JPH0957785A - Automatic molding device using release film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out an automatic resin-molding by providing a conveyance mechanism for supplying a release film to a pressing mechanism part. SOLUTION: A resin molding device is equipped with a pressing mechanism part A for applying an article to be molded to resin molding, the conveyance mechanisms B, C of a release film for supplying the release film 10 to the pressing mechanism part by fitting timing to resin molding operation in the pressing mechanism part A and the conveying in/out mechanism part of a product which transfers the article to be molded to the pressing mechanism part and also conveys out the product after resin molding from the pressing mechanism part. 1 The conveyance mechanism parts B, C of the release film newly supply the release film 10 to each top force 12 and bottom force 14 at every time of performing resin molding operation in a designated number of times in the pressing mechanism part A. The release film 10 after use is conveyed out from the top of the molding die and recovered. In the case of conveying the release film 10, conveyance of the release film 10 is stopped to perform resin molding in a plurality of numbers of times and thereafter conveyed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic molding apparatus using a release film, which is used for manufacturing a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art Conventionally, an automatic molding apparatus such as a transfer molding apparatus has been used as an apparatus for manufacturing resin-sealed semiconductor devices such as PLCC and QFP. These automatic molding apparatuses are configured to set a molding die in which a cavity recess for resin molding is formed in a press machine, and automatically supply a resin tablet for resin molding and a molding target to perform resin molding. .

When handling a strip-shaped molded product such as a lead frame, a magazine containing a plurality of molded products is set in a molding machine, and the molded product is automatically supplied from the magazine to a molding die. Resin molded. The product after resin molding is taken out from the molding die, and after removing unnecessary resin, only the product is stored in a storage tray or the like. In the conventional resin molding apparatus, the resin pressure-fed into the cavity directly contacts the inner surface of the mold to cure the resin. Therefore, an ejector pin is provided in the molding die, and the resin part of the product is projected by the ejector pin when the mold is opened for mold release.

[0004]

By the way, in recent semiconductor devices, semiconductor elements having extremely high power consumption and high frequency characteristics are mounted, and resin-molded semiconductor devices also meet these characteristics. There is a demand for products that can. In the resin mold type semiconductor device, the resin sealing material used for the resin mold has a great influence on these characteristics, and therefore the selection of the mold resin is important.

For example, in the case of a semiconductor device having a semiconductor element that generates a large amount of heat, a resin having a high thermal conductivity, for example, a resin in which a ceramic filler having a high thermal conductivity and a high heat resistance is mixed at a high ratio is used. There are cases. However, such a resin has a strong effect of abrading the mold die, and if resin molding is continued, the gate of the mold die abruptly wears, which causes a problem that mass production cannot be performed.

Further, although recent resin mold products tend to be made thinner, it becomes difficult to fill the resin into the cavity during resin molding in the case of such a thin package, and it is difficult to fill the resin. There arises a problem that a void is generated in the cavity. Further, since the pitch of the bonding portion such as the lead frame is extremely narrow due to the miniaturization of the package, there is a problem that a wire sweep occurs when the resin passes between these wirings. It has been considered to use a resin having high fluidity as a method of solving these problems. However, when such a resin having high fluidity is used, sliding of plungers, ejector pins, etc. that come into contact with the resin in the mold There is a problem that the resin enters the moving part to make the operation impossible, and a problem that the resin leaks on the parting surface of the mold and stains the mold and the molded product.

The resin molding method using a release film was devised as a method for solving the above problems in the conventional automatic molding apparatus. That is,
This resin molding method uses a flexible film that is required heat resistance and easily peels off from the resin as the release film, and covers the inner surface of the cavity of the mold with the release film during resin molding. This is a method of resin molding without directly contacting the mold surface.

FIG. 8 shows a resin molding method using a release film. In the figure, the left half of the center line shows a state before the resin is filled in the cavity, and the right half shows a state in which the cavity is filled with the resin. The molded product 204 is clamped by the upper mold 200 and the lower mold 202, and the resin 208 is removed from the pot 206.
Is filled in the cavity 210 and resin-molded. Two
12a and 212b are release films, and the upper mold 20
0 and the inner surface shape of the cavity concave portion of the lower mold 202 are covered with the mold surface, and the cavity 210 is filled with resin and resin-molded.

In this example, a wrapping resin 214 in which a resin is sealed with a heat resistant film is used as a mold resin. The wrapping resin 214 is supplied to the pot 206 in a state where the resin is sealed with the film, and the resin is pressure-fed by the plunger so that the sealing portions on both side edges of the wrapping film are expanded and the resin 208 is filled in the cavity 210. .

As described above, in the case of the resin molding method using the release film, the mold resin does not directly contact the mold surface, and accordingly, the wear of the mold at the gate portion, the cavity concave portion, etc. does not pose a problem. There is an advantage that the type of molding resin used is not restricted. Further, the mold release after the resin molding is easy, and the mold release can be easily performed without providing the ejector pin. Further, since the mold surface is covered and resin-molded, there is an advantage that there is no concern that the resin will enter the gap portion of the mold even if a resin having high fluidity is used.

In the conventional resin molding apparatus, the type of resin used is limited due to abrasion of the molding die as described above, whereas the resin molding method using the release film described above is as follows. It is possible to use the most suitable resin according to the product without any restrictions, and it is possible to use the mold resin most suitable for the product. The present invention proposes a configuration suitable as an automatic molding apparatus to which the resin molding method using such a release film is applied.

