CN211238235U

CN211238235U - Super large step high accuracy lead frame

Info

Publication number: CN211238235U
Application number: CN201922177236.3U
Authority: CN
Inventors: 熊俊; 朱怀亮; 陈杰华; 熊志; 张欣
Original assignee: Taixing City Yongzhi Electronic Device Co ltd
Current assignee: Taixing City Yongzhi Electronic Device Co ltd
Priority date: 2019-12-06
Filing date: 2019-12-06
Publication date: 2020-08-11
Anticipated expiration: 2029-12-06

Abstract

The utility model provides an ultra-large step distance high precision lead frame, which relates to the technical field of integrated circuit lead wires and lead frames, comprising a plurality of frame units arranged along the length direction of the lead frame, wherein the side walls of adjacent frame units which are close to each other are mutually butted and integrally formed; the frame unit comprises a frame with a square-shaped structure, two ends of the frame along the length direction are symmetrically provided with substrate bases, and the distance between the two adjacent ends of the substrate bases is 77-85 mm; the inner walls of the two sides of the frame along the length direction are respectively provided with a plurality of leads, and the leads on the two sides are arranged in a staggered way. The utility model discloses during the use, the circuit substrate that distance between two base plate seats can satisfy super large step distance uses, and circuit substrate fixes on base plate seat and lead wire and the plastic envelope, and base plate seat and lead wire play the supporting role to circuit substrate. And a plurality of frame unit array sets up conveniently the utility model discloses an integrated into one piece.

Description

Super large step high accuracy lead frame

Technical Field

The utility model relates to an integrated circuit lead wire and lead frame technical field especially relate to a super large step high accuracy lead frame.

Background

The lead frame is used as a chip carrier of an integrated circuit, realizes the electrical connection between the leading-out end of an internal circuit of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires), forms a key structural member of an electrical circuit, and plays a role of a bridge connected with an external lead. Lead frames are required in most semiconductor packages, and are therefore important basic materials in the electronic information industry. With the development of large scale integrated circuits and very large scale integrated circuits, more requirements are placed on the structure of the lead frame.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a super large step size high accuracy lead frame, its user demand that can satisfy super large step size circuit substrate, and the use accuracy is high.

The above technical purpose of the present invention can be achieved by the following technical solutions:

the lead frame with the ultra-large step pitch and high precision comprises a plurality of frame units which are arranged in an array mode along the length direction of the lead frame, wherein the side walls, close to each other, of the adjacent frame units are mutually abutted and integrally formed; the frame unit comprises a frame with a square-shaped structure, two ends of the frame along the length direction are symmetrically provided with substrate bases, and the distance between the ends, close to each other, of the two substrate bases is 77-85 mm; the inner walls of two sides of the frame along the length direction are respectively provided with a plurality of leads, and the leads on two sides are arranged in a staggered manner.

Through adopting above-mentioned technical scheme, compare in the lead frame among the prior art use the punching press method processing maximum step only 50mm-60mm, normally only about 20mm, the utility model discloses frame unit's step is at 110mm-120mm, and the distance between two base plate seats is 77mm-85mm, can satisfy the circuit substrate use of super large step. The utility model discloses during the use, a plurality of chips are fixed on circuit substrate, and circuit substrate fixes on base plate seat and lead wire and the plastic envelope, and base plate seat and lead wire play the supporting role to circuit substrate. And a plurality of frame unit arrays are conveniently arranged, the utility model discloses an it is integrative.

Furthermore, the longitudinal section of the substrate base along the length direction of the frame is of a Z-shaped structure, and one end of the substrate base connected with the frame is higher than one end far away from the frame; the longitudinal section of the lead along the width direction of the frame is of a Z-shaped structure, and one end of the lead connected with the frame is higher than one end far away from the frame.

Through adopting above-mentioned technical scheme, carry out the plastic envelope behind circuit substrate fixes in the frame unit, all set up substrate seat and lead wire to be the zigzag structure, and the structure has the difference in height, on the one hand, conveniently places circuit substrate and fixes on substrate seat and lead wire, and circuit substrate's the copper product back exposes outside when guaranteeing the plastic envelope, guarantees circuit substrate's radiating effect. On the other hand, the plastic package material is prevented from overflowing or damaging the circuit substrate, the structure is simple, and the effect is obvious.

Furthermore, a yielding port is arranged on the substrate base, and the projection of the yielding port in the vertical direction is in a convex shape.

