TWI685911B - Object exchange system, object exchange method, and exposure apparatus - Google Patents

Abstract

The substrate stage (20a) of the present invention ejects pressurized gas from the substrate holder (30a) to suspend the substrate (P1), and the substrate carrying-out device (93) uses the upper surface (substrate loading surface) of the substrate holder (30a) as The guide surface moves the substrate (P1) along the horizontal plane to carry it out of the substrate holder (30a). Secondly, when the substrate (P1) is being carried out, another substrate (P2) that is scheduled to be exposed, stands by above the substrate holder (30a), and is delivered to the substrate stage after the substrate (P1) carrying out operation is completed ( 20a) A plurality of substrate lifting devices (46a).

Description

Object replacement system, object replacement method, and exposure device

The present invention relates to an object replacement system, an object replacement method, an object removal method, an object holding device, an exposure device, a manufacturing method of a flat panel display, and a component manufacturing method. In detail, it relates to the replacement of an object held in an object holding device Object replacement system and method, object removal method for removing objects from the object holding device, object replacement method including the aforementioned object removal method, object holding device for retaining objects, object replacement system including the aforementioned object holding device, including the aforementioned object retention An exposure device of the device or the aforementioned object replacement system, a scanning exposure device, a method of manufacturing a flat panel display using the aforementioned exposure device, and a method of manufacturing a device using the aforementioned exposure device.

Conventionally, in the lithography process of manufacturing electronic components (microdevices) such as liquid crystal display devices, semiconductor devices (integrated circuits), etc., a photomask or reticle (hereinafter collectively referred to as "photomask") and glass are used Step & scan method in which a plate or wafer (hereinafter collectively referred to as "substrate") moves synchronously in a predetermined scanning direction (scanning direction) while transferring the pattern formed on the photomask to the substrate using an energy beam Exposure device (so-called scanning stepper (also called scanner)), etc.

Such an exposure apparatus uses a substrate conveying apparatus to carry in and out a substrate to be exposed to a substrate stage (for example, refer to Patent Document 1).

Here, when the exposure device finishes the exposure process on the substrate held by the substrate stage, that is, the substrate is carried out from the substrate stage, and another substrate is conveyed onto the substrate stage, thereby continuously exposing a plurality of substrates deal with. Therefore, when exposure processing is continuously performed on a plurality of substrates, it is preferable to quickly carry out the substrates from the substrate stage.

Advanced technical literature

[Patent Literature 1] US Patent No. 6,559,928

In view of the above circumstances, the first object replacement system of the first aspect of the present invention is to replace the object loaded on the object holding member of the object holding device, and it includes: a carrying-in device for conveying the object to be carried into Above the object holding member; the unloading device moves the object to be carried out on the object loading surface of the object holding member from the object holding member in the direction along the object loading surface; the object receiving device is provided on the object The holding device receives the object to be carried in from the carrying device; and the guide is provided in the object holding device to specify a guide surface for guiding the object to be carried out carried out by the carrying device.

According to this, when the object to be carried out is carried out from the object holding member, it is guided by the guide provided in the object holding device and carried out along the object loading surface of the object holding member. Therefore, it is not necessary to use, for example, the object holding member. The member for recovering the object is located above the object holding member. Therefore, the object can be carried out quickly. In addition, above the object holding member, it is only necessary to provide a space where the loading device can be located.

The first object replacement method of the second aspect of the present invention is to replace the object loaded on the object holding member of the object holding device, including: the action of transporting the object to be carried onto the object holding member; An object receiving device of the device, which accepts the movement of the object to be carried into the object holding member; and the object to be carried out of the object loading surface of the object holding member is guided to the object holding device The guide surface defined by the guide is moved out of the object holding member from the object holding device in the direction of the object loading surface.

The object unloading method of the third aspect of the present invention is to carry out the object loaded on the object holding member of the object holding device from the object holding member, including: making the object holding device holding the object oriented toward The movement of the object carrying position at which the object is carried out of the object holding member; and the operation of starting the carrying out operation of carrying the object out of the object holding member before the object holding device reaches the object carrying out position.

According to this, since the object carrying-out operation is started before the object holding device reaches the object carrying-out position, the object can be quickly carried out from the object holding member.

The second object replacement method of the fourth aspect of the present invention includes: starting the unloading operation with the object unloading method of the third aspect of the present invention; before the object holding device reaches the object unloading position, the other object is set Standby position standby action; in the state where the object holding device is in the object carrying out position, the object is moved out of the object holding device; and the other object in the standby position is carried into the object holding device action.

The third object replacement method of the fifth aspect of the present invention is to replace the object loaded on the object holding member of the object holding device, including: the action of transporting the object into the object holding member above the object holding member; Object acceptance in the object holding device A device that accepts the movement of the object to be carried into the object holding member; and the object to be carried out of the object loading surface of the object holding member is guided by the guide provided by the object holding device The guide surface is carried out from the object holding member in the direction of the object loading surface using the object carrying-out device included in the object holding device.

An object holding device according to a sixth aspect of the present invention includes: an object holding member having an object loading surface for loading an object to be carried in, which can hold the object loaded on the object loading surface; and an unloading device for holding the object The object held by the member is carried out from the object holding member to the outside.

According to this point of view, since the object holding device is equipped with the unloading device, the unloading operation of the object can be performed at any timing. Therefore, the object can be quickly removed from the object holding device.

A second object replacement system according to the seventh aspect of the present invention includes: an object holding device according to the sixth aspect of the present invention; a carrying device that conveys the object to be carried above the object holding member; an object receiving device provided on the object holding device, It is used to receive the object to be carried in from the carrying-in device; and a guide is provided in the object holding device to specify a guide surface for guiding the object to be carried out carried out by the carrying-out device.

The first exposure device according to the eighth aspect of the present invention includes: an object holding device according to the sixth aspect of the present invention, a first object replacement system according to the first aspect of the invention, and a second object replacement system according to the seventh aspect of the invention One; and a patterning device that uses the energy beam to form a predetermined pattern on the object held by the object holding device.

The second exposure device according to the ninth aspect of the present invention is a scanning type that moves an object relative to the energy beam in the scanning direction during exposure, and includes a first moving body that can be set on a predetermined two-dimensional plane Move inwards in the first direction orthogonal to the scanning direction; the second moving body can move on the first moving body in the second direction parallel to the scanning direction and can move together with the first moving body in the The first direction; the object holding device, which is arranged to hold the object, is arranged above the second moving body, and is integrated with the object by the movement of the second moving body to be induced in the predetermined two-dimensional plane Parallel direction; and the unloading device is provided on the first moving body, and drives the object in a predetermined unloading direction relative to the object holding device.

According to this ninth point of view, since the unloading device for unloading objects is provided on the first moving body moving in the direction orthogonal to the scanning direction, the inertial mass of the second moving body moving in the scanning direction will increase, especially during scanning The position of the object can be controlled with high precision during exposure.

The method for manufacturing a flat panel display according to the tenth aspect of the present invention includes: an operation for exposing the object using the first exposure device according to the eighth aspect of the invention or the second exposure device according to the ninth aspect of the invention; and The action of object development.

The device manufacturing method of the eleventh aspect of the present invention includes: the operation of exposing the object using the first exposure device of the eighth aspect of the invention or the second exposure device of the ninth aspect of the invention; and developing the object after exposure 'S action.

10a, 10c, 100‧‧‧ liquid crystal exposure device

11‧‧‧Ground

12‧‧‧Platform

13‧‧‧Substrate stage

16‧‧‧lens tube platform

17a, 17b‧‧‧positioning device

18.19‧‧‧Transport arm

18a, 19a‧‧‧manipulator

20a~20f, 120a, 120e‧‧‧substrate stage

21‧‧‧Micro stage

21a, 24a, 31a ‧‧‧ hole

22x‧‧‧X moving mirror

23X, 123X‧‧‧X coarse motion stage

23Y, 123Y‧‧‧Y coarse motion stage

24‧‧‧Mirror mount

25‧‧‧Y linear guide device

26‧‧‧Weight elimination device

26a‧‧‧Air bearing

26b‧‧‧Connecting device

26c‧‧‧Z sensor

27‧‧‧Leveling device

29x‧‧‧X voice coil motor

29z‧‧‧Z voice coil motor

30a~30e‧‧‧ substrate holder

31b1‧‧‧X slot

31b2, 31c‧‧‧through hole

32‧‧‧Notch

46a, 46b‧‧‧Substrate jacking device

47‧‧‧Z actuator

48a‧‧‧Top selling

48b‧‧‧Guide

60‧‧‧ Port Department

61‧‧‧Frame

62‧‧‧Substrate guide device

63‧‧‧Dock

64‧‧‧Z actuator

65‧‧‧Guide

66‧‧‧X linear guide

70a, 70d, 70e, 70f, 70g, 170, 270, 570

71, 81‧‧‧X travel guide

73x‧‧‧X slot

77a, 77f ‧‧‧ adsorption device

77a1‧‧‧adsorption pad

77a2‧‧‧Z actuator

77d‧‧‧Adsorption device

78‧‧‧Y linear guide device

80a, 80c‧‧‧ substrate carrying device

82、173b‧‧‧X slide

83‧‧‧ Loading arm

831‧‧‧Base

832‧‧‧Support

833‧‧‧Installation components

84、98‧‧‧adsorption pad

90‧‧‧ Port Department

91‧‧‧Frame

92‧‧‧Guide

93‧‧‧Substrate carrying out device

94, 96‧‧‧Z actuator

95‧‧‧X Travel Guide

97‧‧‧X slide

114‧‧‧Base

115‧‧‧Auxiliary base

116a‧‧‧Y linear guide

116b‧‧‧Y slide

117‧‧‧Y feed screw device

117a‧‧‧screw shaft

117b‧‧‧Nut

125、425‧‧‧X beam

126‧‧‧Y bracket

126a‧‧‧Auxiliary bracket

127‧‧‧X linear guidance device

127a、173a‧‧‧X linear guide

128‧‧‧X linear motor

128a‧‧‧Magnet unit

128b‧‧‧coil unit

129‧‧‧X bracket

130‧‧‧Body

131‧‧‧tube platform

132‧‧‧Side column

133‧‧‧Substrate stage

134‧‧‧Anti-vibration device

141‧‧‧Base member

142‧‧‧Porous member

143‧‧‧Z actuator

144‧‧‧foot

145‧‧‧ pole

146‧‧‧Z linear guide

150‧‧‧Y stepping platform

151‧‧‧Bending device

171, 271, 371

172‧‧‧Supporting member

173‧‧‧X linear guidance device

174‧‧‧X linear motor

174a‧‧‧Magnet unit

174b‧‧‧coil unit

176a‧‧‧Moving part

176b‧‧‧Fixed Department

180‧‧‧Substrate sliding device

181‧‧‧Base

182‧‧‧Y linear guide

183‧‧‧Y slide

184‧‧‧Push pin

200‧‧‧Substrate stage device

CP‧‧‧Position

IL‧‧‧Light

IOP‧‧‧Department of Lighting

M‧‧‧mask

MST‧‧‧mask stage

P‧‧‧Substrate

PL‧‧‧Projection optics

PSTa, PSTc ‧‧‧ substrate stage device

S‧‧‧Irradiated area

FIG. 1 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus of the first embodiment.

2 is a plan view of a substrate stage (substrate holder), a substrate carrying-in device, and a substrate carrying-out device included in the liquid crystal exposure device of FIG. 1.

3 is a cross-sectional view taken along line A-A of the substrate stage of FIG. 2.

4(A) and 4(B) are diagrams for explaining the substrate replacement operation of the first embodiment (Part 1 and Its 2).

5(A) and 5(B) are diagrams (No. 3 and No. 4) for explaining the substrate replacement operation in the first embodiment.

6(A) and 6(B) are diagrams (No. 5 and No. 6) for explaining the operation of replacing the substrate in the first embodiment.

7(A) and 7(B) are diagrams for explaining the substrate replacement operation of the first embodiment (Part 7 and Part 8).

8(A) and 8(B) are diagrams (No. 9 and No. 10) for explaining the substrate replacement operation in the first embodiment.

9 is a plan view of a substrate stage (substrate holder), a substrate carrying-in device, and a substrate carrying-out device according to the second embodiment.

Fig. 10 is a sectional view taken along line B-B of Fig. 9.

11 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to a third embodiment.

12 is a plan view of a substrate stage (substrate holder), a substrate carrying device, and a port portion included in the liquid crystal exposure device of FIG. 11.

13 is a line cross-sectional view of the substrate stage of FIG. 12 (a cross-sectional view taken along line C-C of FIG. 12).

14(A) and 14(B) are diagrams (No. 1 and No. 2) for explaining the operation of substrate replacement in the third embodiment.

15(A) and 15(B) are diagrams (No. 3 and No. 4) for explaining the substrate replacement operation in the third embodiment.

16(A) and 16(B) are diagrams (No. 5 and No. 6) for explaining the substrate replacement operation of the third embodiment.

FIGS. 17(A) and 17(B) are diagrams for explaining the substrate replacement operation of the third embodiment (Part 7 and Part 8).

18(A) and 18(B) are diagrams (No. 9 and No. 10) for explaining the substrate replacement operation in the third embodiment.

19 is a diagram for explaining the relationship between the substrate stage and the port portion when the substrate of the third embodiment is carried out.

20(A) to 20(C) are diagrams for explaining the operation of the substrate when the substrate of the third embodiment is carried out (Part 1 to Part 3).

21 is a plan view of a substrate stage (substrate holder), substrate carrying device, and port portion according to the fourth embodiment.

22 is a cross-sectional view of the substrate stage (substrate holder), substrate carrying device, and port portion of FIG. 21.

FIG. 23 is a plan view of a substrate stage (substrate holder), substrate carrying-in device, and port portion according to the fifth embodiment.

24 is a cross-sectional view of a substrate stage of a sixth embodiment.

25(A) to 25(C) are diagrams (No. 1 to No. 3) for explaining the substrate replacement operation of the sixth embodiment.

FIGS. 26(A) to 26(C) are diagrams for explaining the substrate replacement operation of the first modification (Part 1 to Part 3).

FIGS. 27(A) to 27(C) are diagrams for explaining the substrate replacement operation of the first modification (Part 4 to Part 6).

FIG. 28 is a diagram of a substrate stage device (substrate holder and substrate carrying-out device) of a second modification Top view.

FIGS. 29(A) and 29(B) are diagrams (No. 1 and No. 2) for explaining the operation of replacing the substrate in the third modification.

FIGS. 30(A) and 30(B) are diagrams (No. 3 and No. 4) for explaining the substrate replacement operation of the third modification.

FIG. 31 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus of a seventh embodiment.

32 is a plan view of a substrate stage device included in the liquid crystal exposure device of FIG. 31.

33 is a side view of the substrate stage device of FIG. 32 viewed from the +Y side.

34 is a sectional view taken along the line E-E of the substrate stage device of FIG. 33.

35 is a plan view of a substrate stage (substrate holder), a substrate carrying-in device, and a port portion included in the liquid crystal exposure device of the seventh embodiment.

36(A) and 36(B) are diagrams (No. 1 and No. 2) for explaining the operation of substrate replacement in the seventh embodiment.

37(A) and 37(B) are diagrams (No. 3 and No. 4) for explaining the operation of substrate replacement in the seventh embodiment.

FIG. 38(A) and FIG. 38(B) are diagrams (No. 5 and No. 6) for explaining the substrate replacement operation of the seventh embodiment.

FIGS. 39(A) and 39(B) are diagrams for explaining the substrate replacement operation of the seventh embodiment (Parts 7 and 8).

FIGS. 40(A) and 40(B) are diagrams (No. 9 and No. 10) for explaining the substrate replacement operation of the seventh embodiment.

FIG. 41(A) and FIG. 41(B) are diagrams for explaining the substrate replacement operation of the seventh embodiment (Part 11 And 12).

42 is a plan view of the substrate stage of the eighth embodiment, showing the state before the substrate carrying out operation.

43 is a cross-sectional view of the substrate stage of FIG. 42.

Fig. 44 is a plan view of a substrate stage of an eighth embodiment, showing a state when the substrate is carried out.

45 is a cross-sectional view of the substrate stage of FIG. 44.

46 is a diagram showing a substrate stage of a fourth modification.

47 is a plan view of a substrate holder included in a substrate stage device of a fifth modification.

48(A) is a cross-sectional view taken along the line FF of FIG. 47, FIG. 48(B) is a cross-sectional view taken along the line GG of FIG. 48(A), and FIG. 48(C) is used to explain the operation of the substrate lifting device according to the fifth modification Figure.

49(A) and 49(B) are diagrams showing the internal structure of the substrate jacking device of FIG. 48(A) (Part 1 and 2).

50(A) to 50(D) are diagrams for explaining the substrate loading and unloading operations of the substrate stage of the fifth modification (Part 1 to Part 4).

