JPWO2018062508A1 - Object holding apparatus, exposure apparatus, method of manufacturing flat panel display, device manufacturing method, and object holding method - Google Patents

Abstract

The substrate holder (70) for holding the substrate (P) has a plurality of chuck portions (each having a holding surface for holding the substrate (P), and a suction portion and a non-suction portion provided on the back surface side of the holding surface 74), a base (72) on which a suction part of the chuck (74) is sucked, a platen (50), and the platen (50) and the base (72), A conduit (62) having a conduit for passing gas through the non-adsorbed portion of the chuck (74), the chuck (74) using the gas passing through the non-adsorbed portion to form a substrate P) The object holding device in which the first member is removed from the base member when holding the suction portion and releasing the suction to the base portion (72) of the suction portion.

Description

  The present invention relates to an object holding apparatus, an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an object holding method, and more specifically, an object holding apparatus and method for holding an object, the object holding apparatus And a method of manufacturing a flat panel display or device using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display element or a semiconductor element (integrated circuit etc.), a pattern formed on a mask or a reticle (hereinafter collectively referred to as "mask") is An exposure apparatus is used which transfers an image onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”) using

  In this type of exposure apparatus, there is known a substrate holding device in which a substrate holder of a substrate stage device holds a substrate, for example, by vacuum suction (see, for example, Patent Document 1).

  The substrate holding device is required to hold the substrate with high flatness.

U.S. Patent Application Publication No. 2010/026691

  The present invention has been made under the circumstances described above, and according to a first aspect, an object holding apparatus for holding an object, comprising: a first holding surface for holding the object; and the first holding surface A plurality of first members respectively provided with a first portion and a second portion provided at mutually different positions on the back surface side, and a second holding surface for holding the first member, the first portion and the second portion The second member is provided between a second member fixed to the second holding surface, the base, the base and the second member, and the second member is the second member. And a conduit portion having a conduit communicating with the first portion of the first member to allow gas to pass therethrough, the first member using the gas passing through the first portion, the When holding an object and releasing adhesion of the second portion to the second holding surface, Object-holding device being removed from the two members, it is provided.

  According to a second aspect, an exposure apparatus comprising: the object holding device of the present invention; and a pattern forming device that forms a predetermined pattern on the object held by the object holding device using an energy beam. Is provided.

  According to a third aspect, there is provided a method of manufacturing a flat panel display, comprising: exposing the substrate using the exposure apparatus of the present invention; and developing the exposed substrate.

  According to a fourth aspect, there is provided a device manufacturing method comprising: exposing the object using the exposure apparatus of the present invention; and developing the exposed object.

  According to a fifth aspect, there is provided an object holding method for holding an object, comprising: a first holding surface for holding the object; and first portions provided at mutually different positions on the back surface side of the first holding surface; Holding the object using a plurality of first members respectively provided with a second portion, and a second holding surface for holding the first member, and of the first portion and the second portion Holding the first member using a second member fixed to the second holding surface, the second portion being provided between the base portion and the second member; Passing the gas using a conduit portion having a conduit communicating with the first portion of the first member via a member and passing the gas, using the plurality of first members Holding the object, the object using the gas passing through the first portion The method comprising holding the releases the fixation with respect to the second holding surface of the second portion, wherein the removing the first member from the second member, the object holding method comprising, are provided.

It is a figure showing roughly the composition of the liquid-crystal exposure device concerning one embodiment. It is a figure which shows the micro-movement stage with which the liquid-crystal exposure apparatus of FIG. 1 is equipped (part omission of an upper surface). It is an exploded view of the fine movement stage of FIG. It is a top view of the fine movement stage of FIG. It is AA arrow sectional drawing of FIG. It is a BB arrow sectional drawing of FIG. It is the top view which removed some members from the fine movement stage. It is a figure for demonstrating the assembly procedure of a micro-motion stage. It is a top view of the chuck | zipper part with which a micro-movement stage is provided. It is sectional drawing of the pipeline part and holder part with which a micro-movement stage is provided. It is the top view seen from the back surface side of a chuck | zipper part. It is a figure which shows an example of the modification of a fine movement stage. It is a top view of the fine movement stage of FIG. It is sectional drawing of the fine movement stage of FIG. It is a figure which shows an example of the fastening structure of a chuck | zipper part. It is a figure which shows the other example of the fastening structure of a chuck | zipper part. It is a figure which shows an example of the floating | lifting prevention structure of a chuck | zipper part. It is a figure which shows the other example of the floating | lifting prevention structure of a chuck | zipper part. It is a figure showing lapping processing to a fine movement stage. It is a figure (the 1) for explaining the exchange procedure of a zipper part. It is a figure (the 2) for demonstrating the exchange procedure of a chuck | zipper part. It is a figure (the 3) for demonstrating the exchange procedure of a chuck | zipper part. It is a figure (the 4) for demonstrating the exchange procedure of a chuck | zipper part. It is a figure which shows the back surface of the chuck | zipper part for replacement | exchange. It is a figure for demonstrating the other example (the 1) of the exchange procedure of a chuck | zipper part. It is a top view of the chuck | zipper part used by the exchange procedure which concerns on FIG. It is a figure for demonstrating the other example (the 2) of the exchange procedure of a chuck | zipper part. It is a figure which shows the back surface of the chuck | zipper part used by the exchange procedure which concerns on FIG. It is a figure which shows the modification of a chuck | zipper part. It is a figure for demonstrating the collision prevention structure of adjacent chuck | zipper parts.

  Hereinafter, one embodiment will be described with reference to FIGS. 1 to 30.

  FIG. 1 schematically shows the configuration of an exposure apparatus (in this case, a liquid crystal exposure apparatus 10) according to an embodiment. The liquid crystal exposure apparatus 10 is a step-and-scan projection exposure apparatus that uses an object (here, a glass substrate P) as an exposure target, that is, a so-called scanner. The glass substrate P (hereinafter, simply referred to as “substrate P”) is formed in a rectangular shape in a plan view (square), and is used for a liquid crystal display device (flat panel display) or the like.

  The liquid crystal exposure apparatus 10 includes an illumination system 12, a projection optical system 14, a substrate stage device 20 for holding a substrate P coated with a resist (sensitive agent) on the surface (surface facing the + Z side in FIG. 1), and It has a control system etc. Hereinafter, the direction in which the mask M and the substrate P are scanned relative to the projection optical system 14 at the time of exposure is referred to as a first direction (here, the X axis direction), and the direction orthogonal to the X axis in the horizontal plane is the second direction. A direction orthogonal to the X axis and the Y axis (here, the Y axis direction) is the Z axis direction (a direction parallel to the optical axis direction of the projection optical system 14), and a rotation direction about the X axis, the Y axis, and the Z axis Will be described as θx, θy, and θz directions, respectively. Further, positions in the X axis, Y axis, and Z axis directions will be described as X position, Y position, and Z position, respectively.

  The illumination system 12 is configured in the same manner as the illumination system disclosed in US Pat. No. 5,729,331 and the like, and illuminates the mask M with illumination light for illumination (illumination light) IL. As the illumination light IL, light such as i-ray (wavelength 365 nm), g-ray (wavelength 436 nm), h-ray (wavelength 405 nm) or the like (or combined light of the i-ray, g-ray and h-ray) is used.

  As the mask M, a transmissive photomask is used. A predetermined circuit pattern is formed on the lower surface of the mask M (the surface facing the −Z side in FIG. 1). The mask M is driven with a predetermined long stroke in the scanning direction (X-axis direction) by a mask stage device (not shown).

