TW202210266A - Resin sealing device capable of suppressing a temperature drop of a resin sealing mold and preventing degradation of molding quality and lowering of productivity caused by the temperature drop even when a large number of resin sheets are put into a resin sealing mold - Google Patents

Abstract

The present invention realizes a resin sealing device capable of suppressing a temperature drop of a resin sealing mold and preventing degradation of molding quality and lowering of productivity caused by the temperature drop even when a large number of resin sheets are put into a resin sealing mold. A resin sealing device 10 of the present invention includes a resin sheet supply mechanism 60 for arranging and sending out a plurality of resin sheets R from a container 64 that contains the plurality of resin sheets R; and a sheet transport mechanism 72 for transporting and delivering the plurality of resin sheets R to a loader 44 while holding the plurality of the resin sheets R sent from the resin sheet supply mechanism 60. The sheet transport mechanism 72 has a sheet holder 76 for loading and holding a plurality of resin sheets R in a plurality of holding holes 78 provided at a predetermined interval. The sheet holder 76 is provided with a heater 96 for preheating the resin sheets R at a predetermined temperature lower than the resin sealing temperature.

Description

Resin sealing device

The present invention relates to a resin sealing device for resin sealing a workpiece.

As a resin sealing apparatus for resin sealing a workpiece, a transfer molding apparatus is known.

The transfer molding apparatus is a device that clamps a workpiece with an upper die and a lower die, and uses a plunger to extrude molten resin from a tank of a resin-sealing die, and fill the cavity with resin for resin sealing.

For example, Patent Document 1 (Japanese Patent Laid-Open No. 2005-246709 ) describes a resin sealing device that supplies resin chips from a parts feeder supply method or even a chip magazine supply method The resin pellets sent out by the mechanism are conveyed while being held by the pellet holder and delivered to the loader, and then conveyed by the loader to the resin sealing mold for resin sealing.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2005-246709

[Problems to be Solved by Invention]

In the resin sealing device exemplified in Patent Document 1, when the resin small pieces are put into the resin sealing mold, heat is absorbed from the resin sealing mold after the temperature rise, and the temperature of the input part (tank) and its surroundings decreases. . Until now, a relatively small workpiece can be molded using a resin pellet with a diameter of about 20 mm and a length of about 20 mm. Therefore, even if a temperature drop occurs, the temperature can be recovered relatively early to perform molding.

However, in recent years, high-capacity resins have been required to mold relatively large products such as power semiconductors, electronic control units (ECUs), and insulated gate bipolar transistors (IGBTs). In this case, for example, it is necessary to use large-diameter resin chips, or to flow resin from two or three tanks into one molded product, and to stack a plurality of resin chips on one tank for use. Therefore, the temperature drop of the resin-sealing mold becomes large, and it takes time until the molding temperature is recovered to start molding, and there is a possibility of a decrease in productivity. In addition, if molding is started in a state where the temperature of the mold is not sufficiently recovered, molding defects (unfilling, voids, insufficient hardening, etc.) due to insufficient heat are likely to occur, and molding quality may be degraded.

[Technical means to solve the problem]

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to realize a resin sealing device capable of suppressing the temperature drop of the resin sealing mold and preventing the temperature drop even when a large volume of resin chips is put into the resin sealing mold The resulting drop in molding quality and productivity.

The present invention solves the above-mentioned problems by means of solving the problems described below.

The resin sealing apparatus according to the present invention is a resin sealing apparatus for carrying resin chips into a resin sealing mold by a loader for resin sealing, and includes a resin chip supply mechanism for arranging and arranging the resin chips from a storage container for accommodating a large number of resin chips. sending out; and a small piece conveying mechanism that conveys a plurality of resin small pieces sent out from the resin small piece supply mechanism while holding the plurality of resin small pieces, and transfers it to the loader, the small piece conveying mechanism has the function of loading and holding the plurality of resin small pieces A heater for preheating the resin chips at a predetermined temperature lower than the resin sealing temperature is provided in the chip holder in the holding holes provided at predetermined intervals.

According to this, preheating can be performed before the resin chips supplied from the resin chip supply mechanism are delivered to the loader. Therefore, the temperature difference between the resin-sealing mold and the injected resin small pieces can be reduced, so that the temperature drop of the resin-sealing mold that occurs when the resin small pieces are put into the resin-sealing mold can be suppressed.

In addition, it is preferable that the resin chip holder is provided as a transfer chip holder that loads and holds a plurality of resin chips in a tank provided at the same pitch as the resin sealing mold and with the In the holding holes in which the number of cans of the resin-sealing mold is the same, the chip conveying mechanism includes a chip lifter mechanism, and the chip lifter mechanism fills the holding holes of the transfer chip holder. A plurality of resin chips are simultaneously transferred to the loader from below, and the heater is provided in the transfer chip holder. According to this, in the die holder (handover die holder) for transferring the resin chips to the loader, the resin chips required for the primary resin sealing are generally held and transferred to the loader in batches, so that the temperature of each resin chip can be adjusted. The conditions (preheating conditions) are the same, and the molding quality can be stabilized.

