200836840 九、發明說明： 【發明所屬之技術領域】 本發明係關於以浮起運送方式在被處理基板上形成處理液之塗 布膜的塗布方法及塗布裝置。 【先前技術】 LCD等平面顯示器（FPD)之製造處理中，於光微影步驟，常使用 /^有狹縫狀喷吐口之長形抗蝕劑噴嘴相對地掃描而在被處理基板 C玻璃基板專）上塗布抗姓劑液的非旋轉塗布法。 就，這種非旋轉塗布法之i種形式而言，已知有浮起運送方式， 12f利文獻1所開示，將用以支持FPD用矩形被處理基板(例如 f璃基板丨之台座以雜式地構成，在台座上將基板維持浮起於空 ，在水平的一方向（台座長邊方向）運送，於運中 、士巧液，猎此從基板上之—端到另—端塗布抗敍劑液。 固定ίίϊίίί，相較於以往一般的喷嘴移動方式，亦即將基板 矛夕動之上，而於其上方使長尺形抗_彳喷嘴於水平方向 if虫劑液以帶狀喷吐來從基板上之—端至另一端塗 行二布彳口 於係轉固定長尺形抗侧喷嘴之狀態，進 有ί布㈣ 對於基板大型化（亦即抗姓劑喷嘴之重厚長大化） 起運送’具備··一對引導執道，配置於台座之左 對滑動機構’沿著此等之引導執道而平行地直進移 ί ’依固㈣隔以可離合方式吸附於基板之左 f兩邊邛，板弹頁4連結構件，各別將此等左右一丨 ΐί機?f結’並且追隨基板之浮起高度而上下地位移，、工 提供ϋ體度$起量）係由從浮起台座之頂面對基板 ”（瓜為4)之壓力所規對於沿著運送方向所區分 5 200836840 之浮，台座上的每-個區域，設定最適 板之搬入及搬出的台座兩端部 於^基 液之台座h部區? t 對基板上供給抗姓劑 缺後，於倾i 2布域），例如設定30〜60⑽之小浮起量。 ‘：事起運送時，：…將基板從搬入區域通過塗布區域至搬出區域 子起’改變基板之浮起高度，且於運送方向之 板之核1而使纽置之連、賴構上下地轉。° 艰土 又，於浮起運送方式，為了在抗蝕劑喷嘴盥美招門 狭窄的間隙，不僅要求將其说η心員，、基扳之間形成固疋 ί値’也需要正確地管理；劑嘖度二， 測嘴對於台座= ]f ' / 貝知基準値之起始化或誤差之校正。 在劑喷嘴之間的間隙，會將塊狀治具 之i定點，從)的方式載置’並在該治具 頂面⑽)之高度ίΐ住Ϊ;規 灼丁仕卩桃#古机， 牧有取卜，口具，在抗蝕劑贺嘴之下端， 减之古择你娶又‘見之觸針，並從度盤規讀取値測定抗蝕劑喷嘴下 ΐΐίΐ’將第1測定値（台座頂面之高度位置)減去第2 f f嘴下端之高度錄），以減值作制_定値。 $ L專利文獻1]日本特開平2〇〇5—244155 【發明内容】 [發明欲解決之問題] 祕浮起運送式抗賴塗布裝置，如上所述，浮起台座 、、,;土反提供之氣體之壓力可變地控制基板之浮起高度（浮起量）， ，使保持基板之吸附墊或連結構件追隨基板之浮起高度而上下地位 私。然而，浮起運送中，會有基板之前端部及後端部上下振動而上 I偏擺的問題。亦即，基板之前端在辭完全覆蓋台麵面之各列 或各個別噴出口或抽吸口之瞬間，從台座侧受到的浮起壓力劇烈變 200836840 t 方向振動’且基板之後端在各列或各個別喷 氣之瞬間，浮起壓力劇烈變動也會於編 -:f:广寺，保持基板之_墊或連結構件也會與基板 、“ 布膜之膜料安定，有時會發生條錄塗布不均。 ^ ""規之叹置或刼作麻煩，而且因為是接觸式，合 問或度舰騎被抗侧污染，而容易誤债測的 本發明，有鑑於如上述習知技之生 f樹裝置，能 [解決問題之方式] ^m： 座上沿既定運送方向使 =保符和且為使在刖述台 述保持部於前述運送方，/运而將保持著前述基板之前 ，前述浮起運送而通過前ί噴“之塗布膜，而向 贺吐處理液；前述保持部具有： 基板，藉由前述噴嘴 基板之4個角落局部地保持·弁夂弓曲的保持構件，將前述 或者位移。 ，、寺，及升^邛，使前述保持構件升降移動 著運i方頂面設有多數噴出口之台座上，沿 搬入前述台座上；塗‘ · ，用以將矩形的被處理基板 土布&域’用以在商基板上塗布處理液；搬出 200836840 區域’用以將前述基板從前述台座搬出；以從前述台座之噴出口喷 出，氣體壓力使前述基板從前述台座上浮起，並將前述基板之4個 角落！ίΐ質上不彎曲且可升降之保持構件局部保持的狀態，將前述 基板彳文4述搬入區域運送到前述搬出區域，並於中途之前述塗布區 ν 域内，以配置於上方之喷嘴喷吐處理液並在前述基板上塗布前述處 、 理液。 ^發明中，運送部具備之保持部或保持構件，由於將基板之4 個角落實質上獨曲地保持’因此，t運送部在台座上將矩形基板 =起運送時，即使從台座侧受_浮起壓力變動，也能藉著保持部 ^保持構件之堅硬的保持力或拘束力，而能抑制基板之前端部或後 端部上下偏擺。 依照本發明塗布方法之一較佳態樣，將台座上之基板之浮起高 度依照各搬人區域、塗布區域及搬出區域侧設定，並在將基板從 搬入區域運送雜出區域之細，因應基板之浮起高度變化而使各 ϋίΐί升降移動齡移。此_，較佳為，在運送巾使前列保持 構件彼此及劍麟構件彼此各關—時齡降雜或升降位移。 ;^本电a月塗布裝置之一較佳態樣，保持構件具有：4個吸附塾， 可α自吸附在基板4個角落的背面；及第i及第2墊支持部，將夂 :及方向限制各自於錯直方向之位移而支持於隔著既定； :ίΐΓΐ;ΪΪΪ，為了吸收第1及第2墊支持部間之升降誤 ^支持部雙方，具有能使吸_在其周11於錯直面 内可_位移的水平旋轉軸，第〗及第2塾支持部其中之一， 使吸附t可在水平方向絲轉之直練 能 為，升降部，具有：第i及第2促動器，將第i及第2整== 降?ΐ;及升降控制部’將第1及第2促動器之驅動動； 1’ 1促動器’可具:第1馬達;* 1傳動機構， 動力轉變成第1墊支持部於錯直方向之直進 達之旋轉驅動力轉變成第2墊支 錯直 $弟2馬 200836840 個角落的才ΐί 姓輛升降移動而吸附結合於基板之4 基板^部及鱗朗墊之斜⑩，進-步保持 、赫距離，以第ί編石U ’為了控制第1墊支持部之升降 ‘之旋轉量，並且為了控虎作為反饋信號而控制第i馬達 旋轉編石馬器之輸出^ 墊支持部之升降移触離，而以第2 或就另-較===’ 馬達之旋轉ί ? 及第2墊支持部之升降 ‘ j ’也可，、有為了各自備測第1 亦可為，為了押制的弟1及第2距離感測器。此情形 測器之輪出信號作為反饋離:而以第1酬 i。在弟1及㈣蝴蝴 依照本發明之一較佳態樣，運送部具有： fj:於前述運送方向延伸;滑動機構，Ϊ載保4:執道，彡台 冷執k移動；及運送驅動部，使滑動機構沿著引導執道1可沿者引 又’於-較佳態樣，設置為了使喷嘴 ％ 而直進驅動。 同時，為了以光學对歌與正下方之動之升降機構’ 二设置安裝在喷嘴或支持該等而—體升降移動之間隔’ 的距離間隔，或測定與台座上之基板間的距^隔測疋與吸附墊間 再者，依照本發明之一較佳態樣，於運 = 為了以光學偵測噴嘴之高度位置的光學式位残,哭、、，部’安裝有 置感測器，較佳為與至少i個吸附墊一體地以 200836840 向作為前方而設在台座之左右兩側 & 置感測器，可具有：投光部，相對於樣而言，此光學式位 大致水平地射出光束；$絲，嘴^平行或斜向角度以 大小的間隙與投光部之射出面正向面對部可從上方出入之 是否已到達受光面之電信號。 、，及文光部，產生代表光束 W [發明之效果] 使浮起運送中:二上述構成及作用， 確安定地控制基板之浮起高产C端部下偏擺，而正 依照本發明之塗布裝置，膜厚品質。再者， 釀便且安全正確地測定噴嘴的高度述先學式位置感測器，能簡 【實施方式】 [實施發明之最佳形態] ’茶照附圖說明本發明之較佳實施形態。 統。此塗布顯例的塗布顯影處理系 板作為被處理基板G，並實施於LCD製i處理Ϊ的璃基 洗、抗钱劑塗布、預烘、顯影及後中的清 •此系統鄰接設置之外部曝光裝置12進行。& 光處理於與 V站(ct Ϊ 峨盒站(c/s)14及界面站⑽^ 1 (c/s)14，為糸統10之匣盒搬入出埠，具備：匣各△座 i多片 1Γ「方人向Γ(Υ方向）最多並排載置4個可將基板G多段重^收 秦22 ’具有能將基板G以1片單位或2片單 站板送γ:ζ、04軸動作，能與鄰接的處理 處理站(P/S)16，在水平的系統長邊方向（X方向）延伸平行且反 10 200836840 向相向的-對線A、B，依處理流程或步驟依序配置各處理部。 更詳細而言，於從g盒站(C/S)14側往界面站（I/F)18側的上产 部之處理線A，沿著第1平流運送通道34從上游側起，依序成一^ 酉己^搬入單元（IN PASS)24、清洗處理部26、第丨熱處理部沈、 塗布處理部30、第2熱處理部32 〇 巧 更詳言之，搬入單元（IN PASS)24從匿盒站（c/s)14運送機 將未處理之，板G以1片單钱2片單位接取，於既定的作業時間， 逐片地投入第1平流運送通道34。清洗處理部26，沿著第丨平产運 送通道34 ’從上游侧依序地設置：準分子w照射單元(E_uv)^及 擦磨清洗單元(SCR)38。第1熱處理冑28，從上游侧域序地設 附單元(AD)40及冷卻單元(c〇L)42。[Technical Field] The present invention relates to a coating method and a coating apparatus for forming a coating film of a treatment liquid on a substrate to be processed by a floating conveyance method. [Prior Art] In the manufacturing process of a flat panel display (FPD) such as an LCD, in the photolithography step, a long resist nozzle having a slit-like ejection opening is often used to relatively scan the substrate C on the substrate to be processed. Non-rotating coating method for coating anti-surname liquid. In view of the i-form of the non-rotation coating method, a floating transport method is known, and the document 1 is disclosed in the document 1 to support a rectangular substrate to be processed for FPD (for example, a pedestal of a glass substrate) In the structure, the substrate is floated on the pedestal and transported in a horizontal direction (longitudinal direction of the pedestal). In the middle of the movement, Shiqiao liquid, hunting from the end of the substrate to the other end coating resistance The liquid is fixed. ίίϊίίί, compared with the conventional nozzle movement method, the substrate is spear-on, and the long-shaped anti-彳 nozzle is sprayed in the horizontal direction of the insect solution in the horizontal direction. Applying a two-cloth nipple from the end to the other end of the substrate to fix the long-length anti-side nozzle, and inserting the diaper (4) for the enlargement of the substrate (that is, the thickening and thickening of the anti-surname nozzle) The transport "has a pair of guides, and the left-to-sliding mechanism disposed on the pedestal" moves in parallel along the guides of the pedestal. Depending on the solid (four), it can be attached to the left side of the substrate by the clutch.邛, the bounce page 4 link components, each of these left A 丨ΐ 机 f f f f f f 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追 追For each float on the pedestal, the two sides of the pedestal that are moved in and out of the pedestal are placed in the h section of the pedestal of the base liquid. t Supply anti-surname on the substrate After the agent is missing, for example, the amount of small floating of 30 to 60 (10) is set. In the case of transportation, the substrate is transferred from the loading area to the carrying-out area to change the floating of the substrate. The height is high, and the core of the board in the direction of the transport is connected to the top of the board, and the structure is turned up and down. ° The hard soil is again in the floating transport mode, in order to make the seal nozzles close to the narrow gap of the door. Not only is it required to say that it is a nucleus, but the formation of a solid 疋 値 也 也 也 也 也 也 也 也 也 也 也 ; ; ; ; ; 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧 啧Correction. The gap between the nozzles of the agent will fix the block fixture i, from the square Mount 'and the height of the top surface of the fixture (10)) ΐ ΐ Ϊ 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规 规'See the stylus and read from the dial gauge 値 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 将 将 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第。 L 专利 L L L L L L L L 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 日本 — — — — — — — — — — — — — 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘 秘The pressure of the gas supplied by the soil variably controls the floating height (floating amount) of the substrate, so that the adsorption pad or the connecting member holding the substrate follows the floating height of the substrate and is up and down. However, the floating transport Among them, there is a problem that the front end portion and the rear end portion of the substrate vibrate up and down and the upper I yaw. That is, the floating pressure received from the pedestal side is sharply changed to the vibration of the 200836840 t direction at the moment when the front end of the substrate completely occupies the columns of the mesa surface or the respective ejection openings or suction ports, and the rear end of the substrate is in each column. Or at the moment of each jet, the fluctuation of the floating pressure will also be in the editor-:f:Guangsi, the substrate or the connecting member will remain with the substrate, "the film material is stable, sometimes it will happen." Uneven coating. ^ "" sighs or slaps are troublesome, and because it is a contact type, a question or a degree of ship riding is resistant to side pollution, and the invention is easy to misunderstand, in view of the above-mentioned conventional techniques In the case of the problem, the method of solving the problem is as follows: ^m: The seat is held in the predetermined transport direction, and the substrate is held in the transport side, and the substrate is held. In the past, the above-mentioned holding portion has a substrate, and the holding portion has a substrate, and the holding member is partially held by the four corners of the nozzle substrate. , will be the aforementioned or displaced. