JP3575592B2 - Mold for resin molding of lead frame assembly and resin molding method - Google Patents
Mold for resin molding of lead frame assembly and resin molding method Download PDFInfo
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- JP3575592B2 JP3575592B2 JP33665499A JP33665499A JP3575592B2 JP 3575592 B2 JP3575592 B2 JP 3575592B2 JP 33665499 A JP33665499 A JP 33665499A JP 33665499 A JP33665499 A JP 33665499A JP 3575592 B2 JP3575592 B2 JP 3575592B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、樹脂モールド技術、特に樹脂封止型半導体装置に形成される樹脂バリを容易且つ確実に除去できるリードフレーム組立体の樹脂モールド用成形型及び樹脂モールド成形法に属する。
【０００２】
【従来の技術】
樹脂封止型半導体装置は、支持板及び半導体素子（半導体チップ）を備え、支持板及び半導体素子は、周知のトランスファモールド法により形成される樹脂封止体により封止される。樹脂封止型半導体装置を形成するトランスファモールド金型（２２）を図１０に示す。トランスファモールド金型（２２）は、キャビティ（成形空所）（５）を形成する下型（２３）及び上型（２４）と、複数配置されたキャビティ（５）に沿って上型（２４）の主面に形成され且つ流動化した樹脂を搬送するランナ（１３）と、ランナ（１３）及びキャビティ（５）を接続して樹脂をキャビティ（５）内に注入するゲート（１４）と、上型（２４）を可動させる駆動装置（２０）とを備える。
【０００３】
トランスファモールド法で樹脂封止型半導体装置を形成する際、最初に、図３に示すリードフレーム組立体（半導体装置組立体）（１）を形成する。リードフレーム組立体（１）は、半導体素子（７）が固着された複数の支持板（６）と、支持板（６）の各一方の側に配置された複数の外部リード（１０）と、支持板（６）の各他方の側に接続された位置決めリード（９）と、前記支持板（６）に対し並列配置された複数の位置決めリード（９）を接続する連結条（１６）と、半導体素子（７）の電極と外部リード（１０）とを接続するリード細線（８）とを備える。リードフレーム組立体（１）は図９に示すように、トランスファモールド金型（２２）の下型（２３）に配置される。このとき、支持板（６）の底面（６ａ）に薄く樹脂を形成するため、下型（２３）に形成されたリード溝部（１５）及び溝部（１８）に位置決めリード（９）及び連結条（１６）を配置する。駆動装置（２０）で上型（２４）を可動させてトランスファモールド金型（２２）を閉じると、下型（２３）と上型（２４）との間には、形成すべき樹脂封止体（５ａ）の外形に合致するキャビティ（５）が形成され、支持板（６）はキャビティ（５）内で位置決めされる。次に、キャビティ（５）内にランナ（１３）及びゲート（１４）を介して樹脂を注入する。熱硬化性樹脂を使用し、キャビティ（５）内に注入された流動化した樹脂は、所定時間、所定温度の熱処理が施されて硬化し、図１０に示すように、支持板（６）、半導体素子（７）、リード細線（８）及び外部リード（１０）の内端を被覆する樹脂封止体（５ａ）をキャビティ（５）内で形成する。その後、上型（２４）を下型（２３）から離型して、樹脂封止体（５ａ）が形成されたリードフレーム組立体（１）をトランスファモールド金型（２２）から取り外し、リードフレーム組立体（１）は半田ディップ等の後工程に搬送される。
【０００４】
【発明が解決しようとする課題】
前記のように、支持板（６）に接続された位置決めリード（９）を相互に連結する連結条（１６）が下型（２３）の溝部（１８）に配置されると、支持板（６）はキャビティ（５）内で位置決めされ、支持板（６）の底面（６ａ）に所定の厚さで樹脂封止体（５ａ）が形成される。ところが、流動化した樹脂をキャビティ（５）内に注入するとき、キャビティ（５）から位置決めリード（９）のリード溝部（１５）を介して連結条（１６）の溝部（１８）へ樹脂が漏出し、樹脂が硬化した後、図１１に示すように連結条（１６）に沿って長い樹脂バリ（１８ａ）が形成される。樹脂バリ（１８ａ）は、除去に手間がかかるばかりでなく、樹脂成形工程後の搬送工程、半田ディップ工程等の後工程で落下して、作業工程及び製造設備に悪影響を与える。
【０００５】
そこで、本発明は、樹脂封止型半導体装置の樹脂バリの落下を防止すると共に、樹脂バリを容易且つ確実に除去できるリードフレーム組立体の樹脂モールド用成形型及び樹脂モールド成形法を提供することを目的とする。
