JP2020166109A - Substrate transfer apparatus, exposure device, flat panel display producing method, device producing method, and exposure method - Google Patents

Abstract

To reduce the time required for substrate replacement.SOLUTION: A substrate transfer apparatus comprises: a support part that includes a support surface for supporting a substrate; a first holding part that holds a section of a surface facing the support surface of the first substrate located above the support surface; a second holding part that includes a holding surface inclined with respect to the support surface and holding another section of the surface facing the support surface of the first substrate located above the support surface; a third holding part that holds a section of a second substrate supported by the support part on the support surface; and a driving device that relatively drives the second holding part and the support part so that the second holding part retracts in the first direction from between the first substrate and the support part, and relatively drives the third holding part and the support part so that the third holding part moves in the first direction with respect to the support part while holding the second substrate in order to transfer the first substrate into the support part and transfer the second substrate from the support part.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate transfer device, an exposure device, a flat panel display manufacturing method, a device manufacturing method, and an exposure method.

In the lithography process for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements, a pattern formed on a mask (or reticle) is applied on a substrate (a substrate made of glass or plastic, a semiconductor wafer, etc.) using an energy beam. An exposure apparatus for transfer is used.

In this type of exposure apparatus, the substrate transfer apparatus is used to carry out the exposed substrate on the stage apparatus for holding the substrate and to carry in the new substrate onto the stage apparatus. As a method for transporting a substrate, for example, the method described in Patent Document 1 is known.

International Publication No. 2013/150787

According to the first aspect, the substrate transfer device holds a support portion having a support surface for supporting the substrate and a part of a surface of the first substrate located above the support surface facing the support surface. A first holding portion, a second holding portion having a holding surface that is inclined with respect to the support surface and holds another portion of the surface of the first substrate that faces the support surface and is located above the support surface. The second holding portion retracts in the first direction from between the third holding portion that holds a part of the second substrate supported by the supporting portion on the supporting surface and the first substrate and the supporting portion. In addition, the second holding portion and the supporting portion are relatively driven, and the third holding portion moves in the first direction with respect to the supporting portion while holding the second substrate. 3. By relatively driving the holding portion and the supporting portion, the first substrate is carried into the supporting portion, and the driving device for carrying out the second substrate from the supporting portion is provided.

The configuration of the embodiment described later may be appropriately improved, or at least a part thereof may be replaced with another configuration. Further, the configuration requirement without particular limitation on the arrangement is not limited to the arrangement disclosed in the embodiment, and can be arranged at a position where the function can be achieved.

It is a figure which shows schematic structure of the exposure apparatus which concerns on 1st Embodiment. It is a top view of the stage apparatus and the substrate transfer apparatus which the exposure apparatus of FIG. 1 has. It is a perspective view of a slide plate. 4 (a) and 4 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation in the first embodiment. 5 (a) and 5 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation in the first embodiment. 6 (a) and 6 (b) are side views (No. 3) of the exposure apparatus for explaining the substrate replacement operation in the first embodiment. 7 (a) and 7 (b) are side views (No. 4) of the exposure apparatus for explaining the substrate replacement operation in the first embodiment. It is a side view of the stage apparatus and the substrate transfer apparatus which the exposure apparatus which concerns on 1st modification of 1st Embodiment have. It is a top view of the stage apparatus and the substrate transfer apparatus included in the exposure apparatus of FIG. 10 (a) and 10 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation in the first modification of the first embodiment. 11 (a) and 11 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation in the first modification of the first embodiment. It is a top view of the stage apparatus and the substrate transfer apparatus which the exposure apparatus which concerns on 2nd modification of 1st Embodiment has. 13 (a) and 13 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation in the second modification of the first embodiment. 14 (a) and 14 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation in the second modification of the first embodiment. It is a side view (No. 3) of the exposure apparatus for demonstrating the substrate exchange operation in the 2nd modification of 1st Embodiment. It is a top view of the stage apparatus and the substrate transfer apparatus which the exposure apparatus which concerns on 3rd modification of 1st Embodiment has. 17 (a) and 17 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation in the third modification of the first embodiment. 18 (a) and 18 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation in the third modification of the first embodiment. 19 (a) and 19 (b) are side views (No. 3) of the exposure apparatus for explaining the substrate replacement operation in the third modification of the first embodiment. FIG. 20A is a plan view of the substrate feeder included in the substrate transfer device according to the fourth modification of the first embodiment, and FIG. 20B is a side view of the substrate feeder. 21 (a) and 21 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation in the fourth modification of the first embodiment. 22 (a) and 22 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation in the fourth modification of the first embodiment. It is a side view (the 3) of the exposure apparatus for demonstrating the substrate exchange operation in 4th modification of 1st Embodiment. It is a figure which shows another example of the 4th modification of 1st Embodiment. It is a side view which shows a part of the exposure apparatus which concerns on 5th modification of 1st Embodiment. 26 (a) and 26 (b) are side views (No. 1) of the exposure apparatus for explaining the substrate replacement operation of the substrate transfer apparatus according to the sixth modification of the first embodiment. 27 (a) and 27 (b) are side views (No. 2) of the exposure apparatus for explaining the substrate replacement operation of the substrate transfer apparatus according to the sixth modification of the first embodiment. It is a figure for demonstrating the 7th modification of 1st Embodiment. 29 (a) and 29 (b) are diagrams for explaining an eighth modification of the first embodiment. 30 (a) and 30 (b) are a plan view and a side view of the exposure apparatus according to the second embodiment, respectively. 31 (a) and 31 (b) are perspective views of the substrate loading hand according to the second embodiment. 32 (a) and 32 (b) are a plan view and a side view (No. 1) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 33 (a) and 33 (b) are a plan view and a side view (No. 2) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 34 (a) and 34 (b) are a plan view and a side view (No. 3) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 35 (a) and 35 (b) are a plan view and a side view (No. 4) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 36 (a) and 36 (b) are a plan view and a side view (No. 5) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 37 (a) and 37 (b) are a plan view and a side view (No. 6) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 38 (a) and 38 (b) are plan views and side views of an exposure apparatus for explaining another example of the substrate exchange operation shown in FIGS. 37 (a) and 37 (b), respectively. 39 (a) and 39 (b) are a plan view and a side view (No. 7) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 40 (a) and 40 (b) are a plan view and a side view (No. 8) of the exposure apparatus for explaining the substrate exchange operation in the second embodiment, respectively. 41 (a) and 41 (b) are diagrams for explaining the advantages of the substrate carry-in hand according to the second embodiment, respectively. 42 (a) and 42 (b) are plan views and side views of an exposure apparatus for explaining a substrate replacement operation in the first modification of the second embodiment, respectively. 43 (a) and 43 (b) are a plan view and a side view (No. 1) of the exposure apparatus for explaining the substrate exchange operation in the second modification of the second embodiment, respectively. 44 (a) and 44 (b) are a plan view and a side view (No. 2) of the exposure apparatus for explaining the substrate exchange operation in the second modification of the second embodiment, respectively. 45 (a) and 45 (b) are a plan view and a side view (No. 3) of the exposure apparatus for explaining the substrate exchange operation in the second modification of the second embodiment, respectively. 46 (a) and 46 (b) are a plan view and a side view (No. 4) of the exposure apparatus for explaining the substrate exchange operation in the second modification of the second embodiment, respectively. 47 (a) and 47 (b) are side views of a substrate transfer device for explaining the transfer of the substrate from the beam unit to the substrate carry-in hand in the third modification of the second embodiment. 48 (a) and 48 (b) are a plan view and a side view of an exposure apparatus for explaining the transfer of the substrate from the beam unit to the substrate carry-in hand in the fourth modification of the second embodiment, respectively. 1). 49 (a) and 49 (b) are a plan view and a side view of an exposure apparatus for explaining the transfer of the substrate from the beam unit to the substrate carry-in hand in the fourth modification of the second embodiment, respectively. 2). 50 (a) and 50 (b) are a plan view and a side view of an exposure apparatus for explaining the transfer of the substrate from the external transfer apparatus to the substrate carry-in hand in the fifth modification of the second embodiment, respectively. The 1). 51 (a) and 51 (b) are a plan view and a side view of the exposure apparatus for explaining the transfer of the substrate from the external transfer apparatus to the substrate carry-in hand in the fifth modification of the second embodiment, respectively. The second). It is a figure for demonstrating the structural example of a surface plate. 53 (a) and 53 (b) are plan views and side views showing the configurations of the stage apparatus in the first and second embodiments and the modified examples thereof, respectively. 54 (a) is a plan view showing another example of the stage device, and FIGS. 54 (b) and 54 (c) are sectional views taken along the line AA of FIG. 54 (a). FIG. 55 (a) is a plan view showing another example of the stage device, and FIG. 55 (b) is a sectional view taken along the line AA of FIG. 55 (a). 56 (a) to 56 (c) are side views for explaining the mounting of the substrate on the stage apparatus shown in FIGS. 55 (a) and 55 (b).

<< First Embodiment >>
Hereinafter, the first embodiment according to the present invention will be described with reference to FIGS. 1 to 7.

FIG. 1 schematically shows the configuration of the exposure apparatus 10P according to the first embodiment. 2 is a plan view of the stage device 20P and the substrate transfer device 100P included in the exposure device 10P of FIG. 1. FIG.

The exposure apparatus 10P is a step-and-scan projection in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a liquid crystal display device (flat panel display) or the like is used as an exposure object. An exposure device, a so-called scanner.

The exposure apparatus 10P is a resist (sensitizer) on the illumination system 12, the mask stage 14 holding the mask M on which a pattern such as a circuit pattern is formed, the projection optical system 16, and the surface (the surface facing the + Z side in FIG. 1). It has a stage device 20P for holding the substrate P (P) coated with the above, a substrate transfer device 100P, a control system for these, and the like. Hereinafter, as shown in FIG. 1, the X-axis, Y-axis, and Z-axis orthogonal to each other are set with respect to the exposure apparatus 10P, and the mask M and the substrate P are respectively in the X-axis direction with respect to the projection optical system 16 at the time of exposure. It is assumed that the relative scanning is performed along the horizontal plane, and the Y-axis is set in the horizontal plane. Further, the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. Further, the positions related to the X-axis, Y-axis, and Z-axis directions will be described as X-position, Y-position, and Z-position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, US Pat. No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. As the illumination light IL, for example, light containing at least one wavelength of i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used. The wavelengths of the light source used in the illumination system 12 and the illumination light IL emitted from the light source are not particularly limited, and are ultraviolet rays such as ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 248 nm). It may be light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is driven by a mask stage drive system (not shown) including, for example, a linear motor with a predetermined stroke at least in the scanning direction (X-axis direction). Further, the mask stage 14 is driven by a fine movement drive system that moves its X position and Y position by a stroke in order to adjust the relative position with at least one of the lighting system 12, the stage device 20P, and the projection optical system 16. The position information of the mask stage 14 is obtained by, for example, a mask stage position measurement system (not shown) including a linear encoder system and an interferometer system.

The projection optical system 16 is arranged below the mask stage 14 (−Z side). The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms, for example, an erect image. It has multiple optical systems that are telecentric on both sides. The projection optical system 16 does not have to be a multi-lens type. It may be composed of one projection optical system as used in a semiconductor exposure apparatus.

In the exposure apparatus 10P, when the mask M located in a predetermined illumination region is illuminated by the illumination light IL from the illumination system 12, a projected image of the mask M pattern in the illumination region (partial pattern image). Is formed in the exposed region by the projection optical system 16. Then, the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region in the scanning direction, so that scanning exposure is performed on the substrate P. The pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

(Stage device 20P)
The stage device 20P includes a surface plate 22, a board table 24, a support device 26, and a board holder 28.

The surface plate 22 is composed of, for example, a rectangular plate-shaped member in a plan view (viewed from the + Z side) arranged so that the upper surface (+ Z plane) is parallel to the XY plane, and is via a vibration isolator (not shown). It is installed on the floor F. The support device 26 is placed on the surface plate 22 in a non-contact state, and supports the substrate table 24 from below in a non-contact state. The board holder 28 is arranged on the board table 24, and the board table 24 and the board holder 28 are integrally driven by a stage drive system (not shown) included in the stage device 20. The stage drive system includes, for example, a linear motor, and includes a coarse motion system capable of driving the substrate table 24 in the X-axis and Y-axis directions (along the upper surface of the platen 22) with a predetermined stroke, and a voice coil motor, for example. The substrate table 24 is provided with a fine movement system that microdrives the substrate table 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions. Further, the stage device 20P includes, for example, an optical interferometer system, an encoder system, and the like, and includes a stage measurement system for obtaining position information of the substrate table 24 in the six degrees of freedom direction.

In the substrate holder 28, the substrate P is placed on the upper surface 28u (the surface on the + Z side) having a rectangular shape in a plan view. As shown in FIG. 2, the aspect ratio of the upper surface 28u is substantially the same as that of the substrate P. As an example, the lengths of the long side and the short side of the upper surface 28u are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively.

