TWI666104B - Resin sealing device and resin sealing method - Google Patents

Abstract

The resin sealing device includes a substrate conveying mechanism including a claw portion that can be moved in an up-down direction and a horizontal direction; a substrate holding portion that can hold a substrate placed on the claw portion; a molding mold including an upper mold and In the lower mold, a cavity is formed in at least one of the upper mold and the lower mold, and the substrate held on the claw portion is inserted along the horizontal direction with the claw portion to insert the upper mold and the lower mold. Between, it includes a support portion that can support the substrate when the claw portion is pulled out from between the upper mold and the lower mold in a horizontal direction; and a mold clamping mechanism that mounts the substrate to the lower mold. In the latter state, the upper mold and the lower mold are clamped to seal the substrate with resin in the cavity.

Description

Resin sealing device and resin sealing method

The invention relates to a resin sealing device and a resin sealing method.

Generally, a mechanism for conveying an object to be moved relative to a mold of a resin sealing device is a conveying mechanism including a chuck for holding both ends of the object in the lateral direction.

For example, in Japanese Patent Application Laid-Open No. 2009-147188 (Patent Document 1), there is disclosed a conveying mechanism that holds the resin holder that holds the plastic pellets supplied to the mold by the chuck jaws and holds both ends in the lateral direction.

Japanese Patent Application Laid-Open No. 5-343499 (Patent Document 2) and Japanese Patent Application Laid-Open No. 2007-260862 (Patent Document 3) disclose a conveying mechanism that supports a workpiece below with an arm body or the like to transfer the workpiece. However, in a mechanism for conveying an object to a mold of a resin sealing device, it is required to avoid interference with the mold. Therefore, a chuck mechanism such as Patent Document 1 is generally used, and patent documents 2 and Patent Documents are not generally used. 3 the fork body carrying mechanism.

When the width of the object to be conveyed is narrow, when the chuck mechanism holding the lateral ends is used as the conveying mechanism, the deflection of the object to be conveyed during transportation becomes large. In recent years, in the manufacturing process of electronic parts, the enlargement and thinning of substrates before resin sealing are underway. When the relative relativity of the weight of the assembly parts and the like with respect to the rigidity of the substrate becomes large, the deflection of the substrate during transportation becomes large. When deflection becomes larger In this case, it is easy to cause damage to the substrate, deformation of the assembled parts, positional deviation in the forming mold, etc., and the material utilization rate is reduced.

An object of the present invention is to provide a resin sealing device and a resin sealing method that can stably carry a substrate to a molding die.

The resin sealing device of the present invention includes a substrate conveying mechanism including: a claw portion that can be moved in an up-down direction and a horizontal direction; and a substrate holding portion that can hold a substrate placed on the claw portion; a molding die including: The upper mold and the lower mold, a cavity is formed in at least one of the upper mold and the lower mold, and the substrate held on the claw portion is inserted in the horizontal direction together with the claw portion to insert the upper mold and the lower mold. Between the lower molds includes a support portion that can support the substrate when the claw portion is pulled out from between the upper mold and the lower mold in a horizontal direction; and a mold clamping mechanism for placing the substrate to In the state after the lower mold, the upper mold and the lower mold are clamped to seal the substrate with resin in the cavity.

In one embodiment, in the resin sealing device, the supporting portion includes a substrate that can be contacted with the substrate when the claw portion is pulled out between the upper mold and the lower mold along a horizontal direction. Blocks the components of the aforementioned substrate.

In one embodiment, in the above resin sealing device, the support portion includes the claw portion being pulled out from the upper mold and the lower mold by using the upper mold and the lower mold. In between, it can support the components of the aforementioned substrate.

In one embodiment, the above-mentioned resin sealing device further includes a determination of positioning the substrate inserted between the upper mold and the lower mold. 位 机构。 Bit agencies.

In one embodiment, in the above resin sealing device, the forming mold further includes a fixing mechanism capable of fixing the substrate to the lower mold.

In one embodiment, the resin sealing device further includes a substrate mounting portion on which the substrate is inserted before being inserted between the upper mold and the lower mold. The substrate mounting portion includes: Part 1 Can support both lateral ends of the substrate; and a second part can support lateral inner portions of the substrate.

In one embodiment, the resin sealing device further includes a heating mechanism for heating the substrate before the resin is sealed.

In one embodiment, in the resin sealing device, a recessed portion corresponding to the shape of the claw portion of the heating mechanism is formed on the upper surface.

The resin sealing method of the present invention includes: a process of holding a substrate on a claw portion of a substrate conveying mechanism; preparing an upper mold and a lower mold, and forming a mold cavity on at least one of the upper mold and the lower mold A process of inserting the substrate held on the claws along with the claws in a horizontal direction and inserting between the upper mold and the lower mold; between the upper mold and the lower mold, holding A process of pulling out the claws from the upper mold and the lower mold along the horizontal direction in the state of the substrate; and clamping the upper portion of the upper mold while the substrate is placed on the lower mold. And the lower mold to seal the substrate with resin in the cavity.

