TW201304044A - Object exchange system, object exchange method, object carry-out method, object holding apparatus, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method - Google Patents

Abstract

A substrate stage (20a) releases a burst of a pressurized gas from a substrate holder (30a) in order to lift up a substrate (P1). A substrate-removal device (93) removes said substrate (P1) from the substrate holder (30a) by moving said substrate horizontally using the top surface (substrate-placement surface) of the substrate holder (30a) as a guide surface. While the substrate (P1) is being removed, another substrate (P2) to be exposed next is waiting above the substrate holder (30a), and when the removal of the first substrate (P1) is finished, the second substrate (P2) is transferred to substrate lift devices (46a) that are part of the substrate stage (20a).

Description

Object replacement system, object replacement method, object carrying out method, object holding device, exposure device, manufacturing method of flat panel display, and component manufacturing method

The present invention relates to an object exchange system, an object replacement method, an object unloading method, an object holding device, an exposure device, a method of manufacturing a flat panel display, and a component manufacturing method, and more particularly to performing replacement of an object held by an object holding device Object replacement system and method, object removal method for moving an object from the object holding device, object replacement method including the object removal method, object holding device for holding the object, object replacement system including the object holding device, and the object holding An exposure apparatus of the apparatus or the object exchange system, a scanning type exposure apparatus, a method of manufacturing a flat panel display using the exposure apparatus, and a component manufacturing method using the exposure apparatus.

In the lithography process for manufacturing electronic components (microdevices) such as a liquid crystal display device or a semiconductor device (integrated circuit), a photomask or a reticle (hereinafter collectively referred to as a "photomask") and a glass are used. A step/scan method in which a plate or a wafer (hereinafter collectively referred to as a "substrate") is synchronously moved in a predetermined scanning direction (scanning direction) while transferring a pattern formed on the reticle to the substrate using an energy beam Exposure device (so-called scanning stepper (also called scanner)).

In such an exposure apparatus, the substrate to be transferred to and from the substrate stage is carried out by using the substrate transfer device (see, for example, Patent Document 1).

Here, the exposure device is exposed at the substrate held by the substrate stage At the end of the process, the substrate is carried out from the substrate stage, and the other substrate is transferred to the substrate stage, whereby a plurality of substrates are continuously exposed. Therefore, when the exposure processing is continuously performed on a plurality of substrates, it is preferable that the substrate can be quickly carried out from the substrate stage.

Advanced technical literature

[Patent Document 1] US Patent No. 6,559,928

In view of the above, the first object exchange system of the first aspect is a replacement of an object mounted on an object holding member included in the object holding device, and includes a loading device for transporting the object to be carried to Above the object holding member, the unloading device carries out the object to be carried out on the object loading surface of the object holding member, and carries out the object holding member from the object loading surface; the object receiving device is disposed on the object The holding device receives the object to be carried in from the loading device, and the guide is provided in the object holding device for defining a guiding surface for guiding the object to be carried out by the carrying device.

According to this, when the object to be carried out is carried out from the object holding member, it is guided by the guide member of the object holding device and carried out along the object loading surface of the object holding member. Therefore, it is not necessary to use, for example, the object holding member. The member that reclaims the object is located above the object holding member. Therefore, the object can be quickly moved out. Further, above the object holding member, it is only necessary to provide a space in which the loading device can be placed.

The first object replacement method according to the second aspect of the present invention is to replace the object The object loaded on the object holding member of the holding device includes: an operation of transporting the object to be carried onto the object holding member; and the object receiving device provided in the object holding device is carried and carried over the object holding member And an operation of loading the object to be carried; and guiding the object to be carried out on the object loading surface of the object holding member to guide surface defined by the guide member of the object holding device to be guided from the object holding member The action of moving out of the object holding device in the direction of the object loading surface.

According to a third aspect of the present invention, in the object carrying-out method, an object mounted on an object holding member included in the object holding device is carried out from the object holding member, and the object holding device holding the object is oriented. An operation of moving the object carrying-out position on the object holding member to carry out the object; and an operation of moving the object out of the object holding member before the object holding device reaches the object carrying-out position.

According to this, since the object carrying-out operation is started before the object holding device reaches the object carrying-out position, the object can be quickly carried out from the object holding member.

A second object replacement method according to a fourth aspect of the present invention, comprising: the object carrying out method according to the third aspect of the present invention, wherein the moving operation is started; and the other object is set before the object holding device reaches the object carrying out position. a standby standby operation; an operation of moving the object out of the object holding device in a state where the object holding device is located at the object carrying-out position; and moving the other object located at the standby position into the object to hold The action on the device.

The third object replacement method according to the fifth aspect of the present invention is for replacing an object mounted on the object holding member included in the object holding device, and includes: an operation of transporting the object to be carried onto the object holding member; The object receiving device of the object holding device receives an operation of the object to be carried carried over the object holding member, and guides the object to be carried out on the object loading surface of the object holding member to be held by the object The device has a guide surface defined by the guide member, and the object carrying device provided by the object holding device is carried out from the object holding member in the direction of the object loading surface.

An object holding device according to a sixth aspect of the present invention includes: an object holding member having an object loading surface for loading an object to be loaded, holding the object loaded on the object loading surface; and carrying out the device to hold the object The object held by the member is carried out from the object holding member to the outside.

According to the present viewpoint, since the object holding device includes the unloading device, the object carrying out operation can be performed at an arbitrary timing. Therefore, the object can be quickly carried out from the object holding device.

A second object exchange system according to a seventh aspect of the present invention includes the object holding device according to the sixth aspect of the present invention, wherein the loading device transports the object to be carried over the object holding member, and the object receiving device is provided in the object holding device. The object to be loaded is received from the loading device; and a guide is provided in the object holding device for defining a guiding surface for guiding the object to be carried out by the carrying device.

The first exposure apparatus according to the eighth aspect of the present invention includes: the sixth aspect of the present invention Any one of the object holding device of the aspect, the first object replacing system according to the first aspect of the present invention, and the second object replacing system according to the seventh aspect of the present invention; and the energy beam used for the object held by the object holding device A pattern forming device that forms a predetermined pattern.

A second exposure apparatus according to a ninth aspect of the present invention is a scanning type that moves an object relative to an energy beam in a scanning direction during exposure, and includes a first moving body that is movable in a predetermined two-dimensional plane in a direction perpendicular to the scanning direction. a first moving direction; the second moving body is movable in the second direction parallel to the scanning direction on the first moving body, and is movable in the first direction together with the first moving body; the object holding device Provided to hold the object, disposed above the second moving body, integrated with the object by the movement of the second moving body, induced in a direction parallel to the predetermined two-dimensional plane; and a carrying device The first moving body is provided to drive the object in a predetermined carry-out direction with respect to the object holding device.

According to the ninth aspect, since the unloading device is carried out by the first moving body moving in the direction orthogonal to the scanning direction, the inertial mass of the second moving body moving in the scanning direction is increased, particularly in scanning. The position control of the object can be performed with high precision during exposure.

A method of manufacturing a flat panel display according to a tenth aspect of the present invention, comprising: the first exposure apparatus according to the eighth aspect of the present invention or the second exposure apparatus according to the ninth aspect of the present invention, wherein the object is exposed; and the exposure is performed The action of developing the object.

The device manufacturing method according to the eleventh aspect of the present invention, comprising: the first exposure apparatus using the eighth aspect of the present invention or the second exposure of the ninth aspect of the present invention The action of exposing the object to the device; and the act of developing the object after exposure.

"First Embodiment"

Hereinafter, the first embodiment will be described with reference to Figs. 1 to 8(B).

Fig. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10a according to the first embodiment. The liquid crystal exposure apparatus 10a is a projection exposure apparatus using a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) such as a liquid crystal display device (planar display) as an exposure target.

The liquid crystal exposure apparatus 10a includes an illumination system IOP, a mask holder MST holding the mask M, a projection optical system PL, and a surface (the surface facing the +Z side in FIG. 1) coated with a photoresist (sensing agent). The substrate stage device PSTa of the substrate P, the substrate carrying device 80a, the dam portion 90 for receiving the substrate between the external device, and the like, and the like. Hereinafter, the direction in which the exposure mask M and the substrate P are scanned with respect to the projection optical system PL is defined as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis and the Y-axis. The directions in the Z-axis direction and the directions around the X-axis, the Y-axis, and the Z-axis are defined as θ x , θ y , and θ z directions, respectively. In addition, the positions of the X-axis, the Y-axis, and the Z-axis direction are assumed to be the X position, the Y position, and the Z position, respectively.

The illumination system IOP has the same configuration as the illumination system disclosed in, for example, the specification of U.S. Patent No. 6,552,775. In other words, the illumination system IOP causes the light emitted from a light source (for example, a mercury lamp) (not shown) to be reflected by a reflection (not shown). A mirror, a dichroic mirror, a blind, a filter, various lenses, and the like are used as the exposure illumination light (illumination light) IL to illuminate the mask M. For the illumination light IL, for example, an i-line (wavelength: 365 nm), a g-line (wavelength: 436 nm), an h-line (wavelength: 405 nm), or the like (or the above-described i-line, g-line, and h-line combined light) is used.

In the mask stage MST, for example, a mask M having a circuit pattern or the like formed on the pattern surface thereof is adsorbed and held by vacuum suction. The mask stage MST is mounted on the barrel stage 16 of a part of the apparatus body (body), and is driven in the scanning direction by a predetermined length stroke, for example, by a mask stage driving system (not shown) including a linear motor. The axis direction) is appropriately micro-driven in the Y-axis direction and the θ z direction. The position information (including the rotation information in the θ z direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is disposed below the mask stage MST and supported by the barrel stage 16. The projection optical system PL has the same configuration as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems in which the pattern image of the mask M is arranged in a zigzag pattern, and can exhibit a projection optical system having a rectangular single image field having a longitudinal direction in the Y-axis direction. The same function (so-called multi-lens projection optics). In the present embodiment, each of the plurality of projection optical systems is formed by using, for example, a double-centered telecentric system and forming an erect image.

Therefore, when the illumination area on the reticle M is illuminated by the illumination light IL from the illumination system IOP, that is, by the illumination light IL passing through the reticle M, the circuit of the reticle M in the illumination area is transmitted through the projection optical system PL. Pattern projection image (partial erect image), forming illumination light IL conjugated to the illumination region on the substrate P Irradiation area (exposure area). Then, by the synchronous driving of the mask stage MST and the substrate stage device PSTa, the mask M is moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is moved relative to the exposure area (illumination light IL). In the scanning direction, scanning exposure of one irradiation region on the substrate P is performed, and the pattern formed on the mask M is transferred to the irradiation region. That is, in the present embodiment, the pattern of the mask M is formed on the substrate P by the illumination system IOP and the projection optical system PL, and the exposure layer (photoresist layer) on the substrate P is irradiated onto the substrate P by the illumination light IL. The pattern is formed on it.

The substrate stage device PSTa includes a stage 12 and a substrate stage 20a disposed above the stage 12.

The platform 12 is formed of a rectangular plate-like member in plan view (viewed from the +Z side), and the upper surface thereof is processed to a very high flatness. The stage 12 is mounted on a substrate stage stand 13 of a part of the apparatus body. The apparatus including the substrate stage gantry 13 is mounted on the vibration isolating device 14 provided on the floor 11 of the clean room, whereby the reticle stage MST, the projection optical system PL, and the like are vibrated with respect to the ground 11 Separation.

The substrate stage 20a includes an X coarse movement stage 23X, and a Y coarse movement stage which is mounted on the X coarse motion stage 23X and the X coarse movement stage 23X to constitute a so-called gantry type XY biaxial stage apparatus. 23Y, a fine movement stage 21 disposed on the +Z side (upper side) of the Y coarse movement stage 23Y, a substrate holder 30a holding the substrate P, a weight eliminating device 26 for supporting the fine movement stage 21 from below on the stage 12, and A plurality of substrate jacking devices 46a (not shown in FIG. 1 with reference to FIG. 3) for separating the substrate P from the substrate holder 30a.

The X coarse movement stage 23X is a rectangle whose longitudinal direction is the Y-axis direction in plan view In the member structure, a long hole-shaped opening (not shown) having a longitudinal direction in the Y-axis direction is formed in the center portion. The X coarse movement stage 23X is mounted on a guide (not shown) that is provided on the floor 11 and extends in the X-axis direction, and includes a linear motor, for example, during a scanning operation during exposure or a substrate replacement operation. The X stage drive is driven in the X-axis direction with a predetermined stroke.

The Y coarse movement stage 23Y is formed of a member having a rectangular shape in plan view, and an opening portion (not shown) is formed in a central portion thereof. The Y coarse movement stage 23Y is mounted on the X coarse motion stage 23X through the Y linear guide device 25, and is, for example, a Y stage drive system including a linear motor or the like in the Y step operation during exposure. The stage 23X is driven in the Y-axis direction with a predetermined stroke. Further, the Y coarse movement stage 23Y is moved integrally with the X coarse motion stage 23X in the X-axis direction by the action of the Y linear guide device 25.

The fine movement stage 21 is constituted by a rectangular parallelepiped member having a substantially square shape in plan view. The fine movement stage 21 is a micro-motion stage drive system including a plurality of voice coil motors (or linear motors) composed of a stator fixed to the Y coarse movement stage 23Y and a movable body fixed to the fine movement stage 21, The Y coarse movement stage 23Y is micro-driven in the six-degree-of-freedom direction (X-axis, Y-axis, Z-axis, θ x, θ y, and θ z directions). The plurality of voice coil motors include a plurality of (in FIG. 1 overlapped in the depth direction of the drawing) X-coil motor 29x that micro-drives the micro-motion stage 21 in the X-axis direction, and micro-drives the micro-motion stage 21 to the Y-axis. a plurality of Y-coil motors (not shown) in the direction, and a Z-voice coil that micro-drives the fine movement stage 21 in the Z-axis direction (for example, at positions corresponding to the four corners of the micro-motion stage 21) Motor 29z.

Moreover, the fine movement stage 21 is thickened by Y through the plurality of voice coil motors The movable stage 23Y is induced to move in the X-axis direction and/or the Y-axis direction along the XY plane along the XY plane together with the Y coarse movement stage 23Y. The position information in the XY plane of the fine movement stage 21 is obtained by a substrate interferometer system including a moving mirror fixed to the fine movement stage 21 to the transmission mirror mount 24 (including having an orthogonal to the X axis) The X moving mirror 22x of the reflecting surface and the Y moving mirror (not shown) having the reflecting surface orthogonal to the Y axis illuminate the distance measuring device (not shown) (including the use of the X moving mirror 22x to measure the fine moving load) The X interferometer at the X position of the stage 21 and the Y interferometer for measuring the Y position of the fine movement stage 21 using the Y moving mirror). The configuration of the micro-motion stage drive system and the substrate interferometer system is disclosed, for example, in the specification of U.S. Patent Application Serial No. 2010/0018950.

Further, as shown in FIG. 3, the micro-motion stage 21 is formed with an opening (+Z plane) and a lower surface (-Z plane) at a position corresponding to each of a plurality of substrate jacking devices 46a to be described later (on the Z-axis). The plurality of holes 21a are penetrated in the direction. Further, a hole portion 24a corresponding to the substrate jacking device 46a is formed in the mirror holder 24 in the same manner.

The substrate holder 30a is composed of a low-height rectangular parallelepiped member having a rectangular shape in the longitudinal direction of the X-axis direction, and is fixed to the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a is selectively connectable to a vacuum device provided outside the substrate stage 20a and a compressor (none of which is shown), and the substrate P can be adsorbed and held by the vacuum device (not shown in FIG. 3; Fig. 1) and the substrate P are suspended by a small gap by ejecting the pressurized gas supplied from the compressor. Gas attraction and ejection can be performed using common holes, so that Use a dedicated hole.

Further, in the substrate holder 30a, a plurality of openings (in the Z-axis direction) are formed on the upper surface (+Z plane) and the lower surface (-Z plane) at positions corresponding to the plurality of substrate jacking devices 46a to be described later. Hole portion 31a. Further, as is clear from FIGS. 2 and 3, a notch 32 opening on the +Z side and the +X side is formed at the +X side end portion of the upper surface of the substrate holder 30a and at the center portion in the Y-axis direction.

As shown in FIG. 3, the weight eliminating device 26 is constituted by a column-like member extending from the Z-axis direction (also referred to as a stem), and supports a central portion of the fine movement stage 21 from below through a device called a leveling device 27. . The weight eliminating device 26 is inserted into the opening of each of the X coarse movement stage 23X (not shown in Fig. 3, see Fig. 1) and the Y coarse movement stage 23Y. The weight eliminating device 26 is suspended on the platform 12 via a plurality of air bearings 26a mounted on the lower portion thereof with a small gap therebetween. The weight eliminating device 26 is connected to the Y coarse movement stage 23Y through a plurality of coupling devices 26b at a position of the center of gravity of the Z-axis direction, and is pulled by the Y coarse movement stage 23Y together with the Y coarse movement stage 23Y on the platform. 12 moves in the Y-axis direction and/or the X-axis direction.

The weight eliminating device 26 has, for example, an air spring (not shown), and the force in the vertical direction by the air spring is eliminated (offset) by the weight of the micro-motion stage 21, the leveling device 27, the substrate holder 30a, and the like ( The downward direction of the force), thereby reducing the load of the plurality of voice coil motors of the micro-motion stage drive system. The leveling device 27 supports the fine movement stage 21 from below to be swingable (tilting motion) with respect to the XY plane. The leveling device 27 supports the weight eliminating device 26 in a non-contact manner from below by an air bearing (not shown). The information on the tilt of the micro-motion stage 21 relative to the XY plane is installed by The plurality of Z sensors 26c under the fine movement stage 21 are obtained by using the target 26d attached to the weight eliminating device 26. The leveling device 27, the connecting device 26b, and the like are included, and the detailed configuration and operation of the weight eliminating device 26 are disclosed, for example, in the specification of US Patent Publication No. 2010/0018950.

