JP2012238776A - Object replacing system, exposure device, manufacturing method of flat panel display, manufacturing method of device, and object replacing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To replace a substrate on a substrate stage quickly.SOLUTION: A substrate stage 20a floats a substrate Pby jetting pressurized gas from a substrate holder 30a, and a substrate carrying-out device 93 carries out the substrate Pfrom the substrate holder 30a by moving the substrate Palong a horizontal plane by using the top face (substrate mounting surface) of the substrate holder 30a as a guide surface. Another substrate Pto be exposed next is waiting above the substrate holder 30a when the substrate Pis carried out, and delivered to substrate lift devices 46a of the substrate stage 20a upon finishing the carrying-out operation of the substrate P.

Description

  The present invention relates to an object exchange system, an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an object exchange method, and more particularly, an object exchange system and method for exchanging an object held by an object holding apparatus. The present invention relates to an exposure apparatus including the object exchange system, a flat panel display manufacturing method using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or step-and- A scanning projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  As this type of exposure apparatus, one that carries in and out a glass plate or wafer (hereinafter collectively referred to as “substrate”), which is an object to be exposed, with respect to a substrate stage apparatus using a predetermined substrate transfer apparatus is known. (For example, refer to Patent Document 1).

  Here, in the exposure apparatus, when the exposure process on the substrate held by the substrate stage apparatus is completed, the substrate is unloaded from the substrate stage, and another substrate is transported onto the substrate stage, so that a plurality of substrates are transferred. The exposure process is continuously performed on the substrate. Therefore, it is preferable to quickly carry out the substrate from the substrate stage apparatus when performing the exposure process on a plurality of substrates continuously.

US Pat. No. 6,559,928

  The present invention has been made under the circumstances described above. From a first viewpoint, the present invention is an object exchange system for exchanging an object placed on an object holding member included in an object holding device, wherein the object A carry-in device that conveys an object to be loaded above the holding member, and a direction along the object placement surface from above the object holding member to place the object to be carried placed on the object placement surface of the object holding member An unloading device for unloading, an object receiving device that is provided in the object holding device and receives the object to be loaded from the loading device, and an unloading device that is provided in the object holding device and is unloaded by the unloading device. An object exchange system comprising: a guide member that defines a guide surface that guides an object.

  According to this, when the object to be carried out is carried out from the object holding member, it is guided by the guide member of the object holding device and carried out along the object placement surface of the object holding member. There is no need to position a member for recovering the object from the object holding member above the object holding member. Accordingly, the object can be quickly carried out. Further, a space sufficient to position the carry-in device may be provided above the object holding member.

  According to a second aspect of the present invention, there is provided an object exchange system according to the first aspect of the present invention, and a pattern for forming a predetermined pattern on the object held by the object holding device using an energy beam. And an exposure apparatus.

  According to a third aspect of the present invention, there is provided a flat panel display comprising: exposing the object using the exposure apparatus according to the second aspect of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising: exposing the object using the exposure apparatus according to the second aspect of the present invention; and developing the exposed object. is there.

  According to a fifth aspect of the present invention, there is provided an object exchanging method for exchanging an object placed on an object holding member of an object holding device, wherein the object to be carried is conveyed above the object holding member. And using the object receiving device provided in the object holding device, receiving the object to be carried conveyed above the object holding member, and placing the object on the object placement surface of the object holding member The object to be carried out is guided on a guide surface defined by a guide member included in the object holding device, and is carried out of the object holding device from the object holding member in a direction along the object placement surface. The object exchange method.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 1st Embodiment. 2 is a plan view of a substrate stage (substrate holder), a substrate carry-in device, and a substrate carry-out device that the liquid crystal exposure apparatus of FIG. 1 has. FIG. FIG. 3 is a cross-sectional view of the substrate stage of FIG. 2 taken along line AA. FIGS. 4A and 4B are views (No. 1 and No. 2) for explaining the substrate exchange operation on the substrate holder. FIGS. 5A and 5B are diagrams (No. 3 and No. 4) for explaining the substrate exchange operation on the substrate holder. FIGS. 6A and 6B are views (No. 5 and No. 6) for explaining the substrate replacement operation on the substrate holder. FIGS. 7A and 7B are views (No. 7 and No. 8) for explaining the substrate exchange operation on the substrate holder. FIGS. 8A and 8B are diagrams (No. 9 and No. 10) for explaining the substrate exchange operation on the substrate holder. It is a top view of a substrate holder concerning a 2nd embodiment, a substrate carrying-in device, and a substrate carrying-out device. It is a BB line sectional view of a substrate stage device containing a substrate holder concerning a 2nd embodiment, a substrate carrying-in device, and a substrate carrying-out device.

<< First Embodiment >>
The first embodiment will be described below with reference to FIGS. 1 to 8B.

  FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure apparatus 10 is a projection exposure apparatus that uses a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used for, for example, a liquid crystal display device (flat panel display) as an exposure object.