【０００６】
本発明によるリードフレーム組立体の樹脂モールド用成形型は、半導体素子(7)が固着された複数の支持板(6)と、支持板(6)の各一方の側に配置された複数の外部リード(10)と、支持板(6)の各他方の側に接続された位置決めリード(9)と、支持板(6)に対し並列配置された複数の位置決めリード(9)を接続する連結条(16)と、半導体素子(7)の電極と外部リード(10)とを接続するリード細線(8)とを備えたリードフレーム組立体(1)の支持板(6)、半導体素子(7)、リード細線(8)及び外部リード(10)の内端を被覆する樹脂封止体(5a)をリードフレーム組立体(1)に形成する。この樹脂モールド用成形型は、樹脂封止体(5a)と相補的形状を有する複数のキャビティ(5)と、複数のキャビティ(5)から離間して且つ複数のキャビティ(5)に並行に形成されて流動化した樹脂の流れを案内するランナ(13)と、ランナ(13)とキャビティ(5)の各々とを連結するゲート(14)とが成形型(2)の第１の型(3)及び第２の型(4)に設けられる。連結条(16)よりも幅の広い溝部(18)が第１の型(3)にランナ(13)に並行に形成される。溝部(18)内に配置した連結条(16)に沿い且つランナ(13)に連絡する間隙部(19)が溝部(18)内に形成される。成形型(2)の型締め後、ランナ(13)及びゲート(14)を介してキャビティ(5)内に流動化した樹脂を注入して、リードフレーム組立体(1)の支持板(6)、半導体素子(7)、リード細線(8)及び外部リード(10)の内端を被覆する樹脂封止体(5a)を形成するとき、連結条(16)に付着した溝樹脂(19a)が間隙部(19)内に形成され、溝樹脂(19a)は、ランナ(13)内のランナ樹脂(13a)と一体に硬化するため、連結条(16)を含むリードフレーム組立体(1)と一体に溝樹脂(19a)を成形型(2)から取り出すことができる。溝樹脂(19a)は連結条(16)に強固に固着され、強制的に除去しない限り連結条(16)から落下しない。
【０００７】
本発明のリードフレーム組立体の樹脂モールド成形法は、半導体素子(7)が固着された複数の支持板(6)と、支持板(6)の各一方の側に配置された複数の外部リード(10)と、支持板(6)の各他方の側に接続された位置決めリード(9)と、支持板(6)に対し並列配置された複数の位置決めリード(9)を接続する連結条(16)と、半導体素子(7)の電極と外部リード(10)とを接続するリード細線(8)とを備えたリードフレーム組立体(1)を準備する工程と、複数のキャビティ(5)と、複数のキャビティ(5)から離間して複数のキャビティ(5)に並行に形成されて流動化した樹脂の流れを案内するランナ(13)と、ランナ(13)とキャビティ(5)の各々とを連結するゲート(14)とを形成する第１の型(3)及び第２の型(4)から成る成形型(2)を準備する工程と、キャビティ(5)内に支持板(6)を配置すると共に、第１の型(3)に形成され且つ連結条(16)よりも幅の広い溝部(18)内に連結条(16)を配置して、連結条(16)に沿い且つランナ(13)に連絡する間隙部(19)を溝部(18)内に形成する工程と、成形型(2)を型締めしてランナ(13)及びゲート(14)を通じてキャビティ(5)内に流動化した樹脂を注入する工程と、リードフレーム組立体(1)の支持板(6)、半導体素子(7)、リード細線(8)及び外部リード(10)の内端を被覆する樹脂封止体(5a)をリードフレーム組立体(1)に形成すると共に、溝部(18)の間隙部(19)内で連結条(16)に付着した溝樹脂(19a)をランナ(13)内のランナ樹脂(13a)と一体に硬化させる工程と、ランナ樹脂(13a)及び溝樹脂(19a)と共に、リードフレーム組立体(1)を成形型(2)から取り出す工程と、ランナ樹脂(13a)、溝樹脂(19a)、連結条(16)及び位置決めリード(9)をリードフレーム組立体(1)から除去する工程とを含む。
【０００８】
【発明の実施の形態】
以下、本発明によるリードフレーム組立体の樹脂モールド用成形型及び樹脂モールド成形法の実施の形態を図１〜図８により説明する。
【０００９】
図１に示す本発明による成形型であるトランスファモールド金型(2)は、複数のキャビティ（成形空所）(5)と、流動化した樹脂の流れを案内するランナ(13)と、ランナ(13)及びキャビティ(5)の各々とを連結するゲート(14)とが形成された下型(3)及び上型(4)を備える。ランナ(13)は、複数のキャビテイ(5)に沿って並行に形成され、図２に示すように上型(4)の主面に形成される。ランナ(13)の端部には、図示しないポット（成形用樹脂投入孔）が接続される。ゲート(14)は流動化した樹脂をランナ(13)からキャビティ(5)内に注入し、注入された樹脂により、キャビティ(5)と相補的形状を有する樹脂封止体(5a)がリードフレーム組立体(1)に形成される。
【００１０】