A plurality of substrate jacking devices 46a each having a Z actuator 47 fixed to the Y coarse moving stage 23Y and a Z actuator 47 on the upper side (substrate loading surface) from the substrate holder 30a toward the +Z side The protruding position is driven by a lift pin 48a in the Z-axis (up and down) direction between the position where the upper surface of the substrate holder 30a is retracted toward the -Z side. The substrate lifting device 46a includes a top pin 48a, and the end portion on the +Z side is inserted into the hole portion 21a formed in the fine movement stage 21 (or the hole portion 24a formed in the mirror holder 24), and is formed on the substrate holder. In the hole portion 31a of 30a. Between the substrate lifting device 46a and the wall surfaces of the predetermined hole portions 21a, 24a, and 31a, a gap is formed between the fine movement stage 21 and the Y coarse movement stage 23Y when they are micro-driven.

A plurality of substrate jacking devices 46a are shown in FIG. 2 (however, only the top pin 48a is shown in FIG. 2, and the Z actuator 47 (see FIG. 3) is not shown), and are disposed apart from each other at a predetermined interval. The lower surface of the support substrate P can be substantially equal. In the first embodiment, a plurality of (for example, four) substrate jacking devices 46a arranged at predetermined intervals in the Y-axis direction are arranged in a plurality of columns (for example, 6 in a predetermined interval in the X-axis direction). Column). Further, in the first embodiment, the number of the substrate P is separated from the substrate holder 30a by using, for example, 24 substrate lifting devices 46a. However, the number and arrangement of the substrate lifting devices 46a are not limited thereto. For example, the size of the substrate P can be appropriately changed. Further, the type of the Z actuator 47 is also not particularly limited and can be used. For example, a cylinder device, a feed screw device, a cam device, and the like.

Referring back to Fig. 1, the substrate loading device 80a is disposed above the dam portion 90 (+Z side) which will be described later. As shown in FIG. 2, the substrate loading device 80a includes a pair of X traveling guides 81, a pair of X-travel guides 81, a pair of X sliders 82, and a loading arm disposed between the pair of X sliders 82. 83.

Each of the pair of X traveling guides 81 is formed of a member extending in the X-axis direction, and its longitudinal direction dimension is set to be slightly longer than the dimension of the substrate P in the X-axis direction. The pair of X traveling guides 81 are arranged in parallel with each other at a predetermined interval (a space which is slightly wider than the dimension of the substrate P in the Y-axis direction) in the Y-axis direction. Each of the pair of X sliders 82 is slidably engaged with the corresponding X travel guide 81 in the X-axis direction, and is driven by an actuator (for example, a feed screw device, a linear motor, a belt drive). The device, etc.) is driven synchronously along the X travel guide 81 with a predetermined stroke.

The loading arm 83 has a base portion 83 _{1 having a} plate-like portion extending parallel to the XY plane in the Y-axis direction, and a plurality of (for example, four) support portions 83 ₂ parallel to the plate-like portion extending in the X-axis direction. . The dimension of the longitudinal direction (Y-axis direction) of the base portion 83 ₁ is set to be slightly shorter than the dimension of the substrate P in the Y-axis direction. The plurality of support portions 83 ₂ are arranged in parallel with each other at a predetermined interval in the Y-axis direction, and the +X-side end portions are integrally connected to the -X-side end portions of the base portion 83 ₁ . The base portion 83 ₁ and the plurality of support portions 83 ₂ are integrally formed by, for example, CFRP (Carbon Fiber Reinforced Plastics). The dimension of the longitudinal direction (X-axis direction) of the plurality of support portions 83 ₂ is set to be slightly shorter than the dimension of the substrate P in the X-axis direction, and the substrate P is separated from the -X side region of the base portion 83 ₁ and the plurality of support portions 83 ₂ Supported below. The Z position of the loading arm 83, as shown in Fig. 1, is set on the -Z side of the X traveling guide 81.

Referring back to Fig. 2, a plurality of (e.g., three) adsorption pads 84 arranged at predetermined intervals in the X-axis direction are attached to the upper surfaces of the plurality of support portions 83 ₂ . A vacuum device (not shown) is connected to the loading arm 83, and the substrate P can be adsorbed and held by the plurality of adsorption pads 84. The loading arm 83 has a +Y side and a -Y side end portion of the base portion 83 ₁ and is connected to the X slider 82 on the +Y side and the -Y side via the mounting member 83 ₃ , and is synchronously driven by the pair of X sliders 82 . In the X-axis direction, between the region above the crotch portion 90 shown in FIG. 1 and the region above the +X side end portion of the stage 12, the substrate P is parallel to the XY plane and is defined in the X-axis direction. The trip moves. Further, in the substrate loading device 80a, the loading arm 83 can be configured to be movable up and down with respect to the pair of X traveling guides 81 (or a pair of X traveling guides 81).

Referring back to FIG. 1, the dam portion 90 has a gantry 91, a plurality of guides 92, and a substrate unloading device 93. The gantry 91 is placed on the floor 11 at a position on the +X side of the stage 12, and is housed in a chamber (not shown) together with the substrate stage device PSTa.

Each of the plurality of guides 92 is formed of a plate-like member parallel to the XY plane, and supports the substrate P from below. The plurality of guides 92 are respectively driven by the Z actuators 94 fixed to the gantry 91 in the Z-axis (up and down) directions. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 92, and a pressurized gas (for example, air) can be ejected from the hole portion, and the substrate P can be suspended and supported via a small gap. Further, the guide member 92 may adsorb and hold the substrate P by using the plurality of holes (or other holes).

A plurality of guides 92, as shown in FIG. 2, are separated from each other at a predetermined interval The lower surface of the support substrate P can be arranged substantially equally. In the first embodiment, a plurality of (for example, three) guides 92 arranged at predetermined intervals in the X-axis direction are arranged in a plurality of columns (for example, four columns) at predetermined intervals in the Y-axis direction. As described above, in the dam portion 90 of the first embodiment, the substrate P is supported from below by using, for example, a total of twelve guides 92.

Here, the plurality of guides 92 are disposed in a state in which the loading arm 83 of the substrate loading device 80a is positioned above the flange portion 90 (the loading arm 83 is in the state of the +X side stroke end), and is in the Y-axis direction. The position does not overlap with the plurality of support portions 83 _{2 of} the loading arm 83. Thus, when the plurality of guides 92 are synchronously driven in the +Z direction in a state where the loading arm 83 is positioned above the weir portion 90, the plurality of guide members 92 are not in contact with the loading arm 83 and can pass each other. Between the adjacent support portions 83 ₂ . Further, the interval between the plurality of substrate lifting devices 46a of the substrate stage 20a in the Y-axis direction is substantially the same as the interval between the plurality of the guide members 92 in the Y-axis direction, and the loading arm 83 is positioned above the substrate holder 30a. In the state in which the plurality of jack pins 48a are driven in the +Z direction, the plurality of jack pins 48a can pass between the support portions 83 ₂ adjacent to each other without contacting the loading arm 83.

Referring back to Fig. 1, the substrate carrying device 93 includes an X traveling guide 95, a plurality of Z actuators 96 for moving the X traveling guide 95 up and down, and a predetermined stroke in the X-axis direction on the X traveling guide 95. The moving X slider 97 and the adsorption pad 98 mounted on the X slider 97 are mounted.

The X traveling guide 95 is composed of a member extending in the X-axis direction, and is disposed between the second column and the third column in the plurality of columns (for example, four columns) of the guide row as shown in FIG. 2 . Returning to Fig. 1, the Z actuator 96 is separated in the X-axis direction. For example, 2 sets. The X slider 97 is engaged with the X traveling guide 95 so as to be slidable in the X-axis direction, and is guided along the X by an actuator (for example, a feed screw device, a linear motor, a belt driving device, etc.) (not shown). The member 95 is driven by a predetermined stroke (the same stroke as the size of the substrate P in the X-axis direction). The adsorption pad 98 is formed of a plate-like member parallel to the XY plane, and a hole for vacuum suction is formed on the upper surface (the surface on the +Z side). The substrate carrying device 93 can be driven by a plurality of Z actuators 96 by the X traveling guide 95 to move the X slider 97 and the suction pad 98 in the Z-axis direction (up and down).

In the liquid crystal exposure apparatus 10a (see FIG. 1) configured as described above, the mask M is attached to the mask stage MST by a mask loader (not shown) under the management of a main control unit (not shown). Loading and loading of the substrate P onto the substrate holder 30a is performed by the substrate loading device 80a. Thereafter, the main control device performs alignment measurement using an alignment detecting system (not shown). After the alignment measurement is completed, stepwise scanning (step & scan) is performed on the plurality of irradiation regions set on the substrate P. Exposure action. Since this exposure operation is the same as the exposure operation of the step-and-scan method which has been conventionally performed, detailed description thereof will be omitted. Then, the substrate on which the exposure process is completed is carried out from the substrate holder 30a, and the other substrate to be exposed next is transferred to the substrate holder 30a to perform substrate replacement on the substrate holder 30a. The sheet substrate is continuously subjected to an exposure operation or the like.

Next, the replacement operation of the substrate P on the substrate holder 30a of the liquid crystal exposure apparatus 10a (for convenience, the plurality of substrates P are referred to as the substrate P ₀ , the substrate P ₁ , the substrate P ₂ , and the substrate P ₃ ) This will be described using FIG. 4(A) to FIG. 4(B). The following substrate replacement operation is performed under the management of a main control device (not shown).

In FIG. 4 (A), the substrate stage 20a of the substrate holder 30a holding the substrate P _1. Further, the substrate carry-in device 80a of the loading arm 83 is held in the rear substrate P ₁ is unloaded from the substrate holder 30a, the next predetermined loading of the substrate holder 30a of the substrate P ₂ (a lower substrate P _2). Further, in the liquid crystal provided in the exposure device 10a (refer to FIG. 1) outside of the substrate carry-out robot 19 of the transfer arm, holds the completion of the exposed substrate P _0. Here, the transfer arm 19 of the substrate carrying robot and the transfer arm 18 of the substrate loading robot described later are substantially the same as the loading arm 83 of the substrate loading device 80a, but are moved along the X traveling guide 81 with respect to the loading arm 83. In the X-axis direction, the transfer arm 19 and the transfer arm 18 are supported by the robot arms 19a and 18a (cantilever support) near the +X side end portions, and the robot arms 19a and 18a are appropriately controlled to move to the X-axis. direction.

Main control means for setting to a plurality of shot areas on the _substrate P, the last one after the exposure process is the irradiation area of the substrate stage 20a downward (see FIG. 1) is moved from the projection optical system PL on to the platform 12 The position adjacent to the crotch portion 90 in the vicinity of the +X side end portion (hereinafter referred to as the substrate replacement position). At the substrate replacement position, as shown in FIG. 2, the substrate stage 20a is positioned such that the Y position of the notch 32 in the Y-axis direction substantially coincides with the Y position of the substrate carry-out device 93. In addition, the substrate replacement position can be carried out by the substrate holder P held by the substrate holder 30a (substrate stage 20a) and carried out from the substrate holder 30a (substrate stage 20a). position).

Further, in parallel with the operation of moving the substrate stage 20a to the substrate replacement position, the substrate loading device 80a is driven in the -X direction as shown in FIG. 4(B), whereby the substrate P ₂ is placed on the substrate replacement. Above the position. Further, in the substrate carrying device 93, the X slider 97 is driven in the -X direction on the X traveling guide 95, and the insertion pad 98 is inserted into the notch 32 of the substrate holder 30a at the substrate replacement position.

Thereafter, as shown in FIG. 5(A), the X traveling guide 95 and the X slider 97 are driven in the +Z direction by the plurality of Z actuators 96 (the substrate holder 30a is driven to the substrate carrying device 93). also -Z direction), until the suction pad 98 into contact below the top of the P ₁ position of the substrate. Adsorption suction pad 98 near the + X side end portion of the holding substrate P below _1. Further, on the substrate stage 20a, 30a of the release substrate holder _holding the substrate P is attracted and held on the substrate with the face 30a of the underlying substrate ₁ P ejected pressurized gas. Further, the plurality of guides 92 are controlled to have their Z positions such that the Z position on the upper surface thereof is substantially the same as the Z position on the upper surface of the substrate holder 30a.

Next, as shown in FIG. 5(B), in the substrate unloading device 93, the X slider 97 is driven in the +X direction on the X traveling guide 95. Accordingly, the suction holding the suction pads 98 of the substrate P ₁ that is held by the substrate above the upper edge 30a of the tool, and a plurality of guide members 92 are formed parallel to the plane of movement of the XY plane (guide surface) in the + X direction, from The substrate holder 30a is carried out to a plurality of guides 92. In this case, a plurality of guide member 92 above the substrate P also following _a discharge of pressurized gas. According to this, the substrate P _{1 can be} moved at a high speed and with low dust.

When the carry-out end of the substrate P _1, FIG. 6 (A), the substrate stage 20a, Z actuator 47 are synchronously controlled so that a plurality of substrates jacking means 46a 48a + Z direction toward their respective top pin Moving, a plurality of the top pins 48a are respectively passed between the support portions 83 _{2 of the} loading arm 83, and the lower surface of the substrate P ₂ is pressed from below. Further, the loading arm 83, is released 84 pairs of a plurality of suction pads ₂ of the substrate P held suction. Thus, the substrate P ₂ is separated from the loading arm 83.

After the substrate P _{2 is} separated from the loading arm 83, as shown in FIG. 6(B), in the substrate loading device 80a, the loading arm 83 is driven in the +X direction and is withdrawn from above the substrate replacement position. Further, in the substrate carrying-out device 93, the X traveling guide 95 and the X slider 97 are driven in the -Z direction by a plurality of Z actuators 96. As a result, a large space is formed between the substrate loading device 80a and the substrate unloading device 93. Further, a plurality of guide member 92 is driven in the -Z side was also slightly, the substrate P ₁ is slightly moved in the -Z direction. Further, mounted on the substrate carry-out robot of the transport under the substrate P ₂ substrate on the transfer arm 19 P ₀ is conveyed to the external device (e.g., coating and developing apparatus), and the substrate carrying robot of the transport arm 18 is moved from an external device a It is intended to be carried into the substrate P _{3 of the} substrate holder 30a.

Thereafter, as shown in FIG. 7(A), the Z actuator 47 is synchronously controlled on the substrate stage 20a to move the top pins 48a of the plurality of substrate jacking devices 46a in the -Z direction, whereby the substrate P is _{2 is} mounted on the upper surface of the substrate holder 30a. In this case, the Z position of the control pin 48a of the top so that the top pin 48a is separated from the underlying substrate of P _2. The substrate P ₂ is adsorbed and held by the substrate holder 30a. In addition, the transfer arm 18 of the substrate carrying robot supporting the substrate P ₃ is driven in the -X direction, and one of the substrate carrying devices 80a is inserted into the X traveling guide 81 (only one of them is shown in FIG. 7(A). See FIG. 2). between. In this manner, the transfer arm 18 of the substrate loading robot and the loading arm 83 of the substrate loading device 80a are arranged to overlap each other in the vertical direction. Further, the transfer arm 19 of the substrate carry-out robot is driven in the -X direction, and the space between the loading arm 83 and the substrate unloading device 93 is inserted. As described above, since the transfer arm 19 and the loading arm 83 have substantially the same shape, they are not in contact with the guide 92. As a result, the transfer arm 19 of the substrate unloading robot and the loading arm 83 of the substrate loading device 80 are arranged to overlap each other in the vertical direction.

Then, by the plurality of guide members 92 are driven in the -Z direction, i.e., cross the substrate P ₁ to the substrate carry-out robot 19 of the transfer arm. Cheng Youji support plate P ₁ of the conveying arm 19, FIG. 7 (B) as shown, is driven in the + X direction, conveying the substrate P ₁ to an external device. Further, the substituent may drive a plurality of guide member 92 in the -Z direction to the substrate P ₁ is delivered to the substrate carry-out robot arm 19 of the transfer, the substrate carry-out robot can be driven in the + Z direction to the substrate carrying arm 19 undertake P ₁ . Further, the guide member may be a plurality of the substrate carry-out robot 92 are driven in the Z-direction to the delivery of the substrate P _1.

After delivery to the transfer arm 19 when the substrate P _1, a plurality of guide member 92, are shown in FIG. 8 (A) is driven in synchronism in the + Z direction. A plurality of respective guides 92, the loading arm 83 without contacting the transfer and below the substrate P ₃ thereon contacts the arm 18 of the case, since the substrate P so as to leave _three transfer arm 18.

Thereafter, as shown in FIG. 8(B), the substrate carrying robot 18 is driven in the +X direction and exits from the upper region of the substrate unloading device 93. Next, the plurality of guides 92 supporting the substrate P ₃ from the lower side are respectively driven by the Z actuator 96 in the -Z direction. At this time, the plurality of guides 92 are respectively passed between the support portions 83 ₂ adjacent to each other by the loading arm 83, and the substrate P ₃ is supported by the support portion 83 _{2 of the} loading arm 83 (to be here). Thus, the state shown in FIG. 4(A) is returned (however, the substrate P ₀ is replaced with the substrate P ₁ , the substrate P ₁ is replaced with the substrate P ₂ , and the substrate P ₂ is replaced with the substrate P ₃ ). After addition, in FIG. 7 (B) ~ FIG. 8 (B), although the illustrated base ₂ holds the substrate P substrate stage 20a, but also hold the substrate P in the suction ₂ (see FIG. 7 (A)), immediately left The alignment measurement and exposure processing are started at the substrate replacement position.

As described the above, according to the first embodiment, since the substrate P (FIG. 4 (A) ~ FIG. 8 (B) of the substrate P ₁₎ of the unloading system using a substrate holder having a top surface 30a of a guide, it is possible to The substrate unloading operation on the substrate holder 30a is quickly performed. Further, when the substrate P is separated from the substrate holder 30a by carrying out the substrate, the amount of movement (the amount of increase) of the substrate P may be slightly small. Therefore, in a state where the substrate stage 20a is positioned at the substrate replacement position, it is sufficient to have a space in which the loading arm 83 can be inserted above the substrate holder 30a of the substrate stage 20a. As described above, the substrate replacement system (including the substrate loading device 80a and the substrate carrying device 93 that uses the upper surface of the substrate holder 30a as a guide surface) in the substrate holder 30a and the lens barrel of the first embodiment When the space between the platforms 16 (see Fig. 1) is narrow, it can be used very suitably.