  The liquid crystal exposure apparatus 10 holds an illumination system IOP, a mask stage MST that holds a mask M, a projection optical system PL, and a substrate P on which a surface (a surface facing the + Z side in FIG. 1) is coated with a resist (sensitive agent). A substrate stage device PST, a substrate carry-in device 80, a port unit 90 for transferring a substrate to and from an external device, and a control system thereof. In the following, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, X-axis, and Y-axis. The direction orthogonal to the axis is defined as the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are described as the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  On the mask stage MST, a mask M on which a circuit pattern or the like is formed is held by suction, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel surface plate 16 which is a part of the apparatus body (body), and has a predetermined length in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including a linear motor, for example. While being driven by a stroke, it is slightly driven as appropriate in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

  Projection optical system PL is arranged below mask stage MST and supported by lens barrel surface plate 16. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered pattern, and is a rectangular single unit whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. A projected image (partial upright image) of the pattern is formed in the irradiation region (exposure region) of the illumination light IL conjugate to the illumination region on the substrate P. Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P by the illumination light IL. Is formed.

  The substrate stage apparatus PST includes a surface plate 12 and a substrate stage 20 a disposed above the surface plate 12.

  The surface plate 12 is made of a rectangular plate-like member in plan view (viewed from the + Z side), and the upper surface thereof is finished with a very high flatness. The surface plate 12 is mounted on a substrate stage frame 13 which is a part of the apparatus main body. The apparatus main body including the substrate stage pedestal 13 is mounted on a vibration isolator 14 installed on the floor 11 of the clean room, whereby the mask stage MST, the projection optical system PL, etc. vibrate with respect to the floor 11. Separated.

  The substrate stage 20a is mounted on the X coarse movement stage 23X and the X coarse movement stage 23X, and together with the X coarse movement stage 23X, forms a so-called gantry type XY two-axis stage device. Fine movement stage 21 disposed on (upper), substrate holder 30a for holding substrate P, weight canceling device 26 for supporting fine movement stage 21 on the surface plate 12 from below, and a plurality for separating substrate P from substrate holder 30a Substrate lift device 46a (not shown in FIG. 1, refer to FIG. 3).

  The X coarse movement stage 23X is formed of a rectangular member having a longitudinal direction in the Y-axis direction in a plan view, and a long hole-like opening (not shown) having a longitudinal direction in the Y-axis direction is formed at the center thereof. Yes. The X coarse movement stage 23X is mounted on a guide member (not shown) that extends in the X-axis direction and is installed on the floor 11 separately from the apparatus main body. It is driven with a predetermined stroke in the X-axis direction by an X stage drive system including a linear motor.

  The Y coarse movement stage 23Y is made of a rectangular member in plan view, and an opening (not shown) is formed at the center thereof. The Y coarse movement stage 23Y is mounted on the X coarse movement stage 23X via a Y linear guide device 25. For example, during the Y step operation during exposure, the Y coarse movement is performed by a Y stage drive system including a linear motor. It is driven with a predetermined stroke on the stage 23X in the Y-axis direction. The Y coarse movement stage 23Y is moved in the X-axis direction integrally with the X coarse movement stage 23X by the action of the Y linear guide device 25.

  Fine movement stage 21 is formed of a rectangular parallelepiped member having a substantially square shape in plan view. The fine movement stage 21 is controlled by a fine movement stage drive system including a plurality of voice coil motors (or linear motors) including a stator fixed to the Y coarse movement stage 23Y and a mover fixed to the fine movement stage 21. The moving stage 23Y is slightly driven in directions of six degrees of freedom (X axis, Y axis, Z axis, θx, θy, θz directions). In the plurality of voice coil motors, a plurality of X voice coil motors 29x (overlapping in the depth direction of the paper surface in FIG. 1) and fine movement stage 21 are slightly driven in the Y-axis direction. A plurality of Y voice coil motors (not shown) and a plurality of Z voice coil motors 29z (for example, arranged at positions corresponding to the four corners of the fine movement stage 21) for finely driving the fine movement stage 21 in the Z-axis direction are included. .

  Further, the fine movement stage 21 is guided to the Y coarse movement stage 23Y via the plurality of voice coil motors, so that the fine movement stage 21 and the Y coarse movement stage 23Y are along the XY plane in the X axis direction and / or the Y axis direction. Move with a predetermined stroke. The positional information of the fine movement stage 21 in the XY plane is obtained by using a movable mirror (an X movable mirror 22x having a reflective surface orthogonal to the X axis and a reflective surface orthogonal to the Y axis) fixed to the fine movement stage 21 via a mirror base 24. An interferometer (not shown) that irradiates a measuring beam to a Y moving mirror (not shown) having X (an X interferometer that measures the X position of fine movement stage 21 using X moving mirror 22x), and a Y moving mirror. And a Y interferometer that measures the Y position of the fine movement stage 21 using a substrate interferometer system. The configurations of the fine movement stage drive system and the substrate interferometer system are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Further, as shown in FIG. 3, the fine movement stage 21 has a plurality of holes 21 a that open to the upper surface (+ Z surface) and the lower surface (−Z surface) thereof (penetrate in the Z-axis direction). It is formed at a position corresponding to each substrate lift device 46a. Similarly, the mirror base 24 has a hole 24a corresponding to the substrate lift device 46a.

