KR102097123B1 - Substrate-replacement method - Google Patents

Abstract

The substrate holder 30a is formed with an X groove 31x that accommodates the substrate tray 40a used for conveyance of the substrate P. Further, in the X groove 31 x, a substrate carrying device 70a is formed that presses the substrate tray 40a to move the substrate P together with the substrate tray 40a. For this reason, after the exposure process with respect to the board | substrate P is complete | finished, the removal operation of the board | substrate P can be started before the board | substrate stage 20a is located in the board | substrate exchange position for the exchange of the board | substrate P.

Description

Substrate exchange method {SUBSTRATE-REPLACEMENT METHOD}

The present invention relates to a method for carrying out an object, a method for exchanging an object, a method for holding an object, a method for manufacturing an exposure apparatus, a flat panel display, and a method for manufacturing a device, and more specifically, an object on the object holding device is provided with an object supporting member. An object holding device comprising at least a part of an object carrying out method, a method of exchanging an object on the object holding device including the method of carrying out the object, and an object carrying device for carrying out the object. It relates to an exposure apparatus having an object holding apparatus, a method of manufacturing a flat panel display using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display element, a semiconductor element (integrated circuit, etc.), mainly a step-and-repeat projection exposure apparatus (so-called stepper) or a step-and-step Scanning projection exposure devices (so-called scanning steppers (also called scanners)) are used.

As an exposure apparatus of this kind, it is known to carry in and out a glass plate or wafer (hereinafter referred to as "substrate"), which is an object to be exposed, to and from a substrate stage apparatus using a predetermined substrate transport apparatus (for example) , See Patent Document 1).

Here, in the exposure apparatus, when the exposure process for the substrate held in the substrate stage device is finished, the substrate is taken out from the substrate stage, and another substrate is conveyed on the substrate stage, whereby exposure processing is continuously performed on a plurality of substrates It is carried out. Therefore, when the exposure process is continuously performed on a plurality of substrates, it is preferable to promptly carry out the substrates from the substrate stage device.

U.S. Patent No. 6,559,928

The present invention has been made under the above-described circumstances, and from the first point of view, an object holding member holding an object and an object holding device holding an object supporting member used for conveying the object from the object holding member And moving the object toward an object carrying position to be carried out, and initiating a carrying out operation of carrying out the object from the object holding member before the object holding device reaches the object carrying position. It is a way.

According to this, since the object carrying out operation starts before the object holding device reaches the object carrying out position, the object carrying out operation on the object holding member can be performed quickly.

According to the second aspect of the present invention, the object carrying out method according to the first aspect of the present invention is implemented, and another object supported by another object supporting member before the object holding device reaches the object carrying out position. To stand at a predetermined waiting position, and to carry the object and the object supporting member supporting the object from the object holding device while the object holding device is located at the object carrying position, and to be placed at the waiting position It is a method of exchanging an object on an object holding device comprising bringing the other object and the other object supporting member supporting the other object together on the object holding device.

According to a third aspect of the present invention, an object holding member for holding an object and an object supporting member used for conveying the object, and the object held by the object holding member and the object supporting member for supporting the object It is an object holding device provided with at least a part of a carrying device which is carried out from the object holding member together.

The present invention is an exposure apparatus comprising an object holding device according to a third aspect of the present invention and a pattern forming device for forming a predetermined pattern using an energy beam on the object, when viewed from the fourth aspect.

According to a fifth aspect of the present invention, an exposure apparatus for exposing an object by an energy beam to form a pattern on the object, comprising: an object holding member for holding the object and an object supporting member used for conveying the object, An object holding device having at least a part of a carrying device for carrying the object held by the object holding member and the object supporting member supporting the object together from the object holding member, and a predetermined energy using an energy beam to the object It is an exposure apparatus provided with the pattern forming apparatus which forms the pattern of.

In view of the sixth aspect, the present invention is a method of manufacturing a flat panel display comprising exposing the object using the exposure apparatus according to the fourth or fifth aspect of the present invention and developing the exposed object. .

In view of the seventh aspect, the present invention is a device manufacturing method comprising exposing the object using the exposure apparatus according to the fourth or fifth aspect of the present invention and developing the exposed object.

1 is a diagram schematically showing a configuration of a liquid crystal exposure apparatus of a first embodiment.
FIG. 2 (A) is a plan view of the substrate tray used in the liquid crystal exposure apparatus of FIG. 1, and FIG. 2 (B) is a side view of the substrate tray of FIG. 2 (A).
3 is a plan view of a substrate holder and a port portion of the liquid crystal exposure apparatus of FIG. 1.
Fig. 4 (A) is a plan view showing a state in which the substrate holder and the substrate tray are combined, and Fig. 4 (B) is a cross-sectional view taken along line AA in Fig. 4 (A).
5 is a plan view of the substrate carrying apparatus of the liquid crystal exposure apparatus of FIG. 1.
6 (A) to 6 (C) are views (1 to 3) for explaining the substrate carrying operation.
7 (A) and 7 (B) are diagrams (1 and 2 thereof) for explaining the substrate carrying out operation.
8 (A) to 8 (C) are views for explaining the substrate exchange operation on the substrate holder (1 to 3 thereof).
9 (A) is a plan view of the substrate tray according to the second embodiment, and FIG. 9 (B) is a side view of the substrate tray of FIG. 9 (A).
10 is a plan view of the substrate holder and the port portion according to the second embodiment.
11 (A) to 11 (C) are views for explaining the substrate carrying out operation of the second embodiment (parts 1 to 3).
12 is a plan view of the substrate holder and the port portion according to the third embodiment.
13 is a cross-sectional view of the substrate holder according to the fourth embodiment.
14 (A) is a plan view of the substrate holder according to the fifth embodiment, and FIG. 14 (B) is a view showing a state in which the substrate holder and the substrate tray of FIG. 14 (A) are combined.
15 (A) is a plan view of the substrate tray according to the sixth embodiment, and FIG. 15 (B) is a state in which the substrate tray of FIG. 15 (A) and the substrate holder according to the sixth embodiment are combined. It is a drawing shown.
16 is a plan view of the substrate holder and the port portion according to the sixth embodiment.
17 (A) is a plan view of a substrate tray, a substrate holder, and a port portion according to a seventh embodiment, and FIG. 17 (B) is a diagram for explaining the substrate unloading operation in the seventh embodiment to be.
18 is a plan view of a port portion according to the eighth embodiment.
19 is a view for explaining the operation of the substrate at the time of carrying out the substrate in the eighth embodiment.

<< first embodiment >>

Hereinafter, 1st Embodiment is demonstrated using FIGS. 1-8 (C).

1, the structure of the liquid crystal exposure apparatus 10 of 1st Embodiment is schematically shown. The liquid crystal exposure apparatus 10 is a projection exposure using, for example, a rectangular (rectangular) glass substrate P (hereinafter simply referred to as the substrate P) used for a liquid crystal display (flat panel display) or the like as an object to be exposed. Device.

In the liquid crystal exposure apparatus 10, a resist (sensitizer) is applied to the illumination system (IOP), the mask stage (MST) holding the mask M, the projection optical system (PL), and the surface (the surface facing the + Z side in FIG. 1). And a substrate stage device (PST) for holding the coated substrate (P), a substrate carrying device (50), a port portion (60a) for transferring substrates between external devices, and their control system. In the following, the direction in which the mask M and the substrate P are respectively scanned relative to the projection optical system PL during exposure is the X-axis direction, and the direction orthogonal to the X axis in the horizontal plane is the Y-axis direction, Description will be given with the directions perpendicular to the X and Y axes as the Z axis directions, and the rotation directions of the X axis, Y axis, and Z axis rotations as θx, θy, and θz directions, respectively. In addition, description will be given with the X-axis, Y-axis, and Z-axis positions as X positions, Y positions, and Z positions, respectively.

The illumination system IOP is configured in the same manner as the illumination system disclosed in, for example, US Patent No. 6,552,775. That is, the illumination system (IOP), the light emitted from a light source (for example, a mercury lamp) not shown, through a reflector, dichroic mirror, shutter, wavelength selection filter, various lenses, etc., not shown, respectively, The mask M is irradiated as the exposure illumination light (illumination light) IL. As the illumination light IL, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), light such as h-line (wavelength 405 nm) (or synthetic light of the i-line, g-line, h-line) ) Is used.

In the mask stage MST, a mask M having a circuit pattern or the like formed on the pattern surface thereof is adsorbed and held by, for example, vacuum adsorption. The mask stage MST is mounted on the tube holder 16 which is a part of the apparatus body (body), and is predetermined in the scanning direction (X-axis direction) by, for example, a mask stage drive system (not shown) including a linear motor. While being driven by the long stroke, it is appropriately micro-dried in the Y-axis direction and the θz direction. The position information (including rotation information in the θz direction) in the XY plane of the mask stage MST is obtained by a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is disposed below the mask stage MST, and is supported by the tube holder 16. The projection optical system PL is configured in the same manner as the projection optical system disclosed in, for example, US Patent No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection regions of the pattern image of the mask M are arranged in a zigzag manner, and is a rectangular shape with the Y-axis direction as the longer direction. It functions equally to a projection optical system having a single image field of. In the present embodiment, for each of the plurality of projection optical systems, for example, one that forms an erect top with a telecentric equal magnification system on both sides is used.

For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination is passed through the projection optical system PL by the illumination light IL passing through the mask M. A projected image (partially erected image) of the circuit pattern of the mask M in the region is formed in the irradiation region (exposure region) of the conjugated illumination light IL in the illumination region on the substrate P. Then, by synchronous driving of the mask stage MST and the substrate stage device PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the exposure area (illumination light IL )) By moving the substrate P relative to the scanning direction, scanning exposure of one shot region on the substrate P is performed, and the pattern formed in the mask M is transferred to the shot region. That is, in the present embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the sensitive layer (resist layer) on the substrate P by the illumination light IL is generated. ), The pattern is formed on the substrate P by exposure.

The substrate stage device PST includes a surface plate 12 and a substrate stage 20a disposed above the surface plate 12.

The surface plate 12 is formed of a rectangular plate-shaped member when viewed from a plane (as viewed from the + Z side), and the top surface of the platen is finished very high. The platen 12 is mounted on a substrate stage stand 13 which is a part of the apparatus body. A substrate stage mount 13 is included, and the apparatus main body is mounted on the anti-vibration device 14 provided on the floor 11 of a clean room, whereby the mask stage MST, projection optical system PL, etc. The floor 11 is vibrated and separated.

