TW200727338A - Substrate processing apparatus and substrate processing method and substrate processing program - Google Patents

Substrate processing apparatus and substrate processing method and substrate processing program

Info

Publication number
TW200727338A
TW200727338A TW095108195A TW95108195A TW200727338A TW 200727338 A TW200727338 A TW 200727338A TW 095108195 A TW095108195 A TW 095108195A TW 95108195 A TW95108195 A TW 95108195A TW 200727338 A TW200727338 A TW 200727338A
Authority
TW
Taiwan
Prior art keywords
substrate processing
area
substrate
coating
stage
Prior art date
Application number
TW095108195A
Other languages
Chinese (zh)
Other versions
TWI305659B (en
Inventor
Yoshiharu Ota
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200727338A publication Critical patent/TW200727338A/en
Application granted granted Critical
Publication of TWI305659B publication Critical patent/TWI305659B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Abstract

The stage 76 is divided into five areas that are the carrying-in area M1, the changes area M2, the coating area M3, the changes area M4, and the taking-out area M5 in the direction of a long neighborhood (X directions). The coating area M3 is making the blowing port 88 of positive pressure, and the suction port 90 of negative pressure intermingled, and can hold the surfacing altitude Hb of the substrate G to a setting value in high accuracy. In case the substrate G passes through this coating area M3, the resist liquid R is supplied on it from the upper resist nozzle 78. The resist nozzle 78 has the nozzle body of a long shape prolonged in the direction of Y by the length which can cover the substrate G on a stage 76 from an end to other ends, and moves in the opposite direction from the 1st position to the 2nd position with the conveyance direction of the substrate G at the time of coating process.
TW095108195A 2005-03-10 2006-03-10 Substrate processing apparatus and substrate processing method TWI305659B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005067082A JP4571525B2 (en) 2005-03-10 2005-03-10 Substrate processing apparatus and substrate processing method

Publications (2)

Publication Number Publication Date
TW200727338A true TW200727338A (en) 2007-07-16
TWI305659B TWI305659B (en) 2009-01-21

Family

ID=37093541

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108195A TWI305659B (en) 2005-03-10 2006-03-10 Substrate processing apparatus and substrate processing method

Country Status (3)

Country Link
JP (1) JP4571525B2 (en)
KR (2) KR101154756B1 (en)
TW (1) TWI305659B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661505B (en) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method
TWI685911B (en) * 2011-05-13 2020-02-21 日商尼康股份有限公司 Object exchange system, object exchange method, and exposure apparatus
TWI807413B (en) * 2020-09-25 2023-07-01 日商斯庫林集團股份有限公司 Substrate processing method

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JP4884871B2 (en) * 2006-07-27 2012-02-29 東京エレクトロン株式会社 Coating method and coating apparatus
JP4318714B2 (en) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 Coating device
JP2009018917A (en) * 2007-07-12 2009-01-29 Tokyo Ohka Kogyo Co Ltd Application device, substrate delivery method and application method
KR100874611B1 (en) 2007-08-13 2008-12-17 주식회사 케이씨텍 The meathod of multi layer coatings
KR100891723B1 (en) * 2007-09-19 2009-04-03 주식회사 엠엠티 Non-Contact Panel Cleaning Apparatus
JP4495752B2 (en) 2007-11-06 2010-07-07 東京エレクトロン株式会社 Substrate processing apparatus and coating apparatus
JP2010034309A (en) * 2008-07-29 2010-02-12 Dainippon Screen Mfg Co Ltd Coating apparatus and substrate processing system
KR101341013B1 (en) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 Washing device
JP4787872B2 (en) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 Substrate transfer processing equipment
KR101071583B1 (en) 2009-08-21 2011-10-10 주식회사 케이씨텍 Inline type substrate coater apparatus
KR101051767B1 (en) * 2009-09-01 2011-07-25 주식회사 케이씨텍 Floating Board Coater Device
JP5010019B2 (en) * 2010-09-09 2012-08-29 東京エレクトロン株式会社 stage
JP5663297B2 (en) * 2010-12-27 2015-02-04 東京応化工業株式会社 Coating device
KR102096956B1 (en) * 2011-12-22 2020-04-06 세메스 주식회사 Apparatus and Method for treating substrate
KR102190687B1 (en) * 2014-12-08 2020-12-15 엘지디스플레이 주식회사 slit coaster system
JP2018043200A (en) * 2016-09-15 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス Coating applicator and application method
JP6860356B2 (en) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス Coating device and coating method
JP6860357B2 (en) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス Coating device and coating method
TW202021424A (en) * 2018-08-22 2020-06-01 日商東京威力科創股份有限公司 Drawing device and drawing method
KR102262080B1 (en) * 2019-08-22 2021-06-07 세메스 주식회사 Apparatus for treating substrate
WO2022209197A1 (en) * 2021-03-31 2022-10-06 東京エレクトロン株式会社 Coating processing device, coating processing method, and coating processing program

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Publication number Priority date Publication date Assignee Title
JPH0455347A (en) * 1990-06-20 1992-02-24 Konica Corp Method and device for applying oily resin solution
JP2002346463A (en) * 2001-05-24 2002-12-03 Toppan Printing Co Ltd Sheet glass coating device
JP2003290697A (en) * 2002-04-02 2003-10-14 Toppan Printing Co Ltd Device for continuously coating single sheet
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2004273714A (en) 2003-03-07 2004-09-30 Tokyo Electron Ltd Equipment and method for substrate treatment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661505B (en) * 2010-02-17 2019-06-01 日商尼康股份有限公司 Transfer device, transfer method, exposure device, and component manufacturing method
TWI777060B (en) * 2010-02-17 2022-09-11 日商尼康股份有限公司 Conveyor device, exposure device, and device manufacturing method
TWI685911B (en) * 2011-05-13 2020-02-21 日商尼康股份有限公司 Object exchange system, object exchange method, and exposure apparatus
TWI739271B (en) * 2011-05-13 2021-09-11 日商尼康股份有限公司 Object holding apparatus, object exchange system, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
TWI807413B (en) * 2020-09-25 2023-07-01 日商斯庫林集團股份有限公司 Substrate processing method
US11742211B2 (en) 2020-09-25 2023-08-29 SCREEN Holdings Co., Ltd. Substrate processing method

Also Published As

Publication number Publication date
KR20110131149A (en) 2011-12-06
KR20060097659A (en) 2006-09-14
KR101154756B1 (en) 2012-06-08
JP2006253373A (en) 2006-09-21
TWI305659B (en) 2009-01-21
KR101188077B1 (en) 2012-10-08
JP4571525B2 (en) 2010-10-27

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