The upper surface 28u of the substrate holder 28 is finished flat over the entire surface. Further, a plurality of minute holes (not shown) for blowing air and a plurality of minute holes (not shown) for vacuum suction are formed on the upper surface of the substrate holder 28. It should be noted that a common hole may be used in combination for the minute hole for air blowing and the minute hole for vacuum suction. The substrate holder 28 sucks air between the upper surface 28u and the substrate P through the plurality of holes by using a vacuum suction force supplied from a vacuum device (not shown), and attaches the substrate P to the upper surface 28u. It is possible to adsorb (correct the plane). The substrate holder 28 is a so-called pin chuck type holder, in which a plurality of pins (pins having a diameter as small as, for example, about 1 mm in diameter) are arranged at substantially equal intervals. By having the plurality of pins, the substrate holder 28 can reduce the possibility of supporting the substrate P by sandwiching dust or foreign matter, and can reduce the possibility of deformation of the substrate P due to the sandwiching of the foreign matter. The substrate P is held (supported) on the upper surfaces of the plurality of pins. The XY plane formed by the upper surfaces of the plurality of pins is defined as the upper surface of the substrate holder 28. Further, the substrate holder 28 supplies (supplys) the pressurized gas (for example, air) supplied from the pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the hole. Therefore, the back surface of the substrate P attracted to the substrate holder 28 can be separated from the upper surface 28u (the substrate P is floated). Further, in each of the plurality of holes formed in the substrate holder 28, there may be a time lag in the timing of supplying the pressurized gas, or the location of the hole for vacuum suction and the hole for supplying the pressurized gas. The air pressure is appropriately changed between suction and air supply to control the ground contact state of the substrate P (for example, an air pool is formed between the back surface of the substrate P and the upper surface of the substrate holder 28A). Can be done).

The substrate holder 28 may perform surface correction of the substrate in a state where the substrate P is not attracted to the upper surface 28u and is floated and supported. In this case, the substrate holder 28 supplies (supplys) the pressurized gas (for example, air) supplied from the pressurized gas supply device (not shown) to the back surface of the substrate P through the holes, thereby supplying (supplying) the substrate. A gas is interposed between the lower surface of P and the upper surface 28u of the substrate holder 28 (that is, a gas film is formed). Further, the substrate holder 28 sucks the gas between the substrate holder 28 and the substrate P through the hole for vacuum suction by using a vacuum suction device, and a force (preload) downward in the direction of gravity with respect to the substrate P. ) Is applied to impart rigidity in the direction of gravity to the gas film. Then, the substrate holder 28 floats the substrate P in the Z-axis direction through a minute clearance and holds (supports) the substrate P in a non-contact manner by balancing the pressure and flow rate of the pressurized gas with the vacuum suction force. A force for controlling the flatness (for example, a force for correcting or correcting the flatness) may be applied to P. Each hole may be formed by processing the substrate holder 28, or the substrate holder 28 may be formed of a porous material to supply or suck air. Further, the upper surface 28u of the substrate holder 28 that floats and supports the substrate P is not a surface on which a hole is formed, but a virtual surface located above the surface by the above clearance, that is, a plane-corrected substrate. The upper surface is the upper surface 28u.

As shown in FIG. 2, for example, two notches 28a are formed at the end of the upper surface 28u of the substrate holder 28 on the −X side so as to be separated from each other in the Y-axis direction. Further, as shown in FIG. 2, for example, two notches 28b are formed at the end of the upper surface 28u of the substrate holder 28 on the + X side so as to be separated from each other in the Y-axis direction.

(Board transfer device 100P)
As shown in FIG. 1, the substrate transfer device 100P includes a port portion 150P, a substrate slide hand 140P, a substrate feeder 160P, and a transfer device 180P. The port portion 150P, the substrate slide hand 140P, and the substrate feeder 160P are installed on the + X side with respect to the stage device 20P. For example, the transfer of the substrate P between an external device (not shown) such as a coater / developer and the exposure apparatus is performed by the substrate transfer device 100P.

Further, the transfer of the substrate P between the above-mentioned external device and the exposure device 10P is performed by the external transfer device 300 arranged outside the chamber (not shown) accommodating the exposure device 10P. The external transfer device 300 has a fork-shaped robot hand, and can transport the mounted substrate P from the external device to the port portion 150P in the exposure device 10P. Further, the external transfer device 300 can carry the exposed substrate P conveyed to the port portion 150P by the substrate transfer device 100P from the inside of the chamber to the external device.

As shown in FIG. 2, the port portion 150P has a beam unit 152 composed of a plurality of beams (seven in the first embodiment) arranged at predetermined intervals in the Y-axis direction. A plurality of minute holes (not shown) for blowing air are formed on the upper surface of the beam unit 152. The beam unit 152 supplies (for example, air) a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the back surface of the substrate P and the upper surface of the beam unit 152 via the holes. ), It is possible to separate the back surface of the substrate P from the upper surface of the beam unit 152 (float the substrate P). The distance between the plurality of beams in the Y-axis direction is such that when the beam unit 152 can support the substrate P from below and the robot hand of the external transfer device 300 is arranged at the same height as the beam unit 152, the robot hand The plurality of finger portions 300F to be held are set so that they can be arranged (inserted / removed) between the plurality of beams.

The length of each beam in the longitudinal direction (X-axis direction) is slightly longer than the length in the longitudinal direction of the substrate P, and the length in the width direction (Y-axis direction) is the length in the width direction of the substrate P, for example. It is set to about 1/50 or, for example, about 10 to 50 times the thickness of the substrate P.

As shown in FIG. 1, each of the plurality of beams (overlapping in the depth direction of the paper surface in FIG. 1) is provided by a plurality of (for example, two) rod-shaped legs 254 at positions inside the both ends in the X-axis direction. It is supported from below. The lower ends of each of the plurality of legs 254 that support the beam unit 152 are connected to the plate-shaped base portion 253. The base portion 253 is moved up and down by the vertical movement mechanism 255. Further, the vertical movement mechanism 255 is movable in the X-axis direction along the rail 257 laid on the floor F along the X-axis direction. That is, the beam unit 152 and the substrate P supported by the beam unit 152 can move in the X-axis direction and the Z-axis direction.

As shown in FIG. 2, a pair of substrate slide hands 140P are provided on the + Y side and −Y side of the port portion 150P. As shown in FIG. 2, the substrate slide hand 140P has a suction pad 142 and a vertical movement mechanism 144 that moves the suction pad 142 up and down. The vertical movement mechanism 144 is movable in the X-axis direction along the rail 146 laid along the X-axis direction. That is, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown). As shown in FIG. 2, the suction pad 142 of the substrate slide hand 140P is in a state of protruding toward the side closer to the beam unit 152 than the rail 146. This is done in this way when the board slide hand 140P conveys the board P (P2) to the board feeder 160P (in the state of FIG. 5B), the board P is placed on the board holder 28. This is to avoid contact between (P1) and the vertical movement mechanism 144.

As shown in FIGS. 1 and 2, the substrate feeder 160P is provided between the stage device 20P and the port portion 150P in the X-axis direction, and is floored by two support columns 262 and two support columns 262. It has a slide plate 264 supported at a position at a predetermined height from F. As will be described later, the height of the support column 262 is defined so that the upper surface of the substrate holder 28 and the lower surface of the slide plate 264 do not come into contact with each other when the stage device 20P moves to the substrate replacement position. FIG. 3 shows a perspective view of the slide plate 264. As can be seen from FIGS. 3 and 2, the slide plate 264 has a plate portion 263 having a triangular XZ cross section and a support portion 265 to which the upper end portion of the support pillar 262 is connected. The size of the upper surface of the plate portion 263 is set to a size that can support substantially the entire surface of the substrate P. The upper surface of the plate portion 263 is inclined with respect to the XY surface. Although not shown, a plurality of minute holes (not shown) for blowing air are formed on the upper surface of the plate portion 263. In the plate portion 263, the pressurized gas (for example, air) supplied from the pressurized gas supply device (not shown) is supplied to the back surface of the substrate P placed on the plate portion 263 via the hole portion (air supply). By doing so, it is possible to separate the back surface of the substrate P from the upper surface of the plate portion 263 (float the substrate P). Notches 263a are formed at the ends of the plate portion 263 on the + X side and the + Y side and the −Y side. The notch 263a is formed in order to avoid mechanical interference with the suction pad 142 of the substrate slide hand 140P.

(Transport device 180P)
Returning to FIG. 1, the transport device 180P is a device that cooperates with the port portion 150P and the board slide hand 140P when the board is replaced. In other words, in the exposure apparatus 10P, the substrate P is carried in and out of the substrate holder 28 by using the port portion 150P, the substrate slide hand 140P, and the transfer device 180A.

The transfer device 180P is provided in the stage device 20P, and includes a pair of substrate carry-in bearer devices 182P, a pair of board carry-out bearer devices 183P, and an offset beam unit 185P, as shown in FIGS. 1 and 2.

The substrate carry-in bearer device 182P includes a suction pad 284 that sucks and holds the lower surface of the board P by a vacuum suction force supplied from a vacuum device (not shown), and a drive mechanism 286 that drives the suction pad 284 along the Z-axis direction. , Equipped with. The suction pad 284 is located in the most −Z side and is in the notch 28a formed in the substrate holder 28.

The substrate carry-out bearer device 183P has a suction pad that sucks and holds the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown), and can be driven along the X-axis direction. The substrate unloading bearer device 183P is in a state of being in the notch 28b formed in the substrate holder 28 in a state of being located most on the −X side.

The offset beam unit 185P has a plurality of beams (for example, eight in the first embodiment) arranged at predetermined intervals in the Y-axis direction. The beam is arranged so that its upper surface is included in substantially the same plane as the upper surface 28u of the substrate holder 28. A plurality of minute holes (not shown) for blowing air are formed on the upper surface of the beam. Pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) from the plurality of holes toward the back surface of the substrate P. As a result, the back surface of the substrate P can be separated from the upper surface of the beam (the substrate P is levitated).

The configurations of the substrate carry-in bearer device 182P and the board carry-out bearer device 183P can be changed as appropriate. For example, the bearer devices 182P and 183P are attached to the board table 24 in the present embodiment, but the present invention is not limited to this, and for example, the board holder 28 or the XY stage device for driving the board table 24 in the XY plane. It may be attached to (not shown). Further, the positions and numbers of the bearer devices 182P and 183P are not limited to this. For example, it may be attached to the + Y side and −Y side side surfaces of the substrate table 24.

In the exposure apparatus 10P configured as described above, the mask M is loaded onto the mask stage 14 by the mask loader (not shown) under the control of the main control device (not shown), and the substrate transfer apparatus 100P is used. The substrate P is carried onto the substrate holder 28. After that, the main control device executes alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, a plurality of shot regions set on the substrate P are sequentially exposed by a step-and-scan method. The operation is performed. Since this exposure operation is the same as the exposure operation of the step-and-scan method that has been conventionally performed, the X direction is set as the scan direction. A detailed description of the step-and-scan exposure operation will be omitted. Then, the substrate P for which the exposure process has been completed is carried out from the substrate holder 28 by the substrate transport device 100P, and another substrate P to be exposed next is carried into the substrate holder 28, whereby the substrate P is carried onto the substrate holder 28. The substrate P is replaced, and a series of exposure operations for the plurality of substrates P are continuously performed.

(Board replacement operation)
Hereinafter, the operation of exchanging the substrate P on the substrate holder 28 in the exposure apparatus 10P will be described in detail with reference to FIGS. 1 and 4 (a) to 7 (b). The following board replacement operation is controlled by a main controller (not shown). In each side view of FIGS. 4A to 7B for explaining the substrate replacement operation, the operating directions of the components are schematically indicated by white arrows for easy understanding. ing. In addition, the state of sucking or supplying (supplying) gas is schematically indicated by a black arrow.

Further, as a premise of the operation explanation, it is assumed that the substrate P1 is placed in advance on the substrate holder 28 of the stage device 20P. Further, in the substrate replacement operation, an operation of carrying out the exposed substrate P1 and an operation of loading (mounting) the newly exposed substrate P2 (separate from the substrate P1) into the substrate holder 28 are executed. It shall be. The substrate P2 may be an unexposed (not exposed even once) substrate, or may be a substrate to be exposed for the second and subsequent times.

As shown in FIG. 1, in a state where the substrate P1 is exposed in the stage apparatus 20P, the main control apparatus drives the external transfer device 300 holding the substrate P2 before the exposure to the upper part of the port portion 150P. Then, the main control device delivers the substrate P2 to the port portion 150P by driving the external transport device 300 downward. It is assumed that the external transfer device 300 is positioned in the Y-axis direction so that each finger portion 300F of the fork-shaped robot hand of the external transfer device 300 does not come into contact with each beam of the beam unit 152.

After the board P2 is delivered to the port portion 150P, the main control device drives the external transport device 300 in the + X direction (arrow A direction) as shown in FIG. 4A, and ports the external transport device 300. The part 150P is retracted from the lower side of the beam unit 152.

Next, the main control device controls the vertical movement mechanism 255 of the port portion 150P as shown in FIG. 4B to drive the beam unit 152 downward (see arrow B). As a result, the height positions of the upper surface (+ Z surface) of the beam unit 152 and the upper end of the slide plate 264 of the substrate feeder 160P are substantially the same. Further, the main control device controls the vertical movement mechanism 144 of the substrate slide hand 140P to drive the suction pad 142 ascending (see arrow C), and the suction pad 142 causes + X on the lower surface (−Z surface) of the substrate P2. Start suction holding near both ends of the side. Further, at this stage, since the exposure to the substrate P1 is completed, the main control device drives the stage device 20P in the + X direction (see arrow D).

