KR20140031940A - Substrate-replacement device - Google Patents

Abstract

The board | substrate stage 20a ejects pressurized gas from the board | substrate holder 30a, and makes the board | substrate P ₁ float, and the board | substrate carrying out apparatus 93 guides the upper surface (substrate mounting surface) of the board | substrate holder 30a. The substrate P ₁ is moved out of the substrate holder 30a by moving along the horizontal plane. Next, another substrate P ₂ to be exposed is waiting above the substrate holder 30a when the carrying out operation of the substrate P ₁ is performed, and after completion of the carrying out operation of the substrate P ₁ , the substrate stage ( The number of substrate lift devices 46a received by 20a is received.

Description

Board exchange device {SUBSTRATE-REPLACEMENT DEVICE}

The present invention relates to an object exchange system, an object exchange method, an object carrying method, an object holding apparatus, an exposure apparatus, a manufacturing method of a flat panel display, and a device manufacturing method, and more particularly, an object held in an object holding apparatus. An object exchange system and method for exchanging an object, an object discharging method for discharging an object from an object holding apparatus, an object dispensing method including the object discharging method, an object holding apparatus for holding an object, and the object holding apparatus including An object exchange system, an exposure apparatus including the object holding apparatus or the object exchange system, a scanning exposure apparatus, a manufacturing method of a flat panel display using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

Conventionally, in the lithography process of manufacturing electronic devices (micro devices), such as a liquid crystal display element and a semiconductor element (integrated circuit, etc.), a mask or a reticle (henceforth a "mask"), and a glass plate or a wafer (henceforth, A step-and-scan exposure apparatus (so-called scanning) that transfers a pattern formed on a mask onto a substrate using an energy beam while synchronously moving the "substrate" along a predetermined scanning direction (scan direction). Stepper (also called a scanner)) and the like are used.

As this kind of exposure apparatus, it is known to carry in and carry out the board | substrate of exposure object with respect to a board | substrate stage using a board | substrate conveyance apparatus (for example, refer patent document 1).

Here, in the exposure apparatus, when the exposure process to the board | substrate hold | maintained at the board | substrate stage is complete | finished, the board | substrate is carried out from the board | substrate stage, and another board | substrate is conveyed on the board | substrate stage, and exposure processing is performed continuously with respect to a some board | substrate. do. Therefore, when carrying out exposure process with respect to several board | substrate continuously, it is preferable to carry out a board | substrate quickly from a board | substrate stage.

US Patent No. 6,559,928

The present invention has been made under the circumstances described above, and from the first point of view, an object exchange system for exchanging an object placed on an object holding member of an object holding device is provided. An import device for conveying an object to be carried upwards; an export device for carrying out an object to be carried on the object placing surface of the object holding member from the object holding member in a direction along the object placing surface; and the object holding A guide member which is formed in the apparatus and defines an object receiving apparatus which receives the object to be loaded from the carrying apparatus, and a guide surface formed in the object holding apparatus and which guides the object to be taken out by the carrying apparatus. The first object exchange system having a.

According to this, when a carrying object is carried out from the object holding member, it is guided to the guide member which an object holding apparatus has, and is carried out along the object mounting surface of an object holding member, For example, an object is carried out, for example, It is not necessary to position the member for recovering from the upper portion of the object holding member. Therefore, the carrying out operation of the object can be performed quickly. Moreover, what is necessary is just to form the space above which the object holding member can only place a carrying apparatus.

According to a second aspect of the present invention, there is provided an object exchanging method for exchanging an object placed on an object holding member of an object holding device, the object carrying device being carried above the object holding member, and the object holding device. A guide having the object holding device configured to receive the object to be conveyed above the object holding member by using an object receiving device formed on the object and to carry the object to be carried on the object placing surface of the object holding member; It guides to the guide surface defined by a member, and it carries out from the said object holding apparatus exterior in the direction along the said object mounting surface from the said object holding member.

According to a third aspect of the present invention, there is provided an object carrying method for carrying out an object placed on an object holding member of an object holding device from the object holding member, wherein the object holding device holding the object is the object. Moving the object from the holding member toward the object discharging position for carrying out the object, and initiating a discharging operation for discharging the object from the object holding member before the object holding apparatus reaches the object discharging position; It is a method of carrying out the object.

According to this, the carrying out operation of the object is started before the object holding device reaches the object carrying out position, so that the carrying out of the object onto the object holding member can be performed quickly.

According to a fourth aspect of the present invention, the present invention starts the carrying out operation by the object discharging method according to the third aspect of the present invention, and before the object holding apparatus reaches the object discharging position, the other object is moved to a predetermined position. Waiting to be in a standby position, taking the object out of the object holding device with the object holding device positioned at the object carrying position, and bringing the other object placed in the waiting position onto the object holding device; A second object exchange method comprising the.

According to a fifth aspect of the present invention, there is provided an object exchanging method for exchanging an object placed on an object holding member included in an object holding device, the object carrying member being carried above the object holding member, and the object The object holding device is configured to receive the carrying object to be conveyed upward of the object holding member by using an object receiving device formed on the holding device, and to carry out the object to be placed on the object placing surface of the object holding member. It guides to the guide surface defined by the guide member which has, and it carries out in the direction along the said object mounting surface from the said object holding member using the object carrying apparatus which the object holding apparatus has. .

According to a sixth aspect of the present invention, there is provided an object holding member having an object placing surface on which an imported object is placed, capable of holding the object placed on the object placing surface, and the object held by the object holding member. It is an object holding apparatus provided with the carrying out apparatus which carries out from the said object holding member to the exterior.

According to this, since the object holding | maintenance apparatus is equipped with the carrying out apparatus, the carrying out operation | movement of an object can be performed with arbitrary timing. Therefore, carrying out of the object from the object holding device can be performed quickly.

According to a seventh aspect, the present invention is provided in the object holding apparatus according to the sixth aspect of the present invention, an importing apparatus for carrying an object to be loaded above the object holding member, and the object holding apparatus. A second object exchange system comprising an object receiving device for receiving a target object from the carrying device, and a guide member formed in the object holding device and defining a guide surface for guiding the carrying object to be carried out by the carrying device. to be.

The present invention is, from the eighth aspect, the object holding apparatus according to the sixth aspect of the present invention, the first object exchange system according to the first aspect of the present invention, and the second object exchange system according to the seventh aspect of the present invention. It is a 1st exposure apparatus provided with any one of and the pattern forming apparatus which forms a predetermined pattern using an energy beam with respect to the said object hold | maintained at the said object holding apparatus.

According to a ninth aspect, the present invention provides a scanning exposure apparatus for moving an object in a scanning direction with respect to an energy beam at the time of exposure, the first exposure being movable in a first direction orthogonal to the scanning direction within a predetermined two-dimensional plane. A movable body, a second movable body movable on the first movable body in a second direction parallel to the scanning direction and movable together with the first movable body in the first direction, and configured to hold the object; An object holding device which is disposed above the second movable body and is guided in a direction parallel to the predetermined two-dimensional plane integrally with the object by the movement of the second movable body, formed on the first movable body, and the object It is a 2nd exposure apparatus provided with the carrying out apparatus which drives the said object in a predetermined carrying out direction with respect to a holding apparatus.

According to this, since the carrying-out apparatus which carries out an object is formed in the 1st mobile body which moves in the direction orthogonal to a scanning direction, the inertial mass of the 2nd mobile body which moves to a scanning direction does not increase, especially at the time of scanning exposure. It is possible to control the position of the object with high precision.

According to a tenth aspect of the present invention, the object is exposed using the first exposure apparatus according to the eighth aspect of the present invention or the second exposure apparatus according to the ninth aspect of the present invention. It is a manufacturing method of a flat panel display including developing.

According to an eleventh aspect of the present invention, the object is exposed using the first exposure apparatus according to the eighth aspect of the present invention or the second exposure apparatus according to the ninth aspect of the present invention. A device manufacturing method comprising developing an object.

FIG. 1: is a figure which shows roughly the structure of the liquid crystal exposure apparatus of 1st Embodiment.
FIG. 2 is a plan view of the substrate stage (substrate holder), the substrate loading apparatus, and the substrate carrying apparatus included in the liquid crystal exposure apparatus of FIG. 1.
FIG. 3 is a cross-sectional view taken along the line AA of the substrate stage of FIG. 2.
4 (A) and 4 (B) are diagrams (1 and 2) for explaining the substrate exchange operation in the first embodiment.
5 (A) and 5 (B) are diagrams (3 and 4) for explaining the substrate exchange operation in the first embodiment.
6 (A) and 6 (B) are diagrams (5 and 6) for explaining the substrate exchange operation in the first embodiment.
FIG. 7: (A) and 7 (B) are figures (7 and 8) for demonstrating the board | substrate exchange operation | movement in 1st Embodiment.
8 (A) and 8 (B) are diagrams (9 and 10) for explaining the substrate exchange operation in the first embodiment.
9 is a plan view of the substrate stage (substrate holder), the substrate loading device, and the substrate carrying out device according to the second embodiment.
FIG. 10 is a cross-sectional view taken along line BB of FIG. 9.
FIG. 11: is a figure which shows roughly the structure of the liquid crystal exposure apparatus of 3rd Embodiment.
FIG. 12 is a plan view of the substrate stage (substrate holder), substrate loading apparatus, and port portion of the liquid crystal exposure apparatus of FIG. 11.
FIG. 13 is a cross sectional view (CC line sectional view of FIG. 12) of the substrate stage of FIG. 12.
14 (A) and 14 (B) are diagrams (1 and 2) for explaining the substrate exchange operation in the third embodiment.
15A and 15B are diagrams (3 and 4) for explaining the substrate exchange operation in the third embodiment.
FIG.16 (A) and FIG.16 (B) are figures (5 and 6) for demonstrating the board | substrate exchange operation in 3rd Embodiment.
17 (A) and 17 (B) are diagrams (7 and 8) for explaining the substrate exchange operation in the third embodiment.
18 (A) and 18 (B) are diagrams (9 and 10) for explaining the substrate exchange operation in the third embodiment.
It is a figure for demonstrating the relationship of a board | substrate stage and a port part at the time of carrying out the board | substrate of 3rd Embodiment.
20A to 20C are diagrams (1 to 3) for explaining the operation of the substrate at the time of carrying out the substrate of the third embodiment.
21 is a plan view of a substrate stage (substrate holder), a substrate loading device, and a port portion according to the fourth embodiment.
FIG. 22 is a cross-sectional view of the substrate stage (substrate holder), the substrate loading device, and the port portion of FIG. 21.
FIG. 23 is a plan view of a substrate stage (substrate holder), a substrate loading device, and a port portion according to the fifth embodiment.
24 is a cross-sectional view of the substrate stage according to the sixth embodiment.
FIG.25 (A)-FIG.25 (C) is a figure (1-3) for demonstrating the operation | movement of the board | substrate in 6th Embodiment.
26A to 26C are diagrams (1 to 3) for explaining the substrate exchange operation in the first modification.
FIG. 27 (A)-FIG. 27 (C) are figures (4-4) for demonstrating the board | substrate exchange operation | movement in a 1st modification.
28 is a plan view of a substrate stage apparatus (substrate holder and substrate unloading apparatus) according to a second modification.
29A and 29B are diagrams (1 and 2) for explaining the substrate exchange operation in the third modification.
30 (A) and 30 (B) are diagrams (3 and 4) for explaining the substrate exchange operation in the third modification.
FIG. 31: is a figure which shows roughly the structure of the liquid crystal exposure apparatus which concerns on 7th Embodiment.
FIG. 32 is a plan view of the substrate stage apparatus of the liquid crystal exposure apparatus of FIG. 31.
FIG. 33 is a side view of the substrate stage apparatus of FIG. 32 seen from the + Y side. FIG.
34 is a cross-sectional view taken along the line EE of the substrate stage apparatus of FIG. 33.
35 is a plan view of the substrate stage (substrate holder), the substrate loading device, and the port portion of the liquid crystal exposure apparatus of the seventh embodiment.
36A and 36B are diagrams (1 and 2) for explaining the substrate exchange operation in the seventh embodiment.
37 (A) and 37 (B) are diagrams (3 and 4) for explaining the substrate exchange operation in the seventh embodiment.
38 (A) and 38 (B) are diagrams (5 and 6) for illustrating the substrate exchange operation in the seventh embodiment.
39 (A) and 39 (B) are diagrams (7 and 8) for explaining the substrate exchange operation in the seventh embodiment.
40A and 40B are diagrams (9 and 10) for explaining the substrate exchange operation in the seventh embodiment.
41 (A) and 41 (B) are diagrams (11 and 12) for explaining the substrate exchange operation in the seventh embodiment.
FIG. 42 is a plan view of the substrate stage according to the eighth embodiment, illustrating a state before the substrate unloading operation. FIG.
43 is a cross-sectional view of the substrate stage of FIG. 42.
FIG. 44 is a plan view of the substrate stage according to the eighth embodiment, which is a diagram illustrating a state during the substrate unloading operation. FIG.
45 is a cross-sectional view of the substrate stage of FIG. 44.
46 is a diagram illustrating a substrate stage according to a fourth modification.
47 is a plan view of the substrate holder of the substrate stage apparatus according to the fifth modification.
48: (A) is FF line sectional drawing of FIG. 47, FIG. 48 (B) is sectional view GG line of FIG. 48 (A), FIG. 48 (C) is operation | movement of the board | substrate lift apparatus which concerns on 5th modified example. It is a figure for demonstrating.
49 (A) and 49 (B) are diagrams (1 and 2) showing the internal structure of the substrate lift apparatus of FIG. 48 (A).
50A to 50D are diagrams (1 to 4) for explaining the loading and unloading operation of the substrate in the substrate stage according to the fifth modification.
51 (A) and 51 (B) are diagrams (1 and 2) showing a substrate lift apparatus according to a sixth modification.
52 is a diagram illustrating a substrate stage device according to a seventh modification.
53 is a diagram illustrating the substrate stage device according to the eighth modification.

≪ First Embodiment >

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment is described using FIGS. 1-8 (B).

In FIG. 1, the structure of the liquid crystal exposure apparatus 10a of 1st Embodiment is shown schematically. The liquid crystal exposure apparatus 10a is, for example, a projection exposure using a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used as a liquid crystal display device (flat panel display) as an exposure object. Device.

In the liquid crystal exposure apparatus 10a, a resist (sensitizer) is applied to the illumination system IOP, the mask stage MST holding the mask M, the projection optical system PL, and the surface (the surface facing the + Z side in FIG. 1). The board | substrate stage apparatus PSTa which hold | maintains the apply | coated board | substrate P, the board | substrate loading apparatus 80a, the port part 90 which carries out a board | substrate between external devices, these control systems, etc. Include. In the following, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is set as the X axis direction, and the direction orthogonal to the X axis in the horizontal plane is Y axis direction, The description will be made with the directions perpendicular to the X and Y axes being the Z axis direction, and the rotation directions of the X, Y, and Z axis rotations being the θx, θy, and θz directions, respectively. In addition, description is made with positions in the X-axis, Y-axis, and Z-axis directions as X positions, Y positions, and Z positions, respectively.

The illumination system (IOP) is constructed in the same manner as the illumination system disclosed in, for example, U.S. Patent No. 6,552,775. That is, the illumination system IOP is for exposing light emitted from a light source (for example, a mercury lamp) not shown through a reflector, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, etc., not shown, respectively. The mask M is irradiated as illumination light (illumination light) IL. As the illumination light IL, for example, light such as i line (wavelength 365 nm), g line (wavelength 436 nm), h line (wavelength 405 nm) (or synthetic light of the i line, g line, h line, etc.). ) Is used.

The mask M in which the circuit pattern etc. were formed in the pattern surface is adsorb | sucked and hold | maintained in the mask stage MST by vacuum suction, for example. The mask stage MST is mounted on the barrel surface plate 16 which is a part of the apparatus main body (body), and is predetermined in the scanning direction (X axis direction) by, for example, a mask stage drive system (not shown) including a linear motor. While being driven by a long stroke of, it is appropriately finely driven in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) in the XY plane of the mask stage MST is measured by a mask interferometer system including a laser interferometer not shown.

The projection optical system PL is disposed below the mask stage MST and is supported by the barrel surface plate 16. The projection optical system PL is configured in the same manner as the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems in which the projection area of the pattern image of the mask M is arranged in a zigzag shape, and has a rectangular single image field having the Y axis direction as the longitudinal direction. Function equivalently (so-called multi-lens projection optical system). In this embodiment, as each of the plurality of projection optical systems, forming an upright phase with, for example, bilateral telecentric equal magnification systems is used.

For this reason, when the illumination region on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination region through the projection optical system PL by the illumination light IL passing through the mask M. The projected image (partial grain-shaped image) of the circuit pattern of the mask M in the inside is formed in the irradiation area (exposure area) of illumination light IL conjugated to the illumination area on the board | substrate P. As shown in FIG. Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PSTa, the mask M is moved relative to the illumination region (illumination light IL) in the scanning direction, and the exposure region (illumination light IL) By relatively moving the substrate P in the scanning direction with respect to)), scanning exposure of one shot region on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot region. That is, in this embodiment, the pattern of the mask M is produced | generated on the board | substrate P by the illumination system IOP and the projection optical system PL, and the sensitive layer on the board | substrate P by illumination light IL (resist layer) The pattern is formed on the substrate P by exposure to the substrate.

The substrate stage apparatus PSTa is provided with the surface plate 12 and the substrate stage 20a arrange | positioned above the surface plate 12.

The surface plate 12 is made of a rectangular plate-like member in plan view (viewed from the + Z side), and its top surface is finished with a very high plan view. The surface plate 12 is mounted on a substrate stage mount 13 that is a part of the apparatus main body. The apparatus main body, including the substrate stage mount 13, is mounted on the vibration isolator 14 provided on the floor 11 of the clean room, whereby the mask stage MST, the projection optical system PL, etc. The vibration is separated with respect to the floor 11.

The substrate stage 20a is mounted on the X coarse motion stage 23X and the X coarse motion stage 23X and constitutes a so-called gantry-type XY two-axis stage device together with the X coarse motion stage 23X. 23Y, the fine motion stage 21 arrange | positioned at the + Z side (upper) of the Y coarse motion stage 23Y, the board | substrate holder 30a holding the board | substrate P, and the fine motion stage 21 on the surface plate 12 below. And a plurality of substrate lift devices 46a (not shown in FIG. 1, see FIG. 3) for separating the weight canceling device 26 and the substrate P from the substrate holder 30a.