[0012]

The present invention has the following constitution in order to achieve the above object. That is, in an automatic molding apparatus that uses a release film that covers the mold surface of a resin mold portion of a mold mold with a release film and molds the resin, the mold mold is mounted and supplied onto the mold mold. A press mechanism part for resin-molding a molded product and a long release film which is controlled in conjunction with a resin molding operation in the press mechanism part and is aligned with the set position of the molded product on the molding die. The transport mechanism part of the release film which is intermittently fed at a constant size and is controlled in conjunction with the resin molding operation in the press mechanism part, and the molded product and the mold resin are supplied to the mold die, It has a carrying-in / carrying-out mechanism section for a product after resin molding and a product for taking out unnecessary resin from the molding die. In addition, the transport direction of the release film in the transport mechanism of the release film,
The moving direction of the transport head of the loading / unloading mechanism for the product is arranged to be substantially orthogonal. Moreover, the release film transporting mechanism in the release film transporting mechanism and the moving direction of the transporting head of the product loading / unloading mechanism are arranged substantially parallel to each other. Also,
The product carrying-in / carrying-out mechanism section, a work carrying-in head for supplying a molded product onto a molding die, and a resin supply head for supplying a molding resin to a pot of the molding die,
It has a product carrying-out head for taking out a product after resin molding from a molding die. Further, the product carry-in / carry-out mechanism section has a resin carry-out head for carrying out the unnecessary resin from the molding die. Further, the loading / unloading mechanism section for the product has a digating section for removing unnecessary resin from the product taken out from the molding die. Further, the release film transporting mechanism section has a supply reel around which a long release film is wound, and a recovery reel around which the resin-molded release film is wound up. Further, the release film transport mechanism section has a storage section for directly introducing the release-side release film into a storage box or the like and storing the release film without winding the release film on a reel. Further, the release film transporting mechanism section has a feed drive section for moving the feed head forward and backward in parallel with the feed direction of the release film and pinching and transporting the release film by the feed head. Further, the release film transporting mechanism section is characterized by having a feed drive section for feeding a fixed size by a pinch roller on the supply side. Further, the release film transporting mechanism section has a mechanism for pinching the release film by a pinching roller and transporting the release film on the collecting side. Further, the release film transporting mechanism section has a sensor for detecting a transporting position of the release film during transporting.

[0013]

In the automatic molding apparatus using the release film according to the present invention, a new release film transfer mechanism is provided on the molding die of the press mechanism unit for each one resin molding operation or every several resin molding operations. Release film is fed by constant size feed, then
The article to be molded and the molding resin are supplied to the molding die by the product loading / unloading mechanism to be resin-molded. After the resin molding, the product carry-in / carry-out mechanism takes out the product and unnecessary resin from the press mechanism section. The product carry-in / carry-out mechanism has a work carry-in head, a resin supply head, and a product carry-out head, and these carrying heads automatically perform required operations such as supply of a molded product.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described. [First Embodiment] FIG. 1 is a front view showing the construction of a first embodiment of an automatic molding apparatus using a release film according to the present invention, and FIG. 2 is a plan view. This resin molding device is composed of a press mechanism section for resin-molding a molded product, a release film transport mechanism section for supplying a release film to the press mechanism section at the same timing as the resin molding operation in the press mechanism section, and the molded product. And a product loading / unloading mechanism section for transferring the resin-molded product from the press mechanism section.

In FIG. 1, the portion A is the press mechanism portion, B and C.
The portion is a release film transport mechanism portion, and the portion D is a product loading / unloading mechanism portion. The release film 10 passes through the press mechanism A from the release film supply unit B installed on the left side of the press mechanism unit A in FIG. 1 and is collected by the release film collecting unit C on the right side. As shown in FIG. 2, the product loading / unloading mechanism D is arranged in a direction orthogonal to the release film transport direction of the release film transport mechanism. These press mechanism section A, supply section B, recovery section C,
The overall plane arrangement of the product loading / unloading mechanism section D is substantially T-shaped.

Pressing Mechanism Section The pressing mechanism section A is equipped with a pressing machine for mounting a molding die for resin-molding by clamping a molded product. The operation of mounting the upper die 12 and the lower die 14 on the press machine and resin-molding is the same as in the case of the conventional transfer molding apparatus or the like. In this example, the upper mold 12 is fixed to the fixed platen 15 to be the fixed side, and the lower mold 14 is fixed to the movable platen 16 to be the movable side. The movable platen 16 is guided and supported by a tie bar fixed on the base so as to be movable in the mold opening / closing direction, and is connected to and pressed by a press ram of a pressing device.

In this example, a strip-shaped lead frame is used as the molded product 20. As shown in FIG. 2, the molding die sets two pieces 20 to be molded with a pot 22 interposed therebetween. The release film 10 is conveyed as a long body in two rows in the left-right direction in the drawing. Molded product 2 on the mold
In the case of 0, the longitudinal direction is set to the left-right direction in FIG. 2, and the arrangement position of each series of release films 10 is set according to the arrangement position of the molding target 20. The release film is fed from the supply section B toward the collecting section C at a fixed size.

The pot 22 of the molding die is the molded product 20.
It is provided in the form of an elongated groove in a plane arrangement in the middle sandwiched between.
The plunger that pumps the resin from the pot 22 is the pot 22.
The one in which the pressing end surface is formed in an elongated rectangular shape is used in accordance with the planar shape of. Further, the resin set in the pot 22 is also formed into an elongated stick shape in accordance with the shape of the pot 22. Of course, the shape of the pot 22 provided in the molding die is not limited to the shape formed in such an elongated groove shape, but a circular shape for inserting a cylindrical resin tablet like a conventional multi-pot type transfer molding device. It may be one.