  The substrate holder 30 a is formed of a rectangular parallelepiped member having a rectangular shape in plan view with the X-axis direction as the longitudinal direction, and is fixed on the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a can be selectively connected to a vacuum device and a compressor (each not shown) provided outside, and the substrate P (not shown in FIG. 3; see FIG. 1) is sucked by the vacuum device. By holding and ejecting the pressurized gas supplied from the compressor, the substrate P can be floated through a minute clearance. Note that the suction and ejection of the gas may be performed using a common hole, or a dedicated hole may be used for each.

  In addition, the substrate holder 30a has a plurality of holes 36a that open to the upper surface (+ Z surface) and the lower surface (−Z surface) (penetrate in the Z-axis direction), respectively, corresponding to a plurality of substrate lift devices 46a described later. Formed in position. Further, as can be seen from FIG. 2 and FIG. 3, a notch 37 that opens to the + Z side and the + X side is formed at the + X side end of the upper surface of the substrate holder 30a and at the center in the Y-axis direction. ing.

  The weight canceling device 26 is composed of a single columnar member extending in the Z-axis direction (also referred to as a core column), and supports the central portion of the fine movement stage 21 from below via a device referred to as a leveling device 27. doing. The weight cancellation device 26 is inserted into the opening of each of the X coarse movement stage 23X and the Y coarse movement stage 23Y. The weight canceling device 26 floats on the surface plate 12 through a small clearance via a plurality of air bearings 26a attached to the lower surface portion thereof. The weight cancellation device 26 is connected to the Y coarse movement stage 23Y via a plurality of coupling devices 26b at the center of gravity height position in the Z-axis direction, and is pulled by the Y coarse movement stage 23Y. It moves on the surface plate 12 in the Y-axis direction and / or the X-axis direction together with the moving stage 23Y.

  The weight cancellation device 26 includes, for example, an air spring (not shown), and the weight (vertical downward force) of the fine movement stage 21, the leveling device 27, the substrate holder 30a, and the like by the upward force generated by the air spring. This reduces the load on the plurality of voice coil motors of the fine movement stage drive system. The leveling device 27 supports the fine movement stage 21 from below so as to be swingable (tilt operation) with respect to the XY plane. The leveling device 27 is supported in a non-contact manner from below on the weight cancellation device 26 via an air bearing (not shown). As shown in FIG. 3, the tilt amount information of the fine movement stage 21 with respect to the XY plane is obtained by using a target 26 d attached to the weight cancellation device 26 by a plurality of Z sensors 26 c attached to the lower surface of the fine movement stage 21. It is done. The detailed configuration and operation of the weight canceling device 26 including the leveling device 27 and the connecting device 26b are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Each of the plurality of substrate lift devices 46a is fixed to the upper surface of the Y coarse movement stage 23Y, the Z actuator 47, the position protruding from the upper surface (substrate mounting surface) of the substrate holder 30a to the + Z side by the Z actuator 47, and the substrate holder 30a. And a lift pin 48a driven in the Z-axis (vertical) direction between the upper surface and the position retracted to the -Z side. The substrate lift device 46a includes lift pins 48a, and the vicinity of the + Z side end thereof is formed in the hole 21a formed in the fine movement stage 21 (or the hole 24a formed in the mirror base 24) and the substrate holder 30a. Is inserted into the hole 36a. A gap is set between the substrate lift device 46a and the wall surface defining the holes 21a and 36a so that the fine movement stage 21 does not come into contact with each other when the fine movement stage 21 is slightly driven on the Y coarse movement stage 23Y. .

  As shown in FIG. 2 (only the lift pin 48a is shown in FIG. 2 and the Z actuator 47 is not shown), the plurality of substrate lift devices 46a are spaced at predetermined intervals so that the lower surface of the substrate P can be supported almost evenly. They are spaced apart from each other. In the first embodiment, a plurality of (for example, four) substrate lift device rows each including a plurality of (for example, four) substrate lift devices 46a arranged at predetermined intervals in the Y-axis direction are provided at predetermined intervals in the X-axis direction. It is arranged. In the first embodiment, for example, the substrate P is separated (lifted) from the substrate holder 30a by using, for example, 24 substrate lift devices 46a, but the number and arrangement of the substrate lift devices 46a are not limited thereto. It is not limited, and can be appropriately changed according to the size of the substrate P, for example.

  Returning to FIG. 1, the substrate carry-in device 80 is disposed above (+ Z side) a port unit 90 described later. As shown in FIG. 2, the substrate carry-in device 80 includes a pair of X travel guides 81, a pair of X slide members 82 provided corresponding to the pair of X travel guides 81, and a pair of X slide members 82. An arranged road hand 83 is provided.

