JP2014165322A - Exposure substrate conveyance device - Google Patents

Exposure substrate conveyance device Download PDF

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JP2014165322A
JP2014165322A JP2013034764A JP2013034764A JP2014165322A JP 2014165322 A JP2014165322 A JP 2014165322A JP 2013034764 A JP2013034764 A JP 2013034764A JP 2013034764 A JP2013034764 A JP 2013034764A JP 2014165322 A JP2014165322 A JP 2014165322A
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substrate
exposure
floating
transport
gripping
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JP6142217B2 (en
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Nobuhito Saji
伸仁 佐治
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NSK Technology Co Ltd
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NSK Technology Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a substrate conveyance mechanism in view of the foregoing situations, the substrate conveyance mechanism being able to reciprocate a substrate without dropping the substrate from the substrate conveyance mechanism.SOLUTION: An exposure substrate conveyance device 1 according to the present invention comprises: a substrate floating mechanism 3 configured to convey a substrate 2 while floating it by blowing air; a substrate gripping mechanism 5 configured to fix one end part or both end parts of the substrate 2 jutting out from the side faces of the substrate floating mechanism 3; and a substrate conveyance mechanism 6 provided adjacent to the side face of the substrate floating mechanism 3 and configured to reciprocate the substrate 2 in a direction along the positive and negative X axes via the substrate gripping mechanism 5.

Description

本発明は、露光装置用基板搬送機構に関し、例えば、液晶ディスプレイやプラズマディスプレイ等の大型のフラットパネルディスプレイの基板上にマスクのパターンを露光転写するのに好適な露光装置用基板搬送機構に関する。   The present invention relates to a substrate transport mechanism for an exposure apparatus, and more particularly to a substrate transport mechanism for an exposure apparatus suitable for exposing and transferring a mask pattern onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display.

大型の薄形テレビ等に用いられる液晶ディスプレイやプラズマディスプレイ等の大型のフラットパネルディスプレイは、基板をマスクに近接させて、基板上にマスクのパターンを分割逐次露光方式で露光転写することで製造される。従来のこの種の分割逐次露光装置としては、例えば、被露光材としての基板より小さいマスクを用い、該マスクをマスクステージで保持すると共に基板をワークステージで保持して両者を近接して対向配置し、この状態でワークステージをマスクに対してステップ移動させて各ステップ毎にマスク側から基板にパターン露光用の光を照射することにより、マスクに描かれた複数のマスクパターンを基板上に露光転写して一枚の基板に複数のディスプレイ等を作成するようにしたものが知られている。特に、特許文献１の技術では、基板に対して、それより小型のマスクと光源とを同期して移動させることで、大型の基板にマスクのパターンを露光できるようになっている。   Large flat panel displays such as liquid crystal displays and plasma displays used in large thin televisions are manufactured by bringing the substrate close to the mask and exposing and transferring the mask pattern onto the substrate using the division sequential exposure method. The As a conventional sequential sequential exposure apparatus of this type, for example, a mask smaller than the substrate as the material to be exposed is used, the mask is held on the mask stage and the substrate is held on the work stage, and both are placed close to each other. In this state, the work stage is moved stepwise with respect to the mask, and the substrate is exposed to light for pattern exposure from the mask side at each step, thereby exposing a plurality of mask patterns drawn on the mask onto the substrate. There is known one in which a plurality of displays and the like are created on a single substrate by transfer. In particular, in the technique of Patent Document 1, a mask pattern can be exposed on a large substrate by moving a smaller mask and a light source in synchronization with the substrate.