Release Film Conveyance Mechanism Section The release film conveyance mechanism section comprises an upper die 12 and a lower die 1 each time the press mechanism A carries out a resin molding operation a designated number of times.
The release film 10 is newly supplied to each of 4 and the used release film 10 is carried out from the mold and collected. When the release film 10 is conveyed, it is possible to carry out the operation of stopping the conveyance of the release film 10 and carrying out resin molding a plurality of times, and then carrying it. However, normally, a new release film is formed after one resin molding is completed. 10 will be supplied.

In FIG. 1, reference numeral 18 is a supply reel in which the release film 10 is wound into a roll, and 19 is a recovery reel for recovering the release film 10 after use. The release film 10 is a long film, and the release film 10 sent from the supply reel 18 is wound by the recovery reel 19. In this example, two supply reels 18 and recovery reels 19 are used for the upper mold 12, and two supply reels 18 and recovery reels 19 are used for the lower mold 14. The supply reel 18 and the recovery reel 19 are arranged below the frame of the apparatus so as not to hinder the work.

As described above, the release film 10 is for covering the mold surfaces of the upper mold 12 and the lower mold 14 to prevent the resin from adhering to the mold surfaces such as cavity recesses during resin molding. . In this example, the release film 10 is air-adsorbed and supported on the mold surface of the mold so as not to be displaced during resin molding. After the resin molding, the molded product 20 is separated from the release film 10, the molded product 20 is taken out from the press mechanism section A, and the release film 10 is wound by the collecting reel.

When the release film 10 is conveyed, the release film 10 is intermittently fed at a fixed length by the length clamped by the mold. Since the length of clamping with the mold differs depending on the product, release film 10
The pull-out length (fixed length) can be set according to the product. The method adopted in this example as a method for feeding the release film 10 at a constant size uses feed heads 26 and 27 that reciprocate in the feed direction, and the feed heads 26 and 27 are used to pinch and release the release film 10. Is the way. The feed head 26 is the release film 1
The feeding side of 0 and the feeding head 27 are installed on the collecting side.

The feed heads 26 and 27 linearly reciprocate within a predetermined range using a linear servo motor. Reference numeral 28 is a stator of a linear servo motor, and the feed heads 26 and 27 are attached to a slider which is reciprocally driven on the stator 28. The moving range of the slider on the stator 28 is the pull-out length of the release film 10. The feed heads 26 and 27 pinch the release film 10 to move the release film 10 in the forward movement (direction from left to right in FIG. 1), and to pinch the release film 10 in the backward movement. The release film 10 is released and the release film 10 is moved freely. Stator 28 is upper mold 1
The second side is fixed to the fixed platen 15 and the lower mold 14
The side is fixed to the movable platen 16 so as to move up and down together with the lower mold 14.

Reference numeral 30 is a support arm extending on both sides of the press mechanism A for supporting a linear servomotor or the like.
The support arm 30 is fixed to the fixed platen 15 on the upper die 12 side, and is fixed to the movable platen 16 on the lower die 14 side. The release film 10 is supplied to the supply reel 18 and the recovery reel 1 via a roller 32 provided at the end of the support arm 30.
It is led to 9. In addition, the roller 32 on the upper die 12 side is replaced by the lower die 1
The upper mold 12 is made to extend slightly outside the roller 32 on the fourth side.
The release film 10 on the side of the lower mold 14 and the release film 10 on the side of the lower mold 14 are prevented from generating static electricity or sticking to each other due to static electricity to hinder the conveyance.

Reference numeral 34 denotes a pinch head installed on the support arm 30 between the stator 28 of the linear servo motor and the roller 32. The pinch head 34 serves to prevent the release film 10 from being pulled back by pinching the release film 10 when the feeding head 26 pulls out the release film 10 and returns to the original position in the supply section B. Further, the pinch head 34 of the collecting section C is the feed head 2
The release film 10 is pinched so as not to be pulled back when the moving mechanism 7 moves in the direction of the press mechanism portion A.

Reference numeral 36 denotes a tension roller installed on the support arm 30 between the stator 28 of the linear servo motor and the press mechanism section A. The tension roller 36 has a guide function for transporting the release film 10 without shifting its position, and a function for preventing the release film 10 from sagging during transport.

Reference numeral 40 is an adjusting head for guiding the release film 10 and setting it at a predetermined position of the molding die. The adjusting heads 40 are arranged on both sides of the mold in the conveying direction of the release film 10, and support the release film 10 so as to stretch across the mold. The adjusting head 40 is driven and controlled so as to project the release film 10 into and out of the mold surfaces of the upper mold 12 and the lower mold 14 in the mold opening / closing direction.

In this example, the release film 10 is sucked and supported on the mold surface by air suction and resin molding is performed. The outline of the resin molding operation in this case will be described. First, the release film 10 is air-adsorbed on the die surface of the molding die, and then air is also adsorbed from the bottom of the cavity recess, so that the release film 10 is embossed following the shape of the inner surface of the cavity recess. Then
The molding target 20 and the molding resin are supplied to the upper mold 12
The molded product 20 is clamped by the lower mold 14 and the resin mold. After resin molding, the product is on the side of the lower mold 14 in the mold opened state, and the release film 10 is air-adsorbed on the upper mold 12. The product is taken out from the lower mold 14, and the release film 10 is separated from the upper mold 12 and the lower mold 14 by pneumatic injection or the like to release the release film 1.
0 is transported and driven.

