JPH11191563A - Molding method and equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding equipment and a method, in which a molding technique is improved in quality and a molding capacity is improved. SOLUTION: This molding equipment is composed of a lower molding die 7 and an upper molding die 8, which are assembled to form a cavity 9 that corresponds to the encapsulating body of a quad flat package(QFP), a pot 11 which is fixed to the lower molding die 7 and possessed of a feed opening 11a and an inlet opening 11b which communicate with the cavity 9, a frame transfer body 21, which supports and transfers a lead frame 2 mounted with a semiconductor chip 1 over the cavity 9 of the lower molding die 7 when the molding dies 7 and 8 are opened, and a tablet transfer body 22 which supports and transfers a tablet 13 between the inlet opening 11b of the pot 11. In this case, the tablet 13 is pressed with a plunger 12 to be introduced into the pot 11 through the inlet opening 11b, the molding dies 7 and 8 are clamped, encapsulating resin is injected into the cavity 9 through the feed opening 11a of the pot 11 to encapsulate the semiconductor chip 1 with resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique and, more particularly, to a method and apparatus for separating a lead frame and a tablet in a resin-encapsulated semiconductor device.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

[0003] A molding apparatus for performing resin molding of a resin-encapsulated semiconductor device such as a QFP (Quad Flat Package) includes:
In some cases, only one transfer means is provided for transferring a lead frame or a tablet on which a semiconductor chip is mounted (solidified sealing resin for easy handling).

[0004] In such a molding apparatus, the lead frame and the tablet are simultaneously transported by the above-mentioned one transport means (transport body).

For example, when a pot is provided in a lower mold (first mold), the lead frame and the tablet are supported by one transport means, and when the mold is opened, the lower mold and the upper mold (first mold) are opened. And two dies).

At this time, the tablet is placed on the pot of the lower mold, and the lead frame is placed on the cavity of the lower mold. Thereafter, the tablet is dropped into the pot from the conveying means. Place the lead frame on the mold cavity.

[0007] A molding apparatus for transporting a lead frame and a tablet by one transport means is described in, for example, Industrial Research Institute, Ltd., November 2, 1994.
Published on May 5, "Ultra LSI Manufacturing and Testing Equipment Guidebook <1
995 edition>, Electronic materials separate volume (1994 separate volume), 1
It is described on pages 18 to 124.

[0008]

However, in the molding apparatus in the above-mentioned technology, since the tablet is transported on the lower die, the powder of the sealing resin generated from the tablet falls on the lower die, and As a result, the powder of the sealing resin may fly up and adhere to the lead frame when the lead frame is transported.

At this time, if the sealing resin powder falls or adheres to the clamping portion of the mold, the inner lead of the lead frame is deformed at the time of mold clamping, and thus, when the sealing body is formed by resin molding. A problem arises in that adjacent inner leads come into contact with each other in the sealing body to cause an electric short circuit.

That is, there is a problem that the quality of the molding technique and the semiconductor device is reduced.

In the molding apparatus, when the tablet is pre-heated, the tablet is pre-heated outside the mold, and then the tablet is transported onto the lower mold.
It is a problem that the temperature of the sealing resin once heated is lowered or the temperature is varied.

Furthermore, since the lead frame and the tablet are transported together by one transport means, they cannot be transported at an optimum timing, which causes a problem that the improvement in the processing capability of the mold is hindered. .

Further, the lead frame and the tablet are
Since this is a mold apparatus that conveys by two conveying means, the conveying means becomes large in size, which causes a problem that the conveying speed of the two cannot be improved.

An object of the present invention is to provide a molding method and apparatus for improving the quality of molding technology and improving the processing ability of a mold.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0016]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, a molding method according to the present invention is a method for molding a semiconductor device, comprising the steps of preparing first and second molds for forming a cavity having a shape corresponding to a sealing body of the semiconductor device; A step of transporting a lead frame having a semiconductor chip mounted on the cavity of the first or second mold; and a tablet of a sealing resin in a pot attached to any of the first or second mold. A step of transporting the tablet between an introduction port to be introduced and a plunger arranged opposite thereto, and after transporting the tablet, pressing the tablet by the plunger to push the tablet from the introduction port. Introducing the sealing resin formed by heating the tablet into a pot; The resin-sealing said semiconductor chip by the inlet and the supply port provided on the opposite side is injected into the cavity of and a step of performing resin molding.