"Second Embodiment"

Next, a second embodiment will be described with reference to Figs. 9 and 10 . The liquid crystal exposure apparatus of the second embodiment is the same as the liquid crystal exposure apparatus 10a (see FIG. 1) of the first embodiment except for the configuration of the substrate holder 30b and the substrate lifting device 46b, and the following is only for the different points. In the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

In the first embodiment, the substrate P is moved by the upper surface of the substrate holder 30a as a guide surface when the substrate is carried out (see FIGS. 5(A) and 5(B)). However, the second embodiment is implemented. In the form, as shown in FIG. 10, the difference is that The guide 48b of the Z actuator 47 mounted on each of the plurality of substrate jacking devices 46b is moved by the guide surface.

9, above the substrate holder 30b, extending in the X-X axis of the groove 31b ₁ in the Y-axis direction is formed with a plurality of strips (e.g. 4) at a predetermined interval. Further, as shown in FIG. 10, the through hole 31b ₂ penetrating the substrate holder 30b in the vertical direction is formed at a predetermined interval (for example, three) in the X-axis direction, and the through hole 31b _{2 is} formed in the bottom surface of the X groove 31b ₁ . A portion of the Z actuator 47 is inserted.

48b guide the X-axis direction in a groove 31b ₁ housed at predetermined intervals a plurality (e.g., three). The guide member 48b is formed of a plate-like member parallel to the XY plane, and is held by the Z actuator 47 from the upper surface of the substrate holder 30b (substrate loading surface) to the +Z side and the holder from the substrate. The upper surface of 30b is driven in the Z-axis (up and down) direction between the positions where the -Z side is retracted. Is formed with a plurality of micropores (not shown) on the upper surface of the guide member 48b, it can discharge the pressurized gas (e.g. air) through the hole portion, a suspension supporting substrate through the tiny gap P (in FIG. 10 is a substrate P _1). Further, the guide member 48b may adsorb and hold the substrate P by using the plurality of holes (or other holes). Further, in the present second embodiment, although the X-based grooves 31b ₁ is formed with, for example four, but the number X of grooves 31b _1, 48b and the guide number and arrangement is not limited to this, for example, the visual size of the substrate proper Change it.

This second embodiment, shown in Figure 10, when the objects of the unloading of the substrate P (substrate P in FIG. 10 is a ₁₎ of the carry-out, is released by the state of the substrate holder 30b holding the substrate P ₁ of the adsorbed the plurality of guide members 48b is driven in the + Z direction of synchronization, i.e. the substrate P ₁ below the upper tool holder 30b separated from the substrate. The substrate carry-out device 93 of the suction pads 98 is inserted between the lower substrate holding device 30b of the upper substrate P _1. Further, in the substrate holder 30b of the second embodiment, the notch 32 is not formed as in the substrate holder 30a of the first embodiment shown in Fig. 2 .

Returning to Figure 10, when the suction pads 98 is inserted between the lower substrate holding device 30b of the upper substrate P _1, from a plurality of substrates in the device top 46b, the guide member 48b is driven in the micro -Z direction, so the substrate P The lower side of ₁ is adsorbed and held on the adsorption pad 98. Next, a plurality of guide members from below of the substrate P ₁ 48b discharge the pressurized gas, the substrate P in _a suspended state of the X slider 97 is driven in the + X direction, according to the substrate P from _a group of the substrate stage 20b The guide 48b is fed onto the guide 92 of the jaw 90. Further, the loading operation of the next substrate P ₂ to the substrate holder 30b is carried out by a plurality of guides 48b (see FIGS. 6(A) and 6(B)) instead of a plurality of pins 48a (see FIGS. 6(A) and 6(B)). The holding of the substrate P ₂ is the same as that of the first embodiment described above (the plurality of guides 48b have the function of a plurality of the pins 48a), and the description thereof will be omitted.

According to the second embodiment described above, in addition to the effects of the first embodiment, it is not necessary to form the notch for inserting the adsorption pad 98 in the substrate holder 30b, so that the substrate P mounted on the substrate holder 30b can be suppressed. Flexed. In addition, since it is not necessary to drive the adsorption pad 98 in the Z-axis direction when the adsorption pad 98 is sucked and held by the adsorption pad 98 (refer to the first embodiment, refer to FIG. 5(A)), the control of the crotch portion 90 can be easily performed. Further, since it is not necessary to discharge the pressurized gas for suspending the substrate P from the upper surface of the substrate holder 30b, it is not necessary to provide a line for supplying the pressurized gas, and the substrate holder 30b can be made lighter.

"Third Embodiment"

Next, a third embodiment will be described with reference to Figs. 11 to 20(C). In the first embodiment, as shown in FIG. 1, the dam portion 90 provided outside the substrate stage device PSTa has the substrate unloading device 93. On the other hand, the liquid crystal exposure device 10c of the third embodiment shown in FIG. The difference is that the substrate stage 20c of the substrate stage device PSTc has the substrate unloading device 70a. In the third embodiment, the differences from the above-described first embodiment will be mainly described, and the same components as those in the first embodiment will be denoted by the same reference numerals and will not be described.

The liquid crystal exposure apparatus 10c according to the third embodiment includes an illumination system IOP, a mask stage MST, a projection optical system PL, a substrate stage device PSTc, a substrate loading device 80c, a crotch portion 60, and the like. The substrate stage 20c of the substrate stage device PSTc includes an X coarse movement stage 23X, a Y coarse movement stage 23Y, a fine movement stage 21, a substrate holder 30c, a weight eliminating device 26, and a plurality of substrate lifting devices 46a (Fig. 11 is not shown. Refer to Fig. 13). In addition, the configuration of the substrate stage 20c is the same as that of the substrate stage 20a (see FIG. 1 and the like) of the first embodiment, except that the substrate holder 30c has the substrate carrying device 70a. Therefore, the description thereof is omitted here.

As shown in FIG. 12, on the upper surface (substrate mounting surface) of the substrate holder 30c, the X-grooves 73x parallel to the X-axis are formed in a plurality of (for example, two) at predetermined intervals in the Y-axis direction. The X groove 73x is opened on each of the +X side and the -X side of the substrate holder 30c.

The substrate unloading device 70a is housed in each of the plurality of X slots 73x. The substrate unloading device 70a has an X traveling guide 71 and an adsorption device 77a. The X traveling guide 71 is constituted by a member extending in the X-axis direction, and as shown in Fig. 13, is fixed to the bottom surface for defining the X groove 73x. The dimension of the long side (X-axis) direction of the X traveling guide 71 is set to be longer than the dimension of the substrate holder 30c in the X-axis direction, and both end portions in the longitudinal direction protrude from the outer side of the substrate holder 30c. The adsorption device 77a has a suction pad 77a _{1 for} adsorbing and holding the lower surface of the substrate P (not shown in Fig. 13 and referring to Fig. 11), and driving the adsorption pad 77a ₁ to the upper and lower sides (Z axis) on the X traveling guide 71. Directional Z actuator 77a ₂ . Suction pads 77a ₁ XY plane by a plate-like member extending parallel to, and is connected to a vacuum apparatus provided in the substrate (not shown) of the external station 20c.

The suction device 77a is engaged with the X traveling guide 71 so as to be slidable in the X-axis direction, and is driven in the X-axis direction by a predetermined stroke on the X traveling guide 71. The type of the driving device for driving the adsorption device 77a is not particularly limited, and for example, an X linear motor composed of a stator having the X traveling guide 71 and a movable member of the adsorption device 77a, or a X-guided motor can be used. The feed screw of the member 71 and the feed screw device of the nut which the adsorption device 77a has. Further, a belt driving device that pulls the suction device 77a with a belt (or a rope) or the like can also be used.

As shown in FIG. 11, the crotch portion 60 is provided on the +X side of the substrate stage device PSTc, and is housed in a chamber (not shown) together with the substrate stage device PSTc. The crotch portion 60 has a gantry 61 and a substrate guiding device 62.

The substrate guiding device 62 has a susceptor 63, a plurality of Z actuators 64 mounted on the susceptor 63, and a corresponding Z actuator 64 corresponding to each of the plurality of Z actuators 64. A plurality of guides 65 in the up and down (Z-axis) direction. The pedestal 63 is composed of a rectangular plate-like member parallel to the XY plane, and is composed of a plurality of X linear guides 66 fixed to the upper surface of the gantry 61. A plurality of X linear guides, which are fixed to the underside of the base 63 and slidably engaged with the X slider 67 of the X linear guide 66, are guided in the X-axis direction. Further, the susceptor 63 is driven in the X-axis direction by a predetermined stroke by an X actuator (for example, a feed screw device, a linear motor, or the like) (not shown). The type of the Z actuator 64 is not particularly limited, and for example, a cam device, a feed screw device, an air cylinder, or the like can be used. A plurality of Z actuators 64 are synchronously driven by a main control unit (not shown). The guide 65 is the same member as the guide 92 (see FIG. 1 and the like) of the above-described first embodiment, and the support substrate P and the adsorption holding substrate P can be suspended and supported from below.

Here, the arrangement of the plurality of Z actuators 64 and the plurality of guides 65 included in the substrate guiding device 62 will be described with reference to FIG. Further, in Fig. 12, the Z actuator 64 is hidden under the guide 65 (-Z side) and is not displayed. In addition, in FIG. 12, illustration of the gantry 61, the base 63, etc. is abbreviate|omitted.

The plurality of guides 65 are arranged such that the guide faces of the substrate P formed by the plurality of guides 65 have a trapezoidal shape in plan view. Specifically, the substrate guiding device 62 has, for example, three rows of guide columns composed of a plurality of guides 65 arranged at predetermined intervals in the Y-axis direction at predetermined intervals in the X-axis direction. The guide row on the most-X side is composed of, for example, eight guide members 65. Further, the guide row in the middle of the three rows of guide rows is constituted by, for example, six guides 65. Further, the guide row on the most +X side is constituted by, for example, four guides 65. As described above, the plurality of guides 65 are the guide rows on the X-X side, and the number of the guides is more on the +X side. On the substrate guiding device 62, the substrate P can be supported from below in the Y-axis direction. The range is wider than the +X side on the -X side (the substrate stage 20c side). On the other hand, for example, the guide on the most-X side (the substrate stage 20a side) of the eight guide members 65 The length (width) of the member in the Y-axis direction is set to be longer (for example, 1.5 to 2 times) than the length (width) of the substrate P in the Y-axis direction.

Further, each of the plurality of guides 65 is disposed in a state in which the loading arm 83 of the substrate loading device 80c is positioned above the crotch portion 60, similarly to the guide 92 (see FIG. 2) of the first embodiment. (The state in which the loading arm 83 is located at the stroke end on the +X side) does not overlap with the position of the plurality of support portions 83 _{2 of} the loading arm 83 in the Y-axis direction. Further, the shape, the number, and the arrangement of the plurality of guides 65 may be set such that the dimension of the -X side in the Y-axis direction of the guide surface defined by the plurality of guides is larger than the dimension of the substrate P in the Y-axis direction. In the case where the guide surface can be formed in a rectangular shape, it is not limited thereto, and can be appropriately changed.

As shown in FIG. 11, the substrate loading device 80c is disposed above the crotch portion 60 (+Z side). The substrate loading device 80c according to the third embodiment is slightly longer than the pair of X traveling guides 81 and the mounting member 83 _{3 for} connecting the loading arm 83 to the pair of X sliders 82. Since the substrate loading device 80a (see FIG. 2) of the first embodiment has the same configuration, the description thereof is omitted here.

In the following, the substrate P on the substrate holder 30c is continuously subjected to an exposure operation or the like for a plurality of substrates P (for convenience, the plurality of substrates P are referred to as a substrate P ₀ , a substrate P ₁ , a substrate P ₂ , and a substrate P ₃ The replacement operation will be described with reference to Figs. 14(A) to 18(B). The following substrate replacement operation is performed under the management of a main control device (not shown). In addition, for easy understanding, the substrate stage 20c is shown in FIG. 14(A) to FIG. 15(A), FIG. 16(B) to FIG. 18(B), and is a cross-sectional view taken along line DD of FIG. Fig. 16(A) shows a cross-sectional view taken along line CC of Fig. 12.

FIG. 14 (A), the substrate stage 20c 30c of the substrate holder holds the substrate P _1. Further, the substrate carrying apparatus 80c of the loading arm 83, after holding the substrate P ₁ unloaded from the substrate holder 30c, the lower sheet carrying a predetermined substrate holder 30c of the substrate P ₂ (views a substrate P _2). Further, the substrate P _{0 in} which the exposure has been completed is held by the transfer arm 19 of the substrate carrying robot.

Main control means for at the end of the exposure processing is set in the plurality of shot areas on the _substrate P at a final irradiated area, as shown in FIG 14 (B), the substrate stage 20c from the projection optical system PL (refer to Move below the substrate replacement position in Figure 11).

Further, the substrate stage 20c is moved to the replacement position of the substrate in parallel operation, the substrate carry-in device 80c, the loading arm 83 is driven in the -X direction, whereby the substrate P ₂ which is located above the position of the substrate replacement. Further, in the weir portion 60, in order to reduce the interval (gap) between the guide member 65 on the most-X side and the substrate holder 30c, the susceptor 63 is driven in the -X direction (the direction close to the substrate stage 20c). The plurality of guides 65 on the base 63 have Z positions controlled such that the Z positions thereon are substantially the same as the Z positions on the substrate holder 30c.

When the substrate stage 20c of the substrate exchange position, the main control unit, FIG. 15 (A) as shown, i.e., the substrate holder 30c is released to the suction _holding the substrate P, the substrate holder and ejected from the top 30c of the pressurized gas The substrate P _{1 is} suspended. Further, for example, the adsorption pad 77a ₁ (not shown in FIG. 15 (A) is not shown in FIG. 15 (A)) of the two substrate carry-out devices 70a (not shown in FIG. 15 (A)) is driven in the +Z direction. The lower surface of the substrate P ₁ is held by adsorption.

Thereafter, as shown in FIG. 15(B), the adsorption device 77a is driven in the +X direction on the X traveling guide 71. Accordingly, the substrate P ₁ adsorbed and held by the adsorption pad 77a ₁ is along the upper surface of the substrate holder 30c and the surface (guide surface) parallel to the XY plane formed by the upper surface of the plurality of guides 65 to +X. The direction is moved, and the substrate holder 30c is carried out to the crotch portion 60. At this time, pressurized gas is also ejected from the upper surface of the plurality of guides 65. In this way, the substrate P _{1 can be} moved at a high speed and with low dust.

When the carry-out end of the substrate P _1, FIG. 16 (A), the substrate stage 20c, a plurality of substrates from the top 46a of the respective device by the synchronous control such that a top pin 48a moves toward the + Z direction. At this time, the plurality of jack pins 48a are respectively pressed between the support portions 83 _{2 of the} loading arm 83 to press the lower surface of the substrate P ₂ from below. Further, the loading arm 83, releasing a plurality of suction pads 84 pairs of holding the substrate P ₂ adsorption. Accordingly, the substrate P ₂ is separated from the loading arm 83. Further, in the port portion 60, the support substrate ₁ of P substrate guide device 62 (base 63) is driven in the + X direction (from the base station 20c away from the direction of the board).

When the substrate P _{2 is} separated from the loading arm 83, as shown in FIG. 16(B), the loading arm 83 is driven in the +X direction and is withdrawn from above the substrate replacement position, and returns to the position above the crotch portion 60. Moreover, in the crotch portion 60, a plurality of guides 65 are slightly driven on the -Z side, and the substrate P ₁ Move slightly in the -Z direction. Further, the substrate P ₀ loaded on the transfer arm 19 of the substrate unloading robot is transported to the external device, and the transfer arm 18 of the substrate transfer robot transports the next substrate P ₃ from the external device.

Thereafter, as shown in FIG. 17(A), on the substrate stage 20c, a plurality of substrate jacking devices 46a are synchronously controlled to move the top pins 48a in the -Z direction, whereby the substrate P ₂ is loaded to the substrate holder. The upper surface of the member 30c (the top pin 48a is separated from the lower surface of the substrate P ₂ ). The substrate P ₂ is adsorbed and held by the substrate holder 30c. Further, in parallel with the adsorption holding operation of the substrate P ₂ , the substrate carrying device 70a is driven in the -X direction by the adsorption device 77a (see FIG. 12) located near the +X side end portion of the X traveling guide 71. Return to the position on the vicinity of the -X side end of the X traveling guide 71.

Furthermore, the port portion 60 in the above, the substrate P supported by the substrate ₃ of the robot carrying the transport arm 18 is driven in the -X direction, is inserted into one of the substrate carry-in device 80c of the guide member 81 travels X (FIG. 17 (A) is not Fig. 12). As a result, the transfer arm 18 of the substrate loading robot and the loading arm 83 of the substrate loading device 80c are arranged to overlap each other in the vertical direction. Further, the substrate carry-out robot 19 of the transfer arm is driven in the -X direction, into the lower substrate P _1. As described above, since the transfer arm 19 and the loading arm 83 have substantially the same shape, they do not come into contact with the guide 65. As a result, the transfer arm 19 of the substrate carry-out robot and the loading arm 83 of the substrate carry-in device 80c are arranged to overlap each other in the vertical direction.

Thereafter, a plurality of guide members 65 are driven in the -Z direction, according to the substrate to deposit P ₁ of the substrate carry-out robot transfer arm 19. The substrate P ₁ supports the transfer arm 19 and is driven in the +X direction as shown in Fig. 17 (B) to transport the substrate P ₁ to the external device.

After the completion of the exposure of the substrate P ₁ to deposit the substrate after transfer of the carry-out robot arm 19, a plurality of guide member 65, in the + Z direction in FIG. 18 (A), the driven synchronously. Each of the plurality of guides 65 is in contact with each other under the loading arm 83 and the transfer arm 18, and the upper surface thereof faces the lower surface of the substrate P ₃ and lifts the substrate P ₃ to be transported therefrom. The arm 18 leaves. At this time, the substrate P ₃ is adsorbed and held by the plurality of guides 65.