In addition, it is preferable that the small piece holder is provided as a transfer small piece holder and the transfer small piece holder which loads and holds a plurality of resin small pieces in the holding holes provided at predetermined intervals, and the transfer small piece holder and the small piece conveying mechanism includes a small piece holder conveying mechanism that conveys the conveying small piece holder in which the resin small pieces sent from the resin small piece supply mechanism are loaded in the holding holes, and transfers the small piece holder to the holding hole. The resin chips loaded in the holding holes of the transfer chip holder are transferred to the transfer chip holder, and at least the transfer chip holder is provided with the heater. According to this, the resin chips can be preheated near the resin sealing mold. Therefore, it can be loaded into the resin-sealed mold while maintaining the effect of temperature increase, and temperature management can also be easily performed.

Moreover, it is preferable to provide a temperature sensor in the said delivery die holder or the said conveyance die holder, and it is preferable to maintain the preheating temperature of the said heater at a predetermined temperature. Accordingly, the resin chips can be preheated more stably.

Moreover, it is preferable that the preheating temperature of the said delivery die holder is set to a predetermined temperature higher than the preheating temperature of the said conveyance die holder. According to this, the temperature of the resin small piece can be increased in steps according to the travel of the conveyance path, and can be preheated at a predetermined preheating temperature at the time of delivery to the loader.

In addition, the heaters may be provided on both sides in the arrangement direction of the holding holes provided at predetermined intervals in the small piece holder formed in the frame shape, or may be provided at predetermined intervals in the frame body formed at a predetermined interval. The retaining holes on the chip holder in the shape of a separate location. In this way, by arranging the heater around or between the holding holes, it is possible to uniformly preheat each resin chip.

In addition, it is preferable that the resin chip supply mechanism is covered with a cover so as to be separated from the chip conveyance mechanism, and a cooling for temperature management is provided so that the ambient temperature in the resin chip supply mechanism becomes a predetermined temperature. device. According to this, by isolating the resin small piece supply mechanism that accommodates the plurality of pre-supplied resin small pieces from the surrounding environment, the temperature rise of the resin small pieces can be suppressed and the hardening of the resin can be prevented. Furthermore, it is possible to more reliably prevent the progress of hardening by actively cooling the resin chips by the cooling device.

[Effect of invention]

According to the present invention, even when a large-capacity resin tablet is put into the resin-sealing mold, the temperature drop of the resin-sealing mold can be suppressed. As a result, it is possible to prevent a decrease in molding quality due to a decrease in the temperature of the mold at the time of resin sealing without reducing productivity.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic plan view showing the layout structure of the resin sealing device 10 . In addition, FIG. 2 is a main part cross-sectional view showing a configuration example of the press section 20 of the resin sealing device 10 shown in FIG. 1 , in particular, the resin sealing mold 22 and the loader 44 .

The resin sealing apparatus 10 of the present embodiment is an apparatus for resin sealing a workpiece (a product to be molded) W. Hereinafter, a transfer molding apparatus will be described as an example.

First, a general configuration example of the workpiece W as a molded article will be described. The workpiece W includes a structure in which a second member Wb as an electronic component is mainly mounted on a first member Wa as a base material (see FIG. 2 ). More specifically, as the first member Wa, for example, various surrounding members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer formed in a thin strip shape can be exemplified. Furthermore, the shape is not limited to a strip shape, and may be a circle or a quadrangle. In addition, as the second member Wb, a semiconductor wafer (sometimes simply referred to as a "wafer"), a Micro-Electro-Mechanical System (MEMS), an electronic component, a heat sink, a lead frame for wiring/heat dissipation, Various members such as bumps for electrical connection are taken as an example. That is, the workpiece W in the present invention refers to a workpiece in a state where the second members Wb are stacked on these first members Wa (die mounting, flip chip mounting, wire bonding mounting, etc.). Therefore, the workpiece W also includes a workpiece on which one or more layers of wafers are mounted on a substrate, a workpiece on which a semiconductor device is mounted on a substrate, an imaging element mounted on the substrate, and light-transmitting glass is bonded to the light-receiving surface of the imaging element. finished workpieces, etc. Here, as a form of resin sealing, it is assumed that a plurality of mounted components mounted on the board are housed in one cavity 34 and resin-sealed in batches. In addition, it is also applicable to the case where each mounted component is individually accommodated in the cavity 34 for resin sealing.