FIGS. 51(A) and 51(B) are diagrams showing a substrate jacking device according to a sixth modification (Part 1 and 2).

Fig. 52 is a diagram showing a substrate stage device of a seventh modification.

FIG. 53 is a diagram showing a substrate stage device of an eighth modification.

"First Embodiment"

The first embodiment will be described below using FIGS. 1 to 8(B).

FIG. 1 schematically shows the configuration of the liquid crystal exposure apparatus 10a of the first embodiment to make. The liquid crystal exposure apparatus 10a is a projection exposure apparatus using a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a liquid crystal display device (flat panel display) or the like as an object to be exposed.

The liquid crystal exposure device 10a includes: an illumination system IOP, a mask stage MST holding a mask M, a projection optical system PL, and a surface (the surface toward the +Z side in FIG. 1) coated with a photoresist (sensitizer) ), the substrate stage device PSTa of the substrate P, the substrate carrying-in device 80a, the port portion 90 for accepting substrates with external devices, and such control systems. Hereinafter, the directions in which the photomask M and the substrate P are scanned with respect to the projection optical system PL during exposure are X-axis directions, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis and Y-axis This is the Z-axis direction, and the directions of rotation around the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. In addition, the position in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The lighting system IOP has the same structure as the lighting system disclosed in, for example, US Patent No. 6,552,775. That is, the illumination system IOP allows light emitted from a light source (such as a mercury lamp) not shown to pass through reflectors, dichroic mirrors, blinds, filters, various lenses, etc., which are not shown, as illumination light for exposure (illumination Light) IL illuminates the photomask M. For the illumination light IL, for example, light of i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), etc. (or combined light of the above-mentioned i-line, g-line, and h-line) is used.

On the mask stage MST, for example, a mask M in which a circuit pattern or the like is formed on the pattern surface is sucked and held by a vacuum suction method. The reticle stage MST is mounted on the lens barrel platform 16 of a part of the device body (machine body), and is driven in the scanning direction (X by a predetermined long stroke with a reticle stage drive system (not shown) including a linear motor, for example) Axis direction), and is slightly driven in the Y axis direction and θ z direction as appropriate. The position information of the photomask stage MST in the XY plane (including the rotation data of θ z direction) Information) is measured with a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is arranged below the mask stage MST and supported by the lens barrel platform 16. The projection optical system PL has the same configuration as the projection optical system disclosed in, for example, US Patent No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems in which the pattern image projection area of the mask M is arranged in a zigzag shape, and can be used as a projection optical system having a rectangular single image field whose longitudinal direction is the Y-axis direction The same function (the so-called multi-lens projection optical system). In this embodiment, for example, a plurality of projection optical systems each use an equal-magnification system with telecentricity on both sides and form an erect image.

Therefore, when the illumination area on the mask M is illuminated with the illumination light IL from the illumination system IOP, that is, by the illumination light IL passing through the mask M, the circuit of the mask M in the illumination area is transmitted through the projection optical system PL The projected image of the pattern (partially upright image) is formed on the substrate P to irradiate the area (exposure area) of the illumination light IL conjugated to the illumination area. Then, by the synchronous driving of the mask stage MST and the substrate stage device PSTa, the mask M is moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is moved with respect to the exposure area (illumination light IL) In the scanning direction, one exposure area of the substrate P is scanned and exposed, and the pattern formed on the photomask M is transferred to the exposure area. That is, in this embodiment, the pattern of the photomask M is formed on the substrate P by the illumination system IOP and the projection optics PL, and the exposure of the sensing layer (photoresist layer) on the substrate P by the illumination light IL is exposed to the substrate P The pattern is formed.

The substrate stage device PSTa includes a stage 12 and a substrate stage 20a arranged above the stage 12.

The platform 12 is composed of a rectangular plate-shaped member in plan view (viewed from the +Z side), and its upper surface is processed into a very high flatness. The platform 12 is mounted on a substrate of a part of the device body On the gantry table 13. Device including substrate stage 13 The system is mounted on a vibration-proof device 14 installed on the floor 11 of a clean room. According to this, the above-mentioned mask stage MST, projection optical system PL, etc. vibrate relative to the floor 11 Separate.

The substrate stage 20a includes: an X coarse motion stage 23X, a Y coarse motion stage mounted on the X coarse motion stage 23X, and the X coarse motion stage 23X to constitute a so-called gantry type XY biaxial stage device 23Y, the fine movement stage 21 disposed on the +Z side (upper side) of the Y coarse movement stage 23Y, the substrate holder 30a holding the substrate P, the weight eliminating device 26 that supports the fine movement stage 21 from below on the platform 12, and A plurality of substrate jacking devices 46a (not shown in FIG. 1. Refer to FIG. 3) and the like for separating the substrate P from the substrate holder 30 a.

The X coarse motion stage 23X is composed of a rectangular member with the Y-axis direction as the longitudinal direction in a plan view, and a long hole-shaped opening (not shown) with the Y-axis direction as the longitudinal direction is formed in the center portion. The X coarse motion stage 23X is mounted on a guide (not shown) that is installed on the ground 11 separately from the device body and extends in the X-axis direction. For example, it includes a linear motor during the scanning operation during exposure and the substrate replacement operation. The X stage drive is driven in the X axis direction with a predetermined stroke.

The Y coarse motion stage 23Y is composed of a rectangular member in plan view, and an opening (not shown) is formed in the central portion thereof. The Y coarse motion stage 23Y is mounted on the X coarse motion stage 23X through the Y linear guide 25. For example, during the Y stepping operation during exposure, the Y stage drive system including a linear motor and the like is used in the X coarse motion. The stage 23X is driven in the Y-axis direction with a predetermined stroke. Moreover, the Y coarse motion stage 23Y moves integrally with the X coarse motion stage 23X in the X-axis direction by the action of the Y linear guide 25.

The fine movement stage 21 is composed of a low-height rectangular parallelepiped member viewed from above in a substantially square shape. The micro-movement stage 21 is composed of a stator and a micro-movement stage 23Y The micro-motion stage drive system of a plurality of voice coil motors (or linear motors) composed of the movable elements of the dynamic stage 21 is slightly driven in the direction of 6 degrees of freedom (X axis, Y axis, Z axis) relative to the Y coarse motion stage 23Y , Θ x, θ y, θ z directions). The plurality of voice coil motors includes a plurality of micro-movement stages 21 that are micro-driven in the X-axis direction (which overlap in the depth direction of the drawing in FIG. 1) X voice coil motor 29x, and micro-drive stages 21 that are micro-driven on the Y axis A plurality of Y voice coil motors (not shown) in the direction, and a plurality of Z voice coils that micro-drive the micro-movement stage 21 in the Z-axis direction (e.g., positions corresponding to the four corners of the micro-motion stage 21) Motor 29z.

Furthermore, the fine movement stage 21 is induced by the Y coarse movement stage 23Y through the plurality of voice coil motors, and moves in the X-axis direction and/or the Y-axis direction along the XY plane with a predetermined stroke along the Y coarse movement stage 23Y. . The position information in the XY plane of the micro-movement stage 21 is obtained by a substrate interferometer system, which includes a movable mirror (including a mirror that is orthogonal to the X axis) fixed to the micro-movement stage 21 through a mirror base 24 The X moving mirror 22x of the reflecting surface, and the Y moving mirror (not shown) having a reflecting surface orthogonal to the Y axis) illuminate a ranging beam of an unillustrated interferometer (including the use of the X moving mirror 22x to measure the micro-motion load (X interferometer at the X position of the stage 21 and Y interferometer for measuring the Y position of the micro-movement stage 21 using a Y moving mirror). Regarding the configuration of the micro-motion stage drive system and the substrate interferometer system, for example, it has been disclosed in US Patent Application Publication No. 2010/0018950.

Furthermore, as shown in FIG. 3, on the micro-motion stage 21, openings (on the Z axis) are formed on the upper surface (+Z surface) and the lower surface (-Z surface) at positions corresponding to the plurality of substrate lifting devices 46a described later. Direction through) a plurality of holes 21a. In addition, a hole 24 a corresponding to the substrate lifting device 46 a is also formed in the mirror holder 24.

The substrate holder 30a has a rectangular shape with a low height in the plan view with the X-axis direction as the longitudinal direction A rectangular parallelepiped-shaped member is formed and fixed on the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a can be selectively connected to a vacuum device and a compressor (both not shown) provided outside the substrate stage 20a, and the substrate P can be sucked and held by the vacuum device (not shown in FIG. 3). Fig. 1), and by ejecting the pressurized gas supplied from the compressor, the substrate P is suspended with a minute gap. The suction and ejection of the gas can be performed using a common hole, or a dedicated hole can be used separately.

In addition, in the substrate holder 30a, a plurality of openings (penetrating in the Z-axis direction) on the upper surface (+Z plane) and the lower surface (-Z plane) are formed at positions corresponding to the plurality of substrate jacking devices 46a described later. Hole part 31a. Further, as can be seen from FIGS. 2 and 3, the +X side end portion of the upper surface of the substrate holder 30a and the central portion in the Y-axis direction are formed with notches 32 opening on the +Z side and +X side.

As shown in FIG. 3, the weight elimination device 26 is composed of a pillar-shaped member (also called a spine) extending in the Z-axis direction, and supports the central portion of the micro-motion stage 21 from below through a device called a leveling device 27 . The weight eliminating device 26 is inserted into the opening of each of the X coarse motion stage 23X (not shown in FIG. 3. Refer to FIG. 1) and the Y coarse motion stage 23Y. The weight eliminating device 26 is suspended on the platform 12 through a small gap through a plurality of air bearings 26a installed on the lower surface thereof. The weight eliminating device 26 is connected to the Y coarse motion stage 23Y through a plurality of coupling devices 26b at the center of gravity height position in the Z axis direction, and is pulled on the platform together with the Y coarse motion stage 23Y by being pulled by the Y coarse motion stage 23Y 12 Move in the Y axis direction and/or X axis direction.

The weight eliminating device 26 has, for example, an air spring (not shown), and the vertical upward force generated by the air spring eliminates (cancels) the weight including the micro-motion stage 21, the leveling device 27, the substrate holder 30a, etc. Vertical downward force), thereby reducing the drive system of the micro-motion stage The load of multiple voice coil motors. The leveling device 27 supports the fine movement stage 21 from below so as to be able to swing relative to the XY plane (tilting operation). The leveling device 27 supports the weight eliminating device 26 in a non-contact manner from below through an air bearing (not shown). The inclination information of the fine movement stage 21 with respect to the XY plane is obtained by a plurality of Z sensors 26c installed under the fine movement stage 21 using the target 26d installed in the weight eliminating device 26. Including the leveling device 27, the connecting device 26b, etc., the detailed structure and operation of the weight eliminating device 26 have been disclosed in, for example, US Patent Publication No. 2010/0018950.

A plurality of substrate jacking devices 46a, each having a Z actuator 47 fixed on the upper surface of the Y coarse motion stage 23Y, and the Z actuator 47 from the upper surface of the substrate holder 30a (substrate loading surface) to the +Z side A lift pin 48a is driven in the Z-axis (up and down) direction between the protruding position and the position retracted toward the -Z side from the upper surface of the substrate holder 30a. The substrate jacking device 46a includes an ejector pin 48a, and the end near the +Z side is inserted into a hole 21a (or a hole 24a formed in the mirror holder 24) formed in the fine movement stage 21 and a substrate holder In the hole 31a of 30a. Between the substrate jacking device 46a and the wall surfaces of the predetermined holes 21a, 24a, and 31a, a gap is set so that the fine movement stage 21 does not contact each other when it is slightly driven on the Y coarse movement stage 23Y.

A plurality of substrate jacking devices 46a, as shown in FIG. 2 (however, only the ejector pin 48a is shown in FIG. 2, and the Z actuator 47 (see FIG. 3) is not shown), are separated from each other at a predetermined interval to The lower surface of the support substrate P can be supported substantially uniformly. In the first embodiment, a substrate jacking device row composed of a plurality (for example, four) of substrate jacking devices 46a arranged at a predetermined interval in the Y-axis direction, and a plurality of rows (for example, 6) arranged at a predetermined interval in the X-axis direction Column). In the first embodiment, for example, a total of 24 substrate lifting devices 46a are used to separate (push up) the substrate P from the substrate holder 30a, but the number and arrangement of the substrate lifting devices 46a are not limited to this. For example, the size of the visual substrate P Change it as appropriate. In addition, the type of the Z actuator 47 is not particularly limited, and for example, a cylinder device, a feed screw device, a cam device, etc. can be used.

Returning to FIG. 1, the substrate carrying-in device 80a is disposed above the port portion 90 (+Z side) described later. As shown in FIG. 2, the substrate carrying device 80 a includes a pair of X travel guides 81, a pair of X sliders 82 corresponding to the pair of X travel guides 81, and a loading arm disposed between the pair of X slides 82 83.

The pair of X travel guides 81 are each composed of members extending in the X-axis direction, and the longitudinal dimension thereof is set to be slightly longer than the dimension of the substrate P in the X-axis direction. The pair of X travel guides 81 are arranged parallel to each other at a predetermined interval (a slightly wider interval than the Y axis direction dimension of the substrate P) in the Y axis direction. Each of the pair of X sliders 82 is capable of sliding in the X-axis direction to be engaged with the corresponding X travel guide 81, and is driven by an unillustrated actuator (eg, feed screw device, linear motor, belt drive) (Device, etc.) The X-travel guide 81 is driven synchronously with a predetermined stroke.

The loading arm 83 has a base portion 831 of a plate-shaped portion parallel to the XY plane extending in the Y-axis direction, and a plurality of (for example, four) support portions 832 of the plate-shaped portion parallel to the XY plane extending in the X-axis direction. The dimension of the base portion 831 in the longitudinal direction (Y-axis direction) is set to be slightly shorter than the dimension of the substrate P in the Y-axis direction. The plurality of support portions 832 are arranged parallel to each other at a predetermined interval in the Y-axis direction, and the respective +X side end portions are connected to the -X side end portion of the base portion 831 as a whole. The base portion 831 and the plurality of support portions 832 are integrally formed by, for example, CFRP (Carbon Fiber Reinforced Plastics) or the like. The length of the plurality of support portions 832 in the longitudinal direction (X-axis direction) is set to be slightly shorter than the dimension of the substrate P in the X-axis direction. The substrate P is supported from below by the -X side region of the base 831 and the plurality of support portions 832. As shown in FIG. 1, the Z position of the loading arm 83 is set on the -Z side of the X travel guide 81.

Returning to FIG. 2, a plurality of (for example, three) suction pads 84 arranged at predetermined intervals in the X-axis direction are mounted on each of the plurality of support portions 832. A vacuum device (not shown) is connected to the loading arm 83, and the plurality of suction pads 84 can be used to suck and hold the substrate P. The loading arm 83 has its +Y side and -Y side ends of the base 831 connected to the X slides 82 on the +Y side and -Y side through the mounting member 833, and is synchronously driven to X by a pair of X slides 82 It can move the substrate P parallel to the XY plane in the X axis direction with a predetermined stroke between the upper area of the port 90 shown in FIG. 1 and the upper area near the +X side end of the platform 12 . In addition, in the substrate carrying-in device 80a, the loading arm 83 can be configured to move up and down relative to the pair of X travel guides 81 (or the pair of X travel guides 81 integrated).

Returning to FIG. 1, the port portion 90 includes a gantry 91, a plurality of guides 92, and a substrate carrying-out device 93. The gantry 91 is installed on the floor 11 at the +X side position of the platform 12, and is accommodated in a chamber (not shown) together with the substrate stage device PSTa.

The plurality of guides 92 are each formed of a plate-shaped member parallel to the XY plane, and support the substrate P from below. A plurality of guides 92 are synchronously driven in the Z axis (up and down) direction by Z actuators 94 fixed on the gantry 91, respectively. A plurality of micro holes (not shown) are formed on the upper surface of the guide 92, and pressurized gas (for example, air) can be ejected from the holes to suspend and support the substrate P with a small gap. In addition, the guide 92 may use the plurality of holes (or other holes) to suction-hold the substrate P.

The plurality of guides 92, as shown in FIG. 2, are the lower surfaces of the support substrate P that are arranged at a predetermined interval and spaced apart from each other. In the first embodiment, since the guide row constituted by a plurality of (for example, three) guides 92 arranged at a predetermined interval in the X-axis direction, a plurality of rows (for example, four rows) are arranged at a predetermined interval in the Y-axis direction. As described above, the port portion 90 of the first embodiment supports the substrate P from below using a total of twelve guides 92, for example.