  The projection optical system 14 is disposed below the mask M. The projection optical system 14 is a so-called multi-lens projection optical system having a configuration similar to that of the projection optical system disclosed in US Pat. No. 6,552,775 and the like, and is a double-sided telecentric equal magnification system Are provided with a plurality of lens modules to form

  In the liquid crystal exposure apparatus 10, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light IL that has passed (transmitted) through the mask M passes through the projection optical system 14 to illuminate the illumination area. A projected image (partial erected image) of the circuit pattern of the mask M is formed on an irradiation area (exposure area) of illumination light conjugate to the illumination area on the substrate P. Then, the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction. The scanning exposure of one shot area is performed, and the pattern formed on the mask M is transferred to the shot area.

  The substrate stage device 20 is a device for controlling the position of the substrate P with respect to the projection optical system 14 (illumination light IL) with high accuracy, and along the horizontal surface (X-axis direction and Y-axis direction) While driving with a predetermined long stroke, it is finely driven in the direction of six degrees of freedom. The configuration of the substrate stage apparatus (except for the fine movement stage 22) used in the liquid crystal exposure apparatus 10 is not particularly limited, but in the present embodiment, it is disclosed in, for example, US Patent Application Publication 2012/0057140 A substrate stage device 20 having a so-called coarse / fine movement configuration is used which includes a gantry type two-dimensional coarse movement stage and a fine movement stage finely driven with respect to the two-dimensional coarse movement stage.

  The substrate stage device 20 includes a fine movement stage 22, a Y coarse movement stage 24, an X coarse movement stage 26, a self-weight supporting device 28, and the like.

  The fine adjustment stage 22 is entirely formed in a plate shape (or a box shape) in a rectangular shape in plan view (see FIG. 2), and the substrate P is mounted on the upper surface (substrate mounting surface) thereof. The dimensions in the X-axis and Y-axis directions of the upper surface of fine movement stage 22 are set to the same extent as substrate P (in fact, they are somewhat short). The substrate P is vacuum-held on the fine adjustment stage 22 while being mounted on the upper surface of the fine adjustment stage 22, so that substantially the entire surface (entire surface) is planarly corrected along the upper surface of the fine adjustment stage 22. Therefore, it can be said that fine movement stage 22 of the present embodiment is a member having the same function as the substrate holder provided in the conventional substrate stage device. The detailed configuration of fine movement stage 22 will be described later.

  The Y coarse movement stage 24 is disposed below the fine movement stage 22 (−Z side). The Y coarse movement stage 24 has a pair of X beams 30a. The X beam 30a is formed of a member having a YZ cross section rectangular shape extending in the X axis direction. The pair of X beams 30a are arranged in parallel at predetermined intervals in the Y-axis direction. The Y coarse movement stage 24 is driven with a predetermined long stroke in the Y-axis direction by a Y actuator (not shown) including a pair of X beams 30a.

  The X coarse movement stage 26 is disposed above (+ Z side) the Y coarse movement stage 24 and below the fine movement stage 22 (between the fine movement stage 22 and the Y coarse movement stage 24). The X coarse movement stage 26 is a plate-like member having a rectangular shape in a plan view, and is mounted on a pair of X beams 30 a via a plurality of mechanical linear guide devices 30 b. The X coarse movement stage 26 is movable with respect to the Y coarse movement stage 24 in the X axis direction, while moving integrally with the Y coarse movement stage 24 in the Y axis direction. The X coarse movement stage 26 is driven with a predetermined long stroke in the X-axis direction with respect to the Y coarse movement stage 24 by a plurality of X actuators 30 c. Although a linear motor is illustrated as the X actuator 30c in FIG. 1, the type of the X actuator is not particularly limited. The type of Y actuator for driving the Y coarse movement stage 24 is likewise not particularly limited.

  A Y stator 32 a is attached to the upper surface of the X coarse movement stage 26. The Y stator 32a, together with the Y mover 32b attached to the side surface of the fine movement stage 22, is a Y linear motor (a voice coil motor in the present embodiment) for applying thrust in the Y axis direction to the fine movement stage 22. Configure In the substrate stage device 20, a plurality of Y linear motors are disposed apart in the X axis direction. Although not shown, substrate stage device 20 also includes a plurality of X linear motors for applying thrust in the X-axis direction to fine movement stage 22. The configuration of the X linear motor is the same as the Y linear motor except for the arrangement. That is, the X stator is attached to the upper surface of the X coarse movement stage 26, and the X mover is attached to the side surface of the fine movement stage 22.

  When the X coarse movement stage 26 moves in the X-axis direction and / or the Y-axis direction, the main controller (not shown) causes the relative position between the fine movement stage 22 and the X coarse movement stage 26 to fall within a predetermined range. While applying the thrust in the direction of three degrees of freedom in the horizontal plane (direction of X axis, Y axis, θz) to fine movement stage 22 using the plurality of X, Y linear motors, the plurality of X, Y linear motors are used Then, the fine movement stage 22 is slightly driven in the horizontal direction with three degrees of freedom with respect to the X coarse movement stage 26. Positional information in the direction of three degrees of freedom in the horizontal plane of fine movement stage 22 is determined by a laser interferometer (not shown) using bar mirror 34 b fixed to fine movement stage 22 via mirror base 34 a. Although only the Y-bar mirror extending in the X-axis direction is illustrated in FIG. 1, in fact, the Y-bar mirror is fixed to the side surface on the -Y side of fine movement stage 22 and on the side surface on the -X side of fine movement stage 22 An X-bar mirror extending in the Y-axis direction is fixed. The measurement system using the laser interferometer is disclosed in, for example, US Patent Application Publication No. 2010/0018950, and the description thereof is omitted. The positional information of the fine movement stage 22 in the direction of three degrees of freedom in the horizontal plane may be determined using an encoder system having a head and a scale instead of an interferometer.

  A Z stator 36 a is attached to the upper surface of the X coarse movement stage 26. The Z stator 36a, together with the Z mover 36b attached to the lower surface of the fine adjustment stage 22, is a Z linear motor (a voice coil motor in the present embodiment) for applying thrust in the Z axis direction to the fine adjustment stage 22. Configure In the substrate stage device 20, the Z linear motors are disposed at at least three locations that are not on the same straight line. The main controller (not shown) finely drives fine movement stage 22 with respect to X coarse movement stage 26 in the Z tilt direction (direction of Z axis, θx, θy) using a plurality of Z linear motors. Positional information of the fine adjustment stage 22 in the Z tilt direction is obtained by a Z sensor 38 a attached to the lower surface of the fine adjustment stage 22 using a target 38 b attached to the self-weight supporting device 28. In the substrate stage device 20, the Z sensors 38a (and the corresponding targets 38b) are arranged at at least three noncollinear positions. The measurement system using a plurality of Z sensors 38a is disclosed in, for example, US Patent Application Publication No. 2010/0018950 and the like, and thus the description thereof is omitted.

  The self-weight support device 28 includes a weight cancellation device 40a that supports the weight of the fine adjustment stage 22 from below, and a Y step guide 42a that supports the weight cancellation device 40a from below.

  The weight cancellation device 40 a is inserted into an opening formed in the X coarse movement stage 26. The weight cancellation device 40a is mechanically connected to the X coarse movement stage 26 via a plurality of connection members 40b, and moves in the X axis and / or Y axis direction integrally with the X coarse movement stage 26. Do. The weight cancellation device 40 a supports the weight of the fine adjustment stage 22 from below with no contact via the leveling device 44. Thereby, relative movement of the fine adjustment stage 22 in the X axis, Y axis, and θz directions with respect to the weight cancellation device 40a, and rocking (relative movement in the θx and θy directions) with respect to the horizontal plane are permitted. The configuration and function of the weight cancellation device 40a are disclosed in, for example, US Patent Application Publication No. 2010/0018950 and the like, and thus the description thereof is omitted.

