TWI375135B - Reduced-pressure drying device - Google Patents

Reduced-pressure drying device Download PDF

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TWI375135B
TWI375135B TW096140948A TW96140948A TWI375135B TW I375135 B TWI375135 B TW I375135B TW 096140948 A TW096140948 A TW 096140948A TW 96140948 A TW96140948 A TW 96140948A TW I375135 B TWI375135 B TW I375135B
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chamber
substrate
roller
pin
transport
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TW096140948A
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Chinese (zh)
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TW200842525A (en
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Takahiro Sakamoto
Mitsuhiro Sakai
Shunichi Yahiro
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Tokyo Electron Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Nonlinear Science (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

t 1375135 九、發明說明: 【發明所屬之技術領域】 燥之使塗布在被處理基板上之塗布液於嶋 【先前技術】 此種減座乾燥裝置’係用於例如液晶顯 嫌減猶嶋= 習知的減壓乾燥裝置,例如如專利文獻】所記載,具有:頂 ^開二之托盤或淺底容器型之下部腔室,以及可氣密地密合或嵌 。於此下部腔室之頂面的蓋狀上部腔室。下雜室之中,設有台 ^ ’於此台座上將基板水平地載置而後,關閉腔室(使上部腔室= 將ίΐί~^而開放腔室,再者,為將基板裝載/卸載, ϊ #適备升。然後,基板搬出人或裝載/卸載,係择 由在減壓乾雜置顯操作魏絲 行曰 [專利文獻1]日本_聰_18刪 狀υ來進订 【發明内容】 [發明欲解決之問題] 在Ϊ知的紐乾燥裝置’如上所述,每次將基板搬出人腔室時, 糸以將上部腔室上升下降(開閉)之方式 =t 1375135 IX. Description of the invention: [Technical field to which the invention pertains] The coating liquid applied to the substrate to be treated is dried. [Prior Art] This type of reduction drying device is used for, for example, liquid crystal display. A conventional vacuum drying apparatus, for example, as described in the patent document, has a top tray or a shallow bottom container type lower chamber, and can be airtightly fitted or embedded. A cap-shaped upper chamber on the top surface of the lower chamber. Among the lower chambers, there is a table ^' on which the substrate is placed horizontally, and then the chamber is closed (the upper chamber = the chamber is opened, and further, the substrate is loaded/unloaded) , ϊ #适备升. Then, the substrate is carried out or loaded/unloaded, and the selection is performed by the Weishang line in the decompression and dry operation [Patent Document 1] Japanese _ _ _ _ _ _ _ _ _ _ _ _ _ Contents] [Problems to be Solved by the Invention] As described above, each time the substrate is carried out of the human chamber, the upper chamber is raised and lowered (opened and closed).

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ϋ為-邊超過2米的大小,難室會㈣大型化 上雜室就有2_上的重量,需要大型的升降機構,且 =動造成,塵的問題或對於作業人員在安全上的問題也會J 器人也愈來愈Α型化,但是將大的基板^平地 保持運讀來愈難,·抗_塗布後之基板如目驗以彎曲的 t癌運送’容易在將基板搬出入減壓乾燥裝置之腔室或裝載/卸載 時’發生位置偏離或碰撞或破損等錯誤。 本發明有鑑於上述習知技術之問題而生,目的在於提供一種 減壓乾燥裝置,以良好效率且安全、順暢地進行被處理基板之搬 出入丄而且使在基板上之塗布膜附著到基板接觸部之轉印痕跡抑 制车最小限度。 [解決問題之方式] 味在,ΐί之中離散配置之多數升降銷,於實施前述乾燥 將祕升關之前端提高至高於前述滾子通道而支 二述基板搬出人時’使前述升降銷之鎖前 為達成上述目的,本發明之減壓乾燥裝置,係對於被處理基 扳上之塗布液以減壓狀態施以乾燥處理,具備:可減壓之腔室, 有用以將前述基板以大致水平狀態收容之空間;g i排氣機構, ,了實巧前述乾燥處理,使前述腔室内在密閉狀態進行真空排 軋i運送機構,具有在前述腔室外與中間連續的滾子運送通道, 滾子運騎道上之滾子運送將前述基板搬出人前述腔室; 二機構,具有為了將前述基板以銷前端大致水平地支持並上升 絲子運送通道,而⑽麟賴絲進行前述 、料i述,構^ ’由於係將應接受_乾燥處理之基板,以 以'料之中’並將於腔室内減壓乾燥處理完畢的基板 “子運达搬出到腔室外,所以不需要使用運送臂之運送機器 離發ί基板像11扇-樣地彎#,而造成請卸載時位i偏 Ιϊΐϊ °又’在搬出人基板時,不需要開閉腔ί 乾ίίί Γ t Ιί__或安全上的問題。再者,於減麗 通道往上方抬起而ί持根姿勢從滚子運送 到基板接觸部之轉二所^有附著 巧〇.8職以下(右考慮強度’則較佳為〇4麵〜〇6麵),能顯著 1375135 =低跡產生。再者,為進—步地減少轉印 ^為’升降_具有中,所構_本體以及絲在 ^ =^脂製銷尖端部,更佳為齡端部由其前端呈_之^ 鮮二依Ϊ本發明之-較佳雜,升降機構,係㈣直豎立支 1降銷之雜或板狀絲部配置核子運送通道 产。战 ,基部_配置在腔室外之升降驅動源之购力升降。若 ί: =51Ϊ降機構而施用於腔室之密封機構為必要最小: 又此在減ι狀態之腔室内使多數根升降銷升降動作。 道之i子======細子運送通 ϊίίί ,Γ?部分的任意部位以軸承支持。本發明 ,可由兩端部固定於固定高度位置之第1車由承 以筆直的姿 :且,♦高触㈣整之第2軸 編心’即嶋的滾侧 又 將基板中==側1設有:用於 以滾子運送從腔室之中搬出‘面以將基板 n'f_。此情 故閘 ?以:;、=,運送通過之程度的大小即可, 壁部’但是也可以用1個Π兼用為搬出人σ。 又’依照本發明之—較佳紐 抓 普== 7 又,依照本發明之—較佳態樣,紐去腔室内之塵埃,會設 ^將^室内於開放狀態實施排氣的第2排氣機構。此第2排氣機 ,田較佳為與設置於腔室之將排氣σ真空抽吸用的第丨排氣機構 兴用。 (發明之效果) 依,本發明之減壓乾縣置’能_像上述構成及作用,以 f好效率、安全且順暢地進碰處理基板之«人,且能使在基 板上之塗布膜附著基板接觸部之轉印痕跡減至最小限度。 【實施方式】 [實施發明之最佳形態] 以下,參照附圖說明本發明之較佳實施形能。 ^顯示能適用本發明減壓乾燥裝置之;成例的塗布顯影 驗布顯影處理系統1〇,設置於清淨室内,例如以玻 為被纽基板,實祕LCD製造處財之級影步驟之 :如洗、抗储丨塗布、預烘、顯影及後料—連$處理。曝 處理,係於鄰接於此系統而設置之外部曝光裝置12進行。 nD/c、it塗布顯影處理系統1〇,在中心部配置橫長的處理站 其長邊方向(X方向)的㈣雜置E盒站(C/S)14及界 20 ’為系統1〇之.搬出入埠,具備:厘盒台座 重疊而可收衫糾之水付向(丫方 ί ίίϋΐ輯置;運送機構22,對於此台座2G上之匿盒c ^丁 J板G搬出人。運送機構22 ’具有 基板 反向(二 坪5之’從E盒站(C/S)14側往界面站(I/F)18側之上游部 ’沿著第1平流運送通道34,從上游側起依序以一列配 ^搬入單元(INPASS)24、清洗處理部26、第!熱處理部%、塗 布處理部30及第2熱處理部32。 更詳5之’搬入單元(INPASS)24從匣盒站(c/s)14之運送機 ,接取未處理之基板G,以既定作業時間投;^ 。清洗歧部26,沿著第〗平流魏通道%從上游側起依 序地言又置準分子UV照射單元(E-UV)36及擦磨清洗單元 (SCR)38。第1熱處理部28,從上游側起依序地設置黏附單元 =)4()及冷卻單元(c〇L)42。塗布處理部%,從上游側起依序地 故,抗蝕劑塗布單元(COT)44及減壓乾燥單元。第2熱處 理。卩32’從上游侧起依序地設置預烘單元 ^。位於第2祕轉32猶鑛之第2 4 k 34終點、設置通過單元(PASS)52。於第1平流運送通道34上 以平流運送絲的基板G ’從此賴之通過單A 到界面站卿8。 认 另一方面,從界面站(]717)18側往匣盒站(c/s)14側之下游部處 f線fn第2平流運送通道64從上賴起依序成-列配置: ,,員影f tc(DEV)54、後烘單元(p〇ST_BAKE)56、冷卻單元(c %、 檢查單τ〇(ΑΡ)60及搬出單元(OUT_pASS)62。在此,後烘單元 (fOST-BAKE)56及冷卻單元(a)L)58構成第3熱處理部66。搬出 =(OUTPASS)62 ’從第2平流運送通道M將處理完畢的基板g I片地接取,並遞送給匣盒站(c/s)14之運送機構22。 一在兩巧理線A、B之間,、設有輔助運送空間明,能將基板〇 以單片為單位水平載置之穿梭機構7G,_未圖示之驅動, 可於處理線方向(X方向)雙方向移動。 界面站讲)18,具有實施上述第1及第2平流運送通道34、 64或鄰接之曝光裝置I2與基板㈣之交流的運送裝置72, 送裝置72之周圍配置有旋轉台座卿)74及周邊裝置%。 △ 座(R/S)74,為將基板G於水平面内旋轉之台座,用於在與曝光装 1375135 * ' 置125間遞送時轉換長方形基板G之方向。周邊裝置,將例 如印字曝光器(TITLER)或周邊曝光裝置(EE)等與第2平流運送通 道64連接。 ^ 圖2之中,顯示此塗布顯影處理系統之中,對於1片基板g =所有步驟的處理步驟。首先,在匣盒站(c/s)14,運送機構22從 ,座20上任一匣盒C中取出1片基板G,將取出的基扳〇搬入 處理站(P/S)16之處理線A側之搬入單元(inPASS)24(步驟S1)e基 板G從搬入單元(INPASS)24被移載或投入第丨平流運送通道34 上。 • ,投入第1平流運送通道34之基板G,最初在清洗處理部· 26,藉由準分子^照射單元田―仍^託及擦磨清洗單元 (SCR)38 ’依序貫施紫外線清洗處理及擦磨清洗處理(步驟、 . S3)。擦磨清洗單元(SCR)38,對於在平流運送通道34上水平移動 之基板G,藉由施以刷洗或吹風清洗,從基板表面除去 ' 之後,施以沖洗處理,最後空氣刀等使基板.G乾燥。t磨 巧$單兀(801)38中,若一連串之清洗處理結束,則基板^直接 從第1平流運送通道34下來’通過第1熱處理部28。 於第1熱處理部28中,基板.G,最初在黏附單元(Α〇)4〇被施 • 以使用蒸氣狀™1^之黏附處理,將被處理面疏水化(步驟S4)。 .於此黏附處理結束後,基板G以冷卻單元(C〇L)42冷卻至既定之 基板溫度(步驟S5)。此後,基板G從第1平流運送通道34下來, . 被搬入塗布處理部30。 於塗布處理部30,基板G最初於抗蝕劑塗布單元((:〇乃44維 ' #平,地利用使用狹縫喷嘴之非旋轉法,在基板頂面(被處理面) 塗布抗蝕劑液,隨後立即於下游側鄰之減壓乾燥單元,接 受利用減壓之常溫乾燥處理(步驟S6)。 離開塗布處理部30之基板G’從第1·平流運送通道34下來, ,過第2熱處理部32。於第2熱處理部32,基板G,最初在預烘 單元(PRE-B AKE)4 8接受作為抗餘劑塗布後之熱處理或曝光前之 10 1375135 j7)。藉此預烘,將殘留在基板g上之抗蝕劑 其4c广心片洛發除去,強化抗蝕劑膜對於基板之密合性。