CN114171425A - Resin sealing device - Google Patents
Resin sealing device Download PDFInfo
- Publication number
- CN114171425A CN114171425A CN202110570717.XA CN202110570717A CN114171425A CN 114171425 A CN114171425 A CN 114171425A CN 202110570717 A CN202110570717 A CN 202110570717A CN 114171425 A CN114171425 A CN 114171425A
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- Prior art keywords
- resin
- chip
- holder
- resin sealing
- chips
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 296
- 239000011347 resin Substances 0.000 title claims abstract description 296
- 238000007789 sealing Methods 0.000 title claims abstract description 94
- 230000007246 mechanism Effects 0.000 claims abstract description 76
- 238000001816 cooling Methods 0.000 claims description 6
- 238000007726 management method Methods 0.000 claims description 2
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 50
- 238000000465 moulding Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002250 progressing effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000013290 Sagittaria latifolia Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 235000015246 common arrowhead Nutrition 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a resin sealing device which can restrain the temperature drop of a resin sealing mould and prevent the forming quality reduction and the productivity reduction caused by the temperature drop even when a large amount of small resin pieces are input into the resin sealing mould. A resin sealing device (10) of the present invention includes: a resin chip supply mechanism (60) for distributing and delivering the resin chips (R) from a container (64) for containing a plurality of resin chips (R); and a chip conveying mechanism (72) which conveys and delivers the resin chips (R) sent out from the resin chip supply mechanism (60) to the loader (44) in a state of keeping the resin chips (R), wherein the chip conveying mechanism (72) is provided with a chip retainer (76) which loads and keeps the resin chips (R) in keeping holes (78) arranged at a specified pitch, and the chip retainer (76) is provided with a heater (96) which preheats the resin chips (R) at a specified temperature lower than the resin sealing temperature.
Description
Technical Field
The present invention relates to a resin sealing device for resin-sealing a workpiece.
Background
As a resin sealing apparatus for resin-sealing a workpiece, a transfer molding apparatus is known.
The transfer molding apparatus clamps a workpiece by an upper mold and a lower mold, extrudes molten resin from a pot of a resin sealing mold by a plunger, and fills resin into a cavity to seal the resin.
For example, patent document 1 (japanese patent laid-open No. 2005-246709) describes a resin sealing device that conveys and delivers resin chips sent from a resin chip supply mechanism using a parts feeder supply system or even a chip magazine supply system to a loader while holding the resin chips by a chip holder, and then conveys the resin chips by the loader to a resin sealing mold to perform resin sealing.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2005-246709
Disclosure of Invention
[ problems to be solved by the invention ]
In the resin sealing device exemplified in patent document 1, when a small resin piece is put into a resin sealing mold, heat is absorbed from the resin sealing mold after the temperature is raised by the resin, and a phenomenon occurs in which the temperature of the input portion (can) and the surroundings thereof is lowered. Heretofore, a relatively small-sized workpiece can be molded using a small resin piece having a diameter of about 20mm and a length of about 20mm, and therefore, even if a temperature drop occurs, the molding can be performed by relatively early recovery of the temperature.
However, in recent years, a large-capacity resin is required for forming relatively large products such as a power semiconductor, an Electronic Control Unit (ECU), an Insulated Gate Bipolar Transistor (IGBT), and the like. In this case, for example, when using a large-diameter resin chip, or when flowing resin from two or three or more tanks into one molded article and then overlapping a plurality of resin chips in one tank, it is necessary to use the resin chips. Therefore, the temperature of the resin sealing mold is greatly decreased, and it takes time to return to the molding temperature and start molding, which may decrease productivity. Further, when the molding is started in a state where the temperature of the mold is not sufficiently recovered, molding defects (unfilled portions, voids, insufficient curing, and the like) due to insufficient heat are likely to occur, and the molding quality may be deteriorated.
[ means for solving problems ]
The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin sealing device that can prevent a decrease in molding quality and a decrease in productivity due to a decrease in temperature by suppressing a decrease in temperature of a resin sealing mold even when a large amount of small resin pieces are put into the resin sealing mold.
The present invention solves the above problems by the following solving means.
The resin sealing device of the present invention is a resin sealing device for carrying a resin small piece into a resin sealing mold by a loader to perform resin sealing, and includes: a resin chip supply mechanism for distributing and delivering the resin chips from a container for storing a plurality of resin chips; and a chip conveying mechanism for conveying the resin chips fed out from the resin chip supply mechanism in a state of holding the resin chips, and delivering the resin chips to the loader, wherein the chip conveying mechanism comprises a chip holder for loading and holding the resin chips in holding holes arranged at a predetermined pitch, and the chip holder is provided with a heater for preheating the resin chips at a predetermined temperature lower than a resin sealing temperature.