The X coarse motion stage 23X is made of a rectangular member having the Y axis direction in the longitudinal direction in plan view, and an elongated opening portion (not shown) is formed in the central portion thereof in the Y direction in the longitudinal direction. The X coarse motion stage 23X is mounted on a guide member (not shown) extending in the X-axis direction provided separately from the apparatus main body on the floor 11, for example, during a scanning operation at the time of exposure, a substrate exchange operation. It is driven at a predetermined stroke in the X axis direction by an X stage drive system including a linear motor or the like at the time.

The Y coarse motion stage 23Y consists of a rectangular member in plan view, and an opening part (not shown) is formed in the center part. The Y coarse motion stage 23Y is mounted on the X coarse motion stage 23X via the Y linear guide device 25, and is, for example, included in a Y stage drive system including a linear motor at the time of Y step operation at the time of exposure. It is driven by the predetermined stroke in the Y axis direction by the X coarse motion stage 23X. In addition, the Y coarse motion stage 23Y moves in the X axis direction integrally with the X coarse motion stage 23X by the action of the Y linear guide device 25.

The fine motion stage 21 consists of a rectangular parallelepiped member with a substantially square height low in plan view. The fine motion stage 21 is Y by a fine motion stage drive system including a plurality of voice coil motors (or linear motors) comprising a stator fixed to the Y coarse motion stage 23Y and a mover fixed to the fine motion stage 21. The micro stage is driven in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, θz directions) with respect to the coarse motion stage 23Y. In the plurality of voice coil motors, the X voice coil motors 29x and the fine motion stages 21 of the plurality of microscopic drivings of the fine motion stages 21 in the X-axis direction (superimposed in the direction of the paper depth in Fig. 1) are Y A plurality of Y voice coil motors (not shown) which micro drive in the axial direction, and the fine motion stage 21 are arranged at positions corresponding to four corners of the plurality of micro drive (for example, the fine motion stage 21) that are micro driven in the Z axis direction. Z voice coil motor 29z is included.

Moreover, the fine motion stage 21 is guide | induced to the Y coarse motion stage 23Y through the said several voice coil motor, and is predetermined along the XY plane in the X-axis direction and / or Y-axis direction with the Y coarse motion stage 23Y. Move to the stroke of. The positional information in the XY plane of the fine movement stage 21 is a movement mirror fixed to the fine movement stage 21 via the mirror base 24 (X movement mirror 22x having a reflection surface orthogonal to the X axis, and orthogonal to the Y axis). An X interferometer for measuring the X position of the fine motion stage 21 using an unillustrated interferometer (X moving mirror 22x) that irradiates the side beam to a Y moving mirror having a reflecting surface (not shown) And a Y interferometer for measuring the Y position of the fine motion stage 21). The configuration of the fine motion stage drive system and the substrate interferometer system is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

In addition, as shown in FIG. 3, the fine movement stage 21 has several hole part 21a which penetrates to the upper surface (+ Z surface) and lower surface (-Z surface) (it penetrates in the Z-axis direction) mentioned later. It is formed in the position corresponding to each of the some board | substrate lift apparatus 46a. Similarly, the mirror base 24 is also provided with a hole 24a corresponding to the substrate lift device 46a.

The board | substrate holder 30a consists of a rectangular parallelepiped member with a low height of a quadrangle as seen from the plane which makes the X-axis direction the longitudinal direction, and is being fixed on the upper surface of the fine motion stage 21. As shown in FIG. On the upper surface of the substrate holder 30a, a plurality of hole portions (not shown) are formed. The substrate holder 30a can be selectively connected to a vaccum device formed on the outside of the substrate stage 20a and a compressor (not shown), and the substrate P (in FIG. 3) is provided by the vaccum device. It is possible to make the board | substrate P float through the micro clearance by adsorbing-holding (refer FIG. 1) and blowing the pressurized gas supplied from the said compressor. In addition, suction and blowing of gas may be performed using a common hole part, and you may use a dedicated hole part, respectively.

Moreover, the some board lift apparatus 46a which the some hole part 31a opened to the board | substrate holder 30a (it penetrates in the Z-axis direction) opening in the upper surface (+ Z plane) and lower surface (-Z plane) is mentioned later. Is formed at a position corresponding to each. 2 and 3, it is an end part of the + X side in the upper surface of the substrate holder 30a, and the notch opened to the + Z side and the + X side in the center part in the Y-axis direction. 32 is formed.

As shown in FIG. 3, the weight canceling apparatus 26 consists of one columnar member extended in a Z-axis direction (it is also called a pontoon), and fine movement stage through the apparatus called the leveling apparatus 27. As shown in FIG. The center part of 21 is supported from below. The weight canceling device 26 is inserted in the opening of each of the X coarse motion stage 23X (not shown in FIG. 3, see FIG. 1), and the Y coarse motion stage 23Y. The weight canceling device 26 floats through the minute clearance on the surface plate 12 via the some air bearing 26a attached to the lower surface part. The weight canceling device 26 is connected to the Y coarse motion stage 23Y via the plurality of coupling devices 26b at the center height position in the Z axis direction, and is pulled by the Y coarse motion stage 23Y, thereby providing the Y It moves on the surface plate 12 in the Y-axis direction and / or the X-axis direction with the coarse motion stage 23Y.

The weight canceling device 26 has an air spring, not shown, for example, and the fine motion stage 21, the leveling device 27, and the substrate holder 30a are driven by the vertical upward force generated by the air spring. Cancels the weight (force in the vertical direction downward) of the system including the pressure-reduced load, thereby reducing the load of the plurality of voice coil motors of the fine motion stage drive system. The leveling device 27 supports the fine movement stage 21 from below to be able to swing (tilt motion) with respect to the XY plane. The leveling device 27 is non-contactedly supported from below by the weight canceling device 26 via an air bearing (not shown). The inclination amount information with respect to the XY plane of the fine motion stage 21 uses the target 26d attached to the weight cancellation apparatus 26 by the some Z sensor 26c attached to the lower surface of the fine motion stage 21. Obtained by The detailed configuration and operation of the weight canceling device 26, including the leveling device 27 and the connecting device 26b, is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

Each of the plurality of substrate lift devices 46a is fixed to the upper surface of the Y coarse motion stage 23Y and + Z from the upper surface (substrate mounting surface) of the substrate holder 30a by the Z actuator 47 and the Z actuator 47. It has a lift pin 48a driven in a Z-axis (up-down) direction between the position which protruded to the side, and the position which entered into the -Z side rather than the upper surface of the board | substrate holder 30a. The substrate lift device 46a includes a lift pin 48a, and the hole portion 21a (or the hole portion 24a formed in the mirror base 24) is formed in the fine movement stage 21 near the end of its + Z side. And a hole 31a formed in the substrate holder 30a. Between the substrate lift device 46a and the wall surfaces defining the holes 21a, 24a, 31a, a gap such that the fine movement stage 21 does not come into contact with each other when microscopically driven on the Y coarse stage 23Y is provided. It is set.

As shown in FIG. 2 (only the lift pin 48a is shown in FIG. 2, and the Z actuator 47 (refer FIG. 3) is abbreviate | omitted in FIG. 2), the some board | substrate lift apparatus 46a of the board | substrate P The lower surfaces are spaced apart from each other at predetermined intervals so as to support almost evenly. In this 1st Embodiment, the board | substrate lift apparatus row which consists of the several (for example, four) board | substrate lift apparatus 46a arrange | positioned at predetermined space | intervals in the Y-axis direction has a plurality (for example, at predetermined intervals in the X-axis direction). For 6 columns) are arranged. In addition, in this 1st Embodiment, although the board | substrate P is separated (lifted) from the board | substrate holder 30a using 24 board | substrate lift apparatus 46a in total, for example, of the board | substrate lift apparatus 46a The number and arrangement are not limited to this, and can be appropriately changed depending on the size of the substrate P, for example. Moreover, the kind of Z actuator 47 is not specifically limited, either, For example, an air cylinder apparatus, a feed screw apparatus, a cam apparatus, etc. can be used.

Returning to FIG. 1, the board | substrate loading apparatus 80a is arrange | positioned above (+ Z side) the port part 90 mentioned later. As shown in FIG. 2, the substrate loading device 80a includes a pair of X travel guides 81, a pair of X slide members 82 formed corresponding to the pair of X travel guides 81, and 1. A rod hand 83 disposed between the pair of X slide members 82 is provided.

The pair of X running guides 81 are each formed of members extending in the X axis direction, and the longitudinal dimension thereof is set slightly longer than the X axis direction dimension of the substrate P. As shown in FIG. The pair of X running guides 81 are arranged in parallel to each other at a predetermined interval (slightly wider than the Y-axis direction dimension of the substrate P) in the Y-axis direction. Each of the pair of X slide members 82 is slidably engaged in the X-axis direction with respect to the corresponding X travel guide 81 and includes an actuator not shown (for example, a feed screw device, a linear motor, a belt drive device). Etc.) are synchronously driven along a X travel guide 81 at a predetermined stroke.

Loading hand 83, XY plane XY plane plate, for portions of plural (for example, parallel to and extending in a plate-like part of the base portion parallel (83 ₁₎ and, X-axis direction to extending in the Y-axis direction It has a supporting portion (83 ₂₎ of the four). Longitudinal direction of the base portion (83 ₁₎ (Y-axis direction) dimension, is set slightly shorter than the dimension of the Y-axis direction of the substrate (P). A plurality of supports (83 ₂₎ has an end portion in the Y axis direction are arranged in parallel to each other at a predetermined interval, each of the + X side is integrally connected to the end of the -X side of the base portion (83 _1). A plurality of support portion and the base portion (83 ₁₎ (83 ₂₎ are, for instance, ever been integrally molded by CFRP (Carbon Fiber Reinforced Plastics). Longitudinal direction of the plurality of supports (83 ₂₎ (X-axis direction) dimension, and is set slightly shorter than the dimension of the X-axis direction of the substrate (P), the substrate (P) is -X a base portion (83 ₁₎ by a support part (83 ₂₎ and a plurality of regions of the side it is supported from the lower side. As shown in FIG. 1, the Z position of the rod hand 83 is set on the −Z side than the X travel guide 81.

Returning to FIG. 2, on the upper surface of each of the several support parts 83 ₂ , the several (for example, three) adsorption pad 84 arrange | positioned at predetermined intervals in the X-axis direction is attached. A bariumum device (not shown) is connected to the rod hand 83, and the substrate P can be adsorbed and held using the plurality of suction pads 84. Loading hand 83, the side of + Y of the base portion (83 _1), and via the member (83 ₃₎ ends are seated in the -Y side of the + Y side, are connected to the X slide member 82 of the -Y side, The pair of X slide members 82 are synchronously driven in the X-axis direction, so that the substrate is between the region above the port portion 90 shown in FIG. 1 and the region near the end portion on the + X side of the surface plate 12. (P) can be moved in a predetermined stroke in the X-axis direction parallel to the XY plane. In addition, in the board | substrate loading apparatus 80a, the rod hand 83 is comprised so that up-and-down movement with respect to a pair of X travel guides 81 (or integrally with a pair of X travel guides 81) is possible. You may be.

Returning to FIG. 1, the port part 90 has the mount 91, the some guide member 92, and the board | substrate carrying out apparatus 93. As shown in FIG. The mount 91 is on the floor 11 and is provided at a position on the + X side of the surface plate 12 and is housed in a chamber (not shown) together with the substrate stage device PSTa.

Each of the plurality of guide members 92 is made of a plate-like member parallel to the XY plane, and supports the substrate P from below. Each of the plurality of guide members 92 is synchronously driven in the Z axis (up and down) direction by the Z actuator 94 fixed on the mount 91. In the upper surface of the guide member 92, a plurality of minute holes (not shown) are formed, and a pressurized gas (for example, air) is blown out from the hole parts, and the substrate P is floated and supported by the minute clearances. I can do it. Moreover, the guide member 92 can also adsorb | suck and hold | maintain the board | substrate P using the said some hole part (or another hole part).

As shown in FIG. 2, the some guide member 92 is mutually spaced at predetermined intervals so that the lower surface of the board | substrate P can be supported substantially evenly. In this 1st Embodiment, the guide member row which consists of the some (for example, three) guide member 92 arrange | positioned at the predetermined space | interval in the X-axis direction has a plurality (for example, four rows at predetermined intervals in the Y-axis direction). ) Is arranged. Thus, the port part 90 of this 1st Embodiment supports the board | substrate P from below using a total of 12 guide members 92, for example.

Here, each of the plurality of guide members 92 is a state in which the rod hand 83 of the substrate loading device 80a is positioned above the port portion 90 (the rod hand 83 is placed at the stroke end on the + X side). Position) so that the plurality of support portions 8 ₂ of the rod hand 83 and the position in the Y-axis direction do not overlap each other. Accordingly, when the plurality of guide members 92 are driven in the + Z direction in synchronism with the rod hand 83 located above the port portion 90, the plurality of guide members 92 are formed by the rod hand ( It can pass through between the support parts 83 _{2 which} adjoin each other, without contacting 83). Moreover, the space | interval regarding the Y-axis direction of the some board | substrate lift apparatus 46a which the above-mentioned board | substrate stage 20a has is substantially the same as the space | interval regarding the Y-axis direction of the said some guide member 92, and a board | substrate holder When the plurality of lift pins 48a are driven in the + Z direction with the rod hand 83 positioned above the 30a, the plurality of lift pins 48a do not contact the rod hand 83, It is able to pass through the support part (83 ₂₎ adjacent to each other.

Returning to FIG. 1, the board | substrate carrying out apparatus 93 carries out several X actuators 96 and X run guides 95 for moving up and down the X run guide 95 and the X run guide 95 in an X-axis direction. The X slide member 97 and the adsorption pad 98 mounted to the X slide member 97 are moved to a predetermined stroke.

The X travel guide 95 is formed of a member extending in the X-axis direction, and is arranged between the second row and the third row among the plurality of (for example, four rows) of guide members rows as shown in FIG. 2. It is. Returning to FIG. 1, two Z actuators are spaced apart in the X-axis direction, for example, two are formed. The X slide member 97 is slidably engaged with the X travel guide 95 in the X axis direction, and is provided with an actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive device, etc.), It is driven along a X travel guide 95 at a predetermined stroke (stroke about the same as the X axis direction dimension of the substrate P). The adsorption pad 98 consists of a plate-shaped member parallel to an XY plane, and the vacuum suction hole part is formed in the upper surface (surface toward + Z side). In the substrate carrying device 93, the X travel guide 95 is driven by the plurality of Z actuators 96 so that the X slide member 97 and the suction pad 98 move (up and down) in the Z axis direction. It is.

In the liquid crystal exposure apparatus 10a (refer FIG. 1) comprised as mentioned above, under the control of the main controller which is not shown in figure, the mask M on the mask stage MST is shown by the mask loader which is not shown in figure. While the load is carried out, the substrate P is loaded onto the substrate holder 30a by the substrate loading device 80a. After that, alignment measurement is performed using an alignment detection system (not shown) by the main controller, and after completion of the alignment measurement, exposure operation of a sequential step and scan method is performed on a plurality of shot regions set on the substrate. do. In addition, since this exposure operation is the same as the exposure operation of the step-and-scan system conventionally performed, the detailed description is abbreviate | omitted. And while the board | substrate which completed exposure process is carried out from the board | substrate holder 30a, the other board | substrate exposed next is conveyed to the board | substrate holder 30a, and the board | substrate on the board | substrate holder 30a is exchanged, and several The exposure operation or the like is continuously performed on the substrate.

A substrate (P) on the substrate holder (30a) in the following, a liquid crystal exposure device (10a) (for convenience, a substrate a plurality of substrates (P) (P _0), the substrate (P _1), the substrate (P _2), the substrate The replacement operation (referred to as P ₃ ) will be described with reference to FIGS. 4A to 8B. The following substrate exchange operation is performed under the management of a main controller not shown.

In FIG. 4A, the substrate P ₁ is held in the substrate holder 30a of the substrate stage 20a. Further, in the loading hand 83 of the substrate carry-in device (80a), the substrate (P ₁₎ after the out of the substrate holder (30a), the substrate (P _2), to be brought about, and then the substrate holder (30a) ( Next substrate P ₂ ) is held. In addition, in the conveying hand 19 of the substrate carry-out robot provided outside the liquid crystal exposure device (10a) (see FIG. 1), there is a holding substrate (P _0), exposure is ended. Here, although the shape of the conveyance hand 19 of the board | substrate carrying robot and the conveyance hand 18 of the board | substrate carrying robot mentioned later is substantially the same as the rod hand 83 of the said board | substrate carrying apparatus 80a, the rod hand 83 ) Moves along the X travel guide 81 in the X-axis direction, while the conveyance hand 19 and the conveyance hand 18 are supported by the robot arms 19a and 18a near the end portions on the + X side, respectively ( Cantilever supported) and the robot arms 19a and 18a are controlled appropriately, thereby moving in the X-axis direction.

The main controller is configured to move the substrate stage 20a from the lower side of the projection optical system PL (see FIG. 1) after the exposure processing to the last shot region among the plurality of shot regions set on the substrate P ₁ is completed. It is in the vicinity of the end part on the + X side on the surface plate 12, and moves to the position (henceforth a board | substrate exchange position) adjacent to the port part 90. At the board | substrate exchange position, as shown in FIG. 2, the board | substrate stage 20a is positioned with respect to the Y-axis direction so that the Y position of the notch 32 and the Y position of the board | substrate carrying out apparatus 93 may substantially correspond. In addition, the board | substrate exchange position is a board | substrate carrying out position which carries out the board | substrate P hold | maintained in the board | substrate holder 30a (substrate stage 20a) from the board | substrate holder 30a (substrate stage 20a) as mentioned later. It can be said to be (object carrying out position).

In addition, in parallel with the movement of the substrate stage 20a to the substrate exchange position, in the substrate loading apparatus 80a, as shown in FIG. 4 (B), the rod hand 83 is driven in the -X direction. Thus, the substrate P ₂ is located above the substrate exchange position. Moreover, in the board | substrate carrying out apparatus 93, the X slide member 97 is driven in the -X direction on the X running guide 95, and the suction pad 98 is cut out of the board | substrate holder 30a located in a board | substrate exchange position. It is inserted in 32.

Subsequently, as shown in FIG. 5A, in the substrate transport apparatus 93, the upper surface of the suction pad 98 is in contact with the lower surface of the substrate P ₁ by the plurality of Z actuators 96. The X travel guide 95 and the X slide member 97 are driven in the + Z direction to the position (you may drive the substrate holder 30a in the -Z direction). Suction pads (98), the suction when the edge vicinity of the + X side of the substrate (P _1). In addition, ejected against the lower face of the substrate stage (20a) in the substrate holder (30a) substrate (P ₁₎ pressurized gas from the substrate (P ₁₎ from the upper surface of together as soon suction holding is released, the substrate holders (30a) of by do. Moreover, the Z position of the some guide member 92 is controlled so that the Z position of the upper surface may become substantially the same as the Z position of the upper surface of the board | substrate holder 30a.