Through adopting above-mentioned technical scheme, the material of base plate seat not only can be saved in the setting of the mouth of stepping down, and the plastic envelope effect when can also effectively guaranteeing the resin plastic envelope avoids the layering, makes the plastic envelope more firm, guarantees the utility model discloses an result of use, its simple structure, the effect is obvious.

Furthermore, the substrate base and the part of the lead wire, which is lower than the upper end surface of the frame, are provided with through locking holes.

By adopting the technical scheme, the circuit substrate is arranged on the lower end faces of the substrate base and the lower end face of the lead, and the plastic package material enters the locking hole to carry out plastic package on the circuit substrate, so that the plastic package force is improved, the plastic package effect on the circuit substrate is ensured, and the plastic package material and the frame unit are prevented from being layered.

Furthermore, the joints of the adjacent frame units are provided with waist-shaped grooves which are arranged along the width direction of the frames and penetrate through the frames, and the centers of the waist-shaped grooves are positioned on the connecting lines of the adjacent frames.

Through adopting above-mentioned technical scheme, the setting up of waist type groove can the effective dispersion stress, avoids the frame to warp, makes things convenient for cutting off of adjacent frame, and its simple structure, the effect is obvious.

Furthermore, two ends of the joint of the adjacent frame units are provided with V-shaped openings, and the top points of the V-shaped openings are positioned on the connecting line of the adjacent frames.

Through adopting above-mentioned technical scheme, the setting of V type mouth plays sign and positioning action when cutting off adjacent frame element, makes things convenient for the cutter to cut into from V type mouth, guarantees frame element's the quality of cutting off, effectively reduces the rejection rate. Meanwhile, the cutter is prevented from leaving traces on the side wall of the frame, and the surface quality of the frame unit is ensured.

Furthermore, a plurality of positioning holes are arranged on one side edge of the frame along the length direction of the frame in an array mode, one positioning hole is located at the connecting position of the adjacent frame units, and the center of the positioning hole is located on the connecting line of the adjacent frame.

Through adopting the technical scheme, the utility model discloses add man-hour, the locating hole plays the positioning action, guarantees to add precision and stability man-hour, and then guarantees the utility model discloses a processingquality and result of use. The V-shaped opening, the waist-shaped groove and the positioning hole at the joint of the adjacent frame units can realize the cutting of the adjacent frame units by using smaller cutting force, and the cutting effect is ensured.

Furthermore, a plurality of poking openings are formed in one side edge of the frame along the length direction of the frame in an array mode, and the poking openings and the positioning holes are located on the two side edges of the frame respectively.

Through adopting above-mentioned technical scheme, dialling the setting of mouthful, the pusher dog can be through dialling mouthful mobile frame unit when welding circuit substrate conveniently, makes things convenient for circuit substrate's installation, its simple structure, and the effect is obvious.

To sum up, the utility model discloses following beneficial effect has:

1. the frame units are arranged in a plurality of arrays, each frame unit comprises a frame, substrate bases are symmetrically arranged at two ends of the frame along the length direction of the frame, and the distance between the ends, close to each other, of the two substrate bases is 77-85 mm; the inner walls of the two sides of the inner side of the side frame along the length direction are respectively provided with a plurality of leads, and the leads on the two sides are arranged in a staggered manner, so that the circuit substrate with ultra-large step pitch can be used, and the use precision is high;

2. through setting up substrate seat and lead wire into zigzag structure, the structure has the difference in height, has fine supporting role to circuit substrate, and circuit substrate's copper product back exposes outside when guaranteeing the plastic envelope, and convenient heat dissipation just avoids the plastic envelope to glue and spills over or damage circuit substrate.

Drawings

FIG. 1 is a schematic view of an overall structure of a super-large step-pitch high-precision lead frame;

fig. 2 is a schematic structural diagram of a frame unit in an ultra-large step pitch high-precision lead frame.