図３に示すように、リードフレーム組立体（１）は、半導体素子（７）が固着された複数の支持板（６）と、支持板（６）の各一方の側に配置された複数の外部リード（１０）と、支持板（６）の各他方の側に接続された位置決めリード（９）と、前記支持板（６）に対し並列配置された複数の位置決めリード（９）を接続する連結条（１６）と、半導体素子（７）の電極と外部リード（１０）とを接続するリード細線（８）とを備える。リードフレーム組立体（１）の支持板（６）、半導体素子（７）、リード細線（８）及び外部リード（１０）の内端は、被覆されて樹脂封止体（５ａ）が形成される。
【００１１】
下型(3)には、位置決めリード(9)を配置するリード溝部(15)と、連結条(16)を配置する溝部(18)とが形成される。連結条(16)よりも幅の広い溝部(18)は、下型(3)にランナ(13)に並行に形成される。本発明では、図４及び図５に示すように、連結条(16)を溝部(18)内に配置したとき、連結条(16)に沿って間隙部(19)が形成され、図１に示すように、間隙部(19)はランナ(13)に連絡される。これにより、連結条(16)に沿って付着される樹脂バリ(18a)を意識的に大きくした溝樹脂(19a)が間隙部(19)に形成され、溝樹脂(19a)がランナ樹脂(13a)と一体に形成される。ランナ樹脂(13a)と一体に形成された溝樹脂(19a)は、連結条(16)を含むリードフレーム組立体(1)と一体にトランスファモールド金型(2)から取り出され、ランナ樹脂(13a)と共に容易に除去することができる。間隙部(19)の底部は溝部(18)の底部と同一平面で形成され、連結条(16)を挟んで支持板(6)と反対側に形成される。図４に示すように、間隙部(19)は、連結条(16)に沿ってリードフレーム組立体(1)が配置された複数のキャビティ(5)の外側まで延伸する。
【００１２】
本発明の実施の形態では、間隙部（１９）の幅（Ｌ）は、１．０〜５．０ｍｍである。１．０ｍｍ未満であると、連結条（１６）に付着した溝樹脂（１９ａ）とランナ樹脂（１３ａ）及びゲート樹脂（１４ａ）との接触部分が小さいため、半田ディップ工程等の後工程に送られる際に、溝樹脂（１９ａ）が落下することがある。５．０ｍｍを超えると、樹脂の消費量が増えると共に、溝樹脂（１９ａ）と間隙部（１９）との接触部分が大きくなり、樹脂封止体（５ａ）が形成されたリードフレーム組立体（１）をトランスファモールド金型（２）から取り出すとき、溝樹脂（１９ａ）の一部が下型（３）の間隙部（１９）内に固着して、ランナ樹脂（１３ａ）又はゲート樹脂（１４ａ）から分離する難点がある。好ましくは２．０〜２．５ｍｍである。
【００１３】
トランスファモールド金型（２）を用いて樹脂封止型半導体装置を製造する際、最初に図３に示すリードフレーム組立体（１）を準備し、複数のキャビティ（５）、溝部（１８）、ランナ（１３）及びゲート（１４）が形成されたトランスファモールド金型（２）のキャビティ（５）内に、リードフレーム組立体（１）の支持板（６）を配置する。これと同時に、位置決めリード（９）及び連結条（１６）を下型（３）のリード溝部（１５）及び溝部（１８）内に配置して、支持板（６）の底面（６ａ）に所定厚さの樹脂を形成できるように、キャビティ（５）内で支持板（６）の位置を決める。連結条（１６）を配置したとき溝部（１８）内には、連結条（１６）に沿って間隙部（１９）が形成される。
【００１４】
次に、上型（４）を駆動装置（２０）により下方に移動して、図１に示すように、下型（３）と上型（４）とを型締めした後、ランナ（１３）及びゲート（１４）を介してキャビティ（５）内に流動化した樹脂を注入する。ランナ（１３）に連結された図示しないポットに熱硬化性樹脂を投入し、図示しないプランジャで押圧して樹脂を流動化させる。流動化した樹脂は、図６に示すように、キャビティ（５）内に充填されて、リードフレーム組立体（１）の支持板（６）、半導体素子（７）、リード細線（８）及び外部リード（１０）の内端を被覆する樹脂封止体（５ａ）をリードフレーム組立体（１）に形成すると共に、間隙部（１９）内に充填されて連結条（１６）に付着した溝樹脂（１９ａ）を形成する。溝樹脂（１９ａ）は、ランナ樹脂（１３ａ）と一体に硬化すると共に、支持板（６）等を被覆した樹脂封止体（５ａ）とゲート樹脂（１４ａ）を介して一体に硬化する。
【００１５】
樹脂が硬化した後、駆動装置（２０）により上型（４）を上方に移動させて下型（３）と上型（４）とを離型し、図７に示すように、リードフレーム組立体（１）に形成された樹脂封止体（５ａ）と共に溝樹脂（１９ａ）をトランスファモールド金型（２）から取り出して樹脂封止工程を終了する。溝樹脂（１９ａ）は、図８に示すように、ランナ樹脂（１３ａ）と一体に形成された状態を維持するので、樹脂封止工程後の搬送工程等で落下しない。その後、樹脂除去工程でランナ樹脂（１３ａ）及びゲート樹脂（１４ａ）と共に溝樹脂（１９ａ）が除去される。樹脂除去工程では、溝樹脂（１９ａ）を複数連結されたリードフレーム組立体（１）の連結条（１６）の長さ方向に一体に除去できる。更に、連結条（１６）及び位置決めリード（９）をリードフレーム組立体（１）から除去して樹脂封止型半導体装置が形成される。
