HK1255616A1 - Substrate-replacement device - Google Patents

Substrate-replacement device

Info

Publication number
HK1255616A1
HK1255616A1 HK18114750.1A HK18114750A HK1255616A1 HK 1255616 A1 HK1255616 A1 HK 1255616A1 HK 18114750 A HK18114750 A HK 18114750A HK 1255616 A1 HK1255616 A1 HK 1255616A1
Authority
HK
Hong Kong
Prior art keywords
substrate
replacement device
replacement
Prior art date
Application number
HK18114750.1A
Other languages
Chinese (zh)
Inventor
青木保夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011107802A external-priority patent/JP5741927B2/en
Priority claimed from JP2011107796A external-priority patent/JP5741926B2/en
Priority claimed from JP2012085484A external-priority patent/JP5843161B2/en
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1255616A1 publication Critical patent/HK1255616A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
HK18114750.1A 2011-05-13 2018-11-19 Substrate-replacement device HK1255616A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011107802A JP5741927B2 (en) 2011-05-13 2011-05-13 Object carrying-out method, object exchange method, object holding device, object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP2011107796A JP5741926B2 (en) 2011-05-13 2011-05-13 Object exchange system, exposure apparatus, flat panel display production method, device production method, and object exchange method
JP2011107810 2011-05-13
JP2012085484A JP5843161B2 (en) 2011-05-13 2012-04-04 Exposure apparatus, flat panel display manufacturing method, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1255616A1 true HK1255616A1 (en) 2019-08-23

Family

ID=48138182

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18114750.1A HK1255616A1 (en) 2011-05-13 2018-11-19 Substrate-replacement device

Country Status (4)

Country Link
KR (2) KR102193251B1 (en)
CN (1) CN103534787B (en)
HK (1) HK1255616A1 (en)
TW (3) TWI739271B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103824792A (en) * 2014-02-28 2014-05-28 上海和辉光电有限公司 Storage cabinet and control method thereof
CN105116692B (en) * 2015-09-24 2018-03-09 京东方科技集团股份有限公司 A kind of exposure device and exposure method
CN108091601A (en) * 2016-11-23 2018-05-29 沈阳芯源微电子设备有限公司 A kind of semiconductor long range wafer conveying device
KR102614210B1 (en) * 2017-09-29 2023-12-14 가부시키가이샤 니콘 Substrate handling device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
WO2019064577A1 (en) * 2017-09-29 2019-04-04 株式会社ニコン Substrate handling device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
JP7205966B2 (en) * 2018-06-29 2023-01-17 川崎重工業株式会社 Substrate transfer device and its operation method
CN109384062B (en) * 2018-09-19 2020-02-18 武汉华星光电技术有限公司 Exposure machine and method for conveying substrate by exposure machine

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1351199A (en) * 1997-12-03 1999-06-16 Nikon Corporation Substrate transferring device and method
WO1999039999A1 (en) 1998-02-09 1999-08-12 Nikon Corporation Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP4049751B2 (en) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 Coating film forming device
JP4497972B2 (en) * 2004-03-23 2010-07-07 株式会社オーク製作所 Substrate transport mechanism of drawing apparatus
JP2005352070A (en) * 2004-06-09 2005-12-22 Nsk Ltd Substrate exchanging apparatus and aligner
JP4530352B2 (en) * 2004-12-21 2010-08-25 大日本スクリーン製造株式会社 Substrate mounting device
JP4870425B2 (en) * 2004-12-30 2012-02-08 エーエスエムエル ネザーランズ ビー．ブイ． PCB handler
JP4378301B2 (en) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and substrate processing program
JP4571525B2 (en) * 2005-03-10 2010-10-27 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4745040B2 (en) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 Substrate transport apparatus and substrate processing apparatus
KR101300853B1 (en) * 2005-12-05 2013-08-27 도쿄엘렉트론가부시키가이샤 Substrate conveying system, substrate conveying device and substrate treatment device
JP4661716B2 (en) * 2006-07-24 2011-03-30 株式会社日立プラントテクノロジー Board bonding equipment
JP5108557B2 (en) * 2008-02-27 2012-12-26 東京エレクトロン株式会社 Load lock device and substrate cooling method
TWI503631B (en) * 2008-04-24 2015-10-11 Tokyo Ohka Kogyo Co Ltd Coating apparatus

Also Published As

Publication number Publication date
TW202018849A (en) 2020-05-16
TWI590365B (en) 2017-07-01
CN103534787A (en) 2014-01-22
TWI739271B (en) 2021-09-11
KR102014553B1 (en) 2019-08-26
TWI685911B (en) 2020-02-21
KR20190099354A (en) 2019-08-26
TW201732993A (en) 2017-09-16
KR102193251B1 (en) 2020-12-22
TW201304044A (en) 2013-01-16
CN103534787B (en) 2018-02-06
KR20140031940A (en) 2014-03-13

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