ところで、近接露光には、マスクを基板と同じ大きさにして一括で露光する方式があるが、このような方式では、大型基板上にマスクのパターンを露光転写する場合にマスクが大型化し、マスクの撓みによるパターン精度への影響やコスト面等で問題が生じる。このような事情から、従来においては、大型基板上にマスクのパターンを露光転写する場合には、基板より小さいマスクを用い、ワークステージをマスクに対してステップ移動させてステップ毎にマスクを基板に近接配置した状態でパターン露光光を照射し、これにより、マスクに描かれた複数のパターンを基板上に露光転写する、所謂ステップ式の近接露光方式が用いられる場合がある。   By the way, in proximity exposure, there is a method in which the mask is made the same size as the substrate and is exposed in a lump. However, in such a method, when the mask pattern is exposed and transferred onto a large substrate, the mask becomes large, and the mask This causes problems in terms of the influence on the pattern accuracy due to the bending of the pattern and the cost. Under these circumstances, conventionally, when a mask pattern is exposed and transferred onto a large substrate, a mask smaller than the substrate is used, the work stage is moved stepwise relative to the mask, and the mask is moved to the substrate for each step. There is a case where a so-called stepwise proximity exposure method is used in which pattern exposure light is irradiated in a state of being closely arranged, whereby a plurality of patterns drawn on a mask are exposed and transferred onto a substrate.

特開平１１−２３７７４４号公報     Japanese Patent Laid-Open No. 11-237744

このような露光装置において、露光用基板搬送機構には、基板リフトピンなどが取り付けられている。   In such an exposure apparatus, a substrate lift pin or the like is attached to the exposure substrate transport mechanism.

ところで、近年の基板の大型化に伴い、基板を隣接するリフトピンに渡す際に、基板を基板搬送機構に接触させ、基板を破損する恐れがある。   By the way, with the recent increase in size of a substrate, when the substrate is transferred to an adjacent lift pin, the substrate may be brought into contact with the substrate transport mechanism and the substrate may be damaged.

本発明は、上記事情に鑑みて為されたものであり、その目的は、基板搬送機構に接触させずに、基板を往復運動させることができる露光用基板搬送装置を提供することにある。 The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure substrate transport apparatus that can reciprocate a substrate without contacting the substrate transport mechanism.

本発明の上記目的は、下記の構成により達成される。
（１）基板の片端部もしくは両端部を把持する基板把持機構と、
前記基板把持機構を移動させる基板移動機構と、
前記基板を浮上させる基板浮上機構と、
を備え、
前記基板が媒質によって浮上され、かつ、前記基板移動機構が前記把持機構を往復運動させることを特徴とする露光用基板搬送装置。
（２）前記隣接する基板浮上機構の高さを段々低くすることを特徴とする（１）の露光装置用基板搬送装置。
（３）前記基板浮上機構の表面に傾斜を設けていることを特徴とする（１）の露光用基板搬送装置。
（４）前記基板浮上機構の隣に補機が設けられていることを特徴とする（１）から（３）の露光装置用基板搬送装置。
（５）前記基板を前記基板浮上機構から吹き出される前記媒質によって浮上させることを特徴とする（１）から（４）の露光装置用基板搬送装置。
（６）前記基板浮上機構を振動させて発生した超音波によって、基板を浮上させることを特徴とする（１）から（４）の露光装置用基板搬送装置。
（７）前記補機がローラまたは空気ノズルであることを特徴とする（４）の露光装置用基板搬送装置。
（８）前記媒質が気体であることを特徴とする（１）から（６）の露光装置用基板搬送装置。
（９）前記気体が空気であることを特徴とする（８）の露光装置用基板搬送装置。 The above object of the present invention can be achieved by the following constitution.
(1) a substrate gripping mechanism for gripping one or both ends of the substrate;
A substrate moving mechanism for moving the substrate gripping mechanism;
A substrate levitating mechanism for levitating the substrate;
With
An exposure substrate transport apparatus, wherein the substrate is levitated by a medium, and the substrate moving mechanism reciprocates the gripping mechanism.
(2) The substrate transport apparatus for an exposure apparatus according to (1), wherein the heights of the adjacent substrate floating mechanisms are gradually lowered.
(3) The substrate transport apparatus for exposure according to (1), wherein a surface of the substrate floating mechanism is inclined.
(4) The exposure apparatus substrate transfer apparatus according to any one of (1) to (3), wherein an auxiliary machine is provided next to the substrate floating mechanism.
(5) The substrate transfer apparatus for an exposure apparatus according to any one of (1) to (4), wherein the substrate is levitated by the medium blown from the substrate levitating mechanism.
(6) The substrate transport apparatus for an exposure apparatus according to any one of (1) to (4), wherein the substrate is levitated by ultrasonic waves generated by vibrating the substrate levitating mechanism.
(7) The substrate transport apparatus for an exposure apparatus according to (4), wherein the auxiliary machine is a roller or an air nozzle.
(8) The substrate transport apparatus for an exposure apparatus according to any one of (1) to (6), wherein the medium is a gas.
(9) The substrate transport apparatus for an exposure apparatus according to (8), wherein the gas is air.