【００１６】
本発明の前記実施の形態は変更が可能である。前記実施の形態では、溝樹脂（１９ａ）を除去した後に、連結条（１６）及び位置決めリード（９）を除去することを示したが、連結条（１６）及び位置決めリード（９）をリードフレーム組立体（１）から除去すると同時に、ランナ樹脂（１３ａ）、ゲート樹脂（１４ａ）及び溝樹脂（１９ａ）を除去してもよい。
【００１７】
本実施の形態では、下記の作用効果が得られる。
［１］ 溝樹脂（１９ａ）を下型（３）に残留させずにランナ樹脂（１３ａ）と一体に取り出せるので、残留樹脂の除去工程が必要ない。
［２］ 樹脂封止の後工程で溝樹脂（１９ａ）の落下を確実に防止できるので、落下防止及び落下樹脂除去手段を設ける必要がない。
［３］ 溝樹脂（１９ａ）をランナ樹脂（１３ａ）と一体に形成するので、溝樹脂（１９ａ）等の樹脂除去を短時間で容易にできる。
［４］ 溝部（１８）に所定の幅（Ｌ）を有する間隙部（１９）を形成すれば、従来の成形型（２２）を本発明の実施に直接使用することができる。
【００１８】
【発明の効果】
前記のように本発明では、樹脂バリを容易且つ確実に除去でき且つ生産設備の縮小及び生産時間の短縮を図り、樹脂封止型半導体装置の生産性を向上することができる。
【図面の簡単な説明】
【図１】本発明によるリードフレーム組立体の樹脂モールド用成形型の断面図
【図２】第２の型を示す平面図
【図３】リードフレーム組立体を示す平面図
【図４】第１の型にリードフレーム組立体を配置した状態を示す平面図
【図５】図４の拡大図
【図６】成形型に樹脂を充填した状態を示す断面図
【図７】樹脂封止体が形成されたリードフレーム組立体を示す断面図
【図８】図７の平面図
【図９】従来の第１の型にリードフレーム組立体を配置した状態を示す平面図
【図１０】従来のリードフレーム組立体の樹脂モールド用成形型の断面図
【図１１】従来の樹脂封止体が形成されたリードフレーム組立体を示す平面図
【符号の説明】
（１）・・リードフレーム組立体、 （２）・・成形型（トランスファモールド金型）、 （３）・・第１の型（下型）、 （４）・・第２の型（上型）、 （５）・・キャビティ、 （５ａ）・・樹脂封止体、 （６）・・支持板、 （６ａ）・・底面、 （７）・・半導体素子、 （８）・・リード細線、 （９）・・位置決めリード、 （１０）・・リード端子、 （１３）・・ランナ、 （１３ａ）・・ランナ樹脂、 （１４）・・ゲート、 （１４ａ）・・ゲート樹脂、 （１５）・・リード溝部、 （１６）・・連結条、 （１８）・・溝部、 （１８ａ）・・樹脂バリ、 （１９）・・間隙部、 （１９ａ）・・溝樹脂、 （２０）・・駆動装置、[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin molding technique, and more particularly to a resin mold and a resin molding method for a lead frame assembly capable of easily and reliably removing resin burrs formed on a resin-sealed semiconductor device.
[0002]
[Prior art]
The resin-encapsulated semiconductor device includes a support plate and a semiconductor element (semiconductor chip), and the support plate and the semiconductor element are sealed by a resin seal formed by a well-known transfer molding method. FIG. 10 shows a transfer mold (22) for forming a resin-sealed semiconductor device. The transfer mold (22) includes a lower mold (23) and an upper mold (24) that form a cavity (molding space) (5), and an upper mold (24) along a plurality of arranged cavities (5). A runner (13) formed on the main surface of the substrate and transporting the fluidized resin; a gate (14) for connecting the runner (13) and the cavity (5) to inject the resin into the cavity (5); A driving device (20) for moving the mold (24).