The board | substrate stage 20a is mounted on the X coarse stage 23X, the X coarse stage 23X, and the Y coarse stage 23Y, Y which together with the X coarse stage 23X constitute a so-called gantry type XY2 axis stage device. The weight cancellation which supports the fine motion stage 21 from the bottom on the surface 12 of the fine motion stage 21 arrange | positioned on the + Z side (upper side) of the coarse motion stage 23Y, the board | substrate holder 30a holding the board | substrate P And a device 26 and the like.

The X coarse stage 23X is formed of a rectangular member having a Y-axis direction in a long direction when viewed from a plane, and an opening (not shown) in a long hole in the center of the Y-axis direction is formed in the central direction. It is done. The X coarse stage 23X is mounted on a guide member (not shown) that extends in the X-axis direction and is provided on the floor 11 separately from the apparatus body, for example, during a scan operation during exposure or a substrate exchange operation It is driven by a predetermined stroke in the X-axis direction by an X stage drive system including a linear motor or the like.

The Y coarse stage 23Y is formed of a rectangular member when viewed in a plan view, and an opening (not shown) is formed in the central portion thereof. The Y coarse stage 23Y is mounted on the X coarse stage 23X via a Y linear guide device 25, for example, a Y stage drive system including a linear motor or the like during Y stage operation during exposure. By this, it is driven on the X coarse stage 23X in a predetermined stroke in the Y-axis direction. Moreover, the Y coarse stage 23Y moves integrally with the X coarse stage 23X in the X-axis direction by the action of the Y linear guide device 25.

The fine movement stage 21 is made of a rectangular parallelepiped member having a substantially square height when viewed from a plane. The fine motion stage 21 is a fine motion stage drive system including a plurality of voice coil motors (or linear motors) comprising a stator fixed to the Y coarse stage 23Y and a mover fixed to the fine motion stage 21. The coarse stage 23Y is micro-driven in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz directions). In a plurality of voice coil motors, a plurality of X voice coil motors 29x and fine movement stages 21 in which the fine movement stage 21 is micro-driven in the X-axis direction (overlapping in the ground direction in FIG. 1), the fine movement stage 21 in the Y-axis direction A plurality of Y voice coil motors (not shown) that are micro-driven in a microscopic manner, and are arranged at positions corresponding to four corners of the micro-driven stage 21 (for example, a micro-driven stage in which the micro-movement stage 21 is micro-driven) ) Z voice coil motor 29z is included.

Further, the fine movement stage 21 is guided to the Y adjustment stage 23Y via the plurality of voice coil motors, so that the XY plane is arranged in the X axis direction and / or the Y axis direction together with the Y adjustment stage 23Y. It moves according to a predetermined stroke. The positional information in the XY plane of the fine movement stage 21 is fixed to the movement stage (X movement mirror 22x having a reflective surface orthogonal to the X axis) and the Y axis fixed to the movement stage 21 via a mirror base 24. An X interferometer for measuring the X position of the fine movement stage 21 using an X-axis interferometer (X-shift mirror 22x) for irradiating a measurement beam onto a Y-shift mirror (not shown) having an orthogonal reflecting surface, It is calculated | required by the substrate interferometer system including the Y interferometer which measures the Y position of the fine movement stage 21 using a Y moving mirror. The configuration of the fine motion stage drive system and the substrate interferometer system is disclosed, for example, in US Patent Application Publication No. 2010/0018950.

The substrate holder 30a is formed of a rectangular parallelepiped member having a low quadrangular height when viewed in a plane in which the X-axis direction is the longer direction, and is fixed on the upper surface of the fine movement stage 21. A plurality of hole portions (not shown) are formed on the upper surface of the substrate holder 30a. The board | substrate holder 30a is connected to the holding device formed outside, and it is made to be able to hold and hold the board | substrate P by the holding device. The structure of the substrate holder 30a will be described in detail later.

The weight canceling device 26 is composed of one columnar member extending in the Z-axis direction (also called a core), and through a device called a leveling device 27, the central portion of the fine movement stage 21 is viewed from below. I support it. The weight canceling device 26 is inserted into the opening of each of the X coarse stage 23X and the Y coarse stage 23Y. The weight canceling device 26 is floated through a small clearance on the surface 12 via a plurality of air bearings 26a attached to the lower surface. The weight canceling device 26 is connected to the Y adjustment stage 23Y via a plurality of connecting devices 26b at a center height position in the Z-axis direction, and is pulled to the Y adjustment stage 23Y, thereby The Y-movement stage 23Y moves along the platen 12 in the Y-axis direction and / or the X-axis direction.

The weight canceling device 26 has, for example, an air spring (not shown), and the fine movement stage 21, the leveling device 27, and the substrate holder 30a are driven by the vertical upward force generated by the air spring. The weight of the back (force in the downward direction in the vertical direction) is canceled, thereby reducing the load of the plurality of voice coil motors of the fine motion stage drive system. The leveling device 27 supports the fine movement stage 21 from the lower side so as to be able to swing (tilt operation) with respect to the XY plane. The leveling device 27 is non-contactly supported from below by the weight canceling device 26 via an air bearing (not shown). The detailed configuration and operation of the weight canceling device 26, including the leveling device 27 and the connecting device 26b, are disclosed, for example, in US Patent Application Publication No. 2010/0018950, and the like.

Here, in the liquid crystal exposure apparatus 10, the carrying (loading) of the substrate P to the substrate holder 30a and the carrying out (unloading) of the substrate P from the substrate holder 30a are the substrate P ) Is carried out by mounting on a member called the substrate tray 40a shown in Figs. 2A and 2B.

The substrate tray 40a includes a plurality of support members 41, a connecting member 42, a plurality of reinforcing members 43, and the like, as shown in Fig. 2A. The support member 41 is formed of a rod-like member extending in the X-axis direction, and the shape of the cross section (YZ cross section) orthogonal to the long direction is rectangular. The plurality of support members 41 are arranged parallel to each other at substantially equal intervals in the Y-axis direction. As shown in FIG. 5, the dimension in the longitudinal direction of the support member 41 is set slightly longer than the dimension in the X-axis direction of the substrate P, and the substrate tray 40a includes a plurality of support members 41 The substrate P is supported from below using. On the upper surface of each of the plurality of support members 41, a plurality of small hole portions (not shown) are formed, and the substrate P can be adsorbed and held through the plurality of hole portions. Moreover, although the board | substrate tray 40a of this 1st Embodiment shown in FIG. 2 (A), FIG. 4, FIG. 5 etc. has three support members 41 as an example, the number of support members 41 is, It is not limited to this, For example, it can be suitably changed according to the size, thickness (easy to bend) of the substrate P, and the like.

2 (B), the taper member 44a which has a tapered surface tapering toward the + X side from the -X side (end of the cone target member) at the + X side end of each of the plurality of support members 41 Is attached. Further, a tapered member 44b having a tapered surface tapering from the + X side to the -X side is attached to the end portion of the -X side of each of the plurality of support members 41.

2 (A) and 2 (B), the connecting member 42 is formed of a rod-shaped member having an XZ cross-section square extending in the Y-axis direction. As for the connecting member 42, the lower part is fitted in the recess formed in the upper surface in the vicinity of the + X side edge part of each of the several support members 41, and the several support members 41 are connected to each other. Each of the plurality of reinforcing members 43 is formed of a rod-shaped member having an XZ cross-section square extending in the Y-axis direction, and the thickness is set to be thinner than that of the supporting member 41. As shown in Fig. 2 (B), a recess is formed on each of the plurality of support members 41 at a predetermined interval in the X-axis direction, and a reinforcing member 43 fits into each of the plurality of recesses. It is done. The depth of the concave portion to which the reinforcing member 43 fits is set so that the upper surface of the reinforcing member 43 is located on the -Z side (or the same Z position) than the upper surface of the supporting member 41. The overall rigidity of the board | substrate tray 40a is improved by the intermediate part of the longitudinal direction of the some support member 41 being mutually connected by the some reinforcement member 43.

In addition, among the plurality of support members 41 (for example, three in the present embodiment), the central support member 41 is a cuboid projection 45a near the end of the -X side of the lower surface thereof. Have The function of the projection 45a will be described later.

As shown in Fig. 3, the upper surface (substrate mounting surface) of the substrate holder 30a corresponds to a plurality of supporting members 41 (see Fig. 2 (A)) of the substrate tray 40a. , A plurality of X grooves 31x extending in the X-axis (for example, three in the first embodiment) are formed at predetermined intervals in the Y-axis direction. The X groove 31x opens on the side of each of the + X side and -X side of the substrate holder 30a. The space | interval with respect to the Y-axis direction of the some X groove 31x is substantially the same as the space | interval with respect to the Y-axis direction of the some support member 41 of the board | substrate tray 40a shown in FIG. 2 (A). As shown in FIG. 4 (A), the support member 41 of the substrate tray 40a is accommodated in the X groove 31x while the substrate P is placed on the substrate holder 30a. Further, the length of the substrate holder 30a in the X-axis direction is set to be shorter than the length of the support member 41 in the X-axis direction, and the substrate tray 40a and the substrate holder 30a are combined. , The connecting member 42 is located outside the substrate holder 30a (+ X side than the + X side end portion of the substrate holder 30a), and the tapered members 44a, 44b are outside the substrate holder 30a, respectively. Overhanging.

Returning to FIG. 3, the Y groove 31y extending in the Y-axis direction corresponding to the plurality of reinforcing members 43 (see FIG. 2 (A)) of the substrate tray 40a on the upper surface of the substrate holder 30a ) A plurality (for example, three in the first embodiment) are formed at predetermined intervals in the X-axis direction. The intervals in the X-axis direction of the plurality of Y grooves 31y substantially coincide with the intervals in the X-axis direction of the plurality of reinforcing members 43 of the substrate tray 40a shown in Fig. 2A. As shown in 4 (A), the reinforcing member 43 of the substrate tray 40a is accommodated in the Y groove 31y while the substrate tray 40a and the substrate holder 30a are combined.