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The field 'is used to coat the processing liquid on the commercial substrate; the 200836840 area is carried out to carry out the substrate from the pedestal; to eject from the ejection opening of the pedestal, the gas pressure causes the substrate to float from the pedestal, and 4 corners of the aforementioned substrate! a state in which the holding member that is not bent and can be lifted and lowered is partially held, and the substrate is transported into the carry-out area, and the nozzle is disposed in the upper portion of the coating area ν region. The surface and the chemical solution are applied to the substrate. In the invention, the holding portion or the holding member provided in the transport portion holds the four corners of the substrate substantially in a unique manner. Therefore, when the t transport portion transports the rectangular substrate on the pedestal, it is received from the pedestal side. The fluctuation of the floating pressure can also suppress the vertical deflection of the front end portion or the rear end portion of the substrate by the holding force or the restraining force of the holding portion. According to a preferred aspect of the coating method of the present invention, the lifting height of the substrate on the pedestal is set according to each of the moving area, the coating area, and the carrying-out area, and the substrate is transported from the loading area to the fine area, and the corresponding The floating height of the substrate changes so that each 升降 ΐ ΐ 升降 moves up and down. Preferably, in the transporting towel, the front row holding members and the sapling members are closed to each other - the age is reduced or the displacement is lowered. A preferred embodiment of the present invention is that the holding member has: four adsorbing crucibles, which can be self-adsorbed on the back of the four corners of the substrate; and the i-th and second mat supporting portions, The direction limits each of the displacements in the wrong direction and are supported by the predetermined; : ΐΓΐ ΐΓΐ; ΪΪΪ, in order to absorb the lifting between the first and second pad support parts, the support part has the ability to absorb _ in its circumference 11 The horizontal rotation axis of the _ displacement in the wrong plane, one of the first and second support portions, so that the adsorption t can be turned in the horizontal direction, the lifting portion has: the i-th and the second actuation , the i and 2nd == down?ΐ; and the lifting control unit 'drives the first and second actuators; 1'1 actuator' can have: the first motor; * 1 transmission The mechanism, the power is converted into the first pad support in the wrong direction, the rotational driving force is converted into the second pad branch wrong. The younger brother 2 horse 200836840 corners of the corner ΐ 姓 辆 辆 升降 升降 升降 升降 升降 辆 辆 辆 辆 辆 辆 辆 辆 辆 4 4 ^The section of the section and the scale of the scale is 10, the step-by-step retention, the Hertz distance, and the ί 编 stone U 'in order to control the lifting of the first pad support portion' The amount of rotation, and in order to control the tiger as a feedback signal to control the output of the i-th motor rotating stone machine, the lifting and lowering of the pad support, and the rotation of the motor by the second or the other -===' motor It is also possible to raise and lower the 'j' of the second pad support portion, and it is also possible to prepare the first and second distance sensors for the first time. In this case, the round signal of the detector is used as the feedback: and the first reward is i. In the preferred embodiment of the present invention, the transport portion has: fj: extending in the aforementioned transport direction; the sliding mechanism, the load carrying 4: the road, the cold running, and the transport drive; For example, the sliding mechanism can be guided along the guiding lane 1 and then placed in a preferred manner to drive the nozzle in order to drive the nozzle. At the same time, in order to optically sing the song with the moving mechanism below, the distance between the nozzles or the support of the lifting and moving movements is determined, or the distance between the substrate and the substrate on the pedestal is measured. Further, in accordance with a preferred aspect of the present invention, in order to optically detect the optical position of the nozzle, the crying, and the portion are mounted with a sensor, preferably The sensor may be provided on the left and right sides of the pedestal with the at least i adsorption pads in the 200836840 direction as the front side, and may have a light projecting portion, and the optical position is emitted substantially horizontally with respect to the sample. The light beam; the wire, the mouth, the parallel or the oblique angle, the gap between the size and the exit surface of the light projecting portion, the forward facing portion, the electrical signal that can enter and exit the light receiving surface from above. And the light-receiving unit generates a representative light beam W. [Effects of the Invention] In the floating transport: the above-mentioned configuration and action, and surely control the floating high-production C-end lower yaw of the substrate, and the coating according to the present invention Device, film thickness quality. Further, the height of the nozzle can be measured safely and accurately, and the position sensor can be easily described. [Embodiment] [Best Mode for Carrying Out the Invention] The preferred embodiment of the present invention will be described with reference to the drawings. System. The coating and developing treatment plate of the coating example is used as the substrate G to be processed, and is applied to the glass-based washing, the anti-money coating, the pre-bake, the development, and the subsequent cleaning of the LCD-made i-process. The exposure device 12 performs. & Light processing in the V station (ct Ϊ 峨 box station (c / s) 14 and interface station (10) ^ 1 (c / s) 14, for the 10 10 box into the 埠 box, with: 匣 each △ seat i Multi-piece 1" "Fang Ren Xiang Γ (Υ direction) at most 4 rows can be placed on the substrate G multi-stage ^ ^ Qin 22 ' can have the substrate G can be sent in 1 unit or 2 single-station board γ: ζ, The 04 axis motion can be paralleled with the adjacent processing station (P/S) 16 in the horizontal direction of the horizontal system (X direction) and reversed 10 200836840 to the opposite - to the line A, B, according to the processing flow or step Each processing unit is arranged in order. In more detail, the processing line A of the upper production unit from the g-box station (C/S) 14 side to the interface station (I/F) 18 side is along the first advection transport path. 34 from the upstream side, in order to carry out the unit (IN PASS) 24, the cleaning treatment unit 26, the second heat treatment portion sink, the coating treatment portion 30, and the second heat treatment portion 32, in more detail, carry in The unit (IN PASS) 24 will be unprocessed from the concealed station (c/s) 14 conveyor, and the board G will be taken in one unit of two pieces of money, and the first advection will be carried out piece by piece for a predetermined working time. Channel 34. Cleaning processing unit 26, along The third production transport channel 34' is sequentially disposed from the upstream side: an excimer w irradiation unit (E_uv) and a scrub cleaning unit (SCR) 38. The first heat treatment 胄 28 is sequentially arranged from the upstream side. Unit (AD) 40 and cooling unit (c〇L) 42.