[0003]
When forming a resin-encapsulated semiconductor device by the transfer molding method, first, a lead frame assembly (semiconductor device assembly) (1) shown in FIG. 3 is formed. The lead frame assembly (1) includes a plurality of support plates (6) to which a semiconductor element (7) is fixed, a plurality of external leads (10) disposed on one side of each of the support plates (6), A positioning lead (9) connected to each other side of the support plate (6), and a connecting strip (16) connecting a plurality of positioning leads (9) arranged in parallel to the support plate (6); A thin lead wire (8) for connecting an electrode of the semiconductor element (7) and an external lead (10) is provided. As shown in FIG. 9, the lead frame assembly (1) is disposed on a lower mold (23) of a transfer mold (22). At this time, in order to form a thin resin on the bottom surface (6a) of the support plate (6), the positioning leads (9) and the connecting strips () are formed in the lead grooves (15) and the grooves (18) formed in the lower mold (23). 16) is arranged. When the upper mold (24) is moved by the driving device (20) to close the transfer mold (22), a resin sealing body to be formed is formed between the lower mold (23) and the upper mold (24). A cavity (5) conforming to the outer shape of (5a) is formed, and the support plate (6) is positioned in the cavity (5). Next, resin is injected into the cavity (5) via the runner (13) and the gate (14). Using a thermosetting resin, the fluidized resin injected into the cavity (5) is subjected to a heat treatment at a predetermined temperature for a predetermined time to be cured, and as shown in FIG. 10, the support plate (6), A resin sealing body (5a) for covering the semiconductor element (7), the fine lead wires (8) and the inner ends of the external leads (10) is formed in the cavity (5). Thereafter, the upper mold (24) is released from the lower mold (23), and the lead frame assembly (1) on which the resin sealing body (5a) is formed is removed from the transfer mold (22). The assembly (1) is transported to a post-process such as a solder dip.
[0004]
[Problems to be solved by the invention]
As described above, when the connecting strip (16) for connecting the positioning leads (9) connected to the support plate (6) to each other is disposed in the groove (18) of the lower mold (23), the support plate (6) is formed. ) Is positioned in the cavity (5), and a resin sealing body (5a) is formed with a predetermined thickness on the bottom surface (6a) of the support plate (6). However, when the fluidized resin is injected into the cavity (5), the resin leaks from the cavity (5) to the groove (18) of the connecting strip (16) through the lead groove (15) of the positioning lead (9). Then, after the resin is cured, a long resin burr (18a) is formed along the connecting strip (16) as shown in FIG. The resin burr (18a) not only takes time and effort to remove, but also falls in a post-process such as a conveying process after the resin molding process, a solder dip process, and adversely affects the working process and the manufacturing equipment.
[0005]
Accordingly, the present invention provides a resin mold and a resin molding method for a lead frame assembly capable of preventing resin burrs from dropping in a resin-encapsulated semiconductor device and removing resin burrs easily and reliably. With the goal.
[0006]
The mold for resin molding of a lead frame assembly according to the present invention includes a plurality of support plates (6) to which a semiconductor element (7) is fixed, and a plurality of external plates arranged on one side of the support plate (6). A connecting strip for connecting a lead (10), a positioning lead (9) connected to each other side of the support plate (6), and a plurality of positioning leads (9) arranged in parallel with the support plate (6). (16), a support plate (6) of a lead frame assembly (1) provided with a lead wire (8) for connecting an electrode of the semiconductor element (7) and an external lead (10), a semiconductor element (7) Then, a resin sealing body (5a) covering the inner ends of the thin lead wires (8) and the outer leads (10) is formed in the lead frame assembly (1). This mold for resin molding has a plurality of cavities (5) having a shape complementary to the resin sealing body (5a), and is formed in parallel with the plurality of cavities (5) apart from the plurality of cavities (5). A runner (13) for guiding the flow of the resin that has been fluidized and fluidized, and a gate (14) for connecting the runner (13) and each of the cavities (5) are formed by a first mold (3) of a molding mold (2). ) And the second mold (4). A groove (18) wider than the connecting strip (16) is formed in the first mold (3) in parallel with the runner (13). A gap (19) is formed in the groove (18) along the connecting strip (16) arranged in the groove (18) and communicating with the runner (13). After clamping the mold (2), the fluidized resin is injected into the cavity (5) through the runner (13) and the gate (14), and the support plate (6) of the lead frame assembly (1) When forming the resin sealing body (5a) covering the inner ends of the semiconductor element (7), the fine lead wires (8) and the external leads (10), the groove resin (19a) attached to the connecting strip (16) is The groove resin (19a) formed in the gap portion (19) is integrally cured with the runner resin (13a) in the runner (13). The groove resin (19a) can be taken out of the mold (2) integrally. The groove resin (19a) is firmly fixed to the connecting strip (16) and does not drop from the connecting strip (16) unless it is forcibly removed.
[0007]
The resin molding method for a lead frame assembly according to the present invention includes a plurality of support plates (6) to which a semiconductor element (7) is fixed, and a plurality of external leads arranged on one side of each of the support plates (6). (10), a positioning lead (9) connected to each other side of the support plate (6), and a connecting strip (40) for connecting a plurality of positioning leads (9) arranged in parallel to the support plate (6). 16), a step of preparing a lead frame assembly (1) including a lead wire (8) for connecting an electrode of a semiconductor element (7) and an external lead (10), and a plurality of cavities (5). A runner (13) that is separated from the plurality of cavities (5) and is formed in parallel with the plurality of cavities (5) to guide the flow of the fluidized resin; and each of the runner (13) and the cavity (5). Preparing a molding die (2) comprising a first die (3) and a second die (4) forming a gate (14) connecting the support plate (6); and a support plate (6) in a cavity (5). When you place Next, the connecting strip (16) is arranged in the groove (18) formed in the first mold (3) and wider than the connecting strip (16), and is arranged along the connecting strip (16) and the runner (13). Forming a gap (19) communicating with the groove (18), and clamping the molding die (2) to fluidize the cavity (5) through the runner (13) and the gate (14). A resin injecting step and a resin sealing body (5a) for covering the inner ends of the support plate (6), the semiconductor element (7), the fine lead wires (8) and the external leads (10) of the lead frame assembly (1). ) Is formed on the lead frame assembly (1), and the groove resin (19a) attached to the connecting strip (16) in the gap (19) of the groove (18) is filled with the runner resin (13a) in the runner (13). ) And the step of taking out the lead frame assembly (1) from the molding die (2) together with the runner resin (13a) and the groove resin (19a), and the step of removing the runner resin (13a) and the groove resin (19a). ), Connecting strip (16) and positioning lead (9) And removing from the body (1).