  The Y step guide 42a is a member extending in parallel to the X axis, and is disposed between the pair of X beams 30a. The weight cancellation device 40a is mounted on the Y step guide 42a via an air bearing 40c. The Y step guide 42a is mounted on the gantry 16 via the mechanical linear guide device 42b and is movable in the Y-axis direction with respect to the gantry 16, but has a relative movement in the X-axis direction. It is restricted. The frame 16 is a part of a member that supports the projection optical system 14 and the like, and the Y coarse movement stage 24 and the X coarse movement stage 26 are vibrationally separated from each other. The Y step guide 42a is mechanically connected to the pair of X beams 30a via a plurality of connecting members 42c. The Y step guide 42 a moves in the Y axis direction integrally with the Y coarse movement stage 24 by being pulled by the Y coarse movement stage 24.

  Next, the configuration of fine movement stage 22 will be described. As shown in FIG. 2, fine movement stage 22 includes a surface plate portion 50, a channel portion 60, a base portion 72, and a chuck portion 74. The surface plate portion 50 is formed in a box shape having a rectangular shape in plan view, and the conduit portion 60 and the holder portion 70 are each formed in a plate shape having a rectangular shape in plan view. In fine movement stage 22, channel portion 60 is disposed (stacked) on surface plate portion 50, base portion 72 is disposed (stacked) on channel portion 60, and chuck portion 74 is disposed further on base portion 72 ( By laminating (stacking), it has a four-layer structure as a whole.

  While the length and width direction (X-axis and Y-axis directions) dimensions of the surface plate portion 50, the conduit portion 60, the base portion 72, and the chuck portion 74 are substantially the same, the surface plate The dimension in the thickness direction (Z-axis direction) of the portion 50 is set larger (thicker) than that of the conduit portion 60, the base portion 72, and the chuck portion 74. The dimension in the thickness direction (Z-axis direction) in which the surface plate portion 50, the conduit portion 60, and the base portion 72 are combined is set larger (thick) than the chuck portion 74. Further, the combined weight of the surface plate portion 50, the conduit portion 60, and the base portion 72 is heavier than the chuck portion 74, and has a weight of, for example, about 2.5 times.

  The surface plate portion 50 which is the lowermost layer is a portion to be a base of the fine movement stage 22. As shown in FIG. 3, the platen unit 50 includes a lower surface 52, an upper surface 54, an outer wall 56, and a honeycomb structure 58. The lower surface portion 52 and the upper surface portion 54 are plate members having a rectangular shape in a plan view formed of carbon-fiber-reinforced plastic (CFRP). The outer wall portion 56 is a frame-shaped member having a rectangular shape in plan view, and is formed of an aluminum alloy or CFRP. A honeycomb structure 58 is filled inside the outer wall portion 56. The honeycomb structure 58 is formed of an aluminum alloy. Although only a part of the honeycomb structure is illustrated in FIG. 3 from the viewpoint of avoiding the complication of the drawing, actually, the honeycomb structure 58 is disposed substantially without a gap inside the outer wall portion 56. (See FIGS. 5 and 6).

  The outer wall 56 in which the honeycomb structure 58 is filled has the upper surface 54 bonded to the upper surface and the lower surface 52 bonded to the lower surface. Thus, the surface plate portion 50 has a so-called sandwich structure, is light in weight, high in rigidity (particularly high in the thickness direction), and easy to be manufactured. In addition, the material which forms each element which comprises the surface plate part 50 is not restricted to what was demonstrated above, It can change suitably. Further, the fastening structure of the lower surface 52, the upper surface 54, and the outer wall 56 is not limited to adhesion.

  An opening 52 a is formed at the center of the lower surface 52. In the honeycomb structure 58, a recess (dent) is formed in a portion corresponding to the opening 52a (see FIGS. 5 and 6), and the above-described leveling device 44 is fitted in the recess. Here, the configuration of the leveling device 44 is not particularly limited as long as it has a function of supporting the fine movement stage 22 so as to be able to swing relative to the horizontal surface (in the θx and θy directions). Therefore, although the spherical bearing device is illustrated in FIG. 1, the leveling device 44 is not limited to this, and may be an elastic hinge device as shown in FIGS. It may be a pseudo spherical bearing device as disclosed in Japanese Patent Application Publication No. 2010/0018950.

  The pipeline portion 60 includes a plurality of pipes 62 extending in the Y-axis direction, and the plurality of pipes 62 are arranged side by side in the X-axis direction. The dimension in the longitudinal direction (Y-axis direction) of the pipe 62 is set to be substantially the same as the dimension in the Y-axis direction of the surface plate portion 50. The number of pipes 62 is not particularly limited, and can be changed as appropriate in accordance with the desired performance required of fine movement stage 22. In FIG. 6 and the like, the number of pipes 62 is illustrated smaller than the actual number in order to facilitate understanding of the configuration and function of fine movement stage 22. Further, the cross-sectional shape of the XZ cross section of the pipe 62 is not particularly limited. Although a so-called square pipe having a rectangular XZ cross section is used as the pipe 62 in FIG. 6 and the like, the present invention is not limited to this, and a so-called round pipe as shown in FIG. 12 may be used. When a round pipe is used, it is preferable to process so that the upper surface and the lower surface of the outer peripheral surface of the round pipe are parallel to each other (the cross section orthogonal to the longitudinal direction becomes a barrel shape). In the present embodiment, the pipe 62 is formed of CFRP, but the material of the pipe 62 is not particularly limited, and can be changed as appropriate. When CFRP is not used as the material of the pipe 62, it is preferable to use a member having a different expansion coefficient from CFRP. Further, although it has been described that the plurality of pipes 62 extend in the Y-axis direction and are arranged side by side in the X-axis direction, the invention is not limited thereto, and the pipes 62 extend in the X-axis direction and are arranged side by side in the Y-axis direction Also good.

  As shown in FIG. 3, the base portion 72 is a thin plate member having a rectangular shape in a plan view, and is formed of stone, ceramic or the like. In addition, although the raw material of the base part 72 is not specifically limited, The material which is excellent in hardness and whose high-precision processing is easy is preferable. In the fine adjustment stage 22, a plurality of base portions 72 are placed on a plurality of pipes 62 constituting the conduit portion 60. The respective base portions 72 are spread over the duct portion 60 in a state in which they are in close contact with each other (a gap can be ignored), and are fixed to the plurality of pipes 62 by an adhesive.

  Each of the base portions 72 is processed (such as lapping) so that the flatness of the surface (the surface opposite to the adhesive surface to the pipe 62) is very high. Further, in the state where the plurality of base portions 72 are spread over the duct portion 60, the surface height positions of the plurality of base portions 72 are adjusted such that the level difference between the base portions 72 becomes substantially negligible. There is. If a plane having an area equivalent to that of the substrate P (see FIG. 1) can be formed above the conduit portion 60, the size (area) of each base portion 72 is as shown in FIG. The base portions 72 may have a common size, or may be mixed with base portions 72 having different sizes, as shown in FIG. 7. Also, the total number of base portions 72 is not particularly limited, and may be constituted by one base portion 72. Although it has been described that the base portion 72 is processed so as to have a very high flatness, the present invention is not limited to this. If one or a part of the base portion 72 is lower than the other base portion 72, a part of the base portion 72 may be missing or a recess may be present. As described later, the base portion 72 may have a notch or a recess smaller than the size of the chuck portion 74 as long as the flatness is obtained when the chuck portion 74 is placed on the base portion 72.

  The surface height position adjustment between the base portions 72 described above may be performed by lapping or the like. In this case, lapping may be performed in consideration of bending so as to obtain a desired accuracy in a state where various accessories (bar mirror 34 b, movers 32 b and 36 b, and a plurality of chucks 74) are attached to fine movement stage 22. desirable. Further, as shown in FIG. 10, the vicinity of the end on the upper surface of the base portion 72 is chamfered, and in a state in which the plurality of base portions 72 are spread, V is placed between adjacent base portions 72. A groove is formed. The V-shaped groove is filled with the joint material 72a, and it is possible to prevent moisture and the like from intruding between adjacent base portions 72 at the time of lapping.

