JP6320448B2 - Resin sealing device and resin sealing method - Google Patents

Description

  The present invention relates to a resin sealing device and a resin sealing method.

  As a mechanism for transporting the object to be transported to the mold of the resin sealing device, it is common to use a transport mechanism provided with chucks for gripping both widthwise ends of the object to be transported.

  For example, Japanese Unexamined Patent Application Publication No. 2009-147188 (Patent Document 1) discloses a transport mechanism that grips both end portions in the width direction of a resin holder in which a resin tablet supplied to a mold is accommodated by a chuck claw.

  Japanese Patent Application Laid-Open No. 5-343499 (Patent Document 2) and Japanese Patent Application Laid-Open No. 2007-260862 (Patent Document 3) disclose a transport mechanism that supports a lower part of a work by an arm or the like and transfers the work. Yes. However, since a mechanism for transporting an object to be transported to a molding die of a resin sealing device is required to avoid interference with the molding die, a chuck mechanism as in Patent Document 1 is generally used. No transport mechanism such as a fork described in Patent Document 2 and Patent Document 3 has been used.

JP 2009-147188 A JP-A-5-343499 JP 2007-260862 A

  When the object to be conveyed is wide and thin, if the chuck mechanism that grips both end portions in the width direction is a conveying mechanism, the deflection of the object to be conveyed becomes large. In recent years, in the manufacturing process of electronic components, the size and thickness of substrates before resin sealing have been increased. When the weight of the mounting component or the like is relatively increased with respect to the rigidity of the substrate, the bending of the substrate being transferred increases. When the bending becomes large, the substrate is easily broken, the mounted parts are deformed, the position is shifted in the mold, and the yield is lowered.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a resin sealing apparatus and a resin sealing method capable of stably transporting a substrate to a mold. It is to provide.

  A resin sealing device according to the present invention includes a substrate transport mechanism including a claw portion that is movable in the vertical direction and the horizontal direction, a substrate holding portion that can hold a substrate placed on the claw portion, and an upper mold A mold including a lower mold, wherein a cavity is formed in at least one of the upper mold and the lower mold, and the substrate held on the claw portion is horizontally aligned with the claw portion along the horizontal direction. And a mold that is inserted between the lower mold and includes a support portion that can support the substrate when the claw portion is extracted from between the upper mold and the lower mold along the horizontal direction, and the substrate. A mold clamping mechanism for clamping the upper mold and the lower mold in a state of being placed on the lower mold and sealing the substrate with resin in the cavity;

In one embodiment, in the resin sealing device, the support portion contacts a side end surface of the substrate when the claw portion is pulled out between the upper mold and the lower mold along the horizontal direction. includes a section member that stops the substrate, stopping the substrate member is provided in the lower die, the claw portion when extracting the claw portion along the horizontal direction from between the upper and the lower die The upper end of the member that holds the substrate in the vertical direction is placed on the substrate mounted on the nail portion when the nail portion is arranged outside the moving region and is extracted from between the upper die and the lower die along the horizontal direction. It is above the placement surface .

In one embodiment, in the resin sealing device, the support portion is positioned between the upper die and the lower die in a state where the claw portion is extracted from between the upper die and the lower die. And a substrate support member capable of moving up and down to support the substrate in the inner region, the substrate support member is provided in the lower mold, and the claw portion is arranged in the horizontal direction along the upper mold and the lower mold. The claw portion is arranged in a region other than the moving region when the claw portion is extracted from between the spaces, and the substrate is supported in the vertical direction when the claw portion is extracted from between the upper die and the lower die along the horizontal direction. The upper end of the member is above the substrate placement surface of the claw portion .

In one embodiment, the resin sealing device further includes a positioning mechanism for positioning the substrate inserted between the upper mold and the lower mold, and the positioning mechanism is provided in the substrate transport mechanism. The positioning claw portion includes the positioning claw portion, and the positioning claw portion presses the end surface of the substrate placed on the lower mold, so that the positioning pin provided on the lower mold abuts the opposite end surface of the substrate. To position .

  In one embodiment, in the resin sealing device, the mold further includes a fixing mechanism capable of fixing the substrate on the lower mold.

  In one embodiment, the resin sealing device further includes a substrate platform on which the substrate before being inserted between the upper mold and the lower mold is mounted, and the substrate platform is A first portion capable of supporting both ends of the substrate in the width direction; and a second portion capable of supporting an inner portion in the width direction of the substrate.

  In one embodiment, the resin sealing device further includes a heating mechanism for heating the substrate before the resin sealing.