Next, as shown to FIG. 5 (B), in the board | substrate carrying out apparatus 93, the X slide member 97 is driven on the X running guide 95 to + X direction. In this way, the suction on the suction pad (98) the substrate (P ₁₎ is a plane parallel to the XY plane formed by the upper surface, and the upper surface of the plurality of guide members 92 of the substrate holder (30a) (a guide surface) It moves along + X direction along the board | substrate, and is carried out on the some guide member 92 from the board | substrate holder 30a. At this time, a pressurized gas is sprayed against the lower face of the upper surface of the plurality of guide members 92 also, the substrate (P _1). Thereby, the board | substrate P ₁ can be moved at high speed and low oscillation.

In Exporting the end of the substrate (P _1), as shown in Fig. 6 (A), the substrate stage (20a), each lift pin (48a) multiple substrate lift device (46a) is to move in the + Z direction The Z actuator 47 is synchronously controlled, and each of the plurality of lift pins 48a passes between the support portions 83 ₂ of the rod hand 83 to press the lower surface of the substrate P ₂ from below. do. In addition, in the rod hand 83, the suction holding of the substrate P ₂ by the plurality of suction pads 84 is released. As a result, the substrate P ₂ is separated from the rod hand 83.

Substrate (P ₂₎ and the loading hand 83 is when separated, in the as shown in Fig. 6 (B), the substrate carry device (80a), to load the hand 83 is driven in the + X direction, the substrate exchange position Evacuate from above. Moreover, in the board | substrate carrying out apparatus 93, the X travel guide 95 and the X slide member 97 are driven by the -Z direction by the some Z actuator 96. FIG. Thereby, a wide space is formed between the board | substrate carrying apparatus 80a and the board | substrate carrying apparatus 93. As shown in FIG. In addition, it is also driven toward some -Z plurality of guide member 92, and the substrate (P ₁₎ moves in the -Z direction slightly. In addition, the mounting substrate on the conveying hand 19 of the substrate carry-out robot (P _0), the external device (e.g., a coater-developer apparatus) for an external device transporting, conveying hand 18 of the substrate carry-robot together as soon as The substrate P ₃ to be loaded into the substrate holder 30a is then conveyed from the substrate P ₂ .

Subsequently, as shown in FIG. 7A, the Z actuator 47 is synchronized so that the lift pins 48a of the plurality of substrate lift devices 46a move in the −Z direction in the substrate stage 20a. It is controlled, and the board | substrate P ₂ is mounted on the upper surface of the board | substrate holder 30a by this. At this time, the Z position of the lift pin 48a is controlled so that the lower surface of the lift pin 48a and the substrate P ₂ are separated from each other. The substrate P ₂ is held by the substrate holder 30a. In addition, the substrate (P ₃₎ in the supporting substrate conveying hand 18 of the feeding robot is driven in the -X direction, the pair of the X traveling guide of the substrate carry-in device (80a) (81) (Fig. 7 (A) Only one is shown, see Fig. 2). Thereby, the conveyance hand 18 of the board | substrate carrying robot and the rod hand 83 of the board | substrate carrying apparatus 80a overlap and are arrange | positioned in the up-down direction. Moreover, the conveyance hand 19 of a board | substrate carrying robot is driven to-X direction, and is inserted in the space between the rod hand 83 and the board | substrate carrying apparatus 93. As mentioned above, since the conveyance hand 19 is substantially the same shape as the rod hand 83, it does not contact with the guide member 92. FIG. Thereby, the conveyance hand 19 of the board | substrate carrying robot and the rod hand 83 of the board | substrate loading apparatus 80 overlap and are arrange | positioned in the up-down direction.

Thereafter, each of the plurality of guide members 92 is driven in the -Z direction, so that the substrate P ₁ is received by the transfer hand 19 of the substrate carrying robot. As the conveying hand 19 which supports the substrate (P ₁₎ it is shown in Fig. 7 (B) also, is driven in the + X direction, and transferring the substrate (P ₁₎ towards the external device. Further, instead of driving the plurality of guide members 92 in the -Z direction to pass the substrate P ₁ to the transfer hand 19 of the substrate carrying robot, the substrate carrying robot is driven in the + Z direction to drive the substrate P _1. ) May be received by the conveyance hand 19. In addition, the plurality of guide members 92 and the substrate transporting robot may be driven in the Z direction to pass the substrate P ₁ .

A plurality of substrate guide member 92 after a modest (P ₁₎ of the conveying hand 19, each of which is driven in synchronization with the + Z direction as shown in Fig. 8 (A) Fig. A plurality of guide members 92. Each of the loading hand 83 and does not come into contact with the conveying hand 18 and the upper surface contacts the lower surface of the substrate (P _3), conveyed by lifting the substrate (P ₃₎ Hand Separate from (18).

Thereafter, as shown in FIG. 8B, the transfer hand 18 of the substrate loading robot is driven in the + X direction to evacuate from the region above the substrate carrying device 93. Then, the substrate (P ₃₎ for each of the plurality of guide members (92) which supports from the lower side is driven in the direction of -Z by the Z actuator (96). At this time, while each of the plurality of guide members 92 passes between the support parts 8 _{2 with} which the rod hands 83 are adjacent to each other, the substrate P ₃ supports the support parts 8 ₂ of the rod hand 83. Supported from below (received). In this way, the state shown in Fig. 4 (A) (However, the substrate (P ₀₎ of the substrate (P _1), the substrate (P ₁₎ to the substrate (P _2), the substrate (P ₂₎ of the substrate (P ₃ ), Each to be replaced). Further, (see Fig. 7 (A)) Figure 7 (B) ~ FIG. 8 (B) in the substrate (P ₂₎ a substrate stage (20a) that may be seen, suction to the substrate (P ₂₎ maintaining a Immediately thereafter, alignment measurement and exposure processing may be started away from the substrate exchange position.

As described above, if, according to the first embodiment, the substrate (P) (Fig. 4 (A) ~ FIG. 8 (B) in the substrate (P ₁₎₎ guide the top surface of the substrate holder (30a) on the release of Since it is used as, the substrate carrying out operation on the substrate holder 30a can be performed quickly. Moreover, when separating the board | substrate P from the board | substrate holder 30a for carrying out a board | substrate, the moving amount (rise amount) of the board | substrate P may be a little. Therefore, in the state where the substrate stage 20a is located at the substrate exchange position, it is sufficient that there is a space into which the load hand 83 can be inserted above the substrate holder 30a of the substrate stage 20a. Thus, the board | substrate exchange system (it includes the board | substrate carrying out apparatus 93 which uses the upper surface of the board | substrate carrying apparatus 80a and the board | substrate holder 30a as a part of guide surface) of this 1st Embodiment is the board | substrate holder 30a. ) Can be preferably used even when the space between the barrel and the barrel surface plate 16 (see FIG. 1) is narrow.

≪ Second Embodiment >

Next, 2nd Embodiment is described using FIG. 9 and FIG. Since the liquid crystal exposure apparatus which concerns on this 2nd Embodiment is the same as that of the liquid crystal exposure apparatus 10a (refer FIG. 1) of the said 1st Embodiment except the structure of the board | substrate holder 30b and the board | substrate lift apparatus 46b. Hereinafter, only difference is demonstrated and the element which has the structure and function similar to the said 1st Embodiment is attached | subjected the same code | symbol as the said 1st Embodiment, and the description is abbreviate | omitted.

In the said 1st Embodiment, the board | substrate P moved on the upper surface of the board | substrate holder 30a as a guide surface at the time of carrying out a board | substrate (refer FIG. 5 (A) and FIG. 5 (B)), In 2nd Embodiment, as shown in FIG. 10, the point which moves the guide member 48b attached to the Z actuator 47 of each of several board | substrate lift apparatus 46b as a guide surface differs.

On the upper surface of the substrate holder (30b) as shown in Figure 9, it is formed a plurality (e.g. four) at a predetermined interval in the X-groove (31b _1), a Y-axis extending in the X-axis direction. In addition, X home through hole (31b ₂₎ is in the X-axis direction for a predetermined distance (for example, 3 to (31b ₁₎ penetrating in the substrate holder (30b) the vertical direction, as the bottom surface for defining, as shown in Figure 10 A portion of the Z actuator 47 is inserted through the through hole 31b ₂ .

The guide member 48b is accommodated in one groove 31b ₁ in plurality (for example, three) at predetermined intervals in the X-axis direction. The guide member 48b consists of a plate-shaped member parallel to the XY plane, and is positioned by the Z actuator 47 so that its upper surface protrudes from the upper surface (substrate mounting surface) of the substrate holder 30b to the + Z side and the substrate holder. It drives in the Z-axis (up-down) direction between the positions which entered the -Z side rather than the upper surface of 30b. On the upper surface of the guide member 48b, a plurality of minute holes (not shown) are formed, and a pressurized gas (for example, air) is blown out from the hole parts, and the substrate P (Fig. 10) is made through the minute clearances. In this case, the substrate P ₁ can be floated and supported. Moreover, the guide member 48b is able to adsorb | suck and hold | maintain the board | substrate P using the said some hole part (or another hole part). In this second embodiment, X groove (31b ₁₎ are for example formed of four but, X home number of (31b _1), and the guide member can be of (48b), arrangement and the like is not limited thereto Instead, for example, it can be appropriately changed depending on the size of the substrate.

Present in the second embodiment, as shown in Figure 10, the export destination substrate (P) (In Figure 10 the substrate (P ₁₎₎ in the anti-release of the substrate (P ₁₎ by the substrate holder (30b) The plurality of guide members 48b are synchronously driven in the + Z direction while the suction holding is released, so that the lower surface of the substrate P ₁ is separated from the upper surface of the substrate holder 30b. The suction pad 98 of the substrate carrying device 93 is inserted between the upper surface of the substrate holder 30b and the lower surface of the substrate P ₁ . In addition, the notch 32 is not formed in the board | substrate holder 30b of this 2nd Embodiment like the board | substrate holder 30a of the said 1st Embodiment shown in FIG.

Returning to FIG. 10, when the suction pad 98 is inserted between the upper surface of the substrate holder 30b and the lower surface of the substrate P ₁ , in the plurality of substrate lift devices 46b, the guide member 48b has a small amount. are driven in the direction of -Z, and therefore is kept adsorbed to the suction pad (98) when the substrate (P _1). And, being a pressurized gas is ejected against the lower face of the substrate (P ₁₎ from a plurality of guide members (48b), driven in the X slide member (97) is the + X direction to the substrate (P ₁₎ a floating state, the substrate ( P ₁ ) is received from the guide member 48b of the substrate stage 20b onto the guide member 92 of the port 90. Further, instead of following the substrate (see Fig. 6 (A) and 6 (B)) as to bring the operation to the substrate holder (30b) in (P _2), the substrate (P ₂₎ a plurality of lift pins (48a) Since it is the same as the said 1st Embodiment except that it is supported (suction-held) from the some guide member 48b from below (the several guide member 48b also functions as the some lift pin 48a). ), The description is omitted.

In 2nd Embodiment demonstrated above, in addition to the effect acquired by the said 1st Embodiment, it is not necessary to provide the notch for inserting the adsorption pad 98 in the board | substrate holder 30b, and therefore it mounts on the board | substrate holder 30b. The warping of the substrate P to be used can be suppressed. In addition, since the suction pad 98 does not need to be driven in the Z-axis direction when the substrate P is adsorbed and held by the suction pad 98 (see FIG. 5 (A) in the first embodiment), the port portion The control of 90 can be simplified. In addition, since it is not necessary to blow out the pressurized gas for floating the substrate P from the upper surface of the substrate holder 30b, no piping or the like for supplying the pressurized gas is necessary, and the substrate holder 30b can be made light in weight. .

`` Third embodiment ''

Next, 3rd Embodiment is described using FIGS. 11-20 (C). In the said 1st Embodiment, as shown in FIG. 1, the port part 90 provided in the exterior of the board | substrate stage apparatus PSTa has the board | substrate carrying apparatus 93, and is shown in FIG. In the liquid crystal exposure apparatus 10c which concerns on a form, the point which the board | substrate stage 20c of the board | substrate stage apparatus PSTc has the board | substrate carrying out apparatus 70a differs. Hereinafter, in this 3rd Embodiment, the difference of the said 1st Embodiment is mainly demonstrated, and about the element which has a structure and a function similar to the said 1st Embodiment, the same code | symbol as the said 1st Embodiment is attached | subjected and the description Omit.

The liquid crystal exposure apparatus 10c of the third embodiment includes an illumination system IOP, a mask stage MST, a projection optical system PL, a substrate stage device PSTc, a substrate loading device 80c, and a port portion 60. And control systems thereof. The board | substrate stage 20c of the board | substrate stage apparatus PSTc is the X coarse motion stage 23X, the Y coarse motion stage 23Y, the fine motion stage 21, the board | substrate holder 30c, the weight canceling apparatus 26, and the some board | substrate. The lift apparatus 46a (not shown in FIG. 11, see FIG. 13) is provided. In addition, the structure of the board | substrate stage 20c is the same as that of the board | substrate stage 20a (refer FIG. 1 etc.) of the said 1st Embodiment except the board | substrate holder 30c having the board | substrate carrying apparatus 70a. Therefore, the description is omitted here.

As shown in FIG. 12, in the upper surface (substrate mounting surface) of the board | substrate holder 30c, the X groove | channel 73x parallel to an X-axis is formed in multiple numbers (for example, two) at predetermined intervals in a Y-axis direction. have. The X groove 73x is opened in each side surface of the + X side and the -X side of the substrate holder 30c.

The substrate carrying-out apparatus 70a is accommodated in each of some X groove 73x. The board | substrate carrying out apparatus 70a has the X running guide 71 and the adsorption apparatus 77a. The X travel guide 71 is formed of a member extending in the X axis direction, and is fixed to the bottom face defining the X groove 73x, as shown in FIG. 13. The dimension of the length (X-axis) direction of the X running guide 71 is set longer than the dimension of the X-axis direction of the board | substrate holder 30c, and each end of the longitudinal direction protrudes outward of the board | substrate holder 30c. It is. The suction device 77a is a suction pad 77a ₁ for holding and holding a lower surface of the substrate P (not shown in FIG. 13, see FIG. 11), and the suction pad 77a ₁ on the X travel guide 71. It has a Z actuator 77a ₂ which drives to a vertical direction (Z-axis). The suction pad 77a _{1 is} formed of a plate-like member parallel to the XY plane, and is connected to an unshown vacuum device provided outside the substrate stage 20c.

The suction device 77a is slidably engaged with the X travel guide 71 in the X axis direction, and is driven on the X travel guide 71 with a predetermined stroke in the X axis direction. Although the kind of the drive apparatus for driving the adsorption apparatus 77a is not specifically limited, For example, the X linear motor which consists of a stator which the X traveling guide 71 has, and a mover which the adsorption apparatus 77a has, or X The feed screw device etc. which consist of the feed screw which the travel guide 71 has, and the nut which the suction device 77a has can be used. Moreover, you may use the belt drive apparatus which pulls the adsorption apparatus 77a by a belt (or a rope).

The port part 60 is provided in the + X side of the board | substrate stage apparatus PSTc, as shown in FIG. 11, and is accommodated in the chamber not shown with the board | substrate stage apparatus PSTc. The port part 60 has the mount 61 and the board | substrate guide apparatus 62. As shown in FIG.

The board | substrate guide apparatus 62 is formed in multiple numbers corresponding to each of the base 63, the some Z actuator 64 mounted on the base 63, and the some Z actuator 64, and the corresponding Z actuator 64 ), The guide member 65 is driven in the vertical direction (Z axis) direction. The base 63 is composed of a rectangular plate-shaped member viewed in a plane parallel to the XY plane, and is provided on a plurality of X linear guide members 66 fixed to an upper surface of the mount 61 and a lower surface of the base 63. It is guided straight to the X-axis direction by the several X linear guide apparatus which consists of the X slide member 67 fixed and engaged so that it can slide to the X linear guide member 66 freely. The base 63 is driven by a predetermined stroke in the X axis direction by an X actuator (for example, a feed screw device, a linear motor, etc.) not shown. Although the kind of Z actuator 64 is not specifically limited, For example, a cam apparatus, a feed screw apparatus, an air cylinder, etc. can be used. The plurality of Z actuators 64 are synchronously driven by a main controller not shown. The guide member 65 is a member similar to the guide member 92 (refer FIG. 1 etc.) of the said 1st Embodiment, and can hold | maintain the floating support and the board | substrate P from the board | substrate P from below.

Here, arrangement | positioning of the some Z actuator 64 and the some guide member 65 which the board | substrate guide apparatus 62 has is demonstrated using FIG. In addition, in FIG. 12, the Z actuator 64 is not shown hidden under the guide member 65 (-Z side). In addition, illustration of the mount 61, the base 63, etc. is abbreviate | omitted in FIG.

The some guide member 65 is arrange | positioned so that the guide surface of the board | substrate P formed by the some guide member 65 may become trapezoid shape by planar view. Specifically, the board | substrate guide apparatus 62 has 3 rows of guide members which consist of the some guide member 65 arrange | positioned at the predetermined | prescribed interval in the Y-axis direction, for example by 3 rows at predetermined intervals in the X-axis direction. have. And the guide member row of the most -X side is comprised by the eight guide members 65, for example. In addition, the middle guide member row among three rows of guide member rows is comprised by the six guide members 65, for example. Moreover, the guide member row of the + X side is comprised by four guide members 65, for example. As described above, the plurality of guide members 65 are arranged in a larger number than the guide member rows on the -X side as the guide member rows on the -X side, and in the substrate guide device 62, the substrate P is provided in the Y axis direction. The side of the -X side (substrate stage 20c side) is wider than the + X side in the range which can support this from below. And the length (width) about the Y-axis direction of the guide member row of the most -X side (substrate stage 20a side) comprised by the eight guide members 65 is Y-axis of the board | substrate P, for example. It is set longer than the length (width) with respect to a direction (for example, about 1.5 to 2 times).

Moreover, each of the some guide member 65 is similar to the guide member 92 (refer FIG. 2) of the said 1st Embodiment, and the port part 60 carries out the rod hand 83 of the said board | substrate loading apparatus 80c. (state loading hand 83, in which position the stroke end in the + X side) was positioned above the state, so as not to overlap the position of the plurality of supports (83 ₂₎ and the Y-axis direction of the loading hand 83 It is arranged. In addition, the shape, number, and arrangement | positioning of the some guide member 65 have the dimension regarding the Y-axis direction of the -X side of the guide surface prescribed | regulated by the some guide member regarding the Y-axis direction of the board | substrate P. If it is set larger than the dimension (when a guide surface is formed in trapezoid shape by planar view), it is not limited to this, It can change suitably.