Feed heads 26 and 2 for feeding the release film 10 peeled from the upper mold 12 and the lower mold 14.
7. The operation of the adjusting head 40 and the like is as follows.
First, before releasing the release film 10 from the mold surface, the feed head 26 of the supply section B is moved by a length of about twice the protruding amount of the adjusting head 40 to allow the release film 10 to be loose. The adjusting head 40 can be ejected with a margin. Next, the release film 10 which is difficult to attach to the die surfaces of the upper die 12 and the lower die 14 is peeled off from the die surface by pneumatic ejection or the like, and the adjusting head 40 is projected to slightly separate the release film 10 from the die surface. Support in the state of being made.

After the adjusting head 40 is projected, the feed heads 26 and 27 are advanced to the constant feed position to convey the release film 10. The movement of the feed head 26 and the feed head 27, and the adjustment on the supply side The operations of the head 40 and the adjusting head 40 on the collecting section side are controlled by slightly shifting the timing. That is,
On the supply unit side, after the feed head 26 has completely advanced to the feed position, the adjustment head 40 on the supply unit side is retracted, and on the collection unit side, the feed head 27 is moved up and down by the stroke length of the adjustment head 40 from the advance completion position. After stopping at the previous coordinates and lowering the recovery-side adjusting head 40, it is moved to the forward movement completion position.

At this time, if the tension sensor of the release film 10 detects the slack of the release film 10, a correction may be added as long as it is within the maximum value of the feed amount set in advance. When the feed head 26 and the feed head 27 start to move, the feed head side starts to move by double the adjusting head stroke length. If the feed head 26 and the feed head 27 move while maintaining this difference, the simplest feed control method will be used.
It is preferable to perform this smoothly and control so that the release film 10 does not contact the die surface as much as possible.

The feed amount of the feed head 26 of the supply section B and the feed head 27 of the recovery section C when the release film 10 is conveyed is basically the same, but the release film 10 is heated and clamped during resin molding. Therefore, the feed amount of the feed heads 26 and 27 needs to be corrected. After the release film 10 is conveyed as described above, the release film is air-adsorbed on the mold surface of the mold to prepare for the next resin molding. Thus, the release film 10 can be resin-molded while being transported.

Product carry-in / carry-out mechanism unit 50 in FIG. 1 is a carrying head for carrying a product carry-in / carry-out mechanism unit for setting a product to be molded in the mold and taking out the product from the mold. The carrying head 50 is a work carry-in head for supplying a molded product to a molding die, a resin supply head for supplying a molding resin to the pot 22, and a product carry-out head for carrying out a product and unnecessary resin after the resin molding. Is equipped with.

Since the carrying head 50 carries in a product to be molded and carries out a product, the carrying head 50 reciprocates between a position retracted outside the press mechanism unit A and a position entered into the press mechanism unit A to perform a required operation. To do. In FIG. 2, reference numeral 51 is a guide rail for guiding and moving the transport head 50. The transport head 50 linearly reciprocates along the guide rails 51 to set the molded product 20 and take out the product.

The work carry-in head, the resin supply head,
The product carry-out heads are arranged in series in the moving direction of the carry head 50, and are controlled to perform a required operation. The arrangement of each of these heads can be carried out in several forms depending on the order of the operation of setting the product to be molded in the mold and the operation order of taking out the product.

For example, when an operation such as setting of a molded product is performed while the transport head 50 is being inserted into the press mechanism unit A from the outside of the press mechanism unit A, the product unloading head is arranged at the forefront of the transport head 50. Next, the work loading head,
Next, there is a method of arranging and operating the resin supply head. In this case, when the transport head 50 enters the press mechanism section A, the product carry-out head first picks up the product, and further advances the work carry-in head to set the molded product 20, and further advances the resin supply head. To set the mold resin. After this, the transport head 50
Is moved to the outside of the press mechanism unit A, the taken out product is stored in a storage tray, a new molded product is held in the work carry-in head, and mold resin is set.

This setting method is a case where resin molding is performed in an arrangement (upper runner molding) in which a resin passage for resin filling is provided in the upper die of the molding die. That is, when a wrapping resin is used as the resin to be supplied to the molding die, the wrapping film of the wrapping resin is arranged so as to partially overlap with the molding target, so that the positional relationship between the wrapping resin and the molding target is the mold. It is related to the placement of runners in the mold. When the mold resin is set on the molded product as described above, the upper runner system is used. When the lower mold is provided with the runner, the mold resin is set and then the molded product is set.

In addition to the above-mentioned setting method, the transfer head 50 is introduced into the press mechanism unit A from the outside of the press mechanism unit A.
, The product is first picked up by the product carry-out head arranged at the forefront of the carrying head 50 and carried out from the press mechanism section A, and the product is delivered to the storage device, and at the same time the work carry-in head and the resin supply head A setting method in which the molded product and the mold resin are each chucked, the transport head 50 is again inserted into the press mechanism section A, the workpiece 20 is set by the work carry-in head, and then the mold resin is supplied by the resin supply head. It is also possible to The above-described arrangement of the transport head 50 and the like has an advantage that such a supply method can be efficiently performed.

As described above, the method of supplying the product to be molded and the molding resin after the product is first carried out is the method of carrying out the resin-molded product to the storage station earliest, and the product is in a state of natural convection. There is an advantage that it is possible to minimize the generation of internal stress due to partial cooling due to partial cooling. After this, the product is 120 ℃
When sandwiched between plates that have been heated to a moderate degree, lightly pressurized, gradually cooled to about 50 ° C. and then stored in a magazine or the like, a stable product with less distortion and less internal stress can be produced.