Accordingly, the preheating can be performed before the resin pellets supplied from the resin pellet supply mechanism are delivered to the loader. Therefore, the temperature difference between the resin sealing mold and the resin small piece to be charged can be reduced, and therefore, the temperature drop of the resin sealing mold generated when the resin small piece is charged into the resin sealing mold can be suppressed.
Further, it is preferable that the resin chip holder is provided as a delivery chip holder which loads and holds a plurality of resin chips in the holding holes provided at the same pitch as the pitch of the resin sealing mold and at the same number as the number of the resin sealing mold, the chip carrying mechanism includes a chip lifter mechanism which delivers a plurality of resin chips loaded in the holding holes of the delivery chip holder to the loader from below at the same time, and the heater is provided in the delivery chip holder. Accordingly, in the chip holder (transfer chip holder) for transferring the resin chips to the loader, the resin chips required for primary resin sealing are usually held and transferred to the loader in a batch, and therefore, the temperature conditions (preheating conditions) of the resin chips can be made the same, and the molding quality can be stabilized.
Preferably, the chip holder is provided with a conveying chip holder for loading and holding a plurality of resin chips in the holding holes provided at a predetermined pitch, and the delivery chip holder includes a chip holder conveying mechanism for conveying the conveying chip holder loaded with the resin chips fed from the resin chip supply mechanism in the holding holes and delivering the resin chips loaded in the holding holes of the conveying chip holder to the delivery chip holder, and the heater is provided at least in the delivery chip holder. Accordingly, the resin pellet can be preheated in a position close to the resin sealing mold. Therefore, the resin sealing mold can be carried in while maintaining the effect of temperature rise, and temperature control can be easily performed.
Preferably, a temperature sensor is provided in the delivery chip holder or the transport chip holder to maintain the preheating temperature of the heater at a predetermined temperature. Accordingly, the resin pellets can be preheated more stably.
Preferably, the preheating temperature of the delivery chip holder is set to a predetermined temperature higher than the preheating temperature of the conveying chip holder. Accordingly, the temperature of the resin pellets can be raised in stages according to the travel of the conveying path, and the resin pellets can be preheated at a predetermined preheating temperature when the resin pellets are transferred to the loader.
The heaters may be provided on both sides in the arrangement direction of the holding holes provided in the case-shaped chip holder at a predetermined pitch, or at positions that separate the holding holes provided in the case-shaped chip holder at a predetermined pitch. By providing the heater around or between the holding holes in this manner, the respective resin chips can be uniformly preheated.
Preferably, the resin chip supply mechanism is covered with a cover so as to be separated from the chip conveying mechanism, and a cooling device for performing temperature management so that an ambient temperature in the resin chip supply mechanism becomes a predetermined temperature is provided. Accordingly, by isolating the resin small piece supply mechanism, which accommodates a plurality of resin small pieces before supply, from the ambient environment, it is possible to suppress an increase in temperature of the resin small pieces and prevent hardening of the resin. Further, the small resin pieces can be actively cooled by the cooling device, and the hardening can be more reliably prevented from progressing.
[ Effect of the invention ]
According to the present invention, even when a large amount of small resin pieces are put into a resin sealing mold, a temperature drop of the resin sealing mold can be suppressed. As a result, without reducing productivity, it is possible to prevent the molding quality from being reduced due to a decrease in the temperature of the mold during resin sealing.
Drawings
Fig. 1 is a schematic plan view showing a layout structure of a resin sealing apparatus according to an embodiment of the present invention.
Fig. 2 is a sectional view of a main part showing a configuration example of the press section and the loader of fig. 1.
Fig. 3 is a plan view of an example of the structure and operation of the resin pellet supply unit shown in fig. 1.
Fig. 4 is an explanatory diagram of an example of the structure and operation of the resin chip supply section and the chip conveying mechanism of fig. 1.
Fig. 5 is an explanatory diagram of an example of the structure and operation of the chip lifter mechanism included in the chip carrying mechanism of fig. 4.
Fig. 6 is an explanatory diagram of an example of the structure and operation of the resin chip supply unit of fig. 1.
Fig. 7 (a) to 7 (c) are explanatory views of an example of the arrangement configuration of the die holder and the heater provided in the die holder in the resin sealing device shown in fig. 1.