3, another X groove 31x other than the center X groove 31x among the plurality of X grooves 31x (in the first embodiment, two X grooves 31x on the + Y side and the -Y side) )) In each of them, a plurality of tray guide devices 32 (in the first embodiment, in one X groove 31x, at a predetermined interval in the X-axis direction, for example, three) are accommodated. As shown in Fig. 4 (B), the tray guide device 32 is formed by a Z actuator 34 and a Z actuator 34 accommodated in a recess 33 formed in a bottom surface defining the X groove 31x. It has a guide member 35 driven in the vertical direction (Z axis) in the X groove 31x. The type of the Z actuator 34 is not particularly limited, and for example, a cam device, a feed screw device, an air actuator, or the like, which converts a horizontal force into a vertical force can be used. The Z actuator 34 of each of the plurality of tray guide devices 32 is synchronously driven by a main control device (not shown). The guide member 35 is formed of a plate-like member parallel to the XY plane, and supports the supporting member 41 of the substrate tray 40a from below. On the upper surface of the guide member 35, a plurality of small hole portions (not shown) are formed, and pressurized gas (for example, air) is blown out from the hole part, and the support member 41 is interposed through a small clearance. It is intended to support injuries. In addition, the guide member 35 is capable of adsorbing and holding the support member 41 placed on the upper surface using the hole (or other hole).

Returning to FIG. 3, among the plurality of X grooves 31x, the substrate carrying device 70a is accommodated in the central X groove 31x. The substrate transport device 70a includes an X travel guide 71 and a pressing member 72a. The X travel guide 71 is made of a member extending in the X-axis direction, and is fixed to the bottom surface defining the X groove 31x. The length of the X travel guide 71 in the long (X-axis) direction is set to be longer than the dimension of the X-axis direction of the substrate holder 30a, and each of both ends in the long direction is outside the substrate holder 30a. Overhanging. As shown in Fig. 7 (A), the pressing member 72a is made of a member having an L-shaped XZ cross section, and a portion parallel to the XY plane is slidably engaged with the X travel guide 71 in the X-axis direction. And is driven on the X travel guide 71 in a predetermined stroke in the X axis direction. The type of the driving device for driving the pressing member 72a is not particularly limited, but, for example, an X linear motor comprising an stator of the X traveling guide 71 and a mover of the pressing member 72a, or an X traveling. It is possible to use a feed screw device comprising a feed screw of the guide 71 and a nut of the pressing member 72a.

As shown in FIG. 1, the substrate loading device 50 has a first conveying unit 51a and a second conveying unit 51b. The 1st conveyance unit 51a is arrange | positioned above the port part 60a mentioned later, and the 2nd conveyance unit 51b is the -X side of the 1st conveyance unit 51a, and exchanges the board | substrate P The substrate holder 30a when the substrate stage 20a moves to a position adjacent to the port portion 60a (a position on the + X side end portion of the surface plate 12, hereinafter referred to as a substrate exchange position) in order to perform the substrate holder 30a ). Moreover, the board | substrate exchange position carries out the board | substrate P which carries out the board | substrate P hold | maintained on the board | substrate holder 30a (substrate stage 20a) as mentioned later from the board | substrate holder 30a (substrate stage 20a). It can be changed to the location (the location where the object is taken out).

As shown in FIG. 5, the 1st conveyance unit 51a is a pair of X travel guides 52, a pair of X slide members 53 formed corresponding to a pair of X travel guides 52, and It has a holding member 54a temporarily installed between a pair of X slide members 53. The pair of X travel guides 52 are each made of members extending in the X-axis direction, and the dimension in the long direction is set slightly longer than the dimension in the X-axis direction of the substrate P. The pair of X travel guides 52 are arranged parallel to each other at a predetermined interval in the Y-axis direction (slightly wider than the Y-axis dimension of the substrate P). Each of the pair of X slide members 53 is slidably engaged in the X-axis direction with respect to the corresponding X travel guide 52, and actuators (not illustrated, for example, feed screw units, linear motors, and belt drives) are omitted. Device, etc.) to drive synchronously at a predetermined stroke along the X travel guide 52.

The holding member 54a is made of a member extending in the Y-axis direction, and a plurality of concave portions 55a are formed in a surface portion facing the -X side. The plurality of recesses 55a are formed in a plurality of predetermined intervals in the Y-axis direction (approximately the same as the intervals in the Y-axis direction of the plurality of tapered members 44a of the substrate tray 40a). The recess 55a is defined by a tapered surface narrowing from the -X side to the + X side, and the holding member 54a is a plurality of tapered members of the substrate tray 40a in the plurality of recesses 55a. 44a) By inserting each, the edge part of the + X side of the board | substrate tray 40a is hold | maintained. The pair of X travel guides 52, the pair of X slide members 53, and the holding member 54a are driven by a predetermined stroke in the Z axis direction by a Z actuator (not shown). Further, without changing the Z position of the pair of X travel guides 52 and the pair of X slide members 53, only the holding member 54a is in the Z-axis direction with respect to the pair of X travel guides 52 You may make it movable. The configuration of the second transfer unit 51b is except that the plurality of recesses 55b into which the tapered member 44b of the substrate tray 40a is inserted is formed on the + X side surface portion of the holding member 54b. And, since it is the same as the said 1st conveyance unit 51a, description is abbreviate | omitted.

The board | substrate carrying-in apparatus 50 is the state which hold | maintained the board | substrate tray 40a by the holding member 54a of the 1st conveying unit 51a, and the holding member 54b of the 2nd conveying unit 51b, and holding multiple By the synchronous drive of the X slide member 53, the substrate tray 40a can be moved between the upper portion of the port portion 60a and the upper substrate exchange position along the XY plane (horizontal plane). Moreover, the board | substrate carrying-in apparatus 50 is the upper direction of the port part 60a, or the upper side of a board | substrate exchange position because the 1st conveying unit 51a and the 2nd conveying unit 51b are synchronously driven in a Z-axis direction. The substrate tray 40a can be moved up and down in each of the regions.

Here, the loading operation of the substrate P with respect to the substrate holder 30a using the substrate loading device 50 will be described with reference to Figs. 6A to 6C. 6 (A) to 6 (C), for the sake of simplicity, members excluding the substrate holder 30a in the substrate stage 20a and holding members 54a in the substrate carrying device 50, The illustration of the member except 54b) is omitted, respectively. As shown in Fig. 6 (A), the substrate tray 40a held by the holding members 54a, 54b is conveyed above the substrate holder 30a located at the substrate exchange position. In the substrate stage 20a, the Y position is positioned such that the Y positions of the plurality of support members 41 (see FIG. 2 (A)) of the substrate tray 40a and the Y positions of the plurality of X grooves 31x generally coincide. Is decided. In the substrate holder 30a, the guide member 35 of each of the plurality of tray guide devices 32 is positioned such that its upper surface is located on the + Z side of the substrate holder 30a (from the upper surface of the substrate holder 30a). Position). Moreover, the pressing member 72a of the board | substrate carrying-out apparatus 70a is the position of the -X side of the movable range, and is located outside the board | substrate holder 30a. The length of the X travel guide 71 is set so that the pressing member 72a and the substrate tray 40a do not contact each other when the substrate is brought in.

From the state shown in Fig. 6 (A), the main control device, not shown, lowers the substrate tray 40a by driving each of the holding members 54a, 54b in the -Z direction (see the arrow in Fig. 6 (A)). Order. Thereby, as shown to FIG. 6 (B), the board | substrate tray 40a is transferred on the some tray guide apparatus 32, and is adsorbed-held by the some guide member 35. As shown in FIG. In the main control device, the substrate tray 40a is mounted on the guide members 35 of the plurality of tray guide devices 32, and the holding members 54a and 54b are separated from the substrate tray 40a. After driving (refer to the arrow in Fig. 6 (B)), as shown in Fig. 6 (C), it is driven upward (refer to the arrow in Fig. 6 (C)).

Further, in the substrate holder 30a, as shown in Fig. 6 (C), a plurality of guide members 35 are synchronously driven in the -Z direction (see arrows in Fig. 6 (C)). The tray 40a descends, and the substrate P is placed on the upper surface of the substrate holder 30a. Further, the plurality of guide members 35 are further driven in the -Z direction even after the substrate P is placed on the upper surface of the substrate holder 30a. Thereby, the lower surface of the board | substrate tray 40a and the board | substrate P are separated, and the board | substrate P is hold | maintained by the board | substrate holder 30a.

Returning to Fig. 1, the port portion 60a has a trestle 61 and a plurality of tray guide devices 62 (overlapping in the direction of the paper in Fig. 1; see Fig. 3). The mount 61 is provided on the floor 11 at a position on the + X side of the surface plate 12 and is housed in a chamber (not shown) together with the substrate stage device PST.

A plurality (for example, two in this embodiment) of the tray guide devices 62 is mounted on the mount 61 at a predetermined interval in the Y-axis direction, as shown in FIG. 3. In addition, although the port part 60a of this embodiment has two tray guide devices 62 as an example, the number of the plurality of tray guide devices 62 is not limited to this, For example, the board tray ( 40a) can be appropriately changed according to the number of the supporting members 41 (not shown in FIG. 3, see FIG. 2 (A)). Specifically, among the plurality of support members 41, the support member 41 (the central support member 41 in the first embodiment) having the projection 45a (see Fig. 2 (B)) is excluded. The tray guide device 62 is provided on the mount 61 in correspondence with the other support members 41. In the present embodiment, for example, the intervals in the Y-axis direction of the two tray guide devices 62 are as shown in FIG. 5, and the support member 41 on the most + Y side of the substrate tray 40a is displaced. -It is substantially the same as the spacing of the support member 41 on the Y side.

As shown in Fig. 1, the tray guide device 62 includes a base 63 made of a plate-like member extending in the X-axis direction, and a plurality (for example) mounted on the base 63 at predetermined intervals in the X-axis direction. It has a Z actuator 64 of three units, a plurality of guide members 65 driven by the Z actuator 64 in the vertical direction (Z axis), and the like. The base 63 is fixed to the plurality of X linear guide members 66 fixed to the upper surface of the mount 61 and the lower surface of the base 63, and engages so as to be able to slide freely on the X linear guide members 66. It is guided straight in the X-axis direction by the X linear guide device made of the X slide member 67. In addition, the base 63 is driven by a predetermined stroke in the X-axis direction by an X-illustrated X actuator (for example, a feed screw device, a linear motor, etc.). The type of the Z actuator 64 is not particularly limited, but, for example, a cam device, a feed screw device, an air actuator, or the like can be used. The Z actuator 64 of each of the plurality of tray guide devices 62 is synchronously driven by a main control device (not shown). The guide member 65 is made of a plate-like member parallel to the XY plane, and a supporting member 41 (see Fig. 2 (A)) of the substrate tray 40a is placed on the upper surface. On the upper surface of the guide member 65, a plurality of micro-holes (not shown) are formed, and a pressurized gas (for example, air) is blown out from the holes, and the substrate tray 40a is interposed through a micro clearance. It is intended to support injuries.

