JPH0722446A - Mechanism and method for transferring and charging resin tablet in resin molding equipment - Google Patents

Abstract

PURPOSE:To eliminate failures such as the generation of unnecessary dust, tablet non-filling, etc., by means of a simplified construction when resin tablets are charged into a plunger pot of a lower mold in a resin molding equipment. CONSTITUTION:When resin tablets are to be transferred and charged into a plunger pot which is formed in a mold under mold open state, the resin tablet is supplied thereto as they are loaded in a supply tray 9, and then they are picked up and put into a tablet holding hole 13 of a transfer unit 11 whose lower opening can be freely opened or closed. Then, the unit 11 is moved to the above of the mold and the lower opening of the hole 13 is opened to charge the resin tablets 5 into the plunger pot 6 on the mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin tablet conveying / charging mechanism and method in a resin molding apparatus.

[0002]

2. Description of the Related Art For example, a resin mold package type electronic component such as an IC or a transistor uses a manufacturing frame formed by stamping a thin metal plate to perform a chip bonding process and a wire bonding process. It is manufactured by performing each process such as a process, a resin molding process, a marking process, an inspection process, a lead cutting or lead forming process.

In the resin molding step, a resin molding apparatus using a thermosetting resin such as an epoxy resin by a so-called transfer molding method is used.

This resin mold molding apparatus comprises a lower mold,
The upper mold has a mold clamped state in which it is superposed on the lower mold and a mold open state in which the mold is opened above the lower mold. A plurality of cavities corresponding to the form of the resin package of the electronic component to be manufactured are formed on both mold surfaces. In addition to the above-mentioned cavity, the lower mold is provided with a plunger pot into which a thermosetting resin tablet in a solid state is put, and a runner groove or a gate groove connected to this plunger pot.
Put a resin tablet in the plunger pot, clamp the two molds so that they are sandwiched while positioning the manufacturing frame, and then heat the resin melted in the plunger pot to the lower metal. By pressing the plunger incorporated in the mold, the pressure is fed into each cavity space through the runner groove or the gate groove. In a state where the upper and lower molds are opened after a certain curing, the resin mold package part having a predetermined shape is formed on the manufacturing frame.

By the way, in the past, the injection of the resin tablet into the plunger pot formed in the lower mold was generally performed as follows.

That is, a cylindrical resin tablet having a fixed length is transported while being aligned by a ball feeder or the like, and then transported on a transport belt in an aligned state, for example. In this way, the resin tablets lined up on the conveyor belt are supplied one by one into the plunger pot on the mold by the suction conveyor means.

However, in the above-described conventional resin tablet transporting / charging method, the resin tablet has many occasions of rubbing contact with the ball feeder or the transporting belt during transporting, and dust generated by this tends to be in the vicinity. In many cases, it is attached to the drive parts and sensors of the existing devices, resulting in operational mistakes and malfunctions.

Further, the resin tablet often falls on the conveyor belt and a pickup error due to the suction and conveying means often occurs due to this. For this reason, defective loading of the resin tablet into the mold occurs. There were many things to do.

The present invention has been devised under the circumstances described above, and it is possible to suppress the generation of dust or the like or the inconvenience resulting therefrom in the resin molding process as much as possible. It is an object of the present invention to provide a resin tablet transfer / loading mechanism and method in a resin mold molding apparatus that can more stably and reliably load the resin tablet into the plunger pot of the mold.

[0010]

In order to solve the above problems, the present invention takes the following technical means.

That is, the invention described in claim 1 of the present application is a mechanism for carrying and loading a resin tablet into a plunger pot formed in a mold in a mold open state, in which a resin tablet supply tray is provided. The present invention is characterized in that it is provided with a transfer means for sequentially picking up and transferring the aligned resin tablets and a transfer unit for transferring the resin tablets received from the transfer means onto the mold and inserting them into the plunger pot. To be

According to a second aspect of the present invention, in the mechanism of the first aspect, the transfer unit moves between a tablet receiving position outside the die and a tablet loading position on the die. It has a tablet holding hole that penetrates vertically and is slidable between a closed position that closes the lower opening of the tablet holding hole and an open position that opens, and is always in the closed position direction. The shutter plate is further urged toward the transfer unit by contacting the mold or a member integral with the mold when the transfer unit moves to the tablet loading position. It is characterized in that it is configured to slide relatively to the open position.