Thereafter, as shown in FIG. 18(B), the transfer arm 18 of the substrate loading robot is driven in the +X direction, and is withdrawn from the upper region of the crotch portion 60. Further, a plurality of guides 65 supporting the substrate P ₃ from below are synchronously driven in the -Z direction. At this time, the plurality of guides 65 are respectively supported by the support portions 83 ₂ adjacent to each other by the loading arm 83. On the other hand, the substrate P ₃ is supported by the support portion 83 _{2 of the} loading arm 83 from below. Accordingly, the substrate P _{3 is} transferred from the guide 65 to the loading arm 83, and returns to the state shown in FIG. 14(A) (however, the substrate P ₀ is replaced with the substrate P ₁ and the substrate P ₁ is replaced with the substrate P _{2. The} substrate P ₂ is replaced with a substrate P ₃ ).

The liquid crystal exposure apparatus 10c of the third embodiment can also obtain the same effects as those of the first embodiment. Further, in the third embodiment, since the substrate stage 20c has the substrate unloading device 70a, before the substrate stage 20c reaches the substrate replacement position, that is, when the exposure processing for the final irradiation region is completed and the substrate replacement position is moved, The carry-out operation of the substrate P can be started in parallel with this movement. Therefore, the substrate replacement cycle time on the substrate holder 30c can be shortened, and the number of processed substrates of the substrate P per unit time can be increased.

Further, for example, when a plurality of irradiation regions are set on the substrate P, generally, the irradiation region in which the exposure process is finally performed is set to be + on the substrate P in order to reduce the total amount of movement of the substrate P (substrate stage 20c). Y side, or -Y side. Therefore, the substrate stage 20c after the exposure processing in the last irradiation region is moved in the X-axis direction and also in the Y-axis direction (moving in the oblique direction with respect to the X-axis) when moving to the substrate replacement position. On the other hand, in the third embodiment, as shown in FIG. 19, among the plurality of guides 65, for example, the guides including the eight guides 65 disposed on the most-X side are arranged in the Y-axis direction. It is set to be longer than the dimension of the substrate P in the Y-axis direction, and thus is on the substrate stage 20c. When the X-axis is moved in the oblique direction, the portion of the substrate P that protrudes from the +X-side end portion of the substrate holder 30c is also supported by the guide 65 from below. According to this, the substrate P can be carried out more quickly.

Hereinafter, specific description will be given using FIGS. 20(A) to 20(C). In FIGS. 20(A) to 20(C), illustrations of the substrate carrying-out device 70a and the dam portion 60 (see FIG. 12, respectively) are omitted. In addition, in FIGS. 20(A) to 20(C), for the sake of convenience, the irradiation region (exposure region) is given the same reference numeral as the projection optical system PL (see FIG. 11).

As shown in FIG. 20(A), for example, six irradiation regions are set on the substrate P, and the last irradiation region is provided on the +Y side of the substrate P and the irradiation region S ₆ on the +X side. Further, the center of the substrate P before the start of the exposure operation in the irradiation region S ₆ is located at the position CP ₁ , and the center of the substrate P is located at the position CP ₂ at the end of the exposure operation.

Here, assuming that the dimension of the most-X side guide row (see FIG. 19) in the Y-axis direction is the same as the dimension of the substrate P in the Y-axis direction, the substrate P is carried out by the substrate P and X. Since the axial direction moves in parallel, it is necessary to control the Y position of the substrate stage 20c so that the most-X side guide is arranged at the center of the Y-axis direction and substantially coincides with the center of the substrate P in the Y-axis direction. The position control of the substrate stage 20c must be performed in such a manner that the center of the substrate holder 30c passes through the position CP ₁ → CP ₂ → CP ₄ (the position CP ₄ is the substrate replacement position) of FIG. 20(B).

On the other hand, in the third embodiment, regardless of the Y position of the substrate stage 20c, the +X side end portion of the substrate P is supported by the guide 65 (see FIG. 19), so that the substrate stage 20c is irradiated from the final stage. When the position (position CP ₂ ) at the end of the exposure processing of the area is moved to the substrate replacement position (position CP ₄ ), the substrate P can be carried out simultaneously with the movement, and the center of the substrate P can be sequentially passed through FIG. 20 ( B) Position CP ₁ → CP ₂ → CP ₃ The substrate P is carried out (the center of the substrate stage 20c passes in the order of CP ₁ → CP ₂ → CP ₄ ). Therefore, the substrate P can be quickly carried out. After the substrate stage 20c is positioned at the substrate replacement position, the substrate P moves parallel to the X-axis as shown in FIG. 20(C).

"Fourth Embodiment"

Next, a fourth embodiment will be described with reference to Figs. 21 and 22 . The liquid crystal exposure apparatus of the fourth embodiment is the same as the liquid crystal exposure apparatus 10c (see FIG. 11) of the third embodiment except for the configuration of the substrate holder 30d. Therefore, only the differences will be described below. The third embodiment has the same configuration and function, and the same reference numerals are given to the third embodiment, and the description thereof is omitted.

In the third embodiment, the substrate P is moved by the upper surface of the substrate holder 30c as a guide surface when the substrate is carried out (see FIGS. 15(A) and 15(B)). The fourth embodiment is similar to the second embodiment (see FIG. 9) in that the substrate P is carried out along the guide surface formed by the plurality of guides 48b (see FIG. 22). Further, the configuration of the substrate carrying-out device 70a is the same as that of the third embodiment. Further, as shown in FIG. 22, the configuration including the guide 48b and the substrate jacking device 46b is the same as that of the second embodiment described above, and thus the description thereof is omitted here. According to the fourth embodiment, it is not necessary to form a hole portion for discharging the pressurized gas for suspending the substrate P on the substrate holder 30d. Furthermore, since there is no need to protect the substrate Since the pipe for gas discharge is fitted in the holder 30d, the substrate holder 30d can be made lighter.

"Fifth Embodiment"

Next, the fifth embodiment will be described with reference to Fig. 23 . In the third embodiment and the fourth embodiment, the substrate holders 30c and 30d (see FIGS. 12 and 21, respectively) have the substrate unloading device 70a. However, in the fifth embodiment, as shown in FIG. The substrate stage 20e is provided with a substrate unloading device 70a on the outside of the substrate holder 30e, on the +Y side and the -Y side. For example, the configuration of each of the two substrate carrying-out devices 70a is the same as that of the above-described third embodiment. In addition, the portion other than the arrangement of the substrate carrying-out device 70a is the same as that of the above-described fourth embodiment. Therefore, only the different points will be described below, and the same configuration and functional requirements as those of the third and fourth embodiments are given. The same reference numerals are given to the third and fourth embodiments, and the description thereof is omitted.

In the fifth embodiment, the amount of protrusion of the substrate P from the +Y side and the -Y side of the substrate holder 30e is set larger than that of the third and fourth embodiments, and one of the substrate carrying devices 70a is disposed. In the substrate P, below the portion protruding from the substrate holder 30e toward the +Y side, the other substrate unloading device 70a is disposed below the portion of the substrate P that protrudes from the substrate holder 30e toward the -Y side. Further, although not shown in FIG. 23, for example, each of the two substrate carrying-out devices 70a is attached to a support member fixed to the upper surface of the Y-stacking stage 23Y (see FIG. 11) disposed under the substrate holder 30e, and is attached to Y coarse movement stage 23Y. That is, for example, each of the two substrate carrying-out devices 70a is disposed apart from the substrate holder 30e.

In the fifth embodiment, for example, two substrate unloading devices 70a are respectively It is disposed outside the substrate holder 30e, and it is not necessary to form a groove for accommodating the substrate carrying device 70a in the substrate holder 30e, and the rigidity of the substrate holder 30e can be suppressed from being lowered. Moreover, since the substrate P can be adsorbed and held with a large area, the flatness of the substrate P can be improved. Further, since the business of the substrate holder 30e can be reduced in weight and the reaction force when the adsorption device 77a is driven does not act on the substrate holder 30e, the positional controllability of the substrate holder 30e (substrate P) can be improved. Further, since the substrate carrying-out device 70a is disposed outside the substrate holder 30e, the maintenance property is also good.

"Sixth Embodiment"

Next, the sixth embodiment will be described with reference to Figs. 24 to 25(C). In the fifth embodiment (see FIG. 23), the configuration of the substrate unloading device 70a is the same as that of the third embodiment. However, in the sixth embodiment shown in FIG. 24, the configuration of the substrate unloading device 70d is different. . In addition, the portion other than the configuration of the substrate carrying-out device 70d is the same as that of the fifth embodiment, and therefore, only the differences will be described below, and the components having the same configuration and function as those of the fifth embodiment described above are provided. The fifth embodiment (or the third and fourth embodiments) have the same reference numerals and will not be described.

As shown in FIG. 24, the substrate stage 20f of the sixth embodiment is similar to the fifth embodiment (see FIG. 23) in the +Y side and the -Y side of the substrate holder 30e, and the substrate carrying device. The 70d system is disposed separately from the substrate holder 30e. The substrate carrying-out device 70d includes an X-traveling guide 71 supported by a support member 28 fixed to the upper surface of the Y-stacking stage 23Y, and a Y-line that can move in the X-axis direction on the X-traveling guide 71 with a predetermined stroke. The guiding device 78 and the adsorption device 77d that is mounted on the X traveling guide 71 through the Y linear guiding device 78. Suction means comprises a suction 77d holding the substrate P ₁ below the suction pad. The Y linear guide 78 has a Y actuator (not shown), and can drive the adsorption device 77d in the Y-axis direction with respect to the X traveling guide 71 with a predetermined stroke. Further, the Z position of the lower side of the adsorption device 77d is slightly on the +Z side than the Z position of the upper surface of the substrate holder 30e. Further, the type of the X actuator that drives the Y linear guide device 78 in the X-axis direction and the Y actuator that drives the adsorption device 77d in the Y-axis direction are not particularly limited, and for example, a feed screw device or a linear device can be used. Motor, etc. Further, the adsorption device 77d does not have a Z actuator that drives the adsorption pad in the Z-axis direction, unlike the above-described first to fifth embodiments.

In the sixth embodiment, the substrate P is mounted on the substrate holder 30e shown in Fig. 25(A), and the plurality of guides 48b are mounted in the substrate holder 30e (or by the micro-motion stage). 21 (refer to FIG. 24) is driven in the -Z direction) of the substrate P (substrate P in _{FIG. 1} 24) lifted from the substrate holder 30e of the above, then, as shown in FIG. 25 (B), the two substrates e.g. Each of the adsorption devices 77d of the unloading device 70d is driven in the direction approaching the substrate holder 30e (see an arrow in Fig. 25(B)). Accordingly, the substrate adsorption device 77d is inserted between the lower holder and the upper 30e of the substrate P (refer to FIG. 24. However, in FIG. 24, the insertion means 77d based substrate P and the substrate ₁ below the suction holding the tool between the upper 30e ).

Thereafter, in the substrate holder 30e, the plurality of guides 48b are lowered, whereby the adsorption and holding of the substrate P by the adsorption device 77d can be performed. For example, two adsorption devices 77d that adsorb and hold the substrate P are respectively driven to the +X side as shown in Fig. 25(C). As a result, the substrate P is carried out from the substrate holder 30e toward the crotch portion (not shown). Further, the substrate holder shown in FIG. 24 of the other of the load ₁ and the loading arm 30e P substrate 83 (the lower one) of the substrate P ₂ replacement operation is the same as the above-described second embodiment, description thereof is omitted. According to the sixth embodiment, since the adsorption device 77d can be moved in the Y-axis direction, the substrate P does not need to be largely protruded from both end portions of the substrate holder 30e in the Y-axis direction, and the substrate P can be downsized.

Further, the configurations of the third to sixth embodiments described above can be appropriately changed. For example, in the substrate unloading device 70d of the sixth embodiment, the adsorption device 77d can move in the Y-axis direction with respect to the X traveling guide 71. However, the present invention is not limited thereto, and may be, for example, as shown in Figs. 26(A) to 27(C). In the same manner as the substrate carrying device 70e of the first modification, the adsorption device 77d protrudes from the X traveling guide 71 toward the substrate holder 30e side in advance (the substrate carrying device 70e does not have to drive the adsorption device 77d to the X traveling guide 71 to Y). Y actuator in the axial direction). In this case, as shown in FIG. 26(A), in a state where the substrate P is mounted on the substrate holder 30e, the adsorption device 77d is placed on the -X side of the substrate P, and after the exposure is completed, the substrate P is used using a plurality of guides 48b. After being lifted from the substrate holder 30e, it is driven in the +X direction as shown in Fig. 26(B), and is thereby inserted between the substrate holder 30e and the substrate P. Thereafter, the substrate P is lowered, and the adsorption device 77d adsorbs and holds the substrate P, and in this state, is driven in the +X direction as shown in Fig. 26(C). Thereby, the substrate P is carried out from the substrate holder 30e. Further, after the substrate P is carried out, in the exposure processing of the other substrate P, the adsorption device 77d is located at the +X side of the substrate P as shown in Fig. 27(A). Next, the exposure process of the substrate P is completed, and the substrate P is moved out. When the plurality of guides 48b are lifted up from the substrate holder 30e, the adsorption device 77d returns to the initial position shown in Fig. 26(A) through the lower side of the substrate P as shown in Fig. 27(B). (Position on the -X side of the substrate P). As shown in Fig. 27(C), the processing after the above-described Fig. 26(B) is repeated. According to the first modification, the structure and control of the substrate carrying-out device 70e can be made simpler.

Further, in the substrate stage 20f of the sixth embodiment, the substrate carrying device 70d is disposed on both sides (+Y side and -Y side) of the substrate holder 30e, but as shown in Fig. 28 (hereinafter referred to as In the second modification, the substrate unloading device 70f is disposed only on one side (+Y side or -Y side) of the substrate holder 30e. In this case, in order to adsorb and hold the substrate P with a stronger adsorption holding force, it is preferable to set the adsorption holding surface of the adsorption pad of the adsorption device 77f to the adsorption device 77a of the third to sixth embodiments. For example, refer to FIG. 12). Further, in this case, the adsorption device 77f can be moved in the Y-axis direction with respect to the X traveling guide 71 as in the sixth embodiment, and can be moved from the X traveling guide 71 to the substrate holder as in the first modification. The 30e side is fixed in a state of being protruded.

Further, in the substrate carrying device according to the third to sixth embodiments, the adsorption pad can be driven in the Z-axis direction or the Y-axis direction in the Z-axis direction or the Y-axis direction, and is located at a position below the substrate P. However, the present invention is not limited thereto. As shown in FIGS. 29(A) to 30(B) (hereinafter referred to as a third modification), the substrate P is moved relative to the adsorption device 77g. As shown in Fig. 29(A), the substrate unloading device 70g is disposed on the +Y side of the substrate holder 30e (the adsorption device 77g cannot move in the Y-axis direction). Further, on the -Y side of the substrate holder 30e, for example, two positioning devices 17a are disposed apart from each other in the X-axis direction, and are +Y in the substrate holder 30e. The side is provided with, for example, one positioning device 17b. Each of the plurality of positioning devices 17a and 17b is mounted on the Y coarse movement stage 23Y (see FIG. 11) via a support member (not shown), and is disposed at substantially the same Z position as the substrate P (hence, does not follow the X travel guide). 71 contradicts). The positioning devices 17a and 17b have actuators such as cylinders, and press the ends of the substrate P to control the position of the substrate P.

In the third modification, in a state in which the exposed substrate P is suspended and supported by the plurality of guides 48b, as shown in FIG. 29(B), for example, the substrate P is driven to +Y by two positioning devices 17a. direction. At this time, excessive movement of the substrate P by the inertia in the +Y direction is prevented by the movement preventing pin 17c and the positioning device 17b attached to the adsorption device 77g. Further, on the upper surface of the substrate holder 30e, a plurality of notches 17d for preventing contact with the positioning device 17a are formed. When the substrate P is positioned at a position where the adsorption device 77g can be adsorbed and held by the substrate P, as shown in Fig. 30(A), the positioning devices 17a, 17b are withdrawn from the substrate P, and thereafter, as shown in Fig. 30(B) It is shown that the substrate P is adsorbed and held by the adsorption device 77g, and is carried out from the substrate holder 30e. In the third modification, since the base substrate P moves relative to the substrate unloading device 70g, the amount of protrusion of the substrate P from the substrate holder 30e can be reduced in advance.

"Seventh Embodiment"

Next, a seventh embodiment will be described with reference to Figs. 31 to 41. In the substrate stages 20a to 20f of the first to sixth embodiments, the Y coarse movement stage 23Y is mounted on the X coarse movement stage 23X, but the liquid crystal exposure apparatus of the seventh embodiment shown in FIG. The difference between the substrate stage 120a of 100 is that the X coarse movement stage 123X is not mounted on the Y coarse motion stage 123Y (the upper coarse movement stage moves in the scanning direction). Moreover, the substrate unloading device 170 is provided in the Y coarse dynamic load Table 123Y (the coarse moving stage on the lower side). In the following, the seventh embodiment differs from the above-described first to sixth embodiments, and the first to sixth embodiments are provided with the same configuration and functional requirements as those of the first to sixth embodiments. The same reference numerals are given to the embodiments, and the description thereof is omitted.

In the seventh embodiment, as shown in FIG. 31, the apparatus main body 130 has a barrel stage 131, a pair of side columns 132, and a substrate stage 133. The barrel stage 131 is composed of a plate-like member disposed in parallel with the XY plane, and supports a projection optical system PL, a mask stage MST, and the like. The pair of side columns 132 are disposed apart from each other in the Y-axis direction, and support the vicinity of the end portion on the +Y side of the barrel stage 131 and the end portion on the -Y side, respectively, from below. The substrate stage 133 is composed of a member extending in the Y-axis direction. As is apparent from FIG. 32 and FIG. 33, for example, two are provided in the X-axis direction. Referring back to Fig. 31, the side column 132 on the +Y side is mounted on, for example, the vicinity of the +Y side end portion of the two substrate stage gantry 133, and the side column 132 on the -Y side is mounted on, for example, two substrate stage 133. -Y side near the end. The substrate stage 133 is provided on the clean room floor 11 and the vibration isolating device 134 is supported from the lower side in the vicinity of the end portion in the longitudinal direction. Accordingly, the apparatus body 130 (and the projection optical system PL, the mask stage MST, and the like) are separated from the ground 11 by vibration.