Here, the plurality of guides 92 are arranged in the Y-axis direction in a state where the loading arm 83 of the substrate loading device 80a is positioned above the port portion 90 (a state where the loading arm 83 is positioned at the +X side stroke end point) The position does not overlap with the plural support portions 832 of the loading arm 83. In this way, when the loading arm 83 is positioned above the port portion 90, when the plurality of guides 92 are synchronously driven in the +Z direction, the plurality of guides 92 do not contact the loading arm 83 but can pass each other Between adjacent support parts 832. In addition, the interval of the plurality of substrate lifting devices 46a in the Y-axis direction of the substrate stage 20a is substantially the same as the interval of the plurality of guides 92 in the Y-axis direction, and the loading arm 83 is located above the substrate holder 30a In this state, when the plurality of ejecting pins 48a are driven in the +Z direction, the plurality of ejecting pins 48a can pass between the support portions 832 adjacent to each other without contacting the loading arm 83.

Returning to FIG. 1, the substrate carrying-out device 93 includes an X travel guide 95, a plurality of Z actuators 96 for moving the X travel guide 95 up and down, and a predetermined stroke in the X axis direction on the X travel guide 95 The moving X slider 97 and the suction pad 98 mounted on the X slider 97 are installed.

The X travel guide 95 is composed of a member extending in the X-axis direction, and as shown in FIG. 2, it is arranged between the second and third columns in the guide row of the plurality of columns (for example, 4 columns). Returning to FIG. 1, for example, two Z actuators 96 are provided separately in the X-axis direction. The X slider 97 is engaged with the X travel guide 95 so as to be slidable in the X axis direction, and is guided along the X travel by an unillustrated actuator (eg, feed screw device, linear motor, belt drive device, etc.) The member 95 is driven with a predetermined stroke (stroke of the same extent as the dimension of the substrate P in the X-axis direction). The suction pad 98 is composed of a plate-like member parallel to the XY plane, and a vacuum suction hole is formed on the upper surface (the surface facing the +Z side). In the substrate carrying-out device 93, the X travel guide 95 can be driven by a plurality of Z actuators 96 to move the X slider 97 and the suction pad 98 in the Z axis direction (up and down).

The liquid crystal exposure apparatus 10a (refer to FIG. 1) constructed in the above manner is under the management of a master control device (not shown), and a mask loader (not shown) performs a mask M to a mask stage MST. The substrate P is loaded onto the substrate holder 30a by the substrate carrying device 80a. After that, the main control device performs alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, a step & scan method is sequentially performed on the plurality of irradiation areas set on the substrate P Exposure action. Since this exposure operation is the same as the exposure operation of the conventional step scan method, its detailed description is omitted. Then, the substrate after the exposure process is carried out from the substrate holder 30a, and the substrate on the substrate holder 30a is replaced by transferring the next exposed substrate to the substrate holder 30a. The wafer substrate continuously performs the exposure operation and the like.

Next, for the replacement operation of the substrate P on the substrate holder 30a of the liquid crystal exposure device 10a (for convenience, a plurality of substrates P are referred to as substrate P0, substrate P1, substrate P2, and substrate P3), use FIG. 4( A) ~ Figure 4 (B) to illustrate. The following substrate replacement operations are performed under the management of a master control device (not shown).

In FIG. 4(A), the substrate P1 is held by the substrate holder 30a of the substrate stage 20a. In addition, the loading arm 83 of the substrate carrying device 80a holds the substrate P2 (the next substrate P2) to be carried into the substrate holder 30a next after the substrate P1 is carried out from the substrate holder 30a. In addition, the substrate transporting arm 19 provided outside the liquid crystal exposure device 10 a (see FIG. 1) holds the substrate P0 that has been exposed. Here, the shape of the transfer arm 19 of the substrate transfer robot and the transfer arm 18 of the substrate transfer robot, which will be described later, are substantially the same as the loading arm 83 of the substrate transfer device 80a described above, but move relative to the loading arm 83 along the X travel guide 81 In the X-axis direction, the transport arm 19 and the transport arm 18 are supported by the robot arms 19a, 18a (cantilever support) Bearing), the robot arms 19a, 18a are appropriately controlled to move in the X-axis direction.

The main control device moves the substrate stage 20a from below the projection optical system PL (refer to FIG. 1) to the stage 12 after the exposure process of the last irradiation area among the plurality of irradiation areas set on the substrate P1 is completed +The position near the end on the X side and adjacent to the port portion 90 (hereinafter referred to as the substrate replacement position). At the substrate replacement position, as shown in FIG. 2, the substrate stage 20 a is positioned so that the Y position of the notch 32 and the Y position of the substrate carrying-out device 93 substantially coincide with each other. In addition, the substrate replacement position may be the substrate carrying position (object carrying out) where the substrate P held by the substrate holder 30a (substrate stage 20a) is carried out from the substrate holder 30a (substrate stage 20a) as described later. position).

In addition, in parallel with the movement of the substrate stage 20a to the substrate replacement position, in the substrate loading device 80a, as shown in FIG. 4(B), the loading arm 83 is driven in the -X direction, thereby positioning the substrate P2 at the substrate replacement position Above. In addition, in the substrate carrying-out device 93, the X slider 97 is driven in the -X direction on the X travel guide 95, and is inserted into the notch 32 of the substrate holder 30a of the suction pad 98 at the substrate replacement position.

Then, as shown in FIG. 5(A), in the substrate carrying-out device 93, the X travel guide 95 and the X slider 97 are driven in the +Z direction by a plurality of Z actuators 96 (the substrate holder 30a is driven in -Z direction is also acceptable) until the upper surface of the suction pad 98 contacts the lower surface of the substrate P1. The suction pad 98 suction-holds the vicinity of the +X side end of the lower surface of the substrate P1. In addition, on the substrate stage 20a, the substrate holder 30a is released from the adsorption and holding of the substrate P1, and pressurized gas is ejected from the upper surface of the substrate holder 30a facing the substrate P1. In addition, the plurality of guides 92 are controlled to the Z position in such a manner that the Z position on the upper surface thereof is substantially the same as the Z position on the upper surface of the substrate holder 30a.

Next, as shown in FIG. 5(B), on the substrate carrying-out device 93, the X slider 97 is attached to the X The travel guide 95 is driven in the +X direction. According to this, the substrate P1 sucked and held by the suction pad 98 moves in the +X direction along the plane parallel to the XY plane (guide surface) formed by the upper surface of the substrate holder 30a and the upper surfaces of the plurality of guides 92, from the substrate The holder 30a is carried out onto the plurality of guides 92. At this time, pressurized gas is also ejected from the upper surfaces of the plurality of guides 92 to the lower surface of the substrate P1. According to this, the substrate P1 can be moved at high speed with low dust generation.

When the carrying out of the substrate P1 is completed, as shown in FIG. 6(A), on the substrate stage 20a, the Z actuator 47 is synchronously controlled to move the ejector pins 48a of the plurality of substrate lifting devices 46a in the +Z direction A plurality of ejector pins 48a respectively pass between the support portions 832 of the loading arm 83 and press the lower surface of the substrate P2 from below. In addition, at the loading arm 83, the suction holding of the plurality of suction pads 84 to the substrate P2 is released. In this way, the substrate P2 is separated from the loading arm 83.

After the substrate P2 is separated from the loading arm 83, as shown in FIG. 6(B), in the substrate loading device 80a, the loading arm 83 is driven in the +X direction and is withdrawn from above the substrate replacement position. In addition, in the substrate carrying-out device 93, the X travel guide 95 and the X slider 97 are driven in the -Z direction by a plurality of Z actuators 96. Accordingly, a large space is formed between the substrate carrying-in device 80a and the substrate carrying-out device 93. In addition, the plurality of guides 92 are also slightly driven on the -Z side, and the substrate P1 moves slightly in the -Z direction. In addition, the substrate P0 loaded on the transfer arm 19 of the substrate transfer robot is transferred to an external device (for example, a coating and developing device), and the transfer arm 18 of the substrate transfer robot is transferred from the external device to the substrate P2 under a predetermined transfer The substrate P3 of the substrate holder 30a.

Then, as shown in FIG. 7(A), on the substrate stage 20a, the Z actuator 47 is synchronously controlled to move the ejector pins 48a of each of the plurality of substrate lifting devices 46a in the -Z direction, and accordingly, the substrate P2 Mounted on the upper surface of the substrate holder 30a. At this time, the Z position of the ejector pin 48a is controlled so that the ejector pin 48a is separated from the lower surface of the substrate P2. The substrate P2 is sucked and held by the substrate holder 30a. In addition, the transfer arm 18 of the substrate transfer robot supporting the substrate P3 is driven in the -X direction, and a pair of X travel guides 81 (only one is shown in FIG. 7(A) is shown in FIG. 7(A). Refer to FIG. 2). between. In this way, the transfer arm 18 of the substrate transfer robot and the loading arm 83 of the substrate transfer device 80a are arranged to overlap in the vertical direction. In addition, the transfer arm 19 of the substrate transfer robot is driven in the -X direction, and is inserted into the space between the loading arm 83 and the substrate transfer device 93. As described above, since the transfer arm 19 and the loading arm 83 have substantially the same shape, they do not come into contact with the guide 92. Accordingly, the transfer arm 19 of the substrate transfer robot and the loading arm 83 of the substrate transfer device 80 are arranged to overlap in the vertical direction.

After that, by driving the plurality of guides 92 in the -Z direction, the substrate P1 is delivered to the transfer arm 19 of the substrate transfer robot. As shown in FIG. 7(B), the transport arm 19 supporting the substrate P1 is driven in the +X direction, and transports the substrate P1 to an external device. Moreover, instead of driving the plurality of guides 92 in the -Z direction to deliver the substrate P1 to the transfer arm 19 of the substrate carrying-out machine, the substrate carrying robot may also be driven in the +Z direction to carry the substrate P1 by the carrying arm 19 . In addition, the plurality of guides 92 and the substrate carrying robot may be driven in the Z direction to deliver the substrate P1.

After the substrate P1 is delivered to the transfer arm 19, the plurality of guides 92 are synchronously driven in the +Z direction as shown in FIG. 8(A), respectively. Each of the plurality of guides 92 has its upper surface contacting the lower surface of the substrate P3 without touching the loading arm 83 and the transport arm 18, and lifts the substrate P3 away from the transport arm 18.

Thereafter, as shown in FIG. 8(B), the transfer arm 18 of the substrate transfer robot is driven in the +X direction and exits from the area above the substrate transfer device 93. Next, the plurality of guides 92 that support the substrate P3 from below are driven by the Z actuator 96 in the -Z direction, respectively. At this time, compared to the plural The guides 92 respectively pass between the support portions 832 of the loading arm 83 adjacent to each other, and the substrate P3 is supported under the support portion 832 of the loading arm 83 (delivered here). This returns to the state shown in FIG. 4(A) (however, the substrate P0 is replaced with the substrate P1, the substrate P1 is replaced with the substrate P2, and the substrate P2 is replaced with the substrate P3). In addition, in FIGS. 7(B) to 8(B), although the substrate stage 20a holding the substrate P2 is shown, the substrate P2 (see FIG. 7(A)) may be sucked and held, and then the substrate may be replaced immediately. Position, start alignment measurement, exposure processing.

As described above, according to the first embodiment, since the substrate P (the substrate P1 in FIGS. 4(A) to 8(B)) is carried out, the upper surface of the substrate holder 30a is used as a guide surface, so it can be quickly The substrate carrying-out operation on the substrate holder 30a is performed. In addition, when the substrate P is separated from the substrate holder 30a in order to carry out the substrate, the movement amount (rise amount) of the substrate P may be slight. Therefore, in a state where the substrate stage 20a is positioned at the substrate replacement position, as long as there is a space into which the loading arm 83 can be inserted above the substrate holder 30a of the substrate stage 20a. As described above, in the substrate replacement system of the first embodiment (including the substrate carrying device 80a and the substrate carrying device 93 using the upper surface of the substrate holder 30a as a part of the guide surface), the substrate holder 30a and the lens barrel When the space between the platforms 16 (refer to FIG. 1) is narrow, it can also be used very suitably.

"Second Embodiment"

Next, the second embodiment will be described using FIGS. 9 and 10. The liquid crystal exposure apparatus of the second embodiment is the same as the liquid crystal exposure apparatus 10a (refer to FIG. 1) of the first embodiment except for the structure of the substrate holder 30b and the substrate lifter 46b. Note that the elements having the same configuration and function as those in the above-mentioned first embodiment are given the same symbols as in the above-mentioned first embodiment, and their descriptions are omitted.

In the first embodiment described above, the substrate P is supported by the substrate holder when the substrate is carried out The upper surface of 30a is the guide surface to move (refer to FIG. 5(A) and FIG. 5(B)). In contrast, in the second embodiment, as shown in FIG. 10, the difference is that it is installed in a plurality of The guide 48b of each Z actuator 47 of the substrate jacking device 46b moves as a guide surface.

As shown in FIG. 9, on the upper surface of the substrate holder 30b, a plurality of X grooves 31b1 extending in the X axis are formed at predetermined intervals (for example, 4) in the Y axis direction. Also, on the bottom surface of the predetermined X groove 31b1, as shown in FIG. 10, a through hole 31b2 penetrating the substrate holder 30b in the vertical direction is formed at a predetermined interval (for example, three) in the X axis direction, and Z is inserted into the through hole 31b2 Part of the actuator 47.

The guide 48b accommodates a plurality (for example, three) at predetermined intervals in the X-axis direction in one groove 31b1. The guide 48b is composed of a plate-like member parallel to the XY plane, and the position on the upper surface of the substrate holder 30b (substrate mounting surface) protruding toward the +Z side by the Z actuator 47 and the substrate holder The upper surface of 30b is driven in the Z-axis (up and down) direction between the positions retracted toward the -Z side. A plurality of micro-holes (not shown) are formed on the upper surface of the guide 48b, and pressurized gas (for example, air) can be ejected from the holes to suspend and support the substrate P (substrate P1 in FIG. 10) through the minute gap. In addition, the guide 48b may also suck and hold the substrate P using the plurality of holes (or other holes). In addition, in the second embodiment, although four X grooves 31b1 are formed, for example, the number of X grooves 31b1 and the number and arrangement of the guides 48b are not limited thereto. For example, the size may be appropriately determined depending on the size of the substrate. change.

In the second embodiment, as shown in FIG. 10, when the substrate P to be unloaded (the substrate P1 in FIG. 10) is unloaded, the substrate P1 is removed from the substrate holder 30b by removing the adsorption and retention of the substrate P1. The guides 48b are synchronously driven in the +Z direction, and the lower surface of the substrate P1 is separated from the upper surface of the substrate holder 30b. The suction pad 98 of the substrate carrying-out device 93 is inserted into the substrate holder Between the upper surface of 30b and the lower surface of the substrate P1. In addition, in the substrate holder 30b of the second embodiment, the notch 32 is not formed as in the substrate holder 30a of the above-described first embodiment shown in FIG.

Returning to FIG. 10, when the suction pad 98 is inserted between the upper surface of the substrate holder 30b and the lower surface of the substrate P1, the guide member 48b is slightly driven in the -Z direction on the plurality of substrate jacking devices 46b. Next, it is adsorbed and held by the adsorption pad 98. Next, a pressurized gas is sprayed from the plurality of guides 48b to the lower surface of the substrate P1, and the X slider 97 is driven in the +X direction while the substrate P1 is floating, whereby the substrate P1 is removed from the guide 48b of the substrate stage 20b It is sent to the guide 92 of the port 90. In addition, with respect to the carrying-in operation of the next substrate P2 to the substrate holder 30b, the plurality of guides 48b are supported from below (absorption and holding instead of a plurality of ejector pins 48a (see FIGS. 6(A) and 6(B)) ) Except for the substrate P2, it is the same as the first embodiment described above (the plurality of guides 48b also have the functions of the plurality of ejector pins 48a), so the description thereof is omitted.

In the second embodiment described above, in addition to the effects of the above-described first embodiment, since there is no need to form a notch for inserting the suction pad 98 in the substrate holder 30b, the substrate P loaded on the substrate holder 30b can be suppressed Flex. In addition, when the suction pad 98 sucks and holds the substrate P, it is not necessary to drive the suction pad 98 in the Z-axis direction (refer to FIG. 5(A) in the first embodiment described above), so the port section 90 can be easily controlled. Furthermore, since there is no need to eject the pressurized gas for suspending the substrate P from above the substrate holder 30b, there is no need to provide a pipeline for supplying the pressurized gas, and the substrate holder 30b can be made lighter.

"Third Embodiment"

Next, the third embodiment will be described using FIGS. 11 to 20(C). In the first embodiment described above, as shown in FIG. 1, the port portion 90 provided outside the substrate stage device PSTa has a substrate carrying-out device 93, On the other hand, the liquid crystal exposure apparatus 10c of the third embodiment shown in FIG. 11 is different in that the substrate stage 20c of the substrate stage device PSTc has a substrate carrying-out device 70a. In the following, the third embodiment mainly describes the differences from the above-mentioned first embodiment, and the elements having the same configuration and function as those of the above-mentioned first embodiment are given the same symbols as those of the above-mentioned first embodiment, and their description is omitted.