本発明は、上記事情に鑑みて為されたものであり、その目的は、露光用基板搬送機構に基板を接触させないために、基板を媒質によって浮上させ、基板の端部を少なくとも１箇所以上を把持する把持手段を往復運動させる基板搬送機構を提供することにある。   The present invention has been made in view of the above circumstances, and its purpose is to prevent the substrate from coming into contact with the substrate transport mechanism for exposure, so that the substrate is levitated by a medium, and at least one end portion of the substrate is placed over the substrate. An object of the present invention is to provide a substrate transport mechanism for reciprocating a gripping means for gripping.

本発明の基板把持機構を使用した露光用基板搬送装置の実施例を示す概略斜視図。The schematic perspective view which shows the Example of the board | substrate conveyance apparatus for exposure using the board | substrate holding | grip mechanism of this invention. 図２（ａ）は露光用基板搬送装置の基板浮上機構の第一実施形態を示した断面模式図。図２（ｂ）は基板浮上機構の第一実施形態の変形例を示した断面模式図。FIG. 2A is a schematic cross-sectional view showing a first embodiment of a substrate floating mechanism of an exposure substrate transfer apparatus. FIG. 2B is a schematic cross-sectional view showing a modification of the first embodiment of the substrate floating mechanism. 図３（ａ）と図３（ｂ）とは第１実施形態における露光用基板搬送装置の具体的な浮上状態を示した説明図である。図３（ｃ）と図３（ｄ）とは第１実施形態の変形例における露光用基板搬送装置の具体的な浮上状態を示した説明図である。FIG. 3A and FIG. 3B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the first embodiment. FIG. 3C and FIG. 3D are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the modification of the first embodiment. 図４（ａ）は露光用基板搬送装置の基板浮上機構の第２実施形態を示した断面模式図。図４（ｂ）は基板浮上機構の第２実施形態の変形例を示した断面模式図。FIG. 4A is a schematic sectional view showing a second embodiment of the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 4B is a schematic cross-sectional view showing a modification of the second embodiment of the substrate floating mechanism. 図５（ａ）と図５（ｂ）とは第２実施形態における露光用基板搬送装置の具体的な浮上状態を示した説明図である。図５（ｃ）と図５（ｄ）とは第２実施形態の変形例における露光用基板搬送装置の具体的な浮上状態を示した説明図である。FIG. 5A and FIG. 5B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the second embodiment. FIG. 5C and FIG. 5D are explanatory views showing a specific floating state of the exposure substrate transport apparatus in a modification of the second embodiment. 図６（ａ）は露光用基板搬送装置の基板浮上機構の第３実施形態を示した断面模式図。図６（ｂ）は基板浮上機構の第３実施形態の変形例を示した断面模式図。FIG. 6A is a schematic cross-sectional view showing a third embodiment of the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 6B is a schematic cross-sectional view showing a modification of the third embodiment of the substrate floating mechanism. 図７（ａ）と図７（ｂ）とは第３実施形態における露光用基板搬送装置の具体的な浮上状態を示した説明図である。図７（ｃ）と図７（ｄ）とは第３実施形態の変形例における露光用基板搬送装置の具体的な浮上状態を示した説明図である。FIG. 7A and FIG. 7B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the third embodiment. FIG. 7C and FIG. 7D are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the modification of the third embodiment.

（第１実施形態）
以下、本発明の実施形態である基板把持構成を有する露光用基板搬送装置について図面に基づいて説明する。図１は露光用基板搬送装置の構成図である。
図２は露光用基板搬送装置の基板浮上機構を示した断面模式図。図３は搬送中の基板の具体的な浮上状態を示した説明図である。 (First embodiment)
Hereinafter, an exposure substrate transport apparatus having a substrate gripping configuration according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of an exposure substrate transfer apparatus.
FIG. 2 is a schematic cross-sectional view showing the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 3 is an explanatory view showing a specific floating state of the substrate being transported.