Next, as shown in FIG. 5A, the main control device sucks and holds the substrate P1 on the substrate unloading bearer device 183P (not shown in FIG. 5A, see FIGS. 1 and 2), and the substrate unloading bearer. By driving the apparatus 183P in the + X direction, the substrate P1 is offset in the + X direction on the substrate holder 28 (see arrow E). The offset amount varies depending on the size of the substrate P1, but is assumed to be, for example, about 50 mm to 100 mm, and is the distance to the position where the −X side end of the substrate P1 does not overlap with the substrate carry-in bearer device 182P. The substrate carry-out bearer device 183P moves the + X side of the substrate P1 onto the offset beam portion 185P in a state where the substrate P1 is attracted and held. At the time of offset, pressurized gas is supplied (air supplied) from the upper surface 28u of the substrate holder 28 to the lower surface of the substrate P1. As a result, the substrate P1 rises from the upper surface 28u of the substrate holder 28, and the friction between the lower surface of the substrate P1 and the upper surface 28u of the substrate holder 28 is negligible (low friction state). The main control device also supplies (supplies) the pressurized gas from the upper surface of the beam included in the offset beam unit 185P. As a result, the movement of the substrate P1 from the upper surface of the substrate holder 28 to the offset beam portion 185P is performed in a low friction state. It is not necessary to form the notch 28b in the substrate holder 28. As described above, the lengths of the long side and the short side of the upper surface 28u of the substrate holder 28 are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively. Therefore, if the substrate P protruding from the substrate holder 28A can be moved in the + X-axis direction while being held by the substrate unloading bearer device 183P, and the substrate P can be offset from the upper surface 28u of the substrate holder 28 to the + X side. , The notch 28b does not have to be formed on the substrate holder 28A. In this case, the plane correction on the substrate holder 28A can be performed even at the end of the substrate P.

Further, in FIG. 5A, the main control device drives the substrate slide hand 140P (suction pad 142 and vertical movement mechanism 144) along the rail 146 in the −X direction (see arrow F). At the time of this drive, the main control device ejects pressurized gas from the upper surface of the beam unit 152 of the port portion 150P and the upper surface of the slide plate 264 (plate portion 263) of the substrate feeder 160P. As a result, the substrate P2 is floated and conveyed on the beam unit 152 and the slide plate 264 in a non-contact state. At this time, the substrate P2 slightly bends due to its own weight following the upper surfaces of the beam unit 152 and the slide plate 264.

FIG. 5B shows a state in which the substrate slide hand 140P (suction pad 142 and vertical movement mechanism 144) has moved to the end on the −X side of the rail 146. In the state of FIG. 5B, the suction pad 142 is located at the position of the notch 263a of the plate portion 263 of the slide plate 264. On the other hand, the stage device 20P reaches the substrate replacement position at this stage. In the state of FIG. 5B, the end portion of the substrate P2 on the −X side is located above the suction pad 284 of the substrate carry-in bearer device 182P. At this stage, the main control device may adjust (align) the position of the substrate P2 with respect to the substrate holder 28 by adjusting the position of the suction pad 142 of the substrate slide hand 140P.

Next, as shown in FIG. 6A, the main control device ascends and drives the suction pad 284 of the substrate carry-in bearer device 182P (see arrow G). Further, the main control device starts suction holding of the substrate P2 by the suction pad 284. When the suction pad 284 sucks and holds the substrate P2, the suction pad 284 restrains the X position and the Y position of the substrate P2. Further, the main control device releases the suction holding of the substrate P2 by the suction pad 142 of the board slide hand 140P, and drives the suction pad 142 in the order of −Z direction, + X direction, −Z direction, and −X direction (). (See arrow H), the suction pad 142 is positioned on the lower surface side of the + X side end of the substrate P1. The suction pad 142 is driven as shown by the arrow H in order to avoid contact between the suction pad 142 and the substrate P1. When the suction pad 142 is positioned at the position shown in FIG. 6A, the main control device starts suction holding of the substrate P1 by the suction pad 142. Further, the main control device controls the vertical movement mechanism 255 to drive the beam unit 152 downward so that the upper surface of the beam unit 152 substantially coincides with the upper surface of the offset beam unit 185P (see arrow I).

Next, the main control device moves the stage device 20P in the −X direction as shown in FIG. 6 (b) (see arrow J). Further, the main control device moves the port portion 150P in the −X direction in accordance with (synchronously) the movement of the stage device 20P (see arrow K). As a result, the positional relationship between the stage device 20P and the port portion 150P is maintained. Further, the main control device moves the substrate slide hand 140P in the + X direction while the stage device 20P and the port portion 150P are driven in the −X direction (see arrow L).

As a result, the substrate holder 28 moves relative to the substrate feeder 160P in the direction away from it. In this case, as the substrate holder 28 moves away from the slide plate 264, the area of the substrate P2 held by the slide plate 264 gradually decreases, and the area of the substrate P2 supported by the substrate holder 28 gradually increases. It has become. The substrate holder 28 can hold the substrate P2 in order from the −X side end portion of the substrate P2 to the + X side end portion. As a result, the air between the substrate holder 28 and the substrate P2 can be discharged from the −X side toward the + X side, so that the substrate is deformed by the air between the substrate holder 28 and the substrate P2, or the substrate is deformed. It is possible to solve the problem caused by the air accumulation such that the flatness of the substrate P cannot be corrected on the holder 28.

Further, as the stage device 20P, the port portion 150P, and the substrate slide hand 140P move, the substrate P1 slides on the substrate holder 28 and the offset beam portion 185P, and the substrate P1 moves from the substrate holder 28 onto the beam unit 152. It is supposed to be listed. As described above, by the series of operations shown in FIG. 6B, at least a part of the operation of carrying out the board P1 from the board holder 28 and the operation of carrying in the board P2 from the board feeder 160P to the board holder 28 are performed in parallel. .. Therefore, the board exchange operation can be performed faster than the respective operations of the carry-out operation and the carry-in operation are performed serially.

Next, as shown in FIG. 7A, the main control device moves the port portion 150P and the substrate slide hand 140P in the + X direction at the same speed (see arrows M and N). Then, the main control device releases the suction holding of the substrate P1 by the suction pad 142 when the board slide hand 140P reaches the position (board transfer position) of FIG. 7A. The main control device may perform alignment (position adjustment) of the substrate P1 by slightly driving the suction pad 142 before releasing the suction holding of the suction pad 142. Further, the main control device may slightly lower the suction pad 142 after releasing the suction holding of the suction pad 142.

Next, the main control device lowers and drives the suction pad 284 of the substrate carry-in bearer device 182P. Further, the main control device starts suction holding of the substrate P2 by the substrate holder 28. When the substrate carry-in bearer device 182P can be finely driven in the X-axis direction, the substrate carry-in bearer device 182P is driven before the substrate holder 28 attracts and holds the substrate P2 for alignment (board holder of the substrate P2). (Position adjustment with respect to 28) may be performed.

Further, the main control device moves the stage device 20P that attracts and holds the substrate P2 to a predetermined exposure start position, and starts exposure to the substrate P2. The description of the exposure operation for the substrate P2 will be omitted.

Next, as shown in FIG. 7B, the main control device controls the vertical movement mechanism 255 of the port portion 150P to drive the beam unit 152 ascending, and the substrate P1 whose suction holding by the suction pad 142 is released. Is supported by the port portion 150P (see arrow O). Then, the main control device scoops the substrate P1 from the port portion 150P by driving the external transport device 300, and drives the external transport device 300 holding the substrate P1 in the + X direction to coat the substrate P1. / Carry out to an external device such as a developer. After the exposed substrate P1 is delivered to the external device, the main control device uses the external transfer device 300 to carry the substrate P3 to be exposed next to the substrate P2 into the port portion 150P (FIG. 4). Same as (a)).

As described in detail above, according to the first embodiment, the substrate holder 28 having a support surface for supporting the substrate P and a part of the lower surface (-X side) of the substrate P2 located above the substrate holder 28. A substrate carry-in bearer device 182P that attracts and holds the substrate P2, a substrate feeder 160P (slide plate 264) that has a surface inclined with respect to the XY surface and holds the substrate P2, and a substrate holder 28. It is provided with a substrate slide hand 140P that sucks and holds a part of the substrate P1 (the end on the + X side), and the main control device is a substrate feeder 160P (slide plate 264) from between the substrate P2 and the substrate holder 28. ) Is retracted along the X-axis direction, and the board slide hand 140P moves in the X-axis direction with respect to the board holder 28 while holding the board P1 to move the board P2. While carrying in on the board holder 28, the board P1 is carried out on the board holder 28. As a result, in the first embodiment, by sliding the substrate P2 to the substrate holder 28, it is possible to suppress the generation of an impact during the transfer. Further, in the first embodiment, since the substrate feeder 160P is fixed to the floor F, a movable part for driving the substrate feeder 160P becomes unnecessary, the structure can be simplified, and dust is generated. Can be reduced. Further, in the first embodiment, since the structure of the entire substrate transfer device 100P is simple, the cost can be reduced.

Further, in the first embodiment, when the substrate P1 held by the substrate slide hand 140P is carried out from the substrate holder 28, the port portion 150P and the offset beam portion 185P support the substrate P1 (FIG. 6). 6 (a), see FIG. 6 (b)). As a result, the exposed substrate P1 can be slid and conveyed from the substrate holder 28, so that the impact on the substrate is small, the possibility of cracks and scratches on the substrate is reduced, and dust generation can be reduced. it can.

Further, in the first embodiment, the port portion 150P supports the substrate P2 before exposure, and the substrate slide hand 140P holds and moves the substrate P1 supported by the port portion 150P to the substrate carry-in bearer device 182P. Hand over. In this way, the port portion 150P and the board slide hand 140P function both when the board is carried in and when the board is carried out, so that the necessary functions can be realized with a simple configuration. Further, since the substrate P is slid-conveyed from the port portion 150P to the substrate feeder 160P, the impact on the substrate is small, the possibility of cracks and scratches on the substrate is reduced, and dust generation can be reduced. ..

Further, in the first embodiment, the exposure apparatus 10P includes a substrate holder 28 that supports the substrate P and a substrate feeder 160P that holds the lower surface of the substrate P2 above the substrate holder 28, and is a main control device. Brings the substrate P2 onto the substrate holder 28 by driving the substrate holder 28 in a direction away from the substrate feeder 160P while a part of the substrate P2 is held by the substrate carry-in bearer device 182P. As a result, in the first embodiment, since the substrate feeder 160P can be fixed to the floor F, a movable portion for driving the substrate feeder 160P becomes unnecessary, and the structure can be simplified and the structure can be simplified. Dust generation can be reduced. Further, in the first embodiment, since the structure of the entire substrate transfer device 100P is simple, the cost can be reduced. Further, in the first embodiment, since the upper surface of the substrate feeder 160P (slide plate 264) is inclined with respect to the upper surface of the substrate holder 28, the substrate P2 is placed on the substrate holder 28 by performing the above operation. It can be transported by slide. As a result, it is possible to suppress the impact during substrate transfer and reduce dust generation.

Further, in the first embodiment, the substrate slide hand 140P in which the exposure apparatus 10P holds and moves a part of the exposed substrate P1 held by the substrate holder 28, and the substrate slide hand 140P holds the substrate P1. It has a port portion 150P that supports the substrate P1 while moving while moving. As a result, when the substrate is carried into the substrate holder 28 using the substrate feeder 160P, the exposed substrate P1 can be carried out from the substrate holder 28 in parallel.

Further, in the first embodiment, the port portion 150P moves in the −X direction following the movement of the substrate holder 28 in the −X direction when the substrate P1 is carried in and out, so that the substrate P2 is carried in. Therefore, even if the board holder 28 is moved, the board can be carried out in parallel with the board loading by following the port portion 150P. As a result, the throughput of substrate replacement can be improved.

(First modification)
Hereinafter, the first modification will be described with reference to FIGS. 8 to 11.

FIG. 8 schematically shows a side view of the stage device 20P and the substrate transfer device 100P ′ included in the exposure apparatus 10P ′ according to the first modification. Further, FIG. 9 is a plan view of the stage device 20P and the substrate transfer device 100P' provided by the exposure device 10P'of FIG.

As shown in FIGS. 8 and 9, the first modification is characterized in that the substrate feeder 160P'is provided in place of the substrate feeder 160P. The substrate feeder 160P'has a slide plate 264' as shown in FIGS. 8 and 9. As shown in FIG. 9, the slide plate 264'has a plate portion 263', a support portion 265', and a rotation mechanism 266. The support portion 265'is supported by a support pillar 262 at a predetermined height from the floor F. Unlike the first embodiment, the plate portion 263'and the support portion 265'are not fixed, and the upper surface (slide) of the plate portion 263'is caused by the rotational driving force around the Y axis of the rotation mechanism 266. The inclination angle of the upper surface of the plate 264') with respect to the XY plane is changed.

Further, a pair of substrate pick hands 268 are provided in the vicinity of the + X side end portion of the plate portion 263'. The substrate pick hand 268 can move along the X-axis direction while sucking and holding the lower surface of the substrate P. That is, the substrate pick hand 268 is a mechanism for sliding the substrate P along the surface of the plate portion 263'.

Hereinafter, the operation of the first modification will be described in detail with reference to FIGS. 10 (a) to 11 (b).

FIG. 10A is a diagram corresponding to FIG. 4B of the first embodiment. In this first modification, as shown in FIG. 10A, the main control device drives the rotation mechanism 266 in a state where the substrate P2 before exposure is placed on the beam unit 152 of the port portion 150P. The upper surface of the slide plate 264'(plate portion 263') is made substantially parallel to the XY plane. Further, the main control device drives the port portion 150P and brings it close to the substrate feeder 160P'. As a result, the upper surface of the slide plate 264'and the upper surface of the beam unit 152 are substantially flush with each other and are in close contact with each other.

