。 (用以解決課題的手段) 爲了達成上述目的,本發明的第1觀點之處理系統, Φ 係依製程流程的順序來連接複數的處理單元,而對被處理 基板實施一連串的處理之串聯型的處理系統,其特徵係具 有: 第1製程路線,其係於系統長邊方向中在第1方向包 含:使第1群的處理單元相鄰,或經由搬送系單元來配置 成一列,平移搬送基板的第1往路平移搬送部、及在比該 第1往路平移搬送部更製程流程的下游側平移搬送基板的 第2往路平移搬送部; ❹ 第2製程路線,其係於系統長邊方向中在與前述第1 方向相反的第2方向,使位於比前述第1製程路線更製程 流程的下游側之第2群的處理單元相鄰’或經由搬送系單 元來配列成一列,在系統寬度方向與前述第1製程路線空 出預定尺寸的中庭空間來平行延伸; 第3群的處理單元,其係配置於前述中庭空間;及 第1搬送裝置,其係配置於前述中庭空間,從前述第 1往路平移搬送部的終端側的基板交接部搬出各基板’而 搬送至前述第3群的處理單元之一 ’將在前述第3群的處 201017804 理單元之一完成處理的各基板從該處理單元搬出’而搬入 至前述第2往路平移搬送部的始端側的基板交接部。 又,本發明的第2觀點之處理系統,係依製程流程的 順序來連接複數的處理單元,而對被處理基板實施一連串 的處理之串聯型的處理系統,其特徵係具有: 第1製程路線,其係於系統長邊方向中在第1方向, 使第1群的處理單元相鄰,或經由搬送系單元來配置成一 歹!J而成’ _ 第2製程路線,其係於系統長邊方向中與前述第1方 向相反的第2方向包含:使位於比前述第1製程路線更製 程流程的下游側之第2群的處理單元相鄰,或經由搬送系 單元來配列成一列,平移搬送基板的第1復路平移搬送部 、及在比該第1復路平移搬送部更製程流程的下游側平移 搬送基板的第2復路平移搬送部,在系統寬度方向與前述 第1製程路線空出預定尺寸的中庭空間來平行延伸; 第3群的處理單元,其係配置於前述中庭空間;及 瘳 第1搬送裝置,其係配置於前述中庭空間,從前述第 1復路平移搬送部的終端側的基板交接部搬出各基板,而 搬送至前述第3群的處理單元之一,將在前述第3群的處 理單元之一完成處理的各基板從該處理單元搬出,而搬入 至前述第2復路平移搬送部的始端側的基板交接部。 在本發明的處理系統中,第3群的處理單元及第1搬 送裝置的佔有空間或運轉空間是全部被吸收於中庭空間之 中’不被含在兩製程路線,因此不會增加系統寬度尺寸, -8- 201017804 可實現系統全長尺寸的大幅度縮短化。 在本發明的較佳之一形態中,是在第3群的處理單元 包含對基板之處理的內容及時間實質上相同的第1及第2 處理單元。而且,經由第1往路平移搬送部來對連續不斷 送來的基板交替重複安排第1及第2處理單元。藉由該構 成,可錯開時間來使第1及第2處理單元並列運轉,實現 工站時間的大幅度縮短化。 0 此情況,第1搬送裝置具有可在設於中庭空間的搬送 區域內移動的搬送機器人,第1及第2處理單元較理想是 在系統長邊方向,之間夾著搬送區域來彼此相向配置於中 庭空間。 在較佳之一形態中,第1及第2處理單元係與搬送區 域鄰接配置。而且,搬送機器人係對第1及第2處理單元 直接搬出入基板。 在較佳之一形態中,在中庭空間,爲了對第1處理單 φ 元搬出入基板,而設有在第1處理單元之外及中連續的第 1中庭平移搬送部。而且,搬送機器人係對第1處理單元 經由第1中庭平移搬送部來搬出入基板。 較佳之一形態,係第1中庭平移搬送部具有: 第1中庭基板搬入路,其係與搬送區域鄰接設置; 第1單元內搬送路,其係設於第1處理單元內,可與 第1中庭基板搬入路連接;及 第1中庭基板搬出路,其係由第1處理單元來看可在 與第1中庭基板搬入路相反的側與第1單元內搬送路連接 -9 - 201017804 ,通過第1處理單元之上或下延伸至與搬送區域鄰接的終 端位置。 而且,在對第1處理單元搬入基板時,係於第1中庭 基板搬入路及第1單元內搬送路上搬送基板。 並且,在從第1處理單元搬出基板時,係於第1單元 內搬送路及第1中庭基板搬出路上搬送基板。 別的較佳之一形態,係第1中庭平移搬送部具有:與 搬送區域鄰接而設成上下2段之可昇降的第1中庭基板搬 φ 入路及第1中庭基板搬出路、及設於第1處理單元內,可 選擇性地連接至第1中庭基板搬入路及第1中庭基板搬出 路的任一之第1單元內搬送路。 而且,在對第1處理單元搬入基板時,係使第1中庭 基板搬入路的高度位置對準第1單元內搬送路,在第1中 庭基板搬入路及第1單元內搬送路上,將基板搬送於系統 長邊方向的第1方向。 並且,在從第1處理單元搬出基板時,係使第1中庭 @ 基板搬出路的高度位置對準第1單元內搬送路,在第1單 元內搬送路及第1中庭基板搬出路上,將基板搬送於系統 長邊方向的第2方向。 在較佳之一形態中,係於中庭空間,爲了對第2處理 單元搬出入基板,而設有在第2處理單元之外及中連續的 第2中庭平移搬送部,而且,搬送機器人係對第2處理單 元經由第2中庭平移搬送部來搬出入基板。 在較佳之一形態中,第2中庭平移搬送部具有 -10- 201017804 第2中庭基板搬入路,其係與搬送區域鄰接設置; 第2單元內搬送路,其係設於第2處理單元內,可與 第2中庭基板搬入路連接;及 第2中庭基板搬出路,其係由第2處理單元來看可在 與第2中庭基板搬入路相反的側與第2單元內搬送路連接 ,通過第2處理單元之上或下延伸至與搬送區域鄰接的終 端位置。 φ 而且,在對第2處理單元搬入基板時,係於第2中庭 基板搬入路及第2單元內搬送路上搬送基板。 並且,在從第2處理單元搬出基板時,係於第2單元 內搬送路及第2中庭基板搬出路上搬送基板。 在別的較佳之一形態中,係第2中庭平移搬送部具有 :與搬送區域鄰接而設成上下2段之可昇降的第2中庭基 板搬入路及第2中庭基板搬出路、及設於第2處理單元內 ,可選擇性地連接至第2中庭基板搬入路及第2中庭基板 φ 搬出路的任一之第2單元內搬送路。 而且,在對第2處理單元搬入基板時,係使第2中庭 基板搬入路的高度位置對準第2單元內搬送路,在第2中 庭基板搬入路及第2單元內搬送路上,將基板搬送於系統 長邊方向的第2方向。 並且,在從第2處理單元搬出基板時,係使第2中庭 基板搬出路的高度位置對準第2單元內搬送路,在第2單 元內搬送路及第2中庭基板搬出路上,將基板搬送於系統 長邊方向的第1方向。 -11 - 201017804 若根據較佳之一形態,則於第1製程路線中,在第1 往路平移搬送部的終端側的基板交接部與第2往路平移搬 送部的始端側的基板交接部之間配置有第3處理單元。而 且,第1搬送裝置係對第3處理單元進行基板的搬出入。 在較佳之一形態中,第3處理單元爲在基板上塗佈阻 劑液的阻劑塗佈單元,第1及第2處理單元爲分別使基板 上的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元 ,對阻劑塗佈單元的基板搬出口而言,第1及第2減壓乾 燥單元的基板搬入口爲大致等距離位置。 在此構成中,即使使第1及第2減壓乾燥單元並列運 轉,全部的基板還是會同等隔一定的延遲時間在阻劑塗佈 處理後接受減壓乾燥處理,因此可使阻劑塗佈膜的膜質( 安定性•再現性)提升。 若根據別的較佳之一形態,則於第1製程路線中,在 第1往路平移搬送部的搬送路上,設有在基板上塗佈阻劑 液的阻劑塗佈單元,第1及第2處理單元爲分別使基板上 的阻劑塗佈膜在減壓下乾燥的第1及第2減壓乾燥單元’ 對第1往路平移搬送部的終端側的基板交接部而言’第1 及第2減壓乾燥單元的基板搬入口爲大致等距離位置。 在此構成中,也是即使使第1及第2減壓乾燥單元並 列運轉,全部的基板還是會同等隔一定的延遲時間在阻劑 塗佈處理後接受減壓乾燥處理’因此可使阻劑塗佈膜的膜 質(安定性•再現性)提升。 在較佳之一形態中,具有第2搬送裝置’其係於系統 -12- 201017804 長邊方向的一端部,從被投入系統的任一卡匣取出未處理 的基板來交給第1製程路線,從第2製程路線接收系統內 的所要處理全部完成的基板,而收納於應從系統逐出的任 —IM ° 在別的較佳之一形態中,具有第3搬送裝置,其係於 系統長邊方向的他端部,從第1製程路線搬出基板,而直 接搬入第2製程路線,或使經由外部的處理裝置之後搬入 φ 第2製程路線。 [發明的效果] 若根據本發明的處理系統,則藉由上述那樣的構成及 作用,可在沿著直線延伸的往復路的製程路線來依製程流 程的順序排列配置複數的處理單元之串聯型系統中有效率 地實現全長尺寸的縮短化及工站時間縮短化。 φ 【實施方式】 以下,參照附圖來說明本發明的較佳實施形態。 (第1實施形態) 圖1是表示本發明的第1實施形態之塗佈顯像處理系 統10的佈局構成。此塗佈顯像處理系統10是設置於無塵 室內,例如以玻璃基板作爲被處理基板,在LCD製造製 程中進行光蝕刻微影工程中的洗淨、阻劑塗佈、預烘烤、 顯像及後烘烤等一連串的處理者。曝光處理是在與此系統 -13- 201017804 鄰接設置的外部曝光裝置12進行。 此塗佈顯像處理系統10是在中心部配置橫長的製程 站(P/S) 16,其長邊方向(X方向)兩端部配置卡匣站 (C/S ) 14 與介面站(I/F ) 1 8。 卡匣站(C./S) 14是系統10的卡匣搬出入口,具備: 卡匣平台20,其係可將能多段堆叠基板G而收容複 數片的卡匣C於水平的一方向(Y方向)排列載置至4個 :及 搬送裝置22,其係對此平台20上的卡匣C進行基板 G的出入。 搬送裝置22是由具有可以1片的單位來保持基板G 的搬送臂22a之搬送機器人所構成,可用Χ,Υ,Ζ,Θ的 4軸來動作,能夠進行鄰接的製程站(P/S) 16側與基板 G的交接。 製程站(P/S) 16是沿著延伸於水平的系統長邊方向 (X方向)之互相平行且逆向的一對製程路線A,Β來大 致依製程流程或工程的順序配置複數的處理單元。 更詳細是在從卡匣站(C/S) 14側往介面站(I/F) 18 側的往路之製程路線Α中,依序一列配置搬入單元(ΙΝ-PASS ) 24、準分子UV照射單元(E-UV ) 26、刷子洗淨 (Scrubber )單元(SCR ) 28、附著(adhesion )單元( AD ) 30、冷卻單元(COL) 32、搬出單元(OUT-PASS ) 34、阻劑塗佈單元(CT ) 36、搬入單元(IN-PASS ) 38、 預烘烤單元(PRE-BAKE ) 40、冷卻單元(COL) 42及搬 201017804 出單元(OUT-PASS) 44等,作爲第1群的單元。 在此,準分子UV照射單元(E-UV ) 26、刷子洗淨單 元(SCR) 28、附著單元(AD) 30及冷卻單元(COL) 32 皆是構成爲平移方式的處理單元,從搬入單元(IN-PASS )24到搬出單元(OUT-PASS ) 34鋪設有縱貫上述處理單 元26〜32而延伸之例如滾子搬送路所構成的第i往路平 移搬送部46。[Technical Field] The present invention relates to a processing system for transporting a transport path of a substrate to be processed in a horizontal direction in a series of processing processes in a series of processes. [Prior Art] Conventionally, a resist coating development processing system manufactured by an FPD (Flat Panel Display) is equipped with a translation type processing unit for laying a roller in a horizontal direction in order to increase the size of a substrate to be processed. When the carrier such as a roller is transported horizontally on the translational conveyance path, a predetermined liquid, gas, light, or the like is supplied to the surface to be processed of the substrate, and the desired processing is performed to make the order of the process flow along the horizontal level. The route of the direction is to serially arrange the system configuration or layout standardization of a plurality of processing units including the processing unit of such a translation mode (for example, refer to Patent Document 1). 9 As described in Patent Document 1, such a layout is such that a horizontally long process station is disposed in the center of the system, and a cassette station and a interface station are disposed at both ends in the longitudinal direction. The cassette station carries in and out of the cassette of the unprocessed or processed substrate between the platform in the station and the outside of the system, and the substrate is carried in and out between the cassette on the platform and the processing station. The interface station performs the transfer of the substrate between the adjacent exposure device and the processing station. The process station is a two-row process route with a card station as the starting point and the end point, and the interface station as the turning point and the return path. In general, the process route in the forward route is a unit of the cleaning treatment system, a unit of the resist coating processing system, a unit of -5 - 201017804 thermal processing system, or the like, or a unit arranged in a transport system. . The process route of the re-route is a unit of the development processing system, a unit of the thermal processing system, a unit of the inspection system, and the like, or arranged in a row with the unit of the transport system interposed therebetween. [Patent Document 1] JP-A-2007-200993 SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) _ As described above, the processing method including the translation mode is arranged in series in the order of the process flow along the processing route of the linear reciprocating path The tandem type processing system of the plurality of processing units of the processing unit is such that the length of the system (the full length dimension) of the system becomes larger as the FPD substrate is enlarged, which is a footprint for the FPD manufacturing plant. The face is a disadvantage. Further, the processing speed of the exposure apparatus is increased, and in each of the processing units of the resist coating and developing processing system, the required station time (TactTime) is shortened. Among them, in the case where the process of reducing the pressure between the resist coating process and the prebaking process is carried out, since the vacuum drying process takes a relatively long time, it is most difficult to shorten the station time of the vacuum drying unit. In particular, when a halftone exposure process is used for photolithography, the film thickness of the resistive mask is about 1.5 to 2 times (about 2.0 to 3.0 μm) which is usually (about 1.5 μm), and the portion is in the resist. Since the amount of solvent used per substrate in the coating process is increased, the time required for evaporation of the solvent in the reduced-pressure drying unit is prolonged, and it is more difficult to shorten the station time. The present invention has been made in view of the above-described problems of the prior art, and the purpose of the present invention is to provide a processing unit in which a plurality of processing units are arranged in the order of a process flow in a process route of a reciprocating path extending along a straight line. In the tandem system, the processing system for shortening the full-length size and shortening the station time is efficiently realized. (Means for Solving the Problem) In order to achieve the above object, in the processing system according to the first aspect of the present invention, Φ is a series type in which a plurality of processing units are connected in the order of the process flow, and a series of processes are performed on the substrate to be processed. The processing system is characterized in that: the first process route is included in the first direction of the system in the first direction: the processing units of the first group are adjacent to each other, or are arranged in a row via the transport unit, and the substrate is transferred by translation. The first forward translation transfer unit and the second forward translation transfer unit that translates the substrate on the downstream side of the process flow of the first forward translation transfer unit; ❹ the second process route is in the longitudinal direction of the system The second direction opposite to the first direction is adjacent to the processing unit of the second group on the downstream side of the process flow of the first process route or is arranged in a row via the transport system unit, and is oriented in the system width direction. The first process route vacates a predetermined size of the atrium space to extend in parallel; the third group of processing units are disposed in the atrium space; and the first transport device It is disposed in the atrium space, and one of the processing units that are transported to the third group from the substrate delivery unit on the terminal side of the first forward translation transfer unit and transferred to the third group is disposed at the third group 201017804 Each of the substrates that have been processed by the unit is carried out from the processing unit and moved into the substrate delivery portion on the start side of the second forward translation transfer unit. Further, the processing system according to the second aspect of the present invention is a series processing system in which a plurality of processing units are connected in the order of a process flow, and a series of processing is performed on the substrate to be processed, and the first processing route is characterized in that: It is in the first direction in the longitudinal direction of the system, and the processing units of the first group are adjacent to each other or are arranged in a single pass through the transport system unit! J is a _ second process route, and the second direction opposite to the first direction in the longitudinal direction of the system includes: processing of the second group located on the downstream side of the process flow of the first process route The units are adjacent to each other, or arranged in a row via the transport unit, the first complex translation transport unit that translates the transport substrate, and the second complex translation transfer that translates the substrate on the downstream side of the process flow of the first bypass translation transport unit a portion that extends in parallel with the atrium space of a predetermined size in the system width direction and the first process route; the processing unit of the third group is disposed in the atrium space; and the first conveying device is disposed in the aforesaid The atrium space is carried out from the substrate delivery unit on the terminal side of the first bypass translation transfer unit, and is transported to one of the processing units of the third group, and each of the processing units of the third group is processed. The substrate is carried out from the processing unit, and is carried into the substrate delivery portion on the start side of the second bypass translation transfer unit. In the processing system of the present invention, the occupied space or the running space of the processing unit of the third group and the first conveying device are all absorbed in the atrium space, and are not included in the two process routes, so the system width is not increased. , -8- 201017804 can greatly shorten the overall length of the system. In a preferred aspect of the present invention, the processing unit of the third group includes first and second processing units having substantially the same content and time of processing on the substrate. Further, the first and second processing units are alternately arranged on the continuously fed substrates via the first forward translation transfer unit. According to this configuration, the first and second processing units can be operated in parallel by shifting the time, and the station time can be greatly shortened. In this case, the first transport device has a transport robot that can be moved in the transport area provided in the atrium space, and the first and second processing units are preferably arranged in the longitudinal direction of the system with the transport region interposed therebetween. In the atrium space. In a preferred embodiment, the first and second processing units are disposed adjacent to the transport area. Further, the transport robot directly carries the first and second processing units into and out of the substrate. In a preferred embodiment, in the atrium space, a first atrium translation transfer unit that is continuous outside the first processing unit and is continuous in order to carry the substrate into and out of the first processing unit is provided. Further, the transport robot carries the first processing unit into and out of the substrate via the first atrium translation transport unit. In a preferred embodiment, the first atrium translation transport unit includes: a first atrium substrate loading path that is disposed adjacent to the transport area; and a first unit inner transport path that is provided in the first processing unit and can be first The atrium substrate loading path connection and the first atrium substrate carrying-out path are connected to the first unit inner conveying path on the side opposite to the first atrium substrate carrying path by the first processing unit -9 - 201017804, 1 The processing unit extends above or below the end position adjacent to the transport area. When the substrate is loaded into the first processing unit, the substrate is transported on the first atrium substrate carrying path and the first unit inner conveying path. When the substrate is carried out from the first processing unit, the substrate is transported on the first unit transfer path and the first atrium substrate carry-out path. In a preferred embodiment, the first atrium translation transfer unit has a first atrium substrate transfer path and a first atrium substrate carry-out path that are vertically movable up and down in parallel with the transfer area, and are provided in the first In the processing unit, the first intra-cell transfer path and the first intra-substrate transfer path are selectively connected to any of the first intra-cell transfer paths. When the first processing unit is loaded into the substrate, the height of the first atrium substrate carrying path is aligned with the first unit inner conveying path, and the substrate is transported on the first atrium substrate carrying path and the first unit inner conveying path. The first direction in the direction of the long side of the system. When the substrate is carried out from the first processing unit, the height of the first atrium@substrate transport path is aligned with the first intra-unit transport path, and the first unit inner transport path and the first atrium substrate carry-out path are used. It is transported in the second direction in the direction of the long side of the system. In a preferred embodiment, in the atrium space, a second atrium translation transfer unit that is continuous outside the second processing unit and in the middle of the second processing unit is provided in the atrium space, and the transfer robot is paired. 2 The processing unit carries in and out of the substrate via the second atrium translation transfer unit. In a preferred embodiment, the second atrium translation transport unit has a -10-201017804 second atrium substrate carrying path that is disposed adjacent to the transport area, and the second unit inner transport path is provided in the second processing unit. The second atrium substrate carrying path can be connected to the second atrium substrate carrying-out path, and the second processing unit can be connected to the second cell transfer path on the side opposite to the second atrium substrate carrying path by the second processing unit. 2 The processing unit extends above or below the end position adjacent to the transport area. φ Further, when the second processing unit is loaded into the substrate, the substrate is transported on the second atrium substrate carrying path and the second unit inner conveying path. When the substrate is carried out from the second processing unit, the substrate is transported on the second unit transfer path and the second atrium substrate carry-out path. In another preferred embodiment, the second atrium translation transport unit has a second atrium substrate carrying path and a second atrium substrate carrying-out path that are vertically movable up and down in two stages, and is provided in the second In the processing unit, the second abutment substrate transfer path and the second intra-substrate substrate φ carry-out path are selectively connected to any of the second intra-cell transfer paths. When the second processing unit is loaded into the substrate, the height of the second atrium substrate carrying path is aligned with the second intra-cell transfer path, and the substrate is transported on the second atrium substrate transfer path and the second intra-cell transfer path. The second direction in the direction of the long side of the system. When the substrate is carried out from the second processing unit, the height of the second atrium substrate transport path is aligned with the second intra-cell transport path, and the substrate transport is performed on the second intra-cell transport path and the second atrium substrate transport path. The first direction in the direction of the long side of the system. -11 - 201017804 According to a preferred embodiment, the first substrate route is disposed between the substrate delivery portion on the terminal side of the first forward translation transfer portion and the substrate delivery portion on the start side of the second forward translation transfer portion. There is a third processing unit. Further, the first transfer device carries out the substrate in and out of the third processing unit. In a preferred embodiment, the third processing unit is a resist coating unit that applies a resist liquid on the substrate, and the first and second processing units respectively dry the resist coating film on the substrate under reduced pressure. In the first and second reduced-pressure drying units, the substrate transfer ports of the first and second reduced-pressure drying units are substantially equidistant positions to the substrate transfer port of the resist application unit. In this configuration, even if the first and second decompression drying units are operated in parallel, all of the substrates are subjected to a vacuum drying treatment after the resist coating treatment with a predetermined delay time, so that the resist can be coated. The film quality (stability and reproducibility) of the film is improved. According to another preferred embodiment, in the first process route, a resist coating unit for applying a resist liquid on the substrate is provided on the transport path of the first forward transfer unit, first and second. The processing unit is a first and a second decompression drying unit that respectively dries the resist coating film on the substrate under reduced pressure, and the first and the second substrate transfer unit on the terminal side of the first forward translation transfer unit 2 The substrate transfer inlet of the vacuum drying unit is at a substantially equidistant position. In this configuration, even if the first and second decompression drying units are operated in parallel, all of the substrates are subjected to a reduced-pressure drying treatment after the resist coating treatment with a predetermined delay time. The film quality (stability and reproducibility) of the film is improved. In a preferred embodiment, the second conveying device is attached to one end of the system-12-201017804 in the longitudinal direction, and the unprocessed substrate is taken out from any of the cassettes of the system, and is delivered to the first process route. In the second process route receiving system, all the substrates to be processed are processed, and are stored in the system to be ejected. In any other preferred embodiment, the third transport device is provided in the longitudinal direction of the system. At the other end, the substrate is carried out from the first process route, and directly moved into the second process route, or moved into the φ second process route via the external processing device. [Effects of the Invention] According to the processing system of the present invention, by the above-described configuration and action, it is possible to arrange a series of processing units in the order of the process flow in the process route of the reciprocating path extending along a straight line. In the system, the shortening of the full-length size and the shortening of the station time are efficiently achieved. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. (First Embodiment) Fig. 1 shows a layout configuration of a coating development processing system 10 according to a first embodiment of the present invention. The coating development processing system 10 is disposed in a clean room, for example, using a glass substrate as a substrate to be processed, performing cleaning, resist coating, prebaking, and display in a photolithography lithography process in an LCD manufacturing process. A series of processors like and after baking. The exposure processing is performed on the external exposure device 12 disposed adjacent to the system -13-201017804. In the coating development processing system 10, a horizontally long process station (P/S) 16 is disposed at the center portion, and a card station (C/S) 14 and an interface station are disposed at both ends in the longitudinal direction (X direction). I/F) 1 8. The cassette station (C./S) 14 is a cassette loading and unloading port of the system 10, and includes: a cassette platform 20 which is capable of stacking a plurality of sheets of the substrate G and accommodating a plurality of cassettes C in a horizontal direction (Y) The direction is arranged to be placed in four: and the transfer device 22 is configured to perform the entry and exit of the substrate G on the cassette C on the stage 20. The transporting device 22 is constituted by a transport robot having a transport arm 22a that can hold the substrate G in a single unit, and can be operated by four axes of Χ, Υ, Ζ, Θ, and can be adjacent to a processing station (P/S). The intersection of the 16 side and the substrate G. The process station (P/S) 16 is a pair of process routes A that are parallel and opposite each other along the longitudinal direction (X direction) of the horizontal system, and the plurality of processing units are arranged substantially in the order of the process flow or the engineering process. . More specifically, in the process route from the card side station (C/S) 14 side to the interface station (I/F) 18 side, the loading unit (ΙΝ-PASS) 24 is arranged in sequence, and the excimer UV irradiation is performed. Unit (E-UV) 26, Scrubber unit (SCR) 28, adhesion unit (AD) 30, cooling unit (COL) 32, carry-out unit (OUT-PASS) 34, resist coating Unit (CT) 36, carry-in unit (IN-PASS) 38, pre-baking unit (PRE-BAKE) 40, cooling unit (COL) 42 and moving 201017804 out unit (OUT-PASS) 44, etc., as the first group unit. Here, the excimer UV irradiation unit (E-UV) 26, the brush cleaning unit (SCR) 28, the attachment unit (AD) 30, and the cooling unit (COL) 32 are all processing units configured to be in a translational manner, from the loading unit The (IN-PASS) 24 to the carry-out unit (OUT-PASS) 34 is provided with an i-th path translation transport unit 46 including, for example, a roller transport path extending through the processing units 26 to 32.