Here, the substrate tray 40a using the substrate carrying device 70a, and the transfer operation from the substrate holder 30a of the substrate P placed on the substrate tray 40a to the port portion 60a (substrate carrying out operation) ) Will be described with reference to FIGS. 7 (A) and 7 (B). 7 (A) and 7 (B), for the sake of simplicity, a member excluding the substrate holder 30a in the substrate stage 20a, and a part of the mount 61 in the port portion 60a Each of the cities is omitted. When the board | substrate P is taken out from the board | substrate holder 30a, in the board | substrate holder 30a, as shown to FIG. 7 (A), after the adsorption | maintenance hold | maintenance of the board | substrate P is released, a some tray guide apparatus ( 32) is synchronously driven, and the plurality of guide members 35 are driven in the + Z direction. Thereby, the board | substrate tray 40a rises and the board | substrate P is supported from below by the some support member 41. In addition, the main control device further moves the plurality of guide members 35 in the + Z direction even after the substrate P is supported on the substrate tray 40a. Thereby, the board | substrate P and the board | substrate tray 40a move integrally in the + Z direction, and the lower surface of the board | substrate P is separated from the upper surface of the board | substrate holder 30a. At this time, the main control device is the minimum necessary to separate the substrate P from the substrate holder 30a and to place the lower surfaces of the plurality of reinforcing members 43 on the + Z side of the upper surface of the substrate holder 30a. The guide member 35 is driven by a stroke. For this reason, the plurality of support members 41 of the substrate tray 40a are in a state where the lower half thereof is accommodated in the X groove 31x.

Further, in the port portion 60a, the plurality of tray guide devices 62 are driven in the -X direction (substrate stage 20a side), and the end of the -63 side of the base 63 is from the trestle 61- It is positioned at the protruding position on the X side. Further, the plurality of Z actuators 64 are such that the Z positions of the plurality of guide members 65 are substantially the same (or slightly -Z side) of the Z positions of the plurality of guide members 35 in the substrate holder 30a. Controlled.

Then, in the substrate holder 30a, the pressing member 72a of the substrate carrying device 70a is driven in the + X direction. The Z position (height) of the pressing member 72a is such that the substrate tray 40a is supported by a plurality of tray guide devices 32 in the substrate holder 30a in order to take out the substrate P, and the projection ( 45a). Therefore, when the pressing member 72a is driven in the + X direction, as shown in Fig. 7B, the substrate tray 40a is pressed against the pressing member 72a, and integrally + X with the pressing member 72a. Direction. In addition, in the port portion 60a, the tray guide device 62 is driven in the + X direction in conjunction with the substrate tray 40a moving in the + X direction.

At this time, the guide member 35 on the substrate holder 30a side and the guide member 65 on the port portion 60a side eject pressurized gas against the lower surface of the support member 41, respectively, and the substrate tray ( 40a) injured. Therefore, the board | substrate tray 40a (substrate P) can be taken out from the board | substrate holder 30a to the port part 60a at high speed and low dust generation. In addition, since the board | substrate P is carried out at a high speed, the board | substrate tray 40a may adsorb and hold the board | substrate P so that the position of the board | substrate P may not shift (it may only hold by frictional force). Further, a regulating member (for example, a pin-shaped member protruding from the support member 41) that restricts the movement of the substrate P on the substrate tray 40a may be formed on the substrate tray 40a. In addition, since the substrate tray 40a is floating and supported, when pressing the substrate tray 40a with the pressing member 72a, the substrate tray 40a and the pressing member 72a are not separated from each other, for example, pressing An adsorbing device (for example, a vacuum adsorption device, a magnetic adsorption device, etc.) for adsorbing and holding the projections 45a may be formed on the member 72a. Alternatively, for example, a mechanism (for example, a lock pin, etc.) for mechanically engaging the pressing member 72a and the substrate tray 40a may be formed. Further, for example, by applying a light load (braking force) in the -Z direction to the substrate tray 40a using the adsorption-retaining function of the guide member 35, the pressing member 72a and the protrusion 45a are prevented from falling. You may prevent.

In the first embodiment, the substrate P is carried out by the substrate carrying device 70a of the substrate holder 30a. However, the substrate tray 40a is held in the port portion 60a. Alternatively, another substrate transport device to be moved in the + X direction may be formed, and the substrate transport operation by the substrate transport device 70a may be switched to a substrate transport operation using the other substrate transport device during the movement of the substrate tray 40a. In this case, the stroke of the pressing member 72a can be shortened. Moreover, since the board | substrate tray 40a is floated and supported, the board | substrate tray 40a pressurized by the pressing member 72a (with the thrust of + X direction) is guided from the guide member 35 by inertia. (65) It may be moved upward. Even in this case, the stroke of the pressing member 72a can be shortened.

In the liquid crystal exposure apparatus 10 (refer to FIG. 1) configured as described above, the mask M of the mask stage MST on the mask stage MST is managed by the mask loader of illustration omitted under the management of the main controller of illustration not shown. With the load being performed, the substrate P is loaded onto the substrate holder 30a by the substrate carrying device 50. Thereafter, alignment measurement is performed using an alignment detection system (not shown) by the main control device, and after the alignment measurement is finished, a step-and-scan method is sequentially applied to a plurality of shot areas set on the substrate P. The exposure operation is performed. In addition, since this exposure operation is the same as the exposure operation of the step-and-scan method which has been conventionally performed, detailed description thereof will be omitted. Then, the substrate on which the exposure processing is completed is carried out from the substrate holder 30a, and another substrate to be exposed next is transferred to the substrate holder 30a, whereby the substrate on the substrate holder 30a is exchanged, and a plurality of An exposure operation or the like is continuously performed on the substrate.

Hereinafter, the substrate exchange operation on the substrate holder 30a in the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 8 (A) to 8 (C). 8 (A) to 8 (C), for the sake of simplicity, other members except the substrate holder 30a in the substrate stage 20a, and holding members 54a and 54b in the substrate carrying device 50 In other members except for the port portion 60a, a part of the mount 61 is omitted. In the first embodiment, during the substrate exchange operation on the substrate holder 30a, as shown in Figs. 8A to 8C, two substrate trays 40a (for convenience, the substrate tray 40a ₁ , Referred to as 40a ₂ )). The two substrate trays 40a ₁ and 40a ₂ are substantially the same. The following substrate exchange operation is performed under the management of a main controller not shown.

As shown in FIG. 8 (A), the substrate P ₁ on which the exposure processing carried out from the substrate holder 30a is finished is placed on one of the substrate trays 40a ₁ and the substrate tray 40a ₁ ) Is supported from below by a plurality of tray guide devices 32 of the substrate holder 30a. On the other hand, another substrate will be exposed, processed in the following embodiments (P ₂₎ is, and is placed on the other substrate of the tray (40a _2). Further, the substrate is held on the tray (40a ₂₎ includes a substrate holder (30a) a holding member (54a, 54b) so as to be positioned above the substrate holder that (30a) when located at a substrate exchange position.

Here, the main control device, below the projection optical system PL (see FIG. 1), the substrate stage 20a after the exposure process for the last shot area is completed among the plurality of shot areas set on the substrate P ₁ . From, it moves to the board | substrate exchange position (position adjacent to the port part 60a). Then, as shown in Fig. 8 (A), the main control device controls the plurality of tray guide devices 32 in the substrate holder 30a during movement of the substrate stage 20a, that is, before reaching the substrate exchange position. By doing so, the substrate tray 40a ₁ is raised, the substrate P ₁ is separated from the upper surface of the substrate holder 30a, the substrate carrying device 70a is controlled, and the substrate tray is used using the pressing member 72a. (40a ₁ ) is moved to the + X side (port portion 60a side). As described above, in the first embodiment, the movement operation with respect to the substrate exchange position of the substrate stage 20a and the carrying out operation of the substrate P ₁ are partially performed in parallel (i.e., at the substrate exchange position of the substrate stage 20a). Prior to the positioning, the substrate P ₁ is carried out.

Hereinafter, from the state shown in FIG. 8 (A), the unloading of the substrate P ₁ is performed in the order shown in FIGS. 7 (A) and 7 (B). That is, the substrate tray 40a ₁ supporting the substrate P ₁ is further driven to the + X side by the substrate carrying device 70a in the substrate holder 30a, and the substrate tray 40a ₁ is the port portion 60a ) To the tray guide device 62.

Subsequently, as shown in FIG. 8 (B), the substrate previously waited above the substrate holder 30a with respect to the substrate holder 30a in the sequence shown in FIGS. 6 (A) to 6 (C) described above. (P ₂ ) is carried in. Then, as shown in Fig. 8 (C), in the substrate stage 20a, the X coarse stage 23X and / or the Y coarse stage 23Y (not shown in Fig. 8 (C), respectively). Is appropriately driven, and an exposure operation is performed on the substrate P ₂ held in the substrate holder 30a. Further, the substrate in the exposure operation and in parallel to the port portion (60a) of the (P _2), the exposure is over a substrate (P ₁₎ (for example, coater-developer apparatus) outside the device from a substrate tray (40a ₁₎ While being conveyed, another substrate P ₃ is placed on the substrate tray 40a ₁ . The exchange operation of the substrate in the port portion 60a is performed using, for example, a robot arm (not shown), a lift pin device not shown in the port portion 60a, or the like.

Hereinafter, although not shown, the substrate tray 40a ₁ supporting the substrate P ₃ is held by the holding members 54a and 54b and is positioned at the position shown in FIG. 8A (above the substrate exchange position). Is returned. Typically, in the transport operation of the substrate trays (40a ₁₎ by the substrate (P _1, P ₃₎ exchange operation, and the substrate carry-in device 50 in the in the port portion (60a), the substrate (P ₂₎ Since the exposure is completed earlier than the exposure operation, the main control apparatus moves the substrate P ₃ to the substrate exchange position until the exposure operation for the substrate P ₂ is ended and the substrate holder 30a moves to the substrate exchange position. It can be placed above. As described above, in the first embodiment, since two substrate trays 40a ₁ and 40a ₂ are used, the cycle time for exchanging the substrate on the substrate holder 30a can be shortened.