  The pair of X traveling guides 81 are each composed of a member extending in the X-axis direction, and the longitudinal dimension thereof is set somewhat longer than the X-axis dimension of the substrate P. The pair of X traveling guides 81 are arranged in parallel to each other at a predetermined interval in the Y-axis direction (spacing slightly larger than the dimension of the substrate P in the Y-axis direction). Each of the pair of X slide members 82 is engaged with the corresponding X traveling guide 81 so as to be slidable in the X axis direction, and by an actuator (not shown) (for example, a feed screw device, a linear motor, a belt driving device, etc.). , And are driven synchronously with a predetermined stroke along the X travel guide 81.

Loading hand 83 includes a base portion 83 ₁ is a parallel plate-like portion to the XY plane extending in the Y-axis direction, a plurality of (e.g. four) is a X-axis direction parallel to the plate-like portion to the XY plane extending and a support portion 83 _2. Longitudinal direction (Y-direction) dimension of the base portion 83 ₁ is set somewhat shorter than the dimension in the Y-axis direction of the substrate P. A plurality of support portions 83 ₂ are disposed parallel to each other at predetermined intervals in the Y-axis direction, the ends of each of the + X side is integrally connected to the -X side end of the base portion 83 _1. A base portion 83 _1, and the plurality of support portions 83 _2, are integrally formed by, for example, CFRP (Carbon Fiber Reinforced Plastics). The longitudinal direction (X-axis direction) dimension of the plurality of support portions 83 ₂ is set somewhat shorter than the dimension in the X-axis direction of the substrate P, the substrate P includes the -X side of the area of the base portion 83 ₁ by a plurality of support portions 83 _2, is supported from below. As shown in FIG. 1, the Z position of the road hand 83 is set somewhat on the −Z side from the X travel guide 81.

Returning to Figure 2, the plurality of support portions 83 ₂ each of the upper surfaces, the suction pads 84 of a plurality arranged in a predetermined interval in the X-axis direction (for example, three) are mounted. A vacuum device (not shown) is connected to the load hand 83, and the substrate P can be sucked and held using the plurality of suction pads 84. Loading hand 83, the base portion 83 ₁ of the + Y side end portion of the -Y side via an attachment member 83 ₃ + Y side are respectively connected to the X slide member 82 on the -Y side, a pair of X slide member By synchronously driving 82 in the X-axis direction, the substrate P is moved between the region above the port portion 90 shown in FIG. 1 and the region near the end on the + X side of the surface plate 12 XY. It can be moved with a predetermined stroke in the X-axis direction parallel to the plane.

  Returning to FIG. 1, the port unit 90 includes a gantry 91, a plurality of guide members 92, and a substrate carry-out device 93. The gantry 91 is installed on the floor 11 at a position on the + X side of the surface plate 12, and is housed in a chamber (not shown) together with the substrate stage device PST.

  Each of the plurality of guide members 92 is composed of a plate-like member parallel to the XY plane, and supports the substrate P from below. Each of the plurality of guide members 92 is synchronously driven in the Z-axis (vertical) direction by a Z actuator 94 fixed on the gantry 91. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 92, and pressurized gas (for example, air) is ejected from the holes to support the substrate P in a floating manner through a minute clearance. Be able to. Further, the guide member 92 can also hold the substrate P by suction using the plurality of holes (or other holes).

  As shown in FIG. 2, the plurality of guide members 92 are spaced apart from each other at a predetermined interval so that the lower surface of the substrate P can be supported almost evenly. In the first embodiment, a plurality (for example, four rows) of substrate guide member arrays each including a plurality of (for example, three) guide members 92 arranged at predetermined intervals in the X-axis direction are arranged at predetermined intervals in the Y-axis direction. Has been. Thus, in the first embodiment, the substrate P is supported from below using, for example, 12 guide members 92 in total.

Here, each of the plurality of guide members 92 is in a state where the load hand 83 of the substrate carry-in device 80 is positioned above the port portion 90 (a state where the load hand 83 is positioned at the stroke end on the + X side). It is arranged so as not to overlap the position for a plurality of support portions 83 ₂ and the Y-axis direction of the load hand 83. Accordingly, when the plurality of guide members 92 are driven in the + Z direction in synchronization with the load hand 83 positioned above the port portion 90, the plurality of guide members 92 contact the load hand 83. without, so that it can pass between the support portions 83 ₂ adjacent to each other. Further, the intervals in the Y-axis direction of the plurality of substrate lift devices 46a included in the substrate stage 20a described above are substantially the same as the intervals in the Y-axis direction of the plurality of guide members 92, although not shown, the substrate holder 30a. in a state where the upward are positioned loading hand 83, when a plurality of lift pins 48a is driven in the + Z direction, the plurality of lift pins 48a without contacting the load hand 83, while the supporting portion 83 ₂ adjacent to each other Can pass through.

  Returning to FIG. 1, the substrate carry-out device 93 includes an X travel guide 95, a plurality of Z actuators 96 for moving the X travel guide 95 up and down, and an X slide member that moves on the X travel guide 95 with a predetermined stroke in the X axis direction. 97, a suction pad 98 attached to the X slide member 97, and the like.

