JP6874314B2 - Object holding device, exposure device, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The invention, object-holding device, an exposure device, a method of manufacturing a flat panel display, and relates to a device manufacturing method, more particularly, an object holding device for holding an object, an exposure apparatus provided with the object-holding device, and the exposure apparatus The present invention relates to a method for manufacturing a flat panel display or a device.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), a pattern formed on a mask or reticle (hereinafter collectively referred to as “mask”) is formed into an energy beam. An exposure apparatus is used to transfer to a glass plate or a wafer (hereinafter, collectively referred to as a “substrate”) using the above.

As an exposure apparatus of this type, a substrate holder included in the substrate stage apparatus is known to hold the substrate by vacuum suction (see, for example, Patent Document 1).

The substrate holder is required to hold the substrate so that wrinkles or irregularities are not formed on the surface of the substrate.

U.S. Patent Application Publication No. 2010/0266961

The present invention has been made under the above-mentioned circumstances, and according to the first aspect, it is an object holding device that holds an object, includes a holding portion for holding the object, and supports the object from the first direction. It has a plurality of first support portions and a second support portion that non-contactly supports a portion of the object that is not held by the holding portion from the first direction, and the first support portion is in the first direction. An object holding device that moves in a direction intersecting with is provided.

According to the second aspect, the object holding device according to the first aspect and a pattern forming device for forming a predetermined pattern on the object held by the object holding device by using an energy beam are provided. An exposure apparatus is provided.

According to a third aspect, there is provided a method for manufacturing a flat panel display including exposing the object using the exposure apparatus according to the second aspect and developing the exposed object. To.

According to the fourth aspect, there is provided a device manufacturing method including exposing the object using the exposure apparatus according to the second aspect and developing the exposed object.

According to a fifth aspect, it is an object holding method for holding an object, wherein the holding portion for holding the object is provided, and the object is supported by a plurality of first supporting portions that support the object from the first direction. The object is supported by the second support portion that non-contactly supports the portion of the object that is not held by the holding portion from the first direction, and the first support portion intersects the first direction. A method of holding an object, including moving in a direction, is provided.

It is a figure which shows schematic the structure of the liquid crystal exposure apparatus which concerns on 1st Embodiment. 2 (A) and 2 (B) are a plan view and a side view of a substrate holder included in the liquid crystal exposure apparatus of FIG. It is sectional drawing of the substrate holder of FIG. 2A. 4 (A) and 4 (B) are a cross-sectional view and a plan view of a chuck portion of the substrate holder. FIG. 5A is a diagram for explaining the operation of the substrate holder, and FIG. 5B is a diagram for explaining the operation of the chuck portion. 6 (A) and 6 (B) are a plan view and a side view of the substrate holder according to the second embodiment, and FIG. 6 (C) is a cross-sectional view of the chuck portion according to the second embodiment. .. 7 (A) and 7 (B) are a plan view and a side view of the substrate holder according to the modified example of the second embodiment.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5 (B).

FIG. 1 schematically shows the configuration of the exposure apparatus (here, the liquid crystal exposure apparatus 10) according to the first embodiment. The liquid crystal exposure apparatus 10 is a so-called scanner, which is a step-and-scan type projection exposure apparatus in which an object (here, a glass substrate P) is an object to be exposed. The glass substrate P (hereinafter, simply referred to as “substrate P”) is formed in a rectangular shape (square shape) in a plan view, and is used for a liquid crystal display device (flat panel display) or the like.

The liquid crystal exposure device 10 comprises a lighting system 12, a mask stage device 14 for holding the mask M, a projection optical system 16, and a substrate P on which a resist (sensitizer) is applied to the surface (the surface facing the + Z side in FIG. 1). It has a substrate stage device 20 for holding, a control system for these, and the like. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 during exposure is defined as the X-axis direction, and the directions orthogonal to the X-axis in the horizontal plane are defined as the Y-axis direction, the X-axis, and the Y-axis. The direction perpendicular to the Z-axis direction will be described as the Z-axis direction.

The illumination system 12 is configured in the same manner as the illumination system disclosed in US Pat. No. 5,729,331 and the like, and irradiates the mask M with exposure illumination light (illumination light) IL. As the illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) (or the composite light of the i-line, g-line, and h-line) is used.

The mask stage device 14 holds the mask M by, for example, vacuum suction. The mask stage device 14 is driven by a mask stage drive system (not shown) including an actuator such as a linear motor with a predetermined long stroke at least in the scanning direction (X-axis direction). The position information of the mask stage device 14 is obtained by a mask stage measurement system (not shown) including a linear encoder system or an optical interferometer system.

The projection optical system 16 is arranged below the mask stage device 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775. It is equipped with a plurality of projection optical systems that form an erect image.