In one embodiment, in the resin sealing device, the heating mechanism has a concave portion corresponding to the shape of the claw portion formed on the upper surface .
In one embodiment, in the resin sealing apparatus, the substrate transport mechanism further includes a holding mechanism that holds a side of the substrate during transport of the substrate.

In one aspect, the resin sealing method according to the present invention includes a step of holding the substrate on the claw portion of the substrate transport mechanism, and an upper die and a lower die, and the cavity is at least one of the upper die and the lower die. A step of preparing a mold formed on the claw portion, a step of inserting the substrate held on the claw portion together with the claw portion between the upper die and the lower die along the horizontal direction, and the upper die The claw portion is moved along the horizontal direction while supporting the substrate between the lower mold and the lower mold, the side end surface of the substrate is brought into contact with a member to stop the movement of the substrate, and the claw portion is moved. The step of extracting from between the upper mold and the lower mold, and clamping the upper mold and the lower mold in a state where the substrate is placed on the lower mold, and sealing the substrate in the cavity and a step, the upper die and the said pawl portion In the step of extracting from between the molds, the member for stopping the substrate is arranged in a region other than the movement region of the claw portion when the claw portion is extracted from between the upper mold and the lower mold along the horizontal direction, The upper end of the member that stops the substrate in the direction is above the substrate mounting surface of the claw portion .
In another aspect, the resin sealing method according to the present invention includes a step of holding the substrate on the claw portion of the substrate transport mechanism, and an upper die and a lower die, and the cavity is at least one of the upper die and the lower die. A step of preparing a mold formed on the claw portion, a step of inserting the substrate held on the claw portion together with the claw portion between the upper die and the lower die along the horizontal direction, and the upper die A step of extracting the claw portion from between the upper mold and the lower mold along the horizontal direction while the substrate is supported between the lower mold and the lower mold; and a state in which the substrate is placed on the lower mold The upper mold and the lower mold are clamped and the substrate is resin-sealed in the cavity. The step of transferring the substrate and the claw portion are arranged between the upper mold and the lower mold. In the step of extracting from the substrate support member, The claw portion is arranged in a region other than the movement region of the claw portion when the claw portion is extracted from between the upper die and the lower die along the horizontal direction, and the upper end of the substrate support member is the substrate of the claw portion in the vertical direction. It is set above the mounting surface.

  In one embodiment, in the resin sealing method, the claw portion includes a first claw and a second claw that extend substantially parallel to each other along a direction of insertion of the substrate.

In one embodiment, in the resin sealing method, the substrate transport mechanism is provided between the step of extracting the claw portion from between the upper die and the lower die and the step of resin sealing the substrate. The positioning nail portion presses the end surface of the substrate placed on the lower mold, and the positioning pin provided on the lower mold is brought into contact with the end surface on the opposite side of the substrate to position the substrate. Is done.

  According to the present invention, the substrate can be placed and transported on the claw portion suitable for the width of the substrate, so that the substrate can be prevented from being bent and the substrate can be transported stably.

It is a top view which shows the whole structure of the resin sealing apparatus which concerns on one embodiment of this invention. It is a figure which shows the state which added the molding unit in the resin sealing apparatus shown in FIG. It is a front view of the mold mechanism part (mold open state) contained in the resin sealing apparatus shown in FIG. It is a front view of the mold mechanism part (clamping state) contained in the resin sealing apparatus shown in FIG. It is sectional drawing which shows the example of the plunger unit for inject | pouring resin to the cavity formed between the upper mold | type and lower mold | type of a shaping | molding die. It is a figure which shows the state holding a board | substrate with a conveyance mechanism, (a) is the front view seen from the longitudinal direction, (b) is the side view seen from the width direction. It is a figure which shows the 1st process of conveyance of the board | substrate to a lower mold | type, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a side view which shows the 2nd process of conveyance of the board | substrate to a lower mold | type. It is a side view which shows the 3rd process of conveyance of the board | substrate to a lower mold | type. It is a side view which shows the 4th process of conveyance of the board | substrate to a lower mold | type. It is a figure which shows the 1st process of the positioning of the board | substrate longitudinal direction, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 2nd process of the positioning of the board | substrate longitudinal direction, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 3rd process of the positioning of the board | substrate longitudinal direction, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 1st process of positioning of the board | substrate of the transversal direction, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 2nd process of the positioning of the transversal direction of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 3rd process of the positioning of the transversal direction of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 1st process of the modification of positioning of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 2nd process of the modification of positioning of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 3rd process of the modification of positioning of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a figure which shows the 4th process of the modification of positioning of a board | substrate, (a) is the side view seen from the width direction, (b) is the top view seen from the upper direction. It is a flowchart which shows the resin sealing method which concerns on one embodiment of this invention. It is a figure which shows the heating mechanism (preheater) which heats a board | substrate. It is a figure which shows the modification of the pin which protrudes from a lower mold | type. It is a figure which shows the modification of a board | substrate mounting part.