As another method, after the mold is opened, the transport head 50 is first moved through the press mechanism section A and moved to the forefront, and the transport head 50 is moved in the return direction to pick up and mold the product. There is a method to set items. In this case, the heads of the transport head 50 are arranged from the front side of the transport head 50 to a resin supply head, a work loading head, and a product unloading head. Transport head 5
By moving 0 toward the return direction, the product is first picked up by the product carry-out head, the workpiece is set by the work carry-in head, and the mold resin is supplied to the mold die by the resin supply head. Also in this case, the upper runner method is used.

In the case of this method, since the product is taken out or the product to be molded is supplied while moving the transport head 50 in the retreat direction, the distance that the product picked up by the transport head 50 passes through the inside of the press mechanism section A. Has a merit that it is possible to prevent a thin resin burr from dropping on the mold.

The product carrying-out head, the work carrying-in head, and the resin supply head installed on the carrying head 50 may be arranged in a different order from the above example. For example, in the above example, the molding resin is supplied after the molding target is set in the molding die, but conversely, the molding resin may be supplied before the molding target is set. In such a case, the arrangement of the work carry-in head and the resin supply head may be reversed from the above example.

The order in which the molded product and the molding resin are set in this way is a problem when resin molding is performed using the wrapping resin described above. In this case, the set order differs depending on whether the runner path connecting the pot and the cavity is provided in the lower mold or the upper mold. That is, when a runner path is provided in the upper die, the release film is air-adsorbed to the molding die, then the article to be molded is set in the lower die, and the mold resin is set on it. When the runner path is provided in the lower die, the release film is air-adsorbed to the molding die, the mold resin is set, and the article to be molded is set thereon.

In the above example, the product is taken out or the product to be molded is set only by moving the carrying head 50 forward or backward, but the product to be molded or the product is taken out. Conveyor head 5 when operating
If 0 is allowed to move forward and backward, the transport head 50
Regardless of the arrangement of the heads, it is possible to arbitrarily take out the product and change the set order of the product to be operated.

The example shown in FIG. 2 is an example in which the product is taken out while the transport head 50 is being inserted into the press mechanism section A. A product unloading head 52 is arranged at the frontmost part on the entrance side of the transport head 50, a resin supply head 54 is next arranged, and then a work carry-in head 56 is arranged. At the retracted position, the product is received from the product carry-out head 52 and stored in the storage tray, and the workpiece carry-in head 56 newly receives the molded product 20.
Perform the operation to chuck. Therefore, the transport head 50
The product storage mechanism unit 6 according to the arrangement positions of the product carry-out head 52, the resin supply head 54, and the work carry-in head 56 in FIG.
0, the mold resin supply mechanism 70, and the molded product supply mechanism 80 are arranged.

The product storage mechanism section 60 has a degate section 62 and a product storage section 64. The digating unit 62 is provided for the product unloading head 5 when the carrying head 50 moves to the retracted position.
Receive the product from 2 and remove unnecessary resin from the product. Products with unnecessary resin removed are in product storage 64
Is stored in. The unnecessary resin separated from the product is conveyed by the conveyor 66 and is dropped and stored in the storage box 67.

The mold resin supply mechanism section 70 is provided for accommodating the mold resin in an aligned manner and for accommodating the mold resin in a required number from the mold resin accommodating section 72 and transferring it to the resin supply head 54. It has a molding resin transfer mechanism 74. The mold resin transfer mechanism 74 picks up the mold resin from the mold resin storage portion 72, transfers the mold resin to a position below the resin supply head 54 at the retracted position, and transfers the resin.
Make an operation to pass to.

The molded article supply mechanism section 80 is a molded article storage section 82 in which a molded article to be resin-molded is stored.
And a molded product transfer mechanism 84 for transferring the molded product 20 to the work carry-in head 56 located at the retracted position by withdrawing the molded product from the molded product storage section 82. The workpiece transfer mechanism 84 arranges the molded articles 20 side by side at the same position as the set position of the molded articles 20 on the molding die, and transfers the workpiece 20 to the workpiece carry-in head 56 with the arrangement as it is. It can be transferred from the mold to the mold.

The product loading / unloading mechanism section D described above reciprocates the transport head 50 in synchronism with the resin molding operation in the press mechanism section A to perform product removal and molding operation and mold resin supply operation. Controlled to do. At the same time, the release film transport mechanism also carries out the release film transport operation in synchronization with the resin molding operation in the press mechanism A.

[Second Embodiment] FIG. 3 shows a front view of an automatic molding apparatus using a release film in a second embodiment. This automatic molding apparatus also has a press mechanism section A, a release film transport mechanism section B, as in the first embodiment.
C, has a product loading / unloading mechanism section. The planar arrangement of these parts is the same as in the first embodiment, and the operations in the press mechanism part, the release film conveying mechanism part, and the product loading / unloading mechanism part are also the same as in the first embodiment.

The supply reel 18 is used in the second embodiment.
Are separately installed on the upper mold side and the lower mold side, and the supply reels 18 are installed on the fixed platen 15 and the movable platen 16, respectively. The configuration of supplying the release film 10 from the supply reel 18 to the press mechanism section side via the roller 32 is the same as that of the first embodiment. Also, release film 1
The transport of 0 is also performed using the feed heads 26 and 27.