In one embodiment, in the resin sealing method, the claw portion includes a first claw and a second claw that extend substantially parallel to each other along the insertion direction of the substrate.

In one embodiment, the resin sealing method further includes The process of heating the substrate before being sealed by the resin.

In one embodiment, in the resin sealing method, the substrate is positioned between the upper mold and the lower mold before being sealed by the resin.

According to the present invention, since a substrate can be placed and transported on a claw portion suitable for a substrate width or the like, it is possible to suppress the deflection of the substrate and perform stable transportation of the substrate.

The above and other objects, features, situations, and advantages of the present invention are understood from the following detailed description of the present invention in connection with the accompanying drawings, which should be understood.

1, 280‧‧‧ substrate

1A‧‧‧hole

10‧‧‧ substrate handling mechanism

11, 41, 42 ‧ ‧ ‧ claws

12‧‧‧Guide Pin

20‧‧‧ Substrate mounting section

21‧‧‧ end placement section

22, 22A, 22B ‧‧‧ inside mounting section

23‧‧‧ protrusion

30, 220‧‧‧ lower mold

31, 32, 34, 35‧‧‧ pin body

33‧‧‧fall

35A‧‧‧ Highlight

35B‧‧‧Mounting part

40‧‧‧ substrate positioning mechanism

50‧‧‧preheater

51‧‧‧ recess

100‧‧‧ elbow mechanism

100A ~ 100D‧‧‧ connecting rod member

100E‧‧‧cross bar

100F‧‧‧Ball Screw

110、120‧‧‧Forming mold

110A, 120A, 210‧‧‧

110B, 120B‧‧‧Die

130‧‧‧ Upper fixed plate

140‧‧‧ intermediate plate

150‧‧‧Sliding plate

160‧‧‧lower plate

170‧‧‧ Lower fixed plate

170A‧‧‧Fixed components

180‧‧‧Connecting member

190‧‧‧ cylinder

230‧‧‧tank

240‧‧‧Sorted out

250‧‧‧Gate Department

260‧‧‧Gate Department

270‧‧‧mould cavity

290‧‧‧chip

300‧‧‧Wire

310‧‧‧ plunger

1000‧‧‧ Mould Mechanism Department

2000‧‧‧ Entered the loader

3000‧‧‧Discharge loader

A‧‧‧forming unit

B‧‧‧Enter the loader unit

C‧‧‧Discharge loader unit

FIG. 1 is a plan view showing the overall configuration of a resin sealing device according to an embodiment of the present invention.

Fig. 2 is a view showing a state after adding a molding unit in the resin sealing device shown in Fig. 1.

FIG. 3 is a front view of a mold mechanism part (opening state) included in the resin sealing device shown in FIG. 1. FIG.

Fig. 4 is a front view of a mold mechanism part (clamped state) included in the resin sealing device shown in Fig. 1.

Fig. 5 is a sectional view showing an example of a plunger unit for injecting resin into a cavity formed between an upper mold and a lower mold of a molding die.

6A and 6B are diagrams showing a state in which a substrate is held by a conveying mechanism, FIG. 6A is a front view seen from a vertical direction, and FIG. 6B is a side view seen from a horizontal direction.

Figures 7A and 7B are diagrams showing the first process of transferring the substrate to the lower mold. Figure 7A is a side view seen from the horizontal direction, and Figure 7B is a plan view seen from the top.

FIG. 8 is a side view showing the second process of transferring the substrate to the lower mold.

FIG. 9 is a side view showing the third process of transferring the substrate to the lower mold.

FIG. 10 is a side view showing the fourth process of transferring the substrate to the lower mold.

11A and 11B are diagrams showing the first process of longitudinal positioning of the substrate, FIG. 11A is a side view seen from a horizontal direction, and FIG. 11B is a plan view seen from above.

Figures 12A and 12B are diagrams showing the second process of longitudinal positioning of the substrate, Figure 12A is a side view seen from the lateral direction, and Figure 12B is a plan view seen from the top.

13A and 13B are diagrams showing a third process of longitudinal positioning of the substrate, FIG. 13A is a side view seen from a horizontal direction, and FIG. 13B is a plan view seen from above.

Figures 14A and 14B are diagrams showing the first process of the lateral positioning of the substrate, Figure 14A is a side view seen from the lateral direction, and Figure 14B is a plan view seen from the top.

15A and 15B are diagrams showing the second process of the lateral positioning of the substrate, FIG. 15A is a side view seen from the lateral direction, and FIG. 15B is a plan view seen from the top.

16A and 16B are diagrams showing the third process of lateral positioning of the substrate, FIG. 16A is a side view seen from the lateral direction, and FIG. 16B is a plan view seen from the top.

17A and 17B are diagrams showing a first process of a modified example of substrate positioning, FIG. 17A is a side view seen from a horizontal direction, and FIG. 17B is a plan view seen from above.