In the liquid crystal exposure apparatus 10, when the illumination region on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light passing through the mask M causes the mask M in the illumination region via the projection optical system 16. A projected image (partially upright image) of the circuit pattern of is formed in an irradiation region (exposure region) of illumination light conjugate to the illumination region on the substrate P. Then, the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region (illumination light IL) in the scanning direction. Scanning exposure is performed on one shot area, and the pattern formed on the mask M is transferred to the shot area.

The board stage device 20 includes a surface plate 22, a board table 24, a self-weight support device 26, and a board holder 30.

The surface plate 22 is made of a rectangular plate-shaped member in a plan view (when viewed from the + Z side), and is installed on the floor F. The substrate table 24 is made of a thin box-shaped member having a rectangular shape in a plan view. The self-weight support device 26 is placed on the surface plate 22 in a non-contact state, and supports the self-weight of the substrate table 24 and the substrate holder 30 from below. The board holder 30 is fixed to the upper surface of the board table 24. Further, although not shown, the board stage device 20 includes an actuator such as a linear motor, and drives the board table 24 in the X-axis and Y-axis directions (along the XY plane) with a predetermined long stroke. The board holder 30 includes a board stage drive system that microdrives the board table 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions, an encoder system, an optical interferometer system, and the like. It is equipped with a board stage measurement system for obtaining position information in the above 6 degrees of freedom direction. As the substrate stage drive system and the substrate stage measurement system, the exposure apparatus (surface plate 22 is fixed) disclosed in US Patent Application Publication No. 2010/0018950 and International Publication No. 2015/147319 (surface plate 22 is movable). ), But the present invention is not limited to this.

The substrate holder 30 is made of a plate-shaped member having a rectangular shape in a plan view, and the substrate P is placed on the upper surface (the surface on the + Z side). As shown in FIG. 2A, the upper surface of the substrate holder 30 is formed in a rectangular shape with the X-axis direction as the longitudinal direction, and the aspect ratio thereof is substantially the same as that of the substrate P. However, the lengths of the long side and the short side of the upper surface of the substrate holder 30 are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively, and the substrate P is the upper surface of the substrate holder 30. In the state of being placed on the substrate P, the vicinity of the four side ends of the substrate P protrudes outward from the substrate holder 30.

FIG. 2A is a plan view of the substrate holder 30 included in the liquid crystal exposure apparatus of FIG. 1 (top view looking down from the + Z direction), and FIG. 2B is a side surface of the substrate holder 30 viewed from the −Y direction. It is a figure. As can be seen from FIGS. 2A and 2B, the substrate holder 30 includes a base portion 32, an intermediate portion 34, a holding surface portion 36, and nine chuck portions 40.

The base portion 32, the intermediate portion 34, and the holding surface portion 36 are plate-shaped (or box-shaped) members having a rectangular shape in a plan view, respectively. The substrate holder 30 has a three-layer structure in which the base portion 32 is the lowermost layer, the intermediate portion 34 is the intermediate layer, and the holding surface portion 36 is the uppermost layer. In the substrate holder 30, a plurality of chuck portions 40 vacuum suction and hold the substrate P placed on the holding surface portion 36. Further, in the substrate holder 30, the pressurized gas is ejected from the holding surface portion 36 to the lower surface portion of the substrate P, and a vacuum suction force is supplied between the lower surface portion of the substrate P and the upper surface portion of the holding surface portion 36. The base portion 32 and the intermediate portion 34 are formed with the vacuum suction force, a conduit for supplying a pressurized gas, and the like. The intermediate portion 34 is formed of, for example, black granite (gabbro) or ceramics, and its surface (the surface on which the holding surface portion 36 is placed (opposed), the upper surface) covers the entire surface. It is finished extremely flat. Further, the intermediate portion 34 may be formed by combining a plurality of flat plates having a flat surface. Hereinafter, the structure and operation of each element constituting the substrate holder 30 will be described.

The holding surface portion 36 is formed of a porous material. The porous material forming the holding surface portion 36 is not particularly limited, and metals, ceramics, synthetic resins and the like can be used. Nine storage portions 38 (see FIG. 2A) are formed inside the holding surface portion 36. As shown in FIG. 3, a space opened by the storage portion 38 on the upper surface side of the holding surface portion 36 is formed in the holding surface portion 36, and the chuck portion 40 is housed in the space. The number and arrangement of the nine chuck portions 40 are not particularly limited, but the substrate holder 30 can hold the central portion (center of gravity position) of the substrate P by suction (see FIG. 2A). It is preferable to include one chuck portion 40 arranged in the central portion (central portion). Hereinafter, when it is necessary to make a distinction, the chuck portion 40 arranged in the central portion of the substrate holder 30 will be appropriately referred to as a center-chuck portion 40C.

FIG. 3 is an XZ cross-sectional view of the substrate holder 30 of FIG. 2A when viewed from the −Y direction. 4 (A) and 4 (B) are an XZ cross-sectional view of the chuck portion 40 of the substrate holder 30 seen from the −Y direction and a plan view (top view) looking down from the + Z direction.