In the first embodiment described above, since the substrate holder 30a is provided with the substrate transport device 70a, after the exposure operation is finished, the substrate P 30 before the substrate holder 30a reaches the substrate exchange position Can be started. Therefore, the exchange cycle time of the substrate on the substrate holder 30a can be shortened, and the number of treatments of the substrate P per unit time can be increased. On the other hand, when the substrate carrying device is formed outside the substrate stage 20a (for example, the port portion 60a), in order to start the substrate carrying out operation, the substrate holder 30a is positioned at the substrate exchange position. Since it is necessary to take, it takes time for the substrate carrying out operation compared to the first embodiment.

<< second embodiment >>

Next, the second embodiment will be described with reference to Figs. 9A to 11C. The liquid crystal exposure apparatus according to the second embodiment, except for the configurations of the substrate holder 30b, the port portion 60b (see Fig. 10, respectively), and the substrate tray 40b (see Fig. 9 (A)), Since it is the same as the liquid crystal exposure apparatus 10 of the first embodiment (see FIG. 1), only the differences will be described below, and elements having the same configuration and function as the first embodiment will be described in the first embodiment. The same reference numerals as those of the form are given and the description is omitted.

The substrate tray 40a of the first embodiment (see FIG. 2 (A)) supports the substrate from below using, for example, three (odd number) supporting members 41, while FIG. 9 The substrate tray 40b of the second embodiment shown in (A) has, for example, four (even) support members 41. Further, the substrate trays 40a of the first embodiment (see Fig. 2 (A)) are formed by, for example, three reinforcement members 43, the middle portions of the plurality of support members 41 in the longitudinal direction of each other. On the contrary, the substrate tray 40b according to the second embodiment shown in Fig. 9A adds a reinforcing member 43 that connects the vicinity of the ends of the -X side of the plurality of support members 41 to each other. (Total, for example, it has four reinforcing members 43). Moreover, the board | substrate tray 40b does not have the processus | protrusion 45a (refer FIG. 2 (B)) like the board | substrate tray 40a of the said 1st Embodiment.

As shown in Fig. 10, on the upper surface of the substrate holder 30b, for example, four support members 41 of the substrate tray 40b (not shown in Fig. 10, see Fig. 9 (A)), and For example, a plurality of X grooves 31x and Y grooves 31y corresponding to each of the four reinforcing members 43 are formed. With the substrate holder 30b and the substrate tray 40b combined, each of the plurality of support members 41 and the reinforcing members 43 is accommodated in the corresponding X groove 31x and Y groove 31y. However, as shown in FIG. 11 (A), the -X side reinforcement member 43 is located outside the substrate holder 30b. Returning to FIG. 10, a plurality of tray guide devices 32 are accommodated in the plurality of X grooves 31x, respectively. In addition, another X groove 73x is formed in the central portion of the upper surface of the substrate holder 30b in the Y-axis direction. In the X groove 73x, a substrate carrying device 70b is accommodated. Moreover, the X groove 73x is formed in order to accommodate the board | substrate carrying-out apparatus 70b, and the support member 41 of the board | substrate tray 40b is not accommodated. Moreover, in the port part 60b, four tray guide devices 62 are mounted on the mount stand 61, for example, corresponding to four support members 41, for example.

The board | substrate carrying-out apparatus 70b has the X travel guide 71 and the press member 72b which presses the board tray 40b. As shown in FIG. 11 (A), the pressing member 72b is composed of a plate-like member parallel to the XY plane, and an X slide portion 72b ₁ driven on the X travel guide 71 in the X-axis direction, The X slide portion 72b ₁ has, for example, a pressing portion 72b ₂ made of a plate-like member to which one end is connected via a hinge device. The substrate carrying device 70b has an actuator not shown, and the angle of the X slide portion 72b ₁ and the pressing portion 72b ₂ is appropriately controlled by the actuator.

Hereinafter, the board | substrate exchange operation using the board | substrate carrying-out apparatus 70b is demonstrated using FIG. 11 (A)-FIG. 11 (C). Also in the second embodiment, two substrate trays 40b (referred to as substrate trays 40b ₁ and 40b _{2 in} FIGS. 11 (A) to 11 (C)) are the same as in the first embodiment. Is used. From Figure 11 (A) a substrate holder (30b) and a substrate tray (40b ₁₎ a combination of the state shown in, when taken out of the substrate holder (30b) of the substrate (P ₁₎ with a substrate tray (40b _1), Fig. As shown in 11 (B), the angle of the X slide portion 72b ₁ and the pressing portion 72b ₂ is, for example, 90 °, and similarly to the first embodiment, the pressing member 72b is The substrate P ₁ is taken out by pressing the substrate tray 40b ₁ . At this time, the pressing member 72b presses the reinforcing member 43 on the -X side of the plurality of reinforcing members 43 included in the substrate tray 40b ₁ . For this reason, the dimension in the height (Z axis) direction of the pressing member 72b is set slightly longer than the first embodiment.

Further, after the first exchange of the substrate (P) on the embodiments in the form, the substrate holder (30b) is the same as the first embodiment, the substrate (P ₁₎ taken out from the substrate holder (30b), Fig. As shown in 11 (C), another substrate P ₂ supported by another substrate tray 40b ₂ is carried out by being carried on the substrate holder 30b by a substrate carrying device (not shown).

And, after the end of fetch operation of the substrate (P _2), FIG. 11 as shown in (C), the substrate carry-out device (70b) pressing member (72b) is by an actuator of a not shown, X slide portion of (72b ₁₎ Is controlled so that the angle of the and the pressing portion 72b ₂ becomes an obtuse angle (in an open state than when the substrate is taken out), and in that state, is driven in the -X direction on the X travel guide 71. Here, the angle of the X slide portion 72b ₁ and the pressing portion 72b ₂ is a state in which the substrate tray 40b ₂ supported by the plurality of tray guide devices 32 is located at the most -Z side (substrate P ₂ ) Is placed on the upper surface of the substrate holder 30b, and is set so as not to contact the reinforcing member 43 with the substrate tray 40b ₂ apart.

In the second embodiment described above, even when the substrate P is mounted on the substrate holder 30b (including, for example, during exposure), the initial position in which the pressing member 72b is shown in FIG. 11 (A) (Substrate tray 40b can be returned to a position where it can be pressed). Therefore, after carrying out the board | substrate P, the carrying-in operation of the other board | substrate P can be started immediately (in contrast, in the said 1st embodiment, it is necessary to wait for return to the initial position of the pressing member 72a) There is).

Further, in the substrate holder 30b, since the substrate transport device 70b is accommodated in the X groove 73x (a dedicated groove not used for accommodating the substrate tray 40b), the substrate tray 40b is In the substrate holder 30b, while all the supporting members 41 are supported from below by the tray guide device 32, in the port portion 60b, all the supporting members 41 are tray guide devices 62 It is supported from below. Therefore, the recess of the board | substrate tray 40b and the board | substrate P is suppressed.

In addition, although the pressing member 72b has a configuration in which the pressing portion 72b ₂ is rotated relative to the X slide portion 72b ₁ , the configuration of the pressing member 72b is in a state where the substrate tray 40b can be pressed. However, the state is not limited as long as it is possible to move between states that are not in contact with the substrate tray 40b and moveable in the X-axis direction. For example, the pressing member 72b (or the entire substrate carrying device 70b) is in the Z-axis direction. It may be configured to be movable (up and down). Moreover, you may comprise the board | substrate carrying out device 70a of the said 1st embodiment shown in FIG. 3 etc. similarly to the board | substrate carrying out device 70b of this 2nd embodiment.

<< third embodiment >>

Next, the third embodiment will be described with reference to FIG. 12. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as the liquid crystal exposure apparatus of the second embodiment except for the substrate holder 30c (substrate tray 40b (not shown in FIG. 12. FIG. 9 ( (See A)), including the port portion 60b), only the differences will be described below, and for the elements having the same configuration and function as the first and second embodiments, the first and second The same reference numerals as in the embodiment are given and descriptions thereof are omitted.

In the second embodiment, as shown in Fig. 10, the X groove 73x that accommodates the substrate carrying device 70b in the center of the substrate holder 30b is a substrate tray 40b (not shown in Fig. 10). On the other hand, in the third embodiment, the substrate holder (as shown in FIG. 12), while being formed separately from the X groove 31x for accommodating the plurality of support members 41 of FIG. 9 (A). In 30c), for example, among the 4 X grooves 31x, between the 1st X groove 31x and the 2nd X groove 31x from the + Y side, and the 3rd X groove 31x and the 4th Between each of the X grooves 31x, X grooves 73x for accommodating the substrate carrying device 70c are formed. For this reason, the board | substrate holder 30c has two board | substrate carrying-out devices 70c spaced apart in the Y-axis direction. The substrate discharging device 70c is the above-mentioned product except that it has a hemispherical pressing member (not shown in FIG. 12) in contact with the substrate tray (not shown in FIG. 12) in the pressing member 72c. It is the same as 2nd Embodiment. Note that the substrate exchange operation is the same as that of the second embodiment, and thus the description is omitted.

According to the third embodiment, for example, since two substrate carrying devices 70c are provided, movement of the substrate tray and the substrate in the θz direction (yaw direction) at the time of carrying out the substrate can be easily suppressed. . In addition, since the thrust for moving the substrate tray is improved, the substrate tray can be taken out more smoothly and quickly. Further, the pressing member 72c does not need to have a hemispherical pressing member (either point contact or surface contact with the substrate tray).

<< fourth embodiment >>

Next, the fourth embodiment will be described with reference to FIG. 13. The configuration of the liquid crystal exposure apparatus according to the fourth embodiment is the same as the liquid crystal exposure apparatus 10 (see Fig. 1) of the first embodiment except for the substrate holder 30d (substrate tray 40a) Therefore, only the differences will be described below, and elements having the same configuration and function as in the first embodiment are denoted by the same reference numerals as in the first embodiment, and the description is omitted.

