CN110310915B - Ejection mechanism and plastic packaging device - Google Patents

Ejection mechanism and plastic packaging device Download PDF

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Publication number
CN110310915B
CN110310915B CN201910477282.7A CN201910477282A CN110310915B CN 110310915 B CN110310915 B CN 110310915B CN 201910477282 A CN201910477282 A CN 201910477282A CN 110310915 B CN110310915 B CN 110310915B
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Prior art keywords
heat dissipation
ejection mechanism
dissipation plate
abutting
plate
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CN201910477282.7A
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CN110310915A (en
Inventor
姜峰
朱正宇
邢卫兵
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Tongfu Microelectronics Co Ltd
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Tongfu Microelectronics Co Ltd
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Priority to CN201910477282.7A priority Critical patent/CN110310915B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application discloses ejection mechanism and plastic packaging device, this ejection mechanism are used for semiconductor device plastic packaging process, include: the extending assembly comprises at least one abutting piece, and the abutting piece is used for abutting against the heat dissipation plate of the semiconductor packaging device; and the driving component is connected with the extending component and used for driving the abutting piece to move so that the abutting piece drives the heat dissipation plate to move. Through the mode, the ejection mechanism provided by the application can be suitable for a packaging method of plastic packaging after the heat dissipation plate is arranged, and the plastic packaging process is stable.

Description

Ejection mechanism and plastic packaging device
Technical Field
The application relates to the technical field of semiconductors, in particular to an ejection mechanism and a plastic packaging device.
Background
For a semiconductor device with high integration or for a semiconductor device including a high-power chip, since the heat generation amount of the chip is large, it is generally necessary to discharge the heat through a heat dissipation plate.
At present, the common way of arranging the heat dissipation plate is as follows: firstly, plastic packaging is carried out on the semiconductor device, and then a heat dissipation plate is pasted on the surface of the semiconductor device after the plastic packaging is finished. The packaging method of firstly arranging the heat dissipation plate and then carrying out plastic packaging is less, and the plastic packaging device matched with the packaging method is less.
Disclosure of Invention
The technical problem that this application mainly solved provides an ejection mechanism and plastic envelope device, can be applicable to the packaging method who carries out the plastic envelope after setting up the heating panel earlier, and the plastic envelope process is comparatively steady.
In order to solve the technical problem, the application adopts a technical scheme that: the utility model provides an ejection mechanism for semiconductor device plastic envelope process, ejection mechanism includes: the extending assembly comprises at least one abutting piece, and the abutting piece is used for abutting against the heat dissipation plate of the semiconductor packaging device; and the driving component is connected with the extending component and used for driving the abutting piece to move so that the abutting piece drives the heat dissipation plate to move.
In order to solve the technical problem, the other technical scheme adopted by the application is as follows: providing a plastic packaging device for the plastic packaging process of a semiconductor device, wherein the plastic packaging device comprises the ejection mechanism of any embodiment, namely a first ejection mechanism and a second ejection mechanism; the first ejection mechanism and the second ejection mechanism are respectively arranged on one side of a first heat dissipation plate and one side of a second heat dissipation plate which are arranged opposite to the semiconductor packaging device, so that a first abutting piece of the first ejection mechanism drives the second heat dissipation plate to move, and a second abutting piece of the second ejection mechanism drives the first heat dissipation plate to move.
The beneficial effect of this application is: different from the situation of the prior art, the ejection mechanism provided by the application is used for the plastic packaging process of a semiconductor device and comprises an extension assembly and a driving assembly; the extending assembly comprises at least one abutting piece, and the abutting piece is used for abutting against a heat dissipation plate of the semiconductor packaging device; the driving component is connected with the extension component and used for driving the abutting piece to move so that the abutting piece drives the heat dissipation plate to move. The ejection mechanism can be suitable for a packaging method in which plastic packaging is carried out after the heat dissipation plate is arranged, the plastic packaging process is stable, and the plastic packaging quality is high.