Next, the main control device slides the substrate P2 along the upper surface of the beam unit 152 and the upper surface of the slide plate 264'using the suction pad 142 of the substrate slide hand 140P as shown in FIG. 10 (b). See arrow F). At the time of this slide movement, the main control device raises the substrate P2 by exhausting gas from the upper surface of the beam unit 152 and the upper surface of the slide plate 264'. Since the upper surface of the slide plate 264'and the upper surface of the beam unit 152 are substantially flush with each other, the suction pad 142 can move the substrate P2 from above the beam unit 152 to the slide plate 264'without deforming the substrate P2. As a result, there is no possibility that extra stress is applied to the substrate P2, and it is possible to prevent a part of the substrate P2 from being cracked or deformed. Further, during this slide movement, the main control device drives the board unloading bearer device 183P (see FIG. 2 and the like) to offset the board on the board holder 28 in the + X direction (see arrow E). ..

Next, as shown in FIG. 11A, the main control device ascends and drives the suction pad 284 of the substrate carry-in bearer device 182P (see arrow G). Further, the main control device drives the rotation mechanism 266 to incline the upper surface of the slide plate 264'with respect to the XY plane (so that the lower surface of the slide plate 264' is parallel to the XY plane). Further, the main control device releases the suction holding of the substrate P2 by the suction pad 142, starts the suction by the substrate pick hand 268, and moves the substrate pick hand 268 to move the substrate P2 along the upper surface of the slide plate 264'. To move. As a result, when the −X side end of the substrate P2 comes into contact with the suction pad 284, the main control device starts suction holding of the substrate P2 by the suction pad 284. Further, the main control device drives the suction pad 142 of the substrate slide hand 140P in the −Z direction and the −X direction (see arrow H') to drive the suction pad 142 to the lower surface side of the + X side end of the substrate P1. Position to. Then, the main control device starts the suction holding of the substrate P1 by the suction pad 142. Further, the main control device controls the vertical movement mechanism 255 to drive the beam unit 152 downward so that the upper surface of the beam unit 152 substantially coincides with the upper surface of the offset beam unit 185P (see arrow I).

Next, the main control device moves the stage device 20P in the −X direction as shown in FIG. 11 (b) (see arrow J). Further, the main control device moves the port portion 150P in the −X direction in accordance with (synchronously) the movement of the stage device 20P (see arrow K). Further, the main control device moves the substrate slide hand 140P in the + X direction while the stage device 20P and the port portion 150P are driven in the −X direction (see arrow L).

As described above, even in the first modification, the substrate on the substrate holder 28 can be replaced. After that, the same operation as that of the first embodiment (FIG. 7) is executed.

As described above, according to the first modification, the same effect as that of the first embodiment can be obtained. Further, according to the first modification, the posture of the slide plate 264'of the substrate feeder 160P'can be changed, and the upper surface (the surface holding the substrate) of the slide plate 264' is parallel to the XY plane. And since it is possible to make a transition between the tilted state and the tilted state, it is possible to suppress the bending of the substrate when the substrate is conveyed from the port portion 150P to the slide plate 264'.

(Second modification)
Hereinafter, the second modification will be described with reference to FIGS. 12 to 15.

In FIG. 12, the stage device 20P and the substrate transfer device 100Q included in the exposure device 10Q according to the second modification are shown in a plan view. As shown in FIG. 12, the substrate transfer device 100Q of the second modification includes a substrate feeder 160Q.

The substrate feeder 160Q has a slide plate 264 similar to that of the first embodiment, and also has a pair of rotation mechanisms 266 that rotate the slide plate 264 around the Y axis. Further, the substrate feeder 160Q also has a pair of X drive mechanisms 269 that move the pair of rotation mechanisms 266 in the X-axis direction. That is, the slide plate 264 of the substrate feeder 160Q is rotatable around the Y-axis and can be reciprocated in the X-axis direction as well.

Hereinafter, the operation of the second modification will be described in detail with reference to FIGS. 13A to 15. In addition, in FIGS. 13A to 15, the X drive mechanism 269 is not shown for convenience of illustration.

FIG. 13 (a) is a diagram corresponding to FIG. 4 (b) of the first embodiment. In this second modification, as shown in FIG. 13A, the main control device drives the rotation mechanism 266 with the substrate P2 mounted on the beam unit 152 of the port portion 150P, and the substrate feeder 160Q. Make the upper surface of the slide plate 264 parallel to the XY plane. Further, the main control device drives the port portion 150P and brings it close to the substrate feeder 160Q. As a result, the upper surface of the slide plate 264 and the upper surface of the beam unit 152 are substantially flush with each other and are in close proximity to each other.

Next, the main control device slides the substrate P2 along the upper surface of the beam unit 152 and the upper surface of the slide plate 264 by using the suction pad 142 of the substrate slide hand 140P as shown in FIG. 13 (b). At the time of this slide movement, the main control device raises the substrate P2 by exhausting air from the upper surface of the beam unit 152 and the upper surface of the slide plate 264. Further, during this slide movement, the main control device drives the board unloading bearer device 183P (see FIG. 2 and the like) to offset the board on the board holder 28 in the + X direction (see arrow E). .. As described above, since the upper surface of the slide plate 264'and the upper surface of the beam unit 152 are almost flush with each other, the suction pad 142 moves the substrate P2 from the beam unit 152 to the slide plate 264'without deforming the substrate P2. It has the effect of being able to make it. As a result, there is no possibility that extra stress is applied to the substrate P2, and it is possible to prevent a part of the substrate P2 from being cracked or deformed.

Next, the main controller controls the X drive mechanism 269 so that the slide plate 264 (and the substrate P2) of the substrate feeder 160Q is located above the substrate holder 28 as shown in FIG. 14 (a). Move in the −X direction (see arrow T). As a result, the distance that the substrate holder 28 moves in the + X direction can be shortened. Further, the dimension of the surface plate 22 in the X direction can be reduced accordingly, and the exposure apparatus 10Q can be miniaturized.

The main control device drives the suction pad 142 of the substrate slide hand 140P in the −Z direction and the −X direction (see arrow H ”) to move the suction pad 142 to the lower surface of the substrate P1 as shown in FIG. 14 (b). Positioning is performed at the end on the + X side of the main control device, and the main control device starts suction holding of the substrate P1 by the suction pad 142.

Next, as shown in FIG. 14B, the main control device drives the rotation mechanism 266 to incline the upper surface of the slide plate 264 with respect to the XY plane (the lower surface of the slide plate 264 is parallel to the XY plane). To be). Further, the main control device ascends and drives the suction pad 284 of the substrate carry-in bearer device 182P (see arrow G). Further, the main control device controls the vertical movement mechanism 255 to drive the beam unit 152 downward and in the −X direction so that the upper surface of the beam unit 152 substantially coincides with the upper surface of the offset beam unit 185P. (See arrow I').

Next, the main control device moves the stage device 20P in the −X direction as shown in FIG. 15 (see arrow J). Further, the main control device moves the port portion 150P in the −X direction in accordance with (synchronously) the movement of the stage device 20P (see arrow K). Further, the main control device moves the slide plate 264 of the substrate feeder 160Q in the + X direction via the X drive mechanism 269 (see arrow U). By such a series of board replacement operations, the stage device 20P and the board feeder 160Q are moved in opposite directions, so that the board can be replaced in a shorter time. Further, the main control device moves the substrate slide hand 140P in the + X direction while the stage device 20P and the port portion 150P are driven in the −X direction (see arrow L).

As a result, the substrate P1 is carried out from above the substrate holder 28, and the slide plate 264 of the substrate feeder 160P retracts from between the substrate P2 and the substrate holder 28. As described above, even in this second modification, it is possible to replace the substrate on the substrate holder 28. After that, the same operation as that of the first embodiment (FIG. 7) is executed.

As described above, according to the second modification, since the stage device 20P and the substrate feeder 160Q are moved in opposite directions when the substrate is exchanged, the substrate can be exchanged in a shorter time. Further, it is not necessary to prepare the substrate pick hand 268 used in the first modification. Further, when the substrate P2 is conveyed above the substrate holder 28, the upper surface of the substrate feeder 160Q (slide plate 264) is maintained parallel to the XY plane, so that the end portion of the substrate P2 on the −X side is maintained. It is possible to prevent the substrate holder 28 and the substrate carry-in bearer device 182P from coming into contact with each other.

In this second modification, the end portion of the substrate P2 on the −X side can be brought into contact with the substrate holder 28 by rotating the slide plate 264 around the Y axis, so that the substrate carry-in bearer device 182P is not provided. May be.

(Third modification example)
Hereinafter, the third modification will be described with reference to FIGS. 16 to 19 (b).

In FIG. 16, the stage device 20P included in the exposure device 10R according to the third modification and the substrate transfer device 100R are shown in a plan view. As shown in FIG. 16, the substrate transfer device 100R of the third modification includes a substrate feeder 160R.

The substrate feeder 160R has a slide plate 264'similar to that of the first modification, and also has a pair of rotation mechanisms 266 that rotate the slide plate 264' around the Y axis. Further, the substrate feeder 160R also has a pair of X drive mechanisms 269 that move the pair of rotation mechanisms 266 in the X-axis direction. That is, the slide plate 264'of the substrate feeder 160R is rotatable around the Y axis and can be reciprocated in the X-axis direction as well. Further, as in the first modification, a pair of substrate pick hands 268 are provided in the vicinity of the + X side end of the slide plate 264'.

Hereinafter, the operation of the third modification will be described in detail with reference to FIGS. 17 (a) to 19 (b). In FIGS. 17 (a) to 19 (b), the X drive mechanism 269 is not shown for convenience of illustration.

FIG. 17A is a diagram corresponding to FIG. 4B of the first embodiment. In this third modification, as shown in FIG. 17A, the main control device drives the rotation mechanism 266 with the substrate P2 mounted on the beam unit 152 of the port portion 150P, and the substrate feeder 160R. The upper surface of the slide plate 264'is parallel to the XY plane. Further, the main control device drives the port portion 150P and brings it close to the substrate feeder 160R. As a result, the upper surface of the slide plate 264'and the upper surface of the beam unit 152 are substantially flush with each other and are in close contact with each other.

Next, the main control device slides the substrate P2 along the upper surface of the beam unit 152 and the upper surface of the slide plate 264'using the suction pad 142 of the substrate slide hand 140P as shown in FIG. 17 (b). At the time of this slide movement, the main control device raises the substrate P2 by exhausting air from the upper surface of the beam unit 152 and the upper surface of the slide plate 264. By this slide movement, after the substrate P2 is placed on the upper surface of the slide plate 264', the suction pad 142 releases the suction of the substrate P2. The substrate pick hand 268 starts sucking the substrate P2 that has been released from being sucked by the suction pad 142. Further, during this slide movement, the main control device drives the board unloading bearer device 183P (see FIG. 2 and the like) to offset the board on the board holder 28 in the + X direction (see arrow E). ..

Next, as shown in FIG. 18A, the main control device drives the rotation mechanism 266 and inclines the upper surface of the slide plate 264'with respect to the XY plane (the lower surface of the slide plate 264' is relative to the XY plane. Make it parallel). Further, the main control device lowers and drives the suction pad 142 of the substrate slide hand 140P, and also lowerly drives the beam unit 152 of the port portion 150P.

Next, as shown in FIG. 18B, the main control device controls the X drive mechanism 269 to move the slide plate 264'(and the substrate P2) in the −X direction (see arrow T). Further, the main control device drives the suction pad 142 of the substrate slide hand 140P to position the suction pad 142 at the + X side end of the lower surface of the substrate P1 as shown in FIG. 18 (b). Then, the main control device starts the suction holding of the substrate P1 by the suction pad 142. Further, as shown in FIG. 18B, the main control device brings the beam unit 152 close to the offset beam unit 185P. Further, the main control device ascends and drives the suction pad 284 of the substrate carry-in bearer device 182P. Then, the main control device moves the substrate P2 along the upper surface of the slide plate 264'by driving the substrate pick hand 268. As a result, the −X side end of the substrate P2 comes into contact with the suction pad 284, so that the main control device starts suction holding of the substrate P2 by the suction pad 284.

Next, the main control device moves the stage device 20P in the −X direction as shown in FIG. 19A (see arrow J). Further, the main control device moves the port portion 150P in the −X direction in accordance with (synchronously) the movement of the stage device 20P (see arrow K). Further, the main control device moves the slide plate 264'of the substrate feeder 160R in the + X direction via the X drive mechanism 269 (see arrow U). Further, the main control device moves the substrate slide hand 140P in the + X direction while the stage device 20P and the port portion 150P are driven in the −X direction (see arrow L).

As a result, as shown in FIG. 19B, the substrate P1 is carried out from above the substrate holder 28, and the slide plate 264 of the substrate feeder 160P retracts from between the substrate P2 and the substrate holder 28. As described above, even in this third modification, it is possible to replace the substrate on the substrate holder 28. After that, the same operation as that of the first embodiment (FIG. 7) is executed.

As described above, according to the third modification, the same effect as that of the first embodiment can be obtained. Further, since the substrate pick hand 268 can deliver the substrate P2 to the suction pad 284 instead of the suction pad 142, it is shown in FIG. 18B after the suction pad 142 delivers the substrate P2 to the suction pad 284. You can move quickly to the desired position. Specifically, the suction pad 142 is located at the position shown in FIG. 18B after the substrate P2 is delivered to the substrate pick hand 268 and before the substrate P2 is delivered from the substrate pick hand 268 to the suction pad 284. It becomes possible to move to, and the board exchange time can be shortened.