The liquid crystal exposure device 10c of the third embodiment includes an illumination system IOP, a mask stage MST, a projection optical system PL, a substrate stage device PSTc, a substrate loading device 80c, a port 60, and these control systems. The substrate stage 20c of the substrate stage device PSTc includes an X coarse motion stage 23X, a Y coarse motion stage 23Y, a fine motion stage 21, a substrate holder 30c, a weight eliminating device 26, and a plurality of substrate lifting devices 46a (FIG. Not shown in 11. Refer to FIG. 13). The structure of the substrate stage 20c is the same as that of the substrate stage 20a (refer to FIG. 1 etc.) of the first embodiment described above, except that the substrate holder 30c includes the substrate carrying-out device 70a. Therefore, the description is omitted here.

As shown in FIG. 12, on the upper surface of the substrate holder 30c (substrate mounting surface), a plurality of X grooves 73x parallel to the X axis are formed at predetermined intervals in the Y axis direction (for example, two). The X groove 73x is opened on each side surface of the +X side and -X side of the substrate holder 30c.

In each of the plurality of X grooves 73x, a substrate carrying-out device 70a is housed. The substrate carrying-out device 70a includes an X travel guide 71 and a suction device 77a. The X travel guide 71 is composed of a member extending in the X axis direction, and as shown in FIG. 13, is fixed to the bottom surface that defines the X groove 73x. The dimension of the X travel guide 71 in the long side (X axis) direction is set to be longer than the dimension of the substrate holder 30c in the X axis direction, and both end portions in the longitudinal direction thereof protrude outside the substrate holder 30c, respectively. The suction device 77a has a suction pad 77a1 for suctioning and holding the lower surface of the substrate P (not shown in FIG. 13). As shown in FIG. Z to 器77a2. The suction pad 77a1 is composed of a plate-shaped member parallel to the XY plane, and is connected to a vacuum device (not shown) provided outside the substrate stage 20c.

The suction device 77a is engaged with the X travel guide 71 so as to be slidable in the X axis direction, and the X travel guide 71 is driven in the X axis direction with a predetermined stroke. The type of driving device used to drive the suction device 77a is not particularly limited, and for example, an X linear motor composed of a stator provided by the X travel guide 71 and a movable member provided by the suction device 77a, or a X travel guide can be used The feed screw device composed of the feed screw of the member 71 and the nut of the suction device 77a is formed. In addition, a belt drive device that pulls the suction device 77a with a belt (or rope) or the like can also be used.

As shown in FIG. 11, the port portion 60 is provided on the +X side of the substrate stage device PSTc, and is housed in a chamber (not shown) together with the substrate stage device PSTc. The port section 60 has a gantry 61 and a substrate guide 62.

The substrate guide device 62 includes a base 63, a plurality of Z actuators 64 mounted on the base 63, and corresponding to each of the plurality of Z actuators 64, and is driven by the corresponding Z actuator 64 at A plurality of guides 65 in the up-down (Z-axis) direction. The base 63 is composed of a rectangular plate-shaped member parallel to the XY plane in plan view, and is composed of a plurality of X linear guides 66 fixed on the upper surface of the gantry 61 and the X linear guides 66 fixed under the base 63 and sliding freely A plurality of X linear guide devices constituted by the X slider 67 are linearly guided in the X axis direction. In addition, the base 63 is driven in the X-axis direction by a predetermined stroke by an X actuator (not shown) (for example, a feed screw device, a linear motor, etc.). The type of Z actuator 64 is not particularly limited, and for example, a cam device, a feed screw device, a cylinder, or the like can be used. The plural Z actuators 64 are synchronously driven by a main control device (not shown). The guide 65 is the same member as the guide 92 (refer to FIG. 1 etc.) of the first embodiment described above, and can be viewed from below The substrate P is suspended and supported, and the substrate P is suction-held.

Here, the arrangement of the plurality of Z actuators 64 and the plurality of guides 65 included in the substrate guide 62 will be described using FIG. 12. Also, in FIG. 12, the Z actuator 64 is hidden under the guide 65 (-Z side) and is not shown. In addition, in FIG. 12, illustration of the gantry 61, the base 63, etc. is omitted.

The plurality of guides 65 are arranged such that the guide surface of the substrate P formed by the plurality of guides 65 is trapezoidal in plan view. Specifically, the substrate guide device 62 has, for example, three rows of guides composed of a plurality of guides 65 arranged at predetermined intervals in the Y-axis direction at predetermined intervals in the X-axis direction. The row of guides on the most -X side is composed of, for example, eight guides 65. In addition, the middle guide row among the three guide member rows is composed of, for example, six guide members 65. In addition, the guide row on the most +X side is composed of, for example, four guide members 65. As described above, the plurality of guides 65 are the more rows of guides on the -X side, and the more the number of the guides is on the +X side, the substrate guide 62 can support the substrate P from below in the Y-axis direction The range is wider than the -X side (substrate stage 20c side) compared to the +X side. The length (width) of the guides on the most -X side (substrate stage 20a side) composed of, for example, 8 guides 65 is set in the Y-axis direction, and is set to be longer than the length (width) of the substrate P in the Y-axis direction Long (for example, about 1.5 to 2 times).

In addition, each of the plurality of guides 65 is arranged in a state where the loading arm 83 of the substrate loading device 80c is positioned above the port 60, similar to the guide 92 (refer to FIG. 2) of the first embodiment described above. (The state where the loading arm 83 is positioned at the stroke end on the +X side) does not overlap the positions of the plural support portions 832 of the loading arm 83 in the Y-axis direction. Moreover, as long as the shape, number, and arrangement of the plurality of guides 65 can be set to be larger than the size of the substrate P in the Y-axis direction, the dimension of the -X side of the guide surface defined by the plurality of guides is in the Y-axis direction Words (can be formed as the guiding surface is down (Regarding the rectangle), it is not limited to this, and can be changed as appropriate.

As shown in FIG. 11, the substrate carrying-in device 80 c is arranged above the port portion 60 (+Z side). The substrate loading device 80c of the third embodiment has a wide interval between the pair of X travel guides 81 and a slightly longer mounting member 833 for connecting the loading arm 83 to the pair of X sliders 82. The substrate carrying-in device 80a (refer to FIG. 2) of the first embodiment has the same configuration, and therefore its description is omitted here.

Hereinafter, the replacement operation of the substrate P on the substrate holder 30c (for convenience, the plurality of substrates P will be referred to as the substrate P0, the substrate P1, the substrate P2, and the substrate P3) when the exposure operation is continuously performed on the plurality of substrates P It will be described using FIGS. 14(A) to 18(B). The following substrate replacement operations are performed under the management of a master control device (not shown). In addition, for ease of understanding, the substrate stage 20c is shown in FIG. 14(A) to FIG. 15(A), FIG. 16(B) to FIG. 18(B) in FIG. ), Fig. 16(A) shows the CC line cross-sectional view of Fig. 12.

In FIG. 14(A), the substrate P1 is held by the substrate holder 30c of the substrate stage 20c. In addition, the loading arm 83 of the substrate carrying device 80c holds a substrate P2 (substrate P2) which is scheduled to be carried into the substrate holder 30c after the substrate P1 is carried out from the substrate holder 30c. In addition, the transfer arm 19 that is loaded into the substrate transfer machine holds the substrate P0 that has been exposed.

The main control device, after the exposure process for the last one of the plurality of irradiation areas set on the substrate P1 is completed, as shown in FIG. 14(B), causes the substrate stage 20c from the projection optical system PL (see FIG. 11) Move down to the substrate replacement position.

In addition, in parallel with the movement of the substrate stage 20c to the substrate replacement position, the loading arm 83 is driven in the -X direction in the substrate loading device 80c, so that the substrate P2 is located above the substrate replacement position. In addition, in the port portion 60, to reduce the most-X side guide 65 and the substrate holder 30c At the interval (gap) between them, the base 63 is driven in the -X direction (the direction approaching the substrate stage 20c). The Z position of the plurality of guides 65 on the base 63 is controlled so that the Z position on the upper surface is substantially the same as the Z position on the upper surface of the substrate holder 30c.

When the substrate stage 20c is located at the substrate replacement position, the main control device, as shown in FIG. 15(A), releases the adsorption and holding of the substrate P1 by the substrate holder 30c, and ejects pressurized gas from the upper surface of the substrate holder 30c to The substrate P1 is suspended. In addition, for example, the adsorption pad 77a1 (not shown in FIG. 15(A) of each of the two substrate carrying-out devices 70a (one of which is not shown in FIG. 15(A)) is driven in the +Z direction to The lower surface of the substrate P1 is sucked and held.

Thereafter, as shown in FIG. 15(B), the suction device 77a is driven in the +X direction on the X travel guide 71. Accordingly, the substrate P1 sucked and held by the suction pad 77a1 moves in the +X direction along the upper surface of the substrate holder 30c and a surface (guide surface) parallel to the XY plane formed by the upper surfaces of the plurality of guides 65 , And is carried out from the substrate holder 30c to the port portion 60. At this time, pressurized gas is also ejected from above the plurality of guides 65. In this way, the substrate P1 can be moved with high speed and low dust generation.

When the carrying out of the substrate P1 is completed, as shown in FIG. 16(A), on the substrate stage 20c, each of the plurality of substrate lifting devices 46a is synchronously controlled to move the ejector pin 48a in the +Z direction. At this time, the plurality of ejector pins 48a respectively pass between the support portions 832 of the loading arm 83 to press the lower surface of the substrate P2 from below. In addition, at the loading arm 83, the suction holding of the plurality of suction pads 84 to the substrate P2 is released. According to this, the substrate P2 is separated from the loading arm 83. In the port section 60, the substrate guide 62 (base 63) supporting the substrate P1 is driven in the +X direction (direction away from the substrate stage 20c).

略往-Z方向移動。此外，裝載在基板搬出機械人之搬送臂19上之基板P0被搬送至外部裝置、且基板搬入機械人之搬送臂18從外部裝置將次一基板P3搬送來。 When the substrate P2 is separated from the loading arm 83, as shown in FIG. 16(B), the loading arm 83 is driven in the +X direction to withdraw from above the substrate replacement position and return to the position above the port portion 60. Also, at the port portion 60, the plurality of guides 65 are slightly driven on the -Z side, and the substrate P1

Move slightly in the -Z direction. In addition, the substrate P0 loaded on the transfer arm 19 of the substrate transfer robot is transferred to an external device, and the transfer arm 18 of the substrate transfer robot transfers the next substrate P3 from the external device.

Then, as shown in FIG. 17(A), on the substrate stage 20c, a plurality of substrate lifting devices 46a are controlled synchronously to move the ejector pin 48a in the -Z direction, and accordingly, the substrate P2 is loaded onto the substrate holder The upper surface of 30c (the ejector pin 48a is separated from the lower surface of the substrate P2). The substrate P2 is sucked and held by the substrate holder 30c. Also, in parallel with the above-mentioned suction and holding operation of the substrate P2, the suction device 77a (refer to FIG. 12 respectively) located near the +X side end of the X travel guide 71 in the substrate carrying-out device 70a is driven in the -X direction and returns To the position on the side near the -X side end of the X travel guide 71.

Also, above the port portion 60, the transfer arm 18 of the substrate transfer robot supporting the substrate P3 is driven in the -X direction, and a pair of X travel guides 81 (not shown in FIG. 17(A)) are inserted into one of the substrate transfer devices 80c Refer to Figure 12). Accordingly, the transfer arm 18 of the substrate transfer robot and the loading arm 83 of the substrate transfer device 80c are arranged to overlap in the vertical direction. In addition, the transfer arm 19 of the substrate transfer robot is driven in the -X direction and inserted below the substrate P1. As described above, since the transfer arm 19 and the loading arm 83 have substantially the same shape, they do not come into contact with the guide 65. According to this, the transfer arm 19 of the substrate transfer robot and the loading arm 83 of the substrate transfer device 80c are arranged to overlap in the vertical direction.

After that, the plurality of guides 65 are driven in the -Z direction, respectively, so that the substrate P1 is delivered to the transfer arm 19 of the substrate transfer robot. The substrate P1 supports the transport arm 19 and is driven in the +X direction as shown in FIG. 17(B) to transport the substrate P1 to an external device.

After the exposed substrate P1 is delivered to the transfer arm 19 of the substrate transfer robot, a plurality of guides 65 are driven in the +Z direction synchronously as shown in FIG. 18(A). Each of the plurality of guides 65 faces the bottom of the substrate P3 and pushes up the substrate P3 from the transfer arm 18 when they are not in contact with the loading arm 83 and the transfer arm 18 go away. At this time, the substrate P3 is sucked and held by the plurality of guides 65.

Thereafter, as shown in FIG. 18(B), the transfer arm 18 of the substrate transfer robot is driven in the +X direction, and exits from the area above the port 60. In addition, the plurality of guides 65 that support the substrate P3 from below are simultaneously driven in the -Z direction. At this time, the plurality of guides 65 respectively pass between the support portions 832 of the loading arm 83 adjacent to each other, and the substrate P3 is supported by the support portion 832 of the loading arm 83 from below. Accordingly, the substrate P3 is transferred from the guide 65 to the loading arm 83, and returns to the state shown in FIG. 14(A) (however, the substrate P0 is replaced with the substrate P1, the substrate P1 is replaced with the substrate P2, and the substrate P2 is replaced Replace with substrate P3).

The liquid crystal exposure device 10c of the third embodiment can also obtain the same effect as the first embodiment described above. Further, in the third embodiment, since the substrate stage 20c includes the substrate carrying-out device 70a, before the substrate stage 20c reaches the substrate replacement position, that is, when the exposure process to the final irradiation area ends and moves to the substrate replacement position, The movement of the substrate P can be started in parallel with this movement. Therefore, the substrate replacement cycle time on the substrate holder 30c can be shortened, and the number of processed substrates P per unit time can be increased.

In addition, for example, when a plurality of irradiation areas are set on the substrate P, generally speaking, the irradiation area that is finally subjected to the exposure process is set on the substrate P to reduce the total amount of movement of the substrate P (substrate stage 20c) Y side, or -Y side. Therefore, the substrate stage 20c after the exposure process of the last irradiation area is moved to the X-axis direction when moving to the substrate replacement position and Also in the Y-axis direction (moving in an oblique direction relative to the X-axis). On the other hand, in the third embodiment, as shown in FIG. 19, the guides composed of, for example, eight guides 65 arranged on the most -X side of the plurality of guides 65 are listed in the dimension of the Y-axis direction, It is set to be longer than the dimension of the substrate P in the Y-axis direction, so when the substrate stage 20c moves in an oblique direction with respect to the X-axis, the portion of the substrate P that protrudes from the +X side end of the substrate holder 30c is also It is supported by the guide 65 from below. According to this, the substrate P can be carried out more quickly.

Hereinafter, it demonstrates concretely using FIG.20(A)-FIG.20(C). In addition, in FIGS. 20(A) to 20(C), illustrations of the substrate carrying-out device 70a, the port portion 60 (see FIG. 12 respectively), and the like are omitted. In addition, in FIGS. 20(A) to 20(C), for convenience, the irradiation area (exposure area) system is given the same symbol as the projection optical system PL (see FIG. 11) for description.

As shown in FIG. 20(A), for example, six irradiation areas are set on the substrate P, and the last irradiation area is provided on the irradiation area S6 on the +Y side and the +X side of the substrate P. In addition, the center of the substrate P before the exposure operation to the irradiation area S6 is located at the position CP1, and the center of the substrate P at the end of the exposure operation is located at the position CP2.

Here, assuming that the dimension of the guide row on the most -X side (refer to FIG. 19) in the Y-axis direction is the same as the dimension of the substrate P in the Y-axis direction, when the substrate P is carried out, the substrate P and X Since the movement in the axis direction is parallel, the Y position of the substrate stage 20c must be controlled in such a way that the above-most side guide is listed in the center of the Y axis direction and substantially coincides with the center of the substrate P in the Y axis direction. In this case, The position of the substrate stage 20c must be controlled in such a manner that the center of the substrate holder 30c passes through the positions CP1→CP2→CP4 (position CP4 is the substrate replacement position) of FIG. 20(B) in sequence.

On the other hand, in the third embodiment, regardless of the Y position of the substrate stage 20c Why, the +X side end of the substrate P is supported by the guide 65 (see FIG. 19), so the substrate stage 20c moves from the position (position CP2) at the end of the exposure process of the final irradiation area to the substrate replacement position (position CP4), the substrate P can be carried out simultaneously with the movement, and the substrate P can be carried out in the order of the center of the substrate P through the position CP1→CP2→CP3 of FIG. 20(B) (substrate stage The center of 20c passes in the order of CP1→CP2→CP4). Therefore, the substrate P can be quickly carried out. After the substrate stage 20c is located at the substrate replacement position, the substrate P, as shown in FIG. 20(C), moves parallel to the X axis.