塗布處理部30，從上游侧起依序地設置··傳遞單元(pASS)43、 抗蝕劑塗布單元（C0T)44、傳遞單元（PASS)45及減壓乾燥單元 (VD)46，同時在傳遞單元(PASS)43、45與抗蝕劑塗布單元(c〇T)44 之間’没有用以將基板G之運送暫時從第1平流運送通道34往外（橫） 繞道的運送裝置47及旁通運送通道49。更詳細而言，上游侧傳遞單 元(PASS)43將從弟1熱處理部28以平流運送過來的基板g遞送給旁 通運送通道49之運送裝置47，運送裝置47將所接取的基板g經由 旁通運送通道49而搬入抗蝕劑塗布單元(c〇T)44。然後，運送裝置 4,7將於抗蝕劑塗布單元(C〇T)44結束抗蝕劑塗布處理之基板G搬出 並經由旁通運送通道49經由交給下游側的傳遞單元(1^8幻45。從傳 遞單元(PASS)45，基板G再次於第1平流運送通道34上以平流送入 減壓乾燥單元(VD)46。減壓乾燥單元(VD)46，具有：可收容基板_G 並可減壓之腔至，以及用以將基板G以平流地搬出入此腔室的運送 機構。 第2熱處理部32，從上游側起依序地設置：預烘單元 (PRE-BAKE)48及冷卻單元(C0L)5()。位於第2熱處理部32之下游侧 鄰的第1平流運送通道34終點，設有傳遞單元(pass)52。於第1平 流運送通道34上以平流運送過來的基板g，從此終點之傳遞單元 11 200836840 (PASS)52被遞送到界面站（ΐ/ρ)ΐ8。 另一方面，從界面站（I/F)18側往匣盒站（C/S)14侧之下游部之 處理線B ’沿著第2平流運送通道64從上游側起依序成一列配置： 顯影單元(DEV)54、後烘單元(p〇STBAKE)56、冷卻單元(C0L)58、檢 查單元(AP)60及搬出單元（OUT PASS)62。在此，後烘單元（p〇s^ BAKE)56及冷部單元(c〇l)58構成第3熱處理部66。搬出單元(out • PASS)62，將來自於第2平流運送通道64之已處理完畢的基板g逐 片地接取，以1片單位或2片單位遞送給匣盒站（c/s)14之運送機構 22 ° 兩處理線A、B之間，設有輔助運送空間68。又，亦可利用能將 基板G以1片單位水平地載置的穿梭機構(油咐16)(未圖示）以驅動 機構（未圖示），於處理線方向（χ方向）雙向移動。 奸界面站（I/!F)18 ’具有運送裝置72，其用於將基板G與上述第1 及第2平流運送通道34、64或鄰接之曝光裝置12進行遞送，此運 送裝置72周圍配置有旋轉台座(R/S)74及周邊裝置％。.旋轉台座 (R/S)74係使基板G在水平面内旋轉之台座，且用於在 轉基板G之方向。周邊裝置76，例如印字曝S (TITLER)或周邊曝光裝置⑽）等係設於第2平流運送通道“之 層。圖不雖省略，於周邊裝置76之下，設有從運送裝置 板G而乘載於第2平流運送通道64之始點的傳遞單元(，ass)。土 驟的顯;=(?= 其中之-嶋二Τη ΓΛ，軸構22從台座20上 之搬人單元（I娜S)24(步驟S1)。從搬入 平流運送通道34 既定作業時間’逐片地移載或投入第1 依序流運送通道34之基板G，最初在清洗處理部26 以紫外線清讀理及_清洗纽（㈣S2 12 200836840 (SQ038對於在第-平流運送通道34上水平地移動的基板G，藉由 施以刷洗清洗或吹送清洗，從基板表面將粒子狀污垢除去，之後施 以沖洗處理，最後使用空氣刀等使基板〇乾燥。擦磨清洗單元(SCR)38 中一連串的清洗處理結束，則基板(；維持此狀態從第〗平流運送 道34下來，通過第1熱處理部28。 於第1熱處理部28，基板G最初在黏附單元(ad)40使用蒸氣狀 ^ 丽㈧被施以黏附處理，使被處理面疏水化（步驟S4)。於此黏附處理 結束後，基板G以冷卻單元(c〇L)42冷卻至既定的基板溫度（步驟The coating processing unit 30 sequentially supplies the transfer unit (pASS) 43, the resist coating unit (COT) 44, the transfer unit (PASS) 45, and the reduced-pressure drying unit (VD) 46 from the upstream side, while Between the transfer units (PASS) 43, 45 and the resist coating unit (c〇T) 44, there is no transport means 47 and a bypass for bypassing the transport of the substrate G temporarily from the first advection transport path 34. Passing the passage 49. More specifically, the upstream side transfer unit (PASS) 43 delivers the substrate g transported in the advection from the heat treatment unit 28 of the brother 1 to the transport device 47 of the bypass transport path 49, and the transport device 47 passes the substrate g received The transfer coating path 49 is bypassed and carried into the resist coating unit (c〇T) 44. Then, the transporting devices 4, 7 are carried out by the resist coating unit (C〇T) 44, and the substrate G of the resist coating process is carried out and passed through the bypass transport path 49 to the transfer unit on the downstream side (1^8 illusion) 45. From the transfer unit (PASS) 45, the substrate G is again fed into the reduced-pressure drying unit (VD) 46 on the first advection transport path 34. The reduced-pressure drying unit (VD) 46 has: a substrate _G can be accommodated The chamber can be decompressed and a transport mechanism for carrying the substrate G into the chamber in a flat flow. The second heat treatment unit 32 is sequentially disposed from the upstream side: a pre-baking unit (PRE-BAKE) 48 And a cooling unit (C0L) 5 (). An end of the first advection conveying passage 34 adjacent to the downstream side of the second heat treatment unit 32 is provided with a transmission unit 52. The first advection conveying passage 34 is conveyed by advection. The substrate g from which the transfer unit 11 200836840 (PASS) 52 is delivered to the interface station (ΐ/ρ) ΐ 8. On the other hand, from the interface station (I/F) 18 side to the cassette station (C/S) The processing line B' of the downstream portion of the 14 side is arranged in a row from the upstream side along the second advection conveying passage 64: developing unit (DEV) 54, post-bake A unit (p〇STBAKE) 56, a cooling unit (C0L) 58, an inspection unit (AP) 60, and an unloading unit (OUT PASS) 62. Here, a post-drying unit (p〇s^ BAKE) 56 and a cold unit (c) 〇l) 58 constitutes a third heat treatment unit 66. The carry-out unit (out • PASS) 62 picks up the processed substrate g from the second advection transport path 64 piece by piece, in one unit or two units. The transport mechanism 22 that is delivered to the cassette station (c/s) 14 is provided with an auxiliary transport space 68 between the two process lines A and B. Alternatively, the substrate G can be placed horizontally in one unit. The shuttle mechanism (oil head 16) (not shown) moves in the processing line direction (χ direction) by a drive mechanism (not shown). The interface station (I/!F) 18' has a transport device 72, which is used. The substrate G is transported to the first and second advection transport passages 34, 64 or the adjacent exposure device 12, and a rotating pedestal (R/S) 74 and a peripheral device % are disposed around the transport device 72. The rotating pedestal ( R/S) 74 is a pedestal that rotates the substrate G in a horizontal plane and is used in the direction of the transfer substrate G. The peripheral device 76, such as a printing exposure S (TITLER) or a peripheral exposure device And the like is provided on the layer of the second advection transport path. The figure is not omitted, and a transfer unit that is carried from the transport device plate G to the start of the second advection transport path 64 is provided below the peripheral device 76 ( , ass). The soil is suddenly displayed; = (? = where - 嶋 Τ ΓΛ ΓΛ, the shaft structure 22 from the pedestal 20 on the moving unit (I Na S) 24 (step S1). From the moving into the advection transport channel 34 The working time 'transfers one by one or puts into the substrate G of the first sequential flow transport path 34, initially in the cleaning processing unit 26, and clears the ray (_4) S2 12 200836840 (SQ038 for the first-level advection channel) The substrate G horizontally moved 34 is subjected to brush cleaning or blow cleaning to remove particulate dirt from the surface of the substrate, and then subjected to a rinsing treatment, and finally the substrate is dried by an air knife or the like. When a series of cleaning processes in the scrubbing cleaning unit (SCR) 38 is completed, the substrate (the state is maintained from the first advection transport path 34 and passes through the first heat treatment portion 28. In the first heat treatment portion 28, the substrate G is initially adhered. The unit (ad) 40 is subjected to an adhesion treatment using a vapor-form (8) to hydrophobize the surface to be treated (step S4). After the adhesion treatment is completed, the substrate G is cooled by a cooling unit (c〇L) 42 to a predetermined one. Substrate temperature (step
S5)。此後，基板G從第1平流運送通道34下來，運送到塗布 部 30。 a I •、、,、進入塗布處理部30,則基板G從傳遞單元(PASS)43經由旁通運 送，道49、而搬入抗蝕劑塗布單元(c〇T)44，藉由使用長形狹缝喷嘴 参起運送的非旋轉法，在基板頂面（被處理面）塗布抗姓劑液。接 ，，經由旁通運送通道49及傳遞單元(PASS)45被送到麵乾燥單元 (VD)46.，在此，接受利用減壓之常溫乾燥處理（步驟S6) 〇 、#搬出塗布處理部3〇的基板G，從第丨平流運送通道34下來，通 過第2熱處理部32。於第2熱處理部32中，基板G最初於預烘單元S5). Thereafter, the substrate G is transported from the first advection transport path 34 and transported to the coating unit 30. a I • , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The non-rotation method in which the slit nozzles are transported is applied, and the anti-surname liquid is applied to the top surface (treated surface) of the substrate. Then, it is sent to the surface drying unit (VD) 46 via the bypass conveyance path 49 and the transmission unit (PASS) 45. Here, the room temperature drying process by the decompression is performed (step S6), and the coating processing unit is carried out. The 3 〇 substrate G passes through the second advection transport path 34 and passes through the second heat treatment unit 32. In the second heat treatment unit 32, the substrate G is initially in the pre-baking unit
⑽-MKEM8接受作馳赠塗_之熱處轉^狀J 步驟S7)。藉由此預烘，將殘留在基板G上之抗侧膜中的溶 刎=發除去，強化抗蝕劑膜對於基板之密合性。其次，基板G於冷 =兀巧，冷卻至既定之基板溫度(步驟S8)。然後，基板G從 平流運送通道34終點之傳遞單元（PASS)52被送到界面站 (I/F)18之運送裝置72。 於界面站（I/F)i8 ’基板G以旋轉台座74例如轉換90度之方向 二技被搬入周邊裝置76之周邊曝光裝置㈣，於此接受用於將附著 =板G之周邊部的抗蝕劑於顯影時除去的曝光後，送到相鄰的曝 光裝置12(步驟S9)。 於曝光裝置丨2，基板g上之抗㈣被縣為既定的電路圖案。 #、、H，結束圖案曝光之基板0，從曝光裝置12返回界面站（I/F)18(步 13 200836840 ，，9) ’百先被搬人周邊裝置μ之印字曝光抓丨雇彡，於此 部位士記錄既定資訊(步驟sio)。然後，基板g，藉由運 =置被搬人布設於處理站（P/s)16之處理線B側之第2平 达通運64之始點傳遞單元(PASS)。 連 a如此-來，基板G這次在第2平流運送通道64上往處理線β之 :制則運送。於最初之顯影單元⑽)54，基板6以平流運送之^間， 不急以顯影、沖洗、乾燥之一連串顯影處理（步驟。 單元(勝)54結束一連串顯影處理之基板G，維持此狀態 7流運送通道64,依序通過第3熱處理部66及檢查單元 拉、〇从L於弟/熱處理部66，基板G最初於後烘單元(P0ST— bakE)56 接文作為顯影處理後之熱處理的後烘（步驛S12)。於此後供，將殘留 ϊίϊΐ上之綱之顯影液綠洗液蒸發除知強化抗韻麵 j於基板之翁s性。其次，基板G於冷卻單元(c〇L)58冷卻至既定 巧才严度(步驟Sl3)。檢查單元⑽⑽，對於基板G上之織劑圖 木，貫施非接觸式的線寬檢查或膜質、膜厚檢查等（步驟S14)。 ㈣搬ί單元(〇UT搬)62，從第2平流運送通道64將已完成所有: ，驟之處理的基板G·地接取，並以丨片單減2片單位地遞送 給ϋ盒站(C/S) 14之運送機構22。於站(G/S)14^ .，運送機構 22將從搬出單元⑽TPASS)62以1片單位或2片單位接取的處理完 畢的基板G，收容於任意（通常為原先的）的匣盒c(步驟S1)。 於此塗布顯影處理系統10中，本發明可適用於塗布處理部3〇 内之抗塗布單元(C0T)44。以下，就圖3〜圖17，詳加說明將本 發明適用於抗蝕劑塗布單元(C0T)44之一實施形態。 圖3〜圖5顯示此實施形態之中，抗餘劑塗布單元(⑶τ)44整體 構成，圖3為概略平面圖、圖4為立體圖、圖5為概略正面圖。 如圖3所示，抗蝕劑塗布單元(C0T)44具有在第！平流運送通道 34(圖1)之運送方向（X方向）長向地延伸的台座。應接受塗布處 理之新的基板G，藉由運送裝置47從旁通運送通道49以箭頭Fa所 示，被搬入台座80之運送上流端的區域(搬入區域吣）。然後，在台 14 200836840 f 80上如箭頭Fb所示藉由浮起運送而接受過非旋轉法 ^里的基板G，從台座8〇之運送下游端之區域(搬出屈 c所示，被運送到旁通運送通道49側之運送裝置π。(10)-MKEM8 accepts the heat of the coating _ the heat is turned into a shape J step S7). By this prebaking, the dissolution of the anti-side film remaining on the substrate G is removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature (step S8). Then, the substrate G is sent from the transfer unit (PASS) 52 at the end of the advection transport path 34 to the transport unit 72 of the interface station (I/F) 18. In the interface station (I/F) i8', the substrate G is carried into the peripheral exposure device (4) of the peripheral device 76 by the rotation pedestal 74, for example, in the direction of 90 degrees, and the resistance for the peripheral portion of the adhesion = plate G is accepted here. After the exposure of the etchant removed during development, it is sent to the adjacent exposure device 12 (step S9). In the exposure device 丨2, the resistance (4) on the substrate g is a predetermined circuit pattern. #,,H, the substrate 0 that ends the pattern exposure, returns to the interface station (I/F) 18 from the exposure device 12 (step 13 200836840, , 9) 'The first exposure of the peripheral device μ is printed and captured, The localist records the established information (step sio). Then, the substrate g is placed at the start point transfer unit (PASS) of the second flat transfer 64 on the processing line B side of the processing station (P/s) 16 by the transfer. In this case, the substrate G is now transported to the processing line β on the second advection transport path 64: the standard transport. In the initial developing unit (10) 54, the substrate 6 is transported in a flat flow, and is not urgently developed, rinsed, and dried in a series of development processes (step. Unit (Win) 54 ends the series of development processing of the substrate G, maintaining this state 7 The flow transport path 64 is sequentially pulled by the third heat treatment unit 66 and the inspection unit, and is taken from the L/di-heat treatment unit 66. The substrate G is initially attached to the post-drying unit (P0ST-bakE) 56 as a heat treatment after development processing. After post-baking (step S12), after this, the residual green liquid of the developing solution is evaporated, and the surface of the substrate is strengthened. Next, the substrate G is in the cooling unit (c〇L). 58 is cooled to a predetermined level (step S13). The inspection unit (10) (10) applies a non-contact line width inspection or film quality, film thickness inspection, etc. to the woven agent wood on the substrate G (step S14). The transfer unit (〇 UT move) 62 picks up all the substrates G· ground that have been processed from the second advection transport path 64, and delivers the unit to the cassette station by two pieces of the cymbal unit ( C/S) 14 transport mechanism 22. At the station (G/S) 14^., the transport mechanism 22 will carry out the unit (10) TPASS) 62 The processed substrate G taken in one unit or two units is housed in any (usually the original) cassette c (step S1). In the coating and developing treatment system 10, the present invention is applicable to the coating unit (C0T) 44 in the coating processing unit 3A. Hereinafter, an embodiment in which the present invention is applied to a resist coating unit (COT) 44 will be described in detail with reference to Figs. 3 to 17 . Fig. 3 to Fig. 5 show the overall configuration of the anti-residue coating unit ((3) τ) 44 in the embodiment, and Fig. 3 is a schematic plan view, Fig. 4 is a perspective view, and Fig. 5 is a schematic front view. As shown in FIG. 3, the resist coating unit (COT) 44 has the first! A pedestal that extends in the direction of transport (X direction) of the advection transport path 34 (Fig. 1). The new substrate G to be subjected to the coating process is carried by the transport device 47 from the bypass transport path 49 as indicated by the arrow Fa, and is carried into the region (the carry-in region 运送) where the upstream end of the pedestal 80 is transported. Then, on the stage 14 200836840 f 80, the substrate G of the non-rotation method is received by the floating conveyance as indicated by the arrow Fb, and the area from the downstream end of the pedestal 8 is transported. The transport device π is on the side of the bypass transport path 49.