As shown in FIG. 13, the board | substrate holder 30d has the board | substrate carrying-out apparatus 70d containing the rope drive device 74 and the pressing member 72a. Rope drive device (74) comprises a rope (74 _1), a plurality of pulleys (74 _2), and the like. In the middle part of the rope (74 _1), it is connected to the pressing member (72a). Rope (74 _1), a portion thereof with a pressing member (72a) is inserted in the home X (31x) formed on an upper surface of the substrate holder (30d). In addition, although not shown in FIG. 13, three X grooves 31x are formed on the upper surface of the substrate holder 30d at predetermined intervals in the Y-axis direction, for example, and the ropes 74 ₁ are centered therein. Is inserted into the X groove 31x, and a plurality of tray guide devices 32 are accommodated in the other X groove 31x. Further, in the central portion on the Y-axis direction of the lower face of the substrate holder (30d), the other X groove (74 ₃₎ it is formed, and that in the X groove (74 _3), the other part of the rope (74 ₁₎ is inserted have. The plurality of pulleys 74 ₂ are separated from each of the + X side and -X side cross-sections of the substrate holder 30d in the vertical direction, and are attached, for example, two (four in total). Each of the plurality of pulleys (74 _2), is wound around the rope (74 _1). Has one of the plurality of pulleys (74 _2), the actuator not shown (for example, the motor rotation speed), and are connected by being that the actuator is a pulley connection (74 ₂₎ rotationally driven, the pressing member (72a) is X Within the groove 31x, it moves in a predetermined stroke in the X-axis direction. About the board | substrate carrying out operation using the board | substrate carrying out device 70d, since it is the same as that of the said 1st Embodiment, the description is abbreviate | omitted.

According to the substrate discharging device 70d of the fourth embodiment, the pressing member 72a can be driven in the X-axis direction at a higher speed than the case in which, for example, a transfer screw device or the like is used, and the substrate can be quickly moved. It can be carried out from the substrate holder 30d. (It may be toothed, and without the teeth) In addition, if it can be driven by the pressing member (72a) the direction of + X, and -X directions, instead of a rope (74 _1), a belt, a chain, etc. may be used. In addition, the rope (74 _1), the material is not particularly limited, for example, a wire rope is even, or may be a synthetic resin. In addition, a part of the substrate carrying device 70d, such as an actuator that rotates the pulley, is formed on a member other than the substrate holder 30d (for example, the Y adjustment stage 23Y (not shown in Fig. 13, see Fig. 1)). In this case, the substrate holder 30d can be made lighter, and the position controllability of the substrate is improved.The pressing member 72a is movable as in the second embodiment (see Fig. 11 (A), etc.). In addition, the board | substrate carrying-out apparatus 70d may be provided in multiple numbers spaced apart in the Y-axis direction like the said 3rd Embodiment. Moreover, the guide member which guides the pressing member 72a to the X-axis direction is sufficient. You may form.

<< Fifth Embodiment >>

Next, the fifth embodiment will be described with reference to Figs. 14A and 14B. The configuration of the liquid crystal exposure apparatus according to the fifth embodiment is the first embodiment except for the substrate holder 30e and the substrate tray 40e (not shown in Fig. 14 (A), see Fig. 14 (B)). Since it is the same as the liquid crystal exposure apparatus 10 of the form (see Fig. 1), only the differences will be described below, and elements having the same configuration and function as the first embodiment will be denoted by the same reference numerals as the first embodiment. And omit the description.

The board | substrate tray 40e used by the liquid crystal exposure apparatus which concerns on 5th Embodiment is the same as 1st Embodiment (refer FIG. 2 (A)), multiple (for example, 3) support members 41 However, it differs from the first embodiment in that it does not have a projection 45a (see Fig. 2 (B)) on its lower surface. Further, a plurality of (for example, three) X grooves 31x corresponding to the plurality of (for example, three) supporting members 41 are formed on the upper surface of the substrate holder 30e, but all of them In the X groove 31x, a plurality of tray guide devices 32 (for example, three at predetermined intervals in the X-axis direction) are accommodated, and the plurality of support members 41 of the substrate tray 40e are all It is supported from below by the tray guide device 32 in the X groove 31x of the substrate holder 30e. Moreover, although not shown, the port portion of the fifth embodiment corresponds to a plurality of (for example, three) tray guide devices 62 corresponding to the plurality of (for example, three) support members 41 (FIG. 1).

As shown in FIG. 14 (B), the substrate carrying device 70e included in the substrate holder 30e is provided with a pair of roller devices 75. In the + Y side and -Y side of the central X groove 31x in the vicinity of the + X side end portion of the substrate holder 30e, concave portions 75 ₃ are formed, respectively, and the pair of roller devices 75 are It is accommodated in a state placed between an X-groove (31x), in the middle of the one-way + Y cheukin recess (75 ₃₎ inside, the other -Y cheukin recess (75 _3). Each of the pair of roller devices 75 has a rotation motor 75 ₁ and a roller 75 ₂ that is rotationally driven by the rotation motor 75 ₁ . The Z position of the roller 75 ₂ is the substrate holder 30e on the lower surface of the reinforcing member 43 of the substrate tray 40e in order to take out the substrate P (not shown in Fig. 14 (B), see Fig. 1). ) Is set to a position where the support member 41 of the substrate tray 40e can be interposed therebetween while being positioned on the + Z side of the upper surface. In the substrate carrying device 70e, when each of the pair of rollers 75 ₂ is rotated in the opposite direction to each other with the support member 41 inserted between the pair of rollers 75 ₂ , the pair of rollers (75 ₂ ) By the frictional force between each and the supporting member 41, the substrate tray 40e moves in the + X direction with respect to the substrate holder 30e, and is sent out from the substrate holder 30e to a port portion not shown. . About the board | substrate carrying out operation using the board | substrate carrying out device 70e, since it is the same as that of 1st Embodiment mentioned above, description is abbreviate | omitted.

According to the board | substrate carrying-out apparatus 70e which concerns on this 5th embodiment, while being small and lightweight, the board | substrate tray 40e can be taken out from the board | substrate holder 30e quickly. Moreover, when carrying out the board | substrate tray 40e, the member which moves in a predetermined stroke in the X-axis direction (for example, the pressing member 72a of the said 1st Embodiment (refer FIG. 3)) is not provided, but the member is Since the operation of returning to the initial position after taking out the substrate tray 40e is not necessary, the substrate exchange operation can be performed quickly. In addition, in the substrate holder 30e (and port portions not shown), since the substrate tray 40e can be carried out in a state where all of the plurality of support members 41 are supported from below, the substrate P ) (Not shown in FIGS. 14 (A) and 14 (B), see FIG. 1).

In addition, the roller device 75 may be provided with an elastic member that elastically moves the roller 75 ₂ toward the support member 41, whereby slippage of the roller 75 ₂ and the support member 41 can be suppressed. have. Further, each of the pair of rollers 75 ₂ may be configured to be microdriven in the Y-axis direction. Thus, when the support member 41 is inserted into the X groove 31x, a pair of rollers 75 ₂ are retracted from the support member 41, and when the substrate tray 40e is unloaded, the pair is reliably one pair. It is possible to sandwich the support member 41 by the roller 75 _{2 of} . In addition, the board | substrate carrying-out apparatus 70e may be provided spaced apart in the Y-axis direction (for example, corresponding to the X groove 31x of the most + Y side and the most -Y side). Moreover, a pair of roller devices (not shown) having the same configuration as the pair of roller devices 75 (see FIGS. 14A and 14B) may be formed in the port portion.

<< sixth embodiment >>

Next, a sixth embodiment will be described with reference to Figs. 15 (A) to 16. The configuration of the liquid crystal exposure apparatus according to the sixth embodiment is a substrate holder 30f (not shown in Fig. 15 (A), see Fig. 15 (B)), a substrate tray 40f, a port portion 60f (Fig. 15 (A) and 15 (B) are omitted, since the same as the liquid crystal exposure apparatus 10 of the first embodiment (see FIG. 1) except for FIG. 16), only the differences will be described below. The same reference numerals as those in the first embodiment are given to elements having the same configuration and function as in the first embodiment, and descriptions thereof are omitted.

In the above-mentioned first to fifth embodiments, the substrate carrying apparatus is formed on the substrate holder, respectively, whereas in the sixth embodiment, as shown in Fig. 15B, the substrate holder 30f has 1 A pair of X linear motors 70f composed of a pair of X stators 76 and a pair of X movers 45f possessed by the substrate tray 40f function as a substrate take-out device.

As shown in Fig. 15 (A), the substrate tray 40f has a plurality (for example, three) of supporting members 41, similarly to the first embodiment (see Fig. 2 (A)). have. And, for example, the X-movement including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction on each of the + Y side and -Y side surface portions of the central support member 41 among the three support members 41. A ruler 45f is attached. The X mover 45f is formed over substantially the entire portion except for the vicinity of both ends of the support member 41. In addition, the said central support member 41 does not have the projection 45a (refer FIG. 2 (B)) similar to the board | substrate tray 40a of the said 1st Embodiment.

As shown in FIG. 16, a plurality (for example, three) of X grooves 31x corresponding to the plurality of (for example, three) support members 41 are formed on the upper surface of the substrate holder 30f. It is done. Then, in all of the X grooves 31x, a plurality of tray guide devices 32 (for example, three at a predetermined interval in the X-axis direction) are accommodated, and a plurality of support members 41 of the substrate tray 40f ) (Not shown in Fig. 16. See Fig. 15 (B)) are all supported from below by the tray guide device 32 in the X groove 31x of the substrate holder 30f. Further, in the vicinity of the + X side end of the substrate holder 30f, for example, among the three X grooves 31x, a pair of opposing surface portions defining the central X groove 31x are shown in Fig. 15 (B). As shown in the figure, an X stator 76 including a coil unit is accommodated. Incidentally, Fig. 15B corresponds to a sectional view taken along line B-B in Fig. 16 (however, the substrate tray 40f is not shown in Fig. 16). The Z position of each pair of X stators 76 is shown by the lower surface of the reinforcing member 43 of the substrate tray 40f in order to carry out the substrate P (not shown in Fig. 15 (B), see Fig. 1). It is set to the position opposite to the X mover 45f attached to the support member 41 of the board | substrate tray 40f, in the state located on the + Z side than the upper surface of the board | substrate holder 30f.

Moreover, as shown in FIG. 16, the port portion 60f corresponds to the plurality (for example, three) of the support members 41 (not shown in FIG. 16, see FIG. 15 (A)). It has a tray guide device 62 (for example, three). And, for example, among the three tray guide devices 62, a pair of X stators 68 are attached to the vicinity of the -X side end of the base 63 of the central tray guide device 62. Each pair of X stators 68 includes a coil unit similar to the X stator 76. The pair of X stators 68 are arranged to be spaced apart in the Y-axis direction at intervals wider than the dimension (width) of the support member 41 of the substrate tray 40f in the Y-axis direction, and the Z position thereof is With the support member 41 mounted on the plurality of guide members 65, the X mover 45f attached to the support member 41 (not shown in Fig. 16, see Fig. 15 (A)) It is set to be approximately the same as the Z position (to face the X mover 45f).