其次, 二德^Ϊ卻單元(C〇L)50冷卻至既定之基板溫度(步驟S8)。 .二終點之通過~被 向攀ϊί面ΪΓ18,基板G以旋轉台座74例如接受90度之方 後’被搬人周邊錢76之周邊曝絲置_,於此, ί if Γ著在級G之職部的抗_於顯料除去之曝光後, k到相鄰的曝光裝置12(步驟S9)。 铁後於對r基板g上之抗银劑曝光既定電路圖案。 j t束圖案曝光之基板G,若從曝光裝置12返回界面站 (=)18(步驟S9),首先,被搬入周邊裝置%之印字曝光器 徭1後在基板上之既定部位記錄既定資訊(步驟S10)。鈇 側的第2千&運运通道64的顯影單元(dev)54的起點。ϋ - 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 边 四 四 四 四 四 四 四 四 四 四 四 四 四 四It is also becoming more and more sturdy, but it is more difficult to keep a large substrate on the ground. The anti-coating substrate is transported in a curved t cancer. Errors such as positional deviation or collision or breakage occur in the chamber of the vacuum drying apparatus or during loading/unloading. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a vacuum drying apparatus which can carry out the loading and unloading of a substrate to be processed in a safe and smooth manner and attach the coating film on the substrate to the substrate. The transfer marks of the ministry inhibit the car to a minimum. [When the problem is solved] Most of the lift pins in the discrete arrangement are in the middle of the implementation of the above-mentioned drying, and the front end is raised above the roller passage to support the lifting of the substrate. In order to achieve the above object, the vacuum drying apparatus of the present invention is characterized in that the coating liquid applied to the substrate to be treated is subjected to a drying treatment under reduced pressure, and includes a chamber capable of decompressing, and the substrate is substantially The space in which the horizontal state is accommodated; the gi exhaust mechanism, and the above-described drying process, the vacuum chamber is transported in a sealed state in the chamber, and has a roller transport passage continuous to the outside of the chamber, and a roller The roller on the track is carried out to carry the substrate out of the chamber; and the second mechanism has a wire transport path for supporting the substrate substantially horizontally at the pin end, and (10) Lin said to perform the foregoing, Structure ^ 'Because the system will accept the drying process of the substrate, to "under the material" and the substrate in the chamber after drying under reduced pressure "sub-transport out to the cavity outside Therefore, it is not necessary to use the transport arm of the transporting machine to disengage the ί substrate like the 11-like curved bend #, and the unloading time i is biased ° ° and 'when moving out the substrate, there is no need to open and close the cavity ί ί Ι Ι _ _ or safety problem. In addition, the lifting channel is lifted upwards and the root position is transferred from the roller to the substrate contact portion. It is preferably 〇4 faces ~ 〇6 faces), which can significantly produce 1375135 = low traces. In addition, for the step-by-step reduction of transfer ^ for 'lifting _ with medium, constructed _ body and wire in ^ = grease The tip end of the pin-making part is better, and the end portion of the body is represented by the front end of the invention. The second embodiment of the invention is based on the invention - a preferred hybrid, a lifting mechanism, and a (four) straight vertical support 1 The transport channel is produced. The base is configured to be lifted and lowered by the lift drive source outside the chamber. If the pressure mechanism is applied to the chamber, the sealing mechanism is the minimum necessary: Most of the lift pins are lifted and lowered. The i sub ======The fine haul transport pass ϊ ί ί ί According to the present invention, the first vehicle that can be fixed at a fixed height position at both ends can be in a straight posture: and, ♦ high-touch (four) whole second-axis braiding, that is, the rolling side of the crucible is in the substrate. = Side 1 is provided for: carrying the roller out of the chamber to carry out the 'face to the substrate n'f_. The situation is controlled by:;, =, the degree of transport through the wall, ' However, it is also possible to use one Π for both 搬 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The second exhaust mechanism that exhausts the indoors in an open state is preferably used in the second exhaust machine, and is preferably provided in a third exhaust mechanism for vacuum suction of the exhaust gas σ provided in the chamber. (Effects of the Invention) According to the present invention, the dehumidification can be used to form a coating film on the substrate in a manner that efficiently and safely and smoothly enters the substrate. The transfer marks attached to the substrate contact portions are minimized. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. ^ Shows that the vacuum drying apparatus of the present invention can be applied; the coating development and development fabric development processing system of the example 1 is installed in a clean room, for example, the glass substrate is used as a substrate, and the solid LCD manufacturing process is as follows: Such as washing, anti-storage coating, pre-baking, developing and post-processing - even $ processing. The exposure treatment is performed by an external exposure device 12 disposed adjacent to the system. nD/c, it coating development processing system 1〇, in the center of the horizontal processing station, the long side direction (X direction) of the (four) miscellaneous E box station (C / S) 14 and boundary 20 ' is the system 1〇 Move out and enter, there are: PCT box pedestal overlap and can receive the shirt to correct the water payment (丫 ί ί ί ϋΐ ; ;; transport mechanism 22, for this pedestal 2G on the box c ^ D J board G moved out. The transport mechanism 22' has a substrate reversal (the second portion 5' from the E-box station (C/S) 14 side to the interface station (I/F) 18 side upstream portion' along the first advection transport path 34, from the upstream The side is sequentially arranged in a row (INPASS) 24, the cleaning