"Fourth Embodiment"

Next, the fourth embodiment will be described using FIGS. 21 and 22. The liquid crystal exposure apparatus of the fourth embodiment is the same as the liquid crystal exposure apparatus 10c of the third embodiment (see FIG. 11) except for the structure of the substrate holder 30d. Therefore, only the differences will be described below. The third embodiment has the same configuration and function requirements, and the same reference numerals as those in the third embodiment are given to omit the description.

In the third embodiment described above, the substrate P is moved using the upper surface of the substrate holder 30c as a guide surface when the substrate is carried out (refer to FIGS. 15(A) and 15(B)). In contrast, FIG. 21 The fourth embodiment is the same as the second embodiment (see FIG. 9) described above, except that the substrate P is carried out along the guide surface formed by the plurality of guides 48b (see FIG. 22). The structure of the substrate carrying-out device 70a is the same as that of the third embodiment described above. In addition, as shown in FIG. 22, the configuration including the guide 48b and the substrate jacking device 46b is the same as in the second embodiment described above, and therefore the description thereof is omitted here. According to the fourth embodiment, it is not necessary to form a hole for ejecting pressurized gas for suspending the substrate P on the upper surface of the substrate holder 30d. In addition, since there is no need to incorporate a gas discharge line or the like in the substrate holder 30d, the substrate holder 30d can be made lighter.

"Fifth Embodiment"

Next, the fifth embodiment will be described using FIG. 23. In the third and fourth embodiments described above, the substrate holders 30c and 30d (see FIGS. 12 and 21 respectively) have the substrate carrying-out device 70a. In contrast, in the fifth embodiment, as shown in FIG. 23, The substrate stage 20e is provided with a substrate carry-out device 70a outside the substrate holder 30e, on the +Y side and the -Y side, respectively. For example, the configuration of each of the two substrate carry-out devices 70a is the same as the third embodiment described above. The parts other than the arrangement of the substrate carrying-out device 70a are the same as those in the above-mentioned fourth embodiment. Therefore, only the differences will be described below, and the elements having the same structure and function as those in the above-mentioned third and fourth embodiments are given. The same symbols as in the above-mentioned third and fourth embodiments will be omitted.

In the fifth embodiment, the amount of protrusion of the substrate P from each end of the +Y side and -Y side of the substrate holder 30e is set to be larger than that in the third and fourth embodiments described above, and one of the substrate carrying-out devices 70a is disposed In the substrate P, below the portion protruding from the substrate holder 30e toward the +Y side, another substrate carry-out device 70a is disposed below the portion protruding from the substrate holder 30e toward the -Y side. Although not shown in FIG. 23, for example, each of the two substrate carry-out devices 70a is mounted on a support member fixed on the Y coarse motion stage 23Y (see FIG. 11) disposed below the substrate holder 30e. Y coarse motion stage 23Y. That is, for example, each of the two substrate carrying-out devices 70a is separated from the substrate holder 30e.

In the fifth embodiment, for example, the two substrate carry-out devices 70a are respectively arranged outside the substrate holder 30e, and since the substrate holder 30e does not need to form a groove for accommodating the substrate carry-out device 70a, the substrate holder 30e can be suppressed The rigidity is reduced. In addition, since the substrate P can be adsorbed and held in a large area, the flatness of the substrate P can be improved. In addition, the business can make the substrate holder 30e lightweight, and the reaction force when driving the suction device 77a does not act on the substrate holder 30e, Therefore, the position controllability of the substrate holder 30e (substrate P) can be improved. In addition, since the substrate carrying-out device 70a is disposed outside the substrate holder 30e, the maintainability is also good.

"Sixth Embodiment"

Next, the sixth embodiment will be described using FIGS. 24 to 25(C). In the above-mentioned fifth embodiment (refer to FIG. 23), the structure of the substrate carrying-out device 70a is the same as that of the above-mentioned third embodiment, but in contrast, in the sixth embodiment shown in FIG. 24, the structure of the board carrying-out device 70d is different. . The parts other than the structure of the substrate carrying-out device 70d are the same as the above-mentioned fifth embodiment. Therefore, only the differences will be described below, and the elements having the same structure and function as the above-mentioned fifth embodiment will be given to the above The fifth embodiment (or the third and fourth embodiments) has the same reference numerals, and the description thereof is omitted.

The substrate stage 20f of the sixth embodiment, as shown in FIG. 24, is the same as the fifth embodiment (see FIG. 23) described above. On the +Y side and -Y side of the substrate holder 30e, respectively, the substrate carrying device 70d is separated from the substrate holder 30e. The substrate carrying-out device 70d includes an X travel guide 71 supported from below by a support member 28 fixed on the upper surface of the Y coarse motion stage 23Y, and Y linear which can move on the X travel guide 71 in the X axis direction by a predetermined stroke The guide device 78 and the suction device 77 d mounted on the X travel guide 71 through the Y linear guide device 78. The suction device 77d includes a suction pad that suction-holds the substrate P1 below. The Y linear guide 78 has a Y actuator (not shown), and can drive the suction device 77d in the Y axis direction with respect to the X travel guide 71 with a predetermined stroke. In addition, the Z position of the lower surface of the suction device 77d is slightly on the +Z side than the Z position of the upper surface of the substrate holder 30e. In addition, the types of the X actuator that drives the Y linear guide 78 in the X-axis direction and the Y actuator that drives the suction device 77d in the Y-axis direction are not particularly limited. For example, a feed screw device, linear Motor etc. Furthermore, the adsorption device 77d is as described above The first to fifth embodiments differ in that they do not have a Z actuator that drives the suction pad in the Z axis direction.

In the sixth embodiment, from the state where the substrate P is loaded on the substrate holder 30e shown in FIG. 25(A), the plurality of guides 48b built in the substrate holder 30e (or 21 (refer to FIG. 24) driven in the -Z direction) lift the substrate P (substrate P1 in FIG. 24) from above the substrate holder 30e, and then, as shown in FIG. 25(B), for example, take out two substrates The suction device 77d of each device 70d is driven in a direction approaching the substrate holder 30e (refer to the arrow in FIG. 25(B)). Accordingly, the suction device 77d is inserted between the upper surface of the substrate holder 30e and the lower surface of the substrate P (refer to FIG. 24. However, in FIG. 24, the suction device 77d is inserted between the lower surface of the substrate P1 and the upper surface of the substrate holder 30e) .

After that, the plurality of guides 48b are lowered in the substrate holder 30e, so that the adsorption device 77d can adsorb and hold the substrate P. For example, two suction devices 77d that hold and hold the substrate P, as shown in FIG. 25(C), are simultaneously driven on the +X side. Accordingly, the substrate P is carried out from the substrate holder 30e toward the port portion (not shown). In addition, the replacement operation of the substrate P1 on the substrate holder 30e shown in FIG. 24 and the other (next) substrate P2 loaded on the loading arm 83 is the same as in the second embodiment described above, and therefore its description is omitted. According to the sixth embodiment, since the suction device 77d can move in the Y-axis direction, the substrate P need not be greatly protruded from both ends of the substrate holder 30e in the Y-axis direction, and the substrate P can be miniaturized.

In addition, the configuration of the above-mentioned third to sixth embodiments can be appropriately changed. For example, in the substrate carrying-out device 70d of the sixth embodiment described above, the suction device 77d can move in the Y-axis direction relative to the X travel guide 71, but it is not limited to this, and may be as shown in FIGS. 26(A) to 27(C), for example. Like the substrate carrying-out device 70e of the first modification shown, the suction device 77d protrudes from the X travel guide 71 to the substrate holder 30e side in advance (the substrate carrying-out device 70e does not include the suction device 77d relative to X The travel guide 71 drives the Y actuator in the Y axis direction). In this case, as shown in FIG. 26(A), in a state where the substrate P is mounted on the substrate holder 30e, the suction device 77d is positioned on the -X side of the substrate P, and after the exposure is completed, a plurality of guides 48b are used to place the substrate P After being lifted from the substrate holder 30e, it is driven in the +X direction as shown in FIG. 26(B), whereby it is inserted between the substrate holder 30e and the substrate P. After that, the substrate P is lowered, and the suction device 77d sucks and holds the substrate P, and in this state, it is driven in the +X direction as shown in FIG. 26(C). Accordingly, the substrate P is carried out from the substrate holder 30e. After the substrate P is unloaded, the suction device 77d is located on the +X side of the substrate P as shown in FIG. 27(A) during the exposure process on the other substrate P. Next, when the exposure process of the substrate P is completed and the substrate P is lifted from the substrate holder 30e by the plurality of guides 48b for the carrying out operation, the suction device 77d, as shown in FIG. 27(B), passes through the substrate P The lower part returns to the initial position shown in FIG. 26(A) (position on the -X side of the substrate P). As shown in FIG. 27(C), the processing after FIG. 26(B) is repeated. According to the first modification, the structure and control of the substrate carrying-out device 70e can be simplified.

Furthermore, in the substrate stage 20f of the above-mentioned sixth embodiment, although the substrate carrying-out device 70d is disposed on both sides (+Y side and -Y side) of the substrate holder 30e, as shown in FIG. 28 (hereinafter, referred to as As shown in the second modification example, the substrate carrying-out device 70f is arranged only on one side (+Y side or -Y side) of the substrate holder 30e. In this case, in order to be able to adsorb and hold the substrate P with a stronger adsorption holding force, it is preferable to set the adsorption holding surface of the adsorption pad included in the adsorption device 77f to the adsorption device 77a of the third to sixth embodiments ( For example, refer to FIG. 12). In this case, the suction device 77f may be movable in the Y-axis direction relative to the X travel guide 71 as in the sixth embodiment described above, or may be moved from the X travel guide 71 to the substrate holder as in the first modification described above. Fix it with the 30e side protruding.

In addition, in the substrate carrying-out apparatus of the third to sixth embodiments described above, the suction pad may be driven in the Z-axis direction or the Y-axis direction relative to the substrate P to be positioned below the substrate P, but is not limited to this, As shown in FIGS. 29(A) to 30(B) (hereinafter, referred to as a third modification), the substrate P can be moved relative to the suction device 77g. As shown in FIG. 29(A), the substrate carry-out device 70g is disposed on the +Y side of the substrate holder 30e (the suction device 77g cannot move in the Y-axis direction). Furthermore, on the -Y side of the substrate holder 30e, for example, two positioning devices 17a are separated and arranged in the X-axis direction, and on the +Y side of the substrate holder 30e, for example, one positioning device 17b is arranged. A plurality of positioning devices 17a and 17b are mounted on the Y coarse motion stage 23Y (refer to FIG. 11) through support members (not shown), respectively, and are arranged at substantially the same Z position as the substrate P (therefore, they do not travel with the X guide 71 conflict). The positioning devices 17a and 17b have actuators such as air cylinders, and press the end of the substrate P to control the position of the substrate P.

In the third modification, in a state where the exposed substrate P is suspended and supported by a plurality of guides 48b, as shown in FIG. 29(B), for example, the substrate P is driven to +Y by two positioning devices 17a direction. At this time, the movement prevention pin 17c and the positioning device 17b attached to the suction device 77g prevent excessive movement of the substrate P due to inertia in the +Y direction. In addition, a plurality of notches 17d are formed on the upper surface of the substrate holder 30e to prevent interference with the positioning device 17a. When the substrate P is positioned at a position where the suction device 77g can adsorb and hold the substrate P, as shown in FIG. 30(A), the positioning devices 17a, 17b are withdrawn from the substrate P, and then, as shown in FIG. 30(B) As shown, the substrate P is sucked and held by the suction device 77g, and is carried out from the substrate holder 30e. In the third modification, since the system substrate P moves relative to the substrate carry-out device 70g, the amount of protrusion of the substrate P from the substrate holder 30e can be reduced in advance.

"Seventh Embodiment"

Next, the seventh embodiment will be described using FIGS. 31 to 41. The substrate stages 20a to 20f of the first to sixth embodiments described above are configured to mount the Y coarse movement stage 23Y on the X coarse movement stage 23X, but the liquid crystal exposure apparatus of the seventh embodiment shown in FIG. 31 The difference between the substrate stage 120a of 100 is that the X coarse motion stage 123X is not mounted on the Y coarse motion stage 123Y (the upper coarse motion stage moves in the scanning direction). In addition, the substrate carrying-out device 170 is provided on the Y coarse motion stage 123Y (lower coarse motion stage). In the following, the seventh embodiment will only describe the differences from the above-mentioned first to sixth embodiments, and the elements with the same configuration and function as the above-mentioned first to sixth embodiments will be given to the above-mentioned first to sixth Embodiments have the same symbols and their description is omitted.

In the seventh embodiment, as shown in FIG. 31, the device body 130 includes a lens barrel stage 131, a pair of side columns 132, and a substrate stage 133. The lens barrel stage 131 is composed of a plate-shaped member arranged parallel to the XY plane, and supports the projection optical system PL, the mask stage MST, and the like. The pair of side columns 132 are separated from each other in the Y-axis direction, and support the vicinity of the +Y side end of the lens barrel stage 131 and the vicinity of the -Y side end from below. The substrate stage 133 is composed of members extending in the Y-axis direction, and as can be seen from FIGS. 32 and 33, for example, two are provided apart in the X-axis direction. Returning to FIG. 31, the side post 132 on the +Y side is mounted on the vicinity of the +Y side end of, for example, two substrate stage 133, and the side post 132 on the -Y side is mounted on, for example, two substrate stage 133 -Near the end of the Y side. The substrate stage 133 is supported by the vibration isolator 134 provided on the floor 11 of the clean room from below to support the vicinity of the end in the longitudinal direction. According to this, the device body 130 (and the projection optical system PL, the mask stage MST, etc.) is vibrationally separated from the floor 11.

As shown in FIG. 33, the substrate stage device 200 includes a pair of bases 114, an auxiliary base 115, and a substrate stage 120a.

A base 114 is on the +X side of the substrate stage 133 on the +X side and the other bottom The base 114 is on the -X side of the substrate stage 133 on the -X side, and the auxiliary base 115 is arranged between the pair of substrate stage 133 at a predetermined distance (in a non-contact state) from the substrate stage 133. . The pair of bases 114 and the auxiliary bases 115 are respectively composed of plate-shaped members extending in the Y-axis direction and parallel to the YZ plane, and are installed on the ground 11 in a manner capable of adjusting the height position (Z position) through a plurality of adjustment devices. At each upper end surface (+Z side end) of the pair of bases 114 and auxiliary bases 115, as shown in FIG. 32, the mechanical Y linear guide device (uniaxial guide device) elements extending in the Y-axis direction are fixed Ylinear guide 116a.

Returning to FIG. 31, the substrate stage 120a includes a Y coarse motion stage 123Y, an X coarse motion stage 123X, a fine motion stage 21, a substrate holder 30b, a plurality of substrate lifting devices 46b, a Y stepping stage 150, and weight elimination The device 26 and the substrate carrying-out device 170.

As shown in FIG. 33, the Y coarse motion stage 123Y is mounted on a pair of bases 114 and auxiliary bases 115. As shown in FIG. 32, the Y coarse motion stage 123Y has a pair of X beams 125. The pair of X beams 125 are each formed of a member having a rectangular YZ cross section extending in the X axis direction, and are arranged parallel to each other at a predetermined interval in the Y axis direction. The pair of X beams 125 are connected to each other by the Y bracket 126 near the ends of the +X side and the -X side. The Y bracket 126 is composed of a plate-shaped member extending in the Y axis direction and parallel to the XY plane, and a pair of X beams 125 is mounted on the upper surface thereof. In addition, as shown in FIG. 33, the pair of X beams 125 are connected at the central portion in the longitudinal direction by an auxiliary bracket 126a.

Further, as can be seen from FIGS. 31 and 33, under the Y bracket 126 and the auxiliary bracket 126a, a plurality of Y sliders 116b (which form the Y linear guide 116 together with the Y linear guide 116a are fixed ( (It overlaps in the depth direction of the paper in FIG. 33). The Y slider 116b is engaged with the corresponding Y linear guide 116a with low friction and sliding freely, and the Y coarse motion stage 123Y has low friction and can travel on the pair of bases 114 and the auxiliary base 115 in the Y axis direction with a predetermined stroke mobile. Pair of X The Z position of the lower surface of the beam 125 is set to be more +Z side than the upper surface of the pair of substrate stage 133, and the Y coarse motion stage 123Y is separated from the pair of substrate stage 133 (that is, the device body 130) in vibration .