As shown in FIG. 33, the substrate stage device 200 includes a pair of bases 114, an auxiliary base 115, and a substrate stage 120a.

One base 114 is on the +X side of the substrate stage 133 on the +X side, the other base 114 is on the -X side of the substrate stage 133 on the -X side, and the auxiliary base 115 is on the pair of substrate stages 133. Each of the substrates is placed at a predetermined distance (in a non-contact state) with the substrate stage 133. a pair of bases 114 Each of the auxiliary bases 115 is formed of a plate-like member extending in the Y-axis direction and parallel to the YZ plane, and is disposed on the floor 11 so as to be capable of adjusting the height position (Z position) by a plurality of adjusting devices. As shown in FIG. 32, the upper end faces (+Z side end portions) of the pair of bases 114 and the auxiliary base 115 are fixed with a mechanical Y linear guide device (single-axis guide device) extending in the Y-axis direction. Y linear guide 116a.

Referring back to Fig. 31, the substrate stage 120a has a Y coarse movement stage 123Y, an X coarse movement stage 123X, a fine movement stage 21, a substrate holder 30b, a plurality of substrate lifting devices 46b, a Y stepping platform 150, and weight elimination. The device 26 and the substrate unloading device 170.

The Y coarse movement stage 123Y is mounted on the pair of bases 114 and the auxiliary base 115 as shown in FIG. The Y coarse movement stage 123Y has a pair of X beams 125 as shown in FIG. Each of the pair of X-beams 125 is formed of a member having a rectangular shape in a YZ cross section extending in the X-axis direction, and is disposed in parallel with each other at a predetermined interval in the Y-axis direction. The pair of X-beams 125 are connected to each other by the Y bracket 126 at the vicinity of the +X side and the -X side end, respectively. The Y bracket 126 is composed of a plate-like member extending in the Y-axis direction and parallel to the XY plane, and a pair of X-beams 125 are mounted on the upper surface thereof. Further, as shown in Fig. 33, the pair of X-beams 125 are connected to the auxiliary bracket 126a at the center in the longitudinal direction.

Further, as is apparent from FIGS. 31 and 33, a plurality of Y sliders 116b constituting the Y linear guide 116 together with the Y linear guide 116a are fixed to the lower surface of the Y bracket 126 and the lower surface of the auxiliary bracket 126a ( In Fig. 33, the paper surface overlaps in the depth direction. The Y slider 116b is slidably engaged with the corresponding Y linear guide 116a with low friction and the Y coarse motion stage 123Y with low friction Moreover, it is possible to move on the pair of bases 114 and the auxiliary base 115 in the Y-axis direction with a predetermined stroke. The Z position of the lower side of the pair of X beams 125 is set to be more +Z side than the upper surface of the pair of substrate stages 133, and the Y coarse movement stage 123Y and the pair of substrate stage stages 133 (that is, the apparatus body 130) are Separated on vibration.

As shown in Fig. 32, the Y coarse movement stage 123Y is driven by the pair of Y feed screw units 117 in the Y-axis direction. The pair of Y feed screw devices 117 respectively include a screw shaft 117a that is rotationally driven by a motor attached to the outer side surface of the base 114, and a nut 117b having a plurality of circulating balls (not shown) mounted on the Y bracket 126. . Needless to say, the type of the Y actuator for driving the Y coarse movement stage 123Y (the pair of X beams 125) in the Y-axis direction is not limited to the above-described ball screw device, and may be, for example, a linear motor or a belt drive device. Further, a Y actuator of the same configuration (or another type) as the above-described Y feed screw device 117 may be disposed in the auxiliary base 115. Further, the Y feed screw device 117 may be one.

On the upper side of each of the pair of X-beams 125, as shown in FIG. 34, a single-axis guiding device extending in the X-axis direction is fixed to the X-beam 125 at a predetermined interval in the Y-axis direction, for example, in parallel with each other. The X linear guide 127a of the element. Further, in a region between the pair of X linear guides 127a on the upper surface of each of the pair of X-beams 125, a magnet unit 128a (X stator) including a plurality of permanent magnets arranged at a predetermined interval in the X-axis direction is fixed.

The X coarse movement stage 123X is formed of a rectangular plate-like member in plan view, and an opening portion is formed in a central portion thereof. Below the X coarse movement stage 123X, an X slider 127b constituting the X linear guide 127 together with the X linear guide 127a is fixed. X slider 127b is for an X linear guide 127a, at X The axial direction is provided, for example, at a predetermined interval (see FIG. 33). The X slider 127b is engaged with the corresponding X linear guide 127a with low friction and slidably, and the X coarse movement stage 123X is movable on the pair of X beams 125 with a low friction in the X-axis direction for a predetermined stroke. Further, on the lower surface of the X coarse movement stage 123X, the pair of magnet units 128a are fixed to each other with a predetermined gap therebetween, and are formed together with the pair of magnet units 128a for driving the X-movement in a predetermined stroke in the X-axis direction. One of the stages is a pair of coil units 128b (X moveable) of the X linear motor 128.

The X coarse movement stage 123X is restricted by the X linear guide 127 from moving in the Y-axis direction with respect to the Y coarse movement stage 123Y, and moves integrally with the Y coarse movement stage 123Y in the Y-axis direction. That is, the X coarse motion stage 123X and the Y coarse movement stage 123Y constitute a gantry type two-axis stage apparatus. The Y position information of the Y coarse movement stage 123Y and the X position information of the X coarse motion stage 123X are respectively obtained by a linear encoder system (not shown). Further, the configuration of the fine movement stage 21 (including the drive system and the measurement system) is the same as that of the first embodiment as shown in FIGS. 33 and 34 (including a fine movement stage including a plurality of voice coil motors 29x, 29y, and 29z). The drive system and the substrate interferometer system using the X moving mirror 22x and the Y moving mirror 22y are omitted here.

Further, the configuration of the substrate holder 30b is substantially the same as that of the second embodiment described above, and thus the description thereof is omitted here. Further, in the seventh embodiment, the X-groove 31b ₁ is opened at both ends of the substrate holder 30b, but may not be opened. Further, the configuration of the plurality of substrate jacking devices 46b is substantially the same as that of the second embodiment described above, and thus the description thereof is omitted here. However, in the seventh embodiment, as shown in FIG. 33, the substrate jacking device 46b is disposed at a predetermined interval in the X-axis direction (for example, four), and the guide 48b, as shown in FIG. 32, corresponds to one X. The tank 31b ₁ accommodates, for example, four units (for example, 16 units in total).

As shown in FIG. 32, the Y stepping platform 150 is formed of a member having a rectangular YZ section extending in the X-axis direction, and is inserted into a pair of X-beams 125 in a state of being separated from the pair of X-beams 125 by a predetermined distance (in a non-contact state). between. The longitudinal direction dimension of the Y stepping stage 150 is set to be slightly longer than the movement stroke of the fine movement stage 21 in the X-axis direction. The upper surface of the Y stepping platform 150 is processed to have a very high degree of flatness. The Y stepping platform 150, as shown in FIG. 34, is formed by a plurality of Y linear guides 135a fixed to the upper surface of each of the pair of substrate stages 133 and a plurality of Y-slips fixed under the Y stepping platform 150. The plurality of Y linear guides 135 formed by the member 135b are guided in the Y-axis direction by a predetermined stroke on the pair of substrate stages 133.

The Y stepping platform 150, as shown in FIG. 32, is mechanically coupled to a pair of X-beams 125 through a pair of devices called flexure devices 151 near the ends of the +X side and the -X side, respectively. . Accordingly, the Y stepping stage 150 and the Y coarse movement stage 123Y move integrally in the Y-axis direction. The flexure device 151 includes, for example, a strip-shaped steel plate having a thin thickness disposed in parallel with the XY plane, and a hinge device (for example, a ball joint or a hinge device) provided at both ends of the steel plate, the steel plate being erected in the Y step by the hinge device Between platform 150 and X beam 125. Therefore, the flexure device 151 has lower rigidity than the other five degrees of freedom directions (X, Z, θ x, θ y, and θ z directions) in the Y-axis direction, and the Y stepping platform in the above 5-DOF direction. The 150 and Y coarse motion stage 123Y are separated by vibration. In addition, the Y position of the Y stepping platform 150 can also use, for example, a linear motor. The actuator of the feed screw device or the like is independently controlled separately from the Y coarse movement stage 123Y.

The configuration of the weight eliminating device 26 (including the leveling device 27) is substantially the same as that of the above-described first embodiment, and thus the description thereof is omitted here. However, in the seventh embodiment, as shown in FIG. 34, the weight eliminating device 26 is mounted on the Y stepping platform 150 in a non-contact state by passing through a plurality of air bearings 26a attached to the lower surface thereof. The dimension in the axial direction is shorter than that of the first embodiment described above. The weight eliminating device 26 is mechanically coupled to the X coarse movement stage 123X through a plurality of bending devices 26b, and moves on the Y stepping stage 150 when moving integrally with the X coarse movement stage 123X in the X-axis direction. On the other hand, when the weight canceling device 26 moves integrally with the X coarse motion stage 123X in the Y-axis direction, the weight canceling device 26 moves integrally with the Y coarse motion stage 123Y and the Y stepping stage 150 in the Y-axis direction, so that no The situation in which the Y stepping platform 150 is detached.

The substrate carrying device 170 carries out the substrate P loaded on the substrate holder 30b toward the outside of the substrate stage device 200 (in the present embodiment, the substrate guiding device 62 (see FIG. 35) of the crotch portion 60 to be described later). The device is mounted on the outer side (facing the +Y side) of the X beam 125 on the +Y side of the pair of X-beams 125. The substrate unloading device 170 has a suction pad 171 that adsorbs and holds the lower surface of the substrate P to be carried out, a support member 172 that supports the adsorption pad, and a pair of X linear guides that guide the support member 172 (and the adsorption pad 171) in the X-axis direction. 173. An X linear motor 174 for driving the support member 172 (and the adsorption pad 171) in the X-axis direction. FIG. 34 is a cross-sectional view taken along line E-E of FIG. 33, and is a view showing the configuration of the substrate unloading device 170. The pad 171 and the support member 172 are in the state of the -X side stroke terminal.

As shown in FIG. 34, the adsorption pad 171 is composed of a member having an inverted L shape in a YZ cross section, and a portion parallel to the XY plane, as shown in FIG. 32, is a rectangular plate member having a rectangular shape in the longitudinal direction of the X-axis direction. Composition. The adsorption pad 171 is connected to a vacuum device (not shown) provided outside, and the upper surface of the portion parallel to the XY plane has a function of adsorbing a surface as a substrate. As shown in FIG. 33, the support member 172 is composed of a plate-like member extending in the Z-axis direction and parallel to the XZ plane, and an adsorption pad 171 is attached to the upper end portion (+Z-side end portion). The support member 172 has a structure in which the rigidity in the X-axis direction is higher than the rigidity in the Y-axis direction. The support member 172 is formed such that the portion on the +Z side is slightly curved toward the +X side from the central portion in the Z-axis direction, and the upper end portion protrudes from the lower end portion (the -Z-side end portion) on the +X side (that is, the crotch portion 60 (Fig. 33 is not shown. Refer to Figure 35) side). Further, between the support member 172 and the substrate holder 30b, as shown in FIG. 34, the substrate holder 30b is micro-driven with respect to the X coarse movement stage 123X in a state where the support member 172 is adjacent to the substrate holder 30b. In the case of the Y-axis direction and/or the θ z direction, there is no gap in contact with each other.

Here, the adsorption pad 171 is disposed such that the end portion on the -Y side protrudes from the surface of the support member 172 toward the -Y side on the -Y side by connecting the end portion on the +Y side to the support member 172 (substrate) The holder 39b side) has a Y position on the -Y side end portion on the -Y side from the +Y side end portion of the substrate holder 30b. That is, when the substrate stage 120a is viewed from the +Z side, the adsorption pad 171 is positioned above the substrate holder 30b (overlapped in the Z-axis direction) depending on the X position of the substrate holder 30b. Further, the adsorption pad 171 is supported by the member 172 The Z position supported below is located higher than the Z position above the substrate holder 30b (since the Z position of the substrate holder 30b varies within a small range, for example, the substrate holder 30b is positioned in the Z-axis direction In the state of the neutral position, it is located higher than the Z position above the substrate holder 30b). According to this, the adsorption pad 171 can be inserted between the substrate P and the substrate holder 30b while the substrate P is driven by the plurality of substrate lifting devices 46b and raised (uplifted) from the upper surface of the substrate holder 30b.

One side of the lower end portion of the support member 172 is opposite to the outer side of the X beam 125 on the +Y side. On the other hand, on the outer side surface of the X beam 125 on the +Y side, as shown in FIG. 33, for example, two (one pair) X linear guides 173a extending in the X-axis direction are fixed at predetermined intervals in the Z-axis direction. The length of the pair of X linear guides 173a (the size in the X-axis direction) is set to be substantially half of the X-beam 125 (or the same extent as the length of the substrate P in the X-axis direction), and is disposed on the X-axis of the X-beam 125 The central portion of the direction is further +X side (the side of the crotch portion 60 (not shown in Fig. 33, see Fig. 35)). Further, on one surface of the support member 172 (opposite to the X-beam 125), a pair of X linear guides 173a are fixed at predetermined intervals in the X-axis direction with rolling elements (for example, circulating balls) (not shown). For example, two X sliders 173b of the X linear guide 173a are mechanically slidably engaged. The X linear guide 173a and the corresponding X sliders 173b corresponding to the X linear guide 173a constitute an X linear guide for guiding the support member 172 (and the adsorption pad 171) in the X-axis direction. 173.

Further, between the pair of X linear guides 173a, a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction is fixed 174a. On the other hand, on one surface of the support member 172 (opposite to the X-beam 125), the coil unit 174b including the coil is fixed to the magnet unit 174a at a predetermined interval. The magnet unit 174a (X stator) and the coil unit 174b (X mover) corresponding to the magnet unit 174a constitute an X linear motor for driving the support member 172 (and the adsorption pad 171) in the X-axis direction. 174. Further, the actuator for driving the support member 172 (and the adsorption pad 171) in the X-axis direction is not limited thereto, and for example, a ball screw (feed screw) device or a rope (or a belt) may be used. Traction devices, etc., other single-axis actuators. Further, a stopper 175 of a movable range of the predetermined support member 172 is fixed to the outer side surface of the X beam 125 on the +Y side and the both end portions of the magnet unit 174a.

In the substrate stage 120a, when the substrate P is carried out, a plurality of Z actuators 47 are controlled so that the Z position on the upper surface of each of the guides 48b of the plurality of substrate lifting devices 46b is higher than the upper surface of the substrate holder 30b. Located on the +Z side. Then, in the substrate carrying-out device 170, the suction pad 171 is sucked and held on the lower side of the -X side and the +Y-side end (corner portion) of the substrate P. In this state, the support member 172 is driven by the X linear motor 174 to make the substrate. P moves on the substrate holder 30b in the +X direction and carries it out to the crotch portion 60. At this time, pressurized gas is ejected from the plurality of guides 48b to the lower surface of the substrate P to suspend the support substrate P. According to this, the substrate P moves on the substrate holder 30b with low friction.

Here, in the substrate unloading device 170, as shown in FIG. 33, the shape (bending amount) of the support member 172 is set to the X position of the adsorption pad 171 when the support member 172 is positioned at the stroke end on the +X side. X coarse motion stage 123X The substrate holder 30b is located on the +X side at the +X side. According to this, during the exposure processing of the substrate P or the like, the adsorption pad 171 can be retracted to the outside of the movable range of the X coarse motion stage 123X. Further, in the present embodiment, the intermediate portion of the support member 172 is curved. However, the shape of the support member 172 is not limited to this as long as the suction pad 171 can be retracted to the outside of the movable range of the substrate holder 30b in the X-axis direction. .

The configuration of the substrate carrying device 80c and the crotch portion 60 (including the substrate guiding device 62) shown in Fig. 35 is the same as that of the above-described third embodiment, and thus the description thereof is omitted here.

Hereinafter, the liquid crystal substrate exposure apparatus 100 of the holder 30b of the substrate P (for convenience, will be referred to as the substrate a plurality of substrates P P _1, P ₂ of the substrate, the substrate _{P. 3)} the replacement operation, using FIGS. 36 (A ) ~ Figure 41 (B) is explained. The following substrate replacement operation is performed under the management of a main control device (not shown). In addition, in FIGS. 36(A) to 41(B), for the sake of easy understanding, the substrate holder 30b is shown in a cross-sectional view, and a part of the substrate stage 120a including a plurality of voice coil motors and the like is omitted.

FIG 36 (A), the substrate stage 120a of the substrate holder 30b holds the substrate P _1. Further, the loading arm 83 holds the substrate P ₂ (the next substrate P ₂ ) of the next predetermined holding substrate holder 30b after the substrate P _{1 is carried} out from the substrate holder 30b.

Main control means in the setting in the plurality of shot areas on the _substrate P, the exposure process is ended after the last one shot area, FIG. 36 (B), the control substrate so that the position of the mobile station 120a from the end of exposure To the substrate replacement position. During the exposure process described above, the support member 172 of the substrate unloading device 170 is positioned at the stroke end on the +X side, and the adsorption pad 171 is retracted to the outside of the movable range of the substrate P in the X-axis direction. Accordingly, the substrate P ₁ is unloaded and the X coarse movement stage 123X (substrate holder and 30b) to move the X-axis direction, the substrate P ₁ and 171 will not contact with the suction pads. Further, in parallel with this, the loading arm 83 is driven in the -X direction, whereby the substrate P ₂ is positioned above the substrate replacement position. Further, in the crotch portion 60, the substrate guiding device 62 is driven in a direction approaching the substrate stage 120a.