(Fourth modification)
Next, the exposure apparatus 10S according to the fourth modification will be described with reference to FIGS. 20A to 23.

FIG. 20A shows a plan view of the substrate feeder 160S included in the substrate transfer device 100S according to the fourth modification, and FIG. 20B shows a side view of the substrate feeder 160S.

As shown in FIGS. 20 (a) and 20 (b), the substrate feeder 160S extends in the Y-axis direction provided at the end of the slide plate 364 and the upper surface (+ Z surface) of the slide plate 364 on the + X side. It has a plate-shaped member 367 and a substrate transport arm 369 provided near the + X-side end of the side surface (+ Y surface and −Y surface) of the slide plate 364. Further, the substrate feeder 160S has an X drive mechanism 368 that applies a driving force in the X-axis direction to the plate-shaped member 367.

The slide plate 364 has a comb-shaped shape in a plan view (viewed from the + Z direction) and a trapezoidal shape in a side view (viewed from the −Y direction). The comb teeth of the slide plate 264 and the position of the beam unit 152 of the port portion 150P in the Y-axis direction do not overlap.

The substrate transfer arm 369 is an articulated robot or a parallel link robot having a suction pad at its tip. The suction pad can suck and hold the substrate P (P1, P2).

Here, as shown in FIG. 21A, the substrate transfer device 100S of the fourth modification is provided with the substrate slide hand 140P described in the first embodiment and the first to third modifications. Absent. Further, in the fourth modification, the stage device 20P'in which a part of the stage device 20P described above has been modified is used. In the stage device 20P', as shown in FIG. 21A, the notch 28a is not formed in the substrate holder 28. Further, the pair of substrate carry-in bearer devices 182P move the suction pad 284 in the Z-axis direction, and the entire substrate carry-in bearer device 182P can move in the X-axis direction (see arrow V).

Next, the operation of the fourth modification will be described in detail with reference to FIGS. 21A to 23. In FIGS. 21 (a) to 23, the X drive mechanism 368 is not shown for convenience of illustration.

FIG. 21A shows a state in which the substrate P2 before exposure is conveyed from the external transfer device 300 (not shown) onto the beam unit 152 of the port portion 150P. Before the substrate P2 is conveyed, the beam unit 152 is positioned so that the slide plate 364 of the substrate feeder 160S is below the beam unit 152.

The main controller then drives the beam unit 152 downward (see arrow W1), as shown in FIG. 21 (b). As a result, the substrate P2 is delivered to the upper surface of the slide plate 364. The beam unit 152 descends so as to pass through the gap between the comb teeth of the slide plate 364.

In the state where the substrate P2 is delivered to the slide plate 364, the lower surface of the substrate P2 is suction-held by the suction pad at the tip of the substrate transfer arm 369. The main controller then moves the slide plate 364 in the −X direction, as shown in FIG. 22 (a) (see arrow W2). Further, the main control device raises the suction pad 284 of the substrate carry-in bearer device 182P (see arrow L1) and moves the board carry-in bearer device 182P in the + X direction (see arrow L2). Then, the main control device slides the substrate P2 along the upper surface of the slide plate 364 by extending the substrate transport arm 369. At this time, since the pressurized gas is ejected from the upper surface of the slide plate 364, the substrate P2 is levitated and conveyed in a non-contact state with respect to the upper surface of the slide plate 364. When the substrate P2 reaches the position shown in FIG. 22A, the −X side end of the substrate P2 comes into contact with the suction pad 284, so that the main control device starts suction holding of the substrate P2 by the suction pad 284.

While the substrate P2 is being moved as described above, the main control device moves the substrate P1 on the substrate holder 28 in the + X direction via the substrate unloading bearer device 183P (see FIG. 2 and the like) (arrow E). reference). That is, the main control device offsets the substrate P1 from the substrate holder 28 in the + X direction.

Next, as shown in FIG. 22B, the main control device drives the substrate transfer arm 369 to bring the suction pad at the tip into contact with the lower surface of the substrate P1 to start suction holding.

Next, as shown in FIG. 23, the main control device moves the slide plate 364 of the substrate feeder 160S in the + X direction via the X drive mechanism 368 (see arrow W4). As a result, the substrate P1 held by the substrate transport arm 369 is slid out from above the substrate holder 28 along the beam unit 152, and the slide plate 364 of the substrate feeder 160P retracts from between the substrate P2 and the substrate holder 28. , The substrate P2 is carried onto the substrate holder 28. As described above, even in the fourth modification, it is possible to replace the substrate on the substrate holder 28. The main control device may move the stage device 20P and the port portion 150P in the −X direction while the slide plate 364 moves in the + X direction. As a result, the substrates P1 and P2 can be exchanged in a shorter time.

After FIG. 23, since the substrate P1 is placed on the beam unit 152, the external transfer device 300 carries the substrate P1 out of the exposure apparatus 10S.

As described above, according to the fourth modification, the substrate holder has a simple configuration that does not use the substrate slide hand 140P, that is, a configuration that does not require a drive mechanism for driving the substrate slide hand 140P in the X direction. The board on 28 can be replaced. Further, by moving the board feeder 160P in the + X direction, the board P2 can be carried into the board holder 28 and the board P1 can be carried out from the board holder 28 at the same time. Further, the board P2 can be carried into the board holder 28 and the board P1 can be carried out from the board holder 28 only by the drive system for moving the board feeder 160P in the X direction.

Further, in the fourth modification, it is not necessary to prepare a drive mechanism for moving the slide plate 364 up and down, so that the configuration can be simple. Further, since it is not moved up and down, the rigidity of the entire substrate feeder 160S can be increased.

Further, in the fourth modification, since the board transfer arm 369 is provided on the slide plate 364, a dedicated mechanism for moving the board transfer arm 369 in the X-axis direction is not provided as in the board slide hand 140P. However, the configuration can be simplified from this point as well.

In the fourth modification, the case where the slide plate 364 of the substrate feeder 160S has a comb-like shape has been described, but the present invention is not limited to this. For example, as shown in FIG. 24, instead of the slide plate 364, a plurality of thin plates (trapezoidal thin plates viewed from the + Y direction) 364'are placed at predetermined intervals in the Y-axis direction on the lower surface of the plate-shaped member 367. It may be fixed to (-Z plane). Even in this way, the same effect as that of the fourth modification can be obtained.

(Fifth modification)
Next, the exposure apparatus 10S'according to the fifth modification will be described with reference to FIG.

FIG. 25 is a side view showing a part of the exposure apparatus 10S'according to the fifth modification. The fifth modification is characterized in that the port portion 150P'is used instead of the port portion 150P of the fourth modification described above. Further, in order to correspond to the port portion 150P', the substrate feeder 160S assumes that the slide plate 364 can move in the Z-axis direction in addition to the X-axis direction. In the fifth modification, the same stage device 20P as in the first embodiment is used as the stage device.

The port portion 150P'has a plurality of beam units 152 and a parallel link mechanism 255'that moves the plurality of beam units 152 in parallel. The parallel link mechanism 255'is movable in the X-axis direction along the rail 257.

In the fifth modification, the slide plate 364 of the main control device moves to the lower side of the beam unit 152 before the substrate P2 before exposure is transported from the external transport device to the beam unit 152 of the port portion 150P'. .. Then, the main control device raises the slide plate 364 after the substrate P2 is transported from the external transport device to the beam unit 152. As a result, the substrate P2 is delivered from the beam unit 152 onto the slide plate 364. Others are the same as those of the fourth modification described above.

As described above, in the fifth modification, the same effect as that of the fourth modification described above can be obtained. Further, in the fifth modification, since the port portion 150P'has a parallel link mechanism 255', even if the rail 267 is shortened (even if the movement amount of the port portion 150P'in the X-axis direction is reduced), the fifth modification is performed. 4 The same effect as the modified example can be obtained.

(6th modification)
Next, the sixth modification will be described with reference to FIGS. 26 (a) to 27 (b). FIG. 26A shows a side view of the substrate transfer device 100T according to the sixth modification. As shown in FIG. 26A, the substrate transfer device 100T includes a substrate feeder 160T, a port portion 150T, and a substrate slide hand 140P similar to that of the first embodiment.

The substrate feeder 160T has a slide plate 264'similar to that of the first modification, and a pair of substrate pick hands 268 are provided at the + X side end of the upper surface of the slide plate 264'. The slide plate 264'is moved along the X-axis direction by an X drive mechanism (not shown).

The port portion 150T has a plurality of beam units 152 as before. The plurality of beam units 152 are moved by a pair of Z-axis drive mechanisms 255A and 255B. Since the Z-axis drive mechanisms 255A and 255B are driven independently, the beam unit 152 is tilted with respect to the X-axis when the upper ends of the Z-axis drive mechanisms 255A and 255B are controlled to different height positions. It becomes a state (see FIG. 26 (b)). Further, when the upper ends of the Z-axis drive mechanisms 255A and 255B are controlled to the same height position, the upper surface of the beam unit 152 is in a state parallel to the XY plane (see FIG. 26A). Further, the Z-axis drive mechanisms 255A and 255B and the beam unit 152 are moved in the X-axis direction along the rail 257.

Next, the operation of the sixth modification will be described.

In the sixth modification, as shown in FIG. 26A, when the substrate P2 before exposure is conveyed from the external transfer device 300 onto the beam unit 152 of the port portion 150T, the main control device is transferred to FIG. 26. As shown in (b), the Z-axis drive mechanisms 255A and 255B are driven. At this time, the main control device makes the height of the upper end portion of the Z-axis drive mechanism 255A lower than the height of the upper end portion of the Z-axis drive mechanism 255B. As a result, the beam unit 152 holding the substrate P2 is tilted so that the end portion on the −X side is lower than the end portion on the + X side. At this time, the upper surface of the beam unit 152 is substantially parallel to the upper surface of the slide plate 264'of the substrate feeder 160T. Further, the main control device raises the suction pad 142 of the substrate slide hand 140P and causes the suction pad 142 to suck and hold the lower surface of the substrate P2.

Next, the main control device moves the suction pad 142 in the −X direction and the −Z direction as shown in FIG. 27 (a). As a result, the substrate P2 is conveyed along the upper surfaces of the beam unit 152 and the slide plate 264'. When the suction pad 142 is moved, the main control device raises the substrate P2 by exhausting air from the upper surface of the beam unit 152 and the upper surface of the slide plate 264'. When the substrate P2 reaches the position shown in FIG. 27A, the main control device starts suction holding of the lower surface of the substrate P2 by the substrate pick hand 268 and stops suction holding of the suction pad 142.

Next, as shown in FIG. 27 (b), the main control device drives the slide plate 264'in the −X direction and the substrate pick hand 268 in the −X direction. As a result, the −X end of the substrate P2 comes into contact with the suction pad 284 of the substrate carry-in bearer device 182P, so that the main control device starts suction holding of the lower surface of the substrate P2 by the suction pad 284 and picks the substrate. The suction holding of the substrate P2 by the hand 268 is released. Further, the main control device brings the suction pad 142 of the substrate slide hand 140P into contact with the lower surface of the substrate P1 on the substrate holder 28, and starts the suction holding of the substrate P1 by the suction pad 142.

After that, the main control device moves the stage device 20P in the −X direction and the port portion 150T in the −X direction. Further, the main control device moves the substrate slide hand 140P in the + X direction while the stage device 20P and the port portion 150T are driven in the −X direction.

As a result, the slide plate 264'of the substrate feeder 160T is retracted from between the substrate P2 and the substrate holder 28, so that the substrate P2 is placed on the substrate holder 28. Further, the substrate P1 is transferred onto the beam unit 152.

As described above, according to the sixth modification, the same effect as that of the first embodiment can be obtained, and by inclining the beam unit 152, the beam unit 152 is not deformed (bent) of the substrate. It becomes easy to slide the substrate feeder 160T from above. Further, by making the upper surface of the beam unit 152 substantially parallel to the upper surface of the external transfer device 300, the transfer of the substrate from one of the beam unit 152 and the external transfer device 300 to the other can be performed without deforming the substrate. be able to.

(7th modification)
Next, a seventh modification will be described with reference to FIG. 28. The seventh modification is characterized in that a cover 199 is provided on the slide plate 264 of the substrate feeder 160P of the first embodiment.

The cover 199 has an inverted U-shaped cross section in YZ, and the substrate can be slid in between the cover 199 and the slide plate 264 from the + X side, and the substrate can be slid out from the −X side. You can do it. Although FIG. 28 shows the case where the cover 199 is transparent, the cover 199 does not have to be transparent.

In the seventh modification, by providing the cover 199, it is possible to prevent dust from adhering to the substrate P and to keep the temperature of the substrate P constant.

The cover 199 can be appropriately provided on a slide plate other than the first embodiment (excluding an example in which the substrate is not slid into the slide plate from the port portion). In particular, in the case of a substrate feeder fixed on the floor F, since the substrate feeder does not move, there is no particular problem even if the weight is increased by providing the cover 199.

(8th modification)
Next, the eighth modification will be described with reference to FIG. 29. As shown in FIG. 29A, the eighth modification is characterized in that the upper surface of the slide plate 264 of the substrate feeder 160P of the first embodiment is curved. By bending the upper surface (board support surface) of the slide plate 264 in this way, the cross-sectional coefficient of the board can be increased. That is, it is possible to obtain the same effect that the thickness of the substrate is several times to several hundred times larger than the actual thickness with respect to the bending of the substrate.