  The X traveling guide 95 is composed of a member extending in the X-axis direction, and, as shown in FIG. 2, between the second row and the third row of the plurality (for example, four rows) of the substrate guide member rows. Is arranged. Returning to FIG. 1, for example, two Z actuators 96 are provided apart from each other in the X-axis direction. The X slide member 97 is engaged with the X travel guide 95 so as to be slidable in the X-axis direction, and is driven by an actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive device, etc.). And is driven with a predetermined stroke. The suction pad 98 is made of a plate-like member parallel to the XY plane, and a vacuum suction hole is formed on the upper surface (the surface facing the + Z side). In the substrate carry-out device 93, the X traveling guide 95 is driven by a plurality of Z actuators 96, whereby the X slide member 97 and the suction pad 98 are moved (vertically moved) in the Z-axis direction.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage MST by a mask loader (not shown) under the control of the main controller (not shown). At the same time, the substrate loading device 80 loads the substrate P onto the substrate holder 30a. After that, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after the alignment measurement, a step-and-scan exposure operation is sequentially performed on a plurality of shot areas set on the substrate. Is done. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate on which the exposure processing has been completed is carried out of the substrate holder 30a, and another substrate to be exposed next is transferred to the substrate holder 30a, whereby the substrate on the substrate holder 30a is exchanged, and a plurality of substrates are exchanged. An exposure operation or the like is continuously performed on the substrate.

Hereinafter, the exchange operation of the substrate P on the substrate holder 30a in the liquid crystal exposure apparatus 10 (for convenience, a plurality of substrates P will be referred to as substrate P ₀ , substrate P ₁ , substrate P ₂ , substrate P ₃ ) will be described with reference to FIGS. This will be described with reference to FIG. The following board replacement operation is performed under the control of a main controller (not shown).

In FIG. 4 (A), the substrate holder 30a of the substrate stage 20a, the substrate _{P 1} is held. Further, the loading hand 83 of the substrate carry-in device 80, after the substrate _{P 1} is unloaded from the substrate holder 30a, and then the substrate _P that is to be carried to the substrate holder 30a ₂ (the next substrate _{P 2)} is Is retained. In addition, the exposed substrate P ₀ is held on the transfer hand 19 of the substrate carry-out robot installed outside the liquid crystal exposure apparatus 10 (see FIG. 1). Here, the shape of the transfer hand 19 of the substrate carry-out robot and the transfer hand 18 of the substrate carry-in robot, which will be described later, are substantially the same as the load hand 83 of the substrate carry-in device 80, but the load hand 83 becomes the X travel guide 81. In contrast, the transport hand 19 and the transport hand 18 are supported (cantilevered) by the robot arms 19a and 18a in the vicinity of the + X side end, and the robot arms 19a and 18a It moves in the X-axis direction by being controlled appropriately.

The main control unit, among the plurality of shot areas set on the substrate P _1, after exposure for the last shot area has been completed, from the lower side of the substrate stage 20a projection optical system PL (see FIG. 1), a constant The position is moved to a position adjacent to the port section 90 (hereinafter referred to as a board replacement position) on the board 12 in the vicinity of the end on the + X side. At the substrate exchange position, the substrate stage 20a is positioned with respect to the Y-axis direction so that the Y position of the notch 37 and the Y position of the substrate carry-out device 93 substantially coincide as shown in FIG.

In parallel with the movement of the substrate stage 20a to the substrate replacement position, in the substrate carry-in device 80, the load hand 83 is driven in the -X direction as shown in FIG. ₂ is located above the substrate replacement position. In the substrate carry-out device 93, the X slide member 97 is driven on the X travel guide 95 in the −X direction and is inserted into the notch 37.

Thereafter, as shown in FIG. 5 (A), the substrate carry-out device 93, a plurality of Z actuators 96, to a position where the upper surface of the suction pad 98 is in contact with the lower surface of the substrate P _1, X running guide 95 and X The slide member 97 is driven in the + Z direction (the substrate holder 30a may be driven in the -Z direction). Suction pad 98 sucks and holds the end portion of the + X side on the lower surface of the substrate P _1. Furthermore, the substrate stage 20a, together with the suction holding of the substrate P ₁ is released by the substrate holder 30a, the pressurized gas is ejected from the upper surface of the substrate holder 30a. Further, the Z positions of the plurality of guide members 92 are controlled such that the Z position of the upper surface thereof is substantially the same as the Z position of the upper surface of the substrate holder 30a.

Next, as shown in FIG. 5B, in the substrate carry-out device 93, the X slide member 97 is driven on the X travel guide 95 in the + X direction. Moving Thus, the upper surface of the substrate P ₁ is a substrate holder 30a sucked and held by the suction pad 98, and the + X direction along a plane parallel (guide surface) in the XY plane formed by the upper surface of the plurality of guide members 92 Then, it is unloaded from the substrate holder 30a. At this time, pressurized gas is ejected from the upper surfaces of the plurality of guide members 92. This makes it possible to move the substrate P ₁ high speed, low dust generation.