0 又,預烘烤單元(PRE-BAKE) 40及冷卻單元(COL )42皆是構成爲平移方式的處理單元,從搬入單元(IN_ PASS) 38到搬出單元(OUT-PASS ) 44鋪設有縱貫上述 處理單元40,42而延伸之例如滾子搬送路所構成的第2 往路平移搬送部48。 阻劑塗佈單元(CT) 36並非是平移方式的處理單元 ,如後述圖2那樣,在平台76上載置固定基板G,在其 上方使阻劑噴嘴78移動或掃描於水平方向,而在基板G φ 上形成阻劑塗佈膜。 另一方面,在從介面站(I/F ) 18側往卡匣站(C/S ) 14側的復路之製程路線B中,依序一列配置搬入單元( 未圖示)、顯像單元(DEV ) 52、後烘烤單元(?〇3丁-BAKE ) 54、冷卻單元(COL) 56、檢査單元(AP) 57及 搬出單元(OUT-PASS) 58等,作爲第2群的單元。在此 ,上述搬入單元(未圖示)是設於周邊裝置(TITLER/EE )50之下,亦即與顯像單元(DEV ) 52同層。 顯像單元(DEV ) 52、後烘烤單元(POST-BAKE ) 54 -15- 201017804 、冷卻單元(COL) 56及檢査單元(AP) 57皆是構成爲 平移方式的處理單元。從上述搬入單元(未圖示)到搬出 單元(OUT-PASS) 58鋪設有縱貫上述處理單元52〜58而 延伸之例如滾子搬送路所構成的復路平移搬送部60。 介面站(I/F) 18是具有用以進行上述往路及復路的 製程路線A,B或鄰接的曝光裝置12與基板G的交易之 搬送裝置62,在此搬送裝置62的旁邊配置周邊裝置( TITLER/EE) 50及旋轉平台(R/S) 64。周邊裝置50是包 含周邊曝光裝置(EE)及打碼機(TITLER )。旋轉平台 (R/S) 64是使基板G在水平面內旋轉的平台,用以在和 曝光裝置12交接時變換長方形的基板G的方向。 在此塗佈顯像處理系統10中,形成有被卡匣站(C/S )14及往路的製程路線A及介面站(I/F) 18以及復路的 製程路線B所包圍筆直延伸於X方向的中庭空間NS。在 此中庭空間NS中,作爲第3群的單元之2台的減壓乾燥 單元66L,66R會彼此相向來分別配置於預定的位置,且 在兩單元66L,66R之間設有1台的搬送裝置68。 圖2是表示減壓乾燥單元66L,66R及搬送裝置68以 及其周圍的處理單元的詳細構成。 第1減壓乾燥單元66L是比第1往路平移搬送部46 的搬出單元(OUT-PASS ) 34更靠製程路線A的上游側, 配置於冷卻單元(COL) 32的旁邊。第2減壓乾燥單元 6 6R是比第2往路平移搬送部48的搬入單元(IN-PASS) 38更靠製程路線a的下游側,配置於預烘烤單元(PRE_ 201017804 BAKE ) 40的旁邊。 在兩減壓乾燥單元66L,66R之間設有搬送區域TE。 搬送裝置68是由具有可以1片的單位來保持基板G的搬 送臂68a之搬送機器人所構成,可用X,Υ,Ζ,Θ的4軸 來動作,移動於搬送區域TE內,可對基板搬入口或搬出 口面臨搬送區域TE的全部單元、亦即兩減壓乾燥單元 66L,66R、第1往路平移搬送部46的搬出單元(OUT-φ PASS) 34、阻劑塗佈單元(CT) 36及第2往路平移搬送 部48的搬入單元(IN-P AS S ) 38進出,而能夠進行該等 的單元與基板G的交接。 各減壓乾燥單元66L,66R可將減壓可能的腔室予以 二分割成上下,從上面開口的托盤或底淺容器型的下部腔 室70 (圖2)將可昇降移動的上部腔室(未圖示)舉起到 上方,而使能夠進行基板G的搬出入。 如圖2所示,下部腔室70是大致四角形,在中心部 φ 配設有用以水平載置基板G而予以支撐的平台72,在底 面的四個角落設有排氣口 74。各排氣口 74是經由排氣管 (未圖示)來連通至真空泵(未圖示)。可在下部腔室70 蓋上上部腔室的狀態下’藉由該真空泵來將兩腔室內被密 閉的處理空間減壓至預定的真空壓力。並且’在各減壓乾 燥單元66L,66R亦具備用以在平台72上進行搬送裝置 68的搬送臂68a與基板G的交接之裝載/卸載機構(未圖 示)。 如圖2所示’阻劑塗佈單元(CT) 36是具有:水平 -17- 201017804 載置基板G而予以保持的平台76、及在被載置於該平台 76上的基板G的上面(被處理面)利用長形的阻劑噴嘴 78來以無旋轉法塗佈阻劑液之塗佈處理部80、及在未進 行塗佈處理的期間爲了下次準備而恢復阻劑噴嘴78的阻 劑液吐出機能的噴嘴更新部82等。 阻劑噴嘴78是具有可在X方向從一端到另一端覆蓋 平台76上的基板G之細縫狀的噴嘴口的長形噴嘴,被連 接至阻劑液供給源(未圖示)。塗佈處理部80是具有在 塗佈處理時使阻劑噴嘴78在平台76的上水平移動於Y方 向的噴嘴移動機構84。此噴嘴移動機構84是具有:水平 支撐阻劑噴嘴78之倒]字狀或門形的支撐體86、及使該支 撐體86在Y方向直進移動於雙方向的直進驅動部88。阻 劑噴嘴78會一邊將阻劑液帶狀地吐出,一邊在平台76上 方從基板G的一端倒另一端水平移動(掃描)於Y方向 ,藉此在基板G的上面(被處理面)宛如鋪設地毯般以所 望的膜厚來形成阻劑液的塗佈膜。另外,亦可將阻劑噴嘴 78的長邊方向設爲Y方向,將塗佈掃描方向設爲X方向 〇 在此阻劑塗佈單元(CT ) 36中,可從中庭空間NS的 搬送區域TE側來進行基板G的搬出入。在平台76上亦 具備用以進行基板G的裝載/卸載之可昇降移動的升降銷 90等。 兩減壓乾燥單元66L,66R是從阻劑塗佈單元(CT) 36的基板搬出入口起左右對稱等距離位置。藉此,可使爲 201017804 了在阻劑塗佈單元(CT) 36完成阻劑塗佈處理的基板G 接受其次工程的減壓乾燥處理,而藉由搬送裝置68來移 送至第1減壓乾燥單元6 6L時的搬送延遲時間與藉由搬送 裝置68來移送至第2減壓乾燥單元66R時的搬送延遲時 間能夠形成相等。 在圖2中,第1往路平移搬送部46是在搬送方向(X 方向)以一定間隔排列棒狀的滾子92來形成滾子搬送路 φ ,藉由馬達及傳動機構等所構成的滾子驅動部(未圖示) 來旋轉驅動各滾子92,構成可在滾子搬送路上搬送基板G 。在冷卻單元(COL) 32內設有冷卻機構(未圖示),其 係藉由熱交換在滾子搬送下通過的基板G,或吹冷風來冷 卻至預定溫度。搬出單元(OUT-PASS ) 34是形成在第1 往路平移搬送部46的滾子搬送路使平移搬送而來的基板 G停止或静止的構成、及在搬送裝置68的搬送臂68a接 收基板G的構成。另外,在第1往路平移搬送部46中, φ 滾子搬送路可被分割成複數的區間,在各區間設有獨立的 滾子驅動部。 同様,第2往路平移搬送部48也是在搬送方向(X 方向)以一定間隔排列棒狀的滾子94來形成滾子搬送路 ,藉由具有馬達及傳動機構等的滾子驅動部(未圖示)來 旋轉驅動各滾子94,構成可在滾子搬送路上搬送基板G。 在預烘烤單元(PRE-BAKE) 40內設有加熱器機構(未圖 示),其係藉由熱交換在滾子搬送下通過的基板G,或吹 熱風來加熱至預定溫度。搬入單元(IN-PASS ) 38是形成 -19- 201017804 由搬送裝置68的搬送臂68a來接收基板G的構成、及可 在剛接收基板G後開始平移搬送(滾子搬送)的構成。在 第2往路平移搬送部48中,也是滾子搬送路可被分割成 複數的區間,在各區間設有獨立的滾子驅動部。 在此,說明此塗佈顯像處理系統對1片基板G的全工 程的處理程序。 首先,在卡匣站(C/S) 14中,搬送裝置22會從平台 20上的任一卡匣C取出一片基板G,且將該取出的基板G 搬入至製程站(P/S) 16的製程路線A側的搬入單元(IN-PASS ) 24。在搬入單元(IN-PASS) 24中,基板G是被 投入製程路線A的第1往路平移搬送部46。 被投入第1往路平移搬送部46的基板G是最初在洗 淨製程部中藉由準分子UV照射單元(E-UV ) 26及刷子 洗淨單元(SCR) 28來依序實施紫外線洗淨處理及刷子洗 淨處理。刷子洗淨單元(SCR) 28是對水平移動於第1往 路平移搬送部46的滾子搬送路上的基板G實施刷洗洗淨 或吹氣洗淨,藉此來從基板表面除去粒子狀的污穢,然後 實施洗滌處理,最後利用氣刀等來使基板G乾燥。一旦完 成刷子洗淨單元(SCR ) 28之一連串的洗淨處理,則基板 G會就那樣下降第1往路平移«送部46的滾子搬送路而 通過熱的處理部(3〇,32)。 在熱的處理部(30,32)中,基板G是最初在附著單 元(AD) 3 0實施利用蒸氣狀的HMDS之附著處理,使被 處理面疏水化。在此附著處理終了後,基板G會在冷卻單 -20- 201017804 元(COL) 32被冷卻至預定的基板溫度。然後,基板G會 進入搬出單元(OUT-PASS) 34,停止於此。 之後不久,搬送裝置68會從中庭空間NS的搬送區域 TE來進出於搬出單元(OUT-PASS) 34,從第1往路平移 搬送部46搬出基板G。其次,搬送裝置68會移動於搬送 區域TE內,而將基板G搬入旁邊的阻劑塗佈單元(CT) 36 ° 在阻劑塗佈單元(CT) 36中,基板G是被載置固定 於平台76上,藉由使細縫噴嘴78水平移動(掃描)之無 旋轉法來對基板G的上面(被處理面)塗佈阻劑液。 一旦在阻劑塗佈單元(CT ) 36完成阻劑塗佈處理, 則搬送裝置68會從中庭空間NS的搬送區域TE來進出於 阻劑塗佈單元(CT) 36,從平台76搬出基板G。其次, 搬送裝置68會移動於搬送區域TE內,將基板G搬入至 兩減壓乾燥單元(VD ) 66L,66R的一方,例如第1減壓 乾燥單元(VD ) 66L。 在第1減壓乾燥單元(VD) 66L中,在平台72上水 平載置基板G之後,關閉腔室(使上部腔室密合於下部腔 室70) ’真空泵作動而開始真空排氣,將腔室內減壓而進 行乾燥處理。此減壓乾燥處理是在減壓下的腔室內從基板 G上的阻劑液膜蒸發有機溶劑(例如稀釋劑),有機溶劑 蒸氣會與其他的氣體一起從腔室的排氣口 74通過排氣管 來送往真空泵側。一旦以一定時間完成減壓乾燥處理,則 開啓腔室(使上部腔室往上方離開下部腔室70),卸載基 -21 - 201017804 板G。 搬送裝置62會進出於第1減壓乾燥單元(VD) 66L ’而搬出完成減壓乾燥處理的基板G。其次,移動於搬送 區域TE內,將基板G搬入至搬入單元(IN-PASS) 38。 之後不久,在第2往路平移搬送部48開始滾子搬送,基 板G平移搬送至製程路線A的下游側,通過熱的處理部 (40 , 42) ° 在熱的處理部(40,42)中,基板G是最初在預烘烤 單元(PRE-BAKE ) 40接受預烘烤,作爲阻劑塗佈後的熱 處理或曝光前的熱處理。藉由此預烘烤,殘留於基板G上 的阻劑膜中之溶劑會蒸發而被除去,阻劑膜對基板的密合 性會被強化。其次,基板G會在冷卻單元(COL) 42被冷 卻至預定的溫度。然後,基板G會從第2往路平移搬送部 48的終點的搬出單元(OUT-PASS) 44退出至介面站( I/F ) 18的搬送裝置62。 在介面站(I/F) 18中,基板G是在旋轉平台64例如 接受90度的方向變換之後搬入至周邊裝置50的周邊曝光 裝置(EE),在此接受用以在顯像時除去附著於基板G 的周邊部的阻劑之曝光後,送往旁邊的曝光裝置12。 曝光裝置12是對基板G上的阻劑曝光預定的電路圖 案。然後,完成圖案曝光的基板G是從曝光裝置12回到 介面站(I/F) 18,首先搬入至周邊裝置50的打碼機( TITLER ),在基板G上的預定部位記上預定的資訊。然 後,基板G會藉由搬送裝置62來搬入周邊裝置50之下的 -22- 201017804 搬入單元(未圖示)。 如此,基板G將會搭乘於復路的製程路線B所鋪設的 復路平移搬送部60的滾子搬送路來往卡匣站(C/S) 14移 動。 在最初的顯像單元(DEV ) 52中,基板G是在平移搬 送間實施顯像、洗滌、乾燥的一連串顯像處理。 在顯像單元(DEV) 52完成一連串的顯像處理的基板 φ G是就那樣維持搭乘於復路平移搬送部60的滾子搬送路 來依序通過熱的處理部(54,56)及檢査單元(AP) 57。 在熱的處理部(54,56)中,基板G最初是在後烘烤 單元(POST-BAKE ) 54接受後烘烤,作爲顯像處理後的 熱處理。藉由此後烘烤來蒸發除去在基板G上的阻劑膜所 殘留的顯像液或洗淨液,強化阻劑圖案對基板G的密合性 。其次,基板G是在冷卻單元(COL) 56被冷卻成預定的 溫度。在檢査單元(AP) 57是針對基板G上的阻劑圖案 φ 進行非接觸的線寬檢査或膜質·膜厚檢査等。 搬出單元(OUT-PASS ) 58會從復路平移搬送部60接 收完成全工程的處理之基板G,而交給卡匣站(C/S) 14 的搬送機構22。在卡匣站(C/s) 14側,搬送機構22會 將從搬出單元(OUT-PASS) 58接收之完成處理的基板G 收容於1個(通常是原來)的卡匣C。0, the pre-baking unit (PRE-BAKE) 40 and the cooling unit (COL) 42 are all processing units configured to be in a translational manner, and are arranged from the loading unit (IN_PASS) 38 to the unloading unit (OUT-PASS) 44. The second forward translation transport unit 48, which is formed by the roller transport path, extends through the processing units 40 and 42. The resist coating unit (CT) 36 is not a translating processing unit. As shown in FIG. 2 described later, the fixed substrate G is placed on the stage 76, and the resist nozzle 78 is moved or scanned in the horizontal direction above the substrate. A resist coating film is formed on G φ . On the other hand, in the process route B of the re-route from the interface station (I/F) 18 side to the cassette station (C/S) 14 side, the carry-in unit (not shown) and the developing unit are arranged in a row ( DEV) 52, a post-baking unit (??3-BAKE) 54, a cooling unit (COL) 56, an inspection unit (AP) 57, and an unloading unit (OUT-PASS) 58 are used as units of the second group. Here, the carry-in unit (not shown) is provided under the peripheral device (TITLER/EE) 50, that is, in the same layer as the developing unit (DEV) 52. The developing unit (DEV) 52, the post-baking unit (POST-BAKE) 54 -15-201017804, the cooling unit (COL) 56 and the inspection unit (AP) 57 are all processing units configured to be in a translational manner. A reversing translation transport unit 60 including, for example, a roller transport path extending through the processing units 52 to 58 is disposed from the loading unit (not shown) to the unloading unit (OUT-PASS) 58. The interface station (I/F) 18 is a transport device 62 having a process route A, B for performing the above-described approach and re-routing, or a transaction between the adjacent exposure device 12 and the substrate G, and a peripheral device is disposed beside the transfer device 62 ( TITLER/EE) 50 and rotating platform (R/S) 64. Peripheral device 50 includes a peripheral exposure device (EE) and a coder (TITLER). The rotary table (R/S) 64 is a platform for rotating the substrate G in the horizontal plane for converting the direction of the rectangular substrate G when it is transferred to the exposure device 12. In the coating development processing system 10, the process route A and the interface station (I/F) 18 formed by the cassette station (C/S) 14 and the forward path, and the process route B of the re-route are formed to extend straight through the X. Direction of the atrium space NS. In the atrium space NS, the two decompression drying units 66L and 66R, which are the units of the third group, are disposed at predetermined positions toward each other, and one of the two units 66L and 66R is disposed. Device 68. Fig. 2 is a view showing the detailed configuration of the processing units at and around the reduced-pressure drying units 66L, 66R and the conveying device 68. The first decompression drying unit 66L is disposed on the upstream side of the process route A than the unloading unit (OUT-PASS) 34 of the first forward translation conveying unit 46, and is disposed beside the cooling unit (COL) 32. The second decompression drying unit 6 6R is disposed on the downstream side of the process route a than the loading unit (IN-PASS) 38 of the second forward translation conveying unit 48, and is disposed beside the pre-baking unit (PRE_201017804 BAKE) 40. A transfer area TE is provided between the two decompression drying units 66L, 66R. The transporting device 68 is constituted by a transport robot having a transport arm 68a that can hold the substrate G in a single unit, and can be operated by four axes of X, Υ, Ζ, Θ, and moved in the transport area TE to carry in the substrate. The port or the transfer port faces all the units of the transfer area TE, that is, the two decompression drying units 66L, 66R, the carry-out unit (OUT-φ PASS) 34 of the first forward transfer unit 46, and the resist coating unit (CT) 36 The loading unit (IN-P AS S ) 38 of the second forward translation transport unit 48 is moved in and out, and the units can be transferred to the substrate G. Each of the decompression drying units 66L, 66R can divide the chambers under pressure decompression into two upper and lower chambers, and move the upper chamber that can be moved up and down from the upper tray 70 or the bottom container type lower chamber 70 (Fig. 2). Not shown in the figure, the upper side is lifted, and the substrate G can be carried in and out. As shown in Fig. 2, the lower chamber 70 has a substantially quadrangular shape, and a platform 72 for supporting the substrate G to be horizontally placed is disposed at the center portion φ, and an exhaust port 74 is provided at four corners of the bottom surface. Each of the exhaust ports 74 is connected to a vacuum pump (not shown) via an exhaust pipe (not shown). The closed processing space in the two chambers can be depressurized to a predetermined vacuum pressure by the vacuum pump in a state where the lower chamber 70 is covered with the upper chamber. Further, each of the decompression drying units 66L, 66R is provided with a loading/unloading mechanism (not shown) for transferring the transfer arm 68a of the conveying device 68 to the substrate G on the stage 72. As shown in FIG. 2, the resist coating unit (CT) 36 is a platform 76 having a horizontal -17-201017804 mounting substrate G and being held on the substrate G placed on the platform 76 ( The surface to be treated is a coating treatment unit 80 that applies a resist liquid by a non-rotation method using a long resist nozzle 78, and restores the resistance of the resist nozzle 78 for the next preparation period without performing a coating process. The nozzle refreshing unit 82 and the like of the agent liquid discharge function. The resist nozzle 78 is an elongated nozzle having a slit-like nozzle opening which covers the substrate G on the stage 76 from one end to the other end in the X direction, and is connected to a resist liquid supply source (not shown). The coating processing unit 80 has a nozzle moving mechanism 84 that horizontally