18A and 18B are diagrams showing a second manufacturing process of a modified example of substrate positioning, FIG. 18A is a side view seen from a horizontal direction, and FIG. 18B is a plan view seen from above.

19A and 19B are diagrams showing a third process of a modification example of the positioning of the substrate, FIG. 19A is a side view seen from a horizontal direction, and FIG. 19B is a plan view seen from above.

20A and 20B are diagrams showing a fourth process of a modification example of the positioning of the substrate, FIG. 20A is a side view seen from a horizontal direction, and FIG. 20B is a plan view seen from above.

Fig. 21 is a flowchart showing a resin sealing method according to an embodiment of the present invention.

Fig. 22 is a diagram showing a heating mechanism (preheater) for heating a substrate.

Fig. 23 is a diagram showing a modified example of the pin body protruding from the lower die.

Fig. 24 is a diagram showing a modification example of the substrate mounting portion.

Hereinafter, embodiments of the present invention will be described. In addition, the same or equivalent parts are given the same reference numerals, and the descriptions thereof may not be repeated.

In addition, in the embodiments described below, when referring to the number and number, etc., the scope of the present invention is not necessarily limited to the number and number, etc., except for the cases specifically described. In addition, in the following embodiments, each constituent element is not necessarily required for the present invention except in the case where it is specifically described.

FIG. 1 is a plan view showing the overall configuration of the resin sealing device of this embodiment. As shown in FIG. 1, the resin sealing device of this embodiment includes, for example, a molding unit A including a mold mechanism unit 1000 including a resin-sealed substrate on which a semiconductor wafer is mounted, and a loader unit B, which includes supplying the substrate to the mold. The entry loader 2000 of the molding die of the unit A; and the discharge loader unit C, which includes a discharge loader 3000 that takes out a molded product from the molding die of the molding unit A, and a storage portion that stores the molded product. The loading loader 2000 and the discharging loader 3000 move upward and downward in the first figure.

The molding unit A, the loader unit B, and the discharge loader unit C are detachably connected to each other through a connection mechanism such as a bolt or a pin body. In the example in FIG. 1, there are two molding units A, but this number is based on the production volume and can be adjusted by increasing or decreasing. There may be one molding unit A, as shown in FIG. 2, for example, four molding units may be added. In other words, the resin sealing device of this embodiment can be configured to increase or decrease the number of molding units.

In the examples of FIGS. 1 and 2, the molding unit A, the entry loader unit B, and the discharge loader unit C are arranged in this order. However, for example, the molding unit A and the entry loading The mother machine integrated with the loader unit B and the discharge loader unit C is juxtaposed with one or more slave machines including only the molding unit A to form a resin sealing device.

Next, an example of the structure of the mold mechanism part 1000 is demonstrated using FIG.3 and FIG.4. 3 and 4 are front views showing a mold opening state and a mold clamping state of the mold mechanism part 1000, respectively.

As shown in FIGS. 3 and 4, the mold mechanism part 1000 includes two molding dies 110 and 120 that are stacked in a vertical direction. Forming die The tool 110 includes an upper mold 110A and a lower mold 110B, and the molding mold 120 includes an upper mold 120A and a lower mold 120B.

The mold mechanism part 1000 further includes: an upper fixed plate 130, an upper mold 110A for fixing the forming mold 110; an intermediate plate 140, a fixed mold 110 for the lower mold 110B and an upper mold 120A for the forming mold; a sliding plate 150, for fixing the mold 120 Lower mold 120B; lower plate 160 is provided below sliding plate 150; lower fixing plate 170 is provided below lower plate 160; connecting member 180 connects intermediate plate 140 and lower plate 160; and pillar 190 connects The upper fixed plate 130 and the lower fixed plate 170.

The intermediate plate 140 and the sliding plate 150 are movable in the vertical direction relative to the upper fixed plate 130 and the lower fixed plate 170. The lower plate 160 and the slide plate 150 connected to the intermediate plate 140 are driven in the vertical direction by the toggle lever mechanism 100 provided below the slide plate 150. Thereby, the mold opening state (FIG. 3) and the mold clamping state (FIG. 4) of the molding dies 110 and 120 are switched.

The toggle lever mechanism 100 includes: a link member 100A and a moving sliding plate 150; the link member 100B has a half length relative to the link member 100A and moves the intermediate plate 140 through the lower plate 160; the link member 100C is connected The link members 100A, 100B; and the link member 100D, connecting the link member 100C with the cross bar 100E and the ball screw 100F. The clamping force of the forming dies 110 and 120 is transmitted to the intermediate plate 140 and the sliding plate 150 through the ball screw 100F and the link members 100A to 100D. At this time, when the intermediate plate 140 moves a distance L, the slide plate 150 moves a distance of 2L. Thereby, the molding dies 110 and 120 can be clamped simultaneously.