When unloading of the substrate P ₁ is completed, as shown in FIG. 6 (A), the substrate stage 20a, Z actuator 47 so that a plurality of substrate lift device 46a each lift pin 48a is moved in the + Z direction is controlled synchronously , each of the plurality of lift pins 48a passes through between the supporting portion 83 ₂ of the loading hand 83, to press the lower surface of the substrate P ₂ from below. The load hand 83, suction holding of the substrate P ₂ by the plurality of suction pads 84 is released. As a result, the substrate P ₂ is separated from the load hand 83.

When the substrate P ₂ and load the hand 83 is spaced, as shown in FIG. 6 (B), the substrate carry-in device 80, the load hand 83 is driven in the + X direction, it is retracted from above the substrate exchange position. Further, in the substrate carry-out device 93, the X travel guide 95 and the X slide member 97 are driven in the −Z direction by the plurality of Z actuators 96. Thereby, a wide space is formed between the substrate carry-in device 80 and the substrate carry-out device 93. Further, a plurality of guide members 92 is also driven somewhat on the -Z side, the substrate P ₁ is moved slightly in the -Z direction. Furthermore, the substrate P ₀ is an external device that is placed on the conveying hand 19 of the substrate carry-out robot (e.g., coater developer device) while being conveyed to another substrate P transfer hand 18 from the external device substrate carrying robot ₃ is conveyed.

Thereafter, as shown in FIG. 7A, in the substrate stage 20a, the Z actuator 47 is synchronously controlled so that the lift pins 48a of each of the plurality of substrate lift devices 46a move in the -Z direction. ₂ is placed on the upper surface of the substrate holder 30a. At this time, as the lower surface of the lift pin 48a and the substrate P ₂ are separated, Z position of the lift pin 48a is controlled. Substrate _{P 2} is attracted to and held on the substrate holder 30a. Also, transfer hand 18 of the substrate loading robot supporting the substrate P ₃ is driven in the -X direction, between the pair of X running guide 81 of the substrate carry-in device 80 (see illustrated only one in FIG. 7 (A). FIG. 2) Inserted into. Thereby, the conveyance hand 18 of the substrate loading robot and the load hand 83 of the substrate loading device 80 are arranged so as to overlap each other in the vertical direction. Further, the transfer hand 19 of the substrate carry-out robot is driven in the −X direction and is inserted into the space between the load hand 83 and the substrate carry-out device 93. As described above, since the transport hand 19 has substantially the same shape as the load hand 83, it does not contact the guide member 92. Thereby, the transfer hand 19 of the substrate carry-out robot and the load hand 83 of the substrate carry-in device 80 are arranged so as to overlap in the vertical direction.

Thereafter, by the plurality of guide members 92 are driven in the -Z direction, the substrate P ₁ is delivered to the conveying hand 19 of the substrate carry-out robot. Transfer hand 19 supporting the substrate P _1, as shown in FIG. 7 (B), is driven in the + X direction, it conveys the substrate P ₁ to an external device.

After hands over the substrate P ₁ to the conveying hand 19, each of the plurality of guide members 92, it is driven in synchronism with the + Z direction as shown in FIG. 8 (A). Each of the plurality of guide members 92 comes into contact with the lower surface of the substrate P ₃ without contacting the load hand 83 and the transport hand 18, and is separated from the transport hand 18 by lifting the substrate P ₃ .

Thereafter, as shown in FIG. 8B, the transfer hand 18 of the substrate carry-in robot is driven in the + X direction and retreats from the area above the substrate carry-out device 93. Then, each of the plurality of guide members 92 for supporting the substrate P ₃ from below are driven in the -Z direction by the Z actuator 96. At this time, each of the plurality of guide members 92 while passing between the support portions 83 ₂ adjacent to each other in the loading hand 83, the substrate P ₃ is supported from below on the supporting portion 83 ₂ of the load hand 83 (receiving Passed). This returns to the state shown in FIG. 4A (where the substrate P ₀ is replaced with the substrate P ₁ , the substrate P ₁ is replaced with the substrate P ₂ , and the substrate P ₂ is replaced with the substrate P ₃ ). In FIG. 7 (B) ~ FIG 8 (B), after Although the substrate stage 20a which holds the substrate _{P 2} are shown, the substrate _{P 2} adsorbed held (see FIG. 7 (A)), immediately port The alignment measurement and exposure processing may be started away from the unit 90.

As described above, according to the first embodiment, the upper surface of the substrate holder 30a is used as a guide surface for unloading the substrate P (the substrate P _{1 in} FIGS. 4A to 8B). When moving the substrate P away from the substrate holder 30a for carrying out the substrate, the moving amount (rising amount) of the substrate P may be small. Accordingly, it is sufficient that there is a space in which the load hand 83 can be inserted above the substrate holder 30a of the substrate stage 20a in a state where the substrate stage 20a is positioned at the substrate exchange position. As described above, the substrate exchange system according to the first embodiment (including the substrate carry-in device 80 and the substrate carry-out device 93 that uses the upper surface of the substrate holder 30a as a part of the guide surface) includes the substrate holder 30a and the lens barrel. Even when the space between the surface plate 16 (see FIG. 1) is narrow, it can be used suitably, and the substrate on the substrate holder 30a can be replaced quickly.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. The liquid crystal exposure apparatus according to the second embodiment is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the configuration of the substrate holder 30b and the substrate lift device 46b. Only the points will be described, and elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof will be omitted.