In the sixth embodiment, when carrying out the substrate tray 40f from the substrate holder 30f, one pair of X stators 76 of the substrate holder 30f and one pair of X movers of the substrate tray 40f By a pair of X linear motors 70f constituted by 45f, and a pair of X stators 68 of the port portion 60f and a pair of X movers 45f of the substrate tray 40f. A total of four X linear motors of another pair of X linear motors configured are suitably used as a substrate transport device. About the board | substrate carrying out operation, since it is the same as that of the said 1st Embodiment, the description is abbreviate | omitted.

In the sixth embodiment, since the substrate tray 40f can be taken out from the substrate holder 30f at high speed in a non-contact manner, oscillation is prevented. Further, in the substrate holder 30f and the port portion 60f, since the substrate tray 40f can be carried out in a state where all of the plurality of support members 41 are supported from below, the substrate P (Figs. 15 (A) to 16 are omitted from the drawing. See Fig. 1). In addition, as in the third embodiment, the X linear motor may be formed in a plurality of spaces (for example, corresponding to the support members 41 on the most + Y side and the most -Y side) spaced apart in the Y-axis direction.

<< seventh embodiment >>

Next, a seventh embodiment will be described with reference to Figs. 17A and 17B. The configuration of the liquid crystal exposure apparatus according to the seventh embodiment is the liquid crystal exposure apparatus 10 of the first embodiment (FIG. 1), except for the substrate holder 30g, the substrate tray 40g, and the port portion 60g. (See References), only the differences will be described below, and elements having the same configuration and function as the first embodiment will be denoted by the same reference numerals as in the first embodiment, and the description will be omitted.

In the first to sixth embodiments, the substrate holders 30a to 30f (refer to FIGS. 1 to 16, respectively) had a substrate carrying device (or part of the substrate carrying device), whereas in the seventh embodiment, , As shown in FIG. 17 (A), as the exterior of the substrate holder 30g, a substrate transport device 70g is disposed on the + Y side and -Y side of the substrate holder 30g, respectively. For example, the configuration of each of the two substrate taking-out devices 70g, except that the Z-axis dimension of the pressing member 72g is set to be slightly longer, the substrate taking-out device 70a of the first embodiment ( 3).

As shown in FIG. 17 (A), the substrate tray 40g has a plurality (for example, five) of supporting members 41. Further, the substrate trays 40a of the first embodiment (see Fig. 2 (A)) are formed by, for example, three reinforcement members 43, the middle portions of the plurality of support members 41 in the longitudinal direction of each other. On the contrary, the substrate tray 40g further has a reinforcing member 45g that connects the ends of the -X side of the plurality of support members 41 to each other. In addition, the substrate tray 40g does not have the same projections 45a (see Fig. 2 (B)) as the substrate tray 40a of the first embodiment.

In addition, among the plurality of reinforcing members 43 and 45g, the reinforcing member 45g on the most -X side is longer than the reinforcing member 43 in which its long-direction dimension is different, and its dimension is shown in FIG. 17 (A). As shown in the figure, with the substrate tray 40g accommodated in the substrate holder 30g, the -Y side end portion protrudes from the -Y side end portion of the substrate holder 30g to the -Y side, and also on the + Y side. The end portion is set to protrude from the + Y side end portion of the substrate holder 30g to the + Y side. As shown in FIG. 17 (B), the substrate tray 40g is a pressing member of the substrate carrying device 70g in which the + Y side end portion of the reinforcing member 45g is disposed on the + Y side of the substrate holder 30g. While being pressed against (72g), the vicinity of the -Y side end portion of the reinforcing member (45g) is pressed against the pressing member (72g) of the substrate carrying device (70g) disposed on the -Y side of the substrate holder (30g). It is carried out from the substrate holder 30g.

Here, the substrate holder 30g of the substrate stage 20g of the seventh embodiment is the same as the first embodiment shown in FIG. 1, the Y adjustment stage 23Y (FIGS. 17 (A) and 17 (B)) (Not shown in the figure). In addition, each of the two board | substrate carrying-out apparatuses 70g shown in FIG. 17 (A) and FIG. 17 (B) is attached to the Y adjustment stage 23Y via the support member (not shown), for example. It is mechanically (and vibratively) separated from the holder 30g. For example, the substrate carrying out operation using the two substrate carrying devices 70g is the same as that of the first embodiment, and thus the description is omitted. In addition, except that the port portion 60g and the substrate carrying device (not shown) are configured in correspondence with, for example, the substrate tray 40g having five supporting members 41, the function is the above-mentioned. Since it is the same as 1st Embodiment, description is abbreviate | omitted.

In the seventh embodiment, for example, since each of the two substrate carrying devices 70g is disposed outside the substrate holder 30g, the substrate carrying device 70g is accommodated in the substrate holder 30g. There is no need to form a groove or the like, and the decrease in rigidity of the substrate holder 30g can be suppressed. Further, since the substrate P can be adsorbed and held in a larger area, the flatness of the substrate P can be improved. In addition, the position of the substrate holder 30g (substrate P) because the substrate holder 30g can be made lighter and the reaction force when driving the pressing member 72g does not act on the substrate holder 30g. Controllability is improved. In addition, since the substrate transport device 70g is disposed outside the substrate holder 30g, it is also excellent in maintainability.

Further, the substrate holder 30g is micro-driven in the + Z direction using a plurality of Z voice coil motors 29z (see Fig. 1), for example, each of the two substrate carrying devices 70g is a substrate tray 40g. By being positioned on the -Z side of the reinforcing member 45g, even if the substrate P is placed on the substrate holder 30g, it is possible for the pressing member 72g to pass under the reinforcing member 45g. . Thereby, it becomes possible to carry out another board | substrate carrying out similarly to the same effect as said 2nd Embodiment, ie, after carrying out a board | substrate. Further, for example, each of the two substrate carrying devices 70g may be vertically movable on the Y coarse stage 23Y.

In addition, if the pressure-sensitive member 72g has a configuration in which the reinforcing member 45g does not adsorb (only in contact), the θz direction (yaw direction) of the substrate tray 40g and the substrate P is the same as in the third embodiment described above. ) Can be easily suppressed. In addition, when the pressing member 72g adsorbs and holds the reinforcing member 45g, only one substrate carrying device 70g may be formed outside the substrate holder 30g. Further, the pressing member 72g may be towed by a rope or the like in the same manner as in the fourth embodiment. Moreover, you may arrange | position the roller apparatus 75 like the board | substrate carrying-out apparatus 70e (refer FIG. 14 (A)) which concerns on the said 5th embodiment similarly to this 7th embodiment, and may be arrange | positioned outside the board | substrate holder. Moreover, you may attach a mover to a board | substrate tray similarly to the said 6th Embodiment, and you may arrange an X stator outside the board | substrate holder.

<< eighth embodiment >>

Next, an eighth embodiment will be described with reference to FIGS. 18 and 19. The configuration of the liquid crystal exposure apparatus according to the eighth embodiment is the same as the liquid crystal exposure apparatus of the seventh embodiment (including the substrate holder 30g and the substrate tray 40g) except for the port portion 60h. Therefore, only the differences will be described below, and elements having the same configuration and function as in the seventh embodiment will be denoted by the same reference numerals as in the seventh embodiment and the description will be omitted.

18, the port part 60h has the tray guide device 62h on the -X side of the mount stand 61. As shown in FIG. The tray guide device 62h includes a base 63h mounted on a floor (not shown) and a guide member 65h mounted on the base 63h. In addition, in the eighth embodiment, the plurality of tray guide devices 62 mounted on the mount stand 61 do not move in the X-axis direction. The guide member 65h is made of a member extending in the Y-axis direction, and its long dimension is longer than the length (width) of the substrate tray 40g (and the substrate P) in the Y-axis direction ( Wide). The guide member 65h is installed at the same height position as the other guide members 65 on the mount 61, and, like the guide members 65, ejects pressurized gas from its upper surface and floats the substrate tray 40g. I can support. Therefore, when the substrate stage 20g is moved to the substrate exchange position in order to transfer the substrate tray 40g from the substrate holder 30g to the port portion 60h, it protrudes from the end of the + X side of the substrate holder 30g. The substrate tray 40g is supported by the guide member 65h from below. Therefore, the depression of the board | substrate tray 40g and the board | substrate P can be suppressed.

Here, for example, when a plurality of shot regions are set on the substrate P, the shot region to which exposure processing is performed last is typically performed by the substrate P in order to reduce the total amount of movement of the substrate P. It is set on the + Y side or the -Y side. Therefore, the substrate stage 20g after the exposure process for the last shot area is finished is moved in the X-axis direction and moves in the Y-axis direction as it moves toward the substrate exchange position (with respect to the X axis. Move in the photo direction). In contrast, in the eighth embodiment, the substrate stage 20g is X because the dimension of the guide member 65h in the Y-axis direction is set longer than the dimension in the Y-axis direction of the substrate tray 40g. Even when moving in the direction inclined with respect to the axis, the portion protruding from the + X side end of the substrate holder 30g of the substrate tray 40g is supported from below by the guide member 65h. For this reason, the board | substrate P can be taken out more quickly.

Specifically, with reference to FIG. 19, on the substrate P, for example, six short areas are set, and among them, the last short area is the short area S set on the + Y side and the + X side of the substrate P ₆ ) is. Further, the center of the substrate P before the start of the exposure operation with respect to the short region S ₆ is located at the position CP ₁ , and the center of the substrate P when the exposure operation is finished is the position (CP) ₂ ). In Fig. 19, illustration of the substrate tray 40a, the substrate carrying device 70g, the tray guide devices 62 and 62h (refer to Fig. 18, respectively) is omitted.

Then, in the eighth embodiment, before the substrate stage 20g reaches the substrate exchange position, the substrate P (and the substrate tray not shown) is provided by the substrate transport device 70g (see FIG. 18) (not shown). (40g)) is carried out. For this reason, the substrate P (and the substrate tray 40g (not shown)) protrudes from the + X side end of the substrate holder 30g, and the protruding portions thereof guide member 65h of the tray guide device 62h ) (Not shown in Fig. 19. See Fig. 18) is supported from the lower side before the guide member 65 on the mount 61.