An end portion of one side of the link member 100C is rotatably connected to The fixed member 170A which is immovable with respect to the lower fixed plate 170, and the other end portion of the link member 100C is rotatably connected to the link member 100A. The link member 100B is rotatably connected to the link member 100C at a midpoint position between the end of the one side and the end of the other side.

The mold mechanism part 1000 shown in Figs. 1 to 4 is used. When resin molding is performed, in the state of the upper mold 110A of the fixed mold 110, the toggle lever mechanism 100 provided below the slide plate is used to The intermediate plate 140 is moved only by a distance L, and at the same time, the slide plate 150 is moved only by a distance of 2L, and the required clamping force is applied to the forming dies 110, 120.

Moreover, the scope of the present invention is not limited to those laminated by the molding dies 110 and 120. A forming unit composed of one forming mold can also be included in the scope of the present invention. In addition, the scope of the present invention is not limited to those in which the driving mechanism for driving the molding die in the vertical direction is the toggle lever mechanism 100. For example, an elbow mechanism may not be used, the drive source may be an electric motor such as a servo motor, and the transmission member may be a ball screw, or the drive source may be a hydraulic cylinder, and the transmission member may be a rod, which may be included in the present invention. Within range.

Fig. 5 is a sectional view showing an example of a plunger unit for injecting resin into a cavity formed between an upper mold and a lower mold. The upper mold 210 and the lower mold 220 in FIG. 5 correspond to the upper molds 110A and 120A and the lower molds 110B and 120B shown in FIGS. 3 and 4, respectively. In the tank body 230 provided in the lower mold 220, a fluid resin (none of which is shown) formed by melting plastic pellets is stored. This fluid resin is pressed from below and is sequentially injected into the cavity 270 through the pick-out portion 240, the runner portion 250, and the gate portion 260. The substrate 280 is a wiring member on which the wafer 290 is assembled, and the substrate 280 is placed on the lower mold 220 under the cavity 270 in advance. Substrate 280 The electrodes (all not shown) with the chip 290 are electrically connected by the wires 300. The plunger 310 is raised by an actuator (not shown), and the fluid resin is pressed from below. Thereby, the resin is injected into the cavity 270.

The resin sealing device of this embodiment typically uses the transfer molding shown in FIG. 5, but the scope of the present invention is not limited to this, and the same thinking method can be applied to compression molding.

The resin sealing device of this embodiment typically includes the following structures.

1Substrate conveying mechanism with claws that can move up and down

2 Preheater (heating mechanism) for heating the substrate and the claws of the substrate

3 Lower mold having a mold for forming a member such as a pin body for separating a substrate from a claw portion

4The substrate position adjustment mechanism (positioning mechanism) that performs the operation near the end of the substrate loaded on the lower mold

5Clamping mechanism of upper mold and lower mold of mold clamping mold

Figures 6A and 6B are diagrams showing the state of the substrate held by the conveying mechanism. Figure 6A is a front view seen from the longitudinal direction (longitudinal or longitudinal direction of the substrate), and Figure 6B is from the transverse direction (horizontal or Width direction).

As shown in FIGS. 6A and 6B, the substrate transfer mechanism 10 includes a claw portion 11, and the substrate 1 is placed and held on the claw portion 11. The substrate 1 is also called a plug-in board. For example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, etc. may correspond to this. However, the substrate 1 in this embodiment is typically a thin resin substrate having portability. Moreover, in FIG. 6A, only the board conveyance mechanism 10 is shown. 示 爪 部 11。 11 showing claws.

Typically, a plurality of electronic components (including a wafer) are mounted on the substrate 1. The electronic components mounted on the substrate 1 may be active components such as ICs, transistors, LEDs, or passive components such as capacitors and inductors. The electronic components include electronic components using semiconductors and electronic components not using semiconductors.

The claw portion 11 of the substrate conveyance mechanism 10 is movable in the vertical and horizontal directions. The substrate transfer mechanism 10 includes a substrate holding mechanism that holds the substrate 1 placed on the claw portion 11 during the transfer. As an example of the substrate holding mechanism, a guide member that can be relatively moved up and down relative to the claw portion 11 (typically, it can be a guide pin 12 that pushes the side face of the substrate, but a substrate can also be added Pin body on the top surface), vacuum chuck, electrostatic chuck, etc. The substrate holding mechanism has the function of preventing the substrate from falling during transportation, and the function of preventing the position of the substrate from shifting. The claw portion 11 may be singular or plural, or may have a shape in which plural parts are diverged from a common part, in other words, it may be a shape in which plural divergent parts are connected by a common connection part.

The substrate mounting section 20 includes: an end mounting section 21 (part 1) for supporting the lower surfaces of both ends of the substrate 1; and an inner mounting section 22 (part 2) for supporting the lower surface of the substrate by the inside of these And the protruding portion 23 protrudes upward from the outside of the substrate mounting surface; by providing the protruding portion 23, the substrate 1 can be positioned. When the guide member is provided in the substrate holding mechanism of the substrate conveyance mechanism 10, a configuration is provided in which a notch portion is partially provided in the protruding portion 23, and the guide member is inserted into the notch portion. Further, as shown in FIG. 6A, the structure of the claw portion 11 includes a first claw and a second claw that extend substantially parallel to each other in a direction of being inserted into the substrate 1.