  In the first embodiment, the substrate P moves with the upper surface of the substrate holder 30a as a guide surface when the substrate is carried out (see FIGS. 5A and 5B), whereas the second embodiment. However, as shown in FIG. 10, the difference is that the guide member 48b attached to the Z actuator 47 of each of the plurality of substrate lift devices 46b moves as a guide surface.

As shown in FIG. 9, on the upper surface of the substrate holder 30b, X groove 36b ₁ extending in the X-axis direction several (e.g. four) at predetermined intervals in the Y-axis direction are formed. Further, as shown in FIG. 10, through holes 36 b ₂ penetrating the substrate holder 30 b in the vertical direction are formed in the bottom surface defining the groove 36 b ₁ at a predetermined interval (for example, three) in the X-axis direction. its through hole 36b _2, a portion of the Z actuator 47 is inserted.

Guide member 48b is (three for example) a plurality at predetermined intervals in the X-axis direction in one of the grooves 36b ₁ are housed. The guide member 48b is composed of a plate-like member parallel to the XY plane. The Z actuator 47 causes the upper surface of the guide member 48b to protrude to the + Z side from the upper surface (substrate mounting surface) of the substrate holder 30b and the upper surface of the substrate holder 30b. Driven synchronously in the Z-axis (vertical) direction with the position retracted to the Z side. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 48b, and pressurized gas (for example, air) is ejected from the holes to support the substrate P in a floating manner through a minute clearance. Be able to. In the second embodiment, for example, four X grooves 36b ₁ are formed. However, the number of X grooves 36b ₁ and the number and arrangement of the guide members 48b are not limited thereto. It can be appropriately changed according to the size of the.

In the second embodiment, as shown in FIG. 10, when the substrate P to be carried out (substrate P _{1 in} FIG. 10) is carried out, the suction and holding of the substrate P ₁ by the substrate holder 30b is released. by a plurality of guide members 48b is driven in the + Z direction, the lower surface of the substrate P ₁ is separated from the upper surface of the substrate holder 30b. Suction pads 98 of the substrate carry-out device 93 is inserted between the upper and lower surfaces of the substrate P ₁ of the substrate holder 30b. Note that the substrate holder 30b of the second embodiment is not formed with a notch 37 unlike the substrate holder 30a of the first embodiment shown in FIG.

Returning to FIG. 10, when the suction pad 98 is inserted between the upper surface of the substrate holder 30 b and the lower surface of the substrate P ₁ , the guide members 48 b are driven in a slight amount in the −Z direction in the plurality of substrate lift devices 46 b, Thus the lower surface of the substrate P ₁ is sucked and held by the suction pad 98. A plurality of guides pressurized gas to the lower surface of the member 48b the substrate P ₁ is ejected, by X slide member 97 in a state in which the substrate P ₁ emerged is driven in the + X direction, the substrate P ₁ is a substrate The material is transferred from the guide member 48b of the holder 30b to the guide member 92 of the port portion 90. Regarding the carrying operation to another substrate _{P 2} of the substrate holder 30b, the lower substrate _{P 2} is instead a plurality of lift pins 48a (see FIGS. 6 (A) and 6 (B)) to a plurality of guide members 48b Since it is the same as that of the said 1st Embodiment except the point supported from (the some guide member 48b serves as the function of the some lift pin 48a), the description is abbreviate | omitted.

  In the second embodiment described above, in addition to the effects obtained in the first embodiment, it is not necessary to form a notch for inserting the suction pad 98 into the substrate holder 30b. Can be suppressed. Further, when the substrate P is sucked and held by the suction pad 98, it is not necessary to drive the suction pad 98 in the Z-axis direction (see FIG. 5A in the first embodiment). Easy to do. Furthermore, since it is not necessary to eject pressurized gas for floating the substrate P from the upper surface of the substrate holder 30b, piping for supplying the pressurized gas is unnecessary, and the substrate holder 30b can be reduced in weight.

  The configuration of the liquid crystal exposure apparatus is not limited to that described in the first and second embodiments, and can be changed as appropriate. For example, the lower surface of the substrate P is sucked and held by the suction pad 98, but the apparatus for holding the substrate P is not limited to this, and may be a clamp device that mechanically holds the substrate P, for example. . In the first and second embodiments, the substrate lift devices 46a and 46b are respectively mounted on the Y coarse movement stage 23Y. However, the present invention is not limited to this. For example, the substrate lift devices 46a and 46b may be provided on the substrate holders 30a and 30b. good.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In the above-described embodiment, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described. However, the number of projection optical units is not limited to this, and the number of projection optical units is one. That's all you need. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above-described embodiment, the case where the projection optical system PL has an equal magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In the above embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. As disclosed in US Pat. No. 6,778,257, based on electronic data of a pattern to be exposed, an electronic mask (variable shaping mask) that forms a transmission pattern or a reflection pattern, or a light emission pattern, for example, You may use the variable shaping | molding mask using DMD (Digital Micro-mirror Device) which is 1 type of a non-light-emitting type image display element (it is also called a spatial light modulator).