moves the resist nozzle 78 in the Y direction on the stage 76 during the coating process. The nozzle moving mechanism 84 is a support body 86 having an inverted shape or a gate shape that horizontally supports the resist nozzle 78, and a linear drive unit 88 that linearly moves the support body 86 in the Y direction in both directions. The resist nozzle 78 is horizontally moved (scanned) in the Y direction from the one end of the substrate G to the other end while the resist liquid is discharged in a strip shape, so that the upper surface (processed surface) of the substrate G is like A coating film of a resist liquid is formed in a film thickness as expected by laying a carpet. Further, the longitudinal direction of the resist nozzle 78 may be set to the Y direction, and the coating scanning direction may be set to the X direction. The resist coating unit (CT) 36 may be used to transfer the TE from the atrium space NS. The substrate G is carried in and out. The platform 76 is also provided with a lift pin 90 for lifting and unloading the substrate G, and the like. The two decompression drying units 66L, 66R are symmetrical and equidistant positions from the substrate carrying-out port of the resist coating unit (CT) 36. Thereby, the substrate G which has been subjected to the resist coating treatment in the resist coating unit (CT) 36 can be subjected to the vacuum drying treatment of the next step, and transferred to the first vacuum drying by the conveying device 68. The transport delay time in the case of the unit 6 6L can be made equal to the transport delay time when the transport device 68 transfers to the second decompression drying unit 66R. In FIG. 2, the first forward translation transfer unit 46 is formed by arranging rod-shaped rollers 92 at regular intervals in the transport direction (X direction) to form a roller transport path φ, and a roller composed of a motor and a transmission mechanism. The drive unit (not shown) rotatably drives the rollers 92 to configure the substrate G to be transported on the roller transport path. A cooling mechanism (not shown) is provided in the cooling unit (COL) 32, which cools to a predetermined temperature by heat exchange of the substrate G which is passed under the roller conveyance or by blowing cold air. The carry-out unit (OUT-PASS) 34 is a configuration in which the roller transport path formed in the first forward translation transport unit 46 stops or stops the substrate G that has been transferred by translation, and the transport arm 68a of the transport device 68 receives the substrate G. Composition. Further, in the first forward translation transport unit 46, the φ roller transport path can be divided into a plurality of sections, and independent roller drive sections are provided in each section. In the same manner, the second forward translation transport unit 48 also forms a roller-shaped roller 94 at a predetermined interval in the transport direction (X direction) to form a roller transport path, and has a roller drive unit including a motor and a transmission mechanism (not shown). Each of the rollers 94 is rotationally driven to form a substrate G that can be transported on the roller transport path. A heater mechanism (not shown) is provided in the pre-baking unit (PRE-BAKE) 40, which is heated to a predetermined temperature by heat exchange of the substrate G which is passed under the roller conveyance or by blowing hot air. The loading unit (IN-PASS) 38 is a configuration in which the substrate G is received by the transfer arm 68a of the transport device 68 in the formation of -19-201017804, and the translation transfer (roller transport) is started immediately after the substrate G is received. In the second forward translation transport unit 48, the roller transport path can be divided into a plurality of sections, and independent roller drive sections are provided in each section. Here, the processing procedure of the entire development of the one substrate G by the coating development processing system will be described. First, in the cassette station (C/S) 14, the transport device 22 takes out one of the substrates G from any of the cassettes C on the stage 20, and carries the taken-out substrate G into the process station (P/S) 16 The loading unit (IN-PASS) 24 on the side of the process route A. In the carry-in unit (IN-PASS) 24, the substrate G is the first forward translation transfer unit 46 that is put into the process route A. The substrate G to be fed into the first forward transfer unit 46 is initially subjected to ultraviolet cleaning by the excimer UV irradiation unit (E-UV) 26 and the brush cleaning unit (SCR) 28 in the cleaning process unit. And brush cleaning treatment. In the brush cleaning unit (SCR) 28, the substrate G that has been horizontally moved on the roller transport path of the first forward translation transport unit 46 is subjected to brush washing or air blowing, thereby removing particulate contamination from the surface of the substrate. Then, the washing treatment is carried out, and finally the substrate G is dried by an air knife or the like. When a series of cleaning processes of the brush cleaning unit (SCR) 28 are completed, the substrate G is lowered by the first path translation «the roller conveying path of the feeding portion 46 and passed through the heat processing unit (3, 32). In the heat treatment unit (30, 32), the substrate G is first subjected to an adhesion treatment using a vaporous HMDS to the attachment unit (AD) 30 to hydrophobize the surface to be treated. After the end of the adhesion process, the substrate G is cooled to a predetermined substrate temperature in the cooling sheet -20-201017804 (COL) 32. Then, the substrate G enters the carry-out unit (OUT-PASS) 34 and stops there. After that, the transport device 68 advances into the carry-out unit (OUT-PASS) 34 from the transport area TE of the atrium space NS, and carries out the substrate G from the first forward transfer unit 46. Next, the transfer device 68 moves in the transfer region TE, and the substrate G is carried into the resist coating unit (CT) 36° in the resist coating unit (CT) 36, and the substrate G is placed and fixed on the substrate G. On the stage 76, a resist liquid is applied to the upper surface (processed surface) of the substrate G by a non-rotation method in which the slit nozzle 78 is horizontally moved (scanned). Once the resist coating process is completed in the resist coating unit (CT) 36, the transfer device 68 advances from the transfer area TE of the atrium space NS into the resist coating unit (CT) 36, and the substrate G is carried out from the stage 76. . Next, the conveying device 68 moves into the conveying area TE, and the substrate G is carried into one of the two decompression drying units (VD) 66L, 66R, for example, the first decompression drying unit (VD) 66L. In the first decompression drying unit (VD) 66L, after the substrate G is placed horizontally on the stage 72, the chamber is closed (the upper chamber is brought into close contact with the lower chamber 70), and the vacuum pump is activated to start vacuum evacuation. The chamber is decompressed and dried. The vacuum drying treatment is to evaporate an organic solvent (for example, a diluent) from a resist liquid film on the substrate G in a chamber under reduced pressure, and the organic solvent vapor is discharged from the chamber exhaust port 74 together with other gases. The trachea is sent to the side of the vacuum pump. Once the vacuum drying treatment has been completed for a certain period of time, the chamber is opened (the upper chamber is moved upward from the lower chamber 70), and the base -21 - 201017804 plate G is unloaded. The conveying device 62 carries out the first decompression drying unit (VD) 66L' and carries out the substrate G which has been subjected to the reduced-pressure drying treatment. Then, the substrate G is moved into the transport unit TE, and the substrate G is carried into the carry-in unit (IN-PASS) 38. After that, the second forward translation transfer unit 48 starts the roller transport, and the substrate G is translated and transported to the downstream side of the process route A, and passes through the heat processing unit (40, 42) ° in the heat processing unit (40, 42). The substrate G is initially subjected to prebaking in a pre-baking unit (PRE-BAKE) 40 as a heat treatment after resist coating or a heat treatment before exposure. By this prebaking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Second, the substrate G is cooled to a predetermined temperature in the cooling unit (COL) 42. Then, the substrate G is ejected from the carry-out unit (OUT-PASS) 44 at the end of the second forward translation transport unit 48 to the transport device 62 of the interface station (I/F) 18. In the interface station (I/F) 18, the substrate G is a peripheral exposure device (EE) that is carried into the peripheral device 50 after the rotary table 64 is subjected to, for example, a 90-degree direction change, and is received therein for removing the adhesion during development. After exposure of the resist on the peripheral portion of the substrate G, it is sent to the adjacent exposure device 12. The exposure device 12 is a predetermined circuit pattern for exposing the resist on the substrate G. Then, the substrate G on which the pattern exposure is completed is returned from the exposure device 12 to the interface station (I/F) 18, first loaded into the peripheral device 50 (TITLER), and predetermined information is recorded on a predetermined portion on the substrate G. . Then, the substrate G is carried into the -22-201017804 carrying unit (not shown) under the peripheral device 50 by the transport device 62. In this manner, the substrate G is moved to the cassette station (C/S) 14 by the roller transport path of the return path translation transport unit 60 laid on the process route B of the return path. In the first developing unit (DEV) 52, the substrate G is a series of developing processes for performing development, washing, and drying between translational transports. The substrate φ G that has completed a series of development processes in the developing unit (DEV) 52 is a processing unit (54, 56) and an inspection unit that sequentially pass the heat by the roller transport path of the bypass translation/transport unit 60. (AP) 57. In the heat treatment portion (54, 56), the substrate G is initially subjected to post-baking after the post-baking unit (POST-BAKE) 54 as a heat treatment after development processing. The developing liquid or the cleaning liquid remaining on the resist film on the substrate G is evaporated by this post-baking to enhance the adhesion of the resist pattern to the substrate G. Next, the substrate G is cooled to a predetermined temperature at the cooling unit (COL) 56. The inspection unit (AP) 57 performs a non-contact line width inspection, a film quality, a film thickness inspection, and the like on the resist pattern φ on the substrate G. The carry-out unit (OUT-PASS) 58 receives the substrate G that has completed the processing of the entire project from the return path translation transport unit 60, and delivers it to the transport mechanism 22 of the cassette station (C/S) 14. On the side of the cassette station (C/s) 14, the transport mechanism 22 accommodates the completed substrate G received from the carry-out unit (OUT-PASS) 58 in one (usually the original) cassette C.