Figures 7A and 7B are diagrams showing the first process of transferring the substrate to the lower mold. Figure 7A is a side view seen from the horizontal direction, and Figure 7B is a plan view seen from the top. Figures 8 to 10 are side views showing the second to fourth processes following the first process shown in Figures 7A and 7B, respectively. In FIG. 7B, only the claw portion 11 is shown with respect to the substrate conveyance mechanism 10, and the substrate 1 is not shown.

In the examples shown in FIGS. 7A to 10, the lower mold 30 includes a pin body 31 as a substrate supporting member. The pin body 31 functions as a support member for supporting the lower surface of the substrate 1 when the claw portion 11 of the substrate 1 is lowered (see FIG. 8). As a result, the substrate 1 is transferred from the claw portion 11 to the pin body 31. Before the claw portion 11 is lowered, the substrate 1 held on the claw portion 11 is inserted between the upper mold and the lower mold 30 along the horizontal direction together with the claw portion 11; however, the structure of the claw portion 11 includes A first claw and a second claw extending substantially parallel to each other in the direction of insertion of the substrate 1. In this way, when the claw portion 11 is pulled out from the upper mold and the lower mold 30 in the horizontal direction according to the pin body 31, the substrate 1 can be contacted to stop the substrate 1.

When the pin body 31 is used, the substrate 1 can be supported by the position between the upper mold and the lower mold 30 in a state where the claw portion 11 is pulled out from between the upper mold and the lower mold 30.

By providing the pin body 31, when the claw portion 11 is pulled out, it is possible to suppress the substrate 1 from being inclined and bent (see FIG. 9).

The lower mold 30 is provided with a fixing mechanism for fixing the substrate 1. Typically, the scope of the present invention is not limited to the use of a suction hole provided in the lower mold 30, and a vacuum is sucked from the suction hole for suction. Instead of vacuum suction, electrostatic suction, mechanical clamping mechanism, etc. may be used. The substrate 1 is fixed by the fixing mechanism after the substrate positioning (substrate position adjustment) described later.

The pin body 31 is movable up and down. After the substrate 1 is transferred to the pin body 31, the pin body 31 is lowered before the substrate 1 is fixed to the lower mold 30 (see FIG. 10). The lower pin body 31 can be used to place the substrate 1 on the lower mold 30.

11A to 13B are diagrams showing the first to third processes of positioning the substrate in the longitudinal direction (longitudinal direction), respectively. Figures 11A, 12A, and 13A are side views as viewed from the lateral direction, and Figures 11B, 12B, and 13B are plan views as viewed from above. In FIGS. 11B, 12B, and 13B, only the claw portion 11 is shown with respect to the substrate conveyance mechanism 10.

In the example shown in FIGS. 11A to 13B, when the claw portion 11 holding the substrate 1 moves in the horizontal direction, a pin body 32 that functions as a stopper that pushes the end surface of the substrate is provided in the lower mold. 30 on. When the claw portion 11 is pulled out from the upper portion of the lower mold 30, the side end surface of the substrate 1 abuts on the pin body 32. Thereby, the longitudinal positioning of the substrate 1 is performed. That is, the pin body 32 has a function of positioning the substrate 1.

The pin body 32 is supported by an elastic body such as a spring, and is moved downward by pressing the upper mold during mold clamping. The upper end of the pin body 32 is aligned with the mold surface by clamping.

In this way, the pin body 32 functions as a positioning member of the positioning mechanism (position adjustment mechanism).

Moreover, in the positioning process of the substrate in the longitudinal direction in FIGS. 11A to 13B, the pin body 31 which has been described with reference to FIGS. 8 to 10 may be used or may not be used. In addition, it can be seen from the embodiment shown in FIG. 12A of this case that when the claw portion 11 is pulled out from the upper mold and the lower mold along the horizontal direction, the member of the substrate 1 is blocked in the vertical direction ( For example, the upper end of the pin body 32) in FIG. 12A is higher than the substrate mounting surface of the claw portion 11.

When the pin body 31 is not used, the pin body 32 also functions as a support The function of the substrate supporting member of the substrate, when the claw portion 11 is pulled out from the upper mold and the lower mold 30 in the horizontal direction, contacts the substrate 1 to stop the substrate 1.

When the pin body 31 is used, the position of the upper end of the pin body 31 may be lower than the position of the upper end of the pin body 32. In addition, when the pin body 31 is used, compared with a case where the pin body 31 is not used, when the claw portion 11 is pulled out, it is possible to suppress the substrate 1 from being inclined and bent.