As shown in FIG. 11, the board | substrate loading apparatus 80c is arrange | positioned above the port part 60 (+ Z side). The board | substrate carrying-in apparatus 80c of this 3rd Embodiment is a thing with which the space | interval of a pair of X running guides 81 is wide, and the mount for connecting the rod hand 83 to a pair of X slide members 82. Since the member (83 ₃₎ is slightly longer, except that, the first embodiment of the substrate carry-in device (80a) (see FIG. 2) with the same configuration, a description thereof will be omitted here.

Hereinafter, the substrate a substrate (P) (for convenience, a plurality of the substrate (P) on the substrate holder (30c) when the practice to include exposure operation continuously for a plurality of the substrate (P) (P _0), the substrate (P ₁ ) And the exchange operation of the substrate P ₂ and the substrate P ₃ ) will be described with reference to FIGS. 14A to 18B. The following substrate exchange operation is performed under the management of a main controller not shown. In addition, in order to make understanding easy, the board | substrate stage 20c is sectional drawing of the DD line | wire of FIG. 12 in FIG.14 (A)-FIG.15 (A), FIG.16 (B)-FIG.18 (B), FIG. CC line sectional drawing of FIG. 12 is shown in (B) and FIG. 16A, respectively.

In FIG. 14A, the substrate P ₁ is held in the substrate holder 30c of the substrate stage 20c. The loading hand 83, the substrate (P ₁₎ after being carried out of the substrate holder (30c), substrate will be brought about, and then the substrate holder (30c) (P ₂₎ of the substrate carry-in device (80c) there are (next substrate (P ₂₎₎ is retained. In addition, in the conveying hand 19 of the substrate carry-out robot, which is holding the substrate (P _0), exposure is ended.

The main control device includes a substrate (P ₁₎ of the plurality of shot areas set on the, after the exposure process of the last shot area end, a projection for the substrate stage (20c) optical system as shown in Fig. 14 (B) (PL ) (See FIG. 11) to the substrate exchange position.

In addition, in parallel with the movement of the substrate stage 20c to the substrate exchange position, in the substrate loading apparatus 80c, the rod hand 83 is driven in the -X direction, whereby the substrate P ₂ is moved to the substrate exchange position. Is located above. Moreover, in the port part 60, in order to narrow the space | interval (gap) of the guide member 65 and the board | substrate holder 30c of the most -X side, the base 63 is oriented to -X direction (substrate stage 20c). Approaching direction). The Z position of the plurality of guide members 65 on the base 63 is controlled such that the Z position of the upper surface thereof is substantially the same as the Z position of the upper surface of the substrate holder 30c.

When the substrate stage 20c is positioned at the substrate exchange position, as shown in FIG. 15A, the main controller releases the suction of the substrate P ₁ by the substrate holder 30c, and releases the substrate holder. The pressurized gas is blown off from the upper surface of 30c to float the substrate P ₁ . In addition, for example, the two adsorption pads 70a (one is not shown in FIG. 15 (A)) of each adsorption pad 77a ₁ (not shown in FIG. 15 (A). Driven to adsorb and hold the lower surface of the substrate P ₁ .

Thereafter, as shown in FIG. 15B, the adsorption device 77a is driven in the + X direction on the X travel guide 71. Accordingly, the side suction pads (77a ₁₎ suction holding the substrate (P ₁₎ is a plane parallel to the XY plane formed by the upper surface, and the upper surface of the plurality of guide members 65 of the substrate holder (30c), (Guide to ), It moves to + X direction, and it is carried out to the port part 60 from the board | substrate holder 30c. At this time, the pressurized gas is also ejected from the upper surfaces of the plurality of guide members 65. In this way, the substrate (P ₁₎ can be moved in a high speed, a low oscillation (低發塵).

Exporting the end of the substrate (P _1), respectively FIG. 16 (A), in the substrate stage (20c), the lift pin (48a) is + multiple substrate lift device Z to move in a direction (46a) as shown in Fig. Synchronous control. At this time, each of the plurality of lift pins 48a passes between the support portions 83 ₂ of the rod hand 83 to press the lower surface of the substrate P ₂ from below. In addition, in the rod hand 83, the suction holding of the substrate P ₂ by the plurality of suction pads 84 is released. As a result, the substrate P ₂ is separated from the rod hand 83. In addition, it is driven in the port portion (60), the substrate (P ₁₎ to the + X direction of the substrate guide mechanism 62, the support (base 63) (direction away from the substrate stage (20c)).

When the substrate P ₂ and the rod hand 83 are separated from each other, as shown in FIG. 16 (B), the rod hand 83 is driven in the + X direction, retracted from above the substrate exchange position, and the port portion 60. Return to the position above). Also, in the port portion 60, a plurality of guide member 65 is driven toward the -Z slightly, the substrate (P ₁₎ moves in the -Z direction slightly. Further, by transferring the next substrate (P ₃₎ from the substrate (P _0), the conveying hand 18 is an external apparatus, a substrate feeding robot with soon as the transfer to an external device placed on the conveying hand 19 of the substrate carry-out robot come.

Thereafter, as shown in FIG. 17A, each of the plurality of substrate lift devices 46a is synchronously controlled so that the lift pins 48a move in the -Z direction in the substrate stage 20c. P ₂ is placed on the upper surface of the substrate holder 30c (the lower surface of the lift pin 48a and the substrate P ₂ are spaced apart). The substrate P ₂ is held by the substrate holder 30c. In addition, the substrate (see Fig. 12, respectively) (P ₂₎ adsorbing the holding operation and in parallel to, the substrate carry-out device (70a) in the adsorption device, located in the edge vicinity of the + X side of the X driving guide (71) (77a) of Is driven in the -X direction to return to the position on the vicinity of the end portion on the -X side of the X travel guide 71.

Further, in the chamber of the port part 60, a substrate (P ₃₎ for supporting a conveying hand 18 of the substrate feeding robot is driven in the -X direction, the substrate carry-in device comprises a pair of travel guide of the X (80c) ( 81) (not shown in Fig. 17A. See Fig. 12). Thereby, the conveyance hand 18 of the board | substrate carrying robot and the rod hand 83 of the board | substrate carrying apparatus 80c overlap and are arrange | positioned in the up-down direction. In addition, the conveying hand 19 of the substrate carry-out robot is driven in the -X direction, and inserted into the lower side of the substrate (P _1). As mentioned above, since the conveyance hand 19 is almost the same shape as the rod hand 83, it does not contact with the guide member 65. FIG. Thereby, the conveyance hand 19 of the board | substrate carrying robot and the rod hand 83 of the board | substrate loading apparatus 80c overlap and are arrange | positioned in the up-down direction.

After that, each of the plurality of guide members 65 is driven in the -Z direction, so that the substrate P ₁ is received by the transfer hand 19 of the substrate carrying robot. As shown in the substrate (P ₁₎ for supporting a conveying hand (19) 17 (B), Fig., Is driven in the + X direction, the substrate (P ₁₎ is conveyed towards the external device.

After the exposure is finished plain substrate (P ₁₎ to the conveying hand 19 of the substrate carry-out robot, a plurality of guide members (65) each of which is synchronized with driving in the + Z direction as shown in Fig. 18 (A). Toward each of the plurality of guide members 65, the load hand 83 and the transfer hand 18, the upper surface without contacting each against the lower face of the substrate (P _3), by lifting the substrate (P ₃₎ It separates from the conveyance hand 18. FIG. At this time, the substrate (P ₃₎ is sucked and held on a plurality of guide members (65).

Thereafter, as shown in FIG. 18B, the transfer hand 18 of the substrate loading robot is driven in the + X direction to evacuate from the region above the port portion 60. Then, the substrate (P ₃₎ for each of the plurality of guide members (65) for supporting from below the synchronous drive is in the direction of -Z. At this time, while each of the plurality of guide members 65 passes between the support portions 8 ₂ where the rod hands 83 are adjacent to each other, the substrate P ₃ is the support portion 8 ₂ of the rod hand 83. Is supported from below. In this way, the substrate (P _3), the guide member 65 loaded hand-83 14 and sorghum, (A) state (where the substrate (P ₀₎ of the substrate (P ₁₎ shown in the from, the substrate ( P ₁₎ of the substrate (P _2), the substrate (P ₂₎ of the substrate (P _3), the flow returns to lie change, respectively).

Also in the liquid crystal exposure apparatus 10c of this 3rd embodiment, the effect similar to the said 1st embodiment can be acquired. In addition, in the third embodiment, since the substrate stage 20c has the substrate discharging device 70a, the exposure processing to the final shot region is terminated before the substrate stage 20c reaches the substrate exchange position. When moving to the board | substrate exchange position, the carrying out operation | movement of the board | substrate P can be started in parallel with the movement. Therefore, the replacement cycle time of the board | substrate on the board | substrate holder 30c can be shortened, and the number of sheets of the board | substrate P per unit time can be increased.

In addition, for example, when a plurality of shot regions are set in the substrate P, the shot region to which the exposure processing is usually performed lastly reduces the total amount of movement of the substrate P (substrate stage 20c). And the + Y side or the -Y side of the substrate P. Therefore, the substrate stage 20c after the exposure process to the last shot region is finished moves in the X axis direction as well as in the Y axis direction when moving to the substrate exchange position (in a direction oblique to the X axis). Move). On the other hand, in this 3rd Embodiment, as shown in FIG. 19, Y of the guide member row | line | column which consists of eight guide members 65 arrange | positioned at the most -X side among the some guide members 65, for example. Since the dimension regarding an axial direction is set longer than the dimension regarding the Y-axis direction of the board | substrate P, even when the board | substrate stage 20c moves to a direction oblique with respect to an X-axis, the board | substrate holder of the board | substrate P The part which protruded from the edge part at the + X side of 30c is supported by the guide member 65 from below. Thereby, the board | substrate P can be carried out more quickly.

Hereinafter, it demonstrates concretely using FIG. 20 (A)-FIG. 20 (C). In addition, illustration of board | substrate carrying out apparatus 70a, the port part 60 (refer FIG. 12, etc.) is abbreviate | omitted in FIG.20 (A)-FIG.20 (C). In addition, in FIG.20 (A)-FIG.20 (C), it demonstrates by attaching | subjecting the same code | symbol as the projection optical system PL (refer FIG. 11) to an irradiation area (exposure area) for convenience.

As shown to FIG. 20 (A), six shot regions are set on the board | substrate P, for example, and the last shot region among them is the shot region S set to the + Y side and the + X side of the board | substrate P. FIG. ₆ ). In addition, the center of the substrate P before the start of the exposure operation with respect to the shot region S ₆ is located at the position CP ₁ , and the center of the substrate P when the exposure operation is completed is the position CP ₂ . Located in

Here, if it is assumed that the dimension regarding the Y-axis direction of the guide member row (refer FIG. 19) of the most -X side is about the same as the dimension regarding the Y-axis direction of the board | substrate P, when carrying out the board | substrate P Since the substrate P moves in parallel in the X-axis direction, the substrate stage (so that the center in the Y-axis direction of the guide member row on the most -X side and the center in the Y-axis direction of the substrate P substantially coincides). The Y position control of 20c must be performed, and in this case, the center of the substrate holder 30c is located at the position (CP _{1 in} FIG. 20B). It is necessary to perform the position control of the substrate stage 20c so as to pass through the order of → CP ₂ → CP ₄ ) (the position CP ₄ is the substrate exchange position).

In contrast, in the third embodiment, the end of the + X side of the substrate P is supported by the guide member 65 (see FIG. 19) irrespective of the Y position of the substrate stage 20c, so that the substrate stage 20c is supported. Moves from the position (position CP ₂ ) to the substrate exchange position (position CP ₄ ) at the end of the exposure process of the final shot region, the carrying out operation of the substrate P is performed in parallel with the movement. It is possible to carry out the carrying out operation of the substrate P so that the center of the substrate P passes through the sequence of the positions (CP ₁ → CP ₂ → CP ₃ ) in FIG. 20B (substrate stage 20c). The center of the cross passes through the sequence (CP ₁ → CP ₂ → CP ₄ ). Therefore, the carrying out operation | movement of the board | substrate P can be performed quickly. After the substrate stage 20c is positioned at the substrate exchange position, the substrate P moves in parallel with the X axis as shown in FIG.

`` Fourth Embodiment ''

Next, 4th Embodiment is described using FIG. 21 and FIG. Since the liquid crystal exposure apparatus which concerns on this 4th Embodiment is the same as that of the liquid crystal exposure apparatus 10c (refer FIG. 11) of the said 3rd Embodiment except the structure of the board | substrate holder 30d, only a difference is demonstrated below. In addition, about the element which has the structure and function similar to the said 3rd Embodiment, the same code | symbol as the said 3rd Embodiment is attached | subjected and the description is abbreviate | omitted.

In the said 3rd Embodiment, the board | substrate P moved at the time of carrying out a board | substrate using the upper surface of the board | substrate holder 30c as a guide surface (refer FIG.15 (A) and FIG.15 (B)), FIG. In this 4th Embodiment shown to 21, the board | substrate P is carried out along the guide surface formed by the some guide member 48b similarly to the said 2nd Embodiment (refer FIG. 9) (FIG. 22 Point) In addition, the structure of the board | substrate carrying out apparatus 70a is the same as that of the said 3rd Embodiment. In addition, as shown in FIG. 22, since the structure of the board | substrate lift apparatus 46b is included as the said 2nd Embodiment, including the guide member 48b, description is abbreviate | omitted here. According to this 4th Embodiment, it is not necessary to form the hole part which blows out the pressurized gas for floating the board | substrate P on the upper surface of the board | substrate holder 30d. Moreover, since it is not necessary to arrange | position a gas blowing piping etc. in the board | substrate holder 30d, the board | substrate holder 30d can be reduced in weight.

`` Fifth Embodiment ''

Next, 5th Embodiment is described using FIG. In the said 3rd and 4th embodiment, while the substrate holder 30c, 30d (refer FIG. 12, FIG. 21, respectively) has the board | substrate carrying apparatus 70a, in this 5th Embodiment, it shows in FIG. As described above, the substrate stage 20e is outside the substrate holder 30e and has a substrate carrying device 70a on each of the + Y side and the -Y side of the substrate holder 30e. For example, the structure of each of two board | substrate carrying out apparatuses 70a is the same as that of the said 3rd Embodiment. In addition, since the part except the arrangement | positioning of the board | substrate carrying apparatus 70a is the same as that of said 4th embodiment, only the difference is demonstrated below and the element which has the structure and function similar to the said 3rd and 4th embodiment is as follows. The same reference numerals as those in the third and fourth embodiments are given, and the description thereof is omitted.

In the fifth embodiment, the amount of protruding (protruding) of the substrate P from the end portions of the + Y side and the -Y side of the substrate holder 30e is set larger than that of the third and fourth embodiments. One board | substrate carrying out apparatus 70a is arrange | positioned under the part protruded to the + Y side from the board | substrate holder 30e among board | substrates P, and the other board | substrate carrying out apparatus 70a is the board | substrate P, It is arrange | positioned under the part protruded to the -Y side from the board | substrate holder 30e. In addition, although not shown in FIG. 23, for example, each of the two board | substrate carrying out apparatuses 70a is the support fixed to the upper surface of the Y coarse motion stage 23Y (refer FIG. 11) arrange | positioned under the board | substrate holder 30e. It is attached to the Y coarse motion stage 23Y via a member. That is, for example, each of two board | substrate carrying out apparatuses 70a is arrange | positioned separately from the board | substrate holder 30e.

In the fifth embodiment, for example, each of the two substrate carrying apparatuses 70a is disposed outside the substrate holder 30e, so that a groove or the like for accommodating the substrate carrying apparatus 70a in the substrate holder 30e is provided. It is not necessary to form a structure, and the stiffness fall of the substrate holder 30e can be suppressed. Moreover, since the board | substrate P can be adsorbed-held with a larger area, the flatness of the board | substrate P can be improved. Moreover, since the reaction force at the time of driving the adsorption apparatus 77a does not act on the board | substrate holder 30e, since the board | substrate holder 30e can be reduced in weight, the position control of the board | substrate holder 30e (substrate P) is controlled. Sex is improved. Moreover, since the board | substrate carrying out apparatus 70a is arrange | positioned outside the board | substrate holder 30e, it is also excellent in maintenance property.

`` Sixth Embodiment ''

Next, 6th Embodiment is described using FIGS. 24-25 (C). In the fifth embodiment (refer to FIG. 23), the configuration of the substrate transporting device 70a was the same as that of the third embodiment. In the sixth embodiment shown in FIG. 24, the configuration of the substrate transporting device 70d is shown. This is different. In addition, since the part except the structure of the board | substrate carrying out apparatus 70d is the same as that of said 5th embodiment, only a difference is demonstrated below and the element which has a structure and a function similar to the said 5th embodiment is mentioned above. The same code | symbol as 5th Embodiment (or 3rd and 4th Embodiment) is attached | subjected, and the description is abbreviate | omitted.

In the board | substrate stage 20f which concerns on this 6th Embodiment, as shown in FIG. 24, a board | substrate is carried out to the + Y side and -Y side of the board | substrate holder 30e similarly to the said 5th Embodiment (refer FIG. 23). The device 70d is disposed separately from the substrate holder 30e. The board | substrate carrying out apparatus 70d has the X travel guide 71 supported from below by the support member 28 fixed on the upper surface of the Y coarse motion stage 23Y, and the X travel guide 71 on the X axis direction. The Y linear guide apparatus 78 which can move to a predetermined stroke, and the suction device 77d mounted on the X travel guide 71 via the Y linear guide apparatus 78 are provided. The suction device (77d) comprises a suction pad for holding the lower surface of the suction, the substrate (P _1). The Y linear guide device 78 has a Y actuator (not shown), and is capable of driving the suction device 77d with a predetermined stroke in the Y axis direction with respect to the X travel guide 71. Moreover, the Z position of the lower surface of 77 d of adsorption apparatus is located in the + Z side rather than the Z position of the upper surface of the substrate holder 30e. In addition, the kind of X actuator which drives the Y linear guide apparatus 78 in the X-axis direction, and the Y actuator which drives the adsorption apparatus 77d in the Y-axis direction are not specifically limited, respectively, For example, a feed screw apparatus And linear motors can be used. Moreover, unlike the said 1st-5th embodiment, the adsorption apparatus 77d does not have a Z actuator which drives a adsorption pad in a Z-axis direction.