The invention set forth in claim 3 of the present application is a method for carrying and loading a resin tablet into a plunger pot formed in a mold in a mold open state,
While supplying the resin tablet in a state of being aligned with the supply tray, after picking up and storing the resin tablet of the supply tray in the tablet holding hole of the transfer unit having a tablet holding hole capable of opening and closing the lower opening, The transfer unit is transferred to the mold, and the lower opening of the tablet holding hole is opened to insert the resin tablet into the plunger pot on the mold.

[0014]

In the invention described in claim 1 of the present application, first, the supply of the resin tablets is performed in a state where they are preliminarily aligned in the supply tray.
Therefore, when the resin tablets arranged in the supply tray are sequentially picked up and loaded into the transfer unit, there is almost no pick-up error. Further, the transfer unit that has thus surely received the resin tablet can be surely and easily put into the plunger pot in the mold by adopting the specific configuration described in claim 2 above, for example. is there.

Further, unlike the conventional resin tablet charging method, the ball feeder and the process of arranging the resin tablets on the conveyor belt are eliminated, so that the dust generated from the resin tablets is also extremely small, and this dust generation Defects are also effectively resolved.

According to the invention described in claim 2 of the present application, the construction and operation of the transfer unit are characterized.
The tablet holding hole of the transfer unit is opened on the upper side, and the lower opening is closed by a shutter plate which is always biased in the closing direction. Therefore, by simply dropping the resin tablet into the tablet holding hole of the transfer unit at the tablet receiving position outside the mold from the upper opening of the transfer unit, the resin tablet will have a certain correct posture and the tablet holding hole. It is delivered inside.

Then, when the transfer unit advances from the tablet receiving position onto the die to take the tablet loading position, the shutter plate comes into contact with the die or a member integral with the die, whereby It slides to the open position against the biasing force to open the lower opening of the tablet holding hole. As a result, the resin tablet housed in the tablet holding hole is dropped by gravity into the plunger pot on the mold.

As described above, the transfer unit that has received the resin tablet can automatically insert the resin tablet into the appropriate plunger pot by simply advancing onto the mold. The moving mechanism can be extremely simplified.

The invention described in claim 3 of the present application is substantially the same as the invention described in claim 2, which is a method for carrying and loading a resin tablet using the apparatus described in claim 2. The effect can be expected.

As described above, according to the resin tablet transporting / charging mechanism and method in the resin mold molding apparatus of the present invention, the resin tablet can be placed in the plunger pot on the lower mold in the resin mold molding step with a simple structure and operation. The resin tablet can be surely put in without causing the filling failure, and thus, for example, the resin mold forming step in the electronic part of the resin mold package type can be performed with high yield.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below.
A specific description will be given with reference to the drawings.

FIG. 1 is a schematic view showing the overall construction of a resin tablet conveying / charging mechanism in a resin molding apparatus 1 of the present invention. First, the structure shown in this figure will be briefly described. Reference numerals 2 and 3 denote molds in a mold opening state. On the lower mold 3, a plurality of cavities 4 ... Corresponding to the shape of the intended resin mold package, and a plunger pot 6 into which the resin tablet 5 is put, as already described in the section of the prior art. A runner groove 7 connected to the plunger pot 6 and a gate groove 8 connected to each cavity 4 so as to branch from the runner groove 7 are formed. On the other hand, upper mold 2
Is supported by a press device or the like, and it is possible to select a clamped state in which it overlaps the lower mold 3 and a mold open state as shown in FIG. 1. Cavities (not shown) corresponding to the respective cavities 4 formed on the lower mold 3 are formed.

On the side of the resin molding apparatus 1,
A supply tray 9 is arranged for supplying the resin tablets 5 in an aligned state. The tray 9 is in the shape of a rectangular box having a predetermined depth, and the partition plate 10 extends in the longitudinal direction.
Are provided at equal intervals. The interval between the partition plates 10 corresponds to the diameter of the cylindrical resin tablet 5 to be charged, and the tablet 5 can be held without rattling. Further, the width of the box-shaped tray 9 has a dimension corresponding to an integral multiple of the diameter of the resin tablet 5.

In the embodiment, the resin tablets 5 are aligned and held in a stacked manner in four rows in a space having a rectangular shape in plan view surrounded by the partition plates.

The tray 9 is held by a tray holding mechanism (not shown) and is intermittently fed in a direction indicated by an arrow A in FIG. 1 at a pitch corresponding to the pitch of the partition plates 10. There is.

