JP3092568B2 - Mold for manufacturing resin-encapsulated semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die apparatus for manufacturing a resin-encapsulated semiconductor device using a substrate having no strength such as a carrier tape.

[0002]

2. Description of the Related Art The resin sealing of a product using a carrier tape, for example, a CSP (chip size package) will be described with reference to FIG. As shown in FIG. 4A, a carrier tape i having a chip j mounted on a lower mold a
Is set. A spacer (middle mold) c for forming a package outer shape by resin sealing and an upper mold b are set thereon. After the setting is completed, the thermosetting resin p is injected into the cavity by the transfer method, and the resin is cured according to the effect characteristics of the resin.

After the completion, the upper mold b is removed, and the resin runner 1 is gate-breaked from the gate port f.

Next, when the spacer c is removed, the resin formed is in a state of being in close contact with the spacer c.

[0005] The product is removed with a punching jig or the like, and one cycle of resin sealing is completed. In FIG. 4A, k indicates a plunger and m indicates a resin cull.

[0006]

In this conventional resin encapsulation, it is necessary to manually perform all steps from supply (set) of a product to punching of the product. is there.

[0007] As a problem, resin injection is performed by L / F
(Lead frame) Since the resin runner on the L / F and the gate port on its extension must be made from above the package, such as the base material, three molds such as the lower mold a, the spacer c, and the upper mold b A method is needed.

[0008] The largest factor is that when a resin runner l is constructed on a carrier tape i, as in the case of the L / F base material, as shown in FIG. The gate breakage is impossible due to the adhesive force of the resin and the resin wrapping around the back surface of the carrier tape i, and even if the gate break occurs, the carrier tape i is damaged.

Further, when the gate break is not performed, there is a problem that the product cannot be held due to the weight of the resin runner 1 and causes a defect.

Accordingly, the present invention has been made in view of the above problems, and has as its object to construct a resin runner on a carrier tape in a resin-sealed semiconductor manufacturing apparatus using a carrier tape base material. It is an object of the present invention to provide a mold apparatus that performs resin sealing without performing the above steps, improves transportability, and realizes automatic resin sealing.

[0011]

In order to achieve the above object, a mold apparatus for manufacturing a resin-encapsulated semiconductor device according to the present invention is characterized in that a resin runner groove is separated from a main mold, and a pot as a resin charging section is provided. It is a drivable groove integrated with the mouth.

According to the present invention, there is no need to contact the resin runner on the carrier tape, and the gate break can be performed in the equipment, so that the resin sealing can be automated.

In the present invention, preferably, a pot-side edge of a carrier tape on which a chip set on a sealing mold is mounted is clamped by a tape clamp, clamped by upper and lower molds, and put into the pot. The injected resin is injected into a resin runner groove provided in the tape clamp connected to the pot, and filled into the cavity through a gate port.The resin runner is resin-sealed to the carrier tape in a non-contact manner. Further, at the time of knockout after completion of molding, the resin runner is gate-breaked at the gate opening by simultaneously operating the tape clamp.

Further, in the present invention, a configuration may be adopted in which the resin charged in the pot is injected into a resin runner groove provided in the upper mold and filled into the cavity through the gate port.

[0015]

Embodiments of the present invention will be described below. In the molding die apparatus of the present invention, the side of the carrier tape on which the chip set on the sealing die is mounted on the pot side is clamped with a tape clamp, the mold is clamped with the upper and lower dies, and put into the pot. The injected resin is injected into a resin runner groove provided in the tape clamp connected to the pot, and is filled into the cavity through a gate port, and the resin runner is resin-sealed to the carrier tape in a non-contact manner. It is said.

Then, at the time of knockout (ejection) after the completion of molding, the tape clamp is simultaneously operated to break the gate of the resin runner at the gate opening.

In the embodiment of the present invention, the resin charged in the pot may be injected into a resin runner groove provided in the upper mold and filled into the cavity through the gate port.

In the embodiment of the present invention, the resin runner is gate-breaked at the gate opening, the knockout (ejector) is operated, and the resin runner is released from the mold. It is possible to perform the removal of the resin runner and the storage of the product by using the same.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to explain the above-mentioned embodiment in more detail, an embodiment of the present invention will be described with reference to the drawings.

Embodiment 1 FIG. 1 is a sectional view of a semiconductor device manufacturing mold according to a first embodiment of the present invention, and FIG. 2 is a top view.

Referring to FIG. 1, first, a carrier tape i on which a chip j is mounted is set in a lower mold a, and a side of the carrier tape i is fixed by a tape clamp g connected to a pot e. Next, the entire carrier tape i is clamped by the upper and lower molds b and a by lowering the upper mold b or raising the lower mold a.

The resin p charged into the pot e is started to be injected by the plunger k, the resin p is injected into the resin runner groove q provided in the tape clamp g, and the cavity d is injected through the gate port f. Filled into.