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a resin mold and a resin molding method of a lead frame assembly according to the present invention will be described with reference to FIGS.
[0009]
A transfer mold (2) as a molding die according to the present invention shown in FIG. 1 includes a plurality of cavities (molding cavities) (5), a runner (13) for guiding a flow of fluidized resin, and a runner (13). 13) and a lower mold (3) and an upper mold (4) in which a gate (14) connecting to each of the cavities (5) is formed. The runner (13) is formed in parallel along the plurality of cavities (5), and is formed on the main surface of the upper mold (4) as shown in FIG. A pot (not shown) (a resin injection hole for molding) is connected to an end of the runner (13). The gate (14) injects the fluidized resin from the runner (13) into the cavity (5), and the injected resin causes a resin sealing body (5a) having a shape complementary to the cavity (5) to be formed in the lead frame. It is formed into an assembly (1).
[0010]
As shown in FIG. 3, the lead frame assembly (1) includes a plurality of support plates (6) to which the semiconductor element (7) is fixed, and a plurality of support plates (6) disposed on one side of the support plate (6). An external lead (10), a positioning lead (9) connected to each other side of the support plate (6), and a plurality of positioning leads (9) arranged in parallel with the support plate (6) are connected. A connecting strip (16) and a lead wire (8) for connecting an electrode of the semiconductor element (7) and an external lead (10) are provided. The inner ends of the support plate (6), the semiconductor element (7), the fine lead wires (8) and the outer leads (10) of the lead frame assembly (1) are covered to form a resin sealing body (5a). .
[0011]
The lower die (3) is formed with a lead groove (15) for disposing the positioning lead (9) and a groove (18) for disposing the connecting strip (16). A groove (18) wider than the connecting strip (16) is formed in the lower mold (3) in parallel with the runner (13). In the present invention, as shown in FIGS. 4 and 5, when the connecting strip (16) is arranged in the groove (18), a gap (19) is formed along the connecting strip (16). As shown, the gap (19) communicates with the runner (13). Thereby, a groove resin (19a) in which the resin burr (18a) adhered along the connecting strip (16) is intentionally enlarged is formed in the gap portion (19), and the groove resin (19a) is changed to the runner resin (13a). ) And formed integrally. The groove resin (19a) formed integrally with the runner resin (13a) is taken out of the transfer mold die (2) integrally with the lead frame assembly (1) including the connecting strip (16), and the runner resin (13a ) And can be easily removed. The bottom of the gap (19) is formed on the same plane as the bottom of the groove (18), and is formed on the opposite side of the connecting plate (16) from the support plate (6). As shown in FIG. 4, the gap portion (19) extends along the connecting strip (16) to the outside of the plurality of cavities (5) in which the lead frame assembly (1) is arranged.
[0012]
In the embodiment of the present invention, the width (L) of the gap (19) is 1.0 to 5.0 mm. If it is less than 1.0 mm, the contact portion between the groove resin (19a) adhering to the connecting strip (16) and the runner resin (13a) and the gate resin (14a) is small, so that it is sent to a subsequent step such as a solder dip step. In some cases, the groove resin (19a) may fall. If it exceeds 5.0 mm, the consumption of the resin increases, and the contact portion between the groove resin (19a) and the gap (19) increases, so that the lead frame assembly ( When removing 1) from the transfer mold (2), a part of the groove resin (19a) is fixed in the gap (19) of the lower mold (3), and the runner resin (13a) or the gate resin (14a) is removed. There is a difficult point to separate from). Preferably it is 2.0 to 2.5 mm.
[0013]
When manufacturing a resin-encapsulated semiconductor device using the transfer mold (2), first, a lead frame assembly (1) shown in FIG. 3 is prepared, and a plurality of cavities (5), grooves (18), The support plate (6) of the lead frame assembly (1) is arranged in the cavity (5) of the transfer mold (2) in which the runner (13) and the gate (14) are formed. At the same time, the positioning lead (9) and the connecting strip (16) are arranged in the lead groove (15) and the groove (18) of the lower die (3), and are fixed on the bottom surface (6a) of the support plate (6). The position of the support plate (6) in the cavity (5) is determined so that a resin having a thickness can be formed. When the connecting strip (16) is arranged, a gap (19) is formed in the groove (18) along the connecting strip (16).