  Embodiments of the present invention will be described below. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.

  Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

  FIG. 1 is a plan view showing the overall configuration of the resin sealing device according to the present embodiment. As shown in FIG. 1, the resin sealing device according to the present embodiment includes, for example, a molding unit A including a mold mechanism unit 1000 that resin seals a substrate on which a semiconductor chip is mounted, and a molding die for the molding unit A. An inloader unit B including an inloader 2000 for supplying a substrate, an outloader 3000 for taking out a molded product from a molding die of the molding unit A, and an outloader unit C including an accommodating portion for accommodating the molded product are provided. The inloader 2000 and the outloader 3000 move in the vertical direction in FIG.

  The molding unit A, the inloader unit B, and the outloader unit C are detachably connected to each other via a connection mechanism such as a bolt or a pin. In the example of FIG. 1, two molding units A are provided, but this number can be increased or decreased according to the production amount. The number of molding units A may be one, or may be increased to four as shown in FIG. That is, the resin sealing device of the present embodiment can be configured to increase or decrease the number of molding units.

  1 and 2, the molding unit A, the inloader unit B, and the outloader unit C are arranged in this order. For example, the molding unit A, the inloader unit B, and the outloader are arranged. The resin sealing device may be configured by arranging one master unit in which the unit C is integrated and one or a plurality of slave units including only the molding unit A.

  Next, an example of the structure of the mold mechanism unit 1000 will be described with reference to FIGS. 3 and 4 are front views showing the mold open state and the mold clamp state of the mold mechanism unit 1000, respectively.

  As shown in FIGS. 3 and 4, the mold mechanism unit 1000 includes two molds 110 and 120 that are stacked in the vertical direction. The mold 110 includes an upper mold 110A and a lower mold 110B, and the mold 120 includes an upper mold 120A and a lower mold 120B.

  The mold mechanism unit 1000 includes an upper fixed plate 130 for fixing the upper mold 110A of the mold 110, an intermediate plate 140 for fixing the lower mold 110B of the mold 110 and the upper mold 120A of the mold 120, and a lower part of the mold 120. The slide plate 150 that fixes the mold 120B, the lower plate 160 provided below the slide plate 150, the lower fixing plate 170 provided below the lower plate 160, the intermediate plate 140, and the lower plate 160 are connected. It further includes a connecting member 180 and a post 190 connecting the upper fixed platen 130 and the lower fixed platen 170.

  The intermediate plate 140 and the slide plate 150 are movable in the vertical direction with respect to the upper fixed platen 130 and the lower fixed platen 170. The lower plate 160 connected to the intermediate plate 140 and the slide plate 150 are driven in the vertical direction by the toggle link mechanism 100 provided below the slide plate 150. As a result, the molds 110 and 120 are switched between the mold open state (FIG. 3) and the mold clamped state (FIG. 4).

  The toggle link mechanism 100 includes a link member 100A that moves the slide plate 150, a link member 100B that is half the length of the link member 100A, and that moves the intermediate plate 140 via the lower plate 160, and a link member. A link member 100C to which 100A and 100B are connected, and a link member 100D for connecting the link member 100C to the crossbar 100E and the ball screw 100F are included. The mold clamping force of the molds 110 and 120 is transmitted to the intermediate plate 140 and the slide plate 150 via the ball screw 100F and the link members 100A to 100D. At this time, when the intermediate plate 140 moves the distance L, the slide plate 150 moves the distance 2L. Thereby, the molds 110 and 120 can be simultaneously clamped.

  One end of the link member 100C is rotatably connected to a stationary member 170A that is immovable with respect to the lower fixed platen 170, and the other end of the link member 100C is rotatably connected to the link member 100A. The The link member 100B is rotatably connected to the link member 100C at a midpoint position between the one end and the other end.

  When performing resin molding using the mold mechanism unit 1000 shown in FIGS. 1 to 4, the toggle link mechanism 100 provided below the slide plate is fixed with the upper mold 110 </ b> A of the mold 110 fixed. In use, the intermediate plate 140 is moved by a distance L, and the slide plate 150 is moved by a distance 2L, and a required mold clamping force is applied to the molds 110 and 120.

  Note that the scope of the present invention is not limited to one in which the molds 110 and 120 are laminated. A molding unit consisting of a single mold may also be included in the scope of the present invention. Further, the scope of the present invention is not limited to the toggle link mechanism 100 as the drive mechanism for driving the mold in the vertical direction. For example, a configuration using an electric motor such as a servo motor as a drive source without using a toggle link mechanism and a ball screw as a transmission member, or a configuration using a hydraulic cylinder as a drive source and a rod as a transmission member is also possible. It can be included in the scope of the invention.