如上述般,此塗佈顯像處理系統10是在往路的製程 路線A中鋪設:終端於阻劑塗佈單元(CT) 36之前的第 1往路平移搬送部46、及開始於預烘烤單元(PRE-BAKE -23- 201017804 )40之前的第2往路平移搬送部48,且在與阻劑塗佈單 元(CT) 36鄰接的中庭空間NS中使第1及第2減壓乾燥 單元(VD ) 66L,66R互相對向分別設置於預定位置的同 時,設置搬送裝置68。此搬送裝置68是在設於中庭空間 NS的搬送區域TE內移動,可進出於兩減壓乾燥單元66L ,66R、第1往路平移搬送部46的搬出單元(OUT-PASS )34、阻劑塗佈單元(CT) 36及第2往路平移搬送部48 的搬入單元(IN-PASS ) 38,可進行該等的單元與基板G 的交接。 藉由該構成,在此塗佈顯像處理系統10中,第1及 第2減壓乾燥單元(VD) 68L,68R的佔有空間是被吸收 於中庭空間NS之中,不含於兩製程路線A,B中,因此 不會增加系統寬度尺寸(Y方向尺寸),可實現系統全長 尺寸(X方向尺寸)的大幅度縮短化。 而且,在此塗佈顯像處理系統10中,第1及第2減 壓乾燥單元66L,66R是具有相同的構成•機能,對基板 G之減壓乾燥的處理內容及處理時間實質上是相同。然後 ,對於經由第1往路平移搬送部46依序傳送而來的基板 G,在阻劑塗佈單元(CT ) 3 6剛接受阻劑塗佈處理之後, 交替重複安排第1及第2減壓乾燥單元66L,66R。 例如,奇數個的各基板G是在阻劑塗佈單元(CT) 36接受阻劑塗佈處理之後移送至第1減壓乾燥單元66L, 在此接受減壓乾燥處理之後,送往第2往路平移搬送部48 的搬入單元(IN-PASS ) 38。另一方面,偶數個的各基板 201017804 G是在阻劑塗佈單元(CT) 36接受阻劑塗佈處理之後移 送至第2減壓乾燥單元66R,在此接受減壓乾燥處理之後 ,送往第2往路平移搬送部48的搬入單元(IN-PASS) 38 〇 因此,若第1及第2減壓乾燥單元66L,66R的1台 分的工站時間設爲t,則在間隔t/2的時間差來並列運轉2 台之下,可將全體工站時間形成t/2。如此,1次的處理時 φ 間長的減壓乾燥單元會減半其工站時間,藉此使系統全體 的工站時間律速的主要因素會消失。因此,即使曝光裝置 12的處理速度高速化,或在光蝕刻微影使用半色調曝光製 程,此塗佈顯像處理系統還是可充分從容地對應。 並且,在此塗佈顯像處理系統中,對於阻劑塗佈單元 (CT) 36的基板搬出口而言,第1及第2減壓乾燥單元 66L,66R會被配置成等距離,因此從完成阻劑塗佈處理 的時間點到開始減壓乾燥處理的延遲時間在奇數個的基板 φ G與偶數個的基板G爲一致也是件重要的事。亦即,來自 阻劑塗佈膜之溶劑的蒸發是從剛塗佈之後就開始,一旦蒸 發剛開始之後的乾燥情況有不均,則會有即使藉由其後的 減壓乾燥處理或預烘烤也無法補償的情形。在此塗佈顯像 處理系統,即使第1及第2減壓乾燥單元66L,66R並列 運轉,全部的基板G還是會相等隔一定的延遲時間在阻劑 塗佈處理後接受減壓乾燥處理,因此可使阻劑塗佈膜的膜 質(安定性•再現性)提升。 -25- 201017804 (第2實施形態) 圖3是表示本發明的第2實施形態的塗佈顯像處理系 統100的佈局構成。圖中,對於具有和上述第1實施形態 的塗佈顯像處理系統10內的構成要素實質同一構成或機 能的部分附上同—符號,且省略其說明。並且’在圖4〜 圖6中顯示此塗佈顯像處理系統100的要部的詳細佈局或 構成。 在此第2實施形態的系統100中,與上述第1實施形 態的系統1〇相異的主要部分是被配置於中庭空間NS的第 1及第2減壓乾燥單元102 L,102R並非將基板固定於平 台上的方式,而是構成爲平移方式的減壓乾燥裝置。 在中庭空間NS,爲了在第1及第2減壓乾燥單元 102L,102R以平移搬出入基板G,而設有在該等的單元 102L,102R之外及中連續的第1及第2中庭平移搬送部 104L,104R。然後,搬送裝置68可對第1及第2減壓乾 燥單元102L,102R分別經由第1及第2中庭平移搬送部 104L,104R來搬送基板G。 如圖4所示,第1中庭平移搬送部104L是具有: 中庭基板搬入路106,其係設於與搬送區域TE鄰接 的搬入單元(IN-PASS) 105內; 單元內搬送路108,其係設於第1減壓乾燥單元1〇2L 內,與中庭基板搬入路106連接; 中庭基板搬出路114,其係由第1減壓乾燥單元1〇2L 來看可在位於和搬入單元(IN-PASS) 105相反側的升降 -26- 201017804 機室(EV) 110與單元內搬送路108連接,通過第1減壓 乾燥單元102L的上面延伸至與搬送區域TE鄰接的搬出單 元(OUT-PASS ) 112。 中庭基板搬入路106、單元內搬送路108及中庭基板 搬出路114是在搬送方向(X方向)以一定間隔排列棒狀 或陀螺狀的滾子116而形成滾子搬送路,藉由具有馬達及 傳動機構等的滾子驅動部(未圖示)來旋轉驅動各滾子 116,構成可在滾子搬送路上搬送基板G。在此,可在各 區間(106,108,114)具備獨立的滾子驅動部(未圖示 )° 並且,中庭基板搬出路114的滾子搬送路是被分割成 升降機室(EV) 110內的滾子搬送路114a、及第1減壓乾 燥單元102L的上層的中間搬送室118內的滾子搬送路 114b、及搬出單元(OUT-PASS) 112內的滾子搬送路 114c的3區間,可在各區間具備獨立的滾子驅動部(未圖 示)。 升降機室(EV) 110內的滾子搬送路114a是被安裝 於可昇降移動的滾子支撐部120,可藉由例如汽缸所構成 的昇降驅動部122的昇降驅動來移動於可與第1層的單元 內搬送路(滾子搬送路)1〇8連接的第1高度位置'及 可與第2層的中間搬送室U8內的滾子搬送路114b連接 的第2高度位置H2之間。 在將基板G搬入第1減壓乾燥單元102L時,首先, 搬送裝置68會從中庭空間NS的搬送區域TE來對搬入單 -27- 201017804 元(IN-PASS) 105內搬入基板G。緊接著,在中庭基板 搬入路106及單元內搬送路108上開始滾子搬送動作,基 板G會從搬入單元(IN-PASS) 105搬入至第1減壓乾燥 單元102L 。 並且,在從第1減壓乾燥單元102L搬出基板G時, 首先,在滾子搬送路108,114a上進行滾子搬送動作,基 板G會從第1減壓乾燥單元102L搬出至升降機室(EV) 110的第1層。其次,在升降機室(EV) 110內,滾子搬 _ 送路114a上昇,基板G會被移至第2層。其次,在滾子 搬送路114a,114b,114c上進行滾子搬送動作,基板G 會從升降機室(EV) 110通過中間搬送室118來移至搬出 單元(OUT-PASS) 112。然後,搬送裝置68會從中庭空 間NS的搬送區域TE來接受基板G,從搬出單元(OUT-PASS ) 1 12 搬出。 在圖4中,減壓乾燥單元(VD) 1 02L是具有一體形 式之減壓可能的腔室124,其係具有扁平的長方體形狀。 @ 在基板搬送方向(X方向)在腔室124的相對向的一對側 壁分別設有附遮板或閘閥之可開閉的基板搬入口 126及基 板搬出口 128。在腔室124內設有上述單元內搬送路(滾 子搬送路)108。 在此減壓乾燥單元(VD ) 102L具有用以上升下降的 升降銷機構(未圖示), 其係於腔室124內在用以搬入或搬出基板G的高度位 置(滾子116上的位置)與爲了減壓乾燥處理的高度位置 -28- 201017804 (從滾子116浮至上方的位置)之間上升下降。 在腔室124的底壁設有1個或複數的排氣口 130。該 等的排氣口 130是經由排氣管132來連接至真空泵134的 入側。在排氣管1 3 2的途中設有開閉閥1 3 6。 圖5及圖6是表示搬入單元(IN-PASS) 105的內部 之一構成例。 在搬入單元(IN-PASS) 105內,如圖5所示,空出 0 比基板G更大的間隔來設有在搬送方向(X方向)平行延 伸的一對水平框架14 0A,140B。在該等的水平框架14 0A ,14〇B之間,空出適當的間隔來平行排列配置有複數根 (圖示的例子是4根)的棒狀支撐構件142。各棒狀支撐 構件142是被延伸於與搬送方向(X方向)正交的方向( Y方向)的複數根(圖示的例子是3根)的樑144所支撐 。如圖6所示,樑144的兩端部是分別被固定於水平框架 1 40A,1 40B 的下面。 φ 在棒狀支撐構件142的上面,用以搭載支撐基板G的 球狀的自由滾子146會以一定的間距來安裝多數個。 從搬入單元(IN-PASS ) 105的入口側來看,在水平 框架140A,140B的後端部(最後部)安裝有架橋型的驅 動滾子148。此驅動滾子148是在架設於水平框架14 0A, 140B之間的旋轉軸148a隔著一定的間隔來一體固定多數 的陀螺狀滾子或滾筒148b ’可經由滑輪150利用旋轉驅動 部152來旋轉驅動。 在水平框架140 A,140B,在其長度方向隔著一定的 -29- 201017804 間隔來安裝有多數的單邊支持型的驅動滾子154。該等的 驅動滾子154可在水平框架140A,140B的外側經由驅動 皮帶156來旋轉驅動。在此,驅動皮帶156是經由滑輪 150來連接至旋轉驅動部152。 驅動滾子148,154及自由滾子146是構成上述中庭 基板搬入路106。 搬出單元(OUT-PASS) 112內的構成亦除了搬送方向 或搬送動作成相反的點以外,其餘與上述搬入單元(IN-PASS ) 105內的構成相同》 又,第2減壓乾燥單元102R及第2中庭平移搬送部 104R亦由阻劑塗佈單元(CT) 36來看僅左右對稱配置位 置相異,其餘則具有分別與上述第1減壓乾燥單元102L 及第1中庭平移搬送部104L同樣的構成,發揮同樣的作 用。 .在此第2實施形態的塗佈顯像處理系統100中也是與 上述第1實施形態的塗佈顯像處理系統10同樣,可實現 系統全長尺寸及工站時間之大幅度的縮短化。 (比較例) 另外,就參考例(比較例)而言,可想像如圖7所示 ,在製程路線A中,於第2往路平移搬送部48的途中, 亦即搬入單元(IN-PASS ) 38與預烘烤單元(PRE-BAKE )4〇之間配置第1平移式減壓乾燥單元102L,在中庭空 間NS配置第2平移式減壓乾燥單元l〇2R的佈局。 201017804 此情況,在製程路線A上,在第2往路平移搬送部 48的搬入單元(IN-P AS S) 38與第1平移式減壓乾燥單元 102L之間、及第1平移式減壓乾燥單元l〇2L與預烘烤單 元(PRE-B AKE ) 40之間分別配置有第1及第2橫向輸送 機(CR-PASS) 160,162»而且,夾著第2平移式減壓乾 燥單元102R,且鄰接於第1及第2橫向輸送機(CR-PASS )160,162鄰接,在中庭空間NS分別配置有第3及第4 _ 橫向輸送機(CR-PASS ) 164,166。 在此,各個的橫向輸送機(CR-PASS) 160〜166是具 有相正交的平移搬送路及搬送驅動部,可選擇性地切換平 移的X方向輸送機動作與平移的Y方向輸送機動作。 例如,第1橫向輸送機(CR-PASS) 160是從搬入單 元(IN-PASS ) 38平移接收的基板G中,奇數個的基板G 是就那樣直接搬入第1平移式減壓乾燥單元102L,偶數 個的基板G是轉送至第3橫向輸送機(CR-PASS ) 164。 φ 第3橫向輸送機(CR-PASS) 164是將從第1橫向輸 送機( CR-PASS) 160接收的偶數個的基板G搬入至第2 平移式減壓乾燥單元102R。 第4橫向輸送機(CR-PASS) 166是搬出在第2平移 式減壓乾燥單元102R完成減壓乾燥處理的偶數個的基板 G,轉送至第2橫向輸送機(CR-PASS ) 162。 第2橫向輸送機(CR-PASS) 162是從第1平移式減 壓乾燥單元102L搬出完成減壓乾燥處理的奇數個的基板 G,予以送往後段的預烘烤單元(PRE-BAKE ) 40。並且, -31 - 201017804 從第4橫向輸送機(CR-PASS) 166接收減壓乾燥處理完 成的偶數個的基板G,予以送往後段的預烘烤單元(?尺^-BAKE ) 40。 圖7的佈局是使第1及第2平移式減壓乾燥單元 102L,102R並列運轉,藉此雖可實現工站時間的縮短化 ,但因爲在製程路線A會被插入一列2台的橫向輸送機( CR-PASS ) 160,162及1台的減壓乾燥單元102L,所以 合倂該等3台的單元(160,102L,162)之X方向尺寸L 會就那樣使製程路線A的全長增大,進而使系統的全長增 大,無法實現系統全長尺寸的縮短化。並且,將在阻劑塗 佈單元(CT) 36完成阻劑塗佈處理的基板G送至第1平 移式減壓乾燥單元102L時與送至第2平移式減壓乾燥單 元1 02R時亦有搬送延遲時間相異的缺點。 (第3實施形態) 圖8是表示本發明的第3實施形態的塗佈顯像處理系 統170的佈局構成。圖中,對於具有和上述第1實施形態 的塗佈顯像處理系統1〇內的構成要素實質同一構成或機 能的部分附上同一符號,且省略其說明。並且,在圖9中 顯示此塗佈顯像處理系統170的阻劑塗佈單元(CT) 172 的構成。 在此第3實施形態的系統170中,與上述第1實施形 態的系統1 〇相異的主要部分是阻劑塗佈單元(CT ) 1 72 並非將基板固定於平台上的方式,而是構成爲平移方式的 -32- 201017804 阻劑塗佈裝置,在往路的製程路線A中此阻劑塗佈單元( CT) 172是沿著第1往路平移搬送部46來配置於比搬出 單元(OUT-PASS ) 34更上游的位置。 如圖9所示,阻劑塗佈單元(CT ) 172是具有: 塗佈用的浮上平台174,其係構成第1往路平移搬送 部46的一部分或一區間; 基板搬送機構176,其係將在該塗佈用浮上平台174 φ 上浮在空中的基板G搬送於浮上平台長邊方向(X方向) 9 阻劑噴嘴178,其係對被搬送於浮上平台174上的基 板G上面供給阻劑液;及 噴嘴更新部180,其係於塗佈處理的空閒時間更新阻 劑噴嘴1 7 8。 在浮上平台174的上面設有將預定的氣體(例如空氣 )噴射至上方的多數個氣體噴射孔182,可藉由從該等的 ❿ 氣體噴射孔182所噴射的氣體壓力來使基板G從平台上面 浮上於一定的高度。 基板搬送機構176是具備:隔著浮上平台174來延伸 爲X方向的一對導軌184A,184B、及可沿著該等的導軌 1 84A,18 4B來往復移動的滑塊186、及以能夠在浮上平台 174上可裝卸地保持基板G的兩側端部之方式設於滑塊 186的吸附墊等的基板保持構件(未圖示),藉由直進移 動機構(未圖示)來使滑塊186移動於搬送方向(X方向 ),藉此構成可在浮上平台174上進行基板G的浮上搬送 -33- 201017804 阻劑噴嘴178是在與搬送方向(X方向)正交的水平 方向(Y方向)穿越浮上平台174的上方延伸的長形噴嘴 ,可在預定的塗佈位置由細縫狀的吐出口來對通過其正下 方的基板G的上面帶狀地吐出阻劑液。並且,阻劑噴嘴 178是可與支撐此噴嘴的噴嘴支撐構件188 —體移動於X 方向,且構成可升降於Z方向,可在上述塗佈位置與噴嘴 更新部180之間移動。 噴嘴更新部180是在浮上平台174的上方的預定位置 被支柱構件190所保持,具備:供以作爲塗佈處理的預備 ,使阻劑液吐出至阻劑噴嘴178之塡裝處理部192、及基 於防止阻劑噴嘴178的阻劑吐出口乾燥的目的,供以保持 於溶劑蒸氣的環境中之噴嘴浴室194、及供以除去附著於 阻劑噴嘴1 78的阻劑吐出口附近的阻劑之噴嘴洗淨機構 196 - 在此,說明阻劑塗佈單元(CT ) 1 72的主要作用。首 先’從前段的冷卻單元(COL) 32經由分類機構(未圖示 )來搬入基板G至設定於浮上平台174的前端側之搬入區 域,在此待機的滑塊186會保持基板G而接收。在浮上平 台174上,基板G是接受由氣體噴射孔182所噴射的氣體 (空氣)壓力來以大致水平的姿勢保持浮上狀態。 而且,滑塊186會一邊保持基板G —邊移動於搬送方 向(X方向),在基板G通過阻劑噴嘴178的下面時,阻 劑噴嘴1 78會朝基板G的上面帶狀地吐出液狀的阻劑液, -34- 201017804 藉此在基板G上從基板前端往後端鋪地毯那樣在一面形成 阻劑液的塗佈膜。如此被塗佈阻劑的基板G之後也藉由滑 塊186在浮上平台174上被浮上搬送,從設定於浮上平台 174的後端之搬出區域經由分類機構(未圖示)來送往搬 出單元(OUT-PASS ) 34。 另外,搬入側的分類機構(未圖示)是具有:被鋪設 於第1往路平移搬送部46的搬送方向(X方向)之滾子 φ 搬送路、及對於此滾子搬送路上的基板可真空吸附/離脫 於基板背面的緣部之複數的吸附墊、及可使該等的吸附墊 與搬送方向平行移動於雙方向的基板傳送機構。一旦在平 移下於該滾子搬送路上接收在上游側的冷卻單元(COL) 32被冷卻成一定溫度的基板,則吸附墊會上昇而吸附於該 基板的背面緣部,經由吸附保持基板的吸附墊,基板傳送 機構可將基板移送至平台178的搬入區域。而且,在搬入 區域搬入基板後,吸附墊會從基板分離,其次基板傳送機 ❹ 構及吸附墊會回到原位置。 搬出側的分類機構(未圖示)亦除了動作相反(對稱 匕匕 會 機 成 構 的 様 同 構 機 類 分 的 側 入 搬 和 有 具 外 以 點 的 在此第3實施形態的塗佈顯像處理系統170中也是將 第1及第2減壓乾燥單元(VD) 66L,6 6R配置於中庭空 間NS’因此不會增加系統寬度尺寸(γ方向尺寸),可 實現系統全長尺寸(X方向尺寸)及工站時間的大幅度的 縮短化。不過,在製程路線A上平移方式的阻劑塗佈箪元 -35- 201017804 (CT) 172比平台方式的阻劑塗佈單元(CT) 36更單元 尺寸(X方向尺寸)長,該部分多少系統全長尺寸(X方 向尺寸)會變長。但,另一方面,中庭空間NS的搬送裝 置68是只要進出於兩減壓乾燥單元66L,66R、第1往路 平移搬送部46的搬出單元(OUT-PASS) 34及第2往路平 移搬送部48的搬入單元(IN-PASS) 38即可,不必進出 於阻劑塗佈單元(CT) 1*72。亦即,具有搬送裝置68的搬 送行程上的負擔變輕的優點。 另外,圖8的佈局是在製程路線A上將第1往路平移 搬送部46的搬出單元(OUT-PASS) 34及第2往路平移搬 送部48的搬入單元(IN-PASS ) 38排列配置於橫方向(X 方向)。 但,亦可爲一變形例,如圖1 〇所示,將該搬出單元 (OUT-PASS ) 34及該搬入單元(IN-PASS ) 38以兩層方 式上下重疊配置之構成。此情況,第1往路平移搬送部46 的搬出單元(OUT-PASS) 34是與阻劑塗佈單元(CT) 172同層例如排列於第1層,第2往路平移搬送部48的搬 入單元(IN-PASS) 38是與預供烤單元(PRE-BAKE) 40 同層例如排列於第2層。 在圖10的佈局中,由於第1往路平移搬送部46的搬 出單元(OUT-PASS) 34與第2往路平移搬送部48的該搬 入單元(IN-PASS) 38是二維地集中配置於一處,因此中 庭空間NS內的搬送裝置68及第1及第2減壓乾燥單元( VD) 66L,66R亦可集中乃至近接配置,可使搬送裝置68 201017804 的移動範圍縮小化,使移動方向(運動軸)簡素化。 (第4實施形態) 圖11是表示本發明的第4實施形態的塗佈顯像處理 系統2 00的佈局構成的要部。圖中,對於具有和上述第2 實施形態的塗佈顯像處理系統100內的構成要素實質同一 構成或機能的部分附上同一符號,且省略其說明。 φ 此實施形態也是與上述第2實施形態同樣’在中庭空 間NS中,搬送裝置68是可對第1及第2減壓乾燥單元 1 02L,1 02R分別經由第1及第2中庭平移搬送部202L ’ 202R來搬出入基板G。 在此,在搬送區域TE與第1及第2減壓乾燥單元 102L,102R之間分別設有可昇降之一體形式的第1及第2 搬入 / 搬出單元(IN/OUT-PASS) 204L,204R。 如圖12〜圖14所示,第1中庭平移搬送部2 02 L是 φ 具有:分別設置於第1搬入/搬出單元(IN/OUT-PASS ) 204L內的下段及上段之中庭基板搬入路206及中庭基板 搬出路208、及設於第1減壓乾燥單元102L內,可選擇 性地連接至中庭基板搬入路206及中庭基板搬出路208的 任一之單元內搬送路108。中庭基板搬入路206、中庭基 板搬出路208及單元內搬送路108是例如由滾子搬送路所 構成,可藉由分別獨立的滾子驅動部來驅動。 中庭基板搬入路206及中庭基板搬出路208是在被收 容於第1搬入/搬出單元(IN/OUT-PASS ) 204內的狀態下 -37- 201017804 ,可藉由例如汽缸等所構成的昇降驅動部210的昇降驅動 來昇降移動。 在第1減壓乾燥單元102L搬入基板G時,如圖14所 示,將中庭基板搬入路2 06的高度位置對準單元內搬送路 108,在中庭基板搬入路206及單元內搬送路108上將基 板G搬送於系統長邊方向(X方向)的第1方向(從圖的 右邊至左邊)。 從第1減壓乾燥單元102L搬出基板G時,如圖13所 示,將中庭基板搬出路208的高度位置對準單元內搬送路 108,在單元內搬送路108及中庭基板搬出路20 8上將基 板G搬送於系統長邊方向(X方向)的第2方向(從圖的 左邊到右邊)。 在此塗佈顯像處理系統200中,如圖12所示,在第1 減壓乾燥單元102L內基板Gi正接受減壓乾燥處理的期間 ,搬送裝置68可進出於第1搬入/搬出單元(IN/OUT-PASS ) 204L來以搬送臂68a搬入其次的基板Gi + 1至中庭 基板搬入路206。 然後,如圖13所示,可在中庭基板搬入路2 06使其 次的基板Gi+1保持待機下,將在第1減壓乾燥單元102L 內完成減壓乾燥處理的基板Gi以滾子搬送來搬出至中庭 基板搬出路208。 或,亦可爲別的順序,亦即將減壓乾燥處理完成的基 板Gi從第1減壓乾燥單元102L搬出至中庭基板搬出路 208,同時將其次應在第1減壓乾燥單元102L接受減壓乾 201017804 燥處理的基板〇;+1搬入至中庭基板搬入路2 06。 4 又’如圖14所示,將基板Gi + 1從中庭基板搬入路 206以滾子搬送來搬入至第1減壓乾燥單元i〇2L,同時搬 送裝置68可將處理完成的基板Gi利用搬送臂68a來從中 庭基板搬出路208搬出。 搬入/搬出單元(IN/OUT-PASS) 204L的中庭基板搬 入路206及中庭基板搬出路208的構成可與圖5及圖6所 _ 示者相同。 第2搬入/搬出單元(IN/OUT-PASS) 204R及第2中 庭平移搬送部202R亦具有與上述第1搬入/搬出單元( IN/OUT-PASS ) 204L及第1中庭平移搬送部202L同様的 構成·機能。 在此第4實施形態中,因爲在第1及第2減壓乾燥單 元102L,102R中可使基板搬出口 128兼用於基板搬入口 126來從搬送區域TE側進行基板G的出入,所以可使中 ❹ 庭平移搬送部202L,202R小型化。 以上說明有關本發明的較佳實施形態,但本發明並非 限於上述實施形態,亦可在其技術思想的範圍內實施各種 的變形。 例如,上述實施形態是在往路的製程路線A包含第1 及第2往路平移搬送部46,48的系統中,在中庭空間NS 配置以製程流程來連接該等的平移搬送部46,48之第3 群的處理單元。然而,在復路的製程路線B包含第1及第 2復路平移搬送部時,可在中庭空間NS配置以製程流程 -39- 201017804 來連接該等2個的復路平移搬送部之第3群(或第4群) 的處理單元。 在上述實施形態,被配置於中庭空間NS的處理單元 爲減壓乾燥單元,但亦可按照製程路線的配置構成來配置 其他的處理單元。 本發明的被處理基板並非限於LCD用的玻璃基板, 亦可爲其他的平板顯示器用基板、或半導體晶圓、CD基 板、光罩、印刷基板等。 @ 【圖式簡單說明】 圖1是表示本發明的第1實施形態的塗佈顯像處理系 統的佈局構成的平面圖。 圖2是表示在圖1的塗佈顯像處理系統中被配置於中 庭空間的減壓乾燥單元及搬送裝置以及其周圍的處理單元 的詳細構成的平面圖。 圖3是表示第2實施形態的塗佈顯像處理系統的佈局 _ 構成的平面圖。 圖4是表示圖2的塗佈顯像處理系統的要部構成的大 略側面圖。 圖5是表示圖4的搬入單元內部的構成平面圖。 圖6是表示圖4的搬入單元內部的構成正面圖。 圖7是表示比較例的系統的佈局構成平面圖。 圖8是表示第3實施形態的塗佈顯像處理系統的佈局 構成的平面圖。 -40- 201017804 圖9是表示圖9的塗佈顯像處理系統的阻劑塗佈單元 的構成平面圖。 圖10是表示第3實施形態之一變形例的塗佈顯像處 理系統的佈局構成的要部平面圖。 圖11是表示第4實施形態的塗佈顯像處理系統的要 部的佈局構成的平面圖。 圖12是表示圖11的塗佈顯像處理系統的搬入/搬出 φ 單元及中庭平移搬送部的構成及動作的一階段的一部分剖 面側面圖。 圖13是表示圖11的塗佈顯像處理系統的搬入/搬出 單元及中庭平移搬送部的構成及動作的一階段的一部分剖 面側面圖。 圖14是表示圖11的塗佈顯像處理系統的搬入/搬出 單元及中庭平移搬送部的構成及動作的一階段的一部分剖 面側面圖。 ❿ 【主要元件符號說明】 10:塗佈顯像處理系統 14 ··卡匣站(c / s ) 1 6 :製程站(ρ/s ) 1 8 :介面站(I/F ) 22 :搬送裝置 34:搬出單元(ouT-PASS) 36:阻劑塗佈單元(CT) -41 - 201017804 38 :搬入單元(IN-PASS ) 46:第1往路平移搬送部 48:第2往路平移搬送部 60:復路平移搬送部 62 :搬送裝置 66L :第1減壓乾燥單元(VD) 66R :第1減壓乾燥單元(VD ) 6 8 :搬送裝置 0 102L:第1減壓乾燥單元(VD) 102R :第1減壓乾燥單元(VD ) 104L:第1中庭平移搬送部 104R:第2中庭平移搬送部 105 :搬入單元(IN-PASS ) 1 12 :搬出單元(OUT-PASS ) 172 :阻劑塗佈單元(CT ) A:往路製程路線 @ B :復路製程路線 -42-As described above, the coating development processing system 10 is laid in the process route A of the forward path: the first forward translation transfer unit 46 before the resist coating unit (CT) 36, and the pre-baking unit (PRE-BAKE -23-201017804) The second forward translation transfer unit 48 before 40, and the first and second decompression drying units (VD) in the atrium space NS adjacent to the resist application unit (CT) 36 The 66L and 66R are disposed opposite to each other at a predetermined position, and the transport device 68 is provided. The conveying device 68 moves in the conveying area TE provided in the atrium space NS, and can enter the two decompression drying units 66L and 66R, the unloading unit (OUT-PASS) 34 of the first forward translating unit 46, and the resist coating. The transport unit (IN-PASS) 38 of the cloth unit (CT) 36 and the second forward translation transport unit 48 can perform the transfer of the units to the substrate G. According to this configuration, in the coating development processing system 10, the occupied spaces of the first and second decompression drying units (VD) 68L, 68R are absorbed in the atrium space NS, and are not included in the two process routes. In A and B, the system width dimension (Y-direction dimension) is not increased, and the total length of the system (X-direction dimension) can be greatly shortened. Further, in the coating development processing system 10, the first and second decompression drying units 66L and 66R have the same configuration and function, and the processing contents and processing time for decompressing and drying the substrate G are substantially the same. . Then, after the resist application coating unit (CT) 36 has just received the resist coating treatment on the substrate G sequentially transferred through the first forward translation transfer unit 46, the first and second decompressions are alternately repeated. Drying units 66L, 66R. For example, each of the odd-numbered substrates G is transferred to the first decompression drying unit 66L after the resist coating unit (CT) 36 receives the resist coating treatment, and is subjected to the vacuum drying treatment, and then sent to the second path. The loading unit (IN-PASS) 38 of the transfer unit 48 is translated. On the other hand, an even number of substrates 201017804 G are transferred to the second decompression drying unit 66R after the resist coating unit (CT) 36 receives the resist coating treatment, and after being subjected to the vacuum drying treatment, it is sent to The carry-in unit (IN-PASS) of the second forward transfer transport unit 48. Therefore, when the station time of one of the first and second decompression drying units 66L and 66R is t, the interval is t/2. The time difference is parallel to the operation of 2 units, which can form the total station time to form t/2. In this way, the decompression drying unit with a length of φ at one time of processing will halve the station time, thereby causing the main factor of the station time rate of the entire system to disappear. Therefore, even if the processing speed of the exposure device 12 is speeded up, or the photo-etching lithography uses a halftone exposure process, the coating development processing system can sufficiently cope with it. Further, in the coating development processing system, the first and second decompression drying units 66L and 66R are disposed at equal distances with respect to the substrate transfer port of the resist coating unit (CT) 36. It is also important that the delay time from the completion of the resist coating treatment to the start of the vacuum drying treatment is coincident with an odd number of substrates φ G and an even number of substrates G. That is, the evaporation of the solvent from the resist coating film is started immediately after the coating, and once the drying is started immediately after the evaporation, there is unevenness, and there is even a drying treatment or prebaking by the subsequent vacuum drying. Bake can not compensate for the situation. When the development processing system is applied, even if the first and second decompression drying units 66L and 66R are operated in parallel, all of the substrates