其-對邊與運送方向（X方向）平行，另—對邊與運送方㈣ 姿勢，被浮起運送。 台座80在其長邊方向（X方向），被分割成5個區域沁、吣、他、 Ms(圖5)。左端的區域Μι為搬入區域，依照圖3，如上所述應接 叉塗布處理之新的基板G從;fit運送通道49被搬人於此搬入區域 My於此搬入區域Ml，有多根頂升銷86隔著既定間隔被配置，該等 係用於從運送裝置47之運送臂接取基板G而裝載於台座8〇上，可 在台座下方之原位置與台座上方往動位置之間升降移動。此等頂升 銷86,例如藉由使用空氣缸筒（未圖示）之搬入用頂升銷升降部肋^圖 12)而升降驅動。 ° 此搬入區域此亦為基板G之浮起運送開始的區域，此區域内之 台座頂面，為了使基板G以搬入用之浮起高度或浮起量Ha浮起，以 固定密度設有多數將高壓或正壓之壓縮空氣喷出的噴出口 88。在 此’搬入區域Μι中，基板G之浮起高度Ha，不需特別的高的精度， 例如保持在250〜350//m之範圍内即可。又，於運送方向方向）， 搬入區域Μι之尺寸較佳為超過基板G之尺寸。再者，於搬入區域Μι， 可設有用於將基板G在台座80上進行位董對準用的調準部(未圖 示）。 設定於台座80之長邊方向中心部的區域Mr為抗蝕劑液供給區 15 200836840 • Hb，規定為抗_喷嘴8{) 2二+。塗布區域M3 +的基板浮起高度 間的塗布_ s(例如巾（贺吐口）與基板頂面(被處理面）之 ~謂縣抗_雜量的轉)^%=^；^/^^劑塗布膜 -噴出曙，為了將基板，設置： 壓縮空氣；及抽吸口 90，ri ^子起同度Hb斤起，贺出高壓或正屢 G之塗布_3 _部分^將空 =^ 於位在基板 之力量，同時，抽吸口 90利88/_新目空氣施加垂直往上 •在來 、Y較基板2之尺寸小，例如1/3〜1/4左右即可。 斜的角送方向α方向）成固定傾 的各=直：广上替口，在相鄰 上之基板浮起力均句化，j而使台座80 ^於基板各部，嘴出口 88及抽 Ϊί跡？3成在基板G上塗布膜附著到噴出口 88或抽吸口 90 之痕跡或稷印痕跡。於塗布區域私之人口 〜〇 =====安定 度。又，於塗布區域Ms，88及抽吸口90的密The opposite side is parallel to the transport direction (X direction), and the other side is transported by the opposite side and the transport side (four). The pedestal 80 is divided into five regions 沁, 吣, 他, and Ms (Fig. 5) in the longitudinal direction (X direction). The area at the left end is the loading area. According to Fig. 3, the new substrate G which has been subjected to the coating treatment as described above is moved from the fit transport path 49, and the loading area My is moved into the area M1. The pins 86 are disposed at predetermined intervals, and are used to pick up the substrate G from the transport arm of the transport device 47 and mount it on the pedestal 8 ,, and can move up and down between the original position below the pedestal and the moving position above the pedestal. . These jacking pins 86 are driven up and down, for example, by using a jacking pin lifting portion rib (Fig. 12) for carrying in an air cylinder (not shown). This loading area is also the area where the floating conveyance of the substrate G is started. The top surface of the pedestal in this area is provided at a fixed density in order to float the substrate G for the floating height or the floating amount Ha for loading. A discharge port 88 for discharging high pressure or positive pressure compressed air. In the 'loading area', the floating height Ha of the substrate G does not need to be particularly high precision, and for example, it can be maintained in the range of 250 to 350 / / m. Further, in the direction of the transport direction, the size of the carry-in area 较佳ι is preferably larger than the size of the substrate G. Further, in the loading area Μ, an alignment portion (not shown) for aligning the substrate G on the pedestal 80 may be provided. The region Mr set in the center portion in the longitudinal direction of the pedestal 80 is the resist liquid supply region 15 200836840 • Hb, which is defined as anti-nozzle 8{) 2 two +. Coating _ s between the floating height of the substrate in the coating area M3 + (for example, the towel (He spit) and the top surface of the substrate (the surface to be processed) ~ 县县抗_杂量转)^%=^;^/^^ Coating film - ejecting 曙, in order to set the substrate, compressed air; and suction port 90, ri ^ from the same degree Hb pounds, congratulations to high pressure or positive G coating _3 _ part ^ will be empty = ^ At the same time, the strength of the substrate is at the same time, and the suction port 90 is 88/_new air is applied vertically upwards. • The size of the substrate 2 is smaller than the size of the substrate 2, for example, about 1/3 to 1/4. The oblique angle of the direction of the direction of the direction of the α direction is fixed to the vertical = straight: the upper mouth, the adjacent substrate floating force is uniform, j so that the pedestal 80 ^ on the substrate, mouth outlet 88 and pumping Ϊ trace? The coating film adhered to the discharge port 88 or the suction port 90 on the substrate G to mark or print marks. Private population in the coating area ~〇 ===== stability. Moreover, the density of the coating areas Ms, 88 and the suction port 90
上）m七u甘』' 在台座80之兩側緣部（直線K 防止基/·反G之兩側緣部下垂，而僅配置喷*口狀。 剌ί田於圖5，設定在搬入區域Ml與塗布區域私之間的中間區 或M2，為用於在運送中使基板G之浮起高度位置從搬入區域=中^ 16 200836840 ίΐϊί Π1或過渡到塗布區域沁中的浮起高度Hb的過渡區域。 &或2内，亦可在台座80之頂面混置噴 7將抽如9(3之密抑著運送方向逐漸狀ΐ / = 過渡_m2中，不含抽吸σ 9G，而僅以適當配置圖案配置2 • 、塗布區則3之下游侧狀區域M4，為用棘運送中使基板「夕 洋起量從塗布用之浮起量Hb改變為搬出用浮起高度Hc(例如25〇^ 350//Π1)的過渡區域。此過渡區域私中，台座⑼之 置喷出口 88與抽吸口 9〇，於此情形，可使抽吸口 9〇之= ，方$逐漸減小。或者，亦可不含抽吸口⑽，而僅以適當配置圖安 设置，出口 88。又’如圖6所示’與塗布區域-同樣地，過渡區二 M4亦較佳為，為防止形成在基板G上之抗侧塗布贿著到ϋ 跡’將抽吸口 90(及喷出口 88)配置在對於基板運送方向（χ方！ 的直線Ε上，並於相鄰的各列間，在排列間距設置 適萄的偏移I；卢。 台座80之下游端（右端）之區域Ms為搬出區域。在抗蝕劑塗 元(C0T)44接受過塗布處理之基板G，從此搬出區域吣藉由裝 47(圖1)經由旁通運送通道49而移送到下游侧之減壓乾燥單元 (VD)46(圖1)。於此搬出區域Μ5，在台座之頂面，以固定之密度設 多數用以使基板G以搬出用之浮起高度Hc浮起的嘴出口 88二， 為了將基板G從台座80上卸載並遞送給運送裝置47，多數根頂^ 92隔著既定之間隔，在台座下方之原位置與台座上方之往動位置 間，以可升降移動地設置。此等頂升銷92,例如藉由使用空氣缸筒（未 圖示）作為驅動源之搬出用頂升銷升降部95(圖12)而升^驅動°。 抗触劑噴嘴82,具有能將台座80上之基板g從一端到另一端含 盍的狹縫狀噴吐口 82a，以可升降地安裝在門形或匚字形的框架 138(圖3、圖11)，並與來自於抗蝕劑液供給機構96(圖丨2)之抗^ 劑液供給管98(圖4)連接。 几 17 200836840 基板運送部84，如圖3、圖4及圖7所示，且備：卢右一 導執道100L、100R，平行地配置在台座80之兩侧左右二對動= 構102L、102R，於運送方向（X '方向）以可移動地配置在此等引勅 運100L、100R上；運送驅動部1〇4，使兩滑動機構1〇2L、1〇2R护 或平行地在兩引導執道100L、贿上直進移動；及保持部1〇6守 於將基板G以可離合方式保持，裝載於兩滑動機構1〇乩、1〇沈。 - 送驅動部丨〇4由直進型驅動機構，例如，線性馬達構成。 保持部106,如圖3、圖4、圖7〜圖9所示，具有：4個吸p 墊108⑴、108⑵、⑽⑶、順4)，與基板G之4個角落面^ 表面）以真空吸附力結合；-對墊支持部11〇a、u〇b，將各 • 1G8(i)(卜1〜4)於運送方向（X方向）隔著固定間隔的2部&限制0 直方向之位移而支持；-對塾促動器112a、mb，使該 σ 持部llGa、110b各自獨立地升降移動或升降位移。 叉 更詳細而言’各吸附墊108⑴，如圖9及圖1Q所示，在例如由 不錄鋼鋼(SUS)所構成之直方體雜的墊本_面，設有多個抽吸口 Π4。再者，如圖示之構成例，為提高對於基板之 使橡膠的伸縮套m露出-部分而襄著於各抽吸口 114^=口 114通過墊本體内之真空通路而與外部直 、^^^ 真空，，與墊吸附控制部115(圖12)以=圖=通此 j支持部noa、·，例如為不錄鋼鋼(sum 才U部之墊支持部11Ga，其下端部（基端部)= 108⑴之前部結合。後部之墊向延伸喊該吸附墊 直方向延伸而錢輕促_ 112H 部（基端部）於錯 .而與該吸附墊灌⑴之後 、、办其上端部於水平方向延伸 在此，吸_⑽⑴與兩墊支持部11〇 較佳為能將兩墊支持部_、隱間之斗降誤差以=；；= 側吸收之構成。為此，較佳為兩墊支持 〇 队:土一二 吸附墊108(i)在其周圍於如直&由/击〇 、110b兩者具有能將 範直面内釭轉位移的水平旋轉軸，且兩墊 18 200836840 支持部110a、ll〇b之其中之一，呈右处你 直，移之直動軸。此實施形態例如圖10 g ' 合。 7平上食而部各與雨部軸承122a及後部轴承122b結 m 動11 112a，具有：例如舰騎施；及傳動機構 110a • i6b^l?^112b J ^ 12lb 之奸亩古上古司i良馬達12处之旋轉驅動力轉變成後部墊支持部110b /ίί向直f運動的例如直動引導件—體型滾珠螺桿機構所構 ]施安裝著用於_各別的旋轉角的旋轉編 來I靡。猎由以此等之旋轉編碼器之輸出信號作為反饋信號 ί i !〗Ϊ 服馬達124a、124b之旋，能使前部及後部墊支 符。卩110a、110b之升降移動距離大致正確地一致。 夕^者，於此實施形態之中，為了使對於兩塾支持部·、110b =返升降移動控制的精度更為提高，如圖8及圖9所示，設有各 塾支持部110a、110b之升降位践升降移動距離而反饋的 • ^ j度尺127a、127b。各線性刻度尺127a、127b，具有：刻度部 闲安I於滑動機構l〇2L(l〇2R)，於Z方向延伸；刻度讀取部128， ' ηϋ以光學地讀取此刻度部126之刻度，安裝在各墊支持部ll〇a、 此貝加形悲之保持部1〇6，如上所述，由於藉由不使各吸附墊 08(1^)實質地彎曲的堅硬的一對墊支持部11〇a、n〇b，利用一對墊 态112a、112b以2軸升降驅動，故能將各吸附墊1〇8⑴保持固 疋安勢（尤其水平姿勢）而安定地升降移動。 —又，於基板運送部84，將裝載於滑動機構102L、102R之各部與 疋置的控制部或用力供給源予以連接的電配線或配管等，皆收納在 19 200836840 可撓性的纜索輸送帶（Ca|3le Vey〇r)(未圖示）。 於J 9 ’前列左侧之吸附墊1〇8⑴，安裝有與該等為一體的光 13G。前列右侧之吸附墊⑽⑵，亦同樣安裝著與 ί為ΓΪ的光學式位置感測器130。此光學式位置感測器130，係 〜取代以減盤規，胁败祕嫩嘴82統 及 '用參照圖9、圖16、圖Π於後詳述。 〃觀及作 . 上々、如上戶^述’藉由形成在台座80頂面之多數噴出口 88，以及對於 该等供給汙起力產生用之壓縮空氣的壓縮空氣供給機構13牡圖 11)，以及於台座80之塗布區域吣内與噴出口 88混雜形成之多數抽 吸口 9〇，及對於該等供給真空之壓力的真空供給機構136(圖η)， 構成台座基板浮起部135(圖⑵，在搬人區域Μι或搬出區域Μ5使美 板G洋起適於搬出入或高速運送之浮起高度Ha、Hc，於塗布區域ς ，基板G洋起適於安定且正確地進行抗餘劑塗布掃描的設定浮高 度Hb。 圖11顯示噴嘴升降機構132、壓縮空氣供給機構134 命 給機構136之構成。喷嘴升降機構132，具有：門形框架ΐ38=ς 布區域Ms上以跨過與運送方向（X方向）垂直之水平方向^方向）之$ 式架設；鉛直直線運動機構140L、140R，安裝在此門形框牟nR · 移動體(升降體)之噴嘴支持體142,水平地地跨越在此等錯直直運 動機構140L、1嫩之間。各錯直直線運動機構14〇L、u〇R之驅 部，例如，具有脈衝馬達144L、144R、滾珠螺桿146L、U6R及引 =148L、148R。脈衝馬達脆、麗之旋轉力藉由滾珠螺構 (+146L、148L)、（146R、148R)在鉛直方向之直線運動轉換，抗蝕劑 贺嘴82與升降體之喷嘴支持體142 -體在錯直方向升降移動^ 脈衝馬達144L、144R之旋轉量及旋轉停止位置，可以任意 ^ 飯劑喷嘴82之升降移動量及高度位置。喷嘴支持體142，例士:由= 柱的剛體所構成，抗蝕劑喷嘴82可經由凸緣、螺栓箄而 式地安裝於其一側面。 一』雊口万 壓縮空氣供給機構134具有：正壓歧管15〇，在台座8〇頂面所 20 200836840 分割成的多數區域的各區域，與喷出口 88連接；壓縮空氣供給管 154，對於該等正壓歧管150，送入例如來自於工廠用力之壓縮空氣 源152的壓縮空氣；調節器156,設置於此壓縮空氣供給管154中途。 真空供給機構136 ’具有··負壓歧管158，在台座8〇頂面所分割成 的多數區域的各區域，與抽吸口 90連接；真空管162,對於此等之 負壓歧管158送入來自於例如工場用力之真空源ι6〇的真空；及節 * 流閥164 ’設於此真空管162之中途。 又’此抗钮劑塗布單元(C0T)44，為了測定抗飿劑噴嘴82與基 板G或各吸附墊i〇8(i)間的距離間隔，如圖u所示，在喷嘴支ϋ 丨42安裝著光學式距離感測器166(166L、166R)。此光學式距離感測 • 器166 ’與噴嘴支持體142及抗触劑喷嘴82 -體地升降移動，^以 光學方式測定從任意高度位置至正下方的物體，亦即台座8〇上之基 板G間的距離間隔，或與各吸附墊1〇8(i)間 二 光料巨離測定，光學式距離感測器166，包含：投光 ίϊΐί束；及受光部，將從該光束射到的物體(基板或_墊)反 怎1::3=丄則定距離之位置受光。圖示之構成例，係使用左 、166R ’於左右兩側分別測定與基板 實施形態之抗侧塗布單元⑼T)44，，控制系之 尤ίί蝕17G’包含1或乡織電腦，其控鄉元内之各部， & 機構96、喷嘴升降機構132、台絲板浮起部 1⑵、(運送驅動部1(34、墊吸附控制部115、墊促動器 作盘整體動作升t85、搬出用頂升鎖升降部95等各個的動 ίί:控制器17G具有程式記憶體，存放執 (軟體），微電腦之中附加功能的一切控制的程式 需的程式喊行。又雜式記㈣逐次地讀取所 記憶體等各觀憶髓保存㈣，可使用硬碟、光碟、快閃 ’、人口兄明此貫施形態之抗侧塗布單元(_私之中的塗布處 21 200836840 程式記憶體之测塗布處 搬入將未處理的新的基板入台㈣之 之運送臂退出後，頂倘狀動位置接取該基板g。運送裝置47 ^ -"ΐί ΐ."Γ« 8方。