本発明に係る露光用基板搬送装置１は、空気の吹き出しにて基板２を浮上させながら搬送する基板浮上機構３と、基板浮上機構３の側面からはみ出した基板２の片端部及び両端部を固定する基板把持機構５と、基板浮上機構３との側面と隣接して設けられ、基板把持機構５を介して基板２を正負のＸ軸方向に往復運動する基板搬送機構６と、を備える。   An exposure substrate transport apparatus 1 according to the present invention fixes a substrate floating mechanism 3 that transports a substrate 2 while floating the substrate 2 by blowing air, and one end and both ends of the substrate 2 protruding from the side surface of the substrate floating mechanism 3. And a substrate transport mechanism 6 which is provided adjacent to the side surface of the substrate floating mechanism 3 and reciprocates the substrate 2 in the positive and negative X-axis directions via the substrate gripping mechanism 5.

次に基板浮上機構３の構造について図２（ａ）を使用して説明する。なお、図２（ａ）は基板浮上機構３の断面模式図である。   Next, the structure of the substrate floating mechanism 3 will be described with reference to FIG. FIG. 2A is a schematic cross-sectional view of the substrate floating mechanism 3.

本発明の露光用基板搬送装置１における基板浮上機構３は、矩形状の中空構造体であり、基板２と対向する基板浮上機構３の表面３ａから空気を吹き出すことによって、基板２を浮上させる事が可能となる。   The substrate floating mechanism 3 in the exposure substrate transport apparatus 1 of the present invention is a rectangular hollow structure, and the substrate 2 is floated by blowing air from the surface 3 a of the substrate floating mechanism 3 facing the substrate 2. Is possible.

本発明の露光用基板搬送装置１における基板搬送機構６は、図１に示すように、基板浮上機構３の片側もしくは両側に隣接して設けられ、Ｘ軸方向に沿って基板２をムラ無く一定速度で搬送する一軸の搬送機構である。例えば、リニアモーターとリニアガイドの組み合わせが適している。
しかしながら今後検査の要求精度が上がり超高分解能の検査機等に本搬送装置を適用させる場合などは、コアレスタイプのリニアモーターに空気浮上ガイド等を組み合わせいくことも考えられる。 As shown in FIG. 1, the substrate transport mechanism 6 in the exposure substrate transport apparatus 1 of the present invention is provided adjacent to one side or both sides of the substrate floating mechanism 3, and the substrate 2 is kept uniform along the X-axis direction. It is a uniaxial transport mechanism that transports at a speed. For example, a combination of a linear motor and a linear guide is suitable.
However, in the future, when the required accuracy of inspection will increase and this transport device will be applied to an ultra-high resolution inspection machine, it may be possible to combine an air levitation guide with a coreless type linear motor.

また、図２（ｂ）に示すように、第１実施形態の変形例として、基搬送浮上機構３の表面３ａから空気を吹き出す代わりに、基搬送浮上機構３をＺ軸方向に空気を振動させることにより発生した超音波によって、基板２を浮上させても良い。   Further, as shown in FIG. 2B, as a modification of the first embodiment, instead of blowing air from the surface 3a of the base transport levitation mechanism 3, the base transport levitation mechanism 3 is vibrated in the Z-axis direction. The substrate 2 may be levitated by the ultrasonic waves generated by this.