processing unit 26, the first heat treatment unit %, the coating processing unit 30, and the second heat treatment unit 32. More specifically, the 'loading unit (INPASS) 24 is 匣The conveyor of the box station (c/s) 14 picks up the unprocessed substrate G and casts it for a predetermined working time; ^. The cleaning portion 26, along the grading flow channel % from the upstream side, sequentially The alignment molecular UV irradiation unit (E-UV) 36 and the scrub cleaning unit (SCR) 38. The first heat treatment unit 28 sequentially sets the adhesion unit =) 4 () and the cooling unit (c〇L) from the upstream side. 42. Coating treatment The part % is sequentially applied from the upstream side, a resist coating unit (COT) 44 and a reduced-pressure drying unit. The second heat treatment is performed. The 卩32' is provided with a pre-baking unit in order from the upstream side. The 2nd 4k 34 end point of the secret transfer 32 is set to pass through the unit (PASS) 52. The substrate G of the wire is transported on the first advection transport path 34 by the advection, and then passes through the single A to the interface station 8 . On the other hand, from the interface station (717) 18 side to the downstream side of the cassette station (c/s) 14 side, the f-line fn second advection transport path 64 is arranged in a row-by-column arrangement from the top: The member f tc (DEV) 54, the post-drying unit (p〇ST_BAKE) 56, the cooling unit (c%, the check sheet τ〇(ΑΡ) 60, and the carry-out unit (OUT_pASS) 62. Here, the post-drying unit (fOST- BAKE) 56 and cooling unit (a) L) 58 constitute a third heat treatment unit 66. Carry out = (OUTPASS) 62 'The processed substrate g I is taken from the second advection transport path M and delivered to the cassette. The transport mechanism 22 of the station (c/s) 14 is a shuttle mechanism 7G, which is capable of horizontally placing the substrate 单 in units of a single piece, between the two smart lines A and B. Drive not shown, Moving in the processing direction (X direction) in both directions. The interface station 18 has a transport device 72 for performing the first and second advection transport channels 34, 64 or the adjacent exposure device I2 and the substrate (4), and the transport device Around the 72, a rotating pedestal 74 and peripheral devices are arranged. The Δ seat (R/S) 74 is a pedestal for rotating the substrate G in the horizontal plane for converting the direction of the rectangular substrate G when being delivered between the exposure device 1375135*'. The peripheral device is connected to the second advancing transport path 64 by, for example, a print exposure device (TITLER) or a peripheral exposure device (EE). ^ In Fig. 2, the processing steps of all the steps of g = one step in the coating development processing system are shown. First, at the cassette station (c/s) 14, the transport mechanism 22 takes out one of the substrates G from any of the cassettes C on the holder 20, and carries the taken-out substrate into the processing line of the processing station (P/S) 16. The carry-in unit (inPASS) 24 on the A side (step S1) e The substrate G is transferred from the carry-in unit (INPASS) 24 or is placed on the second advection transport path 34. • The substrate G that has been introduced into the first advection transport path 34 is initially subjected to ultraviolet cleaning treatment by the excimer ^ irradiation unit and the scrub cleaning unit (SCR) 38 ' in the cleaning processing unit 26 And scrub cleaning treatment (step, .S3). A scrubbing cleaning unit (SCR) 38, for the substrate G horizontally moving on the advection transport path 34, is subjected to brushing or blow cleaning, and is removed from the surface of the substrate, followed by a rinsing process, and finally an air knife or the like to cause the substrate. G is dry. When the series of cleaning processes is completed, the substrate ^ is directly passed down from the first advection transport path 34 to pass through the first heat treatment portion 28. In the first heat treatment unit 28, the substrate G is first applied to the adhesion unit (4), and the surface to be treated is hydrophobized by the adhesion treatment using the vapor form TM1 (step S4). After the end of the adhesion process, the substrate G is cooled by the cooling unit (C〇L) 42 to a predetermined substrate temperature (step S5). Thereafter, the substrate G is lowered from the first advection transport path 34, and is carried into the coating processing unit 30. In the coating processing unit 30, the substrate G is initially applied to the resist coating unit ((:: 〇 is 44-dimensional, using a non-rotation method using a slit nozzle, and a resist is applied on the top surface (processed surface) of the substrate) Immediately thereafter, the liquid is immediately subjected to a drying treatment at room temperature by a downstream side (step S6). The substrate G' leaving the coating processing unit 30 is lowered from the first advection conveying passage 34, and the second is passed. The heat treatment unit 32. In the second heat treatment unit 32, the substrate G is first subjected to heat treatment after application of the anti-surplus agent or pre-exposure 10 1375135 j7) in the pre-baking unit (PRE-B AKE) 48. The resist remaining on the substrate g is removed from the 4c wide core sheet to enhance the adhesion of the resist film to the substrate. Secondly, the second unit (C〇L) 50 is cooled to a predetermined substrate. Temperature (step S8). The passage of the second end point is to be climbed to the surface ,18, and the substrate G is rotated by the pedestal 74, for example, after receiving 90 degrees, and the surrounding area of the peripheral money 76 is moved. _ Here, ί If next to the exposure of the level G, the exposure to the exposure is removed, k to the adjacent exposure device 12 (step S9). Then, the anti-silver agent on the r substrate g is exposed to a predetermined circuit pattern. When the substrate G exposed by the jt beam pattern is returned from the exposure device 12 to the interface station (=) 18 (step S9), first, the printing of the peripheral device is carried out. After the exposure device 徭1, predetermined information is recorded on a predetermined portion on the substrate (step S10). The starting point of the developing unit (dev) 54 of the second thousand &