As can be seen from FIGS. 4 (A) and 4 (B), the chuck portion 40 has a protruding portion 42 formed in a cylindrical shape protruding in the Z direction and a flange integrally connected to the lower end of the protruding portion 42. It is provided with a part 44.

As shown in FIG. 3, the chuck portion 40 is housed in the storage portion 38 so that the tip of the protruding portion 42 slightly protrudes from the upper surface of the holding surface portion 36 (protrudes by about several tens of micrometers). The height dimension is set. The amount of the tip of the protruding portion 42 protruding from the holding surface portion 36 is such that the substrate P attracted and supported by the tip of the protruding portion 42 of the chuck portion 40 is sprayed with gas from the holding surface portion 36, which will be described later. It is set within a protrusion amount that can be floated and supported on the 36.

The flange portion 44 serves to prevent the chuck portion 40 from coming off so that the chuck portion 40 can be maintained in the storage portion 38. With the flange portion 44, even if the chuck portion 40 moves in the XY plane or moves in the Z direction, the chuck portion does not come out of the storage portion 38. The flange portion 44 also functions as a portion that receives a force (pressurized gas) acting on the chuck portion 40 in order to control the movement of the chuck portion 40 in the XY plane and the movement in the Z direction, which will be described later.

Further, as shown in FIG. 3, in a state where the chuck portion 40 is stored in the storage portion 38, a predetermined value is provided between the wall surface forming the storage portion 38 (space) and the outer peripheral surface of the chuck portion 40. The dimensions of the storage portion 38 and the chuck portion 40 are set so that a gap is formed. With such a dimensional configuration and the position control of the chuck portion 40 by the pressurized gas described later, the chuck portion 40 is stored in the storage portion 38 in a direction parallel to the XY plane (the protruding portion of the chuck portion 40). With respect to the direction in the plane where 42 protrudes with respect to the Z direction), the state of being unconstrained with respect to the holding surface portion 36 (the state of being unconstrained with respect to the position in the XY plane, in other words, the holding surface portion 36). It is in a state where it can move relative to the direction parallel to the XY plane). Further, the plurality of chuck portions 40 other than the center chuck portion 40C described above are placed on the annular member 46 formed of the porous member.

As can be seen from FIGS. 4 (A) and 4 (B), at the tip of the protruding portion 42 in the + Z direction, a peripheral wall portion 48a formed in an annular shape and an inner diameter side of the peripheral wall portion 48a are arranged. A plurality of (four in this embodiment) pins (pin portions) 48b are formed. The tip of the peripheral wall portion 48a and the tip of the pin 48b are processed with high accuracy so that the positions in the height direction (Z-axis direction) are substantially the same. Further, at the tip of the protrusion 42, a hole 48c (suction hole) for sucking gas in the space inside the peripheral wall 48a is located at a substantially central position (at the peripheral wall 46a) surrounded by the pins 48b. It is located in the center of the enclosed area). The substrate holder 30 (see FIG. 3) is subjected to a vacuum suction operation through the hole 48c in a state where the peripheral wall portion 48a of the chuck portion 40 and the plurality of pins 48b support the substrate P (see FIG. 3) from below. A vacuum suction force acts on the inner diameter side of the peripheral wall portion 48a. As a result, the substrate P is adsorbed and held at a total of nine locations (see FIG. 2A). In FIG. 2A and the like, the chuck portion 40 is shown larger than the actual one for easy understanding, but in reality, the diameter of the protruding portion 42 of the chuck portion 40 is several mm (10 mm). The substrate P (one side length of 500 mm or more) is substantially point-supported at each support position of the plurality of chuck portions 40. Therefore, the substrate holder 30 of the present embodiment can suck and hold the substrate P at nine points. In the present embodiment, a vacuum suction force acts through the hole 48c in the space surrounded by the peripheral wall portion 48a, but the present invention is not limited to this, and each pin 48b is formed into a tubular shape, and the pin 48b is formed. The tip of the substrate P may be configured to attract and hold the substrate P (by the opening of the tubular tip).

Returning to FIG. 3, a joint 60 for supplying a pressurized gas and a joint 62 for supplying a vacuum suction force are connected to the side surface of the base portion 32. A plurality of pipelines are formed in the base portion 32 and the intermediate portion 34, and the pressurized gas supplied to the base portion 32 via the joint 60 is a porous material through the plurality of pipelines. It is supplied to the holding surface portion 36 and the member 46 formed by the above (see the small arrow in FIG. 3). The holding surface portion 36 and the member 46 eject the pressurized gas onto the outer peripheral surface (the surface of the protruding portion 42 and the flange portion 44) and the bottom surface of the chuck portion 40 (excluding the center chuck portion 40C), and of the pressurized gas. By static pressure, the holding surface portion 36 is held in a state where a gap is provided between the storage portion 38 and the chuck portion 40, that is, in a mechanically unconstrained state in the storage portion 38. In FIG. 3, a plurality of black arrows shown from each of the X, Y (not shown), and Z directions with respect to the chuck portion 40 indicate the flow of the pressurized gas.