また、図３（ａ）に示すように、基板浮上機構３の表面３ａから吹き出される空気によって浮上した基板２が正のＸ軸方向に搬送される。基板浮上機構３と隣接する浮上機構３の間は、空気が吹き出していないため、基板２の先端部２ａは撓む。撓んだ基板２の先端部２ａは、隣接する基板浮上機構３の表面３a上に搬送される。図３（ｂ）に示すように、基板浮上機構３の表面３ａから吹き出される空気は、撓んだ基板２の先端部２ａを持ち上げる。そのため、基板２は平坦度を保ち浮上しながら、基板２は搬送させることができる。基板２を把持した基板把持機構５が正負のＸ軸方向に往復運動することができるため、正負のＸ軸方向に基板２を往復搬送させることができる。   As shown in FIG. 3A, the substrate 2 that has been levitated by the air blown from the surface 3a of the substrate levitating mechanism 3 is conveyed in the positive X-axis direction. Since air does not blow out between the substrate levitation mechanism 3 and the adjacent levitation mechanism 3, the tip 2a of the substrate 2 bends. The tip portion 2 a of the bent substrate 2 is conveyed onto the surface 3 a of the adjacent substrate floating mechanism 3. As shown in FIG. 3B, the air blown from the surface 3 a of the substrate floating mechanism 3 lifts the tip portion 2 a of the bent substrate 2. Therefore, the substrate 2 can be transported while floating while maintaining the flatness. Since the substrate gripping mechanism 5 that grips the substrate 2 can reciprocate in the positive and negative X-axis directions, the substrate 2 can be reciprocated in the positive and negative X-axis directions.

また、図３（ｃ）に示すように、基搬送浮上機構３をＺ軸方向に振動させることによって発生した超音波は、基板２を浮上させ搬送することができる。基板浮上機構３と隣接する浮上機構３の間は、超音波が発生していないため、基板２の先端部２ａは撓む。垂れた基板２の先端部２ａは、隣接する基板浮上機構３の表面３a上に搬送される。図３（ｄ）に示すように、基搬送浮上機構３をＺ軸方向に振動させることによって発生した超音波は、撓んだ基板２の先端部２ａを持ち上げる。そのため、基板２の平坦度を保ちながら浮上して、基板２を搬送させることができる。基板２を把持した基板把持機構５が正負のＸ軸方向に往復運動することができるため、正負のＸ軸方向に基板２を往復搬送させることができる。   Further, as shown in FIG. 3C, ultrasonic waves generated by vibrating the base transport levitation mechanism 3 in the Z-axis direction can float and transport the substrate 2. Since no ultrasonic wave is generated between the substrate levitation mechanism 3 and the adjacent levitation mechanism 3, the tip 2a of the substrate 2 bends. The tip portion 2 a of the substrate 2 that has drooped is conveyed onto the surface 3 a of the adjacent substrate floating mechanism 3. As shown in FIG. 3 (d), the ultrasonic waves generated by vibrating the base transport levitation mechanism 3 in the Z-axis direction lift the tip portion 2 a of the bent substrate 2. Therefore, the substrate 2 can be transported by floating while maintaining the flatness of the substrate 2. Since the substrate gripping mechanism 5 that grips the substrate 2 can reciprocate in the positive and negative X-axis directions, the substrate 2 can be reciprocated in the positive and negative X-axis directions.

（第２実施形態）
次に、露光用基板搬送装置の第２実施形態について図４を参照して説明する。なお、第１実施形態と同一または同等部分については同一符号又は相当符号を付して、説明を簡略化又は省略する。
図３（ａ）または図３（ｃ）に示すように、浮上量が少ない場合は基板２の先端部２ａが垂れることによって、基板２の先端部２ａが基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れがある。 (Second Embodiment)
Next, a second embodiment of the exposure substrate transfer apparatus will be described with reference to FIG. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol or an equivalent code | symbol is attached | subjected, and description is simplified or abbreviate | omitted.
As shown in FIG. 3 (a) or 3 (c), when the flying height is small, the tip 2a of the substrate 2 hangs down so that the tip 2a of the substrate 2 becomes the surface 3a or edge 3b of the substrate floating mechanism 3. There is a risk of contact.

図４（ａ）に示すように、このような接触を回避するため、正のＸ軸方向へ隣接する基板浮上機構３の高さを段々と低くする。それにより、基板把持機構５（図１）を正のＸ軸方向に運動させると、基板２の先端部２ａが隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れがない。   As shown in FIG. 4A, in order to avoid such contact, the height of the substrate floating mechanism 3 adjacent in the positive X-axis direction is gradually lowered. Accordingly, when the substrate gripping mechanism 5 (FIG. 1) is moved in the positive X-axis direction, there is no possibility that the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

基板２の先端部２ａの撓み量を考慮せずに基板２を浮上させることができるので、不図示の浮上制御部で消費する電力量を減らすことが出来る。そのため、基板２を浮上させるために吹き出される空気量を少なくして、消費電力量を減らすことができる。   Since the board | substrate 2 can be floated without considering the amount of bending of the front-end | tip part 2a of the board | substrate 2, the electric energy consumed by a floating control part not shown can be reduced. Therefore, the amount of air blown to float the substrate 2 can be reduced and the power consumption can be reduced.