之ιίϋ式HG其次在第2平流運送通道64上往處理線B 4初_影單柳ev)54,基板g在以平流運 期顯影、沖洗、乾燥之—連串顯影處理(步驟su)。 於t=(DEV)54 ’結束一連串顯影處理之基板G,以承載 2 道64之狀態,依序通過第3熱處理部%及檢 ^早凡(AP)6〇。於第3熱處理部66 ’基板G最初在後元 (^OST-BAKE)%接受作為顧影處理後熱處理 =化上之抗側膜的顯影液或;膏洗液蒸= 案對於基板之密合性。其次,基板G於冷卻單 ί t卩至既絲板溫度(步驟S13)。於檢查單元(仰〇, 厚姓劑圖案,進行非接觸之線寬檢查或膜質、膜 ,出單元(OUTPASS)62從第2平流運送通道64接取所有 驟之處理已結束的基板G ’遞送給g盒站(c/s)i4之運送機構U。 11 1375135 於匡盒站(C/S)14側,運送機構22將從搬出單元(〇UTpASS)62接 取之處理完畢的基板G’收容在任-(通常為原來的(步驟 S1)。 於此塗影處理系統1〇,可將本發明適用於塗布處理部30 内之減壓乾燥單元(VD)46。以下,依照圖3〜圖π,對於本發明 較佳實施形態中之塗布處理部内3〇之減壓乾燥單元(VD)46之構 成及作用詳加說明。Next, the HG is applied to the processing line B 4 at the second advection transport path 64, and the substrate g is developed, washed, and dried in a parallel flow process (step su). The substrate G which has been subjected to a series of development processes at t = (DEV) 54 'end passes through the third heat treatment portion % and the inspection (AP) 6 依 in a state of carrying two channels 64. In the third heat treatment unit 66', the substrate G is initially subjected to the development of the anti-side film as the heat treatment of the after-treatment (the OST-BAKE), or the adhesion of the paste liquid to the substrate. Sex. Next, the substrate G is cooled to the temperature of the both sheets (step S13). In the inspection unit (returning, thick surname pattern, performing non-contact line width inspection or film quality, film, out unit (OUTPASS) 62 from the second advection transport channel 64 to receive all the processing of the finished substrate G' delivery The transport mechanism U of the g-cart station (c/s) i4. 11 1375135 On the side of the cassette station (C/S) 14, the transport mechanism 22 receives the processed substrate G' from the carry-out unit (〇UTpASS) 62. The present invention is generally used (step S1). The coating processing system 1 can be applied to the vacuum drying unit (VD) 46 in the coating processing unit 30. Hereinafter, according to Fig. 3 to Fig. 3 π, the configuration and operation of the vacuum drying unit (VD) 46 in the coating treatment unit in the preferred embodiment of the present invention will be described in detail.

圖3顯不此實施形態之中,塗布處理部3〇之全體構成平面 圖。圖4〜圖6顯示-實施例的減壓乾燥單元⑽抑之構成,圖 4為其平面圖、圖5及圖6為其剖面圖。 、、:』LI中:、抗賴塗布單元(C〇T)44,具有:構成第1平流運 ϋ 二!τ部分或一區間之浮起式台座8〇,以及將於此台 ί:盖ί G於台座長邊方向(χ方向)運送之基板運 座8G上運送之基板g的頂面供給抗钱 ====84,収μ錢妓敎触鋪嗔嘴- 多數ίΐΐΓΛ面=有將既定氣體(例如空氣)對於上方喷射之 f射⑽触狀氣體之壓 wΪ反機構82,具備:一對引導軌道90A、讎,夾持著 =Γ可向称縣機構92,沿著此利導執道90A、 抗蝕劑賁嘴84,為於台座8〇之上方 垂直之水付向(Y方向;)橫斷延伸 二I方向(X方向) 置,對於财其正下方之基尺射餘蚊塗布位 劑液成帶狀喷吐。又’抗4^=盜= 1375135 持構件94 一體地於χ方向移動,且 布位置與噴嘴更新部86之間移動。 ' 向升降,能在上述塗 星備H新部86 ΐ台座8〇上方既定位置由支柱構件96保持, 具備·預塗(pmrnng}處理部%,用 :狂稱仵y6保持 於抗噴嘴84噴吐抗_液;噴嘴浴i布=的前準備而對 嘴84之抗鋪喷吐口乾燥,而保持^容劑塞氣抗儀劑喷 清洗機構脱,用以將附著在抗姓 以及㈣ 的抗姓劑除去。 1噴嘴84之抗餘劑噴吐口附近 從塗布單元(cot)44社要作用。首先,將 以r運送送過來的基板g 所然ί之二姿t持浮起狀態。 _6..蝴x方;乾燥單元 :液之端往後端以絨毯狀布設之方式將抗钱 d液之液跡成為-面。#此塗布有抗輔液 ==;=到台座80上,越過台座80之後端= J後处滾子運k通道104,於此解除滑動機構92 滚子運送通道K)4之基板G,之後如後所述,在滾子 上滾子運送並移動,搬入後段之減壓乾燥單元^)46。 塗布處理完畢之基板G如上狀式送丨賴乾料元⑽ 侧後’滑動機構92為了接取下一基板G,而返回台座8〇前端側 之搬入部。又’抗·噴嘴84,若結束!次或多次塗布處理 ^塗布位置(抗蝕劑液喷吐位置)往噴嘴更新部86移動,並於虛 實施喷嘴清洗或預塗處理等更新或前準備後,返回塗布位置。 如圖3所示,抗蝕劑塗布單元(COT)44在台座8〇之延長上 游側),布設有構成第1平流運送通道34(圖丨)一部分或一^間之 13 1375135 滚子運送通道104。此滚子運送通道104,在減壓乾燥單元(^)46 之腔室106之令及之外(前後)連續布設。 更詳言之’此減壓乾燥單元(VD)46周圍的滾子運送通道 1〇4 ’由以下所構成:搬入側滾子運送通道104a ’布設於腔室1〇6 之運送上游側’亦即搬入側;内部滾子運送通道104b,布設於腔 室106内;搬出側滾手運送通道104c,布設於腔室i06之運送下 游側,亦即,搬出側。 各。卩之滚子運送通道104a、104b、104c ’係使在運送方向(X 方向)各隔著適當間隔配置之多根滾子i〇8a、1〇8b、1〇8c藉由各獨 立或共通之運送驅動部而旋轉,而使基板G在滾子運送之運送方 向(X方向)運送。在此,搬入侧滾子運送通道104a,功能為接取從 抗蝕劑塗布單元(COT)44之台座80於浮起運送之延長搬出的基板 G ’以滾子運送送入減壓乾燥單元(^)46之腔室1〇6内。内^滾 子運送通道l〇4b ’功能為,將從搬入側滚子運送通道1〇4a以滾子 運送送過來的基板G .以同速度之滾子運送,送入腔室1〇6内同 時將在腔室106内減壓乾燥處理完畢之基板G以滚子運送送出到 腔室106之外(後段)。搬出側滾子運送通道1〇4c,功能為,將從 腔至106内之内部滾子運送通道i〇4b送出之處理完畢的基板G以 同速度之滚子運送接取,送到後段處理部(第2熱處理部32)。 如圖3〜圖6所示,減壓乾燥單元(^0)46之腔室1〇6,形成 為較扁平的直方體,其中,具有能將墓板G水平收容的空間二於 此腔室106之運送方向(X方向),彼此相向的一對(上游側及下游 側)之腔室側壁,各設有基板G能以平流恰夠通過之大小的口的 縫狀搬入口 110及搬出口 112。再者,用於開閉此等搬入口 1⑴ 搬出口 112之閘機構114、116安裝於腔室1〇6之外壁。腔室1〇6 之頂面部或上蓋118,在維修時可取下。 各閘機構Π4、116圖示雖省略,但具備:蓋體(閥體 狹縫狀之搬出入口(110、m)氣密地閉塞;第i缸筒,使此罢^ 與搬出人口 _、m)水平對向之錯直往動位置以及更低的二^ 14 1375135 動位置之間升降移動;第2缸筒,使蓋體在相對於搬出入口(11〇、 112)為氣密密合之水平往動位置及離開分離之水平回動位置之間 水平移動。 於腔室106内’構成内部滾子運送通道1〇4b之滾子1〇%,以 對應^搬出,口(110、112)之高度位置,在運送方向(χ方向)隔 週富間隔配置成一列,一部分或全部之滾子i〇gb與設於腔室i〇6 之外的馬達等旋轉驅動源120經由適當的傳動機構連接。各滾子 l〇8b,由外徑相同的圓筒部或圓柱部而與基板〇之背面接觸之棒 體形式構成,其兩端部被設置在腔室106之左右兩側壁或其附近 的軸承(未圖示)以可旋轉方式支持著。傳動機構之旋轉軸122貫 之腔室106之側壁部分,以密封構件124密封。 構成搬入側滾子運送通道l〇4a之滾子i〇8a,圖示亦省略,其 兩端部由E1定在框架等雜相可旋轉方式支持著,藉由和上& 内部滚子運送通道104b 之轉驅祕12G共通或其他的旋轉驅 動源而旋轉驅動。構成搬出側滾子運送通道l〇4c之l〇8c亦同。 此減壓乾燥單元(VD)46,具有用於在腔室1〇6内使基板G以 大致水平地支持而上升下降的升降機構126。此升降機構,具 備:多數根(較佳為50根以上)之升降銷128,在腔室1〇6内以& J的配置_(例如矩陣狀)離散的配置;錄水平棒或水平板的銷 ^部130 ’將此等升降銷128以各既定之組或群,在較内部滾子運 送通道104b更低的位置支持;升降驅動源例如缸筒132, 銷基部130升降移動,配置在腔室ι〇6之外(下)。 … 更詳言之’於相鄰接的2根滾子l〇8b、l〇8b的間隙,與滾子 108b平行(γ方向)地’多數根(較佳為7根以上)升降銷⑵^固定 直Ϊ立配置成一列’該升降銷列在運送方向(X方向)隔著適 ,間隔设有多數列(較佳為8列以上),使各銷基部13〇支持i組或 £數組(圖示之例為2組)的升降銷列。然後,腔室1〇6之底壁經由 =構件134而氣密地貫通,且藉由可升降移動之升降驅動轴 36,將腔室内侧之各銷基部13〇與腔室外側之各對應缸筒m連 15 1375135 接。 f該構成之升降機構126,藉由使全躲筒132於 5動程一起前進(上升)或後退(下降)驅動 由驅動 m及銷基部13G將所有升_ 12δ齊―化為銷 ^所不銷前端在較滾子運送通道勵為低之 端在較滚子運送通道1嶋為高之往^上^^ 及銷’ ί ί :銷本體施’下端部固定在銷基部130; 5)。銷本i 128 本體12如之上端起往錯直上方突出(圖 」銷本體1撕,例如由不銹鋼(啊所構成剛體之 銷尖端部·,較佳為PEEK或Cdaz 二^ 圓柱狀频,㈣麵賴施之_]^顧^伽日所構成之· 在此,此實施形態中’升降銷128之銷尖端部咖, ^比f用在台座上之基板裝載/卸載之以往—般的移載^升i ▲板處嶋板後放下到台座並將處理後 =。亦即’㈣独往—般移載用升降銷之銷 上’此實施形態”升降銷128之銷尖端部成i 為〇.8mm以下(若考慮強度,最好的直 4 直 而且則端圓形化為既定反値(例如R=〇2〜〇 3mm)。.贿) 持既^ 5i 5 i4^ 較’亦即接近—及搬出σ出且 氣iti送通道更低之位置,設有於γ方向延伸之圓筒狀§ 、嘴M44。此等氮氣喷出部144,例如由將金屬粉末燒結而^ 16 1375135 之孔貝中二管所構成,經由配營146(圖4)而連接於氮氣供仏源 (ίΠ、)。減壓乾燥處理結束後,於維持腔室106密閉之狀ΐϊ減 壓狀I返回大氣壓狀態時,此等氮氣噴出部144從管之全部周面 噴出氮氣。 其次,說明此實施形態中減壓乾燥單元(^)46之作用。 如上所述,於上游側鄰之抗蝕劑塗布單元(c〇T)44塗布了抗 =液之基板G,以平流從台座8G上之浮域送通道機到搬入 ^滾子運送通道1G4a。