As shown in FIG. 32, the Y coarse motion stage 123Y is driven in the Y axis direction by a pair of Y feed screw devices 117. The pair of Y feed screw devices 117 include a screw shaft 117a driven by a motor mounted on the outer surface of the base 114 and a nut 117b having a plurality of recirculating balls (not shown) mounted on the Y bracket 126 . Of course, the types of Y actuators used to drive the Y coarse motion stage 123Y (a pair of X beams 125) in the Y axis direction are not limited to the above-mentioned ball screw devices, but may also be, for example, linear motors, belt drive devices, and the like. In addition, a Y actuator having the same configuration (or another kind) as the Y feed screw device 117 described above may be disposed on the auxiliary base 115. Moreover, the Y feed screw device 117 may be one.

On each of the pair of X beams 125, as shown in FIG. 34, opposite to one X beam 125 at a predetermined interval in the Y axis direction, parallel to each other, for example, two mechanical uniaxial guides extending in the X axis direction are fixed X linear guide 127a of the requirements. In addition, in a region between the pair of X linear guides 127a on each of the pair of X beams 125, a magnet unit 128a (X stator) including a plurality of permanent magnets arranged at predetermined intervals in the X axis direction is fixed.

The X coarse motion stage 123X is composed of a rectangular plate-shaped member in plan view, and an opening is formed in the center thereof. Below the X coarse motion stage 123X, an X slider 127b that constitutes the X linear guide 127 together with the X linear guide 127a is fixed. The X slider 127b is provided for one X linear guide 127a at predetermined intervals in the X axis direction (see FIG. 33). The X slider 127b is engaged with the corresponding X linear guide 127a with low friction and sliding freely. The X coarse motion stage 123X can move on the pair of X beams 125 with a low friction in the X axis direction by a predetermined stroke. Also, under the X coarse motion stage 123X, a predetermined gap is fixed to each of the pair of magnet units 128a A pair of opposing coil units 128a (X movers) constitute a pair of magnet units 128a to drive a pair of X linear motors 128 with a predetermined stroke in the X axis direction at a predetermined stroke.

The X coarse motion stage 123X is restricted by the X linear guide 127 from moving in the Y axis direction relative to the Y coarse motion stage 123Y, and the Y coarse motion stage 123Y moves integrally in the Y axis direction. That is, the X coarse motion stage 123X and the Y coarse motion stage 123Y together constitute a gantry-type biaxial stage device. The Y position information of the Y coarse motion stage 123Y and the X position information of the X coarse motion stage 123X are respectively obtained by a linear encoder system (not shown). In addition, the structure of the fine movement stage 21 (including the drive system and the measurement system) is the same as that of the above-mentioned first embodiment as shown in FIGS. 33 and 34 (including the fine movement stage including a plurality of voice coil motors 29x, 29y, and 29z The driving system and the substrate interferometer system using the X moving mirror 22x and the Y moving mirror 22y), therefore, the description is omitted here.

In addition, the structure of the substrate holder 30b is substantially the same as in the second embodiment described above, and therefore, the description thereof is omitted here. In the seventh embodiment, although the X groove 31b1 is opened at both ends of the substrate holder 30b, it may not be opened. In addition, the configuration of the plurality of substrate jacking devices 46b is also substantially the same as the second embodiment described above, and therefore, the description thereof is omitted here. However, in the seventh embodiment, the substrate jacking device 46b, as shown in FIG. 33, is provided with plural numbers (for example, 4 sets) at predetermined intervals in the X-axis direction, and the guide 48b, as shown in FIG. 32, corresponds to an X The slot 31b1 accommodates, for example, four (for example, a total of 16).

The Y stepping platform 150, as shown in FIG. 32, is composed of a YZ section rectangular member extending in the X-axis direction, and is inserted into a pair of X-beams 125 in a state (a non-contact state) at a predetermined distance from the pair of X-beams 125, respectively between. The dimension of the Y step platform 150 in the longitudinal direction is set to be slightly longer than the movement stroke of the fine movement stage 21 in the X axis direction. The upper surface of the Y stepping platform 150 is processed into a very high flatness. Y stepping platform 150, as shown in FIG. 34, is fixed by a pair of substrate stages A plurality of Y linear guides 135a above each of the stages 133 and a plurality of Y linear guides 135 composed of a plurality of Y slides 135b fixed below the Y stepping platform 150, on a pair of substrate stage 133 The predetermined stroke is guided straight in the Y-axis direction.

The Y stepping platform 150, as shown in FIG. 32, is mechanically connected to a pair of X beams 125 through a pair of devices called flexure devices 151 near the ends of the +X side and -X side, respectively. . According to this, the Y step platform 150 and the Y coarse motion stage 123Y move integrally in the Y axis direction. The flexure device 151 includes, for example, a thin-thick strip-shaped steel plate arranged parallel to the XY plane, and a hinge device (such as a ball joint or a hinge device) provided at both ends of the steel plate. Between the platform 150 and the X beam 125. Therefore, the flexure device 151 has a lower rigidity than the other 5 degrees of freedom directions (X, Z, θ x, θ y, θ z directions) compared with the Y axis direction rigidity. In the above 5 degrees of freedom direction, the Y stepping platform 150 and Y coarse motion stage 123Y are separated in vibration. In addition, the Y position of the Y stepping platform 150 can also be controlled independently of the Y coarse motion stage 123Y using actuators such as linear motors and feed screw devices.

The structure of the weight eliminating device 26 (including the leveling device 27) is substantially the same as the first embodiment described above, and therefore, the description thereof is omitted here. However, in the seventh embodiment, as shown in FIG. 34, the weight eliminating device 26 is mounted on the Y stepping platform 150 in a non-contact state through a plurality of air bearings 26a mounted below it. Therefore, Z The dimension in the axial direction is shorter than in the first embodiment described above. The weight eliminating device 26 is mechanically connected to the X coarse motion stage 123X through a plurality of flexure devices 26b. When the X coarse motion stage 123X moves integrally in the X axis direction, it moves on the Y step platform 150. On the other hand, when the weight removing device 26 moves integrally with the X coarse motion stage 123X in the Y-axis direction, it moves with the Y coarse motion stage 123Y and the Y stepping platform 150 integrally in the Y-axis direction. The situation of Y stepping platform 150 falling off.

The substrate carrying-out device 170 carries out the substrate P loaded on the substrate holder 30b toward the outside of the substrate stage device 200 described later (in this embodiment, the substrate guide device 62 (see FIG. 35) of the port section 60 described later) The device is mounted on the outer side of the X beam 125 on the +Y side (the surface facing the +Y side) of the pair of X beams 125. The substrate carrying-out device 170 includes an adsorption pad 171 that adsorbs and holds the substrate P to be removed, a support member 172 that supports the adsorption pad, and a pair of X linear guides that guide the support member 172 (and the adsorption pad 171) straight in the X-axis direction 173, and an X linear motor 174 for driving the support member 172 (and the suction pad 171) in the X axis direction. 34 is a cross-sectional view taken along the line E-E in FIG. 33, and illustrates the configuration of the substrate carrying-out device 170, and shows the state where the suction pad 171 and the support member 172 are located at the -X side stroke terminal.

The suction pad 171, as shown in FIG. 34, is composed of an inverse L-shaped member with a YZ cross-section, and a portion parallel to the XY plane, as shown in FIG. 32, is a rectangular plate-shaped member with the X-axis direction as the longitudinal direction in a plan view constitute. The suction pad 171 is connected to a vacuum device (not shown) provided outside, and the upper surface of the part parallel to the XY plane has a function as a substrate suction surface. As shown in FIG. 33, the support member 172 is composed of a plate-like member extending in the Z-axis direction and parallel to the XZ plane, and an adsorption pad 171 is attached near the upper end (+Z side end). The support member 172 has a structure with higher rigidity in the X-axis direction than in the Y-axis direction. The support member 172 is formed so that the portion on the +Z side is slightly curved toward the +X side from the central portion in the Z-axis direction, and the upper end portion protrudes from the lower end portion (-Z side end portion) on the +X side (that is, the port portion 60 (FIG. Not shown in 33. Refer to FIG. 35) side). Further, between the support member 172 and the substrate holder 30b, as shown in FIG. 34, it is set that the substrate holder 30b is slightly driven relative to the X coarse motion stage 123X in a state where the support member 172 is adjacent to the substrate holder 30b In the case of the Y-axis direction and/or the θz direction, there will be no gaps in contact with each other.

Here, the suction pad 171 is configured by connecting the end near the +Y side to the The support member 172 has the end of the -Y side protruding from the surface of the support member 172 toward the -Y side to the -Y side (substrate holder 30b side), and the Y position of the -Y side end is higher than that of the substrate holder 30b The +Y side end is located on the -Y side. That is, when viewing the substrate stage 120a from the +Z side, although the X position of the substrate holder 30b is required, the suction pad 171 is located above the substrate holder 30b (overlapping in the Z-axis direction). In addition, the suction pad 171 is supported by the support member 172 such that the Z position below it is located at a position higher than the Z position above the substrate holder 30b (because the Z position of the substrate holder 30b changes within a small range, it is (The substrate holder 30b is located at a position higher than the Z position on the upper surface of the substrate holder 30b in a state where it is in a neutral position in the Z-axis direction). According to this, it is possible to insert the suction pad 171 between the substrate P and the substrate holder 30b in a state where the substrate P is driven by a plurality of substrate jacking devices 46b to ascend (upped) from the upper surface of the substrate holder 30b.

A surface near the lower end of the support member 172 faces the outer side of the X beam 125 on the +Y side. On the other hand, on the outer side of the X beam 125 on the +Y side, as shown in FIG. 33, for example, two (one pair) X linear guides 173a extending in the X axis direction are fixed at predetermined intervals in the Z axis direction. A pair of X linear guides 173a whose length (dimension in the X-axis direction) is set to approximately half of the X-beam 125 (or about the same length as the length of the substrate P in the X-axis direction), are arranged closer to the X-beam 125 than the X-axis The central part of the direction is a region on the +X side (port part 60 (not shown in FIG. 33. Refer to FIG. 35) side). In addition, on one face of the support member 172 (opposite face to the X beam 125), one X linear guide 173a is fixed at predetermined intervals in the X-axis direction to include rolling elements (not shown) such as circulating balls. 2. Mechanically slidingly engages with the X linear guide 173a, for example, two X sliders 173b. The X linear guide 173a and the two X sliders 173b corresponding to the X linear guide 173a constitute an X linear guide device for guiding the support member 172 (and the suction pad 171) straight in the X axis direction 173.

In addition, between the pair of X linear guides 173a, magnet units 174a including a plurality of permanent magnets arranged at a predetermined interval in the X-axis direction are fixed. On the other hand, a coil unit 174b including a coil is fixedly opposed to the magnet unit 174a at a predetermined interval on one surface of the support member 172 (opposite surface to the X beam 125). The above-mentioned magnet unit 174a (X stator) and the coil unit 174b (X mover) corresponding to the magnet unit 174a constitute an X linear motor for driving the support member 172 (and suction pad 171) in the X-axis direction 174. Moreover, the actuator for driving the support member 172 (and the suction pad 171) in the X-axis direction is not limited to this, and for example, a ball screw (feed screw) device, a rope (or belt, etc.) may be used. Traction devices and other single-axis actuators. In addition, mechanical stoppers 175 that define the movable range of the support member 172 are fixed to the outer surface of the X beam 125 on the +Y side and near both ends of the magnet unit 174a.

On the substrate stage 120a, when the substrate P is carried out, the plurality of Z actuators 47 are controlled so that the Z position above the guides 48b of the plurality of substrate lifting devices 46b is higher than that of the substrate holder 30b Located on the +Z side. Next, in the substrate unloading device 170, the suction pad 171 sucks and holds the lower surface near the -X side and the +Y side end (corner) of the substrate P, and in this state, the support member 172 is driven by the X linear motor 174 to make the substrate P moves on the substrate holder 30b in the +X direction to carry it out to the port 60. At this time, pressurized gas is sprayed from the plurality of guides 48b to the lower surface of the substrate P to suspend and support the substrate P. According to this, the substrate P moves on the substrate holder 30b with low friction.

Here, in the substrate carrying-out device 170, as shown in FIG. 33, the shape (bending amount) of the support member 172 is set to the X position of the suction pad 171 when the support member 172 is positioned at the stroke end of the +X side, so that When the X coarse motion stage 123X is located at the stroke end of the +X side, the substrate holder 30b is further on the +X side. According to this, during the exposure process of the substrate P, etc., the suction can be performed The pad 171 retreats to the outside of the movable range of the X coarse motion stage 123X. Moreover, in this embodiment, the middle portion of the support member 172 is formed by bending, but as long as the suction pad 171 can be retracted outside the movable range of the substrate holder 30b in the X-axis direction, the shape of the support member 172 is not limited to this .

The configuration of the substrate carrying-in device 80c shown in FIG. 35 and the port portion 60 (including the substrate guide device 62) is the same as that of the third embodiment described above, and therefore, its description is omitted here.

Hereinafter, for the replacement operation of the substrate P on the substrate holder 30b of the liquid crystal exposure apparatus 100 (for convenience, a plurality of substrates P are referred to as substrate P1, substrate P2, and substrate P3), use FIG. 36(A) to FIG. 41(B). The following substrate replacement operations are performed under the management of a master control device (not shown). In addition, in FIGS. 36(A) to 41(B), for ease of understanding, the substrate holder 30b is shown in a cross-sectional view, and a part of the illustration including a plurality of voice coil motors and the substrate stage 120a is omitted.

In FIG. 36(A), the substrate P1 is held by the substrate holder 30b of the substrate stage 120a. In addition, the loading arm 83 holds a substrate P2 (next substrate P2) that holds the substrate holder 30b next after the substrate P1 is carried out from the substrate holder 30b.

The main control device controls the substrate stage 120a to move from the exposure end position to the end position of the exposure as shown in FIG. 36(B) after the exposure process of the last shot area among the plurality of shot areas set on the substrate P1 is completed Substrate replacement position. During the above exposure process, the support member 172 of the substrate carrying-out device 170 is located at the stroke end on the +X side, and the suction pad 171 is retracted outside the movable range of the substrate P in the X-axis direction. Therefore, in order to carry out the substrate P1, the X coarse movement stage 123X (and the substrate holder 30b) moves in the X-axis direction, and the substrate P1 and the suction pad 171 are not in contact. In parallel with this, the loading arm 83 is driven in the -X direction, and accordingly, the substrate P2 is located above the substrate replacement position. Furthermore, at the port portion 60, the substrate guide 62 is driven In the direction approaching the substrate stage 120a.

When the substrate stage 120a reaches the substrate replacement position, as shown in FIG. 37(A), the main control device releases the adsorption and holding of the substrate P1 by the substrate holder 30b and controls the plurality of substrate jacking devices 46b to drive the guide 48b to rise . Accordingly, a gap is formed between the lower surface of the substrate P1 and the upper surface of the substrate holder 30b. Next, as shown in FIG. 37(B), the support member 172 of the substrate carrying-out device 170 is driven in the -X direction, and accordingly, the suction pad 171 passes through the gap between the lower surface of the substrate P1 and the upper surface of the substrate holder 30b, and The end portion (corner portion) on the -X side and +Y side of the substrate P1 is near and below. After that, the plurality of guides 48b are driven to descend, and the lower surface of the substrate P1 is sucked and held by the suction pad 171. In addition, a plurality of guides 48b eject pressurized gas onto the lower surface of the substrate P1 to suspend and support the substrate P1. At this time, the plurality of guides 48b of the substrate stage 120a and the plurality of guides 65 of the port portion 60 are controlled so that the upper Z positions are substantially the same as each other.

即沿著與以複數個導件48b及複數個導件65之上面形成之XY平面平行之面(導引面)移動於+X方向，從基板保持具30b被搬出至埠部60。此時，從複數個導件65之上面亦對基板P1噴出加壓氣體。據此，即能以高速且低發塵的使基板P1移動。 After that, as shown in FIG. 38(A), the support member 172 of the substrate carry-out device 170 is driven in the +X direction, so that the substrate P1 that is sucked and held by the suction pad 171

That is, it moves in the +X direction along a surface (guide surface) parallel to the XY plane formed by the plurality of guides 48b and the plurality of guides 65, and is carried out from the substrate holder 30b to the port portion 60. At this time, pressurized gas is also ejected from the upper surfaces of the plurality of guides 65 onto the substrate P1. According to this, the substrate P1 can be moved at high speed with low dust generation.