Further, the molding apparatus of the present invention performs resin molding of a semiconductor device. The molding apparatus is installed so as to face each other and has a shape corresponding to the sealing body of the semiconductor device by matching both the molds. First and second molds forming a cavity, a supply port attached to one of the first and second molds and communicating with the cavity, and a sealing resin provided on the opposite side to the supply port. A pot having an inlet into which a tablet is introduced, and a frame for supporting a lead frame on which a semiconductor chip is mounted and transporting the lead frame onto the cavity of the first or second mold when the mold is opened. Transport means, and a tablet for supporting the tablet and transporting the tablet between the inlet of the pot and a plunger arranged opposite thereto; Conveying means, the tablet is pressed by the plunger and introduced into the pot from the inlet, and after closing the mold, the sealing resin formed by heating the tablet is supplied to the supply port of the pot. Then, the semiconductor chip is sealed with a resin by injecting the resin into the cavity, and resin molding is performed.

Thus, the lead frame and the tablet can be transported separately, and the tablet can be transported outside the die, not between the first die and the second die.

Therefore, it is possible to prevent the powder of the sealing resin from dropping onto the first or second mold during the transportation of the tablet. As a result, the powder of the sealing resin adheres to the cavity, Prevents soaring and sticking to the lead frame.

As a result, it is possible to prevent deformation of the inner leads due to powder falling of the sealing resin, and as a result, it is possible to improve the quality of the semiconductor device.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an example of the embodiment of the structure of the molding apparatus according to the present invention. FIG. 2 is an example of the structure of a semiconductor device (QFP) manufactured by resin molding using the molding apparatus shown in FIG. FIG.

The molding apparatus of the present embodiment shown in FIG. 1 performs resin molding in a molding step of a semiconductor manufacturing process to resin-seal the semiconductor chip 1 and the bonding wires 25 in the semiconductor device. In the embodiment, the semiconductor device in which resin molding is performed by the molding device is a QFP (Quad Flat Packag) shown in FIG.
e) Case 16 will be described.

The structure of the molding apparatus according to the present embodiment will be described with reference to FIG. 1 and FIG. Lower mold 7 (first mold) and upper mold 8 (second mold) forming cavity 9
And the lower mold 7 and the cavity 9
And a supply port 11b which is provided on the opposite side of the supply port 11a and into which a tablet 13 of the sealing resin 27 (the sealing resin 27 is hardened so as to be easily handled) is introduced. A pot 11, a frame transporter (frame transport means) 21 that supports the lead frame 2 on which the semiconductor chip 1 is mounted, and transports the lead frame 2 onto the cavity 9 of the lower mold 7 when the mold is opened; 13 and a tablet conveying body (tablet conveying means) 22 for conveying the tablet 13 between the inlet 11b of the pot 11 and the plunger 12 arranged opposite thereto, and the lower mold heat insulating plate 19 The lower mold mounting plate 6 to which the lower mold 7 is attached via the upper mold and the upper mold mounting plate 4 to which the upper mold 8 is attached via the upper mold heat insulating plate 20. The semiconductor chip is pressed by the lancer 12 and introduced into the pot 11 from the inlet 11b, and after clamping, the sealing resin 27 formed by heating the tablet 13 is injected into the cavity 9 from the supply port 11a of the pot 11. 1 is resin-molded by resin sealing.

That is, in the molding apparatus of the present embodiment, the transport system for the lead frame 2 and the transport system for the tablet 13 are completely separated.
When the mold is opened by the frame carrier 21, the tablet 13 is conveyed between the lower mold 7 and the upper mold 8, while the tablet 13 is moved by the tablet carrier 22 into the tablet 13 of the pot 11.
Between the plunger 12 and the inlet 11b.

In this embodiment, the case where the first mold is the lower mold 7 and the second mold is the upper mold 8 will be described. The mold 7 may be used, and the first mold may be the upper mold 8.