之後,如圖5所示,基板G以滾子運送在 搬入側滾子運送通道臟上移動,最終碰人口 m進In the embodiment shown in Fig. 3, the entire coating processing unit 3 is a plan view. Fig. 4 to Fig. 6 show the configuration of the reduced-pressure drying unit (10) of the embodiment, and Fig. 4 is a plan view thereof, and Figs. 5 and 6 are sectional views thereof. ,::LI:: The anti-slipping coating unit (C〇T) 44 has: a floating pedestal 8 构成 which constitutes the first turbulent flow ! 2 τ part or a section, and ί G The top surface of the substrate g transported on the substrate transport 8G transported in the long-side direction of the pedestal (χ direction) is supplied with anti-money ====84, and the money is touched by the shop - most of the ΐΐΓΛ ΐΐΓΛ = = The predetermined gas (for example, air) is provided with a pair of guide rails 90A and 对于 for the injection of the upper (10) contact gas, and the clamped guide rail 90A, 夹持, and the Γ can be referred to the county mechanism 92, along the guide The obstruction 90A and the resist nozzle 84 are perpendicular to the water above the pedestal 8 ( (Y direction;) transversely extending in the second I direction (X direction), and the base beam is just below the financial base. The mosquito-coated solution is sprayed into a strip. Further, the anti-4^= thief = 1375135 holding member 94 is integrally moved in the x-direction and moved between the cloth position and the nozzle updating portion 86. 'The lifting and lowering can be held by the pillar member 96 at the predetermined position above the 涂 新 新 新 新 新 新 , , , , , , , , , , , , pm pm pm pm pm pm pm 84 84 84 84 84 84 84 84 84 84 84 84 84 84 Anti-liquid; nozzle bath i cloth = pre-preparation and drying against the mouth-spraying spout of the mouth 84, while maintaining the agent-filling gas-resistance agent spray cleaning mechanism to remove the anti-surname and (four) anti-surname The agent is removed. The vicinity of the anti-reagent spouting port of the nozzle 84 is applied from the coating unit (cot) 44. First, the substrate g transported by r is held in a floating state. _6.. Butterfly x square; drying unit: the liquid end to the back end in a velvet-like manner to make the liquid trace of the anti-money d liquid into a surface. #This coating has anti-auxiliary liquid ==; = to the pedestal 80, over the pedestal 80 After the rear end = J, the roller transports the k-channel 104, thereby releasing the substrate G of the roller transporting path K) 4 of the sliding mechanism 92, and then, as will be described later, the roller is transported and moved on the roller, and the moving into the rear section is reduced. Press drying unit ^) 46. The substrate G after the coating process is sent to the side of the dry material element (10) as described above. The sliding mechanism 92 returns to the loading portion of the front end side of the pedestal 8 in order to pick up the next substrate G. Also, 'anti-nozzle 84, if it is over! The coating process (the resist liquid ejection position) is moved to the nozzle refreshing portion 86, and after the refreshing or pre-coating process such as nozzle cleaning or precoating is performed, the coating position is returned. As shown in FIG. 3, a resist coating unit (COT) 44 is disposed on the extended upstream side of the pedestal 8), and is provided with a 13 1375135 roller transport path constituting a part of the first advection transport path 34 (Fig. 104. This roller transport path 104 is continuously disposed outside and outside (before and after) of the chamber 106 of the reduced-pressure drying unit (^) 46. More specifically, the roller transport path 1〇4' around the reduced-pressure drying unit (VD) 46 is constituted by the fact that the carry-in side roller transport path 104a' is disposed on the upstream side of the transport of the chamber 1〇6 That is, the carry-in side; the inner roller transport path 104b is disposed in the chamber 106; the carry-out side roller transport path 104c is disposed on the downstream side of the transport of the chamber i06, that is, the carry-out side. each. The roller transport passages 104a, 104b, and 104c' of the crucibles are each independently or in common by a plurality of rollers i8a, 1b, 8b, and 1b8 disposed at appropriate intervals in the transport direction (X direction). The drive unit is rotated to rotate, and the substrate G is transported in the transport direction (X direction) of the roller transport. Here, the loading side roller transport path 104a functions as a substrate G' that is taken out from the pedestal 80 of the resist coating unit (COT) 44 and transported by the roller to the decompression drying unit. ^) The chamber of 46 is within 1〇6. The inner roller transport path l〇4b' functions as a substrate G that is transported by a roller from the loading side roller transport path 1〇4a. It is transported by rollers of the same speed and sent into the chamber 1〇6. At the same time, the substrate G which has been dried under reduced pressure in the chamber 106 is transported by rollers to the outside of the chamber 106 (rear stage). The side roller transport path 1〇4c is carried out, and the processed substrate G sent from the inner roller transport path i〇4b in the cavity to 106 is transported by the roller of the same speed and sent to the rear stage processing unit. (Second heat treatment unit 32). As shown in FIG. 3 to FIG. 6, the chamber 1〇6 of the reduced-pressure drying unit (^0) 46 is formed into a relatively flat rectangular body, wherein there is a space in which the tomb G can be horizontally accommodated in the chamber. The transport direction of the 106 (X direction), the side walls of the pair of the upstream (the upstream side and the downstream side) facing each other, each of which is provided with a slit-shaped transfer port 110 and a transfer port in which the substrate G can pass through the size of the advancing flow. 112. Further, the shutter