When the substrate stage 120a reaches the substrate exchange position, i.e., the main control apparatus shown in Figure 37 (A), releasing the substrate holder 30b of the substrate P is attracted and held _a plurality of substrates jacking control means 46b, 48b guide the drive rise. Accordingly, the substrate P below the substrate _holding i.e. the gap is formed between the upper tool 30b. Next, FIG. 37 (B), the substrate supporting device 170 of the unloading member 172 driven in the -X direction, whereby the suction pads 171 that is a gap between the holder 30b through the upper substrate below the substrate ₁ of P, located on the -X side of the substrate P ₁ + and below the vicinity of the end portion (corner portion) Y side of. Thereafter, a plurality of driven guide 48b drops, i.e. the substrate P below the suction pad 171 ₁ sucked and held. And, a plurality of guide member 48b of the substrate P below the _ejection of pressurized gas to the suspension support substrate P _1. At this time, the plurality of guides 48b of the substrate stage 120a and the plurality of guides 65 of the crotch portion 60 are controlled such that the upper Z positions are substantially identical to each other.

Thereafter, as shown in FIG. 38(A), the supporting member 172 of the substrate carrying-out device 170 is driven in the +X direction, and thus, the substrate P ₁ adsorbed and held by the adsorption pad 171 is held. That is, the surface (guide surface) parallel to the XY plane formed by the plurality of guides 48b and the plurality of guides 65 is moved in the +X direction, and is carried out from the substrate holder 30b to the flange portion 60. In this case, also the substrate ₁ P discharged from the pressurized gas above a plurality of guides 65. According to this, the substrate P _{1 can be} moved at a high speed and with low dust.

₁ when the substrate P from the substrate holder 30b when turned over onto a plurality of guides 65, FIG. 38 (B), the suction pads 171 is released to the substrate P is stopped and the suction _holding of the pressurized gas from the plurality of guide The ejection of piece 65. According to this, the substrate P ₁ Is mounted on a plurality of guide member 65, then the substrate P supported by the substrate 62 of the guiding device ₁ is driven in the + X direction. Further, as long as the substrate carry-out device 170 can transfer to the substrate P ₁ is located on FIG. 38 (B), the position of the substrate guide means 62, it is not necessary to guide the substrate 62 moves the substrate stage 120a to the advance side (may be Unable to move). Further, on the substrate stage 120a, a plurality of driven guide member 48b rises, the pressing from below the substrate P ₂ below. The loading arm 83, releasing the substrate P held suction _2, whereby the substrate P ₂ i.e. away from the loading arm 83. Further, the loading arm 83 may be lowered to transfer the substrate P ₂ to the plurality of guides 48b.

When the substrate P _{2 is} separated from the loading arm 83, as shown in FIG. 39(A), the loading arm 83 is driven in the +X direction to exit from the substrate replacement position and return to the position above the substrate guiding device 62. Further, in the crotch portion 60, the plurality of guides 65 are driven to slightly lower. Next, FIG. 39 (B), the substrate stage 120a, a plurality of driven guide 48b drops, P ₂ is loaded to the substrate on the substrate holder with 30b. Further, in the port portion 60, transfer of the substrate carry-out robot arm 19 is inserted beneath the substrate P _1.

Then, as shown in FIG. 40(A), the substrate P ₂ is adsorbed and held by the substrate holder 30b, and the X coarse movement stage 123X is driven to the top portion in order to perform an alignment operation, an exposure operation, and the like on the substrate P ₂ . 60 leaves the direction. Further, in the port portion 60 to the substrate carry-out robot 19 of the transfer arm 60 from the recovery port portion of the substrate P _1, is conveyed to the external apparatus (not shown). Further, a plurality of guides 65 are driven to rise. The transfer arm 18 of the substrate loading robot holds the substrate P ₃ .

Thereafter, as shown in FIG 40 (B), the substrate carrying robot arm 18 of the transfer substrate conveyed to the P ₃ over a plurality of guide member 65, FIG. 41 (A), the substrate to the plurality of P ₃ Guide 65. Thereafter, as shown in Fig. 41 (B), the plurality of guides 65 are driven to descend, and the plate P _{3 is} loaded on the loading arm 83 (returning to the state shown in Fig. 36 (A)). At this time, the position alignment (alignment) of the loading arm 83 may be performed in a state where the substrate P _{3 is} suspended on the plurality of guides 65. The alignment is performed by, for example, detecting the end (edge) position of the substrate P ₃ by an edge sensor or a camera while pressing the end portions of the substrate P ₃ .

As described above, according to the seventh embodiment, since the substrate unloading device 170 is mounted on the substrate stage 120a and is in the stationary state of the Y coarse movement stage 123Y during the scanning operation, the X coarse movement stage is not affected. The position control of the 123X can control the X position of the substrate P with high precision during the scanning operation. In addition, the substrate stage 120a has a structure in which the X coarse movement stage 123X and the fine movement stage 21 are mounted on the Y coarse movement stage 123Y having the substrate carrying device 170 (the Y coarse movement stage 123Y is in the lowermost structure). Therefore, the maintenance of the substrate unloading device 170 is also easy. Further, since the substrate unloading device 170 moves the adsorption pad 171 (and the support member 172) only in the X-axis (uniaxial) direction, the configuration and control are simple, and the cost is low, for example, compared with the multi-joint robot. Further, the substrate unloading device 170 can retract the adsorption pad 171 to the outside of the movable range of the substrate P in the X-axis direction, and therefore even the adsorption pad 171 The height position (Z position) of the substrate P (or the substrate holder 30b) is the same, and it is also possible to prevent contact with each other.

Further, since the substrate substrate 120a has the substrate unloading device 170, only the substrate loading device 80c for transporting the substrate P to the substrate stage 120a needs to be disposed in the flange portion 60. In other words, in the seventh embodiment, when the substrate is held by the substrate stage 120a, the loading arm 83 of the substrate loading device 80c is located above the substrate stage 120a at the substrate replacement position. As shown in FIG. 34, the substrate holder 30b and the barrel stage 131 are provided as shown in FIG. 34, in comparison with the case where the substrate replacement device having the substrate carrying-out robot arm and the substrate loading robot is provided in the flange portion 60. When the space between the spaces is narrow, the replacement operation of the substrate P can be easily performed.

Further, since the substrate substrate 120a has the substrate unloading device 170, the substrate carrying operation from the substrate stage 120a can be performed regardless of the position (X position, and/or Y position) of the substrate stage 120a. Therefore, similarly to the third embodiment, after the exposure of the final irradiation region is completed and before the substrate stage 120a reaches the substrate replacement position (including the movement of the substrate stage 120a), the substrate P is ejected. Further, in the crotch portion 60, the guide surface of the substrate P formed of the plurality of guides 65 is set to be wider than the substrate P. Therefore, it is not necessary to strictly perform the substrate stage 120a and the substrate guiding device 62 in the Y-axis direction. Position alignment (the carry-out operation can be started when the substrate holder 30b is moved obliquely with respect to the X-axis). Therefore, the cycle time for substrate replacement can be shortened.

Further, in the substrate jacking device 46b, since the Z actuator 47 for moving the guide 48b up and down is mounted on the X coarse movement stage 123X, When the Z-actuator is mounted in the fine movement stage 21 (or the substrate holder 30b), the fine movement stage 21 can be made thinner and lighter, and a Z actuator having a long stroke in the Z-axis direction can be used. The guide 48b can be driven with a long stroke.

"Eighth Embodiment"

Next, the eighth embodiment will be described with reference to Figs. 42 to 45. The substrate stage 120b of the eighth embodiment differs from the seventh embodiment in the configuration of the substrate holder 30a, the substrate lifting device 46a (not shown in FIG. 42, see FIG. 43), and the substrate carrying device 270. In the following, the components having the same configurations and functions as those in the seventh embodiment are denoted by the same reference numerals as in the seventh embodiment (or the same as the last), and the description thereof will be omitted.

As shown in FIG. 42, the substrate holder 30a of the substrate stage 120b of the eighth embodiment has the same number of holes 31a for the top pin 48a and the notch 133 which will be described later, and the first embodiment. Since the form is the same, the substrate holder 30a of the first embodiment will be denoted by the same reference numerals, and the description thereof will be omitted. Further, as is clear from Figs. 42 and 43, in the eighth embodiment, the number of the substrate jacking devices 46a is six in total.

The substrate stage 120b has a substrate slide device 180 for sliding the substrate P mounted on the substrate holder 30a in the Y-axis direction with respect to the substrate holder 30a. As shown in FIG. 42, the substrate slide device 180 is disposed, for example, at a predetermined interval in the X-axis direction. However, the number and arrangement of the substrate slide devices 180 are not limited thereto, and may of course be appropriately changed.

In the substrate holder 30a, as shown in FIG. 43, a notch 133 is formed at a position corresponding to the substrate slide device 180. The notch 133 is formed to open on the upper surface side of the substrate holder 30a and the side surface side on the -Y side.

The substrate slide device 180 includes a base 181, a Y linear guide 182, a Y slider 183, and a pressing pin 184. The base 181 is formed of a flat member extending in a rectangular shape in a plan view in the Y-axis direction, and the end side of the +Y side is inserted into the notch 133, and the end side of the -Y side is from the -Y side end of the substrate holder 30a. -Y side (outside) protruding. The lower surface of the base 181 is fixed to the substrate holder 30a. The Y linear guide 182 is fixed to the base 181. The Y slider 183 is slidably mechanically engaged with the Y linear guide 182. The pressing pin 184 is composed of a cylindrical member extending in the Z-axis direction, and is fixed to the Y slider 183. The Z position of the +Z side end portion of the pressing pin 184 is set to be located on the +Z side from the upper surface of the substrate holder 30a. The substrate slide device 180 has a Y actuator (not shown) for driving the press pin 184 in the Y-axis direction, and the press pin 184 is driven to the outside of the substrate holder 30a shown in FIG. The position and a portion shown in Fig. 45 are accommodated between the positions in the notch 133.

The substrate carrying-out device 270 is attached to the support member 172 of the X-beam 125 on the +Y side by the pair of X linear guides 173, and is driven by the X linear motor 174 in the X-axis direction with a predetermined stroke, similarly to the seventh embodiment. . As shown in FIG. 34, the adsorption pad 271 of the seventh embodiment is formed such that the YZ cross section is inverted L-shaped, and the substrate adsorption surface protrudes from the -Y side of the support member 172 on the -Y side, and the Y position and the substrate. In contrast, as shown in FIG. 42 and FIG. 43, the substrate adsorption surface of the adsorption pad 271 of the eighth embodiment is disposed on the outer side (+Y side) of the substrate holder 30a, and is held on the substrate. When the substrate P is loaded with the substrate P, it moves in the X-axis direction and does not contact the substrate P. In addition, above the adsorption pad 271 The Z position of the surface (adsorption surface) is set to be slightly on the -Z side (lower side) than the upper surface (substrate loading surface) of the substrate holder 30a.

Further, in the seventh embodiment, as shown in FIG. 32, when the substrate P is exposed to light, the adsorption pad 271 is outside the movable range of the substrate P (substrate holder 30b) in the X-axis direction (specifically On the other hand, in the eighth embodiment, as shown in FIG. 42, even when the substrate P is exposed, the adsorption pad 271 is disposed on the substrate holder 30a. Within the range of movement. Even in this case, the substrate P and the adsorption pad 271 are not in contact when the substrate P (and the substrate holder 30a) is moved in the X-axis direction (see FIG. 43). Further, the pressing pin 184 of the substrate sliding device 180 is located at the stroke end of the -Y side to avoid contact with the substrate P.

As shown in FIG. 45, the substrate P is carried out on the substrate stage 120b, and the pressurized gas is discharged from the substrate holder 30a to the lower surface of the substrate P to suspend the substrate P. On the substrate stage 120b, the pressing pin 184 of the substrate slide device 180 is driven to the +Y side, whereby the +Y side end portion of the substrate P protrudes from the +Y side end portion of the substrate holder 30a on the +Y side. the amount. Next, the fine movement stage 21 and the substrate holder 30a are lowered by the Z voice coil motor 29z (or by the pressure reduction in the air spring (not shown) included in the weight eliminating device 26). As a result, the substrate P is lowered in a state of being suspended on the substrate holder 30a, and the +Y side and the -X side end portion are adsorbed and held by the adsorption pad 27 previously positioned below the substrate P. Further, in the eighth embodiment, the substrate lifting device 46a is not used for carrying out the substrate P only when the substrate P is received from the substrate loading device 80c (not shown in Fig. 45. See Fig. 35).

Thereafter, as shown in FIG. 44, the adsorption pad 271 is driven in the +X direction. The substrate P is carried out to the crotch portion 60 along the upper surface of the substrate holder 30a (not shown in FIG. 44. See FIG. 35).

In the eighth embodiment described above, since the adsorption pad 271 does not have to wait outside the movable range of the substrate P in the X-axis direction, the substrate P can be quickly ejected after the exposure process is completed. Therefore, the cycle time for substrate replacement can be shortened. In the eighth embodiment, the substrate holder P is brought into contact with the adsorption pad 271 to drive the substrate holder 30a to be lowered. However, the present invention is not limited thereto, and the substrate carrying device 270 may be provided with the adsorption pad 271. The driving device that is driven in the up and down direction drives the adsorption pad 271 to bring the substrate P into contact with the adsorption pad 271. Further, the substrate slide device 180 may be provided on the fine movement stage 21 or the X coarse motion stage 123X.

Further, the configurations of the seventh and eighth embodiments described above can be appropriately changed. For example, in the seventh embodiment, as shown in FIG. 34, the adsorption pad 171 of the substrate unloading device 170 is arranged in advance so as to protrude from the support member 172 on the substrate holder 30b side so that the substrate P and the substrate holder 30b can be inserted. between. However, in the same manner as the substrate stage 120c of the fourth modification shown in FIG. 46, the Y driving device 375 that drives the adsorption pad 371 in the Y-axis direction is mounted on the support member 172, and the substrate P is exposed. The adsorption pad 371 is ejected from the substrate P at the same time and is inserted between the substrate P and the substrate holder 30b only when the substrate P is carried out. In the seventh embodiment, when the substrate P is sent to the crotch portion, as shown in Fig. 37(B), after the substrate P is separated from the upper surface of the substrate holder 30b, the adsorption pad 171 must be held by the substrate P and the substrate. Moved between 30b and moved to the position where the substrate P can be adsorbed, but In the substrate carrying-out apparatus 370 shown in FIG. 46, the adsorption pad 371 can be moved to a position on the -X side of the substrate P and the vicinity of the +Y-side end portion in a state where the substrate P is placed on the substrate holder 30b. Therefore, the time required for the substrate to be carried out can be shortened.

Further, the configuration of the substrate jacking device for lifting the substrate P from the substrate holder 30b is not limited to the above-described seventh embodiment. For example, as shown in FIG. 5 of the first embodiment of the deformation of the substrate board 47 a plurality of substrates from the top of the table 120d has means 140, respectively, housed in the base member 141 is provided within the groove 31b ₁ X, in the X-axis direction is mounted at a predetermined distance The plurality of (for example, six) porous members 142 on the base member 141 and the base member 141 are driven in the Z-axis direction (up and down) to the Z actuator 143 (not shown in FIG. 47. See FIG. 48 ( A)). The base member 141 is formed of a rod-shaped member extending in the X-axis direction, and the dimension in the longitudinal direction is set to be the same as the dimension of the substrate P (not shown in FIG. 47 (see FIG. 50(B)). In the fifth modification, it is slightly shorter).

As shown in FIG. 48(B), the substrate jacking device 140 is provided, for example, at a predetermined interval (interval between the plurality of X grooves 31b ₁ formed in the substrate holder 30b) in the Y-axis direction. Further, the present fifth modification of the substrate holder 30b holding -X side and the + X-side point end portion of the above-described seventh embodiment having the groove 30b of the X number of 31b _1, 31b ₁ and X slot opening in the substrate is not For the sake of convenience, the same reference numerals as in the seventh embodiment described above are used.

As shown in Fig. 48(A), the lower surface of the base member 141 is fixed to the leg portion 144 extending in the Z-axis direction in the vicinity of both end portions in the longitudinal direction of the base member 141. To the bottom surface of the predetermined X of the groove _{31b. 1,} the vertical direction is formed with a through hole through the substrate holder of 31b with 30b _2, leg portion 144 is inserted through the through hole 31b of each of the pair of _2. Between the wall surface for defining the X groove 31b ₁ and the base member 141, and between the wall surface for defining the through hole 31b ₂ and the leg portion 144, a micro-motion micro-motion stage is set on the opposite X coarse movement stage 123X. At 21 o'clock, there is no gap between them.

A pair of Z actuators 143 are fixed to the upper surface of the X coarse movement stage 123X and correspond to the pair of leg portions 144, respectively. The Z actuator 143 can use a cylinder or the like. A stay 145 composed of an L-shaped member is fixed in the vicinity of the Z actuator 143 on the X coarse movement stage 123X. The base member 141 functions as a Z linear guide formed by the Z linear guide 146 fixed to the leg portion 144 and the Z slider 147 mounted on the strut 145, as shown in Fig. 48(C). The X coarse motion stage 123X is guided straight in the Z-axis direction (up and down direction).

Here, the base member 141 is formed to be hollow as shown in FIG. 49(A), and a plurality of holes are formed on the upper surface. The porous member 142 (not shown in FIG. 49(A). See FIG. 47) is attached to block the plurality of holes. The base member 141 supplies pressurized gas from the outside of the substrate holder 30b (not shown in FIG. 49(A), see FIG. 47) through the line member 148, and passes through the plurality of holes and the porous member 142 to the substrate P. A pressurized gas is sprayed underneath. Further, as shown in FIG. 49(A), the line member 148 may be formed such that one leg portion 144 is hollow and communicates with the base member 141, and is connected to the one leg portion 144, as shown in FIG. 49(B). As shown, it is connected to one end of the base member 141 in the longitudinal direction. Further, the porous member 142 may not be attached to the base member 141. That is, the surface of the base member may not be an air bearing formed as a porous throttling, but Surface throttling or orifice throttling formed by machining of holes or grooves, or a composite throttled air bearing (integral forming process) combined.