  Returning to FIG. 3, the chuck portion 74 is a portion on which the substrate P (see FIG. 1) is placed. The chuck portion 74 suctions and holds the substrate P in cooperation with the channel portion 60 and the base portion 72. The chuck portion 74 is a thin plate member having a rectangular shape in a plan view, and is formed of a ceramic or the like. By forming the chuck portion 74 of ceramic, generation of static electricity from the substrate P can be suppressed. In addition, although the raw material of the chuck | zipper part 74 is not specifically limited, It is preferable that it is lightweight and the material in which high-precision processing is easy. By using a lightweight material as the material of the base portion 72, deformation of the base portion and / or the duct portion 60 can be prevented. The thickness (for example, 8 mm) of the chuck portion 74 is set thinner than the thickness (for example, 12 mm) of the base portion. In fine adjustment stage 22, a plurality of chuck portions 74 are spread on a plane formed by spreading a plurality of base portions 72 (not shown in FIGS. 2 and 3). The chuck portion 74 is attracted and held by the corresponding base portion 72 (below the chuck portion 74). The structure for attracting and holding the chuck portion 74 to the base portion 72 (adsorption holding structure of the chuck portion 74) will be described later.

  The area of one (one) chuck portion 74 is set smaller than that of one (one) base portion 72. In the example shown in FIG. 3, the case where two chucks 74 are placed on one base 72 is shown, but the chuck placed on one base 72 The number of 74 is not particularly limited. In addition, the area of one chuck portion 74 is not limited to the above, and may have the same area as one base portion 72 or may have an area larger than one base portion 72. . And in the case of the same area, one chuck portion 74 may be mounted on one base portion 72, or when the area of the chuck portion 74 is large, one chuck portion 74 may be supported by a plurality of base portions 72. The base portion 72 and the chuck portion 74 may be collectively referred to as a holder portion 70. In this case, the holder portion 70 has a two-layer structure of the base portion 72 (lower layer) and the chuck portion 74 (upper layer). As described above, fine movement stage 22 has a four-layer structure of surface plate portion 50, channel portion 60, base portion 72, and chuck portion 74. However, surface plate portion 50, channel portion 60, and holder portion It can also be said that it is a three-layer structure consisting of 70.

  In fine adjustment stage 22, a plurality of chuck portions 74 placed (spreaded) on a plurality of base portions 72 form a substrate mounting surface. Each chuck portion 74 is processed with high precision so that the thickness is substantially the same. Therefore, the substrate mounting surface of the fine adjustment stage 22 formed by the plurality of chuck portions 74 is formed to have a high degree of flatness, following the plane formed by the plurality of base portions 72. The chuck portion 74 is mounted on the base portion 72 so as to be replaceable / separable. Further, the chuck portion 74 is mounted on the surface plate portion 50 and / or the conduit portion 60 so as to be exchangeable / separable.

  Next, the configuration of the chuck portion 74 will be described. The fine movement stage 22 is a so-called pin chuck type holder, and a plurality of pins 74 a and a peripheral wall 74 b are formed on the upper surface of each chuck 74 as shown in FIG. 9. The plurality of pins 74a are arranged at substantially equal intervals. Since the diameter of the pin 74a in the pin chuck type holder is very small (for example, about 1 mm in diameter) and the width of the peripheral wall 74b is thin, the possibility of holding and supporting dust and foreign matter on the back surface of the substrate P can be reduced. The possibility of deformation of the substrate P due to the inclusion of the foreign matter can also be reduced. The number and arrangement of the pins 74a are not particularly limited, and can be changed as appropriate. The peripheral wall portion 74 b is formed to surround the outer periphery of the upper surface of the chuck portion 74. The height position (Z position) of the tip of the plurality of pins 74a and the peripheral wall portion 74b are set to be the same. Moreover, in order to suppress reflection of the illumination light IL (see FIG. 1), various surface processing such as coating processing and ceramic thermal spraying are performed on the upper surface of the chuck portion 74 so that the surface becomes black.

  In the fine movement stage 22, a vacuum suction force is supplied to the space surrounded by the peripheral wall 74b in a state where the substrate P (see FIG. 1) is placed on the plurality of pins 74a and the peripheral wall 74b (space The substrate P is attracted and held by the chuck portion 74 by vacuum suction of the inside air. The substrate P is planarly corrected following the tips of the plurality of pins 74 a and the peripheral wall 74 b. The structure (the suction holding structure of the substrate P) for causing the chuck portion 74 to hold the substrate P by suction will be described later.

  In the fine movement stage 22, pressurized gas (such as compressed air) is provided in a space surrounded by the peripheral wall 74 b in a state where the substrate P (see FIG. 1) is placed on the plurality of pins 74 a and the peripheral wall 74 b. Can be released from adsorption of the substrate P on the substrate mounting surface. In order to release the suction of the substrate P on the substrate mounting surface, in other words, a structure for floating the substrate P on the substrate mounting surface (floating support structure of the substrate P) will be described later.

  Further, as shown in FIG. 11, a plurality of pins 74 c and 74 d and a peripheral wall 74 e are also formed on the lower surface of the chuck 74. That is, the lower surface of the chuck portion 74 also has a pin chuck structure. The chuck 74 is placed on the base 72, and the tips of the plurality of pins 74 c and 74 d and the peripheral wall 74 e contact the upper surface of the base 72. The plurality of pins 74c and 74d are arranged at substantially equal intervals. The pin 74d is set to have a larger radial dimension (thicker) than the pin 74c, and a contact area with respect to the base portion 72 (see FIG. 10) is larger than the pin 74c. Through holes 74f and 74g are provided substantially at the centers of the pins 74d. The through holes 74f and 74g are configured to penetrate the chuck portion 74, and communicate with the through holes 72b communicating with the suction pipe 62b provided in the base portion 72 and the through holes of the exhaust pipe 62c. It communicates with the through hole of the base portion 72. The through hole 74 f is a hole for sucking air, and the space (air) formed by the pin chuck formed on the upper surface of the chuck portion 74 and the substrate P is vacuum suctioned through the through hole 74 f and the substrate P is Hold the adsorption. The through hole 74g is a compressed air exhaust hole for exhausting (blowing out) air, and the diameter (opening diameter) is smaller than that of the through hole 74f, and the suction of the substrate P adsorbed on the upper surface of the chuck portion 74 is At the time of release, air having a force to lift the substrate P relative to the substrate P is blown through the through holes 74g.

  The number and arrangement of the pins 74c and 74d are not particularly limited, and can be changed as appropriate. The positions of the plurality of pins 74 a and the plurality of pins 74 c and 74 d in the X and Y directions may be the same or may be disposed at different positions. The peripheral wall 74 e is formed to surround the outer periphery of the lower surface of the chuck 74. The height positions (Z positions) of the tips of the plurality of pins 74c and 74d and the peripheral wall portion 74e are set to be the same. In fine adjustment stage 22, with chuck portion 74 mounted on base portion 72, vacuum suction force is supplied to the space surrounded by peripheral wall portion 74 e, and chuck portion 74 is held by suction by base portion 72. Ru. That is, on the lower surface (rear surface) side of the base portion 72 chuck portion 74, a space (space to be vacuum-suctioned) surrounded by the base portion 72 and the peripheral wall portion 74e of the chuck portion 74, pins 74c and pins 74d. The chuck portion 74 is fixed to the base portion 72. On the other hand, as described above, since the through holes 74f and 74g on the lower surface of the chuck portion 74 are arranged to communicate with the through holes of the base portion 72, they are not fixed to the base portion 72. .

  Here, the adhesion of the chuck portion 74 to the base portion 72 in the present embodiment means that, as in the above-described vacuum suction, while the suction force is acting on a part of the lower surface of the chuck portion 74 (the space). This is to maintain a state in which it does not peel off from the base portion 72 (does not cause positional deviation in the Z direction) and does not cause relative positional deviation (positional deviation in the X and Y directions) with respect to the base portion 72. Furthermore, when the vacuum suction is released and the above-described suction force does not act on the chuck portion 74, the chuck portion 74 can be detached (removed) from the base portion 72. In addition, although it demonstrated that the chuck | zipper part 74 was mounted according to the plane formed of several base part 72, it may not be a plane. As long as the shape formed by the plurality of base portions 72 and the lower surface of the chuck portion 74 are substantially the same, the plurality of base portions 72 may be not flat but curved.