On the other hand, the molding resin (sometimes abbreviated as "resin") R used for resin sealing is, for example, a thermosetting resin (eg, an epoxy resin containing a filler). The state is the resin small piece R of a solid shape, and the case where a cylindrical shape is mentioned as an example is demonstrated here, but it is not limited to the said shape.

Next, the outline of the resin sealing apparatus 10 is demonstrated. As shown in FIG. 1 , the resin sealing apparatus 10 includes a supply unit 10A for supplying the molding resin R and the workpiece W, a pressing unit 10B for resin-sealing the workpiece W, and a molded article storage unit 10C for storing the resin-sealed molded article Wp as The main structure. Hereinafter, each unit will be described, but the arrangement of the structure provided in each unit is an example, and various arrangements can be adopted.

[Supply unit 10A]

First, in FIG. 1 , the supply unit 10A includes a workpiece supply unit 12 for supplying workpieces W and a resin small piece supply unit 14 for supplying resin small pieces R. The workpiece supply unit 12 includes a stocker 16 that accommodates a magazine (not shown) in which the workpiece W is accommodated. The workpieces W sent out from the respective magazines by the push rods (not shown) are arranged, for example, in a set of two pieces so as to face the placement table 18 . The workpiece W on the placement table 18 is held by a loader 44 of a transfer mechanism to be described later, and is transferred to the pressing unit 10B.

On the other hand, the resin small piece supply unit 14 includes a resin small piece supply mechanism (here, a parts feeder 60 to be described later) that arranges and sends out the resin small pieces R from a storage container that accommodates a large number of resin small pieces R. The resin small pieces R fed from the resin small piece supply mechanism are held by the small piece holder 76 and transferred to the loader 44 via a small piece holder conveying mechanism 73 and a small piece lifter mechanism 74 which will be described later. In addition, the reference numeral 78 is a holding hole for filling the resin chip R. As shown in FIG. The transferred resin chips R are held by the loader 44 and transferred to the pressing unit 10B. Details of the resin chip supply unit 14 will be described later.

[Press unit 10B]

Next, the pressing unit 10B includes a pressing portion 20 that drives the resin sealing mold 22 to open/close, and clamps the workpiece W for resin sealing. The resin-sealed mold 22 shown in FIG. 2 includes a lower mold 24 and an upper mold 26, and has a structure in which mold opening/closing is performed by pressing at least one of the molds in the mold opening/closing direction by a known mold clamping mechanism. In addition, on the clamping surface of the upper mold 26 , a cavity 34 that accommodates the resin-sealed portion of the workpiece W (the portion where the second member Wb is mounted) and is filled with the resin R, and a resin that communicates with the cavity 34 are formed. Flow path (cull, runner, etc.) 36 . On the other hand, on the clamping surface of the lower mold|type 24, the workpiece|work support part 28 which supports the workpiece|work W, and the cylindrical tank 30 which accommodates the resin chip|tip R are formed. In the present embodiment, a plurality of (here, six, but not limited to) cans 30 are provided at a predetermined pitch (referred to as “can pitch”), and on both sides (here, six) in the arrangement direction of the cans 30 . A workpiece support portion 28 is provided. A plunger 32 pressed by a known transfer mechanism (not shown) is arranged in each tank 30 . The plunger 32 is pressed to supply the resin R in the tank 30 into the cavity 34 .

In addition, the upper mold 26 and the lower mold 24 include heaters 23 (eg, heating wire heaters), temperature sensors, control units, power sources, and the like (except for the heaters 23 , not shown), and perform heating and control. Specifically, the heater 23 of the upper mold 26 applies heat to the entire upper mold 26 , while the heater 23 of the lower mold 24 applies heat to the workpiece W and the resin R in addition to the entire lower mold 24 . Thereby, the lower mold|type 24 and the upper mold|type 26 are adjusted to predetermined temperature (it differs according to the kind of resin, for example, 120 degreeC - 180 degreeC), and is heated. In addition, the solid-shaped resin small pieces R accommodated in the tank 30 are melted in a flowable state. In the pressing section 20 including the above structure, the upper mold 26 and the lower mold 24 are clamped to clamp the workpiece W, and when the resin R in the tank 30 of the resin sealing mold 22 is melted in a state where heat and pressure are applied, and When the plunger 32 is press-fed to fill the cavity 34 , the molten resin R is hardened in a heated and pressurized state, whereby the workpiece W is resin-sealed.

[Molded product storage unit 10C]

Next, in FIG. 1 , the molded product storage unit 10C includes a take-out unit 38 for taking out a resin-sealed molded product Wp by an unloader 52 serving as a conveyance mechanism, which will be described later, and a gate cutting unit 40 for removing a gate from the molded product Wp. Useless resin such as a mouth; and a stocker 42 for accommodating the molded product Wp from which the waste resin has been removed. The molded article Wp is accommodated in a magazine (not shown) for storage, and the magazine in which the molded article Wp is accommodated is sequentially accommodated in the stocker 42 .