In the present embodiment, in order to bring the chuck portion 40 into a mechanically unconstrained state in the storage portion 38, the pressure and air volume of each pressurized gas acting on the chuck portion 40 are controlled to be substantially the same from the XY directions. To do. As a result, the chuck portion 40 can be automatically arranged at a neutral position in the storage portion 38 (a position where the gap between the wall surface forming the storage portion 38 and the outer peripheral surface of the chuck portion 40 is substantially uniform). However, the chuck portion 40 does not necessarily have to be arranged in the neutral position, and the chuck portion 40 may be arranged in a movable position in the XY plane.

In FIG. 3, the ejection of the pressurized gas for controlling the position of the chuck portion 40 in the Z direction does not constrain the position of the substrate P in the XY plane (the chuck portion 40 is placed in the storage portion 38 in the Z direction). It is kept floating (in order to move the chuck portion 40 XY within the storage portion 38 without friction). Then, as shown in FIG. 3, the flange portion of the chuck portion 40 is ejected from below (from the member 46) and from above (from the holding surface portion 36) into a narrow gap by ejecting a pressurized gas into the chuck portion 40. Can be maintained (floating and supported) on the intermediate portion 34 in a state where the rigidity in the Z direction is relatively high. Therefore, the heights of the tips of all the chuck portions 40 are aligned on the same plane and are stable.

On the other hand, in the ejection of the pressurized gas for controlling the position of the chuck portion 40 in the XY direction (the pressurized gas acting on the chuck portion 40 from the XY directions in FIG. 3), the chuck portion 40 holds the storage portion 38. It may be stopped after making it out of contact with the wall surface to be formed (after making the chuck portion 40 movable in any direction in the XY plane) and before receiving the substrate P. This is so that the position of the chuck portion 40 in the XY direction is not constrained by the pressurized gas from the XY direction at all. It should be noted that the above-mentioned ejection of the pressurized gas from the XY direction to the chuck portion 40 before receiving the substrate P is not always necessary. If it is possible to recognize that the XY position of the chuck portion 40 is not in contact with the wall portion of the storage portion 38, it is not necessary to eject the pressurized gas from this XY direction. For example, if a sensor mechanism for monitoring the XY position in the storage portion 38 of the chuck portion 40 is provided in the exposure apparatus, the distance from the wall portion of the storage portion 38 in the XY direction is a predetermined interval based on the sensor output. (When there is no more than that), it is sufficient to control the ejection of the pressurized gas in the XY direction.

As a result, the chuck portion 40 (excluding the center chuck portion 40C) is movable with respect to the holding surface portion 36 in three degrees of freedom in the horizontal plane (rotational directions around the X-axis, Y-axis, and Z-axis). That is, the plurality of chuck portions 40 other than the center chuck portion 40C attract and hold the substrate P, but do not restrain the substrate P with respect to the holding surface portion 36. Further, in a state where a plurality of chuck portions 40 other than the center chuck portion 40C attract and hold the substrate P, stress parallel to the XY plane with respect to a part (or the whole) of the substrate P, that is, wrinkles are generated on the substrate P. When a stress in the direction of causing the crease is applied, the chuck portion 40 can move in the XY plane by receiving the stress. As a result, the acting stress (strain, wrinkles) generated on the substrate P can be released. In this case, the release of stress generated in the substrate P may be assisted by using a pressurized gas acting on the chuck portion 40 from the XY directions. In this case, the pressure of the pressurized gas is set to such an extent that the chuck portion 40 moves relative to the holding surface portion 36 in the horizontal plane due to the stress.

With the above-described configuration, the strain accumulated on the substrate P, the strain due to stress and other influences (for example, thermal deformation, etc.) can be released without being retained on the substrate P, so that the substrate can be supported flat.

Further, the pressurized gas supplied to the holding surface portion 36 is ejected from the upper surface of the holding surface portion 36 and exerts an upward force in the gravity direction on the substrate P placed on the holding surface portion 36 (+ Z in FIG. 3). See the small arrow in the direction). The substrate P is supported from below by a plurality of chuck portions 40 whose tip portions protrude from the upper surface of the holding surface portion 36, and there is a gap between the portion supported by the chuck portion 40 and the upper surface of the holding surface portion 36. Although it is formed, by supplying the pressurized gas to the lower surface side, it is prevented from hanging down due to its own weight and contact between the lower surface of the substrate P and the upper surface of the holding surface portion 36.