In the sixth embodiment, the plurality of guide members 48b incorporated in the substrate holder 30e (or from the state where the substrate P is placed on the substrate holder 30e shown in FIG. 25A) (or By driving the fine motion stage 21 (see FIG. 24) in the -Z direction, the substrate P (substrate P _{1 in} FIG. 24) is lifted from the upper surface of the substrate holder 30e, and then FIG. 25 ( As shown in B), the adsorption | suction apparatus 77d of each of two board | substrate carrying out apparatuses 70d is driven in the direction approaching the board | substrate holder 30e, for example (refer the arrow of FIG. 25 (B)). In this way, the suction device (77d) with a substrate holder is inserted between the (30e) when the upper surface of the substrate (P) (see Fig. 24. However, in Figure 24, the suction device (77d) of the substrate (P ₁₎ Inserted between the lower surface and the upper surface of the substrate holder 30e).

Thereafter, in the substrate holder 30e, the plurality of guide members 48b is lowered, whereby the suction of the substrate P by the suction device 77d becomes possible. For example, each of the two adsorption apparatuses 77d which hold | maintained and adsorb | sucked the board | substrate P is driven to + X side synchronously, as shown to FIG. 25 (C). Thereby, the board | substrate P is carried out from the board | substrate holder 30e toward the port part which is not shown in figure. Further, the exchanging operation of the substrate (P ₁₎ and the other (following) the substrate (P ₂₎ mounted on the loading hand 83 on the substrate holder (30e) as shown in Figure 24 is, same as in the second embodiment Therefore, the description is omitted. According to the sixth embodiment, since the adsorption device 77d can move in the Y-axis direction, it is not necessary to make the substrate P largely protrude from both ends of the Y-axis direction of the substrate holder 30e. P) can be miniaturized.

In addition, the structure of the said 3rd-6th embodiment can be changed suitably. For example, in the board | substrate carrying out apparatus 70d of the said 6th embodiment, although the adsorption | suction apparatus 77d was able to move to the Y-axis direction with respect to the X run guide 71, it is not limited to this, for example For example, like the board | substrate carrying out apparatus 70e which concerns on the 1st modified example shown to FIG. 26 (A)-FIG. 27 (C), the adsorption apparatus 77d is beforehand the board | substrate holder 30e side from the X travel guide 71. FIG. (The board | substrate carrying out apparatus 70e does not have the Y actuator which drives the adsorption apparatus 77d with respect to the X running guide 71 in the Y-axis direction). In this case, as shown to FIG. 26 (A), in the state where the board | substrate P was mounted on the board | substrate holder 30e, the adsorption apparatus 77d is located in the -X side of the board | substrate P, and is exposed. After completion | finish, the board | substrate P is lifted up from the board | substrate holder 30e using the some guide member 48b, and is driven in the + X direction as shown to FIG. 26 (B), and the board | substrate holder 30e and a board | substrate are carried out. Inserted between (P). Subsequently, the substrate P is lowered, and the adsorption device 77d adsorbs and holds the substrate P, and is driven in the + X direction in the state as shown in FIG. 26C. Thereby, the board | substrate P is carried out from the board | substrate holder 30e. Moreover, the adsorption apparatus 77d is in the + X side of the board | substrate P, as shown to FIG. 27 (A) in the midst in which exposure process is performed to another board | substrate P after carrying out of the board | substrate P. FIG. Is located. And when the exposure process of the board | substrate P is complete | finished and it lifts from the board | substrate holder 30e by the some guide member 48b for carrying out operation | movement, the adsorption apparatus 77d will FIG. As shown to 27 (B), it passes under the board | substrate P, and returns to the initial position (position of the -X side of the board | substrate P) shown to the said FIG. 26 (A). And as shown to FIG. 27 (C), the process after the said FIG. 26 (B) is repeated. According to the first modification, the structure and the control of the substrate carrying device 70e can be simplified.

Moreover, in the board | substrate stage 20f of the said 6th embodiment, although the board | substrate carrying out apparatus 70d was arrange | positioned at both sides (+ Y side and -Y side) of the board | substrate holder 30e, FIG. 28 (following, 2nd) As shown to a modification, the board | substrate carrying out apparatus 70f may be arrange | positioned only at the one side (+ Y side or -Y side) of the board | substrate holder 30e. In this case, the adsorption holding surface of the adsorption pad which the adsorption apparatus 77f has is made to adsorb | suck and hold the board | substrate P with a stronger adsorption holding force (for example, the adsorption apparatus 77a of the said 3rd-6th embodiment (for example, 12). In this case, the adsorption device 77f may be movable in the Y axis direction with respect to the X travel guide 71 as in the sixth embodiment, and from the X travel guide 71 as in the first modification. You may fix in the state which protruded toward the board | substrate holder 30e side.

Moreover, in the board | substrate carrying out apparatus of the said 3rd-6th embodiment, although the adsorption pad was driven with respect to the board | substrate P in the Z-axis direction or the Y-axis direction, the lower surface of the board | substrate P was located in the position which can adsorb | suck, It is not limited to this, As shown to FIG. 29 (A)-FIG. 30 (B) (henceforth a 3rd modification), you may move the board | substrate P with respect to 77 g of adsorption apparatus. As shown to FIG. 29 (A), the board | substrate carrying out apparatus 70g is arrange | positioned at the + Y side of the board | substrate holder 30e (the adsorption apparatus 77g cannot move to a Y-axis direction). Moreover, two positioning devices 17a are arrange | positioned apart in the X-axis direction, for example on the -Y side of the board | substrate holder 30e, and one positioning device, for example on the + Y side of the board | substrate holder 30e. 17b is disposed. Each of the plurality of positioning devices 17a and 17b is mounted on the Y coarse motion stage 23Y (see FIG. 11) through a supporting member (not shown), and is disposed at almost the same Z position as the substrate P ( Therefore, it does not conflict with the X travel guide 71). Positioning apparatus 17a, 17b has actuators, such as an air cylinder, for example, presses the edge part of board | substrate P, and controls the position of board | substrate P. FIG.

In this 3rd modification, as shown in FIG. 29 (B) in the state in which the exposed board | substrate P was floatingly supported by the some guide member 48b, for example, two positioning apparatus 17a. By this, the substrate P is driven in the + Y direction. At this time, excessive movement due to inertia of the substrate P in the + Y direction is suppressed by the movement preventing pin 17c and the positioning device 17b attached to the suction device 77g. Moreover, the some notch 17d for preventing the contact with the positioning device 17a is formed in the upper surface of the board | substrate holder 30e. When the substrate P is positioned at the position where the adsorption holding of the substrate P by the adsorption device 77g is possible, the positioning apparatuses 17a and 17b are moved from the substrate P as shown in Fig. 30A. After evacuation, as shown to FIG. 30 (B), the board | substrate P is adsorbed-held by 77g of adsorption apparatuses, and is carried out from the board | substrate holder 30e. In the third modification, since the substrate P moves with respect to the substrate carrying device 70g, the amount of protruding from the substrate holder 30e of the substrate P can be reduced in advance.

`` Seventh Embodiment ''

Next, 7th Embodiment is described using FIGS. 31-41. Although the board | substrate stage 20a-20f of the said, 1st-6th embodiment was a structure in which the Y roughening stage 23Y is mounted on the X roughness stage 23X, the liquid crystal concerning this 7th embodiment shown in FIG. In the board | substrate stage 120a of the exposure apparatus 100, the point on which the X coarse motion stage 123X is mounted on the Y coarse motion stage 123Y (the upper coarse motion stage moves to a scanning direction) differs. Moreover, the board | substrate carrying out apparatus 170 is formed in the Y coarse motion stage 123Y (lower coarse motion stage). Hereinafter, in this seventh embodiment, only the difference with the said 1st-6th embodiment is demonstrated, and about the element which has a structure and a function similar to the said 1st-6th embodiment, said 1st-6th The same code | symbol as embodiment is attached | subjected, and the description is abbreviate | omitted.

In the seventh embodiment, as shown in FIG. 31, the apparatus main body 130 has a barrel surface plate 131, a pair of side columns 132, and a substrate stage mount 133. The barrel surface plate 131 is made of a plate-like member disposed in parallel to the XY plane, and supports the projection optical system PL, the mask stage MST, and the like. The pair of side columns 132 are spaced apart from each other in the Y axis direction and support the vicinity of the end portion on the + Y side of the barrel surface plate 131 and the end portion vicinity on the -Y side from below. The board | substrate stage mount 133 consists of a member extended in a Y-axis direction, As can be seen from FIG. 32 and FIG. 33, it separates in the X-axis direction, for example, and is formed, for example. Returning to FIG. 31, the side column 132 on the + Y side is, for example, near the end of the + Y side of the two substrate stage mounts 133, and the side column 132 on the −Y side is, for example. It is mounted on the edge vicinity of the -Y side of two board | substrate stage mounts 133, respectively. The substrate stage mount 133 is supported from below by the vibration isolator 134 provided on the floor 11 of the clean room in the vicinity of the end portion in the longitudinal direction thereof. Thereby, the apparatus main body 130 (and projection optical system PL, mask stage MST, etc.) are vibratively separated from the floor 11.

As shown in FIG. 33, the substrate stage apparatus 200 includes a pair of base frames 114, an auxiliary base frame 115, and a substrate stage 120a.

One base frame 114 is on the + X side of the substrate stage mount 133 on the + X side, and the other base frame 114 is on the -X side of the substrate stage mount 133 on the -X side. 115 is arrange | positioned (in a non-contact state) between a pair of board | substrate stage mount 133 between predetermined pairs of distances to the board | substrate stage mount 133, respectively. The pair of base frame 114 and the auxiliary base frame 115 each consist of a plate-like member parallel to the YZ plane extending in the Y-axis direction, and the height position (Z position) is adjusted through a plurality of adjuster devices. It is provided on the floor 11 possibly. A mechanical Y linear guide device (one axis) extending in the Y-axis direction as shown in FIG. 32 on the upper end surface (end on the + Z side) of each of the pair of base frames 114 and the auxiliary base frame 115. The Y linear guide 116a, which is an element of the guide device, is fixed.

Returning to FIG. 31, the substrate stage 120a includes the Y coarse motion stage 123Y, the X coarse motion stage 123X, the fine motion stage 21, the substrate holder 30b, the plurality of substrate lift devices 46b, and the Y step. The surface plate 150, the weight canceling device 26, and the substrate carrying out device 170 are provided.

As shown in FIG. 33, the Y coarse motion stage 123Y is mounted on the pair of base frame 114 and the auxiliary base frame 115. As shown in FIG. The Y coarse motion stage 123Y has a pair of X beams 125, as shown in FIG. Each of the pair of X beams 125 is formed of a member having a rectangular YZ cross-section extending in the X-axis direction, and arranged in parallel with each other at predetermined intervals in the Y-axis direction. The pair of X beams 125 are connected to each other by the Y carriage 126 in the vicinity of the end portions on the + X side and the -X side, respectively. The Y carriage 126 consists of a plate-like member parallel to the XY plane extending in the Y-axis direction, and a pair of X beams 125 are mounted on the upper surface thereof. 33, the central part of the longitudinal direction is connected by the auxiliary carriage 126a.

31 and 33, the lower surface of the Y carriage 126 and the lower surface of the auxiliary carriage 126a constitute the Y linear guide device 116 together with the Y linear guide 116a. The plurality of Y slide members 116b (in Fig. 33, are superimposed in the direction of the paper depth) is fixed. The Y slide member 116b is engaged with the corresponding Y linear guide 116a so that it can slide freely with low friction, and the Y coarse motion stage 123Y is a pair of base frame 114 and an auxiliary base frame ( 115) The image can be moved by a predetermined stroke in the Y axis direction with low friction. The Z position of the lower surface of the pair of X beams 125 is set on the + Z side than the upper surface of the pair of substrate stage mounts 133, and the Y coarse motion stage 123Y is a pair of substrate stage mounts 133 ( In other words, it is vibrated from the apparatus main body 130.

As shown in FIG. 32, the Y coarse motion stage 123Y is driven in the Y axis direction by a pair of Y feed screw devices 117. Each of the pair of Y feed screw devices 117 includes a screw shaft 117a which is rotationally driven by a motor mounted on an outer surface of the base frame 114, and a plurality of circulation balls mounted on the Y carriage 126. And a nut 117b (not shown). In addition, the kind of Y actuator for driving the Y coarse motion stage 123Y (one pair of X beams 125) in the Y-axis direction is not limited to the said ball screw apparatus, For example, a linear motor and a belt drive apparatus Etc. may be sufficient. Moreover, you may arrange | position the Y actuator of the same structure (or another kind) with the said Y feed screw apparatus 117 to the auxiliary base frame 115. As shown in FIG. Moreover, the number of Y feed screw devices 117 may be one.

On the upper surface of each of the pair of X beams 125, as shown in FIG. 34, one X linear guide 127a, which is an element of the mechanical one axis guide device extending in the X axis direction, is provided at a predetermined interval in the Y axis direction. The two X beams 125 are fixed in parallel with each other, for example. Moreover, the magnet unit 128a which is the upper surface of each of a pair of X beam 125, and contains several permanent magnets arrange | positioned at predetermined space | interval in the X-axis direction in the area | region between a pair of X linear guide 127a. (X stator) is fixed.

The X coarse motion stage 123X consists of a rectangular plate-like member in plan view, and an opening is formed in the center thereof. On the lower surface of the X coarse motion stage 123X, an X slide member 127b constituting the X linear guide device 127 together with the X linear guide 127a is fixed. Four X slide members 127b are formed with respect to one X linear guide 127a at predetermined intervals in the X axis direction, for example (see FIG. 33). The X slide member 127b is engaged with the corresponding X linear guide 127a so as to slide freely with low friction, and the X coarse motion stage 123X has a low friction on the pair of X beams 125. It is possible to move in a predetermined stroke in the X axis direction. Moreover, the lower surface of X coarse motion stage 123X opposes each pair of magnet unit 128a through a predetermined clearance, and the X coarse motion stage is prescribed | required in a X-axis direction with a pair of magnet unit 128a. A pair of coil units 128b (X movers) constituting a pair of X linear motors 128 for driving with a stroke are fixed.

The X coarse motion stage 123X is limited in the Y axis direction relative to the Y coarse motion stage 123Y by the X linear guide device 127 and integrally with the Y coarse motion stage 123Y in the Y axis direction. Move. That is, the X coarse motion stage 123X comprises the gantry type | mold 2-axis stage apparatus with the Y coarse motion stage 123Y. The Y position information of the Y coarse motion stage 123Y and the X position information of the X coarse motion stage 123X are each obtained by a linear encoder system (not shown). Moreover, since the structure of the fine motion stage 21 (including a drive system and a measurement system) is the same as that of the said 1st Embodiment, as shown to FIG. 33 and FIG. 34 (plural voice coil motors 29x, 29y, 29z). ) And a substrate interferometer system using an X moving mirror 22x and a Y moving mirror 22y).

In addition, since the structure of the board | substrate holder 30b is substantially the same as that of the said 2nd Embodiment, description is abbreviate | omitted here. In addition, in the seventh embodiment, the X groove 31b ₁ is opened at both ends of the substrate holder 30b, but may not be opened. In addition, since the structure of the some board | substrate lift apparatus 46b is also substantially the same as the said 2nd Embodiment, description is abbreviate | omitted here. In the seventh embodiment, however, the substrate lift apparatus 46b is arranged in plural (for example, four) at predetermined intervals in the X-axis direction as shown in FIG. 33, and the guide member 48b is As shown in FIG. 32, for example, four units (total, for example, 16 units) are accommodated in correspondence with one X groove 31b ₁ .

As shown in FIG. 32, the Y step surface plate 150 is formed of a member of a YZ cross-sectional rectangle extending in the X-axis direction, and is placed in a pair of X beams 125 each at a predetermined distance (non-contact state). Are interposed between a pair of X beams 125. The dimension of the longitudinal direction of the Y step surface plate 150 is set slightly longer than the movement stroke regarding the X-axis direction of the fine motion stage 21. The top surface of the Y step surface plate 150 is finished with a very high plan view. As shown in FIG. 34, the Y step surface plate 150 is fixed to the some Y linear guide 135a fixed to the upper surface of each pair of board | substrate stage mount 133, and the lower surface of the Y step surface plate 150. The plurality of Y linear guide devices 135 constituted by the plurality of Y slide members 135b are guided straight on the pair of substrate stage mounts 133 in a predetermined stroke in the Y axis direction.

As shown in FIG. 32, the Y step surface plate 150 is a pair of X-beams 125 via the apparatus called a pair of flexure apparatus 151 in the vicinity of the edge part on the + X side and the -X side, respectively. ) Is mechanically connected. As a result, the Y step surface plate 150 and the Y coarse motion stage 123Y are integrally moved in the Y axis direction. The flexure device 151 includes, for example, a thin strip-shaped steel sheet disposed parallel to the XY plane, and a hinge joint device (for example, a ball joint or a hinge device) formed at both ends of the steel sheet. The steel sheet is constructed between the Y step plate 150 and the X beam 125 via a hinge joint. Accordingly, the flexure device 151 has a lower rigidity in five different degrees of freedom (X, Z, θx, θy, and θz directions) than the stiffness in the Y axis direction, and the Y step surface plate 150 with respect to the five degrees of freedom direction. ) And the Y coarse motion stage 123Y are vibrated. In addition, you may control the Y position of the Y step surface plate 150 independently of the Y coarse motion stage 123Y by actuators, such as a linear motor and a feed screw apparatus, for example.

Since the structure of the weight canceling apparatus 26 (including the leveling apparatus 27) is substantially the same as the said 1st Embodiment, description is abbreviate | omitted here. However, in the seventh embodiment, the weight canceling device 26 is in a non-contact state on the Y step surface plate 150 via the plurality of air bearings 26a attached to the lower surface thereof, as shown in FIG. 34. Since it is mounted in the X-axis direction, the dimension in the Z-axis direction is shorter than that in the first embodiment. The weight canceling device 26 is mechanically connected to the X coarse motion stage 123X via the plurality of flexure devices 26b, and when moving integrally with the X coarse motion stage 123X in the X axis direction, the Y step surface plate 150 to move the phase. In contrast, when the weight canceling device 26 moves in the Y-axis direction integrally with the X coarse motion stage 123X, the weight canceling device 26 moves in the Y-axis direction integrally with the Y coarse motion stage 123Y and the Y step surface plate 150. There is no fall off from the Y step surface plate 150.