Next, the resin sealing apparatus 10 of the present embodiment includes, as a mechanism for conveying across the units, a loader 44 for conveying the resin chips R and the workpieces W into the resin sealing mold 22 of the press unit 10B, and a molded product An unloader 52 that unloads Wp and waste resin (reject pool after molding, runner) from the resin-sealed mold 22 of the press unit 10B. On the lower surface of the loader 44 , chuck claws 46 that hold the workpiece W and resin small piece holding portions 48 that hold the resin small pieces R are provided (see FIGS. 2 and 4 ). The resin small piece holding portion 48 is a concave portion formed so as to be able to accommodate the resin small piece R, and is provided at the same pitch as the tank pitch of the resin sealing mold 22 and the same number as the number of tanks in the resin sealing mold 22 . Moreover, the shutter 50 which restricts the fall of the resin small piece R is provided at the entrance of the said recessed part, and even its vicinity. The shutter 50 can be opened and closed by a shutter drive unit (not shown). Thereby, the workpiece W can be loaded into the workpiece support portion 28 of the resin-sealed mold 22 (here, the lower mold 24 ) and into the tank 30 while the resin small piece R and the workpiece W are held while being conveyed to the pressing portion 20 . Resin chip R.

In addition, the supply unit 10A, the pressing unit 10B, and the molded product storage unit 10C are connected to each other by the unitized stage, and the resin sealing device 10 is assembled. A guide portion 54 is provided on the inside of the device of each unit, and a guide rail is formed by assembling the guide portions 54 to be linearly connected to each other. The loader 44 and the unloader 52 are respectively movable along a common guide rail, the loader 44 is provided so as to be movable between the supply unit 10A and the pressing unit 10B, and the unloader 52 is provided so as to be able to be accommodated in the pressing unit 10B and the molded product move between cells 10C.

Therefore, by changing the structure of each unit, the configuration form of the resin sealing device 10 can be changed while maintaining the state in which the guide portions 54 are connected to each other. For example, FIG. 1 shows an example in which the pressing parts 20 are provided at two places, but a resin sealing device (not shown) in which the pressing parts 20 are provided at one or three or more places can also be constituted. In addition, it is also possible to use a resin sealing device in which a part of the mechanism does not exist for each unit.

[Resin chip supply unit 14]

Next, the structure of the resin chip supply part 14 provided in the supply unit 10A of the resin sealing apparatus 10 is demonstrated.

First, in FIG. 3 , the resin small piece supply unit 14 includes a parts feeder 60 (resin small piece supply mechanism) that arranges and sends out the resin small pieces R from a storage container that accommodates a large number of resin small pieces R. The parts feeder 60 is provided with a chip storage container 64 on the exciter 62 . When excited by the vibration exciter 62, the resin chips R in the chip storage container 64 are arranged in a line on the resin chip arrangement path 65 and sent out toward the supply port 65a (see FIG. 6). However, it is not limited to the above-described structure, and may include, for example, a small-chip magazine type of supply mechanism (not shown in the figure) in which a small-chip magazine for accommodating a large number of resin chips R is provided, and the resin chips R are arranged and sent out from the small-chip magazine by a push rod. Show). Moreover, the stopper 65b which prevents the drop of the resin small piece R sent out in the billiard ball shape is provided in the front-end part of the supply port 65a.

In addition, in this embodiment, the cover 66 which covers the parts feeder 60 is included, and the parts feeder 60 is separated from the small piece conveyance mechanism 72 etc. which are mentioned later. Thereby, by suppressing the temperature rise of the resin small pieces R accommodated in the accommodating container (here, the small piece accommodating container 64), the hardening of the resin R is not accelerated. In addition, a cooling device 68 is provided inside the cover 66, and the ambient temperature in the resin chip supply mechanism (here, the parts feeder 60) is temperature-controlled at a predetermined temperature (for example, approximately room temperature, 20°C to 25°C). Thereby, the progress of hardening can be prevented more reliably. In addition, as an example, the cover 66 is provided with a shutter 66a which can be opened and closed, and is opened when the resin chips R are sent out from the parts feeder 60 .