The vacuum suction force supplied to the base portion 32 via the joint 62 for supplying the vacuum suction force is supplied to the upper surface of the holding surface portion 36 via the plurality of pipelines. A plurality of minute holes are formed on the upper surface of the holding surface portion 36 (not shown in FIG. 2A and the like). These plurality of holes are mechanically processed separately from the minute holes of the holding surface portion 36 (porous material). In the example shown in FIG. 3, two holes for vacuum suction are formed between the adjacent chuck portions 40, but the number of holes for vacuum suction is not limited to this. Further, the inner wall surface of the pipe line for supplying the vacuum suction force may be subjected to a predetermined treatment so that the pressurized gas is not supplied into the pipe line. In the substrate holder 30, a downward force in the direction of gravity is applied to the substrates P placed on the plurality of chuck portions 40 by the vacuum suction force (see the large arrow in FIG. 3). In the substrate holder 30, the upward force in the gravity direction that the pressurized gas acts on the substrate P and the downward force in the gravity direction that the vacuum suction force acts on the substrate P so that the surface of the substrate P is parallel to the horizontal plane. The balance with is set. The flatness of the surface of the substrate P may be measured from the back surface side of the substrate P or from the upper surface side of the substrate P by a sensor built in the substrate holder 30.

Since the vacuum suction force supplied through the joint 62 and the vacuum suction force supplied to the chuck portion 40 are supplied by different systems, the chuck portion 40 holds (and releases) the substrate P. , The plane correction (and its release) of the substrate P by the holding surface portion 36 can be controlled independently at an arbitrary timing.

Further, the intermediate portion 34 sucks and holds the center chuck portion 40C by the vacuum suction force supplied through the joint 62. As a result, of the plurality of chuck portions 40, only the center chuck portion 40C is constrained in the position in the horizontal plane in the direction of three degrees of freedom with respect to the holding surface portion 36. When it is not necessary to switch between restraining and non-constraining of the center chuck portion 40C with respect to the holding surface portion 36, the center chuck portion 40C may be mechanically restrained with respect to the holding surface portion 36 or the intermediate portion 34 in advance. Further, the center chuck portion 40C may have a stronger vacuum suction force than the other chuck portions 40 in order to prevent the displacement of the substrate with respect to the substrate holder 30 in the X, Y, and θz directions. Therefore, the diameter of the protruding portion 42 may be increased, or a plurality of center chuck portions 40C may be arranged in close proximity to each other. Since the height (Z direction) of the center chuck portion 40C does not rise on the intermediate portion 34 like the other chuck portions 40, it is somewhat higher than the height of the other chuck portions (several micrometers to several tens of micrometers). ) It's getting higher.

In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage apparatus 14 by the mask loader (not shown) under the control of the main control apparatus (not shown). At the same time, the substrate P is loaded onto the substrate holder 30 by a plate loader (not shown). After that, the main control device executes alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, a plurality of shot regions set on the substrate P are sequentially exposed by a step-and-scan method. The operation is performed. Since this exposure operation is the same as the conventional step-and-scan exposure operation, detailed description thereof will be omitted.

In the first embodiment described above, the substrate holder 30 is predetermined in the X-axis direction and the Y-axis direction with respect to the projection optical system 16 during the alignment operation and the step-and-scan exposure operation. Stroke and drive at a given speed (including acceleration and deceleration). At this time, in the substrate holder 30, since the center chuck portion 40C restrains the position of the substrate P in the horizontal plane with respect to the holding surface portion 36, the positional deviation of the substrate P in the horizontal plane does not occur.

Further, deformation of the substrate P in the Z-axis direction (occurrence of unevenness and wrinkles) causes the chuck portion 40 excluding the center chuck portion 40C to move relative to the holding surface portion 36 in the horizontal plane (causing the unevenness and wrinkles described above). It is suppressed by canceling the stress). Therefore, even if the substrate P is placed on the substrate holder 30 in a state where the substrate P is wrinkled at the time of loading the substrate, the wrinkles are automatically removed. Further, since the holding surface portion 36 ejects pressurized gas onto the lower surface of the substrate P and exerts a vacuum suction force on the lower surface side of the substrate P, bending due to the weight of the substrate P is suppressed and the overall flatness is improved. Can be made to.

Further, the overall flatness of the substrate P can be individually adjusted, and the height (Z direction) is accurately adjusted in advance, and the Z direction is highly rigid and stable. Since it is formed by a holding surface portion having relatively low rigidity that is contact-supported, it is easy to improve the flatness and plane stability of the substrate as compared with the case where the substrate is floated and supported in a completely non-contact manner. Further, in the completely non-contact holder, it is necessary to take measures to prevent the substrate from slipping (flow prevention in the XY direction) on the outer peripheral portion of the substrate, but such a measure is not necessary. Further, since the substrate holder 30 has a structure of supporting (adsorbing and holding) the substrate P at nine points, it is compared with a substrate holder (so-called pin chuck holder) in which the entire lower surface of the substrate P is supported by a plurality of pins. It is possible to reduce the possibility that dust or the like is caught between the lower surface of the substrate P and the tip of the pin. Therefore, the substrate P can be held with good flatness.