[0014]
Next, the upper mold (4) is moved downward by the driving device (20), and the lower mold (3) and the upper mold (4) are clamped as shown in FIG. Then, the fluidized resin is injected into the cavity (5) through the gate (14). A thermosetting resin is charged into a pot (not shown) connected to the runner (13), and pressed by a plunger (not shown) to fluidize the resin. As shown in FIG. 6, the fluidized resin is filled in the cavity (5), and the support plate (6) of the lead frame assembly (1), the semiconductor element (7), the fine lead wires (8), and the outside. A resin sealing body (5a) for covering an inner end of the lead (10) is formed in the lead frame assembly (1), and a groove resin filled in the gap (19) and adhered to the connecting strip (16). (19a) is formed. The groove resin (19a) is integrally cured with the runner resin (13a), and is also integrally cured with the resin sealing body (5a) covering the support plate (6) and the like via the gate resin (14a).
[0015]
After the resin is cured, the upper die (4) is moved upward by the driving device (20) to release the lower die (3) and the upper die (4), and as shown in FIG. The groove resin (19a) is taken out of the transfer mold (2) together with the resin sealing body (5a) formed in the solid (1), and the resin sealing step is completed. As shown in FIG. 8, the groove resin (19a) maintains a state of being integrally formed with the runner resin (13a), and therefore does not drop in a transfer step or the like after the resin sealing step. Thereafter, the groove resin (19a) is removed together with the runner resin (13a) and the gate resin (14a) in a resin removing step. In the resin removing step, the groove resin (19a) can be integrally removed in the length direction of the connecting strip (16) of the plurality of connected lead frame assemblies (1). Further, the connecting strips (16) and the positioning leads (9) are removed from the lead frame assembly (1) to form a resin-sealed semiconductor device.
[0016]
The above embodiments of the present invention can be modified. In the above-described embodiment, the connecting strip (16) and the positioning lead (9) are removed after the groove resin (19a) is removed. However, the connecting strip (16) and the positioning lead (9) are connected to the lead frame. The runner resin (13a), the gate resin (14a) and the groove resin (19a) may be removed simultaneously with the removal from the assembly (1).
[0017]
In the present embodiment, the following operational effects can be obtained.
[1] Since the groove resin (19a) can be taken out integrally with the runner resin (13a) without remaining in the lower mold (3), a step of removing the residual resin is not required.
[2] Since the fall of the groove resin (19a) can be reliably prevented in the post-process of resin sealing, it is not necessary to provide a means for preventing fall and removing fall resin.
[3] Since the groove resin (19a) is formed integrally with the runner resin (13a), the resin such as the groove resin (19a) can be easily removed in a short time.
[4] If a gap (19) having a predetermined width (L) is formed in the groove (18), the conventional mold (22) can be directly used for implementing the present invention.
[0018]
【The invention's effect】
As described above, according to the present invention, resin burrs can be easily and reliably removed, the production equipment and the production time can be reduced, and the productivity of the resin-encapsulated semiconductor device can be improved.
[Brief description of the drawings]
FIG. 1 is a sectional view of a molding die for resin molding of a lead frame assembly according to the present invention. FIG. 2 is a plan view showing a second mold. FIG. 3 is a plan view showing a lead frame assembly. FIG. FIG. 5 is an enlarged view of FIG. 4; FIG. 6 is a cross-sectional view showing a state where a molding die is filled with a resin; FIG. FIG. 8 is a plan view of FIG. 7, FIG. 9 is a plan view showing a state in which the lead frame assembly is arranged on a first conventional die, and FIG. 10 is a plan view of the conventional lead frame. FIG. 11 is a cross-sectional view of a molding die for resin molding of an assembly. FIG. 11 is a plan view showing a lead frame assembly on which a conventional resin sealing body is formed.