In addition, in FIG. 4, the pick-up/press mechanism 70 (resin chip loading mechanism) is provided in the vicinity of the supply port 65a. The pick-up/press mechanism 70 holds the resin small chips R sent out from the supply port 65a and loads them into holding holes 78a provided in a conveyance chip holder 76a described later. In the present embodiment, as an example, a pick-up/press mechanism 70 that can move between the parts feeder 60 (supply port 65a ) and the conveying chip holder 76a is provided in the vicinity of the upper side of the supply port 65a. When the cylindrical resin small piece R sent out in the state is held, it is rotated by 90° about the support shaft 70a to make the resin small piece R stand up in the vertical direction and move to the predetermined hole of the waiting conveying small piece holder 76a. , and is loaded into the holding hole 78a facing the vertical direction (see arrow A). However, it is not limited to the above-described configuration, and for example, the resin chips R may be inserted into one hole of the rotary table from the supply port 65a, and the rotary table may be rotated by 90° to sequentially fill the holding holes of the transfer chip holder 76a. Structure in 78a (not shown). Various structures can be selected from the related art for the structure of loading the resin small pieces R into the holding holes 78a of the conveying small piece holder 76a from the supply port 65a.

[Small piece transfer mechanism 72]

Next, the resin chips R are transferred by the chip holder transfer mechanism 73 to the chip lifter mechanism 74 while being held by the transfer chip holder 76a, and are transferred to the transfer chip holder 76b, and are further transferred from the chip lifter mechanism 74 to the chip lifter mechanism 74. The holder 76b is handed over to the resin chip holder 48 of the loader 44 . Hereinafter, it demonstrates concretely.

The die holder conveyance mechanism 73 shown in FIG. 4 is configured to reciprocate between the parts feeder 60 side and the die lifter mechanism 74 side with the conveyance die holder 76 a mounted thereon (see arrow B). As an example, the transport small piece holder 76a is placed on a moving body that moves along the transport rail, and is driven by a belt or the like to reciprocate.

The conveyance small-piece holder 76a shown in FIG.7(a)-FIG.7(c) is formed so that a plurality of (here, the same pitch as the tank pitch) are arranged in a row at a predetermined pitch (here, the same pitch as the tank pitch). The number of cans is the same number of six) in a frame shape (here, a rectangular parallelepiped) in which the holding holes 78a of the resin small pieces R can be filled.

Here, the holding hole 78a is formed in a cylindrical shape having the same shape as the resin small piece R, but it is not limited to this, and may be formed in a rectangular parallelepiped shape, for example. In addition, the number of the holding holes 78a is also not limited. Therefore, depending on the number of the holding holes 78a, the shape of the transport small piece holder 76a may be formed into a rectangular parallelepiped or a cube having various aspect ratios. In addition, the transfer chip holder 76a may be filled with the resin chips R at a pitch narrower or wider than the tank pitch, and the pitch may be changed to the same pitch as the tank pitch before handover to the transfer chip holder 76b, or two pieces of the transfer chip holder 76b may be provided. The number of holding holes 78a is doubled and the resin chips R are divided into two transfers.

In addition, the holding hole 78a penetrates the conveying small piece holder 76a in the vertical direction, and a shutter 80 for restricting the drop of the resin small piece R is provided at the lower end of the holding hole 78a and even in the vicinity thereof. A shutter drive unit 82 is provided in the transport small piece holder 76a, and the shutter 80 can be opened and closed. Accordingly, the resin small pieces R can be loaded and held in the holding holes 78a.

The die lifter mechanism 74 shown in FIGS. 4 and 5 is provided below the loader 44 that is waiting above, and is configured to be capable of raising and lowering the die holder 76b (see arrow C). The delivery small piece holder 76b also has the same structure as the conveying small piece holder 76a, but the movable shutter 80 is not provided in the delivery small piece holder 76b, and the inner diameter of the lower end portion of the holding hole 78b is relatively small. The resin small pieces R can be held (see FIG. 5 ). However, a movable shutter 80 may be provided in the delivery chip holder 76b, and the shutter 80 may be movably retracted when the resin chip R is raised. In addition, it is not limited to the said structure, The structure etc. in which the resin small piece R is directly mounted on the push rod 92 mentioned later instead of the shutter 80 may be sufficient.

The die lifter mechanism 74 includes a lifter 90 that moves up and down along a conveyance rail provided in the lifter body 74a. In the upper part of the lift part 90, the delivery die holder 76b is provided. On the other hand, on the lower part of the lift portion 90, a comb-shaped upper push rod 92 formed at a pitch corresponding to the position of each holding hole 78b of the delivery and delivery die holder 76b is provided so as to be movable up and down (see arrow D). ). Therefore, when the elevating part 90 performs the elevating operation, the delivery die holder 76b and the push-up rod 92 can be raised and lowered, and further, the resin pellet R loaded in the holding hole 78b of the delivery die holder 76b can be pushed up from below. Rod 92 is pushed up. In addition, as an example, the raising/lowering part 90 is driven by the drive source 88, such as a servomotor, and a drive transmission member (not shown), such as a ball screw mechanism. In addition, the upper push rod 92 is similarly driven by a drive unit (not shown) such as a ball screw mechanism.