mechanisms 114 and 116 for opening and closing the inlets 1 (1) and the outlets 112 are attached to the outer walls of the chambers 1 and 6. The top surface or upper cover 118 of the chamber 1〇6 can be removed for maintenance. Although the illustration of each of the brake mechanisms Π4 and 116 is omitted, the cover body (the valve body slit-shaped carry-out port (110, m) is hermetically sealed; the i-th cylinder tube is used to remove and remove the population _, m The horizontally opposite straight moving position and the lower moving position between the moving positions; the second cylinder, so that the cover is airtight and close to the carrying out (11〇, 112) Horizontal movement between the horizontal forward position and the horizontal return position leaving the separation. In the chamber 106, '1% of the rollers constituting the internal roller transport passages 1〇4b are arranged in a row at a rich interval in the transport direction (χ direction) corresponding to the height position of the ports (110, 112). A part or all of the rollers i〇gb are connected to a rotary drive source 120 such as a motor provided outside the chamber i〇6 via an appropriate transmission mechanism. Each of the rollers 10 8b is formed of a rod body which is in contact with the back surface of the substrate cymbal by a cylindrical portion or a cylindrical portion having the same outer diameter, and both end portions thereof are provided on the left and right side walls of the chamber 106 or in the vicinity thereof. (not shown) is rotatably supported. The rotating shaft 122 of the transmission mechanism runs through the side wall portion of the chamber 106 and is sealed by the sealing member 124. The roller 〇8a constituting the loading side roller transport path 〇4a is also omitted from the drawing, and both end portions thereof are supported by a miscellaneous phase such as a frame by E1, and are transported by the upper & internal roller. The channel 104b is rotated or driven by a common 12G or other rotary drive source. The same applies to the l〇8c constituting the carry-out side roller transport path l〇4c. This reduced-pressure drying unit (VD) 46 has a lifting mechanism 126 for raising and lowering the substrate G in a substantially horizontal manner in the chamber 1〇6. The elevating mechanism includes a plurality of (preferably 50 or more) lift pins 128, which are disposed in the chamber 1〇6 in a configuration of & J (for example, a matrix); a horizontal bar or a horizontal plate is recorded. The pin portion 130' supports the lift pins 128 at a lower position than the inner roller transport passage 104b in each predetermined group or group; the lift drive source such as the cylinder tube 132, the pin base portion 130 moves up and down, and is disposed at Outside the chamber ι〇6 (bottom). ... more specifically 'the gap between the two adjacent rollers l8b, l8b, parallel to the roller 108b (γ direction) 'majority (preferably 7 or more) lifting pin (2) ^ The fixed straight standings are arranged in a row. The lifting pin rows are arranged in the transport direction (X direction) at appropriate intervals, and a plurality of columns (preferably 8 columns or more) are provided at intervals, so that the pin bases 13A support the i group or the £ array ( The illustrated example is a set of two sets of lift pins. Then, the bottom wall of the chamber 1〇6 is hermetically penetrated via the member 134, and the respective pin bases 13 on the inside of the chamber are connected to the corresponding cylinders on the outside of the chamber by the lifting and lowering drive shaft 36 that can be moved up and down. The tube is connected with 15 1375135. f. The elevating mechanism 126 configured to drive all the lifts -12 δ into the pins by the drive m and the pin base 13G by causing the full escaping 132 to advance (rise) or retreat (lower) together in the 5th motion. The pin front end is fixed to the pin base portion 130 at the lower end of the roller transport path excitation at the lower roller transport path 1 及 and the pin ' ί ί : pin body application' lower end portion; 5). The main body 12 of the pin i 128 protrudes straight upward from the upper end (the figure shows that the pin body 1 is torn, for example, stainless steel (the tip end portion of the rigid body formed by ah, preferably PEEK or Cdaz II cylindrical frequency, (4)面 之 之 ] ] ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Load the ii ▲ plate at the slab and put it down to the pedestal and after processing =. That is, '(4) singularly-like transfer pin for the lift pin 'this embodiment' the tip end of the lift pin 128 is i 〇.8mm or less (if the strength is considered, the best straight is straight and the end is rounded to the established ruthenium (for example, R=〇2~〇3mm).. Bribe) Holds both 5i 5 i4^ Proximate—and moving out of the σ out position and lowering the gas delivery channel, and having a cylindrical shape § and a mouth M44 extending in the γ direction. These nitrogen gas ejecting portions 144 are, for example, sintered by sintering metal powder. The second tube of the Kongbei middle is connected to the nitrogen supply source via the distribution 146 (Fig. 4). After the vacuum drying treatment is completed, the chamber 106 is sealed. When the pressure-reducing state I returns to the atmospheric pressure state, the nitrogen gas ejecting portions 144 discharge nitrogen gas from the entire circumferential surface of the tube. Next, the action of the reduced-pressure drying unit (46) in the embodiment will be described. The adjacent resist coating unit (c〇T) 44 is coated with the anti-liquid substrate G, and is flowed from the floating domain feeding channel on the pedestal 8G to the loading roller transporting passage 1G4a. Thereafter, as shown in FIG. It is shown that the substrate G is transported by rollers on the moving side roller transport path, and finally touches the population m.