  FIG. 5 is a cross-sectional view showing an example of a plunger unit for injecting resin into a cavity formed between an upper mold and a lower mold. The upper mold 210 and the lower mold 220 in FIG. 5 correspond to the upper molds 110A and 120A and the lower molds 120A and 120B shown in FIGS. 3 and 4, respectively. The pot 230 provided in the lower mold 220 stores a fluid resin (not shown) formed by melting a resin tablet. The fluid resin is pressed from below and injected into the cavity 270 through the cull portion 240, the runner portion 250, and the gate portion 260 in this order. The substrate 280 is a wiring member on which the chip 290 is mounted, and is previously placed on the lower mold 220 below the cavity 270. The electrodes (both not shown) of the substrate 280 and the chip 290 are electrically connected by a wire 300. The plunger 310 is raised by an actuator (not shown) to press the fluid resin from below. As a result, the resin is injected into the cavity 270.

The resin sealing device according to the present embodiment is typically used for transfer molding shown in FIG. 5, but the scope of the present invention is not limited to this, and the same concept can be applied to compression molding.
The resin sealing device according to the present embodiment typically has the following configuration.
DESCRIPTION OF SYMBOLS 1 Board | substrate conveyance mechanism which has a nail | claw part which can be moved up and down 2. Preheater (heating mechanism) which heats a board | substrate and the nail | claw part holding a board | substrate
3 Lower position of molding die having a member such as a pin for separating the substrate from the claw portion 4 Substrate position adjusting mechanism (positioning mechanism) that moves the end face of the substrate placed on the lower mold
5 Clamping mechanism for clamping the upper and lower molds of the mold

  6A and 6B are diagrams illustrating a state in which the substrate is held by the transport mechanism, where FIG. 6A is a front view viewed from the longitudinal direction (longitudinal direction or length direction of the substrate), and FIG. It is the side view seen from the hand direction or the width direction.

  As shown in FIG. 6, the substrate transport mechanism 10 has a claw portion 11, and the substrate 1 is placed and held on the claw portion 11. The substrate 1 is also referred to as an interposer. For example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, and the like may correspond to this, but the substrate 1 in the present embodiment is typically a thin resin having flexibility. It is a substrate made. In FIG. 6A, only the claw portion 11 is illustrated for the substrate transport mechanism 10.

  Typically, a plurality of electronic components (including chips) are mounted on the substrate 1. The electronic component mounted on the substrate 1 may be an active element such as an IC, a transistor, or an LED, or may be a passive element such as a capacitor or an inductor. The electronic component includes an electronic component using a semiconductor and an electronic component not using a semiconductor.

  The claw portion 11 of the substrate transport mechanism 10 is movable in the vertical direction and the horizontal direction. The substrate transport mechanism 10 includes a substrate holding mechanism that holds the substrate 1 placed on the claw portion 11 during transport. As an example of the substrate holding mechanism, a guide member that can move up and down relatively with respect to the claw portion 11 (typically, a guide pin 12 that presses a side end surface of the substrate may be used, but a pin that presses the upper surface of the substrate. May be added), vacuum chucks, electrostatic chucks, and the like. The substrate holding mechanism has a function of preventing the substrate from being dropped during transportation and a function of preventing the positional deviation of the substrate. The claw portion 11 may be singular or plural, and may have a shape that branches into a plurality from a common portion, in other words, a plurality of branch portions are connected at a common connection portion. It may be a simple shape.

  The substrate platform 20 includes an end platform 21 (first portion) that supports the lower surfaces of both ends of the substrate 1, and an inner platform 22 (second portion) that supports the lower surface of the substrate inside them. The substrate 1 can be positioned by providing the protruding portion 23 including the protruding portion 23 protruding upward on the outside of the substrate mounting surface. When a guide member is provided as a substrate holding mechanism of the substrate transport mechanism 10, a notch is provided in a part of the projecting portion 23, and the guide member is inserted into the notch. As shown in FIG. 6A, the claw portion 11 includes a first claw and a second claw that extend substantially parallel to each other along the direction of insertion into the substrate 1.

  7A and 7B are diagrams showing a first step of transporting the substrate to the lower mold, wherein FIG. 7A is a side view seen from the width direction, and FIG. 7B is a top view seen from the upper direction. 8 to 10 are side views showing the second to fourth steps following the first step shown in FIG. 7, respectively. In FIG. 7B, only the claw portion 11 is illustrated for the substrate transport mechanism 10, and the substrate 1 is not illustrated.