  Here, fine movement stage 22 has various mechanisms for preventing floating of base members 72 of plurality of chuck parts 74. In the example shown in FIGS. 4 to 6, a flat plate-like convex portion 76 is formed at the end portion on the + Y side of the chuck portion 74, and a concave portion (convex portion corresponding to the convex portion 76 at the end portion on the −Y side Since it overlaps with 76, not shown) is formed. Adjacent chuck portions 74 are mechanically fastened by fitting convex portions 76 to corresponding concave portions. Further, the chuck portion 74 disposed along the outer periphery of the fine movement stage 22 is mechanically fastened to the base portion 72 by the fastening member 78. Each chuck portion 74 may be fastened to the surface plate portion 50 or the conduit portion 60 (see FIG. 12). The fastening member 78 is provided at, for example, the corner on the + X side and + Y side of the base portion 72, the surface plate portion 50, or the conduit portion 60, and using other members, the chuck portion from the −X side and the −Y side 74 may be pressed against the fastening member 78 for fastening.

  Further, in the example of the fastening structure shown in FIGS. 12 to 14, the concave portions 176 are formed at the + Y side and −Y side ends of the chuck portion 74 respectively, and strip members 178 (in the pair of opposing concave portions 176 ( Band 178) is inserted. The band 178 is fastened to the surface plate portion 50 (which may be the base portion 72 or the conduit portion 60), whereby the floating of the chuck portion 74 from the base portion 72 is prevented.

  The fastening structure of the chuck portion 74 and the floating prevention structure can be changed as appropriate. Although the convex portion 76 and the concave portion corresponding to the convex portion 76 are provided at the Y side end of the chuck portion 74, it may be provided at the X side end, or both the Y side and the X side It may be provided at both ends. In the example shown in FIG. 15, recessed portions 276 (hollow holes) are formed at both ends of the chuck portion 74 and the Y-axis direction, and the recessed portions 276 are prepared separately from the main body portion of the chuck portion 74. 278 is assembled by an adhesive or the like. In this example, since there is no protrusion on the surface at the time of molding in the main body portion of the chuck portion 74, it can be processed with desired external dimensions with high accuracy. In addition, if the Hoso 278 is not a brittle material, it is also resistant to chipping.

  Further, in the example shown in FIG. 16, the magnet 374 is embedded on the lower surface side of the chuck portion 74. In this case, by forming the base portion 72 of a magnetic material, it is possible to prevent the chuck portion 74 from being lifted or dropped. In this case, the chucks 74 may not be connected. The chucks 74 may be connected in order to make the prevention of the floating and falling of the chucks 74 more reliable. Alternatively, the magnet 374 of the chuck portion 74 may be temporarily fixed to the base portion 72, and the chuck portion 74 may be attracted and held to the base portion 72.

  Further, in the example shown in FIGS. 12 to 14, each chuck portion 74 is fastened to the surface plate portion 50 by the band 178, but as shown in FIG. Each chuck portion 74 may be fastened. Also, as shown in FIG. 18, instead of the band 178 (see FIG. 13) and the wire rope 476 (see FIG. 17), a single bar 576 is inserted between the adjacent chuck portions 74. It is good. In this case, the recess 578 formed at the end of the chuck portion 74 in the Y-axis direction may be formed into a triangular shape in cross section so that one bar 576 straddles the pair of chuck portions 74.

  Next, the suction holding structure of the chuck portion 74, the suction holding structure of the substrate P, and the floating support structure of the substrate P in the fine movement stage 22 described above will be described with reference to FIG. As described above, the pipeline portion 60 of the fine movement stage 22 is configured by the plurality of pipes 62. As shown in FIG. 7, a suction pipe 62 a for supplying a vacuum suction force for suctioning the chuck portion 74 and a suction pipe for supplying a vacuum suction force for suctioning the substrate P to the plurality of pipes 62. 62b, an exhaust pipe 62c for supplying pressurized gas for floating the substrate P, and a pipe 62d disposed in a gap between the pipes 62a to 62c. The pipe 62d is not supplied with a vacuum suction force or pressurized gas, and functions as a member for supporting the plurality of base portions 72 together with the pipes 62a to 62c. In FIG. 7, an example in which the chuck portion 74 is placed on the five pipes 62 (two pipes 62 a, one pipe 62 b and two pipes 62 c) via the base portion 72 ((the pipe 62 a is two and the pipe 62 b is one). Although an example in which five pipes and one set of pipes 62 are arranged corresponding to one chuck portion 74 is shown, the number, combination, arrangement and the like of each of the pipes 62a to 62c are not limited to this. Changes are possible. Further, instead of providing the suction pipe 62b and the exhaust pipe 62c, it is also possible to provide a combined pipe 62e having the same function.

  As shown in FIG. 10, a plug 64 is fitted in one end (in the present embodiment, the end on the -Y side in the present embodiment) of the pipe 62b for suctioning a substrate. Further, a plug 66 with a joint (hereinafter simply referred to as a “joint 66”) is fitted into the other end of the pipe 62b in the longitudinal direction. A vacuum suction force (see black arrows in FIG. 10) is supplied to the joint 66 from the outside of the fine movement stage 22 via a pipe line member (a tube or the like) (not shown) (the inside of the pipe 62b is in a vacuum state). When the dual purpose pipe 62e is provided, the vacuum suction force and the pressurized gas are switchably supplied.

  A plurality of through holes 68 are formed on the upper surface of the pipe 62b. Further, in the base portion 72 of the holder portion 70, a through hole 72b is formed at a position where the through hole 68 and the position in the XY plane are substantially the same when placed on the pipe 62b. Furthermore, in the chuck portion 74 of the holder portion 70, a through hole 74f is formed at a position where the through holes 68, 72b and the positions in the XY plane are substantially the same in a state of being mounted on the base portion 72. . The through holes 68, 72b and 74f communicate with each other, and when the vacuum suction force is supplied into the pipe 62b, the peripheral wall 74b of the upper surface of the chuck 74 via the through holes 68, 72b and 74f (see FIG. The vacuum suction force is supplied to the space enclosed by 9). Thereby, fine movement stage 22 sucks and holds substrate P (see FIG. 1) mounted on chuck portion 74.

  The strength of the vacuum suction force supplied to the through holes 68, 72b and 74f may be changed according to the position in the fine movement stage. By strengthening the strength of the vacuum suction force supplied to the through holes 68, 72b and 74f arranged at the central portion of the fine movement stage 22, the air pool generated at the central portion of the substrate P can be eliminated. In addition, when the air pool disappears, the strength of the vacuum suction may be weakened. In addition, the vacuum suction force supplied to the through holes 68, 72b, 74f arranged in the central part of the fine movement stage 22 is faster than the through holes 68, 72b, 74f arranged in the peripheral part of the fine movement stage 22, that is, the time difference You may put it on and supply it. Here, as shown in FIG. 11, the through hole 74 f is formed to penetrate the pin 74 d (thick pin), and the vacuum suction force from the pipe 62 b is supplied to the lower surface side of the chuck portion 74. I have not.

  Although FIG. 9 shows an example in which two through holes 74f are formed in the chuck portion 74, the number and arrangement of the through holes 74f (the same as the corresponding through holes 68 and 72b) are It is not limited and can be changed appropriately. The diameters of the through holes 68, 72b and 74f may be different from each other. The diameter of the lower through hole is increased, that is, the diameter of the through hole 68 is larger than the diameter of the through hole 74f, and conversely, the diameter of the upper through hole is increased. In other words, the diameter of the through hole 74 f may be made larger than the diameter of the through hole 68. This facilitates alignment when stacking (loading) the chuck 74, the base 72, and the pipe 62b. In addition, the diameters of the through holes 68, 72b, 74f may be increased as much as the through holes 68, 72b, 74f located near the center of the fine adjustment stage. In addition, the diameters of the through holes 68, 72b, and 74f may be larger as they are closer to the plug 64 in the Y-axis direction.