The lower mold 7 is provided with a gate 15 serving as an injection port of a sealing resin 27 provided in communication with the cavity 9.
The lower mold 7 and the upper mold 8 are provided in the lower mold 7 and the upper mold 8 when the lower mold 7 and the upper mold 8 are separated from each other after resin molding.
Alternatively, an ejector pin 10 for detaching the QFP 16 from the upper mold 8 is provided.

Here, the molding apparatus includes an upper mold mounting plate 4 mounted on a fixed plate 18 (also referred to as a fixed platen) supported by the column 3 and a movable plate 5 (movable plate) also supported by the column 3. The movable platen 5 is vertically movable by a hydraulically operated cylinder (not shown).

The lower mold mounting plate 6 has a lower mold heat insulating plate 1.
9, the upper die 8 is fixed to the upper die mounting plate 4 via the upper die heat insulating plate 20, and the lower die 7 moves the movable platen 5 up and down. By doing so, it moves toward and away from the upper mold 8. Further, the lower mold 7 and the upper mold 8
When the molding is performed, the cavity 9 for molding the sealing body 16a of the QFP 16 is formed on the molding surface, which is also called a parting surface or a molding division plane.

The upper die mounting plate 4 and the lower die mounting plate 6 each include a heater (not shown), and the heaters heat the upper die 8 and the lower die 7, respectively. It has become.

Further, a cylindrical pot 11 is attached to the lower mold 7 through the lower mold mounting plate 6, and the pot 11 is located below the inlet 11 b of the pot 11.
The plunger 12 is mounted slidably in the axial direction.

Here, the frame carrier 21 supports the lead frame 2 on which the semiconductor chip 1 is mounted and wire-bonded, and is guided by a rail (not shown) when the mold is opened, and the cavity 9 of the lower mold 7 is opened. It is a plate-like member for transporting the lead frame 2 thereon.

The frame carrier 21 supports the lead frame 2 by, for example, vacuum suction or gripping by handling, and transports the lead frame 2 to the gap between the lower mold 7 and the upper mold 8 when the mold is opened. Is what you do.

The tablet carrier 22 is a plate-like member for accommodating the tablet 13 in the tablet accommodating portion 22b provided therein and transporting the tablet 13. In the molding apparatus according to the present embodiment, the tablet carrier 22 is movable. The tablet 13 is installed so as to perform a linear reciprocating movement below the board 5 to convey the tablet 13.

It should be noted that the tablet carrier 22 is
When the tablet carrier 22 is moved below the tablet, the tablet accommodating portion 22b of the tablet carrier 22
Is installed so as to be aligned with the opening 5 a of the movable platen 5 communicating with the inlet 11 b of the pot 11.

As shown in FIG. 1, when the plunger 12 in the molding apparatus of the present embodiment descends to the lowest point, it comes off from the pot 11 to the outside and below it, and It is mounted so that it is arranged in.

That is, when the tablet 13 is supplied to the pot 11 in the molding apparatus, the plunger 12 is first protruded from the pot 11 and the movable platen 5 and further lowered to the lowermost point as shown in FIG. And let it stand there.

Thereafter, with the tablet 13 accommodated (supported) in the tablet accommodating portion 22b of the tablet carrier 22, the tablet carrier 22 is moved to a predetermined position below the movable platen 5, ie, the opening 5a of the movable platen 5 and the tablet accommodating portion. Part 2
The tablet transporter 22 is moved so that the position of the tablet transporter 2b is matched.

As a result, the tablet 13 can be arranged between the opening 5a of the movable platen 5 and the plunger 12.

Subsequently, the plunger 12 is raised, the tablet 13 is pushed up, and the tablet 13 is placed in the pot 11.
Supply.

The tablet 13 supplied into the pot 11 is melted by heating the lower mold 7 and the upper mold 8 by a heater (not shown), and becomes the sealing resin 27.

Further, in order to guide the molten sealing resin 27 into the cavity 9, a runner 14 that connects the pot 11 and the cavity 9 is formed on a mold-matching surface. Is a gate 15.

A cull 17 for branching the sealing resin 27 to the runner 14 is also formed.