  In the example shown in FIGS. 7 to 10, the lower mold 30 includes pins 31 as substrate support members. The pin 31 functions as a substrate lower surface support member that supports the lower surface of the substrate 1 when the claw portion 11 that holds the substrate 1 is lowered (see FIG. 8). As a result, the substrate 1 is transferred from the claw portion 11 to the pin 31. Prior to the lowering of the claw part 11, the substrate 1 held on the claw part 11 is inserted between the upper mold and the lower mold 30 together with the claw part 11 along the horizontal direction. The first claw and the second claw extend substantially parallel to each other along the insertion direction of the.

  Thus, according to the pin 31, when the nail | claw part 11 is extracted from between the upper mold | type and the lower mold | type 30 along a horizontal direction, it can contact the board | substrate 1 and the board | substrate 1 can be stopped.

  Further, according to the pin 31, the substrate 1 can be supported at a position between the upper mold and the lower mold 30 in a state where the claw portion 11 is extracted from between the upper mold and the lower mold 30.

  By providing the pin 31, it is possible to suppress the substrate 1 from being inclined and curved when the claw portion 11 is pulled out (see FIG. 9).

  The lower mold 30 is provided with a fixing mechanism that fixes the substrate 1. Typically, vacuum suction is used in which suction holes are provided in the lower mold 30 and vacuum suction is performed from the suction holes, but the scope of the present invention is not limited to this. Instead of vacuum suction, electrostatic suction, a mechanical clamp mechanism, or the like can be used. The substrate 1 is fixed by the fixing mechanism after the substrate positioning (substrate position adjustment) described later.

  The pin 31 can move up and down. After the substrate 1 is transferred to the pins 31, the pins 31 are lowered before fixing the substrate 1 to the lower mold 30 (see FIG. 10). The substrate 1 can be placed on the lower mold 30 by lowering the pins 31.

  11 to 13 are views showing first to third steps of positioning in the longitudinal direction (length direction) of the substrate, respectively. 11 to 13, (a) is a side view seen from the width direction, and (b) is a top view seen from the upper direction. 11B, 12B, and 13B, only the claw portion 11 is illustrated for the substrate transport mechanism 10. FIG.

  In the example shown in FIGS. 11 to 13, the lower mold 30 is provided with a pin 32 that functions as a stopper for pressing the end surface of the substrate when the claw portion 11 that holds the substrate 1 moves in the horizontal direction. When the claw portion 11 is pulled out from the upper portion of the lower mold 30, the side end surface of the substrate 1 contacts the pin 32. Thereby, positioning of the board | substrate 1 in the longitudinal direction is performed. That is, the pin 32 has a function of positioning the substrate 1.

  The pin 32 is supported by an elastic body such as a spring, and moves downward by being pressed by the upper mold during mold clamping. The upper end of the pin 32 coincides with the mold surface by mold clamping.

  Thus, the pin 32 functions as a positioning member for the positioning mechanism (position adjustment mechanism).

  In the positioning process in the substrate longitudinal direction of FIGS. 11 to 13, the pin 31 of the example described with reference to FIGS. 8 to 10 may or may not be used.

  When the pin 31 is not used, the pin 32 also functions as a substrate support member that supports the substrate. When the claw portion 11 is extracted from between the upper die and the lower die 30 along the horizontal direction, The substrate 1 is stopped by contact.

  When the pin 31 is used, the upper end position of the pin 31 may be set lower than the upper end position of the pin 32. Further, when the pin 31 is used, it is possible to suppress the substrate 1 from being inclined and curved when the nail part 11 is pulled out, as compared with the case where the pin 31 is not used.

The board | substrate 1 can be mounted in the lower mold | type 30 by the operation | movement shown in FIGS.
FIGS. 14 to 16 are views showing first to third steps of positioning in the short direction (width direction) of the substrate, respectively. 14 to 16, (a) is a side view seen from the width direction, and (b) is a top view seen from above.

  14 to 16, the position adjustment (positioning) of the substrate 1 in the short direction is performed using the substrate positioning mechanism 40 (substrate position adjusting mechanism). The substrate positioning mechanism 40 includes a claw portion 41 that is a positioning member for pushing the substrate 1. A step portion 33 is provided on the mold surface of the lower mold 30, and the end surface on the opposite side of the substrate 1 is pushed by the claw portion 41 so that one end surface of the substrate 1 is brought into contact with the step portion 33 (see FIG. 15). Alignment is performed (see FIG. 16). 14B, 15B, and 16B, only the claw portion 41 is illustrated for the substrate positioning mechanism 40. FIG.