In the first embodiment, the chuck portion 40 excluding the center chuck portion 40C is in a neutral position (the storage portion 38 is formed) in the storage portion 38 unless a force in the horizontal plane acts on the chuck portion 40. The configuration is automatically arranged at a position where the gap between the wall surface and the outer peripheral surface of the chuck portion 40 is almost uniform (the above-mentioned configuration in which the pressure and air volume of each pressurized gas are controlled to be substantially the same from the XY directions). However, the pressure and flow rate of the pressurized gas ejected to the outer peripheral surface of the chuck portion 40 are controlled as shown in FIGS. 5 (A) and 5 (B). By (see the white arrow in FIG. 5B), the chuck portion 40 may be driven with respect to the holding surface portion 36 (see the black arrow in FIG. 5B). The white arrow in FIG. 5 (B) indicates that the pressurized gas is sprayed on the side surface of the chuck portion 40, and is described on the left side of the chuck portion 40 in FIG. 5 (B) in the right direction. The arrow (right arrow) indicates that the force (flow rate and / or pressure of pressurized gas) acting on the chuck portion 40 is larger than the left-pointing arrow (left arrow) described on the right side of the chuck portion 40. There is. In this case, a force (in the case of FIG. 5B, to the right) is forcibly applied through the chuck portion 40 in a direction parallel to the horizontal plane with respect to the substrate P attracted and held by the chuck portion 40. Tension) can be applied. As a result, wrinkles, irregularities, etc. generated on the surface of the substrate P can be forcibly removed (plane correction). FIG. 5A shows an example in which wrinkles and the like of the substrate P are suppressed by moving the chuck portion 40 to the outside of the substrate holder 30 with respect to the center chuck portion 40C (the central portion of the substrate P). The moving direction of each chuck portion 40 is not limited to this, and an inward tension may be applied to the substrate P, or the chuck portion 40 may be rotated in the rotation direction around the Z axis. Further, only a part of the plurality of chuck portions 40 excluding the center chuck portion 40C may be moved. Further, by controlling the pressure and flow rate of the pressurized gas supplied to the member 46 (see FIG. 3) that non-contactly supports the chuck portion 40 excluding the center chuck portion 40C from below, the chuck portion 40 is subjected to. A force in the Z-axis direction may be applied. As a result, it is possible to control the height position (position in the Z-axis direction) of the tip portion of the chuck portion 40, and it is possible to adjust the height position of the surface of the substrate P.

<< Second Embodiment >>
Next, the liquid crystal exposure apparatus according to the second embodiment will be described with reference to FIGS. 6 (A) to 6 (C). The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration of the substrate holder 230 is different. Therefore, only the differences will be described below. Elements having the same configuration and function as those of the embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

The substrate holder 230 of the second embodiment is configured in the same manner as the substrate holder 30 of the first embodiment (see FIG. 2A and the like) except for the chuck portion 240. The chuck portion 240 is formed in a cylindrical shape, and a flange whose tip portion projects upward from the upper surface of the holding surface portion 36 (see FIG. 6B) and a flange integrally connected to the lower end of the protruding portion 242. It is provided with a unit 244. However, in the substrate holder 30 of the first embodiment, the peripheral wall portion 48a and a plurality of pins 48b (see FIG. 4A and the like) are formed at the tip of the protruding portion 42 (concavities and convexities are formed). ) On the other hand, in the second embodiment, the protruding portion 242 is formed of a porous material, and the tip portion becomes flat. Further, the outer peripheral surface of the protruding portion 242 is subjected to processing such as coating so that a vacuum suction force is not generated. Since the configuration and function of the flange portion 244 other than the above are the same as those of the flange portion 44 described above, detailed description thereof will be omitted here.

A vacuum suction force is supplied to the chuck portion 240 as in the first embodiment, and the chuck portion 240 attracts and holds the substrate P at the tip of the flatly formed protrusion 242. The chuck portion 240 according to the second embodiment also has a protruding portion 242 having a diameter of about several mm, which is set sufficiently smaller than that of the substrate P, so that the substrate P is substantially point-supported. It is the same as the first embodiment. Of the plurality of chuck portions 240, the center chuck portion 240C that attracts and holds the central portion of the substrate P is not movable relative to the holding surface portion 36, and the chuck portion 240 excluding the center chuck portion 240C holds the chuck portion 240. The point that the surface portion 36 is not constrained to three degrees of freedom in the horizontal plane is the same as that of the first embodiment. In the examples shown in FIGS. 6 (A) to 6 (C), an opening 240a (see FIG. 6 (C)) is formed at the center of the tip of the protruding portion 242, and a vacuum suction force is applied to the substrate P. However, the chuck portion 240 may not form the opening 240a and may adsorb and hold the substrate P only by the suction force from the porous member.