G are subjected to a vacuum drying treatment after the resist coating treatment with equal delay time. Therefore, the film quality (stability/reproducibility) of the resist coating film can be improved. -25-201017804 (Second Embodiment) Fig. 3 is a view showing a layout configuration of a coating development processing system 100 according to a second embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 10 of the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. Further, the detailed layout or configuration of the main part of the coating development processing system 100 is shown in Figs. 4 to 6 . In the system 100 of the second embodiment, the main portion different from the system 1 of the first embodiment is the first and second decompression drying units 102 L disposed in the atrium space NS, and the 102R is not a substrate. A method of fixing to a platform, but a vacuum drying device configured as a translational mode. In the atrium space NS, in order to move the first and second decompression drying units 102L and 102R into and out of the substrate G, the first and second atriums are displayed in addition to and in the units 102L and 102R. Transport units 104L, 104R. Then, the transport device 68 can transport the substrate G to the first and second decompressing and drying units 102L and 102R via the first and second atrium shifting and transporting units 104L and 104R, respectively. As shown in FIG. 4, the first atrium translation transport unit 104L includes an atrium substrate loading path 106 which is provided in a loading unit (IN-PASS) 105 adjacent to the transport area TE, and an intra-unit transport path 108. It is provided in the first decompression drying unit 1〇2L, and is connected to the atrium substrate carrying path 106. The atrium substrate carrying out path 114 is formed by the first decompression drying unit 1〇2L and can be located in the loading and unloading unit (IN- PASS) 105, the opposite side of the lift 26 - 201017804 The machine room (EV) 110 is connected to the in-unit transfer path 108, and extends through the upper surface of the first decompression drying unit 102L to the carry-out unit (OUT-PASS) adjacent to the transfer area TE. 112. The atrium substrate carrying path 106, the in-unit transfer path 108, and the atrium substrate carrying-out path 114 are rod-shaped or gyro-shaped rollers 116 arranged at regular intervals in the transport direction (X direction) to form a roller transport path, and have a motor and A roller drive unit (not shown) such as a transmission mechanism rotationally drives the rollers 116 to configure the substrate G to be transported on the roller transport path. Here, an independent roller drive unit (not shown) may be provided in each section (106, 108, 114). Further, the roller transport path of the atrium substrate carry-out path 114 is divided into the elevator room (EV) 110. The roller transport path 114a and the three sections of the roller transport path 114b in the intermediate transfer chamber 118 of the upper layer of the first decompression drying unit 102L and the roller transport path 114c in the carry-out unit (OUT-PASS) 112, An independent roller drive unit (not shown) can be provided in each section. The roller transport path 114a in the elevator room (EV) 110 is attached to the roller support portion 120 that can be moved up and down, and can be moved to the first floor by the lifting drive of the elevation drive unit 122 constituted by, for example, a cylinder. The in-unit conveyance path (roller conveyance path) 1〇8 is connected between the first height position 'and the second height position H2 that can be connected to the roller conveyance path 114b in the intermediate transfer chamber U8 of the second layer. When the substrate G is carried into the first decompression drying unit 102L, first, the conveying device 68 carries the substrate G into the loading unit -27-201017804 (IN-PASS) 105 from the conveying area TE of the atrium space NS. Then, the roller transport operation is started in the atrium substrate transport path 106 and the intra-unit transport path 108, and the substrate G is carried from the carry-in unit (IN-PASS) 105 to the first decompression drying unit 102L. When the substrate G is carried out from the first decompression drying unit 102L, first, the roller transport operation is performed on the roller transport paths 108 and 114a, and the substrate G is carried out from the first decompression drying unit 102L to the elevator room (EV). ) The first layer of 110. Next, in the elevator room (EV) 110, the roller transporting path 114a rises, and the substrate G is moved to the second layer. Then, the roller transporting operation is performed on the roller transporting paths 114a, 114b, and 114c, and the substrate G is moved from the elevator compartment (EV) 110 to the carry-out unit (OUT-PASS) 112 through the intermediate transfer chamber 118. Then, the transport device 68 receives the substrate G from the transport area TE of the atrium space NS, and carries it out from the carry-out unit (OUT-PASS) 1 12 . In Fig. 4, the reduced-pressure drying unit (VD) 102L is a chamber 124 having an integral form of reduced pressure, which has a flat rectangular parallelepiped shape. @ In the substrate transfer direction (X direction), a pair of side walls of the chamber 124 facing each other are provided with an openable and closable substrate transfer inlet 126 and a substrate transfer port 128. The intra-unit conveyance path (roller conveyance path) 108 is provided in the chamber 124. The decompression drying unit (VD) 102L has a lift pin mechanism (not shown) for raising and lowering, which is at a height position (position on the roller 116) for loading or unloading the substrate G in the chamber 124. It rises and falls between the height position -28-201017804 (the position from the roller 116 floating upward) for the vacuum drying treatment. One or a plurality of exhaust ports 130 are provided in the bottom wall of the chamber 124. These exhaust ports 130 are connected to the inlet side of the vacuum pump 134 via the exhaust pipe 132. An opening and closing valve 136 is provided in the middle of the exhaust pipe 133. Fig. 5 and Fig. 6 show an example of the configuration of the inside of the loading unit (IN-PASS) 105. In the loading unit (IN-PASS) 105, as shown in Fig. 5, a pair of horizontal frames 14 0A, 140B extending in parallel in the conveying direction (X direction) are provided at intervals larger than the substrate G. Between these horizontal frames 140A and 14B, a plurality of rod-shaped supporting members 142 (four in the illustrated example) are arranged in parallel at an appropriate interval. Each of the rod-shaped supporting members 142 is supported by a plurality of beams 144 extending in a direction (Y direction) orthogonal to the conveying direction (X direction) (three in the illustrated example). As shown in Fig. 6, both ends of the beam 144 are fixed to the lower surfaces of the horizontal frames 1 40A, 1 40B, respectively. φ On the upper surface of the rod-shaped support member 142, a plurality of spherical free rollers 146 for mounting the support substrate G are mounted at a constant pitch. As seen from the entrance side of the loading unit (IN-PASS) 105, a bridge type driving roller 148 is attached to the rear end portion (last portion) of the horizontal frames 140A, 140B. The drive roller 148 is integrally fixed to a plurality of gyro-shaped rollers or rollers 148b at a predetermined interval between the rotation shafts 148a spanned between the horizontal frames 140A and 140B. The rotation drive unit 152 can be rotated by the pulleys 150. drive. In the horizontal frames 140 A, 140B, a plurality of single-sided support type drive rollers 154 are mounted at intervals of a certain -29-201017804 in the longitudinal direction thereof. The drive rollers 154 can be rotationally driven via the drive belt 156 on the outside of the horizontal frames 140A, 140B. Here, the drive belt 156 is coupled to the rotation driving portion 152 via the pulley 150. The drive rollers 148, 154 and the free roller 146 constitute the atrium substrate carrying path 106. The configuration in the carry-out unit (OUT-PASS) 112 is the same as the configuration in the carry-in unit (IN-PASS) 105 except that the transport direction or the transport operation is opposite, and the second decompression drying unit 102R and The second atrium translation transport unit 104R is also different in the left-right symmetric arrangement position by the resist application unit (CT) 36, and the others are the same as the first decompression drying unit 102L and the first atrium translation transport unit 104L, respectively. The composition plays the same role. In the coating development processing system 100 of the second embodiment, similarly to the coating development processing system 10 of the first embodiment, the overall length of the system and the station time can be greatly shortened. (Comparative Example) In addition, as for the reference example (comparative example), it is conceivable that in the process route A, in the middle of the second forward translation transfer unit 48, that is, the carry-in unit (IN-PASS) The first translation type decompression drying unit 102L is disposed between the 38 and the pre-baking unit (PRE-BAKE) 4, and the layout of the second translation type decompression drying unit 10R2R is disposed in the atrium space NS. 201017804 In this case, in the process route A, between the loading unit (IN-P AS S) 38 of the second forward translation conveying unit 48 and the first translation type decompression drying unit 102L, and the first translation type decompression drying The first and second lateral conveyors (CR-PASS) 160, 162» are disposed between the unit l〇2L and the pre-baking unit (PRE-B AKE ) 40, respectively, and the second translation type vacuum drying unit is interposed therebetween. 102R is adjacent to the first and second lateral conveyors (CR-PASS) 160, 162, and the third and fourth _ transverse conveyors (CR-PASS) 164, 166 are disposed in the atrium space NS. Here, each of the cross conveyors (CR-PASS) 160 to 166 is a Y-direction conveyor that has an orthogonal translational conveyance path and a conveyance drive unit, and can selectively switch between the X-direction conveyor movement and the translation. . For example, the first lateral conveyor (CR-PASS) 160 is the substrate G that is translated and received from the loading unit (IN-PASS) 38, and the odd number of substrates G are directly carried into the first translational reduced-pressure drying unit 102L. The even number of substrates G are transferred to the third lateral conveyor (CR-PASS) 164. φ The third lateral conveyor (CR-PASS) 164 carries an even number of substrates G received from the first lateral conveyor (CR-PASS) 160 to the second translation type vacuum drying unit 102R. The fourth lateral conveyor (CR-PASS) 166 is an even-numbered substrate G that is carried out by the second translation-type vacuum drying unit 102R to perform the reduced-pressure drying process, and is transferred to the second lateral conveyor (CR-PASS) 162. The second horizontal conveyor (CR-PASS) 162 is an odd-numbered substrate G that has been discharged from the first translational-type decompression drying unit 102L to complete the reduced-pressure drying process, and is sent to the subsequent pre-baking unit (PRE-BAKE) 40 . Further, -31 - 201017804 receives an even number of substrates G which have been subjected to reduced-pressure drying processing from the fourth lateral conveyor (CR-PASS) 166, and sends them to the pre-baking unit (foot-to-bake) 40 of the subsequent stage. The layout of Fig. 7 is such that the first and second translating decompression drying units 102L, 102R are operated in parallel, whereby the station time can be shortened, but since the process route A is inserted into a row and two sets of lateral conveyance The machine (CR-PASS) 160, 162 and one decompression drying unit 102L, so that the X-direction dimension L of the three units (160, 102L, 162) will increase the overall length of the process route A. Larger, and thus the total length of the system is increased, and the overall length of the system cannot be shortened. Further, when the substrate G on which the resist coating unit (CT) 36 completes the resist coating treatment is sent to the first translation-type vacuum drying unit 102L, and when it is sent to the second translation-type vacuum drying unit 102R, The disadvantage of different delivery delay times. (Third Embodiment) Fig. 8 is a view showing a layout configuration of a coating development processing system 170 according to a third embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 1 of the above-described first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the configuration of the resist coating unit (CT) 172 of the coating development processing system 170 is shown in Fig. 9 . In the system 170 of the third embodiment, the main difference from the system 1 of the first embodiment is that the resist coating unit (CT) 1 72 is not a method of fixing the substrate to the stage, but is constituted. In the transmissive-32-201017804 resist coating device, the resist coating unit (CT) 172 is disposed along the first forward translation transport unit 46 in the process route A of the forward path, and is disposed in the specific carry-out unit (OUT- PASS) 34 is the upper position. As shown in FIG. 9, the resist coating unit (CT) 172 has a floating upper platform 174 for coating, which constitutes a part or a section of the first forward translation conveying unit 46, and a substrate conveying mechanism 176. The substrate G floating on the airborne floating platform 174 φ is transported to the floating platform in the longitudinal direction (X direction). The resist nozzle 178 supplies the resist liquid to the substrate G that is transported on the floating platform 174. And a nozzle update unit 180 that updates the resist nozzle 178 during the idle time of the coating process. A plurality of gas injection holes 182 for spraying a predetermined gas (e.g., air) onto the upper surface of the floating upper stage 174 are provided, and the substrate G can be driven from the platform by the gas pressure ejected from the helium gas injection holes 182. The top floats at a certain height. The substrate transfer mechanism 176 includes a pair of guide rails 184A and 184B extending in the X direction via the floating upper platform 174, and a slider 186 that can reciprocate along the guide rails 1 84A and 18 4B, and can be The floating platform 174 is provided on a substrate holding member (not shown) such as a suction pad of the slider 186 so as to detachably hold both end portions of the substrate G, and the slider is moved by a linear motion mechanism (not shown). 