By the operations shown in FIGS. 11A to 13B, the substrate 1 can be placed on the lower mold 30.

FIGS. 14A to 16B are diagrams showing the first to third processes for positioning the substrate in the lateral direction (width direction), respectively. Figures 14A, 15A, and 16A are side views as viewed from the lateral direction, and Figures 14B, 15B, and 16B are plan views as viewed from above.

In the examples of FIGS. 14A to 16B, the substrate positioning mechanism 40 (substrate position adjustment mechanism) is used to adjust the lateral position (positioning) of the substrate 1. The substrate positioning mechanism 40 includes a claw portion 41 as a positioning member for pushing the substrate 1. A drop portion 33 is provided on the die surface of the lower mold 30, and the claw portion 41 pushes the end portion on the opposite side of the substrate 1 to lean against the end surface, so that one end surface of the substrate 1 abuts on the drop portion 33 (refer to FIGS. 15A and 15B) and (See Figures 16A and 16B). In FIGS. 14B, 15B, and 16B, only the claw portion 41 is shown with respect to the substrate positioning mechanism 40.

17A to 20B are diagrams showing the first to fourth processes of the modification example of the substrate positioning, respectively. Figures 17A, 18A, 19A, and 20A are side views seen from the lateral direction, and Figures 17B, 18B, 19B, and 20B are top views seen from above. Moreover, refer to FIG. 17A The modified example of the positioning of the substrate illustrated in FIG. 20B is the positioning that can be performed after the operation of placing the substrate 1 described with reference to FIGS. 7A to 10.

In the example shown in FIGS. 17A to 20B, the claw portion 42 serving as the longitudinal positioning member is provided in addition to the claw portion 41 for lateral positioning, and is further provided in the substrate positioning mechanism 40. A pin body 34 is provided in the lower mold 30 as a member for vertical positioning. The pin body 34 may be shorter than the pin body 32 used as the above-mentioned end surface pusher.

First, the claw portion 42 for vertical positioning is brought into contact with the end portion of the substrate (FIGS. 18A and 18B) until the end surface on the opposite side of the substrate 1 touches the positioning pin body 34, and is pushed against the end surface (the 19A and 19B). After that, the claw portion 41 for lateral positioning is brought into contact with the end surface of the substrate until the end surface on the opposite side of the substrate 1 touches the drop portion 33 of the lower mold 30 and is pushed to lean against the end surface (FIGS. 20A and 20B). 17B, 18B, 19B, and 20B, only the claw portion 41 and the claw portion 42 are shown with respect to the substrate positioning mechanism 40.

In the example of FIGS. 17A to 20B, after the vertical positioning, the horizontal positioning is performed. However, this order can be reversed, and the vertical and horizontal bidirectional positioning can be performed simultaneously.

Alternatively, the claw portions 41 and 42 may be independently moved, and the lateral positioning may be performed in a state where the substrate end faces abutted by the claw portions 42 for vertical positioning are released.

Fig. 21 is a flowchart showing a resin sealing method according to this embodiment. As shown in FIG. 21, the resin sealing method according to this embodiment includes a manufacturing process (S10), and the substrate 1 is held by the substrate transfer mechanism 10; and a preheating process (S20), Heating keeps at least the claw portion 11 of the substrate 1; in the process (S30), the substrate 1 is transported above the lower mold 30 of the molding die, and the substrate 1 is supported by the lower mold 30 pin body 31 and / or the pin body 32, and then pulled out. The claw portion 11 is used to place the substrate 1 on the lower mold 30; the process (S40) is performed to lean the end surface of the substrate 1 on the lower mold 30 to adjust the position of the substrate 1; and the process (S50) is to supply the resin to the molding In the state behind the can body of the mold, the upper mold and the lower mold are clamped for resin sealing. Moreover, part or all of the positioning (S40) for adjusting the position of the substrate 1 can be performed simultaneously with the process (S30) of placing the substrate 1 on the lower mold 30.

FIG. 22 is a diagram showing a preheater 50 as a heating mechanism for heating the substrate 1 and the claw portion 11. In the example shown in FIG. 22, the preheater 50 has a recessed portion 51 in a portion corresponding to the claw portion 11 of the substrate conveyance mechanism 10. As a result, the preheater 50 can directly contact the substrate 1 to heat it. In addition, in FIG. 22, although the claw portion 11 and the preheater 50 are not in contact with each other, the claw portion 11 and the preheater 50 may be in contact. Regarding the contact between the substrate 1 and the claw portion 11 and the preheater 50, the substrate holding portion corresponding to the substrate conveyance mechanism 10 may be appropriately designed. When the substrate conveyance mechanism 10 using the claw portion 11 is used, the preheating can be performed efficiently in comparison with the conventional substrate conveyance mechanism using a chuck mechanism. Further, if the recessed portion 51 is provided in the preheater 50, the preheating can be performed more efficiently.