[ description of symbols ]
10: resin sealing device
10A: supply unit
10B: pressing unit
10C: molded product storage unit
12: work supply part
14: resin chip supply part
16. 42: material storage device
18: placing table
20: pressing part
22: resin sealing mold
23: heater in resin sealing mould
24: lower die
26: upper die
28: workpiece support
30: pot for storing food
32: plunger piston
34: die cavity
36: resin flow path (picking pool, flow channel)
38: extraction part
40: gate cutting part
44: loader (resin small piece holding part)
46: chuck jaw
48: resin small piece holding part
50. 66 a: opening and closing device
52: unloading machine
54: guide part
60: parts feeder (resin small piece supply mechanism)
62: vibration exciter
64: storage container (Small piece storage container)
65: resin chip arrangement path
65 a: supply port
65 b: stop piece
66: cover
68: cooling device
70: pick-up/pressing mechanism (resin tablet filling mechanism)
70 a: supporting shaft
72: chip conveying mechanism
73: chip holder conveying mechanism
74: small piece lifter mechanism
74 a: elevator body
76: chip holder
76 a: conveying small piece holder (small piece holder)
76 b: connecting small piece holder (small piece holder)
78: holding hole
78 a: holding hole for conveying chip holder
78b, and (3 b): holding hole of small joint holder
80: shutter in tablet holder
82: driving part of shutter
88: driving source
90: lifting part
92: upper push rod
96: heating device
98: temperature sensor
A. B, C, D: arrow head
R: molding resin (resin chip, resin, molten resin)
W: workpiece (formed article)
Wa: first member
Wb: second member
And (Wp): molded article
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic plan view showing a layout structure of a resin sealing apparatus 10. Fig. 2 is a sectional view of a main part showing a configuration example of the press section 20, particularly the resin sealing mold 22 and the loader 44 of the resin sealing apparatus 10 shown in fig. 1.
The resin sealing apparatus 10 of the present embodiment is an apparatus for resin sealing a workpiece (molded article) W. The following description will be made by taking the transfer molding apparatus as an example.
First, a general configuration example of a workpiece W to be formed will be described. The workpiece W includes a structure in which a second member Wb as an electronic component is mainly mounted on a first member Wa as a base material (see fig. 2). More specifically, the first member Wa includes, for example, various surrounding members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer, which are formed in a stripe shape. Further, the shape is not limited to a thin strip, and may be circular or quadrangular. The second member Wb includes various members such as a semiconductor chip (sometimes simply referred to as a "chip"), a Micro-Electro-Mechanical System (MEMS), an electronic component, a heat sink, a lead frame for wiring and heat dissipation, and a bump for electrical connection. That is, the work W in the present invention is a work in which the second member Wb is superimposed on the first member Wa (die) mounting, flip chip mounting, wire bonding mounting, etc.). Therefore, the workpiece W also includes: a workpiece having one or more layers of chips mounted on a substrate, a workpiece having a semiconductor device mounted on a substrate, a workpiece having an image pickup element mounted on a substrate and having a light-transmitting glass bonded to a light-receiving surface of the image pickup element, and the like. Here, as a form of resin sealing, a case is assumed where a plurality of mounted components mounted on a substrate are accommodated in one cavity 34 and resin sealing is performed in batch. Further, the present invention can be applied to a case where each of the mounted components is individually housed in the cavity 34 and resin-sealed.
On the other hand, the molding resin (sometimes simply referred to as "resin") R used for resin sealing is, for example, a thermosetting resin (for example, an epoxy resin containing a filler). The resin pellet R in a solid state is exemplified by a cylindrical shape, but is not limited to the above shape.
Next, an outline of the resin sealing device 10 will be described. As shown in fig. 1, the resin sealing apparatus 10 includes, as main components, a supply unit 10A that supplies the mold resin R and the workpiece W, a press unit 10B that resin-seals the workpiece W, and a molded article storage unit 10C that stores the molded article Wp after resin sealing. Each unit will be described below, but the arrangement of the structure provided in each unit is an example, and various arrangements can be adopted.
[ supply Unit 10A ]
First, in fig. 1, the supply unit 10A includes a workpiece supply portion 12 that supplies a workpiece W and a resin pellet supply portion 14 that supplies a resin pellet R. The workpiece supply unit 12 includes a stocker (stocker)16, and the stocker 16 accommodates a magazine (not shown) in which the workpieces W are stored. The work W fed out from each magazine by a pusher (not shown) is arranged to face the mounting table 18, for example, with two pieces as a set. The workpiece W on the mounting table 18 is held by a loader 44 of a conveying mechanism described later and conveyed to the press unit 10B.
On the other hand, the resin chip supply section 14 includes a resin chip supply mechanism (here, a parts feeder 60 described later) that arranges and feeds out the resin chips R from a storage container that stores a plurality of resin chips R. The resin pellets R sent from the resin pellet supply mechanism are held in a pellet holder 76, and delivered to the loader 44 via a pellet holder conveyance mechanism 73 and a pellet lifter mechanism 74, which will be described later. Further, reference numeral 78 denotes a holding hole for filling the resin chip R. The resin pellets R after the transfer are held by the loader 44 and conveyed to the press unit 10B. The details of the resin pellet supply unit 14 will be described later.