According to the above configuration, the resin small piece R is conveyed by the small piece holder conveying mechanism 73 to the delivery small piece holder 76b waiting under the loader 44 while being held in the holding hole 78a provided in the conveying small piece holder 76a near the upper surface (arrow B). Next, the shutter 80 is opened in a state in which the holding hole 78a of the transfer small piece holder 76a and the holding hole 78b of the delivery small piece holder 76b are coaxial in the vertical direction, and the shutter 80 is opened, and the resin small piece R is dropped and handed over to the delivery small piece holder. 76b (retaining hole 78b). In the present embodiment, the resin chips R are transferred from the transfer chip holder 76a to the transfer chip holder 76b, but the configuration is not necessarily limited to the above-mentioned configuration. As an example, the pickup/press mechanism 70 may directly load the resin chips R in The structure in the holding hole 78b of the die holder 76b is handed over. Next, the resin chip R is lifted by the lifter 90 from the lower part of the lifter body 74a to the vicinity of the lower surface of the loader 44 waiting above by the lifter 90 while being held by the delivery chip holder 76b (arrow C). Next, in a state in which the holding hole 78b of the transfer die holder 76b and the resin small piece holding portion 48 of the loader 44 are coaxial and aligned in the vertical direction, the resin small piece R is pushed up by the push-up rod 92, and the loader 44 ( The shutter 50 of the resin small piece holding portion 48) is movably closed, and then the upper push rod 92 is lowered, whereby the handover is performed (arrow D).

In addition, in the present embodiment, a configuration is adopted in which the die holder conveyance mechanism 73 and the die lifter mechanism 74 are provided in the die conveyance mechanism 72, and the resin pellets R are delivered to the loader 44 by two conveyance lines, However, it is not limited to the above structure. For example, the die holder conveyance mechanism 73 is not necessarily required, and the pickup/press mechanism 70 may directly load the resin die R into the holding holes 78b of the delivery die holder 76b. Furthermore, it is good also as the structure which transfers by three or more layers of conveyance lines. In addition, when the conveying line has a multi-layered structure, the small-piece holder 76b provided on the final conveying line and delivering the resin chips R to the loader 44 is restricted to hold the hole 78b at the same pitch as the tank pitch and seal the mold with the resin. Although the number of tanks 30 of 22 is the same, the chip holders 76a provided on the conveying line further upstream are not necessarily required to be arranged at the same pitch as the tank pitch or the same number as the number of tanks. In this case, as an example, a tank pitch changing mechanism or the like may be provided, or a structure in which the resin small pieces R are divided into multiple times as a small piece holder 76a having an integral multiple of the holding holes 78a with respect to the small piece holder 76b may be provided. . On the other hand, for example, as the small piece conveying mechanism 72 to convey the resin small pieces R in the vertical direction, the resin small pieces R may be directly fed out from the parts feeder 60 and loaded into the small piece holder 76b, and changed in the 90° vertical direction. pose and hand over to the loader 44 .

[Heater 96]

Here, in the transport small piece holder 76a and the delivery small piece holder 76b of the present embodiment, heaters 96 for preheating the resin small pieces R loaded in the holding holes 78a and 78b are provided ( FIGS. 3 to 7 ). of (c)). According to this, preheating can be performed before the resin chips R supplied from the parts feeder 60 are delivered to the loader 44, and furthermore, by providing a heater (not shown) in the loader 44, the parts feeder can From 60 to the resin sealing mold 22, the resin chips R are preheated. Since the resin chips R required for primary resin sealing are usually held in the chip holder 76b and transferred to the loader 44 in batches, the temperature conditions (preheating conditions) of the resin chips R can be made the same, and the molding quality can be stabilized . When using the conveying die holder 76a and the delivery die holder 76b as a structure for delivering the resin die R to the workpiece W, at least the heater 96 needs to be provided in the delivery die holder 76b immediately before the delivery to the loader 44.

In addition, as described above, a large number of resin small pieces R are put into the small piece storage container 64 of the parts feeder 60. However, depending on the surrounding temperature environment, there is a possibility that the hardening will gradually increase with the passage of time compared with the state at the time of insertion. . Therefore, as the structure to be isolated from the surrounding environment by covering the parts feeder 60 with the cover 66 , the hardening of the resin R is not accelerated by suppressing the temperature rise of the resin chips R. Furthermore, it is also possible to actively cool the resin small pieces R before supply by the cooling device 68 .