Next, the QFP 16 shown in FIG. 2 manufactured by resin molding by the molding apparatus of the present embodiment is used.
Will be described.

The structure of the QFP 16 includes a tab 2 a on which the semiconductor chip 1 is mounted, an inner lead 2 b electrically connected to a pad 1 b provided on the main surface 1 a of the semiconductor chip 1 by a bonding wire 25, Main body 16a formed by sealing resin and bonding wire 25 with sealing resin 27, and inner lead 2
b and outer leads 2c, which are external terminals protruding outward from the sealing body 16a.

That is, the semiconductor chip 1 is mounted on the tab 2a of the lead frame 2 (see FIG. 1) (die bonding).
After a predetermined pad 1b of the semiconductor chip 1 and a predetermined inner lead 2b are electrically connected (wire-bonded) by a bonding wire 25, the semiconductor chip 1 and the bonding wire are connected by using a molding apparatus shown in FIG. And 25 are resin-sealed by a sealing resin 27.

Note that, as shown in FIG.
Is mounted on and fixed to the tab 2a by, for example, a silver paste 26 or the like.

The sealing resin 27 forming the sealing body 16a is, for example, an epoxy-based thermosetting resin.

The bonding wire 25, which is a thin metal wire, is a thin wire formed of gold or the like.

In the molding apparatus of the present embodiment, the number of semiconductor chips 1 fixed in advance to one lead frame 2 and the QF molded by one molding step
It goes without saying that the number of P16 can be set to any number.

The molding method according to the present embodiment will be described.

In the molding method, the molding apparatus shown in FIG. 1 is used for the lead frame 2 which has been subjected to die bonding and wire bonding in the molding step of the semiconductor manufacturing process, and an epoxy thermosetting. The resin sealing (resin molding) of the semiconductor chip 1 and the bonding wires 25 is performed by a sealing resin 27 or the like. Here, a case where the sealing body 16a is formed in manufacturing the QFP 16 shown in FIG. explain.

First, a lower mold 7 (first mold) and an upper mold 8 (second mold) for forming a cavity 9 having a shape corresponding to the sealing body 16a of the QFP 16 are prepared.

That is, the molding apparatus shown in FIG. 1 having the lower die 7 and the upper die 8 is prepared.

Further, the lower mold 7 and the upper mold 8 are previously heated to a predetermined temperature by a heater (not shown).

Subsequently, the lower mold 7 is lowered to open the mold.

Thereafter, the lead frame 2 after the die bonding and the wire bonding is sucked and held by the frame carrier 21, and in this state, the frame is moved between the opened lower mold 7 and the upper mold 8. The carrier 21 is moved.

The lead frame 2 may be held (handled) using a robot or the like.

Thus, the lead frame 2 on which the semiconductor chip 1 is mounted is transferred onto the cavity 9 of the lower mold 7.

Thereafter, the lead frame 2 is placed on the lower mold 7 such that the suction holding of the lead frame 2 is released and the semiconductor chip 1 is placed in the cavity 9 of the lower mold 7.

After the placement, the frame carrier 21 is returned to the original position.

Subsequently, the lower mold 7 is raised, and the lead frame 2 is sandwiched between the lower mold 7 and the upper mold 8. That is, mold clamping is performed.

Thereafter, the tablet 13 in which the sealing resin 27 has been cured is preheated, that is, preheated, using a preheater (not shown).

However, the preliminary heating of the tablet 13 is not always performed, but is performed as needed.

Subsequently, the tablet 13 is accommodated in the tablet accommodating portion 22 b of the tablet carrier 22, and the tablet 1 is moved by the tablet carrier 22 below the movable platen 5.
3 is conveyed.

At this time, the tablet 13 is transported by the tablet transporter 22 from the inlet 11b of the pot 11 to just below the opening 5a of the movable platen 5 communicating therewith.

As a result, the tablet 13 can be transported between the inlet 11b of the pot 11 formed in the lower die 7 and the plunger 12 disposed opposite to the inlet 11b with the movable plate 5 interposed therebetween.

That is, the tablet 13 is disposed below the pot 11 and between the pot 11 and the plunger 12.