  FIGS. 17 to 20 are diagrams showing first to fourth steps of a modification example of the positioning of the substrate. 17 to 20, (a) is a side view seen from the width direction, and (b) is a top view seen from above. A modified example of the positioning of the substrate described with reference to FIGS. 17 to 20 is positioning that can be performed after the placement operation of the substrate 1 described with reference to FIGS.

  In the example shown in FIGS. 17 to 20, a claw portion 42 which is a longitudinal direction positioning member is provided in the substrate positioning mechanism 40 in addition to the claw portion 41 for positioning in the short direction. The lower mold 30 is provided with a pin 34 that is a member for positioning in the longitudinal direction. The pin 34 can be made shorter than the pin 32 as the end surface pressing stopper described above.

  First, the claw portion 42 for positioning in the longitudinal direction is brought into contact with the end face of the substrate (FIG. 18), and is pushed until the end face on the opposite side of the substrate 1 hits the positioning pin 34 (FIG. 19). Thereafter, the claw portion 41 for positioning in the short direction is brought into contact with the end surface of the substrate, and is pushed until the end surface on the opposite side of the substrate 1 abuts against the stepped portion 33 of the lower mold 30 (FIG. 20). In FIG. 17B, FIG. 18B, FIG. 19B, and FIG. 20B, only the claw portion 41 and the claw portion 42 of the substrate positioning mechanism 40 are illustrated.

  In the examples of FIGS. 17 to 20, positioning in the short direction is performed after positioning in the longitudinal direction, but this order may be reversed, and positioning in the two directions of the longitudinal direction and the short direction may be performed. It may be performed simultaneously.

  Further, the claw portions 41 and 42 can be moved independently of each other, and positioning in the short direction can be performed in a state where the contact of the end surface of the substrate by the claw portion 42 for positioning in the longitudinal direction is released.

  FIG. 21 is a flowchart showing the resin sealing method according to the present embodiment. As shown in FIG. 21, the resin sealing method according to the present embodiment includes a step of holding the substrate 1 by the substrate transport mechanism 10 (S10) and a preheating step of heating at least the claw portion 11 holding the substrate 1 ( S20), the substrate 1 is transported above the lower mold 30 of the molding die, and the claw portion 11 is pulled out in a state where the substrate 1 is supported by the pins 31 and / or the pins 32 of the lower mold 30, and the substrate 1 is removed. A process of placing on the lower mold 30 (S30), a process of adjusting the position of the substrate 1 by aligning the end face of the substrate 1 on the lower mold 30 (S40), and a state in which resin is supplied to the pot of the mold And a step of clamping the upper die and the lower die and performing resin sealing (S50). Part or all of the positioning (S40), which is the position adjustment of the substrate 1, can be performed simultaneously with the step (S30) of placing the substrate 1 on the lower mold 30.

  FIG. 22 is a view showing a preheater 50 that is a heating mechanism for heating the substrate 1 and the claw portion 11. In the example shown in FIG. 22, the preheater 50 has a recess 51 in a portion corresponding to the claw portion 11 of the substrate transport mechanism 10. As a result, the preheater 50 can be heated by directly contacting the substrate 1. In FIG. 22, the claw part 11 and the preheater 50 are illustrated so as not to contact each other, but the claw part 11 and the preheater 50 can be brought into contact with each other. The contact between the substrate 1 and the claw portion 11 and the preheater 50 may be appropriately designed according to the substrate holding portion of the substrate transport mechanism 10. According to the substrate transport mechanism 10 using the claw portion 11, preheating can be efficiently performed as compared with a substrate transport mechanism using a conventional chuck mechanism. Furthermore, if the preheater 50 is provided with the recess 51, preheating can be performed more efficiently.

  Further, the preheater 50 may be configured to be movable together with the substrate transport mechanism 10 so that it can be preheated during substrate transport. For example, the preheater 50 can be moved integrally with the substrate transport mechanism 10 in the transport of the substrate 1 by the inloader 2000 shown in FIGS. Thereby, time can be shortened and productivity can be improved.

  FIG. 23 is a view showing a modification of the pin protruding from the lower mold 30. The example shown in FIG. 23 is a pin 35 having a stepped structure, and a hole 1A corresponding to a thin portion (projecting portion 35A) on the distal end side is provided in the substrate 1, and the substrate 1 is supported by the mounting portion 35B. The protruding portion 35A is fitted into the hole 1A of the substrate 1 to function as a stopper. The pin 35 functions as a substrate support member, and is a member that can contact the substrate 1 and stop the substrate 1 when the claw portion 11 is extracted from between the upper die and the lower die 30 along the horizontal direction. It becomes. The pin 35 is a member that can support the substrate 1 at a position between the upper mold and the lower mold 30 in a state where the claw portion 11 is extracted from between the upper mold and the lower mold 30. Further, the pin 35 also functions as a member of a positioning mechanism (substrate position adjusting mechanism).