Drawings
FIG. 1 is a schematic flow chart illustrating an embodiment of a method for packaging a semiconductor device with double-sided heat dissipation according to the present invention;
fig. 2 is a schematic flow chart illustrating an embodiment of forming a first solder layer on at least a partial region of the first surface of at least one first heat dissipation plate in step S101 in fig. 1;
FIG. 3a is a schematic top view of an embodiment of a first fixing jig;
FIG. 3b is a schematic side view of an embodiment of a first fixing jig;
fig. 4 is a schematic flow chart illustrating an embodiment of forming a second solder layer on at least a partial region of the third surface of at least one second heat dissipation plate in step S101 in fig. 1;
fig. 5 is a schematic flow chart illustrating an embodiment of connecting the first lead frame to an area where at least one first solder layer is not covered by the chip in step S103 in fig. 1;
FIG. 6a is a schematic top view of an embodiment of a first intermediate block;
FIG. 6b is a schematic side view of an embodiment of a first intermediate pad;
FIG. 7a is a schematic top view of an embodiment of a first cover plate;
FIG. 7b is a schematic side view of an embodiment of a first cover plate;
FIG. 8 is a schematic structural view of an embodiment of a first fastener;
fig. 9 is a schematic flow chart illustrating an embodiment of connecting the second lead frame to an area where the at least one second solder layer is not covered by the chip in step S103 in fig. 1;
FIG. 10a is a schematic top view of an embodiment of a first leadframe;
FIG. 10b is a side view of one embodiment of the first lead frame of FIG. 10 a;
FIG. 10c is a side view of a second leadframe embodiment;
FIG. 11 is a schematic structural diagram illustrating an embodiment of step S104 in FIG. 1;
fig. 12 is a schematic structural diagram of an embodiment of a first heat dissipation plate;
fig. 13 is a schematic structural view of an embodiment of a second heat dissipation plate;
FIG. 14 is a flowchart illustrating an embodiment of step S105 in FIG. 1;
FIG. 15 is a schematic structural diagram of an embodiment corresponding to step S105 in FIG. 1;
FIG. 16a is a schematic top view of an embodiment of a first ejection mechanism;
FIG. 16b is a schematic top view of one embodiment of a second ejection mechanism;
FIG. 17 is a schematic structural diagram illustrating an embodiment of a semiconductor device with double-sided heat dissipation according to the present application;
FIG. 18 is a schematic diagram illustrating a top view of one embodiment of the semiconductor device of FIG. 17;
FIG. 19 is a schematic diagram illustrating a top view of another embodiment of the semiconductor device of FIG. 17;
FIG. 20 is a schematic structural diagram of another embodiment of a semiconductor device with double-sided heat dissipation according to the present application;
fig. 21 is a schematic structural diagram of another embodiment of a semiconductor device with double-sided heat dissipation according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an embodiment of a packaging method for a semiconductor device with double-sided heat dissipation according to the present application, the packaging method includes:
s101: a first solder layer is formed on at least a portion of the first surface of the at least one first heat spreader plate and a second solder layer is formed on at least a portion of the third surface of the at least one second heat spreader plate, wherein the first heat spreader plate further includes a second surface disposed opposite the first surface and the second heat spreader plate further includes a fourth surface disposed opposite the third surface.
Specifically, in the present embodiment, the order of forming the first solder layer and the second solder layer is not strictly specified. The first heat dissipation plate and the second heat dissipation plate can be double-sided copper-clad substrates, and the double-sided copper-clad substrates can enable the heat dissipation of subsequently formed semiconductor devices to be more sufficient; of course, in other embodiments, the first heat dissipation plate and the second heat dissipation plate may be replaced with a ceramic substrate, a metal substrate, or the like as needed. The first heat dissipation plate and the second heat dissipation plate may have a square shape, a rectangular shape, a rounded rectangular shape, or the like.
In an application scenario, referring to fig. 2, fig. 2 is a schematic flow chart of an embodiment of forming a first solder layer on at least a partial region of the first surface of at least one first heat dissipation plate in step S101 in fig. 1; the step S101 of forming a first solder layer on at least a partial region of the first surface of the at least one first heat dissipation plate includes:
s201: at least one first heat dissipation plate is disposed in at least one first groove 100 of the first fixing jig 10, the first heat dissipation plate corresponds to the first groove 100 one to one, and a first surface of the first heat dissipation plate is exposed from the first groove 100.
Specifically, as shown in fig. 3 a-3 b, fig. 3a is a schematic top view of an embodiment of the first fixing jig. The first fixing jig 10 is provided with a plurality of first grooves 100 arranged in an array, and the shape of the first grooves 100 is matched with that of the first heat dissipation plate, so that the first heat dissipation plate can be fixed in position in the first grooves 100; for example, the first heat dissipation plate is rectangular, the first groove 100 is also rectangular, and the size of the first groove 100 may be slightly larger than that of the first heat dissipation plate. At this time, in order to reduce damage of the first groove 100 to the corner of the first heat dissipation plate, the corner of the first groove 100 may be designed to be a rounded corner 102. For positioning, the positioning mark 104 may be designed at the edge of the first groove 100, for example, the positioning mark 104 may be an arc extending away from the center of the first groove 100 in fig. 3 a. In addition, in order to allow the liquid to flow out when the first heat dissipation plate is cleaned in a later stage, the bottom of the first groove 100 may be further provided with a plurality of through holes 106. Of course, in other embodiments, the first fixing jig 10 may have other structures, which is not limited in the present application.
S202: a first solder layer is formed on at least a partial region of the first surface.
Specifically, in this embodiment, the first fixing jig 10 loaded with the plurality of first heat dissipation plates in step S201 may be placed in a solder printer, and a first solder layer may be printed and formed on at least a partial area of the first surface of the first heat dissipation plate by using the solder printer, where the at least partial area may be a position where a subsequent first heat dissipation plate needs to be connected to a chip or a first lead frame.
In another application scenario, referring to fig. 4, fig. 4 is a schematic flow chart illustrating an embodiment of forming a second solder layer on at least a partial region of the third surface of at least one second heat dissipation plate in step S101 in fig. 1; the step S101 of forming a second solder layer on at least a partial region of the third surface of the at least one second heat dissipation plate includes:
s301: and arranging at least one second heat dissipation plate in at least one second groove of the second fixing jig, wherein the second heat dissipation plates correspond to the second grooves one to one, and the third surface of each second heat dissipation plate is exposed out of the second groove. Specifically, the step S301 is similar to the step S201, and the second fixing jig has a similar structure to the first fixing jig 10, which is not described herein again.