186 is moved in the transport direction (X direction), thereby constituting the floating transport of the substrate G on the floating upper platform 174 - 33 - 201017804 The resist nozzle 178 is in the horizontal direction (Y direction) orthogonal to the transport direction (X direction) The elongate nozzle extending across the upper surface of the floating platform 174 can discharge the resist liquid in a strip shape from the upper surface of the substrate G directly under the slit at the predetermined application position by the slit-shaped discharge port. Further, the resist nozzle 178 is movable in the X direction with the nozzle supporting member 188 that supports the nozzle, and is configured to be movable up and down in the Z direction, and is movable between the coating position and the nozzle updating portion 180. The nozzle update unit 180 is held by the pillar member 190 at a predetermined position above the floating platform 174, and includes an armor processing unit 192 that supplies the resist liquid to the resist nozzle 178 as a preparation for the coating process, and For the purpose of preventing the resist discharge port of the resist nozzle 178 from drying, the nozzle bathroom 194 held in the environment of the solvent vapor and the resist for removing the vicinity of the resist discharge port attached to the resist nozzle 1 78 are provided. Nozzle cleaning mechanism 196 - Here, the main function of the resist coating unit (CT) 1 72 will be explained. First, the cooling unit (COL) 32 from the front stage is carried into the loading area of the front end side of the floating platform 174 via a sorting mechanism (not shown), and the standby slider 186 holds the substrate G and receives it. On the floating upper stage 174, the substrate G receives the gas (air) pressure injected from the gas injection hole 182 to maintain the floating state in a substantially horizontal posture. Further, the slider 186 moves in the transport direction (X direction) while holding the substrate G, and when the substrate G passes under the resist nozzle 178, the resist nozzle 1 78 is discharged in a strip shape toward the upper surface of the substrate G. The resist liquid, -34- 201017804, thereby forming a coating film of the resist liquid on one side of the substrate G from the front end of the substrate to the rear end. The substrate G to which the resist is applied is also transported by the slider 186 on the floating platform 174, and is transported from the carry-out area set at the rear end of the floating platform 174 to the carry-out unit via a sorting mechanism (not shown). (OUT-PASS) 34. Further, the sorting mechanism (not shown) on the carry-in side has a roller φ transport path that is laid in the transport direction (X direction) of the first forward translation transport unit 46, and a vacuum that can be applied to the substrate on the transport path of the roller. A plurality of adsorption pads that adsorb/detach from the edge of the back surface of the substrate, and a substrate transfer mechanism that can move the adsorption pads in parallel with the transport direction in both directions. When the substrate on which the cooling unit (COL) 32 on the upstream side is cooled to a certain temperature is received on the roller transport path under the translation, the adsorption pad is lifted and adsorbed on the back edge portion of the substrate, and the substrate is adsorbed via the adsorption. The pad, substrate transfer mechanism can transfer the substrate to the loading area of the platform 178. Further, after the substrate is carried in the loading area, the adsorption pad is separated from the substrate, and the substrate transfer mechanism and the adsorption pad are returned to the original position. In addition to the action, the sorting mechanism (not shown) on the carry-out side is also in the opposite direction (the side of the 様 様 isomorphism machine constituting the symmetry machine and the application of the third embodiment) In the image processing system 170, the first and second decompression drying units (VD) 66L, 6 6R are also disposed in the atrium space NS', so that the system width dimension (γ-direction dimension) is not increased, and the system full-length size (X direction) can be realized. Dimensional) and station time have been greatly shortened. However, the resisting coating of the processing method on the process route A is -35- 201017804 (CT) 172 than the platform-based resist coating unit (CT) 36 The unit size (X-direction dimension) is long, and the total length of the system (X-direction dimension) becomes longer. However, on the other hand, the transport device 68 of the atrium space NS is only required to enter and exit the two decompression drying units 66L, 66R. The carry-out unit (OUT-PASS) 34 of the first forward translation transfer unit 46 and the carry-in unit (IN-PASS) 38 of the second forward transfer transport unit 48 are not required to enter the resist coating unit (CT) 1*. 72. That is, having the transport device 68 The load on the stroke is lighter. The layout of FIG. 8 is the loading unit of the carry-out unit (OUT-PASS) 34 and the second forward translation transport unit 48 of the first forward translation transport unit 46 on the process route A. (IN-PASS) 38 is arranged in the horizontal direction (X direction). However, it may be a modification, as shown in FIG. 1A, the carry-out unit (OUT-PASS) 34 and the carry-in unit (IN-PASS). 38 is arranged in a two-layer manner in a vertically stacked manner. In this case, the carry-out unit (OUT-PASS) 34 of the first forward translation transfer unit 46 is arranged in the same layer as the resist application unit (CT) 172, for example, on the first layer. The loading unit (IN-PASS) 38 of the second forward translating unit 48 is arranged in the same layer as the pre-bake unit (PRE-BAKE) 40, for example, in the second layer. In the layout of Fig. 10, the first path is shifted. The carry-out unit (OUT-PASS) 34 of the transport unit 46 and the carry-in unit (IN-PASS) 38 of the second forward shift transport unit 48 are two-dimensionally arranged in one place, so that the transport device 68 in the atrium space NS and The first and second decompression drying units (VD) 66L, 66R can be concentrated or even arranged in close proximity, and can be transported. 68. The movement range of the 201017804 is reduced, and the movement direction (motion axis) is simplified. (Fourth Embodiment) Fig. 11 is a main part showing the layout of the coating development processing system 200 according to the fourth embodiment of the present invention. In the drawings, the same components as those in the coating development processing system 100 of the second embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. φ This embodiment is also similar to the above-described second embodiment. In the atrium space NS, the transport device 68 can transfer the first and second decompression drying units 102L and 102R via the first and second atrium translation transmission units, respectively. 202L '202R to carry out the substrate G. Here, between the transfer area TE and the first and second decompression drying units 102L and 102R, first and second loading/unloading units (IN/OUT-PASS) 204L, 204R are provided in a movable form. . As shown in FIG. 12 to FIG. 14, the first atrium translation transport unit 202L is φ having the lower stage and the upper stage abutment substrate carrying path 206 provided in the first loading/unloading unit (IN/OUT-PASS) 204L. The atrium substrate carrying-out path 208 and the first decompression drying unit 102L are selectively connected to any of the in-unit transfer path 108 of the atrium substrate carrying path 206 and the atrium substrate carrying-out path 208. The atrium substrate carrying path 206, the atrium substrate carrying-out path 208, and the intra-unit transfer path 108 are constituted by, for example, a roller transport path, and can be driven by independent roller drive units. The atrium substrate loading path 206 and the atrium substrate carrying-out path 208 are in the state of being accommodated in the first loading/unloading unit (IN/OUT-PASS) 204 -37-201017804, and can be driven by a lifting machine such as a cylinder. The lifting and lowering of the portion 210 is performed to move up and down. When the first decompression drying unit 102L is carried into the substrate G, as shown in FIG. 14, the height position of the atrium substrate carrying path 206 is aligned with the in-unit transfer path 108, and is applied to the atrium substrate carrying path 206 and the intra-unit transfer path 108. The substrate G is transported in the first direction (from the right side to the left side in the drawing) in the longitudinal direction (X direction) of the system. When the substrate G is carried out from the first decompression drying unit 102L, as shown in FIG. 13, the height position of the atrium substrate carrying-out path 208 is aligned with the intra-unit transfer path 108, and the intra-unit transfer path 108 and the atrium substrate carry-out path 20 8 are placed. The substrate G is transported in the second direction (from the left to the right of the drawing) in the longitudinal direction (X direction) of the system. In the coating development processing system 200, as shown in FIG. 12, while the substrate Gi is receiving the vacuum drying process in the first decompression drying unit 102L, the conveying device 68 can enter the first loading/unloading unit ( IN/OUT-PASS ) 204L carries the next substrate Gi + 1 to the atrium substrate carrying path 206 by the transfer arm 68a. Then, as shown in FIG. 13, the substrate Gi+1 that has been subjected to the reduced-pressure drying process in the first decompression drying unit 102L can be carried by the roller while the abutment substrate carrying path 060 is held by the next substrate Gi+1. Move out to the atrium substrate removal path 208. Alternatively, the substrate Gi which has been subjected to the reduced-pressure drying treatment may be carried out from the first decompression drying unit 102L to the atrium substrate carrying-out path 208, and the second decompression drying unit 102L may be subjected to decompression. Dry 201017804 Dry-processed substrate 〇; +1 into the atrium substrate loading path 2 06. 4, as shown in FIG. 14 , the substrate Gi + 1 is carried by the roller from the atrium substrate carrying path 206 to the first decompression drying unit i 2 L, and the transfer device 68 can transport the processed substrate Gi. The arm 68a is carried out from the atrium substrate carrying-out path 208. The configuration of the atrium substrate transport path 206 and the atrium substrate transport path 208 of the carry-in/out unit (IN/OUT-PASS) 204L can be the same as that shown in Figs. 5 and 6 . The second loading/unloading unit (IN/OUT-PASS) 204R and the second atrium translation conveying unit 202R also have the same functions as the first loading/unloading unit (IN/OUT-PASS) 204L and the first atrium shifting conveying unit 202L. Composition and function. In the fourth embodiment, the substrate transfer port 128 can be used as the substrate transfer port 126 in the first and second decompression drying units 102L and 102R, and the substrate G can be taken in and out from the transfer region TE side. The intermediate translation transfer units 202L and 202R are miniaturized. The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, in the above-described embodiment, in the system in which the process route A of the forward route includes the first and second forward translation transfer units 46 and 48, the translational transport unit 46, 48 is connected to the atrium space NS by a process flow. 3 group of processing units. However, when the process route B of the re-routing includes the first and second reversing translation transport sections, the third group of the two reversing translation transport sections can be connected in the atrium space NS by the process flow -39-201017804 (or Processing unit of group 4). In the above embodiment, the processing unit disposed in the atrium space NS is a reduced-pressure drying unit, but other processing units may be disposed in accordance with the arrangement of the process routes. The substrate to be processed of the present invention is not limited to a glass substrate for LCD, and may be another substrate for a flat panel display, a semiconductor wafer, a CD substrate, a photomask, a printed substrate, or the like. [Brief Description of the Drawings] Fig. 1 is a plan view showing a layout configuration of a coating development processing system according to a first embodiment of the present invention. Fig. 2 is a plan view showing a detailed configuration of a decompression drying unit and a conveying device disposed in a room space in the coating development processing system of Fig. 1 and a processing unit therearound. Fig. 3 is a plan view showing the layout of the coating development processing system of the second embodiment. Fig. 4 is a schematic side view showing the configuration of a main part of the coating development processing system of Fig. 2; Fig. 5 is a plan view showing the inside of the loading unit of Fig. 4; Fig. 6 is a front elevational view showing the inside of the loading unit of Fig. 4; Fig. 7 is a plan view showing a layout of a system of a comparative example. Fig. 8 is a plan view showing a layout of a coating development processing system according to a third embodiment. -40- 201017804 Fig. 9 is a plan view showing the configuration of a resist coating unit of the coating development processing system of Fig. 9. Fig. 10 is a plan view of a main part showing a layout configuration of a coating development processing system according to a modification of the third embodiment. Fig. 11 is a plan view showing a layout configuration of a main part of a coating development processing system according to a fourth embodiment. Fig. 12 is a partial cross-sectional side view showing a first stage of the configuration and operation of the loading/unloading φ unit and the atrium shifting conveying unit of the coating development processing system of Fig. 11; Fig. 13 is a cross-sectional side view showing a part of the configuration and operation of the loading/unloading unit and the atrium shifting and conveying unit of the coating development processing system of Fig. 11; Fig. 14 is a partial cross-sectional side view showing a first stage of the configuration and operation of the loading/unloading unit and the atrium shifting and conveying unit of the coating development processing system of Fig. 11; ❿ [Description of main component symbols] 10: Coating development processing system 14 ··Calcography station (c / s) 1 6 : Process station (ρ/s) 1 8 : Interface station (I/F) 22 : Transfer device 34: unloading unit (ouT-PASS) 36: resist coating unit (CT) -41 - 201017804 38 : carrying unit (IN-PASS) 46: first forward shifting transport unit 48: second forward shifting transport unit 60: Reversing translation transfer unit 62: conveying device 66L: first decompression drying unit (VD) 66R: first decompression drying unit (VD) 6 8 : conveying device 0 102L: first decompression drying unit (VD) 102R: 1 decompression drying unit (VD) 104L: first atrium translation transport unit 104R: second atrium translation transport unit 105: carry-in unit (IN-PASS) 1 12: carry-out unit (OUT-PASS) 172: resist coating unit (CT) A: Road route @ B: Reroute route -42-