  The suction holding structure of the chuck portion 74 is configured substantially the same as the suction holding structure of the substrate P. That is, the plug 64 and the joint 66 are respectively fitted to both ends of the chuck portion suction pipe 62a, and a vacuum suction force is supplied from the outside of the fine movement stage 22 through the joint 66 into the pipe 62a. A through hole is formed on the upper surface of the pipe 62a (see FIG. 7), and the peripheral wall 74e of the lower surface of the chuck 74 via the through hole and the through hole formed in the base 72 (see FIG. 7). A vacuum suction force is supplied to the space enclosed by (see FIG. 11). The reference symbol D in FIG. 11 indicates a region corresponding to the through hole formed in the base portion 72, and it can be seen that the vacuum suction force is supplied to a position not overlapping the pins 74c and 74d.

  In the above embodiment, the method (configuration) for vacuum suction is described as the method (configuration) for fixing to the base portion 72 of the chuck portion 74, but the method for fixing the chuck portion 74 is not limited to suction. There is not. For example, the chuck portion 42 may be fixed to the base portion 72 by bonding a part of the back surface of the chuck portion 74 to the base portion 72 with an adhesive. In this case, the performance required for the adhesive for bonding the chuck portion 74 and the base portion 72 is that both are easy to peel off and hard to shift. When the adhesive cures, it is required to be very hard and expand, and the adhesive does not lift the chuck portion 74 from the base portion 72, that is, it does not cause a step. Since the flatness of the upper surface of the chuck portion 42 is determined by the close contact between the back surface of the chuck portion 74 and the base portion 72, the adhesive is paste-like before hardening and enters the groove portion of the back surface of the chuck portion 42. For example, it is preferable to use a moisture-curable releasable deformable silicone sealant or the like.

  Further, as a method of fixing the chuck portion 74 to the base portion 72, the above-mentioned method by vacuum suction may be used in combination with the method by adhesion.

  Since air can not be taken in and out from the place where the adhesive is applied to the chuck portion 74, when applying an adhesive on the back surface of the chuck portion 74, a flow path of air for attracting and holding the substrate P and Apply to a position where the suction hole is not blocked.

  In addition, a magnet is built in the inside of the chuck portion 74, and the base portion 72 (see FIG. 2 etc.) is formed of a magnetic material, and the chuck portion 474 is fixed to the base portion 72 by the magnetic force of the magnet. It is good.

  It is also conceivable to reverse the relationship between the magnet and the magnetic material to form the chuck portion 74 of a magnetic material and provide the magnet on the base portion 72. In this case, the magnetic material is, for example, metal. In some cases, static electricity is likely to be generated on the surface of the chuck portion 74, so it is necessary to take measures against static electricity (utilization of a static elimination device). Further, it is necessary to take measures against heat such as irradiation heat by the exposure light and heat transmitted from the stage, and temperature control (use of a cooling gas).

  When the chuck portion 74 can not be held by suction (vacuum suction) on the base portion 72 during transportation or assembly of the apparatus, the chuck portion 74 does not shift from the base portion 72 using the above-described adhesive or magnet. You may make it (it does not remove).

  The floating support structure of the substrate P is also configured substantially the same as the suction holding structure of the substrate P. That is, when the pressurized gas is supplied to the pipe 62c for floating the substrate, the through hole formed in the vibrator 62c, the through hole of the base portion 72 communicating with the through hole, and the through hole of the chuck portion 74. Pressurized gas is supplied into the peripheral wall 74b via 74g (see FIG. 9). Thereby, fine movement stage 22 can lift substrate P (see FIG. 1) placed on chuck portion 74 from below. As described above, the substrate P is held by suction by the pipe portion 60, the base portion 72, and the chuck portion 74, and is planarly corrected along the substrate mounting surface. That is, it can be said that the three-layer structure of the channel portion 60, the base portion 72, and the chuck portion 74 has the function of the substrate holder.

  Fine movement stage 22 may have a levitation pin for levitating substrate P from chuck portion 74 using a mechanical member. The floating pin has a surface that abuts on the substrate P, and is constituted by a member on a rod that supports the surface. The surface of the floating pin and the upper surface of the chuck portion 74 form a substrate mounting surface. In addition, the floating pins function as a floating prevention structure of the chuck portion 74 by being disposed between each of the chuck portions 74. The number and arrangement of the floating pins are not particularly limited.

  In addition, although the pipeline part 60 was demonstrated as a structure provided with the several pipe 62, a groove is provided in one or several plate-shaped member, and this groove is covered with the surface plate part 50 and / or the base part 72. It is also possible to form a flow path through which pressurized gas (such as compressed air) flows, or to form a flow path to which a vacuum suction force is supplied (the air in the space is vacuum drawn). .

  In liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, substrate P is loaded onto fine movement stage 22 by the plate loader (not shown) under the control of the main controller (not shown). At the same time, alignment measurement is performed using an alignment detection system (not shown), and after completion of the alignment measurement, step-and-scan exposure operations are sequentially performed on a plurality of shot areas set on the substrate P. Since this exposure operation is the same as the exposure operation of the step-and-scan method conventionally performed, the detailed description thereof is omitted.

  At the time of alignment measurement and scanning exposure, fine movement stage 22 sucks and holds substrate P. The fine adjustment stage 22 is mounted on the lower surface of the substrate P, for example, during a prealignment operation before the substrate P to be exposed is placed on the substrate mounting surface, or when unloading the exposed substrate P to an external device. The pressurized gas is ejected to release the adsorption of the substrate P from the substrate mounting surface.

  According to the fine movement stage 22 (substrate holder) according to the present embodiment described above, the substrate mounting surface (substrate holding surface is formed by laying the plurality of chuck portions 74 in a tile shape on the plane formed by the plurality of base portions 72 Since the surface is formed, the flatness of the substrate mounting surface can be easily secured only by processing the thickness of each chuck portion 74 with high accuracy. Further, since the chuck portion 74 is smaller than the size of the substrate P, it is easy to process with high accuracy and good flatness. Further, as the chuck portion 74, it is easy to use a ceramic material which is light in weight and high in rigidity but difficult to be enlarged.

  Further, in the substrate stage device 20, replacement of the fine movement stage 22 is efficient because it is possible to replace only the desired chuck portion 74 without having to replace the entire substrate mounting portion.

  Moreover, since each chuck | zipper part 74 is fixed to the base part 72 by vacuum suction, adsorption | suction force can be uniformly applied to the chuck | zipper part 74. FIG. Therefore, deformation of the chuck portion 74 can be suppressed.

  Further, since the base plate portion 50 which is the lowermost layer of the fine movement stage 22 is formed of a honeycomb structure, the fine movement stage 22 is lightweight, has high rigidity, and can hold the substrate P with good flatness.

  In addition, since fine adjustment stage 22 has pipe line portion 60 disposed (inserted) between surface plate portion 50 and base portion 72, base portion 72 is different from the case where the pipe line member is separately connected to holder 70. , And the arrangement (including the replacement) of the chuck portion 74, the assembly of the fine movement stage 22 is easy.

  Although fine movement stage 22 has been described as a four-layer structure of surface plate 50, channel 60, base 72, and chuck 74, the upper surface of channel 60 is as flat as the upper surface of base 72. The base portion 72 may not be stacked on the conduit portion 60. In this case, it can be said that fine movement stage 22 has a three-layer structure of surface plate portion 50, channel portion 60, and chuck portion 74.