After that, the tablet 13 is pushed upward by the plunger 12 from below, thereby raising the tablet 13.
The tablet 13 is pushed up, whereby the tablet 13 is introduced into the movable platen 5 from the opening 5 a of the movable platen 5.

Further, the plunger 12 is pushed up to introduce the tablet 13 into the pot 11 from the inlet 11b of the pot 11 of the lower mold 7.

At this time, since the tablet 13 is also heated by the lower mold 7, its viscosity is further reduced and softened.

As a result, the tablet 13 is melted,
The sealing resin 27 is formed.

Thereafter, the sealing resin 27 is further pressed by the plunger 12 to inject the sealing resin 27 from the supply port 11 a of the pot 11 into the cavity 9 via the runner 14 and the gate 15.

When the supply of the sealing resin 27 into the cavity 9 starts, the pressing by the plunger 12 is stopped, and after the sealing resin 27 is substantially filled in the cavity 9, pressure is applied again.

Subsequently, when the sealing resin 27 is held for several minutes while being filled, the sealing resin 27 is polymerized and hardened.

As a result, resin molding for resin sealing of the semiconductor chip 1 is performed, and the sealing body 16a is formed.

After the hardening of the sealing resin 27, the plunger 12 is lowered and returned to the original position, and then the tablet transport body 22 is moved and returned to the original position.

Subsequently, the ejector pins 10 on the upper mold 8 side
While lowering the sealing body 16a by the
To open the mold.

As a result, the sealing body 16a is
Release from mold.

Subsequently, the ejector pins 10 on the lower mold 7 side
The sealing body 16a is pushed up by the sealing body 16a.
a is released from the lower mold 7.

After that, the lead frame 2 on which the sealing body 16a is formed is taken out from the lower mold 7 and the upper mold 8, and the outer leads 2c are cut from the frame of the lead frame 2 so that each sealing body is cut. It is separated into the part 16a.

Subsequently, exterior processing such as bending and deburring of the outer lead 2c is performed.
Is manufactured.

According to the molding method and apparatus of the present embodiment, the following operational effects can be obtained.

That is, in the molding apparatus, the lower mold 7
Frame carrier 21 (frame transport means) for transporting lead frame 2 onto cavity 9 of tablet, and tablet transport body 22 for transporting tablet 13 to a location between inlet 11b of tablet 13 of pot 11 and plunger 12
(Tablet transporting means), the lead frame 2 and the tablet 13 can be transported separately, and the tablet 13 can be transported not between the lower mold 7 and the upper mold 8 but outside the two molds. Can be transported.

Thus, it is possible to prevent the powder of the sealing resin 27 from dropping onto the lower mold 7 during the transportation of the tablet 13.

As a result, it is possible to prevent the powder of the sealing resin 27 from adhering to the cavity 9 and soaring from the cavity 9 and adhering to the lead frame 2.

Therefore, the deformation of the inner lead 2b due to the powder falling of the sealing resin 27 can be prevented, whereby the quality of the QFP 16 (semiconductor device) can be improved.

Also, the cavity 9 of the powder of the sealing resin 27 is used.
Since it can be prevented from dropping to the lower mold 7, the cleanness of the atmosphere in the lower mold 7 and the upper mold 8 can be improved.

Thus, the quality of the molding technique can be improved.

Further, a frame carrier 21 and a tablet carrier 22 are provided, and by separately transporting the lead frame 2 and the tablet 13, each can be transported at an optimum timing.

As a result, it is possible to improve the processing ability in the entire molding process.

Further, by providing the frame carrier 21 and the tablet carrier 22 to separately carry the lead frame 2 and the tablet 13, the structure of each carrier can be simplified.

Therefore, it is possible to reduce the weight of each transport body, thereby improving the transport speed of each transport body.

As a result, in the same manner as described above, it is possible to improve the processing ability in the entire molding process.

Further, since the frame carrier 21 and the tablet carrier 22 are separately provided, when any one of the carriers is replaced by the type change, the carrier to be replaced can be changed. Good.

Therefore, the degree of freedom in the transport system for the lead frame 2 and the tablet 13 is increased, and the QF
It can correspond to various types of semiconductor devices other than P16.