In addition, a person who can move the preheater 50 together with the substrate conveyance mechanism 10 may have a structure capable of preheating during substrate conveyance. For example, the preheater 50 and the substrate conveyance mechanism 10 can be moved integrally while the substrate 1 is conveyed into the loader 2000 shown in FIGS. 1 and 2. This makes it possible to reduce time and improve productivity.

FIG. 23 is a diagram showing a modified example of the pin body protruding from the lower mold 30 Illustration. In the example shown in FIG. 23, a pin body 35 having a drop structure is provided with a hole 1A corresponding to a thinner portion on the tip side (a protruding portion 35A) on the substrate 1. The substrate 1 is supported by the placement portion 35B while supporting The protruding portion 35A is combined with the hole 1A of the substrate 1 to function as a stopper. Moreover, this pin body 35 functions as a substrate supporting member. When the claw portion 11 is pulled out from the upper mold and the lower mold 30 along the horizontal direction, it becomes accessible to the substrate 1 to stop the substrate 1 Of the building. In addition, the pin body 35 is a member that can support the substrate 1 by the position between the upper mold and the lower mold 30 after the claw portion 11 is pulled out from between the upper mold and the lower mold 30. In addition, the pin body 35 also functions as a member of the positioning mechanism (substrate position adjustment mechanism).

FIG. 24 is a diagram showing a modified example of the substrate placing section 20. In the example shown in FIG. 24, a plurality of (two) inside placement portions 22A, 22B are provided. The number and arrangement of the inside mounting portions can be appropriately changed.

In the conventional resin sealing device, a substrate transfer mechanism using a chuck mechanism is generally used. When a substrate transfer mechanism of the chuck mechanism is used, the lower surface of the end portion of the substrate is supported by the claw portion of the chuck mechanism. In the case of using this machine feeding mechanism, a recess is formed at the position where the end portion of the substrate is arranged. The recess is grasped by the claw of a chuck mechanism provided to hold the substrate, and from this state, the claw is opened and moved outward to perform the operation of releasing the substrate holding.

In addition, in this embodiment, as with the resin sealing device using the conveying mechanism by the above-mentioned chuck mechanism, when it is desired to set the recessed portion to the lower mold 30 to operate, the recessed portion is set to the lower mold 30 so as to be pulled out. Claw 11. However, when such a recessed portion is provided, a recessed portion is formed on the inner side than the position where the end portion of the substrate is disposed, which may adversely affect resin molding. This embodiment The state is to counteract the related problems by providing a support mechanism and the like when the claw portion 11 is pulled out.

According to the resin sealing device and the resin sealing method according to this embodiment, since the substrate 1 can be placed on the claw portion 11 suitable for the width of the substrate 1, etc., the deflection of the substrate 1 can be suppressed and the substrate 1 can be stably conveyed. . In addition, the mechanism is very simple. Therefore, it is easy to carry and deploy to existing equipment, and it can be converted into a new substrate transfer mechanism with a lower investment.

Although the embodiment of the present invention has been described, the embodiment to be disclosed this time must be considered not as an example at all points, and it is not intended to be limited. The scope of the present invention is expressed by the scope of patent application, and it is also intended to include the meaning equivalent to the scope of patent application and all changes within the scope.

Claims (12)