對於浮起狀態之基板 於= Γ之尺ΐϊ丨If:，寬方向(γ方向〕，台座8。之尺寸較基板 6〜10刪左右）t板之左右兩端部會稍微突出到台座⑽之外(例如 4個搬人部Ml待機，若調準動作結束，則基板G之上 田 m 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在The intermediate portion between the region M1 and the coating region or M2 is a floating height Hb for transferring the floating height position of the substrate G from the loading region to the transition region to the coating region 沁 during transportation. In the transition zone & or 2, it is also possible to mix the spray 7 on the top surface of the pedestal 80 to draw as 9 (the density of the 3 is suppressed, the transport direction is gradually ΐ / = transition _m2, without suction σ 9G In addition, the downstream side region M4 of the coating zone 3 is disposed in an appropriate arrangement pattern, and the substrate is changed from the coating floating amount Hb to the carrying-out floating height Hc during the spine transportation. (for example, 25 〇 ^ 350 / / Π 1) transition zone. In this transition zone, the pedestal (9) is placed at the discharge port 88 and the suction port 9 〇, in this case, the suction port 9 can be made =, square $ It may be gradually reduced. Alternatively, it may not contain the suction port (10), but only the appropriate configuration, the outlet 88. Also 'as shown in Fig. 6' is the same as the coating area. It is also preferable that the transition zone M4 is configured to prevent the anti-side coating on the substrate G from being applied to the traces. The suction port 90 (and the discharge port 88) are disposed in a direction to the substrate transport direction (χ! Ε, and between the adjacent columns, a suitable offset I is set at the arrangement pitch; Lu. The region Ms of the downstream end (right end) of the pedestal 80 is the carry-out region. In the resist coating element (C0T) 44 The substrate G subjected to the coating treatment is transferred from the carry-out region 吣 to the downstream side vacuum drying unit (VD) 46 (FIG. 1) via the bypass conveyance path 49 by the package 47 (FIG. 1). On the top surface of the pedestal, a plurality of nozzle outlets 88 for lifting the substrate G at the floating height Hc for carrying out are provided at a fixed density. In order to unload the substrate G from the pedestal 80 and deliver it to the transport device 47, A plurality of roots 92 are disposed between the original position below the pedestal and the moving position above the pedestal at a predetermined interval, such that the lifting pins 92 are used, for example, by using an air cylinder (not shown). Illustrated as a drive source, the lift pin lifting and lowering portion 95 (Fig. 12) is used to drive the lifter. The nozzle 82 has a slit-shaped ejection opening 82a capable of squeezing the substrate g on the pedestal 80 from one end to the other end, and is attached to the frame-shaped or U-shaped frame 138 (Figs. 3 and 11) so as to be movable up and down. Connected to the resist liquid supply tube 98 (Fig. 4) from the resist liquid supply mechanism 96 (Fig. 2). Several 17 200836840 substrate transport unit 84, as shown in Figs. 3, 4 and 7, Ready: Lu Youyi guide road 100L, 100R, arranged in parallel on the two sides of the pedestal 80, two pairs of motion = 102L, 102R, movably arranged in the transport direction (X 'direction) 100L, 100R; transport drive unit 1〇4, so that the two sliding mechanisms 1〇2L, 1〇2R guard or parallel in the two guide way 100L, bribe straight forward movement; and the holding part 1〇6 on the substrate G It is held in a clutchable manner and is loaded on the two sliding mechanisms 1〇乩, 1 sinking. - The delivery drive unit 4 is constituted by a linear drive mechanism, for example, a linear motor. As shown in FIG. 3, FIG. 4, and FIG. 7 to FIG. 9, the holding portion 106 has four suction p pads 108 (1), 108 (2), (10) (3), and cis 4), and four corner surfaces of the substrate G are vacuum-adsorbed. For the pad support portions 11〇a and u〇b, each of the 1G8(i) (Bu 1 to 4) is restricted in the transport direction (X direction) by a fixed interval of 2 parts & The displacement actuators 112a and mb allow the σ holding portions 11Ga and 110b to be independently moved up and down or moved up and down. In more detail, each of the adsorption pads 108 (1), as shown in FIG. 9 and FIG. 1Q, is provided with a plurality of suction ports 4, for example, in a rectangular body of a rectangular body composed of a non-recorded steel (SUS). . Further, in the configuration example shown in the figure, in order to increase the exposed portion of the rubber telescopic sleeve m for the substrate, the vacuum port of each of the suction ports 114 is replaced by the vacuum passage in the pad body. ^^ Vacuum, and the pad adsorption control unit 115 (Fig. 12) ==Fig.========================================================================================== End) = 108 (1) The front part is combined. The back part of the pad extends to the extension of the adsorption pad in a straight direction and the money is light _ 112H part (base end part) is wrong. After the adsorption pad is filled (1), the upper end part is made. Extending in the horizontal direction, the suction_(10)(1) and the two pad support portions 11 are preferably configured to be capable of reducing the error between the two pad support portions and the hidden pad by ==; side absorption. The two-pad support squad: the soil-two adsorption pad 108(i) has a horizontal rotation axis around which it can be displaced in the straight face, such as straight & / 〇, 110b, and two pads 18 200836840 One of the support portions 110a and 11b is a straight axis that is straight to the right and moved. This embodiment is, for example, Fig. 10 g'. And the rain portion bearing 122a and the rear bearing 122b are connected to the movement 11 112a, and have: for example, a ship riding device; and a transmission mechanism 110a • i6b^l?^112b J ^ 12lb. The force is converted into a rear pad support portion 110b / ί, for example, a linear motion of a straight-moving guide member, a body-type ball screw mechanism, and a rotary knitting device for each of the rotation angles is mounted. The output signal of the rotary encoder is used as the feedback signal ί i ! Ϊ The rotation of the motor 124a, 124b can make the front and rear cushions. The lifting and moving distances of the 卩110a, 110b are substantially exactly the same. In this embodiment, in order to improve the accuracy of the two-turn support portion and 110b=returning movement control, as shown in FIGS. 8 and 9, the elevation support of each of the support portions 110a and 110b is provided. • ^ j scales 127a, 127b for moving up and down the distance. Each of the linear scales 127a, 127b has: a scale free I on the sliding mechanism l〇2L (l〇2R), extending in the Z direction; The portion 128, 'nϋ optically reads the scale of the scale portion 126, and is mounted on Each of the pad supporting portions 11a and the retaining portions 1 to 6 of the Beiga shape is a rigid pair of pad supporting portions 11 which are not substantially bent by the respective adsorption pads 08 (1) as described above. a, n〇b, using a pair of pad states 112a, 112b to drive up and down in two axes, so that each of the adsorption pads 1〇8(1) can be stably moved up and down (especially in a horizontal posture). The transport unit 84 stores the electric wires or pipes connected to the control units or the force supply sources of the respective units of the slide mechanisms 102L and 102R in a flexible cable conveyor belt (Ca|3le Vey). 〇r) (not shown). The adsorption pad 1〇8(1) on the left side of the front row of J 9 ' is mounted with light 13G integrated with the above. The optical position sensor 130 of the suction pad (10) (2) on the right side of the front row is also mounted. The optical position sensor 130 is replaced with a disc gauge, and the following is described in detail with reference to FIG. 9, FIG. 16, and FIG. 