And, in the eighth embodiment, it is possible to carry out position control of the substrate stage (20g) to pass through the center of the sequence are the position of Figure _{19 CP 1 → CP 2 → CP} 3 of the substrate (P). That is, if it is assumed that the port portion 60h does not have the tray guide device 62h (not shown in Fig. 19, see Fig. 18), when the substrate P is taken out, the substrate tray 40g (in Fig. 19) Not shown. Fig. 18) The position relative to the Y-axis direction of the plurality of tray guide devices 62 (not shown in Fig. 19, see Fig. 18) on the mount 61, at the point where it moves parallel to the X-axis direction. The Y position control of the substrate stage 20g should be performed so that the positions of the plurality of support members 41 of the substrate trays 40g (not shown in FIG. 19, see FIG. 18) generally coincide. , In this case, it is necessary to perform position control of the substrate stage 20g so that the center of the substrate P passes the sequence of positions CP ₁ → CP ₂ → CP ₄ → CP ₃ in FIG. 19.

On the other hand, in the eighth embodiment, the guide member 65h is located near the end of the + X side of the substrate tray 40g (not shown in FIG. 19), regardless of the Y position of the substrate stage 20g (see FIG. 18) ( Not shown in Fig. 19. Since it is supported by the substrate stage 20g, the substrate stage 20g is directly replaced with the substrate exchange position (Position CP) from the position (Position CP ₂ ) when the final shot area exposure process is finished. _It can be moved to ₃ )), and the unloading operation of the substrate P can be performed quickly. The auxiliary tray guide device 62h and the method of taking out the substrate P according to the eighth embodiment are also applicable to the first to seventh embodiments. However, when the amount of protrusion of the substrate P from the substrate holder is small (when the tray guide device 62 is not in contact with the substrate exchange position), the substrate stages 20a to 20 are not provided without the auxiliary tray guide device 62h. 20f) may be moved directly from the position at the end of the exposure process in the final shot area to the substrate exchange position.

Note that the configuration of the liquid crystal exposure apparatus is not limited to that described in the first to eighth embodiments, and can be appropriately changed. For example, each of the guide members 35 and 65 of the tray guide devices 32 and 62 has a configuration in which the substrate trays 40a to 40g are non-contact (floating), but is not limited thereto, for example, balls, etc. You may contact and support with low friction using the rolling element of. Further, each of the tray guide devices 32 and 62 may be configured to guide the substrate trays 40a to 40g in a straight line in the X-axis direction using the guide members 35 and 65.

Further, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Further, as the illumination light, for example, a single wavelength laser light of infrared or visible range emitted from a DFB semiconductor laser or a fiber laser is amplified with a fiber amplifier doped with erbium (or both erbium and ytterbium), for example. Alternatively, a harmonic obtained by converting wavelengths into ultraviolet light using a nonlinear optical crystal may be used. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

In addition, in the above embodiment, the case where the projection optical system PL is a multi-lens type projection optical system having a plurality of projection optical units has been described, but the number of projection optical units is not limited to this, and there is one or more. do. Moreover, it is not limited to the projection optical system of a multi-lens system, For example, the projection optical system using an opener type large mirror may be sufficient. In addition, in the above embodiment, the case where the projection magnification is used as the projection optical system PL is equal to, but the present invention is not limited to this, and the projection optical system may be either a reduction system or an expansion system.

Further, in the above-described embodiment, a light-transmitting type mask having a predetermined light-blocking pattern (or phase pattern or photosensitive pattern) formed on a light-transmitting mask substrate was used, but instead of this mask, for example, US Patent No. 6,778,257. As disclosed in the specification, based on the electronic data of the pattern to be exposed, an electronic mask (variable molding mask) for forming a transmission pattern or a reflection pattern or a light emission pattern, for example, a non-emission type image display element ( A variable shaping mask using a digital micro-mirror device (DMD), which is also called a spatial light modulator, may be used.

Moreover, as an exposure apparatus, a board | substrate whose size (including at least one of outer diameter, diagonal length, and one side) is 500 mm or more, for example, an exposure apparatus for exposing a large-sized substrate for flat panel displays such as liquid crystal display elements It is particularly effective to apply for.

Moreover, as an exposure apparatus, it is applicable also to a step-and-repeat-type exposure apparatus and a step-and-stitch-type exposure apparatus.

In addition, the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystals that transfers a liquid crystal display element pattern to a square glass plate, for example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micro machine, and a DNA chip. It can also be widely applied to an exposure apparatus for manufacturing a. In addition, in order to manufacture a mask or reticle used in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus, as well as a micro device such as a semiconductor element, a circuit pattern is transferred to a glass substrate or a silicon wafer. The present invention can also be applied to an exposure apparatus. Further, the object to be exposed is not limited to the glass plate, and other objects such as a wafer, a ceramic substrate, a film member, or a mask blank may be used. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included.

Further, the substrates described in the first to eighth embodiments are not limited to the exposure apparatus, and are applied to an object treatment apparatus that performs predetermined processing on an object, such as an object inspection apparatus used for inspection of a given object ( Object) may be used.

An electronic device such as a liquid crystal display element (or semiconductor element) includes performing a functional and performance design of a device, manufacturing a mask (or reticle) based on the design step, and producing a glass substrate (or wafer). , The lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure apparatus of each of the above-described embodiments, and the exposure method, the developing step of developing the exposed glass substrate, other than the portion where the resist remains It is manufactured through an etching step of removing the exposed member of the part by etching, a resist removal step of removing a resist that becomes unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is performed using the exposure apparatus of the above embodiment, and since a device pattern is formed on the glass substrate, a highly integrated device can be manufactured with good productivity.

In addition, the disclosure of the US patent application publication specification and the US patent specification relating to the exposure apparatus or the like cited in the description so far is taken as part of the description of this specification.

Industrial availability

As described above, the method of carrying out the object of the present invention is suitable for carrying out the object from the object holding device. Further, the method for exchanging objects of the present invention is suitable for exchanging objects held by an object holding device. In addition, the object holding device of the present invention is suitable for quickly carrying out objects. Moreover, the exposure apparatus of this invention is suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. Further, the device manufacturing method of the present invention is suitable for manufacturing a micro device.

Claims (33)

Moving the object holding device having the object holding member holding the object toward the object carrying position for discharging the object from the object holding member,
And before the object holding device reaches the object discharging position, initiating a discharging operation of discharging the object from the object holding member. According to claim 1,
The object carrying out method of moving the object relative to the object holding member by using the carrying device included in the object holding device when starting the carrying out operation. According to claim 1,
The method of carrying out the object, wherein the object is separated from the object holding member by starting the carrying out operation. The method according to any one of claims 1 to 3,
The object carrying out method of moving the object holding device in a first direction and a second direction intersecting the first direction and the up and down direction when starting the carrying out operation. Performing the object carrying out method according to any one of claims 1 to 3,
Taking the object out of the object holding device while the object holding device is located at the object carrying position,
A method for exchanging objects, comprising bringing another object different from the object onto the object holding device from which the object is carried. The method of claim 5,
And before the object holding device reaches the object discharging position, placing the other object in a predetermined waiting position. The method of claim 6,
In the waiting, the other object is moved to the standby position above the object carrying position, the object exchange method. The method of claim 5,
In the carrying out, the object is moved along a predetermined two-dimensional plane,
In the carrying-in, the object exchange method moves the other object in a direction orthogonal to the predetermined two-dimensional plane. An exposure method comprising exposing the other object carried into the object holding device by the object exchange method according to claim 5. A method of manufacturing a display comprising developing the other object exposed by the exposure method according to claim 9.  A device manufacturing method comprising developing the object exposed by the exposure method according to claim 9. An object holding member for holding the object,
A driving unit for moving the object holding member from the object holding member to an object carrying position where the object is carried out;
And a discharging device that initiates a discharging operation for discharging the object from the object holding member before the object holding member reaches the object discharging position. The method of claim 12,
The said carrying-out apparatus has a separation apparatus which moves the said object up and down, and separates from the said object holding member. The method of claim 13,
The said carrying-out apparatus has an carrying-out part which moves the said object separated from the said object holding member in the 1st direction which intersects the said up-down direction. The method of claim 14,
The drive unit, the object carrying device for moving the object holding member in the first direction, the second direction crossing the first direction and the vertical direction. The method of claim 13,
The separation device moves the object support member supported by the object holding member relative to the object holding member in a vertical direction, separates the object from the object holding member, and supports the object holding member. Object carrying device. The method of claim 16,
The object holding member is an object carrying device, in which a concave portion in which at least a part of the object supporting member is accommodated is formed in an object holding surface on which the object is placed. The method of claim 17,
The said carrying-out apparatus is accommodated in the said concave part, The object carrying-out apparatus. The method of claim 17,
The object holding member is formed with a different concave portion different from the concave portion in which the carrying device is accommodated. The method of claim 12,
The said carrying-out apparatus is arrange | positioned outside the said object holding member, The object carrying-out apparatus. The method of claim 12,
A guiding device for guiding the object holding member along a predetermined two-dimensional plane to a predetermined stroke is further provided,
The carrying device is an object carrying device, which is formed in the induction device. The method according to any one of claims 12 to 21,
The plurality of carrying devices are formed, the object carrying device. The method according to any one of claims 16 to 19,
The said carrying-out apparatus has a pressing member which carries out the said object from the said object holding member by pressing the said object support member which supported the said object. The method of claim 23,
The pressing member is movable between a position capable of pressing the object holding member held on the object holding member and a position retracted from the object holding member held on the object holding member. The method according to any one of claims 16 to 19,
The said carrying-out apparatus has a rotating body contactable with the said object supporting member, and the object carrying member is moved by rotating the rotating body. The method according to any one of claims 16 to 19,
A part of the carrying-out device is a stator constituting a linear motor together with a mover formed on the object support member,
The object carrying member is an object carrying device, which is driven by the linear motor. An object discharging device according to any one of claims 12 to 21,
And an carrying device for bringing in a different object from the object to the object holding member from which the object is carried out. The method of claim 27,
The carrying device, the object exchange device, to move the other object to a predetermined standby position to wait. The method of claim 28,
The carrying device moves the other object to the standby position, which is above the carrying position of the object, and the object exchange device. The method of claim 28,
The carrying device moves the other object to the standby position before the object holding member reaches the object carrying position. The exposure apparatus provided with the object exchange apparatus of Claim 27 provided with the pattern formation apparatus which forms a predetermined pattern using an energy beam to the said object carried in the said object holding member. The method of claim 31,
The said object is a board | substrate used for a flat panel display apparatus, The exposure apparatus. The method of claim 32,
The substrate is at least one side length of 500 mm or more, the exposure apparatus.

Images