之腔室106之中。此時,閘機構114預先開啟搬入 口丄 1U 〇 内部滾子運送通道1_亦藉由婦驅祕12()之 ΐ合側滾子運送通道购之滾子運送動作及時點,實施姉 運迗速度之滾子運送動作’如圖5所示,從搬入口 11〇進入之另 送進入到腔室106後方。此時,升降機構126,i 斤有的升降銷128其各銷前端在㈣部滾子運送通道觸 ,更低的回動(下降)位置先待機。然後,基板G若到達腔室取 中心之既定位置,則停止内部滾子運送通道獅之滾子 ^滾‘運此’或緊接在前停止搬人側滾子運送通道104ί 又,如上所述,應接受減壓乾燥處理之基板G從前段 抗敍劑塗布單元(COT)44搬入腔室廳時,在此同時(或g 所示’將剛於腔室内接受減壓乾燥處理之Ϊ 3運送通道_及搬出嫩子運送通道_ 、之連、,貝4速度之泼子運送’從搬出σ 112搬出到腔室鄕 此狀態以平流地運送到後段或下游娜之第2熱處理部 板G如i戶塗布單元(C〇T)44塗布了抗嶋的基 a 滾干運送通道104a及内部滾子運送通道104b 17 ^/5135In the chamber 106. At this time, the gate mechanism 114 opens the transfer port 丄1U 〇 the internal roller transport path 1_ in advance, and also purchases the roller transport action by the combined side roller transport channel of the woman drive secret 12 (), and implements the transfer operation in time. As shown in FIG. 5, the roller transporting operation of the speed is sent from the loading port 11 to the rear of the chamber 106. At this time, the lifting/lowering mechanism 126, the lifting pin 128 of the pinion, has its pin front end in the (four) part of the roller conveying path, and the lower reversing (lowering) position stands by. Then, if the substrate G reaches the predetermined position of the center of the chamber, the internal roller transport passage lion's roller is stopped, and the front side roller transport passage 104 is stopped, as described above. The substrate G to be subjected to the reduced-pressure drying treatment is carried into the chamber hall from the front-stage anti-smoke coating unit (COT) 44, and at the same time (or g is shown in the chamber to be subjected to vacuum drying treatment) The passage _ and the moving out of the tender transport path _ , , and the transfer of the shell 4 speed are carried out from the carry-out σ 112 to the chamber, and the state is transported advancing to the second stage of the second heat treatment section G of the rear stage or the downstream side. The i-coating unit (C〇T) 44 is coated with a tamper-resistant base a spin-drying transport passage 104a and an internal roller transport passage 104b 17^/5135

圖式簡單說明】 頌不貝轭形態之塗布處理部全體槿成巫品固A 圖2 圖 =3顯示實施形態之塗布處理 =示第1實施例之減壓乾燥單;=。 圖 ®硝不弟i貫施例之減餘燥單元礙出入之各部狀態^ 狀態第1實施例之減壓乾料元之減_祕理中各_ 圖7顯示第2實施例之減壓乾燥單元構成平面圖。 圖8顯示第2實施例之減壓乾燥單元構成剖面圖。 圖9顯示第2實施例中,將中心軸承之高度位 整之機構剖φ圖。 W以可變韻 圖10顯示第2實施例中,將中心軸承之高度位置 正之機構的一變形例側面圖。 、〜圖11顯示第2實施例中,設於腔室之搬出入口及/或閑機構3 滚筒式滾動之安裝構造立體圖。 【主要元件符號說明】 C EE G RL SY TITLER 10 12 13 14 H·盒 周邊曝光裝置. 基板 滚筒部 轴 印字曝光器 塗布顯影處理系統 曝光裝置 升降缸筒 匣盒站(C/S) 23 1375135BRIEF DESCRIPTION OF THE DRAWINGS The coating treatment unit of the 贝 贝 形态 形态 槿 巫 图 图 图 图 图 图 = = = = = = = = = = = = = = = = = = = = = = = = = = = = Figure 硝 硝 硝 i i i 施 减 减 单元 单元 单元 单元 单元 单元 单元 单元 单元 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 第 第 第 第 第 第 第 第 第 第 第 第 第The unit constitutes a plan view. Fig. 8 is a cross-sectional view showing the structure of the reduced-pressure drying unit of the second embodiment. Fig. 9 is a cross-sectional view showing the mechanism of the height of the center bearing in the second embodiment. W is a variable side view. Fig. 10 is a side view showing a modification of the mechanism in which the height position of the center bearing is positive in the second embodiment. Fig. 11 is a perspective view showing the mounting structure of the carrying-out port of the chamber and/or the rolling mechanism of the idle mechanism 3 in the second embodiment. [Main component symbol description] C EE G RL SY TITLER 10 12 13 14 H·Box Peripheral exposure device. Substrate Roller section Axis Printed exposure device Coating development processing system Exposure unit Lifting cylinder tube Box station (C/S) 23 1375135

16 處理站(P/S) 18 界面站(I/F) 20 台座 22 運送機構 22a 運送臂 24 搬入單元(IN PASS) 26 .清洗處理部 28 第1熱處理部 30 塗布處理部 32 第2熱處理部 34 第1平流運送通道 36 準分子UV照射單元(E-UV) 38 擦磨清洗單元(SCR) 40 黏附單元(AD) 42 冷卻單元(COL) _ 44 抗蝕劑塗布單元(COT) 46 減壓乾燥單元(VD) 48 預烘單元(PRE-BAKE) 50 冷卻單元(COL) 52 通過單元(PASS) 54 顯影單元(DEV) 56 後烘單元(POSTBAKE) 58 冷卻單元(COL) 60 檢查單元(AP) 62 搬出單元(OUT PASS) 64 第2平流運送通道 66 第3熱處理部 68 輔助運送空間 70 穿梭機構 24 137513516 processing station (P/S) 18 interface station (I/F) 20 pedestal 22 transport mechanism 22a transport arm 24 carry-in unit (IN PASS) 26 cleaning processing unit 28 first heat treatment unit 30 coating processing unit 32 second heat treatment unit 34 1st advection transport channel 36 Excimer UV irradiation unit (E-UV) 38 Scrub cleaning unit (SCR) 40 Adhesion unit (AD) 42 Cooling unit (COL) _ 44 Resin coating unit (COT) 46 Decompression Drying unit (VD) 48 Pre-bake unit (PRE-BAKE) 50 Cooling unit (COL) 52 Passing unit (PASS) 54 Developing unit (DEV) 56 Post-drying unit (POSTBAKE) 58 Cooling unit (COL) 60 Inspection unit (AP) 62 Outlet unit (OUT PASS) 64 Second advection transport path 66 Third heat treatment unit 68 Auxiliary transport space 70 Shuttle mechanism 24 1375135

72 運送裝置 74 旋轉台座(R/S) 76 周邊裝置 80 台座 82 基板運送機構 84 * 、. » . 4-. 86 喷嘴更新部 88 氣體喷射口 90A、90B 引導軌道 92 滑動機構 94 喷嘴支持構件 96 支柱構件 98 預塗處理部 100 喷嘴浴 102 喷嘴清洗機構 104 滚子運送通道 104a 滾子運送通道 104b 滾子運送通道 104c 滾子運送通道 106 腔室 108a、108b、108c、108d 滾子 110 搬入口 112 搬出口 114 、 116 閘機構 118 上蓋 120 旋轉驅動源 122 旋轉軸 124 密封構件 126 升降機構 25 137513572 Transport device 74 Rotating pedestal (R/S) 76 Peripheral device 80 pedestal 82 Substrate transport mechanism 84 *, . . . 4-. 86 Nozzle update unit 88 Gas injection port 90A, 90B Guide rail 92 Sliding mechanism 94 Nozzle support member 96 Strut member 98 Precoating treatment portion 100 Nozzle bath 102 Nozzle cleaning mechanism 104 Roller transport passage 104a Roller transport passage 104b Roller transport passage 104c Roller transport passage 106 Chambers 108a, 108b, 108c, 108d Roller 110 Carrying inlet 112 Outlet 114, 116 Gate mechanism 118 Upper cover 120 Rotary drive source 122 Rotary shaft 124 Sealing member 126 Lifting mechanism 25 1375135