被裝載於複數個導件65上，接著將支承了基板P1之基板導引裝置62驅動於+X方向。又，只要基板搬出裝置170能將基板P1搬送至位於圖38(B)所示位置之基板導引裝置62上的話， 無需使基板導引裝置62預先移動至基板載台120a側(可以是無法移動)。又，於基板載台120a，驅動複數個導件48b上昇，從下方按壓基板P2之下面。於裝載臂83，解除基板P2之吸附保持，據此，基板P2即從裝載臂83離開。又，亦可使裝載臂83下降以將基板P2交至複數個導件48b。 When the substrate P1 is delivered from the substrate holder 30b to the plurality of guides 65, as shown in FIG. 38(B), the adsorption of the adsorption pad 171 to the substrate P1 is released and the pressurized gas is stopped from the plurality of guides 65 Of squirting. Accordingly, the substrate P1

After being mounted on the plurality of guides 65, the substrate guide device 62 that supports the substrate P1 is driven in the +X direction. In addition, as long as the substrate unloading device 170 can transfer the substrate P1 to the substrate guide 62 at the position shown in FIG. 38(B), it is not necessary to move the substrate guide 62 to the substrate stage 120a side in advance (it may not be possible mobile). Also, on the substrate stage 120a, a plurality of guides 48b are driven to rise, and the lower surface of the substrate P2 is pressed from below. At the loading arm 83, the suction holding of the substrate P2 is released, and accordingly, the substrate P2 is separated from the loading arm 83. Also, the loading arm 83 may be lowered to deliver the substrate P2 to the plurality of guides 48b.

When the substrate P2 is separated from the loading arm 83, as shown in FIG. 39(A), the loading arm 83 is driven in the +X direction to withdraw from above the substrate replacement position and return to the upper position of the substrate guide 62. Also, at the port portion 60, the plurality of guides 65 are driven to slightly lower. Next, as shown in FIG. 39(B), a plurality of guides 48b are driven to descend on the substrate stage 120a, and the substrate P2 is loaded on the substrate holder 30b. In the port section 60, the transfer arm 19 of the substrate transfer robot is inserted under the substrate P1.

Thereafter, as shown in FIG. 40(A), the substrate P2 is sucked and held by the substrate holder 30b, and the X coarse movement stage 123X is driven away from the port portion 60 for the alignment operation, exposure operation, etc. of the substrate P2. Of direction. In the port section 60, the substrate P1 is recovered from the port section 60 by the transfer arm 19 of the robot carrying the substrate out, and is transferred to an external device (not shown). In addition, the plural guides 65 are driven to rise. The substrate P3 is held by the transfer arm 18 of the substrate transfer robot.

Thereafter, as shown in FIG. 40(B), the substrate carrying robot 18 transports the substrate P3 above the plurality of guides 65, and as shown in FIG. 41(A), the substrate P3 is sent to the plurality of guides 65. Thereafter, as shown in FIG. 41(B), a plurality of guides 65 are driven to lower, and the board P3 is loaded on the loading arm 83 (returning to the state shown in FIG. 36(A)). At this time, the position of the loading arm 83 may be aligned (aligned) with the substrate P3 suspended on the plurality of guides 65. The above-mentioned alignment is performed, for example, while detecting the position of the end (edge) of the substrate P3 with an edge sensor, a camera, or the like, while pressing the plural places of the end of the substrate P3.

As described above, according to the seventh embodiment, since the substrate carrying-out device 170 is mounted on the substrate stage 120a, the Y coarse motion stage 123Y is in a stationary state during the scanning operation, so it does not affect the X coarse motion stage The 123X position control can control the X position of the substrate P with high accuracy during the scanning operation. In addition, since the substrate stage 120a has a structure in which the X coarse motion stage 123X and the fine motion stage 21 are mounted on the Y coarse motion stage 123Y having the substrate carry-out device 170 (the structure with the Y coarse motion stage 123Y at the bottom), Therefore, the maintenance of the substrate carrying-out device 170 is also easy. In addition, the substrate carrying-out device 170 moves the suction pad 171 (and the support member 172) only in the X-axis (single-axis) direction. Therefore, the structure and control are simple. For example, the cost is lower than that of a multi-joint robot arm. Furthermore, the substrate carrying-out device 170 can retract the suction pad 171 to the outside of the movable range of the substrate P in the X-axis direction. Therefore, even if the suction pad 171 and the substrate P (or the substrate holder 30b) are at the height position (Z position) The same can also prevent contact with each other.

In addition, since the system substrate stage 120a includes the substrate carrying-out device 170, only the substrate carrying-in device 80c for transferring the substrate P to the substrate stage 120a needs to be arranged in the port section 60. That is, in the seventh embodiment, during the replacement operation of the substrate held by the substrate stage 120a, it is only necessary to position the loading arm 83 of the substrate loading device 80c above the substrate stage 120a located at the substrate replacement position. It is assumed that compared with the case where a well-known substrate replacement device having a substrate carrying robot and a substrate carrying robot is provided in the port section 60, as shown in FIG. 34, even in the substrate holder 30b and the lens barrel platform 131 When the space between them is narrow, the substrate P can be easily replaced.

In addition, since the system substrate stage 120a includes the substrate carry-out device 170, the substrate carry-out operation from the substrate stage 120a can be performed regardless of the position (X position and/or Y position) of the substrate stage 120a. Therefore, as in the third embodiment described above, in the final irradiation area After the exposure is completed, before the substrate stage 120a reaches the substrate replacement position (including the movement of the substrate stage 120a), the unloading operation of the substrate P is started. Also, in the port portion 60, the guide surface of the substrate P formed by the plurality of guides 65 is set wider than the substrate P, so there is no need to strictly perform the process of the substrate stage 120a and the substrate guide 62 in the Y-axis direction Position alignment (when the substrate holder 30b moves diagonally with respect to the X axis, the unloading operation can be started). Therefore, the cycle time for substrate replacement can be shortened.

In addition, in the substrate lifting device 46b, since the Z actuator 47 for moving the guide 48b up and down is mounted on the X coarse motion stage 123X, it is assumed to be in the fine motion stage 21 (or the substrate holder 30b) Compared with the case where the Z actuator is installed, the micro-motion stage 21 can be made thinner and lighter, and a Z actuator with a long stroke in the Z-axis direction can be used. Therefore, the guide 48b can be driven with a long stroke.

"Eighth Embodiment"

Next, the eighth embodiment will be described using FIGS. 42 to 45. The substrate stage 120b of the eighth embodiment differs from the seventh embodiment in the configuration of the substrate holder 30a, the substrate lifting device 46a (not shown in FIG. 42. Refer to FIG. 43), and the substrate carrying-out device 270. In the following, members having the same configuration and function as those of the above-mentioned seventh embodiment will be given the same symbols (or common at the end) as those of the above-mentioned seventh embodiment, and their description will be omitted.

As shown in FIG. 42, the substrate holder 30 a of the substrate stage 120 b of the eighth embodiment is the same as the first embodiment except that the number of hole portions 31 a for the ejector pin 48 a is small and the notch 133 described later is formed. Since the form is the same, for the sake of convenience, the same reference numerals as those of the substrate holder 30a of the first embodiment are given here, and the description thereof is omitted. As can be seen from FIGS. 42 and 43, in the eighth embodiment, a total of 16 substrate jacking devices 46a are provided.

The substrate stage 120b has a substrate sliding device 180 for sliding the substrate P mounted on the substrate holder 30a relative to the substrate holder 30a in the Y-axis direction. Substrate sliding device As shown in FIG. 42, 180, for example, two are arranged at predetermined intervals in the X-axis direction. However, the number and arrangement of the substrate sliding devices 180 are not limited to this, and of course can be appropriately changed.

In the substrate holder 30a, as shown in FIG. 43, a notch 133 is formed at a position corresponding to the substrate sliding device 180. The notch 133 is formed to open on the upper surface side and the side surface side of the -Y side of the substrate holder 30a.

The substrate slider 180 includes a base 181, a Y linear guide 182, a Y slider 183, and a pressing pin 184. The base 181 is constituted by a flat plate-shaped member extending in a rectangular shape in the Y-axis direction, the +Y side end is inserted into the above-mentioned notch 133, and the -Y side end is moved from the -Y side end of the substrate holder 30a -Y side (outer side) protrudes. The lower surface of the base 181 is fixed to the substrate holder 30a. The Y linear guide 182 is fixed on the base 181. The Y slider 183 mechanically engages the Y linear guide 182 in a freely sliding manner. The pressing pin 184 is composed of a cylindrical member extending in the Z-axis direction, and is fixed to the Y slider 183. The Z position of the +Z side end of the pressing pin 184 is set to be more on the +Z side than the upper surface of the substrate holder 30a. The substrate sliding device 180 has an unillustrated Y actuator for driving the pressing pin 184 in the Y-axis direction. The pressing pin 184 is driven outside the substrate holder 30a shown in FIG. 43 and does not contact the substrate P The position and a portion shown in FIG. 45 are accommodated between the positions in the notch 133.

The substrate carrying-out device 270, as in the seventh embodiment described above, is mounted on the support member 172 of the X beam 125 on the +Y side through a pair of X linear guides 173, and is driven by the X linear motor 174 in the X axis direction with a predetermined stroke . As shown in FIG. 34, the suction pad 271 of the seventh embodiment described above is formed into a reverse L-shape in YZ cross section, and the substrate suction surface protrudes from the -Y side side surface of the support member 172 to the -Y side. The retainer 30b is partially repeated. On the other hand, as can be seen from FIGS. 42 and 43, the substrate of the adsorption pad 271 of the eighth embodiment adsorbs the face, It is arranged on the outer side (+Y side) of the substrate holder 30a, and when the substrate P is loaded on the substrate holder 30a, it moves in the X-axis direction without contacting the substrate P. In addition, the Z position of the upper surface (suction surface) of the suction pad 271 is set to be slightly -Z side (lower) than the upper surface (substrate mounting surface) of the substrate holder 30a.

Furthermore, in the seventh embodiment described above, as shown in FIG. 32, during the exposure process of the substrate P, the suction pad 271 is outside the movable range of the substrate P (substrate holder 30b) in the X-axis direction (specifically, , Except for the +X side) Standby. In contrast, in the eighth embodiment, as shown in FIG. 42, even when the substrate P is exposed to light, the suction pad 271 may be disposed on the substrate holder 30a. Within range of movement. Even in this case, when the substrate P (and the substrate holder 30a) is moved in the X-axis direction, the substrate P and the suction pad 271 are not in contact (see FIG. 43). In addition, the pressing pin 184 of the substrate sliding device 180 is located at the stroke end of the -Y side to avoid contact with the substrate P.

On the substrate stage 120b, the substrate P is carried out as shown in FIG. 45, and the substrate P is sprayed with pressurized gas from the substrate holder 30a to suspend the substrate P. At the substrate stage 120b, the pressing pin 184 of the substrate sliding device 180 is driven to the +Y side, and accordingly, the +Y side end of the substrate P protrudes from the +Y side end of the substrate holder 30a to the +Y side by a predetermined amount the amount. Next, the micro-motion stage 21 and the substrate holder 30a are lowered by the Z voice coil motor 29z (or by reducing the pressure in the air spring (not shown) included in the weight eliminating device 26). According to this, the substrate P is lowered while being suspended on the substrate holder 30a, and the +Y side and the -X side end portions are adsorbed and held by the suction pad 27 that is positioned under the substrate P in advance. In addition, in the eighth embodiment, the substrate jacking device 46a is used only for receiving the substrate P from the substrate carrying device 80c (not shown in FIG. 45. Refer to FIG. 35), and is not used for carrying out the substrate P.

Thereafter, as shown in FIG. 44, the suction pad 271 is driven in the +X direction, and the substrate P is carried out to the port portion 60 along the upper surface of the substrate holder 30 a (not shown in FIG. 44. Refer to FIG. 35 ).

In the eighth embodiment described above, since the suction pad 271 does not need to wait outside the movable range of the substrate P in the X-axis direction, the substrate P can be quickly moved out after the exposure process is completed. Therefore, the cycle time for substrate replacement can be shortened. In addition, although the eighth embodiment has described the case where the substrate holder 30a is driven to lower the substrate P and the suction pad 271, it is not limited to this, and the suction pad 271 may be provided in the substrate carrying-out device 270. The driving device driven in the vertical direction drives the suction pad 271 to contact the substrate P with the suction pad 271. In addition, the substrate sliding device 180 may be provided on the fine movement stage 21 or the X coarse movement stage 123X.

In addition, the configuration of the above-mentioned seventh and eighth embodiments can be appropriately changed. For example, in the seventh embodiment described above, as shown in FIG. 34, the suction pad 171 of the substrate carrying-out device 170 is pre-arranged to protrude from the support member 172 to the substrate holder 30b side so that the substrate P and the substrate holder 30b can be inserted between. However, for example, the substrate stage 120c of the fourth modification shown in FIG. 46 may be exposed to the substrate P by mounting the Y driving device 375 that drives the suction pad 371 in the Y-axis direction on the support member 172. At the same time, the suction pad 371 is withdrawn from the substrate P and inserted only between the substrate P and the substrate holder 30b only when the substrate P is carried out. In the seventh embodiment described above, when the substrate P is sent to the port, as shown in FIG. 37(B), after the substrate P is separated from the upper surface of the substrate holder 30b, the suction pad 171 must be held by the substrate P and the substrate The substrate 30b is moved to a position where the substrate P can be adsorbed. However, as shown in FIG. 46, the substrate carrying-out device 370 can move the adsorption pad 371 to adsorb the substrate while the substrate P is mounted on the substrate holder 30b. The position near the -X side and +Y side end of P. Therefore, the time required for carrying out the substrate can be shortened.

In addition, the configuration of the substrate lifting device for lifting the substrate P from the substrate holder 30b is not limited to that described in the seventh embodiment. For example, a plurality of substrate lifting devices 140 included in the substrate stage 120d of the fifth modification shown in FIG. 47 each include a base member 141 accommodated in the X groove 31b1, and are mounted on the base at predetermined intervals in the X-axis direction A plurality of (for example, six) porous members 142 on the upper surface of the member 141, and a pair of Z actuators 143 (not shown in FIG. 47) that drive the base member 141 in the Z axis direction (up and down). Refer to FIG. 48(A )). The base member 141 is composed of a rod-shaped member extending in the X-axis direction, and the longitudinal dimension is set to the same extent as the longitudinal dimension of the substrate P (not shown in FIG. 47. Refer to FIG. 50(B)) (this section 5 is slightly shorter in the modification).

As shown in FIG. 48(B), for example, as shown in FIG. 48(B), the substrate lifting device 140 is provided with, for example, five sets at predetermined intervals (intervals corresponding to a plurality of X grooves 31b1 formed in the substrate holder 30b). In addition, the number of X grooves 31b1 in the substrate holder 30b of the fifth modification and the point where the X grooves 31b1 are not opened at the +X side and -X side end of the substrate holder 30b are different from those in the seventh embodiment described above. For the sake of convenience, the same symbols as the seventh embodiment described above are used.

As shown in FIG. 48(A), the lower surface of the base member 141 and the two ends of the base member 141 in the longitudinal direction are fixed with leg portions 144 extending in the Z-axis direction, respectively. A through hole 31b2 penetrating the substrate holder 30b in the vertical direction is formed on the bottom surface for defining the X groove 31b1, and the leg portion 144 is inserted into each of the pair of through holes 31b2. Between the wall surface defining the X groove 31b1 and the base member 141 and between the wall surface defining the through-hole 31b2 and the leg portion 144, when the micro motion stage 21 is slightly driven relative to the X coarse motion stage 123X A gap that does not touch each other.

A pair of Z actuators 143 are fixed to the upper portion of the X coarse motion stage 123X, and correspond to the respective portions of the pair of leg portions 144 described above. The Z actuator 143 may use an air cylinder or the like. Coarse motion stage in X Near the Z actuator 143 above the 123X, a stay 145 composed of an L-shaped member is fixed. The base member 141 functions as a Z linear guide composed of a Z linear guide 146 fixed to the foot 144 and a Z slider 147 mounted on the support rod 145, as shown in FIG. 48(C), relative The X coarse motion stage 123X is guided straight in the Z axis direction (up and down direction).

Here, the base member 141 is formed as a hollow as shown in FIG. 49(A), and a plurality of holes are formed on the upper surface. The porous member 142 (not shown in FIG. 49(A). Refer to FIG. 47) is installed so as to block the plurality of holes. In the base member 141, pressurized gas is supplied from the outside of the substrate holder 30b (not shown in FIG. 49(A). Refer to FIG. 47) through the pipeline member 148, and passes through the plurality of holes and the porous member 142 to the substrate P Pressurized gas is sprayed underneath. In addition, as shown in FIG. 49(A), the pipeline member 148 may be formed with one leg portion 144 hollow and connected to the base member 141, and connected to the one leg portion 144, as shown in FIG. 49(B). As shown, it is connected to one end of the base member 141 in the longitudinal direction. In addition, the porous member 142 may not be attached to the base member 141. That is to say, the surface of the base member may not be formed as a porous throttling air bearing, but a surface throttling or orifice (orifice) throttling formed by hole or groove processing, or a composite throttling combining these Air bearing (integral forming).