また、図４（ｂ）に示すように、第２実施例の変形例として、基搬送浮上機構３の表面３ａから空気を吹き出す代わりに、基搬送浮上機構３をＺ軸方向に空気を振動させることにより発生した超音波によって、基板２を浮上させても良い。   Further, as shown in FIG. 4B, as a modification of the second embodiment, instead of blowing air from the surface 3a of the base transport levitation mechanism 3, the base transport levitation mechanism 3 is vibrated in the Z-axis direction. The substrate 2 may be levitated by the ultrasonic waves generated by this.

また、図５（ａ）に示すように、基板２を負のＸ軸方向へ搬送するとき、基板２の先端部２ａが隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れがある。このような接触を回避するため、隣接する基板浮上機構３の間に、ノズル４ｂ（補機４）を備える。基板２の先端部２aが上空にある時だけノズル４ｂから空気を吹き出す。吹き出された空気は、基板２の先端部２ａを持ち上げる。そのため、基板２の先端部２ａは隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触することなく、基板２を負のＸ軸方向へも搬送することができる。   Further, as shown in FIG. 5A, when the substrate 2 is transported in the negative X-axis direction, the tip 2a of the substrate 2 may come into contact with the surface 3a or the edge 3b of the adjacent substrate levitation mechanism 3. is there. In order to avoid such contact, a nozzle 4b (auxiliary machine 4) is provided between adjacent substrate levitation mechanisms 3. Air is blown out from the nozzle 4b only when the tip 2a of the substrate 2 is in the sky. The blown air lifts up the front end 2 a of the substrate 2. Therefore, the tip 2a of the substrate 2 can transport the substrate 2 in the negative X-axis direction without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

また、図５（ｂ）に示すように、基板２を負のＸ軸方向へ搬送するとき、基板２の先端部２ａが撓んだ隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れがある。このような接触を回避するため、隣接する基板浮上機構３の間に、ローラ４ａ（補機４）を備える。基板２の先端部が隣接する基板浮上機構３の間に搬送されたとき、ローラ４ａはＺ軸方向に上昇して基板２の先端部２ａを持ち上げる。そのため、基板２の先端部２ａは隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触することなく、基板２を搬送することができる。   Further, as shown in FIG. 5 (b), when the substrate 2 is transported in the negative X-axis direction, the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate levitation mechanism 3 bent. There is a fear. In order to avoid such contact, a roller 4a (auxiliary machine 4) is provided between adjacent substrate floating mechanisms 3. When the front end portion of the substrate 2 is conveyed between the adjacent substrate floating mechanisms 3, the roller 4a rises in the Z-axis direction to lift the front end portion 2a of the substrate 2. Therefore, the tip 2a of the substrate 2 can transport the substrate 2 without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

また、図５(ｃ)及び図５（ｄ）に示すように、基搬送浮上機構３をＺ軸方向に空気を振動させることにより発生した超音波によって、基板２を浮上させたときも、補機４（ローラ４ａ、ノズル４ｂ）により、基板２の先端部２ａは隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触することなく、基板２を搬送することができる。   Further, as shown in FIGS. 5 (c) and 5 (d), when the substrate 2 is levitated by ultrasonic waves generated by causing the base conveyance levitation mechanism 3 to vibrate air in the Z-axis direction, the compensation is also performed. By the machine 4 (roller 4a, nozzle 4b), the tip 2a of the substrate 2 can transport the substrate 2 without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