The board | substrate carrying out apparatus 170 is the board | substrate guide apparatus 62 of the port part 60 mentioned later in this embodiment outside the board | substrate stage apparatus 200 which mentions the board | substrate P mounted on the board | substrate holder 30b later. (Refer FIG. 35), and it is attached to the outer side (surface toward + Y side) of the X beam 125 of the + Y side among a pair of X beam 125. As shown in FIG. The board | substrate carrying out apparatus 170 is the adsorption pad 171 which adsorbs and hold | maintains the lower surface of the board | substrate P to be carried out, the support member 172 which supports an adsorption pad, the support member 172 (and the adsorption pad 171). ) X linear motor 174 for driving a pair of X linear guide device 173 and guide member 172 (and adsorption pad 171) which guides linearly to an X-axis direction in an X-axis direction. . 34 is a cross sectional view taken along the line EE of FIG. 33, the suction pad 171 and the supporting member 172 are shown in a state where the stroke end on the -X side is positioned for explanation of the configuration of the substrate carrying device 170. have.

As shown in FIG. 34, the adsorption pad 171 consists of a member of a YZ cross section inverse L shape, and the part parallel to an XY plane is a plane which makes an X-axis direction a longitudinal direction, as shown in FIG. It is made of a rectangular plate-shaped member. The adsorption pad 171 is connected to the vaccum device which is not shown in figure, and the upper surface of the part parallel to the said XY plane functions as a board | substrate adsorption surface part. As shown in FIG. 33, the support member 172 consists of a plate-shaped member parallel to the XZ plane extended in a Z-axis direction, and the adsorption pad 171 is attached in the vicinity of the upper end part (edge part of + Z side). It is. The supporting member 172 has a structure in which the rigidity in the X-axis direction is higher than the rigidity in the Y-axis direction. The support member 172 is formed with a portion of the + Z side slightly bent toward the + X side from the center portion in the Z-axis direction, and its upper end portion is formed on the + X side (ie, the port portion 60) from the lower end portion (the end portion of the -Z side). (Not shown in Fig. 33. See Fig. 35). Moreover, between the support member 172 and the board | substrate holder 30b, as shown in FIG. 34, the board | substrate holder 30b is X X coarse motion stage 123X in the state which the support member 172 and the board | substrate holder 30b adjoin. The clearance is set so that it does not touch each other even when it is micro-driven in the Y-axis direction and / or θz direction with respect to.

Here, the suction pad 171 is connected to the support member 172 near the end of the + Y side, so that the end of the -Y side faces the -Y side of the support member 172 to the -Y side (substrate holder 30b). ), And the Y position of the end of the -Y side is located on the -Y side than the end of the + Y side of the substrate holder 30b. That is, in the case where the substrate stage 120a is viewed from the + Z side, although it depends on the X position of the substrate holder 30b, the suction pad 171 is located above the substrate holder 30b (overlaps with the Z axis direction). do). Moreover, the adsorption pad 171 is a substrate holder so that the Z position of the lower surface thereof is located higher than the Z position of the upper surface of the substrate holder 30b (the Z position of the substrate holder 30b changes in a small range, for example, for example, the substrate holder). It is supported by the support member 172 so that 30b is located higher than the Z position of the upper surface of the board | substrate holder 30b in the state which was located in the neutral position with respect to a Z-axis direction. Thereby, the adsorption pad 171 moves the board | substrate P and the board | substrate holder in the state in which the board | substrate P was driven up (lifted) from the upper surface of the board | substrate holder 30b by the some board | substrate lift apparatus 46b. It is possible to insert between 30b.

One surface near the lower end of the supporting member 172 opposes the outer surface of the X beam 125 on the + Y side. On the other hand, as shown in FIG. 33, on the outer side surface of the X-beam 125 of the + Y side, two X linear guides 173a extended in an X-axis direction are predetermined, for example at two predetermined intervals in a Z-axis direction. 1 pair) is fixed. The pair of X linear guides 173a has its length (dimensions in the X axis direction) set to almost half of the X beam 125 (or about the same length as the length in the X axis direction of the substrate P), It is arrange | positioned in the area | region of the + X side (port part 60 (not shown in FIG. 33. FIG. 35) side) rather than the center part with respect to the X-axis direction of the X beam 125. FIG. Moreover, the one surface (opposing surface with respect to the X beam 125) of the support member 172 contains the rolling element (for example, a circulation ball etc.) which is not shown, and mechanically with respect to the X linear guide 173a. The X slider 173b which engages so that it can slide freely is fixed with respect to one X linear guide 173a at two X-axis direction predetermined spaces, for example. For example, two X sliders 173b corresponding to the X linear guide 173a and the X linear guide 173a move the support member 172 (and the suction pad 171) in the X axis direction. An X linear guide device 173 for guiding straight forward is configured.

In addition, a magnet unit 174a including a plurality of permanent magnets arranged at predetermined intervals in the X axis direction is fixed between the pair of X linear guides 173a. In contrast, the coil unit 174b including the coil is fixed to the magnet unit 174a at a predetermined interval on one surface of the support member 172 (the surface opposite to the X beam 125). The support member 172 (and the suction pad 171) is formed on the X axis by the magnet unit 174a (X stator) and the coil unit 174b (X mover) corresponding to the magnet unit 174a. The X linear motor 174 for driving in the direction is comprised. In addition, as an actuator for driving the support member 172 (and the suction pad 171) to an X-axis direction, it is not limited to this, For example, a ball screw (feed screw) apparatus, a rope (or a belt, etc.) Other single-axis actuators, such as a traction device, may be used. Moreover, the stopper 175 which mechanically defines the movable range of the support member 172 is fixed to the outer surface of the X-beam 125 of the + Y side, and in the vicinity of the both ends of the magnet unit 174a.

In the board | substrate stage 120a, when carrying out the carrying out operation | movement of the board | substrate P, the Z position of the upper surface of the guide member 48b of each of several board | substrate lift apparatus 46b is + Z side rather than the upper surface of the board | substrate holder 30b. The plurality of Z actuators 47 are controlled to be this. And in the board | substrate carrying out apparatus 170, the adsorption pad 171 adsorb | sucks and holds the lower surface in the vicinity of the edge part (edge part) of the -X side and + Y side of the board | substrate P, and the support member 172 in that state. ) Is driven by the X linear motor 174, whereby the substrate P moves on the substrate holder 30b in the + X direction and is carried out to the port portion 60. At this time, the pressurized gas is blown out from each of the some guide member 48b with respect to the lower surface of the board | substrate P, and the board | substrate P is floating-supported. As a result, the substrate P moves on the substrate holder 30b with low friction.

Here, in the board | substrate carrying out apparatus 170, as shown in FIG. 33, the X position of the adsorption pad 171 when the support member 172 is located in the stroke end of the + X side is referred to as the X coarse motion stage 123X. The shape (bending amount) of the support member 172 is set so that it may become a + X side rather than the board | substrate holder 30b at the time of positioning to the stroke end of the + X side. Thereby, while performing the exposure process etc. with respect to the board | substrate P, the suction pad 171 can be evacuated outside the movable range of the X coarse motion stage 123X. In addition, in this embodiment, although the intermediate part of the support member 172 is bent and formed, if a suction pad 171 can be retracted outside the movable range with respect to the X-axis direction of the board | substrate holder 30b, a support member The shape of 172 is not limited to this.

Since the structure of the board | substrate loading apparatus 80c and port part 60 (including the board | substrate guide apparatus 62) shown in FIG. 35 is the same as that of the said 3rd Embodiment, description is abbreviate | omitted here.

A substrate (P) on the substrate holder (30b) in the following, a liquid crystal exposure apparatus 100 (for convenience, a substrate a plurality of substrates (P) (P _1), is referred to as the substrate (P _2), the substrate (P ₃₎ ) Will be described using Figs. 36 (A) to 41 (B). The following substrate exchange operation is performed under the management of a main controller not shown. In addition, in FIG. 36 (A)-FIG. 41 (B), in order to understand easily, while the board | substrate holder 30b is shown in sectional drawing, the board | substrate stage 120a including a some voice coil motor etc. is included. Some illustrations are omitted.

In FIG. 36A, the substrate P ₁ is held in the substrate holder 30b of the substrate stage 120a. The loading hand 83, the substrate (P ₁₎ a substrate (P ₂₎ (and then the substrate (P _2)), to be held in, and then the substrate holder (30b) after the out of the substrate holder (30b) is Maintained.

The main controller performs the substrate stage 120a from the exposure end position as shown in FIG. 36 (B) after the exposure process with respect to the last shot region among the plurality of shot regions set on the substrate P ₁ is completed. The control is moved to the substrate exchange position. In the middle of the exposure process, the support member 172 of the substrate carrying device 170 is located at the stroke end on the + X side, and the suction pad 171 is movable in the X axis direction of the substrate P. We are evacuating out of range. Thus, to the release of the substrate (P _1), X coarse movement stage (123X) (and the substrate holder (30b)) that may be moved in the X-axis direction, the substrate (P ₁₎ and the suction pads 171 are not in contact. In addition, in parallel with this, the rod hand 83 is driven in the -X direction, whereby the substrate P ₂ is located above the substrate exchange position. Moreover, in the port part 60, the board | substrate guide apparatus 62 is driven in the direction approaching the board | substrate stage 120a.

When the substrate stage 120a reaches the substrate exchange position, as shown in FIG. 37 (A), the main controller releases the suction of the substrate P ₁ by the substrate holder 30b, and the plurality of main controllers. The board | substrate lift apparatus 46b is controlled to drive up the guide member 48b. As a result, a gap is formed between the lower surface of the substrate P ₁ and the upper surface of the substrate holder 30b. Then, when the substrate holder in FIG. 37, as shown in (B), the support member 172 of the substrate carry-out device 170 is driven in the -X direction, whereby the suction pad 171, the substrate (P ₁₎ according to in addition, the -X side (corner portion) of the + Y side end of the pass through the gap between the upper surface of the substrate (P ₁₎ of (30b) is situated downstream of the neighborhood. Thereafter, the plurality of guide members 48b are driven to descend, and the lower surface of the substrate P ₁ is adsorbed and held on the suction pad 171. In addition, a plurality of guide members (48b) is a support portion of the substrate (P ₁₎ by ejecting a pressurized gas to the lower surface of the substrate (P _1). At this time, the plurality of guide members 48b of the substrate stage 120a and the plurality of guide members 65 of the port part 60 are controlled such that the Z positions of the upper surfaces of the substrate stage 120a are substantially the same.

After that, as shown in FIG. 38 (A), the supporting member 172 of the substrate discharging device 170 is driven in the + X direction, whereby the substrate P ₁ adsorbed and held on the suction pad 171 is formed. It moves in the + X direction along the surface (guide surface) parallel to the XY plane formed by the plurality of guide members 48b and the upper surfaces of the plurality of guide members 65 to move the port portion 60 from the substrate holder 30b. Are exported. At this time, a pressurized gas is sprayed on the upper surface of the plurality of the guide member 65 is also a substrate (P _1). Thereby, the board | substrate P ₁ can be moved at high speed and low oscillation.

When the substrate P ₁ is received from the substrate holder 30b onto the plurality of guide members 65, as shown in FIG. 38B, the adsorption holding of the substrate P ₁ by the adsorption pad 171 is performed. Is released, and the blowing of the pressurized gas from the plurality of guide members 65 is stopped. As a result, the substrate (P ₁₎ is placed on the plurality of guide members 65, and then is driven into the substrate (P ₁₎ a substrate guide the + X direction, the device 62 supports the. Further, the substrate carry-out device 170. The FIG. 38 (B) position the substrate guide mechanism 62, the far substrate (P ₁₎ to the If can be conveyed, the substrate guide mechanism 62 previously substrate stage which is located as shown in ( It is not necessary to move to 120a) side (it may not be moved). Further, in the substrate stage (120a), a plurality of guide members (48b) is raised driven, forcing the lower surface of the substrate (P ₂₎ from the lower side. In the rod hand 83, the suction holding of the substrate P ₂ is released, whereby the substrate P ₂ is separated from the rod hand 83. In addition, the rod hand 83 may be lowered and the substrate P ₂ may be fed to the plurality of guide members 48b.

When the substrate P ₂ and the rod hand 83 are separated from each other, as shown in FIG. 39A, the rod hand 83 is driven in the + X direction to retract from above the substrate exchange position, thereby providing a substrate guide device ( Return to the position above 62). Moreover, in the port part 60, the some guide member 65 is driven down slightly. Then, as shown in Fig. 39 (B), in the substrate stage (120a), is driven with a plurality of guide members (48b) descends, a substrate (P ₂₎ is placed on the substrate holder (30b). Also, in the port portion 60, the conveying hand 19 of the substrate carry-out robot is inserted into the lower side of the substrate (P _1).

Subsequently, as illustrated in FIG. 40A, the substrate P ₂ is adsorbed and held on the substrate holder 30b, and the X coarse motion stage is performed to perform alignment operation, exposure operation, and the like with respect to the substrate P ₂ . 123X is driven in the direction away from the port part 60. Also, in the port portion 60, the substrate (P ₁₎ is withdrawn from the port section 60 by the conveying hand 19 of the substrate carry-out robot, it is conveyed to an unillustrated external device. Moreover, the some guide member 65 is driven up. Conveying hand 18 of the substrate feeding robot is maintaining a substrate (P _3).

Subsequently, as shown in FIG. 40 (B), the transfer hand 18 of the substrate loading robot transports the substrate P ₃ above the plurality of guide members 65, and as shown in FIG. 41A. Similarly, the substrate P ₃ is passed to the plurality of guide members 65. Thereafter, as shown in FIG. 41B, the plurality of guide members 65 are driven to descend, and the substrate P ₃ is placed on the rod hand 83 (returned to the state shown in FIG. 36A). Goes). At this time, the substrate (P ₃₎ may be implemented for positioning (alignment) of a plurality of guide members (65) to load the hand 83 into which floating state on. The alignment is, for example, while detecting the substrate (P _3), the end (edge) position sensor, such as an edge or a camera, performs a substrate (P ₃₎ by pressing a plurality of portions of the end.

As described above, according to the seventh embodiment, since the substrate discharging device 170 is attached to the Y coarse motion stage 123Y which is in a stopped state during the scan operation, the X coarse motion stage ( There is no influence on the position control of 123X, and the X position of the board | substrate P can be controlled with high precision at the time of a scan operation. Moreover, the board | substrate stage 120a has the structure in which the X coarse motion stage 123X and the fine motion stage 21 are mounted on the Y coarse motion stage 123Y which has the board | substrate carrying apparatus 170 (Y coarse motion stage 123Y). Structure of the bottom), the maintenance of the board | substrate carrying out apparatus 170 is also easy. Moreover, since the board | substrate carrying out apparatus 170 only moves the adsorption pad 171 (and the support member 172) to an X-axis (one axis) direction, a structure and control are simple, for example, a poly joint It is lower cost than robot arm. Moreover, since the board | substrate carrying out apparatus 170 can retract the adsorption pad 171 to the outer side of the movable range with respect to the X-axis direction of the board | substrate P, the adsorption pad 171 and the board | substrate P (or a board | substrate) Even if the height position (Z position) of the holder 30b) is the same, it can prevent that they contact each other.

Moreover, since the board | substrate stage 120a has the board | substrate carrying out apparatus 170, what is necessary is just to arrange | position only the board | substrate loading apparatus 80c for conveying the board | substrate P to the board | substrate stage 120a in the port part 60. That is, in the seventh embodiment, at the time of the exchange operation of the substrate held by the substrate stage 120a, the rod hand 83 of the substrate loading device 80c is positioned above the substrate stage 120a positioned at the substrate exchange position. It is only necessary to position only the substrate holder 30b and the substrate holder 30b as shown in FIG. 34, as compared with the case where a known substrate exchange device having a robot arm for carrying out a substrate and a robot arm for carrying in a substrate is formed in the port portion 60. FIG. Even when the space between the barrel surface plates 131 is narrow, the operation of replacing the substrate P can be performed easily.

In addition, since the substrate stage 120a has the substrate carrying out device 170, the substrate carrying out operation from the substrate stage 120a can be performed regardless of the position (X position and / or Y position) of the substrate stage 120a. Can be. Therefore, similarly to the third embodiment, the substrate P is after the end of the exposure of the final shot region and before the substrate stage 120a reaches the substrate exchange position (including the movement of the substrate stage 120a). The export operation of can be started. Moreover, in the port part 60, since the guide surface of the board | substrate P formed by the some guide member 65 is set to be wider than the board | substrate P, the board | substrate stage 120a is used as a board | substrate guide apparatus ( 62) It is not necessary to strictly perform alignment in the Y axis direction with (the carrying out operation may be started in the middle of the substrate holder 30b moving obliquely with respect to the X axis). Therefore, the cycle time of board exchange can be shortened.

Moreover, in the substrate lift apparatus 46b, since the Z actuator 47 for moving the guide member 48b up and down is mounted in the X coarse motion stage 123X, if the fine movement stage 21 (or the substrate holder 30b) Compared with the case where the Z actuator is built in, the fine motion stage 21 can be made thinner and lighter, and a Z actuator with a long stroke in the Z axis direction can be used, so that the guide member 48b can be driven with a long stroke. Can be.

`` Eighth Embodiment ''

Next, 8th Embodiment is described using FIGS. 42-45. As for the board | substrate stage 120b which concerns on 8th Embodiment, the structure of the board | substrate holder 30a, the board | substrate lift apparatus 46a (not shown in FIG. 42, see FIG. 43), and the board | substrate carrying out apparatus 270 is the said 7th. It is different from embodiment. Hereinafter, about the member which has the same structure and function as the said 7th embodiment, the description is abbreviate | omitted using the code | symbol (or common end) same as the said 7th embodiment.

As shown in FIG. 42, the board | substrate holder 30a of the board | substrate stage 120b which concerns on 8th Embodiment has the small number of the hole parts 31a for lift pins 48a, and the notch 133 mentioned later. Since it is the same as that of 1st Embodiment except the point which was formed, the same code | symbol as the board | substrate holder 30a of 1st Embodiment is attached here for convenience, and description is abbreviate | omitted. As can be seen from FIG. 42 and FIG. 43, in the eighth embodiment, 16 substrate lift devices 46a are formed in total.

The substrate stage 120b has a substrate slide device 180 for sliding the substrate P placed on the substrate holder 30a with respect to the substrate holder 30a in the Y axis direction. As shown in FIG. 42, two substrate slide devices 180 are arranged at predetermined intervals in the X-axis direction, for example. However, the number and arrangement of the substrate slide devices 180 are not limited to this and can be appropriately changed.