A resin sealing device includes a substrate conveying mechanism including a claw portion that can be moved in an up-down direction and a horizontal direction; and a substrate holding portion that can hold a substrate placed on the claw portion; a molding mold including an upper mold And the lower mold, a cavity is formed in at least one of the upper mold and the lower mold, and the substrate held on the claw portion is inserted along the horizontal direction with the claw portion to insert the upper mold and the lower mold. Between the molds, the support includes a support portion that can support the substrate when the claw portion is pulled out from between the upper mold and the lower mold in a horizontal direction; and a mold clamping mechanism for placing the substrate onto the lower mold. In the state after the mold, the upper mold and the lower mold are clamped to resin-seal the substrate in the cavity; the support portion includes a portion that allows the claw portion to move in a horizontal direction from the upper mold and the lower mold. When it is pulled out, the side end surface of the substrate can be contacted to stop the members of the substrate; the member to stop the substrate is provided in the lower mold and is arranged when the claw portion is moved forward in the horizontal direction. When the claw portion is pulled out between the upper mold and the lower mold in a horizontal direction when the claw portion is pulled out between the upper mold and the lower mold, the stopper is vertically adjusted. The upper end of the member for stopping the substrate is higher than the substrate placing surface of the claw portion. A resin sealing device includes a substrate conveying mechanism including a claw portion that can be moved in an up-down direction and a horizontal direction; and a substrate holding portion that can hold a substrate placed on the claw portion; a molding mold including an upper mold And the lower mold, a cavity is formed in at least one of the upper mold and the lower mold, and the substrate held on the claw portion is inserted along the horizontal direction with the claw portion to insert the upper mold and the lower mold. Between the molds, the support includes a support portion that can support the substrate when the claw portion is pulled out from between the upper mold and the lower mold in a horizontal direction; and a mold clamping mechanism for placing the substrate onto the lower mold. In the state after the mold, the upper mold and the lower mold are clamped to resin-seal the substrate in the cavity; the support portion includes the claw portion after being pulled out from the upper mold and the lower mold. In this state, at a position between the upper mold and the lower mold, a substrate supporting member for supporting the substrate can be moved up and down in the internal area; the substrate supporting member is provided in the lower mold and is disposed in the When the claw portion is along the horizontal direction, it is out of the moving area of the claw portion when being pulled out between the upper mold and the lower mold; when the claw portion is made horizontally, between the upper mold and the lower mold When pulling out, the upper end of the substrate support member is made to be higher than the substrate mounting surface of the claw portion in the vertical direction. The resin sealing device according to item 1 or 2 of the scope of patent application, further comprising a positioning mechanism for positioning the substrate inserted between the upper mold and the lower mold; the positioning mechanism includes a substrate provided on the substrate The positioning claw portion of the conveyance mechanism pushes the end surface of the substrate placed on the lower mold by the positioning claw portion, so that the end surface on the opposite side of the substrate contacts the positioning pin body provided on the lower mold. While positioning. The resin sealing device according to item 1 or 2 of the scope of patent application, wherein the forming mold further includes a fixing mechanism capable of fixing the substrate to the lower mold. The resin sealing device according to item 1 or 2 of the patent application scope, further comprising a substrate mounting portion on which the substrate is inserted before being inserted between the upper mold and the lower mold. The substrate mounting portion includes : The first part can support the lateral end portions of the substrate; and the second part can support the lateral inner portions of the substrate. The resin sealing device according to item 1 or 2 of the scope of patent application, further comprising a heating mechanism for heating the aforementioned substrate before being sealed by the resin. The resin sealing device according to item 6 of the scope of patent application, wherein the heating mechanism is formed on the upper surface corresponding to the concave portion of the shape of the claw portion. The resin sealing device according to item 1 or 2 of the scope of patent application, wherein the substrate transporting mechanism further includes a holding mechanism that holds the sides of the substrate during the transportation of the substrate. A resin sealing method includes a process of holding a substrate on a claw portion of a substrate transport mechanism, and a process of preparing a molding die including an upper mold and a lower mold, and a cavity formed on at least one of the upper mold and the lower mold. ; The process of inserting the substrate held by the claws along the claws in a horizontal direction and inserting between the upper mold and the lower mold; between the upper mold and the lower mold, supporting the substrate In this state, a process of moving the claw portion in the horizontal direction, making the side end surface of the substrate contact the member to stop the movement of the substrate, and pulling the claw portion from between the upper mold and the lower mold; and The process of clamping the upper mold and the lower mold in a state after the substrate is placed on the lower mold to seal the substrate with the resin in the cavity; the claw portion is lifted from the upper mold and the lower mold. In the process of drawing between the molds, the member that blocks the substrate is arranged in a moving area of the claws when the claws are pulled out between the upper mold and the lower mold along the horizontal direction. In addition, in the vertical direction, so that the upper end line of the stopper member is further above the substrate than the substrate mounting surface of the pawl portion. A resin sealing method includes a process of holding a substrate on a claw portion of a substrate transport mechanism, and a process of preparing a molding die including an upper mold and a lower mold, and a cavity formed on at least one of the upper mold and the lower mold. ; The process of inserting the substrate held on the claws along the claws in a horizontal direction and inserting the upper mold and the lower mold; lowering the claws and transferring the substrate to the Manufacturing process of a substrate support member capable of moving up and down of the lower mold; between the upper mold and the lower mold, in a state where the substrate is supported by the substrate support member, the claw portion is moved in a horizontal direction from the aforementioned A process of pulling out between the upper mold and the lower mold; and in a state where the substrate supporting member is lowered and the substrate is placed on the lower mold, the upper mold and the lower mold are clamped so as to The process of sealing the substrate with resin in the cavity; the process of transferring the substrate and the process of pulling the claws from the upper mold and the lower mold to the substrate supporting member The upper end of the substrate supporting member is arranged in a vertical direction outside the moving area of the claw portion when the claw portion is pulled out from between the upper mold and the lower mold in the horizontal direction, and the upper end of the substrate supporting member is made vertical in the vertical direction. The substrate mounting surface of the claw portion is further above. The resin sealing method according to claim 9 or claim 10, wherein the claw portion includes a first claw and a second claw extending substantially parallel to each other along the insertion direction of the substrate. The resin sealing method according to item 9 or 10 of the scope of application for a patent, wherein between a process of pulling the claw portion from the upper mold and the lower mold and a process of resin sealing the substrate, At the positioning claw portion of the substrate conveying mechanism, the end surface of the substrate placed on the lower mold is pushed so that the end surface on the opposite side of the substrate contacts the positioning pin body provided on the lower mold to perform the foregoing. Positioning of the substrate.