Also in the second embodiment, the same effect as that of the first embodiment can be obtained. Further, since it is not necessary to form irregularities such as pins (mechanically processed) on the tip portion of the chuck portion 240, the cost can be reduced. In addition, unevenness (adsorption distortion) of the substrate due to the vacuum suction force in the chuck portion 240 can be suppressed.

The configurations of the substrate holders 30 and 230 according to the first and second embodiments are examples, and can be changed as appropriate. That is, in the substrate holders 30 and 230, nine chuck portions 40 and 240 are arranged, respectively, but the number and arrangement of the chuck portions 40 and 240 are not limited to this. 7 (A) and 7 (B) show an example in which the substrate holder 330 has a total of 63 (7 × 9) chuck portions 240 as a modification of the substrate holder 230 of the second embodiment. ing. Since the number of chuck portions 240 in the substrate holder 330 is larger than that in the substrate holder 230, bending due to the weight of the substrate P can be suppressed. The number and arrangement of the chuck portions 240 may be appropriately set according to the size, thickness, and the like of the substrate P.

Further, if the chuck portion 40 (pin holding type) according to the first embodiment and the chuck portion 240 (plane holding type) according to the second embodiment are mixed and the suction holding force of the substrate P differs depending on the part. You may let me.

Further, although there was only one center chuck portion 40C, 240C as the chuck portion to be fixed (restrained) in each embodiment, a plurality of chuck portions 40, 240 holding the vicinity of the central portion of the substrate P may be used. It may be restrained with respect to the intermediate portion 34. Further, the chuck portions 40 and 240 constrained with respect to the intermediate portion 34 are not limited to those arranged at positions corresponding to the central portion of the substrate P.

Further, it may be configured so that the intermediate portion 34 of all the chuck portions 40 and 240 can be switched between restraint and non-constraint. This switching may be performed by vacuum suction holding as in the center chuck portions 40C and 240C, but a mechanical or magnetic device may be used. The reason why the chuck portions 40 and 240 are not restrained is to suppress the occurrence of wrinkles and irregularities on the substrate P, so that there is no problem even if wrinkles and irregularities occur on the substrate P (other than the shot to be exposed). For the region, etc.), the chuck portions 40 and 240 that attract and hold the portion may be placed in an unconstrained state to increase the holding force of the substrate P.

Further, in the above embodiment, the holding surface portion 36 is made of a porous material, but other configurations may be used as long as the supporting force (levitation force) can be given to the substrate P in a non-contact manner. For example, a large number of openings (and suction openings for sucking gas) for blowing out gas with a relatively small opening diameter are arranged on the holding surface portion 36, and the substrate P is floated and supported by the gas using them. You can do it. The center chuck portions 40C and 240C may have a shape without a flange so that they can be easily replaced from above (+ Z side). Further, other chuck portions may also have a configuration in which the protruding portion and the flange portion can be separated so that the protruding portion can be easily replaced from above (+ Z side).

Further, in the above embodiment, the chuck portion 40 that can move in the X and Y directions (in an unconstrained state in the X and Y directions) is floated on the intermediate portion 34 by using a pressurized gas to move in the XY directions. Although the chuck portion 40 is supported in an unconstrained state, another configuration may be used as long as the chuck portion 40 is supported in the X and Y directions without restraint. For example, the lower part (bottom surface portion) of the chuck portion 40 may be supported by an elastic member so that it can move in the X and Y directions. In this case, the side surface portion of the chuck portion 40 (the side surface portion of the protruding portion 42 or the side surface portion of the flange portion 44) is replaced with an elastic member (X, Y) so that the position of the chuck portion 40 in the Z direction does not change due to elastic deformation. It is configured to be supported by an elastic member) that is configured or arranged so as to be displaced in the direction but not in the Z direction.

Further, in the above embodiment, the entire chuck portion 40 is configured to move in the X, Y, and Z directions, but only a part of the chuck portion 40 (for example, the protruding portion 42) can be moved in the X and Y directions. It may be configured as. For example, the above-mentioned is formed at the boundary portion between the protruding portion 42 and the flange portion 44 (the portion corresponding to the bottom surface of the protruding portion 42) so that the protruding portion 42 can move relative to the flange portion 44 in the X and Y directions. It suffices to provide the elastic member as described above. In this case as well, the side surface portion of the protruding portion 42 is supported by an elastic member (an elastic member that is displaced in the X and Y directions but not in the Z direction) so that the position of the protruding portion 42 in the Z direction does not fluctuate. Configure.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as _{F 2 laser light (wavelength 157 nm).} As the illumination light, the single wavelength laser light in the infrared region or the visible region oscillated from the DFB semiconductor laser or the fiber laser is amplified by a fiber amplifier doped with erbium (or both erbium and itterbium). A harmonic whose wavelength is converted to ultraviolet light using a nonlinear optical crystal may be used. Further, a solid-state laser (wavelength: 355 nm, 266 nm) or the like may be used.