By doing so, even if the substrate P is placed on the substrate feeder 160P with the −X side end of the substrate P protruding as shown in FIG. 29B, the −X side of the substrate P It is possible to suppress the occurrence of bending (dripping) at the end portion. Further, since the occurrence of bending (sagging) of the substrate P is suppressed, when the substrate P is brought into contact with the substrate holder 28, the substrate P can be brought into contact with the central portion of the side on the −X side in the Y-axis direction. Therefore, since the substrate P is supported by the substrate holder 28 so as to spread from the central portion in the Y-axis direction in the + Y-axis direction and the −Y-axis direction, wrinkles can be less likely to occur at the end portion on the −X side of the substrate P.

<< Second Embodiment >>
Next, the exposure apparatus according to the second embodiment will be described with reference to FIGS. 30 (a) to 41 (b). The configuration of the exposure apparatus 10G according to the second embodiment is the same as that of the first embodiment except that a part of the configuration and operation of the substrate transfer apparatus are different. Therefore, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

30 (a) and 30 (b) are a plan view and a side view of the exposure apparatus 10G according to the second embodiment, respectively. 31 (a) and 31 (b) are perspective views of the substrate carry-in hand 161G according to the second embodiment.

(Stage device 20G)
The stage device 20G is the same as the stage device 20P of the first embodiment. In the second embodiment, the code of the substrate holder is described as "28G".

(Board transfer device 100G)
In the substrate transport device 100G according to the second embodiment, each of the plurality of beam units 152 is positioned inside the both ends in the X-axis direction by a plurality of (for example, two) rod-shaped legs 154 extending in the Z-axis direction. It is supported from below. The plurality of legs 154 that support each beam unit 152 are connected to each other near the lower end portion by a base plate 156. In the substrate transfer device 100G, the base plate 156 is moved in the X-axis direction with a predetermined stroke by an X actuator (not shown) so that the plurality of beam units 152 are integrally moved in the X-axis direction with a predetermined stroke. It has become. Further, since the base plate 156 is moved in the Z-axis direction by the Z actuator 158, the plurality of beam units 152 can be integrally moved up and down in the Z-axis direction. In addition, in FIG. 30A and the following plan views, the illustration of the base plate 156 is omitted.

In the substrate transport unit 160G according to the second embodiment (corresponding to the substrate feeder 160P of the first embodiment), as shown in FIG. 30A, there are a plurality of substrate carry-in hands 161G (for example, eight in this embodiment). ) Has a finger portion 162G. The vicinity of the end portion on the −X side of the plurality of finger portions 162G is connected to each other by the connecting member 163G. The connecting member 163G has a configuration in which the substrate P can be floated and supported by supplying (supplying) gas to the back surface of the substrate P held by the substrate carry-in hand 161G. On the other hand, the + X side ends of the plurality of finger portions 162G are free ends, and the adjacent finger portions 162G are open to the port portion 150G side. Further, as shown in FIG. 30A, each finger portion 162G is arranged so that the positions in the Y-axis direction do not overlap with the plurality of beams of the plurality of beam units 152 in a plan view.

As shown in FIGS. 31 (a) and 31 (b), of the plurality of finger portions 162G, the finger portions 162G1 at both ends in the Y-axis direction have a thickness on the −X side (board holder 28G side) in the side view. It has a triangular shape that is thin and thick on the + X side (port portion 150G side). On the other hand, the thickness of the inner finger portion 162G2 on the port portion side is thinner than that of the finger portions 162G1 at both ends.

Further, as shown in FIGS. 31 (a) and 31 (b), arms 168 of the substrate carry-in hand 161G are attached to the finger portions 162G1 at both ends. As shown in FIG. 30A, both ends of the arm 168 are connected to the X-axis drive device 164.

As shown in FIGS. 30A and 30B, the substrate carry-in hand 161G has a pair of substrate pick hands 167G provided on the finger portions 162G1 at both ends in the Y-axis direction. The substrate pick hand 167G can be moved along the finger portion 162G1 with a predetermined stroke in the X-axis direction and the Z-axis direction by a driving device (not shown).

Further, the substrate pick hand 167G can attract and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown).

(Transport device 180G)
The transport device 180G is the same as the transport device 180P of the first embodiment.

(About board replacement operation)
Hereinafter, the operation of exchanging the substrate P on the substrate holder 28G in the exposure apparatus 10G according to the second embodiment will be described with reference to FIGS. 32 (a) to 40 (b).

As shown in FIGS. 32 (a) and 32 (b), while the stage device 20G is performing the exposure process, the external transfer device 300 is moved in the −Z direction to mount the new substrate P2 on the beam unit 152. To do. After that, the external transport device 300 is moved in the + X direction and exits (see arrow A1).

The board carry-in hand 161G is moved in the + X direction and enters under the beam unit 152 from the −X side (board holder 28G side) (see arrow A2).

After that, as shown in FIGS. 33 (a) and 33 (b), the stage device 20G that has completed the exposure process moves to the substrate transfer position with the substrate transport unit 160G (see arrow B1).

The beam unit 152 is moved in the −Z direction by the Z actuator 158 while holding the substrate P2 (see arrow B2). At this time, a part of the substrate P2 on the beam unit 152 comes into contact with the substrate pick hand 167G of the substrate carry-in hand 161G. The substrate pick hand 167G sucks and grips the lower surface of the substrate P2.

After that, as shown in FIGS. 34 (a) and 34 (b), in the stage device 20G, the board P1 on the board holder 28G is offset in the + X direction by the board unloading bearer device 183P (see arrow C1). At this time, the substrate holder 28G and the offset beam portion 185P supply (supply) gas to the back surface of the substrate P1 so that the substrate P1 is moved in a floating state.

Pressurized gas is ejected from the beam unit 152. Further, the beam unit 152 gradually continues to descend (see arrow C2).

The substrate carry-in hand 161G is gradually moved in the −X direction while the substrate P2 on the beam unit 152 is sucked and gripped by the substrate pick hand 167G (see arrow C3). The substrate P2 moves in the −X direction as the substrate carry-in hand 161G moves in the −X direction.

After that, as shown in FIGS. 35A and 35B, the substrate carry-in hand 161G is moved in the −X direction to the X position where the crotch portion of the finger portion 162G and the beam unit 152 do not overlap in a plan view. To.

The beam unit 152 is moved down to the lower part of the board carry-in hand 161G (see arrow D1), and the new board P2 is completely delivered to the board carry-in hand 161G. At this time, on the board carry-in hand 161G, the relative position of the board P2 with respect to the board carry-in hand 161G may be adjusted by a pair of board pick hands 167G.

After that, as shown in FIGS. 36 (a) and 36 (b), the substrate carry-in hand 161G is moved in the −X direction while holding the substrate P2 (see arrow E1), and is placed at a predetermined position in the sky above the substrate holder 28G. To be placed in.

In the stage device 20G, the suction pad 284 of the substrate carry-in bearer device 182P is moved in the + Z direction by the drive mechanism 286 (see arrow E2). The substrate carry-in hand 161G pushes the substrate P2 diagonally downward by the substrate pick hand 167G. As a result, the end portion of the substrate P2 on the −X side comes into contact with the suction pad 284. As a result, the suction pad 284 comes into contact with the board P2 on the board carry-in hand 161G waiting above the board holder 28G from below, and sucks and holds the vicinity of the −X side end of the board P2. At this timing, the substrate pick hand 167G may adjust the position of the substrate P2 with respect to the substrate holder 28G.

Further, in parallel with the suction holding operation of the substrate P2 by the suction pad 284, the substrate unloading hand 170A is moved to suck and grip the lower surface of the portion of the substrate P1 offset to the + X side from the substrate holder 28G.

The beam unit 152 is moved in the −X direction and the −Z direction (see arrows E3 and E4), and stops at the substrate transfer position with the substrate holder 28G. Further, the pressurized gas is ejected from the beam unit 152. As a result, the beam unit 152 serves as a guide for supporting the substrate P1 carried out from the substrate holder 28G.

After that, the grip of the substrate P2 by the substrate pick hand 167G of the substrate carry-in hand 161G is released, and as shown in FIGS. 37 (a) and 37 (b), the suction pad 284 of the board carry-in bearer device 182P is attached to the substrate P2. The substrate transport portion 160G is moved in the carry-out direction (+ X side) while the end portion on the −X side is sucked and gripped (see arrow F1). When the board transport unit 160G is moved in the carry-out direction (+ X side), the board carry-out hand 170A holding the board P1 is also moved in the + X direction.

The stage device 20G is moved in the −X direction in parallel with the substrate transport unit 160G being moved in the carry-out direction (see arrow F2). At this time, the port portion 150G is also moved in the −X direction so as to follow the movement of the stage device 20G in the −X direction (see arrow F3). As a result, the substrate P1 moves from the substrate holder 28G onto the port portion 150G (plural beam units 152). At this time, since the pressurized gas is ejected from the upper surface of each of the plurality of beam units 152, the substrate P1 is held on the substrate holder 28G and the port portion 150G in a non-contact state (the substrate unloading hand 170A). (Excluding the part) is floated and transported. Since the board loading hand 161G is moved in the + X direction and the stage device 20G is moved in the −X direction, the board P1 on the board holder 28G can be carried out and the board P2 to the board holder 28G can be carried out in a shorter time. Can be carried in partly in parallel.

As shown in FIGS. 38 (a) and 38 (b), only the substrate transport portion 160G is moved in the carry-out direction (+ X side) (see arrow G1), and the substrate P1 is ported from above the substrate holder 28G. It may be moved onto the unit 150G (plural beam units 152).

After that, as shown in FIGS. 39 (a) and 39 (b), the substrate carry-out hand 170A releases the grip of the board P1 and is moved in the −X direction together with the board carry-in hand 161G (see arrow H1). The port portion 150G is moved in the + X direction while holding the substrate P2 on the beam unit 152 (see arrow H2).

In the stage device 20G, after the board carry-in bearer device 182P aligns the board P2, the suction pad 284 is moved in the −Z direction by the drive mechanism 286, and a part of the suction pad 284 is housed in the notch 28a (arrow H3). reference). As a result, the substrate P2 is attracted to the substrate support surface of the substrate holder 28G. The position adjustment (alignment) of the substrate P2 described here can be omitted, and may be controlled so as to be performed as necessary.

After that, as shown in FIGS. 40A and 40B, when the substrate carry-in hand 161G moves to a position where it does not interfere with the substrate P1, the beam unit 152 is moved in the + Z direction, and the substrate with the external transfer device 300 is used. Move to the delivery position.

The external transfer device 300 collects the substrate P1 on the beam unit 152, and then transfers the new substrate P3 to the port portion 150G.

As described in detail above, according to the second embodiment, the port portion 150G side is open between the adjacent finger portions 162G of the substrate carry-in hand 161G. As a result, the substrate carry-in hand 161G directly enters below the beam unit 152 from the substrate holder 28G side and is moved above the beam unit 152 to scoop up the substrate P2 on the beam unit 152 and to scoop up the substrate holder. It can move to the 28G side. Therefore, even when the substrate P2 is placed on the beam unit 152, the substrate carry-in hand 161G can enter below the substrate P2 with a short moving distance in the X-axis direction. That is, the substrate carry-in hand 161G can receive the substrate P2 on the beam unit 152 without moving to the position on the + X side of the port portion 150G. Further, the substrate carry-in hand 161G can deliver the exposed substrate P1 onto the beam unit 152 without moving to the position on the + X side of the port portion 150G. That is, it is possible to carry out a series of operations of carrying in the board P2 and carrying out the board P1 without changing the positional relationship between the external transfer device 300, the port portion 150G, the board loading hand 161G, and the board holder 28G in the X direction. Further, since it is not necessary to install the chamber so as to provide a space for the substrate loading hand 161G to move to the position on the + X side of the port portion 150G, the footprint of the exposure apparatus, that is, the installation area of the exposure apparatus 10 can be reduced. it can. Further, when a problem occurs in the exposure apparatus, or when performing work such as initial setting, the substrate P carried out to the port portion 150G (beam unit 152) is carried in again without the external transfer device 300. It can be handed over to the hand 161G and carried into the board holder 28G.

Further, in the second embodiment, the substrate holder 28G having a support surface for supporting the substrate P and a part of the lower surface of the substrate P2 located above the substrate holder 28G (the end on the −X side) are sucked and held. A board carry-in bearer device 182P, a board carry-in hand 161G having a surface inclined with respect to the XY surface and holding the board P2, and a part of the board P1 mounted on the board holder 28G (end portion on the + X side). ) Is provided, and the stage device 20G is moved and retracted from between the substrate P2 and the substrate holder 28G so that the substrate loading hand 161G retracts along the X-axis direction. The substrate unloading hand 170A moves in the X-axis direction with respect to the substrate holder 28G while holding the substrate P1 to carry the substrate P2 onto the substrate holder 28 and unload the substrate P1 from the substrate holder 28G. As a result, in the second embodiment, the substrate P2 is slid-conveyed to the substrate holder 28G, so that the impact during the transfer can be suppressed.

Further, according to the second embodiment, the plurality of finger portions 162G of the substrate carry-in hand 161G are connected to each other by the connecting member 163G near the end portion on the −X side (board holder 28G side). As a result, the substrate carry-in hand 161G according to the second embodiment can install the substrate P2 on the substrate holder 28G without distortion.