々 及 及 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 如上 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉And a plurality of suction ports 9〇 formed in the coating region 台 of the pedestal 80 and the discharge port 88, and a vacuum supply mechanism 136 (Fig. η) for supplying the pressure of the vacuum to form the pedestal substrate floating portion 135 (Fig. (2) In the moving area Μι or the carrying out area Μ5, the board G is suitable for the lifting heights Ha and Hc for loading and unloading or high-speed transportation. In the coating area ς, the substrate G is suitable for stability and correct resistance The coating height of the coating application scan is shown in Fig. 11. Fig. 11 shows the configuration of the nozzle lifting mechanism 132 and the compressed air supply mechanism 134. The nozzle lifting mechanism 132 has a gate frame ΐ 38 = ς cloth area Ms to cross over $ erection in the horizontal direction of the transport direction (X direction); the vertical linear motion mechanism 140L, 140R, the nozzle support 142 mounted on the sill 牟nR · moving body (lifting body), horizontally Crossing in this error Linear movement between the mechanism 140L, 1 tender. The drive portions of the respective straight linear motion mechanisms 14A, u〇R have, for example, pulse motors 144L, 144R, ball screws 146L, U6R, and leads = 148L, 148R. The pulse motor is brittle and the rotational force is converted by the linear motion of the ball screw (+146L, 148L) and (146R, 148R) in the vertical direction. The resist nozzle 82 and the nozzle support body 142 of the lifting body are in the body. The movement amount of the pulse motors 144L and 144R and the rotation stop position can be raised and lowered in the wrong direction, and the movement amount and height position of the meal nozzle 82 can be arbitrarily selected. The nozzle support body 142 is composed of a rigid body of a column, and the resist nozzle 82 can be attached to one side surface via a flange or a bolt. I 雊 万 万 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩 压缩The positive pressure manifold 150 is supplied with, for example, compressed air from a factory-compressed compressed air source 152; and a regulator 156 is disposed in the middle of the compressed air supply pipe 154. The vacuum supply mechanism 136' has a negative pressure manifold 158, and is connected to the suction port 90 in each of a plurality of regions divided by the top surface of the pedestal 8, and a vacuum tube 162 is provided for the negative pressure manifold 158. The vacuum is supplied from, for example, a vacuum source ι6 工 of the factory; and the section * flow valve 164' is disposed in the middle of the vacuum tube 162. Further, in order to measure the distance between the anti-caries nozzle 82 and the substrate G or each of the adsorption pads i 8 (i), the anti-binder coating unit (C0T) 44 is shown in Fig. u at the nozzle support 丨 42. An optical distance sensor 166 (166L, 166R) is mounted. The optical distance sensing device 166' is moved up and down with the nozzle support body 142 and the anti-contact agent nozzle 82, and optically measures the object from any height position to directly below, that is, the substrate on the pedestal 8 The distance between G, or the distance between each of the adsorption pads 1〇8(i), the optical distance sensor 166 includes: a light-emitting beam; and a light-receiving portion that will be emitted from the beam The object (substrate or _ pad) is reversed by 1::3=丄, the position of the distance is received by light. In the example of the illustration, the anti-side coating unit (9) T) 44 of the substrate embodiment is measured on the left and right sides using the left and 166R', and the control system of the eclipse 17G' contains 1 or a rural computer, and its control township Each part in the unit, the & mechanism 96, the nozzle elevating mechanism 132, the platen floating portion 1 (2), (the transport drive unit 1 (34, the pad adsorption control unit 115, the pad actuator for the overall operation of the disk rises t85, and the carry-out Each of the jacking-up lifting unit 95 and the like: the controller 17G has a program memory, a storage (software), a program for all the programs controlled by the microcomputer, and a program for the program (four) read one by one. Take the memory and other memories of the memory (4), you can use the hard disk, CD, flash ', the population of the brothers to apply the form of the anti-side coating unit (_ private coating area 21 200836840 program memory test After the coating station is moved into the transfer arm of the unprocessed new substrate into the table (4), the substrate g is picked up at the top position. The transport device 47 ^ -"ΐί ΐ."Γ«8 square. For floating The substrate of the starting state is = Γ ΐϊ丨 : If:, the width direction (γ γ ], Compared with the size of the base substrate 8 puncturing about 6~10) t both end portions of the left and right plate protrudes slightly beyond the pedestal ⑽ (e.g. four people transporting portion Ml standby, when the alignment operation is finished, the substrate G is
Si二If ί ，付墊⑽⑴、108⑵、⑽⑶、厲4) i哭n? H。緊接者，各位置之保持部106使前部及後部墊促 同二夺點8及$上Tit動，使前部及後部塾支持部110a、110b以 i動升動，並使吸附墊1(38⑴從原位置(退避位置） 升到彺動位置（縣錄）。㈣接於狀前 開啟對於吸附墊⑽⑴〜·⑷之真級給，4個^^ = r,(4i；r r g -4 並以真工吸附力結合。如此-來，基板G的基板整體受到來自於二 座80之空氣壓力的浮起力，同時僅其4個絲藉由保持部⑽之^ 個吸_ 108⑴〜108(4)而局部地吸附保持。當保持部⑽ 板G，則緊接著，調準部使推壓構件往既定位置退避。 土 其次，絲運送部84，於使基板G之4個角落保持在保持部1〇6 之吸附墊108(1)〜廳⑷的狀態，開始基板G之浮起運送。 運送驅動部104將左右之兩滑動機構102L、1〇2R從運送始點位置往 運送方向（X方向）以較高速度的固定速度直進移動。以此式，美板 G會在台座80上以浮起運送往塗布區域吣移動，报快地，&基^「 之前端部到達抗蝕劑噴嘴82正下方附近之設定值置的時點板^ 送部84結束此弟1階段的基板運送。此時，喷嘴升降機構I%，使 22 200836840 抗蝕劑喷嘴82於上方之退避位置待機。 & = ίί G若停止，則噴嘴升降機構132作動，將抗蝕劑噴嘴82 二ΐί下方’於喷嘴嘴吐口 82a與基板G之間的距離間隔或間隙S 達値之，停止倾下降動作。接著，抗侧液供給機構 -1几^劑喷嘴犯’朝向基板以頂面開始抗钱劑液之喷吐^另 涂布時之部I4 _第2 之基板運送'。此第2階段亦即 ΡΪ =基ΐ私，娜較低速的固定速度Va。如此—來，於济布Si II If ί , pay mat (10) (1), 108 (2), (10) (3), sharp 4) i cry n? H. Immediately thereafter, the holding portions 106 at the respective positions cause the front and rear portions to be moved by the same two points and the upper Tit, so that the front and rear side support portions 110a and 110b are lifted by i, and the suction pad 1 is moved. (38 (1) From the original position (retracted position) to the swaying position (county record). (4) Open before the shape of the suction pad (10) (1) ~ (4) true level, 4 ^ ^ = r, (4i; rrg -4 And the combination of the real work adsorption force. Thus, the substrate of the substrate G as a whole is subjected to the floating force from the air pressure of the two seats 80, and only the four wires thereof are sucked by the holding portion (10) _ 108 (1) to 108 (4) Locally adsorbing and holding. When the holding portion (10) is in the plate G, the alignment portion retracts the pressing member to a predetermined position. Next, the wire conveying portion 84 holds the four corners of the substrate G at The state in which the suction pads 108 (1) to the halls (4) of the holding portion 1 to 6 start the floating transport of the substrate G. The transport drive unit 104 moves the left and right sliding mechanisms 102L and 1〇2R from the transport start position to the transport direction ( X direction) moves straight at a fixed speed at a higher speed. In this way, the US G will float on the pedestal 80 to the coating area. When the front end reaches the set value near the lower side of the resist nozzle 82, the board feed unit 84 ends the substrate transport of the first stage. At this time, the nozzle lift mechanism I% Let 22 200836840 resist nozzle 82 stand by at the upper retreat position. & = ίί G If stopped, the nozzle lifting mechanism 132 is actuated, and the resist nozzle 82 is slid under the nozzle nozzle 82a and the substrate G. The interval between the distances or the gap S is up, and the tilting down operation is stopped. Then, the anti-side liquid supply mechanism-1 has a few nozzles to make a part of the substrate toward the top surface of the anti-money agent liquid. I4 _ 2nd substrate transport '. This second stage is also ΡΪ = ΐ ΐ private, Na fixed speed Va at a lower speed. So - come, Yu Ji Bu