On the collecting side of the release film 10, like the supply reel 18, the collecting reels 19 may be separately installed in the upper mold and the lower mold and wound by the reels. In this example, the release film 10 is conveyed. The front side was laid down as it was and introduced into the storage box 90 installed at the bottom of the device. The release film 10 is adapted to be lowered from different positions so that the release film 10 delivered from the upper die and the release film 10 delivered from the lower die do not intersect.

[Third Embodiment] FIGS. 4 and 5 are a front view and a plan view showing the overall configuration of a third embodiment of an automatic molding apparatus using a release film. The automatic molding apparatus in this embodiment is characterized in that the transport head is moved in parallel with the transport direction of the release film 10 to supply the molded product and take out the product. In this example, a release film supply section B and a release film recovery section C are arranged on both sides of the press mechanism section A, a product supply section E is provided outside the supply section B, and a product take-out section F is provided outside the recovery section C. It is arranged.

The product supply section E is provided with a work carry-in head 100 for transferring a molded product onto a mold and a resin supply head 102 for supplying mold resin to the pot of the mold. The product unloading section F is provided with a product unloading head 104 for unloading the product from the molding die and a resin unloading head 106 for unloading the unnecessary resin after resin molding from the molding die.

The work carry-in head 100, the resin supply head 102, the product carry-out head 104, and the resin carry-out head 106 are set at a moving height position so that they can enter the press mechanism section A when the mold is opened, and are guided by a guide mechanism. Supported to move horizontally. In this example, the ball screw is used to move the respective transport heads, but the drive mechanism for moving these transport heads is not particularly limited.

Product carry-in / carry-out mechanism section The work carry-in head 100 chucks a molded product 20 such as a lead frame and transfers it onto the lower mold 14. Therefore, as shown in FIG. 4, a storage part 82 for storing the molded product 20 such as a lead frame is arranged below the retracted position of the work loading head 100, and the molded product 20 is loaded from the storage part 82 to the work loading head 100. Try to hand over. The molding die is a two-piece die, and the work carrying-in head 100 chucks and transfers the two to-be-formed products 20 two by two.

In FIG. 5, reference numeral 108 denotes a storage portion 82 for the molded product 20.
Is a pusher that projects the two to-be-molded products 20 on the table 110. The work carrying-in head 100 is located above the table 110 at the retracted position, and chucks the two molded products 20 protruding onto the table 110 and conveys them to the setting position of the molding die. The molded product 20 is juxtaposed on the table 110 in line with the setting position of the molding die, and can be set on the lower mold 14 as it is by simply moving the work loading head 100 in parallel.

Reference numeral 72 denotes a storage portion which stores a molding resin. The resin supply head 102 is located above the mold resin accommodating portion 72 in the retracted position.
In the case of this example, the resin formed in a stick shape is stored in the storage portion 72 of the mold resin so as to be stacked vertically, and the resin supply heads 102 are chucked one by one by pushing up from below. The resin supply head 102 laterally moves to above the pot of the molding die, and mold resin is put into the pot and set.

After the mold is opened, the product carrying-out head 104 enters the mold and picks up the resin-molded product from the lower mold 14. After picking up, the product carry-out head 104 moves to the retreat position and stores the product in the product storage section 64 arranged below the retreat position, but stops temporarily at the degate section 62 in the preceding stage to remove unnecessary resin from the product. And stores it in the product storage unit 64. Degate 6
The unnecessary resin removed in 2 falls into the lower box 111. In the product storage unit 64, products are stored in such a manner that they are sequentially stacked.

The resin carry-out head 106 is used when carrying out the unnecessary resin from the molding die. This is because when removing the product from the mold resin, it may be necessary to remove the unnecessary resin from the pot portion or the like by a different operation from the removal of the product. In that case, the resin carrying-out head 106 picks up the unnecessary resin, The product unloading head 104 picks up the product. In this case, the degating operation is not necessary, and the resin carry-out head 106 is returned to the degating unit 62 to drop the unwanted resin into the box 111.

Release Film Conveyance Mechanism The release film conveyance mechanism is the same as in the first and second embodiments.
Similar to the embodiment, the upper die 12 and the lower die 14 of the molding die are
The release film 10 is arranged so as to pass through the press mechanism section A for each of the above, and is supplied by the constant size feeding. FIG. 6 shows an enlarged release film transport mechanism in this example. Reference numeral 18 denotes a supply reel around which the long release film 10 is wound, and is separately installed in the upper mold 12 and the lower mold 14.

In the first and second embodiments, in order to feed the release film 10 at a fixed size, the feed heads 26 and 2 which move forward and backward in parallel with the conveying direction of the release film 10.
7 was used, but in this example, the pinch roller 1 provided on the supply side is used.
It feeds at a fixed size by 12. Although the method of using the pinch roller 112 is structurally simple, the release film 10 slides between the rollers during the feeding operation, and thus the feeding heads 26 and 27 are used, and thus the feeding accuracy is constant. May be low. A motor 114 drives the pinch roller 112.

On the collection side of the release film 10, the release film 10 is nipped by the nip rollers 116 and 117 and conveyed to the discharge side. The pressure rollers 116 and 117 are rotationally driven by the motor 114 via a timing belt. The release film 10 that has passed through the pressure rollers 116 and 117 can be wound on a recovery reel, but in this example, it is dropped and dropped into the box 111 below. By doing so, the release film 10 hung down to the discharge side interferes with the transport head that enters the press mechanism section A, so that the cutter 118 cuts after it has been discharged to a certain length. Regarding the lower mold 14, the hanging of the release film 10 does not pose a problem, but the lower mold 14 is similarly cut to facilitate storage.