In the figure, 1, a frame unit; 2. a frame; 21. a waist-shaped groove; 22. a V-shaped opening; 23. positioning holes; 24. a kidney-shaped hole; 25. poking the mouth; 3. a substrate holder; 31. a let position port; 4. a lead wire; 5. a locking hole.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

A lead frame with ultra-large step pitch and high precision comprises a plurality of frame units 1 which are arranged in an array along the length direction of the lead frame and are integrally formed, and side walls, close to each other, of the adjacent frame units 1 are mutually abutted. As shown in fig. 1 and 2, each frame unit 1 includes a frame 2 having a rectangular structure, substrate holders 3 are symmetrically disposed at two ends of the frame 2 along a length direction thereof, and the substrate holders 3 are located on a center line of the frame 2 in a width direction thereof. The frame unit 1 has a step pitch of 110mm to 120mm, and the distance between the ends of the two substrate holders 3 close to each other is 77mm to 85 mm. A plurality of lead wires 4 are respectively arranged on the inner walls of the two sides of the frame 2 along the length direction of the frame, and the lead wires 4 on the two sides are arranged in a staggered manner. In the present embodiment, there are two frame units 1. The distance between the ends of the two substrate holders 3 close to each other is 80mm, and two leads 4 are provided on each side.

The distance between the two substrate bases 3 can meet the use requirement of the circuit substrate with the ultra-large step pitch, and the use precision can be ensured. When the circuit board is used, the circuit board is fixed on the substrate base 3 and the lead 4 and is plastically packaged by using resin, and the substrate base 3 and the lead 4 play a role in supporting the circuit board. As shown in fig. 1 and fig. 2, in the present embodiment, the longitudinal section of the substrate holder 3 along the length direction of the frame 2 is in a zigzag structure, and one end of the substrate holder connected to the frame 2 is higher than one end of the substrate holder far away from the frame 2. The longitudinal section of the lead 4 along the width direction of the frame 2 is in a Z-shaped structure, and one end of the lead connected with the frame 2 is higher than one end far away from the frame 2. There is the difference in height in the zigzag structure of base plate seat 3 and lead wire 4, and circuit substrate's bottom is fixed on the lower terminal surface of base plate seat 3 and lead wire 4 low section part, and during the plastic envelope, circuit substrate's the copper product back exposes in the outside, guarantees the radiating effect.

In order to realize the plastic-sealing fixation of the circuit substrate on the substrate base 3, as shown in fig. 1 and 2, a through locking hole 5 is provided at a lower section of the zigzag structure of each substrate base 3 and the lead 4, and two locking holes are symmetrically provided on each substrate base 3 with respect to a center line in the width direction of the frame 2. Still be equipped with on base plate seat 3 and economize material and make things convenient for the mouth 31 of stepping down of plastic envelope, the projection of the mouth 31 of stepping down in vertical direction is the type of calligraphy, and the mouth 31 of stepping down part is located the low section of base plate seat 3, and the part is located the high section of base plate seat 3, and wherein, the head of its protruding type structure is located the low section of base plate seat 3 and is the arc structure. The plastic package material enters the locking hole 5 and the abdicating port 31, so that the resin plastic package effect is ensured, layering is avoided, and the plastic package firmness is improved.

As shown in fig. 1 and 2, a waist-shaped groove 21 is provided at a joint between adjacent frame units 1 and penetrates in the width direction of the side frame 2, and the center of the waist-shaped groove 21 is located on a connecting line between adjacent side frames 2. In this embodiment, two waist-shaped grooves 21 are provided at intervals along the width direction of the frame 2. The waist-shaped groove 21 can disperse stress, avoid deformation of the frame 2 and facilitate cutting off the adjacent frame units 1 with small force. As shown in fig. 1 and 2, V-shaped openings 22 are further provided at both ends of the joint of the adjacent frame units 1, and the apexes of the V-shaped openings 22 are collinear with the center of the kidney-shaped groove 21. The V-shaped opening 22 is arranged to have identification and positioning functions when the adjacent frame units 1 are cut off, the frame units 1 are cut off from the V-shaped opening 22 by the cutter, the cutting quality of the frame units 1 is guaranteed, traces are prevented from being left on the side wall of the frame 2, and the surface quality of the frame units is guaranteed.