（第３実施形態）
次に、露光用基板搬送装置の第３実施形態について図６を参照して説明する。なお、第１実施形態と同一または同等部分については同一符号又は相当符号を付して、説明を簡略化又は省略する。
図４（ａ）または図４（ｃ）に示すように、正のＸ軸方向へ隣接する基板浮上機構３の高さを段々と低くする。これにより、基板２が基板浮上機構３の高さに合わせて正のＸ軸方向へ搬送される。そのため、隣接する基板浮上機構３の高さは異なるので、基板２の先端部２ａが隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れがある。 (Third embodiment)
Next, a third embodiment of the exposure substrate transfer apparatus will be described with reference to FIG. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol or an equivalent code | symbol is attached | subjected, and description is simplified or abbreviate | omitted.
As shown in FIG. 4A or FIG. 4C, the height of the substrate floating mechanism 3 adjacent in the positive X-axis direction is gradually reduced. Thereby, the board | substrate 2 is conveyed to the positive X-axis direction according to the height of the board | substrate floating mechanism 3. As shown in FIG. Therefore, since the heights of the adjacent substrate floating mechanisms 3 are different, there is a possibility that the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

このような接触を回避するため、図６（ａ）に示すように、表面３ａに傾斜を設ける。それにより、基板把持機構５を正のＸ軸方向に運動させても、基板２の搬送高さを変化させることなく、基板２の先端部２ａが基板浮上機構３の表面３ａまたは縁３ｂなどに接触する恐れを無くすことができる。   In order to avoid such contact, as shown in FIG. 6A, the surface 3a is inclined. Thereby, even if the substrate gripping mechanism 5 is moved in the positive X-axis direction, the front end 2a of the substrate 2 does not change on the surface 3a or the edge 3b of the substrate floating mechanism 3 without changing the transport height of the substrate 2. The fear of contact can be eliminated.

また、図６(ｂ)に示すように、基搬送浮上機構３をZ軸方向に超音波の振動数で空気を振動させて、基板２を浮上させ、基板２の先端部２ａは隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触することなく、基板２を搬送することができる。   Further, as shown in FIG. 6 (b), the base transport levitating mechanism 3 is vibrated at an ultrasonic frequency in the Z-axis direction to float the substrate 2, and the tip 2a of the substrate 2 is adjacent to the adjacent substrate The substrate 2 can be transported without contacting the surface 3a or the edge 3b of the levitation mechanism 3.

また、図7(ａ)及び図７（ｂ）に示すように基板把持機構５（図１）を負のＸ軸方向へ運動するときに、基板２の先端部２ａが、隣接する基板浮上機構３の表面３ａまたは縁３ｂなどに接触するのを回避するため、隣接する基板浮上機構３の間に、補機４を備える。   Further, as shown in FIGS. 7A and 7B, when the substrate gripping mechanism 5 (FIG. 1) is moved in the negative X-axis direction, the front end portion 2a of the substrate 2 is adjacent to the substrate floating mechanism. In order to avoid contact with the surface 3a or the edge 3b of the three, the auxiliary machine 4 is provided between the adjacent substrate floating mechanisms 3.

また、図７(ｃ)及び図７（ｄ）に示すように、基搬送浮上機構３を、Ｘ軸方向に超音波の振動数で空気を振動させて、基板２を浮上させたときも、補機４（ローラ４ａ、ノズル４ｂ）は、基搬送浮上機構３の表面３ａから空気を吹き出して、基板２を浮上させたときと同様の効果を生じる。   Further, as shown in FIGS. 7 (c) and 7 (d), when the base transport levitation mechanism 3 is caused to oscillate with air at an ultrasonic frequency in the X-axis direction, the substrate 2 is levitated. The auxiliary machine 4 (roller 4a, nozzle 4b) produces the same effect as when the substrate 2 is floated by blowing air from the surface 3a of the base transport floating mechanism 3.

本実施形態に限らず補機４（ローラ４ａ、ノズル４ｂ）の配置は適宜変更が可能である。また、本実子形態において流体よりも気体である空気を媒質としたが、不図示の露光照射装置にて、基板２に波長が２００ｎｍ以下の紫外線を利用する場合には、空気中の酸素が紫外線と化学反応を起こしてオゾンが発生するおそれがある。そのため、オゾンを除去する設備を備える必要がある。媒質を窒素、アルゴン、ヘリウムのような不活性な気体にすることによって、オゾンを除去する設備を備えることなしに、オゾンを除去することができる。コストを考慮すれば、媒質としては窒素がよい。   The arrangement of the auxiliary machines 4 (rollers 4a and nozzles 4b) is not limited to this embodiment, and can be changed as appropriate. In the present embodiment, air, which is a gas rather than a fluid, is used as a medium. However, when an ultraviolet ray having a wavelength of 200 nm or less is used for the substrate 2 in an exposure irradiation apparatus (not shown), oxygen in the air is an ultraviolet ray. There is a risk that ozone may be generated due to a chemical reaction. Therefore, it is necessary to provide equipment for removing ozone. By making the medium an inert gas such as nitrogen, argon or helium, ozone can be removed without providing a facility for removing ozone. Considering the cost, nitrogen is a good medium.