[ Press Unit 10B ]
Next, the press unit 10B includes a press portion 20, and the press portion 20 performs opening/closing drive of the resin sealing mold 22 and clamps the work W for resin sealing. The resin sealing mold 22 shown in fig. 2 includes a lower mold 24 and an upper mold 26, and is configured to open and close a mold by pressing at least one of the molds in a mold opening and closing direction by a known mold clamping mechanism. Further, on the clamping surface of the upper die 26, a cavity 34 for accommodating a portion (a portion where the second member Wb is mounted) of the workpiece W sealed with resin and filling the resin R, and a resin flow path (a cull pool (well), a flow path, and the like) 36 communicating with the cavity 34 are formed. On the other hand, a work support portion 28 for supporting the work W and a cylindrical tank 30 for storing the resin chips R are formed on the clamping surface of the lower die 24. In the present embodiment, a plurality of (six, but not limited to) tanks 30 are provided at a predetermined pitch (referred to as "tank pitch"), and workpiece support portions 28 are provided on both sides (left and right sides, in this case) of the arrangement direction of the tanks 30. A plunger 32 pressed by a known transfer mechanism (not shown) is disposed in each of the tanks 30. The plunger 32 is pressed to supply the resin R in the tank 30 into the cavity 34.
The upper die 26 and the lower die 24 include: the heater 23 (for example, a heating wire heater), a temperature sensor, a control unit, a power supply, and the like (not shown except for the heater 23) perform heating and control thereof. Specifically, the heater 23 of the upper die 26 applies heat to the entire upper die 26, while the heater 23 of the lower die 24 applies heat to the workpiece W and the resin R in addition to the entire lower die 24. Thus, the lower mold 24 and the upper mold 26 are heated while being adjusted to a predetermined temperature (for example, 120 to 180 degrees centigrade, depending on the kind of resin). The solid resin pellets R contained in the tank 30 are melted in a flowable state. In the press section 20 including the above configuration, the upper die 26 and the lower die 24 are clamped to clamp the workpiece W, and when the resin R in the tank 30 of the resin sealing mold 22 is melted while being heated and pressurized and is pressure-fed by the plunger 32 to be filled into the cavity 34, the melted resin R is cured while being heated and pressurized, thereby resin-sealing the workpiece W.
[ molded article housing Unit 10C ]
Next, in fig. 1, the molded article housing unit 10C includes: a take-out section 38 for taking out the resin-sealed molded product Wp by an unloader 52 serving as a conveying means to be described later; a gate cutting portion 40 for removing unnecessary resin such as a gate from the molded product Wp; and a storage 42 for storing the formed product Wp without unnecessary resin. The molded articles Wp are stored in storage magazines (not shown), and the magazines storing the molded articles Wp are sequentially stored in the stocker 42.
Next, the resin sealing apparatus 10 of the present embodiment includes, as means for conveying the resin pellets R and the workpiece W between the units, a loader 44 for loading the resin pellets R and the workpiece W into the resin sealing mold 22 of the press unit 10B, and an unloader 52 for unloading the molded product Wp and the unnecessary resin (the reject pool and the runner after molding) from the resin sealing mold 22 of the press unit 10B. A lower surface of the loader 44 is provided with chuck claws 46 that hold the workpiece W and a resin chip holding portion 48 that holds the resin chips R (see fig. 2 and 4). The resin chip holding portions 48 are recesses formed so as to be able to accommodate the resin chips R, and are provided at the same pitch as the can pitch of the resin sealing mold 22 and at the same number as the number of cans of the resin sealing mold 22. Further, a shutter 50 for restricting the fall of the resin small pieces R is provided at the entrance of the recess and even in the vicinity thereof. The shutter 50 can be opened and closed by a shutter drive unit (not shown). Thus, the resin pellets R are conveyed to the pressing section 20 while being held together with the workpiece W, and the workpiece W is put into the workpiece support section 28 of the resin sealing mold 22 (here, the lower mold 24) and the resin pellets R are put into the tank 30.
The supply unit 10A, the press unit 10B, and the molded article storage unit 10C are connected to each other by a unitized rack, and the resin sealing device 10 is assembled. The guide portions 54 are provided inside the respective units, and the guide rails are formed by assembling the guide portions 54 to each other in a linear shape. The loader 44 and the unloader 52 are movable along a common rail, respectively, the loader 44 is provided so as to be movable between the supply unit 10A and the press unit 10B, and the unloader 52 is provided so as to be movable between the press unit 10B and the molded article storage unit 10C.
Therefore, by changing the configuration of each unit, the configuration of the resin sealing device 10 can be changed while maintaining the state in which the guide portions 54 are coupled to each other. For example, fig. 1 shows an example in which the pressing portions 20 are provided at two locations, but a resin sealing device (not shown) in which the pressing portions 20 are provided at one location or at three or more locations may be configured. Further, a resin sealing device in which a part of the mechanism does not exist for each unit may be provided.
[ resin chip supply section 14]
Next, the structure of the resin chip supply unit 14 provided in the supply unit 10A of the resin sealing device 10 will be described.