S302: a second solder layer is formed on at least a partial region of the third surface. Specifically, the step S302 is similar to the step S202, and is not described herein again.
S102: at least one chip is disposed on the first solder layer and/or the second solder layer.
Specifically, in this embodiment, the chip may be provided only on the first solder layer or the second solder layer, or may be provided on both the first solder layer and the second solder layer. Of course, in other embodiments, other components, such as resistors, capacitors, etc., may be provided.
S103: the first lead frame and the second lead frame are connected to areas of the at least one first solder layer and the at least one second solder layer, respectively, not covered by the chip.
Specifically, in an application scenario, please refer to fig. 5, fig. 5 is a flowchart illustrating an embodiment of connecting the first lead frame and the area where the at least one first solder layer is not covered by the chip in step S103 in fig. 1. The step S103 of connecting the first lead frame to the region where the at least one first solder layer is not covered by the chip specifically includes:
s401: the first middle pad 12 is disposed on the first fixing jig 10 on the side carrying the first heat dissipation plate, the first middle pad 12 has at least one first through-hole 120, and the plurality of first solder layers located in the extending direction of the first through-hole 120 are exposed from the first through-hole 120.
Specifically, referring to fig. 3a and 6a together, fig. 6a is a schematic top view of an embodiment of the first middle pad. The first long groove 120 may cover the plurality of first grooves 100 in the extending direction thereof. In order to fix the positions of the first intermediate block 12 and the first fixing jig 10 preliminarily, the edge of the first fixing jig 10 is provided with a concave portion 108 (as shown in fig. 3 b), and the position of the first intermediate block 12 corresponding to the concave portion 108 of the first fixing jig 10 is provided with a convex portion 122 (as shown in fig. 6 b) matching with the concave portion 108.
S402: a first lead frame is disposed in the first elongated slot 120, the first lead frame being in contact with the first solder layer.
Specifically, in the present embodiment, the area of the first lead frame is smaller than the area of the first long slot 120, so that the first lead frame is entirely located in the first long slot 120, and a specific structure of the first lead frame will be described later.
S403: the first cover plate 14 is disposed on a side of the first lead frame away from the first fixing jig 10.
Specifically, in the present embodiment, referring to fig. 7a, fig. 7a is a schematic top view of an embodiment of the first cover plate, fig. 7b is a schematic side view of an embodiment of the first cover plate, the first cover plate 14 is a horizontal substrate, and one first long slot 120 corresponds to one first cover plate 14.
S404: the first cover plate 14, the first intermediate block 12, and the first fixing jig 10 are fixed by the first fixing member 16.
Specifically, in this embodiment, as shown in fig. 3a, 6a, and 7a, at least a portion of an edge of the first fixing jig 10 is provided with a plurality of first via holes 101, at least a portion of an edge of the first middle pad 12 is provided with a plurality of second via holes 124, at least a portion of an edge of the first cover plate 14 is provided with a plurality of third via holes 140, the first via holes 101, the second via holes 124, and the third via holes 140 are in one-to-one correspondence, and the first fixing member 16 is inserted into the first via holes 101, the second via holes 124, and the third via holes 140, so that the first fixing jig 10, the first middle pad 12, and the first cover plate 14 are fixed, and further the position of the first lead frame is fixed.
In an application scenario, as shown in fig. 6a, in the length direction of the first long slot 120, a plurality of second via holes 124 are symmetrically disposed on two opposite sides of the first middle pad 12. Further, each of the two opposite sides of the first middle pad 12 is provided with an even number (e.g., 2, 4, etc.) of second through holes 124, each two adjacent second through holes 124 correspond to one first fixing member 16, the first fixing member 16 is of an n-shaped structure (as shown in fig. 8), the first fixing member 16 includes two protruding columns 160, and the columns 160 may be cylindrical, conical, etc. The first fixing member 16, the first via hole 101, the second via hole 124, and the third via hole 140 are in non-interference fit, so that a certain expansion allowance is given to the first fixing jig 10, the first middle pad 12, and the first cover plate 14 during subsequent reflow fixing. In addition, in the embodiment, the first fixing jig 10, the first middle pad 12, the first cover plate 14, and the first fixing member 16 may be made of a synthetic material (e.g., synthetic plastic, etc.), which has a better mechanical property and absorbs less heat, and has less thermal expansion during subsequent reflow.
S405: and carrying out vacuum reflow treatment on the fixed whole to fixedly connect the first lead frame and the first solder layer.
Specifically, after vacuum reflow treatment, the solder pastes in the first solder layer and the second solder layer are melted and solidified at high temperature, so that the first heat dissipation plate is fixedly connected with the chip/the first lead frame, and the second heat dissipation plate is fixedly connected with the chip/the second lead frame; furthermore, the vacuum reflow technique can also be such that the voids inside the solder paste in the first and second solder layers after reflow are <2%.
S406: and removing the first fixing piece, the first cover plate, the first middle cushion block and the first fixing jig. Specifically, before or after the step S406, the method may further include: cleaning (e.g., liquid cleaning, plasma cleaning, etc.), bonding, etc.