On the substrate stage 120d, as shown in FIG. 50(A), in a state where the driving base member 141 is raised, the loading arm 83 of the substrate loading device 80c transports the substrate P above the substrate holder 30b (the substrate P can also be After being transported above the substrate holder 30b, the base member 141 is driven to rise), and then, as shown in FIG. 50(B), the loading arm 83 is driven to be lowered and driven in the +X direction (direction separated from the substrate holder 30b) (also It is possible to further drive the base member 141 to ascend without driving the loading arm 83 down, and deliver the substrate P to the substrate jacking device 140. Thereafter, as shown in FIG. 50(C), the base member 141 is driven to lower, and the substrate P is mounted on the upper surface of the substrate holder 30b. also, When the substrate P is carried out, as shown in FIG. 50(D), the base member 141 is driven to rise, and the pressurized gas is ejected from the porous member 142 to the lower surface of the substrate P with the substrate P separated from the upper surface of the substrate holder 30b. Thereafter, the substrate P is carried out by the substrate carrying-out device 170 (not shown in FIG. 50(D). Refer to FIG. 33 etc.).

According to this fifth modification, it is only necessary to connect one pressurized gas supply line to one base member 141, so the structure of the device is simple (in contrast to this, the above seventh embodiment (refer to FIG. 34) requires a plurality of substrates Each guide member 48b of the jacking device 46b is individually connected to a pipeline for supplying pressurized gas). In addition, since there is no need to form a through hole in the fine movement stage 21, it is possible to prevent the rigidity of the fine movement stage 21 from decreasing. In addition, even when the Z actuator 143 cannot be arranged under the micro-motion stage 21 (for example, when the weight eliminating device 26 is large), it can be used appropriately. In addition, in the fifth modification, although one base member 141 is provided, for example, two Z actuators 143 separated in the X-axis direction, it is not limited to this, and for example, the 2Z actuator 143 may drive all plural actuators Base member 141. In addition, the substrate lifting device 140 of the fifth modification can also be applied to a substrate stage device that does not have a substrate carry-out device (for example, when the substrate carry-out device is arranged on the port side).

Moreover, in the above-mentioned fifth modification, as in the sixth modification shown in FIG. 51(A), it may be connected and stretched near the both end portions of the base member 141 and further outside (end portion side) than the leg portion 144. One end of the coil spring 149. The middle portion of the tension coil spring 149 is inserted into the through hole 31c formed in the substrate holder 30b, and the other end is connected to the support rod 145 (that is, the X coarse motion stage 123X). According to this, as shown in FIG. 51(B), when the base member 141 is driven to rise, near the both end portions of the base member 141, the base near the connecting portion of the base member 141 and the leg portion 144 acts as a center The moment at which the end of the member 141 drops downward. In this way, it is possible to suppress the longitudinal direction of the base member 141 The deflection caused by the central department's own weight.

In addition, the configuration of the substrate carrying-out device 170 that carries the substrate P out of the substrate holder 30b can also be appropriately changed. In Fig. 52, a substrate stage 120e according to a seventh modification is shown. In the substrate stage 120e, the X beam 425 is narrower than the seventh embodiment (see FIG. 31 etc.) (the height dimension is longer than the width dimension), and constitutes an X linear motor 128 for driving the X coarse motion stage 123X The magnet unit 128a is fixed on both sides of the X beam 425. In addition, a pair of X brackets 129 are fixed to the pair of X beams 425 below the X coarse motion stage 123X. The X bracket 129 is composed of a member with a reverse U-shaped YZ cross section, and a corresponding X beam 425 is inserted between a pair of opposed surfaces. A coil unit 128b is fixed to the opposing surface of one of the X brackets 129, facing the magnet unit 128a.

In the substrate carrying-out device 470, the support member 172 supporting the suction pad 171 is composed of a fixed portion 176b fixed to the Y coarse motion stage 123Y, and a movable portion fixedly opposed to the fixed portion 176b near the lower end of the support member 172 The X drive unit 176 of 176a is driven in the X axis direction with a predetermined stroke. On the substrate stage 120e, connect the Y bracket 126 and the auxiliary bracket 126a (not shown in FIG. 52. Refer to FIG. 33) of the pair of X beams 425 near the +X side end to the +Y side The side of the +Y side of the X beam 425 protrudes from the +Y side. The fixing portion 176a is composed of a member extending in the X-axis direction, and is laid on the vicinity of the +Y side end of each of the Y bracket 126 and the auxiliary bracket 126a. Although not shown, the X drive unit 176 includes elements for driving the support member 172 in the X axis direction with a predetermined stroke (for example, the fixed and movable elements of the X linear motor, the guide and the slide of the X linear guide device) ). According to this, as in the seventh embodiment described above, the support member 172 is driven in the X-axis direction by a stroke equal to the length of the substrate P in the X-axis direction. Further, as in the substrate stage 120f of the eighth modification shown in FIG. 53, the fixing portion 176b of the X drive unit 176 of the substrate carry-out device 570 may be fixed to the X bracket 129.

In addition, in the above-mentioned substrate stages 120e and 120f, the substrate lifting device that separates the substrate P from the substrate holder 30b is omitted in order to avoid the intricacy of the drawing, but the substrate top of the seventh embodiment described above can be used Any one of the lifting device 46b (see FIG. 33), the substrate lifting device 46a (see FIG. 43) of the eighth embodiment, and the substrate lifting device 140 (see FIG. 48) of the fifth modification.

In addition, the configuration of the liquid crystal exposure device is not limited to those described in the first to eighth embodiments (including the first to eighth modifications. The same applies hereinafter), and can be modified as appropriate. For example, in the seventh and eighth embodiments (including the fourth to eighth modifications described above. The same applies hereinafter), each of the substrate carrying-out devices 170 to 570 is on the outer surface of the X-beam 125 on the +Y side (Y coarse motion) One of the sides of the stage 123Y) is installed, but the number and arrangement of the substrate carrying-out devices 170 to 570 are not limited to this, for example, a plurality of (for example, 2) can be arranged at predetermined intervals in the X-axis direction on the outer side of the X beam on the +Y side The support member 172 and the suction pad 171 respectively hold a plurality of different positions of the substrate P separated in the X-axis direction. In addition, it is also possible to additionally mount the substrate carrying-out devices 170 to 570 on the X beam 125 on the -Y side to keep the vicinity of the end on the -Y side (or only the -Y side) in addition to the vicinity on the +Y side end of the substrate P Near the end).

Moreover, in the above-mentioned third to eighth embodiments, only the substrate carrying-out devices 70a to 570 included in the substrate stages 20c to 120f are used to carry out the substrate P to the port section 60, but it may also be parallel to the port section, for example 60 is also provided with a substrate carrying-out device, and the substrate P is carried out from the substrate holders 30a, 30b in a state where the substrate P is carried out by a predetermined amount (for example, about one-half of the above-mentioned and eighth embodiment), and the substrate P is carried out. In this case, the stroke of the suction pads 77a1 to 371 on the substrate stage 20c to 120f side in the X-axis direction can be shortened.

In addition, in the third to eighth embodiments described above, the transfer (transfer in and out) of the substrate P between each of the substrate stages 20c to 120f and the port section 60 can be performed using, for example, the US The substrate supporting member that supports the substrate P from below is disclosed in No. 6,559,928. In this case, the substrate carrying-out devices 70a to 570 can also be used to drive the substrate supporting member to carry out the substrate P from the substrate stages 20c to 120f in the same manner as in the third to eighth embodiments. In addition, although the substrate carrying-out apparatuses 70a to 570 of the third to eighth embodiments described above hold the substrate P by vacuum suction, it is not limited to this, and it may be held by other holding (for example, mechanical holding) methods.

In the first to eighth embodiments described above, the plurality of substrate jacking devices 46a and 46b are arranged on the Y coarse motion stage 23Y or the X coarse motion stage 123X, but it is not limited to this, and may be built in Inside the substrate holders 30a, 30b, or the micro-movement stage 21.

In addition, in the substrate stage of the second and fourth to sixth embodiments (including the first to third modified examples), the substrate lifting device of the fifth modified example can be used instead of a plurality of substrate lifting devices 46b 140. In addition, in the substrate stage of the above-mentioned first and third embodiments, instead of the plurality of substrate jacking devices 46a, a plurality of jacking pins 48a may be mounted on the one like the substrate jacking device 140 of the fifth modification described above The substrate of the base member 141 lifts the device.

In addition, in the first to eighth embodiments described above, although the lower surface of the substrate P is sucked and held by the adsorption pad, the device for holding the substrate P is not limited to this, and may be, for example, a clamping device that mechanically holds the substrate P . In addition, in the above third to eighth embodiments, the device for driving the substrate is not limited to those that move in the Y-axis direction like the above-mentioned suction device. For example, a roller that can abut on the outer peripheral surface of the substrate can be provided by using the roller According to the rotation, the substrate is sent out from the substrate holder.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum violet such as F2 laser light (wavelength 157 nm). Outside light. In addition, as the illumination light, a single-wavelength laser light such as an infrared band or a visible band emitted from a DFB semiconductor laser or an optical fiber laser, for example, an optical fiber amplifier doped with erbium (or both erbium and ytterbium) may be used. Increased amplitude, using nonlinear optical crystallization and wavelength conversion into harmonics of ultraviolet light. Furthermore, solid laser (wavelength: 355 nm, 266 nm) or the like can also be used.

In addition, although the first and second embodiments described above describe the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units, the number of projection optical units is not limited to this. As long as there is more than one. In addition, the projection optical system is not limited to the multi-lens system, and may be, for example, a projection optical system using an Ofner type large-scale mirror. Furthermore, in the above embodiment, the case where the projection magnification is used as the projection magnification is the same as the projection optical system PL, but the invention is not limited thereto, and the projection optical system may be any of the reduction system and the enlargement system.

In addition, in the first and second embodiments described above, although a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern or dimming pattern) is formed on a light-transmitting mask substrate is used, it may be substituted A photomask, for example, an electronic photomask (variable shape photomask) that forms a transmission pattern, a reflection pattern, or a light-emitting pattern according to the electronic data of the pattern to be exposed as disclosed in US Patent No. 6,778,257, for example, a non-light-emitting type DMD (Digital Micro-mirror Device), which is a kind of image display device (also known as spatial light modulator), is a variable-shaped mask.

In addition, as an exposure device, it is particularly effective for an exposure device that exposes a substrate having a size (including at least one of an outer diameter, a diagonal line, and at least one side) of 500 mm or more, such as a large substrate for a flat panel display such as a liquid crystal display element.

In addition, as the exposure device, it is applicable to an exposure device of a step & repeat method and an exposure device of a step & stitch method. In addition, in the exposure device, The object carried out by the unloading device is not limited to the substrate or the like of the object to be exposed, but may also be a pattern holder (original) such as a photomask.

In addition, the application of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate, but can also be widely applied to, for example, exposure devices for semiconductor manufacturing, thin film magnetic heads, micromachines, and DNA Exposure device for wafers, etc. In addition, not only micro-elements such as semiconductor element devices, the present invention can also be applied to the manufacture of photomasks or reticle used in light exposure devices, EUV exposure devices, X-ray exposure devices, electronic exposure devices, etc. The circuit pattern is transferred to an exposure device such as a glass substrate or silicon wafer. Furthermore, the object to be exposed is not limited to a glass plate, but may also be other objects such as wafers, ceramic substrates, thin film members, or mask blanks. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included.

Electronic components such as liquid crystal display elements (or semiconductor elements) are designed through the functional performance of the device, the steps of making a photomask (or reticle) according to this design step, and the steps of making a glass substrate (or wafer) 1. The photolithography step of transferring the photomask (reticle) pattern to the glass substrate, the development step of developing the exposed glass substrate, and the part where the resist remains The exposed parts of the outer part are manufactured by an etching step for removing by etching, a resist removing step for removing resist that is not necessary for etching, an element assembling step, an inspection step, and the like. In this case, since the exposure method is performed using the exposure apparatus of the above embodiment in the lithography step to form the device pattern on the glass substrate, it is possible to manufacture a high-integration device with good productivity.

In addition, the disclosure of the U.S. patent and U.S. patent application publication specification concerning the exposure device and the like cited in the above description is incorporated as part of the description of this specification.

Industrial availability

As described above, the object replacement system and method of the present invention are suitable for replacing objects held by an object holding device. Furthermore, the object carrying-out method of the present invention is suitable for carrying objects out of the object holding device. Furthermore, the object holding device of the present invention is suitable for carrying out objects. Moreover, the exposure device of the present invention is suitable for exposing objects. Furthermore, the manufacturing method of the flat panel display of the present invention is suitable for the manufacture of flat panel displays. Furthermore, in addition, the device manufacturing method of the present invention is suitable for the manufacture of micro devices.

18.19‧‧‧Transport arm

20a‧‧‧substrate carrier

23Y‧‧‧Y coarse motion stage

30a‧‧‧Substrate holder

32‧‧‧Notch

46a‧‧‧Substrate jacking device

80a‧‧‧substrate carrying device

83‧‧‧ Loading arm

98‧‧‧Adsorption pad

90‧‧‧ Port Department

92‧‧‧Guide

93‧‧‧Substrate carrying out device

96‧‧‧Z actuator

95‧‧‧X Travel Guide

97‧‧‧X slide

P0, P1, P2‧‧‧ substrate

Claims (18)

An object replacement system for replacing an object loaded on an object loading surface of an object holding member of an object holding device, which includes: a transport device that transports the object above the object loading surface on which the first object is loaded and A second object that is different from the first object; a carry-out device that removes the first object loaded on the object loading surface from the object loading surface; and a carry-in device that removes the conveying device above the object loading surface Accept the second object and carry the second object into the object loading surface where the first object has been carried out; the object holding member has a levitation support portion that suspends and supports the first object on the object loading surface; the The unloading device unloads the first object suspended and supported from the object loading surface. An object replacement system according to item 1 of the patent application further includes a guide provided in the object holding device and guiding the first object carried out by the unloading device. For example, in the object replacement system of claim 2, the first object is moved using the object holding member as the guide and the object loading surface as the guide surface. For example, in the object replacement system of claim 2, the guide is provided in the carrying-in device; the guide is used to receive the second object from the conveying device. For example, in the object replacement system of claim 4, the guide is arranged to move between a protruding position protruding from the object loading surface and a storage position stored in the object holding member; The first object moves on the guide located at the protruding position. An object replacement system as claimed in item 5 of the patent application, wherein the guide supports the first object in a non-contact manner. The object replacement system according to any one of the items 1 to 6 of the patent application range, wherein the unloading device moves the first object along a two-dimensional plane parallel to the object loading surface. An object replacement system as claimed in item 7 of the patent scope, wherein the conveying device moves the second object along a two-dimensional plane parallel to the object loading surface; the carrying-in device has a The movable member moving in the direction receives the second object from the conveying device using the movable member. An object replacement system as claimed in item 8 of the patent scope, wherein the conveying device has a support member that supports the second object; the support member has a notch that opens to the front side in the moving direction when the second object is carried in; the movable member , When inserted into the notch when receiving the second object from the transport device. An object replacement system as claimed in item 9 of the patent application, in which the conveying device is on one side and the other side of the support member in a direction orthogonal to the moving direction of the support member in a plane parallel to the two-dimensional plane Each has a guide member that guides the movement of the support member. An object replacement system as claimed in item 10 of the patent scope, wherein the delivery member for delivering the second object to the support member of the transport device from an external device is inserted and arranged on one side and the other side of the support member Between the guide members. An object replacement system according to any one of claims 1 to 6, wherein the object holding device includes an induction device that induces with a predetermined stroke along a two-dimensional plane parallel to the object loading surface; The carrying-in device is provided in the inducing device. The object replacement system according to any one of the patent application items 1 to 6, wherein the position of the object holding device when delivering the second object from the conveying device to the carrying-in device is performed, and the carrying-out device is performed When the first object is carried out, the position of the object holding device is the same. An object replacement method is to replace an object loaded on an object loading surface of an object holding member of an object holding device, which includes: transporting a different object from the first object above the object loading surface loaded with the first object The operation of the second object; the operation of carrying out the first object suspended and supported by the suspension support portion of the object holding member from the object loading surface; and using the carrying-in device provided in the object holding device to undertake being transported The operation of reaching the second object above the object holding member and carrying the second object into the object loading surface where the first object has been carried out. For example, in the object replacement method of claim 14, the unloading operation uses the guide provided in the object holding device to unload the first object. For example, in the object replacement method of claim 15, the unloading is to move the first object with the object holding member as the guide and the object loading surface as the guide surface. For example, in the object replacement method of claim 15, the guide is provided in the carrying-in device; the carrying-in takes the second object from the conveying device to the guide. An exposure device equipped with: an object replacement system according to any one of patent application items 1 to 13; and A patterning device that forms a predetermined pattern with an energy beam on the object held by the object holding device.

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