:二嘴82朝向正下方絲板G，將抗J R：M 13 G -- 域Μ5Ϊί布I，:/象上述塗布處理結束，則將基板G朝向搬出區 一、gw、、 土板運送部84轉換成運送速度較大的第3卩皆段其 墊促動A 112a、112b作動，使前敍後部墊、支持部110a、 G卸載，從台座下方之原角:置:台^ L將/、-人應接X塗布處理的新的基板G搬人、調準或運送。 m述，於此實施形態，採用以下構成：基板運送部84中， 〜m口(ί 二G之4個角落以4個吸附墊108(1) 08(4)局。P地保持，同％將各吸附塾雨⑴以實質不彎曲地以堅 23 200836840 升降移^或;:移賴υ保持固妓勢（尤其水平姿勢）而安定地 ㈣ϊί種基板^送部84之構成，能使基板G於台錢上浮 出口。8、二’即:吏疋基板G之前端將台座頂面的各列或各個別噴 ,吸幾乎完全覆蓋之_，絲板G之後端將各列 二或f吸口 9〇開放於大氣之瞬間，從台座80侧受 束力而抑:丨if ί地魏’仍能藉*保持部廳之堅硬保持力或拘 束力而抑制基板G之前端部或後端部上下偏擺。 、重、英山台座80上將基板G從搬入區域Μι通過塗布區域Μ3以浮起 ^ 1=域Μ5時’可以因應於各區域的每—個設定的基板浮起 冋度Ρ而將各吸附墊⑽⑴〜戰4)之高度位置適當地可變控制。 龍言，魏聊觸錄板G之浮起料前及_始後， ί3 ^ Γ1()8(4)能—致地在同—高度位置，以使得基板G成 為大致水平地在搬入區域Μι内所設定的浮起高度队。 =，於基板G之前端通過搬人區域Μι與塗布區域M3之間的過 配合在此區間之基板浮起高度從&變成①，前列左右 =^卩106使射格組之墊促絲⑽a、mb)作觸使前列左 如此1G8(1i、⑽⑵於相同時點恰下降相同高低差(Ha-Hb)。 I 土板G之前端進入塗布區域吣而到達抗蝕劑喷嘴82正下方 ίί:於塗布處理掃描（第2階段之基板運送）開始時，如圖14 邻Ξ丄由前列左右保持部議之堅硬拘束力而板g之前端 :p ^貝地水平保持在設定浮起高度Hb。藉此，能提高形成在基 板G之刖端部的抗姓劑塗布膜RM膜厚均勻性。又，基板G之前 正下方移動時，基板G之後端為浮起高度Ha且“ 又，基板G之後端通過過渡區域—時，保持部iQg亦使後列各 24 200836840 組整促動器（112a、112b)作動而使後列之叨糾勒1no/、 相同時點恰下降相同高低差(Μ)。如此，^ (3)、⑽⑷於 域M3通過抗钱劑噴嘴82正下方時，圖後端於塗布區 部106之堅硬拘束力，能將基板G之後安確 • 賴厚均自性抑提高。塗布膜謂 古垆Γ ^义 丞販b之後碥部通過抗蝕劑喷嘴82正下 - 為入搬出區域M5内而以浮起高度峨。 為了榀查或权正各吸附墊108(i)對於抗蝕劑喷嘴82 使瓣⑽⑴在 哭的碰心ί下方移動可以檢查從光學式距離感測 i 108=^^ 邊㈣嘴82之距_隔是否在吸附 112a、112b^/分為均⑽。再者，控制前部及後部墊促動器 前邻及德ίί吸附墊戰1)之頂面間的距離間隔L在對應於 附i i〇8°⑴，fi11〇a、腸之支點的位置為相等，也可實施吸 i〇8m佃日7，、〜周整。又，圖15僅顯示前列左侧之吸附墊 ϋ t 其他吸附墊1G8(2)、1G8(3)、⑽⑷，也可實 細同樣的水平檢查或校正。 、 立β ίϊ圖9、、圖16、圖17 ’對於此實施形態中’設於保持 收μ止凰二子式位置感測斋的構成及作用加以説明。如上所述， : 子/位置感測器130係取代習知的度盤規使用在抗蝕劑喷嘴 以咼度位置測定。 、 如圖Θ所示，例如使前列左側吸附墊1〇8(1)的墊本體於運送方 方=延長，並於其延長區塊Π2安裝光學式位置細器130， 坪、、、田而於延長區塊172,在其長邊方向中心部以抗飿劑喷嘴 8Ζ之下端部可從上方出人之大小形成溝部 174，夾持著此溝部174 在兩侧配置投光部176及受光部178。 、恭如圖17所不，投光部176，具有光學地結合於例如發光二極體 或田射一極體等之發光元件〗80的光纖182，從此光纖182端面（出 25 200836840 射面）以與運送方向（X方向）平行或斜向角度，以 光部m射出光束lb。受光部178，且有 向叉 f受光耕（光電轉換元件)184的光纖186，此 光^投光部m之出射面正向面對。控制器=，=== _ =兀件180予以發光驅動，並藉由從受光部178之受光元 侍到輸出信號’能夠判斷從投光部176射出之 是；^^牛= -Y4而人射到受光部178之受光面，換言之，可舣光束 是否被遮斷在溝部174内。 尤果之傳播 首先使位置130測定抗餘劑嘴嘴82高度位置時， Ϊ 載置在台座8G上，使光學式位置^ =，利用保持部⑽之塾促動器（112a、卿 n〇b)之斜鷄，使光學式位置制器m ^上升’並偵測L字形探針186a之前端在溝。== ϋ學式位置感測器130之高度位置。此高度位置，可s 公碼器或線性刻度尺讀取。又，L字形探針186a 之刖而可δ又疋在與台座8〇之頂面對應的高度位置。 體，將治具187從台座80取下，改成如圖17所示，使噴嘴 置ίί ?ί321ί，將抗_喷嘴82從塗布處理用之基準的高度位 光與所示’使抗㈣噴嘴82之下端（喷吐口）位於 mH/i、為130之溝部174正上方。如此，债測抗蝕劑喷嘴 如嗔嘴井ρ夂邦^贺· 8i间度位置。此贺嘴高度位置，可利用例 如屮一才λΛΙ^α32之馬達144L(144R)具備的編碼器（EC)188讀取。 來，此夠測定抗蝕劑喷嘴82之塗布處理用基準高度位置與台 形，値不同的情 如上所述，於此實施形態之抗顧劑塗布單元(C0T)44，藉由在基 26 200836840 -吐口伽與基板G之_巧隙s疋tt劑料82之喷 由於能隨_或校正触彡’如上所述， 高=光學式距離感測器挪可以提 切=6=17僅顯示與前列左側吸附墊雨⑴―體設置之光興 i3G ’但是’與前列右側吸附塾廳⑵-，詈之二 ⑽編歡高度位置—致 ===土 墊：=位=^^ i7；rrr£ ^ 明之保持部以不獅 面板顯示器LS處ίί板::以j= 劑液，也可為例如層間絶緣材料、介《材料 【圖式簡單說明】 27 ® 211^^ 200836840 圖5顯示上ίϋ ί布早元整體構成之立體圖。 圖6顯示上飾lift元整體構成之概略前視圖。 吸入口之相卜列圖案例平面圖 ::出' ’、 面側社繼_斷單元巾，基板運送部之構成-部分剖 i 9顯;: ’ f持部之構成擴大側面圖。 圖10顯示上卩部之構成立體圖。 體圖。 .墊支持部支持吸附墊之較佳構成例立 圖π顯示上述抗蝕劑冷 給機構及真空供給機構構成 =早功’喷嘴升降機構、壓縮空氣供 圖12顯示上述抗蝕劑塗 圖13顯示上述抗|虫劑塗布由’控制糸之主要構成方塊圖。 膜之侧面圖。 早70中’在基板上形成有抗蝕劑塗布 圖14顯示上述抗飯劑塗布 ^ 劑塗布膜時，各部之狀態側面圖兀中，在基板之前端部形成有抗蝕 圖15顯示於上述抗蝕劑 正之方法的階段侧面圖。 邛早凡，貫施吸附墊之水平檢查或校 圖16顯示上述抗飿劑塗布 感測器測定台座高度之方法立^圖兀中，使用實施形態之光學式位置 圖17顯示上述抗蝕劑塗布 感測器測定抗蝕劑噴嘴之古碎凡中，使用實施形態之光學式位置 、冋度位置的方法侧面圖。 【主要元件符號說明】 C !£盒 G基板 EE 周邊曝光裝置 28 200836840The two nozzles 82 face the silk plate G directly below, and the anti-JR: M 13 G - domain Μ 5 Ϊ ί cloth I, : / / after the coating process is completed, the substrate G is directed toward the carry-out area 1 , gw , and the earth plate transport portion 84 The third drive that is converted into a large transport speed is actuated by the pad actuation A 112a, 112b, so that the front and rear rear pads, the support portions 110a, G are unloaded, and the original angle from below the pedestal: set: table ^ L will /, - The person should be moved, aligned or transported by the new substrate G of the X coating process. In this embodiment, the following configuration is adopted: in the substrate transport unit 84, the ~m port (the four corners of the ί2G are held by four adsorption pads 108(1) 08(4). The adsorption 塾 rain (1) can be lifted or lowered in a substantially unbent manner by the strong 23 200836840; the 移 υ υ υ υ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 84 84 84 84 84 84 84 84 On the Taiwanese money floating outlet. 8, two 'that is: the front end of the base plate G will be sprayed on the top surface of the pedestal or each other, the suction almost completely covered _, the end of the silk plate G will be listed two or f suction port 9 When the atmosphere is open to the atmosphere, it is restrained from the pedestal 80 side: 丨if ί地魏' can still suppress the front or rear end of the substrate G by holding the hard retaining force or restraining force of the department hall. The pendulum, the heavy, and the Yingshan pedestal 80 will pass the substrate G from the loading area Μ1 through the coating area Μ3 to float ^1=domain Μ5', depending on the setting fluctuation of each substrate in each area. The height position of each of the adsorption pads (10) (1) to 3) is appropriately variably controlled. Longyan, Wei chat recording board G before and after the float, ί3 ^ Γ1 () 8 (4) can be in the same - height position, so that the substrate G is substantially horizontal in the loading area Μ The floating height team set in the inside. =, at the front end of the substrate G, by the over-matching between the transfer area Μι and the coated area M3, the substrate floating height in this section becomes 1 from & the front row is left and right = ^ 卩 106 to make the grid of the grid group (10)a , mb) makes the front left so 1G8 (1i, (10) (2) at the same time just drop the same height difference (Ha-Hb). I The front end of the earth plate G enters the coating area 吣 and reaches directly below the resist nozzle 82 ίί: At the start of the coating process scan (the substrate transport in the second stage), as shown in Fig. 14, the neighboring ridge is firmly restrained by the front-left and right-hand holding portions, and the front end of the plate g: p ^ shell level is maintained at the set floating height Hb. Thereby, the uniformity of the film thickness of the anti-surname coating film RM formed at the end portion of the substrate G can be improved. Further, when the substrate G is moved directly below the substrate G, the rear end of the substrate G has a floating height Ha and "again, after the substrate G" When the end passes through the transition region, the holding portion iQg also activates the rear row 24 200836840 group actuators (112a, 112b) to make the rear row 叨 1 1no/, and at the same time, the same height difference (Μ). ^ (3), (10) (4) When the domain M3 passes directly below the anti-money agent nozzle 82, the rear end of the figure The hardening force of the coating portion 106 can improve the stability of the substrate G after the thickness of the substrate. The coating film is called the ancient 垆Γ 垆Γ 丞 丞 b b 碥 碥 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀 抗蚀M5 is inside the floating height 峨. In order to check or correct each adsorption pad 108(i) for the resist nozzle 82 to move the flap (10) (1) under the cries of the crying, it can be checked from the optical distance sensing i 108= ^^ Edge (4) The distance between the mouth 82 is separated by the adsorption 112a, 112b^/ is divided into (10). Furthermore, the front and rear pad actuators are controlled to be adjacent to the top surface of the de- ίί adsorption pad 1) The distance interval L is equal to the position corresponding to the attachment point ii 8° (1), fi11〇a, and the fulcrum of the intestine, and the suction 〇 8〇 7 day 7, and the circumference can be performed. Further, Fig. 15 only shows the front left side. The adsorption pad ϋ t other adsorption pads 1G8 (2), 1G8 (3), (10) (4), can also be the same level inspection or correction. 