After curing of the filled resin is completed, the upper mold b or the lower mold a is opened, and knockout is started. At this time, since the tape clamp g operates at the same time, the resin runner l is gate-breaked at the gate port f.

Next, the knockout h rises, the resin runner l is released from the resin runner groove q, and the resin runner l is removed and the product is stored by suction conveyance or the like.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a sectional view of a semiconductor device manufacturing mold according to a second embodiment of the present invention.

First, the carrier tape i on which the chip j is mounted is set in the lower mold a, and the side of the carrier tape i is fixed by the tape clamp g connected to the pot e. Next, the upper die b is lowered or the lower die a is raised, so that the entire carrier tape i is clamped by the upper and lower dies.

The resin p, which has been charged into the pot e, is started to be injected by the plunger k, and the resin p is injected into the resin runner groove 1 provided in the upper mold b, and is injected into the cavity d through the gate port f. Is filled.

After curing of the injected resin is completed, the upper mold b or the lower mold a is opened, and knockout is started. At this time, since the tape clamp g operates simultaneously, the resin runner l is gate-breaked at the gate port f.

Next, the knockout h rises, the resin runner 1 is released from the mold, and the resin runner is removed and the product is stored by suction conveyance or the like.

[0030]

As described above, according to the present invention,
By providing the carrier tape clamp unit integrated with the pot unit, the resin runner can be constructed in non-contact with the carrier tape, and knockout of the resin runner and automation of conveyance can be achieved.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of a first exemplary embodiment of the present invention.

FIG. 2 is a top view showing the configuration of the first exemplary embodiment of the present invention.

FIG. 3 is a side view showing a configuration of a second exemplary embodiment of the present invention.

FIG. 4 is a diagram showing a configuration of a conventional technique.

[Explanation of symbols]

 a Lower mold b Upper mold c Spacer (medium) d Cavity e Pot f Gate opening g Tape clamp h Knockout i Carrier tape j Chip k Plunger l Resin runner m Resin cal n Resin dam o Resin leak p Resin

Claims (7)

(57) [Claims] 1. A resin-encapsulated mold apparatus for manufacturing a resin-encapsulated semiconductor device, wherein a pot-side edge of a carrier tape on which a chip set on the encapsulation mold is mounted is clamped by a tape clamp. The upper and lower molds are clamped, and the resin charged into the pot is injected into a resin runner groove provided in the tape clamp connected to the pot and filled into the cavity through a gate port, The resin runner is resin-sealed to the carrier tape in a non-contact manner, and, at the time of knockout after completion of molding, the tape clamp is simultaneously operated to break the resin runner at the gate port. A resin molding die apparatus for a semiconductor device, comprising: 2. A molding die apparatus according to claim 1, wherein after a gate break of said resin runner at said gate opening, a knockout (ejector) operates to release said resin runner from said die. The removal of the resin runner and the storage of the product by suction conveyance and the like make it possible to perform the resin sealing molding die apparatus for a semiconductor device. 3. A resin-sealing mold apparatus for manufacturing a resin-sealed semiconductor device, wherein a side of a carrier tape on which a chip set on a sealing mold is mounted is clamped by a tape clamp to form upper and lower molds. The mold is clamped with a mold, and the resin charged in the pot is injected into a resin runner groove provided in the upper mold and filled into the cavity through a gate port, and the resin runner is not contacted with the carrier tape. Resin sealing and, at the time of knockout after completion of molding, simultaneously operating the tape clamp to gate-break the resin runner at a gate port, thereby forming a resin-encapsulated semiconductor device. Mold equipment. 4. A semi-finished product using a low-strength base material such as a carrier tape before resin sealing can be automatically conveyed, carrier tape clamped, and carrier tape clamped.
And a resin runner is provided between the upper mold and the resin runner.
A resin molding die apparatus for a semiconductor device, characterized in that the resin molding is performed through the resin molding. 5. The resin encapsulation mold apparatus according to claim 4, further comprising a drivable resin runner groove which shares automatic carrier and carrier tape clamps, wherein said resin runner is connected to said carrier tape clamp and said upper part. Between molds
After the resin has flowed to the resin runner and gate port
A resin molding die for a semiconductor manufacturing apparatus, wherein the cavity is filled with a resin through the gate port and sealed. 6. A semi-finished product using a weak base material such as a carrier tape before resin sealing can be automatically transported by a carrier tape clamp.
Resin-encapsulated semiconductor device manufacturing mold for characterized in that the resin sealing through the runner resin runner is provided between the upper mold. 7. A resin runner groove for automatic conveyance and sharing a carrier tape clamp, wherein the resin runner is disposed between the carrier tape clamp and the upper mold.
The resin runner and the resin-encapsulated semiconductor manufacturing mold according to claim 6, characterized in that to enable the seal to fill the resin into the gate opening and through the cavity after the gate opening until the resin is fluidized provided .