First, in fig. 3, the resin chip supply section 14 includes a parts feeder 60 (resin chip supply mechanism) that arranges and feeds out the resin chips R from a storage container that stores a plurality of resin chips R. The parts feeder 60 is provided with a small piece housing container 64 in an exciter 62. When excited by the exciter 62, the resin pellets R in the pellet storage container 64 are discharged toward the supply port 65a while being arranged in a line on the resin pellet arranging path 65 (see fig. 6). However, the present invention is not limited to the above configuration, and may include a tablet magazine type supply mechanism (not shown) in which a tablet magazine for storing a large number of resin tablets R is provided and the resin tablets R are arranged and fed out from the tablet magazine by a pusher. Further, a stopper 65b is provided at the tip end of the supply port 65a, and the stopper 65b prevents the resin pellets R fed out in a billiard shape from falling.
In the present embodiment, a cover 66 is provided to cover the parts feeder 60, and the parts feeder 60 is separated from a chip conveyance mechanism 72, which will be described later, and the like. Thus, the resin chips R are prevented from being hardened more rapidly by suppressing the temperature rise of the resin chips R accommodated in the accommodating container (here, the chip accommodating container 64). Further, a cooling device 68 is provided inside the cover 66, and the ambient temperature in the resin pellet supply mechanism (here, the parts feeder 60) is controlled to a predetermined temperature (for example, approximately room temperature, i.e., 20 to 25 ℃). This more reliably prevents the hardening from progressing. In addition, as an example, an openable and closable shutter 66a is provided on the lid 66 and is opened when the resin small pieces R are fed from the parts feeder 60.
In fig. 4, a pickup/pressing mechanism 70 (resin chip loading mechanism) is provided in the vicinity of the supply port 65 a. The pick-and-press mechanism 70 grips the resin chip R fed out from the supply port 65a and fills the resin chip R into a holding hole 78a provided in a conveying chip holder 76a described later. In the present embodiment, for example, a pickup/pressing mechanism 70 that is movable between the parts feeder 60 (supply port 65a) and the conveying chip holder 76a is provided in the vicinity above the supply port 65a, and when a cylindrical resin chip R fed out in an upside-down state is held, the resin chip R is vertically erected by rotating 90 ° about the support shaft 70a, moved to a predetermined hole of the conveying chip holder 76a on standby, and filled into the holding hole 78a oriented in the vertical direction (see arrow a). However, the present invention is not limited to the above configuration, and for example, a configuration (not shown) may be adopted in which the resin pellets R are inserted from the supply port 65a into one hole of the rotary table, and are sequentially loaded into the holding holes 78a of the conveying pellet holder 76a by rotating the rotary table by 90 °. The structure for loading the resin chip R from the supply port 65a into the holding hole 78a of the conveying chip holder 76a can be selected from various structures in the related art.
[ chip conveying mechanism 72]
Next, the resin chips R are conveyed to the chip lifter mechanism 74 by the chip holder conveying mechanism 73 while being held by the conveying chip holder 76a, are transferred to the delivery chip holder 76b by the chip lifter mechanism 74, and are further transferred from the delivery chip holder 76b to the resin chip holding section 48 of the loader 44 by the chip lifter mechanism 74. Hereinafter, the description will be specifically made.
The chip holder transport mechanism 73 shown in fig. 4 is configured to reciprocate between the parts feeder 60 side and the chip elevator mechanism 74 side (see arrow B) in a state where the transport chip holder 76a is placed. For example, the conveying chip holder 76a is mounted on a moving body that moves along a conveying rail, and is driven by a belt or the like to reciprocate.
The conveying chip holder 76a shown in fig. 7 a to 7 c is formed in a frame shape (rectangular parallelepiped in this case) in which a plurality of (six in this case, the same number as the number of cans) holding holes 78a into which resin chips R can be loaded are arranged in a row at a predetermined pitch (here, the same pitch as the can pitch).
Here, the holding hole 78a is formed in a cylindrical shape having the same shape as the resin chip R, but is not limited thereto, and may be formed in a rectangular parallelepiped shape, for example. In addition, the number of the holding holes 78a is also indefinite. Therefore, the shape of the conveying chip holder 76a may be formed into a rectangular parallelepiped or a cube having various aspect ratios depending on the number of the holding holes 78 a. The conveying chip holders 76a may be loaded with resin chips R at a pitch narrower or wider than the can pitch, and the pitch may be changed to the same pitch as the can pitch before the conveying chip holders 76a are transferred to the transfer chip holders 76b, or the conveying chip holders 76b may be provided with twice as many holding holes 78a and the resin chips R may be transferred twice.
The holding hole 78a penetrates the conveying chip holder 76a in the vertical direction, and a shutter 80 for restricting the dropping of the resin chips R is provided at the lower end of the holding hole 78a and even in the vicinity thereof. The conveying chip holder 76a is provided with a shutter drive section 82, and the shutter 80 can be opened and closed. Accordingly, the resin chip R can be loaded and held in the holding hole 78 a.