In another application scenario, referring to fig. 9, fig. 9 is a schematic flowchart illustrating an embodiment of connecting the second lead frame and the area where the at least one second solder layer is not covered by the chip in step S103 in fig. 1, where the step S103 of connecting the second lead frame and the area where the at least one second solder layer is not covered by the chip specifically includes:
s501: and arranging a second middle cushion block on one side of the second fixing jig, which is provided with the second heat dissipation plate, wherein the second middle cushion block is provided with at least one through second long groove, and a plurality of second solder layers positioned in the extending direction of the second long groove are exposed out of the second long groove. Specifically, the step S501 is similar to the step S401, and the structure of the second middle pad is similar to that of the first middle pad, which is not described herein again.
S502: and arranging a second lead frame in the second long groove, wherein the second lead frame is in contact with the second solder layer. Specifically, the step S502 is similar to the step S402, and is not described herein again.
S503: and arranging the second cover plate on one side of the second lead frame, which is far away from the second fixing jig. Specifically, step S503 is similar to step S403, and is not described herein again.
S504: and fixing the second cover plate, the second middle cushion block and the second fixing jig by using a second fixing piece. Specifically, the step S504 is similar to the step S404, and is not described herein again.
S505: and carrying out vacuum reflow treatment on the fixed whole to fixedly connect the second lead frame and the second solder layer. Specifically, the step S505 is similar to the step S405, and is not described herein again.
S506: and removing the second fixing piece, the second cover plate, the second middle cushion block and the second fixing jig.
S104: the first lead frame and the second lead frame are oppositely and fixedly arranged, and a preset distance is reserved between the first heat dissipation plate and the second heat dissipation plate.
Specifically, referring to fig. 10a to 10b, fig. 10a is a schematic top view of an embodiment of the first lead frame, and fig. 10b is a schematic side view of the embodiment of the first lead frame in fig. 10 a. The first lead frame 18 includes a first surface 180 and a second surface 182, which are oppositely disposed, wherein the first surface 180 is located on the same horizontal plane, and the second surface 182 is located on a different horizontal plane.
In the present embodiment, the first lead frame 18 includes at least one sub-frame 184 connected to each other, one sub-frame 184 corresponding to one first heat dissipation plate; in the length direction of the first lead frame 18, the sub-frame 184 includes first regions 1840 symmetrically disposed, each of the first regions 1840 includes a first connection portion a and an extension portion B extending from the first connection portion a to the inside of the sub-frame 184, and a distance between the first connection portion a and the first surface 180 is smaller than a distance between the extension portion B and the first surface 180, wherein the first connection portion a may be connected to an adjacent sub-frame 184. The design method can ensure that the subsequent first lead frame 18 and the second lead frame 11 have enough distance without the support of a spacer in the prior art. In addition, in this embodiment, the sub-frame 184 further includes a second region 1842 adjacent to the first region 1840, the second region 1842 includes a pin 18420, and the surface of the pin 18420 is on the same level as the surface of the extension B, so that the subsequent pin 18420 can be electrically connected to a predetermined position on the first heat dissipation plate.
In an application scenario, as shown in a square dashed box in fig. 10B, for clarity of illustration, the pin 18420 is not drawn in the square dashed box, the first region 1840 further includes a transition portion C, the transition portion C extends from the first connection portion a to the extension portion B in a direction away from the first face 180, both the first connection portion a and the extension portion B are parallel to the first face 180, and the transition portion C may extend in a straight line, obliquely, vertically, or in a zigzag manner. At this time, there may be a gap between the transition portion C and the extension portion B and the main body of the first lead frame 18 (as shown by the square dashed box in fig. 10B), or no gap (as shown by the circular dashed box in fig. 10B).
At this time, the second lead frame 11 may have the same structure as the first lead frame 18; alternatively, the structure of the second lead frame 11 may be as shown in fig. 10c, and fig. 10c is a schematic side view of an embodiment of the second lead frame. The first and second surfaces 110a and 112a of the second lead frame 11a may be located on the same horizontal plane. Of course, in other embodiments, the structure of the first lead frame 18 may also be as shown in fig. 10c, and the structure of the second lead frame 11 is shown in fig. 10 b. In step S103, when the first lead frame 18 and the second lead frame 11 are connected to at least one first solder layer and at least one second solder layer, respectively, the second surface 182 of the first lead frame 18 needs to be connected to at least one first solder layer, and the second surface 112 of the second lead frame 11 needs to be connected to at least one second solder layer.
In addition, in the present embodiment, referring to fig. 10a to 10b again, the first connecting portion a is provided with a plurality of positioning holes D, and the positions of the first lead frame 18 and the second lead frame 11 can be relatively fixed by the positioning holes D.
Referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of step S104 in fig. 1, where the step S104 specifically includes: the first surface 180 of the first lead frame 18 is in contact with the first surface 110 of the second lead frame 11, and the positioning holes D of the first lead frame 18 correspond to the positioning holes E of the second lead frame 11 one by one; the positioning holes D of the first lead frame 18 and the positioning holes E of the second lead frame 11 are fixed by a third fixing member (not shown), and the first heat dissipation plate 13 and the second heat dissipation plate 15 have a predetermined distance therebetween. As shown in fig. 10a, two positioning holes D are formed in the area of the first connecting portion a connected between the adjacent subframes 184, and the two adjacent positioning holes are connected by a third fixing member, which may be like the first fixing member 16 and has an n-shaped structure, and the third fixing member includes two extending posts, which may be cylindrical, conical, etc. Of course, more positioning holes D may be disposed in the region where the first connecting portion a is located, for example, 4 positioning holes D, and two of the 4 positioning holes D are disposed side by side.
S105: a molding layer is formed in a region between the first lead frame 18 and the second lead frame 11, wherein the molding layer does not cover the second surface 131 of the first heat dissipation plate 13 and the fourth surface 154 of the second heat dissipation plate 15.
Specifically, in this embodiment, please refer to fig. 12 and 13, in which fig. 12 is a schematic structural diagram of an embodiment of a first heat dissipation plate, and fig. 13 is a schematic structural diagram of an embodiment of a second heat dissipation plate. A plurality of first blind grooves 130 are formed at a portion of the edge of the first heat dissipation plate 13, and a plurality of second blind grooves 150 are formed at a portion of the edge of the second heat dissipation plate 15. As shown in fig. 12, the black dots in fig. 12 are regions where the orthographic projections of the second blind grooves 150 on the first heat dissipation plate 13 are located, and the orthographic projections of the first blind grooves 130 and the second blind grooves 150 on the first heat dissipation plate 13 are not overlapped. The design mode can facilitate the first ejection mechanism and the second ejection mechanism to apply force to the corresponding second heat dissipation plate 15 and the corresponding first heat dissipation plate 13 when the plastic package layer is formed in the later stage, and the working processes of the first ejection mechanism and the second ejection mechanism are specifically described in the following.
In an application scenario, the number of the first blind slots 130 is even, and every two first blind slots 130 are symmetrically arranged on the first heat dissipation plate 13; the number of the second blind grooves 150 is even, and every two second blind grooves 150 are symmetrically disposed on the second heat dissipation plate 15. This design can make the subsequent first ejection mechanism application of force better in the horizontality when second heating panel 15 and second ejection mechanism application of force are in first heating panel 13, and the process of moulding plastics is more steady.
In a further application scenario, the first edge 132 of the first heat dissipation plate 13 is not provided with the first blind groove 130, the second edge 152 of the second heat dissipation plate 15 is not provided with the second blind groove 150, and the first edge 132 and the second edge 152 are overlapped in an orthogonal projection direction perpendicular to the first heat dissipation plate 13. When the molding compound layer is formed later, the molding compound can enter from the gap between the first edge 132 and the second edge 152, so that the molding compound can enter smoothly without being shielded by other components.
Preferably, in this embodiment, the number of the first blind slots 130 is four, two of the first blind slots 130 are disposed on the third side 134 of the first heat dissipation plate 13, and the other two first blind slots 130 are symmetrically disposed on two sides 136 and 138 adjacent to the third side 134; the number of the second blind grooves 150 is four, and two of the second blind grooves 150 are disposed on the fourth edge 158 of the second heat dissipation plate 15, and the other two second blind grooves 150 are disposed on the other side 151 opposite to the fourth edge 158.
Next, the step S105 will be further described with reference to the first ejection mechanism and the second ejection mechanism. Referring to fig. 14-15, fig. 14 is a schematic flowchart illustrating an embodiment of step S105 in fig. 1, and fig. 15 is a schematic structural diagram illustrating an embodiment corresponding to step S105 in fig. 1, where step S105 specifically includes:
s601: a first ejector mechanism 20 is provided on the side of each first heat dissipation plate 13, and a second ejector mechanism 22 is provided on the side of each second heat dissipation plate 15.
Specifically, the first ejection mechanism 20 and the second ejection mechanism 22 may be mounted on an existing plastic mold. The specific structures of the first ejection mechanism 20 and the second ejection mechanism 22 will be described later.
S602: the first ejection mechanism 20 passes through a first blind slot (not shown in fig. 15) of the first heat dissipation plate 13 to apply force to the second heat dissipation plate 15, so that the fourth surface 154 of the second heat dissipation plate 15 is attached to the first plane 200 of the mold cavity; the second ejection mechanism 22 passes through a second blind slot (not shown in fig. 15) of the second heat dissipation plate 15 to apply a force to the first heat dissipation plate 13, so that the second surface 131 of the first heat dissipation plate 13 is attached to the second plane 202 of the mold cavity.
Specifically, the fourth surface 154 of the second heat dissipation plate 15 is attached to the first plane 200, and the second surface 131 of the first heat dissipation plate 13 is attached to the second plane 202 in the above manner, so that the subsequently formed molding compound layer does not extend to the fourth surface 154 and the second surface 131.