The invention made by the inventor has been specifically described based on the embodiments of the present invention. However, the present invention is not limited to the embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above-described embodiment, the case where the tablet 13 is pre-heated using a pre-heater (not shown) before the tablet 13 is supplied into the pot 11 of the lower mold 7 has been described. In the molding apparatus of the embodiment, when the tablet 13 is supplied to the pot 11 of the lower mold 7, the tablet 13 may be pre-heated in the pot 11 by preheating the lower mold 7 (the pot 11 is not heated). If the upper mold 8 is provided, the same applies to the upper mold 8).

As a result, the lower mold 7 (the first mold) is set in advance.
In addition, since it is not necessary to perform the preliminary heating outside the upper mold 8 (second mold), it is possible to prevent the temperature of the tablet 13 from dropping due to the lapse of time during the tablet conveyance and the temperature variation.

As a result, the quality of the molding technique can be improved.

Further, the lower mold 7 is placed in the pot 11.
By preheating the tablet 13 by preheating (when the pot 11 is provided in the upper mold 8, the upper mold 8), the preheating step (preheating step) of the tablet 13 can be omitted.

As a result, the molding process can be simplified and shortened.

Further, in the above-described embodiment, the case where the tablet carrier 22 is installed so as to carry the tablet 13 by performing linear reciprocating movement below the movable platen 5 is shown in FIG. As in the molding apparatus according to another embodiment, the tablet conveying means may include a disc-shaped tablet holding plate 22a and a tablet conveying body 22 that transfers the tablet 13 to the tablet holding plate 22a. .

That is, the tablet conveying means in the molding apparatus shown in FIG. 3 comprises a disc-shaped tablet holding plate 22a having a plurality of tablet accommodating portions 22b shown in FIG. A tablet carrier 22 for transferring the tablet 13 to the tablet housing 22b, and when the tablet holding plate 22a rotates, each tablet housing 22b is
Of the movable platen 5 in FIG.
The tablet holding plate 22a is rotatably installed so that the tablet holding plate 22a can be arranged between the a) and the plunger 12.

According to this, substantially the same effects as those of the molding apparatus shown in FIG. 1 described in the above embodiment can be obtained.

In the above embodiment and the other embodiments, the case where the tablet conveying means is installed below the movable platen 5 has been described. May be provided.

That is, the lower mold 7 having the pot 11
A (first mold) or an upper mold 8 (second mold) is attached to the movable platen 5, and a tablet conveying means is provided inside the movable platen 5.

According to this, the tablet 13 can be preheated by the preheating of the movable platen 5 because the tablet conveying means is provided inside the movable platen 5,
As a result, as in the above embodiment, the step of preheating the tablet 13 can be omitted.

Further, in the above-described embodiment, a case has been described where the semiconductor device in which resin molding is performed by the molding device shown in FIG. 1 is the QFP 16, but the semiconductor device uses the lead frame 2 and the semiconductor chip 1 If it is a resin-sealed type that performs resin sealing, QFP16
Not limited to SOJ (Small Outline J-leaded Package)
Other semiconductor devices may be used.

[0111]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). In the molding apparatus, the frame transport means for transporting the lead frame onto the cavity of the first or second mold and the tablet transport means for transporting the tablet are provided, so that the lead frame and the tablet can be transported separately. In addition, the tablet can be transported outside the first and second molds, not between the first and second molds. Thereby, it is possible to prevent the powder of the sealing resin from dropping onto the first or second mold during the transportation of the tablet. As a result, it is possible to prevent the powder of the sealing resin from adhering to the cavity or from rising from the cavity and adhering to the lead frame. Therefore, the deformation of the inner lead due to the falling of the sealing resin powder can be prevented, and the quality of the semiconductor device can be improved.

(2). Since the powder of the sealing resin can be prevented from dropping into the cavity, the cleanliness of the atmosphere in the first and second molds can be improved. Thereby, the quality of the molding technique can be improved.

(3). A frame transport unit and a tablet transport unit are provided, and by separately transporting the lead frame and the tablet, each can be transported at an optimal timing. As a result, it is possible to improve the processing ability in the entire molding process.