Claims (1)

201017804 七、申請專利範圍: 1·一種處理系統,係依製程流程的順序來連接複數的 處理單元,而對被處理基板實施一連串的處辱之串聯型的 處理系統,其特徵係具有: 第1製程路線,其係於系統長邊方向中在第1方向包 含:使第1群的處理單元相鄰,或經由搬送系單元來配置 成一列,平移搬送基板的第1.往路平移搬送部、及在比該 _ 第1往路平移搬送部更製程流程的下游側平移搬送基板的 第2往路平移搬送部; 第2製程路線,其係於系統長邊方向中在與前述第1 方向相反的第2方向,使位於比前述第1製程路線更製程 流程的下游側之第2群的處理單元相鄰,或經由搬送系單 元來配列成一列,在系統寬度方向與前述第1製程路線空 出預定尺寸的中庭空間來平行延伸; 第3群的處理單元,其係配置於前述中庭空間;及 〇 第1搬送裝置,其係配置於前述中庭空間,從前述第 1往路平移搬送部的終端側的基板交接部搬出各基板,而 搬送至前述第3群的處理單元之一,將在前述第3群的處 理單元之一完成處理的各基板從該處理單元搬出,而搬入 至前述第2往路平移搬送部的始端側的基板交接部。 2.如申請專利範圍第1項之處理系統,其中,前述第 3群的處理單元係包含對基板之處理的内容及時間實質上 相同的第1及第2處理單元,經由前述第1往路平移搬送 部來對連續不斷送來的基板交替重複安排前述第1及第2 -43- 201017804 處理單元。 3. 如申請專利範圍第2項之處理系統,其中,前述第 1搬送裝置具有可在設於前述中庭空間的搬送區域内移動 的搬送機器人, 前述第1及第2處理單元係於系統長邊方向,之間夾 著前述搬送區域來彼此相向配置於前述中庭空間。 4. 如申請專利範圍第3項之處理系統,其中,前述第 1及第2處理單元係與前述搬送區域鄰接配置, 前述搬送機器人係對前述第1及第2處理單元直接搬 出入基板。 5. 如申請專利範圍第3項之處理系統,其中,在前述 中庭空間,爲了對前述第1處理單元搬出入基板,而設有 在前述第1處理單元之外及中連續的第1中庭平移搬送部 前述搬送機器人係對前述第1處理單元經由前述第1 中庭平移搬送部來搬出入基板。 6. 如申請專利範圍第5項之處理系統,其中,前述第 1中庭平移搬送部係具有: 第1中庭基板搬入路,其係與前述搬送區域鄰接設置 9 第1單元内搬送路,其係設於前述第1處理單元内, 可與前述第1中庭基板搬入路連接;及 第1中庭基板搬出路,其係由前述第1處理單元來看 可在與前述第1中庭基板搬入路相反的側與前述第1單元 -44- 201017804 内搬送路連接,通過前述第1處理單元之上或下延伸至與 前述搬送區域鄰接的終端位置, 在對前述第1處理單元搬入基板時,係於前述第1中 庭基板搬入路及前述第1單元内搬送路上搬送基板, 在從前述第1處理單元搬出基板時,係於前述第1單 元内搬送路及前述第1中庭基板搬出路上搬送基板》 7. 如申請專利範圍第5項之處理系統,其中,前述第 Φ 1中庭平移搬送部係具有:與前述搬送區域鄰接而設成上 下2段之可昇降的第1中庭基板搬入路及第1中庭基板搬 出路、及設於前述第1處理單元内,可選擇性地連接至前 述第1中庭基板搬入路及前述第1中庭基板搬出路的任一 之第1單元内搬送路, 在對前述第1處理單元搬入基板時,係使前述第1中 庭基板搬入路的高度位置對準前述第1單元内搬送路,在 前述第1中庭基板搬入路及前述第1單元内搬送路上,將 0 基板搬送於系統長邊方向的第1方向, 在從前述第1處理單元搬出基板時,係使前述第1中 庭基板搬出路的高度位置對準前述第1單元内搬送路,在 前述第1單元内搬送路及前述第1中庭基板搬出路上,將 基板搬送於系統長邊方向的第2方向。 8. 如申請專利範圍第3、5〜7項中任一項所記載之處 理系統,其中,在前述中庭空間,爲了對前述第2處理單 元搬出入基板,而設有在前述第2處理單元之外及中連續 的第2中庭平移搬送部, -45- 201017804 前述搬送機器人係對前述第2處理單元經由前述第2 中庭平移搬送部來搬出入基板。 9.如申請專利範圍第8項之處理系統,其中,前述第 2中庭平移搬送部係具有: 第2中庭基板搬入路,其係與前述搬送區域鄰接設置 第2單元内搬送路,其係設於前述第2處理單元内, 可與前述第2中庭基板搬入路連接;及 _ 第2中庭基板搬出路,其係由前述第2處理單元來看 可在與前述第2中庭基板搬入路相反的側與前述第2單元 内搬送路連接,通過前述第2處理單元之上或下延伸至與 前述搬送區域鄰接的終端位置, 在對前述第2處理單元搬入基板時,係於前述第2中 庭基板搬入路及前述第2單元内搬送路上搬送基板, 在從前述第2處理單元搬出基板時,係於前述第2單 元内搬送路及前述第2中庭基板搬出路上搬送基板。 參 10.如申請專利範圍第8項之處理系統,其中,前述 第2中庭平移搬送部係具有:與前述搬送區域鄰接而設成 上下2段之可昇降的第2中庭基板搬入路及第2中庭基板 搬出路、及設於前述第2處理單元内,可選擇性地連接至 前述第2中庭基板搬入路及前述第2中庭基板搬出路的任 一之第2單元内搬送路, 在對前述第2處理單元搬入基板時,係使前述第2中 庭基板搬入路的高度位置對準前述第2單元内搬送路,在 -46- 201017804 前述第2中庭基板搬入路及前述第2單元内搬送路上,將 基板搬送於系統長邊方向的第2方向, 在從前述第2處理單元搬出基板時,係使前述第2中 庭基板搬出路的高度位置對準前述第2單元内搬送路,在 前述第2單元内搬送路及前述第2中庭基板搬出路上,將 基板搬送於系統長邊方向的第1方向。 11. 如申請專利範圍第1〜7項中任一項所記載之處理 φ 系統,其中,在前述第1製程路線中,在前述第1往路平 移搬送部的終端側的基板交接部與前述第2往路平移搬送 部的始端側的基板交接部之間配置有第3處理單元, 前述第1搬送裝置係對前述第3處理單元進行基板的 搬出入。 12. 如申請專利範圍第11項之處理系統,其中,前述 第3處理單元爲在前述基板上塗佈阻劑液的阻劑塗佈單元 > φ 前述第1及第2處理單元爲分別使基板上的阻劑塗佈 膜在減壓下乾燥的第1及第2減壓乾燥單元, 對前述阻劑塗佈單元的基板搬出口而言,前述第1及 第2減壓乾燥單元的基板搬入口爲大致等距離位置。 13. 如申請專利範圍第11項之處理系統,其中,在前 述第1製程路線中,在前述第1往路平移搬送部的搬送路 上,設有在前述基板上塗佈阻劑液的阻劑塗佈單元, 前述第1及第2處理單元爲分別使基板上的阻劑塗佈 膜在減壓下乾燥的第1及第2減壓乾燥單元, -47- 201017804 對前述第1往路平移搬送部的終端側的基板交接部而 言,前述第1及第2減壓乾燥單元的基板搬入口爲大致等 距離位置。 14. 一種處理系統,係依製程流程的順序來連接複數 的處理單元,而對被處理基板實施一連串的處理之串聯型 的處理系統,其特徵係具有: 第1製程路線,其係於系統長邊方向中在第1方向, 使第1群的處理單元相鄰,或經由搬送系單元來配置成一 列而成, 第2製程路線,其係於系統長邊方向中與前述第1方 向相反的第2方向包含:使位於比前述第1製程路線更製 程流程的下游側之第2群的處理單元相鄰,或經由搬送系 單元來配列成一列,平移搬送基板的第1復路平移搬送部 、及在比該第1復路平移搬送部更製程流程的下游側平移 搬送基板的第2復路平移搬送部,在系統寬度方向與前述 第1製程路線空出預定尺寸的中庭空間來平行延伸; 第3群的處理單元,其係配置於前述中庭空間;及 第1搬送裝置,其係配置於前述中庭空間,從前述第 1復路平移搬送部的終端側的基板交接部搬出各基板,而 搬送至前述第3群的處理單元之一,將在前述第3群的處 理單元之一完成處理的各基板從該處理單元搬出,而搬入 至前述第2復路平移搬送部的始端側的基板交接部。 15. 如申請專利範圍第1〜7、14項中任一項所記載之 處理系統,其中,具有第2搬送裝置,其係於系統長邊方 201017804 向的一端部,從被投入系統的任一卡匣取出未處理的基板 來交給前述第1製程路線,從前述第2製程路線接收系統 内的所要處理全部完成的基板,而收納於應從系統逐出的 任一卡厘 ° 1 6 ·如申請專利範圍第1〜7、1 4項中任一項所記載之 處理系統,其中,具有第3搬送裝置,其係於系統長邊方 向的他端部,從前述第1製程路線搬出基板,而直接搬入 前述第2製程路線,或使經由外部的處理裝置之後搬入前 述第2製程路線。 -49-201017804 VII. Patent application scope: 1. A processing system that connects a plurality of processing units in the order of process flow, and implements a series of insulting serial processing systems on the processed substrate, the characteristics of which are: The process route includes, in the first direction of the system, the first group of processing units adjacent to each other, or the transport unit is arranged in a row, and the first transfer path of the substrate is translated and transferred, and Translating the second forward translation transport unit of the transport substrate to the downstream side of the process flow further than the _ first forward translation transport unit; the second processing route is the second opposite to the first direction in the longitudinal direction of the system The direction is adjacent to the processing unit of the second group on the downstream side of the process flow of the first process route, or arranged in a row via the transport system unit, and the predetermined size is vacated in the system width direction and the first process route. The atrium space extends in parallel; the processing unit of the third group is disposed in the atrium space; and the first conveying device is disposed in the atrium space The substrate is transported from the substrate transfer unit on the terminal side of the first forward transfer and transport unit, and is transported to one of the processing units of the third group, and each of the substrates processed by one of the processing units of the third group is processed. The processing unit is carried out and carried into the substrate delivery portion on the start side of the second forward translation transfer unit. 2. The processing system according to claim 1, wherein the processing unit of the third group includes first and second processing units having substantially the same content and time for processing the substrate, and translating through the first forward path. The transport unit alternately arranges the first and second -43-201017804 processing units alternately for the continuously fed substrates. 3. The processing system of claim 2, wherein the first conveying device has a transfer robot movable in a transfer area provided in the atrium space, wherein the first and second processing units are attached to a long side of the system The directions are disposed between the atrium spaces facing each other with the transport regions interposed therebetween. 4. The processing system of claim 3, wherein the first and second processing units are disposed adjacent to the transporting region, and the transport robot directly carries the first and second processing units into and out of the substrate. 5. The processing system of claim 3, wherein in the atrium space, a first atrium shift is performed in addition to the first processing unit and in the middle of the first processing unit. In the transport unit, the transport robot carries the first processing unit into and out of the substrate via the first atrium translation transport unit. 6. The processing system of claim 5, wherein the first atrium translation transfer unit includes: a first atrium substrate carrying path, and a first unit inner transfer path is provided adjacent to the transfer area; The first processing unit is connected to the first atrium substrate carrying path, and the first atrium substrate carrying out path is opposite to the first atrium substrate carrying path by the first processing unit. The side is connected to the transfer path in the first unit -44 - 201017804, and the first processing unit extends above or below the end position adjacent to the transfer area, and when the substrate is loaded into the first processing unit, the side is 7. The first atrium substrate loading path and the first unit inner conveying path convey the substrate, and when the substrate is carried out from the first processing unit, the substrate is conveyed on the first unit inner conveying path and the first atrium substrate carrying-out path. The processing system of claim 5, wherein the Φ 1 atrium translation transport unit has a position that is adjacent to the transport area and is set to be up and down The first atrium substrate carrying path and the first atrium substrate carrying-out path and the first processing unit are selectively connected to the first atrium substrate carrying path and the first atrium substrate carrying-out path. In the first unit inner transfer path, when the substrate is loaded into the first processing unit, the height of the first atrium substrate carrying path is aligned with the first intra-unit transfer path, and the first atrium substrate is moved into the path. In the first unit inner conveying path, the 0 substrate is conveyed in the first direction in the longitudinal direction of the system, and when the substrate is carried out from the first processing unit, the height position of the first atrium substrate carrying out path is aligned with the first In the unit inner conveying path, the substrate is conveyed in the first unit inner conveying path and the first atrium substrate carrying-out path in the second direction in the longitudinal direction of the system. The processing system according to any one of the third aspect, wherein the second processing unit is provided in the atrium space for loading and unloading the substrate into the second processing unit. In addition to the second intermediate atrium translation transfer unit, the transfer robot is carried out by the transfer robot to the second processing unit via the second atrium translation transfer unit. 9. The processing system according to the eighth aspect of the invention, wherein the second atrium translation transport unit includes: a second atrium substrate carrying path, wherein the second unit inner transfer path is provided adjacent to the transport area, and the system is provided The second processing unit may be connected to the second atrium substrate carrying path; and the second atrium substrate carrying out path may be opposite to the second atrium substrate carrying path by the second processing unit. The side is connected to the second unit inner transfer path, and extends to the end position adjacent to the transfer area by the second processing unit, and is attached to the second atrium substrate when the substrate is loaded into the second processing unit. When the substrate is transported from the second processing unit, the substrate is conveyed on the second unit transfer path and the second abutment substrate carry-out path. The processing system of the eighth aspect of the invention, wherein the second atrium translation transport unit has a second atrium substrate carrying path that is movable up and down in a two-stage manner adjacent to the transport area, and a second The abutment substrate carrying-out and the second processing unit are selectively connected to the second intra-substrate substrate carrying path and the second intra-substrate substrate carrying-out path. When the second processing unit is loaded into the substrate, the height position of the second atrium substrate carrying path is aligned with the second intra-cell transfer path, and the second atrium substrate carrying path and the second unit transfer path are -46-201017804. The substrate is transported in the second direction in the longitudinal direction of the system, and when the substrate is carried out from the second processing unit, the height position of the second atrium substrate transport path is aligned with the second intra-cell transport path. The in-unit transfer path and the second atrium substrate carry-out path transport the substrate in the first direction in the longitudinal direction of the system. The processing φ system according to any one of the first aspect of the invention, wherein the substrate transfer portion on the terminal side of the first forward translation transfer unit and the first A third processing unit is disposed between the substrate transfer portions on the start side of the forward transfer transfer unit, and the first transfer device carries the substrate into and out of the third processing unit. 12. The processing system of claim 11, wherein the third processing unit is a resist coating unit that applies a resist liquid to the substrate; φ the first and second processing units are respectively The first and second decompression drying units that dry the resist coating film on the substrate under reduced pressure, and the substrate of the first and second decompression drying units to the substrate transfer port of the resist application unit The entrance is roughly equidistant. 13. The processing system according to claim 11, wherein in the first process route, a resist coating agent for applying a resist liquid on the substrate is provided on a transport path of the first forward translation transfer unit. In the cloth unit, the first and second processing units are first and second decompression drying units that respectively dry the resist coating film on the substrate, and -47-201017804, the first forward translation transfer unit In the substrate transfer portion on the terminal side, the substrate transfer ports of the first and second decompression drying units are substantially equidistant positions. 14. A processing system in which a plurality of processing units are connected in the order of a process flow, and a series of processing systems for performing a series of processing on a substrate to be processed has the following features: a first process route, which is system length In the first direction, the processing units of the first group are adjacent to each other or arranged in a row via the transport unit, and the second process route is opposite to the first direction in the longitudinal direction of the system. The second direction includes: a processing unit that is located in the second group on the downstream side of the process flow of the first process route, or a row that is arranged in a row via the transport system unit, and a first complex translation transfer unit that translates and transports the substrate, And a second reversing translation transporting portion that translates the transport substrate on the downstream side of the process flow of the first re-transporting and transporting unit, and extends in parallel with the atrium space of a predetermined size in the system width direction and the first processing route; The processing unit of the group is disposed in the atrium space; and the first conveying device is disposed in the atrium space, and is translating and conveying the first complex road The substrate delivery unit on the terminal side carries out the respective substrates, and transports them to one of the processing units of the third group, and the substrates that have been processed in one of the processing units of the third group are carried out from the processing unit, and are carried into the above-mentioned 2 The substrate delivery portion on the start side of the translational transfer portion. The processing system according to any one of the first to seventh aspects of the present invention, wherein the second conveying device is provided at one end of the system long side 201017804, and is placed in the system. The card is taken out of the unprocessed substrate to be handed over to the first process route, and the completed substrate in the system is received from the second process route, and is accommodated in any of the calipers that should be ejected from the system. The processing system according to any one of the first to seventh aspects, wherein the third transfer device is attached to the end portion of the longitudinal direction of the system, and the substrate is carried out from the first process route. Then, the second process route is directly carried in, or the second process route is carried in via the external processing device. -49-
TW098127715A 2008-08-19 2009-08-18 Processing system TWI388031B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008210662A JP5274148B2 (en) 2008-08-19 2008-08-19 Processing system