In one embodiment, the first ejection mechanism 20 includes a first protruding component 30 and a first driving component 32, where the first protruding component 30 includes at least one first abutting member 300, the first abutting member 300 is used to abut against a heat dissipation plate (e.g., the second heat dissipation plate 15) of the semiconductor device, the first abutting member 300 may be a cylinder, a prism, or the like, and an end of the first abutting member 300 in contact with the second heat dissipation plate 15 is of a non-sharp design, such as an arc, or the like, so as to reduce damage of the first abutting member 300 to the second heat dissipation plate 15; the first driving assembly 32 is connected to the first extending assembly 30 and configured to drive the first abutting member 300 to move, so that the first abutting member 300 drives the second heat dissipation plate 15 to move. The flash condition in the plastic packaging process can be reduced through the design mode, so that the plastic packaging process is more stable.
In one application scenario, the first protruding component 30 further includes: the first carrier 302 includes a first side 3020 and a second side 3022 opposite to each other, at least one first supporting member 300 is fixed on the first side 3020 of the first carrier 302, and the first driving element 32 is fixedly connected to the second side 3022. The number of the first supporting members 300 may be even, and every two first supporting members 300 are symmetrically disposed on the first carrier 302. For example, the first supporting members 300 are symmetrically disposed on two opposite sides of the first carrier 302; alternatively, the first supporting member 300 is disposed on three adjacent sides of the first carrier 302. This design can make the subsequent second heat dissipation plate 15 more uniformly stressed, and the probability of inclination is reduced. In addition, in the embodiment, the first abutting pieces 300 correspond to the first blind grooves on the first heat dissipation plate 13 one to one, and the orthographic projection of the first abutting pieces 300 on the first heat dissipation plate 13 is located in the first blind grooves, so that the first abutting pieces 300 can pass through the first blind grooves and then contact with the second heat dissipation plate 15.
In a further application scenario, the first extension assembly 30 further comprises: at least one first elastic element 304 is elastically disposed between the first carrier 302 and the at least one first supporting element 300, and the first elastic elements 304 correspond to the first supporting elements 300 one to one. For example, the first elastic member 304 may be a spring or the like. Of course, in other embodiments, the first elastic element 304 may also be an elastic whole, and a plurality of first supporting elements 300 may also be fixedly connected to the same first elastic element 304. The first elastic element 304 is disposed to ensure that the abutting force of the first abutting element 300 on the second heat dissipation plate 15 is within a certain range, so that the second heat dissipation plate 15 is not cracked by the first abutting element 300.
In a further application scenario, the first extension assembly 30 further comprises: the first cavity 306, the first cavity 306 may be a cavity having an opening, the first carrier plate 302 is located in the first cavity 306, that is, the first carrier plate 302 is located at the opening of the first cavity 306, the first bottom plate 3060 of the first cavity 306 is provided with at least one first through groove 3062, the first retaining member 300 is inserted in the first through groove 3062, and the first retaining member 300 moves in the first through groove 3062 close to or away from the first bottom plate 3060 under the action of the first driving assembly 32. In this embodiment, one first abutting piece 300 may correspond to one first through groove 3062, or a plurality of first abutting pieces 300 correspond to one first through groove 3062. The first base plate 3060 may be the upper substrate of the mold cavity mentioned above, and the second plane 202 of the mold cavity is the plane on the first base plate 3060.
In addition, in the present embodiment, the first driving assembly 32 may be a cylinder or the like, and the first driving assembly 32 may include: the first cylinder 320 and the first piston rod 322 movably disposed in the first cylinder 320, the end of the first piston rod 322 protruding from the first cylinder 320 is fixedly connected to the first abutting member 300, for example, one end of the first piston rod 322 may be further fixedly connected to the first abutting member 300 through the first carrier plate 302.
In the present embodiment, the structure of the second ejection mechanism 22 is different from that of the first ejection mechanism 20 in the relative positions of the first abutting member 300 and the second abutting member 400. When the first ejection mechanism 20 and the second ejection mechanism 22 are used in cooperation, the first ejection mechanism 20 and the second ejection mechanism 22 form the plastic package device of the present application, and in a direction parallel to the movement direction of the first abutting member 300, orthographic projections of at least one first abutting member 300 and at least one second abutting member 400 do not overlap. The position of the first abutting member 300 corresponds to the position of the first blind slot on the first heat dissipation plate 13, so that the first abutting member 300 can pass through the first blind slot to contact with the second heat dissipation plate 15, the contact point can be shown as a black dot in fig. 13, and the first abutting member 300 drives the second heat dissipation plate 15 to move, so that the second heat dissipation plate 15 abuts against the second bottom plate 4060 of the second cavity 406 of the second ejection mechanism 22. The second abutting member 400 is disposed at a position corresponding to the second blind slot on the second heat dissipation plate 15, so that the second abutting member 400 can pass through the second blind slot to contact the first heat dissipation plate 13, the contact point can be shown as a black dot in fig. 12, and the second abutting member 400 drives the first heat dissipation plate 13 to move, so that the first heat dissipation plate 13 abuts against the first bottom plate 3060 of the first cavity 306 of the first ejection mechanism 20.
In one application scenario, as shown in fig. 16a-16b, fig. 16a is a schematic top view of an embodiment of a first ejection mechanism, and fig. 16b is a schematic top view of an embodiment of a second ejection mechanism. The first side 3020 of the first carrier plate 302 of the first ejection mechanism 20 is not provided with the first abutting member 300, the second side 4020 of the second carrier plate 402 of the second ejection mechanism 22 is not provided with the second abutting member 400, and the first side 3020 and the second side 4020 are overlapped in the orthogonal projection direction perpendicular to the first carrier plate 302, so that the subsequent molding compound is not blocked by the first abutting member 300 and the second abutting member 400 when entering the molding cavity.