(1) Lead frame assembly, (2) Mold (transfer mold), (3) First mold (lower mold), (4) Second mold (upper mold) ), (5) ··· cavity, (5a) ··· resin sealing body, (6) ··· support plate, (6a) ··· bottom, (7) ··· semiconductor element, (8) ·· lead wire, (9) ··· Positioning lead, (10) ··· Lead terminal, (13) ·· Runner, (13a) ·· Runner resin, (14) ·· Gate, (14a) ·· Gate resin, (15) ·・ Lead groove, (16) ・ ・ Connecting strip, (18) ・ ・ Groove, (18a) ・ ・ Resin burr, (19) ・ ・ Gap, (19a) ・ ・ Groove resin, (20) ・ ・ Drive device ,
Claims (5)
前記樹脂封止体と相補的形状を有する複数のキャビティと、該複数のキャビティから離間して且つ該複数のキャビティに並行に形成されて流動化した樹脂の流れを案内するランナと、該ランナと前記キャビティの各々とを連結するゲートとを成形型の第１の型及び第２の型に設け、
前記連結条よりも幅の広い溝部を前記第１の型に前記ランナに並行に形成し、
前記溝部内に配置した前記連結条に沿い且つ前記ランナに連絡する間隙部を前記溝部内に形成し、
前記成形型の型締め後、前記ランナ及びゲートを介して前記キャビティ内に流動化した樹脂を注入して、前記リードフレーム組立体の支持板、半導体素子、リード細線及び外部リードの内端を被覆する樹脂封止体を形成するとき、前記連結条に付着した溝樹脂が前記間隙部内に形成され、該溝樹脂は、前記ランナ内のランナ樹脂と一体に硬化することを特徴とするリードフレーム組立体の樹脂モールド用成形型。A plurality of support plates to which semiconductor elements are fixed, a plurality of external leads arranged on one side of each of the support plates, a positioning lead connected to each other side of the support plate, and the support plate. On the other hand, the supporting plate, the semiconductor element, and the fine lead of the lead frame assembly including a connecting strip connecting the plurality of positioning leads arranged in parallel, and a fine lead connecting the electrode of the semiconductor element and the external lead. And a resin mold for forming a resin molded body covering the inner ends of the external leads in the lead frame assembly,
A plurality of cavities having a shape complementary to the resin sealing body, a runner spaced from the plurality of cavities and formed in parallel with the plurality of cavities to guide a flow of fluidized resin; and A gate connecting each of the cavities is provided in a first mold and a second mold of a mold,
Forming a groove wider than the connecting strip in the first mold in parallel with the runner;
A gap is formed in the groove along the connecting strip disposed in the groove and communicating with the runner;
After the mold is clamped, fluidized resin is injected into the cavity through the runner and the gate to cover the inner ends of the support plate of the lead frame assembly, the semiconductor element, the fine lead wires and the outer leads. A lead frame assembly, wherein a groove resin attached to the connecting strip is formed in the gap portion, and the groove resin is integrally cured with a runner resin in the runner. Mold for three-dimensional resin mold.
複数のキャビティと、該複数のキャビティから離間して該複数のキャビティに並行に形成されて流動化した樹脂の流れを案内するランナと、該ランナと前記キャビティの各々とを連結するゲートとを形成する第１の型及び第２の型から成る成形型を準備する工程と、
前記キャビティ内に前記支持板を配置すると共に、前記第１の型に形成され且つ前記連結条よりも幅の広い溝部内に前記連結条を配置して、前記連結条に沿い且つ前記ランナに連絡する間隙部を前記溝部内に形成する工程と、
前記成形型を型締めして前記ランナ及びゲートを通じて前記キャビティ内に流動化した樹脂を注入する工程と、
前記リードフレーム組立体の前記支持板、半導体素子、リード細線及び外部リードの内端を被覆する樹脂封止体を前記リードフレーム組立体に形成すると共に、前記溝部の間隙部内で前記連結条に付着した溝樹脂を前記ランナ内のランナ樹脂と一体に硬化させる工程と、
ランナ樹脂及び溝樹脂と共に、前記リードフレーム組立体を前記成形型から取り出す工程と、
前記ランナ樹脂、溝樹脂、連結条及び位置決めリードを前記リードフレーム組立体から除去する工程とを含むことを特徴とするリードフレーム組立体の樹脂モールド成形法。A plurality of support plates to which semiconductor elements are fixed, a plurality of external leads arranged on one side of each of the support plates, a positioning lead connected to each other side of the support plate, and the support plate. A step of preparing a lead frame assembly including a connecting strip for connecting the plurality of positioning leads arranged in parallel, and a thin lead wire for connecting the electrode of the semiconductor element and the external lead;
A plurality of cavities, a runner formed apart from the plurality of cavities and formed in parallel with the plurality of cavities to guide the flow of fluidized resin, and a gate connecting the runner and each of the cavities are formed. Preparing a mold comprising a first mold and a second mold to be molded;
Disposing the support plate in the cavity, disposing the connection member in a groove formed in the first mold and wider than the connection member, and communicating with the runner along the connection member. Forming a gap portion in the groove portion,
Injecting the fluidized resin into the cavity through the runner and the gate by clamping the mold,
A resin sealing body covering the support plate, the semiconductor element, the fine lead wires and the inner ends of the external leads of the lead frame assembly is formed on the lead frame assembly, and adheres to the connecting strip in the gap of the groove. Curing the grooved resin integrally with the runner resin in the runner,
Removing the lead frame assembly from the mold together with a runner resin and a groove resin;
Removing the runner resin, groove resin, connecting strips and positioning leads from the lead frame assembly.
前記溝樹脂を除去後、前記連結条及び位置決めリードを除去する工程とを含む請求項４に記載のリードフレーム組立体の樹脂モールド成形法。Removing the groove resin together with the runner resin and the gate resin cured in the runner and the gate,
5. The method of resin molding a lead frame assembly according to claim 4, further comprising: removing the connecting strip and the positioning lead after removing the groove resin. 6.
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| JP33665499A JP3575592B2 (en) | 1999-11-26 | 1999-11-26 | Mold for resin molding of lead frame assembly and resin molding method |
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| JP33665499A JP3575592B2 (en) | 1999-11-26 | 1999-11-26 | Mold for resin molding of lead frame assembly and resin molding method |
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