Reference numeral 11 is for receiving the resin tablet 5 conveyed from the tray 9 by the sucking and conveying means 12 and transferring the resin tablet 5 onto the lower mold to put it in the plunger pot 6. The transfer unit of FIG. The transfer unit 11 is supported by a horizontal transport support mechanism (not shown), and as described above, can be reciprocated between the resin tablet receiving position outside the mold and the resin tablet loading position on the mold. It is like this.

The transfer unit 11 is in the form of a block having a constant thickness, and a plurality of tablet holding holes 13 are vertically arranged so as to correspond to the number of the plunger pots 6 on the lower mold 3 and the intervals thereof. It is formed so as to penetrate in the direction. The vertical thickness of the block of the transfer unit 11 is
Corresponding to the height of the cylindrical resin tablet to be thrown in,
It is set equal to or slightly larger than that.

The lower surface of the block of the transfer unit 11 is slidable between a state where the lower opening of the tablet holding hole 13 is closed and a state where the lower opening of each holding hole is opened, and A shutter plate 14 is provided that is biased toward the closed position.

More specifically, the shutter plate 14 is
As shown in FIGS. 2 and 3, the tablet holding hole 1
3 is a plate-like member having an opening 15 corresponding to 3 and a guide member 16
Is slidably supported on the lower surface of the block, and a locking piece 17 extending downward is integrally attached to the outer end of the block.

A compression coil spring 19 is interposed between the outer surface of the locking piece 17 and the hanging plate 18 formed at the end of the block. As a result, the shutter plate 14 has the opening 15 as shown in FIGS.
However, each is biased toward the closed position that does not coincide with the lower opening of the tablet holding hole 13. Further, the locking piece 17 is extended downward in the height direction so as to interfere with the edge portion of the lower mold 3, and as will be described later, this transfer unit 11 is on the mold. When the locking piece 17 contacts the edge of the mold 3 when moving to the tablet loading position, the lower mold 3 of the shutter plate 14 is contacted.
The movement relative to is blocked.

Resin tablet 5 in the supply tray 9
Is transported into each tablet holding hole 13 on the transport unit 11 at the above-mentioned tablet receiving position by the suction transport means 12. The suction transport means 12 is supported by a transport mechanism (not shown) that moves vertically and horizontally, and sucks and holds the tablets in the tray 9 by the vacuum suction force, and also holds the transfer unit 11. The resin tablet 5 can be transferred into the hole 13.

Next, the operation of the above-mentioned resin tablet conveying / charging mechanism will be described.

The molds 2 and 3 are in the mold open state, and the transfer unit 11 is positioned at the tablet receiving position outside the mold, as shown in FIG. In this state, the shutter plate 14 has the compression coil spring 19
Is located in the closed position, and therefore the bottom of each tablet holding hole 13 of the transfer unit 11 is closed.

In this state, the suction / conveyance mechanism 12 operates to pick up the resin tablets 5 aligned and held in the supply tray 9 one by one and load them into the respective holding holes 13. When the one row of resin tablets partitioned by the partition plate 10 of the tray 9 is used up, a supply tray support mechanism (not shown) moves the supply tray 9 one step in the longitudinal direction (direction of arrow A).

Each tablet holding hole 1 of the transfer unit 11
When the resin is completely loaded into the inside 3, the transfer unit 11 moves in the horizontal direction as shown in FIG. 1 to the tablet loading position on the lower mold. In the middle of the process, the locking piece 17 provided on the shutter plate 14 is brought into contact with the edge of the lower mold 3 to prevent its movement. However, the transfer unit 11 itself further moves to the tablet loading position, so that the shutter plate 14 which is blocked by the locking piece 17 as described above is forcibly moved toward the open position with respect to the transfer unit 11. Will be done.
Then, when the holding hole 13 of the transfer unit 11 is correctly positioned immediately above the plunger pot 6 on the lower die, the lower opening of the tablet holding hole 13 is fully opened and received by the shutter plate 14. The resin tablets 5 in the holding holes 13 are dropped into the plunger pots 6 by gravity falling.

When the loading operation of the tablet is completed, the transfer unit 11 is retracted outside the mold. During this time, the molds are clamped, and the resin heated and melted in the plunger pot 6 is actuated by the plunger incorporated in the lower mold, so that the runner groove 7 or the gate grooves 8 are used to It is injected into the cavity space.