As shown in FIG. 50(A), in the substrate stage 120d, the loading arm 83 of the substrate loading device 80c transports the substrate P to the substrate holder 30b (in the substrate P) while the driving base member 141 is raised. After being transported to the upper side of the substrate holder 30b, the drive base member 141 is raised, and then, as shown in FIG. 50(B), the drive load arm 83 is lowered and driven in the +X direction (the direction from which the substrate holder 30b is separated) (also The substrate P can be transferred to the substrate jacking device 140 without further driving of the lowering of the loading arm 83 to drive the base member 141 up. Thereafter, as shown in FIG. 50(C), the drive base member 141 is lowered, and the substrate P is placed on the upper surface of the substrate holder 30b. When the substrate P is carried out, as shown in FIG. 50(D), the drive base member 141 is raised, and the substrate P is discharged from the porous member 142 to the lower surface of the substrate P while the substrate P is separated from the upper surface of the substrate holder 30b. . Thereafter, the substrate P is carried out by the substrate unloading device 170 (not shown in FIG. 50(D). See FIG. 33 and the like).

According to the fifth modification, only one pressurized gas supply line needs to be connected to one base member 141. Therefore, the configuration of the apparatus is simple (in contrast, the seventh embodiment (see FIG. 34) must have a plurality of substrates. Each of the guides 48b of the jacking device 46b is individually connected to a line for supplying pressurized gas. Further, since it is not necessary to form a through hole in the fine movement stage 21, it is possible to prevent the rigidity of the fine movement stage 21 from being lowered. Further, even when the Z actuator 143 cannot be disposed below the fine movement stage 21 (for example, when the weight eliminating device 26 is large), it can be suitably used. Further, in the fifth modification, the base member 141 is separated from the X-axis direction. For example, the two Z actuators 143 are not limited thereto, and for example, the 2Z actuators 143 may drive all of the plurality of base members 141. Further, the substrate jacking device 140 according to the fifth modification can be applied to a substrate stage device that does not have a substrate carrying device (for example, when the substrate carrying device is disposed on the side of the crotch portion).

Further, in the fifth modification, as shown in the sixth modification shown in FIG. 51(A), the end portion of the base member 141 may be connected to the outer side (end side) of the leg portion 144. One end of the coil spring 149. The intermediate portion of the tension coil spring 149 is inserted into the through hole 31c formed in the substrate holder 30b, and the other end is connected to the support rod 145 (that is, the X coarse movement stage 123X). As a result, as shown in FIG. 51(B), when the drive base member 141 is raised, near the both end portions of the base member 141, the base portion 141 is adjacent to the joint portion of the leg portion 144, and the base is actuated. The moment at which the end of the member 141 is lowered downward. Thus, the deflection due to the self weight of the central portion in the longitudinal direction of the base member 141 can be suppressed.

Moreover, the configuration of the substrate unloading device 170 that carries out the substrate P from the substrate holder 30b can be appropriately changed. In Fig. 52, the substrate stage 120e of the seventh modification is shown. In the substrate stage 120e, the X beam 425 is narrower than the seventh embodiment (see FIG. 31 and the like) (the dimension in the height direction is longer than the width direction), and constitutes an X linear motor 128 for driving the X coarse movement stage 123X. The magnet unit 128a is fixed to both sides of the X beam 425. Further, a pair of X brackets 129 are fixed to the pair of X beams 425 below the X coarse movement stage 123X. The X bracket 129 is formed of a member having a YZ cross-section inverted U-shaped, and a corresponding X-beam 425 is inserted between the pair of opposing faces. The coil unit 128b is fixed to the opposite surface of the X bracket 129 opposite to the magnet unit 128a.

In the substrate carrying-out device 470, the supporting member 172 that supports the suction pad 171 includes a fixing portion 176b fixed to the Y-stacking stage 123Y, and a movable portion that is fixed to the lower end portion of the supporting member 172 and fixed to the fixing portion 176b. The X drive unit 176 of the 176a is driven in the X-axis direction with a predetermined stroke. On the substrate stage 120e, the Y bracket 126 and the auxiliary bracket 126a (not shown in FIG. 52) are connected to the +X side end portions of the pair of X beams 425, which are closer to the +Y side. The +Y side of the X beam 425 protrudes from the +Y side. The fixing portion 176a is formed of a member extending in the X-axis direction, and is stretched around the +Y side end portion of each of the Y bracket 126 and the auxiliary bracket 126a. Although not shown, the X driving unit 176 includes a member for driving the supporting member 172 in the X-axis direction with a predetermined stroke (for example, a stator and a movable member of the X linear motor, a guide and a slider for the X linear guiding device). ). As a result, in the same manner as in the seventh embodiment, the support member 172 is driven in the X-axis direction by a stroke equivalent to the length of the substrate P in the X-axis direction. Further, as in the substrate stage 120f of the eighth modification shown in FIG. 53, the fixing portion 176b of the X driving unit 176 of the substrate carrying-out device 570 may be fixed to the X bracket 129.

Further, in the substrate stages 120e and 120f, the substrate lifting device for separating the substrate P from the substrate holder 30b is omitted, and the substrate top of the seventh embodiment can be used. The device 46b (see FIG. 33), the substrate lifting device 46a (see FIG. 43) of the eighth embodiment, and the substrate lifting device 140 (see FIG. 48) of the fifth modification.

In addition, the configuration of the liquid crystal exposure apparatus is not limited to those described in the first to eighth embodiments (including the first to eighth modifications, the same applies hereinafter), and can be appropriately applied. change. For example, in the seventh and eighth embodiments (including the fourth to eighth modifications described above, the same applies hereinafter), each of the substrate unloading devices 170 to 570 is on the outer side of the X beam 125 on the +Y side (Y is coarse). One of the side surfaces of the stage 123Y is attached, but the number and arrangement of the substrate carrying out devices 170 to 570 are not limited thereto. For example, the outer side of the X beam on the +Y side may be arranged at a predetermined interval in the X-axis direction (for example, two). The support member 172 and the adsorption pad 171 are respectively held at a plurality of mutually different points in which the substrate P is separated in the X-axis direction. Further, the substrate carrying devices 170 to 570 may be additionally mounted on the X beam 125 on the -Y side, and the vicinity of the end portion on the -Y side may be held in the vicinity of the +Y side end portion of the substrate P (or only the Y side). Near the end).

Further, in the above-described third to eighth embodiments, only the substrate carrying devices 70a to 570 included in the substrate stages 20c to 120f are used to carry the substrate P out to the crotch portion 60, but may be parallel to the crotch portion, for example. In the state in which the substrate P is carried out from the substrate holders 30a and 30b by a predetermined amount (for example, one half of the above-described and eighth embodiments), the substrate P is held to carry out the substrate P. In this case, the stroke of the adsorption pads 77a ₁ to 371 on the substrate stage 20c to 120f side in the X-axis direction can be shortened.

Further, in the above-described third to eighth embodiments, the substrate P can be transferred (loaded in and out) between the substrate stages 20c to 120f and the crotch portion 60, for example, in the specification of U.S. Patent No. 6,559,928. The substrate support member that supports the substrate P from below is exposed. In this case, the substrate supporting members can be driven by the substrate carrying-out devices 70a to 570, and the substrate P can be carried out from the substrate stages 20c to 120f in the same manner as in the third to eighth embodiments. Further, the substrate unloading device 70a of the third to eighth embodiments described above Although the substrate P is held by vacuum adsorption, the substrate P is not limited thereto, and may be held by other means (for example, mechanical retention).

Further, in the above-described first to eighth embodiments, the plurality of substrate lifting devices 46a and 46b are disposed on the Y coarse movement stage 23Y or the X coarse movement stage 123X. However, the present invention is not limited thereto, and may be incorporated therein. The substrate holders 30a, 30b or the fine movement stage 21 are inside.

Further, in the substrate stage of the second and fourth to sixth embodiments (including the first to third modifications), the substrate lifting device of the fifth modification can be used instead of the plurality of substrate lifting devices 46b. 140. Further, in the substrate stage of the first and third embodiments, a plurality of the top pins 48a may be attached to the substrate lifting device 140 of the fifth modification instead of the plurality of substrate lifting devices 46a. The substrate lifting device of the base member 141.

Further, in the above-described first to eighth embodiments, the substrate P is adsorbed and held by the adsorption pad, but the device for holding the substrate P is not limited thereto, and may be, for example, a clamp device that mechanically holds the substrate P. . Further, in the above-described third to eighth embodiments, the device that drives the substrate is not limited to the Y-axis direction as in the case of the adsorption device, and for example, a roller that can abut against the outer peripheral surface of the substrate can be provided, and the roller can be provided. The rotation is based on sending the substrate out of the substrate holder.

Further, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Further, as the illumination light, for example, a single-wavelength laser light of an infrared band or a visible light band emitted from a DFB semiconductor laser or a fiber laser may be used, for example, an optical fiber amplifier doped with germanium (or both germanium and germanium). The amplitude is converted to the harmonics of ultraviolet light using nonlinear optical crystallization. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like can also be used.

Further, in the above-described first and second embodiments, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described, but the number of projection optical units is not limited thereto. As long as it is more than one. Further, it is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using an OFNER type large-sized mirror. In the above-described embodiment, the case where the projection magnification is equal to the projection optical system PL is described. However, the present invention is not limited thereto, and the projection optical system may be either a reduction system or an amplification system.

Further, in the above-described first and second embodiments, a light-transmitting type mask in which a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting mask substrate is used instead. A reticle, an electronic reticle (variable shaping reticle) for forming a transmissive pattern or a reflective pattern, or a luminescent pattern, for example, using a non-illuminating type, using an electronic material according to a pattern to be exposed as disclosed in the specification of US Pat. No. 6,778,257. A variable-forming mask of a DMD (Digital Micro-mirror Device) of one of image display elements (also known as spatial light modulators).

Further, the exposure apparatus is particularly effective for exposing a substrate having a size (including at least one of an outer diameter, a diagonal, and one side) of 500 mm or more, and a large substrate for a flat panel display such as a liquid crystal display element.

Moreover, as an exposure apparatus, it can be applied to an exposure apparatus of a step & repeat type, and a step & stitch type exposure apparatus. Set. Further, in the exposure apparatus, the object carried out by the unloading device is not limited to the substrate or the like of the object to be exposed, and may be a pattern holder (original) such as a photomask.

Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus for transferring a liquid crystal display element pattern to a square glass plate, and can be widely applied to, for example, an exposure apparatus for semiconductor manufacturing, for manufacturing a thin film magnetic head, a micromachine, and DNA. An exposure device such as a wafer. Further, the present invention can be applied not only to micro-elements such as semiconductor element elements, but also to manufacturing photomasks or reticle for use in a photo-exposure device, an EUV exposure device, an X-ray exposure device, and an electron beam exposure device. The circuit pattern is transferred to an exposure device such as a glass substrate or a germanium wafer. Further, the object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. In the case where the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like member having a flexible sheet member is also included.

An electronic component such as a liquid crystal display element (or a semiconductor element) is a step of fabricating a photomask (or a reticle) according to the design of the functional performance of the component, and a step of fabricating a glass substrate (or wafer) In the exposure apparatus and the exposure method thereof according to the above embodiments, the photomask (reticle) pattern is transferred to the lithography step of the glass substrate, the development step of developing the exposed glass substrate, and the remaining resist portion The exposed portions of the other portions are etched by etching, the resist removal step of removing the etching is completed, the resist removal step of the resist, the component assembly step, the inspection step, and the like are performed. In this case, since the exposure apparatus of the above embodiment is used in the lithography step By performing the above-described exposure method, an element pattern is formed on a glass substrate, so that a high-complexity element can be manufactured with good productivity.

In addition, the disclosures of the U.S. Patent Nos.

Industrial availability

As explained above, the object exchange system and method of the present invention is suitable for the replacement of objects held by the object holding device. Further, the object carrying out method of the present invention is suitable for carrying out an object from the object holding device. Further, the object holding device of the present invention is adapted to carry out an object. Further, the exposure apparatus of the present invention is suitable for exposing an object. Furthermore, the method of fabricating the flat panel display of the present invention is suitable for the manufacture of flat panel displays. Further, in addition, the component manufacturing method of the present invention is suitable for the manufacture of microcomponents.

10a, 10c, 100‧‧‧ liquid crystal exposure device

11‧‧‧ Ground

12‧‧‧ platform

13‧‧‧Substrate carrier

16‧‧‧Mirror platform

17a, 17b‧‧‧ Positioning device

18, 19‧‧‧Transport arm

18a, 19a‧‧‧ robotic arm

20a~20f, 120a, 120e‧‧‧ substrate carrier

21‧‧‧Micro-motion stage

21a, 24a, 31a‧‧ ‧ Hole Department

22x‧‧‧X moving mirror

23X, 123X‧‧‧X coarse moving stage

23Y, 123Y‧‧‧Y coarse moving stage

24‧‧‧Mirror mount

25‧‧‧Y linear guide

26‧‧‧Weight elimination device

26a‧‧‧Air bearing

26b‧‧‧Linking device

26c‧‧‧Z sensor

27‧‧‧ Leveling device

29x‧‧‧X voice coil motor

29z‧‧‧Z voice coil motor

30a~30e‧‧‧Substrate holder

31b ₁ ‧‧‧X slot

31b ₂ , 31c‧‧‧through holes

32‧‧‧ gap

46a, 46b‧‧‧Substrate jacking device

47‧‧‧Z actuator

48a‧‧‧Selling

48b‧‧‧Guide

60‧‧‧埠

61‧‧‧ 台台

62‧‧‧Substrate guiding device

63‧‧‧Base

64‧‧‧Z actuator

65‧‧‧ Guides

66‧‧‧X linear guide

70a, 70d, 70e, 70f, 70g, 170, 270, 570‧‧‧ substrate carrying out device

71, 81‧‧‧X travel guides

73x‧‧‧X slot

77a, 77f‧‧‧ adsorption device

77a ₁ ‧‧‧Adsorption pad

77a ₂ ‧‧‧Z actuator

77d‧‧‧Adsorption device

78‧‧‧Y linear guide

80a, 80c‧‧‧ substrate loading device

82, 173b‧‧‧X slides

83‧‧‧Loading arm

83 ₁ ‧‧‧ Base

83 ₂ ‧‧‧Support

83 ₃ ‧‧‧Installation components

84, 98‧‧‧Adsorption pad

90‧‧‧埠

91‧‧‧ 台台

92‧‧‧ Guides

93‧‧‧Substrate removal device

94, 96‧‧‧Z actuator

95‧‧‧X travel guide

97‧‧‧X slider

114‧‧‧Base

115‧‧‧Auxiliary base

116a‧‧‧Y linear guide

116b‧‧‧Y slider

117‧‧‧Y feed screw device

117a‧‧‧ screw shaft

117b‧‧‧ nuts

125, 425‧‧‧X beam

126‧‧‧Y bracket

126a‧‧‧Auxiliary bracket

127‧‧‧X linear guide

127a, 173a‧‧‧X linear guides

128‧‧‧X linear motor

128a‧‧‧Magnetic unit

128b‧‧‧ coil unit

129‧‧‧X bracket

130‧‧‧ device body

131‧‧‧Mirror platform

132‧‧‧ side column

133‧‧‧Substrate carrier

134‧‧‧Anti-vibration device

141‧‧‧Base member

142‧‧‧Porous components

143‧‧‧Z actuator

144‧‧‧foot

145‧‧‧ pole

146‧‧‧Z linear guide

150‧‧‧Y stepping platform

151‧‧‧Flexing device

171, 271, 371‧‧ ‧ adsorption pad

172‧‧‧Support members

173‧‧‧X linear guide

174‧‧‧X linear motor

174a‧‧‧Magnetic unit

174b‧‧‧ coil unit

176a‧‧‧movable department

176b‧‧‧Fixed Department

180‧‧‧Substrate slide device

181‧‧‧Base

182‧‧‧Y linear guide

183‧‧‧Y slider

184‧‧‧ Press pin

200‧‧‧Substrate stage device

CP‧‧‧ position

IL‧‧‧Lights

IOP‧‧‧Lighting Department

M‧‧‧Photo Mask

MST‧‧‧Photomask stage

P‧‧‧Substrate

PL‧‧‧Projection Optics

PSTa, PSTc‧‧‧ substrate stage device

S‧‧‧ Irradiation area

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to a first embodiment.

2 is a plan view of a substrate stage (substrate holder), a substrate carrying device, and a substrate unloading device included in the liquid crystal exposure device of FIG. 1.

Figure 3 is a cross-sectional view taken along line A-A of the substrate stage of Figure 2;

4(A) and 4(B) are views for explaining the substrate replacement operation of the first embodiment (the 1 and the 2).

5(A) and 5(B) are views for explaining the substrate replacement operation of the first embodiment (the third and fourth aspects thereof).

6(A) and 6(B) are views for explaining the substrate replacement operation of the first embodiment (the fifth and sixth aspects thereof).

7(A) and 7(B) are views for explaining the substrate replacement operation of the first embodiment (the seventh and eighth embodiments thereof).

8(A) and 8(B) are views for explaining the substrate replacement operation of the first embodiment (9 and 10).

Fig. 9 is a plan view showing a substrate stage (substrate holder), a substrate carrying device, and a substrate unloading device according to a second embodiment.

Figure 10 is a cross-sectional view taken along line B-B of Figure 9.

Fig. 11 is a view schematically showing the configuration of a liquid crystal exposure apparatus of a third embodiment.

Fig. 12 is a plan view showing a substrate stage (substrate holder), a substrate carrying device, and a crucible portion of the liquid crystal exposure apparatus of Fig. 11;

Figure 13 is a cross-sectional view of the substrate stage of Figure 12 (cross-sectional view taken along line C-C of Figure 12).

Figs. 14(A) and 14(B) are views for explaining the substrate replacement operation of the third embodiment (the 1 and the 2).

15(A) and 15(B) are views for explaining the substrate replacement operation of the third embodiment (3 and 4).

16(A) and 16(B) are views for explaining the substrate replacement operation of the third embodiment (the fifth and sixth aspects thereof).

17(A) and 17(B) are views for explaining the substrate replacement operation of the third embodiment (the seventh and eighth embodiments thereof).

18(A) and 18(B) are diagrams for explaining the substrate of the third embodiment. A diagram of the change of action (9 and 10).