立, β ϊ Figure 9, Figure 16, 17 'for this embodiment 'The configuration and function of the sensing position of the two-position position of the holding yoke are explained. As described above, the sub/position sensor 130 is replaced. The known gauge is used in the resist nozzle to measure the twist position. As shown in Fig. ,, for example, the pad body of the front left adsorption pad 1〇8(1) is extended on the transport side and extended. The block Π 2 is provided with an optical position eliminator 130, and the slabs 174 are formed in the extension block 172 at the center of the longitudinal direction thereof. The lower end portion of the tamper-resistant nozzle 8 可 can form a groove portion 174 from the upper side. The light projecting portion 176 and the light receiving portion 178 are disposed on both sides of the groove portion 174. As shown in Fig. 17, the light projecting portion 176 is optically coupled to, for example, a light emitting diode or a field one. The optical fiber 182 of the light-emitting element 80 emits the light beam lb from the light portion m from the end surface of the optical fiber 182 (outlet 25 200836840) in a direction parallel or oblique to the transport direction (X direction). The light-receiving portion 178 is provided with the optical fiber 186 of the light-grazing (photoelectric conversion element) 184, and the exit surface of the light-emitting portion m faces forward. The controller =, === _ = the member 180 is driven to emit light, and can be judged to be emitted from the light projecting portion 176 by receiving the output signal from the light receiving unit of the light receiving portion 178; ^^牛=-Y4 The light is incident on the light receiving surface of the light receiving portion 178, in other words, whether or not the light beam is blocked in the groove portion 174. When the position of the anti-reagent nozzle 82 is measured at the position 130, the Ϊ is placed on the pedestal 8G so that the optical position is ^=, and the 塾 actuator (112a, 〇n〇b) is used by the holding portion (10). The slanting chicken causes the optical position controller to m^' and detects the front end of the L-shaped probe 186a in the groove. == Height position of the drop-in position sensor 130. This height position can be read by s or a linear scale. Further, the L-shaped probe 186a is 刖 and δ is placed at a height position corresponding to the top surface of the pedestal 8〇. Body, remove the jig 187 from the pedestal 80, and change it to as shown in Fig. 17, so that the nozzle is set to ίί?ί321ί, the anti-nozzle 82 is used from the reference level of the coating process and the anti-(four) nozzle is shown The lower end of the 82 (spray port) is located directly above the groove portion 174 of mH/i. In this way, the debt measuring nozzle is like the position of the mouth of the mouth of the mouth. This height position of the mouthpiece can be read by an encoder (EC) 188 provided by a motor 144L (144R) such as 屮 ΛΙ α α α 32. Therefore, it is sufficient to measure the reference height position of the resist nozzle 82 for the coating process and the shape of the table. As described above, the resist coating unit (COT) 44 of this embodiment is used at the base 26 200836840 - The spit gamma and the substrate G _ _ 疋 tt tt agent 82 spray due to the _ or correction touch 彡 ' as described above, high = optical distance sensor can be cut = 6 = 17 only display and front Left side adsorption pad rain (1) - body setting light Xing i3G 'but 'with the front column right side adsorption hall (2) -, 詈 2 (10) woven height position - so === soil pad: = bit = ^ ^ i7; rrr £ ^ Mingzhi The holding part is not lion panel display LS ίί board:: j= liquid, or can be, for example, interlayer insulation material, “Material [Simple description] 27 ® 211^^ 200836840 Figure 5 shows on ίϋ ί布早A perspective view of the overall composition of the yuan. Fig. 6 is a schematic front view showing the overall configuration of the upper lift element. A plan view of the pattern of the suction port is as follows: 'out', the face side is followed by the unit, and the structure of the substrate transport unit is partially cut away. Fig. 10 is a perspective view showing the configuration of the upper jaw. Body map. The pad support portion supports a preferred configuration of the adsorption pad. The vertical view π shows the composition of the resist cold supply mechanism and the vacuum supply mechanism = early work 'nozzle lifting mechanism, compressed air. FIG. 12 shows the above-mentioned resist coating FIG. The above-mentioned anti-insecticide coating is composed of a main block diagram of 'control 糸. Side view of the membrane. In the early 70's, a resist coating is formed on the substrate. When the above-mentioned anti-drug coating coating film is shown in FIG. 14 , in the state side view of each part, a resist is formed on the end of the substrate. FIG. 15 shows the above-mentioned anti-corrosion. A side view of the stage of the method of correcting the etchant.邛 凡 凡 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The sensor measures the side of the resist nozzle, and uses the optical position and the twist position of the embodiment. [Main component symbol description] C !£盒 G substrate EE Peripheral exposure device 28 200836840
TITLER印字曝光器 10 塗布顯影處理系統 12 外部曝光裝置 14 匣盒站（C/S) 16 處理站（P/S) 18 界面站（I /F) 20 匣盒台座 22 運送機構 22a 運送臂 24 搬入單元（IN PASS) 26 清洗處理部 28 第1熱處理部 30 塗布處理部 32 第2熱處理部 34 第1平流運送通道 36 準分子UV照射單元(E-UV) 38 擦磨清洗單元(SCR) 40 黏附單元(AD) 42 冷卻單元(COL) 43 傳遞單元(PASS) 44 抗蝕劑塗布單元(COT) 45 傳遞單元(PASS) 46 減壓乾燥單元(VD) 47 運送裝置 48 預烘單元(PRE-BAKE) 49 旁通運送通道 50 冷卻單元(C0L) 52 傳遞單元(PASS) 54 .顯影單元(DEV) 29 200836840 56 後烘單元(POST BAKE) 58 60 冷卻單元(COL) 檢查單元(AP) 62 搬出單元(OUT PASS) 64 第2平流運送通道 «. 66 第3熱處理部 螌 68 輔助運送空間 72 運送裝置 74 旋轉台座（R/S) 76 周邊裝置 • 80 台座 82 抗蝕劑喷嘴 82a 喷吐口 84 基板運送部 85 頂升銷升降部 86 頂升銷 88 喷出口 90 抽吸口 92 頂升銷 • 95 頂升銷升降部 96 抗蝕劑液供給機構 98 抗蚀劑液供給管. 100L、100R引導軌道 102L、102R滑動機構 104運送驅動部 106保持部 吸附墊 108(1) 、 108(2) 、 108(3) 、 108(4) 110a、110b墊支持部 112、112a、112b 墊促動器 30 200836840 114抽吸口 Π5墊吸附控制部 116伸縮套 118真空管 120a接合部 * 120b直動引導件 * 122a軸承 122b軸承 124a伺服馬達 124b伺服馬達 φ 124編碼器或線性刻度尺 126a傳動機構 126b傳動機構 126刻度部 127a、127b線性刻度尺 128刻度讀取部 130 光學式位置感測器 132喷嘴升降機構 134壓縮空氣供給機構 135台座基板浮起部 * 136真空供給機構 、 138框架 140L、140R鉛直直線運動機構 ~ 142喷嘴支持體 144L、144R脈衝馬達 146L、148L、146R、148R 滾珠螺桿機構 148L、148R引導構件 150正壓歧管 152壓縮空氣源 31 200836840 154壓縮空氣供給管 156調節器 158負壓歧管 162真空管 164節流閥 。 166、166L、166R光學式距離感測器 _ 170控制器 172延長區塊 174溝部 176投光部 φ 178受光部 180發光元件 182光纖 184受光元件（光電轉換元件） 186光纖 186a L字形探針 187治具 32TITLER print exposure device 10 coating development processing system 12 external exposure device 14 cassette station (C / S) 16 processing station (P / S) 18 interface station (I / F) 20 cassette pedestal 22 transport mechanism 22a transport arm 24 moved in Unit (IN PASS) 26 Cleaning processing unit 28 First heat treatment unit 30 Coating processing unit 32 Second heat treatment unit 34 First advection transport path 36 Excimer UV irradiation unit (E-UV) 38 Abrasive cleaning unit (SCR) 40 Adhesion Unit (AD) 42 Cooling unit (COL) 43 Transfer unit (PASS) 44 Resin coating unit (COT) 45 Transfer unit (PASS) 46 Vacuum drying unit (VD) 47 Transport unit 48 Pre-bake unit (PRE-BAKE) 49 Bypass conveying path 50 Cooling unit (C0L) 52 Transfer unit (PASS) 54. Developing unit (DEV) 29 200836840 56 Post-drying unit (POST BAKE) 58 60 Cooling unit (COL) Inspection unit (AP) 62 Carry-out unit (OUT PASS) 64 2nd advection transport channel «. 66 3rd heat treatment unit 螌 68 Auxiliary transport space 72 Transport device 74 Rotating pedestal (R/S) 76 Peripheral device • 80 pedestal 82 Resist nozzle 82a Ejector 84 Substrate transport Department 85 Top lift pin lifting part 86 Top lifting pin 88 Spraying port 90 Suction port 92 Top lifting pin • 95 Top lifting pin lifting part 96 Resist liquid supply mechanism 98 Resist liquid supply pipe. 100L, 100R guide rail 102L, 102R The sliding mechanism 104 carries the driving portion 106 holding portion adsorption pads 108(1), 108(2), 108(3), 108(4) 110a, 110b pad support portions 112, 112a, 112b pad actuator 30 200836840 114 suction Mouth 5 pad adsorption control portion 116 telescopic sleeve 118 vacuum tube 120a joint portion * 120b linear motion guide * 122a bearing 122b bearing 124a servo motor 124b servo motor φ 124 encoder or linear scale 126a transmission mechanism 126b transmission mechanism 126 scale portion 127a, 127b linear scale 128 scale reading unit 130 optical position sensor 132 nozzle lifting mechanism 134 compressed air supply mechanism 135 pedestal board floating part * 136 vacuum supply mechanism, 138 frame 140L, 140R vertical linear motion mechanism ~ 142 nozzle support Body 144L, 144R pulse motor 146L, 148L, 146R, 148R Ball screw mechanism 148L, 148R Guide member 150 Positive pressure manifold 152 Compressed air source 31 200836840 154 Compressed air Regulator tube 156 to the vacuum manifold 158 162 164 throttle vacuum. 166, 166L, 166R optical distance sensor _ 170 controller 172 extension block 174 groove portion 176 light projecting portion φ 178 light receiving portion 180 light emitting element 182 fiber 184 light receiving element (photoelectric conversion element) 186 fiber 186a L-shaped probe 187 Fixture 32