As shown in fig. 1 and 2, a plurality of positioning holes 23 are further arranged in an array on one side edge of the side frame 2 along the length direction thereof, one of the positioning holes 23 is located at the connection position of the adjacent frame units 1, and the center of the positioning hole 23 is located on the connection line of the adjacent side frame 2. The positioning holes 23 can play a role in positioning when the frame units 1 are processed, and the positioning holes 23 at the joints of the adjacent frame units 1 facilitate the cutting of the adjacent frame units 1. As shown in fig. 1 and 2, a plurality of dial openings 25 are arranged in an array on the other side edge of the frame 2 along the length direction thereof, the dial openings 25 are rectangular, and the length direction thereof is arranged along the width direction of the frame 2. A plurality of waist-shaped holes 24 are respectively arranged on two side edges of the frame 2 along the length direction, and a plurality of waist-shaped holes 24 which are arranged on the same side with the positioning holes 23 are staggered with the positioning holes 23; two waist-shaped holes 24 which are positioned on the same side with the poking openings 25 are arranged between the two poking openings 25 at the two ends of the frame 2. The waist-shaped hole 24 is convenient for the installation and fixation of the frame 2, and the setting of the poking opening 25 ensures the plastic package effect.

The positioning hole 23 plays a role in fixing the width and length directions of the frame 2, the waist-shaped hole 24 can allow the copper material to move when expanding under heat, and the setting of the poking opening 25 facilitates the poking claw to move the frame unit when welding the circuit substrate. The positioning holes 23, the waist-shaped holes 24 and the poking openings 25 are arranged in a staggered mode, and the strength of the frame 2 is guaranteed.

The utility model discloses a theory of operation and application method:

when the plastic packaging structure is used, the bottom of the circuit substrate is fixed on the back surfaces of the lower sections of the substrate base 3 and the lead 4 and is subjected to resin plastic packaging, wherein plastic packaging glue enters the locking holes 5 and the abdicating ports 31, the plastic packaging force is improved, layering is avoided, and the plastic packaging effect on the circuit substrate is ensured. The distance between the two substrate bases 3 can meet the use requirement of the circuit substrate with the ultra-large step pitch, and the use precision can be ensured.

While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims

1. The utility model provides an ultra-large step high accuracy lead frame which characterized in that: the frame comprises a plurality of frame units (1) arranged in an array along the length direction of the frame units, wherein the adjacent side walls of the frame units (1) are mutually abutted and integrally formed; the frame unit (1) comprises a frame (2) with a clip structure, substrate bases (3) are symmetrically arranged at two ends of the frame (2) along the length direction of the frame, and the distance between the ends, close to each other, of the two substrate bases (3) is 77-85 mm; a plurality of lead wires (4) are respectively arranged on the inner walls of the two sides of the frame (2) along the length direction of the frame, and the lead wires (4) on the two sides are arranged in a staggered mode.

2. The ultra-large step pitch high precision lead frame of claim 1, characterized in that: the longitudinal section of the substrate base (3) along the length direction of the frame (2) is of a Z-shaped structure, and one end of the substrate base connected with the frame (2) is higher than one end far away from the frame (2); the longitudinal section of the lead (4) along the width direction of the frame (2) is of a Z-shaped structure, and one end of the lead connected with the frame (2) is higher than one end of the lead far away from the frame (2).

3. The ultra-large step pitch high precision lead frame of claim 2, characterized in that: the base plate seat (3) is provided with a position yielding opening (31), and the projection of the position yielding opening (31) in the vertical direction is in a convex shape.

4. The ultra-large step pitch high precision lead frame of claim 3, characterized in that: and the substrate base (3) and the part of the lead (4) lower than the upper end surface of the frame (2) are provided with through locking holes (5).

5. The ultra-large step pitch high precision lead frame of claim 1, characterized in that: the connecting part of the adjacent frame units (1) is provided with a waist-shaped groove (21) which is arranged along the width direction of the frame (2) and penetrates through the connecting part, and the center of the waist-shaped groove (21) is positioned on the connecting line of the adjacent frame (2).

6. The ultra-large step pitch high precision lead frame of claim 5, wherein: two ends of the joint of the adjacent frame units (1) are provided with V-shaped openings (22), and the top points of the V-shaped openings (22) are positioned on the connecting line of the adjacent frames (2).

7. The ultra-large step pitch high precision lead frame of claim 1, characterized in that: a plurality of positioning holes (23) are formed in one side edge of the frame (2) along the length direction of the frame in an array mode, one positioning hole (23) is located at the joint of the adjacent frame units (1), and the center of the positioning hole (23) is located on the connecting line of the adjacent frame (2).

8. The ultra-large step pitch high precision lead frame of claim 7, wherein: the frame (2) is provided with a plurality of poking openings (25) along one side edge of the length direction in an array mode, and the poking openings (25) and the positioning holes (23) are located on two side edges of the frame (2) respectively.