When the release film 10 is used,
For example, the release film 10 may be printed for transfer and the printed portion may be transferred to the product when resin-molded. In such a case, when the release film 10 is conveyed, it is necessary to carry out the feed control with considerably high accuracy. If the fixed-size feed accuracy of the release film 10 is a problem, as described above, the release film 10 is heated by the heat and the clamping pressure during resin molding.
It is necessary to correct the deformation of the sheet and convey it.

In this example, in order to perform such correction and perform accurate feed control, a sensor 120 for detecting the feed position of the release film 10 is installed on each of the supply side and the collection side, and the sensor 120 is used by the sensor 120. The feed position of the release film 10 is detected and the feed amount of the release film 10 is corrected. The sensor 120 on the supply side means the correction of the deviation of the feed amount due to the constant size feed using the pinch roller 112, and the sensor 120 on the recovery side means the correction of the deviation of the deformation such that the release film 10 is stretched by the resin mold. There is.

Note that the release film 10 may shift in the width direction while the release film 10 is being conveyed. The sensor 120 also detects such a shift in the width direction. When the release film 10 is displaced in the width direction, the drive mechanism such as a motor is used to control the entire movement mechanism of the release film 10 in the width direction to correct the displacement. As the sensor 120, for example, a CCD camera is used.

Release film 1 for resin molding
0 is supported by adsorbing air on the mold surfaces of the upper mold 12 and the lower mold 14. In the above-described first and second embodiments, the adjusting head 40 and the like are used to perform the operation of bringing the release film 10 into and out of contact with the mold surface. In this example, the entire feeding mechanism such as the supply roller 18 and the pinching rollers 116 and 117 that support the release film 10 on both sides of the press mechanism section A are moved in the up-down direction, whereby the release film 10 is moved to the mold surface. Make them close or separate.

In FIG. 6, reference numeral 124 is a support frame for supporting the supply roller 18. The support frame 124 is guided by a slide guide 126 and can be moved in the vertical direction by a motor 122. Further, 130 is the pressure side on the collecting side.
Reference numeral 128 is a support frame that supports 17 and the like, and 128 is a support frame 130.
Is a motor for moving up and down. The support frame 130 is also guided and supported by the slide guide 132 so as to move in the vertical direction.

In this way, the release film 10 is moved parallel to the mold surface of the upper mold 12 or the lower mold 14 by vertically moving the support frames 124 and 130 on the supply side and the recovery side of each of the upper mold 12 and the lower mold 14. Can be moved closer to or farther away from. Release film 10 on the mold
When the release film 10 is delivered, the release film 10 is conveyed away from the mold surface, and when the release film 10 is delivered by a predetermined length, the delivery is stopped and the motors 114 and 128 are operated until the release film 10 comes into contact with the die surface. The release film 10 is adsorbed and supported on the mold by bringing them close to each other and sucking air from the mold surface.

After the resin molding, the mold is opened, the product on the lower mold 14 is picked up by the product unloading head 104, and the unnecessary resin is unloaded by the resin unloading head 106 as needed, and then the motors 122 and 128 are driven. The release film 10 is projected in a direction away from the mold surface and released. Then, with the release film 10 separated from the mold surface, the pinch roller 112 and the pinching roller 11
6, 117 and the like are driven to convey the release film 10 by a predetermined amount.

The conveyance of the release film 10 and the operations of the work carry-in head 100, the resin supply head 102, the product carry-out head 104, and the resin carry-out head 106 are controlled completely in the same manner as in the above-mentioned example. That is, after the mold is opened, the product is taken out and a new release film 1
After 0 is supplied, the molding target 20 and the molding resin are set. The order of setting the molding resin and the molding target 20 can be appropriately set. The automatic molding apparatus of this example has an advantage that the entire apparatus can be made compact because the loading / unloading mechanism for the product and the press mechanism section for resin molding are arranged in series.

[Fourth Embodiment] FIG. 7 is a front view showing a fourth embodiment of an automatic molding apparatus using a release film. In the fourth embodiment, as in the third embodiment, the conveying head is moved in parallel with the conveying direction of the release film to supply the molded product and take out the product. The fourth embodiment is an example in which the release film 10 is conveyed by using the feed heads 26 and 27 that advance and retreat in parallel with the feed direction of the release film 10 as in the first and second embodiments. Is.

Release film 1 sandwiching the press mechanism section
A configuration in which a supply reel 18 for supplying 0 and a recovery reel 19 for recovering the release film 10 are arranged, a configuration in which the feed heads 26 and 27 are moved forward and backward to feed the release film 10 at a fixed size, and a release head 10 is adjusted by an adjust head 40. The structure for bringing the mold into and out of contact with the mold surface is the same as in the first and second embodiments.

Further, a work carry-in head 100 as a molded product supply mechanism, a resin supply head 102 as a mold resin supply mechanism, and a product take-out head 104 as a product take-out mechanism are provided outside the transport mechanism for the release film 10. The basic configuration to be installed is the same as in the third embodiment. In this example, only the product take-out head 104 is provided on the product take-out side, and the resin take-out head is not provided.
When it is necessary to take out unnecessary resin by a different operation from taking out the product, a resin take-out head may be separately provided.

The automatic molding apparatus using the release film of this example is configured to drive the feed heads 26 and 27 to convey the release film 10. However, when the automatic molding apparatus is configured, the release film 10 Various configurations can be selected as the transportation method and the like. For example, even when the transport head is moved in the direction orthogonal to the transport direction of the release film to take out the product as in the first and second embodiments, the pinch roller as in the third embodiment is used. 112, pinching roller 116,
A release film transport method using 117 can be adopted.