The chip lifter mechanism 74 shown in fig. 4 and 5 is provided below the loader 44 which is on standby at the upper side, and is configured to be able to lift and lower the delivery chip holder 76b (see arrow C). The delivery chip holder 76b has the same configuration as the conveying chip holder 76a, but the movable shutter 80 is not provided in the delivery chip holder 76b, and the resin chips R can be held by the configuration in which the inner diameter of the lower end portion of the holding hole 78b is made relatively small (see fig. 5). However, the movable shutter 80 may be provided in the delivery small piece holder 76b, and the shutter 80 may be moved and retracted when the resin small piece R is lifted. The configuration is not limited to the above, and instead of the shutter 80, a resin tablet R may be directly mounted on the push-up rod 92 described later.
The chip lifter mechanism 74 includes a lifter portion 90 that moves up and down along a conveyance rail provided in the lifter body 74 a. A delivery chip holder 76b is provided above the elevating section 90. On the other hand, a comb-shaped push-up rod 92 (see arrow D) formed at a pitch corresponding to the position of each holding hole 78b of the delivery chip holder 76b is provided vertically movably below the elevating section 90. Therefore, when the elevating section 90 performs the elevating operation, the delivery chip holder 76b and the push-up rod 92 can be elevated, and the push-up rod 92 can be pushed up from below with respect to the resin chips R loaded in the holding holes 78b of the delivery chip holder 76 b. The elevating unit 90 is driven by a drive source 88 such as a servo motor and a drive transmission member (not shown) such as a ball screw mechanism, for example. The push-up rod 92 is also driven by a driving unit (not shown) such as a ball screw mechanism.
According to the above configuration, the resin pellets R are conveyed by the pellet holder conveyance mechanism 73 to the vicinity of the upper surface of the delivery pellet holder 76B waiting below the loader 44 in a state of being held in the holding holes 78a provided in the conveyance pellet holder 76a (arrow B). Next, the shutter 80 is opened in a state where the holding hole 78a of the conveying chip holder 76a and the holding hole 78b of the delivery chip holder 76b are coaxially and uniformly aligned in the vertical direction, and the resin chips R drop and are delivered to the delivery chip holder 76b (holding holes 78 b). In the present embodiment, the resin chips R are transferred from the conveying chip holder 76a to the transfer chip holder 76b, but the present invention is not necessarily limited to the above configuration, and for example, the pick-and-press mechanism 70 may be configured to directly load the resin chips R into the holding holes 78b of the transfer chip holder 76 b. Then, the resin pellets R are lifted by the lifting and lowering section 90 from the lower portion of the lifter body 74a to the vicinity of the lower surface of the loader 44 standing on the upper side while being held by the delivery pellet holder 76b (arrow C). Next, in a state where the holding hole 78b of the delivery chip holder 76b and the resin chip holding portion 48 of the loader 44 are coaxially aligned in the vertical direction, the resin chip R is pushed up by the push-up rod 92, the shutter 50 of the loader 44 (the resin chip holding portion 48) is movably closed, and then the push-up rod 92 is lowered to perform delivery (arrow D).
In the present embodiment, the chip carrier mechanism 72 is provided with the chip holder carrier mechanism 73 and the chip lifter mechanism 74, and the resin chips R are delivered to the loader 44 through a two-stage carrier line. For example, the chip holder conveyance mechanism 73 is not necessarily required, and the pick-and-press mechanism 70 may directly load the resin chips R into the holding holes 78b of the delivery chip holder 76 b. Further, the transfer may be performed by three or more transfer lines. In the case where the conveying line is configured in multiple stages, the chip holders 76b provided in the final conveying line to deliver the resin chips R to the loader 44 are limited so that the holding holes 78b are spaced at the same pitch as the tank pitch and are spaced at the same number as the number of tanks 30 of the resin sealing mold 22, but the chip holders 76a provided in the conveying line upstream of this holding holes are not necessarily arranged at the same pitch as the tank pitch or the same number as the number of tanks. In this case, for example, a can pitch changing mechanism or the like may be provided, or the resin chips R may be delivered and received in a plurality of times as the chip holder 76a having the integral multiple of the holding hole 78a with respect to the chip holder 76 b. On the other hand, for example, as the chip conveying mechanism 72 for conveying the resin chips R in the vertical direction, the resin chips R may be directly fed out from the parts feeder 60 and loaded into the chip holder 76b, and the posture may be changed in the vertical direction of 90 ° to be transferred to the loader 44.