Fig. 19 is a view for explaining the relationship between the substrate stage and the crotch portion when the substrate is carried out in the third embodiment.

20(A) to 20(C) are views (1 to 3) for explaining the operation of the substrate when the substrate is carried out in the third embodiment.

Fig. 21 is a plan view showing a substrate stage (substrate holder), a substrate carrying device, and a crotch portion according to the fourth embodiment.

22 is a cross-sectional view showing the substrate stage (substrate holder) of FIG. 21, the substrate carrying device, and the dam portion.

Fig. 23 is a plan view showing a substrate stage (substrate holder), a substrate carrying device, and a crucible portion according to the fifth embodiment.

Figure 24 is a cross-sectional view showing a substrate stage of a sixth embodiment.

25(A) to 25(C) are views for explaining the substrate replacement operation of the sixth embodiment (the first to third aspects thereof).

26(A) to 26(C) are views for explaining the substrate replacement operation of the first modification (1 to 3).

27(A) to 27(C) are views for explaining the substrate replacement operation of the first modification (4 to 6).

FIG. 28 is a plan view of a substrate stage device (a substrate holder and a substrate carrying device) according to a second modification.

29(A) and 29(B) are views for explaining the substrate replacement operation of the third modification (1 and 2).

30(A) and 30(B) are views for explaining the substrate replacement operation of the third modification (3 and 4).

Fig. 31 is a view schematically showing the configuration of a liquid crystal exposure apparatus of a seventh embodiment.

Figure 32 is a plan view showing a substrate stage device included in the liquid crystal exposure apparatus of Figure 31.

Figure 33 is a side elevational view of the substrate stage device of Figure 32 as seen from the +Y side.

Figure 34 is a cross-sectional view taken along line E-E of the substrate stage device of Figure 33.

35 is a plan view of a substrate stage (substrate holder), a substrate carrying device, and a crucible portion of a liquid crystal exposure apparatus according to a seventh embodiment.

36(A) and 36(B) are views for explaining the substrate replacement operation of the seventh embodiment (the 1 and the 2).

37(A) and 37(B) are views for explaining the substrate replacement operation of the seventh embodiment (the third and fourth portions thereof).

38(A) and 38(B) are diagrams for explaining the substrate replacement operation of the seventh embodiment (the fifth and sixth aspects thereof).

39(A) and 39(B) are views for explaining the substrate replacement operation of the seventh embodiment (the seventh and eighth aspects thereof).

40(A) and 40(B) are views for explaining the substrate replacement operation of the seventh embodiment (9 and 10).

41(A) and 41(B) are views for explaining the substrate replacement operation of the seventh embodiment (the 11 and 12 thereof).

Fig. 42 is a plan view showing the substrate stage of the eighth embodiment, showing a state before the substrate carrying operation.

Figure 43 is a cross-sectional view of the substrate stage of Figure 42.

Figure 44 is a plan view of the substrate stage of the eighth embodiment, showing the substrate A diagram of the state at the time of moving out.

Figure 45 is a cross-sectional view of the substrate stage of Figure 44.

Fig. 46 is a view showing a substrate stage of a fourth modification.

Fig. 47 is a plan view showing a substrate holder included in the substrate stage device of the fifth modification.

48(A) is a FF line sectional view of FIG. 47, FIG. 48(B) is a GG line sectional view of FIG. 48(A), and FIG. 48(C) is a view for explaining the operation of the substrate lifting device of the fifth modification. Figure.

49(A) and 49(B) are views showing the internal structure of the substrate jacking device of Fig. 48(A) (1 and 2).

50(A) to 50(D) are diagrams (1 to 4) for explaining the substrate loading and unloading operation of the substrate stage in the fifth modification.

51(A) and 51(B) are views (1 and 2) of the substrate jacking device of the sixth modification.

Fig. 52 is a view showing a substrate stage device according to a seventh modification.

Fig. 53 is a view showing the substrate stage device of the eighth modification.

18, 19‧‧‧Transport arm

20a‧‧‧Substrate stage

23Y‧‧‧Y coarse moving stage

30a‧‧‧Substrate holder

32‧‧‧ gap

46a‧‧‧Substrate jacking device

80a‧‧‧Substrate loading device

83‧‧‧Loading arm

98‧‧‧Adsorption pad

90‧‧‧埠

92‧‧‧ Guides

93‧‧‧Substrate removal device

96‧‧‧Z actuator

95‧‧‧X travel guide

97‧‧‧X slider

P ₀ , P ₁ , P ₂ ‧‧‧substrate

Claims (72)

An object exchange system for replacing an object mounted on an object holding member included in the object holding device, comprising: a loading device for conveying the object to be carried over the object holding member; and the loading device to be loaded The object to be transported on the object loading surface of the object holding member is carried out from the object holding member in the direction along the object loading surface; the object receiving device is provided in the object holding device, and the object to be carried is received from the loading device And a guide member provided in the object holding device for defining a guide surface for guiding the object to be carried out by the carry-out device. The object replacement system of claim 1, wherein the object to be carried out is the object holding member, and the object loading surface is moved by the guiding surface. The object replacement system of claim 2, wherein the unloading device includes a carry-out holding member that holds a part of the object to be carried out; and the object holding member has an opening into which the carry-out member is inserted unit. The object replacement system of claim 1, wherein the guide is provided to the object receiving device; and the object to be carried is delivered to the guide from the loading device. Such as the object replacement system of claim 4, wherein The guide member is provided to be movable between a protruding position protruding from the object loading surface and a housing position accommodated in the object holding member; and the unloading object moves on the guide positioned at the protruding position. The object exchange system according to any one of claims 1 to 5, wherein the guide member supports the unloading object in a non-contact manner. The object exchange system according to any one of claims 1 to 6, wherein the unloading device moves the object to be carried out along a two-dimensional plane parallel to the loading surface of the object. The object exchange system of any one of claims 1 to 7, wherein the loading device moves the object along a two-dimensional plane parallel to the loading surface of the object; the object receiving device has a second The movable member that moves in the direction orthogonal to the plane of the dimension receives the object to be carried from the loading device using the movable member. The object replacement system of claim 8, wherein the loading device has a support member for supporting the object to be loaded, and the support member is formed with a notch opening in a front side in a moving direction when the object to be carried is carried in, The movable member is inserted into the notch when the object to be loaded is received. The object replacement system of claim 9, wherein the loading device has one side and the other side of the supporting member in a direction orthogonal to the moving direction of the supporting member in a plane parallel to the two-dimensional plane Each has a guiding member that guides the movement of the support member. For example, the object replacement system of claim 10, wherein A delivery member for delivering the object to be carried into the support member of the object loading device from an external device is inserted between the guide members disposed on one side and the other side of the support member. The object exchange system of any one of claims 1 to 11, wherein the object holding device comprises an inducing device that induces a predetermined stroke along a two-dimensional plane parallel to the loading surface of the object; the object receiving device is provided In the induction device. The object exchange system according to any one of claims 1 to 12, wherein a position of the object holding device when the loading object is delivered to the object receiving device from the loading device is performed, and the loading is performed The position of the object holding device is the same when the device carries out the object to be carried out. An object replacement method for replacing an object loaded on an object holding member included in the object holding device includes: an operation of transporting the object to be carried onto the object holding member; and receiving the object receiving device provided in the object holding device The operation of the object to be carried over the object holding member; and the object to be carried out on the object loading surface of the object holding member are guided to the guide surface defined by the guide member of the object holding device The operation of moving out of the object holding device from the object holding surface in the direction of the object holding surface. The object replacement method according to claim 14, wherein the object holding member is the guide member, and the object loading surface is the guide surface to move the object to be carried out. The object replacement method of claim 14, wherein the guide is provided to the object receiving device; and the receiving device receives the object to be carried from the loading device to the guide. The object replacement method according to any one of claims 14 to 16, wherein the object receiving device holds the position of the object holding device when the object to be carried in, and the object when the object to be carried out is carried out The location of the device is the same. An object carrying-out method for carrying out an object loaded on an object holding member of an object holding device from the object holding member, comprising: causing the object holding device holding the object to face from the object holding member An operation of moving the object carrying-out position of the object; and an operation of moving the object out of the object holding member before the object holding device reaches the object carrying-out position. The object carrying out method according to claim 18, wherein the operation of starting the unloading operation is performed by moving the object relative to the object holding member using a carrying device provided in the object holding device. The object carrying out method of claim 18 or 19, wherein the object is carried out from the object holding member by guiding the object loaded on the object loading surface of the object holding member to the object The guiding surface defined by the guide member of the holding device is moved so as to move from the object holding member in the direction along the loading surface of the object. Object movement as claimed in any of claims 18 to 20 And the method of moving the object to the first direction to be carried out from the object holding device at the object carrying-out position; and the carrying-out operation is performed in the second direction intersecting the object holding device with the first direction Move parallel. A method for replacing an object on an object holding device, comprising: an operation of starting the unloading operation by an object carrying-out method according to any one of claims 18 to 21; before the object holding device reaches the object carrying-out position, An operation of waiting for another object to be in a predetermined standby position; an operation of moving the object out of the object holding device in a state where the object holding device is located at the object carrying-out position; and loading the other object located at the standby position into the object The action on the object holding device. The object replacement method of claim 22, wherein the unloading mechanism moves the object along a two-dimensional plane parallel to the loading surface of the object; the loading system moves the other object to be orthogonal to the two-dimensional plane The direction. The object replacement method of claim 22 or 23, wherein the moving of the other object is carried out by the object receiving device provided in the object holding device. An object replacement method for replacing an object mounted on an object holding member included in the object holding device includes: an operation of transporting the object to be carried onto the object holding member; The object receiving device provided in the object holding device receives an operation of the object to be carried carried over the object holding member, and guides the object to be carried out on the object loading surface of the object holding member. The object holding device has a guide surface defined by the guide member, and the object carrying device provided by the object holding device is carried out from the object holding member in the direction of the object loading surface. The object replacement method of claim 25, further comprising an operation of moving the object holding device that holds the object to be carried out toward the object carrying-out position from which the object is carried out from the object holding member; Before the object holding device reaches the object carrying-out position, the unloading operation of moving the object out of the object holding member is started. The object replacement method according to claim 25 or 26, wherein the object holding member is the guide member, and the object loading surface is the guide surface, and the object to be carried out is moved. The object replacement method of claim 25 or 26, wherein the guide is provided to the object receiving device; and the loading is to deliver the object to be transported to the guide. An object holding device comprising: an object holding member having an object loading surface for loading an object to be loaded, the object loaded on the object loading surface; and an unloading device for holding the object holding member The object holding member is carried out to the outside. An object holding device according to claim 29, wherein A concave portion is formed on the object loading surface of the object holding member, and the unloading device is housed in the concave portion. The object holding device of claim 30, wherein the unloading device is disposed on an outer side of the object holding member. The object holding device of claim 31, further comprising: an inducing device for inducing the object holding member along a predetermined two-dimensional plane with a predetermined stroke; the unloading device is provided in the inducing device. The object holding device according to any one of claims 29 to 32, wherein the carrying device is provided in plurality. The object holding device of any one of claims 29 to 33, wherein the unloading device has a holding device for holding the object; the holding device is configured to be detachable from the object at a position where the object can be held Between the positions, the object moves. The object holding device of claim 34, wherein the holding device is movable relative to at least one of a direction parallel to the surface of the object and a direction orthogonal to the surface of the object. The object holding device according to any one of claims 29 to 35, wherein the object holding member is provided at an object processing position capable of performing predetermined processing on the object, and an object carrying out position at which the object is carried out. The moving device moves the loading and unloading operation of the object from the object holding member before the object holding member reaches the object carrying-out position. An object replacement system having: An object holding device according to any one of claims 29 to 36, wherein the loading device transports the object to be carried over the object holding member; and the object receiving device is provided in the object holding device for receiving from the loading device The object to be carried in; and a guide member provided in the object holding device for defining a guiding surface for guiding the object to be carried out by the carrying device. The object replacement system of claim 37, wherein the object holding member of the object holding device is the guide member, and the object loading surface of the object holding member is the guiding surface mobile. The object replacement system of claim 37, wherein the guide is provided to the object receiving device; and the object to be carried is delivered to the guide from the loading device. The object replacement system of claim 39, wherein the guide member is configured to be movable between a protruding position protruding from the object loading surface and a receiving position accommodated in the object holding member; The object system moves on the guide located at the protruding position. The object exchange system of any one of claims 37 to 40, wherein the guide supports the unloading object in a non-contact manner. The object exchange system of any one of claims 37 to 41, wherein the unloading device is configured to move the object to be carried out along the object The two-dimensional plane of the body loading surface is parallel. An object exchange system according to any one of claims 37 to 42, wherein the loading device moves the object to be moved along a two-dimensional plane parallel to the loading surface of the object; the object receiving device has a capability to The movable member that moves in the direction orthogonal to the two-dimensional plane receives the object to be carried from the loading device using the movable member. The object replacement system of claim 43, wherein the loading device has a support member for supporting the object to be carried in, and the support member is formed with a notch opening in a front side in a moving direction when the object to be carried is carried in, When the object to be carried is received, the movable member is inserted into the notch. An object exchange system according to claim 44, wherein the loading device is in a plane parallel to the two-dimensional plane on a side of the support member and another side in a direction orthogonal to a moving direction of the support member, respectively There is a guiding member that guides the movement of the support member. The object exchange system of claim 45, wherein the delivery member for delivering the carry-in object to the support member of the object carry-in device from an external device is inserted into one side of the support member and the other Between the guiding members on the side. An object exchange system according to any one of claims 37 to 46, further comprising an inducing means for inducing the object holding member at a predetermined stroke along a predetermined two-dimensional plane; the object receiving means is provided to the inducing means. The object exchange system according to any one of claims 37 to 47, further comprising: guiding the object to be carried out by the carry-out device together with the guide member to receive the object carried out from the object holding device The carrying-out member for carrying out the object to be carried out; the carrying-out receiving member has a guiding surface set to be wider than the width of the object. The object exchange system according to any one of claims 37 to 48, wherein a position of the object holding device when the loading object is delivered to the object receiving device from the loading device is performed, and the carrying out is carried out The position of the object holding device is the same when the device carries out the object to be carried out. An exposure apparatus comprising: the object holding device according to any one of claims 29 to 36; and a pattern forming device for forming an intended pattern using the energy beam by the object held by the object holding device. An exposure apparatus comprising: the object replacement system according to any one of claims 1 to 13, 37 to 49; and a pattern forming device for forming an original pattern using the energy beam by the object held by the object holding device. A scanning type exposure apparatus for moving an object relative to an energy beam in a scanning direction during exposure, comprising: a first moving body movable in a predetermined two-dimensional plane and the scanning side The second moving body is movable in the second direction parallel to the scanning direction on the first moving body and is movable in the first direction together with the first moving body; the object is held The device is disposed to hold the object, is disposed above the second moving body, and is integrated with the object by the movement of the second moving body to be induced in a direction parallel to the predetermined two-dimensional plane; and is carried out The device is provided in the first moving body, and drives the object in a predetermined carry-out direction with respect to the object holding device. The exposure apparatus of claim 52, wherein the unloading direction is the second direction. The exposure apparatus of claim 53, wherein the unloading device includes a holding member that holds the object, and a driving device that drives the holding member in the second direction. The exposure apparatus of claim 54, wherein the driving device is in the second direction, and a position where the movement range of the second moving body on the first moving body overlaps and the possible range of movement The holding member is driven between the outer positions. The exposure apparatus of claim 55, wherein the holding member is located outside the range of possible movement at least at the time of exposure. The exposure apparatus of claim 56, further comprising an object driving device that drives the object in a direction separating from the object holding device; the holding member is inserted into the object driven by the object driving device The object is held between the devices. The exposure apparatus of claim 56, wherein the object driving device includes: a first member extending in the second direction and capable of supporting the object from below, and the object is held in the first direction One of the central portions of the device and the other side region drive the first member in a plurality of second members that intersect the two-dimensional plane. The exposure apparatus of claim 57, wherein the object driving device supports the object in a non-contact manner from below in a state in which the object is separated from the object holding device; the unloading device is driven by the object The device drives the object that is non-contact supported in the second direction. The exposure apparatus of claim 59, wherein the object driving device ejects gas from a surface opposite to the object to suspend the object. The exposure apparatus according to any one of claims 57 to 60, wherein the unloading apparatus further comprises a holding member driving device that drives the holding member in a direction of approaching or leaving the object holding device in the two-dimensional plane. . The exposure apparatus of claim 54, further comprising an object driving device that drives the object relative to the object holding device in a direction crossing the second direction; the holding member holds the object to be the object A portion of the drive device that is driven to protrude from the object holding device. An exposure apparatus of claim 62, wherein the object When the object is driven in the carry-out direction, the body holding device ejects gas from the surface facing the object to suspend the object. The exposure apparatus according to any one of claims 54 to 63, wherein the holding member adsorbs and holds the object. The exposure apparatus according to any one of claims 52 to 64, further comprising a micro-drive system that micro-drives the object holding device relative to the second movable body in a six-degree-of-freedom direction. The exposure apparatus according to any one of claims 52 to 65, further comprising: an object holding device that is disposed in parallel with the predetermined two-dimensional plane and that is non-contactably supported from below by being integrated with the object holding device The support device at the center. The exposure apparatus of claim 66, further comprising: a guide extending in the second direction and supporting the support device from below, and defining a guide surface when the support device moves in the second direction; The guide moves in the first direction together with the support device in a state in which the support device is supported from below. The exposure apparatus according to any one of claims 52 to 67, wherein the second moving body induces the object from the exposure end position to the replacement position where the object and the other object are replaced after the exposure is completed; The unloading device starts the object unloading operation until the object reaches the replacement position. The exposure apparatus of any one of claims 50 to 68, wherein the object system is used for a substrate of a flat display device. An exposure apparatus according to claim 69, wherein the base The length of at least one side of the board, or the diagonal length is 500 mm or more. A method of manufacturing a flat panel display comprising: an action of exposing the object using an exposure device of claim 69 or 70; and an action of developing the object after exposure. A method of manufacturing a component, comprising: an action of exposing the object using an exposure device according to any one of claims 50 to 68; and an action of developing the object after exposure.