Specifically, as shown in FIG. 41A, in the substrate feeder 160S according to the fourth modification of the first embodiment, the comb tooth portion extends to the −X side. Therefore, as shown in FIG. 41 (a), the edge of the substrate P2 on the −X side immediately before being installed on the substrate holder 28 has a region supported by the comb tooth portion and a region not supported, so that the amount is very small. However, it is wavy, and it may be difficult to install the substrate P2 on the substrate holder 28 without distortion. On the other hand, as shown in FIGS. 31 (a) and 31 (b), the substrate carry-in hand 161G according to the second embodiment is continuous without opening between the adjacent finger portions 162G on the −X side. , The −X side end of the substrate P2 can be supported by a surface. As a result, as shown in FIG. 41 (b), the edge on the −X side of the substrate P2 immediately before being installed in the substrate holder 28G becomes less likely to undulate. Therefore, the substrate carry-in hand 161G according to the second embodiment can install the substrate P2 on the substrate holder 28G without distortion.

Further, according to the second embodiment, the substrate transfer portion 160G (board carry-in hand 161G) and the stage device 20G (board holder 28G) are moved in opposite directions to move the board carry-in hand 161G to the board P2 and the board holder. Evacuate from between 28G. As a result, the time for carrying the substrate P2 into the substrate holder 28G can be shortened.

Further, according to the second embodiment, in the finger portions 162G of the substrate carry-in hand 161G, the inner finger portions 162G2 other than the finger portions 162G1 at both ends are thinner on the port portion side than the finger portions 162G1 at both ends. (See, for example, FIG. 31 (b)). As a result, the weight of the substrate carry-in hand 161G can be reduced.

Further, according to the second embodiment, since the arm 168 of the board carry-in hand 161G is attached to the finger portions 162G1 at both ends, the board carry-in hand 161G can support the central portion of the board P2, and the board can be supported. The carry-in hand 161G can be reduced. Further, since the arm 168 of the board carry-in hand 161G is attached to the finger portions 162G1 at both ends, the entire center of gravity of the board carry-in hand 161G is supported, so that the board carry-in hand 161G can be suppressed from bending.

(First modification)
Hereinafter, the exposure apparatus 10H according to the first modification of the second embodiment will be described with reference to FIGS. 42 (a) and 42 (b).

In the second embodiment, the Z position (pass line) for passing the substrate between the external transfer device 300 and the beam unit 152 of the port portion 150G is set to a position higher than the upper surface of the substrate holder 28G. The first modification is characterized in that the height of the path line can be freely set (there is no limitation).

42 (a) and 42 (b) are diagrams for explaining the substrate replacement operation in the first modification.

As shown in FIGS. 42 (a) and 42 (b), the external transfer device 300 places the substrate P2 on the beam unit 152 stopped at a position lower than the upper surface of the substrate holder 28G.

After that, as shown in FIGS. 32 (a) and 32 (b) of the second embodiment, if the beam unit 152 rises to a position higher than the highest portion of the board carry-in hand 161G, the board carry-in hand 161G is moved up and down. The board P2 can be handed over to the board carry-in hand 161G even when there is no drive device to move to. As a result, for example, when a problem occurs in the exposure apparatus or when performing work such as initial setting, the substrate carried out to the port portion 150G (beam unit 152) can be re-carried even without the external transfer device 300. It can be handed over to the board carry-in hand 161G and carried into the board holder 28G.

(Second modification)
Hereinafter, the exposure apparatus 10I according to the second modification of the second embodiment will be described with reference to FIGS. 43 (a) and 43 (b). This second modification is an example in which the configuration of the substrate transfer device is changed.

In the board transfer device 100I according to the second modification, the board transfer device 160I includes a drive system for rotating the board carry-in hand 161I around the Y axis. That is, the substrate carrying-in hand 161I can tilt the substrate holding surface around the Y-axis by the drive system.

Further, in the second modification, as shown in FIG. 43A, the stroke of the substrate pick hand 167I included in the substrate carry-in hand 161I is longer than that of the substrate pick hand 167G of the second embodiment. In the second modification, as shown in FIG. 43A, the distance from the −X side end of the substrate carry-in hand 161I to the base of the finger portion 162I, that is, the width of the connecting member 163I in the X-axis direction. However, it is longer than the connecting member 163G of the second embodiment.

The substrate exchange operation in the substrate transfer device 100I according to the second modification will be described with reference to FIGS. 43 (a) to 46 (b). The states of FIGS. 43 (a) and 43 (b) correspond to the states of FIGS. 32 (a) and 32 (b) in the second embodiment, respectively.

As shown in FIGS. 43 (a) and 43 (b), while the stage device 20G is performing the exposure process, the external transfer device 300 is moved in the −Z direction to mount the new substrate P2 on the beam unit 152. After that, it is moved in the + X direction and exits from the exposure apparatus 10I (see arrows J1 and J2).

The board carry-in hand 161I is moved in the + X direction and enters under the beam unit 152 from the −X side (board holder 28G side). Then, the crotch portion of the finger portion 162I of the substrate carry-in hand 161I is stopped at a position that does not overlap with the end portion on the −X side of the beam unit 152 in a plan view.

After that, as shown in FIGS. 44 (a) and 44 (b), the stage device 20G that has completed the exposure process moves to the substrate transfer position with the port portion 150G (see arrow K1).

The substrate loading hand 161I rotates about the Y axis so that the substrate holding surface of the substrate loading hand 161I is substantially parallel to the substrate P2 on the beam unit 152 (see arrow K2). The beam unit 152 is moved downward (moved in the −Z direction) while holding the substrate P2, and stops at a position where a part of the substrate P2 on the beam unit 152 comes into contact with the substrate pick hand 167I of the substrate carry-in hand 161I (moving in the −Z direction). See arrow K3). The substrate pick hand 167I sucks and grips the back surface of the substrate P2.

After that, as shown in FIGS. 45A and 45B, in the stage device 20G, the board P1 on the board holder 28G is offset in the + X direction by the board unloading bearer device 183P.

The board pick hand 167I of the board carry-in hand 161I is moved in the −X direction while holding the board P2 on the beam unit 152 (see arrow L1). As a result, the substrate P2 is moved onto the substrate carry-in hand 161I while being held by the board carry-in hand 161I and the beam unit 152. At this time, the pressurized gas is ejected from the beam unit 152 and the substrate carry-in hand 161I. Since the substrate pick hand 1671 attracts and holds the substrate P2, there is no possibility that the substrate P2 will fall from the beam unit 152 or the substrate carry-in hand 161I. Since the board P2 is held by the board carry-in hand 161I and the beam unit 152, the board carry-in hand 161I moves in the + Z direction with respect to the beam unit, and the board P2 is placed on the board carry-in hand 161I from the beam unit 152. The load on the substrate P2 is less than that. Therefore, it is possible to reduce the risk of the substrate P2 being damaged when the substrate P2 is delivered between the substrate carry-in hand 161I and the beam unit 152.

After that, as shown in FIGS. 46A and 46B, the beam unit 152 is moved in the −Z direction to the lower part of the substrate loading hand 161I (see arrow M1), and the substrate P2 is completely moved to the substrate loading hand 161I. Hand over to. When the board P2 is placed on the board carry-in hand 161I, the board carry-in hand 161I is rotationally driven around the Y axis, and the board holding surface of the board carry-in hand 161I is inclined with respect to the board support surface of the board holder 28G. It is in the state (the state shown in FIG. 43B) (see arrow M2).

Since the subsequent operations are the same as those in the second embodiment, the description thereof will be omitted.

According to the second modification, the substrate loading hand 161I is rotationally driven around the Y axis so that the substrate holding surface of the substrate loading hand 161I is substantially parallel to the substrate P2 on the beam unit 152, and then on the beam unit 152. Board P2 is delivered to the board carry-in hand 161I. As a result, the substrate P2 can be reliably delivered to the substrate carry-in hand 161I without bending.

Further, according to the second modification, the width of the connecting member 163I in the X-axis direction is wide. As a result, the length of the finger portion 162I of the substrate loading hand 161I can be shortened, and the rigidity of the entire substrate loading hand 161I can be increased.

(Third modification example)
Hereinafter, the substrate transfer device 100J according to the third modification of the second embodiment will be described with reference to FIGS. 47 (a) and 47 (b). In the second modification described above, the movement from the beam unit 152 to the substrate carry-in hand 161I to the substrate P2 was performed by tilting the board carry-in hand 161I, but in the third modification, the beam unit 152 is tilted. Do by.

As shown in FIG. 47 (a), in the substrate transfer device 100J according to the third modification, the port portion 150J includes legs 154a and 154b whose upper ends are connected to the beam unit 152. Further, the port portion 150J includes Z actuators 158a and 158b that can independently expand and contract the legs 154a and 154b in the Z-axis direction. The Z actuators 158a and 158b can change the inclination of the upper surface of the beam unit 152 by changing the amount of expansion and contraction of the legs 154a and 154b. In addition, in FIG. 47A, the beam unit 152 arranged between the finger portions 162I1 at both ends and the inner finger portions 162I2 is shown.

Next, the transfer of the substrate P2 from the beam unit 152 to the substrate carry-in hand 161I will be described with reference to FIGS. 47 (a) and 47 (b).

FIG. 47A shows a state in which the substrate P2 is installed on the beam unit 152 by the external transfer device 300. At this time, the substrate carry-in hand 161I is moved from the −X side of the beam unit 152 in the + X direction, and the crotch portion of the finger portion 162G does not overlap the end portion of the beam unit 152 on the −X side in a plan view. It is stopped at.

Next, as shown in FIG. 47 (b), the Z actuators 158a and 158b change the amount of expansion and contraction of the legs 154a and 154b so that the upper surface of the beam unit 152 is substantially the same as the substrate holding surface of the substrate loading hand 161I. The beam unit 152 is tilted to form (see arrows N1 and N2).

Next, the substrate P2 held by the beam unit 152 is gripped by the substrate pick hand 167I as the beam unit 152 descends, and is delivered to the substrate carry-in hand 161I while shifting the substrate position by moving the substrate pick hand 167I.

As in the third modification, the substrate P2 may be moved from the beam unit 152 to the substrate carry-in hand 161I by tilting the beam unit 152.

(Fourth modification)
Hereinafter, the substrate transfer device 100K of the exposure apparatus 10K according to the fourth modification of the second embodiment will be described with reference to FIGS. 48 (a) to 49 (b). The fourth modification is an example in which the configuration of the finger portion of the substrate loading hand is changed.

As shown in FIGS. 48 (a) and 49 (a), the substrate carry-in hand 161K according to the fourth modification has a finger portion 162K having a length substantially the same as the substrate dimension in the X-axis direction. Further, as shown in FIG. 48 (b) and the like, the shape of the substrate loading hand 161K is like a rhombus with both tips pointed in a side view, and the arm 168 is located in a thick place in the central portion. Is installed.

The transfer of the substrate from the beam unit 152 to the substrate loading hand 161K in the fourth modification will be described with reference to FIGS. 48 (a) to 49 (b).

As shown in FIGS. 48 (a) and 48 (b), the substrate carry-in hand 161K is arranged at a position where the crotch portion of the finger portion 162K does not overlap with the −X side end portion of the beam unit 152 in a plan view. ..

After that, when the external transfer device 300 delivers the substrate P2 onto the beam unit 152, the beam unit 152 is moved in the −Z direction as shown in FIGS. 49 (a) and 49 (b). Since the length of the finger portion 162K of the substrate loading hand 161K is substantially the same as the length of the substrate P2, the substrate P2 is placed on the substrate loading hand 161K by moving the beam unit 152 in the −Z direction. After that, the substrate P2 is slid toward the slope side by the substrate pick hand 167K. As a result, a part of the substrate P2 is in an inclined state with respect to the substrate support surface of the substrate holder 28G. Subsequent operations are substantially the same as those in the second embodiment, and detailed description thereof will be omitted.

According to the fourth modification, since the length (length in the X-axis direction) of the finger portion 162K of the substrate loading hand 161K is almost the same as the length of the substrate, the substrate P2 mounted on the beam unit 152 is used. When receiving with the board carry-in hand 161K, the board P2 can be scooped only by passing the board carry-in hand 161K from the bottom to the top of the beam unit 152. Therefore, the operation is simple, and there is an effect that the substrate P2 is less likely to be damaged or dust is generated.

(Fifth modification)
Hereinafter, the substrate transfer device 100L of the exposure apparatus 10L according to the fifth modification of the second embodiment will be described with reference to FIGS. 50A to 51B. The fifth modification is an example in which the substrate is directly delivered from the external transfer device 300 to the substrate carry-in hand 161K.

In the fifth modification, as shown in FIG. 50A, the forks of the external transfer device 300 are arranged so that the finger portions 162K of the substrate carry-in hand 161K and the positions in the Y-axis direction do not overlap in a plan view. .. Further, the beam unit 152 is arranged so as not to overlap the fork of the external transport device 300 in a plan view. As a result, in the fifth modification, the finger portion 162K of the substrate carry-in hand 161K and the beam unit 152 are arranged at overlapping positions in a plan view.

Hereinafter, the transfer of the substrate from the external transfer device 300 to the substrate carry-in hand 161K in the fifth modification will be described with reference to FIGS. 50 (a) to 51 (b).

As shown in FIGS. 50A and 50B, the substrate carry-in hand 161K is moved in the + X direction so as to be arranged at the substrate transfer position with the external transfer device 300 (see arrow Q1). The external transfer device 300 is moved in the −X direction until it reaches the board transfer position with the board carry-in hand 161K while holding the board P2 (see arrow Q2).