As a configuration example of the present embodiment, one or a plurality of small piece holders 76a formed in a frame shape, holding holes 78a in the small piece holder 76b, and holding holes 78b provided at predetermined intervals in the arrangement direction of the holding holes 78b are built-in one or more A tubular heater 96 ( FIG. 7( a )). However, it is not limited to the above-described structure, and as another example, one or more tubular heaters 96 may be built in positions separating the holding holes 78 a and the holding holes 78 b provided at a predetermined pitch ( FIG. 7( b )). . In this way, by arranging the heaters 96 around or between the holding holes 78a and the holding holes 78b, each of the resin small pieces R can be preheated equally. Of course, the heater 96 is not limited to a tubular shape, and various shapes can be employed, and the heater 96 is not limited to the inside of the chip holder 76a and the chip holder 76b, but may be provided outside. Therefore, as a modification of the present embodiment, for example, a structure in which plate-shaped heaters 96 are provided outside the chip holders 76a and 76b located on both sides in the arrangement direction of the holding holes 78a and the holding holes 78b (Fig. 7(c)).

In addition, in this Embodiment, although the heating wire heater was used as the heater 96, it is not limited to this, Various well-known heating means, such as a sheathed heater and a carbon heater, can be used.

In addition, the preheating temperature of the heater 96 is set to a predetermined temperature lower than the resin sealing temperature, but further as a setting example of the preheating temperature in the present embodiment, the preheating temperature of the delivery die holder 76b is set to be higher than the conveyance temperature The preheating temperature of the die holder 76a is a predetermined temperature high. As an example, in the case of the molding resin R whose resin sealing temperature is 130°C to 150°C, the preheating temperature of the transfer die holder 76a is set to about 50°C to 60°C, and the preheating temperature of the die holder 76b is set to be handed over. It is set to about 60 degreeC - 70 degreeC. Thereby, the temperature of the resin small piece R can be increased in steps according to the travel of the conveyance path, and it can be preheated at a predetermined preheating temperature at the time of delivery to the loader 44 . In addition, in this example, when the loader 44 includes a heater, the preheating temperature of the loader 44 is set to about 70°C to 80°C. However, it is not limited to the predetermined temperature exemplified separately.

In addition, since the temperature sensor 98 (refer FIG. 7( a ) to FIG. 7( c )) is provided in the die holder 76 a and the die holder 76 b of the present embodiment together with the heater 96 , the temperature sensor 98 can be The preheating temperature of the heater 96 is maintained at the aforementioned predetermined temperature. Therefore, the resin chips R can be preheated more stably.

In addition, in the case of the structure in which the die conveyance mechanism 72 is delivered by multiple (two or more) conveyance lines, it is not necessary to provide the heaters 96 in all the die holders 76 . That is, the heater 96 may be provided in the die holder 76 as appropriate depending on the type and size of the resin die R, the capacity to be loaded in the die holder 76 , and the like. In this case, the heater 96 is preferably provided on the opposite downstream side (the side of the loader 44 ) to the die holder 76 , and more preferably provided on the final transfer line for delivering the resin die R to the loader. 44 of die holder 76 (here, handover die holder 76b). According to this, the resin small piece R can be preheated near the resin sealing mold 22 . Therefore, it is possible to carry in the resin sealing mold 22 while maintaining the effect of temperature increase, and it is also possible to easily perform temperature management.

As described above, according to the present invention, preheating can be performed before the resin chips supplied from the resin chip supply mechanism are delivered to the loader. Therefore, even when large-capacity resin chips are put into the resin-sealing mold (tank), the temperature difference between the resin-sealing mold and the put-in resin chips can be reduced, so that the temperature caused by the introduction of the resin chips into the tank can be suppressed. decline. As a result, the heating time of the resin-sealed mold does not increase, and it is possible to prevent a decrease in productivity and a decrease in molding quality.

In addition, this invention is not limited to the Example demonstrated above, Various changes can be added in the range which does not deviate from this invention.

10: Resin sealing device 10A: Supply unit 10B: Pressing unit 10C: Molded product storage unit 12: Workpiece supply department 14: Resin chip supply part 16, 42: Stocker 18: Placement table 20: Press Department 22: Resin sealing mold 23: Resin-sealed in-mold heater 24: Lower die 26: Upper die 28: Workpiece support 30: Cans 32: Plunger 34: Cavity 36: Resin flow path (reject pool, runner) 38: Take out part 40: Gate cutting part 44: Loader (resin chip holder) 46: Chuck jaws 48: Resin small piece holding part 50, 66a: switch 52: Unloader 54: Guidance Department 60: Parts feeder (resin chip supply mechanism) 62: Shaker 64: Storage Container (Small Piece Storage Container) 65: resin chip arrangement 65a: Supply port 65b: Stopper 66: Cover 68: Cooling device 70: Picking/Pressing Mechanism (Resin Chip Loading Mechanism) 70a: Support shaft 72: Small piece transfer mechanism 73: Small piece holder conveying mechanism 74: Small piece lifter mechanism 74a: Lifter body 76: Small piece holder 76a: Transporting the small piece holder (small piece holder) 76b: handover die holder (die holder) 78: Hold Holes 78a: Holding hole for conveying small piece holder 78b: Retaining hole for handing over the small holder 80: Shutter in small piece holder 82: Switch driver 88: drive source 90: Lifting part 92: Putting up 96: Heater 98: temperature sensor A, B, C, D: Arrow R: Molding resin (resin chips, resin, molten resin) W: Workpiece (formed product) Wa: first component Wb: Second component Wp: Molded product