As shown in FIG. 43, the notch 133 is formed in the board | substrate holder 30a in the position corresponding to the board | substrate slide apparatus 180. As shown in FIG. The notch 133 opens and is formed in the upper surface side of the board | substrate holder 30a, and the side surface side of the -Y side.

The substrate slide device 180 includes a base 181, a Y linear guide 182, a Y slide member 183, and a pressing pin 184. The base 181 is made of a rectangular flat plate-like member viewed in a plane extending in the Y-axis direction, the end side of the + Y side is inserted into the cutout 133, and the end side of the −Y side is the substrate holder. It protrudes to the -Y side (outer side) from the edge part at the side of -Y of 30a. The lower surface of the base 181 is fixed to the substrate holder 30a. The Y linear guide 182 is fixed to the upper surface of the base 181. The Y slide member 183 is mechanically engaged to freely slide the Y linear guide 182. The pressing pin 184 is made of a cylindrical member extending in the Z axis direction, and is fixed to the Y slide member 183. The Z position of the edge part of the + Z side of the press pin 184 is set to the + Z side rather than the upper surface of the board | substrate holder 30a. The board | substrate slide apparatus 180 is equipped with the not-shown Y actuator for driving the press pin 184 to a Y-axis direction, The press pin 184 is the outer side of the board | substrate holder 30a shown in FIG. It drives between the position which does not contact (P), and the position which a part shown in FIG. 45 is accommodated in notch 133. FIG.

As for the board | substrate carrying out apparatus 270, like the said 7th Embodiment, the support member 172 attached to the X beam 125 by the side of + Y via the pair of X linear guide apparatus 173 is X linear motor ( 174 by a predetermined stroke in the X-axis direction. As shown in FIG. 34, the adsorption pad 271 of the said 7th embodiment is formed in YZ cross section reverse L shape, and the board | substrate adsorption surface part protrudes from the side surface of the support member 172 to the -Y side from the -Y side. While the Y position partially overlaps with the substrate holder 30b, as can be seen from FIGS. 42 and 43, the substrate adsorption surface portion of the adsorption pad 271 of the eighth embodiment is the substrate holder. Even if it moves in the X-axis direction in the state where the board | substrate P was mounted on 30a, it is arrange | positioned in the outer side (+ Y side) of the board | substrate holder 30a so that it may not contact with the board | substrate P. FIG. The Z position of the upper surface (adsorption surface) of the suction pad 271 is set slightly on the −Z side (below) than the upper surface (substrate mounting surface) of the substrate holder 30a.

Moreover, in the said 7th Embodiment, as shown in FIG. 32, the adsorption pad 271 relates to the X-axis direction of the board | substrate P (substrate holder 30b) at the time of the exposure process with respect to the board | substrate P. Moreover, in FIG. While waiting in the outside of the movable range (specifically, the outside of the + X side), in the eighth embodiment, as shown in FIG. 42, the adsorption pad 271 is used even when exposing to the substrate P. FIG. Is disposed within the movable range of the substrate holder 30a. Also in this case, when the substrate P (and the substrate holder 30a) moves in the X-axis direction, the substrate P and the suction pad 271 do not contact each other (see Fig. 43). Moreover, the press pin 184 of the board | substrate slide apparatus 180 is also located in the stroke end on the side of -Y so that it may not contact with the board | substrate P. FIG.

In the substrate stage 120b, as shown in FIG. 45, the pressurized gas is ejected from the substrate holder 30a to the lower surface of the substrate P, and the substrate P floats as shown in FIG. 45. Is carried out in a state. In the board | substrate stage 120b, the pushing pin 184 of the board | substrate slide apparatus 180 is driven to the + Y side, and the edge part of the + Y side of the board | substrate P is + Y from the edge part of the + Y side of the board | substrate holder 30a by this. A predetermined amount protrudes to the side. Next, the fine movement stage 21 and the board | substrate holder 30a fall by the Z voice coil motor 29z (or by depressurizing the inside of the air spring (not shown) which the weight canceling apparatus 26 has). Thereby, the board | substrate P falls down floating on the board | substrate holder 30a, and the edge vicinity of the + Y side and the -X side is adsorbed-held by the adsorption pad 271 previously located below the board | substrate P. . In addition, in the eighth embodiment, the substrate lift device 46a is used only when receiving the substrate P from the substrate loading device 80c (not shown in FIG. 45. See FIG. 35), and the substrate P Not used for export.

Subsequently, as shown in FIG. 44, the suction pad 271 is driven in the + X direction so that the substrate P moves along the upper surface of the substrate holder 30a (not shown in FIG. 44). Are exported).

According to the eighth embodiment described above, the adsorption pad 271 does not have to be kept outside the movable range with respect to the X axis direction of the substrate P, so that the substrate P can be quickly removed after the end of the exposure process. The export operation can be started. Therefore, the cycle time of board exchange can be shortened. In addition, in this 8th Embodiment, although the case where the board | substrate holder 30a was driven down in order to contact the board | substrate P and the adsorption pad 271 was demonstrated, it is not limited to this, To the board | substrate carrying out apparatus 270, A drive device for driving the suction pad 271 in the vertical direction may be formed, and the substrate P and the suction pad 271 may be contacted by driving the suction pad 271. In addition, the substrate slide apparatus 180 may be formed on the fine motion stage 21 or the X coarse motion stage 123X.

In addition, the structure of the said 7th and 8th embodiment can be changed suitably. For example, in the said 7th Embodiment, as shown in FIG. 34, the adsorption pad 171 of the board | substrate carrying out apparatus 170 is previously inserted so that it can be inserted between the board | substrate P and the board | substrate holder 30b. Although it is arrange | positioned protruding from the support member 172 to the board | substrate holder 30b side, like the board | substrate stage 120c which concerns on the 4th modified example shown in FIG. 46, the suction pad 371 drives a Y-axis direction, for example. It mounts on the support member 172 via the Y drive apparatus 375 made to carry out, and when carrying out the exposure process etc. with respect to the board | substrate P, the adsorption pad 371 is evacuated from the board | substrate P, and a board | substrate ( You may insert between the board | substrate P and the board | substrate holder 30b only at the time of carrying out P. In the seventh embodiment, when the substrate P is delivered to the port portion, as shown in FIG. 37B, the suction pad 171 is separated from the upper surface of the substrate holder 30b after the substrate P is separated from the upper surface of the substrate holder 30b. It is necessary to move the board | substrate P to the position which can adsorb | suck the board | substrate P through the board | substrate P and the board | substrate holder 30b, However, in the board | substrate carrying out apparatus 370 shown in FIG. 46, the board | substrate P is a board | substrate holder. In the state mounted on 30b, the adsorption pad 371 can be moved to the position which can adsorb | suck the edge vicinity of the -X side of the board | substrate P, and the + Y side. Therefore, the time required for carrying out the substrate can be shortened.

In addition, the structure of the board | substrate lift apparatus for lifting the board | substrate P from the board | substrate holder 30b is not limited to the thing of the said 7th embodiment. For example, each of the some board | substrate lift apparatus 140 which the board | substrate stage 120d concerning the 5th modified example shown in FIG. 47 has the base member 141 and the base member 141 accommodated in the X groove 31b ₁ . A pair of Z actuators 143 driving (up and down) the plurality of (for example, six) porous members 142 and the base member 141 mounted in the X-axis direction at predetermined intervals in the X-axis direction. (Not shown in Fig. 47. See Fig. 48A). The base member 141 is made of a rod-shaped member extending in the X-axis direction, and the longitudinal dimension is the same as the longitudinal dimension of the substrate P (not shown in FIG. 47. See FIG. 50 (B)). It is set to an extent (slightly short in this fifth modification).

For example a substrate lift device 140 intervals) corresponding to the plurality of X groove (31b ₁₎ formed on the, 48 (B), gap (the substrate holder (30b)) given in the Y-axis direction as shown in Fig. Five sets are formed. In the substrate holder 30b of the fifth modification, the number of the X grooves 31b ₁ and the X grooves 31b ₁ are not open to the ends of the + X side and the -X side of the substrate holder 30b. Although a point differs from the said 7th embodiment, the same code | symbol as the said 7th embodiment is used for convenience.

As shown to FIG. 48 (A), the leg part 144 extended in a Z-axis direction is being fixed to the lower surface of the base member 141, and in the vicinity of the both ends of the longitudinal direction of the base member 141. As shown to FIG. The X-home through-hole (31b ₂₎ which has a bottom surface that defines the (31b _1), through the substrate holder (30b) in the vertical direction are formed in the pair 1 and the legs to each through hole (31b ₂₎ of the first pair The part 144 has passed through. Between the wall surface and the base member 141 which define the X groove 31b ₁ , and between the wall surface and the leg portion 144 which define the through hole 31b ₂ , the fine movement stage 21 is formed by the X coarse motion stage 123X, respectively. The gap is set so that it will not come into contact with each other when it is minutely driven.

The pair of Z actuators 143 is an upper surface of the X coarse motion stage 123X, and is fixed to a portion corresponding to each of the pair of leg portions 144. As the Z actuator 143, an air cylinder or the like can be used. A stay 145 made of an L-shaped member is fixed in the vicinity of the Z actuator 143 on the upper surface of the X coarse motion stage 123X. The base member 141 is formed by the action of the Z linear guide device composed of the Z linear guide 146 fixed to the leg 144 and the Z slide member 147 attached to the stay 145. As shown to C), it guides straight in a Z axis direction (up-down direction) with respect to X coarse motion stage 123X.

Here, the base member 141 is formed hollow as shown to FIG. 49 (A), and the some hole part is formed in the upper surface. The porous member 142 (not shown in FIG. 49 (A). See FIG. 47) is attached to block the plurality of holes. The pressurized gas is supplied to the base member 141 through the piping member 148 from the outside of the substrate holder 30b (not shown in FIG. 49 (A), see FIG. 47). The pressurized gas is blown out with respect to the lower surface of the board | substrate P through the member 142. FIG. In addition, as shown to FIG. 49 (A), the piping member 148 forms one leg part 144 in hollow, communicates with the base member 141, and the one leg part 144 is carried out. You may connect to and as shown to FIG. 49 (B), you may connect to the one end of the base member 141 in the longitudinal direction. In addition, the porous member 142 does not need to be attached to the base member 141. That is, the surface of the base member may not be an air bearing made of a porous aperture, but may be an air bearing (integrated molding) of a surface diaphragm or an orifice diaphragm by a combination of holes or grooves, or a composite diaphragm combining these.

In the substrate stage 120d, as shown in FIG. 50A, in the state where the base member 141 is driven up, the rod hand 83 of the substrate loading device 80c moves the substrate P to the substrate holder ( It conveys upward of 30b) (you may drive up the base member 141 after the board | substrate P is conveyed upward of the substrate holder 30b), and then, as shown to FIG. 50 (B), a rod hand The board 83 is driven downward and driven in the + X direction (the direction away from the substrate holder 30b) (the base member 141 may be driven up further without driving the rod hand 83 downward), and the substrate ( P) is passed to the substrate lift apparatus 140. Thereafter, as shown in FIG. 50C, the base member 141 is driven to descend, and the substrate P is placed on the upper surface of the substrate holder 30b. Moreover, at the time of carrying out the board | substrate P, as shown to FIG. 50 (D), the base member 141 is driven up and the porous member in the state which separated the board | substrate P from the upper surface of the board | substrate holder 30b. The pressurized gas is blown off from 142 to the lower surface of the substrate P. Hereinafter, the board | substrate P is carried out by the board | substrate carrying out apparatus 170 (not shown in FIG. 50 (D), see FIG. 33 etc.).

According to the fifth modification, since one pressurized gas supply pipe is connected to one base member 141, the configuration of the device is simple (in contrast, in the seventh embodiment (see FIG. 34), a plurality of It is necessary to connect piping for pressurized gas supply with respect to the guide member 48b of each board | substrate lift apparatus 46b of the pressurization gas separately). Moreover, since it is not necessary to form a through hole in the fine motion stage 21, the rigid fall of the fine motion stage 21 can be suppressed. Moreover, even when the Z actuator 143 cannot be arrange | positioned under the fine motion stage 21 (for example, when the weight cancel apparatus 26 is large), it can use suitably. In addition, in this 5th modification, although two Z actuators 143 spaced apart in the X-axis direction were formed with respect to one base member 141, for example, It is not limited to this, For example By the two Z actuators 143, you may drive the some base member 141 integrally. Moreover, the board | substrate lift apparatus 140 which concerns on this 5th modification is applicable also to the board | substrate stage apparatus which does not have a board | substrate carrying apparatus (for example, when a board | substrate carrying apparatus is formed in the port part side).

In addition, in the fifth modification, as in the sixth modification shown in FIG. 51A, the tension coil spring is near the both ends of the base member 141 and is further outside (the end side) than the legs 144. One end of 149 may be connected. The tension coil spring 149 has an intermediate portion inserted into a through hole 31c formed in the substrate holder 30b, and the other end thereof is connected to the stay 145 (that is, the X coarse stage 123X). As a result, as shown in FIG. 51 (B), when the base member 141 is driven up, the vicinity of the connecting portion of the base member 141 and the leg portion 144 is located near both ends of the base member 141. The moment which the edge part of the base member 141 descends downward acts on the center. Thereby, the curvature by the own weight of the longitudinal center part of the base member 141 is suppressed.

Moreover, the structure of the board | substrate carrying out apparatus 170 which carries out the board | substrate P from the board | substrate holder 30b can also be changed suitably. 52 shows the substrate stage 120e according to the seventh modification. In the substrate stage 120e, the X beam 425 is formed to have a narrower width (the height direction dimension is longer than the width direction dimension) than the seventh embodiment (see FIG. 31 and the like), and the X coarse motion stage 123X is provided. The magnet unit 128a constituting the X linear motor 128 for driving is fixed to both side surfaces of the X beam 425. Moreover, a pair of X carriage 129 is fixed to the lower surface of X coarse motion stage 123X corresponding to a pair of X beam 425. The X carriage 129 is formed of a member having a YZ cross section inverted U shape, and a corresponding X beam 425 is inserted between a pair of opposing surfaces. The coil unit 128b is fixed to the pair of opposing surfaces of the carriage 129 opposite the magnet unit 128a.

In the board | substrate carrying out apparatus 470, the support member 172 which supports the adsorption pad 171 is the fixed part 176b fixed to the Y coarse motion stage 123Y, and the lower end part of the support member 172 above. It is driven by a predetermined stroke in the X-axis direction by the X drive unit 176 including the movable part 176a fixed to the fixed part 176b. In the substrate stage 120e, the Y carriage 126 and the auxiliary carriage 126a (not shown in FIG. 52) which connect the vicinity of the end portions on the + X side of the pair of X beams 425 to each other are shown in FIG. 33. , It protrudes to the + Y side from the side of the + Y side of the X beam 425 on the + Y side. The fixing portion 176a is formed of a member extending in the X-axis direction and is provided on the vicinity of the end portion on the + Y side of each of the Y carriage 126 and the auxiliary carriage 126a. Although not shown, the X drive unit 176 is an element for driving the support member 172 at a predetermined stroke in the X axis direction (for example, a stator and a mover of the X linear motor, a guide member of the X linear guide device). And a slide member). Thereby, similarly to the seventh embodiment, the supporting member 172 is driven in the X axis direction with a stroke equivalent to the length of the substrate P in the X axis direction. In addition, as in the substrate stage 120f according to the eighth modification illustrated in FIG. 53, the fixing unit 176b of the X driving unit 176 may be fixed to the X carriage 129 in the substrate discharging device 570. .

In addition, in the said board | substrate stage 120e, 120f, although the illustration of the board | substrate lift apparatus which separates the board | substrate P from the board | substrate holder 30b is abbreviate | omitted in order to avoid the appearance of drawing, it is said 7th Embodiment The substrate lift apparatus 46b (refer FIG. 33) which concerns on the form, the board lift apparatus 46a (refer FIG. 43) which concerns on the said 8th embodiment, and the board | substrate lift apparatus 140 which concerns on the said 5th modification (FIG. 48). May be used).

In addition, the structure of a liquid crystal exposure apparatus is not limited to what was described in the said, 1st-8th embodiment (it contains the 1st-8th modified examples. The same below), and can be changed suitably. For example, in the said 7th and 8th embodiment (the said 4th-8th modified examples are also included. The same below), each of the board | substrate carrying out apparatuses 170-570 of the X beam 125 of the + Y side is carried out. Although one is attached to the outer side surface (one side surface of the Y coarse motion stage 123Y), the number and arrangement of the substrate carrying apparatuses 170 to 570 are not limited to this, for example, the outer side surface of the X beam on the + Y side. Even if the support members 172 and the suction pads 171 are disposed (for example, two) at predetermined intervals in the X-axis direction, the plurality of different points spaced apart in the X-axis direction of the substrate P may be maintained, respectively. do. Moreover, the board | substrate carrying apparatus 170-570 is further attached to the X-beam 125 of the -Y side, and near the edge part of the + Y side of the board | substrate P, and the edge vicinity of the -Y side (or the edge of the -Y side) Nearby).

Moreover, in the said 3rd-8th embodiment, although the board | substrate P was carried out to the port part 60 using only the board | substrate carrying apparatus 70a-570 which the board | substrate stage 20c-120f has, for example, In addition, the board | substrate carrying out apparatus is also arrange | positioned at the port part 60, and the board | substrate P is carried out from the board | substrate holder 30a, 30b in the predetermined amount (for example, about half of said and 8th embodiment), and The substrate P may be carried out while the substrate P is held. In this case, X axis of the substrate stage (20c ~ 120f) side suction pads (77a ₁ ~ 371) of it is possible to reduce the stroke on the direction.

Moreover, in the said 3rd-8th embodiment, the receipt (loading in and taking out) of the board | substrate P implemented between each of the board | substrate stages 20c-120f and the port part 60, for example is made of US patent. You may implement using the board | substrate support member which supports the board | substrate P as disclosed in 6,559,928 specification from below. Also in this case, the board | substrate P can be carried out from board | substrate stage 20c-120f similarly to the said 3rd-8th embodiment by driving a board | substrate support member using board | substrate carrying apparatus 70a-570. Moreover, although the board | substrate carrying out apparatuses 70a-570 of the said 3rd-8th embodiment hold | maintained the board | substrate P by vacuum adsorption, it is not limited to this, Other holding | maintenance (for example, mechanical holding) system You may hold | maintain by.

Moreover, in the said 1st-8th embodiment, although the some board | substrate lift apparatus 46a, 46b was arrange | positioned on the Y coarse motion stage 23Y or X coarse motion stage 123X, it is not limited to this, The board | substrate holder 30a, 30b or the fine movement stage 21 may be built in.