Further, the case where the projection optical system 16 is a multi-lens type projection optical system including a plurality of optical systems has been described, but the number of projection optical systems is not limited to this, and one or more projection optical systems may be used. Further, the projection optical system is not limited to the multi-lens type, and may be a projection optical system using a large mirror of the Offner type. Further, the projection optical system 16 may be an expansion system or a reduction system.

Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to the square glass plate, but is not limited to the exposure apparatus for manufacturing organic EL (Electro-Luminescence) panels, and for manufacturing semiconductors. It can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc., glass substrates, silicon wafers, etc. It can also be applied to an exposure apparatus that transfers a circuit pattern to a wafer.

Further, the object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and a film-like (flexible sheet-like member) is also included. The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target.

For electronic devices such as liquid crystal display elements (or semiconductor elements), a step of designing the function and performance of the device, a step of manufacturing a mask (or reticle) based on this design step, and a step of manufacturing a glass substrate (or wafer). Except for the etching apparatus of each of the above-described embodiments, the lithography step of transferring the mask (reticle) pattern to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion where the resist remains. It is manufactured through an etching step of removing exposed members by etching, a resist removing step of removing a resist that is no longer needed after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-mentioned exposure method is executed using the exposure apparatus of the above embodiment, and the device pattern is formed on the glass substrate, so that a device having a high degree of integration can be manufactured with high productivity. ..

As described above, the object holding device and method of the present invention are suitable for holding an object. Further, the exposure apparatus of the present invention is suitable for exposing an object. Further, the method for manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. In addition, the device manufacturing method of the present invention is suitable for manufacturing microdevices.

10 ... Liquid crystal exposure apparatus, 20 ... Substrate stage apparatus, 30 ... Substrate holder, 36 ... Holding surface portion, 40 ... Chuck portion, P ... Substrate.

Claims (19)

An object holding device that holds an object
Of the lower surface of the object, a first support portion a plurality of supporting respective areas spaced apart from the first direction,
The lower surface is provided with a second support portion that non-contactly supports the outside of the region supported by the first support portion from the first direction.
Each of the plurality of first support portions includes a plurality of pin portions capable of supporting the lower surface of the object at a plurality of points, a wall portion surrounding the plurality of pin portions, and a hole formed inside the wall portion. An object holding device that sucks gas in the wall portion through the hole portion, adsorbs and holds the object, and moves in a direction intersecting with the first direction while adsorbing and holding the object. The object holding device according to claim 1, wherein the first support portion moves in any direction in a plane intersecting with the first direction. The object holding device according to claim 2, wherein the first support portion is arranged at a neutral position in a movement range of the first support portion in the plane. The object holding device according to any one of claims 1 to 3, wherein the second support portion applies a supporting force to the lower surface of the object supported by the first support portion. The object holding device according to claim 4, wherein the second support portion blows a gas onto the lower surface of the object. The object holding device according to any one of claims 1 to 5, wherein the first support portion, which is at least a part of the plurality of first support portions, is constrained in position in the plane. Further, a third support portion that supports the plurality of first support portions at positions separated from each other in a plane intersecting the first direction and without restraining the position of the first support portion in the plane. The third support portion includes a suction portion that adsorbs a part of the first support portion of the plurality of first support portions, and the suction portion includes the in-plane of the first support portion of the part. The object holding device according to claim 6, wherein the position of the object is constrained and supported. Any one of claims 2 to 7, wherein the first support portion is provided with an imparting portion that applies a force in a direction parallel to the plane to the first support portion whose position in the plane is not constrained. The object holding device according to the section. The object holding device according to claim 8, wherein the imparting portion blows a gas that acts on the first supporting portion so as to move the first supporting portion in a direction parallel to the plane. The object holding device according to claim 8 or 9, wherein the granting portion applies a force in a direction parallel to the first direction to the first supporting portion whose position in the plane is not constrained. The object holding device according to claim 10, wherein the imparting portion blows gas onto the first supporting portion from below. The first support portion is formed by a porous body, and according to any one of claims 1 to 11, the object is adsorbed and held by applying a suction force to the object through the porous body. Object holding device. The object holding device according to claim 7, wherein the third support portion is formed of a porous body. The object holding device according to any one of claims 8 to 11, wherein the imparting portion is formed of a porous body. The object holding device according to any one of claims 1 to 14,
An exposure apparatus including a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus by using an energy beam. The exposure apparatus according to claim 15, wherein the object is a substrate used for a flat panel display. The exposure apparatus according to claim 16, wherein the substrate has at least one side length or a diagonal length of 500 mm or more. To expose the substrate using the exposure apparatus according to claim 16 or 17.
A method of manufacturing a flat panel display, comprising developing the exposed substrate. To expose the object using the exposure apparatus according to claim 17.
A device manufacturing method comprising developing the exposed object.

Images