  Next, an assembly procedure of fine movement stage 22 and a method of replacing chuck portion 74 will be described. The fine adjustment stage 22 is assembled, for example, by mounting the holder portion 70 on the conduit portion 60 after the conduit portion 60 is mounted on the surface plate portion 50. As described above, the holder portion 70 is formed by laying the plurality of base portions 72 to form a flat surface having a high degree of flatness, and laying the plurality of chuck portions 74 on the flat surface.

  Here, each of the plurality of chucks 74 is processed with high precision so that the thickness is uniform, but since the number of chucks 74 is large, the thickness of all the chucks 74 should be strictly uniform. Can be difficult.

  Therefore, as shown in FIG. 19, after the plurality of chucks 74 are laid on the plane formed by the plurality of base portions 72, the surface (substrate mounting surface) formed by the plurality of chucks 74 is provided. The substrate mounting surface is processed into a plane of high accuracy (flatness) by lapping. In the present embodiment, since the object to be processed is the large-sized fine movement stage 22, the lapping is performed by handling in which the lapping tool 98 is manually moved with respect to the object to be processed. Thus, fine movement stage 22 having a substrate mounting surface with a very high degree of flatness can be manufactured without strictly controlling the thickness of each of the plurality of chuck portions 74. In addition, as described above, the joint between the adjacent base portions 72 is waterproofed using a joint material (see FIG. 10) or the like so that the moisture used at the time of handling does not penetrate below the chuck portion 74. It is preferable to do. Further, although FIG. 19 shows the case where lapping is performed in a state where each chuck portion 74 is held by vacuum suction with respect to the base portion 72, the suction holding may not necessarily be performed.

  Further, since the chuck portion 74 is formed with a plurality of small diameter pins 74a in contact with the substrate P, there is a possibility that breakage of the pins 74a or loss of surface processing (such as film) may occur. As described above, in the present embodiment, only the chuck portion 74 in which the defect occurs can be replaced by pinpoints, which is efficient, but the chuck portion 74 mounted after replacement and other (existing) chuck portions There is a possibility that a slight level difference may occur between them and 74.

  In the example shown in FIG. 20, the replacement chuck portion 174 is thinner than the existing chuck portion 74. An adhesive is applied to the lower surface of the chuck portion 174 along the outer periphery (the tip of the peripheral wall portion 74e). Also, the adhesive is applied so as to surround the holes for gas supply and vacuum suction formed in the chuck portion 174. As shown in FIG. 24, a groove is formed around the tip of the peripheral wall 74e and the hole formed in the pin 74d, and an adhesive is applied to the groove. The adhesive preferably cures when exposed to air and is easy to peel off after curing. The adhesive application groove may be formed in the base portion 72.

  As shown in FIG. 21, since the chuck portion 174 is thinner than the other chuck portions 74, a step is formed between the chuck portions 174 and the chuck portion 74. Therefore, a plate 98 made of ceramics is bridged between a pair of chuck portions 74 adjacent to the chuck portion 174 for replacement. The plate 98 may be a material other than ceramics as long as it is a substantially rigid body. Since the chuck portion 174 is thinner than the chuck portion 74, a gap is formed between the upper surface of the chuck portion 174 and the lower surface of the plate 98.

  Next, as shown in FIG. 22, compressed air is supplied from a base portion 72 disposed below the chuck portion 174. A plurality of the flow paths are formed in the base portion 72 along the longitudinal direction of the pipe 62 (here, the Y-axis direction), and a portion of the flow path is formed thin on the upper surface side. And, as shown in FIG. 24, on the lower surface of the replacement chuck portion 174, a bearing surface 74h is formed which protrudes downward similarly to the pin 74c, and the above-mentioned compressed air is formed at the tip of the bearing surface 74h. It is spouted against. Thereby, as shown in FIG. 22, the chuck portion 174 floats on the base portion 72 by the static pressure of the compressed air and adheres to the lower surface of the plate 98. In this state, when a predetermined time passes, the adhesive cures. The adhesive functions as a part of the peripheral wall 74 e after curing and as a conduit for gas supply and gas suction.

  Then, as shown in FIG. 23, when the plate 98 installed between the pair of chuck parts 74 is removed, the height position of the surface of the chuck part 174 substantially corresponds to the height position of the other chuck part 74 surface. It will be in the state of agreement. As a result, the overall flatness of the substrate mounting surface formed by the plurality of chuck portions 74 and the replacement chuck portion 174 is secured. According to the replacement direction of the chuck portion 74 described above, it is possible to easily replace only the desired chuck portion 74 (a part of the substrate mounting surface) without removing the fine movement stage 22 from the substrate stage device 20.

  The positioning and fixing procedures of the replacement chuck portion 174 are not limited to this. In the example shown in FIG. 26, a plug 94 which can be easily removed from above is attached to a through hole 74f (see FIG. 9) formed in the chuck portion 174 for vacuum suction. In addition, a pipeline for ejecting pressurized gas for floatingly supporting the substrate P is formed inside the pin 74i somewhat thicker than the other pins 74a, and the tip of the pin 74i is pressurized A hole 74g for gas ejection is open. In this case, as shown in FIG. 25, a joint 98 a for vacuum suction is connected to the plate 98, and the replacement chuck portion 174 is vacuum-suctioned from the upper surface side to thereby form another chuck portion 74. And the height position of the upper surface are aligned. The plug 94 is removed after the adhesive cures. According to this embodiment, unlike the above-described embodiment (see FIG. 24 and the like), it is not necessary to perform processing for air flow on the back surface of the base portion 72 and the chuck portion 174.

  Further, in the example shown in FIGS. 27 and 28, a plurality of screw holes penetrating in the thickness direction are formed in the replacement chuck portion 174, and a set screw 74j is screwed in the screws. . Further, in the plate 98, a tool hole 98b having a diameter larger than the screw diameter of the set screw 74j is formed in the thickness direction at a position coinciding with the screw hole. In this example, when the tool 98c is inserted from the tool hole 98b and the set screw 74j is turned, the tip of the set screw 74j abuts against the base 72 and then the chuck 174 lifts from the base 72 and adheres to the plate 98. . In this example, air (high pressure, vacuum pressure) is not required to align the surface position of the upper surface of the chuck portion 174 for replacement with the surface position of the upper surface of the existing chuck portion 74. Is easy. In the example shown in FIGS. 27 and 28, since the height position of the upper surface of the chuck portion 174 is mechanically defined by the set screw 74j, the adhesive for bonding the chuck portion 174 and the base portion 72 is The material is not limited to a curable material, and may be an elastic material such as a caulking agent.

  The configuration of the fine movement stage 22 or the like according to the embodiment described above is an example, and can be changed as appropriate. Like the chuck portion 474 according to the modification shown in FIG. 29, the entire chuck portion 474 may be formed of a porous material. The substrate P may be held by suction by supplying a vacuum suction force to the porous material. In this case, it is preferable that a magnet be contained inside the chuck portion 474, the base portion 72 (see FIG. 2 and the like) be formed of a magnetic material, and the chuck portion 474 be fixed (fixed) to the base portion 72 by magnetic force.

  Further, as a method of fixing the chuck portion 474 formed of a porous material to the base portion 72, the method using the above-mentioned adhesive may be used. In addition, a vacuum-suctionable region (for example, a hollow portion is formed in a part of the lower surface of the porous chuck portion 474, and a member (rubber) that prevents air leakage so that air leakage does not occur in the hollow portion In the case where the space etc. capable of vacuum suction is formed by coating etc.), they may be fixed by vacuum suction. Further, as described above, by forming the chuck portion 474 with a porous material and supplying the pressurized gas to the porous material, it is possible to obtain a non-contact holder for floatingly supporting the substrate P. On the upper surface (substrate mounting surface) of the chuck portion 474 formed of a porous material, a plurality of minute holes communicating with the conduit portion 60 are formed. The non-contact holder 32 causes the substrate P to float by spouting pressurized gas (for example, compressed air) supplied from the conduit 60 onto the lower surface of the substrate P via (a part of) the holes. In addition, the noncontact holder sucks the air between the lower surface of the substrate P and the substrate support surface by the vacuum suction force in combination with the ejection of the pressurized gas. Thereby, a load (preload) acts on the substrate P, and the substrate P is planarized along the upper surface of the non-contact holder. That is, the substrate P can be float-supported (non-contact supported) on the chuck portion 474 while correcting the surface of the substrate P (flattening).