[ Heater 96]
Here, the conveying chip holder 76a and the delivery chip holder 76b of the present embodiment are provided with heaters 96 (fig. 3 to 7 (c)) for preheating the resin chips R loaded in the holding holes 78a and 78 b. Accordingly, the resin pellets R supplied from the parts feeder 60 can be preheated before being transferred to the loader 44, and furthermore, by providing a heater (not shown) also in the loader 44, the resin pellets R can be preheated from the parts feeder 60 to the resin sealing mold 22. Since the resin pellets R required for primary resin sealing are usually held in the pellet holder 76b and transferred to the loader 44 in a batch, the respective temperature conditions (preheating conditions) of the resin pellets R can be made the same, and the molding quality can be stabilized. When the conveying chip holder 76a and the delivery chip holder 76b are used as the configuration for delivering the resin chips R to the workpiece W, at least the heater 96 needs to be provided in the delivery chip holder 76b immediately before delivery to the loader 44.
As described above, although a large number of resin pellets R are charged into the pellet housing container 64 of the parts feeder 60, there is a possibility that the resin pellets are gradually hardened with time as compared with the state at the time of charging, depending on the ambient temperature environment. Therefore, as a structure isolated from the surrounding environment by covering the parts feeder 60 with the cover 66, the hardening of the resin R is not accelerated by suppressing the temperature rise of the resin pieces R. Further, the resin pellets R before being supplied may be actively cooled by the cooling device 68.
As a configuration example of the present embodiment, one or more tubular heaters 96 are incorporated on both sides in the arrangement direction of the holding holes 78a, 78b provided at a predetermined pitch in the chip holders 76a, 76b formed in a frame shape (fig. 7 (a)). However, the present invention is not limited to the above configuration, and as another example, one or more tubular heaters 96 may be incorporated at positions that separate the holding holes 78a and 78b provided at a predetermined pitch (fig. 7 (b)). By providing the heater 96 around or between the holding holes 78a and 78b in this manner, the respective resin chips R can be uniformly preheated. Of course, the heater 96 is not limited to a tubular shape, and may take various shapes, and may be provided not only inside the chip holders 76a and 76b but also outside. Therefore, as a modification of the present embodiment, for example, a plate-shaped heater 96 may be provided outside the chip holders 76a and 76b located on both sides in the arrangement direction of the holding holes 78a and 78b (fig. 7 (c)).
In the present embodiment, a heating wire heater is used as the heater 96, but the heater is not limited to this, and various known heating mechanisms such as a sheath heater and a carbon heater can be used.
The preheating temperature of the heater 96 is set to a predetermined temperature lower than the resin sealing temperature, but as an example of setting the preheating temperature in the present embodiment, the preheating temperature of the delivery chip holder 76b is set to a predetermined temperature higher than the preheating temperature of the conveying chip holder 76 a. For example, in the case of the mold resin R having a resin sealing temperature of 130 to 150 ℃, the preheating temperature of the conveying chip holder 76a is set to about 50 to 60 ℃, and the preheating temperature of the delivery chip holder 76b is set to about 60 to 70 ℃. Accordingly, the resin pellets R can be gradually heated according to the travel of the conveying path, and can be preheated at a predetermined preheating temperature when being delivered to the loader 44. In the present example, when the loader 44 includes a heater, the preheating temperature of the loader 44 is set to about 70 ℃ to 80 ℃. However, the temperature is not limited to the respective exemplary predetermined temperatures.
In addition, since the chip holders 76a and 76b of the present embodiment are provided with the temperature sensors 98 (see fig. 7 a to 7 c) together with the heaters 96, the preheating temperature of the heaters 96 can be maintained at the predetermined temperature. Therefore, the resin pellets R can be preheated more stably.
In the case where the chip conveying mechanism 72 is configured to deliver chips in a plurality of (two or more) conveying lines, it is not necessary to provide the heaters 96 in all the chip holders 76. That is, the heater 96 may be provided in the chip holder 76 as needed and as appropriate according to the type and size of the resin chips R, the capacity of the chip holder 76, and the like. In this case, the heater 96 is preferably provided in the chip holder 76 on the relatively downstream side (loader 44 side), and more preferably in the chip holder 76 (herein, delivery chip holder 76b) which is provided in the final conveyance line and delivers the resin chips R to the loader 44. Accordingly, the resin pellets R can be preheated in the vicinity of the resin sealing mold 22. Therefore, the resin sealing mold 22 can be carried in while the effect of temperature increase is maintained, and temperature control can be easily performed.
As described above, according to the present invention, the preheating can be performed before the resin pellets supplied from the resin pellet supply mechanism are delivered to the loader. Therefore, even when a large amount of small resin pieces are put into the resin sealing mold (can), the temperature difference between the resin sealing mold and the small resin pieces put into the mold can be reduced, and thus the temperature drop caused by the putting of the small resin pieces into the can be suppressed. As a result, the heating time of the resin sealing mold is not prolonged, and the productivity and the molding quality can be prevented from being lowered.
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.