FIG. 1 is a schematic plan view showing a layout structure of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part showing a configuration example of a press section and a loader of FIG. 1 . FIG. 3 is a plan view of an example of the configuration and operation of the resin chip supply unit of FIG. 1 . FIG. 4 is an explanatory diagram of an example of the configuration and operation of the resin chip supply unit and the chip conveying mechanism of FIG. 1 . FIG. 5 is an explanatory diagram of an example of the configuration and operation of a small piece lifter mechanism included in the small piece conveying mechanism of FIG. 4 . FIG. 6 is an explanatory diagram of an example of the configuration and operation of the resin chip supply unit of FIG. 1 . FIGS. 7( a ) to 7 ( c ) are explanatory diagrams of an arrangement configuration example of the die holder and the heater provided in the die holder in the resin sealing device shown in FIG. 1 .

14: Resin chip supply part

44: Loader (resin chip holder)

60: Parts feeder (resin chip supply mechanism)

64: Storage container (small piece storage container)

65: resin chip arrangement

65a: Supply port

65b: Stopper

66: Cover

66a: Switches

68: Cooling device

70: Picking/Pressing Mechanism (Resin Chip Loading Mechanism)

72: Small piece transfer mechanism

73: Small piece holder conveying mechanism

74: Small piece lifter mechanism

74a: Lifter body

76a: conveying the small piece holder (small piece holder)

76b: handover die holder (die holder)

78a: Holding hole for conveying small piece holder

78b: Retaining hole for handing over the small holder

80: Shutter in small piece holder

82: Switch driver

88: drive source

90: Lifting part

96: Heater

W: Workpiece (formed product)

Claims (8)

A resin sealing device, using a loader to carry resin chips into a resin sealing mold for resin sealing, and the resin sealing device is characterized by comprising: a resin chip feeding mechanism that arranges and sends out the resin chips from a storage container that houses a plurality of resin chips; and The small piece conveying mechanism conveys the plurality of resin small pieces sent out from the resin small piece supply mechanism while holding the plurality of resin small pieces, and transfers them to the loader, The chip conveying mechanism includes a chip holder for loading and holding a plurality of resin chips in holding holes provided at predetermined intervals, The die holder is provided with a heater that preheats the resin die at a predetermined temperature lower than the resin sealing temperature. The resin sealing device according to claim 1, wherein The die holder is provided as a handover die holder that loads and holds a plurality of resin die at the same pitch as the tank pitch of the resin-sealing mold and is spaced apart from the resin-sealing mold. The number of canisters is the same as the number of said holding holes, The small piece conveying mechanism includes a small piece lifter mechanism that simultaneously transfers a plurality of resin small pieces loaded in the holding holes of the transfer small piece holder to the loader from below, The heater is provided in the handover die holder. The resin sealing device according to claim 2, wherein The small piece holder is provided as a transfer small piece holder and the transfer small piece holder which loads and holds a plurality of resin small pieces in the holding holes provided at predetermined intervals, and the transfer small piece holder, The small piece conveying mechanism includes a small piece holder conveying mechanism that conveys the conveying small piece holder in which the resin small pieces sent from the resin small piece supplying mechanism are loaded in the holding holes, and loads the small piece holder. The resin chips in the holding holes of the transfer chip holder are handed over to the transfer chip holder, The heater is provided at least in the handover die holder. The resin sealing device according to claim 3, wherein: A temperature sensor is provided in the transfer die holder or the transfer die holder, and the preheating temperature of the heater is maintained at a predetermined temperature. The resin sealing device according to claim 3 or 4, wherein: The preheating temperature of the transfer die holder is set to a predetermined temperature higher than the preheating temperature of the transport die holder. The resin sealing device according to any one of claims 1 to 4, wherein: The heaters are provided on both sides in the arrangement direction of the holding holes provided in the frame-shaped small-piece holder at a predetermined pitch. The resin sealing device according to any one of claims 1 to 4, wherein: The heater is provided at a position separating the holding holes provided in the frame-shaped small-piece holder at a predetermined pitch. The resin sealing device according to any one of claims 1 to 4, wherein: The resin chip feeding mechanism is covered with a cover to be separated from the chip conveying mechanism, and is provided with a cooling device that performs temperature management so that the ambient temperature in the resin chip feeding mechanism becomes a predetermined temperature.

Images