Publications (2)

Publication Number Publication Date
TW201017804A true TW201017804A (en) 2010-05-01
TWI388031B TWI388031B (en) 2013-03-01

Family

ID=42067016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098127715A TWI388031B (en) 2008-08-19 2009-08-18 Processing system

Country Status (4)

Country Link
JP (1) JP5274148B2 (en)
KR (1) KR101366407B1 (en)
CN (1) CN101710564B (en)
TW (1) TWI388031B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727355B (en) * 2018-09-28 2021-05-11 美商應用材料股份有限公司 Processing system and method of processing substrates

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550053B2 (en) * 2011-03-25 2014-07-16 ビアメカニクス株式会社 Inversion apparatus, exposure apparatus using the same, and exposure method
JP6156513B2 (en) * 2013-11-22 2017-07-05 株式会社島津製作所 Substrate processing system
JP6391362B2 (en) * 2014-08-25 2018-09-19 株式会社Screenホールディングス Vacuum drying apparatus, substrate processing apparatus, and vacuum drying method
WO2016199689A1 (en) * 2015-06-11 2016-12-15 シャープ株式会社 Substrate treatment apparatus
JP6864514B2 (en) * 2017-03-23 2021-04-28 株式会社Screenホールディングス Board processing system and board processing method
JP7232596B2 (en) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
KR102108312B1 (en) 2018-10-31 2020-05-12 세메스 주식회사 Apparatus and Method for treating substrate
JP7142566B2 (en) * 2018-12-27 2022-09-27 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN111457858A (en) * 2019-01-18 2020-07-28 东京毅力科创株式会社 Measuring apparatus, substrate processing system, and measuring method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235949A (en) * 1998-12-17 2000-08-29 Tokyo Electron Ltd Coating/developing equipment and its method
JP4114737B2 (en) * 2001-03-09 2008-07-09 東京エレクトロン株式会社 Processing equipment
JP2005251864A (en) * 2004-03-02 2005-09-15 Tokyo Electron Ltd Treatment system
US7403260B2 (en) * 2005-03-11 2008-07-22 Tokyo Electron Limited Coating and developing system
JP4005609B2 (en) * 2005-06-17 2007-11-07 美岳 伊藤 Substrate processing apparatus, substrate processing method, and substrate manufacturing method
JP4797662B2 (en) * 2006-02-03 2011-10-19 東京エレクトロン株式会社 Coating, developing method, coating, developing apparatus and storage medium
JP4816217B2 (en) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 Coating, developing device, coating, developing method and storage medium
JP4873230B2 (en) * 2006-05-19 2012-02-08 株式会社ニコン Exposure method, exposure apparatus, measurement method, and measurement apparatus
JP4954642B2 (en) * 2006-08-29 2012-06-20 東京エレクトロン株式会社 Development processing apparatus and development processing method
JP4845204B2 (en) * 2006-11-30 2011-12-28 東京エレクトロン株式会社 Coating film forming apparatus and coating film forming method
US8740205B2 (en) * 2007-04-16 2014-06-03 Ulvac, Inc. Conveyor and deposition apparatus, and maintenance method thereof
JP4643630B2 (en) * 2007-11-27 2011-03-02 東京エレクトロン株式会社 Processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727355B (en) * 2018-09-28 2021-05-11 美商應用材料股份有限公司 Processing system and method of processing substrates

Also Published As

Publication number Publication date
KR101366407B1 (en) 2014-02-24
TWI388031B (en) 2013-03-01
JP2010050140A (en) 2010-03-04
KR20100022439A (en) 2010-03-02
JP5274148B2 (en) 2013-08-28
CN101710564A (en) 2010-05-19
CN101710564B (en) 2011-12-28

Similar Documents

Publication Publication Date Title
TWI388031B (en) Processing system
TWI294639B (en) Stage equipment and coating processing equipment
TWI303450B (en) Stage equipment and coating processing equipment
JP4954162B2 (en) Processing system
JP4745040B2 (en) Substrate transport apparatus and substrate processing apparatus
TWI375135B (en) Reduced-pressure drying device
JP4407970B2 (en) Substrate processing apparatus and substrate processing method
JP4384685B2 (en) Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method
TWI311633B (en) Decompression drier
KR101300853B1 (en) Substrate conveying system, substrate conveying device and substrate treatment device
KR20090031823A (en) Normal pressure drying device, substrate processing apparatus and substrate processing method
TWI260686B (en) Coating film forming apparatus
TW200415702A (en) Method and apparatus for coating with resist
KR101568050B1 (en) Substrate processing apparatus
JP2011114055A (en) Substrate processing apparatus, substrate processing method, and vacuum-drying device
JP4620536B2 (en) Substrate processing equipment
JP2007173365A (en) System and method for processing application drying
KR20110066864A (en) Substrate processing apparatus, substrate processing method and recording medium storing program for executing the substrate processing method
JP2010083610A (en) Treatment system
JP4763763B2 (en) Resist coating development system
JP2004307115A (en) Processing system
JP4643630B2 (en) Processing equipment
JP4619562B2 (en) Processing equipment
JP2002313699A (en) Processor
JP4589986B2 (en) Substrate heating device