Preferably, the number of the first supporting members 300 is four, two of the first supporting members 300 are disposed on the third side 3022 of the first carrier 302, and the other two first supporting members 300 are symmetrically disposed on two sides 3024 and 3026 adjacent to the third side 3022 respectively; the number of the second supporting members 400 is four, and two of the second supporting members 400 are disposed on the fourth side 4022 of the second carrier 402, and the other two second carriers 402 are disposed on the other side 4024 opposite to the fourth side 4022.
S603: a molding layer is formed between the first surface 133 of the first heat dissipation plate 13 and the third surface 156 of the second heat dissipation plate 15.
In a specific application scenario, the overall process of the plastic packaging process corresponding to the step S105 may be: A. placing the first lead frame 18 and the second lead frame 11 with fixed relative positions into a plastic package mold; B. a first ejection mechanism 20 is arranged on one side of each first heat dissipation plate 13, and a second ejection mechanism 22 is arranged on one side of each second heat dissipation plate 15 (only one group is schematically shown in fig. 15); C. the first driving assemblies 32 in all the first ejection mechanisms 20 drive the first abutting pieces 300 to move, so that the fourth surface 154 of the second heat dissipation plate 15 is in contact with the first plane 200; the second driving assemblies 42 in all the second ejection mechanisms 22 drive the second abutting pieces 400 to move, so that the second surface 131 of the first heat dissipation plate 13 is in contact with the second plane 202; D. the plastic package material enters to form a plastic package layer between the first heat dissipation plate 13 and the second heat dissipation plate 15; E. the first driving member 32 drives the first abutting member 300 to retract, and the second driving member 42 drives the second abutting member 400 to retract; moving the whole body out of the plastic package mold after the plastic package is finished; F. and C, placing the first lead frame 18 and the second lead frame 11 which are to be subjected to plastic package and have fixed relative positions into a plastic package mold, and returning to the step B.
S106: the molding layer between the adjacent first heat dissipation plates 13, the first lead frame 18, and the second lead frame 11 are cut off to obtain a single semiconductor device.
Specifically, in the present embodiment, as shown in fig. 10a, the first region 1840 between the adjacent sub-frames 184 of the first lead frame 18 may be cut away, i.e., both the first connecting portion a and the extending portion B of the sub-frame 184 are cut away at this time; of course, in other embodiments, all or part of the extension B may be retained. And a second region 1842 of the first lead frame 18 adjacent to the first region 1840 may be subjected to a rib-cutting bending process to form a lead 18420.
The present application is further described below in the context of a semiconductor device.
Referring to fig. 17-19, fig. 17 is a schematic structural diagram of an embodiment of a semiconductor device with double-sided heat dissipation according to the present application, fig. 18 is a schematic top view of the embodiment of the semiconductor device in fig. 17, and fig. 19 is a schematic top view of another embodiment of the semiconductor device in fig. 17, the semiconductor device including:
a first heat dissipation plate 50 including a first surface 500 and a second surface 502 which are oppositely disposed, the first surface 500 being provided with a first solder layer 52; in this embodiment, the first heat dissipation plate 50 may be a double-sided copper-clad substrate, and the first solder layer 52 may be located at a position to be connected to the chip 54, the leads 56, and the like.
A second heat dissipation plate 58 spaced opposite to the first heat dissipation plate 50 and including a third surface 580 and a fourth surface 582 disposed opposite to each other, the third surface 580 being provided with a second solder layer (not shown in fig. 17), and the first surface 500 and the third surface 580 being disposed opposite to each other; in this embodiment, the second heat dissipation plate 58 may be a double-sided copper-clad substrate, and the second solder layer may be located at a position to be connected to the chip 54, the leads 56, and the like.
At least one chip 54 secured to the first surface 500 of the first heat spreader 50 by a first solder layer 52 (as shown in fig. 17) and/or secured to the third surface 580a of the second heat spreader 58a by a second solder layer 51 (as shown in fig. 20); in this embodiment, other components, such as a capacitor, a resistor, etc., may also be disposed on the first solder layer 52 and/or the second solder layer 51; the plurality of chips 54 on the first heat dissipation plate 50 on one side may also be interconnected by wires.
A molding layer 53 filling a region between the first surface 500 and the third surface 580; in this embodiment, the molding layer 53 may be made of epoxy resin.
A plurality of leads 56, one end of which is fixed to the first surface 500 through the first solder layer 52 and the other end of which protrudes from the molding layer 53, and/or one end of which is fixed to the third surface 580 through the second solder layer 51 and the other end of which protrudes from the molding layer 53; the leads 56 are cut (e.g., bent by cutting ribs) from the first lead frame and/or the second lead frame.
In one embodiment, as shown in fig. 18 to 19, a plurality of first blind grooves 503 are formed at a portion of the edge of the first heat dissipation plate 50, a plurality of second blind grooves 583 are formed at a portion of the edge of the second heat dissipation plate 58, and orthographic projections of the first blind grooves 503 and the second blind grooves 583 on the first heat dissipation plate 50 do not overlap.