When the resin is thermally cured through a certain cure after the injection, the upper and lower molds are opened, and the cavities are cleaned by a mold cleaning mechanism (not shown), and then the resin is charged by the transfer unit 11. Received, and repeats thereafter.

Although not shown, in the resin molding process in the production of resin package type electronic parts such as semiconductor devices, the manufacturing frame after the chip bonding process or the wire bonding process is moved up and down by a predetermined transport mechanism. It is transported between the molds,
The mold clamping described above is performed in such a manner as to sandwich the manufacturing frame.

As described above, according to the resin tablet conveying / charging mechanism and method in the resin molding apparatus of the present invention, the tablet supply tray 9 is previously prepared.
The tablets aligned by the above are once loaded into the holding holes 13 of the transfer unit 11, and the transfer unit 1
1 is introduced into the mold to insert the tablet into the plunger pot.

Therefore, even if the suction conveyance mechanism is used, there is almost no chance that the suction mistake will occur, the resin tablet is transferred to the transfer unit in an appropriate state, and is stably placed in the plunger pot. It Therefore, unlike the conventional case, a defect such as non-filling of resin into the plunger pot hardly occurs, and the yield of the resin-molded products is improved accordingly.

Further, since the conventional ball feeder and belt conveying mechanism are eliminated, the dust does not rub off from the resin tablet, and the dust adheres to the operating portion or the sensor portion of each peripheral mechanism. Problems such as malfunctions are also conveniently avoided.

Further, as in the embodiment shown in the drawings, the shutter plate that opens and closes the lower opening of the holding hole of the transfer unit is automatically opened and closed by the horizontal movement of the transfer unit itself. The complicated mechanism for separately operating the shutter plate is omitted, the mechanism for moving the transfer unit is simplified, and the operation stability is improved.

Of course, the scope of the present invention is not limited to the above embodiments. Although the above-mentioned embodiment has been described on the premise of the resin molding step in the production of the resin mold package type electronic component, in the resin molding apparatus by the so-called transfer molding method using the thermosetting resin, the resin tablet is molded into a mold. It goes without saying that the present invention can be applied to all cases where it is put into the plunger pot.

In the resin tablet supply tray, the resin tablets having a cylindrical shape may be arranged in advance in an appropriate posture, and the concrete form is not limited.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an overall configuration of a resin tablet transport / loading mechanism according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1, showing a transfer unit that constitutes the resin tablet transfer / loading mechanism.

FIG. 3 is a cross-sectional view showing a state in which the transfer unit of FIG. 2 has been transferred and is in contact with a lower mold.

FIG. 4 is a bottom view taken along the line IV-IV in FIG.

[Explanation of symbols]

1 Resin Tablet Conveying and Loading Mechanism in Resin Mold Forming Device 3 Mold (Lower Mold) 5 Resin Tablet 6 Plunger Pot 9 Resin Tablet Supply Tray 11 Transfer Unit 12 Conveying Means 13 Tablet Holding Hole 14 Shutter Plate

Claims (3)

[Claims] 1. A mechanism for conveying and loading resin tablets into a plunger pot formed in a mold in an opened state, wherein resin tablets arranged in a resin tablet supply tray are sequentially picked up. And a transfer unit that transfers the resin tablet received from the transfer unit onto the mold and inputs the resin tablet into the plunger pot. Input mechanism. 2. The transfer unit is configured to be movable between a tablet receiving position outside the die and a tablet loading position on the die, and includes a tablet holding hole penetrating in a vertical direction, and , Further comprising a shutter plate that is slidable between a closed position that closes the lower opening of the tablet holding hole and an open position that opens, and that is always biased toward the closed position. When the transfer unit is moved to the tablet loading position, the transfer unit is configured to slide relative to the transfer unit by contacting the mold or a member integrated with the mold. The resin tablet transfer / loading mechanism at the resin mold molding position according to claim 1. 3. A method of transporting and feeding a resin tablet into a plunger pot formed in a mold in an opened state, wherein the resin tablet is supplied in a state of being aligned with a supply tray, and a lower opening is provided. After the resin tablet of the supply tray is picked up and accommodated in the tablet holding hole of the transfer unit having a tablet holding hole that can be opened and closed, the transfer unit is transferred onto the mold, and then the tablet holding hole. A method for transporting and charging a resin tablet in a resin molding apparatus, wherein the lower opening of the resin tablet is opened and the resin tablet is charged into a plunger pot on a mold.