Claims (8)
1. A resin sealing device which carries a small resin piece into a resin sealing mold by a loader and performs resin sealing, the resin sealing device comprising:
a resin chip supply mechanism for distributing and delivering the resin chips from a container for storing a plurality of resin chips; and
a chip transport mechanism for transporting the resin chips fed from the resin chip supply mechanism in a state of holding the plurality of resin chips and delivering the resin chips to the loader,
the chip carrying mechanism is provided with a chip holder for loading and holding a plurality of resin chips in holding holes arranged at a predetermined pitch,
the chip holder is provided with a heater for preheating the resin chips at a predetermined temperature lower than the resin sealing temperature.
2. The resin sealing apparatus according to claim 1,
the chip holder is provided as a delivery chip holder which loads and holds a plurality of resin chips in the holding holes provided at the same pitch as the can pitch of the resin sealing mold and at the same number as the number of cans of the resin sealing mold,
the chip carrying mechanism includes a chip lifter mechanism that simultaneously transfers a plurality of resin chips loaded in the holding holes of the transfer chip holder from below to the loader,
the heater is provided to the interface die holder.
3. The resin sealing apparatus according to claim 2,
the chip holder is provided as a conveying chip holder for loading and holding a plurality of resin chips in the holding holes provided at a predetermined pitch,
the chip carrier mechanism includes a chip holder carrier mechanism that carries the carrier chip holder in which the holding hole is filled with the resin chip fed out from the resin chip supply mechanism, and that delivers the resin chip filled in the holding hole of the carrier chip holder to the delivery chip holder,
the heater is provided at least at the interface die holder.
4. The resin sealing apparatus according to claim 3,
a temperature sensor is provided in the delivery chip holder or the transport chip holder to maintain the preheating temperature of the heater at a predetermined temperature.
5. The resin sealing device according to claim 3 or 4,
the preheating temperature of the delivery chip holder is set to a predetermined temperature higher than the preheating temperature of the conveying chip holder.
6. The resin sealing device according to any one of claims 1 to 4,
the heaters are provided on both sides in the arrangement direction of the holding holes provided at a predetermined pitch in the sheet holder formed in a frame shape.
7. The resin sealing device according to any one of claims 1 to 4,
the heater is provided at a position where the holding holes provided at a predetermined pitch in the chip holder formed in a frame shape are separated.
8. The resin sealing device according to any one of claims 1 to 4,
the resin chip supply mechanism is covered by a cover so as to be separated from the chip conveying mechanism, and a cooling device is provided for performing temperature management so that the ambient temperature in the resin chip supply mechanism becomes a predetermined temperature.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020152602A JP7453683B2 (en) | 2020-09-11 | 2020-09-11 | Resin sealing device |
| JP2020-152602 | 2020-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114171425A true CN114171425A (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110570717.XA Pending CN114171425A (en) | 2020-09-11 | 2021-05-25 | Resin sealing device |
Country Status (3)
| Country | Link |
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| JP (1) | JP7453683B2 (en) |
| CN (1) | CN114171425A (en) |
| TW (1) | TWI814009B (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0483614U (en) * | 1990-11-29 | 1992-07-21 | ||
| JPH0542542A (en) * | 1991-08-19 | 1993-02-23 | Toshiba Corp | Feeder of tablet for resin mold |
| JP4429040B2 (en) | 2004-03-02 | 2010-03-10 | アピックヤマダ株式会社 | Resin molding device and resin tablet supply device |
| CN102066081B (en) * | 2008-10-28 | 2014-10-15 | 三菱重工塑胶科技有限公司 | Injection molding machine and injection molding method |
| JP5359779B2 (en) | 2009-10-26 | 2013-12-04 | アピックヤマダ株式会社 | Resin tablet supply device and resin sealing device |
| JP5824765B2 (en) * | 2011-01-11 | 2015-12-02 | アピックヤマダ株式会社 | Resin molding method, resin molding apparatus, and supply handler |
| JP6071216B2 (en) * | 2012-02-28 | 2017-02-01 | Ｔｏｗａ株式会社 | Manufacturing method of resin sealing material and resin sealing device |
| JP6143665B2 (en) * | 2013-12-26 | 2017-06-07 | Ｔｏｗａ株式会社 | Semiconductor sealing method and semiconductor sealing device |
| JP2017212419A (en) * | 2016-05-27 | 2017-11-30 | Ｔｏｗａ株式会社 | Resin sealed product manufacturing method and resin sealing device |
| TWI609439B (en) * | 2016-06-29 | 2017-12-21 | All Ring Tech Co Ltd | Substrate inspection transport method and device |
-
2020
- 2020-09-11 JP JP2020152602A patent/JP7453683B2/en active Active
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2021
- 2021-05-25 CN CN202110570717.XA patent/CN114171425A/en active Pending
- 2021-06-01 TW TW110119885A patent/TWI814009B/en active
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| Publication number | Publication date |
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| TW202210266A (en) | 2022-03-16 |
| JP7453683B2 (en) | 2024-03-21 |
| JP2022046948A (en) | 2022-03-24 |
| TWI814009B (en) | 2023-09-01 |
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