In an application scenario, the number of the first blind slots 503 is even, and every two first blind slots 503 are symmetrically disposed on the first heat dissipation plate 50; and/or the number of the second blind grooves 583 is even, and every two second blind grooves 583 are symmetrically arranged on the second heat dissipation plate 58.
In another application scenario, the first side 504 of the first heat sink 50 is not provided with the first blind groove 503, the second side 584 of the second heat sink 58 is not provided with the second blind groove 583, and the first side 504 and the second side 584 overlap in an orthogonal projection direction perpendicular to the first heat sink 50.
Preferably, the number of the first blind grooves 503 is four, two of the first blind grooves 503 are disposed on the third side 506 of the first heat dissipation plate 50, and the other two first blind grooves 503 are symmetrically disposed on two sides 508 and 501 adjacent to the third side 506; the number of the second blind grooves 583 is four, two of the second blind grooves 583 are disposed on the fourth side 586 of the second heat sink 58, and the other two second blind grooves 583 are disposed on the other side 588 opposite to the fourth side 586.
In the above embodiment, as shown in fig. 17, the semiconductor device has no unnecessary metal on the left and right sides; of course, in other embodiments, as shown in fig. 21, the semiconductor device may also include protruding metal portions 55 on the left and right sides, and the connection regions between adjacent lead frames are partially cut off to form the metal portions 55.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (12)

1. The utility model provides an ejection mechanism which characterized in that for semiconductor device plastic envelope process, ejection mechanism includes:
the extending assembly comprises at least one abutting piece, and the abutting piece is used for abutting against the heat dissipation plate of the semiconductor device;
and the driving component is connected with the extending component and used for driving the abutting piece to move so that the abutting piece drives the heat dissipation plate to move.
2. The ejection mechanism of claim 1, wherein the extension assembly further comprises:
the carrier plate comprises a first side and a second side which are arranged oppositely, at least one abutting piece is fixed on the first side of the carrier plate, and the driving assembly is fixedly connected with the second side.
3. The ejection mechanism of claim 2,
the number of the abutting pieces is even, and every two abutting pieces are symmetrically arranged on the carrier plate.
4. Ejection mechanism according to claim 3,
the supporting pieces are symmetrically arranged on two opposite sides of the carrier plate; or the abutting pieces are arranged on three adjacent edges of the support plate.
5. The ejection mechanism of claim 2, wherein the extension assembly further comprises:
and the elastic piece is elastically arranged between the carrier plate and the at least one abutting piece, and the elastic pieces correspond to the abutting pieces one to one.
6. The ejection mechanism of claim 2, wherein the extension assembly further comprises:
the support plate is located in the cavity, at least one through groove is formed in a bottom plate of the cavity, the abutting piece penetrates through the through groove, and the abutting piece moves close to or far away from the bottom plate in the through groove under the action of the driving assembly.
7. The ejection mechanism of claim 1, wherein the drive assembly comprises: the piston rod protrudes out of one end of the cylinder body and is fixedly connected with the abutting piece.
8. A plastic packaging device, characterized in that, it is used in the plastic packaging process of semiconductor devices, the plastic packaging device includes at least one group of the ejection mechanisms of any claim 1-7, which are the first ejection mechanism and the second ejection mechanism respectively; the first ejection mechanism and the second ejection mechanism are respectively arranged on one side of a first heat dissipation plate and one side of a second heat dissipation plate which are arranged opposite to the semiconductor device, so that a first abutting piece of the first ejection mechanism drives the second heat dissipation plate to move, and a second abutting piece of the second ejection mechanism drives the first heat dissipation plate to move.
9. The plastic package device according to claim 8,
in the direction parallel to the movement direction of the first supporting piece, the orthographic projections of at least one first supporting piece and at least one second supporting piece are not overlapped.
10. The plastic package device according to claim 9,
the first side edge of the first carrier plate of the first ejection mechanism is not provided with a first abutting piece, the second side edge of the second carrier plate of the second ejection mechanism is not provided with a second abutting piece, and the first side edge and the second side edge are overlapped in the orthographic projection direction perpendicular to the first carrier plate.
11. The plastic package device according to claim 10,
the number of the first supporting pieces is four, two of the first supporting pieces are arranged on the third side edge of the first carrier plate, and the other two first supporting pieces are symmetrically arranged on two side edges adjacent to the third side edge respectively;
the number of the second supporting pieces is four, two of the second supporting pieces are arranged on a fourth side edge of the second carrier plate, and the other two second carrier plates are arranged on the other side edge opposite to the fourth side edge.
12. The plastic package device according to claim 8,
the first abutting piece drives the second heat dissipation plate to move, so that the second heat dissipation plate abuts against a second bottom plate of a second cavity of the second ejection mechanism; the second abutting piece drives the first heat dissipation plate to move, so that the first heat dissipation plate abuts against the first bottom plate of the first cavity of the first ejection mechanism.
CN201910477282.7A 2019-06-03 2019-06-03 Ejection mechanism and plastic packaging device Active CN110310915B (en)

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