2 and 5, reference numeral 140 denotes an antistatic portion installed to facilitate the transport of the release film 10. If the release film 10 pulled out from the supply reel 18 is charged, smooth carrying operation may not be possible. In such a case, if the static electricity is removed by an antistatic means such as ion blow before the transportation, the smooth transportation is effective. Further, when the film is charged, minute dust may be adsorbed and transferred to the mold package. The antistatic means also has the effect of eliminating such problems.

[0077]

As described above, according to the automatic molding apparatus using the release film of the present invention, the release film is automatically supplied by the release film conveying mechanism to the press mechanism section for resin-molding the molded product. It can be resin-molded, which makes it possible to automatically perform a resin-molding operation using a release film. In addition, the fixed-length feed mechanism of the release film brings about a remarkable effect such that the release film can be conveyed with high accuracy.

[Brief description of drawings]

FIG. 1 is a front view of a first embodiment of an automatic molding device using a release film.

FIG. 2 is a plan view of a first embodiment of an automatic molding device using a release film.

FIG. 3 is a front view of a second embodiment of an automatic molding device using a release film.

FIG. 4 is a front view of a third embodiment of an automatic molding device using a release film.

FIG. 5 is a plan view of a third embodiment of an automatic molding device using a release film.

FIG. 6 is a front view of a release film transport mechanism according to a third embodiment.

FIG. 7 is a plan view of a fourth embodiment of an automatic molding device using a release film.

FIG. 8 is an explanatory diagram of a resin molding method using a release film.

[Explanation of symbols]

 10 Release Film 12 Upper Die 14 Lower Die 15 Fixed Platen 16 Movable Platen 18 Supply Reel 19 Recovery Reel 20 Molded Item 22 Pot 26, 27 Feed Head 30 Support Arm 34 Pinch Head 36 Tension Roller 40 Adjust Head 50 Transport Head 51 Guide Rail 52 Product carry-out head 54 Resin supply head 56 Work carry-in head 60 Product storage mechanism section 62 Degate section 64 Product storage section 66 Conveyor 67 Storage box 70 Mold resin supply mechanism section 72 Mold resin storage section 80 Molded product supply mechanism section 82 Target Molded product storage section 84 Molded product transfer mechanism 90 Storage box 100 Workpiece loading head 102 Resin supply head 104 Product unloading head 106 Resin unloading head 108 Pusher 110 Table 112 Pinchiro Roller 114 motor 116, 117 pinching roller 118 cutter 120 sensor 122, 128 motor 124, 130 support frame 140 antistatic portion

Claims (12)

[Claims] 1. An automatic molding apparatus using a release film, wherein a mold surface of a resin molding portion or the like of a molding die is covered with a release film and resin-molded, wherein the molding die is mounted and is placed on the molding die. A press mechanism section for resin-molding the supplied molding target, and a long-sized member which is controlled in conjunction with the resin molding operation in the pressing mechanism section and is aligned with the set position of the molding target on the molding die. The release film transport mechanism part which intermittently feeds the release film of the above, and is controlled in conjunction with the resin molding operation in the press mechanism part, and the molded product and the mold resin are controlled in the molding die. A release filter having a loading / unloading mechanism for supplying and discharging the resin-molded product and unnecessary resin from the molding die. Automatic molding machine using rum. 2. The arrangement is such that the release film conveyance direction in the release film conveyance mechanism section and the movement direction of the conveyance head in the product loading / unloading mechanism section are substantially orthogonal to each other. An automatic molding device using the described release film. 3. The release film transporting direction in the release film transporting mechanism section and the moving direction of the transporting head in the product loading / unloading mechanism section are arranged substantially parallel to each other. Automatic molding machine using the release film of. 4. A product carrying-in / carrying-out mechanism section, a work carrying-in head for supplying a molded product onto a molding die, a resin supply head for supplying a molding resin to a pot of the molding die, and a molding die. An automatic molding apparatus using a release film according to claim 1, 2 or 3, further comprising: a product carry-out head for taking out a product after resin molding from the product. 5. The automatic molding apparatus using a release film according to claim 4, wherein the product loading / unloading mechanism section has a resin unloading head for unloading unnecessary resin from the molding die. 6. The automatic molding apparatus using a release film according to claim 4, wherein the product carrying-in / carrying-out mechanism section has a digating section for removing unnecessary resin from the product taken out from the molding die. 7. The release film transport mechanism section has a supply reel around which a long release film is wound and a recovery reel around which the release film after resin molding is wound up. An automatic molding apparatus using the release film described in 2 or 3. 8. The release film transport mechanism section has a storage section for storing the release-side release film by directly introducing it into a storage box or the like without winding it on a reel. An automatic molding device using the release film described in 3. 9. The release film transporting mechanism part has a feed drive part for moving the feed head forward and backward in parallel to the feed direction of the release film, and pinching and transporting the release film by the feed head. Item 1,
An automatic molding apparatus using the release film described in 2, 3, 7 or 8. 10. The release film transport mechanism section has a feed drive section for feeding a fixed size by a pinch roller on the supply side.
An automatic molding apparatus using the release film described in 3, 7, or 8. 11. The automatic mold using the release film according to claim 10, wherein the release film transporting mechanism has a mechanism for transporting the release film while pinching the release film by a pinching roller on the collecting side. apparatus. 12. The release film transport mechanism section has a sensor for detecting a transport position of the release film during transport.
An automatic molding apparatus using the release film described in 9, 10, or 11.