  FIG. 24 is a diagram illustrating a modification of the substrate platform 20. In the example shown in FIG. 24, a plurality (two) of inner placement portions 22A and 22B are provided. The number or arrangement of the inner placement portions can be changed as appropriate.

  In a conventional resin sealing device, a substrate transport mechanism using a chuck mechanism is generally used. In the case of a substrate transport mechanism using a chuck mechanism, the lower surface of the end portion of the substrate is supported by a claw portion of the chuck mechanism. In the lower mold when this transport mechanism is used, a recess is formed at a position where the end of the substrate is disposed. The concave portion is provided so that the claw of the chuck mechanism holding the substrate can enter, and the claw portion can be moved outward from the state to release the substrate.

  On the other hand, in the present embodiment, the lower mold 30 can be pulled out so that the claw portion 11 can be extracted when the lower mold 30 is provided with a recess as in the case of the resin sealing device using the transport mechanism by the chuck mechanism. Will be provided with a recess. However, if there is such a concave portion, the concave portion is formed inside the position where the end portion of the substrate is disposed, which may adversely affect the resin molding. In the present embodiment, this problem is addressed by providing a support mechanism or the like for pulling out the claw portion 11.

  According to the resin sealing device and the resin sealing method according to the present embodiment, the substrate 1 can be placed and transported on the claw portion 11 suitable for the width of the substrate 1 and the like. Can be suppressed, and the substrate 1 can be transported stably. In addition, since the mechanism is simple, it can be easily installed and deployed in existing facilities, and a new substrate transport mechanism can be converted with a relatively low investment.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1,280 Substrate, 11, 41, 42 Claw portion, 1A hole, 30, 110B, 120B, 220 Lower mold, 10 Substrate transport mechanism, 12 Guide pin, 20 Substrate placement portion, 21 End placement portion, 22 Inside Placement part, 23 Protrusion part, 31, 32, 34, 35 Pin, 33 Step part, 35A Protrusion part, 35B Placement part, 40 Substrate positioning mechanism, 50 Preheater, 51 Recess, 100 Toggle link mechanism, 100A, 100B, 100C, 100D Link member, 100E Cross bar, 100F Ball screw, 110, 120 Mold, 110A, 120A, 210 Upper mold, 130 Upper fixed plate, 140 Intermediate plate, 150 Slide plate, 160 Lower plate, 170 Lower fixed plate, 170A fixing member, 180 connecting member, 190 post, 230 pop G, 240 Cull, 250 Runner, 260 Gate, 270 Cavity, 290 Chip, 300 Wire, 310 Plunger, 1000 Mold Mechanism, 2000 Inloader, 3000 Outloader, A Molding Unit, B Inloader Unit, C Outloader unit.

Claims (12)