１・・・露光用基板搬送装置
２・・・基板
３・・・基板浮上機構
３ａ・・・（基板浮上機構）の表面
３ｂ・・・（基板浮上機構）の縁
４・・・補機
４ａ・・・ローラ
４ｂ・・・ノズル
５・・・基板把持機構
６・・・基板搬送機構 DESCRIPTION OF SYMBOLS 1 ... Exposure substrate conveying apparatus 2 ... Substrate 3 ... Substrate floating mechanism 3a ... Surface 3b of substrate floating mechanism ... Edge of substrate floating mechanism 4 ... Auxiliary machine 4a ... Roller 4b ... Nozzle 5 ... Substrate gripping mechanism 6 ... Substrate transport mechanism

Claims (9)

基板の片端部もしくは両端部を把持する基板把持機構と、
前記基板把持機構を移動させる基板移動機構と、
前記基板を浮上させる媒質を発生させる複数の基板浮上機構と、
を備え、
前記基板が媒質によって浮上され、かつ、前記基板移動機構が前記把持機構を往復運動させることを特徴とする露光用基板搬送装置。 A substrate gripping mechanism for gripping one or both ends of the substrate;
A substrate moving mechanism for moving the substrate gripping mechanism;
A plurality of substrate levitating mechanisms for generating a medium for levitating the substrate;
With
An exposure substrate transport apparatus, wherein the substrate is levitated by a medium, and the substrate moving mechanism reciprocates the gripping mechanism. 前記隣接する基板浮上機構の高さを段々低くすることを特徴とする請求項１の露光装置用基板搬送装置。   2. The substrate transfer apparatus for an exposure apparatus according to claim 1, wherein the height of the adjacent substrate floating mechanism is gradually lowered. 前記基板浮上機構の表面に傾斜を設けることを特徴とする請求項１の露光用基板搬送装置。   2. An exposure substrate transport apparatus according to claim 1, wherein an inclination is provided on a surface of the substrate floating mechanism. 前記基板浮上機構の隣に補機が設けられていることを特徴とする請求項１から請求項３の露光装置用基板搬送装置。   4. The substrate transfer apparatus for an exposure apparatus according to claim 1, wherein an auxiliary machine is provided next to the substrate floating mechanism. 前記基板を前記基板浮上機構から吹き出される前記媒質によって浮上させることを特徴とする請求項１から請求項４の露光装置用基板搬送装置。   5. The substrate transfer apparatus for an exposure apparatus according to claim 1, wherein the substrate is levitated by the medium blown from the substrate levitating mechanism. 前記基板浮上機構を振動させて超音波の振動数にした媒質によって基板を浮上させることを特徴とする請求項１から請求項４の露光装置用基板搬送装置。   5. The substrate transport apparatus for an exposure apparatus according to claim 1, wherein the substrate is floated by a medium that vibrates the substrate floating mechanism to obtain an ultrasonic frequency. 前記補機がローラまたは空気ノズルであることを特徴とする請求項４の露光装置用基板搬送装置。   5. The substrate transport apparatus for an exposure apparatus according to claim 4, wherein the auxiliary machine is a roller or an air nozzle. 前記媒質が気体であることを特徴とする請求項１から請求項６の露光装置用基板搬送装置。   7. The substrate transfer apparatus for an exposure apparatus according to claim 1, wherein the medium is a gas. 前記気体が空気であることを特徴とする請求項８の露光装置用基板搬送装置。   9. The substrate transfer apparatus for an exposure apparatus according to claim 8, wherein the gas is air.
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