After that, as shown in FIGS. 51 (a) and 51 (b), the stage device 20G that has completed the exposure process moves to the substrate transfer position with the beam unit 152 (see arrow R1). Further, in the stage device 20G, the board P1 on the board holder 28G is offset in the + X direction by the board carry-out bearer device 183P (see arrow R2).

When the external transfer device 300 is moved in the −Z direction (see arrow R3), the lower surface of the substrate P2 comes into contact with the substrate pick hand 167K. The substrate pick hand 167K sucks and grips the lower surface of the substrate P2.

The substrate pick hand 167K that sucks and grips the lower surface of the substrate P2 is driven in the −X direction. As a result, the substrate P2 on the external transfer device 300 moves to the substrate carry-in hand 161K. When the external transfer device 300 is moved in the −Z direction as it is and the substrate P2 is completely delivered onto the substrate carry-in hand 161K, it is moved in the + X direction and exits from the exposure device 10L (see arrow R4).

The beam unit 152 is moved in the −Z direction and the −X direction (see arrows R5 and R6), and heads toward the substrate transfer position with the stage device 20G.

Since the subsequent operation is almost the same as that of the second embodiment, the detailed description thereof will be omitted.

As described above, according to the fifth modification, when the substrate P2 is carried in, the board carry-in hand 161K can directly receive the board P2 from the external transfer device 300 without passing through the port portion 150G. This is because the connecting portion of the external transport device 300 is provided on the + X side and the connecting member 163G of the board carry-in hand 161G is provided on the −X side, so that the board P is delivered from the external transport device 300 to the board carry-in hand 161K. This is possible because the connecting parts do not interfere with each other. As a result, the board P2 has been delivered from the external transfer device 300 to the port portion 150G, and the substrate P2 has been delivered from the port portion 150G to the board carry-in hand 161K. Only one transfer from the transfer device 300 to the substrate carry-in hand 161K is required, and the number of deliveries of the substrate P2 is reduced. Therefore, the time required for the substrate P2 to be delivered can be shortened and the substrate P2 can be prevented from being damaged or dusting. Can be done.

Regarding the recovery (unloading) of the substrate P1 in the fifth modification, the substrate P1 is delivered from the beam unit 152 to the external transfer device 300 as in the second embodiment.

In the fifth modification, the beam unit 152 and the finger portion 162K of the substrate carry-in hand 161K are arranged in a plan view so that the finger portions of the robot hand of the beam unit 152 and the external transfer device 300 do not overlap in a plan view. Arranged so as to overlap, but is not limited to this. The beam unit 152 and the finger portion 162K of the substrate carry-in hand 161K may also not overlap in a plan view. In this case, the beam unit 152 may be capable of shifting one finger portion 162K in the Y-axis direction. As a result, the board carried out from the board holder 28G to the port portion 150G can be scooped up again with the board loading hand.

When delivering the substrate, the external transfer device 300 may shift in the Y-axis direction instead of shifting the beam unit 152 in the Y-axis direction so as not to overlap the finger portion 162K in a plan view. Then, the substrate carry-in hand 161K may be shifted in the Y-axis direction.

In the second embodiment and its modifications, the stage apparatus 20P'described in the fourth modification of the first embodiment may be used instead of the stage apparatus 20G.

Further, in the second embodiment and the modified examples of the second embodiment, the substrate transfer device is movable in the X-axis direction, but the substrate transfer device may be fixed. In this case, the stage device 20G is configured to be movable below the substrate transfer device in the X-axis direction, and by moving the stage device 20G in the −X direction, the substrate carry-in hand is moved between the substrate P2 and the substrate holder 28G. You may evacuate from the interval.

Further, in the first and second embodiments and modified examples thereof, as shown in FIG. 52, near the + X side end of the surface plate 30 called the upper column that supports the projection optical system 16, the mask stage 14, and the like. May be partially chamfered (30a) so as not to interfere with the substrate feeder or the substrate carry-in hand. Note that FIG. 52 shows a case where the substrate carry-in hand 161G according to the second embodiment is adopted as the board feeder or the board carry-in hand. As a result, the height of the entire exposure apparatus can be reduced. Further, as compared with the case where the upper column is not chamfered, the substrate carry-in hand 161G can be moved to the projection optical system 16, that is, to the more −X direction side. As a result, the distance that the stage device 20G moves to the + X side can be shortened, and the time that the stage device 20G moves to the board replacement position can be shortened, so that the board can be replaced more quickly. Further, the dimension of the surface plate 22 on the + X direction side can be shortened, and the stage device 20G can be miniaturized.

Further, in the first and second embodiments and modifications thereof, the stage devices 20P and 20G are CCD cameras for detecting the edge of the substrate P as shown in FIGS. 53A and 53B. It includes 31x and 31y (image processing edge detection). The CCD camera 31x is arranged so that two sides on the −X side of the substrate P before being placed on the substrate holders 28 and 28G can be observed. The CCD camera 31y is arranged so that one location on the −Y side (or + Y side) side of the substrate P can be observed from below. As a result, the X position, Y position, and θz position of the substrate P with respect to the stage devices 20P and 20G can be known. This information is used for stage control as correction of the position of the substrate P2 before mounting and as position information of the substrate P2 after mounting. Note that the edge of the substrate P is not the CCD cameras 31x and 31y for detection, but a known edge sensor including a light source and a light receiving unit may be used, for example. The light source is arranged at the same position as the CCD cameras 31x and 31y, and the light receiving portion is arranged so as to face the light source with the substrate P interposed therebetween. The cross section orthogonal to the optical axis of the measurement light emitted from the light source is line-shaped, and the light receiving portion detects the end portion of the substrate P by receiving the measurement light. In this way, the X position, Y position, and θz position of the substrate P with respect to the stage devices 20P and 20G are detected based on the detection results obtained by measuring the end portion of the substrate P in the X-axis direction and the end portion in the Y-axis direction. You may try to do it.

Further, in the first and second embodiments and modifications thereof, the stage device 20M shown in FIGS. 54 (a) to 54 (c) may be used.

In the stage device 20M, as shown in FIG. 54A, the substrate carry-in bearer device 182M is provided at two locations on the −X side end of the substrate holder 28M. As shown in FIG. 54B, the substrate carry-in bearer device 182M has an upper surface of the suction pad 284 in a state where a part of the substrate holder 28M is housed in a notch 28a formed at the end on the −X side. The height of the substrate holder 28M is set to be substantially the same as the upper surface of the substrate holder 28M. Therefore, even after the substrate P2 is placed, the suction pad 284 does not have to move in the −X direction and retract from the substrate holder 28M.

Further, as shown in FIG. 54 (c), the substrate carry-in bearer device 182M can be tilted so that the back surface of the substrate P carried in at an angle can be reliably sucked and fixed. Further, the substrate carry-in bearer device 182M can be moved in the horizontal direction (X-axis direction or X-axis and Y-axis directions) so that the position of the substrate P can be aligned.

According to the stage device 20M, since the suction pad 284 can be tilted, the back surface of the substrate P2 can be reliably sucked and fixed.

In addition, the stage device 20N shown in FIGS. 55 (a) and 55 (b) may be used in the first and second embodiments and modifications thereof.

The stage device 20N does not have the substrate carry-in bearer device described in the first and second embodiments, which moves independently. In the stage device 20N, the carry-in substrate is placed in one or more places near the −X side end face of the substrate holder so that a part of the upper surface of the substrate holder 28N also serves as a suction pad 284 that sucks and grips the tip of the carry-in substrate. A suction region (bearer region) 187 is provided for suction and gripping the tip portion of the device.

Since the stage device 20N does not have a substrate carry-in bearer device that moves independently, it is not possible to align the carry-in board by the board carry-in bearer device. For example, a pair of substrates is not adsorbed in the bearer region 187. The board unloading hand may be used to align the board on the board loading hand. Further, when it is desired to align the substrate after mounting the substrate on the substrate holder 28N, the substrate may be aligned using the substrate carry-out bearer device 183P.

When the stage device does not have a board carry-in bearer device that moves independently, for example, as shown in FIGS. 56 (a) to 56 (c), a board feeder 160P (slide plate 264) is used as a board P and a board holder 28N. The substrate P2 is placed on the substrate holder 28N while being retracted from the space between the two. In this case, the substrate holder 28N stably attracts the substrate P2 to the substrate support surface by vacuum suction. P2 can be carried in.

In the first and second embodiments and modifications thereof, the support pad on the finger portion of the substrate feeder and the substrate carry-in hand may be omitted.

Further, in each of the above embodiments, the same magnification system is used as the projection optical system 16, but the present invention is not limited to this, and a reduction system or an expansion system may be used.

The application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to a square glass plate, for example, an exposure apparatus for manufacturing an organic EL (Electro-Luminence) panel, and for semiconductor manufacturing. It can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like are used. It can also be applied to an exposure apparatus that transfers a circuit pattern.

Further, the substrate to be exposed is not limited to the glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or mask blanks. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included. The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape.

<< Device manufacturing method >>
Next, a method for manufacturing a microdevice using the exposure apparatus according to each of the above embodiments in the lithography process will be described. In the exposure apparatus of the above embodiment, a liquid crystal display element as a microdevice can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
<Pattern formation process>
First, a so-called optical lithography step of forming a pattern image on a photosensitive substrate (such as a glass substrate coated with a resist) is executed by using the exposure apparatus according to each of the above-described embodiments. By this optical lithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. After that, the exposed substrate undergoes each step such as a developing step, an etching step, and a resist peeling step, so that a predetermined pattern is formed on the substrate.
<Color filter forming process>
Next, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or a set of filters having three stripes of R, G, and B. A color filter arranged in the direction of a plurality of horizontal scanning lines is formed.
<Cell assembly process>
Next, a liquid crystal panel (liquid crystal cell) is assembled using a substrate having a predetermined pattern obtained in the pattern forming step, a color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained in the pattern forming step and a color filter obtained in the color filter forming step.
<Module assembly process>
After that, each component such as an electric circuit and a backlight for displaying the assembled liquid crystal panel (liquid crystal cell) is attached to complete the liquid crystal display element.

In this case, in the pattern forming step, the substrate is exposed with high throughput and high accuracy by using the exposure apparatus according to each of the above embodiments, and as a result, the productivity of the liquid crystal display element can be improved.

The embodiments described above are examples of preferred embodiments of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

10P exposure device 20P stage device 28 board holder 100P board transfer device 140P board slide hand 150P port part 160P board feeder 182P board carry-in bearer device 266 rotation mechanism P, P1, P2 board

Claims (14)

A support portion having a support surface for supporting the substrate,
A first holding portion that holds a part of the surface of the first substrate located above the support surface that faces the support surface, and
A second holding portion having a holding surface that is inclined with respect to the support surface and holds another portion of the surface of the first substrate that faces the support surface and is located above the support surface.
A third holding portion that holds a part of the second substrate supported by the supporting portion on the supporting surface,
The second holding portion and the supporting portion are relatively driven so that the second holding portion retracts from between the first substrate and the supporting portion in the first direction, and the third holding portion is the third holding portion. By relatively driving the third holding portion and the supporting portion so as to move in the first direction with respect to the supporting portion while holding the second substrate, the first substrate is carried into the supporting portion. A substrate transfer device including a drive device for carrying out the second substrate from the support portion. The substrate transfer device according to claim 1, wherein the drive device drives the second holding portion and the third holding portion in the first direction with respect to the support portion. The substrate transfer device according to claim 1 or 2, further comprising a port portion that supports the second substrate when the second substrate held by the third holding portion is carried out from the support portion. The port portion supports the first substrate before being located above the support surface, and supports the first substrate.
The substrate transfer device according to claim 3, wherein the third holding portion holds and moves the first substrate supported by the port portion and delivers it to the second holding portion. The substrate transfer device according to any one of claims 1 to 4, wherein the third holding portion is provided in the second holding portion. The substrate transport according to any one of claims 1 to 5, wherein the second holding portion has a transition mechanism for transitioning the holding surface between a state in which the holding surface is inclined with respect to the support surface and a state in which the holding surface is not inclined. apparatus. When the first substrate is delivered to the second holding portion, the transition mechanism causes the second holding portion to transition to the non-tilted state, and the first substrate is supported from the second holding portion. The substrate transfer device according to claim 6, wherein the second holding portion is transitioned to the inclined state when it is carried into the portion. The substrate transfer device according to any one of claims 1 to 7, wherein the second holding portion has a cover member that covers the holding surface. The substrate transfer device according to any one of claims 1 to 8, wherein the holding surface of the second holding portion is curved in a concave shape when viewed from the first direction. The substrate transfer device according to any one of claims 1 to 9,
An exposure device including an optical system that irradiates the substrate transported to the holding device by the substrate transport device with an energy beam to expose the substrate. The exposure apparatus according to claim 10, wherein the substrate has at least one side length or a diagonal length of 500 mm or more and is for a flat panel display. Exposing the substrate using the exposure apparatus according to claim 10 or 11.
A method for manufacturing a flat panel display, comprising developing the exposed substrate. It is a device manufacturing method
Exposing the substrate using the exposure apparatus according to claim 10 or 11.
A device manufacturing method comprising developing the exposed substrate. The substrate is transported to the holding device by the substrate transporting device according to any one of claims 1 to 9.
An exposure method comprising irradiating the substrate with an energy beam to expose the substrate.

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