A substrate transport mechanism including a claw portion movable in a vertical direction and a horizontal direction, and a substrate holding portion capable of holding a substrate placed on the claw portion;
A molding die including an upper die and a lower die, wherein a cavity is formed in at least one of the upper die and the lower die, and the substrate held on the claw portion is arranged along the horizontal direction together with the claw portion. A molding die that is inserted between the upper die and the lower die and includes a support portion that can support the substrate when the claw portion is pulled out from between the upper die and the lower die along the horizontal direction;
A mold clamping mechanism for clamping the upper mold and the lower mold in a state where the substrate is placed on the lower mold, and sealing the substrate with resin in the cavity;
The support portion, when the claw portion along the horizontal direction withdrawn from between the upper mold and the lower mold, in contact with the side end surface of said substrate comprises a stopper that part material of the substrate,
The member for stopping the substrate is provided in the lower mold, and is disposed in a region other than the movement area of the claw portion when the claw portion is extracted from between the upper mold and the lower mold along the horizontal direction.
When the claw portion is extracted from between the upper die and the lower die along the horizontal direction, the upper end of the member that stops the substrate is above the substrate placement surface of the claw portion in the vertical direction. , resin sealing apparatus. A substrate transport mechanism including a claw portion movable in a vertical direction and a horizontal direction, and a substrate holding portion capable of holding a substrate placed on the claw portion;
A molding die including an upper die and a lower die, wherein a cavity is formed in at least one of the upper die and the lower die, and the substrate held on the claw portion is arranged along the horizontal direction together with the claw portion. A molding die that is inserted between the upper die and the lower die and includes a support portion that can support the substrate when the claw portion is pulled out from between the upper die and the lower die along the horizontal direction;
A mold clamping mechanism for clamping the upper mold and the lower mold in a state where the substrate is placed on the lower mold, and sealing the substrate with resin in the cavity;
The support portion can be moved up and down to support the substrate in an internal region at a position between the upper die and the lower die in a state where the claw portion is extracted from between the upper die and the lower die. Including a substrate support member,
The substrate support member is provided in the lower mold, and is disposed in a region other than the movement area of the claw portion when the claw portion is extracted from between the upper mold and the lower mold along a horizontal direction.
When the claw portion is extracted from between the upper die and the lower die along the horizontal direction, the upper end of the member that supports the substrate is set to be higher than the substrate placement surface of the claw portion in the vertical direction. It is, resin sealing apparatus. A positioning mechanism for positioning the substrate inserted between the upper mold and the lower mold ;
The positioning mechanism includes a positioning claw portion provided in the substrate transport mechanism, and the positioning claw portion pushes an end surface of the substrate placed on the lower mold by the positioning claw portion, thereby positioning the positioning die provided in the lower die. The resin sealing device according to claim 1 , wherein the pin is positioned by bringing an end face on the opposite side of the substrate into contact with the pin . 4. The resin sealing device according to claim 1 , wherein the molding die further includes a fixing mechanism capable of fixing the substrate onto the lower die. 5. Further comprising a substrate mounting portion on which the substrate before being inserted between the upper mold and the lower mold is mounted;
Said substrate platform, said comprising a first portion capable of supporting the both widthwise end portions of the substrate, and a second portion capable of supporting a widthwise inward portion of the substrate, any of claims 1 to 4 The resin sealing device according to claim 1. The resin sealing device according to any one of claims 1 to 5 , further comprising a heating mechanism that heats the substrate before the resin sealing. The resin sealing device according to claim 6 , wherein the heating mechanism has a concave portion formed on an upper surface corresponding to the shape of the claw portion. The resin sealing device according to claim 1, wherein the substrate transport mechanism further includes a holding mechanism that holds a side of the substrate during transport of the substrate. Holding the substrate on the claw portion of the substrate transport mechanism;
Preparing a mold including an upper mold and a lower mold, and a cavity formed in at least one of the upper mold and the lower mold;
Inserting the substrate held on the claw portion between the upper mold and the lower mold along the horizontal direction together with the claw portion;
The claw portion is moved in a horizontal direction while supporting the substrate between the upper die and the lower die, the side end surface of the substrate is brought into contact with a member to stop the movement of the substrate, and Extracting the nail portion from between the upper mold and the lower mold;
A step of clamping the upper mold and the lower mold in a state where the substrate is placed on the lower mold and resin-sealing the substrate in the cavity ,
In the step of extracting the claw part from between the upper mold and the lower mold, a member for holding the substrate pulls out the claw part from between the upper mold and the lower mold along the horizontal direction. A resin sealing method in which the upper end of a member that is disposed outside the moving region and stops the substrate in the vertical direction is above the substrate placement surface of the claw portion . Holding the substrate on the claw portion of the substrate transport mechanism;
Preparing a mold including an upper mold and a lower mold, and a cavity formed in at least one of the upper mold and the lower mold;
Inserting the substrate held on the claw portion between the upper mold and the lower mold along the horizontal direction together with the claw portion;
Lowering the claw part and transferring the substrate to a vertically movable substrate support member provided in the lower mold; and
Extracting the claw portion from between the upper mold and the lower mold along the horizontal direction while the substrate is supported by the substrate support member between the upper mold and the lower mold;
A step of lowering the substrate support member and placing the substrate on the lower mold, and clamping the upper mold and the lower mold and resin-sealing the substrate in the cavity,
In the step of transferring the substrate and the step of extracting the claw portion from between the upper die and the lower die, the substrate support member moves the claw portion between the upper die and the lower die along the horizontal direction. A resin sealing method in which the claw part is disposed outside the movement region when the claw part is extracted, and the upper end of the substrate support member is above the substrate placement surface of the claw part in the vertical direction. 11. The resin sealing method according to claim 9, wherein the claw portion includes a first claw and a second claw extending substantially parallel to each other along a direction of insertion of the substrate. Between the step of extracting the claw portion from between the upper die and the lower die and the step of resin-sealing the substrate, the claw portion is placed on the lower die by a positioning claw portion provided in the substrate transport mechanism. 12. The substrate according to claim 9 , wherein the substrate is positioned by pressing the end surface of the substrate that has been pressed so that the end surface on the opposite side of the substrate is brought into contact with a positioning pin provided on the lower mold. The resin sealing method according to claim 1.

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