128 升降銷 128a 銷本體 128b 銷尖端部 130 銷基部 132 缸筒 4 ^ j 密封構件 136 升降驅動轴 138 排氣口 140 排氣管 142 真空排氣裝置 144 氮氣喷出部 146 配管 150 轴承 152 轴承 154 基部 156 支持構件 158 支持構件 160 區塊 162 螺栓 164 螺栓 166 排氣用整流板 168 腳部 172 .驅動軸 174 馬達 176 從動滑輪組 178 傳送帶 180 驅動滑輪組 182 水平支持棒 184 水平連結棒 1375135 186、188、190、192 滾動支持部 194 窗 196 排氣管 198 排氣風扇(或排氣管路) 200、202 開閉閥128 Lifting pin 128a Pin body 128b Pin tip 130 Pin base 132 Cylinder 4 ^ j Sealing member 136 Lifting drive shaft 138 Exhaust port 140 Exhaust pipe 142 Vacuum exhaust 144 Nitrogen venting section 146 Piping 150 Bearing 152 Bearing 154 Base 156 Support member 158 Support member 160 Block 162 Bolt 164 Bolt 166 Venting rectifying plate 168 Foot 172. Drive shaft 174 Motor 176 Drive pulley block 178 Conveyor belt 180 Drive pulley block 182 Horizontal support rod 184 Horizontal joint rod 1375135 186, 188 190, 192 rolling support 194 window 196 exhaust pipe 198 exhaust fan (or exhaust pipe) 200, 202 open and close valve

2727

Claims (1)

1375135 096140948 (無劃線) 十、申請專利範圍: 1· 一種減壓乾燥裝置,用來對於被處理基板 狀態下施以乾燥處理,具備: 之堂布液,在祕 的空Γ咸壓之腔室,具有用以將該基板以大致水平狀態加以收容 態進將_室内_閉狀 運送機構’具有在該腔室之外部及内部連續之滚子運送通 k,以該滾子運送通道上之滾子運送將該基板搬出入該腔室丨及 々升降機構,具有在該腔室之中離散地配置的多數之 ί 銷刺以將絲板以直徑G.8mm以下的銷前端大致水平 送通道為高而支持著該基板,在』該== I:使该升降鎖之銷前端較該滾子運送通道為低,而實現利用該 運送機構來進行該基板之滾子運送。 申請專利細第1項之減壓乾燥裝置,其中,該升降銷之鎖 刖立而部之直徑為〇.4mm〜0.6mm。 3.如申請專補圍第1或2項之減壓乾縣置,其中,該升降鎖 ^有:由中空管構成之銷本體,以及安裝在此銷本體之前端部的 树脂製之銷尖端部。 ^如申請專利範圍第3項之減屢乾燥裝置,其中,該銷尖端部 前端成圓形的棒體。 5. 如申請專利範圍第1或2項之減壓乾燥裝置,其中,該升降機 構係置在該滾子運送通道之下方配置棒狀或板狀之銷基部,以垂 直豎立地支持著該升降銷,並藉由配置在該腔室之外的升降驅動 源的驅動力使該銷基部升降。 6. 如申請專利範圍第1或2項之減壓乾燥裝置’其中,在該腔室 之=,構成該滾子運送通道之滾子具有為固定直徑之軸以及隔著 既疋間隔而形成或安裝於此軸上之多數環狀滾筒,此等滾子在該 28 1375135 101年6月曰修正替換頁 096140948 (無劃線) 淚茼之外周面與該基板之底面相接觸。 =如申明專利範圍第6項之減壓乾燥裝置,其中,該滾動之軸, 2兩端部被固定在一定高度位置之第1軸承以可旋轉方式支持 f ’而其巾心部被高度位置可調整之第2軸承以可旋轉方式 者0 專利顧第1或2項之減餘縣置,其中,在該腔室 ’設#:職將絲板以滾子運送從該腔室外搬入該腔 i室ί的ί二及:以將縣板以滾子運送從該腔室内搬入到該 機構在該腔室側壁部之外’設有肋關馳人口及搬出口之閘 9山如申請專利範圍第8項之減壓乾燥裝置,其中 出口係相對向而分別設於該腔室之側壁部。 請專利範圍第8項之減魏燥裝置,其中,於 入口或搬出π,設姆成該滾子運送通叙 、二工至之搬 11·如申請專利顧η項之減壓乾燥裝置,=^袞二。 該搬入口或搬出口之狀態下構成麵子 12. 如申請專利範圍第1或2項之減壓乾燥梦晋, 清潔該腔室内部之目的,祕開放狀_該':巾,設有基於 第2排氣機構。 』工至内部進行排氣的 13. 如申請專利範圍第12項之減壓乾燥裝置,复 氣機構與該第2排氣機構共用之排氣口設於該腔將該第1排 十一、圖式: 291375135 096140948 (without marking) X. Patent application scope: 1. A vacuum drying device for drying the substrate under the condition of the substrate to be processed, with: a cloth liquid, in the secret cavity of the air a chamber for accommodating the substrate in a substantially horizontal state, the indoor-closed transport mechanism having a continuous roller transporting k on the outside and inside of the chamber, on the roller transport path Roller transporting the substrate into the chamber 々 and the 々 lifting mechanism, and having a plurality of spurs discretely arranged in the chamber to substantially horizontally feed the wire plate to the front end of the pin having a diameter of G.8 mm or less The substrate is supported high, and the == I: the front end of the lift lock pin is lower than the roller transport path, and the transport mechanism is used to carry out the roller transport of the substrate. The invention relates to a vacuum drying device according to the first aspect of the invention, wherein the lifting pin has a diameter of 〇.4 mm to 0.6 mm. 3. If applying for the decompression of the first or second item, the lifting lock has: a pin body composed of a hollow tube, and a resin pin installed at the front end of the pin body. Tip end. ^ The drying device of claim 3, wherein the tip end of the pin is formed into a circular rod. 5. The vacuum drying apparatus according to claim 1 or 2, wherein the lifting mechanism is disposed below the roller conveying passage, and a rod-shaped or plate-shaped pin base is disposed to vertically support the lifting The pin is lifted and lowered by a driving force of a lifting drive source disposed outside the chamber. 6. The vacuum drying apparatus of claim 1 or 2, wherein, in the chamber, the roller constituting the roller conveying passage has a shaft of a fixed diameter and is formed by an interval between the two or A plurality of annular rollers mounted on the shaft, the rollers are in contact with the bottom surface of the substrate at the outer surface of the teardrop, in accordance with the correction of the replacement page 096140948 (without scribe lines). The vacuum drying apparatus of claim 6, wherein the rolling shaft 2, the first bearing fixed at a certain height position at both ends, rotatably supports f' and the center of the towel is height-positioned The second bearing that can be adjusted is in a rotatable manner. Patent No. 1 or 2 of the reduced county, wherein the chamber is provided with a roller. The wire is transported from the outside of the chamber into the chamber. i room ί ί 二 和: to transport the county board by roller transport from the chamber to the mechanism outside the side wall of the chamber 'the ribs of the Chichi population and the exit gate 9 mountain as claimed patent scope Item 8. The vacuum drying apparatus of claim 8, wherein the outlets are disposed opposite to each other and are respectively disposed at sidewall portions of the chamber. Please refer to the eighth item of the patent scope to reduce the Wei-drying device, in which the inlet or the out-loading π, the set-up of the roller to transport the general-purpose, the second-work to the move 11 · such as the patented Gu η item of the vacuum drying device, = ^衮二. In the state of the entrance or the exit, the surface is formed. 12. If the purpose of cleaning the interior of the chamber is as follows, the purpose of cleaning the interior of the chamber is to open the _ the ': towel, based on the 2 exhaust mechanism. 13. The exhaust to the inside of the work 13. For the vacuum drying device of claim 12, the exhaust port shared by the regenerator and the second exhaust mechanism is disposed in the cavity. Schema: 29
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JP4312787B2 (en) 2009-08-12
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