(4). By providing the frame transport means and the tablet transport means and transporting the lead frame and the tablet separately, the structure of each transport means can be simplified. Therefore, the weight of each transport unit can be reduced, and the transport speed of each transport unit can be improved. As a result, it is possible to improve the processing ability in the entire molding process.

(5). First or second in the pot
By preheating the tablet by preheating the mold, the tablet preheating step (preheating step) can be omitted. Thereby, the molding process can be simplified and shortened.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of a structure of a molding apparatus according to the present invention.

FIG. 2 is a cross-sectional view showing an example of the structure of a semiconductor device (QFP) manufactured by resin molding using the molding device shown in FIG.

FIG. 3 is a sectional view showing a structure of a molding apparatus according to another embodiment of the present invention.

FIG. 4 is a perspective view showing an example of a structure of a tablet holding plate provided in the molding apparatus shown in FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor chip 1a main surface 1b pad 2 lead frame 2a tab 2b inner lead 2c outer lead 3 support 4 upper mold mounting plate 5 movable platen 5a opening 6 lower mold mounting plate 7 lower die (first die) 8 upper Mold (second mold) 9 Cavity 10 Ejector pin 11 Pot 11a Supply port 11b Inlet 12 Plunger 13 Tablet 14 Runner 15 Gate 16 QFP (semiconductor device) 16a Sealing body 17 Cal 18 Fixing plate 19 Lower mold heat insulation Plate 20 Upper mold heat insulating plate 21 Frame carrier (frame carrier) 22 Tablet carrier (tablet carrier) 22a Tablet holding plate 22b Tablet housing 25 Bonding wire 26 Silver paste 27 Sealing resin

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI // B29L 31:34

Claims (5)

[Claims] 1. A method for molding a resin-encapsulated semiconductor device, comprising the steps of: preparing a first and a second mold that form a cavity having a shape corresponding to a sealing body of the semiconductor device; Transferring a lead frame having a semiconductor chip mounted on the cavity of the first or second mold; introducing a tablet of sealing resin in a pot attached to either the first or second mold; Transporting the tablet between an inlet to be inserted and a plunger arranged opposite thereto, and after transporting the tablet, pressing the tablet with the plunger to push the tablet from the inlet through the pot. And a step of introducing the sealing resin formed by heating the tablet, after clamping, and communicating with the cavity and the introduction port of the pot. By injecting into the cavity from a supply port provided on opposite sides, the mold method characterized by a step of performing resin molding said semiconductor chip sealed with resin. 2. The molding method according to claim 1, wherein
A molding method, wherein when preheating the tablet, the tablet is preheated in the pot by preheating the first or second mold. 3. A molding device for performing resin molding of a semiconductor device, wherein the molding device is provided to face each other and form a cavity having a shape corresponding to a sealing body of the semiconductor device by matching both molds. A first and a second mold; a supply port connected to the first or the second mold; a supply port communicating with the cavity; and a tablet of sealing resin provided on the opposite side of the supply port and introduced. A pot provided with an introduction port, and a frame transfer means for supporting a lead frame on which a semiconductor chip is mounted, and transferring the lead frame onto the cavity of the first or second mold when the mold is opened. Tablet transport means for supporting the tablet, and transporting the tablet between the inlet of the pot and a plunger disposed opposite thereto; The tablet is pressed by the plunger and introduced into the pot through the introduction port, and after clamping, the tablet is heated and the sealing resin is formed from the supply port of the pot into the cavity. Wherein the semiconductor chip is resin-sealed by injecting the resin into a mold to perform resin molding. 4. The molding apparatus according to claim 3, wherein
The tablet conveying means has a disc-shaped tablet holding plate provided with a plurality of tablet storage units on the same circumference,
When the tablet holding plate rotates, the tablet holding plate is rotatably installed such that each tablet accommodating portion can be arranged between the inlet of the pot and the plunger. Mold equipment. 5. The molding apparatus according to claim 3, wherein the first or second mold having the pot is attached to a movable plate, and the tablet transport means is provided inside the movable plate. A molding device, wherein the molding device is provided.