Moreover, in the board | substrate stage which concerns on said 2nd and 4th-6th embodiment (including 1st-3rd modification), it replaces with the some board | substrate lift apparatus 46b, and concerns on the said 5th modification The substrate lift device 140 may be used. Moreover, in the board | substrate stage which concerns on said 1st and 3rd embodiment, instead of the some board | substrate lift apparatus 46a, the some lift pin 48a is the board | substrate lift apparatus 140 which concerns on the said 5th modification. You may use the board | substrate lift apparatus attached to one base member 141 like this.

In addition, in the said 1st-8th embodiment, although the lower surface was adsorbed-held by the adsorption pad, the apparatus for holding the board | substrate P is not limited to this, For example, the board | substrate ( The clamp device etc. which hold | grip P) mechanically may be sufficient. Moreover, in the said 3rd-8th embodiment, as an apparatus which drives a board | substrate, it is not limited to moving to a Y-axis direction like the said adsorption apparatus, For example, the roller which an outer peripheral surface can abut is formed in a board | substrate, The substrate may be taken out from the substrate holder by rotating the roller.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Moreover, as illumination light, the infrared or visible single wavelength laser light oscillated from a DFB semiconductor laser or a fiber laser, for example, is amplified by the fiber amplifier doped with erbium (or both erbium and ytterbium), for example. The harmonics obtained by converting the wavelength into ultraviolet light using a nonlinear optical crystal may be used. In addition, a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

Moreover, in the said 1st and 2nd embodiment, although the case where the projection optical system PL was the projection optical system of the multi-lens system provided with several projection optical unit was demonstrated, the number of projection optical units is not limited to this. 1 or more is required. Moreover, it is not limited to the projection optical system of a multi-lens system, For example, the projection optical system etc. which used the opener-type large mirror may be sufficient. Moreover, in the said embodiment, although the case where the projection magnification is used as an equal magnification was demonstrated as projection optical system PL, it is not limited to this, Any of a reduction system and an enlargement system may be sufficient as a projection optical system.

In addition, in the said 1st and 2nd embodiment, although the light transmissive mask which provided the predetermined light shielding pattern (or phase pattern and photosensitive pattern) was used on the light transmissive mask board | substrate, it replaces with this mask, for example, As disclosed in US Pat. No. 6,778,257, an electronic mask (variable shaping mask) for forming a transmission pattern or a reflection pattern, or a light emission pattern, based on the electronic data of the pattern to be exposed, for example, non-light-emitting You may use the variable shaping mask using DMD (Digital Micro-mirror Device) which is a kind of type image display element (also called a spatial light modulator).

Moreover, as an exposure apparatus, the exposure apparatus which exposes the board | substrate whose size (including at least 1 of an outer diameter, diagonal length, and one side) is 500 mm or more, for example, large board | substrates for flat panel displays, such as a liquid crystal display element. It is particularly valid to apply for.

Also, the exposure apparatus can be applied to a step-and-repeat exposure apparatus and a step-and-stitch exposure apparatus. Moreover, in the exposure apparatus, the object carried out by a carrying out apparatus is not limited to the board | substrate etc. which are objects to be exposed, but may be a pattern holding body (original), such as a mask.

The use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern to a rectangular glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, a DNA chip, The present invention can be widely applied to exposure apparatuses. Moreover, in order to manufacture the mask or reticle used not only in a microdevice, such as a semiconductor element, but a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, etc., a circuit pattern is transferred to a glass substrate or a silicon wafer, etc. The present invention can also be applied to an exposure apparatus. The object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Moreover, when an exposure object is a board | substrate for flat panel displays, the thickness of the board | substrate is not specifically limited, For example, the thing of film shape (sheet-shaped member which has flexibility) is also included.

Electronic devices, such as a liquid crystal display element (or a semiconductor element), perform the function / performance design of a device, manufacturing the mask (or reticle) based on this design step, and manufacturing a glass substrate (or wafer) The lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure apparatus of each embodiment described above, and the exposure method thereof, the developing step of developing the exposed glass substrate, and a portion other than the portion where the resist remains It is manufactured through an etching step of removing the exposed member of the portion by etching, a resist removing step of removing the resist which is unnecessary after the etching, a device assembly step, an inspection step and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, so that a device pattern is formed on the glass substrate, so that a device with high integration can be manufactured with good productivity.

In addition, the disclosure of the US patent application publication and the US patent specification relating to the exposure apparatus and the like cited in the above description are incorporated herein by reference.

Industrial availability

As described above, the object exchange system and method of the present invention are suitable for carrying out the exchange of an object held in the object holding apparatus. Moreover, the object carrying method of this invention is suitable for carrying out an object from an object holding apparatus. Moreover, the object holding apparatus of this invention is suitable for carrying out an object. Moreover, the exposure apparatus of this invention is suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. Moreover, the device manufacturing method of this invention is suitable for manufacture of a micro device.

Claims (72)

An object exchange system for exchanging an object placed on an object holding member of an object holding device,
A carrying-in apparatus for carrying an object to be loaded above the object holding member;
A carrying-out device for carrying out a carrying-out object placed on an object placing surface of the object holding member in a direction along the object placing surface from the object holding member;
An object receiving device formed in the object holding device, the object receiving device receiving the object to be loaded from the carrying device;
And a guide member which is formed in the object holding apparatus and defines a guide surface for guiding the object to be carried out by the carrying apparatus. The method of claim 1,
And said carrying object is moved with said object holding member as said guide member and said object placing surface as said guide surface. 3. The method of claim 2,
The carrying out apparatus includes a carrying out holding member for holding a portion of the carrying out object,
The object holding member is provided with an opening in which the carrying-out holding member is inserted in the object placing surface. The method of claim 1,
The guide member is formed in the object receiving device,
And the loading target object is received from the loading device to the guide member. 5. The method of claim 4,
The guide member is formed to be movable between a protruding position attached from the object placing surface and a receiving position accommodated in the object holding member,
And said carrying object moves on said guide member located in said projecting position. 6. The method according to any one of claims 1 to 5,
And the guide member is in contactless support for the carrying out object. 7. The method according to any one of claims 1 to 6,
And said carrying device moves a carrying object along a two-dimensional plane parallel to said object placing surface. The method according to any one of claims 1 to 7,
The loading device moves along a two-dimensional plane parallel to the object placing surface,
The object receiving device has an movable member movable in a direction orthogonal to the two-dimensional plane, and uses the movable member to receive the object to be loaded from the carrying in device. The method of claim 8,
The carrying device has a supporting member for supporting the carrying object.
The support member is provided with a cutout opened at the front side in the movement direction at the time of carrying in the carry-in object, and the movable member is inserted into the cut-off when the carry-in object is received. The method of claim 9,
The carrying-in apparatus has a guide member for guiding the movement of the support member on each of one side and the other side of the support member in a direction orthogonal to the moving direction of the support member in a plane parallel to the two-dimensional plane. Exchange system. 11. The method of claim 10,
And a receiving member for receiving the object to be loaded from an external device into the supporting member of the object loading device is inserted between the guide members disposed on one side and the other side of the supporting member. 12. The method according to any one of claims 1 to 11,
The object holding device includes an induction device for guiding a predetermined stroke along a two-dimensional plane parallel to the object placing surface,
And the object receiving device is formed in the induction device. 13. The method according to any one of claims 1 to 12,
The position of the object holding device when the carrying object is received from the carrying device to the object receiving device, and the object holding device when carrying out the carrying out object by the carrying device is performed. The same position, object exchange system. An object exchange method for exchanging an object placed on an object holding member of an object holding device,
Conveying an object to be loaded above the object holding member;
Receiving the object to be conveyed above the object holding member by using an object receiving device formed in the object holding device;
The carrying-out object mounted on the object placing surface of the object holding member is guided to the guide surface defined by the guide member of the object holding device, and the object is placed in the direction along the object placing surface from the object holding member. A method of exchanging an object, the method comprising carrying out of the holding device. 15. The method of claim 14,
In the said carrying out, the said object holding member is made into the said guide member, and the said carrying object is moved with the said object mounting surface as the said guide surface. 15. The method of claim 14,
The guide member is formed in the object receiving device,
In the receiving, the object exchange method receives the carrying object from the carrying device to the guide member. 17. The method according to any one of claims 14 to 16,
And the position of the object holding device when the object receiving device receives the object to be loaded and the position of the object holding device when the carrying object is carried out are the same. An object carrying method for carrying out an object placed on an object holding member of an object holding device from the object holding member,
Moving the object holding apparatus holding the object toward an object discharging position for discharging the object from the object holding member;
Initiating an unloading operation of unloading the object from the object holding member before the object holding device reaches the object unloading position. 19. The method of claim 18,
In starting the said carrying out operation, the object carrying method moves the said object with respect to the said object holding member using the carrying out apparatus which the said object holding apparatus has. 20. The method according to claim 18 or 19,
The carry-out of the object from the object holding member guides the object placed on the object placing surface of the object holding member to the guide surface defined by the guide member that the object holding device has and from above the object holding member. The object carrying out method performed by moving to the direction along the said object mounting surface. 21. The method according to any one of claims 18 to 20,
The object is carried out from the object holding device by being moved in a first direction at the object carrying position,
And said carrying out operation is performed in parallel with a movement in a second direction crossing said first direction of said object holding apparatus. Starting the said carrying out operation by the object carrying out method as described in any one of Claims 18-21,
Waiting another object at a predetermined standby position before the object holding device reaches the object discharging position;
Ejecting the object from the object holding device with the object holding device positioned at the object carrying position;
Bringing the other object located in the standby position onto the object holding device. 23. The method of claim 22,
In the carrying out, the object is moved along a two-dimensional plane parallel to the object placing surface,
In the carrying in, the other object is moved in a direction orthogonal to the two-dimensional plane. 24. The method according to claim 22 or 23,
In carrying in the said other object, the said other object is received using the object receiving apparatus formed in the said object holding apparatus, The object exchange method on the object holding apparatus. An object exchange method for exchanging an object placed on an object holding member of an object holding device,
Conveying an object to be loaded above the object holding member;
Receiving the object to be conveyed above the object holding member by using an object receiving device formed in the object holding device;
The carrying object to be placed on the object placing surface of the object holding member is guided to the guide surface defined by the guide member of the object holding device, and the object holding member is used by using the object carrying device of the object holding device. And discharging in a direction along the object placing surface from the image. The method of claim 25,
Moving the object holding device holding the object to be carried out toward the object carrying position to carry the object from the object holding member;
In the discharging, the discharging operation of discharging the object from the object holding member before the object holding device reaches the object discharging position. 27. The method of claim 25 or 26,
In the said carrying out, the said object holding member is made into the said guide member, and the said carrying object is moved with the said object mounting surface as the said guide surface. 27. The method of claim 25 or 26,
The guide member is formed in the object receiving device,
In the carrying in, the carrying in object is received by the guide member. An object holding member having an object placing surface on which the carried object is placed and capable of holding the object placed on the object placing surface;
And a carrying device for carrying out the object held by the object holding member to the outside from the object holding member. 30. The method of claim 29,
A recess is formed in the object placing surface of the object holding member,
And said carrying device is accommodated in said recess. 31. The method of claim 30,
The carrying device is disposed outside the object holding member. 32. The method of claim 31,
Further comprising an induction device for guiding the object holding member to a predetermined stroke along a predetermined two-dimensional plane,
And said carrying device is formed in said induction device. The method according to any one of claims 29 to 32,
The carrying-out apparatus is provided in multiple numbers. The method according to any one of claims 29 to 33,
The carrying out device has a holding device for holding the object,
And the holding device is formed to be movable relative to the object between a position capable of holding the object and a position separated from the object. 35. The method of claim 34,
And the holding device is movable relative to at least one of a direction parallel to the surface of the object and a direction orthogonal to the surface of the object. 37. The method according to any one of claims 29 to 35,
The object holding member is formed to be movable between an object processing position at which a predetermined treatment is applied to the object and an object carrying position at which the object is carried out,
And said carrying device starts a carrying out operation of carrying out said object from said object holding member before said object holding member reaches said object carrying position. The object holding device according to any one of claims 29 to 36,
A carrying-in apparatus for carrying an object to be loaded above the object holding member;
An object receiving device formed in the object holding device, the object receiving device receiving the object to be loaded from the carrying device;
And a guide member formed on the object holding device, the guide member defining a guide surface for guiding the carrying object to be carried out by the carrying device. 39. The method of claim 37,
The object to carry out object exchange system moves the object holding member of the object holding device as the guide member, and moves the object placing surface of the object holding member as the guide surface. 39. The method of claim 37,
The guide member is formed in the object receiving device,
And the loading target object is received from the loading device to the guide member. 40. The method of claim 39,
The guide member is formed to be movable between a protruding position attached from the object placing surface and a receiving position accommodated in the object holding member,
And said carrying object moves on said guide member located in said projecting position. 41. The method according to any one of claims 37 to 40,
And the guide member is in contactless support for the carrying out object. 42. The method according to any one of claims 37 to 41,
And said carrying device moves said carrying object along a two-dimensional plane parallel to said object placing surface. 43. The method according to any one of claims 37 to 42,
The loading device moves the loading object along a two-dimensional plane parallel to the object placing surface,
The object receiving device has an movable member movable in a direction orthogonal to the two-dimensional plane, and uses the movable member to receive the object to be loaded from the carrying in device. 44. The method of claim 43,
The carrying device has a supporting member for supporting the carrying object.
The support member is provided with a cutout opened at the front side in the movement direction at the time of carrying in the carry-in object, and the movable member is inserted into the cut-off when the carry-in object is received. 45. The method of claim 44,
The carrying-in apparatus has a guide member for guiding the movement of the support member on each of one side and the other side of the support member in a direction orthogonal to the moving direction of the support member in a plane parallel to the two-dimensional plane. Exchange system. 46. The method of claim 45,
And a receiving member for receiving the object to be loaded from an external device into the supporting member of the object loading device is inserted between the guide members disposed on one side and the other side of the supporting member. 46. The method according to any one of claims 37 to 46,
Further comprising an induction device for guiding the object holding member to a predetermined stroke along a predetermined two-dimensional plane,
And the object receiving device is formed in the induction device. The method according to any one of claims 37 to 47,
And a carrying-out receiving member for guiding the carrying-out object to be carried out by the carrying-out device together with the guide member and receiving the carrying-out object carried out from the object holding device,
And the carrying-out receiving member has a guide surface set wider than the width of the object. 49. The method according to any one of claims 37 to 48,
The position of the object holding device when the carrying object is received from the carrying device to the object receiving device, and the object holding device when carrying out the carrying out object by the carrying device is performed. The same position, object exchange system. The object holding device according to any one of claims 29 to 36,
And a pattern forming apparatus for forming a predetermined pattern by using an energy beam on the object held in the object holding apparatus. The object exchange system according to any one of claims 1 to 13 and 37 to 49,
And a pattern forming apparatus for forming a predetermined pattern by using an energy beam on the object held in the object holding apparatus. A scanning type exposure apparatus which moves an object in a scanning direction with respect to an energy beam at the time of exposure,
A first movable member movable in a first direction orthogonal to the scanning direction in a predetermined two-dimensional plane,
A second movable body which is movable on the first movable body in a second direction parallel to the scanning direction and movable in the first direction together with the first movable body,
An object holding device which is formed to be capable of holding the object, is disposed above the second moving body, and is guided in a direction parallel to the predetermined two-dimensional plane integrally with the object by the movement of the second moving body;
An exposure apparatus formed in the first moving body and provided with a carrying device for driving the object in a predetermined carrying out direction with respect to the object holding device. 53. The method of claim 52,
The said carrying out direction is the said 2nd direction. 54. The method of claim 53,
The said carrying out apparatus is provided with the holding member which hold | maintains the said object, and the drive apparatus which drives the said holding member to a said 2nd direction. 55. The method of claim 54,
The driving device drives the holding member between a position overlapping with the movable range on the first movable body of the second movable body and a position outside the movable range with respect to the second direction. Exposure apparatus. 56. The method of claim 55,
The holding member is located at least outside of the movable range at the time of exposure. 57. The method of claim 56,
Further comprising an object driving device for driving the object in a direction away from the object holding device,
And the holding member is inserted between the object driven by the object driving device and the object holding device. 57. The method of claim 56,
The object driving device is formed in each of a first member extending along the second direction and capable of supporting the object from below, and an area on one side and the other side of the object holding device with respect to the first direction, And a plurality of second members for driving the first member in a direction crossing the two-dimensional plane. 58. The method of claim 57 or 58,
The object drive device supports the object from below without contact with the object separated from the object holding device,
The said carrying out apparatus drives the said object non-contactedly supported by the said object drive apparatus to the said 2nd direction. 60. The method of claim 59,
And the object driving device causes the object to float by ejecting gas from a surface facing the object. The method of any one of claims 57 to 60,
The said carrying out apparatus is further provided with the holding member drive apparatus which drives the said holding member in the direction which approaches or is separated from the said object holding apparatus in the said two-dimensional plane. 55. The method of claim 54,
And an object driving device for driving the object in a direction crossing the second direction with respect to the object holding device.
The holding member is configured to hold a portion protruding from the object holding device by being driven by the object driving device among the objects. 63. The method of claim 62,
And the object holding device causes the object to float by ejecting a gas from a surface facing the object when the object is driven in the carrying out direction. The method of any one of claims 54 to 63,
The holding member sucks and holds the object. The method of any one of claims 52-64,
An exposure apparatus further comprising a micro drive system for micro-driving the object holding device with respect to the second moving body in six degrees of freedom. The method of any one of claims 52 to 65,
An exposure apparatus, which is integrally formed with the object holding apparatus so as to be movable in parallel to the predetermined two-dimensional plane, and further includes a supporting device that supports the central portion of the object holding apparatus from below without contact. 67. The method of claim 66,
Further provided with a guide member extending in the second direction, supporting the support device from below, and defining a guide surface when the support device moves in the second direction,
The said guide member moves to the said 1st direction with the said support apparatus in the state which supported the said support apparatus from below. The method of any one of claims 52-67,
The second movable body guides the object from the exposure end position toward the exchange position where the object is exchanged with another object after the exposure ends,
And the carrying out device starts the carrying out operation of an object before the object reaches the exchange position. The method of any one of claims 50 to 68,
And the object is a substrate used in a flat panel display device. 70. The method of claim 69,
The said substrate is an exposure apparatus whose length or diagonal length of at least one side is 500 mm or more. Exposing the object using the exposure apparatus according to claim 69 or 70;
A method of manufacturing a flat panel display, comprising developing the exposed object. Exposing the said object using the exposure apparatus as described in any one of Claims 50-68,
And developing the exposed object.

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