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  The substrate (object) described in the first and second embodiments is not limited to the exposure apparatus, but may be applied to an object treatment apparatus that performs a predetermined process on an object, such as an object inspection apparatus used for inspection of a predetermined object. An exchange method may be applied.

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the object exchange system and method of the present invention are suitable for exchanging an object held by an object holding device. The exposure apparatus of the present invention is suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for manufacturing micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20a ... Substrate stage, 30a ... Substrate holder, 46a ... Substrate lift device, 80 ... Substrate carry-in device, 83 ... Load hand, 90 ... Port part, 93 ... Substrate carry-out device, P ... Substrate, PST ... Substrate stage device.

Claims (22)

An object exchange system for exchanging an object placed on an object holding member of an object holding device,
A carry-in device for carrying an object to be carried above the object holding member;
An unloading device for unloading an object to be unloaded placed on the object placement surface of the object holding member in a direction along the object placement surface from the object holding member;
An object receiving device provided in the object holding device for receiving the object to be carried in from the carry-in device;
An object exchange system comprising: a guide member that is provided in the object holding device and defines a guide surface that guides the object to be carried out and carried out by the carrying-out device.   The object exchange system according to claim 1, wherein the object to be carried out is moved using the object holding member as the guide member and the object placement surface as the guide surface. The unloading device includes an unloading holding member that holds a part of the object to be unloaded,
The object exchange system according to claim 2, wherein an opening for inserting the carry-out holding member is formed on the object mounting surface in the object holding member. The guide member is provided in the object receiving device,
The object exchange system according to claim 1, wherein the object to be carried is delivered from the carry-in device to the guide member. The guide member is provided so as to be movable between a protruding position projected from the object placement surface and an accommodation position accommodated in the object holding member,
The object exchange system according to claim 4, wherein the object to be carried out moves on the guide member positioned at the protruding position.   The object exchange system according to any one of claims 1 to 5, wherein the guide member supports the object to be carried out in a non-contact manner.   The object exchange system according to any one of claims 1 to 6, wherein the carry-out device moves an object to be carried out along a two-dimensional plane parallel to the object placement surface. The carry-in device is moved along a two-dimensional plane parallel to the object placement surface,
The object receiving apparatus includes a movable member that is movable in a direction orthogonal to the two-dimensional plane, and receives the object to be loaded from the loading apparatus using the movable member. The object exchange system according to item. The carry-in device has a support member that supports the object to be carried in,
9. The support member is formed with a notch that opens to the front side in the movement direction when the object to be carried in is carried in, and the movable member is inserted into the notch when the object to be carried in is delivered. The object exchange system described in 1.   The carry-in device has guide members for guiding the movement of the support member on one side and the other side of the support member in a direction perpendicular to the movement direction of the support member in a plane parallel to the two-dimensional plane. The object exchange system according to claim 9.   The transfer member for transferring the object to be transferred from an external device to the support member of the object transfer device is inserted between the guide members arranged on one side and the other side of the support member. The object exchange system described. The object holding device includes a guide device that guides with a predetermined stroke along a two-dimensional plane parallel to the object placement surface,
The object exchange system according to claim 1, wherein the object receiving device is provided in the guidance device.   The position of the object holding device when the object to be carried in is transferred from the loading device to the object receiving device, and the object holding device when the object to be carried out is carried out by the carrying out device The object exchange system according to any one of claims 1 to 12, wherein the position of the object is the same. The object exchange system according to any one of claims 1 to 13,
An exposure apparatus comprising: a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus using an energy beam.   The exposure apparatus according to claim 14, wherein the object is a substrate used in a flat panel display device.   The exposure apparatus according to claim 15, wherein the object has a length of at least one side of 500 mm or more. Exposing the object using the exposure apparatus according to claim 15 or 16,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus of claim 14;
Developing the exposed object. An object exchange method for exchanging an object placed on an object holding member of an object holding device,
Conveying an object to be carried in above the object holding member;
Using the object receiving device provided in the object holding device, receiving the object to be carried carried above the object holding member;
The object to be carried out placed on the object placement surface of the object holding member is guided by a guide surface defined by a guide member included in the object holding device, and the object holding surface is placed on the object placement surface. Carrying the object out of the object holding device in a direction along the object.   20. The object exchange method according to claim 19, wherein in the unloading, the object to be unloaded is moved using the object holding member as the guide member and the object placement surface as the guide surface. The guide member is provided in the object receiving device,
The object exchange method according to claim 19, wherein in the receiving, the object to be carried in is received from the carry-in device to the guide member.   The position of the object holding device when the object receiving device receives the object to be carried in is the same as the position of the object holding device when the object to be carried out is carried out. The object exchange method as described in any one of Claims.

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