  Further, as in the modification shown in FIG. 30, in order to prevent collision of the adjacent chucks 74, a buffer member 676 may be inserted between the adjacent chucks 74. The buffer member 676 may be formed of a visco-elastic body.

  The configuration of the embodiment described above can be changed as appropriate. In the above embodiment, fine movement stage 22 can selectively perform non-contact support of substrate P (jetting of pressurized gas to the lower surface of substrate P) and adsorption holding of substrate P (vacuum suction of substrate P). The configuration is not limited to this, and only one of these functions may be performed.

  Further, in the above embodiment, each chuck portion 74 is configured to be fixed to the base portion 72 by vacuum suction (fixed in a state not mechanically restrained), but the present invention is not limited thereto. The base portion 72 may be fixed by an adhesive or the like. In this case, in order to secure the stability of the chuck portion 74 and the ease of replacement, as the above-mentioned adhesive, an adhesive which has little deformation at the time of curing and which can be easily peeled off, for example, epoxy resin type It is preferred to use an adhesive. In this case, in order to facilitate peeling from the base portion 72, it is preferable to apply a release agent and a release agent to the base portion 72 or the chuck portion 74 in advance. As the release agent and the release agent, it is preferable to use a fluorine-based release agent having a thin coating film (for example, about 0.1 to 1.0 μm) and low surface tension.

  In addition, although fine movement stage 22 of the present embodiment is movable with long stroke in two axial directions in the horizontal plane, it is not limited to this, and it is configured to be movable with long stroke only in one axial direction in the horizontal Also, the position in the horizontal plane may be fixed. The fine movement stage 22 is configured to be able to move minutely in the direction of six degrees of freedom in the horizontal plane, but the configuration of the above embodiment may be applied to a substrate holding member (substrate holder) configured not to move slightly.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As illumination light, single-wavelength laser light in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with erbium (or both erbium and ytterbium), A harmonic wave converted to ultraviolet light using a non-linear optical crystal may be used. Also, a solid state laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In addition, although the case where the projection optical system 14 is a multi-lens type projection optical system including a plurality of optical systems has been described, the number of projection optical systems is not limited to this and it is sufficient if one or more. Further, the projection optical system is not limited to the multilens type projection optical system, and may be a projection optical system using a large offner type mirror. The projection optical system 14 may be a magnifying system or a demagnifying system.

  Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal which transfers a liquid crystal display element pattern to a square glass plate, and an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, for semiconductor manufacturing The present invention can be widely applied to an exposure apparatus for producing an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip and the like. In addition, in order to manufacture not only micro devices such as semiconductor devices but also masks or reticles used in light exposure devices, EUV exposure devices, X-ray exposure devices, electron beam exposure devices, etc., glass substrates or silicon wafers etc. Can also be applied to an exposure apparatus for transferring a circuit pattern to

  Further, the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and a film-like (sheet-like member having flexibility) is also included. Note that the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target.

  Electronic devices such as liquid crystal display elements (or semiconductor elements) are subjected to functional function / performance design of the device, fabrication of a mask (or reticle) based on the design steps, fabrication of a glass substrate (or wafer) An exposure apparatus according to each of the above-described embodiments, a lithography step of transferring a pattern of a mask (reticle) to a glass substrate by the exposure method, a development step of developing an exposed glass substrate, and portions other than resist remaining portions. It is manufactured through an etching step of etching away the exposed member of the portion, a resist removing step of removing the unnecessary resist after etching, a device assembling step, an inspection step and the like. In this case, in the lithography step, the exposure method described above is performed using the exposure apparatus of the above embodiment, and the device pattern is formed on the glass substrate, so that a device with high integration can be manufactured with high productivity. .

  As described above, the object holding device of the present invention is suitable for holding an object. Further, the exposure apparatus of the present invention is suitable for forming a predetermined pattern on an object. Also, the method of manufacturing a flat panel display of the present invention is suitable for manufacturing a flat panel display. In addition, the device manufacturing method of the present invention is suitable for manufacturing micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid-crystal exposure apparatus, 20 ... Substrate stage apparatus, 22 ... Fine movement stage, 50 ... Plated part, 60 ... Pipe part, 70 ... Holder part, 72 ... Base part, 74 ... Chuck part, P ... Substrate.

Claims (17)

An object holding device for holding an object, wherein
A plurality of first members each provided with a first holding surface for holding the object, and first and second portions provided at mutually different positions on the back surface side of the first holding surface;
A second member having a second holding surface for holding the first member, the second portion of the first portion and the second portion being fixed to the second holding surface;
And the base
And a conduit portion provided between the base portion and the second member and having a conduit communicating with the first portion of the first member via the second member to allow gas to pass therethrough. ,
The first member holds the object using the gas passing through the first portion, and when the adhesion of the second portion to the second holding surface is released, the object is removed from the second member. apparatus.   The object holding device according to claim 1, wherein the second portion is attracted to the second holding surface.   The object holding device according to claim 2, wherein the second portion comprises a structure to be vacuum-sucked.   The second portion has a plurality of pin portions capable of holding the lower surface of the object at a plurality of points, a wall portion surrounding the plurality of pin portions, and a hole formed inside the wall portion. The object holding device according to claim 2 or 3, wherein the object is adsorbed and held by sucking the gas in the wall through the hole. The pipeline section is
A first conduit for passing gas holding the object;
The object holding device according to any one of claims 2 to 4, further comprising: a second pipe line for passing a gas which causes the second holding surface to adsorb the second portion.   The object holding device according to any one of claims 1 to 5, wherein at least a part of the second portion is adhered to the second holding surface by an adhesive.   The object holding device according to any one of claims 1 to 3, wherein the first member is formed of a porous material.   The object holding device according to claim 2 or 7, wherein one of the second portion and the second holding surface is provided with a magnet, and the other is provided with a magnetic material. The second member can be divided into a plurality of partial members,
The object holding device according to any one of claims 1 to 8, wherein an area of the first member is smaller than an area of the partial member.   The object holding device according to any one of claims 1 to 9, wherein the first member sucks gas from the first holding surface and sucks and holds the object on the first holding surface.   The object holding device according to any one of claims 1 to 9, wherein the first member jets gas from the first holding surface to float and support the object on the first holding surface. An object holding device according to any one of claims 1 to 11,
An exposure apparatus comprising: a pattern forming apparatus for forming a predetermined pattern on the object held by the object holding apparatus using an energy beam;   The exposure apparatus according to claim 12, wherein the object is a substrate used for a flat panel display.   The exposure apparatus according to claim 13, wherein the substrate has a length or a diagonal length of at least 500 mm on one side. Exposing the substrate using the exposure apparatus according to claim 12 or 13;
Developing the exposed substrate. Exposing the object using the exposure apparatus according to claim 14;
Developing the exposed object. An object holding method for holding an object, comprising
The object is formed using a plurality of first members each including a first holding surface for holding the object, and first and second portions provided at mutually different positions on the back surface side of the first holding surface. Holding and
A second holding surface for holding the first member, the second member of the first and second portions being fixed to the second holding surface; Holding the first member;
The gas is provided using a conduit provided between the base portion and the second member and having a conduit communicating with the first portion of the first member via the second member to allow gas to pass therethrough. Passing through, and
Holding the object with the plurality of first members includes holding the object with the gas passing through the first portion,
Releasing the adhesion of the second portion to the second holding surface to remove the first member from the second member.

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